TW201920718A - Device for depositing a structured layer on a substrate with use of a mask - Google Patents

Abstract

The invention relates to a device for depositing layers that are laterally structured by the use of masks on at least one substrate (20), in particular by feeding a vapour into a deposition chamber (19) and condensing the vapour on the substrate (20), said device having a substrate holder (21), coolable by means of coolants (22), for holding the substrate (20) and a mask (8) secured to a mask frame (10) for positioning on the substrate (20). Measures are described, by means of which precisely structured layers can be deposited reproducibly on the substrate. The mask frame (10) is surrounded by a heating frame (25) heated by means of heating media (18). Thermal insulating means are provided between the mask frame (10) and heating frame (25). The invention further relates to a method for depositing layers with use of a device of the type in question.

Description

   Device for depositing a structured layer on a substrate using a mask   

The invention relates to a device for depositing a laterally structured layer by using a mask on at least one substrate, and in particular, it is realized by feeding steam into a deposition chamber and condensing steam on the substrate. A substrate holder for holding the substrate cooled by the cooling member, and a mask for abutting to the substrate fixed on the mask frame.

Such a device is described in DE 10 2013 101 586 A1. With the use of, for example, an evaporator as described in WO 2012/175128 A1, steam is generated from an organic material and this steam is fed into the deposition through an actively heated gas inlet member such as described in DE 10 2014 116 991 A1 Device deposition chamber. A substrate holder cooled to a temperature lower than the condensation temperature of steam by a cooling member is provided below the gas inlet member in a vertical direction, and a substrate is abutted on the substrate holder, which is coated with an organic starting material. This organic starting material is a molecule that emits light in the condensed state due to the passage of current. This type of OLED is used to make screens. To make red, green, and blue pixels, different organic starting materials are used. In order to laterally structure the layer deposited on the substrate in a pixel grid, a shadow mask is used. The material thickness of such masks is between 1 μm and 100 μm. It is usually 40 μm. The structure size of the masked structure is several μm. The area of the substrate holder or the mask can be within a square meter.

US 2005/0037136 A1 describes a device for depositing an organic layer by means of a mask fixed under a mask support. This mask holder has a cooling member for cooling the mask and a heating member for heating the side of the mask holder facing away from the cooling medium.

US 2013/0040054 A1 describes a device for depositing layers on a substrate on a cooled substrate support, wherein a shield plate can be fed between the substrate support and a heated gas inlet member.

The object of the present invention is to improve the same type of device in a convenient way, and in particular to provide measures for depositing a precisely structured layer on a substrate in a reproducible manner.

The solution for achieving the above object of the present invention is the invention given in the scope of patent application. Among them, the subsidiary item is not only a beneficial improvement solution for the independent item but also an independent solution for achieving the above object.

The invention relates to a method for manufacturing a self-emitting display equipped with an organic light emitting diode. An OLED is deposited in a process chamber of a reactor, and a substrate support is provided in the process chamber, and a large-area substrate to be coated is abutted on the substrate support. The substrate holder is cooled so that the organic starting material fed into the process chamber through the heated gas inlet member can condense on the surface of the substrate. In order to implement the method, the process chamber should be (but preferably not only) designed so that the deposition of organic starting materials occurs only on the substrate or on a mask that is placed against the substrate, and not elsewhere in the process chamber. , Especially condensation. That is, the deposition of starting materials at other locations within the process chamber may have the following consequences: the deposits evaporate when other layers are deposited using other organic starting materials and cause undesired contamination of steam.

