TWI703241B - Electrode frame for electrolytic polishing and electrolytic polishing device including the same - Google Patents

Abstract

The present invention relates to an electrode frame for electrolytic polishing and an electrolytic polishing device including the electrode frame. The electrode frame for electrolytic polishing, as an electrode frame used in an electrolytic cell equipped with a storage space for accommodating an electrolytic polishing object and an electrolyte solution, may include: an electrode placement member coupled to at least one protrusion of the electrolytic polishing object And a first negative electrode frame, which is formed in a lattice structure, at least one side is combined with the electrode placement member, and is arranged at a predetermined interval from the polishing surface of the electrolytic polishing object. The electrode placement member may include a first surface combined with the protrusion of the electrolytic polishing object and a second surface combined with the first negative electrode frame. Even if the electrode placement member does not use the discharge port, it can be combined with the protrusion of the electrolytic polishing object.

Description

Electrode frame for electrolytic polishing and electrolytic polishing device including the same

It relates to an electrode frame for electrolytic polishing and an electrolytic polishing device including the same, and relates to an electrolytic polishing device for improving the polishing quality of an electrolytic polishing object.

Generally speaking, electro-polishing is a method of using metal products dissolved in the electrolyte as the positive electrode (Anode), and using the metal insoluble in the electrolyte as the negative electrode (Cathode). A method of polishing the surface of a metal product by applying a voltage while causing electrolysis on the surface of a metal product that is an electrolytic polishing object.

In order to grind metals by electrolytic grinding, an electrolytic bath is filled with electrolyte, the metal to be ground is installed as a positive electrode, and the metal that is not dissolved in the electrolyte is installed as a negative electrode, and then direct current is applied to the positive and negative electrodes.

After electrolytic polishing, a high-viscosity liquid layer (viscous layer) containing a large amount of metal ions dissolved from the positive electrode surrounds the positive electrode. In the liquid layer saturated with metal ions, the metal no longer dissolves and forms a high positive electrode potential, and thus actively combines with oxygen to form an oxide film. At this time, the dissolved metal ions mainly accumulate in the concave part of the metal surface. In the concave part, the movement and diffusion of the metal ions are small, and the electrical conduction is not smooth, so the metal is not dissolved. On the contrary, in the protruding part of the metal surface, the metal ion layer is formed thinly, so the current concentrates and it is easy to dissolve the metal surface. On the whole, the metal surface becomes smooth.

The electrolytic polishing is performed by an electrolytic polishing device. The conventional electrolytic polishing device is configured by arranging an electrolytic polishing object having a positive electrode potential in an electrolytic tank, and arranging the negative electrode plate on the polishing surface of the electrolytic polishing object while being spaced apart. The negative plate should be changed according to the shape of the electrolytic grinding object, so it is assembled according to the shape of the electrolytic grinding object and installed in the electrolytic cell.

The negative plate assembled as described above should be installed in the electrolytic cell in such a way that it does not contact the electrolytic grinding object. However, only when the negative electrode plate is kept close to the electrolytic grinding object and arranged at a predetermined distance, can uniform grinding be realized and the quality of electrolytic grinding can be improved.

However, in the prior art, it is actually impossible to firmly arrange the negative electrode plate so as to maintain a predetermined distance close to the electrolytic polishing object.

On the other hand, the inventor of the present application developed an invention in which the negative electrode bracket is used on the discharge port formed on the electrolytically polished object to make the negative electrode plate close to the side of the electrolytically polished object while uniformly fixing the invention, and obtained a patent (refer to Korea Authorized patent No. 10-1183218).

However, due to the various shapes of the electrolytic polishing object, there is no place area such as a discharge port on the electrolytic polishing object. Therefore, a technical problem was encountered that the negative plate cannot be installed uniformly while being close to the electrolytic polishing object.

At present, as the original technology, the negative electrode rod is hung in the electrolytic tank, or after forming a large net in the form of the negative electrode net, the electrolytic polishing is roughly performed by hanging it in the electrolytic tank, but the quality of electrolytic polishing or process efficiency is very low status.

In addition, when the electrolytic polishing object does not have a placement area such as a discharge port, depending on the shape of the electrolytic polishing object, the trouble of separately setting the placement area of the negative electrode plate each time occurs. Therefore, the time required for the placement area to be set until the electrolytic polishing is performed is quite long, causing a problem of increased assembly costs. In particular, when the shape of the electrolytic polishing object has a relatively complicated structure, it may not be possible to arrange the negative electrode frame on the side of the electrolytic polishing object.

Now, as a technology in the original field, the negative frame is set at a distance that does not touch the grinding object and the negative rod is hung in the electrolytic tank, or after a large net is formed in the form of a negative net, it is hung in the electrolytic tank to roughly perform electrolytic grinding. However, the negative electrode rod or the negative electrode mesh cannot be uniformly and closely fixed to the polishing object member, so the electrolytic polishing quality or process efficiency is actually very low.

On the other hand, the negative electrode plate of the prior art is supported by a jig as another supporting member. However, the distance between the negative electrode plate and the electrolytic polishing object is very close, and it is difficult to locate the negative electrode plate and the electrolytic polishing object. Install fixtures in small spaces. That is, since the jig is formed of a conductive material, if the jig comes into contact with the electrolytically polished object of the positive electrode, it will be electrically short-circuited with the negative electrode plate having the negative electrode.

(Technical problem to be solved)

In one embodiment, there is provided an electrode frame for electrolytic polishing and an electrolytic polishing device including the anode frame for mounting the negative electrode frame close to and uniformly on the side of the electrolytic polishing object even in a region where there is no additional discharge port.

In addition, in another embodiment, an electrolytic polishing device for preventing electrical short-circuit between the negative electrode plate and the electrolytic polishing object due to a clamp is provided.

In addition, in one embodiment, there is provided an electrolytic polishing device for effectively setting a negative electrode frame on the side of an electrolytic polishing object without an additional bracket.

In addition, in another embodiment, there is provided an electrolytic polishing device for preventing electrical short circuit between the negative electrode plate and the electrolytic polishing object due to a clamp.

(Means to solve the problem)

In an embodiment, the electrode frame for electrolytic polishing, as an electrode frame used in an electrolytic cell equipped with a storage space for accommodating electrolytic polishing objects and electrolyte solution, may include: an electrode placement member, which is combined with the electrolytic polishing object And the first negative electrode frame, which is formed in a lattice structure, at least one side of the lattice structure is combined with the electrode placement member, and is separated from the polishing surface of the electrolytic polishing object Interval configuration.

The electrode placement member may include a first surface coupled with the protrusion of the electrolytic polishing object, and a second surface coupled with the first negative electrode frame.

Even if the electrode placement member does not use the discharge port, it can be combined with the protrusion of the electrolytic polishing object.

In addition, in one embodiment, the electrode frame for electrolytic polishing is used as an electrode frame for an electrolytic cell equipped with a storage space for accommodating electrolytic polishing objects and electrolyte solution, and may include: a negative electrode frame disposed on the electrolytic polishing object One side of the polishing surface; and an electrode partition member, which is combined with the negative electrode frame to separate the negative electrode frame from the bottom surface of the electrolytic polishing object.

The electrode partition member may include a first electrode partition member joined to the bottom surface of the electrolytic polishing article and supporting the negative electrode frame.

The first electrode partition member can support the negative electrode frame even if the discharge port is not used.

In an embodiment, the electrolytic polishing device may include the electrode frame.

(The effect of the invention)

In one embodiment, by arranging the electrode placement member that can support the negative electrode frame by using the protrusion formed on the electrolytic polishing object, it can be effectively installed even on the electrolytic polishing object in the area where there is no discharge port. The effect of the negative frame.

In addition, in one embodiment, when the same product is electrolytically polished, the assembled negative electrode frame can be assembled to the electrode placement member for polishing, which has the effect of shortening the time required for installation and removal of the negative electrode frame and the polishing time. .

In addition, in one embodiment, there is an effect that even if one of the bottom or side wall of the electrolytic polishing object has no protrusions, the negative electrode frame can be easily attached to the entire polishing surface of the electrolytic polishing object.

In addition, in one embodiment, by arranging the negative frame bracket on the electrode placement member, it is possible to increase the degree of freedom of the coupling position of the negative frame and to effectively mount the electrode frame.

In addition, in an embodiment, the jig further forms an insulating part, thereby having the effect that it can be easily installed in a narrow space between the negative electrode frame and the electrolytic polishing object.

In addition, in one embodiment, by arranging the electrode partition member on the side of the negative electrode frame, the negative electrode frame is arranged on the electrolytic polishing object, so that the negative electrode frame can be effectively arranged inside the electrolytic polishing object without a separate bracket Or externally, the negative electrode frame can be quickly arranged on the electrolytic polishing object, and the process efficiency of the electrolytic polishing can be improved while being arranged close and uniformly, and the quality of electrolytic polishing can be significantly improved.

In addition, in one embodiment, the lower width of the electrode partition member is gradually reduced, and inserted into the groove or hole formed at the bottom of the electrolytic polishing object, thereby having the effect of more effectively fixing the negative electrode frame.

In one embodiment, by arranging the electrode partition member on the upper part of the side wall of the electrolytic polishing object, it has an effect of stably supporting the negative electrode frame while separating the negative electrode frame from the bottom of the electrolytic polishing object.

In addition, in one embodiment, by disposing the electrode partition member so as not to contact the bottom of the electrolytic polishing object, there is an effect of preventing damage caused by contact between the electrode partition member and the electrolytic polishing object.

In addition, in one embodiment, by using the bracket, there is an effect that the negative electrode frame can be effectively mounted on the inside and outside of the electrolytic polishing object.

The embodiments are described in detail below with reference to the drawings.

FIG. 1 is an exploded perspective view showing the electrolytic polishing apparatus of the first embodiment, FIG. 2 is a combined perspective view showing the electrolytic polishing apparatus of the first embodiment, and FIG. 3 is a state where the electrode frames of the electrolytic polishing apparatus of the first embodiment are combined Fig. 4a and Fig. 4b are respectively a perspective view showing the jig of the electrolytic polishing apparatus of the first embodiment, and Fig. 5 is a perspective view showing a modification of the negative electrode frame of the electrolytic polishing apparatus of the first embodiment.

In an embodiment, the electrode frame may include a negative electrode frame, but it is not limited thereto.

As shown in FIGS. 1 and 2, the electrode frame for electrolytic polishing of the first embodiment is used as an electrode frame for electrolytic polishing used in an electrolytic cell 100 equipped with a storage space for accommodating an electrolytic polishing object 200 and an electrolyte solution. : A plurality of electrode placement members 400, which are coupled to at least one or more protrusions 210 of the electrolytic polishing object 200; a negative electrode frame 300, which is formed in a lattice structure, and at least one side is placed on the plurality of electrodes The member 400 is combined and arranged at a predetermined interval from the polishing surface of the electrolytic polishing object 200.

