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TWI750873B - Transfer module, cutting device, and method of manufacturing cut product - Google Patents

Transfer module, cutting device, and method of manufacturing cut product Download PDF

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Publication number
TWI750873B
TWI750873B TW109137409A TW109137409A TWI750873B TW I750873 B TWI750873 B TW I750873B TW 109137409 A TW109137409 A TW 109137409A TW 109137409 A TW109137409 A TW 109137409A TW I750873 B TWI750873 B TW I750873B
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cutting
cut
cut product
moving body
products
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TW109137409A
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TW202119488A (en
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宮田和志
黃善夏
石橋幹司
森下慎也
大西將馬
堀本京太郎
尾關貴俊
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日商Towa股份有限公司
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    • H10P72/32
    • H10P72/3212
    • H10P52/00
    • H10P54/00
    • H10P72/0428
    • H10P72/3202
    • H10P72/3218

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  • Engineering & Computer Science (AREA)
  • Dicing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Air Transport Of Granular Materials (AREA)

Abstract

本發明提供一種能夠可靠地輸送多個切割品之輸送模組、切割裝置以及切割品之製造方法。輸送模組包含:移動體(44),其配置在切割台(12b)上,能夠一邊與封裝基板(S)被切割而形成之多個切割品(Sa)接觸一邊移動;驅動機構(46),其驅動移動體(44);以及移送機構(47),其移送多個切割品(Sa);移送機構(47)藉由移動體(44)將與移動體(44)接觸之切割品(Sa)自切割台(12b)分離並移送。The present invention provides a conveying module capable of reliably conveying a plurality of cut products, a cutting device, and a manufacturing method of the cut products. The conveying module comprises: a moving body (44), which is arranged on the cutting table (12b) and can move while being in contact with a plurality of cut products (Sa) formed by cutting the package substrate (S); a driving mechanism (46) , which drives the moving body (44); and a transfer mechanism (47), which transfers a plurality of cutting products (Sa); Sa) is separated from the cutting table (12b) and transferred.

Description

輸送模組、切割裝置以及切割品之製造方法Conveying module, cutting device and manufacturing method of cutting product

本發明係關於輸送模組、包括輸送模組之切割裝置以及切割品之製造方法。 The present invention relates to a conveying module, a cutting device including the conveying module, and a manufacturing method of a cut product.

搭載有晶片之引線框架、基板等通常藉由樹脂封裝而用作電子部件。以往,習知有如下切割裝置:在將以搭載多個晶片之方式佈線之基板共同進行樹脂封裝而製造封裝基板後,將該封裝基板切割(單片化)而製造多個切割品(電子部件)(例如,參照專利文獻1至2)。 A lead frame on which a chip is mounted, a substrate, and the like are generally used as electronic components by resin encapsulation. Conventionally, a dicing apparatus has been known in which a package board is produced by resin-sealing the boards wired so as to mount a plurality of chips together, and then dicing (separating) the package board to produce a plurality of diced products (electronic components). ) (for example, refer to Patent Documents 1 to 2).

專利文獻1所記載之切割裝置包含:保持台,藉由保持帶對封裝基板進行吸附保持;切削刀片,將保持台上之封裝基板切割為多個切割品;以及抽吸回收單元,對保持台上之多個切割品進行抽吸並輸送。在該抽吸回收單元中,藉由供給至管狀部件之壓縮空氣來抽吸多個切割品並自保持帶剝離,沿著配置於管狀部件出口側之旋風容器之內壁面,使切割品以螺旋狀下落的同時回收至收納箱。 The dicing device described in Patent Document 1 includes: a holding table for adsorbing and holding the package substrate by a holding tape; a cutting blade for dicing the package substrate on the holding table into a plurality of diced products; and a suction recovery unit for holding the holding table A plurality of cutting products above are suctioned and transported. In this suction and recovery unit, a plurality of cut products are sucked by the compressed air supplied to the tubular member and peeled off from the holding belt, and the cut products are spirally formed along the inner wall surface of the cyclone container arranged on the outlet side of the tubular member. When it falls, it is collected into the storage box.

專利文獻2所記載之切割裝置包含:抽吸源,用於自保持台之下方抽吸封裝基板;切削刀片,將保持台上之封裝基板切割為多個切割品;以及 抽吸單元,藉由配置於上方之抽吸頭來抽吸保持台上之多個切割品並輸送。在切斷抽吸源之負壓之後,使負壓作用於抽吸單元之抽吸頭而抽吸多個切割品,隨著氣體或液體之流動而輸送切割品。 The dicing device described in Patent Document 2 includes: a suction source for sucking the package substrate from below the holding table; a cutting blade for cutting the package substrate on the holding table into a plurality of diced products; and The suction unit sucks and transports a plurality of cut products on the holding table by means of a suction head disposed above. After cutting off the negative pressure of the suction source, make the negative pressure act on the suction head of the suction unit to suck a plurality of cutting products, and convey the cutting products with the flow of gas or liquid.

在先技術文獻 prior art literature 專利文獻 Patent Literature

專利文獻1:日本特開2014-220459號公報; Patent Document 1: Japanese Patent Laid-Open No. 2014-220459;

專利文獻2:日本特開2017-152442號公報。 Patent Document 2: Japanese Patent Laid-Open No. 2017-152442.

在以往的切割裝置中,當切割品之尺寸例如小至不足2mm見方時,輸送變得困難。如專利文獻1所記載之切割裝置那樣,在利用抽吸力將多個切割品自保持帶剝離之情況下,當抽吸力過弱時,殘留無法輸送之切割品,當抽吸力過強時,切割品可能會破損。另外,在專利文獻2所記載之切割裝置中,在利用抽吸頭進行抽吸之情況下,當抽吸力過弱時,亦殘留無法輸送之切割品,當抽吸力過強時,切割品亦可能會破損。 In the conventional cutting apparatus, when the size of the cut product is as small as, for example, less than 2 mm square, it becomes difficult to convey it. As in the dicing device described in Patent Document 1, when a plurality of cut products are peeled off from the holding belt by suction force, when the suction force is too weak, cut products that cannot be conveyed remain, and when the suction force is too strong , the cut product may be damaged. In addition, in the cutting device described in Patent Document 2, when suction is performed with a suction head, when the suction force is too weak, a cut product that cannot be transported remains, and when the suction force is too strong, the cutting The product may also be damaged.

因此,期望能夠可靠地輸送多個切割品之輸送模組、切割裝置以及切割品之製造方法。 Therefore, a conveying module, a cutting device, and a manufacturing method of a cutting product capable of reliably conveying a plurality of cut products are desired.

本發明涉及之輸送模組之特徵結構在於,包含:移動體,配置在切 割台上,能夠一邊與封裝基板被切割而形成之多個切割品接觸一邊移動;驅動機構,驅動該移動體;以及移送機構,移送多個該等切割品;藉由該移動體之旋轉將與該移動體接觸之該等切割品自該切割台分離並移送。 The characteristic structure of the conveying module according to the present invention is that it comprises: a moving body arranged in the cutting On the header, it can move while being in contact with a plurality of cut products formed by cutting the package substrate; a drive mechanism drives the moving body; and a transfer mechanism transfers a plurality of the cut products; The cut articles in contact with the moving body are separated from the cutting table and transferred.

本發明涉及之切割裝置之特徵結構在於,包含:該輸送模組;切割機構,切割該等切割品;以及清洗機構,對由該移送機構移送之該等切割品進行清洗。 The characteristic structure of the cutting device according to the present invention is that it includes: the conveying module; a cutting mechanism for cutting the cut products; and a cleaning mechanism for cleaning the cut products transferred by the transfer mechanism.

本發明涉及之切割品之製造方法的特徵在於,使用該切割裝置來製造該等切割品。 The method for producing a cut product according to the present invention is characterized in that the cut product is manufactured using the cutting device.

根據本發明,提供一種能夠可靠地輸送多個切割品之輸送模組、切割裝置以及切割品之製造方法。 According to the present invention, a conveying module capable of reliably conveying a plurality of cut products, a cutting device, and a manufacturing method of the cut products are provided.

1:切割模組 1: Cutting module

2:清洗模組 2: Cleaning module

2A:清洗機構 2A: Cleaning mechanism

2B:流體供排機構 2B: Fluid supply and discharge mechanism

2C:回收箱 2C: Recycle Bin

3:控制部 3: Control Department

4:輸送模組 4: Conveying module

11:接收部 11: Receiving Department

11a:預工作台 11a: Pre-bench

12:切割機構 12: Cutting mechanism

12a:切割用移送機構 12a: Transfer mechanism for cutting

12b:切割台 12b: Cutting table

12c:切割部 12c: Cutting section

12c1:主軸部 12c1: Spindle part

12c2:旋轉刀片 12c2: Rotary Blade

20a:分支部 20a: Branches

20b:最高水位 20b: Maximum water level

21:容器 21: Container

21b:內筒 21b: Inner cylinder

21b1:傾斜面 21b1: Inclined surface

21c:微細孔 21c: Micropores

21d:環狀凸緣 21d: annular flange

21d1:傾斜突起 21d1: Oblique protrusion

22:旋轉機構 22: Rotary mechanism

22a:電動馬達 22a: Electric motors

22b:旋轉軸 22b: Rotary axis

23:供液機構 23: Liquid supply mechanism

23a:供液管 23a: Liquid supply pipe

24:排液機構 24: Drainage mechanism

24a:排液管 24a: Drain pipe

25:供氣機構 25: Air supply mechanism

25a:供氣管 25a: Air supply pipe

26:排氣機構 26: Exhaust mechanism

26a:排氣管 26a: Exhaust pipe

27:轉動反轉機構 27: Rotate the reversing mechanism

27a:夾緊機構 27a: Clamping mechanism

27a1:夾緊部件 27a1: Clamping parts

27b:轉動機構 27b: Turning mechanism

27b1:轉動軸 27b1: Rotary axis

27c:內筒反轉機構 27c: Inner cylinder reversing mechanism

27c1:反轉軸 27c1: Reverse axis

27d:內筒上下機構 27d: Inner cylinder up and down mechanism

28:排出機構 28: Discharge mechanism

28a:外筒 28a: outer cylinder

28a1:內插管 28a1: Intubation tube

28a2:傾斜突起 28a2: Oblique protrusion

28b:排出管 28b: discharge pipe

29:真空機構 29: Vacuum mechanism

29a:真空管 29a: Vacuum Tube

30:蓋 30: Cover

31:蓋移動機構 31: Cover moving mechanism

43:液體供給機構 43: Liquid supply mechanism

44:移動體 44: Moving body

44a:旋轉本體 44a: rotating body

44a1:旋轉軸 44a1: Rotary axis

44b:突出部 44b: Protrusion

44c:引導槽 44c: Guide slot

45:收納部 45: Storage Department

45b:收納部 45b: Storage Department

46:驅動機構 46: Drive mechanism

46a:旋轉驅動機構 46a: Rotary drive mechanism

46b:滑動驅動機構 46b: Sliding drive mechanism

46c:切換機構 46c: Switching mechanism

47:移送機構 47: Transfer mechanism

47a:撓性管(抽吸路) 47a: Flexible tube (suction path)

