TWI767611B - Heat dissipation pad bonding method and equipment - Google Patents

Abstract

The invention provides a method and equipment for laminating a heat-dissipating rubber pad. The method for laminating a heat-dissipating rubber pad includes: making an object to be attached to be conveyed in a conveying flow path; arranging the heat-dissipating rubber pads on a material belt at intervals; The closing device is provided with the material tape and an abutting piece, the material tape is wound around the abutting piece and an input side and an output side are formed with the abutting piece as a boundary; the sticking piece is displaced toward the input side of the material tape , so that the heat-dissipating rubber pad is completely attached to the upper surface of the object to be attached from one side from the material tape in the process of simultaneous peeling and pasting; Stickers have better economic benefits.

Description

Heat dissipation pad bonding method and equipment

The present invention relates to a bonding method and equipment, in particular to a bonding method and equipment for a heat-dissipating rubber pad for applying a heat-dissipating rubber pad to an object to be attached in an automated manner.

Press, in the general chip packaging process, glue is often coated on a substrate, and then a die is attached to the substrate, and a layer of heat-dissipating glue must be applied on the die, and then a heat sink is attached to the substrate. The heat-dissipating glue is on and covers the die and the substrate; recently, the heat-dissipating glue has been gradually replaced by a heat-dissipating glue pad with a heat-dissipating function. The upper and lower surfaces of each heat dissipation pad are covered with a layer of coating, the operator first peels off one layer of the coating, and then sticks the surface of the heat dissipation pad without coating on the upper surface of the die , then tear off the film on the other side, and then stick the heat sink on top of the heat dissipation pad.

The prior art replaces the heat-dissipating glue with the heat-dissipating glue pad, although the heat-dissipating glue can be reduced In the coating process of hot glue, but artificially adhering each piece of the heat-dissipating rubber pad can not improve the efficiency of the process, and the quality of each piece of the heat-dissipating rubber pad attached is different, which is not economical in mass production; An automated method and equipment for first adhering a heat-dissipating rubber pad to the upper surface of the die on the substrate, and then covering the heat-dissipating fin on the substrate has been adopted. Although the patent case can solve the problem of automatic bonding of heat dissipation pads in the process of planting heat sinks, there is still room for improvement under the requirement of economical efficiency in semiconductor process technology!

In other words, the purpose of the present invention is to provide an economical heat-dissipating rubber pad bonding method.

Another object of the present invention is to provide a heat-dissipating rubber pad laminating apparatus for performing the above-mentioned method for laminating heat-dissipating rubber pads.

The method for laminating heat-dissipating rubber pads according to the purpose of the present invention includes: making the object to be attached to be conveyed in a conveying flow path; making the heat-dissipating rubber pads arranged on a material belt at intervals; making a laminating device set the material belt and a an abutting member, the material tape is wound around the abutting member and an input side and an output side are formed with the abutting member as a boundary; the abutting member is displaced towards the input side of the material tape, so that the heat dissipation rubber pad is It is completely attached to the upper surface of the object to be attached from one side from the material tape to the other side through the simultaneous peeling and attaching process.

According to another object of the present invention, a heat-dissipating rubber pad laminating apparatus is used to perform the above-mentioned method for laminating heat-dissipating rubber pads.

In the method and apparatus for laminating the heat dissipation rubber pad according to the embodiment of the present invention, since the laminating device is provided with the material tape and an abutting member, the material tape is wound around the abutting member and forms an input with the abutting member as a boundary side and an output side; the abutting member is displaced toward the input side of the material tape, so that the heat dissipation pad is completely covered from one side of the material tape to the other side under the simultaneous peeling and covering process To the upper surface of the object to be attached, it can be applied to closely adjacent dies, such as dies that have been cut into individual pieces on the wafer but have not yet been placed on the substrate. Since each die is still on the same film layer, it can be It reduces the transfer between the two objects to be attached and increases the lamination time. At the same time, because it is peeled and attached at the same time, there is no need to peel off the tape after lamination, which can increase the lamination efficiency.

