TW202240201A - Distance sensor and manufacturing method thereof - Google Patents

Abstract

The invention relates to the technical field of distance sensors, and provides a distance sensor and a manufacturing method thereof. The distance sensor comprises a substrate, a light-emitting chip, a sensing chip, a separation glue wall and a light blocking glue shell, the light-emitting chip and the sensing chip are installed on the substrate, the separation glue wall is arranged on the sensing chip in a protruding mode, the light blocking glue shell is installed on the substrate, and the separation glue wall divides an inner cavity of the light blocking glue shell into a first cavity and a second cavity. According to the distance sensor and the manufacturing method thereof provided by the invention, the separation glue wall is convexly arranged between a transmitting end photosensitive area and a receiving end photosensitive area, and the separation glue wall can completely separate light interference between the first cavity and the second cavity, so that the technical problem of low detection accuracy of an existing distance sensor is solved; therefore, the detection accuracy of the distance sensor is improved, and the light-blocking rubber shell does not crush the light-emitting chip and the sensing chip during installation.

Description

Distance sensor and manufacturing method thereof

The invention relates to the technical field of distance sensors, in particular to a distance sensor and a manufacturing method thereof.

A proximity sensor is a sensor that detects the approach of an object in a non-contact manner. Because it can be detected in a non-contact manner, it will not wear and damage the detection object, so the distance sensor is widely used in various industries. For example, an automatic teller machine uses a distance sensor to detect whether a cashier is approaching, a production line uses a distance sensor to realize product counting, a smart phone uses a distance sensor to detect whether a user is away, and a smart earphone uses a distance sensor to detect the distance. The distance of the human ear, and so on.

Please refer to FIG. 1 and FIG. 2, the distance sensor includes a substrate 11, a light-emitting chip 12, a sensing chip 13 and a plastic casing 14, the light-emitting chip 12 and the sensing chip 13 are installed on the substrate 11 at intervals, and the sensing chip 13 includes a transmitter The end photosensitive area 15 and the receiving end photosensitive area 16, the plastic shell 14 is covered on the substrate 11, and separates two chambers, wherein, the light-emitting chip 12 and the emitting end photosensitive area 15 are located in one chamber, and the receiving end photosensitive area 16 in another chamber. The working principle of the distance sensor is that part of the light emitted by the transmitting chip 12 directly reaches the photosensitive area 15 of the transmitting end, and the other part of the light emitted by the emitting chip 12 is emitted from the plastic casing 14 and then meets the detection object 17 and is reflected back to the photosensitive area of the receiving end. 16. Calculate the distance of the detection object 17 according to the time difference between the light received by the photosensitive area 15 of the transmitting end and the photosensitive area 16 of the receiving end.

According to common knowledge in the technical field, please refer to FIG. 2 and FIG. 3 , the plastic housing 14 in the distance sensor has two chambers, but the two chambers are not completely separated. To prevent the partition wall 18 from crushing the sensing chip 13 , a gap 19 is formed between the partition wall 18 and the sensing chip 13 , causing the light in the two chambers to interact with each other, and the detection accuracy of the distance sensor is reduced.

The object of the present invention is to provide a distance sensor and its manufacturing method, aiming to solve the technical problem of low detection accuracy of the existing distance sensor.

In order to achieve the above object, the technical solution adopted by the present invention is: a distance sensor, which includes a substrate, a sensing chip, a separating plastic wall and a light-shielding plastic shell. The light emitting chip is mounted on the substrate. The sensing chip is installed on the base plate and has a distance from the light emitting chip. The sensing chip includes a photosensitive area of the emitting end close to the light emitting chip and a photosensitive area of the receiving end far away from the light emitting chip. The separation glue wall protrudes from the sensing chip and is located between the photosensitive area of the transmitting end and the photosensitive area of the receiving end. The light-shielding plastic shell is installed on the substrate, the top of the partition wall is connected with the light-shielding plastic shell, and the inner chamber of the light-shielding plastic shell is divided into a first chamber and a second chamber, and the photosensitive area of the receiving end is located in the first chamber The chamber, the light-emitting chip and the photosensitive area of the emitting end are located in the second chamber, and the light-shielding plastic shell also has a first light hole communicated with the first chamber and a second light hole communicated with the second chamber.