47b:一端 47b: one end

47c:另一端 47c: The other end

48a:液流路 48a: Liquid flow path

48b:供給路 48b: Supply Road

49:液體供給機構 49: Liquid supply mechanism

B:可動箱 B: movable box

Ba:可動箱 Ba: movable box

Bb:可動箱 Bb: movable box

D:切割裝置 D: cutting device

E:樹脂成形裝置 E: Resin molding device

R:旋轉方向 R: direction of rotation

S:封裝基板 S: package substrate

Sa:切割品 Sa: cut product

T:中間筒 T: Intermediate tube

Va~Vf:開閉閥 Va~Vf: On-off valve

圖1係展示切割裝置之示意圖;圖2係展示輸送模組之概略圖;圖3係展示清洗模組之概略立體圖;圖4係圖3之IV-IV線剖視圖;圖5係展示將可動區塊移動至輸送開始位置之狀態的概略圖;圖6係展示移送切割品之狀態的概略圖;圖7係展示將可動區塊移動至輸送結束位置之狀態的概略圖; 圖8係展示使清洗模組之容器移動之狀態的剖視圖;圖9係展示使清洗模組之容器移動之狀態的俯視圖;圖10係展示清洗模組之反轉機構的概略立體圖;圖11係展示其他實施方式1涉及之輸送模組的概略圖;圖12係展示其他實施方式1涉及之切割品輸送狀態的概略圖;圖13係展示其他實施方式2涉及之輸送模組的概略圖;圖14係其他實施方式2涉及之液流原理的說明圖;圖15係展示其他實施方式2涉及之切割品輸送狀態的概略圖。 Fig. 1 is a schematic diagram showing a cutting device; Fig. 2 is a schematic diagram showing a conveying module; Fig. 3 is a schematic perspective view showing a cleaning module; Fig. 4 is a sectional view taken along line IV-IV of Fig. 3; Schematic diagram of the state in which the block is moved to the conveying start position; FIG. 6 is a schematic diagram showing the state in which the cut product is transferred; FIG. 7 is a schematic diagram showing the state in which the movable block is moved to the conveying end position; 8 is a cross-sectional view showing a state in which the container of the cleaning module is moved; FIG. 9 is a plan view showing a state in which the container of the cleaning module is moved; FIG. 10 is a schematic perspective view showing a reversing mechanism of the cleaning module; Fig. 12 is a schematic diagram showing the conveying state of the cut product according to the other embodiment 1; Fig. 13 is a schematic diagram showing the conveying module according to the other embodiment 2; Fig. 14 is an explanatory diagram of the principle of the liquid flow according to the other embodiment 2;

以下,基於圖式對本發明涉及之輸送模組、切割裝置以及切割品之製造方法之實施方式進行說明。但是,並不限於以下的實施方式,在不脫離其主旨之範疇內可以進行各種變形。 Hereinafter, embodiments of the conveying module, the cutting device, and the manufacturing method of the cut product according to the present invention will be described based on the drawings. However, it is not limited to the following embodiments, and various modifications can be made without departing from the gist.

[裝置結構] [device structure]

搭載有晶片之引線框架、基板等成形對象物藉由進行樹脂封裝而用作電子部件。作為對成形對象物進行樹脂封裝之技術,可舉出壓縮方式或轉移方式。壓縮方式例如係在脫模膜上供給液態或粉粒體狀之樹脂後,將該脫模膜載置於成形模具之腔中,並將成形對象物浸漬在脫模膜上之樹脂中進行樹脂成形的方式。轉移方式例如係將成形對象物收納於成形模具之腔中,向成形模具之罐供給樹脂料片而進行加熱、熔融後,將熔融樹脂供給至腔而進行樹脂成形的方式。 Molded objects such as lead frames and substrates on which chips are mounted are used as electronic components by resin encapsulation. As a technique for resin-encapsulating the object to be molded, a compression method or a transfer method can be mentioned. The compression method is, for example, after supplying a resin in liquid or granular form on a release film, placing the release film in the cavity of a molding die, and immersing the object to be molded in the resin on the release film for resin removal. the way it takes shape. The transfer method is, for example, a method in which an object to be molded is accommodated in a cavity of a molding die, a resin tablet is supplied to a tank of the molding die, heated and melted, and then molten resin is supplied to the cavity to perform resin molding.

關於壓縮方式或轉移方式之樹脂成形裝置,自製造效率化之觀點出發,有時使用製造將以搭載多個晶片之方式佈線係基板共同進行樹脂封裝之模具陣列封裝(mold array packaging,MAP)等封裝基板的裝置。在該裝置中製造封裝基板後,利用切割裝置切割(單片化),所形成之切割品在經過品質檢查之後被用作電子部件。在切割裝置中,對封裝基板被切割而形成之多個切割品進行輸送、清洗、乾燥,但若切割品之尺寸小至不足例如2mm見方,則輸送變得困難。因此,在本實施方式中,提供能夠可靠地輸送多個切割品之輸送模組、切割裝置以及切割品之製造方法。以下,將搭載有多個半導體晶片之封裝基板作為切割對象物之一例進行說明,有時將重力方向作為下方、將與重力方向相反之方向作為上方進行說明。 Regarding the resin molding apparatus of the compression method or the transfer method, from the viewpoint of manufacturing efficiency, a mold array packaging (MAP) or the like is sometimes used to manufacture a resin-encapsulated wiring-based substrate in a manner of mounting a plurality of chips. A device that encapsulates a substrate. After the package substrate is produced in this apparatus, it is cut (singulated) with a dicing apparatus, and the formed cut product is used as an electronic component after passing the quality inspection. In a dicing device, a plurality of diced products formed by dicing a package substrate are conveyed, cleaned, and dried. However, when the size of the diced products is smaller than, for example, 2 mm square, transportation becomes difficult. Therefore, in the present embodiment, a conveying module capable of reliably conveying a plurality of cut products, a cutting device, and a method of manufacturing the cut products are provided. Hereinafter, a package substrate on which a plurality of semiconductor chips are mounted will be described as an example of a dicing object, and the direction of gravity may be referred to as the downward direction and the direction opposite to the direction of gravity may be described as the upper direction.

圖1中展示切割裝置D之示意圖。本實施方式中之切割裝置D與樹脂成形裝置E分體構成,接收由樹脂成形裝置E進行了樹脂封裝之封裝基板S,將該封裝基板S切割、清洗、乾燥,製造多個切割品Sa。該等製造出之切割品Sa在經過了規定的品質檢查之後被用作電子部件。 A schematic diagram of a cutting device D is shown in FIG. 1 . The dicing device D in this embodiment is constituted separately from the resin molding device E, receives the package substrate S resin-encapsulated by the resin molding device E, cuts, cleans, and dries the package substrate S to manufacture a plurality of diced products Sa. These manufactured cut products Sa are used as electronic components after passing through a predetermined quality inspection.

切割裝置D包含切割模組1、清洗模組2以及控制部3。切割模組1及清洗模組2能夠獨立地安裝或拆卸。另外,切割裝置D在切割模組1及清洗模組2之範圍內包含輸送模組4。控制部3作為控制切割裝置D之動作之軟體,包括儲存於硬碟機(Hard Disk Drive,HDD)、記憶體等硬體之程式,藉由電腦之中央處理單元(Central Processing Unit,CPU)執行。亦即,控制部3控制切割模組1、清洗模組2以及輸送模組4之動作。 The cutting device D includes a cutting module 1 , a cleaning module 2 and a control unit 3 . The cutting module 1 and the cleaning module 2 can be installed or removed independently. In addition, the cutting device D includes a conveying module 4 within the scope of the cutting module 1 and the cleaning module 2 . The control unit 3 is a software for controlling the action of the cutting device D, including programs stored in a hard disk drive (Hard Disk Drive, HDD), memory and other hardware, and executed by a central processing unit (CPU) of the computer . That is, the control unit 3 controls the operations of the cutting module 1 , the cleaning module 2 and the conveying module 4 .

切割模組1包含接收部11及切割機構12。此外,接收部11、切割機構12之個數亦可以設定成一個或兩個以上,沒有特別限定。 The cutting module 1 includes a receiving portion 11 and a cutting mechanism 12 . In addition, the number of the receiving portion 11 and the cutting mechanism 12 may be set to one or two or more, and is not particularly limited.

接收部11自樹脂成形裝置E接收俯視呈矩形狀之封裝基板S作為切割對象物。所接收之封裝基板S載置於預工作台11a上。切割機構12包含移送封裝基板S之兩個切割用移送機構12a、配置在切割用移送機構12a上之兩個切割台12b、以及兩個切割部12c。切割用移送機構12a構成為在封裝基板S被固定在切割台12b上之狀態下,能夠在Y方向上移動,並且能夠在θ方向上旋轉。切割用移送機構12a及切割部12c之驅動源沒有特別限定,例如可以使用伺服馬達等電動馬達。 The receiving unit 11 receives the package substrate S having a rectangular shape in plan view from the resin molding apparatus E as a dicing object. The received package substrate S is placed on the pre-stage 11a. The dicing mechanism 12 includes two dicing transfer mechanisms 12a that transfer the package substrate S, two dicing tables 12b arranged on the dicing transfer mechanism 12a, and two dicing portions 12c. The transfer mechanism 12a for dicing is configured to be movable in the Y direction and rotatable in the θ direction in a state where the package substrate S is fixed to the dicing table 12b. The drive source of the transfer mechanism 12a for cutting and the cutting part 12c is not particularly limited, and, for example, an electric motor such as a servo motor can be used.

在切割台12b中,自接收部11接收之封裝基板S以被樹脂封裝之一側作為下表面藉由空氣吸附等被固定。切割部12c包含主軸部12c1及旋轉刀片12c2,藉由旋轉刀片12c2切割固定於切割台12b之封裝基板S。另外,在切割台12b之上表面,亦即固定封裝基板S之固定面上,以能夠供旋轉刀片12c2進入之方式形成有槽。旋轉刀片12c2固定於主軸部12c1之旋轉軸,構成為能夠沿X方向及Z方向移動,並且能夠高速旋轉。切割用移送機構12a沿Y方向及θ方向移動及旋轉,旋轉刀片12c2沿X方向及Z方向移動,由此調整旋轉刀片12c2與封裝基板S之相對位置。一邊反覆進行該相對位置之調整,一邊利用旋轉刀片12c2將封裝基板S以自上表面朝向下表面貫通的方式切割,形成俯視呈矩形狀之多個切割品Sa。此時,亦可以一邊向旋轉刀片12c2與封裝基板S之接觸部位供給切削水一邊進行切割。另外,亦可以使切割用移送機構12a或旋轉刀片12c2中之任一者移動而進行 相對位置之調整。另外,兩個切割部12c能夠處於主軸部12c1為直線狀且旋轉刀片12c2相互對置的位置,兩個旋轉刀片12c2之間隔距離係可變的,在X方向上亦可以移動至兩個切割台12b中任一者之上部。 In the dicing table 12b, the package substrate S received from the receiving portion 11 is fixed by air suction or the like with the side encapsulated by the resin as the lower surface. The cutting part 12c includes a spindle part 12c1 and a rotating blade 12c2, and the package substrate S fixed to the cutting table 12b is cut by the rotating blade 12c2. In addition, a groove is formed on the upper surface of the dicing table 12b, that is, on the fixing surface to which the package substrate S is fixed, so that the rotary blade 12c2 can enter. The rotary blade 12c2 is fixed to the rotation shaft of the main shaft portion 12c1, and is configured to be movable in the X direction and the Z direction, and to be able to rotate at high speed. The transfer mechanism 12a for dicing moves and rotates in the Y direction and the θ direction, and the rotary blade 12c2 moves in the X direction and the Z direction, whereby the relative position of the rotary blade 12c2 and the package substrate S is adjusted. While repeatedly performing the relative position adjustment, the package substrate S is diced by the rotary blade 12c2 so as to penetrate from the upper surface to the lower surface, thereby forming a plurality of diced products Sa having a rectangular shape in plan view. At this time, dicing may be performed while supplying cutting water to the contact portion of the rotary blade 12c2 and the package substrate S. In addition, it may be performed by moving any one of the transfer mechanism 12a for dicing or the rotary blade 12c2 Adjustment of relative position. In addition, the two cutting parts 12c can be located at the positions where the main shaft part 12c1 is linear and the rotating blades 12c2 are opposed to each other, the distance between the two rotating blades 12c2 is variable, and the two cutting tables can also be moved in the X direction. Above any of 12b.

