TWI756579B - Substrate processing equipment - Google Patents

Abstract

The present invention is provided with the holding portion 52a that is held from above with respect to the substrate W held from below by the holding grooves 1321 provided on the holding rods 132 of the lifter 13 arranged in the substrate processing apparatus. The processing position of the inner tank 501.

Description

Substrate processing equipment

The present invention relates to a substrate processing apparatus for performing etching processing or cleaning processing on substrates such as semiconductor wafers.

In the manufacturing step of a semiconductor device, by immersing a substrate such as a semiconductor wafer in a processing tank, the substrate semiconductor is subjected to etching treatment and cleaning treatment. As such a treatment tank, there is known a configuration including ejection pipes for ejecting the treatment liquid toward the center of the bottom surface of the treatment tank on both sides of the bottom of the treatment tank, and a configuration for supplying air bubbles from the bottom of the treatment tank between the ejection pipes. A plurality of air bubble supply pipes (for example, refer to Patent Document 1).

In such a processing tank, an elevator for immersing the substrate in the stored processing liquid is further provided. The lifter holds a plurality of substrates together in a standing posture by three holding rods. In addition, the lifter is provided so as to be movable in the vertical direction and the horizontal direction, so that the plurality of substrates held are between a processing position immersed in the processing liquid in the processing tank and a transfer position pulled up from the processing liquid. It can be lifted and lowered, and it can be moved toward the adjacent processing tank.

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent No. 6356727

When the substrate is treated, the flow of the treatment liquid and the air bubbles from the bottom to the upper direction acts on the substrate held by the holding bar and immersed in the treatment tank. Due to this action, the substrate may be rotated in the circumferential direction. However, for a plurality of substrates held by the lifter, the rotation of the substrates does not necessarily occur uniformly, so that there is a possibility of unevenness in the processing effect.

Here, one aspect of the disclosed technology is to suppress the rotation generated on the substrate as a subject.

One aspect of the disclosed technology is exemplified by the following substrate processing apparatus. The present substrate processing apparatus is characterized by comprising: a tank for storing a processing liquid for processing a substrate and immersing the substrate; and a holding member for holding the substrate in an upright posture and provided relative to the tank The holding member has a holding groove for holding the substrate from below, a holding portion is provided in the groove, and the holding member holds the substrate at the processing position. The holding portion is positioned above the holding groove and abuts the substrate at positions on both sides of the horizontal direction of the virtual plane including the vertical direction of the normal to the surface of the substrate, thereby suppressing the rotation of the substrate. .

According to such an invention, in the case where the substrate is immersed in the processing liquid, the liquid is supplied to the substrate from the bottom of the groove, and the upward flow of bubbles can be achieved by holding the substrate in contact with the substrate above the holding groove. The portion suppresses the downward rotation of the substrate held by the holding groove of the holding member.

Furthermore, in the present invention, the holding groove and the holding portion may be provided on the upper side corresponding to each of the plurality of substrates held and arranged by the holding member. In the arrangement direction, the phase shift with respect to the plurality of the holding grooves provided in the above-mentioned arrangement direction corresponds to a phase corresponding to one-half of the pitch between the adjacent holding grooves, and is shifted in the above-mentioned arrangement direction. The phases of the plurality of holding portions provided are set to be further shifted.

Furthermore, in this invention, the said holding|maintenance part may be provided in the position lower than the horizontal plane passing through the center of the said board|substrate held by the said holding member.

Furthermore, in this invention, the shape of the said holding groove in the cross section parallel to the vertical plane containing the normal line of the said board|substrate may be a wedge shape.

Furthermore, in the present invention, the shape of the holding groove on the cross section parallel to the vertical plane including the normal line of the substrate may be modeled on the shape of the cross section of the edge portion of the substrate. shape.

Furthermore, in the present invention, there may be provided a conveying mechanism that can change the relationship between the holding portion and the substrate held by the holding member in the horizontal direction at the position where the holding member is lowered into the groove. spacing between surfaces.

Furthermore, in this invention, the said holding|maintenance part may be the protrusion of a substantially conical shape, or the shape of a groove.

Furthermore, in the present invention, a second holding portion may be provided on the lower side of the holding portion, and the second holding portion may be more than the holding portion in a state where the holding member holds the substrate at the processing position. The groove is further above and abuts the substrate at positions on both sides of the horizontal direction of the virtual plane including the vertical direction of the normal to the substrate surface, thereby suppressing the rotation of the substrate.

In this way, the rotation generated on the substrate can be more reliably suppressed by the holding portion and the second holding portion provided on the lower side thereof. The number of holding parts is not limited to the case where two are provided in the vertical direction, and three or more can be provided in an appropriately selected number. keep the department.

Furthermore, in this invention, the said tank may be equipped with the discharge pipe which discharges the said processing liquid, and the air bubble supply pipe which supplies air bubbles from the bottom part of the said tank.

In this way, even in the substrate processing apparatus in which the upward flow from the bottom of the tank is generated by the ejection pipe and the air bubble supply pipe, the rotation of the substrate can be effectively suppressed.