By heating the frame surrounded by the mask frame, the vapor fed through the gas inlet member is prevented from being deposited in the deposition chamber at a location where re-evaporation of the deposit may occur. The mask frame is prevented from being heated by a thermal insulating member extending between the heating frame and the mask frame, or the heating frame is prevented from being cooled below the deposition temperature in an area adjacent to the mask frame. The mask frame can rest on a support frame cooled by a cooling member. The support frame surrounds the cooled substrate support. However, the thermal contact of the mask frame on the support frame is insufficient to prevent the mask frame from being heated to a temperature higher than, for example, 20 ° C or 10 ° C. The mask frame is a member that surrounds the mask and is used to transport the mask and hold it in a horizontal position. The mask is a thin film structured by openings arranged in a grid shape having a thickness of 1 to 100 μm, wherein the thin film is brought into contact with the surface of a substrate. Each of the openings represents a pixel, where red, blue, and green pixels are, for example, side by side, and are deposited in successive coating steps. But luminescent, especially OLED pixels are not limited to these colors or color combinations. The pixels may also have other colors or shades. The mask does not allow lateral distortion in the application, and in particular, deposits OLED pixels at specified locations at the edges. The mask is made in particular of steel, which has a coefficient of thermal expansion that almost disappears over a specific temperature range. However, due to the required deposition accuracy, the thermal expansion must be less than 10 μm, preferably less than 1 μm, in the temperature range when the mask is used. By thermally separating the mask frame from the heating frame, the mask frame is only slightly heated on the one hand, and the edges of the heating frame are only slightly cooled on the other. With these additional thermally insulating members, heating due to heat radiation originating from the heating frame is particularly prevented. These insulating members may be composed of an insulator that surrounds the mask frame or the substrate holder surrounded by the mask frame in a frame-like manner so as to extend in a horizontal plane. The insulator may have one or more shielding plates. These shielding plates have surfaces facing away from each other, which can have high reflectivity and, in particular, a small emission coefficient of 0.04. These surfaces can be highly gloss coated. These wide sides face both the heating frame and the mask frame. In addition, the thermal conductivity of these shielding plates is preferably lower. To this end, the shielding plates can be made of, for example, foamed material, foamed plastic or foamed metal. These shielding plates may be made of a single material from an insulator. For example, several grooves can be made in the insulator, so that the ribs left between the grooves constitute a shielding plate. In this case, the shielding plates substantially comb-likely protrude from the bearing section of the insulator. As an alternative to cutting manufacturing of such insulators, insulators can also be cast. The shielding panels are particularly preferably made of metal and have a metallic surface coating. The surface coating may be a gold coating. In addition, the insulator may be connected to the mask frame in a single material manner. For example, the insulator may constitute a shield plate formed by forming a groove of the mask frame. But similarly, the insulator can correspond to the heating frame in a single material. A system composed of several shielding plates that are parallel to each other and spaced apart from each other can surround the shielding frame in a frame shape, wherein the shielding plates extend in a vertical plane. The invention particularly proposes that the insulator establishes a thermally conductive connection with the support frame, and the support frame is cooled by a cooling member. The insulator can also be overlapped by the edges of the mask. However, the thermal separation between the heating frame and the mask frame can also be achieved through the gap between the mask frame and the heating frame. In this case, the faces of the heating frame and the mask frame facing each other may also be highly gloss coated and / or polished, so that these faces have the smallest reflection coefficient. It is also possible that the outer edge of the mask extends at least partially through the insulator. The mask can extend to the outer edge of the mask frame. With the appropriate selection of the components for thermal separation, a lateral temperature gradient is achieved on the outer edge of the masking device, which is changed after each coating step, but not necessarily, where, In the radially outward position, the temperature of the masking device is higher than the condensation temperature. However, the slope of the temperature gradient is sufficiently large so that the surface temperature of the mask is sufficiently lower than the condensation temperature over the entire range of the mask surface.

The invention also relates to a method for depositing a layer using the aforementioned device, wherein the mask frame is temperature-controlled so that its temperature is lower than the condensation temperature, and the heating frame is temperature-controlled so that it The temperature is higher than the condensation temperature of steam. A temperature gradient is formed in which the location of the freezing temperature falls in the area between the mask frame and the heating frame. The condensation point is preferably located in the region of the insulating member, especially in the region of the insulator.

The mask frame preferably extends along a peripheral line in a horizontal plane, so that the substrate support is surrounded by the mask frame. The edge of the mask is fixed on the mask frame. The mask frame may be a rectangular frame surrounded by a rectangular heating frame.

