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TWI761614B - 薄膜狀半導體密封材 - Google Patents

薄膜狀半導體密封材 Download PDF

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Publication number
TWI761614B
TWI761614B TW107137121A TW107137121A TWI761614B TW I761614 B TWI761614 B TW I761614B TW 107137121 A TW107137121 A TW 107137121A TW 107137121 A TW107137121 A TW 107137121A TW I761614 B TWI761614 B TW I761614B
Authority
TW
Taiwan
Prior art keywords
film
component
sealing material
semiconductor sealing
compound
Prior art date
Application number
TW107137121A
Other languages
English (en)
Chinese (zh)
Other versions
TW201925338A (zh
Inventor
福原佳英
齊藤裕美
発地豊和
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW201925338A publication Critical patent/TW201925338A/zh
Application granted granted Critical
Publication of TWI761614B publication Critical patent/TWI761614B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3437—Six-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/353—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • H10W74/10—
    • H10W74/40—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
TW107137121A 2017-11-27 2018-10-22 薄膜狀半導體密封材 TWI761614B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-226724 2017-11-27
JP2017226724 2017-11-27

Publications (2)

Publication Number Publication Date
TW201925338A TW201925338A (zh) 2019-07-01
TWI761614B true TWI761614B (zh) 2022-04-21

Family

ID=66631546

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107137121A TWI761614B (zh) 2017-11-27 2018-10-22 薄膜狀半導體密封材

Country Status (5)

Country Link
JP (1) JP7210031B2 (ja)
KR (1) KR102558125B1 (ja)
CN (1) CN111372994B (ja)
TW (1) TWI761614B (ja)
WO (1) WO2019102719A1 (ja)

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* Cited by examiner, † Cited by third party
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CN110527046A (zh) * 2019-08-19 2019-12-03 湖北三选科技有限公司 改质双胺型苯并恶嗪树脂及制备方法、及其在液态晶圆级封装材料中作为应力释放剂的应用
JP7298450B2 (ja) * 2019-11-20 2023-06-27 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、フレキシブル基板及び半導体装置
JP7562944B2 (ja) * 2019-11-28 2024-10-08 住友ベークライト株式会社 基材付き樹脂膜、プリント配線基板および電子装置
KR102691391B1 (ko) * 2021-12-29 2024-08-05 주식회사 케이씨씨 과립형 에폭시 수지 조성물
KR102696699B1 (ko) * 2021-12-30 2024-08-21 주식회사 케이씨씨 과립형 에폭시 수지 조성물
KR102696698B1 (ko) * 2021-12-30 2024-08-21 주식회사 케이씨씨 과립형 에폭시 수지 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201430087A (zh) * 2012-12-27 2014-08-01 東麗股份有限公司 接著劑、接著膜、半導體裝置及其製造方法
WO2016157259A1 (ja) * 2015-03-31 2016-10-06 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物と、この封止用樹脂組成物を用いた半導体装置、この封止用樹脂組成物を用いる半導体装置の製造方法

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TW201430087A (zh) * 2012-12-27 2014-08-01 東麗股份有限公司 接著劑、接著膜、半導體裝置及其製造方法
WO2016157259A1 (ja) * 2015-03-31 2016-10-06 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物と、この封止用樹脂組成物を用いた半導体装置、この封止用樹脂組成物を用いる半導体装置の製造方法

Also Published As

Publication number Publication date
JPWO2019102719A1 (ja) 2020-12-17
WO2019102719A1 (ja) 2019-05-31
JP7210031B2 (ja) 2023-01-23
KR102558125B1 (ko) 2023-07-20
KR20200085784A (ko) 2020-07-15
CN111372994A (zh) 2020-07-03
TW201925338A (zh) 2019-07-01
CN111372994B (zh) 2023-03-14

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