Referring to FIG. 1 , the object A to be attached in the method for laminating the thermal pad according to the first embodiment of the present invention is, for example, the die on the wafer A1 shown in the figure. The wafer A1 is located on a film layer A2, and the film layer A frame-shaped frame A3 is set on the outer periphery of A2. The attached objects A are planned on the wafer A1 and have been cut into individual pieces. The attached objects A are arranged in a matrix on the wafer A1. They are placed together in a plane and adjacent to each other; when performing the method of laminating the heat-dissipating rubber pads of the present invention, a heat-dissipating rubber pad A4 will be pasted on the top of the object A as shown in FIG. 2 ; The embodiment of the present invention is not limited to the bonding of the heat dissipation pad A4 to the die of the wafer A1 that is still on the film layer A2 in FIG. 1, and can also be applied to the die that has been placed on the substrate The bonding of the heat dissipation pad A4, but because of the same reason, I will not repeat it.

Please refer to FIG. 3 , in the first embodiment of the present invention, the heat-dissipating rubber pad A4 is arranged on a long strip-shaped material strip A41, and a film A42 is used to cover the heat-dissipating rubber pad Above A4, the material tape A41 and the film A42 cover the heat dissipation rubber pad A4 together, and a plurality of the heat dissipation rubber pads A4 are continuously arranged in sequence on the material tape at equal intervals. Both sides have adhesive properties and are respectively adhered to the inner layer of the material tape A41 and the envelope A42, wherein, both sides of the material tape A41 have a row of a plurality of pinholes A411 arranged continuously at equal intervals, and between the two rows of pinholes A411 Spaced apart by a distance, the distance is greater than the width of the heat-dissipating rubber pad A4 and is used for the heat-dissipating rubber pad A4 to be attached therein. shape.

Please refer to FIG. 4 , the heat-dissipating rubber pad laminating device according to the first embodiment of the present invention can be implemented by the device shown in the figure, which is attached to a machine B with: A conveying flow path C is formed by a first rail frame C1; the first rail frame C1 is provided with a fixture C11, and the fixture C11 is provided with a plurality of circular groove-shaped adsorption parts arranged concentrically C111, each suction part C111 provides a suction force of negative pressure; the first rail frame C1 is provided with two spaced side frames C112 and two belts C113 which are respectively placed against the opposite inner sides of the two side frames C112 The track C114 formed above, the conveying flow path C is formed between the two tracks C114, and can be driven to make the object A composed of the wafer A1 with the frame A3 as shown in FIG. 1 attached to the track C114 It is transported or positioned above the fixture C11 by linear displacement in the X-axis; the fixture C11 can be lifted up and down so that the adsorption part C111 on it can adsorb the object A to be lifted or lowered; A transfer mechanism D is provided with two gantry rails D1 spaced apart from each other above the conveying flow path C, and each gantry rail D1 includes Z-axis uprights D11 located on both sides of the conveying flow path C respectively. , and a beam D12 which is arranged horizontally above the two columns D11 in the horizontal Y axis, each beam D12 is respectively provided with a Y axis driving member D13 such as a line code; A cantilever D2 in the X-axis is straddling the cantilever arm D2. Both ends of the cantilever D2 are driven by the Y-axis driving member D13 to make the Y-axis displacement. The cantilever D2 is provided with an X-axis driving member such as a wire code. D21, an operating seat D3 is arranged on the cantilever D2, and can be driven by the X-axis driving member D21 to perform X-axis displacement; A laminating device E is installed above the first rail C1 of the conveying flow path C, and is located on the operating seat D3 of the transfer mechanism D, and can be driven to displace in the X, Y, Z axial directions.

Please refer to FIGS. 4 and 5. The jig C11 is provided with a heating element C12 which can indirectly heat the dies on the object A in FIG. 1 placed on the jig C11. The spacer C131 is erected at an appropriate height, and the base C13 is supported and linked by a plurality of pivot rods C141 on the next linking member C14 on the table B of the machine table. There are a plurality of pivot sleeves C151 for the pivot rod C141 to be pivoted, a fixed seat C16 is also set under the fixed piece C15 with a plurality of supporting pieces C161, and a driving piece C17 such as a motor is arranged under the fixed seat C16. The driving piece C17 drives the linkage C14 through a threaded shaft C171 with a rotational driving force, so as to link the base C13 to support the fixture C11 to move up and down.