In one embodiment, the base plate includes a bottom plate and a circumferential flange surrounding the bottom plate, the flange has a notch, and the light-shielding plastic case has a protrusion matching the notch.

In one embodiment, the partition glue wall straddles the sensing chip, two ends of the partition glue wall abut against the inner wall of the flange respectively, and the top of the partition glue wall is flush with the top of the flange.

In one embodiment, the distance sensor further includes two transparent rubber blocks, and the two transparent rubber blocks are respectively filled in the first chamber and the second chamber.

In one embodiment, the distance sensor further includes a lens integrally formed with the transparent rubber block located in the first chamber, and the lens is used to guide the incident light passing through the first aperture to converge to the photosensitive area of the receiving end.

In one embodiment, the transparent glue block located in the second chamber has a third light hole corresponding to the position of the light-emitting wafer.

In one of the embodiments, the transparent glue block is flush with the partition glue wall.

In one embodiment, the transparent rubber blocks are higher than the partition wall, and a clamping groove is formed between the two transparent rubber blocks, and the light-shielding plastic shell has a partition wall extending into the clamping groove and attached to the partitioning rubber wall.

In one embodiment, the light-shielding plastic case is a plastic case or a molded plastic case.

The present invention also provides a distance sensor, comprising a substrate, a light-emitting chip, a sensing chip, a light-shielding plastic shell, and a separation wall. The end photosensitive area and the receiving end photosensitive area away from the light-emitting chip, the light-shielding plastic shell is installed on the substrate, the top of the light-shielding plastic shell has a hole, one end of the partition wall is connected to the inner wall of the hole, and the other end of the partition wall is connected to the The sensor chip is located between the photosensitive area of the transmitting end and the photosensitive area of the receiving end. The partition glue wall separates the inner chamber of the light-shielding plastic shell into a first chamber and a second chamber. A first light hole communicated with the first chamber and a second light hole communicated with the second chamber.

The present invention also provides a method for manufacturing a distance sensor, including: (1) providing a substrate, and installing a light-emitting chip and a sensing chip on the substrate at intervals. (2) Forming a separating glue wall between the photosensitive area of the transmitting end and the photosensitive area of the receiving end on the sensing wafer. (3) forming a light-shielding plastic shell covering the light-emitting chip and the sensing chip on the substrate by molding injection molding technology; wherein, the top of the partition wall is connected to the light-shielding plastic shell, and the inner chamber of the light-shielding plastic shell is divided into The second light-shielding wall of the first chamber and the second chamber, the photosensitive area of the receiving end is located in the first chamber, the light-emitting chip and the photosensitive area of the emitting end are located in the second chamber, and the light-shielding plastic shell also has the same function as the first chamber. The first light hole communicated with the second chamber communicates with the second light hole.

The beneficial effect of the distance sensor and its manufacturing method provided by the present invention is that: a partition glue wall is protruded between the photosensitive area of the transmitting end and the photosensitive area of the receiving end, and the partition glue wall can completely separate the first chamber and the second chamber. The light interference between the chambers solves the technical problem of low detection accuracy of the existing distance sensor, thereby improving the detection accuracy of the distance sensor, and the light-shielding plastic shell will not crush the light-emitting chip when installed and sensor chips.

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element must have a particular orientation, be constructed, and operate in a particular orientation should therefore not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

Embodiment one

Please refer to FIG. 4 , FIG. 8 and FIG. 9 , a distance sensor includes a substrate 100 , a light-emitting chip 200 , a sensing chip 300 , a partition wall 410 and a light-shielding plastic case 500 . The light emitting chip 200 is mounted on the substrate 100 . The sensing chip 300 is installed on the substrate 100 and has a distance from the light emitting chip 200 . The sensing chip 300 includes a photosensitive area 310 at the emitting end close to the light emitting chip 200 and a photosensitive area 320 at the receiving end far away from the light emitting chip 200 . The partition glue wall 410 protrudes from the sensing chip 300 and is located between the photosensitive area 310 at the transmitting end and the photosensitive area 320 at the receiving end. The light-shielding plastic shell 500 is installed on the substrate 100, and the top of the partition wall 410 is connected to the light-shielding plastic shell 500, and the inner chamber of the light-shielding plastic shell 500 is divided into a first chamber 510 and a second chamber 520 (please Referring to FIG. 7 and FIG. 9 ), the photosensitive area 320 of the receiving end is located in the first chamber 510 , the light-emitting chip 200 and the photosensitive area 310 of the emitting end are located in the second chamber 520 , and the light-shielding plastic shell 500 also has a communication function with the first chamber 510 The first light hole 530 and the second light hole 540 communicated with the second chamber 520 .

