TWI768934B - Distance sensor and method of making the same - Google Patents

Abstract

The invention relates to the technical field of distance sensors, and provides a distance sensor and a manufacturing method thereof. The distance sensor includes a substrate, a light-emitting chip, a sensing chip, a separation glue wall and a light-blocking glue shell. The light-emitting chip and the sensing chip are mounted on the base plate, the separation glue wall is protruded from the sensing chip, and the light-blocking glue shell is installed on the base plate. , the partition wall divides the inner chamber of the light-blocking plastic shell into a first chamber and a second chamber. In the distance sensor and its manufacturing method provided by the present invention, a separation glue wall is protruded between the photosensitive region of the transmitting end and the photosensitive region of the receiving end, and the separation glue wall can completely separate the first chamber and the second chamber It solves the technical problem of low detection accuracy of the existing distance sensor, thereby improving the detection accuracy of the distance sensor, and the light-emitting chip and the sensing chip will not be crushed when the light-blocking plastic shell is installed. .

Description

Distance sensor and method of making the same

The present invention relates to the technical field of distance sensors, and in particular, to a distance sensor and a manufacturing method thereof.

A proximity sensor is a sensor that detects the proximity of an object in a non-contact manner. Since it can be detected in a non-contact manner, the detection object will not be worn and damaged, so the distance sensor is widely used in various industries. For example, automatic teller machines use distance sensors to detect whether there is a drawer approaching, production lines use distance sensors to count products, smartphones use distance sensors to detect whether users are leaving, smart headphones use distance sensors to detect distance The distance of the human ear, etc.

Please refer to FIG. 1 and FIG. 2 , the distance sensor includes a substrate 11 , a light-emitting chip 12 , a sensing chip 13 and a plastic casing 14 . The light-emitting chip 12 and the sensing chip 13 are mounted on the substrate 11 at intervals, and the sensing chip 13 includes an emission The end photosensitive area 15 and the receiving end photosensitive area 16, the plastic casing 14 is covered on the substrate 11, and separates two chambers, wherein the light-emitting chip 12 and the transmitting end photosensitive area 15 are located in one chamber, the receiving end photosensitive area 16 in another chamber. The working principle of the distance sensor is that part of the light emitted by the emitting chip 12 directly reaches the photosensitive area 15 at the transmitting end, and another part of the light emitted by the transmitting chip 12 exits the plastic casing 14 and then encounters the detection object 17 and is reflected back to the photosensitive area at the receiving end. 16. Calculate the distance and distance of the detection object 17 according to the time difference between the light received by the photosensitive area 15 at the transmitting end and the photosensitive area 16 at the receiving end.

According to common knowledge in the art, please refer to FIGS. 2 and 3 , the plastic housing 14 in the distance sensor has two chambers, but the two chambers are not completely separated. In order to prevent the partition wall 18 from crushing the sensing chip 13, a gap 19 is formed between the partition wall 18 and the sensing chip 13, which causes the light of the two chambers to affect each other, and the detection accuracy of the distance sensor decreases.

The purpose of the present invention is to provide a distance sensor and a manufacturing method thereof, aiming at solving the technical problem of low detection accuracy of the existing distance sensor.

In order to achieve the above object, the technical solution adopted in the present invention is: a distance sensor, which includes a substrate, a sensing chip, a separation glue wall and a light-blocking glue shell. The light-emitting chip is mounted on the substrate. The sensing chip is mounted on the substrate and is spaced apart from the light-emitting chip. The sensing chip includes a light-emitting area near the light-emitting chip and a receiving-side light-sensing area far away from the light-emitting chip. The separating glue wall is protruded from the sensing chip, and is located between the photosensitive area of the transmitting end and the photosensitive area of the receiving end. The light-blocking plastic shell is installed on the substrate, the top of the partition wall is connected with the light-blocking plastic shell, and the inner chamber of the light-blocking plastic shell is divided into a first chamber and a second chamber, and the photosensitive area of the receiving end is located in the first cavity The light-emitting chip and the photosensitive area of the emission end are located in the second chamber, and the light-blocking plastic shell also has a first light hole communicated with the first chamber and a second light hole communicated with the second chamber.

In one of the embodiments, the base plate includes a bottom plate and a circumferentially arranged flange surrounding the bottom plate, the flange has a notch, and the light-blocking rubber shell has a protrusion matched with the notch.