Please refer to FIGS. 6 and 7 , the laminating device E is provided with a deflection mechanism E1 and a belt winding mechanism E2; wherein, The deflection mechanism E1 is provided with a carrier E11 fixed behind the fixing element E13 via a first engraving section E121 of a plate-shaped linking element E12 and a second engraving section E131 of a plate-shaped fixing element E13 On a Z-axis rail seat E14 on the side, the bonding device E is fixed on the operating seat D3 of the transfer mechanism D with the Z-axis rail seat E14 and is linked by it; the fixing member E13 is linked with the linkage The fixing piece E13 between the pieces E12 is provided with a Z-axis slide rail E132 and a sliding seat E133, and the linking piece E12 is fixed on the sliding seat E133 for Z-axis upward and downward displacement; the deflection mechanism E1 is not A pendulum seat E15 extends through the first engraving section E121 of the linking element E12 and is fixed to the fixing element E13, so that the deflection mechanism E1 is driven by the carrier seat E11 and the rail seat E14 to act as the Z axis When displacing in the forward direction, the linkage member E12 can be linked together for synchronous displacement in the Z-axis; the swing seat E15 includes an upper swing seat E151 and a lower swing seat E152 respectively located above and below the carrier seat E11; A pivot E153 is arranged in series between the upper swing seat E151 and the lower swing seat E152 of the swing seat E15 in the Z-axis, and two sides of the upper swing seat E151 of the swing seat E15 on both sides of the pivot shaft E153 are respectively provided with external Two convex pivoting parts E1511, a driving part E154 formed by a motor is fixed on the front side of the carrier E11 by a fixing part E1541, the output shaft E1542 and a swing arm E1543 are fixed in the center, and the two sides of the swing arm E1543 are respectively A connecting member E155 is pivoted with the two pivoting parts E1511, so that the swing arm E1543, the two connecting members E155, and the two pivoting parts E1511 together form a four-link mechanism. When the driving member E154 drives the output shaft E1542 When rotating, the swing arm E1543 fixed with the output shaft E1542 will swing horizontally, so that the two connecting pieces E155 pivoted on both sides form a front and a rear swing, so that the two pivot parts E1511 are linked to the swing seat The upper swing seat E151 of E15 makes the linking member E12 fixed with the upper swing seat E151 and the lower swing seat E152 to link the various components on it with the pivot E153 as the axis to yaw; The linking element E12 extends horizontally to one side in the X-axis direction, and forms an upper linking part E123 and a lower linking part E124 separated by a hollow slot E122. The upper linking part E123 is provided with a longer length in the X-axis direction. The first sliding rail E1231 and the lower linking portion E124 are provided with a second sliding rail E1241 with a shorter length. The first sliding rail E1231 is provided with a first sliding seat E1232, and the second sliding rail E1241 is provided with a second sliding rail E1241. The sliding seat E1242; the reeling mechanism E2 is fixed on the first sliding seat E1232 and the second sliding seat E1242 with a plate-shaped fixing seat E21, and a driving member E125 is arranged between the grooves E122 of the linking member E12, which A shaft E1251 with a thread is pivoted to a fixed pivot E1252 on the link E12 after passing through a nut seat E211 on the rear side of the fixed base E21, so that the fixed base E21 and the reeling mechanism E2 on the fixed base E21 are connected. It can be driven by the driving member E125, and relative to the linking member E12 to make X-axis displacement on the first sliding rail E1231 and the second sliding rail E1241; the linking member E12 uses the pivot E153 as the axis to link the When each component oscillates, the linkage fixing base E21 and the belt winding mechanism E2 on it also oscillate.

The reeling mechanism E2 is provided on the front side surface of the fixing seat E21: A material pulley E22 is arranged on the right side of the fixed seat E21, and is driven by a belt E222 to rotate by a driving member E221 on the rear side of the fixed seat E21. The material belt A41; A first reel E23 is located on the upper right side of the fixed seat E21 and above the material pulley E22, which is driven by a belt E232 driven by a driving element E231 on the rear side of the fixed seat E21 and can rotate , to wind up the envelope A42; A second reel E24 is located on the upper left side of the fixed seat E21 and is located above the material pulley E22, which is driven by a belt E242 driven by a driving element E241 on the rear side of the fixed seat E21 and can rotate. , which is used to wind up the envelope A42 after the heat-dissipating rubber pad A4 has been extracted. A driving mechanism E25 is disposed near the bottom of the front surface of the fixing seat E21. The driving mechanism E25 is provided with two needle wheels E252 which are coaxially embedded in the Y-axis at a distance from a driving shaft E251. The driving shaft E251 is supported by the fixing Driven by a driving element E253 on the front side of the seat E21, the material belt A41 is driven by the two needle wheels E252; An abutting member E26 is disposed near the bottom of the front surface of the fixing seat E21 and below the driving mechanism E25. The abutting member E26 is arranged in the Y-axis direction, one end of the abutting member E26 is disposed on the linking member E12, and the other end is suspended.