清洗模組2包含清洗機構2A、流體供排機構2B及俯視呈矩形狀之回收箱2C。清洗機構2A將多個切割品Sa與水等清洗液一起收納在容器21內,藉由使該容器21旋轉而產生液流來清洗多個切割品Sa。流體供排機構2B包含氣體供排泵(未圖示),該氣體供排泵向清洗機構2A之容器21內供給壓縮空氣、或抽吸後述之撓性管47a內之空氣並將其排出。另外,流體供排機構2B能夠自供水源(例如自來水道、工廠內之純水供給管)向容器21內供給清洗液。清洗模組2之細節將在後面敍述。 The cleaning module 2 includes a cleaning mechanism 2A, a fluid supply and discharge mechanism 2B, and a collection box 2C that is rectangular in plan view. The cleaning mechanism 2A accommodates the plurality of cut products Sa in the container 21 together with a cleaning liquid such as water, and cleans the plurality of cut products Sa by rotating the container 21 to generate a liquid flow. The fluid supply and discharge mechanism 2B includes a gas supply and discharge pump (not shown) that supplies compressed air into the container 21 of the cleaning mechanism 2A, or sucks and discharges air in a flexible tube 47a described later. In addition, the fluid supply and discharge mechanism 2B can supply the cleaning liquid into the container 21 from a water supply source (for example, a water supply, a pure water supply pipe in a factory). Details of the cleaning module 2 will be described later.

如圖2所示,輸送模組4包含:移動體44,配置在切割機構12之切割台12b上,能夠一邊與封裝基板S被切割而形成之多個切割品Sa接觸一邊移動;可動箱B,支承移動體44;驅動機構46,驅動移動體44;以及移送機構47,移送多個切割品Sa。 As shown in FIG. 2 , the conveying module 4 includes: a moving body 44, which is arranged on the cutting table 12b of the cutting mechanism 12 and can move while contacting a plurality of cut products Sa formed by cutting the package substrate S; a movable box B , which supports the moving body 44 ; the driving mechanism 46 , which drives the moving body 44 ; and the transfer mechanism 47 , which transfers the plurality of cut products Sa.

移動體44包含旋轉軸44a1、固定於旋轉軸44a1之旋轉本體44a、以及自旋轉本體44a之周圍向徑向外側突出的多個突出部44b。多個突出部44b在與切割品Sa接觸而自切割台12b分離時不易變形,由不損傷切割品Sa之耐綸、聚對苯二甲酸丁二醇酯(PBT)等樹脂材料構成。作為移動體44,例如能夠採用配置有多個直徑為0.10mm至0.13mm之樹脂製之突出部44b的刷狀結構。 The movable body 44 includes a rotating shaft 44a1, a rotating body 44a fixed to the rotating shaft 44a1, and a plurality of protrusions 44b protruding radially outward from the periphery of the rotating body 44a. The plurality of protrusions 44b are not easily deformed when they come into contact with the dicing product Sa and are separated from the dicing table 12b, and are made of resin materials such as nylon and polybutylene terephthalate (PBT) which do not damage the dicing product Sa. As the movable body 44, for example, a brush-like structure in which a plurality of resin-made protrusions 44b having a diameter of 0.10 mm to 0.13 mm is arranged can be employed.

可動箱B係經由軸承(未圖示)等來支承旋轉軸44a1之框體,後述之移送機構47之撓性管47a固定於上部。可動箱B構成為能夠藉由後述之滑動驅動機構46b在X方向及Z方向上滑動移動。 The movable case B is a frame body which supports the rotating shaft 44a1 via a bearing (not shown) etc., and the flexible tube 47a of the transfer mechanism 47 mentioned later is fixed to the upper part. The movable box B is configured to be slidable in the X direction and the Z direction by a slide drive mechanism 46b described later.

驅動機構46包含:旋轉驅動機構46a,使移動體44繞旋轉軸44a1旋轉;以及滑動驅動機構46b,使可動箱B沿X方向及Z方向滑動移動。旋轉驅動機構46a使移動體44之前方在旋轉方向R(圖2中為逆時針方向)上旋轉,該旋轉方向R相對於行進方向(+X方向)向上交叉。亦即,移動體44在旋轉狀態下最接近切割台12b之位置處的旋轉切線方向與移動方向相同。該驅動機構46之驅動源由伺服馬達等電動馬達、氣缸等構成。 The drive mechanism 46 includes a rotation drive mechanism 46a that rotates the movable body 44 around the rotating shaft 44a1, and a slide drive mechanism 46b that slides the movable box B in the X and Z directions. The rotational drive mechanism 46a rotates the moving body 44 forward in a rotational direction R (counterclockwise in FIG. 2 ) that crosses upward with respect to the traveling direction (+X direction). That is, the rotation tangent direction at the position closest to the cutting table 12b in the rotating state of the moving body 44 is the same as the moving direction. The drive source of the drive mechanism 46 is constituted by an electric motor such as a servo motor, an air cylinder, or the like.

移送機構47包含:撓性管47a(抽吸路之一例),氣體及液體與切割品Sa在其中一起流通;真空機構29,利用流體供排機構2B所包括之氣體供排泵之驅動力來抽吸切割台12b上之多個切割品Sa;以及液體供給機構43,將水等液體供給至撓性管47a。撓性管47a之一端47b與供給水等液體之液體供給機構43連接,撓性管47a之另一端47c與容器21之內部連通。真空機構29包括氣體供排泵及真空管29a,該氣體供排泵設置於流體供排機構2B,該真空管29a之一端與氣體供排泵連接以能夠排氣,另一端與後述之外筒28a及中間筒T之底壁連接。在真空機構29之真空管29a設置有由電磁閥等構成之開閉閥Vf。與移動體44之突出部44b接觸而自切割台12b分離的多個切割品Sa受到藉由真空機構29作用於撓性管47a之負壓而流入撓性管47a,並藉由來自液體供給機構43之液流而被移送至容器21。 The transfer mechanism 47 includes: a flexible tube 47a (an example of a suction path) in which gas and liquid circulate together with the cut product Sa; The plurality of cut products Sa on the cutting table 12b are sucked; and the liquid supply mechanism 43 is supplied to the flexible tube 47a with liquid such as water. One end 47b of the flexible tube 47a is connected to a liquid supply mechanism 43 for supplying a liquid such as water, and the other end 47c of the flexible tube 47a is communicated with the inside of the container 21 . The vacuum mechanism 29 includes a gas supply and exhaust pump and a vacuum pipe 29a. The gas supply and exhaust pump is provided in the fluid supply and exhaust mechanism 2B. One end of the vacuum pipe 29a is connected to the gas supply and exhaust pump so as to be able to exhaust gas, and the other end is connected to the outer cylinder 28a and the outer cylinder 28a described later. The bottom wall of the intermediate cylinder T is connected. An on-off valve Vf composed of a solenoid valve or the like is provided in the vacuum tube 29a of the vacuum mechanism 29 . The plurality of cut products Sa separated from the cutting table 12b in contact with the protruding portion 44b of the moving body 44 are subjected to negative pressure applied to the flexible tube 47a by the vacuum mechanism 29 and flow into the flexible tube 47a, and are supplied by the liquid supply mechanism. The liquid flow of 43 is transferred to the container 21.

以下,使用圖3至圖4對清洗模組2之清洗機構2A進行詳細說明。 Hereinafter, the cleaning mechanism 2A of the cleaning module 2 will be described in detail with reference to FIGS. 3 to 4 .

清洗模組2之清洗機構2A包含:容器21,收納封裝基板S被切割而形成之多個切割品Sa;旋轉機構22,使容器21旋轉;供液機構23,向容器21內供給清洗液;排液機構24,排出容器21內之清洗液;供氣機構25,向容器21內供給壓縮空氣;排氣機構26,排出容器21內之空氣;以及轉動反轉機構27,使容器21轉動及反轉。另外,清洗機構2A還可以包含排出機構28,以在容器21內超過規定之水位時將越過後述之中間筒T的包括切屑等微小垃圾之清洗液排出。 The cleaning mechanism 2A of the cleaning module 2 includes: a container 21 for accommodating a plurality of cut products Sa formed by cutting the package substrate S; a rotation mechanism 22 for rotating the container 21; a liquid supply mechanism 23 for supplying cleaning liquid into the container 21; The liquid discharge mechanism 24 discharges the cleaning liquid in the container 21; the air supply mechanism 25 supplies compressed air into the container 21; the exhaust mechanism 26 discharges the air in the container 21; Invert. In addition, the cleaning mechanism 2A may further include a discharge mechanism 28 for discharging the cleaning liquid including fine waste such as chips, which has passed over the intermediate cylinder T, which will be described later, when the water level in the container 21 exceeds a predetermined level.

容器21配置成相對於重力方向傾斜規定角度。該規定角度為5°至50°,較佳為10°至40°,更佳設定在20°至30°之範圍內。容器21包含:有底筒狀之內筒21b,底壁形成為圓錐形狀;以及外筒28a,配置在內筒21b之外周側,內筒21b及外筒28a構成為能夠一體旋轉。在內筒21b之底壁之內表面上形成有愈接近中央(旋轉機構22之旋轉軸22b)愈朝向重力方向傾斜之傾斜面21b1。 The container 21 is arranged to be inclined at a predetermined angle with respect to the direction of gravity. The predetermined angle is 5° to 50°, preferably 10° to 40°, and more preferably set within the range of 20° to 30°. The container 21 includes a bottomed cylindrical inner tube 21b with a conical bottom wall, and an outer tube 28a disposed on the outer peripheral side of the inner tube 21b, and the inner tube 21b and the outer tube 28a are configured to be integrally rotatable. The inner surface of the bottom wall of the inner cylinder 21b is formed with an inclined surface 21b1 which is inclined toward the direction of gravity as it approaches the center (the rotation axis 22b of the rotation mechanism 22).

在內筒21b與外筒28a之間以不能旋轉之方式固定有中間筒T。內筒21b中自比側壁上之中間筒T之上端面稍高的位置(規定的水位)至底壁,形成有大小使得切屑等微小垃圾通過但不能使切割品Sa通過之多個微細孔21c。亦即,內筒21b自中間筒T之上端面附近之側壁至底壁包含網狀結構。另外,在內筒21b形成有向徑向外側呈環狀延伸之環狀凸緣21d,在 該環狀凸緣21d之下表面上形成有在旋轉方向觀察時包含傾斜面之多個傾斜突起21d1(參照圖3之放大圖)。中間筒T之底壁以固定有排液機構24之排液管24a之圓錐台形狀構成。外筒28a作為排出機構28構成,排出機構28用於在容器21內超過規定的水位時將經由內筒21b之微細孔21c而越過中間筒T之上端面(頂部)的包括切屑等微小垃圾之清洗液排出。外筒28a之底壁以內插管28a1突出之圓錐台形狀構成,內插管28a1以能夠相對旋轉之方式內插於向排出目的地(例如下水道、工廠內之排出管)排出清洗液之排出管28b(參照圖4)。另外,在外筒28a之上端外表面上突出形成有多個傾斜突起28a2,該多個傾斜突起28a2包含相對於內筒21b之傾斜突起21d1之傾斜面而在旋轉方向上抵接之傾斜面(參照圖3之放大圖)。 The intermediate cylinder T is fixed between the inner cylinder 21b and the outer cylinder 28a so as not to rotate. In the inner tube 21b, from a position slightly higher than the upper end surface of the intermediate tube T on the side wall (predetermined water level) to the bottom wall, there are formed a plurality of fine holes 21c sized to allow passage of fine waste such as chips but not to allow the passage of cut products Sa . That is, the inner tube 21b includes a mesh structure from the side wall near the upper end surface of the intermediate tube T to the bottom wall. In addition, an annular flange 21d extending annularly outward in the radial direction is formed on the inner cylinder 21b. On the lower surface of the annular flange 21d, a plurality of inclined protrusions 21d1 (refer to the enlarged view of FIG. 3) including inclined surfaces are formed when viewed in the rotational direction. The bottom wall of the intermediate cylinder T is formed in the shape of a truncated cone in which the liquid discharge pipe 24a of the liquid discharge mechanism 24 is fixed. The outer cylinder 28a is constituted as a discharge mechanism 28 for removing the fine waste including chips and the like passing through the fine hole 21c of the inner cylinder 21b and over the upper end surface (top) of the intermediate cylinder T when the water level in the container 21 exceeds a predetermined level. The cleaning fluid is drained. The bottom wall of the outer cylinder 28a is formed in the shape of a truncated cone in which the inner tube 28a1 protrudes, and the inner tube 28a1 is relatively rotatably inserted into the discharge pipe that discharges the cleaning liquid to the discharge destination (such as the sewers, the discharge pipe in the factory). 28b (see Figure 4). In addition, on the outer surface of the upper end of the outer cylinder 28a, a plurality of inclined protrusions 28a2 are formed to protrude, and the plurality of inclined protrusions 28a2 include inclined surfaces that abut against in the rotational direction with respect to the inclined surfaces of the inclined protrusions 21d1 of the inner cylinder 21b (see Enlarged view of Figure 3).