The distance sensor provided by the present invention adopts a partition wall 410 protruding between the photosensitive area 310 of the transmitting end and the photosensitive area 320 of the receiving end. The light interference between the first chamber 510 and the second chamber 520 solves the technical problem of low detection accuracy caused by light leakage in the chamber of the existing distance sensor, thereby improving the detection accuracy of the distance sensor. Moreover, the light-shielding plastic case 500 will not damage the light-emitting chip 200 and the sensing chip 300 when installed.

It should be noted that the "abutment" mentioned in this embodiment includes the situation that the two are connected to each other, and also includes the situation that the two are in contact with each other but not physically connected together.

Wherein, the substrate 100 includes but not limited to one of printed circuit board, bismaleimide triazine substrate, glass fiber substrate or direct copper clad substrate. The light emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The light emitting chip 200 may be, for example, a laser chip. The sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process.

Wherein, the light-shielding plastic shell 500 and the partition plastic wall 410 can be made of materials such as opaque epoxy resin, acrylic resin, or polyurethane independently of each other. Optionally, the materials of the light-shielding plastic case 500 and the partition wall 410 are black glue.

The light-shielding plastic shell 500 can be a plastic shell, which is manufactured by injection molding technology in advance, and then installed on the substrate 100; The chip 200 and the sensing chip 300 are placed on the substrate 100 and glued together to form a light-shielding plastic case 500 on the substrate 100 .

In some embodiments, please refer to FIG. 4 and FIG. 5 , the base plate 100 includes a bottom plate 110 and a circumferentially disposed flange 120 surrounding the bottom plate 110 , the flange 120 has a gap 121 , and the light-shielding plastic case 500 has a gap 121 that fits. Matched bump 550. When the light-shielding plastic case 500 is a molded plastic case, the setting of the notch 121 is convenient for molding and filling. When the light-blocking plastic shell 500 is a plastic shell, the setting of the notch 121 is convenient for positioning, thereby improving the accuracy of the docking between the plastic shell and the substrate 100, avoiding the deviation of the two, or even gaps, preventing light leakage, and protecting the light-blocking The light-emitting chip 200 and the sensing chip 300 inside the plastic shell 500 are not corroded by moisture in the external environment, which reduces the difficulty of alignment between the light-shielding plastic shell 500 and the substrate 100, thereby reducing manufacturing costs and improving distance sensing. The airtight performance of the device.

Specifically, please refer to FIG. 4 , the partition glue wall 410 spans the sensing wafer 300 , the two ends of the partition glue wall 410 abut against the inner wall of the flange 120 respectively, and the top of the partition glue wall 410 is flush with the top of the flange 120 . In this way, the partition glue wall 410 separates the substrate 100 to form two independent parts, preventing light interference.

In some embodiments, please refer to FIG. 4 and FIG. 6 , the distance sensor further includes two transparent glue blocks 430 , and the two transparent glue blocks 430 are filled in the first chamber 510 and the second chamber 520 respectively. Wherein, the transparent rubber block 430 is manufactured by molding technology.

Please refer to FIG. 4, when the substrate 100 has a notch 121, the colloid can enter the first chamber 510 and the second chamber 520 from the notch 121, and after the transparent glue block 430 is formed, the transparent glue block at the notch 121 will 430 is removed to make the light-shielding plastic case 500 convenient for secondary molding.

Specifically, please refer to FIG. 4 , the distance sensor further includes a lens 440, which is integrally formed with the transparent rubber block 430 located in the first chamber 510, and the lens 440 is used to guide the incident light passing through the first optical hole 530 to converge. to the photosensitive area 320 at the receiving end. The lens 440 is located between the first optical hole 530 and the photosensitive area 320 at the receiving end.