Furthermore, another aspect of the disclosed technology is exemplified by the following substrate processing apparatus. This substrate processing apparatus is provided with: a tank for storing a processing liquid, for immersing a flat substrate in an upright posture and processing; The processing positions can be raised and lowered, and have a plurality of concave holding grooves, the plurality of holding grooves are used to hold and place the substrate from below the standing posture; The system has vertices that are spaced apart at an interval equal to the interval between the adjacent holding grooves above the holding groove of the holding member located at the processing position and below the depth center of the groove, and The orientation of the vertex extends in a direction parallel to the longitudinal direction of the holding groove.

According to such an invention, the rotation of the substrate can be suppressed by providing the holding member and the abutting portion, wherein the holding member has a plurality of concave holding grooves for holding and placing the substrate from below. The abutting portion has a body of a sharp shape having vertices above and below the depth center of the holding groove at an interval equal to the interval between the adjoining holding grooves, and the The orientation of the vertex extends in a direction parallel to the longitudinal direction of the holding groove. The apex which is spaced apart from the space|interval equal to the space|interval of the adjoining holding groove above the holding groove|channel and below the depth center of a groove|channel is provided in the main body of each abutting part.

Furthermore, in the present invention, the above-mentioned sharp shape may be a conical shape or Needle shape.

Furthermore, in the present invention, there may be further provided a second abutting portion having a sharp-shaped main body, and the sharply-shaped main body has a lower side than the above-mentioned abutting portion so as to have a contact with the adjoining holding groove. Equally spaced apart vertices.

In this way, the rotation generated on the substrate can be more reliably suppressed by the contact portion and the second contact portion provided on the lower side thereof. The number of abutting portions is not limited to the case where two are provided in the vertical direction, and three or more abutting portions may be provided in an appropriately selected number.

According to the substrate processing apparatus of the present invention, the rotation generated on the substrate can be suppressed.

1: Substrate processing device

2: Buffer

3: Substrate loading and unloading outlet

5, 7, 9: Processing Department

5a, 5b, 7a, 7b, 9a, 9b: Treatment tank

11, 13, 15: Lifts

17: Main conveying mechanism

17a: Arm

20a, 20b: Piping

30a, 30b, 30c, 30d: Bubble piping

43: Sub-conveyor mechanism

52, 53: Supports

52a, 52b, 53a, 53b: holding part

52a1, 52a2, 53a1, 53a2: Ontology

52ap, 52a1p, 52a2p, 53a1p, 53a2p: vertices

52as, 52a1s, 52a2s, 53a1s, 53a2s: side

55: Control Department

57: Memory Department

131: Backplane

132, 133, 134: Keep the stick

132S: Reference position

501: Inner groove

501a, 501b, 501c, 501d: Sidewalls

521: Plate part

522, 523: Engagement part

524, 525: positioning part

524a, 525a: holes

1321, 1322, 1331, 1341: Keep the groove

1321a, 1321b: Bevel

1321c: Center

1322a: Bottom of trench

5012a, 5013a: Bolts for position adjustment

5012b, 5013b: Nut

L0: distance

L1: Spacing

L2: Distance

V: peripheral end face

Vp: virtual plane (vertical plane)

W: substrate

Wc: Center

We: edge

Wf: Surface

Wfp: peripheral part

Wp: peripheral part (crystal edge part)

FIG. 1 is a diagram showing an example of a substrate processing apparatus according to the embodiment.

FIG. 2 is a block diagram showing an example of functional blocks of the substrate processing apparatus.

FIG. 3 is a diagram showing the positional relationship between the substrate and the holding portion in the inner tank.

FIG. 4 is an overall perspective view of the support.

FIG. 5 is a diagram showing the positional relationship between the substrate held by the holding groove in the inner groove and the holding portion.

6 is an enlarged view showing the positional relationship between the substrate held by the holding groove and the holding portion.

FIG. 7 is a diagram showing the effect of suppressing the rotation when the position of the holding portion is changed and the holding groove is processed.

FIGS. 8( a ) and ( b ) are diagrams showing the cross-sectional shapes of the substrate and the holding groove in Example 2. FIG.

FIGS. 9( a ) and ( b ) are diagrams showing the cross-sectional shape of the holding portion of Example 4. FIG.

FIGS. 10( a ) and ( b ) are diagrams showing the positional relationship between the substrate held by the holding groove in the inner groove and the holding portion in the fifth embodiment.

<Example 1>

Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Furthermore, the embodiments shown below are one aspect of the present invention, and are not intended to limit the technical scope of the present invention. FIG. 1 is a perspective view showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment. The substrate processing apparatus 1 mainly performs etching processing and cleaning processing (hereinafter also simply referred to as "processing") to a flat substrate W. In the substrate processing apparatus 1, on the back right side in FIG. 1, a buffer portion 2 for storing the substrate W is arranged, and on the back right side of the buffer portion 2, a front panel (not shown) for operating the substrate processing apparatus 1 is provided. Show). Moreover, in the buffer part 2, the board|substrate carrying-in and unloading port 3 is provided in the opposite side to the front panel. Further, processing units 5 , 7 , and 9 for processing the substrate W are arranged side by side from the opposite side (left and near front side in FIG. 1 ) of the buffer unit 2 in the longitudinal direction of the substrate processing apparatus 1 .

