TWI771080B - Substrate position detection method, drawing method, substrate position detection apparatus and drawing apparatus - Google Patents

Abstract

The substrate position detection method includes a step (step S11) of holding a substrate having a plurality of substrate elements, each of which is partitioned in a rectangular shape by a grid-like line to be split, a step (step S12) of capturing each of two or more selected substrate elements selected from the plurality of substrate elements and acquiring two or more captured images, and a step (step S13) of obtaining the positions of the two or more selected substrate elements and detecting the positions of the substrate by performing pattern matching using a reference image for each of the two or more captured images. Each of the plurality of substrate elements has a pattern region in which a predetermined pattern is formed inside the outer edge of the substantially rectangular region. The reference image is a set of line segments set on each side of the outer edge of the region except for the corners. As a result, the position of the substrate can be detected easily and accurately.

Description

Substrate position detection method, drawing method, substrate position detection device, and drawing device

The present invention relates to a technique for detecting the position of a substrate. [Reference to related applications] This application claims the right of priority based on Japanese Patent Application JP2020-158301 filed on September 23, 2020, and the entire disclosure of Japanese Patent Application JP2020-158301 is incorporated herein by reference.

Conventionally, patterning (hereinafter referred to as "substrate") is performed by irradiating light to a photosensitive material formed on a semiconductor substrate, a printed substrate, an organic EL (electroluminescence) display device, or a glass substrate for a liquid crystal display device (hereinafter referred to as "substrate"). pattern) description. In a drawing apparatus for performing such drawing, an alignment mark provided on a substrate is photographed, and an alignment process for automatically adjusting the drawing position of a pattern is performed based on the photographed result.

In recent years, in a substrate for a semiconductor package, in order to increase the number of packages that can be taken from one substrate, the space for arranging alignment marks has been reduced. Therefore, it is not necessary to provide an alignment-dedicated mark on the substrate, and the operation of using a part of the pattern on the substrate as an alignment mark is performed. In this case, the portion of the pattern utilized as an alignment mark needs to have a unique shape and be present in a certain number on the substrate. However, in order to identify the part satisfying such a condition from the pattern, a complicated operation is required, and the part satisfying the condition does not necessarily exist.

On the other hand, in Japanese Patent Application Laid-Open No. 2013-520825 (Document 1), a technique has been proposed in which, in a drawing device, a workpiece such as a substrate having a plurality of dies arranged on its main surface is drawn. In the alignment, the edges and corners of the workpiece or the edges and corners of the reference crystal grains are used as datum features.

In addition, in the substrate for semiconductor packaging, the corners of the rectangular region forming the package may have irregular shapes such as obliquely chamfered or cut out small rectangles. The shape of the corners may also be different for each substrate, and may also be different in a plurality of rectangular areas on one substrate. Therefore, there is a concern that even if the rectangular area is to be detected by pattern matching and used as an alignment mark, the template for pattern matching will not match the corners of the rectangular area. , resulting in undetectable or false detection.

The present invention focuses on a board position detection method for detecting the position of a board, and aims to easily and accurately perform position detection of a board.

A substrate position detection method according to a preferred aspect of the present invention includes the step a of holding a substrate having a plurality of substrate elements, and the plurality of substrate elements are each divided into a rectangular shape by grid-like planned dividing lines step b, respectively photographing two or more selected substrate elements selected from a plurality of the substrate elements, and acquiring two or more photographed images; and step c, using each of the two or more photographed images The pattern matching of the reference image is performed, whereby the positions of the two or more selected substrate elements are respectively obtained, and the positions of the substrates are detected. Each of the plurality of substrate elements has a pattern area, and the pattern area has a predetermined pattern formed on the inner side of the outer edge of the substantially rectangular area. The reference image is a set of line segments set by removing corners in each side of the outer edge of the region.

According to the above-mentioned board position detection method, the board position can be detected easily and accurately.

Preferably, the reference image includes the longest line segment in each of the sides of the outer edge of the area.

Preferably, in the reference image, the line segments in each of the sides at the outer edge of the region are separated from the virtual intersection of each of the sides with other sides by more than 10% of the length of each of the sides.

Preferably, in the step c, before matching with the reference image pattern, closing processing is performed on two or more of the captured images.

Preferably, the size of the imaging-capable region that can be acquired by one imaging in the step b is smaller than the size of each of the selection substrate elements. The two or more aforementioned captured images are each generated by synthesizing a plurality of partial images obtained by capturing a plurality of times in the aforementioned step b into a base image. The difference between the pixel value of the base image in the periphery of the plurality of partial images and the average pixel value of the entire plurality of partial images is smaller than the difference of the pixel value set to distinguish the pattern area from the background area .

Preferably, in the case where the captured image acquired in the step b includes only a part of the selected substrate element, the patterning is performed in a state where a frame-shaped expanded image is added around the captured image in the step c. match. The difference between the pixel value of the expanded image in the periphery of the captured image and the average pixel value of the entire captured image is smaller than the difference of the pixel value set to distinguish the pattern area from the background area.

Preferably, in the case where the captured image obtained in the above-mentioned step b includes only a part of the selected substrate elements, instead of the above-mentioned step c or after the above-mentioned step c, it is notified that the above-mentioned substrate is an incorrect substrate.

The present invention also focuses on a drawing method for drawing a substrate. A drawing method of a preferred aspect of the present invention includes: a step d of detecting the position of the substrate by the substrate position detection method; and a step e of detecting the position of the substrate based on the substrate detected in the step d The drawing position is adjusted, and the drawing is performed by irradiating light to the plurality of the substrate elements of the substrate.

The present invention also focuses on a substrate position detection device for detecting the position of a substrate. A substrate position detection device according to a preferred aspect of the present invention includes: a substrate holding unit for holding a substrate having a plurality of substrate elements, the plurality of substrate elements being each divided into a rectangle by grid-like planned dividing lines an imaging unit for respectively imaging two or more selected substrate elements selected from a plurality of the substrate elements, and acquiring two or more photographed images; and a detection unit for each of the two or more photographed images By pattern matching using the reference image, the positions of the two or more selected substrate elements are respectively obtained, and the positions of the substrates are detected. Each of the plurality of substrate elements has a pattern area, and the pattern area has a predetermined pattern formed on the inner side of the outer edge of the substantially rectangular area. The reference image is a set of line segments set by removing corners in each side of the outer edge of the region.

The present invention also focuses on a drawing device for drawing a substrate. A drawing apparatus according to a preferred aspect of the present invention includes: the substrate position detection device; a drawing unit that irradiates light on the substrate to perform drawing; and a drawing control unit that is based on the detection by the substrate position detecting device The position of the substrate is controlled by the drawing unit, thereby drawing a plurality of substrate elements of the substrate while adjusting the drawing position.

