TWI763001B - Signal transmission device capable of transmitting multiple data streams - Google Patents
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
- H04B1/1607—Supply circuits
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N21/00—Selective content distribution, e.g. interactive television or video on demand [VOD]
- H04N21/40—Client devices specifically adapted for the reception of or interaction with content, e.g. set-top-box [STB]; Operations thereof
- H04N21/43—Processing of content or additional data, e.g. demultiplexing additional data from a digital video stream; Elementary client operations, e.g. monitoring of home network or synchronising decoder's clock; Client middleware
- H04N21/436—Interfacing a local distribution network, e.g. communicating with another STB or one or more peripheral devices inside the home
- H04N21/4363—Adapting the video stream to a specific local network, e.g. a Bluetooth® network
- H04N21/43632—Adapting the video stream to a specific local network, e.g. a Bluetooth® network involving a wired protocol, e.g. IEEE 1394
- H04N21/43635—HDMI
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Abstract
Description
本發明是關於一種可傳輸複數組資料流之訊號傳輸裝置。The present invention relates to a signal transmission device capable of transmitting complex data streams.
隨著對影像播放畫面的品質要求越來越高,從原本的4K提升到8K解析度,因此從為訊號產生源(Signal Source)之播放機傳送到為訊號接收端(Signal Sink)之顯示器等所需的資料傳輸量也隨之增加。並且,由於家庭劇院的興起,常會需要使用更長的傳輸線來連接訊號產生源和訊號接收端,以滿足各種不同客廳擺置的需求。With the higher and higher requirements for the quality of video playback images, the resolution from the original 4K to 8K is upgraded from the player that is the signal source (Signal Source) to the monitor that is the signal sink (Signal Sink), etc. The amount of data transfer required also increases. Moreover, due to the rise of home theaters, it is often necessary to use longer transmission lines to connect the signal generating source and the signal receiving end to meet the needs of various living room arrangements.
目前的訊號傳輸裝置規範中,如果以接腳位置的定義來看,對於差分訊號所重視的接地屏蔽(Ground Shielding)並不是最佳的規劃方式,這使得在傳輸高速訊號時的訊號品質容易受到串擾(Crosstalk)和延遲(Delay)的影響,難以傳輸到較長的距離。In the current signal transmission device specification, considering the definition of the pin position, the ground shielding (Ground Shielding) that attaches importance to differential signals is not the best planning method, which makes the signal quality when transmitting high-speed signals vulnerable. The effects of crosstalk and delay make it difficult to transmit over longer distances.
在一些實施例中,一種訊號傳輸裝置包含複數正差動接腳、複數負差動接腳、複數接地接腳、複數電源訊號接腳及複數控制訊號接腳。複數正差動接腳中之第一正差動接腳用以傳輸第一差動訊號之正訊號分量,複數正差動接腳中之第二正差動接腳用以傳輸第二差動訊號之正訊號分量;複數負差動接腳中之第一負差動接腳用以傳輸第一差動訊號之負訊號分量,複數負差動接腳中之第二負差動接腳用以傳輸第二差動訊號之負訊號分量;其中,第一正差動接腳以及第一負差動接腳位於複數接地接腳中之第一接地接腳之一側,第二正差動接腳以及第二負差動接腳位於第一接地接腳之另一側。In some embodiments, a signal transmission device includes a plurality of positive differential pins, a plurality of negative differential pins, a plurality of ground pins, a plurality of power signal pins, and a plurality of control signal pins. The first positive differential pin of the plurality of positive differential pins is used to transmit the positive signal component of the first differential signal, and the second positive differential pin of the plurality of positive differential pins is used to transmit the second differential signal The positive signal component of the signal; the first negative differential pin of the plurality of negative differential pins is used to transmit the negative signal component of the first differential signal, and the second negative differential pin of the plurality of negative differential pins is used to transmit the negative signal component of the first differential signal. to transmit the negative signal component of the second differential signal; wherein, the first positive differential pin and the first negative differential pin are located on one side of the first ground pin among the plurality of ground pins, and the second positive differential pin The pin and the second negative differential pin are located on the other side of the first ground pin.
請參照圖1,圖1係為根據本案之訊號傳輸裝置之一實施例的示意圖。訊號傳輸裝置包含複數正差動接腳(Pin)、複數負差動接腳、複數控制訊號接腳、複數電源訊號接腳及複數接地接腳。其中,正差動接腳的數量、負差動接腳的數量、接地接腳的數量、電源訊號接腳的數量及控制訊號接腳的數量可根據不同產品需求(例如所需電流大小、訊號傳輸速率)進行客製化設計,圖1僅是示例出訊號傳輸裝置的其中一種實施例,本案並不以此為限。Please refer to FIG. 1 , which is a schematic diagram of an embodiment of a signal transmission device according to the present application. The signal transmission device includes a plurality of positive differential pins (Pin), a plurality of negative differential pins, a plurality of control signal pins, a plurality of power signal pins and a plurality of ground pins. Among them, the number of positive differential pins, the number of negative differential pins, the number of ground pins, the number of power signal pins and the number of control signal pins can be based on different product requirements (such as the required current, signal transmission rate) for customized design, FIG. 1 is only an example of one embodiment of the signal transmission device, and this case is not limited to this.
圖1示例複數正差動接腳111、121、131、141、複數負差動接腳112、122、132、142及對應前述各差動接腳111、112、121、122、131、132、141、142的複數接地接腳(GND)21-25。正差動接腳111、121、131、141及負差動接腳112、122、132、142分別傳輸差動訊號之正訊號分量及負訊號分量,在此先以正差動接腳111、121(為方便描述,分別稱為第一正差動接腳111及第二正差動接腳121)、負差動接腳112、122(分別稱為第一負差動接腳112及第二負差動接腳122)及對應的接地接腳21(以下稱為第一接地接腳21)為例說明。FIG. 1 illustrates a plurality of positive
第一正差動接腳111及第一負差動接腳112傳輸第一差動訊號,其中,第一正差動接腳111傳輸第一差動訊號的正訊號分量,第一負差動接腳112傳輸第一差動訊號的負訊號分量;第二正差動接腳121及第二負差動接腳122傳輸有別於第一差動訊號之另一差動訊號(以下稱為第二差動訊號),第二正差動接腳121傳輸第二差動訊號的正訊號分量,第二負差動接腳122傳輸第二差動訊號的負訊號分量。在配置上,第一正差動接腳111以及第一負差動接腳112位於第一接地接腳21之一側(即,傳輸相同差動訊號的兩差動接腳111、112係位於第一接地接腳21之同一側),第二正差動接腳121以及第二負差動接腳122位於第一接地接腳21之另一側(即,傳輸相同差動訊號的兩差動接腳121、122係位於第一接地接腳21之同一側),也就是傳輸不同差動訊號的兩差動接腳111、122係位於第一接地接腳21之不同一側。The first positive
再者,圖1示例四個電源訊號接腳31-34以及複數控制訊號接腳。電源訊號接腳31-34可傳輸符合特定通訊規格之電源訊號,控制訊號接腳可傳輸符合特定通訊規格之控制訊號,換言之,訊號傳輸裝置除了可傳輸差動訊號之外亦可傳輸供電子裝置運作之電源訊號及控制訊號,並符合特定之通訊規格。基此,有別於習知的訊號傳輸裝置,本案之訊號傳輸裝置可在傳輸第一差動訊號及第二差動訊號時避免不同差動訊號之間的串擾(crosstalk),並得到更好的阻抗匹配特性,因此提升訊號傳輸裝置的傳輸品質,可更有效率地傳輸訊號至電子裝置。Furthermore, FIG. 1 illustrates four power signal pins 31-34 and a plurality of control signal pins. The power signal pins 31-34 can transmit power signals conforming to specific communication specifications, and the control signal pins can transmit control signals conforming to specific communication specifications. The operating power signal and control signal conform to specific communication specifications. Based on this, different from the conventional signal transmission device, the signal transmission device of the present application can avoid crosstalk between different differential signals when transmitting the first differential signal and the second differential signal, and achieve better results. Therefore, the transmission quality of the signal transmission device is improved, and the signal can be transmitted to the electronic device more efficiently.