In one embodiment, the separation glue wall spans across the sensing chip, two ends of the separation glue wall respectively abut the inner wall of the flange, and the top of the separation glue wall is flush with the top of the flange.

In one embodiment, the distance sensor further includes two transparent glue blocks, and the two transparent glue blocks are respectively filled in the first chamber and the second chamber.

In one embodiment, the distance sensor further includes a lens, the lens is integrally formed with the transparent glue block located in the first chamber, and the lens is used to guide the incident light passing through the first light hole to be collected into the photosensitive area of the receiving end.

In one embodiment, the transparent glue block located in the second chamber has a third light hole whose position corresponds to the position of the light-emitting wafer.

In one embodiment, the transparent glue block is flush with the separation glue wall.

In one embodiment, the transparent glue block is higher than the separation glue wall, a clamping groove is formed between the two transparent glue blocks, and the light-blocking glue shell has a separation wall extending into the clamping groove and attached to the separation glue wall.

In one embodiment, the light-blocking plastic shell is a plastic shell or a molded plastic shell.

The present invention also provides a distance sensor, which includes a substrate, a light-emitting chip, a sensing chip, a light-blocking plastic shell and a partition wall. The end photosensitive area and the receiving end photosensitive area away from the light-emitting chip, the light-blocking plastic shell is installed on the substrate, the top of the light-blocking plastic shell has a hole, one end of the separation glue wall is connected to the inner side wall of the hole, and the other end of the separation glue wall is connected to the The sensing chip is located between the photosensitive area of the transmitting end and the photosensitive area of the receiving end. The partition glue wall separates the inner chamber of the light-blocking plastic shell into a first chamber and a second chamber, and the light-blocking plastic shell also has a A first light hole communicated with a chamber and a second light hole communicated with the second chamber.

The present invention also provides a method for manufacturing a distance sensor, comprising: (1) providing a substrate, and installing the light-emitting chip and the sensing chip on the substrate at intervals. (2) Forming a separation glue wall between the photosensitive region of the transmitting end and the photosensitive region of the receiving end on the sensing wafer. (3) A light-blocking plastic shell covering the light-emitting chip and the sensing chip is formed on the substrate by means of molding injection technology; wherein, the top of the partitioning plastic wall is connected with the light-blocking plastic shell, and the internal cavity of the light-blocking plastic shell is separated into The first chamber and the second light-blocking wall of the second chamber, the receiving end photosensitive area is located in the first chamber, the light-emitting chip and the transmitting end photosensitive area are located in the second chamber, and the light-blocking plastic shell also has a connection with the first chamber. The first light hole communicated with the second light hole communicated with the second chamber.

The beneficial effect of the distance sensor and the manufacturing method thereof provided by the present invention is that a separation glue wall is protruded between the photosensitive region of the transmitting end and the photosensitive region of the receiving end, and the separation glue wall can completely separate the first chamber and the second chamber The light interference between the chambers solves the technical problem of low detection accuracy of the existing distance sensor, thereby improving the detection accuracy of the distance sensor, and the light-blocking plastic case will not be crushed when the light-emitting chip is installed. and sensor chip.

11: Substrate

12, 200: Light-emitting chip

13. 300: Sensing chip

14: Plastic case

15, 310: The photosensitive area of the transmitting end

16, 320: Receiver photosensitive area

410: Separation glue wall

430: Transparent plastic block

17: Detect objects

18: Partition Wall

19: Gap

100: Substrate

110: Bottom plate

120: Flange

121: Notch

431: The third light hole

432: clip slot

440: Lens

450: First filter

460: Second filter

500: light blocking plastic shell

501: Partition Wall

510: First Chamber

520: Second chamber

530: first aperture

540: second aperture

550: bump

560: Pore

610: Molding fixture

611: Escutcheon

630: Dispensing head

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some of the present invention. In the embodiments, for those with ordinary knowledge in the technical field, other drawings can also be obtained according to these drawings without excessive experimentation.

