TW201910034A - Tin paste nozzle, work-bench and tin paste feeding apparatus - Google Patents

Abstract

The present application provides a solder paste addition device capable of automatically removing residual solder paste. The device comprises a worktable and a solder paste nozzle. The worktable is used for carrying the solder paste nozzle. The solder paste nozzle is provided with a through-hole for delivering solder paste. The solder paste nozzle has an end. An outlet of the through-hole is disposed at the end. The end has at least one inclined face extending through the through-hole. The worktable has an opening for accommodating the end of the solder paste nozzle. The worktable has at least one air duct comprising an air duct inlet and an air duct outlet. The air duct inlet is in communication with a gas source, and the air duct outlet is configured to provide gas flow in a downward inclined direction to the inclined face at the end of the solder paste nozzle, thereby cutting the residual solder paste at the end.

Description

Solder paste nozzle, table and solder paste device

The present invention relates to a solder paste device, and more particularly to a solder paste nozzle and a table for an automatic solder paste device capable of automatically removing residual solder paste.

In the printed circuit board surface sealing process, a solder paste printer (also known as a stencil printer) is used to print solder paste onto electronic products such as circuit boards. Solder paste printing machines generally include a stencil (or a template), a solder paste device, a blade or a squeegee. At the time of printing, the board is automatically fed into a solder paste printer having a pattern of solder pads or some other conductive surface on which the solder paste can be deposited, and having a reference point on the board. One or more apertures or indicia for use as a reference point to align the board with the screen in the solder paste printer prior to printing the solder paste onto the board. After the board has been aligned with the screen in the printer, the solder paste is dispensed by moving the blade or squeegee through the screen to force the solder paste through the holes in the board and onto the board. After the printing operation, the board is then sent to another workstation within the printed circuit board processing line.

The automatic solder paste device on the solder paste printer is used to automatically add canned or packaged solder paste to the screen of the solder paste printer to supplement the solder paste that is consumed in the printing process. The solder paste can usually form a solder paste canister with a solder paste nozzle inserted into the solder paste can from the opening of the solder paste can, and distribute the solder paste from the solder paste can by the relative displacement of the solder paste can and the solder paste nozzle (or squeeze) Press it out. When using the automatic solder paste device, first install the solder paste can assembly on the automatic solder paste device so that the solder paste can has the opening facing down, and then move the solder paste can component to a certain position above the mesh plate. To "position"), the solder paste is dispensed from the solder paste can nozzle to the stencil by extrusion or extraction (this action is simply referred to as "plus tin"). After the solder paste is dispensed from the solder paste can nozzle to the screen by performing an extrusion or extraction operation, solder paste remains in the vicinity of the solder paste nozzle exit. In the procedure for removing the solder paste residue, since the viscosity of the solder paste is large, the residue is not easily cleaned, and it is easy to introduce the residual solder paste to a portion where the solder paste is not required.

The purpose of the present invention is to provide a solder paste device capable of automatically removing residual solder paste, which can effectively and automatically remove the solder paste remaining at the exit of the solder paste nozzle of the automatic solder paste device at a low cost.

According to a first aspect of the present invention, there is provided a solder paste nozzle comprising: a body having an end; a through hole extending through the body, an outlet of the through hole being disposed at the end Wherein the end has at least one bevel, the at least one bevel extending through the through hole.

As in the foregoing solder paste nozzle, the at least one slope includes two slopes, and the two slopes are symmetrically disposed with respect to the through hole.

a solder paste nozzle as described above, wherein the body is cylindrical, the body has a head having an increased diameter, an inlet of the through hole is disposed at the head, and a diameter of an end of the body is smaller than a rest of the body Part of the diameter.

As with the solder paste nozzle described above, the at least one bevel of the solder paste nozzle is used to direct the airflow to remove residual solder paste.

According to a second aspect of the present invention, the present invention provides a work bench for a solder paste apparatus comprising: an opening extending through the work table; at least one air passage, each of the at least one air passage including a air passage An inlet and a duct outlet for communicating with a source of gas to deliver a flow of gas from the source of gas to the outlet of the duct, the at least one duct being configured to provide an airflow in a downwardly inclined direction.

As in the aforementioned table, the opening has an inner side wall, and the air duct outlet is provided on an inner side wall of the opening.

