TWI774835B - Apparatus for depositing a structured layer on a substrate using a mask - Google Patents

Abstract

The invention relates to a device for depositing a layer laterally structured by using a mask on at least one substrate (20), in particular by feeding steam into a deposition chamber (19) and condensing the steam on realized on the substrate (20), with a substrate holder (21) for holding the substrate (20), which can be cooled by a cooling member (22), and a substrate holder (21) fixed on the mask frame (10) for abutting against the substrate (20). 20) of the mask (8). The present invention provides means for depositing precisely structured layers on substrates in a reproducible manner. The mask frame (10) is surrounded by a heating frame (25) heated by a heating member (18). A thermal insulating member is provided between the mask frame (10) and the heating frame (25). The invention also relates to a method of depositing layers using an apparatus of the same type.

Description

Apparatus for depositing a structured layer on a substrate using a mask

The invention relates to a device for depositing a layer laterally structured by using a mask on at least one substrate, in particular by feeding vapor into a deposition chamber and condensing the vapor on the substrate, with possible The substrate holder for holding the substrate is cooled by the cooling member, and the mask fixed on the mask frame for abutting against the substrate.

Such a device is described in DE 10 2013 101 586 A1. In the case of using an evaporator as described for example in WO 2012/175128 A1, steam is generated from an organic material which is fed into the deposition through an actively heated gas inlet member as described for example in DE 10 2014 116 991 A1 The deposition chamber of the device. Below the gas inlet member in the vertical direction is provided a substrate holder cooled by a cooling member to a temperature below the condensation temperature of the steam, on which substrate holder abuts a substrate, which is coated with an organic starting material. The organic starting material is a molecule that emits light due to the passage of an electric current in a condensed state. Such OLEDs are used to make screens. To make red, green and blue pixels, different organic starting materials are used. For lateral structuring of layers deposited to the substrate with a grid of pixels, shadow masks are used. The material thickness of such masks is between 1 μm and 100 μm. Usually 40μm. The structure size of the masked structure is several μm. The area of the substrate holder or the area of the mask can be in the square meter range.

US 2005/0037136 A1 describes an apparatus for depositing organic layers by means of a mask fixed under a mask holder. The hood holder has cooling means for cooling the hood and a heating means for heating the side of the hood holder facing away from the cooling medium.

US 2013/0040054 A1 describes an apparatus for depositing layers on a substrate on a cooled substrate holder, wherein a shielding plate can be fed between the substrate holder and a heated gas inlet member.

The object of the present invention is to improve devices of the same type in a manner that is easy to use, and in particular to provide means for depositing precisely structured layers on substrates in a reproducible manner.

The solution of the present invention to achieve the above object is the invention given in the scope of the patent application, wherein the subordinate item is not only a beneficial improvement scheme of the independent item, but also an independent solution to achieve the above purpose.

The present invention relates to a method for manufacturing a self-luminous display equipped with organic light-emitting diodes. The OLED is deposited in a process chamber of the reactor, in which a substrate holder is provided, on which the substrate holder with a large area to be coated rests. The substrate holder is cooled so that the organic starting material fed into the process chamber through the heated gas inlet member can condense on the surface of the substrate. In order to carry out the method, the process chamber should (but preferably not only) be designed such that deposition of organic starting material occurs only on the substrate or on the mask resting on the substrate, and not elsewhere in the process chamber , especially condensation. That is, deposition of starting materials elsewhere in the process chamber may have the consequence that the deposits evaporate and lead to undesired contamination of vapors when other layers are deposited using other organic starting materials.