Fig. 1 is a working principle diagram of a distance sensor; Fig. 2 is an exploded view of the distance sensor of the prior art; Fig. 3 is an internal view of the distance sensor of the prior art; Fig. 4 is the distance sensor in the third embodiment Figure 5 (a) ~ (f) is the manufacturing flow chart of the method for manufacturing the distance sensor in the third embodiment; Figure 6 is the exploded view of the distance sensor in the fourth embodiment; Figure 7(a)～(e) are the manufacturing flow chart of the manufacturing method of the distance sensor in the fourth embodiment; FIG. 8 is an exploded view of another distance sensor in the fourth embodiment; FIG. 9 is the distance in FIG. 8 A cross-sectional view of the light-blocking plastic shell of the sensor; FIGS. 10(a) to (h) are the manufacturing flow chart of the manufacturing method of another distance sensor in the fourth embodiment; FIG. 11 is the distance in the fifth embodiment The exploded view of the sensor; FIGS. 12( a ) to ( g ) are the manufacturing flow chart of the manufacturing method of the distance sensor in the fifth embodiment.

The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "level", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than An indication or implication that the referred device or element must have a particular orientation, be constructed and operate in a particular orientation, is not to be construed as a limitation of the invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the present invention, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of the two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

Example 1

Referring to FIGS. 4 , 8 and 9 , a distance sensor includes a substrate 100 , a light-emitting chip 200 , a sensing chip 300 , a separation glue wall 410 and a light-blocking glue shell 500 . The light-emitting chip 200 is mounted on the substrate 100 . The sensing chip 300 is mounted on the substrate 100 and is spaced apart from the light emitting chip 200 . The sensing wafer 300 includes a photosensitive region 310 at the transmitting end close to the light emitting wafer 200 and a photosensitive region 320 at the receiving end far away from the light emitting wafer 200 . The separation glue wall 410 is protruded from the sensing chip 300 and is located between the light-sensing region 310 at the transmitting end and the light-sensing region 320 at the receiving end. The light-blocking plastic shell 500 is installed on the substrate 100, and the top of the partition wall 410 is connected to the light-blocking plastic shell 500, and separates the inner chamber of the light-blocking plastic shell 500 into a first chamber 510 and a second chamber 520 (please 7 and 9), the receiving end photosensitive area 320 is located in the first chamber 510, the light-emitting chip 200 and the transmitting end photosensitive area 310 are located in the second chamber 520, and the light-blocking plastic shell 500 also has a communication with the first chamber 510. The first light hole 530 and the second light hole 540 communicated with the second chamber 520 .

The distance sensor provided by the present invention adopts a separation glue wall 410 protruding between the photosensitive region 310 of the transmitting end and the photosensitive region 320 of the receiving end. When the light-blocking glue shell 500 is installed on the substrate 100, the separation glue wall 410 can be completely separated The light interference between the first chamber 510 and the second chamber 520 solves the technical problem of low detection accuracy caused by light leakage from the chamber of the existing distance sensor, thereby improving the detection accuracy of the distance sensor, In addition, the light-blocking plastic shell 500 will not crush the light-emitting chip 200 and the sensing chip 300 during installation.

It should be noted that the "abutting" mentioned in this embodiment includes the situation that the two are connected to each other, and also includes the situation that the two are in contact with each other but are not physically connected together.

The substrate 100 includes but is not limited to one of a printed circuit board, a bismaleimide triazine substrate, a glass fiber substrate or a direct copper clad substrate. The light-emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The light-emitting chip 200 may be, for example, a laser chip. The sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process.

Wherein, the light-blocking plastic shell 500 and the separating plastic wall 410 can be independently selected from materials such as epoxy resin, acrylic resin, or polychloride that are not light-transmitting. Optionally, the materials of the light-blocking plastic shell 500 and the partitioning plastic wall 410 are all black plastic.

The light-blocking plastic shell 500 can be optionally a plastic shell, which is manufactured in advance by injection molding technology, and then mounted on the substrate 100; the light-blocking plastic shell 500 can also be a molded plastic shell. The wafer 200 and the substrate 100 of the sensing wafer 300 are sprayed with glue to form a light-blocking glue shell 500 on the substrate 100 .

