[0009] ＜樹脂組成物＞ 本發明之密封用樹脂組成物，其係包含（A）熱硬化性樹脂、（B）半燒成水滑石及（C）硬化劑之樹脂組成物，其特徵為樹脂組成物之硬化物的折射率為1.48～1.54。硬化物之折射率較佳為1.49～1.54，更佳為1.50～1.54，再更佳為與半燒成水滑石之折射率為相同程度即1.50～1.53。 [0010] ＜（A）熱硬化性樹脂＞ 於本發明，係使用樹脂組成物之硬化物的折射率如成為1.48～1.54般之熱硬化性樹脂。較佳為前述折射率如成為1.49～1.54般之熱硬化性樹脂，更佳為前述折射率如成為1.50～1.54般之熱硬化性樹脂，再更佳為前述折射率成為如與半燒成水滑石的折射率為相同程度之1.50～1.53般之熱硬化性樹脂。 [0011] 樹脂組成物之硬化物的折射率可藉由熱硬化性樹脂或其他成分（例如熱塑性樹脂等）調整。為使硬化物之折射率的調整容易進行，（A）熱硬化性樹脂較佳為包含折射率為1.48～1.54之熱硬化性樹脂。前述熱硬化性樹脂之折射率更佳為1.49～1.54，再更佳為1.50～1.54。 [0012] 折射率為1.48～1.54之熱硬化性樹脂的含量，若樹脂組成物之硬化物的折射率成為1.48～1.54的範圍，雖並未特別限定，但相對於（A）熱硬化性樹脂全體，較佳為50～100質量%，更佳為60～100質量%，再更佳為70～100質量%。 [0013] 於本發明使用之（A）熱硬化性樹脂全體的折射率較佳為1.48～1.54，更佳為1.49～1.54，再更佳為1.50～1.54。使用複數個熱硬化性樹脂的情況下，較佳為該等之混合物全體的折射率為上述範圍內。 [0014] 作為熱硬化性樹脂，若樹脂組成物之硬化物的折射率如成為1.48～1.54般之熱硬化性樹脂，雖並未特別限定，但例如可列舉環氧樹脂、氰酸酯樹脂、酚樹脂、雙馬來醯亞胺-三嗪樹脂、聚醯亞胺樹脂、丙烯酸樹脂、乙烯基苄基樹脂等，其中，從低溫硬化性等之觀點來看，較佳為環氧樹脂。 [0015] 環氧樹脂若為樹脂組成物之硬化物的折射率如成為1.48～1.54般之環氧樹脂，則並未特別限定。作為如此之環氧樹脂，可使用平均每1分子具有2個以上環氧基，且透過率高者。例如可列舉氫化環氧樹脂（氫化雙酚A型環氧樹脂、氫化雙酚F型環氧樹脂等）、含有氟之環氧樹脂、鏈狀脂肪族型環氧樹脂、環狀脂肪族型環氧樹脂、雙酚A型環氧樹脂、聯苯型環氧樹脂、聯苯芳烷基型環氧樹脂、茀型環氧樹脂、萘酚型環氧樹脂、萘型環氧樹脂、雙酚F型環氧樹脂、含磷之環氧樹脂、雙酚S型環氧樹脂、芳香族環氧丙基胺型環氧樹脂（例如四環氧丙基二胺基二苯基甲烷、三環氧丙基-p-胺基酚、二環氧丙基甲苯胺（Toluidine）、二環氧丙基苯胺等）、脂環式環氧樹脂、酚酚醛清漆型環氧樹脂、烷基酚型環氧樹脂、甲酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、具有丁二烯構造之環氧樹脂、雙酚之二環氧丙基醚化物、萘二醇之二環氧丙基醚化物、酚類之二環氧丙基醚化物及醇類之二環氧丙基醚化物以及此等之環氧樹脂之烷基取代體等。 [0016] 環氧樹脂可僅使用1種，亦可併用2種以上。環氧樹脂之環氧當量從反應性等之觀點來看，較佳為50～5,000，更佳為50～3,000，再更佳為80～2,000，特佳為100～1,500。尚，所謂「環氧當量」，係包含1克當量之環氧基的樹脂之克數（g/eq），依照JIS K 7236所規定之方法測定。環氧樹脂之重量平均分子量較佳為5,000以下。 [0017] 環氧樹脂可為液狀或固形之任一種，可併用液狀環氧樹脂與固形環氧樹脂。於此，所謂「液狀」及「固形」，係於常溫（25℃）及常壓（1atm）之環氧樹脂的狀態。從塗佈性、加工性、接著性的觀點來看，較佳為使用之環氧樹脂全體的10質量%以上為液狀環氧樹脂。從與水滑石之混練性及清漆黏度的觀點來看，特佳為併用液狀環氧樹脂與固形環氧樹脂。液狀環氧樹脂與固形環氧樹脂之質量比（液狀環氧樹脂：固形環氧樹脂）較佳為1：2～1：0，更佳為1：1.5～1：0。 [0018] 在本發明之一態樣，（A）熱硬化性樹脂除了將其折射率定為1.48～1.54之外，較佳為選自氫化環氧樹脂、含有氟之環氧樹脂、鏈狀脂肪族型環氧樹脂、環狀脂肪族型環氧樹脂及烷基酚型環氧樹脂中之1種以上，更佳為選自氫化環氧樹脂、含有氟之環氧樹脂、鏈狀脂肪族型環氧樹脂及環狀脂肪族型環氧樹脂中之1種以上。藉由使用前述樹脂，可得到透明性高之硬化物。 [0019] 所謂「氫化環氧樹脂」，係意指氫化含有芳香環之環氧樹脂所得之環氧樹脂。氫化環氧樹脂之氫化率較佳為50%以上，更佳為70%以上。所謂「鏈狀脂肪族型環氧樹脂」，係意指具有直鏈狀或分支狀之烷基鏈，或烷基醚鏈之環氧樹脂，所謂「環狀脂肪族型環氧樹脂」，係意指於分子內具有環狀脂肪族骨架，例如具有環烷烴骨架之環氧樹脂。所謂「烷基酚型環氧樹脂」，係意指具有1個以上之烷基及1個以上之羥基之苯環骨架作為作為取代基，前述羥基變換成環氧丙基醚基之環氧樹脂。 [0020] 作為氫化環氧樹脂，較佳為氫化雙酚A型環氧樹脂、氫化雙酚F型環氧樹脂。尚，只要樹脂組成物之硬化物的折射率滿足上述特定之數值範圍，或作為熱硬化性樹脂全體之折射率滿足上述特定之數值範圍，上述適合之環氧樹脂以外的環氧樹脂可包含在熱硬化性樹脂中。 [0021] 作為氫化雙酚A型環氧樹脂，例如可列舉液狀氫化雙酚A型環氧樹脂（例如「YX8000」（三菱化學公司製、環氧當量：約205）、「Denacol EX-252」（Nagase ChemteX公司製、環氧當量：約213））、固形氫化雙酚A型環氧樹脂（例如「YX8040」（三菱化學公司製、環氧當量：約1000））。 [0022] 含有氟之環氧樹脂，例如可使用WO2011/089947所記載之含有氟之環氧樹脂。 [0023] 作為 鏈狀脂肪族型環氧樹脂，例如可列舉聚甘油聚環氧丙基醚（例如「Denacol EX-512」、「Denacol EX-521」，Nagase ChemteX公司製）、季戊四醇聚環氧丙基醚（例如「Denacol EX-411」，Nagase ChemteX公司製）、二甘油聚環氧丙基醚（例如「Denacol EX-421」，Nagase ChemteX公司製）、甘油聚環氧丙基醚（例如「Denacol EX-313」、「Denacol EX-314」，Nagase ChemteX公司製）、三羥甲基丙烷聚環氧丙基醚（例如，「Denacol EX-321」、Nagase ChemteX公司製）、新戊二醇二環氧丙基醚（例如「Denacol EX-211」，Nagase ChemteX公司製）、1,6-己烷二醇二環氧丙基醚（例如「Denacol EX-212」，Nagase ChemteX公司製）、乙二醇二環氧丙基醚（例如「Denacol EX-810」、「Denacol EX-811」，Nagase ChemteX公司製）、二乙二醇二環氧丙基醚（例如「Denacol EX-850」、「Denacol EX-851」，Nagase ChemteX公司製）、聚乙二醇二環氧丙基醚（例如「Denacol EX-821」、「Denacol EX-830」、「Denacol EX-832」、「Denacol EX-841」、「Denacol EX-861」，Nagase ChemteX公司製）、丙二醇二環氧丙基醚（例如「Denacol EX-911」，Nagase ChemteX公司製）、聚丙二醇二環氧丙基醚（例如「Denacol EX-941」、「Denacol EX-920」、「Denacol EX-931」，Nagase ChemteX公司製）等。 [0024] 作為環狀脂肪族型環氧樹脂，例如可列舉Daicel化學工業公司製「EHPE-3150」等。 [0025] 作為烷基酚型環氧樹脂，例如可列舉DIC公司製「HP-820」；新日鐵住金化學工業公司製「YDC-1312」；Nagase ChemteX公司製「EX-146」等。 [0026] 在本發明之一態樣，以（A）熱硬化性樹脂包含折射率為1.48～1.54，且於分子內含有芳香環之環氧樹脂（含有芳香環之環氧樹脂）較佳。使用於分子內包含芳香環構造之環氧樹脂時，由於成為有提昇樹脂組成物之反應性、硬化物之玻璃轉移溫度、密著性之任一種或全部的傾向故較佳。作為如此之熱硬化性樹脂，例如可列舉烷基酚型環氧樹脂、含有氟之芳香族型環氧樹脂等。 [0027] 又，於本發明之另一態樣，（A）熱硬化性樹脂較佳為包含折射率為1.48～1.54之環氧樹脂（a1）（以下有時簡稱為「樹脂（a1）」）及含有芳香環之環氧樹脂（a2）（以下有時簡稱為「樹脂（a2）」）。樹脂（a1）可為僅1種，亦可為2種以上。同樣，樹脂（a2）可為僅1種，亦可為2種以上。 [0028] 藉由使用含有芳香環之環氧樹脂，成為有提昇樹脂組成物之反應性，以及硬化物之玻璃轉移溫度及密著性之任一種或全部的傾向。惟，環氧樹脂包含芳香環時，有提高折射率的傾向。因此，一般而言，滿足1.48～1.54之折射率之含有芳香環之環氧樹脂較少。據此，藉由組合樹脂（a1）與樹脂（a2）使用，可兼顧期望之折射率、與樹脂組成物之反應性以及硬化物之玻璃轉移溫度及密著性的提昇。 [0029] 樹脂（a1）及樹脂（a2）之合計的含量若為達成上述效果的範圍，雖並未特別限定，但相對於（A）熱硬化性樹脂全體，較佳為60～100質量%，更佳為70～100質量%，再更佳為80～100質量%，特佳為90～100質量%，最佳為100質量%。 [0030] 作為樹脂（a1），若折射率為1.48～1.54之環氧樹脂則並未特別限定。具有上述折射率之環氧樹脂，一般而言未包含芳香環構造者較多。樹脂（a1）較佳為選自氫化環氧樹脂、含有氟之環氧樹脂、鏈狀脂肪族型環氧樹脂、環狀脂肪族型環氧樹脂及烷基酚型環氧樹脂中之1種以上。 [0031] 作為樹脂（a2），若為包含芳香環之環氧樹脂則並未特別限定。從樹脂組成物之反應性、硬化物之玻璃轉移溫度及或密著性的提昇的觀點來看，樹脂（a2）較佳為選自雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚酚醛清漆型環氧樹脂、聯苯芳烷基型環氧樹脂、茀型環氧樹脂及含有氟之芳香族型環氧樹脂中之1種以上。含有芳香環之環氧樹脂的折射率一般雖並非為1.48～1.54，但折射率為1.48～1.54之含有芳香環之環氧樹脂亦可作為樹脂（a2）使用。 [0032] 於此，所謂「聯苯芳烷基型環氧樹脂」，係意指具有鍵結酚醛清漆構造及2價聯苯構造之主鏈的環氧樹脂。所謂「茀型環氧樹脂」，係意指具有茀骨架之環氧樹脂。所謂「含有氟之芳香族型環氧樹脂」，係意指具有芳香環之含有氟之環氧樹脂。例如可使用WO2011/089947所記載之含有氟之芳香族型環氧樹脂。 [0033] 在併用樹脂（a1）及樹脂（a2）之態樣，樹脂（a1）更佳為氫化環氧樹脂、含有氟之環氧樹脂、環狀脂肪族型環氧樹脂及烷基酚型環氧樹脂，再更佳為選自氫化雙酚A型環氧樹脂、氫化雙酚F型環氧樹脂及含有氟之環氧樹脂中之1種以上，特佳為選自氫化雙酚A型環氧樹脂及氫化雙酚F型環氧樹脂中之1種以上，最佳為氫化雙酚A型環氧樹脂。又，在前述態樣，樹脂（a2）更佳為選自雙酚型環氧樹脂及含有氟之芳香族型環氧樹脂中之1種以上，再更佳為雙酚型環氧樹脂，再更佳為選自雙酚A型環氧樹脂及雙酚F型環氧樹脂中之1種以上。 [0034] 在併用樹脂（a1）及樹脂（a2）之態樣，樹脂（a2）的量相對於樹脂（a1）及樹脂（a2）的合計，較佳為0.5～40質量%，更佳為1～35質量%，再更佳為2～30質量%。 [0035] 作為雙酚A型環氧樹脂，例如可列舉三菱化學公司製「828EL」、「1001」及「1004AF」；DIC公司製「840」及「850-S」；新日鐵住金化學工業公司製「YD-128」等。又，作為液狀雙酚A型環氧樹脂及液狀雙酚F型環氧樹脂之混合物，例如可列舉新日鐵化學工業公司製「ZX-1059」（環氧當量：約165）。 [0036] 作為雙酚F型環氧樹脂，例如可列舉三菱化學公司製「807」；DIC公司製「830」；新日鐵住金化學工業公司製「YDF-170」等。 [0037] 作為酚酚醛清漆型環氧樹脂，例如可列舉DIC公司製「N-730A」、「N-740」、「N-770」及「N-775」；三菱化學公司製「152」及「154」等。 [0038] 作為聯苯芳烷基型環氧樹脂，例如可列舉日本化藥公司製「NC-3000」、「NC-3000L」及「NC-3100」等。 [0039] 作為茀型環氧樹，例如可列舉大阪燃氣化工公司製「OGSOL PG-100」、「CG-500EG-200」及「EG-280」等。 [0040] 熱硬化性樹脂的量相對於樹脂組成物的不揮發分全體，較佳為10～95質量%，更佳為20～90質量%，再更佳為30～85質量%。 [0041] 環氧樹脂的量相對於樹脂組成物的不揮發分全體，較佳為10～95質量%，更佳為20～90質量%，再更佳為30～85質量%。 [0042] ＜（B）半燒成水滑石＞ 水滑石可分類成未燒成水滑石、半燒成水滑石及燒成水滑石。 [0043] 未燒成水滑石例如如天然水滑石 （Mg6
Al2
(OH)16
CO3
･4H2
O）所代表之具有層狀結晶構造的金屬氫氧化物，例如由成為基本骨架之層［Mg1-X
AlX
(OH)2
］X+
與中間層［(CO3
)X/2
･mH2
O］X-
所構成。在本發明之未燒成水滑石係包含成水滑石等之水滑石樣化合物之概念。作為水滑石樣化合物，例如可列舉下述式（I）及下述式（II）表示者。 [0044]（式中，M2+
表示Mg2+
、Zn2+
等之2價金屬離子，M3+
表示Al3+
、Fe3+
等之3價金屬離子，An-
表示CO3 2-
、Cl-
、NO3 -
等之n價陰離子，且0＜x＜1，0≦m＜1，n為正數）。 式（I）中，M2+
較佳為Mg2+
，M3+
較佳為Al3+
，An-
較佳為CO3 2-
。 [0045]（式中，M2+
表示Mg2+
、Zn2+
等之2價金屬離子，An-
表示CO3 2-
、Cl-
、NO3-
等之n價陰離子，x為2以上之正數，z為2以下之正數，m為正數，n為正數）。 式（II）中，M2+
較佳為Mg2+
，An-
較佳為CO3 2-
。 [0046] 半燒成水滑石係指燒成未燒成水滑石所得之減少或消失層間水的量之具有層狀結晶構造的金屬氫氧化物。所謂「層間水」，若使用組成式進行說明，係指上述之未燒成的天然水滑石及水滑石樣化合物的組成式所記載之「H2
O」。本發明使用此半燒成水滑石成為特徵之一。 [0047] 另一方面，燒成水滑石係指燒成未燒成水滑石或半燒成水滑石所得，不僅層間水，羥基亦藉由縮合脫水而消失之具有非晶構造的金屬氧化物。 [0048] 未燒成水滑石、半燒成水滑石及燒成水滑石可藉由飽和吸水率區別。半燒成水滑石之飽和吸水率為1質量%以上且未滿20質量%。另一方面，未燒成水滑石之飽和吸水率為未滿1質量%，燒成水滑石之飽和吸水率為20質量%以上。 [0049] 所謂在本發明之「飽和吸水率」，係指在天秤量取1.5g之未燒成水滑石、半燒成水滑石或燒成水滑石，測定初期質量後，於設定在大氣壓下、60℃、90%RH（相對濕度）之小型環境試驗器（Espec公司製SH-222）靜置200小時的情況下之相對於初期質量之質量增加率，可用下述式（i）求得。 飽和吸水率（質量%） =100×（吸濕後之質量-初期質量）/初期質量 （i） [0050] 半燒成水滑石之飽和吸水率較佳為3質量%以上且未滿20質量%，更佳為5質量%以上且未滿20質量%。 [0051] 又，未燒成水滑石、半燒成水滑石及燒成水滑石可藉由於熱重量分析測定之熱重量減少率區別。半燒成水滑石在280℃之熱重量減少率為未滿15質量%，且在其380℃之熱重量減少率為12質量%以上。另一方面，未燒成水滑石在280℃之熱重量減少率為15質量%以上，燒成水滑石在380℃之熱重量減少率為未滿12質量%。 [0052] 熱重量分析可使用日立高科技公司製TG/DTA EXSTAR6300，於鋁製之樣品盤秤量5mg之水滑石，以未覆蓋之開放的狀態，於氮流量200mL/分鐘的環境下，從30℃至550℃以昇溫速度10℃/分鐘的條件進行。熱重量減少率可用下述式（ii）求得。 熱重量減少率（質量%） =100×（加熱前之質量-到達預定溫度時之質量）/加熱前之質量 （ii） [0053] 又，未燒成水滑石、半燒成水滑石及燒成水滑石可藉由以粉末X光繞射測定之峰值及相對強度比區別。半燒成水滑石係表示藉由粉末X光繞射於2θ為8～18˚附近有二個經分裂之峰值，或藉由二個峰值之合成而具有肩部之峰值，低角側所出現之峰值或肩部之繞射強度（=低角側繞射強度）、與高角側所出現之峰值或肩部之繞射強度（=高角側繞射強度）的相對強度比（低角側繞射強度/高角側繞射強度）為0.001～1,000。另一方面，未燒成水滑石僅於8～18˚附近具有一個峰值，或低角側所出現之峰值或肩部與高角側所出現之峰值或肩部之繞射強度的相對強度比成為前述的範圍外。燒成水滑石於8˚～18˚的區域不具有特徵性峰值，於43˚具有特徵性峰值。粉末X光繞射測定係藉由粉末X光繞射裝置（PANalytical公司製、Empyrean），以對陰極CuKα（1.5405Å）、電壓：45V、電流：40mA、取樣寬度：0.0260˚、掃描速度：0.0657˚/s、測定繞射角範圍（2θ）：5.0131～79.9711˚的條件進行。峰值搜尋係利用繞射裝置附屬之軟體的峰值搜尋功能，可用「最小顯著度：0.50、最小峰值晶片：0.01˚、最大峰值晶片：1.00˚、峰值基底寬度：2.00˚、方法：2次微分之最小值」的條件進行。 [0054] 半燒成水滑石之BET比表面積較佳為1～250m2