在一些實施例中,如圖1所示,訊號傳輸裝置可傳輸至少四對差動訊號,第三正差動接腳131及第三負差動接腳132可傳輸第三差動訊號,第三正差動接腳131傳輸第三差動訊號的正訊號分量,第三負差動接腳132傳輸第三差動訊號的負訊號分量,第四正差動接腳141及第四負差動接腳142可傳輸第四差動訊號,第四正差動接腳141傳輸第四差動訊號的正訊號分量,第四負差動接腳142傳輸第四差動訊號的負訊號分量。為使前述之四對差動訊號之間不相互干擾,如圖1所示,訊號傳輸裝置之複數接地接腳為第一接地接腳21、第二接地接腳22、第三接地接腳23、第四接地接腳24及第五接地接腳25。第二正差動接腳121及第二負差動接腳122位於第一接地接腳21及第四接地接腳24之間,即第二正差動接腳121及第二負差動接腳122位於第四接地接腳24之一側,第三正差動接腳131及第三負差動接腳132位於第四接地接腳24之另一側;第三正差動接腳131及第三負差動接腳132位於第四接地接腳24及第五接地接腳25之間,即第三正差動接腳131及第三負差動接腳132位於第五接地接腳25之一側,第四正差動接腳141以及第四負差動接腳142位於第五接地接腳25之另一側。基此,第二正差動接腳121與第三負差動接腳132之間受第四接地接腳24屏蔽,第三正差動接腳131與第四負差動接腳142之間受第五接地接腳25屏蔽,第一差動訊號、第二差動訊號、第三差動訊號及第四差動訊號之間不相互干擾。In some embodiments, as shown in FIG. 1 , the signal transmission device can transmit at least four pairs of differential signals, the third positive
在一些實施例中,複數正差動接腳111、121、131、141及複數負差動接腳112、122、132、142係沿著同一直線方向D1(例如,訊號傳輸裝置的長度方向)排列,訊號傳輸裝置可更容易地相容於現有的通訊傳輸規格。In some embodiments, the plurality of positive
在一些實施例中,請參照圖2,圖2為圖1之訊號傳輸裝置之另一實施例的示意圖,訊號傳輸裝置亦可包含八對差動接腳,且傳輸相同差動訊號之每一對差動接腳係受兩接地接腳所屏蔽。訊號傳輸裝置更包含正差動接腳171、181、191、101(以下分別稱為第七正差動接腳171、第八正差動接腳181、第九正差動接腳191及第十正差動接腳101)、負差動接腳172、182、192、102(以下分別稱為第七負差動接腳172、第八負差動接腳182、第九負差動接腳192及第十負差動接腳102)以及對應的接地接腳26、27、28、29。正差動接腳171、181、191、101及負差動接腳172、182、192、102亦沿著同一直線方向D1排列。第七正差動接腳171及第七負差動接腳172可傳輸第七差動訊號,第七正差動接腳171傳輸第七差動訊號的正訊號分量,第七負差動接腳172傳輸第七差動訊號的負訊號分量。第八正差動接腳181及第八負差動接腳182可傳輸第八差動訊號,第八正差動接腳181傳輸第八差動訊號的正訊號分量,第八負差動接腳182傳輸第八差動訊號的負訊號分量。第九正差動接腳191及第九負差動接腳192可傳輸第九差動訊號,第九正差動接腳191傳輸第九差動訊號的正訊號分量,第九負差動接腳192傳輸第九差動訊號的負訊號分量。第十正差動接腳101及第十負差動接腳102可傳輸第十差動訊號,第十正差動接腳101傳輸第十差動訊號的正訊號分量,第十負差動接腳102傳輸第十差動訊號的負訊號分量。In some embodiments, please refer to FIG. 2 , which is a schematic diagram of another embodiment of the signal transmission device of FIG. 1 . The signal transmission device may also include eight pairs of differential pins, each of which transmits the same differential signal. The differential pins are shielded by two ground pins. The signal transmission device further includes positive
為使前述之八個差動訊號之間不相互干擾,如圖2所示,第四正差動接腳141及第四負差動接腳142位於第五接地接腳25及第六接地接腳26之間,即第四正差動接腳141及第四負差動接腳142位於第六接地接腳26之一側,第七正差動接腳171及第七負差動接腳172位於第六接地接腳26之另一側;第七正差動接腳171及第七負差動接腳172位於第六接地接腳26及第七接地接腳27之間,即第七正差動接腳171及第七負差動接腳172位於第七接地接腳27之一側,第八正差動接腳181及第八負差動接腳182位於第七接地接腳27之另一側;第八正差動接腳181及第八負差動接腳182位於第七接地接腳27及第八接地接腳28之間,即第八正差動接腳181及第八負差動接腳182位於第八接地接腳28之一側,第九正差動接腳191及第九負差動接腳192位於第八接地接腳28之另一側;第九正差動接腳191及第九負差動接腳192位於第八接地接腳28及第九接地接腳29之間,即第九正差動接腳191及第九負差動接腳192位於第九接地接腳29之一側,第十正差動接腳101及第十負差動接腳102位於第九接地接腳29之另一側。基此,第四正差動接腳141與第七負差動接腳172之間受第六接地接腳26屏蔽,第七正差動接腳171與第八負差動接腳182之間受第七接地接腳27屏蔽,第八正差動接腳181與第九負差動接腳192之間受第八接地接腳28屏蔽,第九正差動接腳191與第十負差動接腳102之間受第九接地接腳29屏蔽,第一差動訊號、第二差動訊號、第三差動訊號、第四差動訊號、第七差動訊號、第八差動訊號、第九差動訊號及第十差動訊號之間不相互干擾。基此,訊號傳輸裝置可傳輸至少八對差動訊號,且八對差動接腳係沿著同一直線方向D1排列,訊號傳輸裝置可更容易地相容於現有的通訊傳輸規格。In order to prevent the aforementioned eight differential signals from interfering with each other, as shown in FIG. 2 , the fourth positive
在一些實施例中,如圖1及圖2所示,複數接地接腳中之第三接地接腳23之其中一側(即,遠離第一負差動接腳112之一側)未設置有正差動接腳及負差動接腳而可設置有電源訊號接腳31、32,且第三接地接腳23之其中另一側為第一正差動接腳111及第一負差動接腳112,即第一正差動接腳111以及第一負差動接腳112位於第一接地接腳21與第三接地接腳23之間,第一正差動接腳111以及第一負差動接腳112受兩接地接腳21、23屏蔽,接地接腳21、23可共同提供第一差動訊號接地。基此,第三接地接腳23之設置將第一正差動接腳111及第一負差動接腳112分隔於複數電源訊號接腳31、32,如此可防止第一正差動接腳111及第一負差動接腳112在傳輸第一差動訊號時受到電源訊號干擾而導致第一差動訊號之傳輸品質下降的情況。In some embodiments, as shown in FIG. 1 and FIG. 2 , one side of the
在一些實施例中,如圖2所示,第二接地接腳22係位於訊號傳輸裝置之最邊緣位置,也就是第二接地接腳22於直線方向D1上的其中一側未設置有正差動接腳及負差動接腳,第二接地接腳22於直線方向D1上的其中另一側為第十正差動接腳101及第十負差動接腳102。即第十正差動接腳101及第十負差動接腳102位於第九接地接腳29與第二接地接腳22之間,第十正差動接腳101及第十負差動接腳102受兩接地接腳29、22屏蔽,也就是接地接腳29、22可共同提供第十差動訊號接地。基此,可進一步避免第十正差動接腳101及第十負差動接腳102在傳輸第十差動訊號時受到訊號傳輸裝置外之雜訊干擾而導致第十差動訊號之傳輸品質下降的情況。In some embodiments, as shown in FIG. 2 , the
在一些實施例中,如圖2所示,訊號傳輸裝置之複數差動接腳亦包含為兩個正差動接腳151、161及兩個負差動接腳152、162(以下將正差動接腳151、161分別稱為第一正差動高速接腳151及第二正差動高速接腳161,並將負差動接腳152、162分別稱為第一負差動高速接腳152及第二負差動高速接腳162),並且,訊號傳輸裝置之複數接地接腳亦包含第十接地接腳20。第一正差動高速接腳151用以傳輸第五差動訊號之正訊號分量,第一負差動高速接腳152用以傳輸第五差動訊號之負訊號分量;第二正差動高速接腳161用以傳輸第六差動訊號之正訊號分量,第二負差動高速接腳162用以傳輸第六差動訊號之負訊號分量。在配置上,第一正差動高速接腳151以及第一負差動高速接腳152位於第十接地接腳20之一側,第二正差動高速接腳161及第二負差動高速接腳162位於第十接地接腳20之另一側,正差動高速接腳151、161、第十接地接腳20及負差動高速接腳152、162係沿著同一直線方向D1排列。In some embodiments, as shown in FIG. 2 , the plurality of differential pins of the signal transmission device also include two positive
在一些實施例中,訊號傳輸裝置之複數正差動接腳及複數負差動接腳為傳輸高速資料訊號,例如,差動接腳111、112傳輸之第一差動訊號、差動接腳121、122傳輸之第二差動訊號、差動接腳131、132傳輸之第三差動訊號、差動接腳141、142傳輸之第四差動訊號、差動接腳171、172傳輸之第七差動訊號、差動接腳181、182傳輸之第八差動訊號、差動接腳191、192傳輸之第九差動訊號、差動接腳101、102傳輸之第十差動訊號、差動高速接腳151、152傳輸之第五差動訊號及差動高速接腳161、162傳輸之第六差動訊號皆為高速資料訊號。並且,如圖1及圖2所示,訊號傳輸裝置更可包含傳輸低速資料訊號之正差動低速接腳51及負差動低速接腳52,且正差動低速接腳51及負差動低速接腳52與差動高速接腳151、152、161、162係沿著同一直線方向D1排列。正差動低速接腳51及負差動低速接腳52傳輸為低速資料之低速差動訊號,正差動低速接腳51傳輸低速差動訊號的正訊號分量,負差動低速接腳52傳輸低速差動訊號的負訊號分量。基此,訊號傳輸裝置可同時支援高速資料訊號及低速資料訊號之傳輸。In some embodiments, the plurality of positive differential pins and the plurality of negative differential pins of the signal transmission device are used to transmit high-speed data signals. For example, the
