TWI772771B - Electrolytic polishing apparatus - Google Patents

Abstract

An apparatus for electrolytic polishing according to an embodiment may include an electrolytic cell in which a receiving space configured to receive an electrolytic polishing target having a plurality of bolt holes and an electrolytic solution is provided, a plurality of cathode-mounting fixtures each having a fastening blot mounted on a polishing portion formed on one surface of the electrolytic polishing target through the plurality of bolt holes, a cathode plate mounted on the polishing portion of the electrolytic polishing target, a clamp installed on the cathode-mounting fixture and fixing the cathode plate, and a rectifier electrically connected to each of the electrolytic polishing target and the cathode plate and applying a positive pole (+) to the electrolytic polishing target and applying a negative pole (-) to the cathode plate. wherein the cathode plate is a modularized lattice-shaped cathode plate comprising a plurality of first cathode grids and a plurality of second cathode grids coupled to the plurality first cathode grids, the modularized lattice-shaped cathode plate comprises a plurality of mounting spaces corresponding to the plurality of bolt holes of the electrolytic polishing target, and the modularized lattice-shaped cathode plate is mounted on the polishing portion of the electrolytic polishing target by the cathode-mounting fixtures through the plurality of mounting space.

Description

Electrolytic grinding device

One embodiment of the present invention relates to an electrolytic polishing apparatus. More specifically, an embodiment of the present invention relates to an electrolytic polishing apparatus for applying electric current to a positive electrode and a negative electrode, and using an electrolyte solution as a medium to induce electrolysis on the surface of a metal for grinding.

Electrolytic Polishing is a method of using the metal dissolved in the electrolyte as the positive electrode (Anode), using the metal insoluble in the electrolyte as the negative electrode (Cathode), and applying voltage to the positive electrode and the negative electrode, so as to use the electrolyte solution. A method of grinding by causing electrolysis on the surface of a metal by means of a medium.

In order to grind metals by this electrolytic grinding, an electrolytic cell is filled with an electrolyte, the metal to be ground is installed as a positive electrode, and a metal insoluble in the electrolyte is installed as a negative electrode, and then a direct current is applied to the positive electrode and the negative electrode.

On the other hand, after electropolishing, a high-viscosity liquid layer containing a large amount of metal ions dissolved from the positive electrode surrounds the positive electrode. In the liquid layer saturated with metal ions, the metal is no longer dissolved, forming a high positive electrode potential, and thus actively combines with oxygen to form an oxide film.

At this time, the dissolved metal ions are mainly accumulated in the concave parts of the metal surface. In the concave parts, the movement and diffusion of the metal ions are small, and the electric passage is not smooth, so that the metal does not dissolve.

On the contrary, in the protruding portion of the metal surface, the metal ion layer is formed thin, so that the current is concentrated, the metal surface is easily dissolved, and the metal surface is made smoother as a whole.

Among them, such electrolytic polishing is carried out by an electrolytic polishing apparatus, and a conventional electrolytic polishing apparatus is disclosed in Patent Document 1, and will be specifically described below with reference to the drawings.

FIG. 1 is a perspective view showing a conventional electrolytic polishing apparatus as a whole. That is, as shown in FIG. 1 , in the electrolytic polishing apparatus of the related art, an electrolytic polishing article 102 including a chamber, a tank, piping, and the like is installed in an electrolytic cell 110 containing an electrolytic solution 112 . Then, after adding a plurality of negative electrode placement fixing frames 120 to the electrolytic polishing part 104 of the electrolytic polishing object 102, the negative electrode plate 130 is placed between the plurality of negative electrode placing fixing frames 120, and is fixed by the C-type clip 140, A quadrilateral negative electrode basic frame is formed.

In addition, the negative electrode plates 130 are arranged at predetermined intervals between the negative electrode basic frames, and are assembled with the C-type clips 140 . In this way, the negative electrode is completed in the electrolytic polishing part 104 of the electrolytic polishing object 102 .

In addition, the remaining surfaces of the electrolytic polishing object 102 are also constructed in the same manner, and the negative plates 130 and the C-type clips 140 are used to form a structure between the surfaces, so as to be firmly fixed.

