TWI768086B - Tin paste nozzle, work-bench and tin paste feeding apparatus - Google Patents

Abstract

This case provides a solder paste adding device that can automatically remove residual solder paste. The device includes a worktable and a solder paste nozzle, and the worktable is used for carrying the solder paste nozzle. The solder paste nozzle is provided with a through hole, the through hole is used for conveying the solder paste, the solder paste nozzle has an end, the outlet of the through hole is arranged at the end, and the end has at least one inclined surface, and the inclined surface extends through the through hole. The table has an opening for receiving the tip of the solder paste nozzle. The workbench has at least one air duct, the air duct includes an air duct inlet and an air duct outlet, the air duct inlet is communicated with a gas source, and the air duct outlet is configured to provide air flow to the inclined surface of the end of the solder paste nozzle in a downwardly inclined direction, thereby Solder paste remaining at the end of the cut.

Description

Solder paste nozzles, workbenches and solder paste applicators

This case relates to a solder paste adding device, in particular to the solder paste nozzle and workbench of an automatic solder paste adding device that can automatically remove residual solder paste.

In the printed circuit board surface sealing process, solder paste printers (also known as stencil printers) are used to print solder paste onto electronic products such as circuit boards. Solder paste printing machines generally include stencils (or templates), solder paste adding devices, squeegees or squeegees and other mechanisms. During printing, the board is automatically fed into the solder paste printer, the board has a pattern of pads or some other conductive surface on which the solder paste can be deposited, and the board has what are called fiducials One or more small holes or marks used as reference points to align a circuit board with a stencil in a solder paste printer before printing solder paste onto the circuit board. After the circuit board has been aligned with the stencil in the printer, solder paste is dispensed by moving a squeegee or squeegee across the stencil to force the solder paste through holes in the stencil and onto the circuit board. After the printing operation, the board is then sent to another workstation within the printed circuit board processing line.

The automatic solder paste adding device on the solder paste printer is used to automatically add solder paste in cans or cartridges to the screen of the solder paste printer, thereby replenishing the solder paste that is consumed during the printing process. The solder paste can is usually formed with a solder paste nozzle inserted into the solder paste can from the opening of the solder paste can. pressure) out. When using the automatic solder paste adding device, first install the solder paste can assembly on the automatic solder paste adding device so that the opening of the solder paste can is facing down, and then move the solder paste can component to a certain position above the stencil (this action is abbreviated as for "positioning"), and then dispense the solder paste from the solder paste tank nozzle to the stencil by squeezing or extracting (this action is referred to as "tinning"). After the solder paste is dispensed from the solder paste tank nozzle to the stencil by an action such as squeezing or pumping, there is usually a solder paste residue near the exit of the solder paste nozzle. In the process of removing the solder paste residue, due to the high viscosity of the solder paste, the residue is not easy to clean up, and it is easy to lead the residual solder paste to the part where the solder paste is not needed.

The purpose of this case is to provide a solder paste adding device capable of automatically removing residual solder paste, which can automatically and efficiently remove the solder paste remaining at the outlet of the solder paste nozzle of the automatic solder paste adding device at a lower cost.

According to a first aspect of the present application, the present application provides a solder paste nozzle, comprising: a main body having an end; a through hole extending through the main body, and an outlet of the through hole is provided at the end ; wherein the end has at least one bevel, the at least one bevel extending through the through hole.

As with the aforementioned solder paste nozzle, the at least one inclined surface includes two inclined surfaces, and the two inclined surfaces are symmetrically arranged with respect to the through hole.

As in the aforementioned solder paste nozzle, the main body is cylindrical, the main body has a head with an increased diameter, and the entrance of the through hole is provided in the head the diameter of the end of the body is smaller than the diameter of the rest of the body.

As with the aforementioned solder paste nozzle, the at least one inclined surface of the solder paste nozzle is used to guide air flow to remove residual solder paste.

According to a second aspect of the present application, this application provides a workbench for a solder paste application device, comprising: an opening extending through the workbench; at least one air duct, each of the at least one air duct includes an air duct An inlet and a duct outlet for communicating with a gas source to deliver airflow from the gas source to the duct outlet, the at least one duct configured to provide airflow in a downwardly sloping direction.

As with the aforementioned workbench, the opening has an inner side wall, and the air duct outlet is arranged on the inner side wall of the opening.

As with the aforementioned workbench, the lower part of the inner side wall of the opening is inclined away from the opening, and the air duct outlet is provided on the lower part of the inner side wall.