By the heating frame surrounding the mask frame, vapors fed through the gas inlet member are prevented from depositing at locations within the deposition chamber where re-evaporated deposits may occur. The mask frame is prevented from being heated or cooled below the deposition temperature in the area where it abuts the mask frame by thermally insulating members extending between the heating frame and the mask frame. The mask frame can rest on a support frame cooled by cooling means. The support frame surrounds the cooled substrate holder. However, the thermally conductive contact of the mask frame on the support frame is not sufficient to prevent the mask frame from being heated to temperatures above, for example, 20°C or 10°C. The mask frame is the member that encloses the mask and is used to transport the mask and keep it in a horizontal position. The mask is a film having a thickness of 1 to 100 μm, structured with openings arranged in a grid-like arrangement, wherein the film is brought into contact with the surface of the substrate. Each of the openings represents a pixel, wherein red, blue and green pixels are, for example, side-by-side and deposited in successive coating steps. However, luminescent, in particular OLED, pixels are not limited to these colors or color combinations. The pixels may also have other colors or hues. This mask does not allow lateral distortion in application, thereby depositing OLED pixels in defined positions, especially at the edges. The hood is made in particular from steel, which has a nearly vanishing coefficient of thermal expansion in a certain temperature range. However, due to the required deposition accuracy, the thermal expansion must be less than 10 μm, preferably less than 1 μm, over the temperature range when the mask is used. By thermally separating the mask frame from the heating frame, the mask frame is heated only slightly on the one hand and the edges of the heating frame are cooled only slightly on the other hand. Heating due to thermal radiation originating from the heating frame is prevented in particular by these additional thermal insulating members. The insulating members may consist of insulators which frame the mask frame or the substrate holder surrounded by the mask frame in a manner extending in a horizontal plane. The insulator may have one or several shielding plates. The shielding plates have surfaces facing away from each other, which can be highly reflective and in particular have a small emission coefficient of 0.04. These surfaces can be coated with high gloss. These broad sides face both the heating frame and the mask frame. In addition, the thermal conductivity of the shielding plates is preferably lower. For this purpose, the shielding plates can be made of foamed material, foamed plastic or foamed metal, for example. The shielding plates may be constructed of an insulator in a single material manner. For example, several grooves can be made in the insulator, so that the ribs left between the grooves form a shielding plate. In this case, the shielding plates protrude from the carrier section of the insulator in a substantially comb-like manner. As an alternative to the machining of such insulators, the insulators can also be cast. The shielding plates are preferably made of metal and have a metal surface coating. The surface coating may be a gold coating. In addition, the insulator can be connected to the mask frame in a single material manner, for example, the insulator can constitute a mask plate formed through the grooves that create the mask frame. But similarly, the insulator can also correspond to the heating frame in a single material manner. A system of several shielding plates parallel to each other and at a distance from one another can frame the shield frame, wherein the shielding plates extend in a vertical plane. In particular, the invention proposes that the insulator establishes a thermally conductive connection with the support frame, which in turn is cooled by means of cooling elements. The insulator can also be overlapped by the edges of the mask. However, the thermal separation of the heating frame and the shielding frame can also be achieved through the gap between the shielding frame and the heating frame. In this case, the faces of the heating frame and the mask frame facing each other may also be highly gloss coated and/or polished so that these faces have a minimum reflectance. It is also possible that the outer edge of the mask extends at least partially through the insulator. The mask may extend to the outer edge of the mask frame. With a suitable selection of the means for thermal separation, a lateral temperature gradient is achieved over the outer edge of the masking device (which is replaced in particular after each coating step, but not necessarily), wherein, In a radially outer position, the temperature of the mask means is higher than the condensation temperature. However, the slope of the temperature gradient is sufficiently large that the surface temperature of the mask is sufficiently below the condensation temperature over the entire mask surface.

The invention also relates to a method for depositing a layer using the aforementioned device, wherein the mask frame is tempered so that its temperature is below the condensation temperature, and the heating frame is tempered so that it is The temperature is higher than the condensation temperature of steam. A temperature gradient is created in which the location of the condensation temperature falls within the area between the mask frame and the heating frame. The condensation point is preferably located in the region of the insulating member, in particular in the region of the insulator.

The mask frame preferably extends along a perimeter line in a horizontal plane such that the substrate holder is surrounded by the mask frame. The edge of the mask is fixed on the mask frame. The mask frame may be a rectangular frame surrounded by a rectangular heating frame.