1‧‧‧shell

2‧‧‧Gas inlet member

3‧‧‧Steam feed port

4‧‧‧ exhaust surface

5‧‧‧ exhaust port

6‧‧‧Temperature channel

7‧‧‧Mask device

8‧‧‧Mask

8'‧‧‧ edge

9‧‧‧Mask opening

10‧‧‧Mask frame

11‧‧‧ insulator

12‧‧‧shield

12'‧‧‧Reflective surface

12 "‧‧‧Reflective surface

13‧‧‧ Intermediate cavity

14‧‧‧ spacer element

15‧‧‧ Insulation

16‧‧‧Connector

18‧‧‧ heating element

19‧‧‧ Deposition chamber

20‧‧‧ substrate

21‧‧‧ substrate holder

22‧‧‧Temperature channel

23‧‧‧ support frame

24‧‧‧Temperature channel

25‧‧‧Heating frame

25'‧‧‧ side

26‧‧‧Insulation gap

27‧‧‧ Clearance

28‧‧‧ heating zone

The present invention is described in detail below with reference to the embodiments. The drawings are rough schematic diagrams, not drawn to scale, and are used for illustration only, wherein: FIG. 1 is a cross-sectional view of a housing 1 of a reactor for depositing one or several OLED layers, and FIG. 2 is a first embodiment 1 is an enlarged view of part II in FIG. 1, FIG. 3 is a schematic view according to FIG. 2 of the second embodiment, and FIG. 4 is a cross-sectional view according to the line IV-IV in FIG. 1 in the second embodiment. 5 is a schematic diagram of the third embodiment according to FIG. 2, FIG. 6 is a schematic diagram of the fourth embodiment according to FIG. 2, FIG. 7 is a schematic diagram of the fifth embodiment according to FIG. 2, and FIG. FIG. 8 is a schematic diagram of the sixth embodiment according to FIG. 2, and FIG. 9 is a schematic diagram of the seventh embodiment according to FIG. 2.

The housing shown only by way of example in FIG. 1 has an air-tight wall, which is constructed so that the interior of the housing can be evacuated. A gas inlet member 2 is provided inside the casing 1 and has a gas distribution cavity, and the gas distribution cavity is fed through the steam feed port 3. Organic steam transported via a carrier gas such as a rare gas or a carrier gas such as H ₂ or N ₂ is fed into the gas inlet member 2 through the steam feed port 3. The gas inlet member 2 has a bottom plate that constitutes an exhaust surface 4 that faces the process chamber 19. The exhaust surface 4 has a plurality of exhaust ports 5 arranged in a shower head shape, through which steam can enter the process chamber 19 from the gas inlet member 2. The exhaust plate with the exhaust port 5 has a temperature-adjusting channel 6 through which the temperature-adjusting medium can flow in, for heating the gas inlet member 2 and the exhaust surface 4 facing the process chamber 19 in particular. To temperatures above the condensation temperature of steam. For example, the current flowing through the heat conductor can be used as a temperature control medium.

Furthermore, a heating zone 28 is provided around the gas inlet member 2. The heating zone is a heating frame, which is maintained at a temperature higher than the condensation temperature of steam by a suitable temperature-controlling medium (such as a temperature-control liquid) or electrical heating.

A substrate holder 21 is provided below the gas inlet member 2 and extends substantially over the entire surface of the exhaust surface 4. The size of the supporting surface of the substrate 20 abutting on the substrate holder 21 may be in the range of square meters or larger. However, the surface may also be less than 1m ^2, for example, in a range of 0.04m ^2. The steam fed into the process chamber 19 needs to be deposited on the substrate 20 in a laterally structured manner. This is achieved by condensation, and therefore, cooling members 22 are provided, by which the supporting surface of the substrate 20 for the substrate holder 21 is cooled to a temperature lower than the deposition temperature of steam. In the case where the temperature of the gas inlet member 2 or the heating zone 28 is greater than 100 ° C, 150 ° C, or 200 ° C, the temperature of the substrate supporting surface is less than 0 ° C, 10 ° C, or 20 ° C. The temperature of the substrate supporting surface may be less than 100 ° C. The temperature of the substrate supporting surface is usually 20 ° C.

In order to structure the layers to be deposited on the substrate 20 laterally, a masking device 7 is provided. The mask device 7 is composed of a mask frame 10 that surrounds a substrate holder 21. The mask holder 10 carries a mask made of steel, which is a film having a material thickness of 10 μm to 100 μm. This mask has several regularly arranged mask openings 9 and acts as a shadow mask. The edge region 8 ′ of the mask 8 is fixed to the mask frame 10 so that the mask 8 hangs down to a minimum degree in a state separated from the substrate 20.

The mask frame 10 is carried by the support frame 23. The support frame 23 has a support surface for this purpose, which has at least several sections on which the sections of the shield frame 10 are abutted flatly, so that heat transfer can take place. Therefore, the bottom side of the mask frame 10, which may be solid, but may also be composed of a pipe, bears against the support frame 23 at least partially in a planar manner and a heat transfer manner. The support frame 23 has a temperature control medium for cooling the support frame 23. For this purpose, a temperature control channel 24 is shown in the drawing, through which a temperature control medium can flow. The temperature-adjusting medium used here may be the same as the temperature-adjusting medium flowing through the temperature-adjusting channel 22 of the substrate holder 21.