In addition, the electrolytic polishing apparatus of the first embodiment may include: an electrolytic cell 100 equipped with an electrolytic polishing object 200 formed with a protrusion 210 of a predetermined shape on the polishing surface and an electrolytic solution accommodation space therein; a plurality of electrodes The placement member 400 is coupled to at least one protrusion of the electrolytic polishing object 200; the negative electrode frame 300 is formed in a lattice structure, and at least one side of the lattice structure is connected to the plurality of electrode placement members 400 In combination, they are arranged at a predetermined interval from the polishing surface of the electrolytic polishing object 200.

In FIG. 1, an example in which the protrusion 210 is formed on the upper side of the electrolytically polished object 200 is illustrated, but it is not limited to this, and may be formed on the side or underside of the electrolytically polished object 200.

The electrolytic cell 100 may be formed in a box shape equipped with an accommodation space inside. The electrolytic cell 100 may include a cylindrical shape, a polygonal box or a ring shape, but its shape is not limited.

The inside of the electrolytic cell 100 may be filled with electrolyte. As the electrolyte, it can be made from distilled water (H ₂ O), sulfuric acid (H ₂ SO ₄ ), phosphoric acid (H ₃ PO ₄ ), chromic acid, sodium nitrate (NaNO ₃ ), sodium chloride (NaCl), At least one selected from the group consisting of glycerin is mixed, but it is not limited to this.

The electrolytic solution can be replaced after the electrolytic polishing of the electrolytic polishing object 200 is completed while being filled in the electrolytic cell 100. Unlike this, the electrolyte can flow in and out by means of a pump formed independently on one side of the electrolytic cell 100. An electrolyte inflow pipe and an electrolyte outflow pipe may be formed between the electrolytic cell 100 and the pump, and may further include an electrolyte flow regulator and a screening program. The screening program can filter the processed residue and foreign substances contained in the electrolyte.

The electrolytic grinding object 200 can be contained in the electrolytic tank 100. The size of the electrolytic tank 100 may be larger than the electrolytic polishing object 200. The electrolytic polishing object 200 may have a polygonal plate shape, but is not limited thereto. The electrolytic polishing object 200 may be a polygonal or cylindrical cavity or box. The electrolytic polishing object 200 may be a chamber for OLED manufacturing. On the other hand, when the electrolytic polishing object 200 is a chamber for OLED, a MOCVD chamber for LED, or the like, it may weigh several hundred kg to several thousand kg (several tons).

In addition, the electrolytic polishing object 200 may also be a part of the OLED chamber. The electrolytic polishing object 200 may be in the shape of a plate, a box, or a ring formed through up and down.

The electrolytic polishing object 200 is not limited to this, and all metal products can be designated as the electrolytic polishing object. The electrolytic polishing object 200 is immersed in the electrolyte 110. The polishing surface of the electrolytic polishing object 200 may include all surfaces of the electrolytic polishing object 200.

A rectifier may be further arranged on one side of the electrolytic cell 100. The rectifier can connect a positive (+) voltage to the electrolytic grinding object 200, and can connect a negative (-) voltage to the negative frame 300. The rectifier can connect electricity to the electrolytic polishing object 200 by means of a wire or the like.

The negative frame 300 may be disposed on one side of the polishing surface of the electrolytic polishing object 200. The negative frame 300 may be uniformly arranged with a predetermined interval from the polishing surface of the electrolytic polishing object 200. For example, the negative electrode frame 300 and the electrolytic polishing object 200 are uniformly spaced apart and arranged at a distance of 50 mm±20 mm, so the electrolytic polishing efficiency is improved, and the electrolytic polishing quality is excellent.

The negative electrode frame 300 may include a plate shape of a lattice structure. The negative electrode frame 300 may be a stainless steel material excellent in conductivity and acid resistance, but it is not limited to this. The negative electrode frame 300 may be a plate in a bar shape, an L shape, a corner shape, a bar shape, a circular shape, a wire mesh shape, or an orifice shape.

The negative electrode frame 300 may include a first negative electrode plate 310 and a second negative electrode plate 330. The first negative electrode plate 310 and the second negative electrode plate 330 may be configured to form a lattice structure. The first negative electrode plate 310 may be formed in a bar shape, an L shape, a corner shape, a bar shape, a circular shape, a wire mesh shape, or a metal shape of a perforated plate, but is not limited thereto. The first negative plate 310 may be composed of a plurality of plates, which are configured to be spaced apart from each other.

The second negative electrode plate 330 may be formed in the same shape as the first negative electrode plate 310, but is not limited thereto. The second negative electrode plate 330 may be composed of a plurality of plates, which are arranged to be separated from each other. The first negative electrode plate 310 and the second negative electrode plate 330 may be arranged to form 90 degrees, but are not limited to this.

The area where the first negative electrode plate 310 and the second negative electrode plate 330 intersect may be joined by a usual assembly device including rivets, bolts, or welding. Different from this, the area where the first negative electrode plate 310 and the second negative electrode plate 330 intersect can also be fixed by means of a C-shaped clamp.

The structure in which the negative electrode frame 300 has a fixed length is described above, but a variable structure of the negative electrode frame 300 in which the size of the negative electrode frame 300 is changed as the electrolytic polishing object 200 increases can be used.

As shown in FIG. 5, the negative electrode frame 300 may include a first negative electrode plate 310 and a second negative electrode plate 330. The first negative electrode plate 310 and the second negative electrode plate 330 may be configured to form a lattice structure.

The first negative electrode plate 310 may be constituted by a plurality of brackets, and may be constituted in such a manner that the length thereof can be increased or decreased. The structure of the second negative electrode plate 330 may be the same as the structure of the first negative electrode plate 310. Hereinafter, the description will be focused on the structure of the first negative electrode plate 310.

The first negative plate 310 may be configured to connect a plurality of brackets. The first negative electrode plates 310 may be partially overlapped and arranged to move in directions away from or close to each other. The first negative plate 310 can be composed of more than three brackets, but for the convenience of description, the first negative plate 310 is composed of a first bracket 312 and a second bracket 314 connected to the first bracket 312 as the center. Be explained.

The first bracket 312 may be L-shaped, but it is not limited thereto. A part of the first bracket 312 may be formed to overlap with a part of the second bracket 314. The overlapping area of the first bracket 312 and the second bracket 314 may be supported by the C-shaped clamp 500, and the C-shaped clamp 500 arranged in this overlapped area may be referred to as a third clamp.

The first bracket 312 and the second bracket 314 can move in directions away from or close to each other. The C-shaped clamp 500 can support the first support 312 and the second support 314 with a force such that the first support 312 and the second support 314 can move with each other. Different from this, the C-shaped clamp 400 can further apply a fixing force after moving the first bracket 312 and the second bracket 314 to support the first bracket 312 and the second bracket 314.

The second negative plate 330 may include a first bracket 332 and a second bracket 334 the same as the first negative plate 310. The second negative electrode plate 330 may be formed of a rod-shaped plate, but is not limited thereto. The first support 332 of the second negative electrode plate 330 may move in a direction away from or close to the second support 334.

The first bracket 332 and the second bracket 334 of the second negative electrode plate 330 may be partially overlapped. The overlapping area of the first bracket 332 and the second bracket 334 of the second negative electrode plate 330 may be supported by the C-shaped clamp 500. Therefore, the length of the second negative plate 330 is variable.

Returning to FIG. 1, if the negative electrode frame 300 is in contact with the electrolytic polishing object 200 of the positive electrode, a short circuit occurs. To prevent this, the negative frame 300 should be configured to be separated from the polishing surface of the electrolytic polishing object 200.

In the past, the negative electrode frame 300 was fixed to a discharge port formed on the electrolytic polishing object 200, but in this embodiment, when there is no discharge port on the electrolytic polishing object 200, an electrode placement member may be provided to install the negative electrode frame 300 400.

The electrode placement member 400 may include an L shape, a bar shape, a corner shape, and a bar shape, but is not limited thereto.

The electrode placement member 400 may be coupled to one side of the electrolytic polishing object 200. For example, the electrode placement member 400 may be formed by being combined with a reinforcing rib (Rib) formed on the electrolytic polishing object 200. The electrode placement member 400 may be configured in plurality. Generally speaking, protruding parts 210 such as reinforcing ribs and edges may be formed on the electrolytic polishing object 200. In this embodiment, a structure in which the negative electrode frame 300 is mounted using the protrusion 210 formed on the electrolytic polishing object 200 is proposed.

As shown in FIG. 3, the electrode placement member 400 may be arranged perpendicular to the polishing surface of the electrolytic polishing object 200. A negative electrode frame 300 is combined on one side of the electrode placement member 400, and the negative electrode frame 300 can be arranged separately from the polishing surface of the electrolytic polishing object 200.

The electrode placement member 400 may be formed of a conductive substance. The electrode placement member 400 may be a steel plate, aluminum or stainless steel with strong acid resistance. Since the electrode placement member 400 is fixed to the protruding portion 2100 of the electrolytic polishing object 200 of the positive electrode, it can be positively charged. Therefore, if the negative electrode frame 300 having the negative electrode is coupled to one side of the electrode placing member 400, an electrical short circuit occurs between the electrode placing member 400 and the negative electrode frame 300.

To prevent this, an insulating member 700 may be further arranged between the electrode placing member 400 and the negative electrode frame 300. The insulating member 700 may include any one of PVC, rubber, urethane rubber, and bakelite. The insulating member 700 may be formed larger than the width of the negative electrode frame 300, but is not limited thereto.

On the other hand, the electrode placement member 400 may be formed of an insulating substance. If the electrode placing member 400 is formed of an insulating material, the insulating member 700 arranged between the electrode placing member 400 and the negative electrode frame 300 may be removed.

The electrode placement member 400 may include a first face 410 and a second face 430. The second surface 430 of the electrode placing member 400 may be formed by bending the first surface 410 of the electrode placing member 400 at a predetermined angle. In this embodiment, the angle θ1 formed by the first surface 410 of the electrode placing member 400 and the second surface 430 of the electrode placing member 400 may include 90 degrees, but is not limited thereto.

The first surface 410 of the electrode placement member 400 may be combined with one side of the protrusion 210 of the electrolytic polishing object 200. The first surface 410 of the electrode placement member 400 may be fixed by the C-shaped clamp 500 in a state where it is overlapped and arranged on the protrusion 210 of the electrolytic polishing object. The C-shaped clamp 500 arranged on the first surface 410 may be called a first clamp, and the C-shaped clamp 500 arranged on the second surface 430 may be called a second clamp.

The C-type clamp 500 may include fixing parts 510 arranged opposite to each other. The fixing portion 510 may be arranged on one side of the electrode placement member 400 and the other side of the protrusion 210 that are overlapped, so that the electrode placement member 400 is stably fixed to the protrusion 210. The C-type clamp 500 may be formed of a stainless steel material excellent in acid resistance. Different from this, the C-shaped clamp 500 may use the insulating part 520 to form one side of the fixing part 510. Since the C-shaped clamp 500 does not permanently fix the negative electrode frame 300 and the electrode placing member 400, if the C-shaped clamp 500 is used, the negative electrode frame 300 and the electrode placing member 400 can be easily installed and separated. That is, the installation position of the electrode placement member 400 may vary depending on the shape of the electrolytic polishing object 200, so the C-shaped jig 500 can easily change the installation position of the electrode placement member 400 coupled to the negative frame 300.