In some embodiments, please refer to FIG. 4 and FIG. 5 , the base plate 100 includes a bottom plate 110 and a flange 120 circumferentially disposed around the bottom plate 110 , the flange 120 has a notch 121 , and the light-blocking plastic shell 500 has a corresponding gap 121 Matching bumps 550. When the light-blocking plastic shell 500 is a molded plastic shell, the setting of the notches 121 is convenient for molding and inserting the plastic. When the light-blocking plastic shell 500 is a plastic shell, the setting of the gap 121 is convenient for positioning, thereby improving the docking accuracy between the plastic shell and the substrate 100, avoiding the offset or even the gap between the two, preventing light leakage, and protecting the light-blocking position. The light-emitting chip 200 and the sensing chip 300 inside the plastic shell 500 are not corroded by the moisture of the external environment, which reduces the difficulty of alignment between the light-blocking plastic shell 500 and the substrate 100, thereby reducing the manufacturing cost and improving the distance sensing. airtightness of the device.

Specifically, please refer to FIG. 4 , the separation glue wall 410 spans the sensing chip 300 , both ends of the separation glue wall 410 abut the inner wall of the flange 120 respectively, and the top of the separation glue wall 410 is flush with the top of the flange 120 . In this way, the separation glue wall 410 separates the substrate 100 into two independent parts to prevent light interference.

In some embodiments, please refer to FIG. 4 and FIG. 6 , the distance sensor further includes two transparent glue blocks 430 , and the two transparent glue blocks 430 are respectively filled in the first chamber 510 and the second chamber 520 . Wherein, the transparent glue block 430 is manufactured by molding technology.

Referring to FIG. 4 , when the substrate 100 has the notch 121 , the colloid can enter the first chamber 510 and the second chamber 520 from the notch 121 , and after the transparent adhesive block 430 is formed, the transparent adhesive block located at the notch 121 is removed. 430 is removed, so that the light-blocking plastic shell 500 can be made during secondary molding.

Specifically, referring to FIG. 4 , the distance sensor further includes a lens 440 . The lens 440 is integrally formed with the transparent glue block 430 located in the first chamber 510 . The radiated light is collected into the photosensitive area 320 at the receiving end. The lens 440 is located between the first light aperture 530 and the receiving end photosensitive area 320 .

According to the prior art, some distance sensors need to be provided with mounting structures at both ends of the first light hole 530 , so that the top end of the first light hole 530 can install the filter, and the bottom end of the first light hole 530 is bonded to the lens 440 . However, due to the small size of the lens 440 and the edge thickness of only 0.1 mm, if a mounting structure for mounting the lens 440 needs to be provided on the end wall of the first light hole 530 , it is very difficult to manufacture and the product defect rate is high. In addition, the lens 440 is connected by glue, and the glue is easily liquefied or even loses its viscosity when passing through a high temperature SMT (Surface Mounted Technology) furnace, which causes the lens 440 to fall easily. However, in this embodiment, the lens 440 and the transparent plastic block 430 are integrally molded, and there is no need to arrange a mounting structure on the end wall of the first light hole 530, which simplifies the manufacturing process, reduces the investment in automation equipment, improves the production efficiency, and reduces the cost of production.

Specifically, please refer to FIG. 11 and FIG. 12( e ), the transparent glue block 430 in the second chamber 520 has a third light hole 431 whose position corresponds to the position of the light emitting chip 200 . The light emitted by the light-emitting chip 200 is directly emitted through the third light hole 431 without passing through the transparent glue block 430 and is not affected by refraction loss, which is beneficial to improve the detection accuracy of the distance sensor.

Wherein, for the processing of the third light hole 431, a molding jig 610 with an escutcheon 620 can be used. The side wall of the 620 is vertically upward, parallel to the movement direction of the molding jig 610, and there is no obstruction during demolding.

Wherein, the transparent glue block 430 and the separation glue wall 410 are flush or not flush.

In one embodiment, please refer to FIG. 4 , the transparent glue block 430 is flush with the separation glue wall 410 .

In another embodiment, please refer to FIG. 6 and FIG. 7( c ), the transparent glue block 430 is higher than the separation glue wall 410 , a clamping groove 432 is formed between the two transparent glue blocks 430 , and the light-blocking glue shell 500 has a structure extending to The partition wall 501 in the clip groove 432 and attached to the partition wall.

Wherein, the partition wall 501 is attached to the partition wall 410 to form an airtight light blocking wall.