在一些實施例中,圖1至圖2示例之訊號傳輸裝置可支援通用序列匯流排(Universal Serial Bus;USB)2.0之規格,正差動低速接腳51、負差動低速接腳52適用於USB2.0之規格,正差動低速接腳51及負差動低速接腳52傳輸之低速差動訊號為USB2.0之USB訊號,正差動低速接腳51可傳輸USB-DP訊號,負差動低速接腳52可傳輸USB-DM訊號。再者,圖2示例之訊號傳輸裝置亦可支援各種採用差動傳輸方式之規格,訊號傳輸裝置中為傳輸高速資料訊號之複數正差動接腳、複數負差動接腳中(即,差動接腳111、112、121、122、131、132、141、142、171、172、181、182、191、192、101、102及差動高速接腳151、152、161、162)之任兩對差動接腳可傳輸符合USB 2.0或PCIe 1.0以及更新版本規格,或是其他採用差動傳輸方式之高速資料收發訊號。In some embodiments, the signal transmission device shown in FIGS. 1 to 2 can support the Universal Serial Bus (USB) 2.0 specification, and the positive differential low-speed pins 51 and the negative differential low-
在一些實施例中,圖1至圖2示例之訊號傳輸裝置亦可支援PCIe介面之規格,其中,正差動低速接腳51、負差動低速接腳52、第一正差動高速接腳151、第一負差動高速接腳152、第二正差動高速接腳161及第二負差動高速接腳162亦可適用於PCIe介面之傳輸,且正差動低速接腳51、負差動低速接腳52可傳輸符合PCIe介面規格之時脈訊號(可包含正時脈分量與負時脈分量)。In some embodiments, the signal transmission device shown in FIG. 1 to FIG. 2 can also support PCIe interface specifications, wherein the positive differential low-speed pin 51 , the negative differential low-
在一些實施例中,訊號傳輸裝置可支援高畫質多媒體介面(High Definition Multimedia Interface;HDMI),如圖1及圖2所示,前述複數控制訊號接腳可為複數SCL接腳、複數SDA接腳及熱插拔偵測(Hot Plug Detection)接腳411或選自前述項目所形成之組合。複數SCL接腳即為用以傳輸SCL(Serial Clock)訊號之SCL/PCIE_WAKE_N接腳414及REALONE_SCL接腳419;複數SDA接腳即為用以傳輸SDA(Serial Data)訊號之SDA/PCIE_PERST_N接腳412及REALONE_SDA接腳420。SCL接腳及SDA接腳可用於訊號產生源(例如Digital Video Disc,即DVD)裝置和訊號接收端(例如television,即TV)裝置之間的溝通,來源裝置透過SCL接腳及SDA接腳讀取播放裝置所支援的解析度,使來源裝置顯示符合播放裝置之解析度的影像畫面。並且,正差動接腳111、121、131、141、171、181、191、101及負差動接腳112、122、132、142、172、182、192、102中之四對差動接腳共可傳輸三對最小化傳輸差分訊號(Transition Minimized Differential Signaling;TMDS)及一對適於HDMI規格之時脈訊號,以支援HDMI訊號之傳輸。In some embodiments, the signal transmission device can support High Definition Multimedia Interface (HDMI), as shown in FIG. 1 and FIG. 2 , the plurality of control signal pins may be a plurality of SCL pins, a plurality of SDA pins The pin and the hot plug detection (Hot Plug Detection)
在一些實施例中,訊號傳輸裝置之複數控制訊號接腳可為ARC(Audio Return Channel)/SPDIF接腳415、CLK(AUDIO-SYNC clock)接腳413、複數適於序列周邊介面(SPI)之接腳或選自前述項目所形成之組合,以在電子裝置之間傳輸語音視訊相關之控制訊號,其中,複數適於SPI之接腳包含SPI_DI接腳416、SPI_CS接腳417、SPI_WP_PWM接腳421、SPI_DO接腳423、SPI_HOLD_PWM接腳422及SPI_CLK接腳418。In some embodiments, the plurality of control signal pins of the signal transmission device may be the ARC (Audio Return Channel)/
在一些實施例中,訊號傳輸裝置之複數控制訊號接腳中之一可為系統主電源接腳410,系統主電源接腳410為傳輸用以開啟或關閉外接裝置是否提供電源的控制訊號(或稱為致能訊號),舉例來說,訊號傳輸裝置可連接在筆記型電腦與平板電腦之間,平板電腦可視為筆記型電腦之外接裝置,且平板電腦具有可供電給筆記型電腦之供電功能,系統主電源接腳410可為傳輸開啟或關閉前述供電功能之控制訊號。在配置上,系統主電源接腳410位於正差動低速接腳51、負差動低速接腳52與第一正差動高速接腳151、第一負差動高速接腳152、第二正差動高速接腳161、第二負差動高速接腳162之間,以隔離低速資料訊號與高速資料訊號之傳輸。在一些實施例中,前述複數控制訊號接腳係沿著同一直線方向D1排列。In some embodiments, one of the plurality of control signal pins of the signal transmission device may be the system
在一些實施例中,電源訊號接腳31-34可為複數低壓電源接腳及複數高壓電源接腳,其中,電源訊號接腳31、32為低壓電源接腳,即HV-POWER電源接腳,電源訊號接腳31、32供應與HV相關的低壓電源訊號,其電壓可為12伏特(V);電源訊號接腳33、34為高壓電源接腳,即UHV-POWER電源接腳,電源訊號接腳33、34供應與UHV相關的高壓電源訊號,其電壓可為350V。在一些實施例中,複數低壓電源接腳及複數高壓電源接腳之數量可根據訊號傳輸裝置實際導通電流大小與差動訊號傳輸速率作調整。In some embodiments, the power signal pins 31-34 can be a plurality of low-voltage power pins and a plurality of high-voltage power pins, wherein, the power signal pins 31 and 32 are low-voltage power pins, namely HV-POWER power pins, The power signal pins 31 and 32 supply low-voltage power signals related to HV, and the voltage can be 12 volts (V). The power signal pins 33 and 34 are high-voltage power pins, namely UHV-
在一些實施例中,如圖1及圖2所示,訊號傳輸裝置之複數接地接腳可提供電源訊號接地,也就是說,複數接地接腳中之電源接地接腳61、62可提供為高壓電源接腳之電源訊號接腳33、34接地使用,前述電源訊號接腳33、34、電源接地接腳61、62係沿著同一直線方向D1排列。再者,訊號傳輸裝置更包含絕緣層I,絕緣層I位於電源訊號接腳33、34與複數接地接腳中供電源訊號接腳33、34接地之電源接地接腳61、62之間,也就是說,為UHV-POWER接腳之電源訊號接腳33、34位於絕緣層I之一側,電源接地接腳61、62位於絕緣層I之另一側。因此,於電源訊號接腳33、34與電源接地接腳61、62之間設置絕緣層I可防止因跨壓太大而導致電弧或訊號傳輸裝置損壞。In some embodiments, as shown in FIG. 1 and FIG. 2 , the plurality of ground pins of the signal transmission device can provide power signal grounding, that is, the power ground pins 61 and 62 of the plurality of ground pins can be provided as high voltage The power signal pins 33 and 34 of the power pins are used for grounding. The aforementioned power signal pins 33 and 34 and the power ground pins 61 and 62 are arranged along the same linear direction D1. Furthermore, the signal transmission device further includes an insulating layer I, and the insulating layer I is located between the power signal pins 33, 34 and the power ground pins 61, 62 of the plurality of ground pins for the power supply signal pins 33, 34 to be grounded. That is to say, the power signal pins 33 and 34 which are UHV-POWER pins are located on one side of the insulating layer I, and the power ground pins 61 and 62 are located on the other side of the insulating layer I. Therefore, disposing the insulating layer I between the power signal pins 33, 34 and the power ground pins 61, 62 can prevent arcing or damage to the signal transmission device due to excessive voltage across.