The above object and other objects, features, aspects, and advantages will become more apparent from the following detailed description of the present invention with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a drawing apparatus 1 according to one embodiment of the present invention. The drawing device 1 is a direct drawing device that irradiates spatially modulated beam-shaped light to the photosensitive material on the substrate 9 , and scans the irradiated area of the light on the substrate 9 to draw a pattern. . In FIG. 1 , three directions orthogonal to each other are shown by arrows as the X direction, the Y direction, and the Z direction. In the example shown in FIG. 1 , the X direction and the Y direction are horizontal directions perpendicular to each other, and the Z direction is the vertical direction. The same applies to other drawings.

FIG. 2 is a plan view showing the main surface on the (+Z) side of the substrate 9 (hereinafter also referred to as “upper surface 91 ”). The substrate 9 is, for example, a plate-like member having a substantially rectangular shape in plan view. The substrate 9 is, for example, a substrate for semiconductor packaging. In the upper surface 91 of the substrate 9, a resist film formed of a photosensitive material is provided on the copper layer. In the drawing apparatus 1 , a circuit pattern is drawn (that is, formed) on the resist film of the substrate 9 . In addition, the type, shape, and the like of the substrate 9 may be changed to various types, shapes, and the like.

The substrate 9 shown in FIG. 2 has a plurality of substrate elements 94 , and the plurality of substrate elements 94 are each divided into a substantially rectangular shape by grid-like planned dividing lines 93 . In the example shown in FIG. 2 , each substrate element 94 has a substantially square shape. The plurality of substrate elements 94 are arranged in a matrix shape in the X direction and the Y direction. The plurality of substrate elements 94 are divided along planned dividing lines 93 in a process subsequent to the drawing of the pattern by the drawing device 1 , after mounting wafer members and the like and semiconductor packaging, respectively. In FIG. 2 , each board element 94 is drawn larger than actual, and the number of board elements 94 is drawn smaller than actual. Alignment marks dedicated to a position detection process (that is, an alignment process) to be described later are not provided on the substrate 9 .

As shown in FIG. 1 , the drawing apparatus 1 includes a stage 21 , a stage moving mechanism 22 , an imaging unit 3 , a drawing unit 4 , and a control unit 10 . The control unit 10 is a console moving mechanism 22, an imaging unit 3, a drawing unit 4, and the like. The stage 21 is a substantially flat board-shaped board holding part for holding the board 9 in a horizontal state from the lower side below the imaging part 3 and the drawing part 4 (that is, on the (-Z) side). The stage 21 is, for example, a vacuum chuck, and is used for sucking and holding the lower surface of the substrate 9 . The stage 21 may have a structure other than a vacuum jig. The upper surface 91 of the substrate 9 placed on the stage 21 is substantially perpendicular to the Z direction, and is substantially parallel to the X direction and the Y direction.

The stage moving mechanism 22 is a moving mechanism for relatively moving the stage 21 in a horizontal direction (ie, a direction slightly parallel to the upper surface 91 of the substrate 9 ) relative to the imaging unit 3 and the drawing unit 4 . The stage moving mechanism 22 includes a first moving mechanism 23 and a second moving mechanism 24 . The second moving mechanism 24 linearly moves the stage 21 in the X direction along a guide rail. The first moving mechanism 23 linearly moves the stage 21 in the Y direction along the guide rail together with the second moving mechanism 24 . The drive source of the first moving mechanism 23 and the second moving mechanism 24 is, for example, a linear servo motor or a drive source in which a motor is mounted on a ball screw. The structures of the first moving mechanism 23 and the second moving mechanism 24 may be changed to various structures.

The drawing apparatus 1 may be provided with a table rotation mechanism, and the table rotation mechanism uses a rotation axis extending in the Z direction as the center rotation table 21 . In addition, the drawing apparatus 1 may also be provided with a stage elevating mechanism, and the stage elevating mechanism is used to move the stage 21 in the Z direction. As the table rotation mechanism, for example, a servo motor can be used. As the table elevating mechanism, for example, a linear servo motor can be used. Various changes may be made to the structure of the table rotation mechanism and the table elevating mechanism.

The imaging unit 3 includes a plurality of (two in the example shown in FIG. 1 ) heads 31 arranged in the X direction. Each head 31 is supported above the table 21 and the table moving mechanism 22 by a head support portion 30 provided across the table 21 and the table moving mechanism 22 . Of the two heads 31 , one head 31 is fixed to the head support portion 30 , and the other head 31 is movable in the X direction on the head support portion 30 . Thereby, the distance in the X direction between the two heads 31 can be changed. In addition, the number of the heads 31 of the imaging unit 3 may be one, or three or more.

Each of the heads 31 is a camera, and includes an imaging sensor and an optical system not shown in the drawings. Each head 31 is, for example, an area camera, and acquires, for example, a two-dimensional image. The imaging sensor includes, for example, a plurality of CCDs (Charge Coupled Device; Charge Coupled Device) arranged in a matrix. In each of the heads 31 , the reflected light of the illumination light guided toward the upper surface 91 of the substrate 9 from the light source (not shown) is guided toward the imaging sensor via the optical system. The imaging sensor receives the reflected light from the upper surface 91 of the substrate 9 and acquires an image of a substantially rectangular imaging area. As the above-mentioned light source, various light sources such as LED (Light Emitting Diode) can be used. In addition, each of the heads 31 may also be other types of cameras, such as a line camera.

The drawing unit 4 includes a plurality of (five in the example shown in FIG. 1 ) heads 41 arranged in the X direction and the Y direction. Each head 41 is supported above the table 21 and the table moving mechanism 22 by a head support portion 40 provided across the table 21 and the table moving mechanism 22 . The head support portion 40 is arranged on the (+Y) side of the head support portion 30 of the imaging unit 3 . In addition, the number of the heads 41 of the drawing part 4 may be one, or may be plural.

Each head 41 includes a light source, an optical system, and a spatial light modulation element (not shown). As the spatial light modulation element, DMD (Digital Micro Mirror Device) or GLV (Grating Light Valve) can be used (Silicon Light Machines (Sunnyvale, California) ) registered trademark) and other components. As the light source, various light sources such as LD (Laser Diode) can be used. The plural heads 41 have substantially the same structure.

In the drawing device 1 , the substrate 9 is moved in the Y direction by the stage moving mechanism 22 while irradiating modulated (ie, spatially modulated) light rays from the heads 41 of the drawing unit 4 toward the upper surface 91 of the substrate 9 . move. Thereby, the irradiation area of the light rays from the plurality of heads 41 is scanned in the Y direction on the substrate 9 , and the circuit pattern is drawn on the substrate 9 . In the following description, the Y direction is also referred to as a "scanning direction", and the X direction is also referred to as a "width direction". The stage moving mechanism 22 is a scanning mechanism for moving the irradiation area of the light beam from each head 41 on the substrate 9 in the scanning direction.

