TWI749951B - Ultrasonic sensor module - Google Patents
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Abstract
Description
本案係關於一種超音波傳感器。This case is about an ultrasonic sensor.
傳統的超音波傳感器是利用發射端發射聲波至一待測物,再利用接收端接收反射聲波,以偵測超音波傳感器與待測物之距離。The traditional ultrasonic sensor uses the transmitting end to emit sound waves to an object to be measured, and then uses the receiving end to receive the reflected sound waves to detect the distance between the ultrasonic sensor and the object to be measured.
不過,在實際使用上容易遇到發射端的聲波直接繞射到接收端,而導致測距功能產生問題,使超音波感測器產生誤判。However, in actual use, it is easy to encounter the direct diffraction of the sound wave from the transmitting end to the receiving end, which causes problems with the ranging function and makes the ultrasonic sensor misjudge.
依據本案之一實施例,本案提供一種超音波傳感模組。此超音波傳感模組包括一殼體、一超音波發射單元與一超音波接收單元。殼體包括一第一表面。此第一表面包括一第一開口、一第二開口與至少一溝槽。溝槽係位於第一開口與第二開口間。超音波發射單元係設置殼體內,並透過第一開口向外發射聲波。超音波接收單元係設置於殼體內,並透過第二開口接收聲波。其中,溝槽具有一寬度,此寬度滿足以下公式:w = L (n + 1/m);其中,w是寬度,n是大於或等於零的整數,L是超音波發射單元所發射之聲波之波長,m是介於3至16之數值。According to an embodiment of this case, this case provides an ultrasonic sensor module. The ultrasonic sensor module includes a housing, an ultrasonic transmitter unit and an ultrasonic receiver unit. The housing includes a first surface. The first surface includes a first opening, a second opening and at least one groove. The groove is located between the first opening and the second opening. The ultrasonic transmitting unit is arranged in the casing and emits sound waves to the outside through the first opening. The ultrasonic receiving unit is arranged in the casing and receives sound waves through the second opening. Wherein, the groove has a width, and the width satisfies the following formula: w = L (n + 1/m); where w is the width, n is an integer greater than or equal to zero, and L is one of the sound waves emitted by the ultrasonic emission unit The wavelength, m is a value between 3 and 16.
本案之超音波傳感模組之殼體的第一開口與第二開口間具有至少一溝槽,此溝槽具有一特定寬度,超音波發射單元繞射至殼體表面的聲波會在此溝槽內來回反射而削減其強度,如此,即可有效消除由超音波發射單元繞射至超音波接收單元之聲波,避免超音波感測器產生誤判。There is at least one groove between the first opening and the second opening of the housing of the ultrasonic sensor module in this case. The groove has a specific width. The sound waves diffracted by the ultrasonic transmitter unit to the surface of the housing will be in this groove. The back and forth reflection in the groove reduces its intensity. In this way, the sound waves diffracted from the ultrasonic transmitter unit to the ultrasonic receiver unit can be effectively eliminated, and the ultrasonic sensor can avoid misjudgment.
下面將結合示意圖對本案的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍,本案的優點和特徵將更清楚。需說明的是,圖式均採用非常簡化的形式且均使用非精準的比例,僅用以方便、明晰地輔助說明本案實施例的目的。The specific implementation of this case will be described in more detail below in conjunction with the schematic diagram. According to the following description and the scope of patent application, the advantages and features of this case will be clearer. It should be noted that the drawings are in a very simplified form and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of this case.