另外,在清洗模組2設置有封閉內筒21b之上部開口之蓋30,並設置有使該蓋30上下移動的由氣缸等構成之蓋移動機構31。在蓋30上固定有輸送模組4之撓性管47a、供液機構23之供液管23a以及供氣機構25之供氣管25a。在使蓋30緊貼於內筒21b之狀態下,自撓性管47a向內筒21b內藉由液流供給多個切割品Sa,自供液管23a向內筒21b內供給清洗液。此時,在內筒21b形成有多個微細孔21c,因此內筒21b內之清洗液向中間筒T內流出,但切割品Sa不會通過微細孔21c。在本實施方式中,由於藉由液流將多個切割品Sa供給至內筒21b內,因此能夠防止切割品Sa附著於撓性管47a之管內而殘留這樣的不良情況。 In addition, the cleaning module 2 is provided with a cover 30 which closes the upper opening of the inner cylinder 21b, and is provided with a cover moving mechanism 31 composed of an air cylinder or the like for moving the cover 30 up and down. The flexible tube 47a of the conveying module 4, the liquid supply pipe 23a of the liquid supply mechanism 23, and the air supply pipe 25a of the air supply mechanism 25 are fixed on the cover 30. With the lid 30 in close contact with the inner cylinder 21b, the plurality of cut products Sa are supplied by the liquid flow into the inner cylinder 21b from the flexible tube 47a, and the cleaning liquid is supplied into the inner cylinder 21b from the liquid supply pipe 23a. At this time, since a plurality of fine holes 21c are formed in the inner tube 21b, the cleaning liquid in the inner tube 21b flows out into the intermediate tube T, but the cut product Sa does not pass through the fine holes 21c. In the present embodiment, since the plurality of cut products Sa are supplied into the inner cylinder 21b by the liquid flow, it is possible to prevent the inconvenience that the cut products Sa adhere to the inside of the flexible tube 47a and remain.

旋轉機構22包含:電動馬達22a,使內筒21b及外筒28a圍繞旋轉軸22b旋轉;以及上述內筒21b之傾斜突起21d1及外筒28a之傾斜突起28a2。 藉由利用電動馬達22a之驅動力使外筒28a旋轉,外筒28a之傾斜突起28a2與內筒21b之傾斜突起21d1抵接,內筒21b亦一體地旋轉。內筒21b及外筒28a藉由旋轉機構22旋轉而在網眼結構之內筒21b的內部產生液流,在內筒21b內浸漬在清洗液中之多個切割品Sa被回旋的清洗液清洗。 The rotation mechanism 22 includes an electric motor 22a for rotating the inner cylinder 21b and the outer cylinder 28a around the rotation axis 22b, and the inclined protrusions 21d1 of the inner cylinder 21b and the inclined protrusions 28a2 of the outer cylinder 28a. When the outer cylinder 28a is rotated by the driving force of the electric motor 22a, the inclined protrusion 28a2 of the outer cylinder 28a comes into contact with the inclined protrusion 21d1 of the inner cylinder 21b, and the inner cylinder 21b also rotates integrally. The inner cylinder 21b and the outer cylinder 28a are rotated by the rotating mechanism 22 to generate a liquid flow inside the inner cylinder 21b of the mesh structure, and the plurality of cut products Sa immersed in the cleaning liquid in the inner cylinder 21b are cleaned by the swirling cleaning liquid .

供液機構23包含供液管23a,該供液管23a之一端與自來水道或工廠內之純水供給管連接且另一端與蓋30連接。排液機構24包含排液管24a,該排液管24a之一端與下水道或工廠內之排水管連接且另一端與中間筒T之底壁連接。在供液機構23之供液管23a以及排液機構24之排液管24a分別設置有由電磁閥等構成之開閉閥Va及開閉閥Vb。 The liquid supply mechanism 23 includes a liquid supply pipe 23 a, one end of which is connected to a water supply pipe or a pure water supply pipe in a factory, and the other end is connected to the cover 30 . The drain mechanism 24 includes a drain pipe 24a, one end of the drain pipe 24a is connected to a sewer or a drain pipe in the factory, and the other end is connected to the bottom wall of the intermediate cylinder T. The liquid supply pipe 23a of the liquid supply mechanism 23 and the liquid discharge pipe 24a of the liquid discharge mechanism 24 are respectively provided with an on-off valve Va and an on-off valve Vb composed of a solenoid valve or the like.

供氣機構25包含:氣體供排泵,設置於流體供排機構2B;以及供氣管25a,一端以能夠導入壓縮空氣等之方式與氣體供排泵連接,另一端與蓋30連接。排氣機構26包含排氣管26a,該排氣管26a之一端與外部空氣連接且另一端經由分支部20a與中間筒T及外筒28a之底壁連接。在供氣機構25之供氣管25a及排氣機構26之排氣管26a上分別設置有由電磁閥等構成之開閉閥Vc及開閉閥Vd。此外,供氣機構25不需要包含氣體供排泵,只要係能夠向供氣管25a導入壓縮空氣等的結構即可,例如亦可以係工廠內之壓縮空氣供給用之配管經由電磁閥與供氣管25a之一端連接的結構。 The air supply mechanism 25 includes a gas supply and discharge pump installed in the fluid supply and discharge mechanism 2B; The exhaust mechanism 26 includes an exhaust pipe 26a, one end of the exhaust pipe 26a is connected to the outside air and the other end is connected to the bottom wall of the intermediate cylinder T and the outer cylinder 28a via the branch portion 20a. On the air supply pipe 25a of the air supply mechanism 25 and the exhaust pipe 26a of the exhaust mechanism 26, an on-off valve Vc and an on-off valve Vd composed of a solenoid valve or the like are respectively provided. In addition, the air supply mechanism 25 does not need to include a gas supply and discharge pump, and only needs to be a structure capable of introducing compressed air or the like into the air supply pipe 25a. For example, it may be a pipe for supplying compressed air in a factory through a solenoid valve and the air supply pipe 25a. A structure connected at one end.

轉動反轉機構27包含:夾緊機構27a,使夾持內筒21b之夾緊部件27a1工作;內筒上下機構27d,使由夾緊部件27a1夾持之內筒21b上下移動;轉動機構27b,使內筒21b圍繞轉動軸27b1轉動;以及內筒反轉機構 27c,使內筒21b圍繞反轉軸27c1旋轉而上下反轉。轉動反轉機構27之驅動源由電動馬達、氣缸等構成。 The rotation reversing mechanism 27 includes: a clamping mechanism 27a, which makes the clamping member 27a1 holding the inner cylinder 21b work; an inner cylinder up-down mechanism 27d, which makes the inner cylinder 21b clamped by the clamping member 27a1 move up and down; the rotating mechanism 27b, The inner cylinder 21b is rotated around the rotating shaft 27b1; and the inner cylinder reversing mechanism 27c, the inner cylinder 21b is rotated around the reversing axis 27c1 to be reversed up and down. The drive source of the rotation reversing mechanism 27 is constituted by an electric motor, an air cylinder, or the like.

排出機構28包含:外筒28a;以及排出管28b,一端與下水道或工廠內之排水管連接,另一端與外筒28a之底壁連接。真空機構29包含:氣體供排泵,設置於流體供排機構2B;以及真空管29a,一端以能夠排氣之方式與氣體供排泵連接且另一端經由分支部20a與中間筒T及外筒28a之底壁連接。在排出機構28之排出管28b及真空機構29之真空管29a上分別設置有由電磁閥等構成之開閉閥Ve及開閉閥Vf。上述排出管28b在分支部20a中與排液管24a合流而向下方延伸,排氣管26a及真空管29a在分支部20a中與排出管28b合流而向上方延伸。藉由該結構,液體在排液管24a以及排出管28b內流通,氣體在排氣管26a以及真空管29a內流通。本實施方式中之分支部20a位於比中間筒T之上端面(越過中間筒T之上端面之最高水位20b)靠上方的位置,切割品Sa之清洗、乾燥時越過中間筒T之上端面之清洗液不會因分支部20a與容器21內之最高水位20b之水位差而流入排氣管26a及真空管29a。另外,在切割品Sa之清洗中,排液機構24之開閉閥Vb處於閉閥狀態時,滯留於排液管24a之清洗液不會因分支部20a與容器21內之最高水位20b之水位差而流入排氣管26a及真空管29a。萬一滯留於排液管24a之清洗液達到分支部20a之水位的情況下,亦自與分支部20a連接之排出管28b排出。此外,真空機構29若不使外筒28a內成為負壓,則不需要包含氣體供排泵,只要係能夠經由分支部20a自真空管29a排氣之結構即可,例如亦可以係工廠內之排氣管道與真空管29a之一端連接的結構。 The discharge mechanism 28 includes: an outer cylinder 28a; and a discharge pipe 28b, one end of which is connected to a sewer or a drain pipe in a factory, and the other end is connected to the bottom wall of the outer cylinder 28a. The vacuum mechanism 29 includes: a gas supply and exhaust pump, which is provided in the fluid supply and exhaust mechanism 2B; and a vacuum pipe 29a, one end is connected to the gas supply and exhaust pump in a way that can be exhausted, and the other end is connected to the intermediate cylinder T and the outer cylinder 28a through the branch portion 20a bottom wall connection. The discharge pipe 28b of the discharge mechanism 28 and the vacuum pipe 29a of the vacuum mechanism 29 are provided with an on-off valve Ve and an on-off valve Vf composed of a solenoid valve or the like, respectively. The discharge pipe 28b joins with the discharge pipe 24a in the branch part 20a and extends downward, and the discharge pipe 26a and the vacuum pipe 29a join with the discharge pipe 28b in the branch part 20a and extend upward. With this structure, the liquid flows in the liquid discharge pipe 24a and the discharge pipe 28b, and the gas flows in the discharge pipe 26a and the vacuum pipe 29a. In this embodiment, the branch portion 20a is located above the upper end surface of the intermediate cylinder T (the highest water level 20b that crosses the upper end surface of the intermediate cylinder T), and the cut product Sa crosses the upper end surface of the intermediate cylinder T during cleaning and drying. The cleaning liquid does not flow into the exhaust pipe 26a and the vacuum pipe 29a due to the water level difference between the branch portion 20a and the highest water level 20b in the container 21 . In addition, when the on-off valve Vb of the liquid discharge mechanism 24 is in the closed state during the cleaning of the cut product Sa, the cleaning liquid remaining in the liquid discharge pipe 24a will not be caused by the water level difference between the branch portion 20a and the highest water level 20b in the container 21. Then, it flows into the exhaust pipe 26a and the vacuum pipe 29a. In the event that the cleaning liquid remaining in the drain pipe 24a reaches the water level of the branch portion 20a, it is also discharged from the drain pipe 28b connected to the branch portion 20a. In addition, the vacuum mechanism 29 does not need to include a gas supply and exhaust pump unless the outer cylinder 28a becomes a negative pressure, as long as it is a structure capable of exhausting the gas from the vacuum tube 29a through the branch portion 20a, for example, it can also be a gas exhaust pump in a factory. A structure in which the gas pipe is connected to one end of the vacuum pipe 29a.

[切割品之製造方法] [Manufacturing method of cut product]

使用圖1至圖11對切割品Sa之製造方法進行說明。 The manufacturing method of the cut product Sa will be described with reference to FIGS. 1 to 11 .