在一些實施例中,請參照圖1及圖2,訊號傳輸裝置設置一金屬隔離層M作為電氣結構與物理結構(訊號傳輸裝置之複數接腳之間)的隔離。詳細而言,如圖1、圖2所示,電源訊號接腳31、32、正差動接腳111、121、131、141、171、181、191、101及負差動接腳112、122、132、142、172、182、192、102以及接地接腳21、22、23、24、25、26、27、28、29位於金屬隔離層M於方向D2上之一側;正差動低速接腳51、負差動低速接腳52、第一正差動高速接腳151、第一負差動高速接腳152、第十接地接腳20、第二正差動高速接腳161、第二負差動高速接腳162、複數控制訊號接腳、電源訊號接腳33、34、電源接地接腳61、電源接地接腳62及絕緣層I位於金屬隔離層M於方向D2上之另一側,且方向D2垂直於方向D1(例如,方向D2可為訊號傳輸裝置的長度方向),換言之,正差動接腳111、121、131、141、171、181、191、101、負差動接腳112、122、132、142、172、182、192、102與正差動低速接腳51、負差動低速接腳52之間係藉由金屬隔離層M沿著方向D2並列地排列;正差動接腳111、121、131、141、171、181、191、101、負差動接腳112、122、132、142、172、182、192、102與第一正差動高速接腳151、第一負差動高速接腳152、第二正差動高速接腳161、第二負差動高速接腳162之間係藉由金屬隔離層M沿著方向D2並列地排列;正差動接腳111、121、131、141、171、181、191、101、負差動接腳112、122、132、142、172、182、192、102與複數控制訊號接腳之間係藉由金屬隔離層M沿著方向D2並列地排列;電源訊號接腳31、32與電源訊號接腳33、34之間係藉由該金屬隔離層M沿著方向D2並列地排列。在一些實施例中,金屬隔離層M可為鐵片,並且可提供訊號接地。基此,金屬隔離層M可使兩側之接腳之間不相互干擾,且提供良好之參考接地平面以強化信號品質和阻抗匹配特性,雙排並列的接腳也可縮小訊號傳輸裝置之尺寸並提升生產之便利性。In some embodiments, please refer to FIG. 1 and FIG. 2 , the signal transmission device is provided with a metal isolation layer M as the isolation between the electrical structure and the physical structure (between a plurality of pins of the signal transmission device). In detail, as shown in FIG. 1 and FIG. 2 , the power signal pins 31 , 32 , the positive differential pins 111 , 121 , 131 , 141 , 171 , 181 , 191 , 101 and the negative differential pins 112 , 122 , 132, 142, 172, 182, 192, 102 and ground pins 21, 22, 23, 24, 25, 26, 27, 28, 29 are located on one side of the metal isolation layer M in the direction D2; positive differential low speed Pin 51, Negative Differential Low Speed Pin 52, First Positive Differential High Speed Pin 151, First Negative Differential High Speed Pin 152, Tenth Ground Pin 20, Second Positive Differential High Speed Pin 161, The two negative differential high-speed pins 162, the plurality of control signal pins, the power signal pins 33, 34, the power ground pins 61, the power ground pins 62 and the insulating layer I are located on the other side of the metal isolation layer M in the direction D2 side, and the direction D2 is perpendicular to the direction D1 (for example, the direction D2 can be the length direction of the signal transmission device), in other words, the positive differential pins 111, 121, 131, 141, 171, 181, 191, 101, the negative differential The pins 112, 122, 132, 142, 172, 182, 192, 102, the positive differential low-speed pins 51 and the negative differential low-speed pins 52 are arranged in parallel along the direction D2 through the metal isolation layer M; Positive differential pins 111, 121, 131, 141, 171, 181, 191, 101, negative differential pins 112, 122, 132, 142, 172, 182, 192, 102 and first positive differential high-speed pins 151. The first negative differential high-speed pin 152, the second positive differential high-
在一些實施例中,請參照圖1、圖2及圖3,訊號傳輸裝置之全部接腳可由芯線(line)線材繞線而成,並且其排列方式可為排列於同一直線方向上。舉例來說,如圖3所示,線材G1可為有接地接腳做遮蔽的雙絞線、線材G2可為沒有接地接腳做遮蔽的雙絞線、線材G3可為細的單芯線及線材G4可為粗的單芯線,訊號傳輸裝置之全部接腳可分別捆束為線材G1、線材G2、線材G3、線材G4而排列在同一直線方向上。在另一些實施例中,如圖4所示,線材G1-G4亦可為包覆為圓環狀之一束繞線,也就是線材G1、線材G2、線材G3、線材G4可不排列於同一直線方向上。In some embodiments, please refer to FIG. 1 , FIG. 2 and FIG. 3 , all the pins of the signal transmission device can be formed by winding a core wire, and their arrangement can be arranged in the same linear direction. For example, as shown in FIG. 3 , the wire G1 can be a twisted pair with a grounding pin as a shield, the wire G2 can be a twisted pair without a grounding pin as a shield, and the wire G3 can be a thin single-core wire and a wire G4 can be a thick single-core wire, and all the pins of the signal transmission device can be bundled into wire G1, wire G2, wire G3, and wire G4 respectively and arranged in the same straight direction. In other embodiments, as shown in FIG. 4 , the wires G1-G4 can also be a bundle of wires wrapped in a ring shape, that is, the wires G1, G2, G3, and G4 may not be arranged in the same straight line direction.