On the other hand, the C-shaped jig 500 is formed of a conductive material, so the C-shaped jig 500 installed in the narrow space between the negative frame 300 and the electrolytic polishing object 200 is in contact with the electrolytic polishing object 200, and the negative frame 300 is in contact with the electrolytic polishing object. An electrical short circuit will occur between 200.

To prevent this, as shown in FIGS. 4a and 4b, an insulating portion 520 may be further formed on the side of the fixing portion 510 that fixes the negative frame 300 and the electrode placement member 400. Wherein, the fixing part 510 may be respectively disposed on one side of the first body 540 and the second body 550. The second body 550 may be formed in a C-shape and combined with the first body 540. The first body 540 may be coupled to the second body 550 and move up and down. Therefore, the fixing parts 510 disposed opposite to the first body 540 and the second body 550 can move in a direction toward or away from each other.

The insulating part 520 may be formed on one side of the fixing part 510 to be in contact with the negative electrode frame 300 and the electrode placement member 400. Therefore, even if the C-shaped jig 500 is in contact with one side of the electrolytic polishing object 200, an electrical short circuit can be prevented between the electrolytic polishing object 200 and the negative electrode frame 300. The insulating portion 520 may include an elastic material. The insulating part 520 may include PVC, rubber, urethane rubber, bakelite, etc., but is not limited thereto.

In addition, a part of the C-shaped second body 550 may be in contact with one side of the electrolytic polishing object 200 or the negative electrode plate. In order to prevent this, an insulating film 550b may be further included on the surface of the second body 550. In order to maintain rigidity, the inside of the second body 550 may be made of a conductive material 550a, and the outer surface of the second body 550 may be coated with an insulating film 550b.

In addition, the C-shaped clamp 500 may be formed with a convex portion 530 in order to maximize the fixing force of the mutually coupled frames. The convex portion 530 has the effect of preventing the C-shaped clip 500 from slipping from the negative electrode frame 300, and preventing the C-shaped clip 500 from being separated from the negative electrode frame 300.

Although the insulating portion 520 is formed on one side of the fixing portion 510 of the C-shaped clamp 500 in the above, the fixing portion 520 may be formed of an insulating material, and the insulating portion 520 may be removed.

Returning to FIG. 3, the second surface 430 of the electrode placement member 400 may be combined with one side of the first negative electrode plate 310. The first negative electrode plate 310 may be vertically combined with the electrode placing member 400. The first negative electrode plate 310 may be arranged horizontally with the polishing surface of the electrolytic polishing object 200. The first negative plate 310 may include a first surface 312 and a second surface 314. The second surface 314 of the first negative electrode plate 310 may be formed by bending from the first surface 312. The angle θ2 between the first surface 312 and the second surface 314 of the first negative electrode plate 310 may be 90 degrees, but is not limited to this. The second surface 430 of the electrode placement member 410 may be fixed to the first surface 312 of the first negative electrode plate 310. The second surface 430 of the electrode placement member 400 may be fixed by means of the C-shaped clamp 500 in a state of overlapping with the first surface 312 of the first negative electrode plate 310.

The electrode placement member 400 includes a first surface 410 combined with the protrusion 210 and a second surface 430 combined with the first negative plate 310, so as to have an effective combination of the protrusion 210 and the negative frame 300 in a narrow space. effect.

The electrode frame for electrolytic polishing and the electrolytic polishing apparatus including the electrode frame of the first embodiment utilize the protrusions 210 formed on the electrolytic polishing object 200, so that the negative electrode frame 300 can be effectively installed on the electrolytic polishing object 200 without a placement area. Effect.

Please refer to FIG. 1 and FIG. 2 to respectively provide the electrolytic polishing process of the electrolytic polishing object 200. First, the electrode placement member 400 can be mounted on the protrusion 210 formed on the side of the electrolytic polishing object 200 by using the C-shaped fixture 500. At this time, the electrode placement member 400 may be installed on the plurality of protrusions 210 in a manner capable of supporting the negative electrode frame 300 in a balanced manner.

Next, the negative electrode frame 300 may be installed on one side of the electrode placing member 400. The negative electrode frame 300 may be installed in a lattice shape in a state of being coupled to one side of the electrode placement member 400. Unlike this, if you have experience in performing electrolytic polishing for the same product, and the negative frame 300 is already assembled into a grid shape, the grid-shaped negative frame 300 can be easily placed on one side of the electrode placement member 400.

After the electrolytic polishing of the polishing surface of the electrolytic polishing object 200 is completed, the C-shaped jig 500 is separated, and the negative electrode frame 300 can be removed from the electrode placing member 400. Next, if the electrode placement member 400 is separated from the electrolytic polishing object 200, all steps of the electrolytic polishing can be ended.

Then, if the same product is electrolytically polished, the assembly is performed in the reverse order of the previous description, and the negative electrode assembly is completed in a short time, which has the effect of shortening the assembly time and polishing time.

Fig. 6 is a perspective view showing an electrolytic polishing apparatus according to a modification of the first embodiment.

As shown in FIG. 6, the electrolytic polishing apparatus of the first embodiment may include: an electrolytic cell 100 equipped with an electrolytic polishing object 200 formed with a protrusion 210 of a predetermined shape and an electrolytic solution containing space therein; The electrode placement member 400 is coupled to at least one protrusion 210 of the electrolytic polishing object 200; the negative electrode frame 300 is formed in a lattice structure, and at least one side of the lattice structure is placed on the plurality of electrodes The member 400 is combined and arranged at a predetermined interval from the polishing surface of the electrolytic polishing object 200.

The electrolytic cell 100 may be formed in a box shape equipped with an accommodation space inside. The inside of the electrolytic cell 100 may be filled with electrolyte. The electrolytic grinding object 200 can be contained in the electrolytic tank 100.

The electrolytic polishing article 200 may include a bottom portion 200a and a sidewall portion 200b. Although the figure shows a case where one side wall part 200b is formed, it is not limited to this, and a plurality of side wall parts 200b may be formed along the side surface of the bottom part 200a. Therefore, the electrolytic polishing article 200 may include a box shape.

The negative electrode frame 300 may include a plate shape of a lattice structure. The negative electrode frame 300 may be a stainless steel material excellent in conductivity and acid resistance, but it is not limited to this. The negative electrode frame 300 may be a plate in a bar shape, an L shape, a corner shape, a bar shape, a round shape, a wire mesh, or a hole plate shape. The negative electrode frame 300 may include a first negative electrode frame 300a and a second negative electrode frame 300b.

The first negative electrode frame 300a may perform electrolytic polishing on the bottom of the electrolytic polishing object 200. The first negative electrode frame 300 a may be arranged separately from the bottom surface of the electrolytic polishing object 200. The second negative electrode frame 300b can perform electrolytic polishing on the side wall of the electrolytic polishing object 200. The second negative electrode frame 300b may be separated from the inner surface of the electrolytic polishing object 200.

The first negative electrode frame 300a may include a plurality of first negative electrode plates 310a and a plurality of second negative electrode plates 330a. The first negative electrode plate 310a and the second negative electrode plate 330a may be arranged to form a lattice structure. The first negative electrode plate 310a and the second negative electrode plate 330a can be arranged to form 90 degrees, but they are not limited to this. The configuration of the second negative electrode frame 300b is the same as that of the first negative electrode frame 300a, and thus the description thereof is omitted.

If the negative electrode frame 300 comes into contact with the electrolytic polishing object 200 of the positive electrode, a short circuit occurs. To prevent this, the negative frame 300 should be configured to be separated from the polishing surface of the electrolytic polishing object 200.

In the past, the negative electrode frame 300 was fixed to a discharge port formed on the electrolytic polishing object 200, but in this embodiment, when there is no discharge port on the electrolytic polishing object 200, an electrode placement member may be provided to install the negative electrode frame 300 400.

In the second embodiment, the electrode placement member 400 may only be installed on the bottom 210 of the electrolytic polishing object 200. When the protrusions 210 are formed on the bottom 200a and the side wall 200b of the electrolytic polishing object 200, the electrode placement member 400 can be formed on both the bottom 200a and the side wall 200b of the electrolytic polishing object 200, and the negative electrode frame 300 is installed. In the second embodiment, the case where the protrusion 210 is formed only on the bottom 200a of the electrolytically polished object 200 and the protrusions are not formed on the sidewall portion 200b of the electrolytically polished object 200 will be described.

One side of the electrode placement member 400 may be combined with one side of the protrusion 210 of the electrolytic polishing object 200. The electrode placement member 400 may be combined with one side of the protrusion 210 disposed in the edge area of the protrusion 210 of the electrolytic polishing object 200.

The electrode placement member 400 may include a first face 410 and a second face 430. The second surface 430 of the electrode placement member 400 may be bent from the first surface 410 of the electrode placement member 400, that is, formed at a fixed angle. In this embodiment, the angle θ1 formed by the first surface 410 of the electrode placing member 400 and the second surface 430 of the electrode placing member 400 may include 90 degrees, but is not limited thereto.

The other side of the electrode placement member 400 may be combined with the first negative electrode frame 300a. When the electrode placement member 400 is formed of a conductive material, an insulating member 700 may be placed between the electrode placement member 400 and the first negative electrode frame 300 in order to prevent electrical shorts between the two. The electrode placement member 400 and the first negative electrode frame 300a may be fixed by a C-shaped clamp 500. The C-shaped clamp 500 is formed of a conductive material, so an insulating member 700 may be further provided between the C-shaped clamp 500 and the first negative electrode frame 300a.

The structure in which the electrode placement member 400 is formed in the L-shape has been described above, but it is not limited to this, and it may be a bar shape, an angular shape, a rod shape, or a circular plate.

The electrode placement member 400 a adjacent to the side wall 200 b of the electrolytic polishing object 200 may be formed in a long length corresponding to the height of the side wall 200 b of the electrolytic polishing object 200. The electrode placement member 400a adjacent to the side wall portion 200b of the electrolytic polishing object 200 may be arranged apart from the polishing surface of the side wall portion 200b of the electrolytic polishing object 200.

The second negative electrode frame 300b may be disposed between the electrode placement members 210a adjacent to the side wall portion 200b of the electrolytic polishing object 200. One side of the second negative electrode frame 300b may be fixed to the electrode placement member 400a by means of a C-shaped clamp 500. Wherein, between the electrode placement member 400 and the second negative electrode frame 300b, and between the second negative electrode frame 300b and the C-shaped clamp 500, an insulating member 700 may be further arranged. Therefore, the second negative electrode frame 300b can effectively perform electrolytic polishing on the sidewall polishing surface of the electrolytic polishing object 200.

