HK1176175A - Sticking methods of an adhesive film, connection methods, a structural body for connection, and methods of manufacturing the same - Google Patents

Description

Method for attaching adhesive film, method for connecting adhesive film, connection structure, and method for manufacturing connection structure

Technical Field

The present invention relates to a method of attaching an adhesive film, a method of connecting, a connection structure, and a method of manufacturing a connection structure, in which an adhesive film is effectively attached to a substrate on which terminals are formed.

Background

Conventionally, a mounting method has been performed in which an electronic component is mounted on a substrate with an adhesive film. For example, a COG (Chip on Glass) mounting method is used in which an IC Chip as a liquid crystal driving circuit is mounted on a peripheral portion of a liquid crystal display panel (LCD panel) via an anisotropic conductive film.

An anisotropic conductive film is a thin film in which a conductive particle-containing layer in which conductive particles are dispersed in an insulating resin is formed on a release substrate. Such an anisotropic conductive film is used in the shape of a reel body wound around a reel (reel) having a flange (see, for example, patent document 1).

In recent years, however, the width of a mounting portion of an anisotropic conductive film on a substrate such as a liquid crystal display panel, that is, a terminal portion of the substrate has been becoming narrower. In the case where the width of the anisotropic conductive film is narrowed, it becomes difficult for the anisotropic conductive film wound on the reel to maintain the shape of the reel. For example, when the width of the anisotropic conductive film is 0.8mm, if the anisotropic conductive film is wound by 100m or more, the anisotropic conductive film is crushed by a winding pressure or the like, or the winding cannot be smoothly performed, and problems such as winding displacement or peeling-off over time occur. Here, the term "fall-off with time" means that, for example, when the width of the anisotropic conductive film is narrow, the anisotropic conductive film falls off and enters a gap between the flange of the reel and the winding body of the anisotropic conductive film. In this case, the anisotropic conductive film is wound around a portion close to the center axis of the reel.

When the width of the anisotropic conductive film is narrow, the anisotropic conductive film wound around the reel is shortened to prevent winding displacement of the reel shape, falling off over time, and the like, and thus productivity is significantly reduced.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2001 and 171033.

Disclosure of Invention

The present invention has been made in view of the above circumstances, and an object thereof is to provide a method of attaching an adhesive film, a connecting method, a connecting structure, and a method of manufacturing a connecting structure, by which an adhesive film having a narrow width can be effectively attached to a terminal portion of a substrate.

In a method for bonding an adhesive film for connecting a substrate on which terminals are formed and an electronic component on which terminals are formed, a first laminate pulled out from a reel wound on a reel is cut in a longitudinal direction, the first laminate has a structure in which the adhesive film is laminated on a release substrate, a width (A) of the first laminate and a width (B) of a second laminate obtained by cutting the first laminate satisfy a relationship of 0.1 xA.ltoreq.B.ltoreq.0.9xA, the second laminate is formed in the above manner, and the second laminate is bonded to the substrate.

In the connection method according to the present invention, a first laminate pulled out from a reel body wound around a reel is cut in a longitudinal direction, the first laminate has a structure in which an adhesive film is laminated on a release substrate, a width (a) of the first laminate and a width (B) of a second laminate obtained by cutting the first laminate satisfy a relationship of 0.1 × a or more and B or less and 0.9 × a, the second laminate is formed in the above-described manner, the second laminate is bonded to a substrate on which terminals are formed, the release substrate is peeled from the second laminate, the electronic component on which the terminals are formed is temporarily disposed (pseudo-disposed) on the adhesive film, and the terminals of the substrate and the terminals of the electronic component are connected by pressing the electronic component with a heating and pressing device.

The connection structure according to the present invention is obtained by the following processes: the method includes cutting a first laminate pulled out from a reel body wound around a reel in a longitudinal direction, the first laminate having a structure in which an adhesive film is laminated on a release substrate, and a width (A) of the first laminate and a width (B) of a second laminate obtained by cutting the first laminate satisfy a relationship of 0.1 xA. ltoreq. B.ltoreq.0.9 xA, forming the second laminate in the above manner, bonding the second laminate to a substrate on which terminals are formed, releasing the release substrate from the second laminate, temporarily arranging electronic components on which the terminals are formed on the adhesive film, and pressing the electronic components from the terminals by a heating and pressing device to connect the terminals of the substrate and the terminals of the electronic components.