Therefore, in the electrolytic polishing apparatus of the prior art, a plurality of negative electrode plates 130 can be installed at uniform intervals on the electrolytic polishing part 104 of the electrolytic polishing object 102 through the negative electrode placement fixing frame 120 and the C-type clip 140, and the entire inner and outer surfaces can be easily installed. Grind relatively large workpieces.

However, as described above, the electrolytic polishing apparatus of the prior art requires the method of attaching the negative electrode mounting bracket 120 to the electrolytic polishing part 104 of the electrolytic polishing object 102 and individually attaching the negative electrode plate 130 through the C-clamp 140 . The installation time of the negative plate 130 required for electrolytic grinding takes a long time.

Prior Art Documents: Patent Documents_Korea Registered Patent Publication No. 10-1183218.

technical problem to be solved

The purpose of the embodiments is to provide an electrolytic grinding device, which pre-fabricates negative plates according to the specifications of the electrolytic grinding objects and realizes modularization, so that the negative plates required for the electrolytic grinding of the electrolytic grinding objects can be easily installed.

means of solving problems

In order to solve the problem, the electrolytic polishing device of the embodiment may include: an electrolytic cell (Electrolytic Cell), which is internally equipped with a accommodating space for accommodating an electrolytic polishing object and an electrolyte, and the electrolytic polishing object has a plurality of bolt holes; a plurality of negative electrodes are placed and fixed Each frame includes a connecting bolt, and the negative electrode placement fixing frame is attached to the electrolytic grinding part formed on one side of the electrolytic grinding object through the bolt hole; the negative electrode plate is added to the electrolytic grinding part of the electrolytic grinding object; C-clamp ( C-type Clamp), which is installed on the negative electrode placement holder to fix the negative electrode plate; and a rectifier, which is electrically connected to the electrolytic grinding object and the negative electrode plate respectively, and connects the positive electrode (+) to the electrolytic grinding object and the negative electrode to the negative electrode plate. (-).

The negative plate is a modular lattice-shaped negative plate, which includes a plurality of first negative grid plates and a plurality of second negative grid plates coupled to the plurality of first negative grid plates. The modular lattice-shaped negative plate further includes a plurality of placement spaces, and the placement spaces correspond to the bolt holes. The modular lattice-shaped negative plate is installed on the electrolytic grinding part of the electrolytic grinding object by placing the negative electrode fixing frame through the holding space.

In one embodiment, the electrolytic polishing portion of the electrolytic polishing object is formed in a polygonal or cylindrical shape, and the size of the modular lattice-shaped negative plate corresponds to the size of the electrolytic polishing portion of the electrolytic polishing object.

In one embodiment, the modular lattice-shaped negative electrode plate may include: a first negative electrode grid plate, which is arranged in the electrolytic grinding part in a vertical direction; and a second negative electrode grid plate, which is arranged in a horizontal direction in the electrolytic grinding part. The electrolytic grinding parts of the grinding object are arranged along the intersecting direction of the first negative electrode grid plates while forming the placement space, and are assembled into a grid shape.

As far as the electrolytic polishing apparatus of the embodiment is concerned, the first negative grid plate and the second negative grid grid may be formed in a straight or circular shape with a cross-section of "一", "┓" or "口".

As far as the electrolytic polishing apparatus of the embodiment is concerned, the first negative electrode grid plate and the second negative electrode grid plate may be combined with rivets and integrated.

In addition, with regard to the electrolytic polishing apparatus of the embodiment, the first negative grid plates may be arranged in the horizontal direction, and the second negative grid plates may be arranged along the intersecting direction of the first negative grid plates while forming the placement space.

In addition, in the electrolytic polishing apparatus of the embodiment, the electrolytic polishing object may be formed in a polygonal or cylindrical shape, and an electrolytic polishing portion may be formed inside and outside, respectively.

In addition, in the electrolytic polishing apparatus of the embodiment, the negative electrode plates respectively arranged in the electrolytic polishing parts inside and outside the electrolytic polishing object may be electrically connected to each other.

In addition, in the electrolytic polishing apparatus of the embodiment, the negative electrode mounting bracket may include a square plate, a connecting bolt connected to one side surface of the plate, and a fixing nut screwed and connected to the connecting bolt.