Each of the processing units 5, 7, and 9 has two processing tanks 5a and 5b, 7a and 7b, and 9a and 9b, respectively. In addition, the substrate processing apparatus 1 is provided with a sub-conveying mechanism 43 for allowing the plurality of substrates W to pass only in the respective processing tanks 5a and 5b, 7a and 7b, Or move between 9a and 9b in the direction and range of the short arrow in FIG. 1 . In addition, since the plurality of substrates W are immersed in the processing tanks 5a and 5b, 7a and 7b, 9a and 9b, or the plurality of substrates W are pulled up from the processing tanks, the sub-transport mechanism 43 also allows the plurality of substrates W moves up and down. Elevators 11 , 13 , and 15 capable of raising and lowering for holding a plurality of substrates W are provided in each of the sub-transport mechanisms 43 . Furthermore, in the substrate processing apparatus 1, in order to convey the plurality of substrates W to each of the processing sections 5, 7, and 9 On the other hand, there is provided a main conveying mechanism 17 that can move in the direction and range of the long arrow in FIG. 1 .

The main conveying mechanism 17 has two movable arms 17a. The arms 17a are provided with a plurality of holding grooves (not shown) for placing the substrates W, and in the state shown in FIG. 1 , the substrates W are held in an upright posture. The standing posture refers to a posture in which the normal line perpendicular to the surface Wf of the substrate W (see FIGS. 3 and 5 ) is along the horizontal direction. 1, the two arms 17a of the main conveying mechanism 17 swing from a "V" shape to an inverted "V" shape, thereby releasing the substrates W. And by this operation|movement, the board|substrate W can be conveyed between the main conveyance mechanism 17 and the elevators 11, 13, and 15.

A functional block diagram of the substrate processing apparatus 1 is shown in FIG. 2 . The above-mentioned main transport mechanism 17 , sub transport mechanism 43 , processing units 5 , 7 , and 9 are collectively controlled by the control unit 55 . The hardware configuration of the control unit 55 is the same as that of a general computer. That is, the control unit 55 includes a CPU (Central Processing Unit) that performs various arithmetic processing, a ROM (Read Only Memory), which is a read-only memory that stores basic programs, and a Read Only Memory that stores various kinds of information. The freely writeable memory is RAM (Random Access Memory) and a disk with control applications and data stored therein. In the present embodiment, the CPU of the control unit 55 executes a predetermined program to control each part so that the substrate W is transferred to each of the processing units 5, 7, and 9 and the processing corresponding to the program is performed. The above-mentioned program is stored in the memory unit 57 .

In FIG. 3, the process tank 5a in each process tank 5a, 7a, 9a of the process parts 5, 7, 9 is demonstrated as an example. The following description is also applicable to other processing tanks 7a, 9a. Here, in the manufacturing process of the semiconductor wafer, for example, a single crystal ingot of silicon or the like is sliced in the direction of the rod axis, and the obtained product is sequentially subjected to processing such as chamfering, grinding, etching, and polishing. As a result, a plurality of layers, structures, and circuits made of different materials are formed on the surface of the substrate. Next, the etching process of the substrate W performed in the process tank 5a is, for example, This is performed for the purpose of removing metals such as tungsten remaining on the substrate W, and is performed by immersing the substrate W in a phosphoric acid aqueous solution or the like as a treatment liquid for a predetermined time.

The processing tank 5a has a double tank structure composed of an inner tank 501 for immersing the substrate W in the phosphoric acid aqueous solution and an outer tank (not shown) for recovering the phosphoric acid aqueous solution overflowing from the upper part of the inner tank 501 . The inner tank 501 is a box-shaped member having a rectangular shape in plan view and formed of a quartz or fluororesin material having excellent corrosion resistance to an aqueous phosphoric acid solution. As described above, the inner tank 501 is provided with the elevator 13 for immersing the substrate W in the stored phosphoric acid aqueous solution. The elevator 13 has a back plate 131 on the conveying mechanism side, and three holding bars 132 , 133 , and 134 extending in the horizontal direction from the lower part of the back plate 131 and provided in parallel to each other. The plurality of substrates W are collectively held parallel to each other in a standing posture by holding grooves (described later) provided in the holding bars 132 , 133 , and 134 . The lifter 13 is provided so as to be movable in the up, down, left, and right directions by the sub-transport mechanism 43, so that the plurality of substrates W held can be immersed in the phosphoric acid aqueous solution in the inner tank 501 at the processing position and from the phosphoric acid aqueous solution. The pull-up transfer positions are raised and lowered, and these can be moved toward the adjacent processing tank 5b. Here, the elevator 13 corresponds to the holding member.

Phosphoric acid aqueous solution is supplied from piping 20a, 20b arrange|positioned at the bottom of the inner tank 501. Thereby, the upward flow of the phosphoric acid aqueous solution from the bottom to the upper side is generated in the inner tank 501 . Moreover, the bubble of nitrogen gas is supplied from the bubble piping 30a, 30b, 30c, 30d arrange|positioned at the bottom of the inner tank 501. Thereby, an upward flow of nitrogen gas from the bottom to the upper side is also generated in the inner tank 501 . Here, the pipes 20a, 20b correspond to the ejection pipes of the present invention, and the bubble pipes 30a, 30b, 30c, and 30d correspond to the bubble supply pipes of the present invention.