1‧‧‧Shell

2‧‧‧Gas inlet components

3‧‧‧Steam feed port

4‧‧‧Exhaust surface

5‧‧‧Exhaust port

6‧‧‧Temperature channel

7‧‧‧Mask device

8‧‧‧Mask

8'‧‧‧Edge

9‧‧‧Mask opening

10‧‧‧Mask frame

11‧‧‧Insulators

12‧‧‧Shielding plate

12'‧‧‧Reflector

12"‧‧‧Reflector

13‧‧‧Intermediate cavity

14‧‧‧Spacer elements

15‧‧‧Insulation layer

16‧‧‧Connector

18‧‧‧Heating components

19‧‧‧Deposition Chamber

20‧‧‧Substrate

21‧‧‧Substrate bracket

22‧‧‧Temperature channel

23‧‧‧Support frame

24‧‧‧Temperature channel

25‧‧‧Heating frame

25'‧‧‧Side

26‧‧‧Insulation gap

27‧‧‧Clearance

28‧‧‧Heating zone

The present invention will be described in detail below with reference to the embodiments. The accompanying drawings are schematic diagrams, not drawn to scale and used for illustration only, wherein: FIG. 1 is a cross-sectional view of a housing 1 of a reactor for depositing one or several OLED layers, FIG. 2 is a first embodiment 1 is an enlarged view of part II in FIG. 1 , FIG. 3 is a schematic diagram of the second embodiment according to FIG. 2 , and FIG. 4 is a cross-sectional view according to the line IV-IV in FIG. 1 in the second embodiment. 5 is a schematic diagram of the third embodiment according to FIG. 2 , FIG. 6 is a schematic diagram of the fourth embodiment according to FIG. 2 , FIG. 7 is a schematic diagram of the fifth embodiment according to FIG. 2 , and FIG. Fig. 8 is a schematic diagram of a sixth embodiment according to Fig. 2, and Fig. 9 is a schematic diagram of a seventh embodiment according to Fig. 2.

The housing, which is only shown by way of example in FIG. 1 , has gas-tight walls, which are constructed such that the interior of the housing can be evacuated. Inside the casing 1, a gas inlet member 2 is provided, which has a gas distribution cavity, and the gas distribution cavity is fed with gas through the steam feeding port 3. As shown in FIG. The organic vapor conveyed by a carrier gas such as a noble gas or H ₂ or N ₂ is fed into the gas inlet member 2 through the vapor feed port 3 . The gas inlet member 2 has a bottom plate which constitutes the exhaust surface 4 facing the process chamber 19 . The exhaust surface 4 has a plurality of exhaust ports 5 arranged in a showerhead shape, and steam can enter the process chamber 19 from the gas inlet member 2 through the exhaust ports. The exhaust plate with the exhaust port 5 has temperature-adjusting channels 6 through which the temperature-adjusting medium can flow in, in order to heat the gas inlet member 2 and especially the exhaust surface 4 facing the process chamber 19 . to a temperature above the condensation temperature of steam. For example, the current flowing through the heat conductor can be used as the temperature control medium.

Furthermore, a heating zone 28 is provided around the gas inlet member 2 . The heating zone is here a heating frame, which is maintained at a temperature higher than the condensation temperature of the steam by means of a suitable tempering medium (eg tempering liquid) or electrical heating.

A substrate holder 21 is provided below the gas inlet member 2 and extends over substantially the entire surface of the exhaust surface 4 . The size of the support surface for the substrate 20 resting on the substrate holder 21 may be in the square meter range or larger. However, the surface can also be smaller than 1 m ² , for example in the range of 0.04 m ² . The vapor fed into the process chamber 19 needs to be deposited on the substrate 20 in a laterally structured manner. This is achieved by condensation, whereby cooling means 22 are provided, by means of which the support surface of the substrate 20 for the substrate holder 21 is cooled to a temperature below the deposition temperature of the vapor. In the case where the temperature of the gas inlet member 2 or the heating zone 28 is greater than 100°C, 150°C or 200°C, the temperature of the substrate support surface is less than 0°C, 10°C or 20°C. The temperature of the substrate support surface may also be less than 100°C. The temperature of the substrate support surface is usually 20°C.