In addition, with regard to the electrolytic polishing device of the embodiment, the negative electrode placement fixing frame may include insulating plates, which are respectively attached to both sides of the quadrangular plate, and are made of rubber, polyurethane, PVC, or bakelite (Bakelite). .

This solution will be made clearer through the following specific content for implementing the invention based on the drawings.

Before that, it should be explained that the words used in this specification and the scope of the patent application should not be interpreted as the meanings in the usual dictionary. Based on this principle, it should only be interpreted as meanings and concepts consistent with the technical idea of the present invention.

effect of invention

According to the embodiment, the negative electrode plate is prefabricated according to the specifications of the electrolytic polishing object formed in a polygonal or cylindrical shape, and the installation time of the negative electrode required for the electrolytic polishing of the electrolytic polishing object can be shortened, so that the electrolytic polishing can be easily carried out. Effect.

The unique viewpoint and specific technical features of the embodiment will be more clarified through the following specific content related to the drawings and an embodiment. It should be noted that, in this specification, when drawing reference numerals are given to the constituent elements of each drawing, the same constituent elements are given the same reference numerals as much as possible even if they are shown in different drawings.

In describing the constituent elements of the embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. This term is only used to distinguish the constituent element from other constituent elements, and the nature or order or sequence of the corresponding constituent element is not limited by the term. When it is stated that a certain constituent element is "connected", "combined" or "continuous" with another constituent element, it should be understood that the constituent element may be directly connected or connected with its other constituent element, but it may also be used between the constituent elements. There is another element of "connection", "joint" or "connection" between them.

The embodiments are described in detail as follows based on the drawings.

As shown in FIGS. 2 to 6 , the electrolytic polishing apparatus 1 of the embodiment includes an electrolytic cell 20 (refer to FIG. 6 ) filled with an electrolyte solution, a negative electrode placement holder 30 , a C-clamp 50 , a rectifier 60 and a lattice negative electrode plate 40 .

Referring to FIG. 6 , the electrolytic cell 20 is provided with an accommodating space 21 inside, and the accommodating space 21 is filled with an electrolytic solution. The electrolytic polishing object 10 is accommodated in the accommodating space 21, immersed in an electrolyte, and as shown in FIG. 2, an electrolytic polishing portion 11 for electrolytic polishing is formed on one surface thereof.

For example, the electrolytic grinding object 10 may be a polygonal chamber (Chamber) or a cylindrical tank (Tank). However, this is just an example, and the electrolytic abrasive article 10 is not necessarily limited to this.

In addition, the electrolytic polishing part 11 may be formed outside or inside the electrolytic polishing object 10 , or may be formed entirely inside and outside the electrolytic polishing object 10 .

Before the electrolytic polishing object 10 is accommodated in the electrolytic cell 20 , a negative electrode placing holder 30 may be added to the electrolytic polishing portion 11 formed inside and outside. That is, the negative electrode placement fixing frame 30 is installed on the electrolytic polishing part 11 , and a jig 50 , such as a C-type clip 50 , is installed on the negative electrode placing fixing frame 30 , so that the grid-shaped negative electrode plate 40 is fixed.

Referring to FIG. 3 , the negative electrode mounting bracket 30 includes, for example, a rectangular plate 31 made of stainless steel, and a rod-shaped connecting bolt 32 can be connected to one side of the plate 31 . The negative electrode placement fixing frame 30 can be attached to the electrolytic polishing part 11 of the electrolytic polishing object 10 through the connecting bolts 32 , and then screwed and fixed by the fixing nuts 33 .

In addition, the negative electrode mounting bracket 30 may be insulated by attaching insulating plates 34 made of rubber, urethane, PVC, or bakelite to both surfaces of the plate 31 .

The negative electrode placement fixing frame 30 is installed on the top, bottom and left and right of the electrolytic grinding part 11 of the electrolytic grinding object 10, and together with the C-type clip 50, the grid-shaped negative electrode plate 40 is fixed, so that during the electrolytic grinding process, the grid-shaped negative electrode plate 40 is not separated from the electrolytic abrasive article 10 .

