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TWI749075B - 密封用樹脂組成物及密封用薄片 - Google Patents

密封用樹脂組成物及密封用薄片 Download PDF

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Publication number
TWI749075B
TWI749075B TW106134136A TW106134136A TWI749075B TW I749075 B TWI749075 B TW I749075B TW 106134136 A TW106134136 A TW 106134136A TW 106134136 A TW106134136 A TW 106134136A TW I749075 B TWI749075 B TW I749075B
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
epoxy resin
sealing
hydrotalcite
Prior art date
Application number
TW106134136A
Other languages
English (en)
Chinese (zh)
Other versions
TW201827518A (zh
Inventor
久保有希
馬場英治
堀次恒介
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW201827518A publication Critical patent/TW201827518A/zh
Application granted granted Critical
Publication of TWI749075B publication Critical patent/TWI749075B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
TW106134136A 2016-10-04 2017-10-03 密封用樹脂組成物及密封用薄片 TWI749075B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016196395 2016-10-04
JP2016-196395 2016-10-04

Publications (2)

Publication Number Publication Date
TW201827518A TW201827518A (zh) 2018-08-01
TWI749075B true TWI749075B (zh) 2021-12-11

Family

ID=61832201

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106134136A TWI749075B (zh) 2016-10-04 2017-10-03 密封用樹脂組成物及密封用薄片

Country Status (5)

Country Link
JP (1) JP7120017B2 (ja)
KR (1) KR102465011B1 (ja)
CN (1) CN109804035A (ja)
TW (1) TWI749075B (ja)
WO (1) WO2018066548A1 (ja)

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* Cited by examiner, † Cited by third party
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KR102578976B1 (ko) * 2017-03-31 2023-09-18 아지노모토 가부시키가이샤 밀봉용 조성물
JP6985040B2 (ja) * 2017-07-04 2021-12-22 積水化学工業株式会社 熱硬化性樹脂組成物
WO2020105707A1 (ja) * 2018-11-22 2020-05-28 味の素株式会社 接着剤組成物
CN109608893B (zh) * 2018-12-04 2020-12-08 河南省交通规划设计研究院股份有限公司 桥面防水粘结层用废胎胶粉沥青材料及其制备方法
JP7554179B2 (ja) * 2019-03-28 2024-09-19 リンテック株式会社 シート状接着剤、封止シート、電子デバイスの封止体、及び、電子デバイスの封止体の製造方法
TWI862698B (zh) * 2019-09-30 2024-11-21 日商味之素股份有限公司 樹脂組成物及樹脂薄片
JP7661674B2 (ja) * 2019-12-03 2025-04-15 味の素株式会社 電子デバイスおよびペロブスカイト型太陽電池
JP7452001B2 (ja) * 2019-12-24 2024-03-19 味の素株式会社 発光素子パッケージ及びその製造方法
CN116438649A (zh) 2020-11-13 2023-07-14 味之素株式会社 密封用片材

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002088222A (ja) * 2000-09-12 2002-03-27 Shin Etsu Chem Co Ltd 光透過性エポキシ樹脂組成物及びフリップチップ型半導体装置
CN102318080A (zh) * 2009-02-12 2012-01-11 株式会社普利司通 太阳能电池用密封膜及使用了该密封膜的太阳能电池
CN102471461A (zh) * 2009-07-10 2012-05-23 东丽株式会社 粘合剂组合物、粘合片材、使用它们的电路基板及半导体器件以及它们的制造方法
TW201425434A (zh) * 2012-09-28 2014-07-01 Taiyo Ink Mfg Co Ltd 光硬化性樹脂組成物、印刷配線板、及光硬化性樹脂組成物之製造方法
TW201522491A (zh) * 2013-11-08 2015-06-16 味之素股份有限公司 含有菱水鎂鋁石之密封用樹脂組成物及密封用薄片

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3835518B2 (ja) * 2000-09-13 2006-10-18 信越化学工業株式会社 光透過性エポキシ樹脂組成物及び半導体装置
CA2521615A1 (en) * 2003-04-08 2004-10-21 Nippon Kayaku Kabushiki Kaisha Liquid crystal sealing agent and liquid crystalline display cell using the same
US7307286B2 (en) * 2003-10-16 2007-12-11 Nitto Denko Corporation Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
WO2006028001A1 (ja) * 2004-09-08 2006-03-16 Toray Industries, Inc. 光配線用樹脂組成物および光電気複合配線基板
CN101522793B (zh) * 2006-10-06 2011-12-28 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
JP5070972B2 (ja) * 2007-07-26 2012-11-14 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP5577667B2 (ja) 2009-10-16 2014-08-27 味の素株式会社 樹脂組成物
KR20120080050A (ko) * 2011-01-06 2012-07-16 주식회사 두산 투명 기판
WO2013186992A1 (ja) * 2012-06-14 2013-12-19 三井化学東セロ株式会社 太陽電池封止材および太陽電池モジュール
KR102244167B1 (ko) * 2013-11-08 2021-04-26 아지노모토 가부시키가이샤 봉지용 수지 조성물 및 봉지용 시트
KR20150068786A (ko) 2013-12-12 2015-06-22 한국건설기술연구원 프리캐스트 모듈 연결부용 슬래브거푸집 및 이를 이용한 교량시공방법
JP2016139757A (ja) * 2015-01-29 2016-08-04 日立化成株式会社 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
WO2016175271A1 (ja) * 2015-04-28 2016-11-03 味の素株式会社 封止用樹脂組成物および封止用シート
JP6683204B2 (ja) * 2015-09-30 2020-04-15 味の素株式会社 封止用樹脂組成物
KR102674701B1 (ko) * 2016-02-01 2024-06-14 아지노모토 가부시키가이샤 밀봉용의 열경화성 수지 조성물 및 밀봉용 시트

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002088222A (ja) * 2000-09-12 2002-03-27 Shin Etsu Chem Co Ltd 光透過性エポキシ樹脂組成物及びフリップチップ型半導体装置
CN102318080A (zh) * 2009-02-12 2012-01-11 株式会社普利司通 太阳能电池用密封膜及使用了该密封膜的太阳能电池
CN102471461A (zh) * 2009-07-10 2012-05-23 东丽株式会社 粘合剂组合物、粘合片材、使用它们的电路基板及半导体器件以及它们的制造方法
TW201425434A (zh) * 2012-09-28 2014-07-01 Taiyo Ink Mfg Co Ltd 光硬化性樹脂組成物、印刷配線板、及光硬化性樹脂組成物之製造方法
TW201522491A (zh) * 2013-11-08 2015-06-16 味之素股份有限公司 含有菱水鎂鋁石之密封用樹脂組成物及密封用薄片
CN105683283A (zh) * 2013-11-08 2016-06-15 味之素株式会社 含水滑石的密封用树脂组合物和密封用片材

Also Published As

Publication number Publication date
KR20190066018A (ko) 2019-06-12
WO2018066548A1 (ja) 2018-04-12
KR102465011B1 (ko) 2022-11-09
TW201827518A (zh) 2018-08-01
CN109804035A (zh) 2019-05-24
JPWO2018066548A1 (ja) 2019-07-18
JP7120017B2 (ja) 2022-08-17

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