In the drawing apparatus 1, drawing with respect to the board|substrate 9 is performed by the so-called single pass (one-pass) system. Specifically, by the stage moving mechanism 22, the stage 21 is relatively moved in the Y direction with respect to the plurality of heads 41, and the irradiation area of the light rays from the plurality of heads 41 is in the Y direction (that is, the scanning direction) on the upper surface 91 of the substrate 9. ) is scanned only once. Thereby, scanning of the substrate 9 is completed. In addition, in the drawing apparatus 1, the substrate 9 may be drawn by a multi-pass method in which the movement of the stage 21 in the Y direction and the step shift of the stage 21 in the X direction are repeated.

FIG. 3 is a diagram showing the configuration of the computer 100 included in the control unit 10 . The computer 100 is a general computer including a processor 101 , a memory 102 , an input/output unit 103 , and a bus 104 . The bus bar 104 is a signal circuit for connecting the processor 101 , the memory 102 and the input/output part 103 . The memory 102 stores programs and various kinds of information. The processor 101 executes various processing (for example, numerical calculation, image processing) while using the memory 102 and the like in accordance with a program or the like stored in the memory 102 . The input/output unit 103 includes a keyboard 105 and a mouse 106 for receiving input from the operator, and a display 107 for displaying output from the processor 101 and the like. In addition, the control unit 10 may be a programmable logic controller (PLC; Programmable Logic Controller), a circuit board, or the like, and may be a combination of these components and one or more computers.

FIG. 4 is a block diagram showing the functions of the control unit 10 realized by the computer 100 . In FIG. 4 , configurations other than the control unit 10 are also shown together. The control unit 10 includes a memory unit 111 , an imaging control unit 112 , a detection unit 113 , and a drawing control unit 114 . The memory unit 111 is mainly realized by the memory 102, and stores in advance a reference image (that is, a template) used for pattern matching to be described later, data of a predetermined pattern drawn on the substrate 9 (that is, data for drawing), and the like. various information.

The imaging control unit 112 , the detection unit 113 , and the rendering control unit 114 are mainly realized by the processor 101 . The imaging control unit 112 controls the imaging unit 3 and the stage moving mechanism 22 so that the imaging unit 3 captures a part of the upper surface 91 of the substrate 9 and acquires an image (hereinafter also referred to as a "photographed image"). The captured image is transmitted and stored in the memory unit 111 . The detection unit 113 detects the position of the substrate 9 using the captured image. The detailed description of the position detection of the board|substrate 9 is mentioned later. The drawing control unit 114 controls the drawing unit 4 and the stage moving mechanism 22 based on the position of the substrate 9 detected by the detection unit 113 and the drawing data previously stored in the memory unit 111 , and thereby adjusts the drawing position and controls the drawing unit 4 . The substrate 9 is drawn.

Next, the flow of the drawing of the pattern on the substrate 9 by the drawing apparatus 1 will be described with reference to FIG. 5 . When drawing the board|substrate 9, first, the board|substrate 9 is carried into the drawing apparatus 1, and is hold|maintained by the stage 21 (step S11). At this time, the stage 21 is located on the (−Y) side of the imaging unit 3 and the drawing unit 4 . Next, by the stage moving mechanism 22 , the substrate 9 is moved in the (+Y) direction together with the stage 21 and is moved below the imaging unit 3 .

In the drawing device 1 , the design positions on the substrate 9 of two or more substrate elements 94 preselected among the plurality of substrate elements 94 (refer to FIG. 2 ) of the substrate 9 are stored in the memory unit 111 (refer to FIG. 4 ) in advance. . The two or more substrate elements 94 are separated in the X direction and the Y direction, and are not adjacent to each other. In the present embodiment, the memory unit 111 pre-stores four substrate elements located at the four corners of the substrate 9 as surrounded by the two-dot chain line with the reference numeral 94a as shown in FIG. The design position of the board element 94a"). The design position of the selection substrate element 94a is the position of the selection substrate element 94a in the ideal state. The selection substrate element 94a in the ideal state is the selection substrate element 94a formed on the substrate 9 according to the design information and does not cause deformation such as strain on the substrate 9 .

In the drawing device 1, the imaging control unit 112 controls the imaging unit 3 based on the design positions of the respective selection substrate elements 94a, whereby the imaging unit 3 performs imaging of the four selection substrate elements 94a and acquires four captured images (step S12). For example, after two selected substrate elements 94a arranged on the (+Y) side on the substrate 9 are photographed, the substrate 9 is moved in the (+Y) direction by the stage moving mechanism 22, and (-Y) arranged on the substrate 9 is photographed. ) side of the two selection board elements 94a. In addition, the number of the selection board elements 94a is not limited to four, and may be two or more. In step S12 , two or more captured images are acquired by the imaging unit 3 .

FIG. 7 is a diagram showing a captured image 81 . One selection board element 94a is included in the substantially rectangular photographed image 81 . In the example shown in FIG. 7 , the captured image 81 in a substantially square shape includes: the entirety of one selection substrate element 94a, which is located on the (-X) side and the (-Y) side corners on the substrate 9; and A part of the plurality of substrate elements 94 is adjacent to the selected substrate element 94a. The captured image 81 is, for example, a gray scale image of 256 gradations. In the captured image 81, the pixel value of each pixel is an arbitrary value in the range of 0 (black) belonging to the minimum pixel value to 255 (white) belonging to the maximum pixel value. The average pixel value of the entire captured image 81 (that is, the arithmetic mean of pixel values of all pixels in the captured image 81 ) is, for example, 90 to 120.

As shown in FIG. 7 , the selected substrate element 94 a includes a pattern area 95 . The pattern area 95 (also referred to as a die) is an area in which a wafer member or the like is mounted in a process subsequent to the drawing process in the drawing apparatus 1 . A predetermined pattern is previously formed in the pattern area 95 at a stage before being carried into the drawing apparatus 1 . In FIG. 7 , illustration of the pattern previously formed in the pattern area 95 is omitted, and parallel oblique lines are attached to the pattern area 95 . The pattern region 95 has a substantially rectangular outer edge (hereinafter also referred to as "region outer edge 951"). In other words, the area inside the area outer edge 951 is the pattern area 95 . In the example shown in FIG. 7 , the region outer edge 951 has a substantially square shape. The same applies to the other board elements 94 .

In the example shown in FIG. 7, the area outer edge 951 of the pattern area 95 of the selected substrate element 94a has a substantially rectangular shape having a pair of sides substantially parallel to the X direction and a pair of sides substantially parallel to the Y direction. However, in the four corners of the pattern area 95, the shape of the area outer edge 951 is not a part of the rectangle. For example, corners on the (-X) side and (+Y) side of the pattern region 95 are chamfered obliquely with respect to the X and Y directions, and the region outer edge 951 is inclined with respect to the X and Y directions. The same applies to the corners on the (-X) side and the (-Y) side and the corners on the (+X) side and the (+Y) side of the pattern region 95 . Further, the corners on the (+X) side and the (−Y) side of the pattern area 95 have the shape of a small rectangular area cut away, and the area outer edge 951 is bent in a crank shape. That is, in the example shown in FIG. 7, the area|region outer edge 951 has a substantially rectangular shape which lacks a corner|angular part.