According to the prior art, some distance sensors need installation structures at both ends of the first light hole 530 to facilitate the installation of filters at the top of the first light hole 530 , and the lens 440 is bonded at the bottom of the first light hole 530 . However, since the lens 440 is small in size and the edge thickness is only 0.1mm, if a mounting structure for mounting the lens 440 needs to be provided on the end wall of the first light hole 530, the production is very difficult and the defective rate of the product is high. Moreover, the lens 440 is connected by glue, and the glue is easy to liquefy or even loses its viscosity when passing through an SMT (Surface Mounted Technology, Surface Mount Technology) high temperature furnace, so that the lens 440 is easy to fall off. However, in this embodiment, the lens 440 and the transparent rubber block 430 are integrally molded, and there is no need to install an installation structure on the end wall of the first optical hole 530, which simplifies the manufacturing process, reduces the investment in automation equipment, improves production efficiency, and reduces Production costs.

Specifically, please refer to FIG. 11 and FIG. 12( e ), the transparent glue block 430 located in the second chamber 520 has a third light hole 431 corresponding to the position of the light emitting chip 200 . The light emitted by the light-emitting chip 200 is directly emitted through the third optical hole 431 without passing through the transparent rubber block 430 , without the influence of refraction loss, which is beneficial to improve the detection accuracy of the distance sensor.

Wherein, the processing of the third optical hole 431 can use a molding jig 610 with an escutcheon 620. The molding jig 610 covers the light-emitting wafer 200, so that the colloid will not enter the inside of the escutcheon 620 during molding, and the escutcheon 620 The side wall of 620 is set vertically upwards, parallel to the movement direction of molding jig 610, and there is no hindrance when demoulding.

Wherein, the transparent glue block 430 is flush with or not flush with the partition glue wall 410 .

In one embodiment, please refer to FIG. 4 , the transparent glue block 430 is flush with the partition glue wall 410 .

In another embodiment, please refer to FIG. 6 and FIG. 7(c), the transparent rubber blocks 430 are higher than the partition wall 410, a clamping groove 432 is formed between the two transparent rubber blocks 430, and the light-shielding plastic shell 500 has a The partition wall 501 in the clamping groove 432 and attached to the partition glue wall.

Wherein, the partition wall 501 is attached to the partition glue wall 410 to form an airtight light-shielding wall.

In some embodiments, please refer to FIG. 8 and FIG. 9 , the top of the light-shielding plastic shell 500 has a hole 560, one end of the partition wall 410 is connected to the inner wall of the hole 560, and the other end of the partition wall 410 is connected to the sensor Wafer 310, and the partition glue wall 410 is located between the photosensitive area 310 of the transmitting end and the photosensitive area 320 of the receiving end, and the partition glue wall 410 separates the inner chamber of the light-shielding plastic shell 500 into a first chamber 510 and a second chamber 520 , the light-shielding plastic case 500 also has a first light hole 530 communicating with the first chamber 510 and a second light hole 540 communicating with the second chamber 520 .

Similarly, the partition wall 410 can completely separate the light interference between the first chamber 510 and the second chamber 520, improve the detection accuracy of the distance sensor, and the light-shielding plastic case 500 will not be crushed when installed. A light emitting chip 200 and a sensing chip 300 .

In some embodiments, please refer to FIG. 4 , the distance sensor further includes a first filter 450 mounted on the first aperture 530 . The first optical filter 450 is used to filter stray light and optical noise.

In some embodiments, please refer to FIG. 4 , the distance sensor further includes a second filter 460 mounted on the second aperture 540 . The second filter 460 is used to filter stray light and optical noise.

Embodiment two

The present invention also provides a method for manufacturing a distance sensor, comprising the following steps:

Step S100 : Please refer to FIG. 5( b ) and FIG. 12 ( a ), provide a substrate 100 , and mount a light emitting chip 200 and a sensing chip 300 on the substrate 100 at intervals. Optionally, the light emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process.

Step S200 : Please refer to FIG. 5( c ), FIG. 7( a ) and FIG. 12( b ), forming a partition glue wall 410 between the photosensitive area 310 at the transmitting end and the photosensitive area 320 at the receiving end on the sensing wafer 300 .

Step S300: Please refer to FIG. 5(f), FIG. 7(d) and FIG. 12(f), to form a light-shielding plastic case 500 covering the light-emitting chip 200 and the sensing chip 300 on the substrate 100 by molding and injection molding technology.

