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TWI753157B - 模製模具及樹脂模製方法 - Google Patents

模製模具及樹脂模製方法 Download PDF

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Publication number
TWI753157B
TWI753157B TW107114708A TW107114708A TWI753157B TW I753157 B TWI753157 B TW I753157B TW 107114708 A TW107114708 A TW 107114708A TW 107114708 A TW107114708 A TW 107114708A TW I753157 B TWI753157 B TW I753157B
Authority
TW
Taiwan
Prior art keywords
workpiece
mold
resin
molding
cavity
Prior art date
Application number
TW107114708A
Other languages
English (en)
Chinese (zh)
Other versions
TW201902650A (zh
Inventor
野村祐大
齊藤高志
Original Assignee
日商山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商山田尖端科技股份有限公司 filed Critical 日商山田尖端科技股份有限公司
Publication of TW201902650A publication Critical patent/TW201902650A/zh
Application granted granted Critical
Publication of TWI753157B publication Critical patent/TWI753157B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H10W74/01—
    • H10W72/0198—
    • H10W74/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW107114708A 2017-05-18 2018-04-30 模製模具及樹脂模製方法 TWI753157B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-098772 2017-05-18
JP2017098772A JP6742273B2 (ja) 2017-05-18 2017-05-18 モールド金型及び樹脂モールド方法

Publications (2)

Publication Number Publication Date
TW201902650A TW201902650A (zh) 2019-01-16
TWI753157B true TWI753157B (zh) 2022-01-21

Family

ID=64274475

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107114708A TWI753157B (zh) 2017-05-18 2018-04-30 模製模具及樹脂模製方法

Country Status (5)

Country Link
JP (1) JP6742273B2 (ja)
KR (1) KR102342209B1 (ja)
CN (1) CN110621463B (ja)
TW (1) TWI753157B (ja)
WO (1) WO2018211909A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7203414B2 (ja) * 2018-12-27 2023-01-13 アピックヤマダ株式会社 樹脂供給取出装置、ワーク搬送装置及び樹脂モールド装置
JP7121705B2 (ja) * 2019-07-29 2022-08-18 アピックヤマダ株式会社 樹脂モールド金型
CN111186078B (zh) * 2020-01-07 2021-12-07 宁波公牛电器有限公司 一种注塑成型方法
KR102496709B1 (ko) * 2021-06-28 2023-02-06 케이비아이동국실업 주식회사 크래쉬 패드용 사출금형의 스크림 고정 구조
CN116373346B (zh) * 2023-04-21 2025-09-02 北京维盛复合材料有限公司 一种分段式高压注射树脂传递成型工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015051557A (ja) * 2013-09-06 2015-03-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置並びに樹脂モールド方法
TW201709359A (zh) * 2015-07-15 2017-03-01 山田尖端科技股份有限公司 模製模具及樹脂模製裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11284002A (ja) * 1998-03-31 1999-10-15 Sumitomo Heavy Ind Ltd 半導体素子の樹脂封止装置
JP4426880B2 (ja) * 2004-03-12 2010-03-03 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP5193609B2 (ja) * 2008-01-17 2013-05-08 アピックヤマダ株式会社 金型装置
CN101767406B (zh) * 2008-12-30 2013-08-07 比亚迪股份有限公司 一种成型手机导光板的模具及制造手机导光板的工艺
CN101480852B (zh) * 2009-02-04 2011-08-17 武汉循环经济研究院 一种加工包装盒的设备及方法
JP5055326B2 (ja) * 2009-06-29 2012-10-24 Ｔｏｗａ株式会社 樹脂封止型及び樹脂封止方法
SG195616A1 (en) * 2009-11-30 2013-12-30 Husky Injection Molding Molding apparatus
JP5229292B2 (ja) * 2010-10-01 2013-07-03 第一精工株式会社 樹脂封止装置および樹脂封止方法
JP5759181B2 (ja) * 2011-01-12 2015-08-05 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP5909771B2 (ja) * 2012-07-03 2016-04-27 アピックヤマダ株式会社 樹脂封止装置
SG10201807673SA (en) * 2014-03-07 2018-10-30 Agc Inc Process for producing package for mounting a semiconductor element and mold release film
JP6143711B2 (ja) * 2014-06-02 2017-06-07 Ｔｏｗａ株式会社 半導体圧縮樹脂封止方法及び半導体圧縮樹脂封止装置
JP2016111323A (ja) * 2014-11-26 2016-06-20 株式会社デンソー 基板固定装置
JP6749286B2 (ja) * 2017-06-20 2020-09-02 アピックヤマダ株式会社 モールド金型及び樹脂モールド方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015051557A (ja) * 2013-09-06 2015-03-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置並びに樹脂モールド方法
TW201709359A (zh) * 2015-07-15 2017-03-01 山田尖端科技股份有限公司 模製模具及樹脂模製裝置

Also Published As

Publication number Publication date
CN110621463B (zh) 2021-10-15
JP2018192712A (ja) 2018-12-06
CN110621463A (zh) 2019-12-27
KR20200008597A (ko) 2020-01-28
WO2018211909A1 (ja) 2018-11-22
KR102342209B1 (ko) 2021-12-22
TW201902650A (zh) 2019-01-16
JP6742273B2 (ja) 2020-08-19

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