/g，更佳為5～200m2
/g。半燒成水滑石之BET比表面積係依照BET法，可使用比表面積測定裝置（Macsorb HM Model 1210、Mountech公司製），使氮氣體吸附在試料表面，使用BET多點法算出。 [0055] 半燒成水滑石之平均粒子徑較佳為1～1,000nm，更佳為10～800nm。半燒成水滑石之平均粒子徑係藉由雷射繞射散射式粒度分布測定（JIS Z 8825），將粒度分布以體積基準作成時之該粒度分布的中位徑。 [0056] 半燒成水滑石可使用以表面處理劑進行表面處理者。作為表面處理所使用之表面處理劑，例如可使用高級脂肪酸、烷基矽烷類、矽烷偶合劑等，其中，適合高級脂肪酸、烷基矽烷類。表面處理劑可使用1種或2種以上。 [0057] 作為高級脂肪酸，例如可列舉硬脂酸、褐煤酸、肉荳蔻酸、棕櫚酸等之碳數18以上之高級脂肪酸，其中，較佳為硬脂酸。此等可使用1種或2種以上。 [0058] 作為烷基矽烷類，例如可列舉甲基三甲氧基矽烷、乙基三甲氧基矽烷、己基三甲氧基矽烷、辛基三甲氧基矽烷、癸基三甲氧基矽烷、十八烷基三甲氧基矽烷、二甲基二甲氧基矽烷、辛基三乙氧基矽烷、n-十八烷基二甲基（3-（三甲氧基矽烷基）丙基）氯化銨等。此等可使用1種或2種以上。 [0059] 作為矽烷偶合劑，例如可列舉3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基（二甲氧基）甲基矽烷及2-（3,4-環氧環己基）乙基三甲氧基矽烷等之環氧系矽烷偶合劑；3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、3-巰基丙基甲基二甲氧基矽烷及11-巰基十一烷基三甲氧基矽烷等之巰基系矽烷偶合劑；3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-胺基丙基二甲氧基甲基矽烷、N-苯基-3-胺基丙基三甲氧基矽烷、N-甲基胺基丙基三甲氧基矽烷、N-（2-胺基乙基）-3-胺基丙基三甲氧基矽烷及N-（2-胺基乙基）-3-胺基丙基二甲氧基甲基矽烷等之胺基系矽烷偶合劑；3-脲基丙基三乙氧基矽烷等之脲基系矽烷偶合劑、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷及乙烯基甲基二乙氧基矽烷等之乙烯基系矽烷偶合劑；p-苯乙烯基三甲氧基矽烷等之苯乙烯基系矽烷偶合劑；3-丙烯醯氧基丙基三甲氧基矽烷及3-甲基丙烯醯氧基丙基三甲氧基矽烷等之丙烯酸酯系矽烷偶合劑；3-異氰酸酯丙基三甲氧基矽烷等之異氰酸酯系矽烷偶合劑、雙（三乙氧基矽烷基丙基）二硫化物、雙（三乙氧基矽烷基丙基）四硫化物等之硫化物系矽烷偶合劑；苯基三甲氧基矽烷、甲基丙烯醯氧基（Methacryloxy）丙基三甲氧基矽烷、咪唑矽烷、三嗪矽烷等。此等可使用1種或2種以上。 [0060] 半燒成水滑石的表面處理，例如可藉由邊將未處理之半燒成水滑石以混合機在常溫使其攪拌分散，邊添加表面處理劑進行噴霧再攪拌5～60分鐘來進行。作為混合機，可使用周知之混合機，例如可列舉V摻合機、絲帶攪拌機、氣泡錐形攪拌機等之摻合機、亨舍爾混合機及混凝土攪拌機等之混合機、球磨機、絞磨機等。又，以球磨機等粉碎半燒成水滑石時，亦可添加前述之高級脂肪酸、烷基矽烷類或矽烷偶合劑，進行表面處理。表面處理劑的使用量雖因半燒成水滑石的種類或表面處理劑的種類等而有所不同，但相對於未被表面處理之半燒成水滑石100質量份，較佳為1～10質量份。在本發明，經表面處理之半燒成水滑石亦包含在本發明之「半燒成水滑石」。 [0061] 在本發明之樹脂組成物之半燒成水滑石的量，只要能發揮本發明的效果，雖並未被特別限定，但相對於樹脂組成物之不揮發分全體較佳為5～60質量%，更佳為10～55質量%。由於半燒成水滑石係吸濕性能優異，只要增加該量，則提昇所得之硬化物的水分遮斷性。惟，該量超過60質量%時，變成有產生樹脂組成物的黏度上昇、因潤濕性的降低導致密封對象之基板等與樹脂組成物的密著性降低、硬化物的強度降低變脆等之問題的傾向。又，由於因半燒成水滑石之層間水，導致密封層（即硬化物）中之水分量增多，例如在有機EL裝置之製造，有因密封層中之水分導致對發光材料（發光層）或電極層的不良影響顯在化，初期階段的暗點發生增多的疑慮。 [0062] 本發明之樹脂組成物若為發揮本發明的效果的範圍，可包含燒成水滑石。該量相對於樹脂組成物的不揮發分全體，較佳為0～20質量%，更佳為0～15質量%，再更佳為0～10質量%，最佳為0。即，本發明之樹脂組成物最佳為不包含燒成水滑石。增加燒成水滑石的量時，變成有樹脂組成物之硬化物的折射率上昇，透過率降低的傾向。半燒成水滑石：燒成水滑石的質量比較佳為50：50～100：0，更佳為55：45～100：0，再更佳為60：40～100：0。 [0063] 本發明之樹脂組成物若為發揮本發明的效果的範圍，可包含未燒成水滑石。該量相對於樹脂組成物的不揮發分全體，較佳為0～20質量%，更佳為0～10質量%，再更佳為0～5質量%，最佳為0。即，本發明之樹脂組成物最佳為未包含未燒成水滑石。未燒成水滑石雖未對樹脂組成物之硬化物的透過率帶來影響，但由於水分含量大，恐有因增量導致水分遮蔽性的降低之虞，例如，該量超過20質量%時，與半燒成水滑石相同有初期階段之暗點發生增多的懸念。半燒成水滑石：未燒成水滑石的質量比較佳為50：50～100：0，更佳為55：45～100：0，再更佳為60：40～100：0，又再更佳為65：35～100：0，特佳為70：30～100：0。 [0064] 作為半燒成水滑石，例如可列舉「DHT-4C」（協和化學工業公司製、平均粒子徑：400nm）、「DHT-4A-2」（協和化學工業公司製、平均粒子徑：400nm）等。另一方面，作為燒成水滑石，例如可列舉「KW-2200」（協和化學工業公司製、平均粒子徑：400nm）等，作為未燒成水滑石，例如可列舉「DHT-4A」（協和化學工業公司製、平均粒子徑：400nm）等。 [0065] ＜（C）硬化劑及（D）硬化促進劑＞ 本發明之樹脂組成物係含有硬化劑。亦即，密封層係使樹脂組成物硬化所得之硬化物。硬化劑若為具有硬化熱硬化性樹脂之功能者，則並未特別限定。從抑制在樹脂組成物之硬化處理時之有機EL元件等之發光元件之熱劣化的觀點來看，作為硬化劑，較佳為可於140℃以下（較佳為120℃以下）的溫度下，硬化熱硬化性樹脂。硬化劑可僅使用1種，亦可併用2種以上。 [0066] 作為硬化劑，對作為熱硬化性樹脂特佳之環氧樹脂的硬化劑進行例示。例如可列舉離子液體、酸酐化合物、咪唑化合物、3級胺系化合物、二甲基脲化合物、胺加成物化合物、有機酸二肼化合物、有機膦化合物、雙氰胺化合物、1級･2級胺系化合物等。 [0067] 硬化劑較佳為選自離子液體、酸酐化合物、咪唑化合物、3級胺系化合物、二甲基脲化合物及胺加成物化合物中之1種以上，更佳為選自離子液體、酸酐化合物、咪唑化合物、3級胺系化合物及二甲基脲化合物中之1種以上。 [0068] 尤其是作為在本發明之硬化劑，其係可於140℃以下（較佳為120℃以下）的溫度下硬化熱硬化性樹脂（尤其是環氧樹脂）之離子液體，亦即，為可於140℃以下（較佳為120℃以下）的溫度區域融解之鹽，較佳為具有熱硬化性樹脂（尤其是環氧樹脂）之硬化作用的鹽。離子液體期望以均勻溶解在熱硬化性樹脂（尤其是環氧樹脂）的狀態使用，又，離子液體有利於作用在樹脂組成物之硬化物的水分遮斷性的提昇。 [0069] 本發明之樹脂組成物除了硬化劑，以調整硬化時間等為目的亦可含有硬化促進劑。硬化促進劑可僅使用1種，亦可併用2種以上。作為硬化促進劑，對作為熱硬化性樹脂特佳之環氧樹脂的硬化促進劑進行例示。例如可列舉咪唑化合物、3級胺系化合物、二甲基脲化合物及胺加成物化合物等。硬化促進劑較佳為選自咪唑化合物、3級胺系化合物及二甲基脲化合物中之1種以上。 [0070] 作為構成作為在本發明之硬化劑的離子液體之陽離子，可列舉咪唑鎓離子、哌啶鎓離子、吡咯烷鎓離子、吡唑鎓（Pyrazolium）離子、胍鹽（Guanidinium）離子、吡啶鎓離子等之銨系陽離子；四烷基鏻陽離子（例如四丁基鏻離子、三丁基己基鏻離子等）等之鏻系陽離子；三乙基鋶離子等之鋶系陽離子等。 [0071] 作為構成作為在本發明之硬化劑的離子液體之陰離子，可列舉氟化物離子、氯化物離子、溴化物離子、碘化物離子等之鹵素化物系陰離子；甲烷磺酸離子等之烷基硫酸系陰離子；三氟甲烷磺酸離子、六氟膦酸離子、三氟參（五氟乙基）膦酸離子、雙（三氟甲烷磺醯基）醯亞胺離子、三氟乙酸離子、四氟硼酸離子等之含氟化合物系陰離子；酚離子、2-甲氧基酚離子、2,6-二-tert-丁基酚離子等之酚系陰離子；天冬胺酸離子、麩胺酸離子等之酸性胺基酸離子；甘胺酸離子、丙胺酸離子、苯基丙胺酸離子等之中性胺基酸離子；N-苯甲醯基丙胺酸離子、N-乙醯基苯基丙胺酸離子、N-乙醯甘胺酸離子等之下述一般式（1）表示之N-醯基胺基酸離子；甲酸離子、乙酸離子、癸酸離子、2-吡咯烷酮-5-羧酸離子、α-硫辛酸離子、乳酸離子、酒石酸離子、海馬酸離子、N-甲基海馬酸離子、苯甲酸離子等之羧酸系陰離子。 [0072][0073] （惟，R為碳數1～5之直鏈或分支鏈之烷基，或取代或無取代之苯基，X表示胺基酸之側鏈）。 [0074] 作為在該式（1）之胺基酸，例如可列舉天冬胺酸、麩胺酸、甘胺酸、丙胺酸、苯基丙胺酸等，其中，較佳為甘胺酸。 [0075] 上述當中，陽離子較佳為銨系陽離子、鏻系陽離子，更佳為咪唑鎓離子、鏻離子。咪唑鎓離子更詳細而言，為1-乙基-3-甲基咪唑鎓離子、1-丁基-3-甲基咪唑鎓離子、1-丙基-3-甲基咪唑鎓離子等。 [0076] 又，陰離子較佳為酚系陰離子、一般式（1）表示之N-醯基胺基酸離子或羧酸系陰離子，更佳為N-醯基胺基酸離子或羧酸系陰離子。 [0077] 作為酚系陰離子之具體例，可列舉2,6-二-tert-丁基酚離子。又，作為羧酸系陰離子之具體例，可列舉乙酸離子、癸酸離子、2-吡咯烷酮-5-羧酸離子、甲酸離子、α-硫辛酸離子、乳酸離子、酒石酸離子、海馬酸離子、N-甲基海馬酸離子等，其中，較佳為乙酸離子、2-吡咯烷酮-5-羧酸離子、甲酸離子、乳酸離子、酒石酸離子、海馬酸離子、N-甲基海馬酸離子，特別佳為乙酸離子、癸酸離子、N-甲基海馬酸離子、甲酸離子。又，作為一般式（1）表示之N-醯基胺基酸離子之具體例，可列舉N-苯甲醯基丙胺酸離子、N-乙醯基苯基丙胺酸離子、天冬胺酸離子、甘胺酸離子、N-乙醯甘胺酸離子等，其中，較佳為N-苯甲醯基丙胺酸離子、N-乙醯基苯基丙胺酸離子、N-乙醯甘胺酸離子，特別佳為N-乙醯甘胺酸離子。 [0078] 作為具體之離子液體，例如較佳為1-丁基-3-甲基咪唑鎓乳酸酯、四丁基鏻-2-吡咯烷酮-5-羧酸酯、四丁基鏻乙酸鹽、四丁基鏻癸酸鹽、四丁基鏻三氟乙酸鹽、四丁基鏻α-硫辛酸酯、甲酸四丁基鏻鹽、四丁基鏻乳酸酯、酒石酸雙（四丁基鏻）鹽、海馬酸四丁酯鏻鹽、N-甲基海馬酸四丁酯鏻鹽、苯甲醯基-DL-丙胺酸四丁酯鏻鹽、N-乙醯基苯基丙胺酸四丁酯鏻鹽、2,6-二-tert-丁基酚四丁酯鏻鹽、L-天冬胺酸單四丁酯鏻鹽、甘胺酸四丁酯鏻鹽、N-乙醯甘胺酸四丁酯鏻鹽、1-乙基-3-甲基咪唑鎓乳酸酯、1-乙基-3-甲基咪唑鎓乙酸鹽、甲酸1-乙基-3-甲基咪唑鎓鹽、海馬酸1-乙基-3-甲基咪唑鎓鹽、N-甲基海馬酸1-乙基-3-甲基咪唑鎓鹽、酒石酸雙（1-乙基-3-甲基咪唑鎓）鹽、N-乙醯甘胺酸1-乙基-3-甲基咪唑鎓鹽，特別佳為四丁基鏻癸酸鹽、N-乙醯甘胺酸四丁基鏻鹽、1-乙基-3-甲基咪唑鎓乙酸鹽、甲酸1-乙基-3-甲基咪唑鎓鹽、海馬酸1-乙基-3-甲基咪唑鎓鹽、N-甲基海馬酸1-乙基-3-甲基咪唑鎓鹽。 [0079] 作為上述離子液體之合成法，雖有於由烷基咪唑鎓、烷基吡啶鎓、烷基銨及烷基鋶離子等之陽離子部位、與包含鹵素之陰離子部位所構成之前驅物，使NaBF4
、NaPF6
、CF3
SO3
Na或LiN(SO2
CF3
)2
等進行反應之陰離子交換法、使胺系物質與酸酯進行反應而導入烷基，並且有機酸殘基成為對陰離子般之酸酯法及將胺類以有機酸中和而得到鹽之中和法等，但並非被限定於此等。藉由陰離子與陽離子與溶劑之中和法，可等量使用陰離子與陽離子，餾除所得之反應液中之溶劑，亦可直接使用，進而倒入有機溶劑（甲醇、甲苯、乙酸乙酯、丙酮等）進行液濃縮亦無妨。 [0080] 作為在本發明之硬化劑的酸酐化合物，例如可列舉四苯二甲酸酐酐、甲基四苯二甲酸酐酐、六苯二甲酸酐酐、甲基六苯二甲酸酐酐、甲基納迪克酸酐、十二碳烯基琥珀酸酐等。作為酸酐化合物之具體例，可列舉RIKACID TH、TH-1A、HH、MH、MH-700、MH-700G（皆為新日本理化公司製）等。 [0081] 作為在本發明之硬化劑及硬化促進劑的咪唑化合物，例如可列舉1H-咪唑、2-甲基-咪唑、2-苯基-4-甲基咪唑、2-乙基-4-甲基咪唑、1-氰乙基-2-乙基-4-甲基-咪唑、2-十一烷基咪唑、1-氰乙基-2-十一烷基咪唑、1-氰乙基-2-十一烷基咪唑鎓偏苯三酸酯（Trimellitate）、2,4-二胺基-6-（2’-十一烷基咪唑基-（1’））-乙基-s-三嗪、2-苯基-4,5-雙（羥基甲基）-咪唑、1-苄基-2-甲基咪唑、1-苄基-2-苯基咪唑、2-苯基-咪唑、2-十二烷基-咪唑、2-十七烷基咪唑、1,2-二甲基-咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、2,4-二胺基-6-（2’-甲基咪唑基-（1’）-乙基-s-三嗪、2,4-二胺基-6-（2’-甲基咪唑基-（1’））-乙基-s-三嗪異氰脲酸加成物等。作為咪唑化合物之具體例，可列舉Curezol 2MZ、2P4MZ、2E4MZ、2E4MZ-CN、C11Z、C11Z-CN、C11Z-CNS、C11Z-A、2PHZ、1B2MZ、1B2PZ、2PZ、C17Z、1.2DMZ、2P4MHZ-PW、2MZ-A、2MA-OK（皆為四國化成工業公司製）等。 [0082] 作為在本發明之硬化劑及硬化促進劑的3級胺系化合物之具體例，可列舉DBN（1,5-diazabicyclo[4.3.0]non-5-ene）、DBU（1,8-diazabicyclo[5.4.0]undec-7-ene）、DBU之2-乙基己烷酸鹽、DBU之酚鹽、DBU之p-甲苯磺酸鹽、U-CAT SA 102（San-Apro公司製：DBU之辛基酸鹽）、DBU之甲酸鹽等之DBU-有機酸鹽、參（二甲基胺基甲基）酚（TAP）等。 [0083] 作為在本發明之硬化劑及硬化促進劑的二甲基脲化合物之具體例，可列舉DCMU（3-（3,4-二氯苯基）-1,1-二甲基脲）、U-CAT3512T（San-Apro公司製）等之芳香族二甲基脲、U-CAT3503N（San-Apro公司製）等之脂肪族二甲基脲等。其中從硬化性的點來看，較佳為使用芳香族二甲基脲。 [0084] 作為在本發明之硬化劑及硬化促進劑的胺加成物化合物，例如可列舉藉由於中途停止對環氧樹脂之3級胺的加成反應所得之環氧加成物化合物等。作為胺加成物系化合物之具體例，可列舉Amicure PN-23、Amicure MY-24、Amicure PN-D、Amicure MY-D、Amicure PN-H、Amicure MY-H、Amicure PN-31、Amicure PN-40、Amicure PN-40J（皆為Ajinomoto Fine Techno公司製）等。 [0085] 作為在本發明之硬化劑的有機酸二肼化合物之具體例，可列舉Amicure VDH-J、Amicure UDH、Amicure LDH（皆為Ajinomoto Fine Techno公司製）等。 [0086] 作為在本發明之硬化劑及硬化促進劑的有機膦化合物，例如可列舉三苯基膦、四苯基鏻四-p-甲苯基硼酸鹽、四苯基鏻四苯基硼酸鹽、三-tert-丁基鏻四苯基硼酸鹽、（4-甲基苯基）三苯基鏻硫氰酸鹽、四苯基鏻硫氰酸鹽、丁基三苯基鏻硫氰酸鹽、三苯基膦三苯基硼烷等。作為有機膦化合物之具體例，可列舉TPP、TPP-MK、TPP-K、TTBuP-K、TPP-SCN、TPP-S（北興化學工業公司製）等。 [0087] 作為在本發明之硬化劑的雙氰胺化合物，例如可列舉雙氰胺。作為雙氰胺化合物之具體例，可列舉雙氰胺微粉碎品之DICY7、DICY15（皆為三菱化學公司製）等。 [0088] 作為在本發明之硬化劑的1級･2級胺系化合物，例如可列舉脂肪族胺之二乙烯三胺、三乙烯四胺、四乙烯五胺、三甲基六亞甲基二胺、2-甲基五亞甲基二胺、1,3-雙胺基甲基環己烷、二丙烯二胺、二乙基胺基丙基胺、雙（4-胺基環己基）甲烷、降莰烯二胺、1,2-二胺基環己烷等、脂環式胺之N-胺基乙基哌嗪、1,4-雙（3-胺基丙基）哌嗪等、芳香族胺之二胺基二苯基甲烷、m-伸苯基二胺、m-二甲苯二胺、間伸苯基二胺、二胺基二苯基甲烷、二胺基二苯基碸、二乙基甲苯二胺等。作為1級･2級胺系化合物之具體例，可列舉Kayahard A-A（日本化藥公司製：4,4’-二胺基-3,3’-二甲基二苯基甲烷）等。 [0089] 在本發明之樹脂組成物，硬化劑的量相對於樹脂組成物的不揮發分全體，較佳為0.1～40質量%，更佳為0.5～38質量份，再更佳為1～35質量份。該量較0.1質量%更少時，有得不到充分之硬化性之虞，該量較40質量%更多時，有損害樹脂組成物之保存安定性之虞。尚，使用離子液體作為硬化劑時，從樹脂組成物之硬化物的水分遮斷性等之點來看，離子液體的量相對於樹脂組成物不揮發分全體，較佳為0.1～20質量%，更佳為0.5～18質量%，再更佳為1～15質量%。 [0090] 本發明之樹脂組成物包含硬化促進劑時，該量相對於樹脂組成物的不揮發分全體，較佳為0.05～10質量%，更佳為0.1～8質量%，再更佳為0.5～5質量%。該量未滿0.05質量%時，有硬化變遲緩增長熱硬化時間的傾向，超過10質量%時，變成有降低樹脂組成物之保存安定性的傾向。 [0091] 在本發明之熱硬化性樹脂組成物，較佳為組合硬化劑與硬化促進劑使用。作為硬化劑及硬化促進劑的組合，較佳為選自離子液體、酸酐化合物、咪唑化合物、3級胺系化合物、二甲基脲化合物及胺加成物化合物中之2種以上。 [0092] ＜（E）熱塑性樹脂＞ 從對密封層（即，樹脂組成物之硬化物）之可撓性的賦予、調製密封用薄片時之樹脂組成物清漆的塗佈性（防止皸裂）等的觀點來看，於本發明之樹脂組成物可含有熱塑性樹脂。作為熱塑性樹脂，例如可列舉苯氧基樹脂、聚乙烯基縮醛樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚醚碸樹脂、聚碸樹脂、聚酯樹脂、（甲基）丙烯酸系聚合物等。此等之熱塑性樹脂可僅使用1種，亦可併用2種以上。 [0093] 從對硬化樹脂組成物所得之密封層之可撓性的賦予、調製密封用薄片時之樹脂組成物清漆的塗佈性（防止皸裂）等的觀點來看，熱塑性樹脂之重量平均分子量較佳為15,000以上，更佳為20,000以上。惟，此重量平均分子量過大時，由於有降低熱塑性樹脂與熱硬化性樹脂（尤其是環氧樹脂）的相溶性等之傾向。因此，此重量平均分子量較佳為1,000,000以下，更佳為800,000以下。 [0094] 在本發明之重量平均分子量係以凝膠滲透層析（GPC）法（聚苯乙烯換算）測定。藉由GPC法之重量平均分子量，具體而言，使用島津製作所公司製LC-9A/RID-6A作為測定裝置，使用昭和電工公司製Shodex K-800P/K-804L/K-804L作為管柱，使用氯仿等作為移動等，在管柱溫度40℃測定，可使用標準聚苯乙烯之檢量線算出。 [0095] 熱塑性樹脂若樹脂組成物之硬化物的折射率如成為1.48～1.54般之熱塑性樹脂，則並未特別限定。熱硬化性樹脂之折射率低時，可為較上述樹脂組成物之硬化物的折射率更高之樹脂組成物之硬化物的折射率之熱塑性樹脂。熱塑性樹脂的折射率較佳為1.40～1.70，更佳為1.40～1.65。使用複數個熱塑性樹脂時，較佳為熱塑性樹脂之混合物全體的折射率為上述範圍內。 [0096] 作為熱塑性樹脂，較佳為與熱硬化性樹脂（尤其是環氧樹脂）的相溶性良好，可有利於作用在樹脂組成物之硬化物的水分遮斷性的提昇之苯氧基樹脂。 [0097] 苯氧基樹脂亦與環氧樹脂相同可具有環氧基。苯氧基樹脂之重量平均分子量較佳為10,000～500,000，更佳為20,000～300,000。 [0098] 作為適合之苯氧基樹脂，可列舉具有選自雙酚A骨架、雙酚F骨架、雙酚S骨架、雙酚苯乙酮骨架、酚醛清漆骨架、聯苯骨架、茀骨架、二環戊二烯骨架及降莰烯骨架中之1種以上的骨架者。苯氧基樹脂可使用1種或2種以上。 [0099] 作為苯氧基樹脂之市售品，例如可列舉YX7200B35（三菱化學公司製：含有聯苯骨架之苯氧基樹脂）、1256（三菱化學公司製：含有雙酚A骨架之苯氧基樹脂）、YX6954BH35（三菱化學公司製：含有雙酚苯乙酮骨架之苯氧基樹脂）等。 [0100] 含有本發明之樹脂組成物為熱塑性樹脂時，該量相對於樹脂組成物不揮發分全體，為0.1～60質量%，較佳為3～60質量%，更佳為5～50質量%。 [0101] ＜偶合劑＞ 本發明之樹脂組成物可含有偶合劑。作為偶合劑，可列舉矽烷偶合劑、鋁酸鹽偶合劑、鈦酸酯偶合劑。作為矽烷偶合劑，例如可列舉3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基（二甲氧基）甲基矽烷及2-（3,4-環氧環己基）乙基三甲氧基矽烷等之環氧系矽烷偶合劑；3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、3-巰基丙基甲基二甲氧基矽烷及11-巰基十一烷基三甲氧基矽烷等之巰基系矽烷偶合劑；3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-胺基丙基二甲氧基甲基矽烷、N-苯基-3-胺基丙基三甲氧基矽烷、N-甲基胺基丙基三甲氧基矽烷、N-（2-胺基乙基）-3-胺基丙基三甲氧基矽烷及N-（2-胺基乙基）-3-胺基丙基二甲氧基甲基矽烷等之胺基系矽烷偶合劑；3-脲基丙基三乙氧基矽烷等之脲基系矽烷偶合劑；乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷及乙烯基甲基二乙氧基矽烷等之乙烯基系矽烷偶合劑；p-苯乙烯基三甲氧基矽烷等之苯乙烯基系矽烷偶合劑；3-丙烯醯氧基丙基三甲氧基矽烷及3-甲基丙烯醯氧基丙基三甲氧基矽烷等之丙烯酸酯系矽烷偶合劑；3-異氰酸酯丙基三甲氧基矽烷等之異氰酸酯系矽烷偶合劑；雙（三乙氧基矽烷基丙基）二硫化物、雙（三乙氧基矽烷基丙基）四硫化物等之硫化物系矽烷偶合劑；苯基三甲氧基矽烷、甲基丙烯醯氧基（Methacryloxy）丙基三甲氧基矽烷、咪唑矽烷、三嗪矽烷等。此等當中，較佳為乙烯基系矽烷偶合劑、環氧系矽烷偶合劑，特佳為環氧系矽烷偶合劑。作為鋁酸鹽偶合劑，例如可列舉烷基乙醯乙酸鹽二異丙酸鋁（例如「PLENACT AL-M」Ajinomoto Fine Techno公司製）。作為鈦酸酯系偶合劑之具體例，可列舉PLENACT TTS、PLENACT 46B、PLENACT 55、PLENACT 41B、PLENACT 38S、PLENACT 138S、PLENACT 238S、PLENACT 338X、PLENACT 44、PLENACT 9SA（皆為Ajinomoto Fine Techno公司製）等。偶合劑可使用1種或2種以上。 [0102] 在本發明之樹脂組成物之偶合劑的量相對於樹脂組成物的不揮發分全體，較佳為0～15質量%，更佳為0.5～10質量%。 [0103] ＜無機填充材＞ 本發明之樹脂組成物中，從樹脂組成物之硬化物的水分遮斷性、調製封裝薄片時之樹脂組成物清漆的塗佈性（防止皸裂）等的觀點來看，於發揮本發明的效果的範圍，可進一步含有半燒成水滑石以外之無機填充材。作為如此之無機填充材，除了上述之未燒成水滑石及燒成水滑石之外，例如可列舉滑石、二氧化矽、氧化鋁、硫酸鋇、黏土、雲母、氫氧化鋁、氫氧化鎂、碳酸鈣、碳酸鎂、氮化硼、硼酸鋁、鈦酸鋇、鈦酸鍶、鈦酸鈣、鈦酸鎂、鈦酸鉍、氧化鈦、氧化鋯、鋯酸鋇、鋯酸鈣、矽酸鹽等。無機填充材可使用1種或2種以上。尚，無機填充材之一次粒子之粒徑較佳為5μm以下，更佳為3μm以下。例如，可使用一次粒子之粒徑為0.001～3μm者，更佳為0.005～2μm者。 [0104] 無機填充材的粒子形態並未特別限定，可使用略球狀、直方體狀、板狀、如纖維之直線形狀、分枝之分支形狀。無機填充材較佳為滑石、二氧化矽、沸石、氧化鈦、氧化鋁、氧化鋯、矽酸鹽、雲母、氫氧化鎂、氫氧化鋁等，更佳為滑石、二氧化矽，特佳為滑石。作為二氧化矽，較佳為無定形二氧化矽、熔融二氧化矽、結晶二氧化矽、合成二氧化矽濕式二氧化矽、乾式二氧化矽、膠態二氧化矽（水分散型、有機溶劑分散型、氣相二氧化矽等），從難以沉澱、沉降、與樹脂之複合化容易的觀點來看，特佳為有機溶劑分散型膠態二氧化矽（有機二氧化矽溶膠）。 [0105] 無機填充材可使用市售品。作為滑石之例，可列舉日本滑石公司製「FG-15」（平均粒徑1.4μm）、「D-1000」（平均粒徑1.0μm）、「D-600」（平均粒徑0.6μm）等。作為被市售之球狀熔融二氧化矽之例，可列舉Admatechs公司製之真球二氧化矽「Adma fine系列」（「SO-C2；平均粒徑0.5μm」、「SC2500-SQ；平均粒子徑0.5μm、矽烷偶合處理」等）等。作為發煙二氧化矽之例，可列舉日本Aerosil（股）製之「Aerosil系列」（「A-200：一次粒子徑5～40nm」等）等。作為有機溶劑分散型膠態二氧化矽之例，可列舉日產化學工業公司製「MEK-EC-2130Y」（非晶二氧化矽粒徑10～15nm、不揮發分30質量%、MEK溶劑）、日產化學工業公司製「PGM-AC-2140Y」（二氧化矽粒徑10～15nm、不揮發分40質量%、PGM（丙二醇單甲基醚）溶劑）、日產化學工業公司製「MIBK-ST」（二氧化矽粒徑10～15nm、不揮發分30質量%、MIBK（甲基異丁基酮）溶劑）、扶桑化學工業公司製膠體狀二氧化矽溶膠「PL-2L-MEK」（二氧化矽粒徑15～20nm、不揮發分20質量%、MEK（甲基乙基酮）溶劑）等。 [0106] 半燒成水滑石以外之無機填充材的量，從樹脂組成物之硬化物的水分遮蔽性等的觀點來看，相對於樹脂組成物之不揮發分全體，較佳為0～30質量%，更佳為0～25質量%。 [0107] 為了提昇樹脂組成物之硬化物的水分遮蔽性及透過率等，可於本發明之樹脂組成物摻合二氧化矽。摻合二氧化矽時，該量相對於樹脂組成物之不揮發分全體，較佳為0.1～10質量%。二氧化矽的量過多時，成為有降低密著性的傾向。 [0108] 為了提昇樹脂組成物之硬化物的耐濕性及密著性等，可於本發明之樹脂組成物摻合滑石。摻合滑石時，該量相對於樹脂組成物的不揮發分全體，較佳為0.01～30質量%，更佳為0.1～20質量%，再更佳為0.5～10質量%。滑石的量過少時，有難以發揮藉由滑石之耐濕性及密著性提昇的效果的傾向，滑石的量過多時，成為有透明性惡化的傾向。 [0109] ＜其他添加劑＞ 本發明之樹脂組成物若為發揮本發明的效果的範圍，可進一步含有與上述之成分不同之其他添加劑。作為如此之添加劑，例如可列舉橡膠粒子、矽氧粉末、尼龍粉末、氟樹脂粉末等之有機填充材；Orben、Penton等之增黏劑；矽氧系、氟系、高分子系之消泡劑或整平劑；三唑化合物、噻唑化合物、三嗪化合物、卟啉化合物等之密著性賦予劑；等。 [0110] ＜折射率＞ 在本發明，固形樹脂（例如固形環氧樹脂、苯氧基樹脂等）之折射率及樹脂組成物之硬化物的折射率，皆為於25℃之波長594nm的光之折射率，根據棱鏡耦合器法之測定值。詳細而言，可藉由棱鏡耦合器法，藉由測定折射率已知之棱鏡、與在和該棱鏡接觸之試料的界面之臨界角，測定試料之折射率。作為棱鏡耦合器法之測定裝置，例如可使用Metricon公司製棱鏡耦合器（模型2010/M）。測定包含溶劑之溶液狀的固形樹脂或苯氧基樹脂等之折射率時，將於玻璃支持體之上以均勻之膜厚塗佈，在熱循環式烤箱等使足夠溶劑量揮發者用在測定。液狀樹脂（例如液狀環氧樹脂等）之折射率係根據使用於25℃之多波長阿貝折射率計的測定法之測定值。作為多波長阿貝折射率計，例如可使用Atago公司製DR-M2。 [0111] ＜硬化物層之平行線透過率＞ 在本發明，較佳為厚度為20μm之樹脂組成物的硬化物層於D65光之平行線透過率為80～100%。如此之硬化物層在目視可認定為透明。 [0112] 本發明之樹脂組成物藉由適當採用上述之較佳的條件，可輕易地形成平行線透過率優異之樹脂組成物的硬化物（密封層）。厚度為20μm之樹脂組成物的硬化物層（密封層）於D65光之平行線透過率較佳為80～100%，更佳為85～100%。硬化物於D65光之平行線透過率如後述之實施例所記載的方式進行，形成於玻璃板之間挾持樹脂組成物之硬化物的層合體，藉由將空氣作為參考算出。尚，上述之於D65光之平行線透過率的值，雖為厚度為20μm之樹脂組成物的硬化物層之測定值，但硬化物層的厚度一般為3～200μm。 [0113] ＜樹脂組成物之製造方法＞ 硬化物之折射率為1.48～1.54之本發明之樹脂組成物，可藉由使用具有與前述折射率為相同程度折射率之成分，或摻合更低折射率之樹脂與高折射率之樹脂而將樹脂全體之折射率調整在上述範圍，而製得。可藉由將如此之成分及視必要之有機溶劑等使用混練輥或回轉混合機等進行混合，製造本發明之樹脂組成物。 [0114] ＜用途＞ 本發明之樹脂組成物及後述之密封用薄片，例如係被使用在半導體、太陽能電池、高亮度LED、LCD、EL元件等之電子零件，較佳為有機EL元件、太陽能電池等之光學半導體的密封。本發明之樹脂組成物及密封用薄片，尤其是適合被使用在有機EL元件的密封。具體而言，為了適用在有機EL元件之發光部的上部及/或周圍（側部），且將有機EL元件之發光部從外部保護，可使用本發明之樹脂組成物及密封用薄片。 [0115] 可藉由將本發明之樹脂組成物接塗佈在密封對象物，硬化其塗膜，來形成密封層。又，可藉由於支持體上製作形成本發明之樹脂組成物的層之密封用薄片，將密封用薄片層壓在密封對象物的必要地點，將樹脂組成物層轉印在被覆對象物，進行硬化，來形成密封層。 [0116] ＜密封用薄片＞ 本發明之樹脂組成物的層形成在支持體上而成之密封用薄片，可藉由本發明領域具有通常知識者所周知之方法，例如調製樹脂組成物溶解在有機溶劑之樹脂組成物清漆，將該清漆塗佈在支持體上，進而藉由加熱、或熱風吹附等乾燥所塗佈之該清漆，來形成樹脂組成物層而製得。 [0117] 作為密封用薄片所使用之支持體，可列舉聚乙烯、聚丙烯、聚氯化乙烯基等之聚烯烴、環烯烴聚合物、聚對苯二甲酸乙二酯（以下有時稱為「PET」）、聚萘二甲酸乙二酯等之聚酯、聚碳酸酯、聚醯亞胺等之塑膠薄膜。作為塑膠薄膜，尤其是以PET較佳。又支持體可為鋁箔、不銹鋼箔、銅箔等之金屬箔。支持體除了消光處理、電暈處理之外，亦可實施脫模處理。作為脫模處理，例如可列舉藉由矽氧樹脂系脫模劑、醇酸樹脂系脫模劑、氟樹脂系脫模劑等之脫模劑的脫模處理。 [0118] 為了提昇密封用薄片之防濕性，可將具有阻隔層之塑膠薄膜作為支持體使用。作為此阻隔層，例如可列舉氮化矽等之氮化物、氧化鋁等之氧化物、不銹鋼箔、鋁箔之金屬箔等。作為塑膠薄膜，可列舉上述之塑膠薄膜。具有阻隔層之塑膠薄膜可使用市售品。又，可為複合層壓金屬箔與塑膠薄膜之薄膜。例如作為附鋁箔之聚對苯二甲酸乙二酯薄膜之市售品，可列舉東海東洋鋁業銷售公司製「附PET之AL1N30」、福田金屬公司製「附PET之AL3025」、PANAC公司製「Alpet」等。 [0119] 支持體中，可實施藉由矽氧樹脂系脫模劑、醇酸樹脂系脫模劑、氟樹脂系脫模劑等之脫模處理、消光處理、電暈處理等。在本發明，支持體具有脫模層時，該脫模層亦可看作支持體的一部分。支持體的厚度雖並未特別限定，但從操作性等的觀點來看，較佳為20～200μm，更佳為20～125μm。 [0120] 作為有機溶劑，例如可列舉丙酮、甲基乙基酮（以下亦簡稱為「MEK」）、環己酮等之酮類、乙酸乙酯、乙酸丁酯、溶纖劑乙酸鹽、丙二醇單甲基醚乙酸鹽、卡必醇乙酸鹽等之乙酸酯類、溶纖劑、丁基卡必醇等之卡必醇類、甲苯、二甲苯等之芳香族烴類、二甲基甲醯胺、二甲基乙醯醯胺、N-甲基吡咯烷酮等。