3 : is the figure which looked at from the direction orthogonal to the side wall 501a of the conveyance mechanism side of the inner tank 501 (the direction from the lower right to the upper left in FIG. 1). The substrate W is held by the holding rods 132 , 133 , and 134 from the back side in FIG. 3 toward the front direction in a standing posture, and is arranged. The side walls 501b and 501c of the inner groove 501 on both sides along the surface of the substrate W are provided with substantially conical holding portions 52a and 53a which are perpendicular to the side walls 501b and 501c and protrude in the direction along the surface of the substrate W. As shown in FIG. 4, the holding part 52a (the holding part 53a is also the same) has a sharp shape having an apex 52ap and a side surface 52as. The direction of the vertex 52ap of the holding portion 52a (the same is true for the holding portion 53a) extends in a direction parallel to the longitudinal direction of the holding groove 1321 (direction parallel to the drawing in FIG. 3). The holding portions 52a and 53a are virtual planes (vertical planes) Vp in the vertical direction including the normal to the surface Wf of the substrate W (in FIG. 3 , the planes corresponding to the vertical direction passing through the center Wc and perpendicular to the paper surface) On the other hand, the peripheral portions Wfp and Wfp abut on the surface of the substrate W at positions on both sides in the horizontal direction. For example, when the diameter of the substrate W is set to 300 mm, the contact positions of the holding parts 52a and 53a can be set to a position 13 mm downward from the horizontal plane passing through the center Wc of the substrate W. Here, the holding parts 52a and 53a correspond to the holding parts of the present invention, and correspond to the abutting parts of the present invention. Here, the depth center of the inner groove 501 is described as being in agreement with the position of the center Wc of the substrate W, but the present invention is not limited to this.

The holding portions 52a and 53a are provided along the side walls 501b and 501c in the horizontal direction, that is, along the arrangement direction of the plurality of substrates W, corresponding to the number of substrates W that the elevator 13 can hold. The holding portions 52a and 53a are formed at predetermined positions of the support members 52 and 53 provided in the inner groove 501 . A perspective view of the support member 52 is shown in FIG. 4 . The support member 52 has: a plate-shaped part 521 extending in the horizontal direction along the side wall 501 b and forming a holding part 52 a; Extending upward, the upper edge of the side wall 501b is bent and hangs down from the outer side of the side wall 501b; The supporter 53 provided with the holding portion 53a also has the same configuration, so the description is omitted. The engaging portions 522 and 523 of the support member 52 are connected to the upper portion of the side wall 501b of the inner groove 501 The edges are engaged and locked in the inner groove 501 . In addition, the positioning portions 524 and 525 of the support member 52 are provided with holes 524a and 525a, and the holes 524a and 525a are respectively inserted into the side walls 501a on the conveying mechanism side of the inner groove 501. Bolts 5012a and 5013a for position adjustment of the side wall 501d. Nuts 5012b and 5013b are screwed to the ends of the self-positioning bolts 5012a and 5013a on the opposite side to the side walls 501a and 501d via the positioning portions 524 and 525 (see FIG. 5 ). By adjusting the positions in which the nuts 5012b and 5013b are screwed to the position adjusting bolts 5012a and 5013a in the horizontal direction, the support 52 and the supporter 52 locked in the inner groove 501 by the engaging parts 522 and 523 can be adjusted. The position of the horizontal direction of the holding part 52a which it supports is adjusted. The bodies of the support members 52 and 53 can be formed of heat-resistant materials such as quartz, and the holding parts 52a and 53a can be formed of PFA (perfluoroalkoxy alkane). Not limited to this.

FIG. 5 is a diagram showing the positional relationship of the lifter 13 , the substrate W, the support 52 , and the holding portion 52 a in the inner tank 501 . 5 is a view viewed from a direction perpendicular to the side wall 501b, and a cross section of the lifter 13 and the holding bar 132 and a vertical plane passing through the center of the substrate W is indicated by a dotted line. In FIG. 5 , a plurality of (only 12 are shown in the figure) holding grooves 1321 having a wedge-shaped cross section are provided in the holding rod 132 (in FIG. 5 , only the parts related to the substrate W at the right end are denoted by reference numerals. Since the parts related to the other substrates W have the same configuration, the reference numerals are omitted).