For the lateral structuring of the layer to be deposited on the substrate 20, a masking device 7 is provided. The mask device 7 is constituted by a mask frame 10 surrounding the substrate holder 21 . The mask holder 10 carries a mask made of steel, which is a thin film with a material thickness of 10 μm to 100 μm. The mask has several regularly arranged mask openings 9 and acts as a shadow mask. The edge region 8 ′ of the mask 8 is fixed on the mask frame 10 , so that the mask 8 only sags to a minimum degree in the state of being separated from the substrate 20 .

The mask frame 10 is carried by the support frame 23 . For this purpose, the support frame 23 has a support surface with at least several sections on which the sections of the hood frame 10 rest in a planar manner, so that heat transfer can take place. Thus, the underside of the hood frame 10 , which can be solid, but can also consist of pipes, rests at least in sections on the support frame 23 in a planar and heat-transfer manner. The support frame 23 has a tempering medium for cooling the support frame 23 . For this purpose, a temperature control channel 24 is shown in the figure, through which a temperature control medium can flow. The temperature adjustment medium used here can be the same as the temperature adjustment medium flowing through the temperature adjustment channel 22 of the substrate support 21 .

The masking device 7 is surrounded by a heating frame 25 . The heating frame 25 can be heated to a temperature higher than 200°C by means of a tempering medium. For this purpose, a heating element 18 in the form of a tempering channel is shown in the figure, through which a heating medium can flow. However, in order to heat the exhaust surface 4 in particular, the following scheme can also be adopted here: the heating energy is delivered electrically, so the temperature-adjusting medium is a heating wire.

According to the invention, the heating frame 25 surrounding the mask device 7 is thermally separated from the mask frame 10 . The heating frame 25 is at the same vertical level as the shielding means 7 extending in the horizontal plane. The side surface 25 ′ of the heating frame 25 constitutes the wall of the gap 26 . In the embodiment shown in FIG. 2 , the opposite wall of the gap 26 is formed by a side surface of the mask frame 10 . Therefore, the gap 26 constitutes an insulating member. The two spacer portions facing each other can in particular be of a highly glossy embodiment, for example gold-plated and/or polished. However, the emission coefficient of this layer need not be less than 0.04.

In FIG. 3 showing the second embodiment, the insulator is denoted by reference numeral 11 . This insulator 11 can have different technical solutions. It serves to thermally separate the heating frame 25 from the mask frame 10 . The insulator 11 is located between the heating frame 25 and the mask frame 10 so that a temperature gradient is formed within the insulator 11 . The thermal conductivity of insulator 11 is minimized, minimizing heat flow from heating frame 25 to mask frame 10 .

The outer edge 8 ′ of the mask 8 may be positioned above the mask frame 10 in the vertical direction. However, the edge 8 ′ can also extend only through the mask frame 10 , so that the insulator 11 surrounds not only the mask frame 10 but also the mask 8 . However, the solution shown in dashed lines in FIG. 3 can also be used: the mask edge 8 ′ extends past the insulator 11 . The edge of the mask can also coincide with the outer edge of the insulator 11 . In this way, the insulator 11 can be covered to achieve the integrity of the edge section of the mask 8 .

Another gap 27 may be provided between the insulator 11 and the substrate holder 21 .

FIG. 5 shows a third embodiment of the invention, in which the insulator 11 is formed by several shielding plates 12 extending in a vertical plane. The shielding plates 12 are held at a distance from each other by the spacer elements 14 . The mutually facing surfaces 12', 12" of the shielding plates are preferably highly reflective. The surfaces are especially metal-clad, and especially gold-plated, so that their emissivity is preferably less than 0.04.