In the method for manufacturing a connection structure according to the present invention, a first laminate pulled out from a reel body wound around a reel is cut in a longitudinal direction, the first laminate has a structure in which an adhesive film is laminated on a release substrate, a width (a) of the first laminate and a width (B) of a second laminate obtained by cutting the first laminate satisfy a relationship of 0.1 × a or more and B or less and 0.9 × a, the second laminate is formed in the above-described manner, the second laminate is bonded to a substrate on which terminals are formed, the release substrate is peeled from the second laminate, the electronic component on which the terminals are formed is temporarily disposed on the adhesive film, and the terminals of the substrate and the terminals of the electronic component are connected by pressing the electronic component with a heating and pressing device.

According to the present invention, the second laminate having a narrow width obtained by cutting the first laminate is not wound around the reel again but is directly bonded to the substrate, and therefore, the adhesive film can be effectively bonded to the terminal portion of the substrate without causing problems such as winding displacement or falling off of the adhesive film with time.

Drawings

Fig. 1 is a perspective view showing an example of a reel body in which a first laminate is wound around a reel.

Fig. 2 is a diagram showing an example of the anisotropic conductive film.

Fig. 3 is a diagram for explaining an example of a method of cutting the first laminated body, (a) is a diagram showing the first laminated body before cutting, (B) is a diagram showing the first laminated body in cutting, and (C) is a diagram showing the second laminated body after cutting.

Fig. 4 is a diagram showing a state where the second laminate is bonded to the substrate.

Fig. 5 is a diagram showing a state in which an anisotropic conductive film is provided on a terminal of a substrate.

Fig. 6 is a diagram showing a state where an electronic component is temporarily disposed on an anisotropic conductive film.

Fig. 7 is a diagram for explaining a method of pressing an electronic component with a heating and pressing device.

Description of the reference numerals

1 an anisotropic conductive film; 2 stripping the base material; 3 a first laminate; 4, winding the reel; 5, rolling the disc body; 6 a second laminate; 7 a substrate; 8 terminals; 9 a winding part; 10a, 10b flanges; 11 binder (binder); 12 conductive particles; 13 terminals; 14 an electronic component; 15 heating the pressing means.

Detailed Description

Hereinafter, an embodiment of the present invention (hereinafter, referred to as "the present embodiment") will be described in detail in the following order with reference to the drawings.

1. Method for sticking adhesive film

1-1. Process for preparing reel body

1-2. procedure for cutting first laminate

1-3 Process of sticking the second laminate

2. Method for connecting substrate and electronic component

3. Examples are given.

<1. method for sticking adhesive film >

In the method of attaching an adhesive film according to the present embodiment, as shown in fig. 1 and 2, the first laminate 3 (hereinafter, simply referred to as "laminate 3") pulled out from the reel body 5 wound around the reel 4 is cut in the longitudinal direction (L) to form the second laminate 6 (hereinafter, simply referred to as "laminate 6"). Here, the laminate 3 has a structure in which the anisotropic conductive film 1 is laminated on the release substrate 2. The formed laminate 6 is then bonded to the terminals 8 of the substrate 7. As described in detail later, the laminate 6 is formed such that the width (a) of the laminate 3 and the width (B) of the laminate 6 obtained by cutting the laminate 3 satisfy the relationship of 0.1 × a ≦ B ≦ 0.9 × a.

(1-1. Process for preparing reel body 5)

In the method of bonding the anisotropic conductive film 1, first, the reel body 5 is prepared by winding the laminate 3 around the reel 4.

The laminate 3 may be formed in a long strip shape that can be wound around a reel 4 made of plastic (plastic), for example, as shown in fig. 1. That is, in the case where the laminate 3 is in the form of a long tape, the wound portion 9 provided with the flanges 10a and 10b made of plastic or the like at both ends of the laminate 3 in the width direction a is wound so that the release substrate 2 becomes the outer periphery, and is provided as the reel body 5. The length of the long strip-shaped stacked body 3 in the reel body 5 may be about 50 to 300 m.

The thickness of the laminate 3 is preferably 22 to 200 μm, and more preferably 22 to 125 μm, from the viewpoint of improving the cuttability. The thickness of the anisotropic conductive film 1 is preferably 10 μm to 50 μm from the viewpoints of the design of the connection structure, the connection reliability in terms of electrical and mechanical characteristics, and the ease of manufacturing the laminate 3. The thickness of the release substrate 2 is not particularly limited, but is preferably 12 μm to 150 μm from the viewpoints of releasability, favorable winding state in the reel body 5, workability, and the like.