According to the aforementioned workbench, the air duct includes a first air duct part and a second air duct part, the first air duct part is connected to the gas source, the second air duct part is connected to the air duct outlet, The second air duct part is arranged obliquely, so that the airflow blown out from the air duct outlet is inclined downward.

As with the aforementioned workbench, the at least one air duct includes two air ducts, and the two air ducts are symmetrically arranged relative to the opening.

As with the aforementioned workbench, the at least one air duct includes two air ducts.

As with the aforementioned workbench, the two air ducts are arranged symmetrically with respect to the opening, and the air duct outlets of the two air ducts are arranged symmetrically with respect to the opening.

Like the aforementioned workbench, the air duct outlet is flat, so that the airflow flowing out from the air duct outlet is sharper.

As with the aforementioned workbench, the air duct is configured to provide airflow to the inclined surface of the tip of the solder paste nozzle housed in the workbench.

According to the third-party manufacturer of the present case, there is also provided a solder paste application device, comprising: a solder paste nozzle, the solder paste nozzle includes: a main body, the main body has an end; a through hole, the through hole extends through the main body, The outlet of the through hole is arranged at the end; wherein the end has at least one inclined surface, and the at least one inclined surface extends through the through hole; and at least one air duct is arranged to be directed toward the end. The at least one bevel provides airflow to cut solder paste remaining at the ends.

The aforementioned solder paste application device further comprises a worktable, the worktable includes an opening extending through the worktable, the end of the solder paste nozzle is inserted into the opening of the worktable, the At least one air duct is arranged in the workbench and is arranged to be capable of conveying air flow toward the at least one inclined surface of the end of the solder paste nozzle.

According to the aforementioned solder paste adding device, the inclination angle of the airflow blown out from the at least one air duct is smaller than the inclination angle of the at least one inclined surface at the end of the solder paste nozzle.

According to the aforementioned solder paste adding device, the width of the outlet of the at least one air duct is not smaller than the width of the outlet of the through hole of the solder paste nozzle.

The device provided in this case and the nozzle cooperate with each other, which can more thoroughly remove the residual solder paste at the nozzle outlet, and because the end of the solder paste nozzle has a downwardly inclined slope, and the airflow is also configured to flow downwards obliquely, it can be guided to be cut by the airflow. The residual solder paste falls under the nozzle where the solder paste needs to be dispensed, and will not spread to other unwanted locations.

Various embodiments of the present invention will be described below with reference to the accompanying drawings which form a part of this specification. It should be understood that although directional terms such as "front", "back", "up", "down", "left", "right", "inside", "outside" etc. are used in this case to describe the case various example structural parts and elements, but these terms are used herein for convenience of description only and based upon the example orientations shown in the drawings. Since the embodiments disclosed in this application can be arranged in different orientations, these directional terms are used for illustration only and should not be regarded as limiting. Wherever possible, the same or similar reference numerals are used herein to refer to the same parts.

FIG. 1 illustrates a perspective view and an exploded view of the solder paste adding device 100 of the present invention. As shown in FIG. 1 , the solder paste application device 100 includes a driving device 160 , a support plate element 130 , a push rod 110 , a pressing plate 109 and a worktable 300 . The support plate element 130 is used to support the entire solder paste application device 100 on the solder paste printer. The pressing plate 109 is disposed at the lower part of the push rod 110, and the push rod 110 can be driven by the driving device 160 to move up and down, thereby driving the pressing plate 109 to move up and down accordingly. The driving device 160 is fixed on the support plate assembly 130 , and the worktable 300 is also fixed on the support plate assembly 130 . The worktable 300 is used to carry the solder paste can 107 and the solder paste nozzle 200 accommodated in the solder paste can 107, wherein the lower end of the solder paste nozzle 200 is supported by the work table 600, and the upper end of the solder paste nozzle 200 is inserted into the inverted solder paste in tank 107. When performing the tinning action, the bottom of the inverted solder paste can 107 is squeezed by the downward movement of the pressing plate 109 , so that the solder paste can 107 moves downward relative to the solder paste nozzle 200 , so that the tin contained in the solder paste can 107 is moved downward. The paste flows out from the nozzle opening (not shown in FIG. 1 ) at the lower end of the solder paste nozzle 200 . Since the solder paste has a certain viscosity, after the tinning action is completed, solder paste usually remains at the nozzle opening of the solder paste nozzle 200 . The solder paste adding device of the present application can automatically remove the residual solder paste by setting the solder paste nozzle and the worktable.