Wherein, the top of the partition wall 410 is connected with the light-shielding plastic shell 500, and divides the inner chamber of the light-shielding plastic shell 500 into a first chamber 510 and a second chamber 520, and the photosensitive area 320 of the receiving end is located in the first chamber The chamber 510, the light-emitting chip 200 and the photosensitive region 310 of the emitting end are located in the second chamber 520, and the light-shielding plastic shell 500 also has a first light hole 530 communicating with the first chamber 510 and a second chamber 520 communicating with the second chamber 520. light hole 540 .

The manufacturing method of the distance sensor in the second embodiment can obtain the distance sensor in the first embodiment, correspondingly, it has the corresponding technical effect of the distance sensor in the first embodiment, so no more details are given here.

In some embodiments, after step S300, the method for manufacturing the distance sensor further includes step S400. Please refer to FIG. 7(e) and FIG. The sheets 460 are mounted in the first light hole 530 and the second light hole 540, respectively.

In some embodiments, in step S100, please refer to FIG. 5(a), a sunken groove is formed in the middle of the plate to obtain a bottom plate 110 and a flange 120 circumferentially disposed around the bottom plate 110, and A gap 121 is opened on the edge 120 .

Before step S300 , please refer to FIG. 5( d ), forming two transparent rubber blocks 430 to fill the sunken tank through the gap 121 by using molding and injection molding technology, and the two transparent rubber blocks 430 are respectively located on both sides of the partition wall 410 , and remove the transparent glue block 430 located in the gap 121 , the purpose is to inject glue when molding the light-shielding plastic shell 500 to form a closed structure and prevent light leakage.

The setting of the notch 121 facilitates glue feeding when molding the transparent rubber block 430 , and facilitates glue feeding when molding the light-shielding plastic case 500 and precise positioning of the light-shielding rubber case 500 during installation.

Specifically, in the step of "using injection molding technology to form two transparent rubber blocks 430 filling the sunken tank through the gap 121", the shapes of the transparent rubber blocks 430 and the lens 440 are molded in the first cavity. In this way, the transparent rubber block 430 in the first cavity is integrally formed with the lens 440 , eliminating the installation technology of the lens 440 and reducing the manufacturing cost.

In other embodiments, the substrate 100 is a flat plate without a sunken tank.

Before step S300, the present invention also includes (please refer to FIG. 7(b)) using molding technology to form a transparent rubber block 430 higher than the partition wall 410, please refer to FIG. 7(c), and remove the above partition wall 410 The transparent glue blocks 430 are formed so as to form two transparent glue blocks 430 respectively located on both sides of the partition wall 410 .

Step S300 is specifically (please refer to FIG. 7(d)) using molding technology to inject opaque colloid above the substrate 100, thereby forming a light-shielding plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300, and the light-blocking plastic shell 500 is connected. Divide the top of the glue wall 410 .

In other embodiments, the substrate 100 is a flat plate without a sunken tank, and step S300 includes:

Step S310 : Please refer to FIG. 10( b ), forming a light-shielding plastic case 500 with pores 560 by using injection molding technology. Wherein, the position of the hole 560 corresponds to the position of the separating glue wall 410 .

Step S320 : Please refer to FIG. 10( f ), install the light-shielding plastic case 500 on the substrate 100 and cover the light-emitting chip 200 and the sensing chip 300 .

Step S330 : Please refer to FIG. 10( g ) and FIG. 10( h ), inject opaque glue into the hole 560 to form the separation glue wall 410 .

Specifically, before step S320, the present invention also includes the following steps:

Step S340 : Please refer to FIG. 10( c ), install the lens 440 at the bottom of the first light hole 530 of the light-shielding plastic case 500 .

Step S350: Please refer to FIG. 10(d), turn the light-shielding plastic case 500 over 180 degrees, install the first optical filter 450 and the second optical filter 460 in the first optical hole 530 and the second optical hole 540 respectively top.

Wherein, the sequence of step S340 and step S350 has no priority.

Embodiment three

Please refer to FIG. 4 , the present embodiment provides a distance sensor, including a substrate 100 , a light-emitting chip 200 , a sensing chip 300 , a partition wall 410 and a light-shielding plastic case 500 . Wherein, the substrate 100 includes a bottom plate 110 and a flange 120 . The flange 120 has a notch 121 .