The electrode frame for electrolytic polishing of the second embodiment and the electrolytic polishing apparatus including the same have the effect that even if there is no protrusion 210 on the bottom 200a or the side wall 200b of the electrolytic polishing object 200, the negative electrode frame can be 300 is easily installed on the polishing surface of the electrolytic polishing object 200.

7 is an exploded perspective view showing the electrolytic polishing apparatus of another modification of the first embodiment, and FIG. 8 is a combined perspective view showing the electrolytic polishing apparatus of another modification of the first embodiment.

As shown in FIGS. 7 and 8, the electrolytic polishing apparatus of the modification of the first embodiment may include: an electrolytic cell 100 equipped with an electrolytic polishing object 200 formed with a protrusion 210 of a predetermined shape and an electrolyte Containing space; a plurality of electrode placement members 400, which are combined with at least one or more protrusions 210 of the electrolytic polishing object 200; a negative frame 300, which is combined with one side of the electrode placement member 400; a negative frame 300, It is formed in a lattice structure, and one side of at least one lattice structure is combined with the plurality of negative electrode frame brackets 600, and is arranged at a predetermined interval from the polishing surface of the electrolytic polishing object 200.

The electrolytic cell 100 may be formed in a box shape equipped with an accommodation space inside. The inside of the electrolytic cell 100 may be filled with electrolyte. The electrolytic grinding object 200 can be contained in the electrolytic tank 100.

The electrolytic polishing object 200 may have a polygonal plate shape, but is not limited thereto. All the metal products of the electrolytic polishing object 200 can be designated as the electrolytic polishing object. Protrusions 210 such as reinforcing ribs and edges may be formed on the electrolytic polishing object 200.

The negative electrode frame 300 may include a plate shape of a lattice structure. The negative electrode frame 300 may be a stainless steel material excellent in conductivity and acid resistance, but it is not limited to this. The negative electrode frame 300 may be a plate in a bar shape, an L shape, a corner shape, a bar shape, a round shape, a wire mesh, or a hole plate shape.

The negative frame 300 may include a plurality of first negative plates 310 and a plurality of second negative plates 330. The first negative electrode plate 310 and the second negative electrode plate 330 may be configured to form a lattice structure. The first negative electrode plate 310 and the second negative electrode plate 330 may be arranged to form 90 degrees, but are not limited to this.

If the negative electrode frame 300 comes into contact with the electrolytic polishing object 200 of the positive electrode, a short circuit occurs. To prevent this, the negative frame 300 should be configured to be separated from the polishing surface of the electrolytic polishing object 200.

In the past, the negative electrode frame 300 was fixed to a discharge port formed on the electrolytic polishing object 200, but in this embodiment, when the electrolytic polishing object 200 has no discharge port, in order to install the negative electrode frame 300, an electrode placement member 400 and Negative frame bracket 600.

The electrode placement member 400 may be combined with one side of the protrusion 210 of the electrolytic polishing object 200. The electrode placement member 400 may include a first face and a second face. The second surface of the electrode placement member 400 may be bent from the first surface 410 of the electrode placement member 400, that is, formed at a fixed angle. The angle θ1 formed by the first surface 410 of the electrode placing member 400 and the second surface 430 of the electrode placing member 400 may include 90 degrees, but is not limited thereto. The electrode placement member 400 may be formed to protrude upward. The electrode placement member 400 may be arranged perpendicular to the protrusion 210, but is not limited to this.

The structure in which the electrode placement member 400 is formed in the L-shape has been described above, but it is not limited to this, and it may be a bar shape, an angular shape, a rod shape, or a circular plate.

The negative frame bracket 600 may be coupled to one side of the electrode placing member 400. The negative frame bracket 600 may be formed of a metal material. When the negative frame bracket 600 is formed of a metal material, an insulating member 700 such as an insulating plate may be further disposed between the electrode placing member 400 and the negative frame bracket 600. The insulating member 700 may be disposed between the electrode placement member 400 and the negative frame bracket 600 and between the negative frame bracket 600 and the C-shaped clamp 500.

The negative frame bracket 600 may use the insulating member 700 as a medium to be combined with the second surface 430 of the electrode placement member 400, but it is not limited thereto. The negative electrode frame bracket 600 may be formed in a shape corresponding to the negative electrode frame 300. The negative frame bracket 600 may be arranged perpendicular to the electrode placement member 400, but is not limited to this.

The negative frame bracket 600 can maintain a level with the polishing surface of the electrolytic polishing object 200 so that the negative frame 300 can maintain a level with the polishing surface of the electrolytic polishing object 200. The negative frame bracket 600 may support the end of the negative frame 300. Unlike this, the negative frame bracket 600 may support a certain part of the negative frame 300.

The negative frame bracket 600 may be formed in an L-shape. The negative frame bracket 600 may be configured to include a first surface and a second surface. In addition to the L-shape, the negative frame bracket 600 may include a bar shape, an angular shape, a rod shape, a circular shape, a wire mesh, and a plate of a perforated plate. The negative frame bracket 600 may be fixed to the negative frame 300 by means of a C-shaped clamp 500. The negative electrode frame bracket 600 can be fixed by means of a C-shaped clamp in a state of overlapping with one side of the negative electrode frame 310.

The negative electrode frame bracket 600 is formed in the same shape as the negative electrode frame 300, and the area in contact with the negative electrode frame 300 is widened, which has the effect of further improving the bonding force of the negative electrode frame bracket 600 and the negative electrode frame 300.

In addition, if the contact area between the negative electrode frame bracket 600 and the negative electrode frame 300 is widened, the conductivity is further improved, the electrolytic polishing efficiency of the electrolytic polishing object 200 becomes better, and there is an effect that the time required for the electrolytic polishing process can be shortened.

The negative frame bracket 600 may be arranged to form a predetermined angle with the electrode placement member 400. The negative frame bracket 600 can be arranged at a predetermined angle with the electrode placement member 400 according to the shape of the negative frame 300 so that the negative frame 300 is effectively coupled to the electrode placement member 400. That is, depending on the structure and position of the protruding portion 210 of the electrolytic polishing object 200, the electrode placement member 400 may not be easily combined with the negative electrode frame 300. At this time, if the negative electrode frame bracket 600 is arranged on the electrode placing member 400, the degree of freedom of the coupling position of the negative electrode frame 300 can be increased, and the negative electrode frame 300 can be effectively mounted.

In this embodiment, by arranging the electrode placement member 400 that can support the negative electrode frame 300 by using the protrusion 210 formed on the electrolytic polishing object 200, the electrode placement member 400 can be used even on the electrolytic polishing object 200 in the area where there is no discharge port. , The effect of the negative frame 300 can also be effectively installed.

In addition, in this embodiment, when the same product is electrolytically polished, the assembled negative frame 300 can be assembled to the electrode placement member 400 for polishing, so the time required for installation and removal of the negative frame 300 and polishing can be shortened. The effect of time.

In addition, in this embodiment, there is an effect that even if one of the bottom 200a or the side wall 200b of the electrolytic polishing object 200 does not have the protruding portion 210, the negative electrode can be easily installed on the entire polishing surface of the electrolytic polishing object 200 Frame 300.

In addition, in this embodiment, by arranging the negative frame bracket 600 on the electrode placing member 400, the degree of freedom of the coupling position of the negative frame 300 can be increased, and the electrode frame can be effectively installed.

9 is a cross-sectional view showing the electrolytic polishing apparatus of the second embodiment, FIG. 10 is a perspective view showing the electrode partition member of FIG. 9, and FIG. 11 is a state in which the electrode partition member of FIG. 9 is fixed to the electrolytic polishing object Schematic perspective view.

12 to 14 are respectively perspective views showing various structures of the electrode partition member of the second embodiment, and FIG. 15 is a perspective view showing a modification of the negative electrode frame of FIG. 9.

As shown in FIG. 9, in this embodiment, the electrode frame is used as an electrode frame for an electrolytic cell equipped with an electrolytic grinding object and an electrolytic solution containing space inside, and may include: a negative electrode frame 3000, which is disposed in the electrolytic cell One side of the polishing surface of the polishing object 2000; and the electrode separating member 4000, which is disposed on one side of the negative electrode frame, so that the negative electrode frame is separated from the side or bottom surface of the electrolytic polishing object.

In addition, the electrolytic polishing apparatus of the second embodiment may include: an electrolytic cell 1000, which is equipped with a storage space for accommodating an electrolytic polishing object 2000 and an electrolyte 1100; a negative electrode frame 3000, which is configured in the polishing of the electrolytic polishing object 2000 One side of the surface; electrode partition member 4000, which is arranged on one side of the negative frame 3000, so that the negative frame 3000 is separated from the bottom surface of the electrolytic polishing object 2000.

The electrolytic cell 1000 may be formed in a box shape equipped with a storage space inside. The electrolytic cell 1000 may include a cylindrical shape, a polygonal box or a ring shape, but its shape is not limited.

The inside of the electrolytic cell 1000 may be filled with an electrolytic solution 1100. As the electrolyte solution 1100, it can be prepared from distilled water (H ₂ O), sulfuric acid (H ₂ SO ₄ ), phosphoric acid (H ₃ PO ₄ ), chromic acid, sodium nitrate (NaNO ₃ ), sodium chloride (NaCl) A mixture of at least one selected from the group consisting of glycerols, but it is not limited to this.

The electrolytic solution 1100 can be replaced after the electrolytic polishing of the electrolytic polishing object 2000 is completed in a state of being filled in the electrolytic tank 1000. Unlike this, the electrolyte 1100 can flow in and out by means of a pump formed independently on one side of the electrolytic cell 1000. Between the electrolytic tank 1000 and the pump, an electrolyte inflow pipe and an electrolyte outflow pipe may be formed, and may further include an electrolyte flow adjustment part and a screening program. The screening program can filter the processed residue and foreign substances contained in the electrolyte.

The electrolytic grinding object 2000 can be accommodated inside the electrolytic tank 1000. The size of the electrolytic tank 1000 may be larger than the electrolytic polishing object 2000. The electrolytic grinding object 2000 may be a polygonal or cylindrical cavity or box. The electrolytic polishing object 2000 may be a chamber for OLED manufacturing. In addition, the electrolytic polishing object 2000 may also be a part of the OLED chamber. The electrolytic polishing object 2000 may be in the shape of a plate, a box, or a ring formed through up and down. The electrolytic polishing object 2000 is not limited to this, and all metal products can be designated as the electrolytic polishing object. The electrolytic polishing object 2000 is immersed in the electrolyte 1100.

Since the electrolytic polishing object 2000 is quite heavy, it can be accommodated in the accommodation space of the electrolytic cell 1000 in a state of being lifted by a crane or the like, for example. For example, when the electrolytic polishing object 2000 is a chamber for OLED, a MOCVD chamber for LED, or the like, it may weigh several hundred kg to several thousand kg (several tons).