2A and 2B illustrate perspective views of the solder paste nozzle 200 of the present invention from two perspectives, and FIG. 2C is a cross-sectional view of the solder paste nozzle in FIG. 2A . As shown in FIGS. 2A-2C , the solder paste nozzle 200 has a cylindrical body 210 and a through hole 218 extending through the body 210 in an axial direction of the body 210 . The body 210 has a head 230 of increased diameter and a tip 202 at an opposite end of the head 230 .

The diameter of the head 230 matches the inner diameter of the solder paste can 107 (see FIG. 4B ) so that when the solder paste can 107 moves downward relative to the solder paste nozzle 200 , the solder paste contained in the solder paste can 107 can pass through The solder paste nozzle through hole 218 flows out.

According to an example of the present application, the diameter of the tip 202 of the solder paste nozzle 200 is smaller than that of other parts of the solder paste nozzle 200 to form a stepped surface 250 where the tip 202 meets other parts of the solder paste nozzle 200 . The above-mentioned stepped surface 250 can facilitate the assembly of the solder paste nozzle 200 on the worktable 300 , which will be described in detail with reference to FIG. 4A .

Of course, the main body 210 of the solder paste nozzle 200 may also have other shapes, as long as the head 230 thereof is cylindrical. When the main body 210 is cylindrical, the diameter of the head 230 of the main body 210 may not increase. In addition, the size of the end 202 of the body 210 may also be the same as the size of the other parts of the body 210 . These are all within the scope of protection of this case.

2A-2C, the nozzle through hole 218 has an inlet 207 and an outlet 209, the inlet 207 is provided at the head 230, and the outlet 209 is provided at the end 202, and solder paste enters from the inlet 207 of the nozzle through hole 218 and exits from the outlet 209 discharge.

The end 202 is provided with two inclined surfaces 221.1 and 221.2, and the two inclined surfaces 221.1 and 221.2 are symmetrically arranged with respect to the through hole 218. The two bevels 221.1 and 221.2 both extend through the through hole 218, but the two bevels 221.1 and 221.2 do not intersect, thereby avoiding sharp corners between the two bevels. The setting of the inclined plane is beneficial to guide the airflow to cut off the solder paste remaining at the outlet 209 of the end 202 and drop it to a suitable position, which will be described in detail below. It is worth noting that the number of inclined surfaces of the end 202 can also be set to one or more than two, which are all within the protection scope of this case.

3A and 3B respectively illustrate perspective views of the worktable 300 of the present invention from two perspectives, and FIG. 3C is a partial cross-sectional view of the worktable 300 of the present invention, on which the solder paste nozzles 200 of the present invention are mounted. As shown in FIGS. 3A-3C , the workbench 300 is provided with an opening 303 and two air ducts 410.1 and 410.2 , and the two air ducts 410.1 and 410.2 are symmetrically arranged relative to the opening 303 . Opening 303 extends through table 300 for receiving end 202 of solder paste nozzle 200 . Air ducts 410.1 and 410.2 are used to direct the gas from a cleaning gas source (not shown) towards the end 202 of the solder paste nozzle 200 housed in the opening 303 to cut (or remove) residual solder paste at the end 202 by the gas .

Specifically, the opening 303 is U-shaped such that the inner side wall 313 of the opening 303 includes opposite left and right inner side walls 301.1 and 301.2 and a rear inner side wall 302 located between the left and right inner side walls 301.1 and 301.2. The left and right inner side walls 301.1 and 301.2 of the opening 303 and the lower portion 314 of the rear inner side wall 302 are both gradually inclined away from the center of the opening.

The two air ducts 410.1 and 410.2 include air duct inlets 308.1 and 308.2, and air duct outlets 309.1 and 309.2, respectively. The air duct inlets 308.1 and 308.2 are respectively arranged on the outer wall of the workbench to facilitate communication with the external gas source. The air duct outlets 309.1 and 309.2 are respectively disposed on the left and right inner side walls 301.1 and 301.2 of the opening 303 of the workbench, and on the inclined lower portions 314 of the left and right inner side walls 301.1 and 301.2. The air duct outlets 309.1 and 309.2 are flat, so that the air flow out from the air duct outlets 309.1 and 309.2 is sharper, and it is easy to remove the residual solder paste.