如圖1所示,用樹脂成形裝置E樹脂成形之封裝基板S被輸送至接收部11,該封裝基板S被載置在預工作台11a上。接著,切割用移送機構12a將自接收部11接收之作為切割對象物之封裝基板S以樹脂封裝之一側作為下表面而固定在切割台12b上,並移送至切割部12c。然後,藉由切割用移送機構12a及切割部12c,調整封裝基板S與旋轉刀片12c2之相對位置,利用旋轉刀片12c2以自上表面朝向下表面貫通的方式對封裝基板S進行切割,形成俯視呈矩形狀之多個切割品Sa(切割工序)。 As shown in FIG. 1, the package board|substrate S resin-molded by the resin molding apparatus E is conveyed to the receiving part 11, and this package board|substrate S is mounted on the pre-table 11a. Next, the transfer mechanism 12a for dicing fixes the package substrate S as the dicing object received from the receiving portion 11 on the dicing table 12b with one side of the resin package as the lower surface, and transfers it to the dicing portion 12c. Then, the relative position of the package substrate S and the rotary blade 12c2 is adjusted by the dicing transfer mechanism 12a and the dicing portion 12c, and the rotary blade 12c2 is used to cut the package substrate S so as to penetrate from the upper surface to the lower surface to form a plan view. A plurality of rectangular cut products Sa (cutting process).

接著,輸送模組4將由切割機構12切割而形成之多個切割品Sa輸送至清洗機構2A之容器21(輸送工序)。如圖5所示,藉由滑動驅動機構46b使可動箱B在X方向及Z方向上滑動移動,移動體44之突出部44b調整至與位於切割台12b之一端(-X方向之端部)之切割品Sa接觸的位置。接著,如圖6所示,驅動用於抽吸多個切割品Sa之真空機構29及用於向撓性管47a供給水等液體之液體供給機構43,並且利用旋轉驅動機構46a使移動體44之前方在旋轉方向R(圖6中為逆時針方向)旋轉,旋轉方向R相對於行進方向(+X方向)向上交叉。其結果,多個切割品Sa與移動體44之突出部44b接觸而自切割台12b分離,藉由真空機構29被抽吸至撓性管47a,與由液體供給機構43供給之液體一起被移送。接著,在移動體44之突出部44b與切割品Sa接觸的狀態下,利用滑動驅動機構46b使可動箱B前進(向+X方向移 動)。此時,由旋轉驅動機構46a旋轉之移動體44之突出部44b與下一個切割品Sa接觸而自切割台12b分離。反覆進行切割台12b上之切割品Sa之分離及利用真空機構29之抽吸。然後,如圖7所示,移動體44之突出部44b前進至切割台12b之另一端(+X方向之端部),全部之切割品Sa最終收納於容器21。在該輸送工序中,在將供液機構23、排液機構24、供氣機構25、排氣機構26以及排出機構28之開閉閥Va至Ve設為關閉狀態、並將旋轉機構22設為非驅動狀態之狀態下,打開真空機構29之開閉閥Vf(參照圖3)。此外,亦可以在移動體44之突出部44b前進至切割台12b之另一端之後,停止滑動驅動機構46b對可動箱B向X方向之滑動移動,使可動箱B向Z方向上升之後向-X方向移動而返回至圖5所示之位置,反覆進行多次利用上述之移動體44之旋轉及向+X方向之移動之切割品Sa的輸送動作。 Next, the transport module 4 transports the plurality of cut products Sa formed by cutting by the cutting mechanism 12 to the container 21 of the cleaning mechanism 2A (transport process). As shown in FIG. 5 , the movable box B is slidably moved in the X direction and the Z direction by the sliding drive mechanism 46b, and the protruding portion 44b of the movable body 44 is adjusted to be located at one end of the cutting table 12b (the end in the −X direction). The position where the cut product Sa touches. Next, as shown in FIG. 6, the vacuum mechanism 29 for sucking the plurality of cut products Sa and the liquid supply mechanism 43 for supplying liquid such as water to the flexible tube 47a are driven, and the moving body 44 is driven by the rotation driving mechanism 46a. The front side rotates in the rotation direction R (counterclockwise in FIG. 6 ), and the rotation direction R crosses upward with respect to the travel direction (+X direction). As a result, the plurality of cut products Sa are separated from the cutting table 12 b by contacting the protruding portion 44 b of the moving body 44 , are sucked to the flexible tube 47 a by the vacuum mechanism 29 , and are transferred together with the liquid supplied by the liquid supply mechanism 43 . . Next, in a state where the protrusion 44b of the movable body 44 is in contact with the cut product Sa, the movable box B is moved forward (moved in the +X direction) by the slide drive mechanism 46b. move). At this time, the protrusion 44b of the moving body 44 rotated by the rotation drive mechanism 46a comes into contact with the next cut product Sa and is separated from the cutting table 12b. Separation of the cut product Sa on the cutting table 12b and suction by the vacuum mechanism 29 are repeated. Then, as shown in FIG. 7 , the protruding portion 44b of the movable body 44 advances to the other end (end in the +X direction) of the cutting table 12b, and all the cut products Sa are finally accommodated in the container 21 . In this conveying step, the on-off valves Va to Ve of the liquid supply mechanism 23 , the liquid discharge mechanism 24 , the air supply mechanism 25 , the exhaust mechanism 26 , and the discharge mechanism 28 are closed, and the rotation mechanism 22 is not In the driving state, the on-off valve Vf of the vacuum mechanism 29 is opened (see FIG. 3 ). In addition, after the protrusion 44b of the moving body 44 has advanced to the other end of the cutting table 12b, the sliding movement of the movable box B in the X direction by the sliding drive mechanism 46b may be stopped, and the movable box B may be raised in the Z direction and then moved to -X. The direction moves and returns to the position shown in FIG. 5, and the conveyance operation|movement of the cut product Sa by the rotation of the above-mentioned moving body 44 and the movement in the +X direction is repeated many times.

由此,在本實施方式中,移送機構47在移送切割品Sa時,藉由一邊與切割品Sa接觸一邊移動之移動體44將切割品Sa自切割台12b分離。其結果,即使在切割品Sa之尺寸變小之情況下,只要藉由移送機構47移送被移動體44分離之切割品Sa,亦能夠在沒有複雜地構成輸送模組4之情況下可靠地輸送多個切割品Sa。亦即,在本實施方式中,難以發生如以往那樣的由於負壓導致之切割品Sa自切割台12b之剝離不良、切割品Sa之破損。 Thus, in the present embodiment, when the transfer mechanism 47 transfers the cut product Sa, the moving body 44 that moves while being in contact with the cut product Sa separates the cut product Sa from the dicing table 12b. As a result, even when the size of the cut product Sa is reduced, as long as the cut product Sa separated by the moving body 44 is transferred by the transfer mechanism 47, it can be reliably conveyed without the complicated configuration of the conveying module 4. Multiple cut items Sa. That is, in this embodiment, it is difficult to generate|occur|produce the peeling defect of the cut product Sa from the cutting table 12b by negative pressure, and the breakage of the cut product Sa as conventionally.

接著,如圖4所示,清洗機構2A利用供液機構23向容器21(內筒21b)內供給清洗液,從而多個切割品Sa與清洗液一起被收納在容器21(內筒21b)內,清洗液通過微細孔21c而存在於中間筒T之內側。然後,利用旋轉機構22使容器21(內筒21b及外筒28a)旋轉來清洗多個切割品Sa(清洗工 序)。此時,在將排液機構24及供氣機構25之開閉閥Vb、Vc設為關閉狀態之情況下,關閉真空機構29之開閉閥Vf,驅動旋轉機構22,並且打開供液機構23、排氣機構26及排出機構28之開閉閥Va、Vd、Ve(參照圖3)。此外,經由內筒21b之微細孔21c而越過中間筒T之上端面的包括切屑等微小垃圾之清洗液被排出機構28排出,內筒21b內之空氣被排氣機構26排出。 Next, as shown in FIG. 4, the cleaning mechanism 2A supplies the cleaning liquid into the container 21 (inner cylinder 21b) by the liquid supply mechanism 23, so that the plurality of cut products Sa are accommodated in the container 21 (inner cylinder 21b) together with the cleaning liquid , the cleaning liquid exists inside the intermediate cylinder T through the fine holes 21c. Then, the container 21 (the inner cylinder 21b and the outer cylinder 28a) is rotated by the rotation mechanism 22 to clean the plurality of cut products Sa (cleaner). sequence). At this time, when the on-off valves Vb and Vc of the liquid discharge mechanism 24 and the air supply mechanism 25 are closed, the on-off valve Vf of the vacuum mechanism 29 is closed, the rotation mechanism 22 is driven, and the liquid supply mechanism 23 and the discharge mechanism are opened. On-off valves Va, Vd, Ve of the air mechanism 26 and the discharge mechanism 28 (refer to FIG. 3 ). In addition, the cleaning liquid including chips and other fine wastes passing over the upper end surface of the intermediate cylinder T through the fine holes 21c of the inner cylinder 21b is discharged by the discharge mechanism 28 , and the air in the inner cylinder 21b is discharged by the exhaust mechanism 26 .

接著,在藉由清洗工序對多個切割品Sa進行清洗之後,利用排液機構24及排出機構28將包括切屑等微小垃圾之清洗液排出,利用供氣機構25向容器21之內筒21b內供給氣體,並且一邊利用旋轉機構22使容器21(內筒21b及外筒28a)旋轉一邊使多個切割品Sa乾燥(乾燥工序)。此時,維持真空機構29之開閉閥Vf之關閉狀態、排氣機構26及排出機構28之開閉閥Vd、Ve之打開狀態,在繼續旋轉機構22之驅動之狀態下關閉供液機構23之開閉閥Va,打開排液機構24及供氣機構25之開閉閥Vb、Vc(參照圖3)。 Next, after cleaning the plurality of cut products Sa in the cleaning process, the cleaning liquid including the fine waste such as chips is discharged by the liquid discharge mechanism 24 and the discharge mechanism 28 , and the air supply mechanism 25 is used to discharge the cleaning liquid into the inner cylinder 21 b of the container 21 . While supplying gas, the plurality of cut products Sa are dried while rotating the container 21 (the inner cylinder 21b and the outer cylinder 28a) by the rotating mechanism 22 (drying step). At this time, the closed state of the on-off valve Vf of the vacuum mechanism 29 and the open state of the on-off valves Vd and Ve of the exhaust mechanism 26 and the discharge mechanism 28 are maintained, and the opening and closing of the liquid supply mechanism 23 is closed while the driving of the rotating mechanism 22 is continued. The valve Va opens the on-off valves Vb and Vc of the liquid discharge mechanism 24 and the air supply mechanism 25 (see FIG. 3 ).

接著,在關閉排液機構24、供氣機構25、排氣機構26以及排出機構28之開閉閥Vb至Ve,並停止旋轉機構22之驅動後,藉由轉動反轉機構27使內筒21b轉動及上下反轉,取出多個切割品Sa(取出工序)。使用圖8至圖10對該取出工序進行說明。 Next, after closing the on-off valves Vb to Ve of the liquid discharge mechanism 24 , the air supply mechanism 25 , the exhaust mechanism 26 and the discharge mechanism 28 , and stopping the driving of the rotating mechanism 22 , the inner cylinder 21 b is rotated by the rotating reversing mechanism 27 . And it reversed up and down, and took out the some cut product Sa (extraction process). The extraction process will be described with reference to FIGS. 8 to 10 .

如圖8所示,藉由蓋移動機構31使蓋30上升,並且在利用夾緊機構27a之夾緊部件27a1夾持內筒21b之狀態下,藉由內筒上下機構27d使內筒21b上升,使內筒21b自中間筒T脫離。接著,如圖9所示,藉由轉動機構 27b使內筒21b圍繞轉動軸27b1轉動而移動至回收箱2C之上方。接著,如圖10所示,藉由內筒反轉機構27c使內筒21b圍繞反轉軸27c1上下反轉,使收納於內筒21b內之多個切割品Sa下落至回收箱2C而取出。然後,回收收納於回收箱2C之清洗、乾燥完之切割品Sa。這樣,使容器21之內筒21b上下反轉而取出切割品Sa,因此能夠可靠地回收切割品Sa。 As shown in FIG. 8, the lid 30 is raised by the lid moving mechanism 31, and the inner cylinder 21b is raised by the inner cylinder up-down mechanism 27d in a state where the inner cylinder 21b is clamped by the clamping member 27a1 of the clamping mechanism 27a. , the inner tube 21b is detached from the intermediate tube T. Next, as shown in FIG. 9, by rotating the mechanism 27b moves the inner cylinder 21b to the upper side of the collection box 2C by rotating the inner cylinder 21b around the rotation axis 27b1. Next, as shown in FIG. 10, the inner cylinder 21b is reversed up and down around the reversing axis 27c1 by the inner cylinder reversing mechanism 27c, and the plurality of cut products Sa accommodated in the inner cylinder 21b are dropped to the collection box 2C and taken out. Then, the cleaned and dried cut product Sa stored in the recovery box 2C is recovered. In this way, since the inner tube 21b of the container 21 is turned upside down and the cut product Sa is taken out, the cut product Sa can be collected reliably.