As shown in fig. 1 and 3, the laminate 3 is formed by laminating an anisotropic conductive film 1 in which conductive particles 12 are dispersed in a pressure-sensitive adhesive (adhesive) 11 on a release substrate 2. The laminate 3 may have a structure in which the release substrate 2 is provided also on the opposite surface side of the anisotropic conductive film 1 from the surface on which the release substrate 2 is laminated, but from the viewpoint of cuttability, it is preferable to provide the release substrate 2 only on one surface.

The anisotropic conductive film 1 is formed on the release substrate 2 by applying an anisotropic conductive composition containing conductive particles 12 dispersed in a general adhesive (adhesive) 11 such as a film-forming resin, a thermosetting resin, a latent curing agent, and a silane coupling agent onto the release substrate 2.

The release substrate 2 is formed by coating a release agent such as silicone on PET (polyethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1: Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), or the like, for example, and can maintain the shape of the anisotropic conductive film 1.

The film-forming resin contained in the binder 11 is preferably a resin having an average molecular weight of about 10000 to 80000. Examples of the film-forming resin include various resins such as epoxy (epoxy) resin, modified epoxy resin, urethane (urethane) resin, and phenoxy (phenoxy) resin. Among them, phenoxy resins are particularly preferable from the viewpoints of film formation state, connection reliability, and the like.

The thermosetting resin is not particularly limited as long as it has fluidity at room temperature, and examples thereof include commercially available epoxy resins and acrylic resins.

The epoxy resin is not particularly limited, but examples thereof include naphthalene (naphthalene) type epoxy resin, biphenyl (biphenyl) type epoxy resin, phenol novolac (phenol novolac) type epoxy resin, bisphenol (bisphenol) type epoxy resin, stilbene (stilbene) type epoxy resin, triphenol methane (triphenol methane) type epoxy resin, aralkyl phenol (phenol aralkyl) type epoxy resin, naphthol (naphthol) type epoxy resin, dicyclopentadiene (dicyclopentadiene) type epoxy resin, triphenylmethane (triphenol methane) type epoxy resin, and the like. These resins may be used alone or in combination of two or more.

The acrylic resin is not particularly limited, and an acrylic compound, a liquid acrylate (acrylate), and the like may be appropriately selected according to the purpose. For example, methyl acrylate (methyl acrylate), ethyl acrylate (ethyl acrylate), isopropyl acrylate (isopropyl acrylate), isobutyl acrylate (isobutryl acrylate), epoxy acrylate (epoxy acrylate), ethylene glycol diacrylate (ethylene glycol diacrylate), diethylene glycol diacrylate (diethylene glycol diacrylate), trimethylolpropane triacrylate (trimethylolpropane triacrylate), dimethylol tricyclodecane diacrylate (dimethylol tricyclic diacrylate), tetramethylene glycol tetraacrylate (tetramethylene glycol tetraacrylate), 2-hydroxy-1, 3-diacryloxypropylene (2-hydroxy-1,3-diacryloxy propane), 2-bis [4- (acryloxy-methoxy) phenyl ] propane (2, 2-bis [4- (2, 2-ethoxy) phenyl ] propane, 2bis [4- (acyloxy-ethoxy) phenyl ] propane), dicyclopentenyl acrylate (dicyclopentenyl acrylate), tricyclodecanyl acrylate (tricyclodecanyl acrylate [5.2.1.02,6] decan-8-yl ester) ], tris (acryloyloxy-ethyl) isocyanurate (tris (acryloxy ethyl) isocyanate), urethane acrylate (urethane acrylate), epoxy acrylate (epoxy acrylate), and the like. In addition, a resin in which an acrylate is replaced with a methacrylate may also be used. These resins may be used singly or in combination of two or more.