As shown in FIG. 3C, the air ducts 410.1 and 410.2 each include first air duct portions 425.1, 425.2 and second air duct portions 426.1, 426.2, and the first air duct portions 425.1 and 425.2 are connected to the gas source through the air duct inlets 308.1 and 308.2, respectively. , the second air duct parts 426.1 and 426.2 are connected to the first air duct parts 425.1 and 425.2, and are respectively connected to the air duct outlets 309.1 and 309.2. The second air duct portions 426.1 and 426.2 are inclined downward from the connecting ends connected to the first air duct portions 425.1 and 425.2, so that the airflow direction from the air duct outlets 309.1 and 309.2 is in a downwardly inclined direction. Of course, the air ducts 410.1 and 410.2 can also be designed to be inclined downward as a whole from the inlet to the outlet, so that the design can also provide airflow flowing out in a downwardly inclined direction.

In addition, the second air duct parts 426.1 and 426.2 are thinner than the first air duct parts 425.1 and 425.2, so that the gas flowing from the first air duct parts 425.1 and 425.2 into the second air duct parts 426.1 and 426. Sharper air knives are formed at the air duct outlets 309.1 and 309.2. Of course, the thicknesses of the second air duct portions 426.1 and 426.2 and the first air duct portions 425.1 and 425.2 may be set to be the same. In addition, the cleaning gas may be compressed gas, so as to increase the flow rate of the gas, thereby facilitating the sharpening of the air knife.

In the embodiment shown in FIGS. 3A-3C, the air duct inlets 308.1 and 308.2 are arranged on the outer side wall of the workbench, but in other embodiments, the air duct inlets 308.1 and 308.2 can also be arranged at other parts of the workbench, Just make it easy to connect to the gas source.

In the embodiment shown in FIGS. 3A-3C , two air ducts are provided for providing air flow to the two inclined surfaces 221.1 and 221.2 at the end 202 of the solder paste nozzle 200 respectively. In other embodiments, the The number can also be other numbers as long as it matches the number of bevels at the tip of the solder paste nozzle.

In addition, although in the above embodiment, the opening 303 of the workbench 300 is recessed inward from one side of the workbench to form a U-shaped groove, the opening 303 may also be a through hole passing through the workbench 300 .

4A is a cross-sectional view of the solder paste nozzle 300 shown in FIG. 2A assembled in the solder paste tank 107 and assembled on the worktable 300 shown in FIG. 3A , and FIG. 4B is a partial enlarged view of part F in FIG. 4A . The following describes the process of removing the solder paste remaining near the outlet of the solder paste nozzle by cooperating with the solder paste nozzle 200 and the worktable 300 with reference to FIG. 4A and FIG. 4B .

As shown in FIG. 4A and FIG. 4B , the head 230 of the assembled solder paste nozzle 200 is inserted into the solder paste tank 107 , and the solder paste nozzle 200 is assembled on the worktable 300 to carry the solder paste nozzle 200 and the solder through the worktable 300 Cream jar 107. When the solder paste nozzle 200 is loaded into the solder paste can 107 containing solder paste, first remove the cover (not shown) of the opening 171 of the solder paste can 107, and then remove the nozzle head of the solder paste nozzle 230 is inserted into the solder paste can 107 from the can opening 171 of the solder paste can 107 . The vicinity of the opening 171 of the solder paste can 107 is not filled with solder paste, thereby leaving an installation space for the solder paste nozzle 200 . In the tinning process, when the solder paste can 107 is pressed down, the solder paste can 107 is squeezed and moves downward relative to the solder paste nozzle 200 , because the diameter of the head 230 of the solder paste nozzle 200 is the same as the diameter of the solder paste can 107 The inner diameters of the solder paste cans 107 are matched, so that the solder paste located above the head 230 of the solder paste nozzle 200 in the solder paste can 107 is squeezed into and discharged from the solder paste nozzle through hole 218 .

As shown in FIG. 4A and FIG. 4B , when the solder paste nozzle 200 is installed on the worktable 300 in place, the end 202 of the solder paste nozzle 200 is inserted into the opening 303 of the worktable 300 , and the step surface 250 of the solder paste nozzle 200 abuts against On top of workbench 300 . The two inclined surfaces 221.1 and 221.2 on the end 202 of the solder paste nozzle 200 face the two air duct outlets 309.1 and 309.2 of the workbench 300, respectively.

When the tinning action is completed, the external air source is activated, so that the air flows through the air ducts 410.1 and 410.2 of the workbench, and flows out from the air duct outlets 309.1 and 309.2 toward the two inclined surfaces 221.1 and 221.2 of the end 202 of the solder paste nozzle 200, so that residual Solder paste at the end 202 of the solder paste nozzle 200 can be quickly removed without dripping into undesired locations.