[其他實施方式] [Other Embodiments]

以下,對於與上述的實施方式相同的部件,為了容易理解,使用相同的術語、符號進行說明。 Hereinafter, the same terms and symbols will be used for the same components as those in the above-described embodiments for easy understanding.

<1>如圖11至圖12所示,移送機構47還可以包含收納多個切割品Sa之收納部45b,將收納有多個切割品Sa之收納部45b移動至容器21,自收納部45b向容器21轉移多個切割品Sa。更詳細而言,本實施方式中之移送機構47包含:移動體44,配置在切割機構12之切割台12b上,能夠一邊與封裝基板S被切割而形成之多個切割品Sa接觸一邊移動;可動箱Bb,支承移動體44;收納部45b,能夠收納多個切割品Sa;以及驅動機構46,驅動移動體44。此等移動體44、收納部45b以及驅動機構46在可動箱Bb內構成為一體單元。 <1> As shown in FIGS. 11 to 12 , the transfer mechanism 47 may further include a storage portion 45b that accommodates a plurality of cut products Sa, and moves the storage portion 45b that accommodates a plurality of cut products Sa to the container 21, from the storage portion 45b The plurality of cut products Sa are transferred to the container 21 . More specifically, the transfer mechanism 47 in the present embodiment includes: a moving body 44 that is arranged on the dicing table 12b of the dicing mechanism 12 and can move while contacting a plurality of dicing products Sa formed by dicing the package substrate S; The movable box Bb supports the movable body 44 ; the accommodating part 45b can accommodate a plurality of cut products Sa; and the drive mechanism 46 drives the movable body 44 . These moving body 44, the accommodating part 45b, and the drive mechanism 46 are comprised in the movable box Bb as an integrated unit.

移動體44包含:旋轉本體44a,圍繞旋轉軸44a1旋轉;多個突出部44b,自旋轉本體44a之周圍向徑向外側突出;以及引導槽44c,支承旋轉軸44a1,並引導旋轉本體44a之滑動移動。多個突出部44b在與切割品Sa接觸而自切割台12b分離時不易變形,並由不損傷切割品Sa之耐綸、聚對 苯二甲酸丁二醇酯(PBT)等樹脂材料構成。藉由後述之滑動驅動機構46b,移動體44構成為能夠沿著引導槽44c在切割台12b上前進或後退移動。 The moving body 44 includes: a rotating body 44a that rotates around a rotating shaft 44a1; a plurality of protrusions 44b that protrude radially outward from the periphery of the rotating body 44a; and a guide groove 44c that supports the rotating shaft 44a1 and guides the sliding of the rotating body 44a move. The plurality of protruding portions 44b are not easily deformed when they come into contact with the cut product Sa and are separated from the cutting table 12b, and are made of nylon, abutment that does not damage the cut product Sa. It is composed of resin materials such as butylene phthalate (PBT). The movable body 44 is configured to be able to move forward or backward on the cutting table 12b along the guide groove 44c by the slide drive mechanism 46b described later.

可動箱Bb係經由軸承(未圖示)等來支承旋轉軸44a1之框體,固定有收納部45b。可動箱Bb構成為能夠藉由後述之滑動驅動機構46b在X方向以及Z方向上滑動移動。 The movable case Bb is a frame which supports the rotating shaft 44a1 via a bearing (not shown) or the like, and the housing portion 45b is fixed. The movable box Bb is configured to be slidable in the X direction and the Z direction by a slide drive mechanism 46b described later.

驅動機構46包含:旋轉驅動機構46a,使移動體44旋轉驅動;以及滑動驅動機構46b,使可動箱Bb在X方向及Z方向上滑動移動,並且使移動體44沿著切割台12b之表面滑動移動。旋轉驅動機構46a使移動體44之前方在旋轉方向R(圖11中為逆時針方向)旋轉,旋轉方向R相對於行進方向(+X方向)向上交叉。滑動驅動機構46b使移動體44(旋轉軸44a1)沿著引導槽44c滑動移動。該驅動機構46之驅動源由伺服馬達等電動馬達等構成。 The drive mechanism 46 includes: a rotary drive mechanism 46a for rotationally driving the moving body 44; and a sliding drive mechanism 46b for sliding the movable box Bb in the X direction and the Z direction and sliding the moving body 44 along the surface of the cutting table 12b move. The rotational drive mechanism 46a rotates the moving body 44 forward in the rotational direction R (counterclockwise in FIG. 11 ), and the rotational direction R crosses upward with respect to the traveling direction (+X direction). The slide drive mechanism 46b slides the movable body 44 (rotation shaft 44a1) along the guide groove 44c. The drive source of the drive mechanism 46 is constituted by an electric motor such as a servo motor or the like.

作為切割品Sa之輸送方法,如圖11所示,藉由滑動驅動機構46b使可動箱Bb在X方向及Z方向上滑動移動,移動體44之突出部44b調整至與位於切割台12b之一端(-X方向之端部)之切割品Sa接觸的位置。然後,使封裝基板S被切割而形成之多個切割品Sa與藉由旋轉驅動機構46a旋轉後之移動體44之突出部44b接觸而自切割台12b分離。接著,在移動體44之突出部44b與切割品Sa接觸的狀態下,藉由滑動驅動機構46b前進,將切割品Sa朝向收納部45b推出。此時,由旋轉驅動機構46a旋轉之移動體44之突出部44b與下一個切割品Sa接觸而自切割台12b分離。反覆進行切割台 12b上之切割品Sa之分離及推出,全部的切割品Sa最終收納於收納部45b。此外,在本實施方式中,亦可以多次反覆進行利用上述之移動體44之旋轉及向+X方向之移動的切割品Sa的輸送動作。 As a method of conveying the cut product Sa, as shown in FIG. 11, the movable box Bb is slid in the X direction and the Z direction by the sliding drive mechanism 46b, and the protrusion 44b of the movable body 44 is adjusted to be positioned at one end of the cutting table 12b. (the end in the -X direction) where the cut product Sa contacts. Then, the plurality of diced products Sa formed by dicing the package substrate S are brought into contact with the protruding portion 44b of the moving body 44 rotated by the rotary drive mechanism 46a and separated from the dicing table 12b. Next, in a state in which the protruding portion 44b of the moving body 44 is in contact with the cut product Sa, the slide drive mechanism 46b advances, and the cut product Sa is pushed out toward the accommodating portion 45b. At this time, the protrusion 44b of the moving body 44 rotated by the rotation drive mechanism 46a comes into contact with the next cut product Sa and is separated from the cutting table 12b. Repeat cutting table The cut product Sa on the 12b is separated and pushed out, and all the cut products Sa are finally accommodated in the accommodating portion 45b. In addition, in this embodiment, the conveyance operation|movement of the cut product Sa by the rotation of the above-mentioned moving body 44 and the movement in the +X direction may be repeated several times.

接著,如圖12所示,輸送模組4使可動箱Bb(收納有多個切割品Sa之收納部45b)移動至清洗機構2A之容器21的附近,以使容器21之開口成為收納部45b之下方。接著,輸送模組4使可動箱Bb傾動的同時使其振動,使多個切割品Sa下落至容器21內。這樣,若在轉移至容器21之前將切割品Sa收納於收納部45b,則僅移動收納有多個切割品Sa之收納部45b即可,能夠提高輸送效率。而且,若使可動箱Bb傾動而振動,則能夠一次將多個切割品Sa收納於容器21,因此與藉由液流、抽吸來輸送切割品Sa之情況相比,不易產生切割品Sa之回收不良、損傷。另外,在圖11至圖12所示之結構中,與上述之實施方式中之切割後的切割品Sa之輸送以及向容器21之收納的說明不同。亦即,並非將多個切割品Sa自撓性管47a之另一端47c收納於容器21之內部,而是將多個切割品Sa自移送機構47之可動箱Bb直接收納於容器21之內部。 Next, as shown in FIG. 12 , the transport module 4 moves the movable box Bb (the storage part 45b in which the plurality of cut products Sa are stored) to the vicinity of the container 21 of the cleaning mechanism 2A so that the opening of the container 21 becomes the storage part 45b below. Next, the transport module 4 tilts the movable box Bb and vibrates the movable box Bb to drop the plurality of cut products Sa into the container 21 . In this way, if the cut product Sa is accommodated in the storage portion 45b before being transferred to the container 21, only the storage portion 45b in which the plurality of cut products Sa are accommodated may be moved, and the conveyance efficiency can be improved. Furthermore, if the movable box Bb is tilted and vibrated, a plurality of cut products Sa can be accommodated in the container 21 at a time, and therefore, compared with the case where the cut products Sa are conveyed by liquid flow and suction, the occurrence of the cut products Sa is less likely to occur. Poor recovery and damage. In addition, in the structure shown in FIG. 11-FIG. 12, it differs from the description of the conveyance of the cut product Sa after cutting and the storage in the container 21 in the above-mentioned embodiment. That is, instead of accommodating the plurality of cut products Sa from the other end 47c of the flexible tube 47a in the container 21 , the plurality of cut products Sa are directly accommodated in the container 21 from the movable box Bb of the transfer mechanism 47 .

<2>如圖13至圖15所示,移送機構47還可以包含水等液體流通之液流路48a,將切割品Sa在液流路48a內移送至內筒21b。更詳細而言,本實施方式中之移送機構47包含:移動體44,配置在切割機構12之切割台12b上,能夠一邊與封裝基板S被切割而形成之多個切割品Sa接觸一邊移動;可動箱Ba,支承移動體44;收納部45a,能夠收納多個切割品Sa;驅動機構46,驅動移動體44;液流路48a,由具有撓性之管構成,藉由使液體在 內部流通而移送切割品Sa;供給路48b,向可動箱Ba內供給液體;以及液體供給機構49,向液流路48a及供給路48b供給液體。此等移動體44、收納部45a、液流路48a、供給路48b以及驅動機構46在可動箱Ba內構成為一體單元。 <2> As shown in FIGS. 13 to 15 , the transfer mechanism 47 may further include a liquid flow path 48a through which a liquid such as water flows, and transfer the cut product Sa to the inner cylinder 21b in the liquid flow path 48a. More specifically, the transfer mechanism 47 in the present embodiment includes: a moving body 44 that is arranged on the dicing table 12b of the dicing mechanism 12 and can move while contacting a plurality of dicing products Sa formed by dicing the package substrate S; The movable box Ba supports the movable body 44; the accommodating part 45a can accommodate a plurality of cutting products Sa; the driving mechanism 46 drives the movable body 44; The inside is circulated to transfer the cut product Sa; the supply path 48b supplies the liquid into the movable box Ba; and the liquid supply mechanism 49 supplies the liquid to the liquid flow path 48a and the supply path 48b. The movable body 44 , the accommodating portion 45 a , the liquid flow path 48 a , the supply path 48 b , and the drive mechanism 46 constitute an integrated unit within the movable case Ba.