The polishing surface of the electrolytic polishing object 2000 may include the outer side, the inner side, and the bottom surface of the electrolytic polishing object 2000.

A rectifier may be further arranged on one side of the electrolytic cell 2000. The rectifier can connect the positive (+) voltage to the electrolytic grinding object, and can connect the negative (-) voltage to the negative frame 3000. The rectifier can be electrically connected to the electrolytic polishing object 2000 by means of wires or the like.

The negative frame 3000 may be disposed inside and/or outside the electrolytic polishing object 2000. The negative frame 3000 may be arranged at a predetermined interval from the polishing surface of the electrolytic polishing object 2000. For example, the negative frame 3000 and the electrolytic polishing object 2000 are uniformly spaced apart and arranged at a distance of 50 mm ± 20 mm, so the electrolytic polishing efficiency is improved, and the electrolytic polishing quality is excellent.

The negative electrode frame 3000 can selectively grind the inner, outer or bottom surface of the grinding surface of the electrolytic grinding object 2000, or it can grind all surfaces at the same time. In this embodiment, for the convenience of description, the structure in which the negative electrode frame 3000 is disposed inside the electrolytic polishing object 2000 is described.

The negative electrode frame 3000 may include a plate shape of a lattice structure. The negative electrode frame 3000 may be a stainless steel material excellent in conductivity and acid resistance, but it is not limited to this. The negative electrode frame 3000 may be a bar shape, an L shape, a corner shape, a bar shape, a wire mesh, a perforated metal, or a circular plate.

The negative electrode frame 3000 is arranged along the polishing surface of the electrolytic polishing object 2000. Therefore, when the electrolytic polishing object 2000 is formed in a quadrangular box shape with the upper part open, correspondingly, a plurality of negative electrode frames 3000 may be formed in a quadrangular box shape.

The negative electrode frame 3000 may include a first negative electrode plate 3100 and a second negative electrode plate 3300. The first negative electrode plate 3100 and the second negative electrode plate 3300 may be arranged to form a lattice structure. The first negative electrode plate 3100 may be formed in a long rod shape. The first negative electrode plate 3100 may be composed of a plurality of plates, which are configured to be arranged vertically apart.

The second negative electrode plate 3300 may be formed in a long rod shape. The second negative electrode plate 3300 may be composed of a plurality of plates, which are arranged in a spaced-apart manner. The first negative plate 3100 and the second negative plate 3300 may be arranged to form 90 degrees, but they are not limited to this.

The area where the first negative plate 3100 and the second negative plate 3300 intersect may be riveted by means of screws or the like. Different from this, the area where the first negative electrode plate 3100 and the second negative electrode plate 3300 intersect can also be fixed by means of a C-type clamp.

The structure in which the negative electrode frame 3000 has a fixed length is described above, but a variable structure of the negative electrode frame 3000 in which the size of the negative electrode frame 3000 changes as the electrolytic polishing object 2000 increases can be used.

As shown in FIG. 15, the negative electrode frame 3000 may include a first negative electrode plate 3100 and a second negative electrode plate 3300. The first negative electrode plate 3100 and the second negative electrode plate 3300 may be arranged to form a lattice structure.

The first negative plate 3100 may be composed of a plurality of brackets, and may be configured in such a way that the length thereof can be increased or reduced. The structure of the second negative plate 3300 may be the same as that of the first negative plate 3100. Hereinafter, the description will be focused on the structure of the first negative electrode plate 3100.

The first negative plate 3100 may be configured to connect a plurality of brackets. The first negative plates 3100 may be partially overlapped and arranged to move in directions away from or close to each other. The first negative plate 3100 may be composed of multiple supports. For the convenience of description, the description is centered on the structure of the first negative plate 3100 consisting of the first support 3120 and the second support 3140 connected to the first support 3120. .

The first bracket 3120 may have an L-shape, but it is not limited thereto. A part of the first bracket 3120 may be formed to overlap with a part of the second bracket 3140. The overlapping area of the first bracket 3120 and the second bracket 3140 may be supported by the C-shaped clamp 500. The C-shaped clamp 500 supporting the overlapping area of the first bracket 3120 and the second bracket 3140 may be referred to as a second clamp.

The first bracket 3120 and the second bracket 3140 can move in directions away from or close to each other. The C-shaped clamp 500 can support the first bracket 3120 and the second bracket 3140 with a force to the extent that the first bracket 3120 and the second bracket 3140 can move mutually. Unlike this, the C-shaped clamp 500 can further apply a fixing force after moving the first bracket 3120 and the second bracket 3140 to support the first bracket 3120 and the second bracket 3140.

The second negative plate 3300 may include a first bracket 3320 and a second bracket 3340 the same as the first negative plate 3100. The second negative electrode plate 3300 may be formed of a rod-shaped plate, but is not limited to this. The first support 3320 of the second negative plate 3300 may move in a direction away from or close to the second support 3340.

The first support 3320 and the second support 3340 of the second negative electrode plate 3300 may be partially overlapped. The overlapping area of the first support 3320 and the second support 3340 of the second negative electrode plate 3300 can be supported by the C-shaped clamp 500. Therefore, the length of the second negative plate 3300 is variable.

Please refer to FIG. 9 again. If the negative frame 3000 is in contact with the electrolytic polishing object 2000 of the positive electrode, a short circuit occurs. In order to prevent this, the negative frame 3000 should be configured to be separated from the bottom and side surfaces of the electrolytic polishing object 2000.

In this embodiment, an electrode partition member 4000 may be provided to separate the negative electrode frame 3000 from the bottom surface and the side surface of the electrolytic polishing object 2000.

The electrode partition member 4000 may be coupled to one side of the negative electrode frame 3000. The electrode partition member 4000 may be coupled to one side of the first negative electrode plate 3100 located at the bottom. The electrode partition member 4000 is coupled to one side of the first negative plate 3100 in a manner of protruding downward from the first negative plate 3100. Therefore, the electrode partition member 4000 can contact the bottom surface of the electrolytic polishing object 2000.

The electrode partition member 4000 may be coupled to one side of the first negative plate 3100 in a manner of protruding from the first negative plate 3100 to the side. Therefore, the electrode partition member 4000 can contact the side surface of the electrolytic polishing object 2000.

In order to prevent a short circuit between the negative electrode frame 3000 and the electrolytic polishing object 2000 by means of the electrode partition member 4000, the electrode partition member 4000 may be formed of an insulating material. The electrode partition member 4000 may be formed of a material that can bear the weight of the negative electrode frame 3000 and has strong acid resistance. The electrode separating member 4000 may include any one of PVC, rubber, urethane rubber, and bakelite. The negative electrode frame 3000 and the electrode partition member 4000 may be combined by means of a C-shaped clamp 500. The C-shaped jig 500 that combines the negative electrode frame 3000 and the electrode partition member 4000 may be referred to as a first jig.

The C-type clamp 500 does not permanently fix the negative electrode frame 3000 and the electrode partition member 4000. Therefore, if the C-type clamp 500 is used, the negative electrode frame 3000 and the electrode partition member 4000 can be easily installed and separated. That is, the installation position of the electrode partition member 4000 may vary depending on the shape of the electrolytic polishing object 2000, so the C-shaped jig 500 can easily change the installation position of the electrode partition member 4000 coupled to the negative frame 3000. The C-type clamp 500 can adopt the structure of FIG. 4a and FIG. 4b.

The electrode partition member 4000 may be spaced apart on one side and the other side of the first negative plate 3100 arranged at the bottom. The electrode partition member 4000 may maintain a balanced support so that the weight of the negative electrode frame 3000 does not deviate in one direction. The number of electrode partition members 4000 to be installed is not limited, and may be formed in three or more. The electrode partition member 4000 may be formed at the lower part of a plurality of negative electrode frames 3000 arranged apart from the other polishing surface inside the electrolytic polishing object 2000.

In addition, if the partition members 4000 fixed to the bottom and side surfaces of the electrolytic polishing article 2000 are installed at the corners of the negative electrode frame 3000, the center of the negative electrode frame 3000 can be grasped and the negative electrode frame 3000 can be installed more firmly.

The electrode partition member 4000 may be formed in an L-shape, a bar shape, a corner shape, or a rod shape, but is not limited to this. Next, the shape of the electrode partition member 4000 will be described as one of the aforementioned shapes. However, the shape of the electrode partition member 4000 is not limited to the shape described below.

As shown in FIG. 10, the electrode partition member 4000 may be formed so that the width of the lower portion becomes smaller. Thus, the area where the electrode partition member 4000 and the electrolytic polishing object 2000 are in contact can be minimized, and the uniform electrolytic polishing quality of the electrolytic polishing object 2000 can be maintained.

The length L of the electrode partition member 4000 may be formed to be greater than the width W of the electrode partition member 4000. The length L of the electrode partition member 4000 may be formed to be greater than the width of the first negative plate 3100. Therefore, the electrode partition member 4000 may be configured to protrude toward the lower portion of the first negative electrode plate 3100.

As an example, the length L of the electrode partition member 4000 may include 8 cm to 12 cm. The width W of the electrode partition member 4000 may include 2 cm to 7 cm. The thickness T of the electrode partition member 4000 may include 2 nm to 7 nm. The length L, width W, and thickness T of the electrode partition member 4000 are not limited to these.

The electrode partition member 4000 may include a first support part 4100 and a second support part 4300. The first support portion 4100 may be formed in a four-sided plate shape, but is not limited to this. The second support part 4300 may be formed such that its width becomes smaller and smaller toward the lower part. As an example, the second supporting portion 4300 may be formed in an inverted triangle shape having an apex at the lower part, but it is not limited thereto. On the bottom surface of the electrolytic polishing object 2000, one of the side surfaces of the first support portion 4100 or the side surface of the second support portion 4300 may be in surface contact.

As shown in FIG. 11, the apex of the second supporting portion 4300 may be in contact with the bottom surface or the side surface of the electrolytic polishing object 2000. The electrolytic polishing article 2000 may have grooves or holes formed on the bottom surface according to its shape. A part of the electrode partition member 4000 may be inserted into the groove or hole 2100 formed on the electrolytic polishing object 2000. In the groove or hole 2100 formed on the electrolytic polishing object 2000, the apex area of the second support portion 4300 of the electrode partition member 4000 can be inserted and joined. The lower part of the second support part 4300 is formed with a narrow width, so a part of the second support part 4300 can be inserted and combined regardless of the size of the slot or hole 2100. Therefore, when there is a groove or hole 2100 at the bottom of the electrolytic polishing object 2000, the groove or hole 2100 can be used to more effectively fix the negative electrode frame 4000.

Even if the groove or hole 2100 is not formed in the electrolytic polishing object 2000, since the partition member 4000 contacts the bottom surface and the side surface of the electrolytic polishing object 2000 and is fixed, the negative electrode frame 3000 can be installed more firmly.

The electrode partition member 4000 described above may be formed in various shapes. The electrode partition member 400 may be formed as shown in FIGS. 12 to 14.