The latent curing agent is not particularly limited, and examples thereof include various curing agents such as a heat curing type and a UV curing type. The latent curing agent is not generally reacted, and is activated by various triggers (trigger) selected depending on the application, such as heat, light, and pressure, to start the reaction. Examples of the method for activating the heat-activatable latent curing agent include a method of generating an active species (cation or anion) by a decomposition reaction by heating, a method of stably dispersing in an epoxy resin at around room temperature and dissolving and starting a curing reaction by being compatible with the epoxy resin at a high temperature, a method of eluting a molecular sieve (molecular sieve) encapsulated curing agent at a high temperature and starting a curing reaction, and an elution and curing method by a microcapsule (microcapsule). Examples of the heat-activatable latent curing agent include imidazole (imidazole) type, hydrazide (hydrazide) type, boron trifluoride-amine (amine) complex, sulfonium (sulfonium) salt, aminated imide (amine imide), polyamine (polyamine) salt, dicyandiamide (dicyanodiamide), and the like, and they may be used alone or as a mixture of two or more kinds thereof. Among them, microcapsule type imidazole type latent curing agents are preferable.

The silane coupling agent is not particularly limited, but examples thereof include epoxy-based, amino-based, mercapto sulfide (mercapto sulfide) based, ureide (ureide) based, and the like. The addition of the silane coupling agent improves the adhesion at the interface between the organic material and the inorganic material.

The conductive particles 12 may be any known conductive particles used for the anisotropic conductive film 1. Examples of the conductive particles 12 include particles of various metals such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, and gold, particles of metal alloys, particles of metal oxides, carbon, graphite, glass, ceramics, and plastics, which are coated with metals on the surfaces thereof, and conductive particles in which the surfaces of these particles are further coated with insulating films. In the case of conductive particles obtained by coating the surfaces of resin particles with a metal, examples of the resin particles include particles of an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile-styrene (AS) resin, a benzoguanamine (benzoguanamine) resin, a divinylbenzene (divinylbenzene) resin, a styrene resin, and the like.

In the above description, the anisotropic conductive film 1 is used for the laminate 3, but the present invention is not limited to this example. An adhesive film other than the anisotropic conductive film 1, that is, an adhesive film containing no conductive particles 12 may be used in the laminate 3. For example, an insulating adhesive Film such as NCF (Non Conductive Film) may be used. In addition, an anisotropic conductive film having a two-layer or three-layer structure in which an insulating adhesive layer and a conductive particle-containing layer containing conductive particles 12 are laminated may be used in the laminate 3.

(1-2. Process for cutting laminate 3)

Next, as shown in fig. 3(a) to (C), the laminate 3 is pulled out from the reel body 5 and cut in the longitudinal direction (L) to form a laminate 6.

In the step of cutting the laminate 3, the laminate 3 is cut in the longitudinal direction so that the width (A) of the laminate 3 and the width (B) of the laminate 6 satisfy the relationship of 0.1 xA. ltoreq.B.ltoreq.0.9 xA to form the laminate 6. In this way, the state of the anisotropic conductive film 1 in the laminate 6 can be improved by making the width (a) of the laminate 3 and the width (B) of the laminate 6 satisfy the relationship of 0.1 × a ≦ B ≦ 0.9 × a, that is, by making the width (B) of the laminate 6 not excessively small with respect to the width (a) of the laminate 3. That is, the generation of floating or wrinkles in the anisotropic conductive film 1 of the laminate 6 can be prevented. Here, "floating" in the anisotropic conductive film 1 means that a part of the anisotropic conductive film 1 floats from the release substrate 2. The term "wrinkle" in the anisotropic conductive film 1 means that the anisotropic conductive film 1 is bent and creased. Further, the width accuracy of the anisotropic conductive film 1 in the laminate 6 can be improved.

Further, it is preferable that the width (A) of the stacked body 3 and the width (B) of the stacked body 6 satisfy a relationship of 0.2 xA. ltoreq.B.ltoreq.0.8 xA, that is, the width (B) of the stacked body 6 is not excessively thin with respect to the width (A) of the stacked body 3. This prevents the occurrence of floating and wrinkles in the cut anisotropic conductive film 1, and improves the width accuracy of the anisotropic conductive film 1 in the laminate 6.

The method of cutting the laminate 3 is not limited to the method of dividing the laminate 3 into two parts as shown in FIG. 3 as long as it satisfies the relationship of 0.1 xA. ltoreq.B.ltoreq.0.9 xA, and the laminate 3 may be cut into three or more parts, for example.