The masking device 7 is surrounded by a heating frame 25. The heating frame 25 can be heated to a temperature higher than 200 ° C by a temperature control medium. For this purpose, a heating element 18 in the form of a temperature control channel is shown in the drawing, which allows a heating medium to flow through. However, in particular, in order to heat the exhaust surface 4, the following scheme can also be adopted here: The heating energy is electrically transmitted, so the temperature-adjusting medium is a heating wire.

According to the present invention, the heating frame 25 surrounded by the mask device 7 is thermally separated from the mask frame 10. The heating frame 25 is at the same vertical height as the masking device 7 extending in a horizontal plane. The side surface 25 ′ of the heating frame 25 constitutes a wall portion of the gap 26. In the embodiment shown in FIG. 2, the opposite wall portion of the gap 26 is formed by one side of the mask frame 10. Therefore, the gap 26 constitutes an insulating member. In particular, the two-face-to-face gap walls can be implemented with a highly glossy embodiment, such as gold-plated and / or polished. However, the emission coefficient of this layer need not be less than 0.04.

In FIG. 3 showing the second embodiment, an insulator is indicated by an element symbol 11. The insulator 11 may have different technical solutions. It is used to thermally separate the heating frame 25 from the mask frame 10. The insulator 11 is located between the heating frame 25 and the mask frame 10 so that a temperature gradient is formed in the insulator 11. The thermal conductivity of the insulator 11 is minimized, so that the heat flow from the heating frame 25 to the mask frame 10 is minimized.

The outer edge 8 ′ of the mask 8 may be located above the mask frame 10 in a vertical direction. However, the edge 8 ′ may only extend through the mask frame 10 so that the insulator 11 not only surrounds the mask frame 10 but also the mask 8. However, the solution shown in dashed lines in FIG. 3 can also be used: the mask edge 8 ′ extends through the insulator 11. The edge of the mask may also coincide with the outer edge of the insulator 11. In this way, the insulator 11 can be covered to achieve the integrity of the edge section of the mask 8.

Another gap 27 may be provided between the insulator 11 and the substrate holder 21.

FIG. 5 shows a third embodiment of the present invention, in which the insulator 11 is composed of a plurality of shielding plates 12 extending in a vertical plane. The shielding plate 12 is held by the spacer element 14 at a certain distance from each other. The mutually facing surfaces 12 ', 12 "of these shielding plates preferably have high reflectivity. These surfaces are especially coated with metal and particularly preferably plated with gold, so that their emission coefficients are preferably less than 0.04.

In the fourth embodiment shown in FIG. 8, the shielding plate 12 is constituted by the mask frame 10 in a single material manner. The mask frame 10 may be composed of a solid metal body, and a plurality of grooves are milled in the metal body to form a comb-shaped cross section. Among them, the comb teeth are constituted by the shielding plate 12. In this case, the mutually facing surfaces 12 ', 12 "of the shielding plate may also be coated with a high gloss. In the fourth embodiment shown in FIG. 6, the connecting piece constituting the shielding plate bearing section 16 is located below .

In the fifth embodiment as shown in FIG. 7, the shielding plate carrying section 16 is located above, and can also be overlapped by the shielding 8 here.

In the sixth embodiment shown in FIG. 8, the space between the shielding plates 12 is filled with an insulating material, which has a lower thermal conductivity. In this case, the edge 8 ′ of the mask 8 also extends to the outermost edge of the insulator 11.

In the seventh embodiment shown in FIG. 9, the space between the shielding plates 12 is also filled with the insulating member 15. However, in this case, the edge 8 ′ of the mask 8 does not extend through the insulator 11, but terminates above the mask frame 10 in a vertical direction.

The aforementioned shielding plates 12 are arranged side by side in a parallel position. Preferably, at least 2, 3, 4 or 5 shielding plates 12 are provided, which are arranged parallel and side by side in such a way as to extend in a vertical plane. The shielding plate 12 may be made of metal. These shielding plates can have a minimum material thickness and consist of a highly glossy coated metal film. However, the shielding plate 12 having a larger material thickness can also be manufactured, so that the shielding plate has sufficient shape stability. In addition, the following scheme is adopted: The coated shielding plate 12 is composed of a material with poor thermal conductivity, especially a metal with poor thermal conductivity. Foamed metal can also be used here.

If an insulating layer 15 is provided between the shielding plates 12, the insulating layer 15 may be made of metal, for example, metal foam. However, the insulating layer 15 can also be made of another material, such as a mineral material or plastic.