In the fourth embodiment shown in FIG. 8 , the shielding plate 12 is constituted by the shielding frame 10 in a single material manner. Therein, the mask frame 10 may be composed of a solid metal body in which a number of grooves are milled to form a comb-shaped cross-section. Among them, the comb teeth are constituted by the shielding plate 12 . In this case, the mutually facing surfaces 12', 12" of the shielding plate can also be coated with a high gloss. In the fourth embodiment shown in FIG. 6, the connecting piece constituting the shielding plate bearing section 16 is located below .

In the fifth embodiment shown in FIG. 7 , the shielding plate bearing section 16 is located above, and can also be overlapped by the shielding 8 here.

In the sixth embodiment shown in FIG. 8, the space between the shielding plates 12 is filled with insulating material, and the insulating material has a low thermal conductivity. In this case, the edge 8 ′ of the mask 8 also extends to the outermost edge of the insulator 11 .

In the seventh embodiment shown in FIG. 9 , the space between the shielding plates 12 is also filled by the insulating member 15 . In this case, however, the edge 8 ′ of the mask 8 does not extend past the insulator 11 , but terminates above the mask frame 10 in the vertical direction.

The aforementioned shielding plates 12 are arranged side by side in a parallel position. There are preferably at least 2, 3, 4 or 5 shielding plates 12 arranged parallel and side by side in a manner extending in a vertical plane. The shielding plate 12 may be formed of metal. The shielding plates may have a minimum material thickness and consist of high gloss coated metal films. However, it is also possible to manufacture the shielding plate 12 with a larger material thickness, so that the shielding plate has sufficient dimensional stability. In addition, the following scheme is adopted: the coated shielding plate 12 is made of a material with poor thermal conductivity, especially a metal with poor thermal conductivity. Foamed metal can also be used here.

If an insulating layer 15 is provided between the shielding plates 12 , the insulating layer 15 may also be composed of metal, such as metal foam. However, the insulating layer 15 can also be made of another material, such as mineral material or plastic.

By means of the measures of the present invention, the following solution is achieved: when applying the masking device in the aforementioned devices, and in the method of depositing OLEDs, the temperature of the masking device varies only within a narrowly defined temperature range. In particular, the invention proposes that the shield 8 expands laterally only minimally over its entire extension.

The means for thermally separating the heating frame 25 from the mask frame 10 may be arranged and designed so that the coating method is carried out such that the temperature of the outer edge region of the mask means is higher than the condensation temperature of the steam . In particular, the invention proposes that, in this coating method, a temperature gradient is achieved within the insulating body 11, wherein the temperature at the outer edge of the insulating body 11 facing away from the mask frame 10 is higher than the condensation temperature of the steam, and that the temperature between the insulating body 11 is higher than the condensation temperature of the steam. The temperature on the edge facing the mask frame 10 is lower than the condensation temperature of the steam. Therefore, all components of the surrounding environment of the substrate whose temperature during the deposition of the OLED layer is below the condensation temperature of the vapor corresponds to the masking device 7 and can be replaced after deposition of one or several layers.

In particular, mask replacement is simplified by the fact that neither the mask frame 10 nor the insulator 11 is cooled by cooling means. However, the following solution can also be adopted: the mask frame 10 and/or the insulator 11 are cooled by the temperature regulating medium.

Preferably, steel or another material whose thermal expansion coefficient is minimized or at least partially disappears in the temperature range of 0° C. to 120° C. is used as the material for the mask 8 . The material used to make the mask frame may be a bulk material, a layer system, a compound, a matrix-containing fiber material, a carbon fiber material, or other material systems. The fiber-reinforced material can in particular have anisotropic thermal expansion properties. Thermal expansion in a spatial direction may be less than 1 ppm. Thermal expansion can be higher in another direction, such as the vertical direction.

The present invention also proposes that the insulator 11 is integrated in the mask device 7 . Furthermore, the insulator 11 may be covered by the mask 8 . By using the insulator 11, the mask frame 10 can be made of materials other than steel. In particular, the mask frame is produced from the aforementioned materials with anisotropic thermal expansion properties. The insulator 11 can in particular be a frame-like body which constitutes an insulating member surrounding the mask frame 10 . The shielding plate 12 forms a heat shielding plate arrangement, which is in particular fastened to the shielding frame 10 . However, the heat shield device can also be fixed on the heating frame 25 .