在一些實施例中,訊號傳輸裝置包含一殼體。訊號傳輸裝置可設計為公接頭或是母接頭中之其中一種,公接頭與母接頭係相互對應,作為公接頭之訊號傳輸裝置與作為母接頭之訊號傳輸裝置可相連接。請參照圖5A至圖5D,圖5A及圖5B分別為母接頭及公接頭之實施例,圖5C為圖5A中訊號傳輸裝置之一側SA之側視示意圖、圖5D為圖5B中訊號傳輸裝置之一側SB之側視示意圖。如圖5C及圖5D所示,A端及A’端設計為斜切角,B端及B’端亦設計為斜切角,因此,分別為母接頭及公接頭之兩訊號傳輸裝置可根據A端對A’端及B端對B’端而相互連接,斜切角可做為防止公接頭與母接頭連接錯誤之防呆機制。在另一些實施例中,殼體包含一斜切角及一直角,且斜切角及直角分別位於殼體之兩側。請參照圖6A、圖6B,圖6A為作為母接頭之訊號傳輸裝置之另一示意圖、圖6B為作為公接頭之訊號傳輸裝置之另一示意圖。如圖6A、圖6B所示,C端及C’端設計為直角,D端及D’端設計為斜切角,因此,分別為母接頭及公接頭之兩訊號傳輸裝置可根據C端對C’端及D端對D’端而相互連接。在另一些實施例中,請參照圖7A、圖7B,圖7A為作為母接頭之訊號傳輸裝置之另一示意圖、圖7B為作為公接頭之訊號傳輸裝置之另一示意圖。如圖7A、圖7B所示,E端及E’端設計為斜切角,F端及F’端設計為直角,因此,分別為母接頭及公接頭之兩訊號傳輸裝置可根據E端對E’端及F端對F’端而相互連接。基此,訊號傳輸裝置根據接頭為不同的斜切角形式,可提供不同產品上的訊號傳輸裝置組合並對訊號傳輸裝置接頭進行區隔,以防止公接頭與母接頭之間誤連接的可能。In some embodiments, the signal transmission device includes a housing. The signal transmission device can be designed as one of a male connector or a female connector. The male connector and the female connector correspond to each other, and the signal transmission device as the male connector and the signal transmission device as the female connector can be connected. Please refer to FIGS. 5A to 5D. FIGS. 5A and 5B are embodiments of a female connector and a male connector, respectively. FIG. 5C is a schematic side view of one side SA of the signal transmission device in FIG. 5A, and FIG. 5D is the signal transmission in FIG. 5B. A schematic side view of one side SB of the device. As shown in FIG. 5C and FIG. 5D , the ends A and A' are designed as chamfered corners, and the ends B and B' are also designed as chamfered corners. Therefore, the two signal transmission devices, which are the female connector and the male connector respectively, can be designed according to the The A end is connected to the A' end and the B end is connected to the B' end, and the chamfered angle can be used as a foolproof mechanism to prevent the wrong connection between the male connector and the female connector. In other embodiments, the casing includes a chamfered corner and a right angle, and the chamfered corner and the right angle are located on two sides of the casing, respectively. Please refer to FIGS. 6A and 6B. FIG. 6A is another schematic view of the signal transmission device as a female connector, and FIG. 6B is another schematic view of the signal transmission device as a male connector. As shown in FIG. 6A and FIG. 6B , the C end and the C' end are designed as right angles, and the D end and D' end are designed as chamfered angles. Therefore, the two signal transmission devices, which are the female connector and the male connector respectively, can be paired according to the C end. The C' end and the D end are connected to the D' end. In other embodiments, please refer to FIGS. 7A and 7B , FIG. 7A is another schematic diagram of the signal transmission device as a female connector, and FIG. 7B is another schematic view of the signal transmission device as a male connector. As shown in FIG. 7A and FIG. 7B , the E and E' ends are designed as chamfered angles, and the F and F' ends are designed as right angles. Therefore, the two signal transmission devices, which are the female connector and the male connector, can be paired according to the E end. The E' end and the F end are connected to each other with respect to the F' end. Based on this, the signal transmission device can provide a combination of signal transmission devices on different products and separate the signal transmission device connectors according to the different chamfered angles of the connectors, so as to prevent the possibility of misconnection between the male connector and the female connector.
在一些實施例中,請參照圖8,圖8示例一傳輸線以及適於傳輸線之電子裝置N。傳輸線包含訊號傳輸裝置P、Q及連接部L,訊號傳輸裝置P、Q設置於傳輸線之兩端,以連接部L連接於訊號傳輸裝置P及訊號傳輸裝置Q之間。電子裝置N包含對應傳輸線之訊號傳輸裝置P、Q之訊號傳輸裝置R。由於訊號傳輸裝置P、Q、R分別被設計為公接頭或是母接頭中之其中一種,公接頭可與母接頭相連接,因此,訊號傳輸裝置P或訊號傳輸裝置Q可與電子裝置N之訊號傳輸裝置R連接,電子裝置N可為筆記型電腦、手機、平板、顯示器或其他視音相關裝置。舉例來說,當為公接頭之訊號傳輸裝置Q與為母接頭之訊號傳輸裝置R連接,且為母接頭之訊號傳輸裝置P連接於另一台電子裝置之為公接頭之訊號傳輸裝置時,另一台電子裝置可發送訊號自傳輸線之訊號傳輸裝置P經由連接部L,再經由訊號傳輸裝置Q及訊號傳輸裝置R傳輸至電子裝置N。In some embodiments, please refer to FIG. 8 , which illustrates a transmission line and an electronic device N suitable for the transmission line. The transmission line includes signal transmission devices P and Q and a connecting part L. The signal transmission devices P and Q are arranged at both ends of the transmission line, and the connecting part L is connected between the signal transmission device P and the signal transmission device Q. The electronic device N includes a signal transmission device R corresponding to the signal transmission devices P and Q of the transmission line. Since the signal transmission devices P, Q, and R are respectively designed as one of a male connector or a female connector, the male connector can be connected with the female connector. Therefore, the signal transmission device P or the signal transmission device Q can be connected with the electronic device N. The signal transmission device R is connected, and the electronic device N can be a notebook computer, a mobile phone, a tablet, a monitor or other audio-visual related devices. For example, when the signal transmission device Q which is the male connector is connected to the signal transmission device R which is the female connector, and the signal transmission device P which is the female connector is connected to the signal transmission device which is the male connector of another electronic device, Another electronic device can send a signal from the signal transmission device P of the transmission line to the electronic device N through the connection part L, and then through the signal transmission device Q and the signal transmission device R.
在一些實施例中,以絕緣層I不設計為接腳形式而使接腳總數量為52為例,如圖2所示(由上而下且由左而右),第1、4、7、10、13、16、19、22、25、33、49、50接腳為GND;第2、3、5、6、8、9、11、12、14、15、17、18、20、21、23、24接腳分別為P3_RTK1_P、P3_RTK1_M、P3_RTK0_P、P3_RTK0_M、P2_RTK1_P、P2_RTK1_M、P2_RTK0_P、P2_RTK0_M、P1_RTK1_P、P1_RTK1_M、P1_RTK0_P、P1_RTK0_M、P0_RTK1_P、P0_RTK1_M、P0_RTK0_P、P0_RTK0_M;第26、27接腳為HV_POWER;第51、52接腳為UHV_POWER;第28-32、34-48接腳分別為USB_DM/REFCLK_M_PCIE、USB_DP/REFCLK_P_PCIE、SYSTEM_MAIN_POWER_EN、USB_SSRX_M/PCIE_HSIN、USB_SSRX_P/PCIE_HSIP、USB_SSTX_M/PCIE_HSON、USB_SSTX_P/PCIE_HSOP、HOT_PLUG_DETECT、SDA/PCIE_PERST_N、AUDIO_SYNC_CLK、SCL/PCIE_WAKE_N、ARC/SPDIF、SPI_DI、SPI_CS、SPI_CLK、REALONE_SCL、REALONE_SDA、SPI_WP_PWM、SPI_HOLD_PWM、SPI_DO。其中,第1根接腳及第28根接腳的外側為面板(Panel)端。In some embodiments, the insulating layer I is not designed in the form of pins and the total number of pins is 52 as an example, as shown in FIG. 2 (from top to bottom and from left to right), the first, fourth, and seventh , 10, 13, 16, 19, 22, 25, 33, 49, 50 pins are GND; 21、23、24接腳分別為P3_RTK1_P、P3_RTK1_M、P3_RTK0_P、P3_RTK0_M、P2_RTK1_P、P2_RTK1_M、P2_RTK0_P、P2_RTK0_M、P1_RTK1_P、P1_RTK1_M、P1_RTK0_P、P1_RTK0_M、P0_RTK1_P、P0_RTK1_M、P0_RTK0_P、P0_RTK0_M;第26、27接腳為HV_POWER; Pins 51 and 52 are UHV_POWER; pins 28-32 and 34-48 are USB_DM/REFCLK_M_PCIE, USB_DP/REFCLK_P_PCIE, SYSTEM_MAIN_POWER_EN, USB_SSRX_M/PCIE_HSIN, USB_SSRX_P/PCIE_HSIP, USB_SSTX_M/PCIE_HSON, USB_SSTX_P/PCIE_HSOP, HOT_PLUG_DETECT, SDA /PCIE_PERST_N, AUDIO_SYNC_CLK, SCL/PCIE_WAKE_N, ARC/SPDIF, SPI_DI, SPI_CS, SPI_CLK, REALONE_SCL, REALONE_SDA, SPI_WP_PWM, SPI_HOLD_PWM, SPI_DO. Among them, the outer side of the first pin and the 28th pin is the panel end.