In some embodiments, please refer to FIG. 8 and FIG. 9 , the top of the light-blocking plastic shell 500 has a hole 560 , one end of the separation glue wall 410 is connected to the inner side wall of the hole 560 , and the other end of the separation glue wall 410 is connected to the sensing The wafer 310, and the separation glue wall 410 is located between the photosensitive region 310 of the transmitting end and the photosensitive region 320 of the receiving end. , the light-blocking plastic shell 500 further has a first light hole 530 communicated with the first chamber 510 and a second light hole 540 communicated with the second chamber 520 .

Likewise, the separation glue wall 410 can completely separate the light interference between the first chamber 510 and the second chamber 520, improve the detection accuracy of the distance sensor, and the light-blocking glue shell 500 will not be crushed during installation The light-emitting wafer 200 and the sensing wafer 300 .

In some embodiments, please refer to FIG. 4 , the above-mentioned distance sensor further includes a first filter 450 mounted on the first light hole 530 . The first filter 450 is used to filter stray light and optical noise.

In some embodiments, please refer to FIG. 4 , the aforementioned distance sensor further includes a second filter 460 mounted on the second aperture 540 . The second filter 460 is used to filter stray light and optical noise.

Embodiment 2

The present invention also provides a method for manufacturing a distance sensor, comprising the following steps:

Step S100 : Please refer to FIG. 5( b ) and FIG. 12( a ), provide a substrate 100 , and mount the light-emitting chip 200 and the sensing chip 300 on the substrate 100 at intervals. Optionally, the light-emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process.

Step S200 : Please refer to FIG. 5( c ), FIG. 7( a ) and FIG. 12( b ), forming a partition wall 410 on the sensing chip 300 between the photosensitive region 310 of the transmitting end and the photosensitive region 320 of the receiving end.

Step S300 : Please refer to FIG. 5( f ), FIG. 7( d ) and FIG. 12( f ), in order to form a light-blocking plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 on the substrate 100 by means of injection molding.

The top of the separating glue wall 410 is connected to the light-blocking glue shell 500, and the inner chamber of the light-shielding glue shell 500 is divided into a first cavity 510 and a second cavity 520, and the receiving end photosensitive area 320 is located in the first cavity In the chamber 510 , the light-emitting chip 200 and the photosensitive region 310 at the emission end are located in the second chamber 520 , and the light-blocking plastic shell 500 further has a first light hole 530 communicating with the first chamber 510 and a second light hole 530 communicating with the second chamber 520 . Aperture 540.

The manufacturing method of the distance sensor in the second embodiment can obtain the distance sensor in the first embodiment, and correspondingly, has the corresponding technical effect of the distance sensor in the first embodiment, which is not repeated here.

In some embodiments, the above-mentioned method for manufacturing a distance sensor further includes step S400 after step S300. Please refer to FIG. 7(e) and FIG. 12(g, ) to separate the first filter 450 and the second filter The sheet 460 is installed in the first light hole 530 and the second light hole 540, respectively.

In some embodiments, in step S100 , referring to FIG. 5( a ), a sunken groove is formed in the middle of the plate to obtain a bottom plate 110 and a flange 120 circumferentially disposed around the bottom plate 110 . A gap 121 is formed on the edge 120 .

Before step S300 , please refer to FIG. 5( d ), two transparent glue blocks 430 are formed to fill the sink-type tank body through the gap 121 by using the molding injection technology, and the two transparent glue blocks 430 are respectively located on both sides of the separation glue wall 410 , and remove the transparent glue block 430 located in the notch 121 , in order to inject glue when molding the light-blocking glue shell 500 to form a closed structure to prevent light leakage.

The setting of the notch 121 is convenient for feeding glue when molding the transparent plastic block 430 , and facilitating the feeding of glue when molding the light-blocking plastic shell 500 and the precise positioning when the light-blocking plastic shell 500 is installed.

Specifically, in the step of "using the injection molding technique to form two transparent plastic blocks 430 filling the sinking tank body through the gap 121" specifically, the shapes of the transparent plastic blocks 430 and the lens 440 are molded in the first cavity. In this way, the transparent glue block 430 located in the first cavity is integrally formed with the lens 440, which eliminates the installation technology of the lens 440 and reduces the manufacturing cost.

In other embodiments, the substrate 100 is a flat plate without a sunken tank.