第一圖係本案超音波傳感模組第一實施例之立體示意圖。第二至四圖係對應於此超音波傳感模組之一前視示意圖、側視示意圖與俯視示意圖。第五圖係對應於第三圖中之A-A剖面的剖面示意圖。一實施例中,此超音波傳感模組100可適用於機器人相關產品,如工業用機器人、玩具機器人、樂高機器人、掃地機器人等,用於偵測外界環境,避免產生碰撞。The first figure is a three-dimensional schematic diagram of the first embodiment of the ultrasonic sensor module in this case. The second to fourth figures are corresponding to a schematic front view, a schematic side view, and a schematic top view of the ultrasonic sensor module. The fifth figure is a schematic cross-sectional view corresponding to the A-A section in the third figure. In one embodiment, the
如第一圖所示,此超音波傳感模組100包括一殼體120、一超音波發射單元140與一超音波接收單元160。As shown in the first figure, the
此殼體120包括一第一表面121與一第二表面122。第一表面121包括一第一開口123、一第二開口124與至少一溝槽(圖中係以三個溝槽125a, 125b, 125c為例)。超音波發射單元140係設置殼體120內,並透過第一開口123向外發射聲波。超音波接收單元160係設置於殼體120內,並透過第二開口124接收聲波。溝槽125a, 125b, 125c係位於第一開口123與第二開口124間。The
一實施例中,殼體120之側邊並具有接頭180,用以提供此超音波傳感模組100運作所需的電能,並用以將此超音波傳感模組100所產生之偵測訊號向外傳輸。In one embodiment, the side of the
一實施例中,如第五圖所示,超音波發射單元140與超音波接收單元160間可設置一間隔層170進行區隔。此間隔層170係位於殼體120內。一實施例中,此間隔層170可以填充吸音材料,例如泡棉。In an embodiment, as shown in FIG. 5, a
在本實施例中,這些溝槽125a, 125b, 125c具有相同的寬度w,且此寬度w滿足以下公式:w = L(n + 1/m);其中,w是寬度,n是大於或等於零的整數,L是超音波發射單元140所發射之聲波之波長,m是介於3至16之數值。In this embodiment, the
此寬度設定可以避免在溝槽125a, 125b, 125c內產生駐波,使繞射於殼體120表面之聲波可在溝槽125a, 125b, 125c內來回反射而削減其強度。同時亦可避免溝槽125a, 125b, 125c寬度過窄而影響製造工序。如此,即可以有效消除由超音波發射單元140繞射至超音波接收單元160之聲波。This width setting can avoid the generation of standing waves in the
一實施例中,如第二圖中所示,溝槽125a, 125b, 125c之長度約略等同於第一開口123或第二開口124之寬度。不過亦不限於此。在其他實施例中,溝槽125a, 125b, 125c之長度大於第一開口123或第二開口124之1/2寬度,即可有效達到削減繞射聲波的效果。In one embodiment, as shown in the second figure, the length of the
一實施例中,如第二圖中所示,第一開口123係呈圓形,第二開口124係呈圓形,以配合超音波發射單元140之發射端與超音波接收單元160之接收端的外型。第一開口123之圓心與第二開口124之圓心係定義出一中線LM(即第一開口123之圓心與第二開口124之圓心的連線)。這些溝槽125a, 125b, 125c係對稱地分布於中線LM之兩側。In one embodiment, as shown in the second figure, the
一實施例中,如第二圖中所示,這些溝槽125a, 125b, 125c均沿著直線方向D1延伸,且其延伸方向垂直於中線LM。不過亦不限於此。在其他實施例中,依據實際需求,這些溝槽125a, 125b, 125c亦可採斜向配置於第一表面121上。又,在其他實施例中,各個溝槽125a, 125b, 125c之延伸方向亦可不同。In one embodiment, as shown in the second figure, the
一實施例中,如第二圖中所示,這三個溝槽125a, 125b, 125c係互相平行地排列於第一開口123與第二開口124間,且相鄰二溝槽125a, 125b, 125c之間隔距離g維持固定。不過亦不限於此。在其他實施例中,因為超音波發射單元140所產生之聲波會有些微變化,這些溝槽125a, 125b, 125c的間隔距離g可因應此變化而採不同間隔距離之設計方式。In one embodiment, as shown in the second figure, the three