The positional relationship between the substrate W and the holding grooves 1321 will be described with reference to FIG. 6 showing the holding grooves 1321 in an enlarged manner. The edge portions We and We (see FIG. 6 ) of the surface of the substrate W are in contact with the inclined surface 1321 a (see FIG. 6 ) on the stepping side of the holding groove 1321 and the inclined surface 1321 b (see FIG. 6 ) on the conveying mechanism side of the holding groove 1321 , respectively. As a result, the lower end of the substrate W is engaged with and held by the holding groove 1321 . On the other hand, as described above, the holding portion 52a is in contact with the peripheral portion Wfp of the surface of the substrate W (see FIG. 3 ). Observed in the direction perpendicular to the paper in Figure 5 At this time, the substrate W is held by the holding groove 1321 from below and held by the holding portion 52a from above. The holding grooves 1321 of the holding rods 132 are formed along the outer periphery of the substrate W from the front of the drawing toward the back side. Therefore, in reality, the edge portion We of the substrate W is connected to the slope of the holding grooves 1321 by a curved region. Each of 1321a and 1321b is in contact with each other. Although omitted in FIG. 5 , between the holding rod 132 and the side wall 501b, the holding rod 133 is held by the inclined surfaces on the stepping side and the conveying mechanism side of the holding groove 1331 having the same wedge-shaped cross-section. 5, between the holding rod 132 and the side wall 501c, the holding rod 134 is held by the stepping side and the conveying mechanism side of the holding groove 1341 having the same wedge-shaped cross-section. Furthermore, in the near side of FIG. 5 , the holding portion is also at a line symmetrical position with respect to a straight line passing through the center of the substrate W in the up-down direction along the surface of the substrate W by the support member 53 provided on the side wall 501c. 53a is in contact with the peripheral portion Wfp of the surface of the substrate W. As shown in FIG.

FIG. 6 is a diagram illustrating the relationship between the positions of the holding grooves 1321 of the holding rods 132 of the elevator 13 and the positions of the holding portions 52a. 6 is a cross-sectional view on a cross-section parallel to a vertical plane passing through the center of the substrate W. As shown in FIG. When the distance between the center 1321c of the holding groove 1321 and the center 1321c of the adjacent holding groove 1321 (the distance between the holding grooves 1321) in the extending direction of the holding rods 132, that is, in the arrangement direction of the substrates W, is taken as L1, the self-holding A position located at a distance of L1/2 from the center 1321c of the groove 1321 serves as a reference position 132S. In other words, the reference position 132S is the position of the center between the centers 1321c of the adjacent holding grooves 1321 . In the present embodiment, the substrate W is inclined toward the conveying mechanism side (left side in the figure), and the holding portion 52a is provided vertically above the reference position 132S so as to be spaced apart from the side inclined toward the substrate W in the horizontal direction. The holding portion 52a is provided at a position of a predetermined distance L2 (L2>0), that is, at a position shifted only by L2. In this embodiment, L1 is set to 5 mm. With respect to the center Wc of the substrate W having a diameter of 300 mm held by the holding bar 132 as shown in FIG. The support member 52 is positioned relative to the side wall 501b of the inner groove 501 in such a way that the upper position in the vertical direction is facing downward L0 (here, it is set to 13 mm, but can be appropriately set according to the size of the substrate W). As shown in FIG. 6 , the holding portions 52a corresponding to each of the plurality of holding grooves 1321 provided in the arrangement direction of the substrates W with the pitch L1 are also provided in the arrangement direction of the substrates W with the pitch L1. That is, the holding portion 52a (apex 52ap) is separated from the adjacent holding groove 1321 at an interval equal to the interval between the center 1321c of the holding groove 1321 and the center 1321c of the adjacent holding groove 1321. is configured. At this time, as can be clearly seen from FIG. 6 , the phases of the plurality of holding grooves 1321 are shifted from the phases of the corresponding plurality of holding portions 52a. That is, the mutual positional relationship between the centers 1321c of the plurality of holding grooves 1321 arranged at equal intervals and the mutual positional relationship between the plurality of holding portions 52a correspondingly arranged at equal intervals are offset. The phases of the plurality of holding portions 52a are further shifted to the left by an amount corresponding to the distance L2 from the reference position 132S whose phase is shifted by only one half of the pitch L1 with respect to the holding groove 1321 . In FIG. 6 , the phases of the plurality of holding portions 52a are shifted to the left with respect to the reference position 132S of the phase pair holding groove 1321 that is shifted by only half the pitch L1, but may be shifted to the right.

When viewed from a direction perpendicular to the side wall 501b of the inner groove 501, the distance L2 is changed with the center between the centers 1321c of the holding grooves 1321 of the holding rod 132, that is, the position vertically above the reference position 132S as a reference. In the case of the holding portion 52a, after measuring the rotation angle of the substrate W, the results shown in FIG. 7 were obtained. At this time, the following conditions were set: the treatment temperature was 160.3°C, the treatment time was 120 minutes, phosphoric acid treatment-washing-drying was performed as a treatment flow, and the bubbling system was 13 liters per minute with nitrogen gas, and the bubbles were closed. The first one of the four pipes is expelled from the three pipes. The position of the holding portion was measured without being displaced from the vertical upper direction of the reference position 132S and by 0.5 mm, 0.8 mm, and 1.0 mm from the vertical upper direction of the reference position 132S. Yu Jiang The rotation angle of the substrate W when the holding portion 52a is disposed vertically above the reference position 132S is distributed in the range of -19 degrees to -39 degrees. On the other hand, when the holding portion 52a is arranged offset by 0.5 mm, 0.8 mm, and 1.0 mm from the vertical above of the reference position 132S, the rotation angle of the substrate W is -5 degrees to -10 degrees, and -2 degrees, respectively. Distributed in the range of -8 degrees, -6 degrees to -10 degrees. Thus, it can be seen that the rotation of the substrate W can be suppressed by arranging the holding portion 52a by being displaced from the center between the centers 1321c of the holding grooves 1321, that is, the vertical position above the reference position 132S. In a state where the elevator 13 is lowered to the processing position, the rotation of the substrate W can be suppressed by the holding portion and the holding groove.