As shown in FIG. 12, the electrode partition member 4000 may include an inner support member 4500 and the outer support member 4600. The inner support member 4500 may include a concrete expansion plug or iron sheet having a rigid strength, but is not limited to this. The inner support member 4500 can increase the hardness of the electrode partition member 4000. The outer support member 4600 may be formed on the surface of the inner support member 4500. The outer support member 4600 may include an insulating material. The outer support member 4600 may include an insulating material such as plastic, but is not limited thereto.

As shown in FIG. 13, the electrode partition member 4000 may include a first support part 4100 and a second support part 4300. The first support portion 4100 may be formed in a four-sided plate shape, but is not limited to this. The second support part 4300 may be formed such that its width becomes smaller and smaller toward the lower part.

The second support part 4300 may have a trapezoidal shape with a lower face width smaller than an upper face width. The lower surface of the second supporting portion 4300 may be in contact with the bottom surface of the electrolytic polishing object. Compared with the sharp-edged electrode partition member, the lower surface of the second support 4300 has a wider contact area with the electrolytic polishing object 2000, and thus has the effect of supporting the negative electrode frame 3000 more effectively. When a groove or hole is formed at the bottom of the electrolytic polishing object 2000, a part of the second supporting portion 4300 may be inserted into the groove or hole of the electrolytic polishing object 2000.

As shown in FIG. 14, the electrode partition member 4000 may include a first support part 4100 and a second support part 4300. The first support portion 4100 may be formed in a four-sided plate shape, but is not limited to this. The second support part 4300 may be formed such that its width becomes smaller and smaller toward the lower part.

The second supporting part 4300 may be formed such that the lower part has rounded corners. The lower surface of the second supporting portion 4300 may be in contact with the bottom surface of the electrolytic polishing object 2000. The lower surface of the second supporting portion 4300 has the effect of preventing scars from appearing on the electrolytic polishing object when it is in contact with the electrolytic polishing object 2000. When a groove or hole is formed at the bottom of the electrolytic polishing object 2000, a part of the second supporting portion 4300 may be inserted into the groove or hole of the electrolytic polishing object 2000.

The electrode partition member 4000 of the second embodiment is arranged at the lower part of the negative electrode frame 3000, so that the negative electrode frame 3000 can be effectively arranged on the electrolytic polishing object 2000 without an additional bracket.

When the electrolytic polishing object 2000 has a plate shape such as a door, the negative electrode frame 3000 is supported by the electrode partition member 4000, and after being arranged on the upper portion of the electrolytic polishing object 2000, electrolytic polishing can be performed. Next, with the negative electrode frame 3000 removed, the electrolytic polishing object 2000 is arranged upside down, and the negative electrode frame 3000 can be rearranged on the upper part of the electrolytic polishing object. Next, if electrolytic polishing is performed on the electrolytic polishing object 2000, there is an effect that the time required for installation and electrolytic polishing can be shortened.

The structure in which the electrode partition member 4000 is in contact with the bottom of the electrolytic polishing object 2000 is described above, but differently from this, the electrode partition member 4000 may be formed in a structure that contacts the side wall of the electrolytic polishing object 2000, so that the negative electrode frame 3000 is removed from the electrolysis The grinding surfaces of the grinding object 2000 are separated.

Please refer to FIGS. 16 to 19 below to provide various embodiments of the electrolytic polishing device structure.

Fig. 16 is a cross-sectional view showing a modification of the electrolytic polishing apparatus of the second embodiment.

As shown in FIG. 16, the electrolytic polishing device may include: an electrolytic tank 1000, which is equipped with a storage space for accommodating an electrolytic polishing object 2000 and an electrolyte; a negative frame 3000, which is disposed on the polishing surface of the electrolytic polishing object 2000 One side; the electrode partition member 4000, which is arranged on one side of the negative frame 3000 to separate the negative frame 3000 from the bottom surface of the electrolytic polishing object 2000.

The electrolytic cell 1000 may be formed in a box shape equipped with a storage space inside. The electrolytic cell 1000 may include a cylindrical shape, a polygonal box or a ring shape, but its shape is not limited. The inside of the electrolytic cell 1000 may be filled with an electrolytic solution 1100. As the electrolyte solution 1100, it can be prepared from distilled water (H ₂ O), sulfuric acid (H ₂ SO ₄ ), phosphoric acid (H ₃ PO ₄ ), chromic acid, sodium nitrate (NaNO ₃ ), sodium chloride (NaCl) A mixture of at least one selected from the group consisting of glycerols, but it is not limited to this.

The electrolytic grinding object 2000 can be accommodated inside the electrolytic tank 1000. The electrolytic polishing object 2000 is immersed in the electrolyte 1100. The polishing surface of the electrolytic polishing object 2000 may include the outer side, the inner side, and the bottom surface of the electrolytic polishing object. A rectifier may also be arranged on the outside of the electrolytic cell 2000. The rectifier can connect the positive (+) voltage to the electrolytic grinding object, and can connect the negative (-) voltage to the negative frame 3000. The rectifier can be electrically connected to the electrolytic polishing object 2000 by means of wires or the like.

The negative frame 3000 can be disposed inside and outside the electrolytic polishing object 2000. The negative frame 3000 may be arranged at a predetermined interval from the polishing surface of the electrolytic polishing object 2000. The negative electrode frame 3000 can selectively grind the inner, outer, or bottom surface of the grinding surface of the electrolytic grinding object 2000, or grind all surfaces. In this embodiment, for the convenience of description, the structure in which the negative electrode frame 3000 is disposed inside the electrolytic polishing object 2000 is described.

The negative electrode frame 3000 may include a plate shape of a lattice structure. The negative electrode frame 3000 may be a stainless steel material with excellent conductivity, but it is not limited to this. The negative electrode frame 3000 may be a bar shape, an L shape, a corner shape, a bar shape, a wire mesh, a perforated metal, or a circular plate.

The negative electrode frame 3000 is arranged along the polishing surface of the electrolytic polishing object 2000. Therefore, when the electrolytic polishing object 2000 is formed in a quadrangular box shape with the upper part open, correspondingly, a plurality of negative electrode frames 3000 may be formed in a quadrangular box shape.

The negative electrode frame 3000 may include a first negative electrode plate 3100 and a second negative electrode plate 3300. The first negative plate 3100 and the second negative plate 3300 are formed in a lattice structure. The first negative electrode plate 3100 may be formed in a long rod shape. The first negative electrode plate 3100 may be composed of a plurality of plates, which are configured to be arranged vertically apart.

The second negative electrode plate 3300 may be formed in a long rod shape. The second negative plate 3300 may be composed of a plurality of plates, which are configured to be spaced apart from each other on the left and right. The first negative plate 3100 and the second negative plate 3300 may be arranged to form 90 degrees, but they are not limited to this.

The area where the first negative plate 3100 and the second negative plate 3300 intersect may be riveted by means of screws or the like. The area where the first negative electrode plate 3100 and the second negative electrode plate 3300 intersect may also be fixed by means of a C-type clamp.

If the negative electrode frame 3000 is in contact with the electrolytic polishing object 2000, a short circuit occurs. In order to prevent this, the negative frame 3000 should be configured to be separated from the side and bottom surfaces of the electrolytic polishing object 2000. The side surface of the electrolytic polishing object 2000 can adjust the length of the first negative plate 3100 of the negative frame 3000, and is arranged separately from the electrolytic polishing object 2000.

In this embodiment, an electrode partition member 4000 may be provided to partition the negative electrode frame 3000 from the bottom surface of the electrolytic polishing object 2000.

The electrode partition member 4000 may be formed of an insulating material. The electrode partition member 4000 may be formed of a material that can bear the weight of the negative electrode frame 3000 and has strong acid resistance. The electrode separating member 4000 may include any one of PVC, rubber, urethane rubber, and bakelite. The electrode partition member 4000 is formed of an insulating material, so that it is possible to prevent the negative electrode frame 3000 from being short-circuited with the electrolysis target 2000 as the positive electrode. The shape of the electrode partition member 4000 may have a shape whose width becomes narrower and narrower to the lower part, but is not limited to this.

The electrode partition member 4000 may be coupled to one side of the negative electrode frame 300. The electrode partition member 4000 may be coupled to one side of the first negative electrode plate 3100 arranged at the top. The electrode partition member 4000 may be arranged to overlap with the first negative electrode plate 3100 arranged on the uppermost side. The electrode partition member 4000 may be fixed to the first negative electrode plate 3100 arranged on the uppermost side by the C-shaped clamp 500.

Wherein, the length of the first negative electrode plate 3100 arranged at the top can be formed to be longer than the length of other first negative electrode plates 3100. The first negative electrode plate 3100 arranged at the top may be arranged on the upper part of the side wall of the electrolytic polishing object 2000. The electrode partition member 4000 may be in contact with the upper part of the side wall of the electrolytic polishing object 2000. The electrode partition member 4000 may be arranged in plurality along the upper surface of the side wall of the electrolytic polishing object 2000.

The electrode partition member 4000 has the effect of stably supporting the negative electrode frame 3000 while partitioning the negative electrode frame 3000 from the bottom of the electrolytic polishing article 2000.

In addition, the electrode partition member 4000 of the second embodiment does not contact the bottom of the electrolytic polishing object 2000, and thus has the effect of preventing damage caused by the electrode partition member 4000 contacting the electrolytic polishing object 2000.

FIG. 17 is a cross-sectional view showing another modified example of the electrolytic polishing apparatus of the second embodiment, and FIG. 18 is a perspective view showing a state where the negative electrode frame of FIG. 17 is coupled to the holder.

As shown in FIG. 17, the electrolytic polishing apparatus of the second embodiment modification may include: an electrolytic tank 1000, which is equipped with a storage space for accommodating an electrolytic polishing object 2000 and an electrolyte 1100; a negative electrode frame 3000, which is disposed in the One side of the grinding surface of the electrolytic grinding object 2000; a support 7000, which is coupled to one side of the negative frame 3000; an electrode separation member 4000, which is coupled to one side of the support 7000, so that the negative frame 3000 is removed from The bottom surfaces of the electrolytic polishing objects are separated.

The electrolytic cell 1000 may be formed in a box shape equipped with a storage space inside. The electrolytic cell 1000 may include a cylindrical shape, a polygonal box or a ring shape, but its shape is not limited. The inside of the electrolytic cell 1000 may be filled with an electrolytic solution 1100. As the electrolyte solution 1100, it can be prepared from distilled water (H ₂ O), sulfuric acid (H ₂ SO ₄ ), phosphoric acid (H ₃ PO ₄ ), chromic acid, sodium nitrate (NaNO ₃ ), sodium chloride (NaCl) A mixture of at least one selected from the group consisting of glycerols, but it is not limited to this.