The shape of the area outer edge 951 in the corners of the pattern area 95 and the small triangles, rectangles, etc. located outside the area outer edge 951 are predetermined wafer members performed after the drawing process in the drawing apparatus 1. It is used for the positioning of chip components and the positioning of the packaged product in the mounting process such as the packaging finished product (ie, semiconductor package) and the mounting process to the electrical equipment. The size of the missing corners in the area outer edge 951 (that is, the difference between the smallest rectangle circumscribing the four sides of the area outer edge 951 and the area outer edge 951, hereinafter also referred to as "missing corners") is determined by Each side of the smallest rectangle is, for example, 5% or less of the length of each side. In addition, in the pattern region 95, the corners of the region outer edge 951 do not need to be missing in all of the four corners. However, in general, the corner tie of the area outer edge 951 is absent in one or more corners of the pattern area 95 .

The captured image 81 acquired by the imaging unit 3 is sent to the control unit 10 shown in FIG. 4 and stored in the memory unit 111 . As described above, the reference image used for pattern matching is previously stored in the storage unit 111 . In the drawing apparatus 1, the figure corresponding to the area outer edge 951 of the pattern area 95 of the selected board element 94a is used as a reference image.

In the control unit 10 , the detection unit 113 performs pattern matching on the captured image 81 using the reference image, thereby obtaining the position of the area outer edge 951 in the captured image 81 , and obtaining the position based on the position of the area outer edge 951 The position of the substrate element 94a is selected. The pattern matching is performed by a known pattern matching method (eg, geometric shape pattern matching, normalized correlation search, etc.). Calculation of the position of the selected board element 94 a for pattern matching is performed for each captured image 81 .

Next, the position of the substrate 9 on the stage 21 is detected by the detection unit 113 based on the position of the selected substrate element 94 a in each captured image 81 and the relative position between the substrate 9 and the imaging unit 3 when each captured image 81 was acquired, etc. (step S13). The position of the substrate 9 detected by the detection unit 113 in step S13 includes the following information: the coordinates in the X direction and the Y direction of the substrate 9 on the display stage 21 , the orientation of the substrate 9 , the strain of the substrate 9 , etc. The information that caused it to deform. In addition, the information showing the deformation of the substrate 9 is information such as the shape of the deformed substrate 9 and the positions of the plurality of substrate elements 94 on the substrate 9 .

Here, when a reference image having a rectangle having four corners as shown in FIG. 8 (hereinafter referred to as "reference image 701 of the comparative example") is used in the pattern matching in step S13, the outer edge of the area is affected as described above. 951 (see FIG. 7 ) has a substantially rectangular shape with missing corners, so the position of the outer edge 951 of the region cannot be detected or the position of the outer edge 951 of the region may be detected erroneously. That is, in the pattern matching using the reference image 701 of the comparative example, it is difficult to accurately detect the position of the substrate 9 .

Here, as shown in FIG. 9 , in the drawing device 1, a figure whose corners have been removed from the area outer edge 951 (refer to FIG. 7 ) (that is, in the area outer edge 951 that is slightly parallel to the X direction or the Y direction) The set of line segments 72 set with the corners removed from each side) is used as the reference image 71 . Thereby, the position of the outer edge 951 of the rectangular region having the missing corners can be obtained with high accuracy by pattern matching in each captured image 81 . As a result, the position detection of the substrate 9 on the stage 21 can be performed with high accuracy. In addition, the reference image 71 may be generated by extracting the outer edge 951 of the region from an image obtained by photographing a normal substrate element 94 and removing corners, or by a known method from the pattern of the substrate element 94 formed in advance. Design data (such as CAD (computer-aided design; computer-aided design) data) generated.

It is preferable that each line segment 72 constituting the above-mentioned reference image 71 is 10% or more of the length of each side from the virtual vertex 73 of the virtual point of intersection of each side and the other side. Each line segment 72 of the reference image 71 is a line segment in the edge corresponding to each edge of the region outer edge 951 in the reference image 71 , and is also simply referred to as “line segment 72 in each edge of the region outer edge 951 ”. The virtual vertex 73 refers to the intersection of the extension lines (drawn by a two-dot chain line in FIG. 9 ) of two adjacent sides in the region outer edge 951 . In addition, the length of each side refers to the distance between two virtual vertices 73 sandwiching each side, and corresponds to the length of each side of the smallest rectangle circumscribed by the four sides of the outer edge 951 of the region. In the following description, the shortest distance between the virtual vertex 73 and the end point of the line segment 72 is referred to as "angular spacing (angular spacing) D1".

As described above, the size of the missing corner portion of the area outer edge 951 is 5% or less of the length of the side of the smallest rectangle circumscribing the four sides of the area outer edge 951 . Therefore, by setting the angular distance D1 to be 10% or more of the length of the side, it is possible to prevent the line segment 72 of the reference image 71 from being matched with the missing corner portion of the area outer edge 951 of the captured image 81 during pattern matching in the captured image 81 . In addition, from the viewpoint of improving the accuracy of pattern matching, it is preferable that the line segment 72 is longer. In particular, from the viewpoint of securing stability (that is, tenacity) of the position detection of the substrate 9, the angular pitch D1 is preferably set to 25% or less of the length of the side.

In the drawing device 1 , the drawing control unit 114 controls the drawing unit 4 and the stage moving mechanism 22 based on the position of the substrate 9 detected by the detection unit 113 , whereby the drawing position can be adjusted with high accuracy for each substrate of the substrate 9 . Drawing of the pattern of the element 94 (step S14). In step S14, the drawing unit 4 and the stage moving mechanism 22 automatically and mechanically correct the modulation interval and the modulation interval of the light beam irradiated from the drawing unit 4 toward the substrate 9 based on the above-mentioned position of the substrate 9 by a known correction method. change the timing and the scanning position of the light beam on the substrate 9, etc.

In the above-mentioned FIG. 7 , the region outer edge 951 is drawn as a straight line in the portion excluding the corners of each side of the pattern region 95 , but it is not actually limited to a straight line. For example, as shown in the enlarged view of FIG. 10A , when a land 96 exists on the outer edge of the pattern region 95 , the edge system on the (+Y) side of the region outer edge 951 is divided into the figure by the land 96 . The two straight lines left and right in 10A. In this case, the line segment 72 on the (+Y) side in the reference image 71 (see FIG. 9 ) also needs to be divided at the position corresponding to the stage 96 . However, as described above, from the viewpoint of improving the accuracy of pattern matching, the In other words, the line segment 72 is preferably longer.