The foregoing embodiments are used to illustrate the inventions contained in the present application as a whole. These inventions independently constitute improvements over the prior art through at least the following feature combinations, wherein two or more of these feature combinations may also be combined. or all in combination, ie: a device characterized in that the mask frame 10 is surrounded by the heating frame 25 heated by the heating means 18 and is thermally separated from the heating frame 25 .

An apparatus characterized in that thermal insulating members 11 and 26 are provided between the mask frame 10 and the heating frame 25 .

A device, characterized in that the insulating member has an insulator 11 , in particular a frame-shaped insulator 11 .

A device is characterized in that: the insulator 11 has a plurality of shielding plates 12 with reflecting surfaces 12 ′, 12 ″ facing the heating frame 25 and/or the shielding frame 10 .

A device is characterized in that the reflective surfaces 12', 12" have high reflectivity, and/or the shielding plate 12 has low thermal conductivity.

A device is characterized in that the shielding plate 12 is made of an insulating body 11 in a single material and protrudes from the shielding plate carrier section in a comb-like manner, in particular in cross-section.

A device characterized in that the insulator 11 has a multilayer structure, wherein the layers extend transversely to the plane of extension of the substrate holder 21 or the heating frame 25 .

A device characterized in that the insulator 11 is connected to the mask frame 10 and/or to the heating frame 25 in a single material manner.

A device characterized in that the mask frame 10 rests on a support frame 23 which can be cooled by means of cooling elements.

A device characterized by a gas inlet member 2 that can be heated by a heating member, which is arranged vertically above the substrate holder 21 and extends over substantially the entire surface of the substrate holder 21, wherein the gas inlet member 2 is particularly A second heating frame 28 is provided.

An apparatus characterized in that the heating members are capable of heating the heating frame 25 surrounding the mask frame 10 to a temperature of at least 100°C, 150°C or 200°C and/or the cooling members are capable of cooling the mask frame 10 to a maximum temperature of 0°C, 10°C, 20°C or 100°C.

A device characterized in that the thermally insulating members are fastened to the mask frame 10 and/or that the edge 8' of the mask 8 extends at least partially past the thermally insulating members.

A method characterized by: adjusting the heating frame 25 to a temperature above the condensation temperature of the steam, and condensing the mask frame 10 to a temperature below the condensation temperature of the steam, wherein the heating frame 25 and the mask frame 10 are The temperature gradient between the two extends through the insulating members 11 , 26 such that the location of this condensation temperature is located within the insulating members 11 , 26 .

All disclosed features (either as a single feature or as a combination of features) are essential to the invention. Therefore, the disclosure content of this application also includes all the content disclosed in the related/attached priority files (copy of the earlier application), and the features described in these files are also included in the patent scope of this application. Subsidiaries (even in the absence of the features of the claims cited) describe the features of the improvement of the present invention over the prior art with their features, and their purpose is mainly to file divisional applications on the basis of these claims. Furthermore, the invention set forth in each claim may have one or more of the features set forth above, in particular by reference numerals and/or in the description of symbols. The invention also relates to embodiments in which individual ones of the aforementioned features are not implemented, especially if these are obviously superfluous for the particular purpose or can be replaced by technically equivalent means.

7‧‧‧Mask device

8‧‧‧Mask

8'‧‧‧Edge

9‧‧‧Mask opening

10‧‧‧Mask frame

11‧‧‧Insulators

18‧‧‧Heating components

20‧‧‧Substrate

21‧‧‧Substrate bracket

22‧‧‧Temperature channel

23‧‧‧Support frame

24‧‧‧Temperature channel

25‧‧‧Heating frame

25'‧‧‧Side

26‧‧‧Insulation gap

27‧‧‧Clearance

Claims (14)

