TWI769025B - Floor structure and forming method thereof - Google Patents
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Abstract
Description
本申請關於建築結構的技術領域,尤其是關於一種地板結構。The present application relates to the technical field of building structures, in particular to a floor structure.
隨著經濟結構、社會結構和空間結構的變遷,人口開始朝向都市集中。由於人口上升,因此建築物開始朝向高樓化發展。因此,無論是用於辦公的商業大樓,或是用於居住的公寓、社區大廈,其容置的人口也逐漸上升。人口上升意味著人們產生的噪音也會增多增大。不僅於此,即便是在透天房屋中,由於人們對於生活品質的要求以及個人隱私的重視,因此,能夠隔音、防震的樓板仍是重要的議題。With the change of economic structure, social structure and spatial structure, the population begins to concentrate in the city. Due to the rising population, buildings are starting to grow towards taller buildings. Therefore, whether it is a commercial building used for office, or an apartment or community building used for living, the population it accommodates is also gradually increasing. Rising population means more noise from people. Not only that, even in the open house, due to people's requirements for the quality of life and the importance of personal privacy, the floor that can be soundproof and shockproof is still an important issue.
對於防震結構而言,一般是在地板中間設置軟墊,並藉由這個軟墊吸收振動以及聲音,以達成降噪減震的功能。為了能夠增加軟墊的貼合程度,通常會在軟墊的上下方塗布一層黏膠,以使軟墊能夠與上下層的混凝土黏合。然而,在塗布黏膠的過程中,作業人員會需要踩在軟墊上施工,如此一來,軟墊可能會因為作業人員的長時間踩踏導致破損。更進一步地,當作業人員的鞋子沾到黏膠並反覆在軟墊上移動,也會使黏膠層的厚度不均,導致施工品質下降。For the shock-proof structure, a cushion is generally arranged in the middle of the floor, and the cushion is used to absorb vibration and sound, so as to achieve the function of noise reduction and shock absorption. In order to increase the fit of the cushion, a layer of adhesive is usually applied on the top and bottom of the cushion so that the cushion can be bonded to the concrete on the upper and lower layers. However, in the process of applying the viscose, the operator needs to step on the soft pad for construction. As a result, the soft pad may be damaged due to the long-term stepping on by the operator. Furthermore, when the operator's shoes are stained with adhesive and move repeatedly on the cushion, the thickness of the adhesive layer will also be uneven, resulting in a decrease in construction quality.
本申請實施例提供一種地板結構,解決目前地板結構中的防震層不易設置且容易破損的問題。The embodiments of the present application provide a floor structure, which solves the problems that the anti-vibration layer in the current floor structure is not easy to install and is easily damaged.
為了解決上述技術問題,本申請是這樣實現的:In order to solve the above technical problems, this application is implemented as follows:
第一方面,提供了一種地板結構,其包含第一混凝土層、黏膠層、防震層、接合層以及第二混凝土層。黏膠層設置於第一混凝土層上。防震層設置於黏膠層上。接合層設置於防震層上,且接合層包含熱貼合層或膠合層。第二混凝土層設置於接合層上。In a first aspect, a floor structure is provided, which includes a first concrete layer, an adhesive layer, an anti-vibration layer, a joint layer and a second concrete layer. The adhesive layer is arranged on the first concrete layer. The shockproof layer is arranged on the adhesive layer. The bonding layer is disposed on the shockproof layer, and the bonding layer includes a thermal bonding layer or an adhesive layer. The second concrete layer is arranged on the joint layer.
第二方面,提供了一種地板結構的形成方法,其包含設置第一混凝土層。設置黏膠層於第一混凝土層上。設置防震層於黏膠層上。藉由熱貼合或膠合設置接合層於防震層上。設置第二混凝土層於接合層上。In a second aspect, a method for forming a floor structure is provided, which includes disposing a first concrete layer. An adhesive layer is arranged on the first concrete layer. Set the shockproof layer on the adhesive layer. The bonding layer is arranged on the shockproof layer by thermal bonding or gluing. A second concrete layer is arranged on the joint layer.
在本申請實施例中,地板結構藉由設置於防震層上的接合層,不僅能夠避免防震層在安裝過程中破損,還能夠有效地降低施工難度,並減少施工時間。In the embodiment of the present application, the floor structure can not only avoid the damage of the shockproof layer during the installation process, but also effectively reduce the construction difficulty and construction time by using the joint layer disposed on the anti-vibration layer.