By the measures of the present invention, when the mask device is applied to the foregoing device, and in the method of depositing OLED, the temperature of the mask device changes only within a narrowly defined temperature range. In particular, the invention proposes that the mask 8 only expands laterally to a minimum extent over its entire extension.

The component for thermally separating the heating frame 25 and the mask frame 10 may adopt a certain arrangement and design scheme, so that the coating method is implemented so that the temperature of the outer edge region of the mask device is higher than the condensation temperature of steam . The invention particularly proposes that in this coating method, a temperature gradient is achieved in the insulator 11, wherein the temperature of the outer edge of the insulator 11 facing away from the mask frame 10 is higher than the condensation temperature of steam, and the temperature of the insulator 11 The temperature on the edge facing the mask frame 10 is lower than the condensation temperature of the steam. Therefore, all the components of the adjacent environment of the substrate during the deposition of the OLED layer that have a temperature lower than the condensation temperature of the steam correspond to the mask device 7 and can be replaced after one or several layers are deposited.

In particular, the mask replacement is simplified by the fact that neither the mask frame 10 nor the insulator 11 is cooled by a cooling member. However, the following solution may also be adopted: the mask frame 10 and / or the insulator 11 are cooled by a temperature-regulating medium.

It is preferable to use as the material for the mask 8 a material which is minimized or at least partially disappeared due to steel or another thermal expansion coefficient, particularly in a temperature range of 0 ° C to 120 ° C. The material used to make the mask frame may be a bulk material, a layer system, a compound, a matrix-containing fiber material, a carbon fiber material, or other material system. The fiber-reinforced material may particularly have anisotropic thermal expansion characteristics. Thermal expansion in a spatial direction may be less than 1 ppm. Thermal expansion can be higher in another direction, such as in the vertical direction.

The invention also proposes that the insulator 11 is integrated in the mask device 7. In addition, the insulator 11 may be covered by a mask 8. By using the insulator 11, the mask frame 10 can be made of a material other than steel. In particular, the mask frame is made of the aforementioned material having anisotropic thermal expansion characteristics. The insulator 11 may be a frame-shaped body, which is an insulating member that surrounds the mask frame 10. The shield plate 12 constitutes a heat shield device, which is particularly fixed to the shield frame 10. However, the heat shielding plate device may be fixed on the heating frame 25.

The foregoing embodiments are used to describe the inventions included in the present application as a whole. These inventions independently constitute an improvement scheme relative to the prior art through at least the following feature combinations. Among them, two or more of these feature combinations can also be used. Or all of them are combined with each other, that is, a device characterized in that the mask frame 10 is surrounded by the heating frame 25 heated by the heating member 18 and is thermally separated from the heating frame 25.

A device characterized in that thermal insulation members 11 and 26 are provided between the mask frame 10 and the heating frame 25.

A device is characterized in that the insulating member has an insulator 11, particularly a frame-shaped insulator 11.

A device is characterized in that the insulator 11 has a plurality of shielding plates 12 having reflecting surfaces 12 ′, 12 ″ facing the heating frame 25 and / or the shielding frame 10.

A device characterized in that the reflective surfaces 12 ', 12 "have high reflectivity and / or the shielding plate 12 has low thermal conductivity.

A device is characterized in that the shielding plate 12 is composed of the insulator 11 in a single material manner, and particularly projects from the shielding plate bearing section in a comb-like manner in cross section.

A device is characterized in that the insulator 11 has a multilayer structure, wherein the layers extend in a direction transverse to the extending plane of the substrate holder 21 or the heating frame 25.

A device is characterized in that the insulator 11 is connected to the mask frame 10 and / or the heating frame 25 in a single material manner.

A device is characterized in that the mask frame 10 abuts on a support frame 23 that can be cooled by a cooling member.

A device characterized by a gas inlet member 2 that can be heated by a heating member, which is arranged above the substrate holder 21 in a vertical direction and extends substantially over the entire surface of the substrate holder 21, wherein the gas inlet member 2 surrounds It is provided with a second heating frame 28.

A device characterized in that the heating members can heat the heating frame 25 surrounding the mask frame 10 to a temperature of at least 100 ° C, 150 ° C, or 200 ° C, and / or the cooling member can cool the mask frame 10 To a maximum temperature of 0 ° C, 10 ° C, 20 ° C or 100 ° C.

A device characterized in that the thermal insulation members are fixed on the mask frame 10 and / or the edge 8 'of the mask 8 extends at least partially through the thermal insulation member.