As in the aforementioned table, the lower portion of the inner side wall of the opening is inclined away from the opening, and the air duct outlet is provided on a lower portion of the inner side wall.

In the aforementioned workbench, the air duct includes a first air passage portion that connects the gas source, and a second air passage portion that connects the air duct outlet, The second duct portion is disposed obliquely such that the airflow blown from the duct outlet is inclined downward.

As in the aforementioned workbench, the at least one air duct includes two air ducts, and the two air ducts are symmetrically disposed with respect to the opening.

As in the aforementioned workbench, the at least one air duct includes two air ducts.

As in the aforementioned table, the two ducts are symmetrically disposed with respect to the opening, and the duct outlets of the two ducts are symmetrically disposed with respect to the opening.

As in the aforementioned workbench, the air duct outlet is flat, so that the airflow flowing out from the air duct outlet is sharper.

As in the aforementioned table, the air duct is configured to provide an air flow to a slope of the end of the solder paste nozzle housed in the table.

According to the collaborators of the present invention, there is also provided a solder paste device comprising: a solder paste nozzle, the solder paste nozzle comprising: a body having an end; and a through hole extending through the body An outlet of the through hole is disposed at the end; wherein the end has at least one slope, the at least one slope extends through the through hole; at least one air passage, the at least one air passage is disposed to the end The at least one bevel provides an air flow to cut the solder paste remaining at the end.

A solder paste apparatus as described above, further comprising a table, the work table including an opening extending through the table, the end of the solder paste nozzle being inserted into an opening of the table, At least one air duct is disposed in the table and is configured to be capable of delivering airflow toward the at least one ramp of the end of the solder paste nozzle.

In the foregoing solder paste apparatus, the inclination of the airflow blown by the at least one air duct is smaller than the inclination angle of the at least one slope of the end of the solder paste nozzle.

As in the above-described solder paste device, the width of the at least one air duct outlet is not less than the width of the exit of the through hole of the solder paste nozzle.

The device and the nozzle provided in the present case cooperate with each other to completely remove the residual solder paste at the nozzle outlet, and since the end of the solder paste nozzle has a downwardly inclined slope, and the air flow is also configured to flow downwardly, the airflow can be guided to be cut off by the airflow. The residual solder paste falls below the nozzle where it needs to be dispensed with solder paste and does not spread to other unwanted locations.

Various specific embodiments of the present invention are described below with reference to the accompanying drawings which form a part of this specification. It should be understood that although the term indicating direction is used in the present case, such as "before", "after", "upper", "lower", "left", "right", "inside", "outside", etc. Various example structural elements and elements are used, but these terms are used herein for convenience of description only, based on the example orientation shown in the figures. Since the embodiments disclosed herein may be arranged in different orientations, these terms are merely illustrative and are not to be considered as limiting. Wherever possible, the same or similar element symbols used in the present invention refer to the same parts.

FIG. 1 illustrates a perspective view and an exploded view of the solder paste device 100 of the present invention. As shown in FIG. 1, the solder paste device 100 includes a driving device 160, a support plate member 130, a push rod 110, a pressure plate 109, and a table 300. The support plate member 130 is used to support the entire solder paste device 100 on a solder paste printer. The pressure plate 109 is disposed at a lower portion of the push rod 110, and the push rod 110 can be driven by the driving device 160 to move up and down, thereby driving the pressure plate 109 to move up and down. The drive unit 160 is fixed to the support plate assembly 130, and the table 300 is also fixed to the support plate assembly 130. The table 300 is used to carry the solder paste can 107 and the solder paste nozzle 200 housed in the solder paste can 107, wherein the lower end of the solder paste nozzle 200 is supported by the table 600, and the upper end of the solder paste nozzle 200 is inserted with the inverted solder paste. In the tank 107. When the tinning action is performed, the bottom of the inverted solder paste can 107 is pressed by the downward movement of the pressing plate 109, so that the solder paste can 107 is moved downward relative to the solder paste nozzle 200, thereby causing the tin contained in the solder paste can 107. The paste flows out from the nozzle opening (not shown in Fig. 1) at the lower end of the solder paste nozzle 200. Since the solder paste has a certain viscosity, solder paste is usually left at the nozzle opening of the solder paste nozzle 200 after the tinning operation is completed. The tin paste device of the present invention can automatically remove the residual solder paste by setting the solder paste nozzle and the workbench.