Therefore, it is preferable to perform a closing process on each shot image 81 before the pattern matching between each shot image 81 and the reference image 71 in step S13. As a result, as shown in FIG. 10B , the platform 96 and the space near the platform 96 (that is, the background) are absorbed by the surrounding parts (that is, a part of the pattern area 95 ), and the edge on the (+Y) side of the outer edge 951 of the area is become a straight line. As a result, the line segment 72 corresponding to the above-mentioned side in the reference image 71 can be used as the line segment 72 as a long straight line without being divided. Therefore, the precision of the pattern matching in step S13 is improved, thereby improving the precision of the position detection of the substrate 9 . In addition, in FIG. 10B, the position of the stage 96 existing before the closing process is shown by a two-dot chain line (the same is true in FIG. 12B).

In addition to preventing division of the line segment 72 of the reference image 71 by the stage 96 and the like as described above, the closing process in step S13 is also useful in the position detection of the substrate 9 . For example, as shown in FIG. 11A , in the case where a straight line 97 that is close to the region outer edge 951 and extends slightly in parallel exists at the outer edge of the pattern region 95 , the line 97 may be mistaken for the line 97 in the pattern matching in step S13 It is the possibility of lowering the accuracy of the position detection of the substrate 9 due to the region outer edge 951 . In this case, a closing process is performed before pattern matching, whereby the straight line 97 is absorbed by the surrounding portion (ie, a part of the pattern area 95 ) as shown in FIG. 11B and eliminated. Thereby, the straight line 97 is prevented from being mistaken for the area outer edge 951, and the accuracy of the position detection of the substrate 9 is prevented from being lowered. In addition, in FIG. 11B , the position of the straight line 97 existing before the closing process is shown by a two-dot chain line.

On the other hand, as shown in FIG. 12A , when there is a terrace pattern in which a plurality of terraces 96 are closely arranged in the X direction at the outer edge portion of the pattern region 95 on the (+Y) side, even if the above-mentioned In the case of the closing process, as shown in FIG. 12B , the edge system on the (+Y) side of the region outer edge 951 is divided into two straight lines on the left and right in FIG. 12B . Therefore, as shown in FIG. 12C , even in the reference image 71 , the line segment 72 on the (+Y) side is divided into two line segments 72 a and 72 b at positions corresponding to the plurality of platforms 96 . In this case, both of the two line segments 72a and 72b are used as the edge on the (+Y) side of the reference image 71 in the pattern matching in step S13.

In this pattern matching, only one line segment of the two line segments 72 a and 72 b may be used as the side on the (+Y) side of the reference image 71 . However, as described above, since it is preferable to use a long line segment from the viewpoint of improving the accuracy of pattern matching, it is preferable to use at least a long line segment among the two line segments 72a, 72b in the example shown in FIG. 12C . 72a serves as a side on the (+Y) side of the reference image 71 . In other words, when one side of the reference image 71 is divided into two or more line segments, it is preferable that the reference image 71 contains at least the longest line segment in the one side from the viewpoint of improving the accuracy of pattern matching.

In the drawing apparatus 1, when the position of the substrate 9 on the stage 21 is displaced and the deformation of the substrate 9 is large, as shown in FIG. 13, the captured image 81 acquired in step S12 may include only one selection substrate A case of part of element 94a. In the example shown in FIG. 13 , the portion on the (+X) side of the selected board element 94a protrudes from the outer edge on the (+X) side of the captured image 81 to the outside. In FIG. 13 , an area outer edge 951 of a portion of the pattern area 95 extending from the captured image 81 is drawn by a dotted line (the same applies to FIGS. 14A and 14B ).

The local content of the selection board element 94a in the captured image 81 is determined based on whether the detected shape of the selection board element 94a matches the shape of the reference image 71 satisfies a predetermined value in the pattern matching in step S13, for example. In this case, in the drawing apparatus 1, for example, instead of the position detection of the board 9 in step S13, the operator of the drawing apparatus 1 is notified that the board 9 on the stage 21 is an incorrect board, and the drawing process on the board 9 is stopped. (step S14). Alternatively, the local inclusion of the selected substrate element 94a in the captured image 81 is based on, for example, whether the position of the substrate 9 detected based on the position of the selected substrate element 94a obtained from the captured image 81 by pattern matching is within a predetermined range or not judge within. In this case, in the drawing apparatus 1, after the position detection of the board 9 in step S13, for example, the operator of the drawing apparatus 1 is notified that the board 9 on the stage 21 is an incorrect board, and the operation of the board 9 is stopped. drawing processing (step S14).

The reason why the substrate 9 is used as an incorrect substrate when the selected substrate element 94a protrudes from the captured image 81 is that the portion of the outer edge of the captured image 81 that overlaps with the selected substrate element 94a (in the example shown in FIG. 13 ) The middle is a part of the outer edge on the (+X) side) is a straight line extending in the Y direction like the region outer edge 951 of the selected substrate element 94a, so that part of the outer edge is prevented from being mistaken for the region outer edge 951. The notification to the operator or the like is performed by, for example, a warning display on the display 107 (see FIG. 3 ). Thereby, it can prevent that the said part of the outer edge of the captured image 81 in the pattern matching of step S13 is mistakenly recognized as the area outer edge 951, and the drawing process can be prevented from being performed in the state which detected the position of the board|substrate 9 erroneously.

Alternatively, in the rendering device 1, in the case where the captured image 81 includes only a part of the selection board element 94a as described above, as shown in FIG. 14A, a rectangle is added around the captured image 81 in step S13. The frame-shaped expanded image 82 performs pattern matching in this state. The inner edge of the expanded image 82 coincides with the outer edge of the captured image 81 over the entire circumference. The width of the expanded image 82 (ie, the shortest distance between the outer edge of the captured image 81 and the outer edge of the expanded image 82 ) is, for example, 100 to 300 pixels. The width of the expanded image 82 can also be changed in various ways according to the size of the selected substrate element 94a. In the example shown in FIG. 14A , the expanded image 82 is an image having the same pixel value (ie, density). The pixel value of the expanded image 82 is, for example, 128 belonging to the middle value of the maximum pixel value and the minimum pixel value. In FIG. 14A , an area outer edge 951 of a portion of the pattern area 95 extending from the captured image 81 is drawn by a dotted line (the same is true in FIG. 14B ).

In this way, by adding the expanded image 82 to the captured image 81 , as shown in FIG. 14B , a part of the reference image 71 can be positioned outside the outer edge of the captured image 81 during pattern matching as shown in FIG. 14B . Therefore, even when a part of the selection board element 94a protrudes beyond the outer edge of the captured image 81, the region outer edge 951 of the selection board element 94a and the line segment 72 of the reference image 71 can be made in the captured image 81. Accuracy is well matched. As a result, the position of the substrate 9 can be detected with high accuracy.