Please refer to FIGS. 7 and 8 , after the film A42 of the material tape A41 is rolled and peeled off by the first reel E23, the material tape A41 with the heat dissipation rubber pad A4 still attached to it is hung on the driving mechanism The second needle wheel E252 of E25 is rolled by the second needle wheel E252; when the material strip A41 is wound under the abutting member E26, the material strip A41 faces the abutting member E26, the heat dissipation rubber pad A4 faces downward and It is the other side of the material strip A41 opposite to the abutting member E26; the material strip A41 is bounded by the abutting member E26 to form an input side A412 and an output side A413, and the abutting member E26 includes a A first side E261 with an inclined shape on the input side A412 of A41, and a second side E262 with an inclined shape on the output side A413, and the first side E261 and the second side E262 of the abutting member E26 face downward An abutting portion E263 with a sharp angle is formed at the intersection, the abutting portion E263 has an acute angle α1 less than ninety degrees, and an arc-curved bottom edge E264 is formed at the end of the abutting portion E263. The material strip A41 The input side A412 and the output side A413 form an acute angle α2 less than ninety degrees, wherein the acute angle α2 is greater than the acute angle α1, and the input side A412 of the material tape A41 and the surface of the object A are input in an inclined manner, The inclination angle is an acute angle α3 less than ninety degrees.

In the implementation of the first embodiment of the present invention, when the die as the object A is still located on the film layer A2 after the wafer A1 is cut, the operation of pasting the heat dissipation pad A4 is carried out. When the object A is transported above the jig C11 by the conveying flow path formed by the first rail C1 (as shown in FIG. 9 ), the jig C11 is lifted and the outer periphery is provided with the film of the frame A3 The layer A2 is adsorbed as the top, and the die on the film layer A2 as the object A is moved to an appropriate height position, and the heating element C12 indirectly heats the object placed on the fixture C11. A; The transfer mechanism D uses the operating seat D3 to drive the Z-axis rail seat E14 (Fig. 7) of the deflection mechanism E1 to make a large displacement displacement, so that the deflection mechanism E1 and the winding mechanism E2 are included in the The sticking device E is transferred to the abutting member E26 just above the object A, and the abutting portion E263 ( FIG. 9 ) is located above the near side of the object A, the sticking device E After the alignment inspection device (such as a CCD lens, not shown in the figure) can be used for alignment inspection, the deflecting mechanism E1 is linked to the reeling mechanism E2 to deflect and align, and then the abutting member E26 is lowered to attach the heat dissipation adhesive. Pad A4 for homework.

In the first embodiment of the present invention, during lamination, the material tape A41 attached with the heat dissipation rubber pad A4 is conveyed from the input side A412 through the bottom edge E264 of the abutting portion E263 of the abutting member E26 to be turned to the output When facing A413, the heat-dissipating rubber pad A4 is peeled off from the material tape A41 of the output side A413; the peeled side of the heat-dissipating rubber pad A4 is contacted by the bottom edge E264 to the upper surface of the object A in a line contact manner. Attached to the surface of the object A; then the abutting member E26 is horizontally displaced toward the input side of the material tape A41, so that the heat dissipation rubber pad A4 is removed from the material tape A41 at the same time. It is completely attached to the upper surface of the object A from the bottom to the other side; after the entire piece of the heat dissipation rubber pad A4 is completely attached to the upper surface of the object A, the contact part E263 of the abutting member E26 The bottom edge E264 is further moved away from the upper surface of the object A; the abutting member E26 is horizontally displaced toward the input side A412 of the material tape A41, so that the deflection mechanism E1 that deflects the abutting member E26 and the This is achieved by setting the reeling mechanism E2 of the sticking member E26 to perform relative displacement, so that the multiple objects A in the same row on the wafer A1 all belong to the displacement of small displacement, and the displacement of large displacement is performed. The operation seat D3 of the transfer mechanism D can be kept in position without displacement for more efficient planning.

