[go: up one dir, main page]

TWI760499B - 焊接頭及具有其的焊接裝置 - Google Patents

焊接頭及具有其的焊接裝置 Download PDF

Info

Publication number
TWI760499B
TWI760499B TW107118327A TW107118327A TWI760499B TW I760499 B TWI760499 B TW I760499B TW 107118327 A TW107118327 A TW 107118327A TW 107118327 A TW107118327 A TW 107118327A TW I760499 B TWI760499 B TW I760499B
Authority
TW
Taiwan
Prior art keywords
block
heating
vacuum
wafer
plate
Prior art date
Application number
TW107118327A
Other languages
English (en)
Chinese (zh)
Other versions
TW201906062A (zh
Inventor
南成龍
金敏基
鄭仁榮
Original Assignee
南韓商美科陶瓷科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商美科陶瓷科技有限公司 filed Critical 南韓商美科陶瓷科技有限公司
Publication of TW201906062A publication Critical patent/TW201906062A/zh
Application granted granted Critical
Publication of TWI760499B publication Critical patent/TWI760499B/zh

Links

Images

Classifications

    • H10P72/0428—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H10P72/00—
    • H10P72/0431—
    • H10P72/70—
    • H10P72/76—
    • H10P72/7606—
    • H10P72/78—
    • H10W99/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
TW107118327A 2017-06-27 2018-05-29 焊接頭及具有其的焊接裝置 TWI760499B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020170080984A KR102439617B1 (ko) 2017-06-27 2017-06-27 본딩 헤드 및 이를 갖는 본딩 장치
??10-2017-0080984 2017-06-27
KR10-2017-0080984 2017-06-27

Publications (2)

Publication Number Publication Date
TW201906062A TW201906062A (zh) 2019-02-01
TWI760499B true TWI760499B (zh) 2022-04-11

Family

ID=64741676

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107118327A TWI760499B (zh) 2017-06-27 2018-05-29 焊接頭及具有其的焊接裝置

Country Status (3)

Country Link
KR (1) KR102439617B1 (fr)
TW (1) TWI760499B (fr)
WO (1) WO2019004620A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI768640B (zh) * 2020-09-08 2022-06-21 旺矽科技股份有限公司 金屬載具及晶圓承載裝置
CN112992730B (zh) * 2021-02-04 2022-06-14 中国电子科技集团公司第二十四研究所 半密闭共晶贴片装置及共晶贴片方法
KR102435062B1 (ko) * 2021-12-20 2022-08-22 주식회사 미코세라믹스 본딩 헤드 및 이를 포함하는 본딩 장치
CN114446833B (zh) * 2022-01-25 2023-03-24 北京北方华创微电子装备有限公司 承载装置及半导体工艺设备
KR102669503B1 (ko) * 2022-02-10 2024-05-29 에스케이실트론 주식회사 웨이퍼 마운팅용 왁스 도포장치와 이를 포함하는 웨이퍼 마운팅 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120088362A1 (en) * 2010-10-08 2012-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal Compressive Bond Head
KR20120040368A (ko) * 2010-10-19 2012-04-27 에스케이하이닉스 주식회사 와이어 본딩 장치용 히터블록
TW201436080A (zh) * 2013-01-21 2014-09-16 貝西瑞士股份有限公司 具有可加熱和可冷卻抽吸構件的接合頭
US20150262858A1 (en) * 2012-09-28 2015-09-17 Tokyo Ohka Kogyo Co., Ltd. Attaching device and attaching method
TW201633415A (zh) * 2015-02-27 2016-09-16 庫利克和索夫工業公司 接合頭組件、熱壓接合系統及其組裝和操作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078299A (ja) * 2001-09-06 2003-03-14 Toshiba Corp ステージ装置、実装装置ならびに電気部品の製造方法
JP2003209142A (ja) 2002-01-17 2003-07-25 Sony Corp ボンディングヘッドおよび実装装置
JP4014481B2 (ja) * 2002-04-30 2007-11-28 東レエンジニアリング株式会社 ボンディング方法およびその装置
US7993460B2 (en) * 2003-06-30 2011-08-09 Lam Research Corporation Substrate support having dynamic temperature control
JP2007329306A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置
KR101150251B1 (ko) * 2010-01-09 2012-06-12 주식회사 리빙케어 냉각 제어를 이용한 웨이퍼 다이싱용 척 장치
JP2011243860A (ja) * 2010-05-20 2011-12-01 Renesas Electronics Corp 半導体装置の製造方法
JP4808283B1 (ja) * 2010-06-30 2011-11-02 株式会社新川 電子部品実装装置及び電子部品実装方法
JP6452449B2 (ja) * 2015-01-06 2019-01-16 東京エレクトロン株式会社 載置台及び基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120088362A1 (en) * 2010-10-08 2012-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal Compressive Bond Head
KR20120040368A (ko) * 2010-10-19 2012-04-27 에스케이하이닉스 주식회사 와이어 본딩 장치용 히터블록
US20150262858A1 (en) * 2012-09-28 2015-09-17 Tokyo Ohka Kogyo Co., Ltd. Attaching device and attaching method
TW201436080A (zh) * 2013-01-21 2014-09-16 貝西瑞士股份有限公司 具有可加熱和可冷卻抽吸構件的接合頭
TW201633415A (zh) * 2015-02-27 2016-09-16 庫利克和索夫工業公司 接合頭組件、熱壓接合系統及其組裝和操作方法

Also Published As

Publication number Publication date
WO2019004620A1 (fr) 2019-01-03
KR102439617B1 (ko) 2022-09-05
TW201906062A (zh) 2019-02-01
KR20190001271A (ko) 2019-01-04

Similar Documents

Publication Publication Date Title
TWI796335B (zh) 卡盤板、具有該卡盤板的卡盤結構物及具有卡盤結構物的焊接裝置
TWI760499B (zh) 焊接頭及具有其的焊接裝置
CN102456589B (zh) 接合装置
CN103367181B (zh) 用于接合基板的方法和设备
JP5129848B2 (ja) 接合装置及び接合方法
KR102439615B1 (ko) 본딩 헤드 및 이를 갖는 본딩 장치
KR102347123B1 (ko) 본딩 헤드 및 이를 갖는 본딩 장치
KR102498914B1 (ko) 본딩 헤드 및 이를 갖는 본딩 장치
JP5299837B2 (ja) 支持装置、加熱加圧装置及び加熱加圧方法
JP6415328B2 (ja) 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
KR102707392B1 (ko) 접합헤드 및 이를 구비하는 접합 장치
TWI827402B (zh) 鍵合頭以及包括該鍵合頭的鍵合裝置
JP2016129196A (ja) 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP6333184B2 (ja) 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP2016129197A (ja) 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP2004314138A (ja) 半田付け装置
JP2013232662A (ja) 支持装置、加熱加圧装置及び加熱加圧方法