On the other hand, if referring to FIG. 2 , the grid-shaped negative electrode plate 40 of the embodiment may include a first negative electrode grid plate 41 and a second negative electrode grid plate 42 using, for example, copper , aluminum, stainless steel and other materials with excellent electrical conductivity are formed in the form of long and thin strips.

The first negative grid plate 41 can be formed in a straight line or a circle with a cross section of the character “一”, “┓” or “mouth” according to the shape of the electrolytic polishing object 10 . The first negative grid plates 41 may be arranged in the vertical direction and disposed in the electrolytic polishing part 11 .

The second negative grid plates 42 can be arranged and assembled in a linear or circular arrangement along the intersecting direction of the first negative grid plates 41 in order to be horizontally arranged on the electrolytic polishing portion 11 of the electrolytic polishing object 10 .

For example, the first and second negative electrode grid plates 41 and 42 are assembled with each other by assembling means including rivets, bolts, or welding to realize integration, thereby realizing modularization. However, in the following embodiments, the case where integration is achieved by joining with the rivets 43 will be described, but the present invention is not limited to this.

In addition, when the first negative grid plates 41 are arranged in the vertical direction, the second negative grid plates 42 are arranged along the horizontal direction intersecting with the placement spaces 44 and are combined by rivets 43 to achieve integration.

That is, the grid-shaped negative electrode plate 40 can be pre-fabricated by a method of combining the first and second negative electrode grid plates 41 and 42 with rivets 43 according to the specifications substantially consistent with the electrolytic polishing portion 11 of the electrolytic polishing object 10 . And achieve modularization.

In addition, in the state where the negative electrode placement holder 30 attached to the electrolytic polishing unit 11 is placed at a predetermined distance from the electrolytic polishing unit 11 by using the placement space 44 , the C-clamp 50 can be attached to the negative electrode placement holder 30 to carry out fixed.

Wherein, the interval of the placement space 44 may be narrowed or widened according to the size or type of the electrolytic polishing object 10 or the position of the electrolytic polishing part 11 .

The C-clamp 50 may be formed of, for example, a stainless steel material excellent in acid resistance. The C-clamps 50 are attached to the negative electrode mounting bracket 30 through the fixing portions 51 located at the top and bottom in the figure, so that the grid-shaped negative electrode plate 40 can be easily fixed to the electrolytic polishing portion 11 .

As shown in FIG. 2 , the electrolytic polishing object 10 of the embodiment is formed in a polygonal shape, and the electrolytic polishing part 11 may be located inside and outside the polygonal electrolytic polishing object 10a.

According to the embodiment, the grid-shaped negative plate 40 , which is modularized by combining the linear first and second negative grid plates 41 and 42 with the rivets 43 , is firstly arranged inside the electrolytic polishing object 10 , and then the electrolytic polishing object 10 is placed in the electrolytic polishing object 10 . The grid-shaped negative plate 40 is arranged on the outside of the , and can be prepared for electrolytic grinding in this way.

For example, in the method of arranging the grid-shaped negative electrode plate 40 on the outside of the polygonal electrolytic polishing object 10 a, first, the grid-shaped negative electrode plate 40 prefabricated in the specification substantially identical to that of the electrolytic polishing unit 11 is placed in the placement space 44 . After the negative electrode placement fixing frame 30 is installed, the C-type clip 50 is installed on the negative electrode placing fixing frame 30 to complete the negative electrode plate basic frame 40a.

The grid-shaped negative electrode plate 40 may have a shape or area corresponding to the electrolytic polishing portion 11 , and is not necessarily limited to a uniform specification.

Wherein, if the grid-shaped negative electrode plate 40 whose specification is substantially the same as that of the electrolytic polishing unit 11 is not prepared, two or more grid-shaped negative electrode plates 40 are combined on site by means of the C-type clip 50 to complete the basic frame of the negative electrode plate. 40a. Then, the grid-shaped negative electrode plate 40 is attached to the remaining electrolytic polishing part 11 by the same method, and the final frame of the negative electrode plate is completed ( 40 b in FIG. 6 ).

On the other hand, referring to FIGS. 1 and 6 , the negative plate basic frames 40a disposed inside and outside the electrolytic polishing object 10 are electrically connected to each other, so that the negative electrode can be easily connected to the negative electrode through the rectifier 60 . Therefore, no matter where the negative electrode plate basic frame 40a is connected to the negative electrode (-), electrolytic polishing can be easily realized.