A method characterized by adjusting the heating frame 25 to a temperature higher than the condensation temperature of steam, and condensing the mask frame 10 to a temperature lower than the condensation temperature of steam, wherein the heating frame 25 and the mask frame 10 The temperature gradient between them extends through the insulating members 11 and 26 so that the position of the condensation temperature is located in the insulating members 11 and 26.

All the disclosed features (as a single feature or a combination of features) are the essence of the invention. Therefore, the disclosure content of this application also includes all the content disclosed in the related / attached priority files (copy of the previous application), and the features described in these files are also included in the scope of patent application of this application. Ancillary items (even in the absence of the characteristics of the claimed items cited) use their characteristics to describe the characteristics of the present invention's improvement schemes to the prior art, and the main purpose is to make a divisional application based on these items. In addition, the invention given in each claim may have one or more of the features previously indicated, in particular by the symbol of the element and / or in the description of the symbol. The present invention also pertains to embodiments in which individual features of the foregoing features are not achieved, especially where such features are obviously redundant for a particular use or can be replaced by a technically equivalent means.

Claims (15)

    A device for depositing a laterally structured layer by using a mask on at least one substrate (20), realized by feeding steam into a deposition chamber (19) and condensing steam on the substrate (20) A substrate holder (21) for holding a substrate (20) cooled by a cooling member (22), and a mask (8) fixed to the mask frame (10) for abutting on the substrate (20) ), And a heating frame (25) that is thermally separated from the mask frame (10) by heating by a heating member (18), characterized in that the mask frame (10) surrounding the mask (8) is It is surrounded by a heating frame (25).         The device according to claim 1, wherein an insulating member (11, 26) is provided between the mask frame (10) and the heating frame (25).         The device according to claim 2, wherein the insulating members have an insulator (11), particularly a frame-like insulator (11).         The device according to claim 3, wherein the insulator (11) has a shielding plate (12) having a reflecting surface (12 ', 12 "facing the heating frame (25) and / or facing the shielding frame (10) ).         The device according to claim 4, wherein the reflecting surfaces (12 ', 12 ") have high reflectivity, and / or the shielding plates (12) have low thermal conductivity.         The device according to claim 4, wherein the shielding plates (12) are composed of an insulator (11) in a single material manner, and project from the shielding plate bearing section in a comb-like manner in cross section in particular.         The device according to claim 3, wherein the insulator (11) has a multilayer structure, wherein the layers extend in a direction transverse to an extension plane of the substrate holder (21) or the heating frame (25).         The device according to claim 4, wherein the insulator (11) is connected to the mask frame (10) and / or the heating frame (25) in a single material manner.         The device of claim 1, wherein the mask frame (10) abuts on a support frame (23) that can be cooled by a cooling member.         The device according to claim 1, wherein a gas inlet member (2) capable of being heated by the heating member is arranged above the substrate holder (21) in a vertical direction and substantially over the entire area of the substrate holder (21) An inner extension, wherein a second heating frame (28) is provided around the gas inlet member (2).         The device of claim 1, wherein the heating members are capable of heating the heating frame (25) surrounding the mask frame (10) to a temperature of at least 100 ° C, 150 ° C, or 200 ° C, and / or the cooling member The mask frame (10) can be cooled to a maximum temperature of 0 ° C, 10 ° C, 20 ° C, or 100 ° C.         The device of claim 1, wherein the thermal insulation members are fixed to the mask frame (10), and / or the edges (8 ') of the mask (8) extend at least partially through the thermal insulation member.         A method for depositing a layer when a device is used. The device has a substrate holder (21) for holding a substrate (20) which can be cooled by a cooling member (22), and is fixed to a mask frame (10). A mask (8) for abutting to the substrate (20), and a heating frame (25) thermally separated from the mask frame (10) by heating by a heating member (18), wherein the mask ( 8) The enclosed mask frame (10) is surrounded by a heating frame (25), which is characterized in that the heating frame (25) is adjusted to a temperature higher than the condensation temperature of steam, and the mask frame (10) is condensed to A temperature lower than the condensation temperature of steam, wherein the temperature gradient between the heating frame (25) and the mask frame (10) extends through the insulating member (11, 26) so that the position of the condensation temperature is located at the insulating member (11 , 26).         The device according to any one of the preceding claims 1 to 12, wherein an edge region (8 ') of the mask (8) is fixed on the mask frame (10), and the mask frame is in a horizontal plane The substrate holder (21) is surrounded.         The method of claim 13, wherein the edge region (8 ') of the mask (8) is fixed to the mask frame (10), and the mask frame (21) is in a horizontal plane with the substrate holder (21). around.