2A and 2B are perspective views of two views of the solder paste nozzle 200 of the present invention, and FIG. 2C is a cross-sectional view of the solder paste nozzle of FIG. 2A. As shown in FIGS. 2A-2C, the solder paste nozzle 200 has a cylindrical body 210 and a through hole 218 extending through the body 210 in the axial direction of the body 210. The body 210 has a head 230 with an increased diameter and an end 202 at the opposite end of the head 230.

The diameter of the head 230 matches the inner diameter of the solder canister 107 (see FIG. 4B) so that the solder paste contained in the solder paste can 107 can pass through when the solder paste can 107 is moved downward relative to the solder paste nozzle 200. The solder paste nozzle through hole 218 flows out.

According to one example of the present case, the diameter of the end 202 of the solder paste nozzle 200 is smaller than the diameter of other portions of the solder paste nozzle 200 to form a stepped surface 250 at a portion where the end 202 meets the other portions of the solder paste nozzle 200. The step surface 250 described above can facilitate the assembly of the solder paste nozzle 200 on the table 300, which will be described in detail in conjunction with FIG. 4A.

Of course, the body 210 of the solder paste nozzle 200 may have other shapes as long as its head 230 is cylindrical. When the body 210 is cylindrical, the diameter of the head 230 of the body 210 may not increase. Moreover, the end 202 of the body 210 may also be the same size as the other portions of the body 210. These are all within the scope of this case.

Still as shown in Figures 2A-2C, nozzle through hole 218 has an inlet 207 and an outlet 209, inlet 207 is provided at head 230, and outlet 209 is provided at end 202, and solder paste enters from inlet 207 of nozzle through hole 218 and exits 209 discharge.

The end 202 is provided with two inclined faces 221.1 and 221.2, and the two inclined faces 221.1 and 221.2 are symmetrically arranged with respect to the through hole 218. Both bevels 221.1 and 221.2 extend through the through hole 218, but the two bevels 221.1 and 221.2 do not intersect, thereby avoiding sharp sharp corners between the two bevels. The arrangement of the bevels facilitates directing the airflow to sever the solder paste remaining at the exit 209 of the end 202 and drip in place, as will be described in more detail below. It should be noted that the number of slopes of the end 202 can also be set to one or more than two, which are all within the scope of the present disclosure.

3A and 3B respectively show perspective views of two viewing angles of the table 300 of the present case, and Fig. 3C is a partial cross-sectional view of the table 300 of the present invention on which the solder paste nozzle 200 of the present invention is mounted. As shown in FIGS. 3A-3C, the table 300 is provided with an opening 303 and two air passages 410.1 and 410.2, and the two air passages 410.1 and 410.2 are symmetrically disposed with respect to the opening 303. The opening 303 extends through the table 300 for receiving the end 202 of the solder paste nozzle 200. The air passages 410.1 and 410.2 are for directing the gas in the cleaning gas source (not shown) toward the end 202 of the solder paste nozzle 200 housed in the opening 303 to cut (or remove) the residual solder paste at the end 202 by gas. .

In particular, the opening 303 is U-shaped such that the inner sidewall 313 of the opening 303 includes opposing left and right inner sidewalls 301.1 and 301.2 and a rear inner sidewall 302 between the left and right inner sidewalls 301.1 and 301.2. The left and right inner side walls 301.1 and 301.2 of the opening 303 and the lower portion 314 of the rear inner side wall 302 are both gradually inclined away from the center of the opening.

The two ducts 410.1 and 410.2 include duct inlets 308.1 and 308.2, and duct outlets 309.1 and 309.2, respectively. The duct inlets 308.1 and 308.2 are respectively disposed on the outer wall of the table to facilitate communication with an external source of gas. The duct outlets 309.1 and 309.2 are respectively disposed on the left and right inner side walls 301.1 and 301.2 of the opening 303 of the table, and are located on the inclined lower portions 314 of the left and right inner side walls 301.1 and 301.2. The duct outlets 309.1 and 309.2 are flattened such that the airflow from the duct outlets 309.1 and 309.2 is sharper and the residual solder paste is easily removed.