In order to better remove the solder paste, as shown in FIG. 4B, the angle α between the second air duct portion 426.2 of the worktable and the horizontal plane L is compared with the angle β between the inclined plane 221.2 of the nozzle end 202 and the horizontal plane L, so that α<β, Therefore, the inclination angle of the airflow blown out from the outlet of the air duct is smaller than the inclination angle of the inclined surface at the end of the nozzle. When α is slightly smaller than β, the airflow can enter from the nozzle tip bevels 221.1 and 221.2 into the through hole 218 at the tip. Therefore, the airflow can not only remove the residual solder paste hanging on the outlet of the nozzle through hole 218, but also remove the residual solder paste on the inner wall of the through hole 218 at the end. Of course, making α=β can also achieve the purpose of this case, which can remove the residual solder paste at the exit of the through hole of the nozzle. where the angle of β is between 10° and 40°, and may include 10° and 40°.

Furthermore, when the solder paste nozzle 200 is installed in place in the table 300, the air duct outlets 309.1 and 309.2 are positioned higher than the nozzle outlets on the nozzle tip slopes 221.1 and 221.2. And the widths of the air duct outlets 309.1 and 309.2 are set to be no less than the width of the outlet 209 of the through hole 218, so that the airflow and the slope of the end 202 have sufficient contact area, which is more conducive to removing residual solder paste.

In addition, the lower part 314 of the inner side wall of the opening 303 of the workbench 300 is designed to be inclined outward, so that the air duct outlet located on the lower part of the inner side wall can be far away from the nozzle outlet, so as to avoid the risk of the air duct outlet being blocked by solder paste .

The workbench provided in this case and the solder paste nozzle cooperate with each other, which can more thoroughly remove the residual solder paste at the nozzle outlet. And since the end of the solder paste nozzle has a downward slope, and the airflow is also configured to flow downward, the residual solder paste cut by the airflow can be guided to fall under the nozzle where the solder paste needs to be distributed, without causing Scattered to other unneeded locations.

This specification discloses the invention using examples, one or more of which are illustrated in the accompanying drawings. Each example is provided to explain the case, not to limit it. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made in the present case without departing from the scope or spirit of the present case. For example, features illustrated or described as part of one embodiment can be used with another embodiment to yield a still further embodiment. Therefore, it is intended that this case covers modifications and variations that come within the scope of the appended claims and their equivalents.

100‧‧‧Solder Paste Apparatus 107‧‧‧Solder Paste Can 109‧‧‧Pressing Plate 110‧‧‧Pusher 130‧‧‧Support Plate Component 160‧‧‧Driver 171‧‧‧Tank 200‧‧‧Tin paste nozzle

202: End

207: Entrance

209: Export

210: Subject

218: Through hole

221.1: Bevel

221.2: Bevel

230: Head

250: Step surface

300: Workbench

301.1: Left and right inner side walls

301.2: Left and right inner side walls

302: Rear inner sidewall

303: Opening

308.1: Air duct entrance

308.2: Air duct entrance

309.1: Air duct outlet

309.2: Air duct outlet

313: Inner Wall

314: Lower

410.1: Air Duct

410.2: Air Duct

425.1: First Air Duct Section

425.2: First Air Duct Section

426.1: Second Air Duct Section

426.2: Second Air Duct Section

These and other features, aspects and advantages of the present invention will become better understood when the following detailed description is read in conjunction with the accompanying drawings, wherein like reference numerals represent like parts throughout, wherein:

Fig. 1 is the perspective view of the solder paste adding device of this case;

2A is a perspective view of the solder paste nozzle of the present invention;

FIG. 2B is a perspective view of the solder paste nozzle of FIG. 2A from another angle;

2C is a cross-sectional view of the solder paste nozzle in FIG. 2A;

3A is a perspective view of the workbench of the present case;

3B is a perspective view of the workbench in FIG. 3A from another angle;

FIG. 3C is a partial cross-sectional view of the workbench in FIG. 3A , wherein the workbench is provided with a solder paste nozzle;

4A is a cross-sectional view of the solder paste nozzle shown in FIG. 2A when assembled in the solder paste tank and on the workbench shown in FIG. 3A;

FIG. 4B is a partial enlarged view of FIG. 4A .