The width (A) of the laminate 3 is preferably 0.4mm or more, and particularly preferably satisfies the relationship of 0.5 mm. ltoreq. A.ltoreq.3.5 mm. By satisfying the relationship of 0.4 mm. ltoreq.A, the width accuracy of the anisotropic conductive film 1 in the laminate 6 can be improved. On the other hand, when the width (a) of the laminate 3 is less than 0.4mm, it becomes difficult to cut the laminate 3 in the longitudinal direction (L), and the width accuracy of the anisotropic conductive film 1 in the laminate 6 becomes poor. Here, the width accuracy of the anisotropic conductive film 1 in the laminate 6 means a variation in width over the entire length of the laminate 6.

The width (B) of the laminate 6 is preferably 0.2mm or more, and particularly preferably satisfies the relationship of 0.3 mm. ltoreq. B.ltoreq.2.0 mm. By satisfying the relationship of 0.2 mm. ltoreq.B, the width accuracy of the anisotropic conductive film 1 in the laminate 6 can be improved. On the other hand, when the width (B) of the laminate 6 is less than 0.2mm, it is difficult to cut the laminate 3 in the longitudinal direction (L), and the width accuracy of the anisotropic conductive film 1 in the laminate 6 is deteriorated.

The width accuracy of the laminated body 6 is preferably within ± 0.1mm, and more preferably within ± 0.05mm, from the viewpoint of accuracy in mounting.

The method of cutting the stacked body 3 in the longitudinal direction (L) is not particularly limited, and examples thereof include a method using a rotary circular blade, a leather blade (cutting blade), and a press-cutting type slitting blade. In particular, the method using a leather knife is preferable from the viewpoint of compactness of the apparatus. In order to stabilize the width accuracy of the obtained laminated body 6, it is preferable to use a device in which a guide groove corresponding to the width of the laminated body 6 is provided in the vicinity of the blade edge.

The cutting speed when the laminate 3 is cut in the longitudinal direction (L) is not particularly limited, and for example, a conveying speed in conjunction with a step of attaching the laminate 6 to the terminals 8 of the substrate 7, which will be described later, may be adopted. Further, it is also possible to provide an accumulation function in the device that cuts the stacked body 3 to continuously cut the stacked body 3. The laminated body 6 obtained by cutting the laminated body 3 may be partially discarded without using the whole.

(1-3. Process for affixing laminate 6)

Next, as shown in fig. 4, for example, the surface of the anisotropic conductive film 1 of the laminate 6 is bonded to the terminal 8 of the substrate 7. The substrate 7 may be any insulating substrate as long as it is provided with the narrow-width terminals 8, and examples thereof include a liquid crystal display panel, a glass substrate provided with narrow-width terminals, a plastic substrate, and a glass-reinforced epoxy resin substrate.

As described above, in the method of attaching an anisotropic conductive film according to the present embodiment, the laminate 3 pulled out from the reel body 5 is cut in the longitudinal direction (L), the width (a) of the laminate 3 and the width (B) of the laminate 6 satisfy the relationship of 0.1 × a ≦ B ≦ 0.9 × a, the laminate 6 is formed in the above-described manner, and the laminate 6 is attached to the terminal 8 of the substrate 7. In this way, the narrow laminate 6 obtained by cutting the laminate 3 is not wound around the reel 4 again but is directly attached to the substrate 7, and therefore, problems such as winding displacement and falling off over time in the anisotropic conductive film 1 can be prevented. This enables the anisotropic conductive film 1 having a narrow width to be effectively bonded to the narrow frame portion of the substrate 7, that is, the terminal 8 portion of the substrate 7.

Further, by forming the laminate 6 so that the width (a) of the laminate 3 and the width (B) of the laminate 6 satisfy the relationship of 0.1 × a ≦ B ≦ 0.9 × a, the width accuracy of the laminate 6 can be improved, and the occurrence of floating or wrinkles in the anisotropic conductive film 1 of the laminate 6 can be prevented.

<3. method for connecting substrate 7 and electronic component 14 >

Next, a method of connecting the substrate 7 on which the terminals 8 are formed and the electronic component 14 on which the terminals 13 are formed by the laminate 6 will be described.

In the connection method according to the present embodiment, the laminate 3 pulled out from the reel body 5 is cut in the longitudinal direction (L) so that the width (a) of the laminate 3 and the width (B) of the laminate 6 satisfy the relationship of 0.1 × a ≦ B ≦ 0.9 × a, the laminate 6 is formed in the above-described manner, and the laminate 6 is bonded to the terminal 8 of the substrate 7. Next, the release substrate 2 is peeled from the laminate 3, and the electronic component 14 having the terminal 13 formed thereon is temporarily placed on the anisotropic conductive film 1. Next, the terminals 8 of the substrate 7 and the terminals 13 of the electronic component 14 are anisotropically conductively connected by being pressed from the electronic component 14 by the heating and pressing device 15.