一實施例中,如第二圖中所示,這些溝槽125a, 125b, 125c之延伸方向互相平行,且各個溝槽125a, 125b, 125c的寬度w相同。不過亦不限於此,在其他實施例中,因為超音波發射單元140所產生之聲波會有些微變化,這些溝槽125a, 125b, 125c可因應此變化而採取不同寬度之設計方式。不過,這些寬度都須滿足前述公式:w = L (n + 1/m),且m是介於3至16之數值。一實施例中,這些溝槽125a, 125b, 125c之間隔距離g可大於或等於溝槽的寬度w。In one embodiment, as shown in the second figure, the extending directions of the
第二表面122包括複數個呈陣列排列之連接結構1222。一實施例中,這些連接結構1222係成圓形。這些連接結構1222可用以與其他具有對應連接結構的表面或元件相連接。藉此,即可以模組方式容易地將本案之超音波傳感模組100固定在所欲裝設的位置。The
一實施例中,殼體120大致呈現一長方體,第二表面122與第一表面121係位於殼體之相對側。不過亦不限於此。在一實施例中,依據實際需求,用於安裝之第二表面122與用於感測之第一表面121亦可以是位於殼體120之相鄰兩側,以提供不同的安裝方式。In one embodiment, the
下表(表一)係以實驗數據呈現依據本案第一實施例進行配置之超音波傳感模組對於繞射聲波的改善程度。表中的D是第一開口123的圓心至第二開口124的圓心的距離。殼體導致之繞射增量是以比較安裝殼體前後之繞射訊號的強度,其數值越低,代表對於繞射的改善越好。表中的對照樣本一是不具有溝槽的超音波傳感模組。對照樣本二的溝槽寬度較大,其對應的m值為2.01,未落入本案設定的範圍(即介於3至16之數值)。樣本一與樣本二均採取本案第一實施例之配置方式,不過其溝槽寬度不同。
依據上表之實驗數據,超音波傳感模組的殼體確實會導致繞射產生而影響其超音波傳感模組的偵測結果。又,雖然在殼體上形成溝槽可以改善繞射問題,不過,相較於對照樣本二的改善效果(其溝槽寬度之對應m值為2.01),依據本案所設定之溝槽寬度所形成的溝槽(即樣本一與樣本二),對於繞射問題的改善可以有明顯的提升。According to the experimental data in the above table, the shell of the ultrasonic sensor module does cause diffraction and affects the detection result of the ultrasonic sensor module. Moreover, although the formation of grooves on the shell can improve the diffraction problem, compared with the improvement effect of the control sample 2 (the corresponding m value of the groove width is 2.01), it is formed according to the groove width set in this case The grooves (namely sample one and sample two) can significantly improve the improvement of diffraction problems.
除此之外,本案的超音波傳感模組可以依據需求而設計為不同尺寸或規格,一實施例中,若第一開口123的圓心至第二開口124的圓心的距離較大時,也就是表中的D數值較大時,n的數值可以對應調大。一實施例中,若超音波傳感模組的尺寸受限於D數值無法太大,也就是需要縮減w的數值時,則可調大m的數值。In addition, the ultrasonic sensor module of this case can be designed in different sizes or specifications according to requirements. In one embodiment, if the distance from the center of the
第六圖係本案超音波傳感模組200第二實施例之立體示意圖。不同於第一圖之超音波傳感模組100,其溝槽125a, 125b, 125c之長度約略等同於第一開口123或第二開口124之直徑,本實施例之超音波傳感模組200之溝槽225a, 225b, 225c則是延伸至第一表面221之邊緣,以確保超音波發射單元140繞射至殼體220表面的聲波會經過溝槽225a, 225b, 225c削減其強度後,才會傳遞至超音波接收單元160。不過亦不限於此,一實施例中,溝槽125a, 125b, 125c之長度大於第一開口123或第二開口124之1/2寬度,即可有效達到削減繞射聲波的效果。The sixth figure is a three-dimensional schematic diagram of the second embodiment of the