<Example 2>

Hereinafter, Example 2 of the present invention will be described. The same reference numerals are used for the same structures as those in the first embodiment, and detailed descriptions are omitted. In Example 1, as shown in FIGS. 5 and 6 , the shape of the holding groove 1321 of the holding rod 132 (the holding rods 133 and 134 are the same) has a wedge-shaped cross section, but in Example 2, the holding groove 1322 has a Section shapes are different. As shown in FIG. 8( a ), the peripheral end surface V of the peripheral edge portion (edge portion) Wp of the substrate W may have a curved shape convex toward the outer diameter side. In this case, as shown in FIG. 8( b ), the cross-sectional shape of the holding groove 1322 of the holding rod 132 is made to follow the cross-sectional shape of the peripheral edge portion Wp of the substrate W, and the groove bottom 1322 a is made into a curved shape, and as By forming a parallel straight line shape toward the opening, the contact area between the substrate W and the holding groove 1322 is increased, and the substrate W can be held more stably. In addition, as shown in FIG. 8( b ), the holding grooves 1322 may be formed to be inclined toward the arrangement direction of the substrates W in such a manner that the holding grooves 1322 may be inclined in the direction of the processing surface of the substrates W, or the holding grooves may be formed in the vertical direction without being inclined. 1322. In addition, in the first embodiment, the holding parts 52a and 53a are in contact with the peripheral edge portion Wfp of the surface of the substrate W, but the holding parts 52a and 53a may be in contact with the substrate W and have a curved surface shape. Peripheral end face V. like In this way, the substrate W can be held in a state in which the holding portions 52a and 53a are not in contact with the surface of the substrate W.

<Example 3>

Hereinafter, Example 3 of the present invention will be described. The same reference numerals are used for the same structures as those in Embodiments 1 and 2, and descriptions thereof are omitted. In the third embodiment, the elevators 11 , 13 , and 15 can be moved not only up, down, left, and right, but also in the direction of the main conveying mechanism and the stepping direction. When the direction in which the rods 132, 133, and 134 extend with respect to the back plate 131 is the front, they can move forward and backward. By moving the elevator 13 forward and backward, the relative position of the elevator 13 with respect to the processing tanks 5, 7, and 9 when the elevator 13 is lowered and the substrate W is immersed in the processing liquid is lowered to the processing position. , it can move in the front and rear direction. The lifter 13 can be lowered at a position that does not interfere with the set holding parts 52a and 53a, and the lifter 13 can be moved in the front-rear direction so that the holding parts 52a and 53a are at the most suitable positions with respect to the substrate W. That is, the conveyance mechanism is comprised so that the space|interval of the horizontal direction of the holding|maintenance part 52a, 53a and the board|substrate W can be changed. Next, when the lifter 13 is raised, the lifter 13 may be raised after the substrate W is moved again in the front-rear direction to a position where it does not interfere with the holding parts 52a and 53a. In Embodiment 1 and Embodiment 2, the holding parts 52a and 53a are provided in the inner groove 501 so that the positions can be adjusted. The relative positions of the substrates W and the holding parts 52a and 53a are adjusted to appropriate positions by setting the lifter 13 in a state where the relative positions are fixed, and moving the elevator 13 in the front-rear direction. Furthermore, as in the first and second embodiments, the holding parts 52 a and 53 a may be provided in the inner groove 501 in advance by the support members 52 and 53 , and the substrate W and the holding parts may be moved back and forth by the elevator 13 . The relative positions of 52a and 53a are slightly Adjustment.

<Example 4>

Hereinafter, Example 4 of the present invention will be described. The same reference numerals are used for the same structures as those in the first embodiment, and detailed descriptions are omitted. FIG.9(a) is a figure which shows the shape of the holding|maintenance part 52a, 53a of Example 4, and the relationship with the board|substrate W by the cross section which passed the center axis|shaft of the holding|maintenance part 52a, 53a. FIG.9(b) is a figure which shows the shape of the holding|maintenance part 52a, 53a of the modification of Example 4, and the relationship with the board|substrate W by the cross section which passed the center axis|shaft of the holding|maintenance part 52a and 53a. In Example 1, the holding parts 52a and 53a were formed as protrusions having a substantially conical shape, but in Example 4, the shapes of the holding parts 52a and 53a were different. Here, the holding portion 52a includes a needle-shaped body 52a1 composed of a substantially conical portion having an apex 52a1p and a cylindrical portion, and a needle-shaped body 52a2 composed of a substantially conical portion having an apex 52a2p and a cylindrical portion constituted by the shape. The holding portion 53a includes a needle-shaped body 53a1 composed of a substantially conical portion having an apex 53a1p and a cylindrical portion, and a needle-shaped body 53a2 composed of a substantially conical portion having an apex 53a2p and a cylindrical portion. constitute. At this time, the orientations of the apex 52a1p, the apex 52a2p, the apex 53a1p, and the apex 53a2p all extend in a direction parallel to the longitudinal direction of the holding groove 1321 . As shown in FIG. 9( a ), by setting the cross-sectional shapes of the holding portions 52 a and 53 a to be wedge shapes sandwiched in the thickness direction of the substrate W, the contact area with the peripheral portion of the substrate W can be increased, and more The substrate W is held stably. The main body 52a1 of the holding part 52a has a sharp shape having a vertex 52a1p and a side surface 52a1s. In addition, the main body 52a2 of the holding part 52a also has a sharp shape having a vertex 52a2p and a side surface 52a2s. The main body 53a1 of the holding part 53a has a sharp shape having a vertex 53a1p and a side surface 53a1s. In addition, the main body 53a2 of the holding part 53a also has a sharp shape having a vertex 53a2p and a side surface 53a2s.