As shown in Fig. 3C, the air ducts 410.1 and 410.2 each include a first duct portion 425.1, 425.2 and a second duct portion 426.1, 426.2, and the first duct portions 425.1 and 425.2 are connected to the gas source through the duct inlets 308.1 and 308.2, respectively. The second duct portions 426.1 and 426.2 are connected to the first duct portions 425.1 and 425.2 and are connected to the duct outlets 309.1 and 309.2, respectively. The second duct portions 426.1 and 426.2 are inclined downwardly from the connection ends connected to the first duct portions 425.1 and 425.2 so that the airflow directions from the duct outlets 309.1 and 309.2 are in a downwardly inclined direction. Of course, the air ducts 410.1 and 410.2 can also be designed to be tilted downwardly from the inlet toward the outlet as a whole, such that the design can also provide airflow in a downwardly inclined direction.

Furthermore, the second duct portions 426.1 and 426.2 are thinner than the first duct portions 425.1 and 425.2 such that the gases flowing from the first duct portions 425.1 and 425.2 to the second duct portions 426.1 and 426. are accelerated, thereby More sharp air knives are formed at the air duct exits 309.1 and 309.2. Of course, it is also possible that the thicknesses of the second duct portions 426.1 and 426.2 and the first duct portions 425.1 and 425.2 are set to be the same. In addition, the cleaning gas may be a compressed gas to increase the flow rate of the gas, thereby facilitating sharpening of the air knife.

In the embodiment illustrated in Figures 3A-3C, the duct inlets 308.1 and 308.2 are disposed on the outer side wall of the table, but in other embodiments, the duct inlets 308.1 and 308.2 may also be disposed elsewhere in the table. Simply connect to the gas source.

In the embodiment illustrated in Figures 3A-3C, two air ducts are provided for providing airflow to the two ramps 221.1 and 221.2 at the end 202 of the solder paste nozzle 200, respectively, in other embodiments, the air duct The number can also be other numbers as long as it matches the number of slopes at the end of the solder paste nozzle.

Further, although in the above embodiment, the opening 303 of the table 300 is recessed inwardly from one side of the table to form a U-shaped groove, the opening 303 may be a through hole penetrating through the table 300.

4A is a cross-sectional view of the solder paste nozzle 300 shown in FIG. 2A assembled in the solder paste can 107 and mounted on the table 300 shown in FIG. 3A, and FIG. 4B is a partially enlarged view of a portion F in FIG. 4A. Next, a procedure in which the solder paste nozzle 200 cooperates with the table 300 to remove the residual solder paste near the exit of the solder paste nozzle will be described with reference to FIGS. 4A and 4B.

As shown in FIGS. 4A and 4B, the head 230 of the assembled solder paste nozzle 200 is inserted into the solder paste can 107, and the solder paste nozzle 200 is mounted on the table 300 to carry the solder paste nozzle 200 and tin through the table 300. Paste tank 107. When the solder paste nozzle 200 is loaded into the solder paste can 107 containing the solder paste, the cap (not shown) of the can 171 of the solder paste can 107 is first removed, and then the nozzle head of the solder paste nozzle is placed. 230 is inserted into the solder paste can 107 from the can 171 of the solder paste can 107. The vicinity of the can 171 of the solder paste can 107 is not filled with solder paste, thereby leaving a mounting space for the solder paste nozzle 200. In the tinning process, when the solder paste can 107 is pressed down, the solder can 107 is pressed to move downward relative to the solder paste nozzle 200 due to the diameter of the head 230 of the solder paste nozzle 200 and the solder paste can 107 The inner diameters are matched such that the solder paste in the solder paste canister 107 above the head 230 of the solder paste nozzle 200 is squeezed into the solder paste nozzle via 218 and discharged therefrom.

As shown in FIGS. 4A and 4B, when the solder paste nozzle 200 is mounted in position on the table 300, the end 202 of the solder paste nozzle 200 is inserted into the opening 303 of the table 300, and the stepped surface 250 of the solder paste nozzle 200 abuts. On top of the workbench 300. The two ramps 221.1 and 221.2 on the end 202 of the solder paste nozzle 200 face the two duct outlets 309.1 and 309.2 of the table 300, respectively.