The electrolytic grinding object 2000 can be accommodated inside the electrolytic tank 1000. The electrolytic polishing object 2000 is immersed in the electrolyte 1100. The polishing surface of the electrolytic polishing object 2000 may include the outer side, the inner side, and the bottom surface of the electrolytic polishing object 2000. A rectifier may also be arranged on the outside of the electrolytic cell 1000. The rectifier can connect the positive (+) voltage to the electrolytic grinding object, and can connect the negative (-) voltage to the negative frame 3000. The rectifier can be electrically connected to the electrolytic polishing object 2000 by means of wires or the like.

The negative frame 3000 can be disposed inside and outside the electrolytic polishing object 2000. The negative frame 3000 may be arranged at a predetermined interval from the polishing surface of the electrolytic polishing object 2000. The negative electrode frame 3000 can selectively grind the inner, outer, or bottom surface of the grinding surface of the electrolytic grinding object 2000, or grind all surfaces. In this embodiment, for the convenience of description, the structure in which the negative electrode frame 3000 is disposed inside the electrolytic polishing object 2000 is described.

The negative electrode frame 3000 may include a plate shape of a lattice structure. The negative electrode frame 3000 may be a stainless steel material with excellent conductivity, but it is not limited to this. The negative electrode frame 3000 may be a bar shape, an L shape, a corner shape, a bar shape, a wire mesh, a perforated metal, or a circular plate.

The negative electrode frame 3000 is arranged along the polishing surface of the electrolytic polishing object 200. Therefore, when the electrolytic polishing object 2000 is formed in a quadrangular box shape with an open upper portion, correspondingly, a plurality of negative electrode frames 3000 can be formed in a quadrangular box shape.

The negative electrode frame 3000 may include a first negative electrode plate 3100 and a second negative electrode plate 3300. The first negative plate 3100 and the second negative plate 3300 are formed in a lattice structure. The first negative electrode plate 3100 may be formed in a long rod shape. The first negative electrode plate 3100 may be composed of a plurality of plates, which are configured to be arranged vertically apart.

The second negative electrode plate 3300 may be formed in a long rod shape. The second negative plate 3300 may be composed of a plurality of plates, which are configured to be spaced apart from each other on the left and right. The first negative plate 3100 and the second negative plate 3300 may be arranged to form 90 degrees, but they are not limited to this.

The area where the first negative plate 3100 and the second negative plate 3300 intersect may be riveted by means of screws or the like. The area where the first negative electrode plate 3100 and the second negative electrode plate 3300 intersect may also be fixed by means of a C-type clamp.

If the negative electrode frame 3000 is in contact with the electrolytic polishing object 2000, a short circuit occurs. In order to prevent this, the negative frame 3000 should be configured to be separated from the side and bottom surfaces of the electrolytic polishing object 2000. The side surface of the electrolytic grinding object 2000 can adjust the length of the first negative plate 3100 of the negative frame 3000, and is arranged separately from the electrolytic grinding object.

The negative frame 3000 may be equipped with the electrode partition member 4000 of this embodiment so as to be partitioned from the bottom surface of the electrolytic polishing object 2000.

The electrode partition member 4000 may be formed of an insulating material. The electrode partition member 4000 may be formed of a material that can bear the weight of the negative electrode frame 3000 and has strong acid resistance. The electrode separating member 4000 may include any one of PVC, rubber, urethane rubber, and bakelite. The electrode partition member 4000 is formed of an insulating material, so as to prevent a short circuit between the negative electrode frame and the electrolytic object as the positive electrode. The shape of the electrode partition member 4000 may have a shape whose width becomes narrower and narrower to the lower part, but is not limited to this.

The electrode partition member 4000 may be disposed on the upper part of the side wall of the electrolytic polishing object 2000. On one side of the negative electrode frame 3000, a bracket 7000 may be combined to support the negative electrode frame 3000. The bracket 7000 may be formed in a bar shape, an L shape, a corner shape, a bar shape, a wire mesh, a perforated metal, or a circular shape. The bracket 7000 may be arranged in parallel with the first negative plate 3100. The bracket 7000 may be combined with the upper side of the second negative plate 3300. The bracket 7000 may be combined with a part or the whole of the second negative plate 3300. The bracket 7000 may be formed in a long manner so as to be arranged on the upper part of the side wall of the electrolytic polishing object 2000. The bracket 7000 can be connected to one side of the electrolytic polishing object 2000. The bracket 7000 may be formed of a metal material. The support 7000 may be a positive electrode support connected to the electrolytic grinding object 2000 for transferring the positive electrode.

An insulating plate 5000 may be further arranged between the support 7000 and the negative frame 3000. The negative frame 3000, the insulating plate 5000, and the bracket 7000 can be firmly fixed with the aid of the C-shaped clamp 500 in the state of overlapping. If the support 7000 is not connected to the electrolytic grinding object 2000, but serves as a common support, the insulating plate 5000 between the negative frame 3000 and the support 7000 can be removed. In addition, if the bracket 7000 functions as a general bracket, it may be formed of an insulating material.

The electrolytic polishing apparatus according to the modification of the second embodiment has the effect that the negative electrode frame can be effectively mounted on the inside and outside of the electrolytic polishing object by using the bracket.

19 is a cross-sectional view showing another modification of the electrolytic polishing apparatus of the second embodiment. The electrolytic polishing apparatus will be mainly described with a structure in which the negative electrode frame is arranged outside the electrolytic polishing apparatus.

As shown in FIG. 19, the electrolytic polishing apparatus of another modification of the second embodiment may include: an electrolytic tank 1000, which is equipped with a storage space for accommodating an electrolytic polishing object 2000 and an electrolyte 1100; The outer side of the grinding surface of the electrolytic grinding object 2000; the bracket 7000, which is coupled to one side of the negative frame 3000; the electrode partition member 4000, which is coupled to one side of the frame 7000, so that the negative frame 3000 Separate from the bottom surface of the electrolytic polishing object.

The electrolytic cell 1000 may be formed in a box shape equipped with a storage space inside. The electrolytic cell 1000 may include a cylindrical shape, a polygonal box or a ring shape, but its shape is not limited. The inside of the electrolytic cell 1000 may be filled with an electrolytic solution 1100. As the electrolyte 1100, it can be prepared from distilled water (H ₂ O), sulfuric acid (H ₂ SO4), phosphoric acid (H ₃ PO ₄ ), chromic acid, sodium nitrate (NaNO ₃ ), sodium chloride (NaCl), At least one selected from the group consisting of glycerin is mixed, but it is not limited to this.

The electrolytic grinding object 2000 can be accommodated inside the electrolytic tank 1000. The electrolytic polishing object 2000 is immersed in the electrolyte 1100. The polishing surface of the electrolytic polishing object 2000 may include the outer side, the inner side, and the bottom surface of the electrolytic polishing object 2000. A rectifier may also be arranged on the outside of the electrolytic cell 1000. The rectifier can connect the positive (+) voltage to the electrolytic grinding object, and can connect the negative (-) voltage to the negative frame 3000. The rectifier can be electrically connected to the electrolytic polishing object 2000 by means of wires or the like.

The negative frame 3000 may be disposed outside the electrolytic polishing object 2000. The negative electrode frame 3000 may be arranged at a predetermined interval from the polishing surface outside the electrolytic polishing object 2000.

The negative electrode frame 3000 may include a plate shape of a lattice structure. The negative electrode frame 3000 may be a stainless steel material with excellent conductivity, but it is not limited to this. The negative electrode frame 3000 may be a bar shape, an L shape, a corner shape, a bar shape, a wire mesh, a perforated metal, or a circular plate.

The negative electrode frame 3000 is arranged along the polishing surface of the electrolytic polishing object 2000. Therefore, when the electrolytic polishing object 2000 is formed in a quadrangular box shape with the upper part open, correspondingly, a plurality of negative electrode frames 3000 may be formed in a quadrangular box shape.

The negative electrode frame 3000 may include a first negative electrode plate 3100 and a second negative electrode plate 3300. The first negative plate 3100 and the second negative plate 3300 are formed in a lattice structure. The first negative electrode plate 3100 may be formed in a long rod shape. The first negative electrode plate 3100 may be composed of a plurality of plates, which are configured to be arranged vertically apart.

The second negative electrode plate 3300 may be formed in a long rod shape. The second negative plate 3300 may be composed of a plurality of plates, which are configured to be spaced apart from each other on the left and right. The first negative plate 3100 and the second negative plate 3300 may be arranged to form 90 degrees, but they are not limited to this.

The area where the first negative plate 3100 and the second negative plate 3300 intersect may be riveted by means of screws or the like. The area where the first negative electrode plate 3100 and the second negative electrode plate 3300 intersect may also be fixed by means of a C-type clamp.

The electrode partition member 4000 may be formed of an insulating material. The electrode partition member 4000 may be formed of a material that can bear the weight of the negative electrode frame 3000 and has strong acid resistance. The electrode separating member 4000 may include any one of PVC, rubber, urethane rubber, and bakelite. The electrode partition member 4000 is formed of an insulating material, so as to prevent the negative electrode frame 3000 from being short-circuited with the electrolytic object 2000 as the positive electrode. The shape of the electrode partition member 4000 may have a shape whose width becomes narrower and narrower to the lower part, but is not limited to this.

The electrode partition member 4000 may be disposed on the upper part of the side wall of the electrolytic polishing object 2000. On one side of the negative electrode frame 3000, a bracket 7000 may be combined to support the negative electrode frame 3000.

The bracket 7000 may include a first bracket 7100 and a second bracket 7200. The first support 7100 may support the negative electrode frame 3000 arranged inside the electrolytic polishing object 2000. The second bracket 7200 may be arranged perpendicular to the first bracket 7100, but is not limited to this. The second bracket 7200 may be formed in a bar shape, an L shape, a corner shape, a bar shape, a wire mesh, a perforated metal, or a round shape.

The second bracket 7200 can be combined with the upper side of the second negative electrode plate 3300 arranged on the outermost profile. The second bracket 7200 may be combined with a part or the whole of the second negative electrode plate 3300.

The support 7000 may be a positive electrode support connected to the electrolytic grinding object 2000 for transferring the positive electrode. At this time, an insulating plate may be further arranged between the second bracket 7200 and the second negative plate 3300. The second negative plate 3300, the insulating plate, and the second bracket 7200 can be firmly fixed by means of the C-shaped clamp 500 in the overlapping state. If the support 7000 is not connected to the electrolytic grinding object 2000, but serves as a common support, the insulating plate between the second negative plate 3300 and the second support 7200 can be removed. In addition, if the bracket 7000 functions as a general bracket, it may be formed of an insulating material.

The electrolytic polishing apparatus according to the modification of the second embodiment has the effect that the negative electrode frame 3000 can be effectively mounted on the inside and outside of the electrolytic polishing object 2000 by using a bracket.

According to an embodiment, by arranging the electrode partition member 4000 on the side of the negative electrode frame 3000, the negative electrode frame 3000 is arranged on the electrolytic grinding object 2000, so that the negative electrode frame 3000 can be effectively arranged on the electrolytic grinding object 2000 without another bracket. Internally or externally, the negative electrode frame 3000 can be quickly disposed on the electrolytic polishing object 2000, and the efficiency of the electrolytic polishing process can be improved, and the electrolytic polishing quality can be significantly improved.