A device for depositing a layer laterally structured by using a mask on at least one substrate (20) by feeding steam into a deposition chamber (19) and condensing the steam on the substrate (20) , having a substrate holder (21) for holding the substrate (20) that can be cooled by a cooling member (22), a mask fixed on the mask frame (10) for abutting against the substrate (20) (8), and a heating frame (25) heated by a heating member (18) thermally separated from the mask frame (10), characterized in that the mask frame (10) surrounds the mask (8) ) is surrounded by the heating frame (25), wherein thermal insulating members (11, 26) are provided between the mask frame (10) and the heating frame (25). The device of claim 1, wherein the thermally insulating members have frame-like insulators (11). The device of claim 2, wherein the insulator (11) has a shielding plate (12) having a reflecting surface (12', 12" facing the heating frame (25) and/or facing the shielding frame (10) ). The device of claim 3, wherein the reflecting surfaces (12', 12") have high reflectivity, and/or the shielding plates (12) have low thermal conductivity. 3. The device of claim 3, wherein the shielding plates (12) are made of the insulator (11) in a single material manner and protrude from the shielding plate carrying section in a comb-like manner in cross section. The device of claim 2, wherein the insulator (11) has a multilayer structure, wherein the layers extend in a direction transverse to the plane of extension of the substrate holder (21) or the heating frame (25). The device of claim 3, wherein the insulator (11) is made of a single material Connected with the mask frame (10) and/or with the heating frame (25). The device of claim 1, wherein the heating means are capable of heating the heating frame (25) surrounding the mask frame (10) to a temperature of at least 100°C, and/or the cooling means are capable of heating the mask The frame (10) is cooled to a maximum temperature of 0°C. 9. The device of claim 1, wherein the thermally insulating members are fastened to the shield frame (10), and/or the edge (8') of the shield (8) extends at least partially through the heat shields insulating member. The device of claim 1, wherein the edge (8') of the mask (8) is fixed to the mask frame (10), the mask frame surrounding the substrate holder (21) in a horizontal plane . A device for depositing a layer laterally structured by using a mask on at least one substrate (20) by feeding steam into a deposition chamber (19) and condensing the steam on the substrate (20) , having a substrate holder (21) for holding the substrate (20) that can be cooled by a cooling member (22), a mask fixed on the mask frame (10) for abutting against the substrate (20) (8), and a heating frame (25) heated by a heating member (18) thermally separated from the mask frame (10), characterized in that the mask frame (10) surrounds the mask (8) ) is surrounded by the heating frame (25), wherein the mask frame (10) rests on a support frame (23) which can be cooled by means of cooling elements. A device for depositing a layer laterally structured by using a mask on at least one substrate (20) by feeding steam into a deposition chamber (19) and condensing the steam on the substrate (20) , having a substrate holder (21) for holding the substrate (20) that can be cooled by a cooling member (22), a mask fixed on the mask frame (10) for abutting against the substrate (20) (8), and a heating frame (25) heated by a heating member (18) thermally separated from the mask frame (10), characterized in that the mask frame (10) surrounds the mask (8) ) is surrounded by the heating frame (25), with A hot gas inlet member (2) arranged vertically above the substrate holder (21) and extending over substantially the entire face of the substrate holder (21), wherein the gas inlet member (2) is surrounded A second heating frame (28) is provided. A method of depositing layers using an apparatus having a substrate holder (21) for holding a substrate (20), which can be cooled by a cooling member (22), fixed on a mask frame (10) A mask (8) for adhering to the substrate (20), and a heating frame (25) thermally separated from the mask frame (10) by heating by heating means (18), wherein the mask is (8) The surrounding mask frame (10) is surrounded by the heating frame (25), characterized in that the heating frame (25) is adjusted to a temperature higher than the condensation temperature of the steam, and the mask frame is (10) Condensing to a temperature below the condensation temperature of the steam, wherein the temperature gradient between the heating frame (25) and the hood frame (10) extends through the thermal insulation members (11, 26) such that the condensation temperature are located within the thermally insulating members (11, 26). The method of claim 13, wherein the edge (8') of the mask (8) is fastened to the mask frame (10) which surrounds the substrate holder (21) in a horizontal plane .

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