In the rendering device 1, the difference between the pixel value of the expanded image 82 and the average pixel value of the entire captured image 81 is preferably smaller than the pattern area 95 for selecting the substrate element 94a and the area outside the pattern area 95 (also That is, the difference between the preset pixel values (hereinafter also referred to as "pattern region threshold value") is still small. This prevents the boundary between the captured image 81 and the expanded image 82 , which are the same straight line as the region outer edge 951 of the selected substrate element 94a, from being mistaken for the region outer edge 951 in the pattern matching in step S13. As a result, the position of the substrate 9 can be detected more accurately. In addition, the said pattern area threshold value is memorize|stored in the memory|storage part 111 of the control part 10 in advance before the process of the board|substrate 9 by which the drawing apparatus 1 is performed.

The density of the above-mentioned expanded image 82 does not necessarily need to be the same. In the case where the density of the expanded image 82 is not the same, it is preferable that at least the pixel value of the expanded image 82 in the periphery of the photographed image 81 (that is, in the vicinity of the photographed image 81 ) and the average pixel value of the photographed image 81 as a whole be between the pixel values. The difference is smaller than the pattern area threshold value. As a result, the boundary between the captured image 81 and the expanded image 82 can be prevented from being mistakenly identified as the region outer edge 951 in the same manner as described above, and as a result, the position of the substrate 9 can be detected more accurately.

In the rendering device 1, when the size of the image-capable area that can be acquired by one imaging performed by the imaging unit 3 in step S12 is smaller than the selection board element 94a, the selection board element 94a is moved slightly each time in the vicinity of the selection board element 94a. Shoot multiple times while shooting at the position. Next, as shown in FIG. 15 , a plurality of images obtained from the images captured a plurality of times (that is, an image including a part of the selection board element 94a, hereinafter also referred to as “partial image 83”) are synthesized into a ratio of The partial image 83 is also placed on the larger base image 84, thereby generating the shot image 81. The area on the substrate 9 corresponding to each partial image 83 is partially overlapped with the area on the substrate 9 corresponding to the other partial images 83 . The base image 84 is a substantially rectangular image larger than the plurality of partial images 83 that are partially and repeatedly arranged, and the plurality of partial images 83 are entirely arranged on the base image 84 . The plurality of partial images 83 include the entire selection board element 94a. In the example shown in FIG. 15 , the base image 84 is an image having the same pixel value (ie, density) excluding the area overlapping with the plurality of partial images 83 . The pixel value of the base image 84 excludes the region overlapping with the plurality of partial images 83 , and is, for example, 128 of the median value between the maximum pixel value and the minimum pixel value.

In the rendering device 1, the difference between the pixel value of the base image 84 and the average pixel value of the entire plurality of partial images 83 is preferably smaller than the above-described pattern region threshold value. This prevents the boundary between the partial image 83 and the base image 84 , which are straight lines like the region outer edge 951 of the selected substrate element 94a, from being mistaken for the region outer edge 951 in the pattern matching in step S13. As a result, the position of the substrate 9 can be detected more accurately.

The density of the above-described base image 84 is not necessarily the same in the entire region that does not overlap with the plurality of partial images 83 . In the case where the density of the base images 84 is different, it is preferable that the pixel value of the base image 84 in the periphery of the plurality of partial images 83 (that is, in the vicinity of the plurality of partial images 83 ) and the average of the whole of the plurality of partial images 83 The difference between pixel values is smaller than the pattern area threshold value. This prevents the boundary between the partial image 83 and the base image 84 from being mistaken for the region outer edge 951 in the same manner as described above, and as a result, the position of the substrate 9 can be detected more accurately.

As described above, the board position detection method for detecting the position of the board 9 includes the step of holding the board 9 having the plurality of board elements 94 through the grid-shaped planned dividing lines 93 each is divided into a rectangular shape (step S11 ); two or more selected substrate elements 94 a selected from the plurality of substrate elements 94 are respectively photographed, and two or more photographed images 81 are acquired (step S12 ); Each of the above captured images 81 is subjected to pattern matching using the reference image 71 to obtain the positions of the two or more selected substrate elements 94a, respectively, and to detect the positions of the substrates 9 (step S13). Each of the plurality of substrate elements 94 has a pattern area 95 , and the pattern area 95 has a predetermined pattern formed inside a substantially rectangular area outer edge 951 . The reference image 71 is a set of line segments 72 set with corners removed from each side of the region outer edge 951 .

Thereby, as described above, even when the corners of the substantially rectangular region outer edge 951 are missing, the position of the region outer edge 951 can be obtained with high pattern matching accuracy in each captured image 81 . In addition, compared with the case where a portion having a unique shape or the like is extracted from the pattern in the pattern region 95 and set as a reference image, the line segment 74 corresponding to a part of the region outer edge 951 of the substrate element 94 is used as a reference For the image 71, the reference image 71 can be easily set. As a result, the number of substrate elements 94 that can be arranged on the substrate 9 can be increased with ease and accuracy, as compared with the case where a mark dedicated to the position detection process (that is, the alignment process) of the substrate 9 is provided on the substrate 9 . The position detection of the substrate 9 is preferably performed.

As described above, in the substrate for semiconductor packaging, in order to be able to utilize the positioning of the substrate elements 94 and the like in the mounting process of the wafer member performed after step S14 and the like, the pattern area 95 of each substrate element 94 is outside the area. There are many cases where the corners of the edge 951 are missing. In this board position detection method, since the position detection of the board 9 can be easily and accurately performed even when the corners of the region outer edge 951 are missing, the board position detection method is particularly suitable for a semiconductor packaging board position detection.

As mentioned above, it is preferred that the reference image 71 includes the longest line segment 72 of each side of the outer edge 951 of the region. Thereby, the precision of the pattern matching in step S13 can be improved. As a result, the accuracy of the position detection of the substrate 9 can be improved.

As mentioned above, it is preferable that in the reference image 71, the line segment 72 in each edge of the region outer edge 951 is distanced from the respective edge from the virtual intersection point (ie, the virtual vertex 73) of the respective edge with the other edge. more than 10% of its length. Thereby, the influence by the missing corner part of the area outer edge 951 can be reduced or prevented in the pattern matching of step S13. As a result, the accuracy of the position detection of the substrate 9 can be improved.

As described above, preferably, in step S13, before the pattern matching with the reference image 71, the above-mentioned two or more captured images 81 are closed. This can reduce or prevent the above-mentioned influence on the pattern matching caused by the land 96 at the outer edge of the pattern region 95, the straight line 97 approaching the region outer edge 951, and the like. As a result, the accuracy of the position detection of the substrate 9 can be improved.