為利瞭解本發明之技術特徵、內容與優點及其所能達成之功效,茲將本發明配合附圖,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本發明實施後之真實比例與精確配置,故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的權利範圍,合先敘明。In order to facilitate the understanding of the technical features, content and advantages of the present invention and the effects that can be achieved, the present invention is hereby described in detail with the accompanying drawings, and in the form of embodiments as follows, and the drawings used therein are only for the purpose of For the purpose of illustration and auxiliary description, it is not necessarily the real scale and precise configuration after the implementation of the present invention, so the ratio and configuration relationship of the attached drawings should not be interpreted or limited to the scope of rights of the present invention in actual implementation. Say Ming.
在附圖中,為了清楚起見,放大元件的厚度或寬度。在整個說明書中,相同的附圖標記表示相同的元件。應當理解,當元件被稱為在另一元件「上」或「連接到」或「設置於」另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反地,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。如本文所使用的「連接」或「設置」,其可以指物理及/或電性的連接或設置。此外,若使用術語「第一」、「第二」、「第三」僅用於描述目的,而不能理解為指示或暗示相對重要性或者其順序關係。In the drawings, the thickness or width of elements are exaggerated for clarity. The same reference numerals refer to the same elements throughout the specification. It will be understood that when an element is referred to as being "on" or "connected to" or "disposed on" another element, it can be directly on or connected to the other element, or intervening elements may also be exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" or "setup" may refer to a physical and/or electrical connection or arrangement. In addition, if the terms "first", "second" and "third" are used for descriptive purposes only, they should not be construed to indicate or imply relative importance or their sequential relationship.
除非另有定義,本文所使用的所有術語(包括技術和科學術語)具有與本發明所屬技術領域的通常知識者通常理解的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地如此定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning unless expressly so defined herein.
請參閱圖1,其是本申請一實施例的地板結構的示意圖。如圖所示,地板結構1包含第一混凝土層10、黏膠層11、防震層12、接合層13以及第二混凝土層14。黏膠層11設置於第一混凝土層10上。防震層12設置於黏膠層11上。接合層13設置於防震層12上,且接合層13包含熱貼合層或膠合層。第二混凝土層14設置於接合層13上。承上所述,本申請的地板結構1與先前技術相比,防震層12僅在與第一混凝土層10的交界處塗布有黏膠,而防震層12與第二混凝土層14的交界處並未塗布黏膠,並改以接合層13代替。如此一來,便能夠實現避免防震層在安裝過程中破損,還能夠有效地降低施工難度,並減少施工時間的技術功效。為使技術功效更加顯而易見,因此,下文中將藉由形成方法進一步說明本申請的地板結構,除此之外,地板結構的材質、尺寸等特徵亦在形成方法進一步提及。Please refer to FIG. 1 , which is a schematic diagram of a floor structure according to an embodiment of the present application. As shown in the figure, the floor structure 1 includes a
請參閱圖2,其是本申請一實施例的地板結構的形成方法的流程圖。其形成步驟如下:Please refer to FIG. 2 , which is a flowchart of a method for forming a floor structure according to an embodiment of the present application. Its formation steps are as follows:
步驟S1:設置第一混凝土層10。第一混凝土層10可以包含石頭、沙子、水泥以及水,但不限於此。進一步地,為了使第一混凝土層10具有不同的功效,第一混凝土層10亦可以包含特定比例的添加物,像是飛灰、助凝劑以及促凝劑。舉例而言,第一混凝土層10可以包含陶粒、頁岩等輕質多孔骨料並摻雜引氣劑、泡沫劑,以形成多孔結構的輕混凝土。或者,第一混凝土層10還可以包含各種纖維材料,以形成不同的纖維混凝土。在一些實施例中,第一混凝土層10可以包含鋼纖維以形成鋼纖混凝土(Steel Fiber Reinforced Concrete, SFRC)。在一些實施例中,第一混凝土層10可以包含玻璃纖維以形成玻璃纖維強化混凝土(Glass Fiber Reinforced Concrete, GFRC)。在一些實施例中,第一混凝土層10可以包含碳纖維以形成碳纖維混凝土(Carbon Fiber Reinforced Concrete, CFRC)。在一些實施例中,第一混凝土層10可以包含聚丙烯纖維以形成聚丙烯纖維混凝土(Polypropylene Fiber Reinforced Concrete, PFRC)。然而,纖維材料的種類不限於此,在其他實施例中,第一混凝土層10還可以包含尼龍纖維、聚乙烯纖維、木纖維、竹纖維或陶瓷纖維、或其任意組合,以形成高抗拉、高抗彎強度且耐沖擊性的混凝土,並設置於不同環境、地點、高度以及功用的建築中。Step S1 : setting the
第一混凝土層10可以藉由澆置形成,但不限於此。在一些實施例中,第一混凝土層10也可以藉由灌漿形成。除此之外,待固化完成後,第一混凝土層10的表面還可以進行經過異物清除以及凹洞填平,以使第一混凝土層10的表面平整。所述的表面是指第一混凝土層10朝向黏膠層11的表面。舉例而言,在施工過程中,可以使用水泥清除劑之類的產品對固化後的第一混凝土層10表面進行異物清除,水泥清除劑可以包含甲酸、醋酸、介面活性劑以及蒸餾水。或者,在施工過程中,可以使用與第一混凝土層10相同或相似的材料填補第一混凝土層10表面的凹洞或是缺口,以使第一混凝土層10平整易於後續加工。The
步驟S2:設置黏膠層11於第一混凝土層10上。黏膠層11是用於黏接第一混凝土層10以及防震層12。黏膠層11可以包含乳膠、丙烯酸系樹脂、環氧樹脂、聚氨酯樹脂或聚脲樹脂或其任意組合,但不限於此。在一些實施例中,黏膠層11也可以由低揮發性的有機化合物組成,且不含有甲醛等污染物,以降低過敏源或是有害物質的產生。黏膠層11可以藉由塗布、噴塗等方式形成在第一混凝土層10上。Step S2 : disposing the
步驟S3:藉由熱貼合或膠合設置接合層13於防震層12上。防震層12可以包含天然橡膠或是合成橡膠。舉例而言,在一些實施例中,防震層12可以由回收後的廢輪胎材料製成。然而,本申請不限於此,在一些實施例中,防震層12還可以包含聚胺酯(Polyurethane, PU)或是熱塑性聚氨酯彈性體(Thermoplastic Urethane,TPU)以及/或其類似物。或者,在一些實施例中,防震層12也可以包含聚乙烯(Polyethylene, PE)、聚丙烯(Polypropylene, PP)及其類似聚合物。防震層12用於吸收震動以及聲音。具體而言,當防震層12被施加一個正向應力時,正向應力帶來的能量的一部份會被防震層12用於產生正向應變,如此一來,便能夠減少震動的傳遞。類似地,聲波在地板結構1中傳遞時,也會有部分被防震層12吸收,即地板結構1能夠藉由防震層12實現降低音量的功效。進一步地,由於力量的傳遞以及聲音的傳遞均須要透過介質,且介質的密度越高傳遞效果越佳。因此,在一些實施例中,防震層12可以是多孔結構,像是泡棉,並透過孔洞中的空氣阻撓力量以及聲音傳遞。Step S3 : disposing the
接合層13設置於防震層12的一側,並與黏膠層11相對。亦即,接合層13與黏膠層11分別在防震層12的兩側。The
請一併參閱圖3,其是本申請一實施例的接合層的形成方法的示意圖。在一些實施例中,接合層13可以藉由熱貼合的方式形成在防震層12上。舉例而言,接合層13具有熱融的特性,其在高溫下會軟化熔融。如此一來,藉由熱滾軋或是類似的方式,就能夠將接合層13與防震層12黏接,並在接合層13與防震層12的交界處形成熱貼合層。然而,本申請不限於此,在一些實施例中,接合層13可以藉由膠合的方式形成在防震層12上。舉例而言,在接合層13上塗布或噴塗黏著劑,所述的黏著劑可以與黏膠層11的材料相同或相似,但不限於此。在一些實施例中,黏著劑的成分可以與黏膠層11的材料不同。如此一來,藉由冷滾軋或是類似的方式,就能夠將接合層13與防震層12黏接,並在接合層13與防震層12的交界處形成膠合層。Please also refer to FIG. 3 , which is a schematic diagram of a method for forming a bonding layer according to an embodiment of the present application. In some embodiments, the
步驟S4: 設置防震層12於黏膠層11上。也就是說,本實施例的施工順序為:先在步驟S3中將防震層12與接合層13黏接,接著在步驟S4中才將經貼合的防震層12與黏膠層11黏接。如此一來,作業人員在施工的流程中,就不會直接踩踏在防震層12上,導致防震層12破損而降低降噪抗震的功效。除此之外,由於接合層13不具有黏性,因此,可以避免作業人員在施工過程中沾黏至衣物上或是鞋子上。更進一步地,還可以避免因作業人員的反覆踩踏而導致黏膠分布不均。然而,本申請不限於此實施例的形成順序,在一些實施例中,亦可以先將防震層12設置於黏膠層11上,再將塗布有黏著劑的接合層13設置於防震層12上,如此一來,作業人員也可以避免沾黏到黏著劑的問題。因此,相較於先前技術,接合層13可以避免黏著劑的沾黏,並提供防震層12在施工過程中的保護。Step S4: Disposing the
步驟S5:設置第二混凝土層14於接合層13上。第二混凝土層14可以包含與第一混凝土層10相同或相似的材料,但不限於此。舉例來說,在一些實施立中,第一混凝土層10可以包含鋼纖維以形成鋼纖混凝土,而第二混凝土層14可以包含防水的材料並在遠離接合層13的表面上形成防水層。因此,第二混凝土層14可以根據實際使用情況來選擇材料。Step S5 : disposing the second
在一些實施例中,地板結構1的形成方法還可以包含其他步驟。例如,為了增加地板結構1的美觀,可以包含有設置裝飾層的步驟,且所述的步驟在步驟S5之後,如下文中所述。In some embodiments, the method of forming the floor structure 1 may also include other steps. For example, in order to increase the aesthetics of the floor structure 1, a step of disposing a decorative layer may be included, and the step is after step S5, as described below.