第七圖係本案超音波傳感模組300第三實施例之立體示意圖。不同於第一圖之超音波傳感模組100中,三個溝槽125a, 125b, 125c具有相同的長度,本實施例之超音波傳感模組300之三個溝槽325a, 325b, 325c則是採取長度不同的設計方式。如第七圖中所示,靠近第一開口123與第二開口124的二個溝槽325a, 325c之長度較短,位於中間處的溝槽325b之長度較長,以配合聲波由第一開口123向外擴散傳遞至第二開口124的軌跡,有效涵蓋超音波發射單元140繞射至殼體320表面的聲波範圍。The seventh figure is a three-dimensional schematic diagram of the third embodiment of the
第八圖係本案超音波傳感模組400第四實施例之立體示意圖。不同於第一圖之超音波傳感模組100在殼體120上設置三個溝槽125a, 125b, 125c,本實施例之殼體420上只設置一溝槽425。本實施例可適用於殼體420尺寸較小或是第一開口123與第二開口124的距離較小的情形。The eighth figure is a three-dimensional schematic diagram of the fourth embodiment of the
第九圖係本案超音波傳感模組500第五實施例之立體示意圖。不同於第一圖之超音波傳感模組100中,三個溝槽125a, 125b, 125c沿著直線方向D1延伸,本實施例之超音波傳感模組500之溝槽525a, 525b, 525c則是沿著弧線方向D2延伸。The ninth figure is a three-dimensional schematic diagram of the fifth embodiment of the
一實施例中,這些溝槽525a, 525b, 525c的長度大於第一開口123或是第二開口124的1/2寬度,且此弧線方向D2的曲率半徑大於第一開口123或是第二開口124之1/2寬度,以確保這些溝槽525a, 525b, 525c可以有效涵蓋超音波發射單元140繞射至殼體520表面的聲波範圍。In one embodiment, the length of the
一實施例中,如第九圖中所示,這些溝槽525a, 525b, 525c的彎曲方向均是朝向第一開口123。不過亦不限於此。在其他實施例中,靠近第一開口123的溝槽525a可朝向第一開口123的方向彎曲,靠近第二開口124的溝槽525b可朝向第二開口124的方向彎曲,位於中間處的溝槽525b可以朝向第一開口123或第二開口124的方向彎曲,亦可以採取如第一圖中所示之直線型的溝槽125b。In an embodiment, as shown in the ninth figure, the bending directions of the
綜上所述,本案之超音波傳感模組之殼體的第一開口與第二開口間具有至少一溝槽,此溝槽具有一特定寬度,超音波發射單元繞射至殼體表面的聲波會在此溝槽內來回反射而削減其強度,如此,即可有效消除由超音波發射單元繞射至超音波接收單元之聲波,避免超音波感測器產生誤判。In summary, there is at least one groove between the first opening and the second opening of the housing of the ultrasonic sensor module of this case. The groove has a specific width. The sound waves will be reflected back and forth in this groove to reduce their intensity. In this way, the sound waves diffracted from the ultrasonic transmitter unit to the ultrasonic receiver unit can be effectively eliminated, and the ultrasonic sensor can avoid misjudgment.
上述僅為本案較佳之實施例而已,並不對本案進行任何限制。任何所屬技術領域的技術人員,在不脫離本案的技術手段的範圍內,對本案揭露的技術手段和技術內容做任何形式的等同替換或修改等變動,均屬未脫離本案的技術手段的內容,仍屬於本案的保護範圍之內。The above are only preferred embodiments of this case, and do not impose any restriction on this case. Any person in the technical field who makes any form of equivalent substitution or modification to the technical means and technical content disclosed in this case within the scope of the technical means of this case is not deviated from the technical means of this case. It still falls within the scope of protection of this case.