Please refer to FIGS. 10 and 11 , the second embodiment of the present invention can use an abutting member F with a semicircular cross-section under the same mechanism and device as the first embodiment, and the abutting member F includes an abutting member F A41 input side A412 is a first side surface F1 of inclined plane, and a second side surface F2 of arc shape close to the output side A413, and the first side surface F1 and the second side surface F2 of the abutting member F are facing An abutting portion F3 with an acute angle is formed at the lower intersection, and a horizontally arranged bottom edge F31 is formed at the end of the abutting portion F3; wherein, the second side F2 of the abutting portion F3 has one hundred and ten The input side A412 and the output side A413 of the material tape A41 form an acute angle β1 of less than ninety degrees, and the input side A412 of the material tape A41 and the surface of the object A are input in an inclined manner, The inclination angle is an acute angle β2 less than ninety degrees; the bottom edge F31 abuts one side of the heat-dissipating rubber pad A4 against the upper surface of the object A, so that the abutting member F is moved to the other side of the heat-dissipating rubber pad A4 One side (that is, in the direction of the input side A412) is horizontally displaced, so that the heat dissipation pad A4 is attached to the upper surface of the attached object A and attached to the attached object A under the process of peeling and attaching at the same time. Then make the abutting member F3 move horizontally toward the input side of the material tape A41, so that the heat-dissipating rubber pad A4 is completely attached to the other side from the material tape A41 in the process of simultaneous peeling and pasting. Cover the top surface of the object A.

In the method and apparatus for laminating the heat-dissipating rubber pad according to the embodiment of the present invention, since the laminating device E is provided with the material strip A41 and an abutting member F, the material strip A41 is wound around the abutting member F and the abutting member F is the boundary to form an input side A412 and an output side A413; the abutting member F is displaced toward the input side A412 of the material tape A41, so that the heat dissipation rubber pad A4 is peeled off from the material tape A41 at the same time. , The pasting process is completely pasted to the upper surface of the object A to the other side, so it can be applied to the die that is closely adjacent, such as the wafer A1 that has been cut into individual units but has not yet been placed on the substrate. , Since each die is still on the same film layer A2, it can reduce the transmission between the two objects A to be attached and increase the lamination time. At the same time, because it is peeled and attached at the same time, there is no need to apply the material tape after lamination. A41 peels off to increase lamination efficiency.

However, the above are only preferred embodiments of the present invention, and should not be The scope of implementation of the present invention is limited, that is, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the description of the invention are still within the scope of the patent of the present invention.

A: to be attached A1: Wafer A2: film layer A3: Border A4: Thermal pad A41: Strip A411: pinhole A412: Input side A413: Output side A42: Envelope A43: Sleeve A431: Shaft hole B: machine C: Delivery flow path C1: The first rail frame C11: Jig C111: Adsorption part C112: Side Frame C113: Belt C114: Orbit C12: Heating element C13: Base C131: Spacer C14: Linkage C141: Pivot lever C15: Fixtures C151: Pivot sleeve C16: Fixed seat C161: Supports C17: Driver C171: Spindle D: transfer mechanism D1: Gantry rail frame D11: Column D12: Beam D13: Y-axis drive D2: Cantilever D21: X-axis drive E: Fitting device E1: deflection mechanism E11: Carrier E12: Linkage E121: The first engraving interval E122: Between slots E123: Upper linkage E1231: The first slide rail E1232: The first slide E124: Lower linkage E1241: Second rail E1242: Second slide E125: Driver E1251: Shaft E13: Fixtures E131: The second engraving interval E132: Slide rail E133: Slider E14: Z-axis rail seat E15: Swing seat E151: Top swing seat E1511: Pivoting part E152: Hem seat E153: Pivot E154: Driver E1541: Fixtures E1542: Output shaft E1543: Swing arm E155: Connector E2: Tape and reel mechanism E21: Fixed seat E22: Material pulley E221: Driver E222: Belt E23: The first reel E231: Driver E232: Belt E24: The second reel E241: Driver E242: Belt E25: Drive Mechanism E251: Drive shaft E252: Needle wheel E26: affixed pieces E261: First side E262: Second side E263: Abutment Department E264: Bottom edge F: sticker F1: The first side F2: Second side F3: Sticker α1: acute angle α2: acute angle α3: acute angle β1: acute angle β2: acute angle