步驟S6:設置裝飾層15於第二混凝土層14上。裝飾層可以包含磁磚、石英磚或木地板,但不限於此。裝飾層可以根據用途來選擇不同的材質。舉例而言,在一些實施例中,裝飾層可以包含石英磚,以提供堅硬、耐磨的功效。或者,在一些實施例中,裝飾層可以包含木地板,以提供舒適、美觀的功效。然而,本申請不限於此,任何所屬技術領域的具有通常知識者認知的裝飾層的材質皆可以用於本申請之中。Step S6 : disposing the decorative layer 15 on the second
綜上所述,本申請的地板結構藉由設置於防震層上的接合層,不僅能夠避免防震層在安裝過程中破損,還能夠有效地降低施工難度,並減少施工時間。To sum up, the floor structure of the present application can not only prevent the shockproof layer from being damaged during the installation process, but also can effectively reduce the construction difficulty and construction time by means of the joint layer disposed on the shockproof layer.
惟以上所述者,僅為本申請之實施例而已,並非用來限定本申請實施之範圍,舉凡依本申請之申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本申請之申請專利範圍內。However, the above descriptions are only examples of the present application, and are not intended to limit the scope of implementation of the present application. For example, all equivalent changes and modifications made according to the shape, structure, characteristics and spirit described in the scope of the patent application of the present application, All should be included in the scope of the patent application of this application.
1:地板結構 10:第一混凝土層 11:黏膠層 12:防震層 13:接合層 14:第二混凝土層 15:裝飾層 S1:步驟 S2:步驟 S3:步驟 S4:步驟 S5:步驟 S6:步驟1: Floor structure 10: First concrete layer 11: Adhesive layer 12: Shockproof layer 13: Bonding layer 14: Second concrete layer 15: Decorative layer S1: Step S2: Step S3: Step S4: Steps S5: Steps S6: Steps
圖1是本申請一實施例的地板結構的示意圖; 圖2是本申請一實施例的地板結構的形成方法的流程圖;以及 圖3是本申請一實施例的接合層的形成方法的示意圖。 FIG. 1 is a schematic diagram of a floor structure according to an embodiment of the present application; FIG. 2 is a flowchart of a method for forming a floor structure according to an embodiment of the present application; and FIG. 3 is a schematic diagram of a method for forming a bonding layer according to an embodiment of the present application.
1:地板結構 1: Floor structure
10:第一混凝土層 10: First concrete layer
11:黏膠層 11: Adhesive layer
12:防震層 12: Shockproof layer
13:接合層 13: Bonding layer
14:第二混凝土層 14: Second concrete layer
15:裝飾層 15: Decorative layer
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| TWM607443U (en) * | 2020-09-02 | 2021-02-11 | 陳重仁 | Building floor sound insulation system |
| TWM619210U (en) * | 2021-07-23 | 2021-11-01 | 泉碩科技股份有限公司 | Floor structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWM607443U (en) * | 2020-09-02 | 2021-02-11 | 陳重仁 | Building floor sound insulation system |
| TWM619210U (en) * | 2021-07-23 | 2021-11-01 | 泉碩科技股份有限公司 | Floor structure |
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