Next, as shown in FIGS. 4 and 5 , the electrolytic polishing object 10b of the embodiment is formed in a cylindrical shape, and an electrolytic polishing portion 11 may be formed on the outside of the cylindrical electrolytic polishing object 10b.

At this time, according to the embodiment, the grid-shaped negative electrode plate 40, which is modularized by using the rivets 43 and the circular second negative electrode grid plate 42 on the linear first negative electrode grid plate 41, is placed on the electrolytic grinding object. 10 After the externally installed negative electrode placement fixture, install the C-clamp on the negative electrode placement fixture to complete the final frame 40b of the negative electrode plate.

Among them, in order to easily fix the grid-shaped negative electrode plate 40, not only the negative electrode mounting bracket and the C-type clip described above, for example, a circular frame, a quadrilateral frame or a polygonal frame can also be installed on the upper part of the cylindrical electrolytic polishing object 10b. The auxiliary fixing frame 45 of the shape is used.

In addition, the auxiliary fixing frame 45 and the grid-shaped negative electrode plate 40 can be electrically connected to each other, and the grid-shaped negative electrode plate 40 can be mounted inside the cylindrical electrolytic polishing object 10b through the auxiliary fixing frame 45 .

Then, as shown in FIG. 6 , in the electrolytic polishing apparatus 1 of the embodiment, the electrolytic polishing object 10 with the negative electrode plate final frame 40 b mounted thereon is accommodated in the accommodation space 21 of the electrolytic cell 20 filled with the electrolyte solution, and the electric wire or the like is passed through the electric wire or the like. And it is electrically connected to the rectifier 60, and electrolytic polishing is performed.

Among them, when the electrolytic polishing object 10 is large, it is quite heavy due to its own weight and the installation of the grid-shaped negative plate 40 , so it is accommodated in the accommodating space 21 of the electrolytic cell 20 in the state of being lifted by a crane, for example.

Then, if the positive electrode (+) is connected to the electrolytic polishing object 10 through the rectifier 60, and the negative electrode (-) is connected to the final frame 40b of the negative electrode plate, electrolysis occurs with the electrolyte as a medium, and the electrolytic polishing part of the electrolytic polishing object 10 is electrolyzed. 11 Perform electrolytic grinding.

Therefore, according to the embodiment, the electrolytic polishing of the electrolytic polishing object 10 is realized by using the final frame 40b of the negative electrode plate completed by using the grid-shaped negative electrode plates prefabricated corresponding to the specifications of the electrolytic polishing object 10, thereby effectively shortening the time required for the electrolytic polishing. The installation time of the negative electrode, therefore, the time of the overall electrolytic polishing process can be shortened.

As mentioned above, although an Example demonstrates in detail, this is for demonstrating the invention of an application specifically, and the electrolytic polishing apparatus of an Example is not limited to this. In addition, the terms such as "include", "constitute" or "have" described above, as long as there is no special objection, mean that the corresponding constituent elements can be included, and thus do not exclude other constituent elements, and should be interpreted as including other constituent elements. .

The embodiments are not intended to limit but describe the technical idea of the claimed invention, and the scope of the technical idea of the claimed invention is not limited by such embodiments.

1: Electrolytic grinding device 10: Electrolytic grinding objects 102: Electrolytic grinding objects 104: Electrolytic grinding department 10a: Polygonal electropolished objects 10b: Cylindrical electrolytic abrasive objects 11: Electrolytic grinding department 110: Electrolytic cell 112: Electrolyte 120: negative pole placement holder 130: negative plate 140: C-clamp 20: Electrolytic cell 21: accommodating space 30: Negative electrode placement holder 31: Plate 32: connecting bolts 33: fixing nut 34: Insulation board 40: negative plate 40a: Negative plate basic frame 40b: Negative Plate Final Frame 41: The first negative grid plate 42: Second negative grid plate 43: Rivets 44: Placement space 45: Auxiliary Fixture 50: C-clamp 51: Fixed part 60: Rectifier

1 is a perspective view showing an electrolytic polishing apparatus of the related art as a whole. [ Fig. 2] Fig. 2 is a perspective view showing an electrolytic polishing apparatus according to an example. [ Fig. 3] Fig. 3 is a perspective view showing a negative electrode placement fixture of the embodiment. 4] It is a perspective view which shows the installation state of the electrolytic polishing apparatus of an Example. [ Fig. 5] Fig. 5 is a perspective view showing an electrolytic polishing apparatus according to an example. [ Fig. 6] Fig. 6 is a perspective view showing an electrolytic polishing apparatus according to an example.