Before step S300 , the present invention further includes (please refer to FIG. 7( b )) forming a transparent glue block 430 higher than the separation glue wall 410 by molding technology, please refer to FIG. 7( c ), and removing the transparent glue block 430 located above the separation glue wall 410 The transparent glue blocks 430 are formed to form two transparent glue blocks 430 respectively located on both sides of the separation glue wall 410 .

Step S300 is specifically (please refer to FIG. 7( d )) injecting opaque colloid on top of the substrate 100 by molding technology, thereby forming a light-blocking plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 , and the light-blocking plastic shell 500 is connected Separate the top of the glue wall 410.

In other embodiments, the substrate 100 is a flat plate without a sunken tank body, and step S300 includes:

Step S310 : Referring to FIG. 10( b ), the light-blocking plastic shell 500 having the pores 560 is formed by injection molding technology. The positions of the pores 560 correspond to the positions of the separation glue walls 410 .

Step S320 : Please refer to FIG. 10( f ), install the light-blocking plastic case 500 on the substrate 100 and cover the light-emitting chip 200 and the sensing chip 300 .

Step S330 : Please refer to FIG. 10( g ) and FIG. 10( h ), inject opaque colloid into the pores 560 to form the separation glue wall 410 .

Specifically, before step S320, the present invention further includes the following steps:

Step S340 : Please refer to FIG. 10( c ), install the lens 440 on the bottom of the first light hole 530 of the light-blocking plastic case 500 .

Step S350 : Please refer to FIG. 10( d ), turn the light-blocking plastic case 500 by 180 degrees, and install the first optical filter 450 and the second optical filter 460 on the first optical hole 530 and the second optical hole 540 respectively. top.

The order of step S340 and step S350 is not sequential.

Embodiment 3

Referring to FIG. 4 , the present embodiment provides a distance sensor including a substrate 100 , a light-emitting chip 200 , a sensing chip 300 , a separation glue wall 410 and a light-blocking glue shell 500 . Wherein, the base plate 100 includes a bottom plate 110 and a flange 120 . The flange 120 has a notch 121 .

Specifically, the number of the notches 121 is multiple, and the plurality of notches 121 are distributed at intervals.

Specifically, the distance sensor further includes a transparent glue block 430 located between the light-blocking glue case 500 and the substrate 100 . The first chamber 510 also has a lens 440, and the lens 440 and the transparent plastic block 430 are integrally molded.

Referring to FIG. 5 , the present embodiment also provides a method for manufacturing a distance sensor, including the following steps:

Step S31 : Referring to FIG. 5( a ), a substrate 100 is formed. The substrate 100 includes a bottom plate 110 and a flange 120 circumferentially disposed around the bottom plate 110 , and the flange 120 has a notch 121 .

Step S32 : referring to FIG. 5( b ), the light-emitting chip 200 and the sensing chip 300 are mounted on the base plate 110 at intervals.

Step S33 : Referring to FIG. 5( c ), draw a separation glue wall 410 on the sensing chip 300 . Wherein, the separation glue wall 410 is located between the photosensitive region 310 of the transmitting end and the photosensitive region 320 of the receiving end, and spans the sensing chip 300 . The top of the flange is flush with the top of the flange 120.

Step S34 : Referring to FIG. 5( d ), two transparent glue blocks 430 are formed above the bottom plate 110 through the notch 121 by molding technology. At the same time, a lens 440 is also formed on the transparent glue block 430 located in the photosensitive area 320 at the receiving end.

Step S35 : Referring to FIG. 5( e ), remove the transparent glue block 430 located in the notch 121 .

Step S36 : referring to FIG. 5( f ), a light-blocking plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 is formed on the transparent plastic block 430 through the notch 121 by molding technology. The top of the separation glue wall 410 is connected with the light-blocking glue shell 500 , and separates the inner cavity of the light-shielding glue shell 500 into a first cavity 510 and the second chamber 520 , the receiving end photosensitive area 320 is located in the first chamber 510 , the light-emitting chip 200 and the transmitting end photosensitive area 310 are located in the second chamber 520 , the light-blocking plastic shell 500 also has a The first light hole 530 and the second light hole 540 communicated with the second chamber 520 .

Embodiment 4

Referring to FIG. 7 , this embodiment provides a method for manufacturing a distance sensor, including the following steps:

Step S41 : providing the substrate 100 , and mounting the light-emitting chip 200 and the sensing chip 300 on the substrate 100 at intervals.