Examples of the electronic component 14 include semiconductor elements such as a semiconductor Chip other than an IC Chip such as an IC Chip and an LSI (Large Scale Integration) Chip, a Chip capacitor (Chip capacitor), a Flexible Printed Circuit (FPC), and a liquid crystal driving semiconductor mounting material COF (Chip On Film). As the heating and pressing device 15, for example, a hot press head can be used. Further, the terminals 8 of the substrate 7 and the terminals 13 of the electronic component 14 may be connected to each other anisotropically and electrically by using an active energy ray such as UV (ultraviolet) light or an electron beam in combination.

First, in the same manner as the above-described method of attaching the anisotropic conductive film, the laminate 6 is attached to the terminal 8 of the substrate 7, and the anisotropic conductive film 1 is temporarily pressure-bonded to the terminal 8.

After the anisotropic conductive film 1 is temporarily pressed, the alignment state of the anisotropic conductive film 1 is confirmed, and the release substrate 2 is peeled from the anisotropic conductive film 1 without causing a failure such as positional misalignment. As a result, as shown in fig. 5, the anisotropic conductive film 1 appears on the terminals 8 of the substrate 7.

Next, as shown in fig. 6 and 7, the electronic component 14 is disposed on the anisotropic conductive film 1 so that the terminal 8 of the substrate 7 and the terminal 13 of the electronic component 14 face each other.

Next, as shown in fig. 7, the upper surface of the electronic component 14 is heated by the heating and pressing device 15 at a temperature equal to or higher than the curing temperature of the thermosetting resin in the anisotropic conductive film 1 while being pressurized at a pressure of, for example, about 3MPa to 50 MPa. Thereby, the terminals 8 of the substrate 7 and the terminals 13 of the electronic component 14 are formally pressure-bonded via the anisotropic conductive film 1. The heating temperature varies depending on the kind of the thermosetting resin, but may be, for example, about 140 to 220 ℃.

By this connection method, a connection structure in which the substrate 7 and the electronic component 14 are connected by the anisotropic conductive film 1 is manufactured. That is, the conductive particles 12 in the anisotropic conductive film 1 connect the terminals 8 of the substrate 7 and the terminals 13 of the electronic component 14, thereby conducting the substrate 7 and the electronic component 14.

The present embodiment has been described above, but the present invention is not limited to the above-described present embodiment, and various modifications can be made without departing from the scope of the present invention.

<4. example >

[ examples ]

Hereinafter, examples of the present invention will be described. The present invention is not limited to these examples.

(example 1)

In example 1, an anisotropic conductive film (CP6920F3, manufactured by sony chemical & information member corporation) having an epoxy resin as a binder and a thickness of 25 μm, which was provided with a release film obtained by peeling a surface of a PET film having a thickness of 50 μm from silicone on both sides, was cut (slit), to obtain a laminate composed of three layers. Next, the laminate was wound on a plastic reel to obtain a reel-shaped laminate (reel body) having a length of 300m, a thickness of 125 μm and a width of 2.5 mm.

The laminate pulled out from the reel body was cut in the longitudinal direction with a leather knife (product name: Special Black blade 02, manufactured by OLFA corporation) to form a laminate having a width (B) of 1.0mm and a laminate having a width (B) of 1.5 mm.

(example 2)

In example 2, the same processing as in example 1 was performed, except that the laminate pulled out from the reel body was cut to form a laminate having a width (B) of 0.5mm and a laminate having a width (B) of 2.0 mm.

(example 3)

In example 3, the same processing as in example 1 was performed except that a coil-shaped laminate (a reel body) having a length of 50m, a thickness of 125 μm, and a width of 0.4mm was prepared, and the laminate pulled out from the coil body was cut and divided into two parts to form two laminates each having a width (B) of 0.2 mm.

(example 4)

In example 4, the same process as in example 1 was performed except that a PET film having a thickness of 75 μm and an anisotropic conductive film having a thickness of 50 μm were used, a coil-shaped laminate (reel body) having a length of 50m, a thickness of 200 μm and a width of 0.4mm was produced, and the laminate pulled out from the coil body was cut into two parts to form two laminates each having a width (B) of 0.2 mm.