有機溶劑可單獨使用任一種，亦可組合2種以上使用。 [0121] 乾燥條件雖並未特別限制，但通常適合於50～100℃左右為3～15分鐘左右。 [0122] 乾燥後之樹脂組成物層的厚度通常為3μm～200μm，較佳為5μm～100μm，再更佳為5μm～50μm的範圍。 [0123] 樹脂組成物層可用保護薄膜保護。藉由以保護薄膜保護，可防止對樹脂組成物層表面之塵埃等之附著或傷痕。保護薄膜較佳為使用與支持體相同之塑膠薄膜。又，保護薄膜除了消光處理、電暈處理之外，亦可實施脫模處理。保護薄膜的厚度雖並未特別限制，但通常為1～150μm，較佳為10～100μm的範圍。 [0124] 密封用薄片若於支持體使用具有防濕性，且透過率高之支持體，可藉由將密封用薄片層壓在密封對象物之必要地點，直接硬化樹脂組成物層形成密封層，形成具備高耐濕性之密封構造。作為具有如此之防濕性，且透過率高之支持體，可列舉於表面蒸鍍氧化矽（二氧化矽）、氮化矽、SiCN、非晶矽等之無機物之塑膠薄膜等。作為塑膠薄膜，例如可列舉聚乙烯、聚丙烯、聚氯化乙烯基等之聚烯烴、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯等之聚酯、聚碳酸酯、聚醯亞胺等。作為塑膠薄膜，尤其是以PET較佳。作為被市售之具有防濕性的塑膠薄膜之例，可列舉TECHBARRIER HX、AX、LX、L系列（三菱樹脂公司製）或進而提高防濕效果之X-BARRIER（三菱樹脂公司製）等。作為支持體，可使用具有2層以上之複層構造者。 [0125] ＜有機EL裝置＞ 以本發明之樹脂組成物的硬化物製造密封有機EL元件之有機EL裝置等時，適合使用上述密封用薄片進行密封。亦即，密封用薄片係樹脂組成物層以保護薄膜保護時，將此剝離後，將密封用薄片該樹脂組成物層直接與密封對象物（例如有機EL元件形成基板上之有機EL元件等）接觸的方式進行層壓。層壓之方法可為批量式亦可為以輥之連續式。層壓後，剝離支持體，進行後述之樹脂組成物層的熱硬化作業。密封用薄片之支持體為具有防濕性之支持體時，層壓密封用薄片後，未剝離支持體直接進行後述之樹脂組成物層的熱硬化作業。 [0126] 樹脂組成物層之硬化通常藉由熱硬化進行。作為該手段，例如可列舉藉由熱風循環式烤箱、紅外線加熱器、熱槍、高頻感應加熱裝置、加熱工具之壓著的加熱等。從可將硬化之樹脂組成物層（密封層）以充分滿足之接著強度接著在密封對象物的觀點來看，硬化溫度較佳為50℃以上，更佳為55℃以上，硬化時間較佳為10分鐘以上，更佳為20分鐘以上。 ［實施例］ [0127] 以下，雖將本發明藉由實施例具體說明，但本發明並非被限定於此等之實施例者。尚，在以下之記載，除非另有說明，透過率以外之濃度、吸水率等之單位即「%」及摻合量之單位即「份」分別係意指「質量%」及「質量份」。尚，作為水滑石，全部使用市售之水滑石。 [0128] ＜合成例1＞離子液體硬化劑之合成 將離子液體硬化劑之N-乙醯甘胺酸四丁基鏻鹽在以下之順序合成。對於41.4%之四丁基鏻氫氧化物水溶液（北興化學工業公司製）20.0g，在0℃加入N-乙醯甘胺酸（東京化成工業公司製）3.54g攪拌10分鐘。攪拌後，使用蒸發器以40～50mmHg的壓力在60～80℃2小時，在90℃5小時濃縮反應溶液。將所得之濃縮物在室溫溶解在乙酸乙酯（純正化學公司製）14.2ml來調製溶液，將所得之溶液使用蒸發器以40～50mmHg的壓力，在70～90℃濃縮3小時，而得到作為油狀化合物之N-乙醯甘胺酸四丁基鏻鹽11.7g（純度：96.9%）。 [0129] ＜實施例1＞ 混練液狀氫化雙酚A型環氧樹脂（三菱化學公司製「YX8000」、環氧當量：約205）60份、與市售之水滑石A（半燒成水滑石、BET比表面積：13m2
/g、平均粒子徑：400nm）40份後，在3輥磨機進行分散，而得到混合物。於將硬化促進劑（San-Apro公司製「U-CAT3512T」）1.5份溶解在苯氧基樹脂溶液（三菱化學公司製「YX7200B35」、溶劑：MEK、不揮發分：35%）114.3份（樹脂40份）之混合物，摻合先已調製之混合物、與離子液體硬化劑（N-乙醯甘胺酸四丁基鏻鹽）3份，以高速回轉混合機進行均勻分散，而得到樹脂組成物清漆。 [0130] 其次，將樹脂組成物清漆於支持體（以矽氧系脫模劑處理之聚對苯二甲酸乙二酯薄膜、厚度38μm、以下簡稱為「脫模PET薄膜」）上，以乾燥後之樹脂組成物層的厚度成為20μm的方式在模塗機進行均勻塗佈，以80℃乾燥5分鐘後，於樹脂組成物層的表面載上脫模PET薄膜作為保護薄膜，而得到密封用薄片。 [0131] ＜實施例2＞ 除了取代水滑石A改使用市售之水滑石B（半燒成水滑石、BET比表面積：15m2
/g、平均粒子徑：400nm）之外，其他與實施例1同樣進行，製造樹脂組成物清漆，而得到密封用薄片。 [0132] ＜實施例3＞ 除了取代苯氧基樹脂溶液（114.3份） 改使用固形氫化雙酚A型環氧樹脂（三菱化學公司製「YX8040」、環氧當量：約1000）之溶液（溶劑：MEK、不揮發分：40%）100份（樹脂40份）之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0133] ＜實施例4＞ 除了取代硬化促進劑（San-Apro公司製「U-CAT3512T」）1.5份改使用咪唑硬化劑（四國化成公司製「1B2MZ」）2份之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0134] ＜實施例5＞ 混練液狀氫化雙酚A型環氧樹脂（三菱化學公司製「YX8000」、環氧當量：約205）30份、與酸酐硬化劑（新日本理化公司製「MH-700」）30份、市售之水滑石B（BET比表面積：13m2
/g、平均粒子徑：400nm）40份後，在3輥磨機進行分散，而得到混合物。於固形氫化雙酚A型環氧樹脂（三菱化學公司製「YX8040」、環氧當量：約1000）之溶液（溶劑：MEK、不揮發分：40%）100份（樹脂40份）中，將藉由先已調製之3輥磨機分散之混合物、與DBU-辛基酸鹽硬化促進劑（San-Apro公司製「U-CAT SA102」）2份以高速回轉混合機進行均勻分散，而得到樹脂組成物清漆。 除了使用所得之樹脂組成物清漆之外，其他與實施例1同樣進行，而得到密封用薄片。 [0135] ＜實施例6＞ 除了將苯氧基樹脂溶液（三菱化學公司製「YX7200B35」、溶劑：MEK、不揮發分：35%）的使用量改為57.2份（樹脂20份），進而使用固形氫化雙酚A型環氧樹脂（三菱化學公司製「YX8040」）之溶液（溶劑：MEK、不揮發分：40%）50份（樹脂20份）之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0136] ＜實施例7＞ 除了將苯氧基樹脂溶液（三菱化學公司製「YX7200B35」、溶劑：MEK、不揮發分：35%）的使用量改為85.7份（樹脂30份），進而使用液狀雙酚A型環氧樹脂及液狀雙酚F型環氧樹脂之混合物（新日鐵化學工業公司製「ZX-1059」、環氧當量：約165）10份之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0137] ＜比較例1＞ 除了取代液狀氫化雙酚A型環氧樹脂改使用液狀雙酚A型環氧樹脂及液狀雙酚F型環氧樹脂之混合物（新日鐵化學工業公司製「ZX-1059」）60份之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0138] ＜比較例2＞ 除了取代水滑石A改使用市售之水滑石C（燒成水滑石、平均粒子徑：400nm）40份之外，其他與實施例1同樣進行，製造樹脂組成物清漆，而得到密封用薄片。 [0139] ＜比較例3＞ 除了取代水滑石A改使用市售之水滑石D（未燒成水滑石、平均粒子徑：400nm）40份之外，其他與實施例1同樣進行，製造樹脂組成物清漆，而得到密封用薄片。 [0140] ＜水滑石之吸水率＞ 將各水滑石在天秤量取1.5g，測定初期質量。大氣壓下於設定在60℃、90%RH（相對濕度）之小型環境試驗器（Espec公司製 SH-222）靜置200小時，測定吸濕後之質量，使用上述式（i）求得飽和吸水率。將結果示於表1。 [0141] ＜水滑石之熱重量減少率＞ 使用日立高科技公司製TG/DTA EXSTAR6300，進行各水滑石之熱重量分析。於鋁製之樣品盤秤量10mg之水滑石，以未覆蓋之開放的狀態，於氮流量200mL/分鐘的環境下，從30℃至550℃以昇溫速度10℃/分鐘昇溫。使用上述式（ii），求得在280℃及380℃之熱重量減少率。將結果示於表1。 [0142] ＜粉末X光繞射＞ 粉末X光繞射之測定係藉由粉末X光繞射裝置（PANalytical公司製,Empyrean），以對陰極CuKα（1.5405Å）、電壓：45V、電流：40mA、取樣寬度：0.0260˚、掃描速度：0.0657˚/s、測定繞射角範圍（2θ）：5.0131～79.9711˚的條件進行。峰值搜尋係利用繞射裝置附屬之軟體的峰值搜尋功能，以「最小顯著度：0.50、最小峰值晶片：0.01˚、最大峰值晶片：1.00˚、峰值基底寬度：2.00˚、方法：2次微分之最小值」的條件進行。檢出於2θ為8～18˚的範圍內出現之分裂的二個峰值，或藉由二個峰值之合成而具有肩部之峰值，測定低角側所出現之峰值或肩部之繞射強度（=低角側繞射強度）、與高角側所出現之峰值或肩部之繞射強度（=高角側繞射強度），算出相對強度比（=低角側繞射強度/高角側繞射強度）。將結果示於表1。 [0143][0144] 由飽和吸水率、熱重量減少率及粉末X光繞射的結果，水滑石A、水滑石B、水滑石E及水滑石F為「半燒成水滑石」，水滑石C為「燒成水滑石」，水滑石D為「未燒成水滑石」。 [0145] ＜樹脂組成物之硬化物的折射率＞ 將於實施例及比較例製得之密封用薄片切成長度70mm及寬度25mm，從經切斷之密封用薄片剝離保護薄膜（脫模PET薄膜），將該密封用薄片於玻璃板（長度76mm、寬度26mm及厚度1.2mm之顯微鏡載玻片、松浪玻璃工業公司製白載玻片S1112 緣磨No.2）使用批式真空層壓機（Nichigo-Morton公司製、V-160）層壓。層壓條件為溫度80℃、減壓時間30秒之後，在壓力0.3MPa加壓30秒。然後，剝離密封用薄片之支持體（脫模PET薄膜），以熱循環式烤箱130℃熱硬化60分鐘，而得到樹脂組成物之硬化物層與玻璃的層合體即評估用樣品。 [0146] 使用Metricon公司製棱鏡耦合器（模型2010/M），使用波長594nm之雷射光，進行折射率測定。由空氣壓傳動 式偶合頭於裝置內之棱鏡，與前述評估用樣品之硬化物層的表面接觸，設置評估用樣品。邊照射雷射邊使棱鏡與樣品的角度變更，進行全反射，光檢出器所導入之雷射光在被稱為模式角度之值，從空氣相對樣品內部進行傳播，到達檢出器之雷射光的光強度最初急遽下降，確認進行光傳搬模式之位置（dip），藉此決定折射率。將結果示於表2。 [0147] ＜樹脂組成物之硬化物的平行線透過率＞ 將於實施例及比較例製得之密封用薄片切成長度70mm及寬度25mm，從經切斷之密封用薄片剝離保護薄膜（脫模PET薄膜），將該密封用薄片於玻璃板（長度76mm、寬度26mm及厚度1.2mm之顯微鏡載玻片、松浪玻璃工業公司製白載玻片S1112 緣磨No.2）使用批式真空層壓機（Nichigo-Morton公司製、V-160）層壓。層壓條件為溫度80℃、減壓時間30秒之後，在壓力0.3MPa加壓30秒。然後，剝離密封用薄片之支持體（脫模PET薄膜），於經曝露之樹脂組成物層上，進而與上述相同層壓玻璃板，製作層合體。將所得之層合體以熱循環式烤箱130℃加熱60分鐘，於玻璃板之間得到具有樹脂組成物之硬化物的層合體（評估用樣品、硬化物之厚度：20μm）。 [0148] 使用Suga試驗機公司製霧度計 HZ-V3（鹵素燈），將空氣作為參考，在D65光測定評估用樣品之平行線透過率Tp（%），用以下之基準評估。將結果示於表2。 （平行線透過率之基準） 佳（○）：85%以上 可（△）：未滿85%、80%以上 不佳（×）：未滿80% [0149] ＜發光面積減少開始時間＞ 除了使用鋁箔/PET複合薄膜「附PET之AL1N30」（鋁箔：30μm、PET：25μm、：東海東洋鋁業銷售公司製）作為支持體之外，其他與各實施例及比較例同樣進行，而得到具有與各實施例及比較例相同之樹脂組成物層之密封用薄片。 [0150] 將無鹼玻璃50mm×50mm平方以經煮沸之異丙醇洗淨5分鐘，在150℃乾燥30分鐘以上。使用該玻璃，使用將來自端部之距離定為3mm之遮罩，蒸鍍鈣膜（純度99.8%）（厚度300nm）。於手套盒內，將蒸鍍鈣膜之無鹼玻璃、與具有和各實施例及比較例相同之樹脂組成物層之密封用薄片以熱層壓機（Fujipura公司製 Rami Packer DAiSY A4（LPD2325））貼合，來調製層合體。將所得之層合體以溫度130℃加熱60分鐘，硬化樹脂組成物層，而得到評估用樣品。 [0151] 鈣與水接觸成為氧化鈣時變成透明。因此，對評估用樣品之水分侵入，可藉由測定從評估用樣品之端部至鈣膜為止的距離（mm）進行評估。因此，將包含鈣膜之評估用樣品作為包含有機EL元件之有機EL裝置的模型使用。 [0152] 首先，將從評估用樣品之端部至鈣膜為止的距離藉由三豐公司製 Measuring Microscope MF-U測定，將此值定為X2。 [0153] 其次，於設定在溫度85℃及濕度85%RH之恆溫恆濕槽投入評估用樣品。對恆溫恆濕槽之投入後之從評估用樣品之端部至鈣膜為止的密封距離X1（mm），以較對恆溫恆濕槽之投入前之從評估用樣品之端部至鈣膜為止的密封距離X2（mm）增加0.1mm的時間，將評估用樣品從恆溫恆濕槽取出，將該時間作為減少開始時間t（時間）。 [0154] 根據以下之菲克（Fick）的擴散式，算出定數K。 X1=K√t （式中，X1為對恆溫恆濕槽之投入後之從評估用樣品之端部至鈣膜為止的密封距離（mm），t為成為X1=X2+0.1之減少開始時間（時間），X2為對恆溫恆濕槽之投入前之從評估用樣品之端部至鈣膜為止的密封距離（mm））。 [0155] 使用所得之K，將X1成為5mm之值的時間作為發光面積減少開始時間算出，以下述基準評估。水分遮斷性越高越能遲緩水分之侵入速度，此發光面積減少開始時間增長。將結果示於表2。尚，表2所記載之單位之「h」係意指「小時」。 （發光面積減少開始時間之基準） 佳（○）：300小時以上 可（△）：未滿300小時、200小時以上 不佳（×）：未滿200小時 [0156] 於表2，除了於實施例及比較例所得之硬化物的折射率等之結果之外，亦記載使用之成分的種類及量。 [0157]［產業上之可利用性］ [0158] 根據本發明之密封用樹脂組成物，可形成水分遮斷性及透明性雙方優異之密封層。因此，本發明之密封用樹脂組成物及密封用薄片可適合使用在有機EL元件等之對水分較弱之元件的密封。 [0159] 本案係以日本申請之日本特願2016-196395號作為基礎，其內容全部包含在本案說明書。