Domestic storage information (please note in the order of storage institution, date and number) None

Foreign deposit information (please note in the order of deposit country, institution, date and number) None

107‧‧‧Solder Paste Can

171‧‧‧Tank

200‧‧‧Solder Paste Nozzle

218‧‧‧Through hole

230‧‧‧Head

300‧‧‧Workbench

308.1‧‧‧Air duct entrance

308.2‧‧‧Air duct entrance

309.1‧‧‧Air duct exit

309.2‧‧‧Air duct exit

410.1‧‧‧Airway

410.2‧‧‧Airway

425.1‧‧‧First Air Duct Section

425.2‧‧‧First Air Duct Section

426.1‧‧‧Second air duct

426.2‧‧‧Second air duct

Claims (12)

A solder paste nozzle (200), characterized in that the solder paste nozzle (200) comprises: a main body (210), the main body (210) has an end (202); a through hole (218), the through hole (218) ) extends through the body (210), the outlet (209) of the through hole (218) is provided at the end (202); wherein the end (202) has at least one bevel (221.1, 221.2), so The at least one chamfer extends through the through hole (218). The solder paste nozzle (200) according to claim 1, wherein: the at least one inclined surface (221.1, 221.2) includes two inclined surfaces (221.1, 221.2), and the two inclined surfaces (221.1, 221.2) are opposite to the through hole (218) Symmetrical setting. The solder paste nozzle (200) according to claim 1, wherein: the main body (210) is cylindrical, and the main body (210) has a head (230) with an increased diameter; an entrance of the through hole (218) (207) is provided on the head (230); and the tip (202) of the body (210) has a diameter smaller than the diameter of the remainder of the body (210). The solder paste nozzle (200) according to claim 1, wherein: the at least one inclined surface (221.1, 221.2) is used to guide the airflow to remove residual solder paste. A workbench (300) for a solder paste nozzle according to one of claims 1 to 4, characterized in that the workbench (300) comprises: an opening (303), the opening (303) passing through The table (300) extends; at least one air duct (410.1, 410.2), each of the at least one air duct (410.1, 410.2) includes an air duct inlet (308.1, 308.2) and an air duct outlet (309.1, 309.2) ), the air duct inlet (308.1, 308.2) is used to communicate with a gas source to deliver the airflow from the gas source to the air duct outlet (309.1, 309.2), the at least one air duct (410.1, 410.2) is configured to provide airflow in a downwardly sloping direction. The workbench according to claim 5, wherein: the opening (303) has an inner side wall (313), and the air duct outlets (309.1, 309.2) are arranged on the inner side wall (313) of the opening (303). The workbench according to claim 6, wherein: the lower part (314) of the inner side wall (313) of the opening (303) is inclined away from the opening (303), and the air duct outlets (309.1, 309.2) are provided On the lower part (314) of the inner side wall (313). The workbench according to claim 6, wherein: the air duct (410.1, 410.2) comprises a first air duct part (425.1, 425.2) and a second air duct part (426.1, 426.2), the first air duct part ( 425.1, 425.2) are connected to the gas source, and the second air duct parts (426.1, 426.2) are connected to the air duct outlets (309.1, 309.2); wherein the second air duct parts (426.1, 426.2) are arranged obliquely, So that the airflow blown out from the air duct outlet (309.1, 309.2) is inclined downward. The workbench according to claim 6, wherein: the at least one air duct (410.1, 410.2) includes two air ducts (410.1, 410.2), and the two air ducts (410.1, 410.2) are opposite to the opening (303) ) symmetrically set. A solder paste adding device, wherein the solder paste adding device comprises: a solder paste nozzle (200), the solder paste nozzle (200) comprises: a main body (210), the main body (210) has an end (202); a hole (218), the through hole (218) extending through the body (210), the outlet (209) of the through hole (218) being provided at the end (202); wherein the end (202) has at least one bevel (221.1, 221.2) extending extending through the through hole (218); at least one air duct (410.1, 410.2) arranged to face the at least one slope (221.1, 221.2) of the end (202) Air flow is provided to cut the residual solder paste at the ends (202). The solder paste adding device according to claim 10, wherein: the solder paste adding device further comprises a worktable (300), the worktable (300) includes an opening (303), and the opening (303) penetrates the worktable (300) is extended, the end (202) of the solder paste nozzle (200) is inserted into the opening (303) of the worktable (300), and the at least one air duct (410.1, 410.2) is provided in the In the worktable (300), it is arranged to be able to deliver airflow toward the at least one inclined surface (221.1, 221.2) of the end (202) of the solder paste nozzle (200). The solder paste adding device according to claim 11, wherein: the inclination angle of the airflow blown out by the at least one air duct (410.1, 410.2) is smaller than the at least one slope (221.1) of the end (202) of the solder paste nozzle (200) , 221.2) inclination.

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