在一些實施例中,以絕緣層I不設計為接腳形式而使接腳總數量為52為例,如圖9所示(由上而下且由左而右),第1、4、7、10、13、16、19、22、25、33、49、50接腳為GND;第2、3、5、6、8、9、11、12、14、15、17、18、20、21、23、24接腳分別為P0_RTK0_M、P0_RTK0_P、P0_RTK1_M、P0_RTK1_P、P1_RTK0_M、P1_RTK0_P、P1_RTK1_M、P1_RTK1_P、P2_RTK0_M、P2_RTK0_P、P2_RTK1_M、P2_RTK1_P、P3_RTK0_M、P3_RTK0_P、P3_RTK1_M、P3_RTK1_P;第26、27接腳為HV_POWER;第51、52接腳為UHV_POWER;第28-32、34-48接腳分別為USB_DP/REFCLK_P_PCIE、USB_DM/REFCLK_M_PCIE、SYSTEM_MAIN_POWER_EN、USB_SSTX_P/PCIE_HSIP、USB_SSTX_M/PCIE_HSIN、USB_SSRX_P/PCIE_HSOP、USB_SSRX_M/PCIE_HSON、HOT_PLUG_DETECT、SDA/PCIE_PERST_N、AUDIO_SYNC_CLK、SCL/PCIE_WAKE_N、ARC/SPDIF、SPI_DI、SPI_CS、SPI_CLK、REALONE_SCL、REALONE_SDA、SPI_WP_PWM、SPI_HOLD_PWM、SPI_DO。其中,第1根接腳及第28根接腳的外側為系統單晶片(SOC)端。In some embodiments, the insulating layer I is not designed in the form of pins and the total number of pins is 52 as an example, as shown in FIG. 9 (from top to bottom and from left to right), the first, fourth, and seventh , 10, 13, 16, 19, 22, 25, 33, 49, 50 pins are GND; 21、23、24接腳分別為P0_RTK0_M、P0_RTK0_P、P0_RTK1_M、P0_RTK1_P、P1_RTK0_M、P1_RTK0_P、P1_RTK1_M、P1_RTK1_P、P2_RTK0_M、P2_RTK0_P、P2_RTK1_M、P2_RTK1_P、P3_RTK0_M、P3_RTK0_P、P3_RTK1_M、P3_RTK1_P;第26、27接腳為HV_POWER; Pins 51 and 52 are UHV_POWER; pins 28-32 and 34-48 are USB_DP/REFCLK_P_PCIE, USB_DM/REFCLK_M_PCIE, SYSTEM_MAIN_POWER_EN, USB_SSTX_P/PCIE_HSIP, USB_SSTX_M/PCIE_HSIN, USB_SSRX_P/PCIE_HSOP, USB_SSRX_M/PCIE_HSON, HOT_PLUG_DETECT, SDA /PCIE_PERST_N, AUDIO_SYNC_CLK, SCL/PCIE_WAKE_N, ARC/SPDIF, SPI_DI, SPI_CS, SPI_CLK, REALONE_SCL, REALONE_SDA, SPI_WP_PWM, SPI_HOLD_PWM, SPI_DO. Among them, the outside of the first pin and the 28th pin is the system-on-chip (SOC) end.
在一些實施例中,可依據圖2之設計將第1、2、3、4、5、6、7、8、9、10、11、12、31-35接腳為不使用,即接腳總數量為35。意即,如圖1所示,第1、4、7、10、13、32、33接腳為GND;第2、3、5、6、8、9、11、12接腳分別為P1_RTK1_P、P1_RTK1_M、P1_RTK0_P、P1_RTK0_M、P0_RTK1_P、P0_RTK1_M、P0_RTK0_P、P0_RTK0_M;第14、15接腳為HV_POWER;第34、35接腳為UHV_POWER;第16-31接腳分別為USB_DM/REFCLK_M_PCIE、USB_DP/REFCLK_P_PCIE、SYSTEM_MAIN_POWER_EN、HOT_PLUG_DETECT、SDA/PCIE_PERST_N、AUDIO_SYNC_CLK、SCL/PCIE_WAKE_N、ARC/SPDIF、SPI_DI、SPI_CS、SPI_CLK、REALONE_SCL、REALONE_SDA、SPI_WP_PWM、SPI_HOLD_PWM、SPI_DO。其中,第16根接腳的外側為面板(Panel)端。In some embodiments, the 1st, 2nd, 3rd, 4th, 5th, 6th, 7th, 8th, 9th, 10th, 11th, 12th, 31-35th pins can be unused according to the design of FIG. The total number is 35. That is, as shown in Figure 1, the 1st, 4th, 7th, 10, 13, 32, and 33rd pins are GND; the 2nd, 3rd, 5th, 6th, 8th, 9th, 11th, and 12th pins are P1_RTK1_M, P1_RTK0_P, P1_RTK0_M, P0_RTK1_P, P0_RTK1_M, P0_RTK0_P, P0_RTK0_M; pins 14 and 15 are HV_POWER; pins 34 and 35 are UHV_POWER; pins 16-31 are USB_DM/REFCLK_M_PCIE, USB_DP/REFCLK__POWER, MAIN_PCIE, SYSTEM_POWER respectively HOT_PLUG_DETECT, SDA/PCIE_PERST_N, AUDIO_SYNC_CLK, SCL/PCIE_WAKE_N, ARC/SPDIF, SPI_DI, SPI_CS, SPI_CLK, REALONE_SCL, REALONE_SDA, SPI_WP_PWM, SPI_HOLD_PWM, SPI_DO. Among them, the outer side of the 16th pin is the panel end.
在一些實施例中,可依據圖9之設計將第1、2、3、4、5、6、7、8、9、10、11、12、31-35接腳為不使用,即接腳總數量為35。意即,如圖10所示,第1、4、7、10、13、32、33接腳為GND;第2、3、5、6、8、9、11、12接腳分別為P0_RTK0_M、P0_RTK0_P、P0_RTK1_M、P0_RTK1_P、P1_RTK0_M、P1_RTK0_P、P1_RTK1_M、P1_RTK1_P;第14、15接腳為HV_POWER;第34、35接腳為UHV_POWER;第16-31接腳分別為USB_DP/REFCLK_P_PCIE、USB_DM/REFCLK_M_PCIE、SYSTEM_MAIN_POWER_EN、HOT_PLUG_DETECT、SDA/PCIE_PERST_N、AUDIO_SYNC_CLK、SCL/PCIE_WAKE_N、ARC/SPDIF、SPI_DI、SPI_CS、SPI_CLK、REALONE_SCL、REALONE_SDA、SPI_WP_PWM、SPI_HOLD_PWM、SPI_DO。其中,第16根接腳的外側為系統單晶片(SOC)端。In some embodiments, the 1st, 2nd, 3rd, 4th, 5th, 6th, 7th, 8th, 9th, 10th, 11th, 12th, 31-35th pins can be unused according to the design of FIG. The total number is 35. That is, as shown in Figure 10, the 1st, 4th, 7th, 10th, 13th, 32nd, and 33rd pins are GND; the 2nd, 3rd, 5th, 6, 8, 9, 11, and 12th pins are P0_RTK0_P, P0_RTK1_M, P0_RTK1_P, P1_RTK0_M, P1_RTK0_P, P1_RTK1_M, P1_RTK1_P; pins 14 and 15 are HV_POWER; pins 34 and 35 are UHV_POWER; pins 16-31 are USB_DP/REFCLK_P_PCIE, USB_DM/REFCLK__POWER_M_PCIE, SYSTEM_MAIN HOT_PLUG_DETECT, SDA/PCIE_PERST_N, AUDIO_SYNC_CLK, SCL/PCIE_WAKE_N, ARC/SPDIF, SPI_DI, SPI_CS, SPI_CLK, REALONE_SCL, REALONE_SDA, SPI_WP_PWM, SPI_HOLD_PWM, SPI_DO. Among them, the outside of the 16th pin is the system-on-chip (SOC) end.