[0009] <Resin composition> "The sealing resin composition of the present invention is a resin composition containing (A) thermosetting resin, (B) semi-fired hydrotalcite, and (C) hardener, characterized by The cured product of the resin composition has a refractive index of 1.48 to 1.54. The refractive index of the cured product is preferably 1.49 to 1.54, more preferably 1.50 to 1.54, and still more preferably the same degree as the refractive index of the semi-fired hydrotalcite, that is, 1.50 to 1.53. [0010] <(A) Thermosetting resin> In the present invention, it is a thermosetting resin in which the refractive index of the cured product of the resin composition becomes 1.48 to 1.54. It is preferably a thermosetting resin having the aforementioned refractive index of 1.49 to 1.54, more preferably a thermosetting resin of the aforementioned refractive index being 1.50 to 1.54, and still more preferably the aforementioned refractive index of being similar to that of semi-fired water. The refractive index of talc is the same degree of thermosetting resin of 1.50～1.53. [0011] The refractive index of the cured resin composition can be adjusted by thermosetting resin or other components (such as thermoplastic resin, etc.). In order to facilitate the adjustment of the refractive index of the cured product, (A) the thermosetting resin preferably contains a thermosetting resin having a refractive index of 1.48 to 1.54. The refractive index of the aforementioned thermosetting resin is more preferably 1.49 to 1.54, and still more preferably 1.50 to 1.54. [0012] Although the content of the thermosetting resin having a refractive index of 1.48 to 1.54, if the refractive index of the cured product of the resin composition is in the range of 1.48 to 1.54, it is not particularly limited, but is relative to (A) thermosetting resin As a whole, it is preferably from 50 to 100% by mass, more preferably from 60 to 100% by mass, and still more preferably from 70 to 100% by mass. [0013] The refractive index of the entire thermosetting resin (A) used in the present invention is preferably from 1.48 to 1.54, more preferably from 1.49 to 1.54, and even more preferably from 1.50 to 1.54. In the case of using a plurality of thermosetting resins, it is preferable that the refractive index of the entire mixture of these is within the above-mentioned range. [0014] As the thermosetting resin, if the refractive index of the cured product of the resin composition becomes 1.48 to 1.54, the thermosetting resin is not particularly limited, but for example, epoxy resin, cyanate resin, Phenolic resins, bismaleimide-triazine resins, polyimide resins, acrylic resins, vinylbenzyl resins, etc., among them, epoxy resins are preferred from the viewpoint of low-temperature curability and the like. [0015] The epoxy resin is not particularly limited as long as the refractive index of the cured product of the resin composition is 1.48 to 1.54. As such an epoxy resin, one having two or more epoxy groups per molecule on average and having a high transmittance can be used. Examples include hydrogenated epoxy resins (hydrogenated bisphenol A type epoxy resins, hydrogenated bisphenol F type epoxy resins, etc.), fluorine-containing epoxy resins, chain aliphatic epoxy resins, and cyclic aliphatic epoxy resins. Oxygen resin, bisphenol A type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, sulphur type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, bisphenol F Type epoxy resin, phosphorus-containing epoxy resin, bisphenol S type epoxy resin, aromatic glycidylamine type epoxy resin (such as tetraglycidyldiaminodiphenylmethane, triglycidyl -P-aminophenol, diglycidyl toluidine (Toluidine), diglycidyl aniline, etc.), alicyclic epoxy resin, phenol novolac type epoxy resin, alkylphenol type epoxy resin , Cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, epoxy resin with butadiene structure, diglycidyl etherate of bisphenol, diglycidyl of naphthalene glycol Ether compounds, phenolic diglycidyl ether compounds, alcohols, diglycidyl ether compounds, and alkyl substituted compounds of these epoxy resins, etc. [0016] Only one type of epoxy resin may be used, or two or more types may be used in combination. From the viewpoint of reactivity and the like, the epoxy equivalent of the epoxy resin is preferably 50 to 5,000, more preferably 50 to 3,000, still more preferably 80 to 2,000, and particularly preferably 100 to 1,500. Moreover, the so-called "epoxy equivalent" refers to the number of grams (g/eq) of the resin containing 1 gram equivalent of epoxy group, measured in accordance with the method specified in JIS K 7236. The weight average molecular weight of the epoxy resin is preferably 5,000 or less. [0017] The epoxy resin may be either liquid or solid, and liquid epoxy resin and solid epoxy resin may be used in combination. Here, the so-called "liquid" and "solid" refer to the state of epoxy resin at normal temperature (25°C) and normal pressure (1atm). From the viewpoints of coatability, processability, and adhesiveness, it is preferable that 10% by mass or more of the total epoxy resin used is a liquid epoxy resin. From the viewpoints of the compatibility with hydrotalcite and the viscosity of the varnish, it is particularly preferable to use a liquid epoxy resin and a solid epoxy resin in combination. The mass ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin: solid epoxy resin) is preferably 1:2 to 1:0, more preferably 1:1.5 to 1:0. [0018] In one aspect of the present invention, the (A) thermosetting resin is preferably selected from hydrogenated epoxy resins, fluorine-containing epoxy resins, chain resins, in addition to setting its refractive index at 1.48 to 1.54 One or more of aliphatic epoxy resins, cycloaliphatic epoxy resins, and alkylphenol epoxy resins, more preferably selected from hydrogenated epoxy resins, fluorine-containing epoxy resins, and chain aliphatic epoxy resins One or more types of epoxy resins and cycloaliphatic epoxy resins. By using the aforementioned resin, a cured product with high transparency can be obtained. [0019] The so-called "hydrogenated epoxy resin" means an epoxy resin obtained by hydrogenating an epoxy resin containing an aromatic ring. The hydrogenation rate of the hydrogenated epoxy resin is preferably 50% or more, more preferably 70% or more. The so-called "chain aliphatic epoxy resin" means an epoxy resin with a linear or branched alkyl chain or alkyl ether chain. The so-called "cyclic aliphatic epoxy resin" is It means an epoxy resin having a cyclic aliphatic skeleton in the molecule, for example, a cycloalkane skeleton. The so-called "alkylphenol type epoxy resin" means an epoxy resin in which a benzene ring skeleton having at least one alkyl group and at least one hydroxyl group as a substituent, and the aforementioned hydroxyl group is converted into a glycidyl ether group . [0020] As the hydrogenated epoxy resin, a hydrogenated bisphenol A type epoxy resin and a hydrogenated bisphenol F type epoxy resin are preferable. Moreover, as long as the refractive index of the cured product of the resin composition satisfies the above-mentioned specific numerical range, or the refractive index of the entire thermosetting resin satisfies the above-mentioned specific numerical range, epoxy resins other than the above-mentioned suitable epoxy resins may be included in In thermosetting resin. [0021] As hydrogenated bisphenol A epoxy resins, for example, liquid hydrogenated bisphenol A epoxy resins (for example, "YX8000" (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205), "Denacol