移動體44包含:旋轉本體44a,圍繞旋轉軸44a1旋轉;多個突出部44b,自旋轉本體44a之周圍向徑向外側突出;以及引導槽44c,支承旋轉軸44a1,並引導旋轉本體44a之滑動移動。多個突出部44b在與切割品Sa接觸而自切割台12b分離時不易變形,並由不損傷切割品Sa之耐綸、聚對苯二甲酸丁二醇酯(PBT)等樹脂材料構成。藉由後述之滑動驅動機構46b,移動體44構成為能夠沿著引導槽44c在切割台12b上前進或後退移動。 The moving body 44 includes: a rotating body 44a that rotates around a rotating shaft 44a1; a plurality of protrusions 44b that protrude radially outward from the periphery of the rotating body 44a; and a guide groove 44c that supports the rotating shaft 44a1 and guides the sliding of the rotating body 44a move. The plurality of protrusions 44b are not easily deformed when they come into contact with the dicing product Sa and are separated from the dicing table 12b, and are made of resin materials such as nylon and polybutylene terephthalate (PBT) which do not damage the dicing product Sa. The movable body 44 is configured to be able to move forward or backward on the cutting table 12b along the guide groove 44c by the slide drive mechanism 46b described later.

可動箱Ba係經由軸承(未圖示)等支承旋轉軸44a1之框體,固定有收納部45a。另外,在可動箱Ba上,液流路48a在收納部45a內以能夠切換為封閉狀態及開放狀態之方式被支承。可動箱Ba構成為能夠藉由後述之滑動驅動機構46b在X方向及Z方向上滑動移動。 The movable case Ba is a frame which supports the rotating shaft 44a1 via a bearing (not shown) or the like, and the housing portion 45a is fixed. Moreover, in the movable tank Ba, the liquid flow path 48a is supported in the accommodating part 45a so that a closed state and an open state can be switched. The movable box Ba is configured to be slidable in the X direction and the Z direction by a slide drive mechanism 46b described later.

驅動機構46包含:旋轉驅動機構46a,使移動體44旋轉驅動;以及滑動驅動機構46b,使可動箱Ba沿X方向及Z方向滑動移動,並且使移動體44沿著切割台12b之表面滑動移動。旋轉驅動機構46a使移動體44之前方在旋轉方向R(在圖13中為逆時針方向)旋轉,旋轉方向R相對於行進方向(+X方向)向上交叉。滑動驅動機構46b使移動體44(旋轉軸44a1)沿著引導 槽44c滑動移動。另外,驅動機構46包含將液流路48a切換為封閉狀態及開放狀態之切換機構46c。該驅動機構46之驅動源由伺服馬達等電動馬達等構成。 The drive mechanism 46 includes: a rotary drive mechanism 46a for rotationally driving the moving body 44; and a sliding drive mechanism 46b for slidingly moving the movable box Ba in the X direction and the Z direction and sliding the moving body 44 along the surface of the cutting table 12b . The rotational drive mechanism 46a rotates the moving body 44 forward in the rotational direction R (counterclockwise in FIG. 13 ), and the rotational direction R crosses upward with respect to the traveling direction (+X direction). The slide drive mechanism 46b guides the movable body 44 (rotation shaft 44a1 ) along the The groove 44c slides. In addition, the drive mechanism 46 includes a switching mechanism 46c that switches the liquid flow path 48a between the closed state and the open state. The drive source of the drive mechanism 46 is constituted by an electric motor such as a servo motor or the like.

作為切割品Sa之輸送方法,如圖13所示,藉由滑動驅動機構46b使可動箱Ba在X方向及Z方向上滑動移動,移動體44之突出部44b調整至與位於切割台12b之一端(-X方向的端部)之切割品Sa接觸的位置。然後,如圖14所示,藉由液體供給機構49向可動箱Ba內供給液體,並且藉由切換機構46c將液流路48a切換為封閉狀態,藉由虹吸效應在液流路48a內貯存液體。接著,如圖13至圖14所示,藉由切換機構46c將液流路48a切換為開放狀態,使封裝基板S被切割而形成之多個切割品Sa與由旋轉驅動機構46a旋轉之移動體44之突出部44b接觸而自切割台12b分離。接著,如圖15所示,在移動體44之突出部44b與切割品Sa接觸的狀態下,藉由滑動驅動機構46b前進,將切割品Sa與液體供給機構49之液流一起朝向收納部45推出。此時,由旋轉驅動機構46a旋轉之移動體44之突出部44b與下一個切割品Sa接觸而自切割台12b分離。被推出至收納部45之切割品Sa藉由液流路48a內之液流而被移送至容器21。然後,移動體44之突出部44b前進至切割台12b之另一端(+X方向之端部),最終全部的切割品Sa收納於容器21。另外,在本實施方式中,亦可以多次反覆進行利用上述之移動體44之旋轉及向+X方向之移動的切割品Sa之輸送動作。 As a method of conveying the cut product Sa, as shown in FIG. 13 , the movable box Ba is slidably moved in the X direction and the Z direction by the sliding drive mechanism 46b, and the protruding portion 44b of the movable body 44 is adjusted to be positioned at one end of the cutting table 12b. The position where the cut product Sa (the end in the -X direction) contacts. Then, as shown in FIG. 14, the liquid is supplied into the movable tank Ba by the liquid supply mechanism 49, and the liquid flow path 48a is switched to the closed state by the switching mechanism 46c, and the liquid is stored in the liquid flow path 48a by the siphon effect . Next, as shown in FIGS. 13 to 14 , the liquid flow path 48a is switched to the open state by the switching mechanism 46c, and the plurality of dicing products Sa formed by dicing the package substrate S and the moving body rotated by the rotary driving mechanism 46a are made The protrusion 44b of 44 contacts and separates from the cutting table 12b. Next, as shown in FIG. 15 , in a state in which the protruding portion 44b of the moving body 44 is in contact with the cut product Sa, the slide drive mechanism 46b advances, and the cut product Sa is directed toward the storage portion 45 together with the liquid flow of the liquid supply mechanism 49 . roll out. At this time, the protrusion 44b of the moving body 44 rotated by the rotation drive mechanism 46a comes into contact with the next cut product Sa and is separated from the cutting table 12b. The cut product Sa pushed out to the accommodating part 45 is transferred to the container 21 by the liquid flow in the liquid flow path 48a. Then, the protruding part 44b of the moving body 44 advances to the other end (end part in the +X direction) of the cutting table 12b, and finally all the cut products Sa are accommodated in the container 21. In addition, in this embodiment, the conveyance operation of the cut product Sa by the rotation of the above-mentioned moving body 44 and the movement in the +X direction may be performed repeatedly.

<3>在上述實施方式中,在容器21內設置有中間筒T,但亦可以省略中間筒T。在該情況下,排液機構24之排液管24a與內筒21b連接。另外, 亦可以省略中間筒T及外筒28a,僅由內筒21b構成容器21,藉由供液機構23、排液機構24控制清洗液之供給量。 <3> In the above-described embodiment, the intermediate cylinder T is provided in the container 21, but the intermediate cylinder T may be omitted. In this case, the drain pipe 24a of the drain mechanism 24 is connected to the inner cylinder 21b. in addition, The intermediate cylinder T and the outer cylinder 28a may be omitted, the container 21 may be constituted only by the inner cylinder 21b, and the supply amount of the cleaning liquid may be controlled by the liquid supply mechanism 23 and the liquid discharge mechanism 24.

<4>在上述的實施方式中,藉由轉動反轉機構27使容器21之內筒21b轉動及反轉而使多個切割品Sa下落,但亦可以省略轉動反轉機構27,藉由抽吸等方式取出容器21內之切割品Sa。 <4> In the above-mentioned embodiment, the inner cylinder 21b of the container 21 is rotated and reversed by the rotation reversing mechanism 27 to drop the plurality of cut products Sa, but the rotation reversing mechanism 27 may be omitted, and the Take out the cut product Sa in the container 21 by suction or the like.

<5>在上述實施方式之輸送模組4中,撓性管47a之一端47b與液體供給機構43連接,藉由液流輸送多個切割品Sa,但亦可以省略液體供給機構43,僅藉由利用真空機構29之抽吸來輸送多個切割品Sa。 <5> In the conveying module 4 of the above-mentioned embodiment, one end 47b of the flexible tube 47a is connected to the liquid supply mechanism 43, and a plurality of cut products Sa are conveyed by the liquid flow, but the liquid supply mechanism 43 may be omitted, and only the The plurality of cut products Sa are conveyed by suction by the vacuum mechanism 29 .

<6>在上述實施方式中,藉由旋轉機構22使容器21之內筒21b及外筒28a旋轉,但亦可以僅使容器21之內筒21b旋轉,亦可以使容器21之內筒21b及中間筒T旋轉,旋轉對象沒有特別限定。 <6> In the above embodiment, the inner cylinder 21b and the outer cylinder 28a of the container 21 are rotated by the rotating mechanism 22, but only the inner cylinder 21b of the container 21 may be rotated, or the inner cylinder 21b of the container 21 and the outer cylinder 28a may be rotated. The intermediate cylinder T rotates, and the object of rotation is not particularly limited.

<7>在上述實施方式中,將供液管23a之一端連接於自來水道或工廠內之純水供給管,將排液管24a及排出管28b之一端連接於下水道或工廠內之排出管,但亦可以在流體供排機構2B設置清洗液槽,將供液管23a、排液管24a及排出管28b之一端連接於清洗液槽,使清洗液循環。在該情況下,較佳在供液管23a或者排液管24a以及排出管28b設置用於過濾清洗液之過濾機構。 <7> In the above-mentioned embodiment, one end of the liquid supply pipe 23a is connected to the water supply pipe or the pure water supply pipe in the factory, and one ends of the liquid discharge pipe 24a and the discharge pipe 28b are connected to the sewer or the discharge pipe in the factory, However, a cleaning liquid tank can also be provided in the fluid supply and discharge mechanism 2B, and one end of the liquid supply pipe 23a, the liquid discharge pipe 24a and the discharge pipe 28b can be connected to the cleaning liquid tank to circulate the cleaning liquid. In this case, it is preferable to provide a filter mechanism for filtering the cleaning liquid in the liquid supply pipe 23a, the liquid discharge pipe 24a, and the discharge pipe 28b.

<8>亦可以不使容器21相對於重力方向傾斜,而是沿著重力方向呈直 立姿勢。另外,內筒21b之底壁亦可以不設置傾斜面21b1而平坦地形成。 <8> The container 21 may not be inclined with respect to the direction of gravity, but may be straight along the direction of gravity standing posture. In addition, the bottom wall of the inner cylinder 21b may be formed flat without providing the inclined surface 21b1.

<9>在移動體44設置有向旋轉本體44a之周圍突出之多個突出部44b,但亦可以省略突出部44b而設置捲繞於旋轉本體44a之周圍之橡膠等彈性材料,亦可以僅由旋轉本體44a構成移動體44。 <9> The movable body 44 is provided with a plurality of protrusions 44b protruding around the rotating body 44a, but the protrusions 44b may be omitted and an elastic material such as rubber wound around the rotating body 44a may be provided. The rotating body 44 a constitutes the moving body 44 .

[上述實施方式之概要] [Outline of the above-mentioned embodiment]

以下,對在上述實施方式中說明之輸送模組4、切割裝置D以及切割品Sa之製造方法之概要進行說明。 Hereinafter, the outline of the manufacturing method of the conveying module 4, the cutting device D, and the cutting product Sa described in the above-mentioned embodiment will be described.

(1)輸送模組4之特徵結構在於,包含:移動體44,其配置在切割台12b上,能夠一邊與封裝基板S被切割而形成之多個切割品Sa接觸一邊移動;驅動機構46,其驅動移動體44;以及移送機構47,其移送多個切割品Sa;移送機構47藉由移動體44將與移動體44接觸之切割品Sa自切割台12b分離並移送。 (1) The characteristic structure of the conveying module 4 is that it includes: a moving body 44, which is arranged on the cutting table 12b and can move while being in contact with a plurality of cut products Sa formed by cutting the package substrate S; a driving mechanism 46, It drives the moving body 44; and a transfer mechanism 47 that transfers a plurality of cut products Sa;

根據本結構,移送機構47在移送切割品Sa時,藉由一邊與切割品Sa接觸一邊移動之移動體44之旋轉而將切割品Sa自切割台12b分離。其結果,即使在切割品Sa之尺寸變小之情況下,只要藉由移送機構47移送被移動體44分離之切割品Sa,亦能夠在沒有複雜地構成輸送模組4之情況下可靠地輸送多個切割品Sa。而且,若使移動體44旋轉,則切割品Sa自切割台12b之分離控制簡便。 According to this configuration, when the transfer mechanism 47 transfers the cut product Sa, the cut product Sa is separated from the cutting table 12b by the rotation of the moving body 44 that moves while being in contact with the cut product Sa. As a result, even when the size of the cut product Sa is reduced, as long as the cut product Sa separated by the moving body 44 is transferred by the transfer mechanism 47, it can be reliably conveyed without the complicated configuration of the conveying module 4. Multiple cut items Sa. Furthermore, when the movable body 44 is rotated, the separation control of the cut product Sa from the cutting table 12b is facilitated.