在一些實施例中,前述芯線之數量可以根據不同的應用與實施例進行調整,以接腳數量52且全部接腳皆使用為例,訊號傳輸裝置可由50條芯線繞線而成,以接腳數量52且使用其中35根接腳為例,訊號傳輸裝置可由33條芯線繞線而成。使用者可自行根據所要支援的規格種類,自行選擇不同的差動接腳和控制信號之繞線組合,以達成傳輸資料的目的。In some embodiments, the number of the aforementioned core wires can be adjusted according to different applications and embodiments. For example, the number of pins is 52 and all the pins are used. The signal transmission device can be formed by winding 50 core wires. The number is 52 and 35 pins are used as an example, the signal transmission device can be formed by winding 33 core wires. Users can choose different differential pins and control signal routing combinations according to the specifications to be supported to achieve the purpose of data transmission.
綜上所述,根據本案之訊號傳輸裝置之一實施例,同一對差動訊號接腳設置在兩接地接腳之間,可避免產生訊號串擾並得到更好的阻抗匹配特性。再者,接腳容置空間的最邊緣位置端設置接地接腳,可避免差動訊號受訊號傳輸裝置外部之雜訊所干擾,並減少差動訊號以電磁波型式傳送到訊號傳輸裝置外部的能量,以降低電磁干擾(Electromagnetic Interference;EMI)而達到較佳之電磁兼容性(electromagnetic compatibility;EMC)、以及靜電防護效果(Electro-Static discharge;ESD)。訊號傳輸裝置因此提升傳輸品質,傳輸線可更有效率地傳輸訊號至電子裝置。並且,訊號傳輸裝置可支援多種現有的傳輸規格,例如USB規格,PCIe規格,Display Port規格以及HDMI規格,以達到單一訊號傳輸裝置透過多工方式以傳輸更大資料傳輸量,使用者無需準備多種支援不同規格的傳輸線,促進使用上之便利性。To sum up, according to an embodiment of the signal transmission device of the present application, the same pair of differential signal pins is arranged between the two ground pins, which can avoid signal crosstalk and obtain better impedance matching characteristics. Furthermore, the most edge position end of the pin accommodating space is provided with a ground pin, which can prevent the differential signal from being interfered by the noise outside the signal transmission device, and reduce the energy that the differential signal transmits to the outside of the signal transmission device in the form of electromagnetic waves. , in order to reduce electromagnetic interference (Electromagnetic Interference; EMI) to achieve better electromagnetic compatibility (electromagnetic compatibility; EMC), and electrostatic protection effect (Electro-Static discharge; ESD). The signal transmission device thus improves the transmission quality, and the transmission line can transmit the signal to the electronic device more efficiently. In addition, the signal transmission device can support a variety of existing transmission specifications, such as USB specification, PCIe specification, Display Port specification and HDMI specification, so that a single signal transmission device can transmit a larger amount of data transmission through multiplexing, and users do not need to prepare multiple Support different specifications of transmission lines to promote the convenience of use.
雖然本案已以實施例揭露如上然其並非用以限定本案,任何所屬技術領域中具有通常知識者,在不脫離本案之精神和範圍內,當可作些許之更動與潤飾,故本案之保護範圍當視後附之專利申請範圍所界定者為準。Although this case has been disclosed with the above examples, it is not intended to limit this case. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of this case. Therefore, the protection scope of this case is The scope of the patent application attached herewith shall prevail.
111:第一正差動接腳 112:第一負差動接腳 121:第二正差動接腳 122:第二負差動接腳 131:第三正差動接腳 132:第三負差動接腳 141:第四正差動接腳 142:第四負差動接腳 151:第一正差動高速接腳 152:第一負差動高速接腳 161:第二正差動高速接腳 162:第二負差動高速接腳 171:第七正差動接腳 172:第七負差動接腳 181:第八正差動接腳 182:第八負差動接腳 191:第九正差動接腳 192:第九負差動接腳 101:第十正差動接腳 102:第十負差動接腳 21:第一接地接腳 22:第二接地接腳 23:第三接地接腳 24:第四接地接腳 25:第五接地接腳 26:第六接地接腳 27:第七接地接腳 28:第八接地接腳 29:第九接地接腳 20:第十接地接腳 31:電源訊號接腳 32:電源訊號接腳 33:電源訊號接腳 34:電源訊號接腳 410:系統主電源接腳 411:熱插拔偵測接腳 412:SDA/PCIE_PERST_N接腳 413:CLK接腳 414:SCL/PCIE_WAKE_N接腳 415:ARC/SPDIF接腳 416:SPI_DI接腳 417:SPI_CS接腳 418:SPI_CLK接腳 419:REALONE_SCL接腳 420:REALONE_SDA接腳 421:SPI_WP_PWM接腳 422:SPI_HOLD_PWM接腳 423:SPI_DO接腳 51:正差動低速接腳 52:負差動低速接腳 61:電源接地接腳 62:電源接地接腳 I:絕緣層 M:金屬隔離層 D1:方向 D2:方向 G1:線材 G2:線材 G3:線材 G4:線材 SA:一側 SB:一側 A:端 A’:端 B:端 B’:端 C:端 C’:端 D:端 D’:端 E:端 E’:端 F:端 F’:端 P:訊號傳輸裝置 Q:訊號傳輸裝置 R:訊號傳輸裝置 L:連接部 N:電子裝置111: The first positive differential pin 112: The first negative differential pin 121: The second positive differential pin 122: Second negative differential pin 131: The third positive differential pin 132: The third negative differential pin 141: Fourth positive differential pin 142: Fourth negative differential pin 151: The first positive differential high-speed pin 152: The first negative differential high-speed pin 161: The second positive differential high-speed pin 162: The second negative differential high-speed pin 171: seventh positive differential pin 172: seventh negative differential pin 181: Eighth positive differential pin 182: Eighth negative differential pin 191: ninth positive differential pin 192: Ninth negative differential pin 101: The tenth positive differential pin 102: Tenth negative differential pin 21: The first ground pin 22: The second ground pin 23: The third ground pin 24: Fourth ground pin 25: Fifth ground pin 26: The sixth ground pin 27: seventh ground pin 28: Eighth ground pin 29: ninth ground pin 20: Tenth ground pin 31: Power signal pin 32: Power signal pin 33: Power signal pin 34: Power signal pin 410: System main power pin 411: hot plug detection pin 412: SDA/PCIE_PERST_N pin 413: CLK pin 414: SCL/PCIE_WAKE_N pin 415: ARC/SPDIF pin 416: SPI_DI pin 417:SPI_CS pin 418: SPI_CLK pin 419: REALONE_SCL pin 420: REALONE_SDA pin 421:SPI_WP_PWM pin 422:SPI_HOLD_PWM pin 423:SPI_DO pin 51: Positive differential low-speed pin 52: Negative differential low-speed pin 61: Power ground pin 62: Power ground pin I: insulating layer M: Metal isolation layer D1: Direction D2: Direction G1: Wire G2: Wire G3: Wire G4: Wire SA: one side SB: one side A: end A': end B: end B': end C: end C': end D: end D': end E: end E': end F: end F': end P: Signal transmission device Q: Signal transmission device R: signal transmission device L: connecting part N: electronic device
[圖1]係為根據本案之訊號傳輸裝置之一實施例的示意圖。 [圖2]係為圖1之訊號傳輸裝置之另一實施例的示意圖。 [圖3]係為根據本案之訊號傳輸裝置之接腳排列方式之一實施例的示意圖。 [圖4]係為根據本案之訊號傳輸裝置之接腳排列方式之一實施例的示意圖。 [圖5A]係為根據本案之訊號傳輸裝置之母接頭之一實施例的外觀示意圖。 [圖5B]係為對應圖5A之訊號傳輸裝置之公接頭之一實施例的外觀示意圖。 [圖5C]係為圖5A之訊號傳輸裝置之一實施例之側視示意圖。 [圖5D]係為圖5B之訊號傳輸裝置之一實施例之側視示意圖。 [圖6A]係為根據本案之訊號傳輸裝置之母接頭之另一實施例之側視示意圖。 [圖6B]係為對應圖6A之訊號傳輸裝置之公接頭之另一實施例之側視示意圖。 [圖7A]係為根據本案之訊號傳輸裝置之母接頭之另一實施例之側視示意圖。 [圖7B]係為對應圖7A之訊號傳輸裝置之公接頭之另一實施例之側視示意圖。 [圖8]係為根據本案之包含訊號傳輸裝置之傳輸線及電子裝置之一實施例的示意圖。 [圖9]係為根據本案之訊號傳輸裝置之另一實施例的示意圖。 [圖10]係為圖9之訊號傳輸裝置之另一實施例的示意圖。[FIG. 1] is a schematic diagram of an embodiment of the signal transmission device according to the present application. FIG. 2 is a schematic diagram of another embodiment of the signal transmission device of FIG. 1 . FIG. 3 is a schematic diagram of an embodiment of the pin arrangement of the signal transmission device according to the present application. FIG. 4 is a schematic diagram of an embodiment of the pin arrangement of the signal transmission device according to the present application. FIG. 5A is a schematic view of the appearance of an embodiment of the female connector of the signal transmission device according to the present application. FIG. 5B is a schematic diagram of the appearance of one embodiment of the male connector of the signal transmission device corresponding to FIG. 5A . 5C is a schematic side view of an embodiment of the signal transmission device of FIG. 5A . 5D is a schematic side view of an embodiment of the signal transmission device of FIG. 5B . 6A is a schematic side view of another embodiment of the female connector of the signal transmission device according to the present application. 6B is a schematic side view of another embodiment of the male connector of the signal transmission device corresponding to FIG. 6A . 7A is a schematic side view of another embodiment of the female connector of the signal transmission device according to the present application. FIG. 7B is a schematic side view of another embodiment of the male connector of the signal transmission device corresponding to FIG. 7A . FIG. 8 is a schematic diagram of an embodiment of a transmission line including a signal transmission device and an electronic device according to the present application. 9 is a schematic diagram of another embodiment of the signal transmission device according to the present application. FIG. 10 is a schematic diagram of another embodiment of the signal transmission device of FIG. 9 .