EX-252 "(Manufactured by Nagase ChemteX, epoxy equivalent: about 213)), solid hydrogenated bisphenol A epoxy resin (for example, "YX8040" (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 1000)). [0022] The fluorine-containing epoxy resin, for example, the fluorine-containing epoxy resin described in WO2011/089947 can be used. [0023] As the chain aliphatic epoxy resin, for example, polyglycerol polyglycidyl ether (for example, "Denacol EX-512", "Denacol EX-521", manufactured by Nagase ChemteX), pentaerythritol polyepoxy Propyl ether (for example, "Denacol EX-411", manufactured by Nagase ChemteX), diglycerol polyglycidyl ether (for example, "Denacol EX-421", manufactured by Nagase ChemteX), glycerin polyglycidyl ether (for example, "Denacol EX-313", "Denacol EX-314", manufactured by Nagase ChemteX), trimethylolpropane polyglycidyl ether (for example, "Denacol EX-321", manufactured by Nagase ChemteX), Neoprene Alcohol diglycidyl ether (for example, "Denacol EX-211", manufactured by Nagase ChemteX), 1,6-hexanediol diglycidyl ether (for example, "Denacol EX-212", manufactured by Nagase ChemteX) , Ethylene glycol diglycidyl ether (e.g. "Denacol EX-810", "Denacol EX-811", manufactured by Nagase ChemteX), diethylene glycol diglycidyl ether (e.g. "Denacol EX-850" , "Denacol EX-851", manufactured by Nagase ChemteX), polyethylene glycol diglycidyl ether (for example, "Denacol EX-821", "Denacol EX-830", "Denacol EX-832", "Denacol EX -841", "Denacol EX-861", manufactured by Nagase ChemteX), propylene glycol diglycidyl ether (for example, "Denacol EX-911", manufactured by Nagase ChemteX), polypropylene glycol diglycidyl ether (for example, " "Denacol EX-941", "Denacol EX-920", "Denacol EX-931", manufactured by Nagase ChemteX), etc. [0024] Examples of the cycloaliphatic epoxy resin include "EHPE-3150" manufactured by Daicel Chemical Industry Co., Ltd., and the like. [0025] Examples of alkylphenol-type epoxy resins include "HP-820" manufactured by DIC Corporation; "YDC-1312" manufactured by Nippon Steel & Sumitomo Metal Chemical Industry Co., Ltd.; and "EX-146" manufactured by Nagase ChemteX Corporation. [0026] In one aspect of the present invention, it is preferable that (A) the thermosetting resin includes an epoxy resin having a refractive index of 1.48 to 1.54 and an aromatic ring in the molecule (an epoxy resin containing an aromatic ring). When used for an epoxy resin containing an aromatic ring structure in the molecule, it is preferred because it tends to increase any or all of the reactivity of the resin composition, the glass transition temperature of the cured product, and the adhesion. Examples of such thermosetting resins include alkylphenol type epoxy resins, fluorine-containing aromatic type epoxy resins, and the like. [0027] Furthermore, in another aspect of the present invention, (A) the thermosetting resin preferably includes an epoxy resin (a1) with a refractive index of 1.48 to 1.54 (hereinafter sometimes referred to as "resin (a1)" ) And epoxy resin (a2) containing aromatic ring (hereinafter sometimes referred to as "resin (a2)"). The resin (a1) may be only one type, or two or more types. Similarly, the resin (a2) may be only one type, or two or more types. [0028] By using an epoxy resin containing an aromatic ring, there is a tendency to increase any or all of the reactivity of the resin composition, and the glass transition temperature and adhesion of the cured product. However, when the epoxy resin contains an aromatic ring, it tends to increase the refractive index. Therefore, generally speaking, there are fewer epoxy resins containing aromatic rings that satisfy the refractive index of 1.48 to 1.54. Accordingly, by combining the resin (a1) and the resin (a2), the desired refractive index, the reactivity with the resin composition, and the glass transition temperature and adhesion of the cured product can be improved. [0029] As long as the total content of the resin (a1) and the resin (a2) is within the range that achieves the above-mentioned effect, although it is not particularly limited, it is preferably 60-100% by mass relative to the entire thermosetting resin (A) , More preferably 70-100% by mass, still more preferably 80-100% by mass, particularly preferably 90-100% by mass, most preferably 100% by mass. [0030] The resin (a1) is not particularly limited if it has an epoxy resin with a refractive index of 1.48 to 1.54. Generally speaking, many epoxy resins having the above-mentioned refractive index do not contain an aromatic ring structure. The resin (a1) is preferably one selected from hydrogenated epoxy resins, fluorine-containing epoxy resins, chain aliphatic epoxy resins, cycloaliphatic epoxy resins, and alkylphenol epoxy resins above. [0031] The resin (a2) is not particularly limited if it is an epoxy resin containing an aromatic ring. From the viewpoint of the reactivity of the resin composition, the glass transition temperature of the cured product, or the improvement of adhesion, the resin (a2) is preferably selected from the group consisting of bisphenol A epoxy resin and bisphenol F epoxy resin. , Phenolic novolac type epoxy resin, biphenyl aralkyl type epoxy resin, sulphur type epoxy resin and fluorine-containing aromatic epoxy resin. Although the refractive index of an aromatic ring-containing epoxy resin is generally not 1.48 to 1.54, an aromatic ring-containing epoxy resin with a refractive index of 1.48 to 1.54 can also be used as the resin (a2). [0032] Here, the so-called "biphenyl aralkyl epoxy resin" means an epoxy resin having a main chain bonded with a novolak structure and a bivalent biphenyl structure. The so-called "epoxy resin" refers to an epoxy resin with a sulphur skeleton. The so-called "fluorine-containing aromatic epoxy resin" means a fluorine-containing epoxy resin having an aromatic ring. For example, the fluorine-containing aromatic epoxy resin described in WO2011/089947 can be used. [0033] In the case where the resin (a1) and the resin (a2) are used in combination, the resin (a1) is more preferably a hydrogenated epoxy resin, a fluorine-containing epoxy resin, a cycloaliphatic epoxy resin, and an alkylphenol type The epoxy resin is more preferably one or more selected from hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin and fluorine-containing epoxy resin, particularly preferably selected from hydrogenated bisphenol A type epoxy resin One or more of epoxy resin and hydrogenated bisphenol F type epoxy resin, the most preferred is hydrogenated bisphenol A type epoxy resin. In addition, in the aforementioned aspect, the resin (a2) is more preferably one or more selected from the group consisting of a bisphenol type epoxy resin and a fluorine-containing aromatic type epoxy resin, and still more preferably a bisphenol type epoxy resin. More preferably, it is one or more selected from bisphenol A type epoxy resin and bisphenol F type epoxy resin. [0034] In the case where the resin (a1) and the resin (a2) are