Step S42 : Referring to FIG. 7( a ), draw a separation glue wall 410 on the sensing chip 300 . Wherein, the separation glue wall 410 is located between the photosensitive region 310 of the transmitting end and the photosensitive region 320 of the receiving end, and spans the sensing chip 300 .

Step S43 : Please refer to FIG. 7( b ), forming a transparent glue block 430 higher than the separation glue wall 410 by molding technology, please refer to FIG. 7( c ), and remove the transparent glue block 430 located above the separation glue wall 410 .

Step S44 : Referring to FIG. 7( d ), an opaque colloid is injected over the substrate 100 by molding technology, thereby forming a light-blocking colloid 500 covering the light-emitting chip 200 and the sensing chip 300 .

Optionally, after step S44, it also includes:

Step S45 : Please refer to FIG. 7( e ), install the first optical filter 450 and the second optical filter 460 on the first light hole 530 and the second light hole 540 of the light blocking plastic case 500 , respectively.

Please refer to FIG. 10 , Embodiment 4 also provides another method for manufacturing a distance sensor, including:

Step S51 : Please refer to FIG. 10( a ), provide the substrate 100 , and mount the light-emitting chip 200 and the sensing chip 300 on the substrate 100 at intervals.

Step S52 : Please refer to FIG. 10( b ), providing a light-blocking plastic case 500 with pores 560 . Wherein, the light-blocking plastic shell 500 further has a first chamber 510 , a second chamber 520 , and a The first light hole 530 and the second light hole 540 communicated with the second chamber 520 . The aperture 560 is located between the first chamber 510 and the second chamber 520 .

Step S53 : Please refer to FIG. 10( c ), install the lens 440 on the bottom of the first light hole 530 .

Step S54: Please refer to FIG. 10(d) and FIG. 10(e), turn the light-blocking plastic shell 500 over, and install the first optical filter 450 and the second optical filter 460 in the first optical hole 530 and the second optical filter 460, respectively. The top of the light aperture 540.

Step S55 : Please refer to FIG. 10( f ), install the light-blocking plastic case 500 on the substrate 100 and cover the light-emitting chip 200 and the sensing chip 300 . The receiving end photosensitive area 320 is located in the first chamber 510 , and the transmitting end photosensitive area 310 and the light-emitting wafer 200 are located in the second chamber 520 .

Step S56 : Please refer to FIG. 10( g ), inject light-blocking glue into the pores 560 to form the separation glue wall 410 . Optionally, the light-blocking glue is injected into the apertures 560 using the glue dispensing head 630 .

Finally, the distance sensor as shown in FIG. 10(h) is produced by the above-mentioned manufacturing method.

Embodiment 5

Referring to FIG. 12 , this embodiment provides a method for manufacturing a distance sensor, including:

Step S61 : Referring to FIG. 12( a ), a substrate 100 is provided, and the light-emitting chip 200 and the sensing chip 300 are mounted on the substrate 100 at intervals.

Step S62 : Referring to FIG. 12( b ), draw a separation glue wall 410 on the sensing chip 300 . Wherein, the separation glue wall 410 is located between the photosensitive region 310 of the transmitting end and the photosensitive region 320 of the receiving end, and spans the sensing chip 300 .

Step S63 : Please refer to FIGS. 12( c ) to ( e ), using the molding jig 610 with the escutcheon 620 to mold two transparent glue blocks 430 above the substrate 100 , and the two transparent glue blocks 430 are respectively located on the separation glue wall Both sides of the 410. The transparent glue block 430 located above the light-emitting chip 200 has a third light hole 431 , and the transparent glue block 430 located in the photosensitive area 320 of the receiving end has an integrally formed lens 440 .

Step S64 : Referring to FIG. 12( f ), an opaque colloid is injected over the substrate 100 using a molding technique to form a light-blocking colloid 500 covering the light-emitting chip 200 and the sensing chip 300 .

Step S65 : Please refer to FIG. 12( g ), install the first filter 450 and the second filter 460 .