1: Electrolytic grinding device

10: Electrolytic grinding objects

10a: Polygonal electropolished objects

11: Electrolytic grinding department

30: Negative electrode placement holder

40: negative plate

40a: Negative plate basic frame

41: The first negative grid plate

42: Second negative grid plate

43: Rivets

44: Placement space

50: C-clamp

51: Fixed part

Claims (9)

An electrolytic grinding device, comprising: an electrolytic cell, which is internally equipped with an accommodating space for accommodating an electrolytic grinding object and an electrolyte, the electrolytic grinding object has a plurality of bolt holes; Connecting bolts, through the bolt holes, the negative electrode placement fixing brackets are attached to an electrolytic grinding part formed on one side of the electrolytic grinding object; a negative electrode plate is added to the electrolytic grinding part of the electrolytic grinding object; A clamp, which is installed on the negative electrode placement fixing frame to fix the negative electrode plate; and a rectifier, which is electrically connected to the electrolytic grinding object and the negative electrode plate respectively, and connects the positive electrode (+) to the electrolytic grinding object, and connects the negative electrode to the electrolytic grinding object. The plate is connected to the negative electrode (-); wherein, the negative electrode plate is a modular lattice-shaped negative electrode plate, which includes a plurality of first negative electrode lattice plates and a plurality of second negative electrodes coupled to the first negative electrode lattice plates Lattice plate; wherein, the modular lattice-shaped negative plate further includes a plurality of placement spaces, and these placement spaces correspond to the bolt holes; wherein, the modular lattice-shaped negative plate is formed by placing these The negative electrode placement fixing frame is installed on the electrolytic polishing part of the electrolytic polishing object through the placement spaces; and the electrolytic polishing object is respectively formed with the electrolytic polishing part inside and outside. The electrolytic polishing device as claimed in claim 1, wherein the electrolytic polishing portion of the electrolytic polishing object is formed in a polygonal or cylindrical shape; the specification of the modular lattice-shaped negative plate corresponds to the electrolytic polishing portion of the electrolytic polishing object Specifications of the grinding section. The electrolytic grinding device as claimed in claim 2, wherein in the modular lattice-shaped negative plate: The first negative grid plates are arranged in a vertical direction on the electrolytic grinding part; and the second negative grid plates are arranged on the electrolytic grinding part of the electrolytic grinding object in a horizontal direction, along with the first negative electrodes The cross directions of the grid plates are arranged while forming the placement space, and are assembled into a grid shape with the first negative electrode grid plates. The electrolytic grinding device of claim 1, wherein the electrolytic grinding object is formed in a cylindrical shape, the electrolytic grinding part is included outside the cylindrical electrolytic grinding object, and the modular lattice-shaped negative plate includes A plurality of linear first negative grid plates and a plurality of circular second negative grid plates combined with the first negative grid plates. The electrolytic grinding device according to claim 4, wherein an auxiliary fixing frame in the shape of a circular frame, a quadrilateral frame or a polygonal frame is installed on the upper part of the cylindrical electrolytic grinding object. The electrolytic polishing device of claim 4, wherein the first negative grid plates and the second negative grid plates are formed in a straight line or a circle. The electrolytic polishing device according to claim 6, wherein the first negative electrode grid plates and the second negative electrode grid plates are combined by any one of rivets, bolts, or welding to realize modularization. The electrolytic polishing apparatus according to claim 1, wherein the negative electrode plates respectively arranged in the electrolytic polishing parts inside and outside the electrolytic polishing object are electrically connected to each other. The electrolytic grinding device according to claim 1, wherein the negative electrode placement fixing frame is attached with: a plate; and an insulating plate, which is made of rubber, polyurethane, PVC or bakelite on both sides of the plate. one constitutes.

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