In addition, as shown in FIG.9(b), the cross-sectional shape of the holding parts 52a and 53a may be a shape sandwiched from both sides of the substrate W in the thickness direction. By sandwiching the peripheral edge portion of the substrate W from both sides in the thickness direction of the substrate W, even if the peripheral edge portion of the substrate W has a curved shape that protrudes toward the outer diameter side, or is not suitable for the wedge shape shown in FIG. 9( a ) In this case, the substrate W can be held more stably by sandwiching the peripheral edge portion of the substrate W from both sides. Here, the holding portion 52a is formed into a concave groove shape by the main body 52a1 and the main body 52a2. The holding portion 53a is also formed into a concave groove shape by the main body 53a1 and the main body 53a2. The main body 52a1 of the holding part 52a has a sharp shape having a vertex 52a1p and a side surface 52a1s. In addition, the main body 52a2 of the holding part 52a also has a sharp shape having a vertex 52a2p and a side surface 52a2s. The main body 53a1 of the holding part 53a has a sharp shape having a vertex 53a1p and a side surface 53a1s. In addition, the main body 53a2 of the holding part 53a also has a sharp shape having a vertex 53a2p and a side surface 53a2s.

<Example 5>

Hereinafter, Example 5 of the present invention will be described. The same reference numerals are used for the same structures as those in the first embodiment, and detailed descriptions are omitted. FIG. 10( a ) is a diagram showing the positional relationship of the lifter 13 , the substrate W, the support 52 , and the holding parts 52 a and 52 b in the inner tank 501 , similarly to FIG. 5 . Fig. 10(b) is an enlarged view showing the positional relationship between a part of the substrate W and the holding portions 52a and 52b in Fig. 10(a). As shown in FIGS. 4 and 5 , in Embodiment 1, on the support members 52 and 53 , with respect to the virtual plane Vp in the vertical direction including the normal to the surface Wf of the substrate W, the two sides in the horizontal direction are for each One holding portion 52a, 53a is provided for each of the substrates W, but in Example 5, one holding portion 52a, 53a is provided for each substrate W on the supports 52, 53, and one holding portion 52a, 53a is provided on the lower side thereof. holding parts 52b, 53b. The apex of the holding portion 52b is arranged to connect the apex of the holding portion 52a and the end of the holding groove 1321. (the positional relationship between the apex of the holding portion 53b, the apex of the holding portion 53a, and the end of the holding groove 1321 is also the same). The holding portions 52b and 53b are provided at positions shifted toward the positioning portion 524 of the support member 52 with respect to the corresponding holding portions 52a and 53a, and are located between the holding portions 52a and 53a and the corresponding substrates W are held. Keep the grooves between. Here, the holding parts 52b and 53b correspond to the second holding part and the second contact part of the present invention. There may be a plurality of holding parts between L0 and the center 1321c of the holding groove 1321 in the above-mentioned vertical direction, and the number and position of the holding parts can be adjusted for the purpose of matching the relationship between the processing liquid and the air bubbles from the bottom to the top. The strength of the flow, the raising and lowering speed of the substrate by the raising and lowering of the elevator, etc., suppress the rotation that occurs on the substrate.

<Variation>

In the above-mentioned embodiment, the holding parts 52a and 53a are formed in the shape of a substantially conical protrusion, a needle-shaped protrusion or a groove shape, but the shape of the holding parts 52a and 53a is not limited to this. In addition, in the above-mentioned embodiment, the case where the phosphoric acid aqueous solution is used as the treatment liquid has been described, but the treatment liquid is not limited to this, and other treatment liquids such as mixed acid (phosphoric acid, nitric acid, acetic acid, pure water) aqueous solution are used. , can also be applied in the same way. The embodiments and modifications disclosed above can be combined, respectively.

13: Lift

52: Supports

52a: Retention Department

132: Keep Stick

501: Inner groove

501a, 501b, 501d: side walls

524, 525: positioning part

1321: Keep Groove

5012a, 5013a: Bolts for position adjustment

5012b, 5013b: Nut

W: substrate

Wf: Surface

Claims (22)