Specifically, there are multiple notches 121, and the notches 121 are distributed at intervals.

Specifically, the distance sensor further includes a transparent rubber block 430 located between the light-shielding plastic shell 500 and the substrate 100 . Wherein, the first chamber 510 also has a lens 440 , and the lens 440 and the transparent rubber block 430 are integrally molded.

Please refer to FIG. 5, this embodiment also provides a method for manufacturing a distance sensor, including the following steps:

Step S31 : Please refer to FIG. 5( a ) to form a base plate 100 . The base plate 100 includes a base plate 110 and a flange 120 disposed circumferentially around the base plate 110 . The flange 120 has a notch 121 .

Step S32 : Please refer to FIG. 5( b ), install the light emitting chip 200 and the sensing chip 300 on the bottom plate 110 at intervals.

Step S33 : Please refer to FIG. 5( c ), draw a partition glue wall 410 on the sensing chip 300 . Wherein, the separating glue wall 410 is located between the photosensitive area 310 of the transmitting end and the photosensitive area 320 of the receiving end, and straddles the sensing chip 300. The top of the top is flush with the top of the flange 120.

Step S34 : Please refer to FIG. 5( d ), forming two transparent glue blocks 430 above the bottom plate 110 through the gap 121 by molding technology, and the two transparent glue blocks 430 are respectively located on both sides of the partition wall 410 . At the same time, a lens 440 is formed on the transparent rubber block 430 located in the photosensitive area 320 of the receiving end.

Step S35 : Please refer to FIG. 5( e ), remove the transparent glue block 430 located in the gap 121 .

Step S36 : Please refer to FIG. 5( f ), forming a light-shielding plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 on the transparent rubber block 430 through the gap 121 by molding technology. Wherein, the top of the partition wall 410 is connected with the light-shielding plastic shell 500, and divides the inner chamber of the light-shielding plastic shell 500 into a first chamber 510 and a second chamber 520, and the photosensitive area 320 of the receiving end is located in the first chamber The chamber 510, the light-emitting chip 200 and the photosensitive region 310 of the emitting end are located in the second chamber 520, and the light-shielding plastic shell 500 also has a first light hole 530 communicating with the first chamber 510 and a second chamber 520 communicating with the second chamber 520. light hole 540 .

Embodiment four

Please refer to FIG. 7, this embodiment provides a method for manufacturing a distance sensor, including the following steps:

Step S41 : providing the substrate 100 , and mounting the light emitting chip 200 and the sensing chip 300 on the substrate 100 at intervals.

Step S42 : Please refer to FIG. 7( a ), draw a partition glue wall 410 on the sensing chip 300 . Wherein, the partition glue wall 410 is located between the photosensitive area 310 of the transmitting end and the photosensitive area 320 of the receiving end, and straddles the sensing chip 300 .

Step S43: Please refer to FIG. 7(b), use molding technology to form a transparent glue block 430 higher than the partition wall 410, please refer to FIG. 7(c), and remove the transparent glue block 430 above the partition wall 410.

Step S44 : Please refer to FIG. 7( d ), inject opaque glue above the substrate 100 by molding technology, thereby forming a light-shielding plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 .

Optionally, after step S44, also include:

Step S45 : Please refer to FIG. 7( e ), respectively install the first optical filter 450 and the second optical filter 460 in the first optical hole 530 and the second optical hole 540 of the light-shielding plastic case 500 .

Please refer to FIG. 10. Embodiment 4 also provides another method for manufacturing a distance sensor, including:

Step S51 : Please refer to FIG. 10( a ), provide a substrate 100 , and mount a light emitting chip 200 and a sensing chip 300 on the substrate 100 at intervals.

Step S52 : Please refer to FIG. 10( b ), providing a light-shielding plastic case 500 with a hole 560 . Wherein, the light-shielding plastic case 500 further has a first chamber 510 , a second chamber 520 , a first light hole 530 communicating with the first chamber 510 , and a second light hole 540 communicating with the second chamber 520 . The aperture 560 is located between the first chamber 510 and the second chamber 520 .

