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TWI762200B - 焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭 - Google Patents

焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭 Download PDF

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Publication number
TWI762200B
TWI762200B TW110105772A TW110105772A TWI762200B TW I762200 B TWI762200 B TW I762200B TW 110105772 A TW110105772 A TW 110105772A TW 110105772 A TW110105772 A TW 110105772A TW I762200 B TWI762200 B TW I762200B
Authority
TW
Taiwan
Prior art keywords
less
mass
solder
mass ppm
ppm
Prior art date
Application number
TW110105772A
Other languages
English (en)
Chinese (zh)
Other versions
TW202138577A (zh
Inventor
川浩由
白鳥正人
川又勇司
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW202138577A publication Critical patent/TW202138577A/zh
Application granted granted Critical
Publication of TWI762200B publication Critical patent/TWI762200B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW110105772A 2020-04-10 2021-02-19 焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭 TWI762200B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-070927 2020-04-10
JP2020070927A JP6836091B1 (ja) 2020-04-10 2020-04-10 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム及びはんだ継手

Publications (2)

Publication Number Publication Date
TW202138577A TW202138577A (zh) 2021-10-16
TWI762200B true TWI762200B (zh) 2022-04-21

Family

ID=74665105

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110105772A TWI762200B (zh) 2020-04-10 2021-02-19 焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭

Country Status (5)

Country Link
JP (1) JP6836091B1 (ja)
KR (1) KR102557835B1 (ja)
CN (1) CN115916453B (ja)
TW (1) TWI762200B (ja)
WO (1) WO2021205759A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040847A (ja) * 2003-07-25 2005-02-17 Hitachi Metals Ltd はんだボールの製造方法
TW200712263A (en) * 2005-07-01 2007-04-01 Nippon Mining Co High-purity tin or tin alloy and process for producing high-purity tin
TW201718883A (zh) * 2015-10-19 2017-06-01 Jx Nippon Mining & Metals Corp 高純度錫及其製造方法
CN109262163A (zh) * 2018-11-30 2019-01-25 长沙浩然医疗科技有限公司 一种无铅焊料合金及其制备方法
TW202010592A (zh) * 2018-07-20 2020-03-16 日商千住金屬工業股份有限公司 焊劑材料、焊膏、及焊劑接頭

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019764B1 (ja) * 1971-04-30 1975-07-09
JP5019764B2 (ja) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP5030442B2 (ja) * 2006-03-09 2012-09-19 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP2008168322A (ja) 2007-01-11 2008-07-24 Ishikawa Kinzoku Kk Ｆｅ浸食抑制鉛フリーはんだ合金
US9394590B2 (en) * 2010-03-16 2016-07-19 Jx Nippon Mining & Metals Corporation Low α-dose tin or tin alloy, and method for producing same
KR101645929B1 (ko) * 2013-09-19 2016-08-04 센주긴조쿠고교 가부시키가이샤 Ni 볼, Ni 핵 볼, 납땜 조인트, 폼 땜납, 납땜 페이스트
JP6717559B2 (ja) 2013-10-16 2020-07-01 三井金属鉱業株式会社 半田合金及び半田粉
JP5534122B1 (ja) * 2014-02-04 2014-06-25 千住金属工業株式会社 核ボール、はんだペースト、フォームはんだ、フラックスコート核ボールおよびはんだ継手
US10150185B2 (en) * 2014-02-04 2018-12-11 Senju Metal Industry Co., Ltd. Method for producing metal ball, joining material, and metal ball
JP6540869B1 (ja) * 2018-03-30 2019-07-10 千住金属工業株式会社 はんだペースト
JP7331579B2 (ja) * 2018-09-28 2023-08-23 荒川化学工業株式会社 鉛フリーはんだフラックス、鉛フリーソルダペースト

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040847A (ja) * 2003-07-25 2005-02-17 Hitachi Metals Ltd はんだボールの製造方法
TW200712263A (en) * 2005-07-01 2007-04-01 Nippon Mining Co High-purity tin or tin alloy and process for producing high-purity tin
TW201718883A (zh) * 2015-10-19 2017-06-01 Jx Nippon Mining & Metals Corp 高純度錫及其製造方法
TW202010592A (zh) * 2018-07-20 2020-03-16 日商千住金屬工業股份有限公司 焊劑材料、焊膏、及焊劑接頭
CN109262163A (zh) * 2018-11-30 2019-01-25 长沙浩然医疗科技有限公司 一种无铅焊料合金及其制备方法

Also Published As

Publication number Publication date
KR102557835B1 (ko) 2023-07-21
CN115916453A (zh) 2023-04-04
JP2021167006A (ja) 2021-10-21
JP6836091B1 (ja) 2021-02-24
WO2021205759A1 (ja) 2021-10-14
TW202138577A (zh) 2021-10-16
KR20220141914A (ko) 2022-10-20
CN115916453B (zh) 2023-06-20

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