As described above, in the example shown in FIG. 15 , the size of the imaging-capable region that can be acquired by one imaging in step S12 is smaller than each of the selection board elements 94a. In addition, the two or more captured images 81 are generated by synthesizing a plurality of partial images 83 obtained by a plurality of captures in step S12 onto a base image 84, respectively. In this case, the difference between the pixel value of the base image 84 in the periphery of the plurality of partial images 83 and the average pixel value of the entire plurality of partial images 83 is set to distinguish the pattern area 95 from the background area. The difference in pixel values (ie, the pattern area threshold value) is also small. Thereby, in the pattern matching of step S13, the boundary between the partial image 83 and the base image 84 can be prevented from being mistakenly recognized as the area outer edge 951 and detected. As a result, the accuracy of the position detection of the substrate 9 can be improved.

As described above, in the example shown in FIGS. 14A and 14B , in the case where the captured image 81 acquired in step S12 includes only a part of the selection board element 94 a , in step S13 , the captured image 81 is added around the captured image 81 Pattern matching is performed in a state where the frame-shaped expanded image 82 is present. Thereby, the position detection of the board|substrate 9 can be performed even when the selected board|substrate element 94a is shifted from the imaging|photography possible area|region of the imaging part 3. FIG. In this case, the difference between the pixel value of the expanded image 82 in the periphery of the captured image 81 and the average pixel value of the entire captured image 81 is larger than the difference of the pixel value set to distinguish the pattern area 95 from the background area ( That is, the pattern area threshold value) is also small. Thereby, in the pattern matching in step S13, the boundary between the captured image 81 and the expanded image 82 can be prevented from being detected by mistakenly being the region outer edge 951. As a result, the accuracy of the position detection of the substrate 9 can be improved.

As described above, in the example shown in FIG. 13 , the captured image acquired in step S12 includes only a part of the selection board element 94a. In this case, instead of step S13 or after step S13, it is preferable to notify that the substrate 9 is the wrong substrate. Thereby, unlike the example shown in FIGS. 14A and 14B , although the position detection of the substrate 9 cannot be performed, it is possible to prevent the position of the substrate 9 from being mistakenly detected as the area outer edge 951 at the outer edge of the captured image 81 . to perform drawing processing.

The drawing method for drawing the substrate 9 includes the steps of: detecting the position of the substrate 9 by the above-mentioned substrate position detecting method (step S11 to step S13 ); The drawing position is adjusted, and drawing is performed by irradiating light to the plurality of substrate elements 94 of the substrate 9 (step S14). Thereby, each board element 94 of the board|substrate 9 can be drawn with high precision.

In the drawing apparatus 1 illustrated in FIG. 1, a part of the structure functions as the board|substrate position detection apparatus 5 for detecting the position of the board|substrate 9. FIG. The substrate position detection device 5 includes a substrate holding unit (ie, the stage 21 ), an imaging unit 3 , and a detection unit 113 . The stage 21 holds the substrate 9 having a plurality of substrate elements 94 , and the plurality of substrate elements 94 are respectively partitioned into a rectangular shape by grid-like planned dividing lines 93 . The imaging unit 3 captures two or more selected substrate elements 94 a selected from the plurality of substrate elements 94 , and acquires two or more captured images 81 , respectively. The detection unit 113 performs pattern matching using the reference image 71 on each of the two or more captured images 81 , thereby obtaining the positions of the two or more selected substrate elements 94 a , and detecting the position of the substrate 9 . Each of the plurality of substrate elements 94 has a pattern area 95 , and the pattern area 95 has a predetermined pattern formed inside a substantially rectangular area outer edge 951 . The reference image 71 is a set of line segments 72 set with corners removed from each side of the region outer edge 951 . In the same manner as described above, in the board position detection device 5, the number of board elements 94 to be provided on the board 9 can be compared with the case where a mark dedicated to the position detection process (that is, the alignment process) is provided on the board 9. The position detection of the substrate 9 can be increased easily and accurately.

The drawing device 1 includes the above-described board position detection device 5 , a drawing unit 4 , and a drawing control unit 114 . The drawing unit 4 irradiates the substrate 9 with light to draw. The drawing control part 114 controls the drawing part 4 based on the position of the board|substrate 9 detected by the board|substrate position detection apparatus 5, and draws the some board|substrate element 94 of the board|substrate 9, adjusting a drawing position. Thereby, similarly to the above, each substrate element 94 of the substrate 9 can be drawn with high accuracy.

Various changes are possible in the above-described drawing apparatus 1 , the board position detection apparatus 5 , the drawing method, and the board position detection method.

For example, the reference image 71 only needs to include line segments corresponding to the respective sides of the area outer edge 951 , and does not necessarily need to include the longest line segment 72 among the respective sides of the area outer edge 951 . In addition, in the reference image 71, the number of line segments 72 included in the four sides of the (+X) side, the (-X) side, the (+Y) side, and the (-Y) side, respectively (that is, the number of line segments 72 relative to the area outer edge 951 ) The number of line segments 72 included in each side corresponding to the four sides) can be one or more than two.

In the reference image 71, the distance between the line segment 72 and the virtual vertex 73 in each side of the area outer edge 951 may be less than 10% of the length of each side.

In step S13, image processing other than the closing processing may be performed on each captured image 81 before pattern matching. Alternatively, instead of performing image processing on each of the captured images 81 , pattern matching may be performed.

As shown in FIG. 11A , in the substrate position detection device 5, even when the selected substrate element 94a has a straight line 97 close to the region outer edge 951, the closing process is not necessarily required in step S13. For example, before pattern matching, image processing is performed on the captured image 81 to check whether there is a straight line close to one side of the region outer edge 951 (eg, a straight line whose distance from the region outer edge 951 is equal to or less than a predetermined threshold value). Next, when there is a straight line close to the side, the area between the side and the straight line is filled with the same pixel value as the straight line. In other words, the same pixel value as the pixel value of the straight line is assigned to the pixel group in the region between the one side and the straight line. In the substrate position detection device 5, the above-described pattern matching is performed after the other three sides of the region outer edge 951 are subjected to the same processing. Thereby, the straight line approaching the area outer edge 951 is suppressed or prevented from being mistaken for the area outer edge 951 . As a result, the accuracy of the position detection of the substrate 9 can be improved.

In addition, in the case where the above-mentioned approaching straight line is located on the inner side of the area outer edge 951 (ie, within the pattern area 95 ), the above-mentioned filled area (ie, the thickened area outer edge 951 ) in the pattern matching is outside. The edge is detected as a line segment corresponding to the line segment 72 of the reference image 71 . In addition, in the case where the above-mentioned close line is located outside the area outer edge 951 , the inner edge of the above-mentioned filled area (that is, the thickened area outer edge 951 ) in the pattern matching is used as the reference image 71 . The line segment corresponding to the line segment 72 is detected.