FIG. 1 is a schematic diagram of an object to be pasted on a film layer according to the first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of the object sticker and the heat-dissipating rubber pad in the first embodiment of the present invention. FIG. 3 is a three-dimensional schematic diagram of a roll formed from a tape provided with a heat-dissipating rubber pad according to the first embodiment of the present invention. FIG. 4 is a schematic perspective view of the laminating device in the first embodiment of the present invention. FIG. 5 is a schematic diagram of a fixture and a lower mechanism in the first embodiment of the present invention. FIG. 6 is a schematic exploded perspective view of the laminating device according to the first embodiment of the present invention. FIG. 7 is a perspective view of the other side of the laminating device according to the first embodiment of the present invention. FIG. 8 is a schematic diagram of a heat-dissipating rubber pad for sticking an abutting member in operation according to the first embodiment of the present invention. FIG. 9 is a schematic diagram of the operation of the laminating device in the first embodiment of the present invention. FIG. 10 is a schematic perspective view of a laminating device according to a second embodiment of the present invention. FIG. 11 is a schematic diagram illustrating the operation of sticking the heat-dissipating rubber pad to the contact piece according to the second embodiment of the present invention.

A: to be attached

A2: film layer

A4: Thermal pad

A41: Strip

A412: Input side

A413: Output side

E26: affixed pieces

E261: First side

E262: Second side

E263: Abutment Department

E264: Bottom edge

α1: acute angle

α2: acute angle

α3: acute angle

Claims (10)

A method for laminating a heat-dissipating rubber pad, comprising: Make the object to be attached to be conveyed in a conveying flow path; The heat dissipation rubber pads are arranged on a material belt at intervals; A laminating device is provided with the material strip and an abutting member, the material strip is wound around the abutting member and forms an input side and an output side with the abutting member as a boundary; Displace the abutting member toward the input side of the material tape, so that the heat dissipation rubber pad is completely covered on the upper surface of the object to be adhered to the other side in the process of simultaneous peeling and pasting from the material tape from one side to the other side . The method for laminating a heat-dissipating rubber pad according to claim 1, wherein the horizontal displacement of the abutting member toward the input side of the tape is caused by a deflection mechanism that deflects the abutting member and a roll on which the abutting member is disposed. The relative displacement of the belt mechanism is achieved. The method for laminating heat dissipation pads according to claim 1, wherein the object to be attached is a die that has been cut into individual pieces on the wafer, the object to be attached is located on a film layer, and the outer periphery of the film layer is Has a border. The method for laminating a heat-dissipating rubber pad according to claim 1, wherein the input side and the output side of the material tape form an acute angle less than ninety degrees. The method for laminating a heat-dissipating rubber pad according to claim 1, wherein the input side of the material tape and the surface of the object to be attached are input in an inclined manner, and the inclination angle is an acute angle less than ninety degrees. The method for attaching a heat-dissipating rubber pad according to claim 1, wherein the abutting member comprises a An inclined first side surface on the input side of the material tape, and a second side surface with an inclined shape close to the output side, and an abutting portion with an acute angle is formed at the intersection of the first side surface and the second side surface facing downward. , the abutting portion has an acute angle less than ninety degrees. The method for laminating a heat-dissipating rubber pad according to claim 1, wherein the material tape is bounded by the abutting member to form an input side and an output side, and the material tape is conveyed from the input side to a side of the abutting member. When a bottom edge of the abutting portion is turned to the output side, the heat dissipation rubber pad is peeled off from the material tape on the output side. The method for attaching a heat-dissipating rubber pad according to claim 7, wherein the peeled side of the heat-dissipating rubber pad is pressed against the upper surface of the object to be attached by the bottom edge in a line contact manner to be attached to the surface of the object to be attached. A heat-dissipating rubber pad laminating device is used to perform the method for laminating heat-dissipating rubber pads according to any one of claims 1 to 8. The device for laminating heat-dissipating rubber pads according to claim 9, which includes: a machine table is provided with: In the conveying flow path, a fixture is arranged in the conveying flow path, and the object to be attached can be conveyed by linear displacement in the conveying flow path or positioned above the fixture; a transfer mechanism, provided with an operating seat that can be displaced by the drive; The laminating device is arranged above the conveying flow path, and is located on the operating seat of the transferring mechanism, and can be driven for displacement.

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