In addition, through an embodiment, the lower width of the electrode partition member 4000 is gradually reduced, and the electrode partition member 4000 is inserted into a groove or hole formed at the bottom of the electrolytic polishing article 2000, thereby having the effect of more effectively fixing the negative electrode frame 3000.

According to an embodiment, by disposing the electrode partition member 4000 on the upper part of the side wall of the electrolytic polishing object 2000, the negative electrode frame 3000 can be separated from the bottom of the electrolytic polishing object 2000 while stably supporting the negative electrode frame 3000.

In addition, by disposing the electrode partition member 4000 so as not to contact the bottom of the electrolytic polishing object 2000 through an embodiment, there is an effect of preventing damage caused by contact between the electrode partition member 4000 and the electrolytic polishing object 2000.

In addition, through the use of the bracket 7000 through an embodiment, the negative electrode frame 3000 can be effectively installed on the inside and outside of the electrolytic polishing object 2000.

100‧‧‧Electrolysis cell 1000‧‧‧Electrolysis cell 1100‧‧‧Electrolyte 200‧‧‧Electrolytic polishing object 200a‧‧‧Bottom 200b‧‧‧Side wall 210‧‧‧Protruding part 2000‧‧‧Electrolytic polishing object 2100‧‧‧Slot/hole 300‧‧‧Negative Frame 300a‧‧‧First Negative Frame 300b‧‧‧Second Negative Frame 310‧‧‧First Negative Plate 310a‧‧‧First Negative Plate 312‧‧‧ One support 314‧‧‧Second support 330‧‧‧Second negative plate 330a‧‧‧Second negative plate 332‧‧‧First support 334‧‧‧Second support 3000‧‧‧Negative frame 3100‧‧‧ One negative plate 3120‧‧‧First support 3140‧‧‧Second support 3300‧‧‧Second negative plate 3320‧‧‧First support 3340‧‧‧Second support 400‧‧‧Electrode placement member 400a‧‧‧ Electrode placement member 410‧‧‧First side 430‧‧‧Second side 4000‧‧‧Electrode separation member 4100‧‧‧First support part 4300‧‧‧Second support part 4500‧‧‧Inner support member 4600‧ ‧‧Outside support member 500‧‧‧Clamp 510‧‧‧Fixed part 520‧‧‧Insulator 530‧‧‧Protrusion 540‧‧‧First body 550‧‧‧Second body 550a‧‧‧Conductive substance 550b ‧‧‧Insulation film 5000‧‧‧Insulation plate 600‧‧‧Bracket 700‧‧‧Insulation member 7000‧‧‧Support 7100‧‧‧First support 7200‧‧‧Second support L‧‧‧Length T‧‧ ‧Thickness W‧‧‧Width

[Fig. 1] is an exploded perspective view showing the electrolytic polishing apparatus of the first embodiment. [Fig. 2] is a combined perspective view showing the electrolytic polishing apparatus of the first embodiment. [Fig. 3] Fig. 3 is a combined perspective view showing a state where the electrode frames of the electrolytic polishing apparatus of the first embodiment are combined. [FIG. 4a]-[FIG. 4b] are perspective views showing the jig of the electrolytic polishing apparatus of the first embodiment, respectively. Fig. 5 is a perspective view showing a modification of the negative electrode frame of the electrolytic polishing apparatus of the first embodiment. [Fig. 6]-[Fig. 8] are perspective views showing modified examples of the electrolytic polishing apparatus of the first embodiment, respectively. [Fig. 9] is a cross-sectional view showing the electrolytic polishing apparatus of the second embodiment. [Fig. 10] is a perspective view showing the electrode partition member of Fig. 9. Fig. 11 is a schematic perspective view showing a state where the electrode partition member of Fig. 9 is fixed to an electrolytic polishing object. [Fig. 12]-[Fig. 14] are perspective views showing various structures of the electrode partition member of the second embodiment, respectively. Fig. 15 is a perspective view showing a modification of the negative electrode frame of Fig. 9. [Fig. 16]-[Fig. 17] are cross-sectional views showing modified examples of the electrolytic polishing apparatus of the second embodiment, respectively. [Fig. 18] is a perspective view showing a state in which the negative electrode frame of Fig. 17 is coupled to a holder. Fig. 19 is a sectional view showing another modification of the electrolytic polishing apparatus of the second embodiment.

100‧‧‧Electrolyzer

200‧‧‧Electrolytic polishing objects

210‧‧‧Protrusion

300‧‧‧Negative Frame

310‧‧‧First negative plate

330‧‧‧Second negative plate

400‧‧‧Electrode placement component

500‧‧‧Fixture

700‧‧‧Insulation member

Claims (10)

An electrode frame for electrolytic polishing. The electrode frame is used in an electrolytic tank equipped with an electrolytic polishing object and an electrolytic solution containing space. The electrolytic polishing object has at least one protrusion and a polishing surface. The electrode The frame includes: an electrode placement member for coupling with the protrusion of the electrolytic polishing object, including: a first surface for coupling with the protrusion of the electrolytic polishing object; and a second surface; Wherein, even if the electrode placement member does not use a discharge port, it is used to directly connect with the protruding part of the electrolytic polishing object; and a first negative electrode frame is formed in a plurality of lattice structures and is combined with the second surface, At least one side of the lattice structure is combined with the electrode placement member, and is arranged at a predetermined interval from the polishing surface of the electrolytic polishing object; wherein, the first surface of the electrode placement member directly combines with the electrolytic polishing object The protrusion. The electrode frame for electrolytic polishing according to claim 1, wherein the second surface and the first surface are bent at a predetermined angle, and the first surface is formed by means of the protrusion of the electrolytic polishing object and a first surface. The second surface of the electrode placement member is fixed by means of a side of the first negative electrode frame and the second clamp. An electrode frame for electrolytic polishing. The electrode frame is used in an electrolytic tank equipped with an electrolytic polishing object and an electrolytic solution containing space. The electrode frame includes: an electrode placement member that is combined with at least one of the electrolytic polishing object The protruding part includes: a first surface combined with the protruding part of the electrolytic polishing object; A second surface combined with the first negative electrode frame; and the electrode placement member is combined with the protrusion of the electrolytic polishing object even if a discharge port is not used; and a first negative electrode frame having a plurality of lattice structures At least one side of the lattice structure is combined with the electrode placement member and is arranged at a predetermined interval from a polishing surface of the electrolytic polishing object; wherein the electrolytic polishing object includes a bottom formed with a lower protrusion, More than one side wall formed by bending from the bottom to the side, further includes a second negative electrode frame arranged opposite to the side wall of the electrolytic polishing object; the electrode placement member is separated from the bottom and the side of the electrolytic polishing object The second negative electrode frame is fixed to the electrode placing member. An electrode frame for electrolytic polishing. The electrode frame is used in an electrolytic tank equipped with an electrolytic polishing object and an electrolytic solution containing space. The electrode frame includes: an electrode placement member that is combined with at least one of the electrolytic polishing object The protruding part includes: a first surface combined with the protruding part of the electrolytic polishing object; a second surface combined with the first negative electrode frame; and the electrode placement member even if a discharge port is not used, it The protruding part of the electrolytic grinding object is combined; and a first negative electrode frame is formed in a plurality of lattice structures, wherein at least one side of the lattice structure is combined with the electrode placement member, and a grinding of the electrolytic grinding object The faces are arranged at a predetermined interval; Wherein the electrode placement member is also provided with a negative frame bracket for placing the first negative frame, the negative frame bracket is combined with the second surface of the electrode placement member, the first negative frame and the negative frame The brackets are overlapped and fixed. An electrode frame for electrolytic polishing. The electrode frame is used in an electrolytic tank equipped with an electrolytic polishing object and an electrolytic solution containing space. The electrode frame includes: an electrode placement member that is combined with at least one of the electrolytic polishing object The protruding part includes: a first surface combined with the protruding part of the electrolytic polishing object; a second surface combined with the first negative electrode frame; and the electrode placement member even if a discharge port is not used, it The protruding part of the electrolytic grinding object is combined; and a first negative electrode frame is formed in a plurality of lattice structures, wherein at least one side of the lattice structure is combined with the electrode placement member, and a grinding of the electrolytic grinding object The surfaces are arranged at a predetermined interval; wherein the first negative frame includes a first negative plate arranged along a first direction and composed of a plurality of brackets, and is arranged along a second direction that forms a predetermined angle with the first direction and A second negative plate is composed of a plurality of supports. The first negative plate includes a first support and a second support. The first support is partially overlapped with the second support. Move away or approach. An electrode frame, which is used to equip an electrolytic cell containing an electrolytic grinding object and a containing space for an electrolyte solution inside. The electrolytic grinding object has a grinding surface, a bottom surface and a side surface. The electrode frame includes: a negative electrode The frame is used to be arranged on one side of the polishing surface of the electrolytic polishing object; and An electrode partition member coupled to the negative electrode frame to separate the negative electrode frame from the bottom surface of the electrolytic polishing object, and the electrode partition member includes for joining to the bottom surface of the electrolytic polishing object and supporting the negative electrode frame A first electrode partition member and a second electrode partition member for joining to the side surface of the electrolytic polishing object, the first electrode partition member is used to support the negative electrode frame even if a discharge port is not used; Wherein, the first electrode separating member is used for directly contacting the bottom surface of the electrolytic polishing object. An electrode frame, which is used for an electrolytic cell equipped with a containing space for an electrolytic grinding object and an electrolyte solution inside, comprising: a negative electrode frame arranged on one side of the grinding surface of the electrolytic grinding object; and An electrode partition member, which is coupled to the negative electrode frame to separate the negative electrode frame from a bottom surface of the electrolytic polishing object, and the electrode partition member includes a second electrode that is joined to the bottom surface of the electrolytic polishing object and supports the negative electrode frame An electrode partition member, the first electrode partition member supports the negative electrode frame even if a discharge port is not used; wherein a groove or a hole is formed on the bottom surface of the electrolytic grinding object, the electrode partition member further includes a lower portion A part is inserted into a second electrode partition member coupled to the groove or hole, and the width of the lower part of the second electrode partition member gradually decreases. The electrode frame according to claim 6, wherein the electrode partition member includes a stainless steel material, an insulating material is coated on the surface of the electrode partition member, and the electrode partition member is arranged to overlap the negative electrode frame by means of a first The electrolytic polishing object is fixed by a jig, the electrolytic polishing object includes a side wall portion, and the electrode separating member is disposed on the upper part of the side wall portion of the electrolytic polishing object. The electrode frame according to claim 6, wherein a bracket is also combined on the upper part of the negative electrode frame, and the electrode partition member is combined on one side of the bracket, the electrolytic polishing object includes a side wall, and the electrode partition member The upper part of the side wall part connected to the electrolytic polishing object is arranged. An electrolytic polishing device including the electrode frame of any one of claims 1 to 9.

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