When the tinning operation is completed, the external gas source is activated to flow the airflow through the table air ducts 410.1 and 410.2, and flow out from the air duct outlets 309.1 and 309.2 toward the two slopes 221.1 and 221.2 of the end 202 of the solder paste nozzle 200, thereby remaining The solder paste at the end 202 of the solder paste nozzle 200 can be quickly removed without dripping into an undesired location.

In order to better remove the solder paste, as shown in FIG. 4B, the angle α between the second air passage portion 426.2 of the table and the horizontal plane L is compared with the angle β between the inclined surface 212.2 of the nozzle end 202 and the horizontal plane L such that α<β, Thereby, the inclination of the airflow blown out from the outlet of the duct is smaller than the inclination of the slope of the tip end of the nozzle. When α is slightly smaller than β, the gas flow can enter the through hole 218 at the end from the nozzle end slopes 221.1 and 221.2. Therefore, the air flow can not only remove the residual solder paste which is suspended from the exit of the nozzle through hole 218, but also the air flow can remove the solder paste remaining on the inner wall of the through hole 218 at the end. Of course, α = β can also achieve the purpose of the present invention, and the residual solder paste at the exit of the nozzle can be removed. Wherein the angle of β is between 10° and 40° and may include 10° and 40°.

In addition, when the solder paste nozzle 200 is installed in position in the table 300, the air duct outlets 309.1 and 309.2 are disposed above the nozzle outlets on the nozzle end ramps 221.1 and 221.2. Moreover, the width of the air duct outlets 309.1 and 309.2 is set to be not less than the width of the outlet 209 of the through hole 218, so that the air flow and the slope of the end portion 202 have a sufficient contact area, which is more advantageous for removing the residual solder paste.

In addition, the lower portion 314 of the inner side wall of the opening 303 of the table 300 is designed to be inclined outwardly so that the air duct outlet located on the lower portion of the inner side wall can be separated from the nozzle outlet by a long distance, thereby avoiding the risk that the air duct outlet is blocked by the solder paste. .

The workbench and the solder paste nozzle provided in this case cooperate with each other to completely remove the residual solder paste at the nozzle exit. And since the end of the solder paste nozzle has a downwardly inclined slope, and the air flow is also configured to flow downwardly downward, the residual solder paste cut by the airflow can be guided to fall under the nozzle where the solder paste needs to be dispensed, without Disperse to other unwanted locations.

This description uses examples to disclose the present invention, one or more examples of which are illustrated in the drawings. Each example is provided to explain the case, not to limit the case. In fact, it will be apparent to those skilled in the art that various modifications and changes can be made in the present invention without departing from the scope and spirit of the invention. For example, the illustrated or described features that are part of one embodiment can be used with another embodiment to provide a still further embodiment. Therefore, it is intended that the present invention cover the modifications and variations of the scope of the appended claims.

100‧‧‧plus solder paste device

107‧‧‧ solder paste cans

109‧‧‧Pressing

110‧‧‧Put

130‧‧‧Support plate components

160‧‧‧ drive

171‧‧‧ cans

200‧‧‧ solder paste nozzle

End of 202‧‧‧

207‧‧‧ entrance

209‧‧ Export

210‧‧‧ Subject

212.2‧‧‧Bevel

218‧‧‧through hole

221.1‧‧‧Bevel

221.2‧‧‧Bevel

230‧‧‧ head

250‧‧‧step surface

300‧‧‧Workbench

301.1‧‧‧ about the inner side wall

301.2‧‧‧ about the inner side wall

302‧‧‧Back inner side wall

303‧‧‧ openings

308.1‧‧‧airway entrance

308.2‧‧‧airway entrance

309.1‧‧‧airway exit

309.2‧‧‧Airway exit

313‧‧‧ inner side wall

Lower part of 314‧‧

410.1‧‧‧Wind

410.2‧‧‧Wind

425.1‧‧‧First air duct section

425.2‧‧‧First air duct section

426.1‧‧‧Second air duct section

426.2‧‧‧Second air duct section

These and other features, aspects, and advantages of the present invention will become better understood from the following detailed description of the invention.