Step S53 : Please refer to FIG. 10( c ), install the lens 440 on the bottom of the first light hole 530 .

Step S54: Please refer to FIG. 10(d) and FIG. 10(e), turn over the light-shielding plastic case 500, and install the first optical filter 450 and the second optical filter 460 in the first optical hole 530 and the second optical hole 530 respectively. The top of the light hole 540 .

Step S55 : Please refer to FIG. 10( f ), install the light-shielding plastic case 500 on the substrate 100 and cover the light-emitting chip 200 and the sensing chip 300 . Wherein, the receiving end photosensitive area 320 is located in the first chamber 510 , and the emitting end photosensitive area 310 and the light emitting chip 200 are located in the second chamber 520 .

Step S56 : Please refer to FIG. 10( g ), inject light blocking glue into the hole 560 to form the partition glue wall 410 . Optionally, a glue dispensing head 630 is used to inject light-shielding glue into the aperture 560 .

Finally, a distance sensor as shown in Fig. 10(h) is manufactured through the above manufacturing method.

Embodiment five

Please refer to FIG. 12 , this embodiment provides a method for manufacturing a distance sensor, including:

Step S61 : Please refer to FIG. 12( a ), provide a substrate 100 , and mount a light emitting chip 200 and a sensing chip 300 on the substrate 100 at intervals.

Step S62 : Please refer to FIG. 12( b ), draw a partition glue wall 410 on the sensing chip 300 . Wherein, the partition glue wall 410 is located between the photosensitive area 310 of the transmitting end and the photosensitive area 320 of the receiving end, and straddles the sensing chip 300 .

Step S63: Please refer to Fig. 12(c)~(e), use the molding jig 610 with the escutcheon 620 to mold two transparent rubber blocks 430 above the substrate 100, and the two transparent rubber blocks 430 are respectively located on the partition wall 410 on both sides. The transparent rubber block 430 located above the light-emitting chip 200 has a third light hole 431 , and the transparent rubber block 430 located in the photosensitive area 320 of the receiving end has an integrated lens 440 .

Step S64 : Please refer to FIG. 12( f ), inject opaque glue above the substrate 100 by molding technology, so as to form a light-shielding plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 .

Step S65 : Please refer to FIG. 12( g ), install the first optical filter 450 and the second optical filter 460 .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.

11: Substrate 12, 200: light-emitting chip 13. 300: Sensing chip 14:Plastic shell 15. 310: Photosensitive area of the transmitter 16. 320: Photosensitive area at the receiving end 410: Partition glue wall 430: transparent rubber block 17: Detecting objects 18: partition wall 19: Gap 100: Substrate 110: Bottom plate 120: Flange 121: Gap 431: The third light hole 432: clip groove 440: lens 450: the first filter 460: Second filter 500: light blocking plastic shell 501: partition wall 510: first chamber 520: second chamber 530: The first light hole 540: Second light hole 550: Bump 560: porosity 610: molded fixture 611:Escutcheon 630: dispensing head

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or prior art. Obviously, the accompanying drawings in the following description are only some of the present invention. Embodiments, for those skilled in the art, other drawings can also be obtained based on these drawings without undue experimentation. Figure 1 is a working principle diagram of the distance sensor; Figure 2 is an exploded view of a distance sensor of the prior art; 3 is an internal view of a distance sensor of the prior art; Fig. 4 is the exploded view of the distance sensor in embodiment three; 5(a)-(f) are the manufacturing flow chart of the manufacturing method of the distance sensor in the third embodiment; Fig. 6 is an exploded view of the distance sensor in Embodiment 4; 7(a)-(e) are the manufacturing flow chart of the manufacturing method of the distance sensor in the fourth embodiment; Fig. 8 is an exploded view of yet another distance sensor in Embodiment 4; Fig. 9 is a cross-sectional view of the light-shielding plastic case of the distance sensor in Fig. 8; Figure 10(a)~(h) are the manufacturing flow chart of another distance sensor manufacturing method in the fourth embodiment; Fig. 11 is an exploded view of the distance sensor in Embodiment 5; 12 ( a ) to ( g ) are the manufacturing flow charts of the manufacturing method of the distance sensor in the fifth embodiment.