111:第一正差動接腳111: The first positive differential pin
112:第一負差動接腳112: The first negative differential pin
121:第二正差動接腳121: The second positive differential pin
122:第二負差動接腳122: Second negative differential pin
131:第三正差動接腳131: The third positive differential pin
132:第三負差動接腳132: The third negative differential pin
141:第四正差動接腳141: Fourth positive differential pin
142:第四負差動接腳142: Fourth negative differential pin
21:第一接地接腳21: The first ground pin
22:第二接地接腳22: The second ground pin
23:第三接地接腳23: The third ground pin
24:第四接地接腳24: Fourth ground pin
25:第五接地接腳25: Fifth ground pin
31:電源訊號接腳31: Power signal pin
32:電源訊號接腳32: Power signal pin
33:電源訊號接腳33: Power signal pin
34:電源訊號接腳34: Power signal pin
410:系統主電源接腳410: System main power pin
411:熱插拔偵測接腳411: hot plug detection pin
412:SDA/PCIE_PERST_N接腳412: SDA/PCIE_PERST_N pin
413:CLK接腳413: CLK pin
414:SCL/PCIE_WAKE_N接腳414: SCL/PCIE_WAKE_N pin
415:ARC/SPDIF接腳415: ARC/SPDIF pin
416:SPI_DI接腳416: SPI_DI pin
417:SPI_CS接腳417:SPI_CS pin
418:SPI_CLK接腳418: SPI_CLK pin
419:REALONE_SCL接腳419: REALONE_SCL pin
420:REALONE_SDA接腳420: REALONE_SDA pin
421:SPI_WP_PWM接腳421:SPI_WP_PWM pin
422:SPI_HOLD_PWM接腳422:SPI_HOLD_PWM pin
423:SPI_DO接腳423:SPI_DO pin
51:正差動低速接腳51: Positive differential low-speed pin
52:負差動低速接腳52: Negative differential low-speed pin
61:電源接地接腳61: Power ground pin
62:電源接地接腳62: Power ground pin
I:絕緣層I: insulating layer
M:金屬隔離層M: Metal isolation layer
D1:方向D1: Direction
D2:方向D2: Direction
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| US63/040,148 | 2020-06-17 |
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| TW110304026F TWD218601S (en) | 2020-06-17 | 2020-12-17 | part of the signal transmission device |
| TW109307104D01F TWD213337S (en) | 2020-06-17 | 2020-12-17 | Part of signal transmission device |
| TW110304025F TWD218600S (en) | 2020-06-17 | 2020-12-17 | part of the signal transmission device |
| TW109307103F TWD213973S (en) | 2020-06-17 | 2020-12-17 | Part of signal transmission device |
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| TW109307104D02F TWD213338S (en) | 2020-06-17 | 2020-12-17 | Part of signal transmission device |
| TW109307104F TWD213336S (en) | 2020-06-17 | 2020-12-17 | Part of signal transmission device |
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| TW110304026F TWD218601S (en) | 2020-06-17 | 2020-12-17 | part of the signal transmission device |
| TW109307104D01F TWD213337S (en) | 2020-06-17 | 2020-12-17 | Part of signal transmission device |
| TW110304025F TWD218600S (en) | 2020-06-17 | 2020-12-17 | part of the signal transmission device |
| TW109307103F TWD213973S (en) | 2020-06-17 | 2020-12-17 | Part of signal transmission device |
| TW109307103D02F TWD213975S (en) | 2020-06-17 | 2020-12-17 | Part of signal transmission device |
| TW109307104D02F TWD213338S (en) | 2020-06-17 | 2020-12-17 | Part of signal transmission device |
| TW109307104F TWD213336S (en) | 2020-06-17 | 2020-12-17 | Part of signal transmission device |
| TW110110117A TWI788808B (en) | 2020-06-17 | 2021-03-19 | Signal transmission device capable of transmitting multiple data streams |
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| CN113169484A (en) * | 2018-10-09 | 2021-07-23 | 安费诺商用电子产品(成都)有限公司 | High density edge connector |
| CN109947683A (en) * | 2019-04-26 | 2019-06-28 | 歌尔科技有限公司 | a VR device |
| CN110600924A (en) * | 2019-09-30 | 2019-12-20 | 广州视源电子科技股份有限公司 | Connector, electronic equipment and open pluggable OPS equipment |
-
2020
- 2020-08-13 TW TW109127629A patent/TWI763001B/en active
- 2020-08-21 CN CN202010848379.7A patent/CN113810070B/en active Active
- 2020-12-17 TW TW109307103D01F patent/TWD213974S/en unknown
- 2020-12-17 TW TW110304026F patent/TWD218601S/en unknown
- 2020-12-17 TW TW109307104D01F patent/TWD213337S/en unknown
- 2020-12-17 TW TW110304025F patent/TWD218600S/en unknown
- 2020-12-17 TW TW109307103F patent/TWD213973S/en unknown
- 2020-12-17 TW TW109307103D02F patent/TWD213975S/en unknown
- 2020-12-17 TW TW109307104D02F patent/TWD213338S/en unknown
- 2020-12-17 TW TW109307104F patent/TWD213336S/en unknown
-
2021
- 2021-03-19 TW TW110110117A patent/TWI788808B/en active
- 2021-06-07 CN CN202110631124.XA patent/CN113809596A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200945700A (en) * | 2008-02-29 | 2009-11-01 | Fci Americas Technology Inc | Cross talk reduction for high speed electrical connectors |
| TW201349760A (en) * | 2012-02-23 | 2013-12-01 | Sony Corp | Input/output apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113809596A (en) | 2021-12-17 |
| TWD218600S (en) | 2022-05-01 |
| TWD213337S (en) | 2021-08-11 |
| CN113810070B (en) | 2023-01-10 |
| TWD213973S (en) | 2021-09-11 |
| TWD213975S (en) | 2021-09-11 |
| TWD213336S (en) | 2021-08-11 |
| TWD213974S (en) | 2021-09-11 |
| TW202201955A (en) | 2022-01-01 |
| TWD213338S (en) | 2021-08-11 |
| TWD218601S (en) | 2022-05-01 |
| CN113810070A (en) | 2021-12-17 |
| TW202201913A (en) | 2022-01-01 |
| TWI788808B (en) | 2023-01-01 |
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