Figure 1 is a perspective view of the solder paste device of the present invention;

2A is a perspective view of the solder paste nozzle of the present invention;

Figure 2B is a perspective view of another angle of the solder paste nozzle of Figure 2A;

Figure 2C is a cross-sectional view of the solder paste nozzle of Figure 2A;

Figure 3A is a perspective view of the workbench of the present invention;

Figure 3B is a perspective view of another angle of the table of Figure 3A;

Figure 3C is a partial cross-sectional view of the table of Figure 3A, wherein the table is mounted with a solder paste nozzle;

4A is a cross-sectional view of the solder paste nozzle of FIG. 2A assembled in a solder paste can and assembled on the table shown in FIG. 3A;

Fig. 4B is a partial enlarged view of Fig. 4A.

Domestic deposit information (please note according to the order of the depository, date, number)

Foreign deposit information (please note in the order of country, organization, date, number)

Claims (12)

A solder paste nozzle (200), characterized in that the solder paste nozzle (200) comprises: a body (210) having a tip end (202); a through hole (218), the through hole (218) Extending through the body (210), an outlet (209) of the through hole (218) is disposed at the end (202); wherein the end (202) has at least one slope (221), the at least A ramp extends through the through hole (218). A solder paste nozzle (200) according to claim 1, wherein: said at least one slope (221) comprises two slopes (221.1, 221.2), said two slopes (221, 222) being opposite to said through holes (218) ) Symmetrical settings. A solder paste nozzle (200) according to claim 1, wherein: said body (210) is cylindrical, said body (210) having an enlarged diameter head (230); said through hole (218) inlet (209) disposed at the head (230); and the diameter of the end (202) of the body (210) is smaller than the diameter of the remainder of the body (210). A solder paste nozzle (200) according to claim 1, wherein: said at least one slope (221) of said solder paste nozzle (200) is for guiding a gas stream to remove residual solder paste. A work table (300) for a solder paste device, characterized in that the work table (300) comprises: an opening (303) extending through the work table (300); at least one wind Lane (410.1, 410.2), each of the at least one air duct (410.1, 410.2) including a duct inlet (308.1, 308.2) and a duct outlet (309.1, 309.2), the duct inlet (308.1, 308.2) Means for communicating with a source of gas to deliver a flow of gas from a source of gas to the outlet of the duct (309.1, 309.2), the at least one duct (410) being configured to provide an airflow in a downwardly inclined direction. A workbench according to claim 5, wherein: said opening (303) has an inner side wall (313), and said air duct outlet (509) is disposed on an inner side wall (313) of said opening (303). According to the workbench of claim 6, wherein: the lower portion (314) of the inner side wall (313) of the opening (303) is inclined away from the opening (303), and the air duct outlet (309) is disposed at the The lower portion (314) of the inner side wall (313) is described. A workbench according to claim 6, wherein: said air duct (410) includes a first duct portion (425) and a second duct portion (426), said first duct portion (425) connecting said gas a source, the second duct portion (426) is coupled to the duct outlet (309); wherein the second duct portion (426) is disposed obliquely to allow airflow from the duct outlet (309) Tilt down. A workbench according to claim 6, wherein: said at least one air duct (410.1, 410.2) comprises two air ducts (410.1, 410.2), said two air ducts (410.1, 410.2) being opposite said opening (303) ) Symmetrical settings. A solder paste device, wherein the solder paste device comprises: a solder paste nozzle (200), the solder paste nozzle (200) comprising: a body (210), the body (210) having an end (202); a hole (218) extending through the body (210), an outlet (209) of the through hole (218) being disposed at the end (202); wherein the end (202) Having at least one bevel (221.1, 221.2), the at least one bevel (221.1, 221.2) extending through the through hole (218); at least one air passage (410.1, 410.2), the at least one air passage (410.1, 410.2) being A gas flow is provided to the at least one bevel (221.1, 221.2) of the end (202) to cut the solder paste remaining at the end (202). A solder paste apparatus according to claim 10, wherein: said solder paste device further comprises a work table (300), said work table (300) comprising an opening (303), said opening (303) extending through said workbench (300) extending, the end (202) of the solder paste nozzle (200) is inserted into the opening (303) of the table (300), and the at least one air channel (410.1, 410.2) is disposed at The table (300) is configured to be capable of delivering airflow toward the at least one ramp (221.1, 221.2) of the end (202) of the solder paste nozzle (200). A solder paste apparatus according to claim 11, wherein: the inclination of the airflow blown by the at least one air passage (410.1, 410.2) is smaller than the at least one slope of the end (202) of the solder paste nozzle (200) (221.1 , 221.2).