used in combination, the amount of the resin (a2) relative to the total of the resin (a1) and the resin (a2) is preferably 0.5-40% by mass, more preferably 1 to 35% by mass, more preferably 2 to 30% by mass. [0035] Examples of bisphenol A epoxy resins include "828EL", "1001", and "1004AF" manufactured by Mitsubishi Chemical Corporation; "840" and "850-S" manufactured by DIC Corporation; and Nippon Steel & Sumikin Chemical Industries, Ltd. Company system "YD-128", etc. In addition, as a mixture of liquid bisphenol A epoxy resin and liquid bisphenol F epoxy resin, for example, "ZX-1059" manufactured by Nippon Steel Chemical Industry Co., Ltd. (epoxy equivalent: about 165) can be cited. [0036] As the bisphenol F type epoxy resin, for example, "807" manufactured by Mitsubishi Chemical Corporation; "830" manufactured by DIC Corporation; "YDF-170" manufactured by Nippon Steel & Sumikin Chemical Industry Co., Ltd., and the like. [0037] As phenol novolac type epoxy resins, for example, "N-730A", "N-740", "N-770" and "N-775" manufactured by DIC Corporation; "152" manufactured by Mitsubishi Chemical Corporation and "154" and so on. [0038] Examples of biphenyl aralkyl epoxy resins include "NC-3000", "NC-3000L", and "NC-3100" manufactured by Nippon Kayaku Co., Ltd. [0039] Examples of the tea-type epoxy tree include "OGSOL PG-100", "CG-500EG-200", and "EG-280" manufactured by Osaka Gas Chemical Corporation. [0040] The amount of the thermosetting resin is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and still more preferably 30 to 85% by mass relative to the total nonvolatile content of the resin composition. [0041] The amount of the epoxy resin is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and still more preferably 30 to 85% by mass relative to the total nonvolatile content of the resin composition. [0042] <(B) Semi-fired hydrotalcite> Hydrotalcite can be classified into unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite. [0043] Unfired hydrotalcite such as natural hydrotalcite (Mg6
Al2
(OH)16
CO3
･4H2
O) Metal hydroxides with layered crystal structure represented by, for example, a layer that becomes the basic framework [Mg1-X
AlX
(OH)2
]X+
And the middle layer [(CO3
)X/2
･MH2
O]X-
Constituted. The unfired hydrotalcite system of the present invention includes the concept of hydrotalcite-like compounds such as hydrotalcite. Examples of hydrotalcite-like compounds include those represented by the following formula (I) and the following formula (II). [0044](In the formula, M2+
Represents Mg2+
, Zn2+
Equal divalent metal ion, M3+
Means Al3+
, Fe3+
Equal trivalent metal ion, An-
Represents CO3 2-
, Cl-
, NO3 -
N-valent anions, and 0<x<1, 0≦m<1, n is a positive number). In the formula (I), M2+
Preferably Mg2+
, M3+
Preferably Al3+
, An-
Preferably CO3 2-
. [0045](In the formula, M2+
Represents Mg2+
, Zn2+
Equal divalent metal ion, An-
Represents CO3 2-
, Cl-
, NO3-
For n-valent anions, x is a positive number above 2, z is a positive number below 2, m is a positive number, and n is a positive number). In the formula (II), M2+
Preferably Mg2+
, An-
Preferably CO3 2-
. [0046] Semi-fired hydrotalcite refers to a metal hydroxide having a layered crystal structure that reduces or disappears the amount of interlaminar water obtained by firing unfired hydrotalcite. The so-called "interlayer water", if the composition formula is used for description, refers to the "H2
O". The present invention uses this semi-fired hydrotalcite as one of the characteristics. [0047] On the other hand, fired hydrotalcite refers to a metal oxide with an amorphous structure obtained by firing unfired hydrotalcite or semi-fired hydrotalcite, and not only the interlayer water but also the hydroxyl group disappears by condensation dehydration. [0048] Unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite can be distinguished by saturation water absorption. The saturated water absorption rate of the semi-fired hydrotalcite is 1% by mass or more and less than 20% by mass. On the other hand, the saturated water absorption rate of the unfired hydrotalcite is less than 1% by mass, and the saturated water absorption rate of the fired hydrotalcite is 20% by mass or more. [0049] The "saturated water absorption" in the present invention means that 1.5 g of unfired hydrotalcite, semi-fired hydrotalcite, or fired hydrotalcite is measured on a scale, and the initial mass is measured and set at atmospheric pressure , 60°C, 90%RH (relative humidity), the mass increase rate relative to the initial mass of a small environmental tester (SH-222 manufactured by Espec) that is allowed to stand for 200 hours can be obtained by the following formula (i) . Saturated water absorption (mass%) =100×(mass after moisture absorption-initial mass)/initial mass (i) [0050] The saturated water absorption of semi-fired hydrotalcite is preferably 3 mass% or more and less than 20 mass %, more preferably 5% by mass or more and less than 20% by mass. [0051] In addition, unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite can be distinguished by the thermogravimetric reduction rate measured by thermogravimetric analysis. The thermal weight loss rate of semi-fired hydrotalcite at 280°C is less than 15% by mass, and the thermal weight loss rate at 380°C is more than 12% by mass. On the other hand, the thermal weight loss rate of unfired hydrotalcite at 280°C is 15% by mass or more, and the thermal weight loss rate of fired hydrotalcite at 380°C is less than 12% by mass. [0052] Thermogravimetric analysis can use Hitachi High-Tech TG/DTA EXSTAR6300, weighing 5 mg of hydrotalcite in an aluminum sample pan, and in an uncovered open state, under an environment with a nitrogen flow rate of 200 mL/min, from 30 The temperature to 550°C is performed under the condition of a temperature increase rate of 10°C/min. The thermal weight reduction rate can be obtained by the following formula (ii). Thermal weight reduction rate (mass%) =100×(mass before heating-mass when reaching a predetermined temperature)/mass before heating (ii) [0053] Also, unfired hydrotalcite, semi-fired hydrotalcite and fired The hydrotalcite can be distinguished by the peak value and relative intensity ratio measured by powder X-ray diffraction. Semi-fired hydrotalcite means that there are two split peaks around 8～18˚ 2θ by powder X-ray diffraction, or a peak with a shoulder due to the synthesis of the two peaks, which appears on the low-angle side The peak or shoulder diffraction intensity (= low-angle side diffraction intensity), and the peak or shoulder diffraction intensity appearing on the high-angle side (= high-angle side diffraction intensity) relative intensity ratio (low-angle side diffraction) The radiation intensity/high-angle side diffraction intensity) is 0.001 to 1,000. On the other hand, the unfired hydrotalcite only has a peak around 8-18˚, or the relative intensity ratio of the peak or shoulder on the low-angle side and the peak on the high-angle side or the diffraction intensity of the shoulder becomes Outside the aforementioned range. The fired hydrotalcite does not have a characteristic peak at 8˚～18˚, but has a characteristic peak at 43˚. The powder X-ray diffraction measurement was performed with a powder X-ray diffraction device (manufactured by PANalytical, Empyrean) to the cathode CuKα (1.5405Å), voltage: 45V, current: 40mA, sampling width: 0.0260˚, scanning speed: 0.0657 ˚/s, measure the range of diffraction angle (2θ): 5.0131～79.9711˚. The peak search is based on the peak search function of the software attached to the diffraction device, which can be used "minimum significance: 0.50, minimum peak value chip: 0.01˚, maximum peak value chip: 1.00˚, peak base width: 2.00˚, method: 2nd differential Minimum” condition. [0054] The BET specific surface area of the semi-fired hydrotalcite is preferably 1～250m2