100: Substrate

121: Gap

200: light emitting chip

310: Transmitter photosensitive area

320: Receiver photosensitive area

410: Partition glue wall

430: transparent rubber block

440: lens

450: the first filter

500: light blocking plastic shell

501: partition wall

530: The first light hole

540: Second light hole

550: Bump

Claims (10)

A distance sensor comprising: a substrate; a light-emitting chip installed on the substrate; A sensing chip, installed on the substrate and spaced from the light-emitting chip, the sensing chip includes a light-sensing area at the emitting end close to the light-emitting chip and a light-sensing area at the receiving end far away from the light-emitting chip; a separation glue wall protrudes from the sensing chip and is located between the photosensitive area of the emitting end and the photosensitive area of the receiving end; and A light-shielding plastic shell installed on the substrate, the top of the partition wall is connected to the light-shielding plastic shell, and divides the inner chamber of the light-shielding plastic shell into a first chamber and a second chamber, the The photosensitive area of the receiving end is located in the first chamber, the light-emitting chip and the photosensitive area of the emitting end are located in the second chamber, and the light-shielding plastic shell also has a first optical hole communicated with the first chamber and connected with the first chamber. A second light hole communicated with the second chamber. The distance sensor as claimed in item 1, wherein the base plate comprises a bottom plate and a flange disposed circumferentially around the bottom plate, the flange has a notch, and the light-shielding plastic shell has a groove that fits the notch of a bump. The distance sensor as described in claim 2, wherein the partition glue wall straddles the sensing chip, the two ends of the partition glue wall abut against the inner wall of the flange respectively, and the top of the partition glue wall and the bump The top of the edge is even. The distance sensor according to claim 1, wherein the distance sensor further comprises two transparent rubber blocks, and the two transparent rubber blocks are respectively filled in the first chamber and the second chamber. The distance sensor as described in claim 4, wherein the distance sensor further includes a lens, the lens is integrally formed with the transparent rubber block located in the first chamber, and the lens is used to guide the light passing through the first The incident light from the hole is collected into the photosensitive area of the receiving end. The distance sensor as claimed in claim 4, wherein the transparent rubber block located in the second chamber has a third light hole corresponding to the position of the light-emitting chip. The distance sensor as described in claim 4, wherein the transparent rubber block is flush with the partition wall; or, the transparent rubber block is higher than the partition wall, and a clamping groove is formed between the two transparent rubber blocks , the light-shielding plastic shell has a partition wall extending into the clamping groove and attached to the partition plastic wall. The distance sensor according to any one of claims 1 to 7, wherein the light-shielding plastic case is a plastic case or a molded plastic case. A distance sensor, which includes a substrate, a light-emitting chip, a sensing chip, a light-shielding plastic shell and a partition plastic wall, the light-emitting chip and the sensing chip are installed on the substrate at intervals, and the sensing chip includes A photosensitive area of the emitting end close to the light-emitting chip and a photosensitive area of the receiving end far away from the light-emitting chip, the light-shielding plastic shell is installed on the substrate, the top of the light-shielding plastic shell has a hole, and one end of the partition wall is connected to On the inner side wall of the hole, the other end of the partition glue wall is connected to the sensing chip, and the partition glue wall is located between the photosensitive area of the transmitting end and the photosensitive area of the receiving end. The inner chamber of the shell is divided into a first chamber and a second chamber, and the light-shielding plastic shell also has a first light hole communicated with the first chamber and a second chamber communicated with the second chamber. light hole. A method of manufacturing a distance sensor, comprising: A substrate is provided, and a light-emitting chip and a sensing chip are mounted on the substrate at intervals, and the sensing chip has a photosensitive area of an emitting end and a photosensitive area of a receiving end; forming a separation glue wall between the photosensitive area of the emitting end and the photosensitive area of the receiving end on the sensing chip; A light-shielding plastic shell covering the light-emitting chip and the sensing chip is formed on the substrate by molding injection molding technology, wherein the top of the partition wall is connected to the light-shielding plastic shell, and the inside of the light-shielding plastic shell is sealed. The chamber is divided into a first chamber and a second chamber, the photosensitive area of the receiving end is located in the first chamber, the light-emitting chip and the photosensitive area of the emitting end are located in the second chamber, and the light-shielding plastic shell also has A first light hole communicated with the first chamber and a second light hole communicated with the second chamber.

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