The above-mentioned substrate 9 is not limited to the substrate for semiconductor packaging. In the substrate position detection device 5, for example, glass substrates for flat panel display devices such as semiconductor substrates, liquid crystal display devices, and organic EL display devices, glass substrates for photomasks, and solar cell panels can also be detected. Position detection of substrates, etc.

The substrate position detection device 5 is not necessarily used in the drawing device 1, and may be used in various devices other than the drawing device 1 (for example, a stepper type exposure device or a chip mounter). use. In addition, the substrate position detection device 5 may be used independently without being incorporated into another device.

The configurations in the above-described embodiment and each modification example may be appropriately combined as long as they do not contradict each other.

While the invention has been depicted and described in detail, these descriptions are intended to be illustrative and not restrictive. Therefore, various changes and aspects can be considered as long as they do not deviate from the scope of the present invention.

1: Drawing device 3: Filming Department 4: Drawing Department 5: Substrate position detection device 9: Substrate 10: Control Department 21: Desk 22: Taiwan moving mechanism 23: The first moving mechanism 24: Second moving mechanism 30,40: head support 31,41: Head 71,701: Baseline image 72,72a,72b: Line segment 73: Virtual Vertex 81: Shooting images 82: Expanded Image 83: Partial image 84: Base Image 91: Upper surface 93: Divide the predetermined line 94: Substrate Elements 94a: Selecting substrate elements 95: Pattern area 96: Platform 97: Straight line 100: Computer 101: Processor 102: Memory 103: Input and output section 104: Busbar 105: Keyboard 106: Mouse 107: Display 111: Memory Department 112: Shooting Control Department 113: Inspection Department 114: Drawing Control Department 951: Area Outer Edge D1: corner spacing

1 is a perspective view showing a drawing device according to one embodiment of the present invention. [FIG. 2] is a top view showing the substrate. [ Fig. 3 ] A diagram showing the configuration of a computer included in the control unit. [FIG. 4] It is a block diagram showing the function of a control part. [ Fig. 5 ] is a diagram showing a flow of drawing a pattern on a substrate. [FIG. 6] It is a top view showing a board|substrate. [FIG. 7] is a diagram showing a captured image. FIG. 8 is a diagram showing a reference image of a comparative example. [Fig. 9] is a diagram showing a reference image. [ Fig. 10A ] An enlarged view showing a part of a selection substrate element. 10B is an enlarged view showing a part of the selected substrate element after the closing process. [ Fig. 11A ] An enlarged view showing a part of a selection substrate element. 11B is an enlarged view showing a part of the selected substrate element after the closing process. [ Fig. 12A ] An enlarged view showing a part of a selection substrate element. FIG. 12B is an enlarged view showing a part of the selected substrate element after the closing process. [ FIG. 12C ] is a diagram showing a reference image. [ Fig. 13 ] is a diagram showing another example of a captured image. [FIG. 14A] is a diagram showing a captured image and an expanded image. [ FIG. 14B ] is a diagram showing a captured image and an expanded image. [ Fig. 15 ] A diagram showing another example of a captured image.

none.

Claims (10)

A substrate position detection method is used to detect the position of the substrate, and has: In step a, a substrate having a plurality of substrate elements is held, and the plurality of substrate elements are respectively divided into a rectangular shape by grid-shaped planned dividing lines; In step b, two or more selected substrate elements selected from the plurality of substrate elements are respectively photographed, and two or more photographed images are acquired; and Step c, performing pattern matching using a reference image on each of the two or more captured images, thereby obtaining the positions of the two or more selected substrate elements respectively, and detecting the positions of the substrates; Each of the plurality of the substrate elements has a pattern area, and the pattern area is formed with a predetermined pattern on the inner side of the outer edge of the substantially rectangular area; The aforementioned reference image is a set of line segments set by removing corners in each of the sides of the outer edge of the aforementioned region. The substrate position detection method according to claim 1, wherein the reference image includes the longest line segment in each of the sides of the outer edge of the region. The substrate position detection method according to claim 1, wherein, in the reference image, the line segments in each of the sides of the outer edge of the region are separated from each of the sides from a virtual intersection point of each of the sides with the other sides. more than 10% of the length. The substrate position detection method according to claim 1, wherein in the step c, before matching with the reference image pattern, a closing process is performed on two or more of the captured images. The substrate position detection method according to claim 1, wherein the size of the image-capable area that can be acquired by one imaging in the step b is smaller than each of the selected substrate elements; The two or more aforementioned captured images are respectively generated by synthesizing a plurality of partial images obtained by a plurality of capturing images in the aforementioned step b into a base image; The difference between the pixel value of the base image in the periphery of the plurality of partial images and the average pixel value of the entire plurality of partial images is smaller than the difference of the pixel value set to distinguish the pattern area from the background area . The substrate position detection method according to any one of claims 1 to 5, wherein in the case where the captured image obtained in the step b includes only a part of the selected substrate element, in the step c, the captured image is The above-mentioned pattern matching is performed in a state where a frame-shaped expanded image is attached to the periphery of the ; The difference between the pixel value of the expanded image in the periphery of the captured image and the average pixel value of the entire captured image is smaller than the difference of the pixel value set to distinguish the pattern area from the background area. The substrate position detection method according to any one of claims 1 to 5, wherein in the case where the captured image obtained in the step b includes only a part of the selected substrate element, the step c is replaced or the step c is After that, it is notified that the aforementioned substrate is an incorrect substrate. A drawing method is used for drawing a substrate, and has: Step d, detecting the position of the substrate by the substrate position detection method as described in any one of Claims 1 to 7; and In step e, the drawing position is adjusted based on the position of the substrate detected in the step d, and the plurality of substrate elements of the substrate are irradiated with light and drawn. A substrate position detection device is used to detect the position of the substrate, and has: the substrate holding part holds a substrate having a plurality of substrate elements, and the plurality of the substrate elements are respectively divided into a rectangular shape by grid-shaped planned dividing lines; an imaging unit for capturing two or more selected substrate elements selected from the plurality of substrate elements, respectively, and acquiring two or more captured images; and a detection unit for performing pattern matching using a reference image on each of the two or more captured images, thereby obtaining the positions of the two or more selected substrate elements respectively, and detecting the positions of the substrates; Each of the plurality of the substrate elements has a pattern area, and the pattern area is formed with a predetermined pattern on the inner side of the outer edge of the substantially rectangular area; The aforementioned reference image is a set of line segments set by removing corners in each of the sides of the outer edge of the aforementioned region. A drawing device is used for drawing a substrate, and has: The substrate position detection device as described in claim 9; a drawing unit that irradiates light to the substrate and draws; and The drawing control unit controls the drawing unit based on the position of the substrate detected by the substrate position detection device, thereby drawing a plurality of substrate elements of the substrate while adjusting the drawing position.

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