(example 5)

In example 5, an anisotropic conductive film (CP6920F3, manufactured by sony chemical & information member corporation) having a thickness of 10 μm and comprising a release film obtained by releasing a PET film having a thickness of 12 μm from silicone on one surface thereof and an epoxy resin as a binder was cut (slit) to prepare a laminate composed of two layers. Next, a laminate (reel body) having a reel shape of 50m in length, 22 μm in thickness and 0.4mm in width was produced by winding the laminate on a reel made of plastic.

Comparative example 1

In comparative example 1, an anisotropic conductive film (CP6920F3, manufactured by sony chemical & information member co., ltd.) having an epoxy resin as a binder and a thickness of 25 μm, which was provided with a release film obtained by peeling a surface of a PET film having a thickness of 50 μm from silicone on both sides, was cut to prepare a laminate composed of three layers. Next, the laminate was wound on a reel made of plastic to obtain a reel-shaped laminate (reel body) having a length of 300m, a thickness of 125 μm and a width of 1.0 mm.

Comparative example 2

In comparative example 2, an anisotropic conductive film (CP6920F3, manufactured by sony chemical & information member co., ltd.) having an epoxy resin as a binder and a thickness of 25 μm, which had a release film obtained by peeling a surface of a PET film having a thickness of 50 μm from silicone on both sides, was cut to obtain a laminate composed of three layers. Next, the laminate was wound on a plastic reel to obtain a reel-shaped laminate (reel body) having a length of 300m, a thickness of 125 μm and a width of 0.5 mm.

Comparative example 3

In comparative example 3, an anisotropic conductive film (CP6920F3, manufactured by sony chemical & information member co., ltd.) having an epoxy resin as a binder and a thickness of 25 μm, which was provided with a release film obtained by peeling a surface of a PET film having a thickness of 50 μm from silicone on both sides, was cut to prepare a laminate composed of three layers. Next, the laminate was wound on a reel made of plastic to obtain a laminate having a thickness of 125 μm and a width of 0.2 mm.

Comparative example 4

In comparative example 4, an anisotropic conductive film (CP6920F3, manufactured by Sony chemical & information Components Co., Ltd.) having a thickness of 25 μm and comprising a release film obtained by releasing a PET film having a thickness of 50 μm from silicone on one surface and an epoxy resin as a binder was cut to obtain a laminate of two layers having a thickness of 75 μm and a width of 0.2 mm.

Comparative example 5

In comparative example 5, the same processing as in example 1 was performed, except that the laminate pulled out from the reel body was cut into two parts to form a laminate having a width (B) of 0.2mm and a laminate having a width (B) of 2.3 mm.

< evaluation of winding State of film laminate >

The laminates of examples 1 to 5 and comparative examples 1 to 5 were visually evaluated for the winding state. In the evaluation of the winding state, exposure of the anisotropic conductive film defined "excellent" for winding state with no winding displacement and uniform good winding displacement, "Δ" for winding displacement in a part of the winding state, and "x" for winding displacement and failure. The evaluation results of the wound state are shown in table 1.

< evaluation of Width precision after cutting >

The accuracy of the width (B) after cutting (width accuracy) was evaluated for the laminates of examples 1 to 5 and comparative examples 1 to 5. In the evaluation of the width accuracy, the case where the width accuracy of the cut laminate was within ± 0.05mm was defined as "excellent", the case where the width accuracy of the cut laminate was within ± 0.1mm was defined as "o", and the case where the width accuracy of the cut laminate exceeded ± 0.1mm was defined as "x". The evaluation results of the width accuracy are shown in table 1.

< evaluation of the State after cutting >

The state after cutting was evaluated for the laminates of examples 1 to 5 and comparative examples 1 to 5. In the evaluation of the state after cutting, a good case where no lifting or wrinkles occurred in the anisotropic conductive film layer was defined as "excellent", and a case where a lifting or cutting defect partially occurred in the anisotropic conductive film layer was defined as "x". The evaluation results of the state after cutting are shown in table 1.

< comprehensive evaluation (judgment) >

In the laminates of examples 1 to 5 and comparative examples 1 to 5, all of the laminates having an "excellent" or "o" evaluation result were defined as "excellent", that is, as an executable laminate. In addition, a laminate having one or more "Δ" or "x" in the above evaluation results is defined as "x", that is, a laminate that is not suitable for implementation is evaluated. The results of the comprehensive evaluation are shown in Table 1.