亦即,在本結構中,如以往那樣,難以發生由於負壓導致之切割品Sa自切割台12b之剝離不良、切割品Sa之破損。這樣,可提供能夠可靠地輸送多個切割品Sa之輸送模組4。 That is, in this structure, as in the past, the peeling failure of the cut product Sa from the cutting table 12b due to the negative pressure and the breakage of the cut product Sa are less likely to occur. In this way, it is possible to provide the conveying module 4 capable of reliably conveying a plurality of cut products Sa.

(2)移動體44還可以包含:旋轉本體44a,固定於旋轉軸44a1;以及多個突出部44b,自旋轉本體44a之周圍向徑向外側突出。 (2) The movable body 44 may further include: a rotating body 44a fixed to the rotating shaft 44a1; and a plurality of protrusions 44b projecting radially outward from the periphery of the rotating body 44a.

若如本結構那樣在移動體44上設置多個突出部44b,則能夠使多個突出部44b與切割品Sa接觸而自切割台12b可靠地分離。 If the movable body 44 is provided with the plurality of protruding portions 44b as in this configuration, the plurality of protruding portions 44b can be reliably separated from the dicing table 12b by being brought into contact with the dicing product Sa.

(3)移動體44在旋轉狀態下最靠近切割台12b之位置處的旋轉切線方向與移動方向亦可以相同。 (3) The rotation tangent direction and the moving direction of the moving body 44 at the position closest to the cutting table 12b in the rotating state may be the same.

本結構中之移動體44在旋轉狀態下最靠近切割台12b之位置處的旋轉切線方向與移動方向相同。亦即,使移動體44之前方在旋轉方向R上旋轉,旋轉方向R相對於行進方向向上交叉,因此,使移動體44行進,同時朝向行進方向之前方分離切割品Sa。其結果,能夠同時實現移動體44對切割品Sa之分離及推出。另外,如上所述,在固定封裝基板S之切割台12b之固定面上,以能夠供旋轉刀片12c2進入之方式形成有槽。在本發明中,由於使移動體44在旋轉方向R上旋轉,因此即使移動體44向前方行進,切割品Sa亦不易鉤掛於該槽,能夠容易地分離切割品Sa。 The rotation tangent direction of the moving body 44 in the rotating state at the position closest to the cutting table 12b is the same as the moving direction. That is, the moving body 44 is rotated forward in the rotation direction R, and the rotation direction R crosses upward with respect to the traveling direction, so that the moving body 44 is moved forward while separating the cut products Sa toward the forward direction of the traveling direction. As a result, separation and push-out of the cut product Sa by the movable body 44 can be realized at the same time. Moreover, as mentioned above, the groove|channel is formed so that the rotary blade 12c2 may enter in the fixing surface of the dicing table 12b which fixes the package board|substrate S. In the present invention, since the movable body 44 is rotated in the rotation direction R, even if the movable body 44 moves forward, the cut product Sa is not easily caught in the groove, and the cut product Sa can be easily separated.

(4)移送機構47還可以包含起負壓作用之撓性管47a(抽吸路),在撓性 管47a內移送與移動體44接觸而自切割台12b分離的切割品Sa。 (4) The transfer mechanism 47 may further include a flexible tube 47a (suction path) that acts as a negative pressure. The cut product Sa which is in contact with the moving body 44 and separated from the cutting table 12b is transferred into the pipe 47a.

如本結構那樣,若在撓性管47a內移送切割品Sa,則能夠防止切割品Sa之飛散。 As in this configuration, when the cut product Sa is transferred in the flexible tube 47a, scattering of the cut product Sa can be prevented.

(5)移送機構47還可以包含用於收納與移動體44接觸而自切割台12b分離的切割品Sa之收納部45b,移送收納有切割品Sa之收納部45b。 (5) The transfer mechanism 47 may further include an accommodating portion 45b for accommodating the cut product Sa that is in contact with the moving body 44 and separated from the cutting table 12b, and may include a accommodating portion 45b in which the cut product Sa is transferred and accommodated.

若如本結構那樣移送收納有切割品Sa之收納部45b自身,則能夠防止切割品Sa之飛散。 If the storage part 45b itself in which the cut product Sa is accommodated is transferred as in this configuration, scattering of the cut product Sa can be prevented.

(6)移送機構47還可以包含液體流通之液流路48a,並將與移動體44接觸而自切割台12b分離的切割品Sa在液流路48a內移送。 (6) The transfer mechanism 47 may further include a liquid flow path 48a through which the liquid flows, and transfer the cut product Sa separated from the cutting table 12b in contact with the moving body 44 in the liquid flow path 48a.

如本結構那樣,若在液流路48a內移送切割品Sa,則能夠防止切割品Sa之飛散,並且液流作為切割品Sa彼此之間的緩衝功能,能夠防止切割品Sa之破損。 As in this configuration, when the cut products Sa are transferred in the liquid flow path 48a, scattering of the cut products Sa can be prevented, and the liquid flow can prevent breakage of the cut products Sa as a buffer function between the cut products Sa.

(7)切割裝置D之特徵結構在於,包含:上述(1)至(6)中任一項之輸送模組4;切割機構12,切割切割品Sa;以及清洗機構2A,對由移送機構47輸送來之切割品Sa進行清洗。 (7) The characteristic structure of the cutting device D is that it includes: the conveying module 4 according to any one of the above (1) to (6); the cutting mechanism 12 for cutting the cut product Sa; and the cleaning mechanism 2A for the transfer mechanism 47 The delivered cut product Sa is cleaned.

在本結構中,利用上述之移送機構47將多個切割品Sa移送至清洗機 構2A,因此能夠可靠地輸送多個切割品Sa。 In this configuration, the plurality of cut products Sa are transferred to the washing machine by the transfer mechanism 47 described above. Since the structure 2A is adopted, a plurality of cut products Sa can be reliably conveyed.

(8)切割品Sa之製造方法的特徵在於,使用上述(7)之切割裝置D來製造切割品Sa。 (8) The method for producing the cut product Sa is characterized in that the cut product Sa is produced using the cutting device D of the above (7).

在本方法中,藉由上述之切割裝置D來製造多個切割品Sa,因此能夠提高製造效率。 In this method, since a plurality of cut products Sa are manufactured by the above-mentioned cutting device D, the manufacturing efficiency can be improved.

此外,上述之實施方式(包含其他實施方式,以下相同)所揭示之結構只要不產生矛盾,就能夠與在其他實施方式中揭示之結構組合來應用。另外,在本說明書中揭示之實施方式係例示,本發明之實施方式並不侷限於此,能夠在不脫離本發明之目的的範疇內適當改變。 In addition, the structures disclosed in the above-mentioned embodiments (including other embodiments, the same below) can be applied in combination with the structures disclosed in the other embodiments, as long as there is no conflict. In addition, the embodiment disclosed in this specification is an illustration, and the embodiment of this invention is not limited to this, It can change suitably in the range which does not deviate from the objective of this invention.

[工業應用性] [Industrial Applicability]

本發明能夠用於輸送模組、包括輸送模組之切割裝置以及切割品之製造方法,尤其在切割品之尺寸小至不足2mm見方之情況下係有效的。 The present invention can be used for a conveying module, a cutting device including the conveying module, and a manufacturing method of a cut product, and is especially effective when the size of the cut product is as small as less than 2 mm square.

4:輸送模組 4: Conveying module

12:切割機構 12: Cutting mechanism

12b:切割台 12b: Cutting table

21:容器 21: Container

29:真空機構 29: Vacuum mechanism

29a:真空管 29a: Vacuum Tube

43:液體供給機構 43: Liquid supply mechanism

44:移動體 44: Moving body

44a:旋轉本體 44a: rotating body

44a1:旋轉軸 44a1: Rotary axis

44b:突出部 44b: Protrusion

46:驅動機構 46: Drive mechanism

46a:旋轉驅動機構 46a: Rotary drive mechanism

46b:滑動驅動機構 46b: Sliding drive mechanism

47:移送機構 47: Transfer mechanism

47a:撓性管(抽吸路) 47a: Flexible tube (suction path)

47b:一端 47b: one end

47c:另一端 47c: The other end

B:可動箱 B: movable box

R:旋轉方向 R: direction of rotation

S:封裝基板 S: package substrate

Sa:切割品 Sa: cut product

Vf:開閉閥 Vf: On-off valve

Claims (7)

一種輸送模組,其包含:移動體,其配置在切割台上,能夠一邊與封裝基板被切割而形成之多個切割品接觸一邊移動;驅動機構,其驅動上述移動體;以及移送機構,其移送多個上述切割品;上述移送機構藉由上述移動體之旋轉將與上述移動體接觸之上述切割品自上述切割台分離並移送;且上述移送機構包含供液體流通之液流路,在上述液流路內移送與上述移動體接觸而自上述切割台分離之上述切割品。 A conveying module comprising: a moving body disposed on a cutting table and capable of moving while being in contact with a plurality of cut products formed by cutting a package substrate; a driving mechanism for driving the moving body; and a transfer mechanism for Transfer a plurality of the above-mentioned cut products; the above-mentioned transfer mechanism separates and transfers the above-mentioned cut products in contact with the above-mentioned moving body from the above-mentioned cutting table by the rotation of the above-mentioned moving body; The above-mentioned cut product which is in contact with the above-mentioned moving body and separated from the above-mentioned cutting table is transported in the liquid flow path. 如請求項1之輸送模組,其中,上述移動體包含:旋轉本體,其固定於旋轉軸;及多個突出部,其自上述旋轉本體之周圍向徑向外側突出。 The conveying module of claim 1, wherein the movable body comprises: a rotating body fixed to the rotating shaft; and a plurality of protrusions protruding radially outward from the periphery of the rotating body. 如請求項1或2之輸送模組,其中,上述移動體在旋轉狀態下最靠近上述切割台之位置處的旋轉切線方向與移動方向相同。 The conveying module according to claim 1 or 2, wherein the rotation tangent direction at the position closest to the cutting table in the rotating state of the moving body is the same as the moving direction. 如請求項1或2之輸送模組,其中,上述移送機構包含起負壓作用之抽吸路,在上述抽吸路內移送與上 述移動體接觸而自上述切割台分離之上述切割品。 The conveying module according to claim 1 or 2, wherein the conveying mechanism includes a suction passage that acts as a negative pressure, and the conveying and upward movement are carried out in the suction passage. The said moving body contacts and separates the said cutting product from the said cutting table. 如請求項1或2之輸送模組,其中,上述移送機構包含收納上述切割品之收納部,並移送收納有上述切割品之上述收納部,上述切割品與上述移動體接觸而自上述切割台分離。 The conveying module according to claim 1 or 2, wherein the transfer mechanism includes a accommodating portion for accommodating the cut product, and transfers the accommodating portion for accommodating the cut product, and the cut product comes into contact with the moving body and is removed from the cutting table separation. 一種切割裝置,其包含:如請求項1至5中任一項之輸送模組;切割機構,其切割上述切割品;以及清洗機構,其對由上述移送機構移送之上述切割品進行清洗。 A cutting device comprising: the conveying module according to any one of claims 1 to 5; a cutting mechanism for cutting the cut product; and a cleaning mechanism for cleaning the cut product transferred by the transfer mechanism. 一種切割品之製造方法,其中,使用如請求項6之切割裝置來製造上述切割品。A method of manufacturing a cut product, wherein the cut product is manufactured using the cutting device as claimed in claim 6.
TW109137409A 2019-10-31 2020-10-28 Transfer module, cutting device, and method of manufacturing cut product TWI750873B (en)

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