100,200,300,400,500:超音波傳感模組
120,220,320,420,520:殼體
140:超音波發射單元
160:超音波接收單元
121,221:第一表面
122:第二表面
123:第一開口
124:第二開口
125a,125b,125c,225a,225b,225c,325a,325b,325c,425,525a,525b,525c:溝槽
170:間隔層
180:接頭
w:寬度
LM:中線
g:間隔距離
1222:連接結構
D1:直線方向
D2:弧線方向
100, 200, 300, 400, 500:
第一圖係本案超音波傳感模組第一實施例之立體示意圖; 第二至四圖係對應於此超音波傳感模組之一前視示意圖、側視示意圖與俯視示意圖; 第五圖係對應於第三圖中之A-A剖面的剖面示意圖; 第六圖係本案超音波傳感模組第二實施例之立體示意圖; 第七圖係本案超音波傳感模組第三實施例之立體示意圖; 第八圖係本案超音波傳感模組第四實施例之立體示意圖;以及 第九圖係本案超音波傳感模組第五實施例之立體示意圖。 The first figure is a three-dimensional schematic diagram of the first embodiment of the ultrasonic sensor module in this case; The second to fourth figures are corresponding to one of the front view, side view and top view of the ultrasonic sensor module; The fifth figure is a schematic cross-sectional view corresponding to the A-A section in the third figure; Figure 6 is a three-dimensional schematic diagram of the second embodiment of the ultrasonic sensor module in this case; The seventh figure is a three-dimensional schematic diagram of the third embodiment of the ultrasonic sensor module in this case; Figure 8 is a three-dimensional schematic diagram of the fourth embodiment of the ultrasonic sensor module in this case; and The ninth figure is a three-dimensional schematic diagram of the fifth embodiment of the ultrasonic sensor module in this case.
100:超音波傳感模組 100: Ultrasonic sensor module
120:殼體 120: shell
140:超音波發射單元 140: Ultrasonic transmitter unit
160:超音波接收單元 160: Ultrasonic receiver unit
121:第一表面 121: first surface
122:第二表面 122: second surface
123:第一開口 123: First opening
124:第二開口 124: second opening
125a,125b,125c:溝槽 125a, 125b, 125c: groove
180:接頭 180: Connector
1222:連接結構 1222: connection structure
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109144617A TWI749951B (en) | 2020-12-17 | 2020-12-17 | Ultrasonic sensor module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109144617A TWI749951B (en) | 2020-12-17 | 2020-12-17 | Ultrasonic sensor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI749951B true TWI749951B (en) | 2021-12-11 |
| TW202225728A TW202225728A (en) | 2022-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW109144617A TWI749951B (en) | 2020-12-17 | 2020-12-17 | Ultrasonic sensor module |
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| TW (1) | TWI749951B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206400093U (en) * | 2016-12-12 | 2017-08-11 | 东莞市美光达光学科技有限公司 | A kind of anallatic lens module and laser ranging system |
| WO2018191516A1 (en) * | 2017-04-12 | 2018-10-18 | Sense Photonics, Inc. | Devices incorporating integrated dectors and ultra-small vertical cavity surface emitting laser emitters |
| TW202009514A (en) * | 2018-08-29 | 2020-03-01 | 華碩電腦股份有限公司 | Ultrasonic transducer apparatus |
| TW202044570A (en) * | 2019-02-21 | 2020-12-01 | 日商索尼半導體解決方案公司 | Avalanche-photodiode sensor and distance measurement device |
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2020
- 2020-12-17 TW TW109144617A patent/TWI749951B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206400093U (en) * | 2016-12-12 | 2017-08-11 | 东莞市美光达光学科技有限公司 | A kind of anallatic lens module and laser ranging system |
| WO2018191516A1 (en) * | 2017-04-12 | 2018-10-18 | Sense Photonics, Inc. | Devices incorporating integrated dectors and ultra-small vertical cavity surface emitting laser emitters |
| TW202009514A (en) * | 2018-08-29 | 2020-03-01 | 華碩電腦股份有限公司 | Ultrasonic transducer apparatus |
| TW202044570A (en) * | 2019-02-21 | 2020-12-01 | 日商索尼半導體解決方案公司 | Avalanche-photodiode sensor and distance measurement device |
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| Publication number | Publication date |
|---|---|
| TW202225728A (en) | 2022-07-01 |
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