[ Table 1]

The laminate before cutting in comparative example 1 had winding displacement in a part of the wound state. This is considered to be due to the narrow width of the laminated body before cutting and the excessively long length of the laminated body wound at the wound portion of the reel body.

The laminate in comparative example 2 had winding displacement and could not be used. This is considered to be due to the narrow width of the laminated body before cutting and the excessively long length of the laminated body wound at the wound portion of the reel body.

The laminate in comparative examples 3 and 4 was too thin because the width (a) of the laminate before cutting was less than 0.4mm, and thus cutting was not possible.

The laminate in comparative example 5 was not satisfactory in the state of the laminate after cutting. This is considered to be because, in the laminate in comparative example 5, the width (A) of the laminate before slitting and the width (B) of the laminate after slitting do not satisfy the relationship of 0.1 XA ≦ B ≦ 0.9 XA, that is, the width (B-1) of the laminate after slitting is too thin relative to the width (A) of the laminate before slitting.

On the other hand, in the laminated bodies of examples 1 to 5, the width (a) of the first laminated body which was the laminated body before cutting and the width (B) of the second laminated body which was the laminated body after cutting satisfy the relationship of 0.1 × a ≦ B ≦ 0.9 × a, and therefore the winding state of the laminated body, the width accuracy after cutting, and the state after cutting are good.

Claims (6)

1. A method of attaching an adhesive film for connecting a substrate on which terminals are formed and an electronic component on which terminals are formed,

the method for manufacturing a laminate includes the steps of cutting a first laminate drawn out from a reel body wound on a reel in a longitudinal direction, the first laminate having a structure in which an adhesive film is laminated on a release substrate, the width (a) of the first laminate and the width (B) of a second laminate obtained by cutting the first laminate satisfying a relationship of 0.1 × a or more and 0.9 × a, forming the second laminate in the above manner, and bonding the second laminate to the substrate.

2. The method of adhering an adhesive film according to claim 1,

the width (A) of the first laminate is 0.4mm or more,

the width (B) of the second laminate is 0.2mm or more.

3. The method of attaching an adhesive film according to claim 1 or 2, wherein the thickness of the first laminate is 22 to 200 μm.

4. A method of connecting, wherein,

cutting a first laminate drawn out from a reel body wound on a reel in a longitudinal direction, the first laminate having a structure in which an adhesive film is laminated on a release substrate, the second laminate being formed so that a width (A) of the first laminate and a width (B) of a second laminate obtained by cutting the first laminate satisfy a relationship of 0.1 xA.ltoreq.B.ltoreq.0.9 xA, and bonding the second laminate to a substrate on which a terminal is formed,

peeling the release base from the second laminate, temporarily disposing an electronic component having a terminal formed on the adhesive film,

pressing from the electronic component with a heating and pressing device,

and connecting the terminals of the substrate and the terminals of the electronic component.

5. A connection structure obtained by the following processes:

cutting a first laminate drawn out from a reel body wound on a reel in a longitudinal direction, the first laminate having a structure in which an adhesive film is laminated on a release substrate, the second laminate being formed so that a width (A) of the first laminate and a width (B) of a second laminate obtained by cutting the first laminate satisfy a relationship of 0.1 xA.ltoreq.B.ltoreq.0.9 xA, and bonding the second laminate to a substrate on which a terminal is formed,

peeling the release base from the second laminate, temporarily disposing an electronic component having a terminal formed on the adhesive film,

pressing from the electronic component with a heating and pressing device,

and connecting the terminals of the substrate and the terminals of the electronic component.

6. A method of manufacturing a connection structure, wherein,

cutting a first laminate drawn out from a reel body wound on a reel in a longitudinal direction, the first laminate having a structure in which an adhesive film is laminated on a release substrate, the second laminate being formed so that a width (A) of the first laminate and a width (B) of a second laminate obtained by cutting the first laminate satisfy a relationship of 0.1 xA.ltoreq.B.ltoreq.0.9 xA, and bonding the second laminate to a substrate on which a terminal is formed,

peeling the release base from the second laminate, temporarily disposing an electronic component having a terminal formed on the adhesive film,

pressing from the electronic component with a heating and pressing device,

and connecting the terminals of the substrate and the terminals of the electronic component to obtain a connection structure.