A substrate processing apparatus comprising: a tank for storing a processing liquid for processing a substrate and immersing the substrate; and a holding member for holding the substrate in an upright posture and provided relative to the substrate The holding member has a holding groove for holding the substrate from below, a holding portion is provided in the groove, and the holding member holds the substrate at the processing position. In this state, the holding portion is positioned above the holding groove, and is in contact with the substrate at positions on both sides of the virtual horizontal direction including the vertical direction of the normal to the surface of the substrate, thereby suppressing the rotation of the substrate. . The substrate processing apparatus according to claim 1, wherein, corresponding to each of the plurality of substrates held and arranged by the holding member, the holding groove and the holding portion are provided in the direction in which the substrates are arranged, with respect to the free The phase shift of the plurality of holding grooves arranged in the arrangement direction is equivalent to a phase of half of the pitch between the adjacent holding grooves, and the phase shift of the plurality of holding portions arranged in the arrangement direction is is set to further offset. The substrate processing apparatus according to claim 1 or 2, wherein the holding portion is provided at a position lower than a horizontal plane passing through the center of the substrate held by the holding member. The substrate processing apparatus according to claim 1 or 2, wherein the shape of the holding groove on a cross section parallel to a vertical plane including a normal to the substrate is a wedge shape. The substrate processing apparatus according to claim 1 or 2, wherein the shape of the holding groove on a cross-section parallel to a vertical plane including a normal line to the substrate is modeled on the cross-section of a crystal edge portion of the substrate. formed shape. The substrate processing apparatus according to claim 1 or 2, further comprising a conveying mechanism capable of changing the holding portion and the portion held by the holding member in a horizontal direction at a position where the holding member is lowered into the groove. The space between the surfaces of the above-mentioned substrates. The substrate processing apparatus according to claim 1 or 2, wherein the holding portion is a substantially conical protrusion or a groove shape. The substrate processing apparatus according to claim 1 or 2, wherein a second holding portion is provided on the lower side of the holding portion, and the second holding portion is attached to a state in which the holding member holds the substrate at the processing position. It abuts on the substrate at positions on both sides of the horizontal direction of the virtual plane including the vertical direction of the normal to the substrate surface above the holding groove, and suppresses the rotation of the substrate. The substrate processing apparatus according to claim 1 or 2, wherein the tank is provided with: an ejection pipe for ejecting the processing liquid; and a bubble supply pipe for supplying bubbles from the bottom of the tank. The substrate processing apparatus according to claim 1 or 2, wherein the holding portion has a body of a sharp shape, and the body of the sharp shape is above and deeper than the holding groove of the holding member located at the processing position. On the lower side of the center, there are vertices that are spaced apart at intervals equal to those of the adjacent holding grooves, and the vertices are oriented in a direction parallel to the longitudinal direction of the holding grooves. The substrate processing apparatus of claim 10, wherein the sharp shape is a cone shape or a needle shape. The substrate processing apparatus according to claim 10, further comprising: 2. A holding portion having a body having a sharp shape, and the body having a sharp shape having vertices at a lower side than the holding portion and spaced apart at an interval equal to the interval between adjacent holding grooves. The substrate processing apparatus according to claim 1 or 2, wherein the holding portion has a sharp shape. The substrate processing apparatus according to claim 1 or 2, wherein the holding portion includes two bodies formed so as to be sandwiched from both sides in the thickness direction of the substrate, and at least one of the two bodies is in contact with each other on the above substrate. The substrate processing apparatus according to claim 14, wherein the two main bodies respectively have a roughly conical portion in a roughly conical shape and a cylindrical portion in a cylindrical shape. The substrate processing apparatus according to claim 1 or 2, wherein the holding portion is in contact with a peripheral edge portion of the surface of the substrate. The substrate processing apparatus according to claim 1 or 2, wherein a plurality of the holding grooves and a plurality of the holding portions are provided in the above-mentioned holding grooves at equal intervals corresponding to each of the plurality of the above-mentioned substrates held and arranged by the holding member. The arrangement direction of the substrates, the mutual positional relationship between the centers of the plurality of holding grooves and the mutual positional relationship between the plurality of the holding portions provided at equal intervals are shifted in the arrangement direction of the substrates. A substrate processing apparatus comprising: a tank for storing a processing liquid, for immersing a flat substrate in an upright posture and processing; The inner processing positions can be raised and lowered, and have a plurality of concave holding grooves, the plurality of holding grooves are held and placed on the substrate from below the standing posture; and an abutting portion which abuts against the substrate held by the holding groove, and has a body with a sharp shape that is higher than the holding groove of the holding member located at the processing position and higher than the groove On the lower side of the depth center, there are vertices that are spaced apart at equal intervals with the adjacent holding grooves, and the direction of the vertices extends in a direction parallel to the longitudinal direction of the holding grooves; The part is provided in the above-mentioned groove. The substrate processing apparatus of claim 18, wherein the sharp shape is a cone shape or a needle shape. The substrate processing apparatus according to claim 18 or 19, further comprising a second abutting portion having a sharp-shaped main body, and the sharply-shaped main body has on the lower side of the abutting portion so as to be in contact with the adjacent abutting portion. Keep the grooves equally spaced apart from the vertices. The substrate processing apparatus according to claim 18 or 19, wherein the abutting portion is in contact with a peripheral edge portion of the surface of the substrate. The substrate processing apparatus according to claim 18 or 19, wherein a plurality of the holding grooves and a plurality of the abutting portions are provided at equal intervals in correspondence with each of the plurality of the substrates held and arranged by the holding member. In the arrangement direction of the substrates, the mutual positional relationship between the centers of the plurality of holding grooves and the mutual positional relationship between the plurality of the abutting portions provided at equal intervals are shifted in the arrangement direction of the substrates.

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