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

100: Substrate

121: Notch

200: Luminous Chip

310: Transmitting end photosensitive area

320: Receiver photosensitive area

410: Separation glue wall

430: Transparent plastic block

440: Lens

450: First filter

500: light blocking plastic shell

501: Partition Wall

530: first aperture

540: second aperture

550: bump

Claims (9)

A distance sensor, comprising: a substrate; a light-emitting chip mounted on the substrate; a sensing chip mounted on the substrate and spaced apart from the light-emitting chip, the sensing chip comprising a proximity to the light-emitting chip a photosensitive area of the transmitting end and a photosensitive area of the receiving end far away from the light-emitting chip; a separation glue wall protruding from the sensing chip and located between the photosensitive area of the transmitting end and the photosensitive area of the receiving end; and a light-blocking glue The shell is installed on the substrate, the top of the partition wall is connected with the light-blocking plastic shell, and the inner chamber of the light-blocking plastic shell is divided into a first chamber and a second chamber, and the receiving end photosensitive area is located in the first chamber, the light-emitting chip and the photosensitive region of the emission end are located in the second chamber, and the light-blocking plastic shell also has a first light hole communicating with the first chamber and a first light hole communicating with the second chamber A second light hole in communication; wherein the base plate includes a bottom plate and a flange circumferentially arranged around the bottom plate, the flange has a notch, and the light-blocking plastic shell has a protrusion adapted to the notch . The distance sensor as claimed in claim 1, wherein the partition wall spans the sensing chip, two ends of the partition wall are respectively abutted against the inner wall of the flange, and the top of the partition wall is in contact with the protrusion. The top of the rim is flush. The distance sensor according to claim 1, wherein the distance sensor further comprises two transparent glue blocks, and the two transparent glue blocks are respectively filled in the first chamber and the first chamber. Two chambers. The distance sensor according to claim 3, wherein the distance sensor further comprises a lens, the lens is integrally formed with the transparent glue block located in the first chamber, and the lens is used for guiding the first light The incident light of the hole is collected into the photosensitive area of the receiving end. The distance sensor of claim 3, wherein the transparent glue block located in the second chamber has a third light hole whose position corresponds to the position of the light-emitting chip. The distance sensor according to claim 3, wherein the transparent glue block is flush with the separation glue wall; or, the transparent glue block is higher than the separation glue wall, and a clamping groove is formed between the two transparent glue blocks , the light-blocking plastic shell has a partition wall extending into the clip groove and attached to the partitioning plastic wall. The distance sensor according to any one of claims 1 to 6, wherein the light-blocking plastic shell is a plastic shell or a molded plastic shell. A distance sensor includes a substrate, a light-emitting chip, a sensing chip, a light-blocking plastic shell and a partition wall, the light-emitting chip and the sensing chip are mounted on the substrate at intervals, and the sensing chip includes A photosensitive area of a transmitting end close to the light-emitting chip and a photosensitive area of a receiving end far away from the light-emitting chip, the light-blocking plastic shell is mounted on the substrate, the top of the light-blocking plastic shell has a hole, and one end of the partition wall is connected to On the inner sidewall of the hole, the other end of the separation glue wall is connected to the sensing chip, and the separation glue wall is located between the photosensitive region of the transmitting end and the photosensitive region of the receiving end, and the separation glue wall is the light-blocking glue The inner cavity of the shell is divided into a first cavity and a second cavity, and the light-blocking plastic shell also has a first light hole communicated with the first cavity and a second cavity communicated with the second cavity. light hole. A method of manufacturing a distance sensor, comprising: A substrate is provided, and a light-emitting chip and a sensing chip are installed on the substrate at intervals, the sensing chip has a photosensitive area of a transmitting end and a photosensitive area of a receiving end; a photosensitive area located at the transmitting end is formed on the sensing chip A separation glue wall between the photosensitive region of the receiving end and the receiving end; a light-blocking glue shell covering the light-emitting chip and the sensing chip is formed on the substrate by means of the molding technology, wherein the top of the separation glue wall is connected to the The light-blocking plastic shell is connected, and the inner chamber of the light-blocking plastic shell is divided into a first chamber and a second chamber, the receiving end photosensitive area is located in the first chamber, the light-emitting chip and the transmitting end are photosensitive The area is located in the second chamber, and the light-blocking plastic shell also has a first light hole communicated with the first chamber and a second light hole communicated with the second chamber; wherein the substrate comprises a bottom plate and A flange is arranged around the circumference of the bottom plate, and the top of the partition wall is flush with the top of the flange.

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