/g, more preferably 5～200m2
/g. The BET specific surface area of the semi-calcined hydrotalcite is based on the BET method. The specific surface area measurement device (Macsorb HM Model 1210, manufactured by Mountech) can be used to adsorb nitrogen gas on the surface of the sample and calculate it using the BET multipoint method. [0055] The average particle diameter of the semi-fired hydrotalcite is preferably 1 to 1,000 nm, more preferably 10 to 800 nm. The average particle diameter of the semi-fired hydrotalcite is the median diameter of the particle size distribution when the particle size distribution is determined by the laser diffraction scattering type particle size distribution measurement (JIS Z 8825) on a volume basis. [0056] Semi-fired hydrotalcite can be surface treated with a surface treatment agent. As the surface treatment agent used for the surface treatment, for example, higher fatty acids, alkyl silanes, silane coupling agents, etc. can be used. Among them, higher fatty acids and alkyl silanes are suitable. One type or two or more types of surface treatment agents can be used. [0057] Examples of higher fatty acids include higher fatty acids with 18 or more carbon atoms such as stearic acid, montanic acid, myristic acid, and palmitic acid. Among them, stearic acid is preferred. One kind or two or more kinds of these can be used. [0058] Examples of alkylsilanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, and octadecyl Trimethoxysilane, dimethyldimethoxysilane, octyltriethoxysilane, n-octadecyldimethyl(3-(trimethoxysilyl)propyl) ammonium chloride, etc. One kind or two or more kinds of these can be used. [0059] As the silane coupling agent, for example, 3-glycidoxy propyl trimethoxy silane, 3-glycidoxy propyl triethoxy silane, 3-glycidoxy propyl ( Epoxy silane coupling agent such as dimethoxy) methyl silane and 2-(3,4-epoxycyclohexyl) ethyl trimethoxy silane; 3-mercaptopropyl trimethoxy silane, 3-mercaptopropane Mercapto-based silane coupling agents such as triethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane; 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyl Trimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropyldimethoxymethyl Amino-based silane coupling agents such as silane; ureido-based silane coupling agents such as 3-ureidopropyltriethoxysilane, vinyl trimethoxy silane, vinyl triethoxy silane and vinyl methyl two Vinyl silane coupling agents such as ethoxysilane; Styryl silane coupling agents such as p-styryltrimethoxysilane; 3-propenyloxypropyltrimethoxysilane and 3-methylpropene Acrylate-based silane coupling agents such as oxypropyltrimethoxysilane; isocyanate-based silane coupling agents such as 3-isocyanatepropyltrimethoxysilane, bis(triethoxysilylpropyl) disulfide, Sulfide-based silane coupling agents such as bis(triethoxysilylpropyl) tetrasulfide; phenyltrimethoxysilane, Methacryloxy propyltrimethoxysilane, imidazole silane, tris Oxazine silane and so on. One kind or two or more kinds of these can be used. [0060] The surface treatment of the semi-calcined hydrotalcite can be, for example, by stirring and dispersing the untreated semi-calcined hydrotalcite with a mixer at room temperature, adding a surface treatment agent, spraying, and stirring for 5 to 60 minutes. conduct. As the mixer, well-known mixers can be used, for example, blenders such as V blenders, ribbon mixers, bubble cone mixers, mixers such as Henschel mixers and concrete mixers, ball mills, and twist mills. Wait. In addition, when the semi-calcined hydrotalcite is pulverized by a ball mill or the like, the aforementioned higher fatty acid, alkyl silanes, or silane coupling agent may be added for surface treatment. Although the amount of surface treatment agent used varies with the type of semi-calcined hydrotalcite or the type of surface treatment agent, etc., it is preferably 1-10 with respect to 100 parts by mass of the semi-calcined hydrotalcite that has not been surface-treated Mass parts. In the present invention, the surface-treated semi-fired hydrotalcite is also included in the "semi-fired hydrotalcite" of the present invention. [0061] The amount of the semi-calcined hydrotalcite in the resin composition of the present invention is not particularly limited as long as it can exhibit the effects of the present invention, but it is preferably 5 to 5 to the total non-volatile content of the resin composition. 60% by mass, more preferably 10 to 55% by mass. Since the semi-fired hydrotalcite system has excellent moisture absorption properties, as long as the amount is increased, the moisture barrier properties of the obtained hardened product will be improved. However, when the amount exceeds 60% by mass, the viscosity of the resin composition will increase, the wettability will decrease, the adhesion between the substrate, etc. of the sealing object and the resin composition will decrease, and the strength of the cured product will decrease and become brittle. The tendency of the problem. In addition, due to the interlayer water of the semi-fired hydrotalcite, the amount of water in the sealing layer (ie, the hardened material) increases. For example, in the manufacture of organic EL devices, the moisture in the sealing layer may cause damage to the light-emitting material (light-emitting layer). Or the adverse effects of the electrode layer have become apparent, and there is a concern that dark spots will increase in the initial stage. [0062] The resin composition of the present invention may include calcined hydrotalcite as long as it is within a range that exhibits the effects of the present invention. The amount is preferably 0-20% by mass, more preferably 0-15% by mass, still more preferably 0-10% by mass, and most preferably 0 with respect to the total nonvolatile content of the resin composition. That is, the resin composition of the present invention preferably does not contain fired hydrotalcite. When the amount of fired hydrotalcite is increased, the refractive index of the cured product of the resin composition increases, and the transmittance tends to decrease. Semi-fired hydrotalcite: The quality of the fired hydrotalcite is preferably 50:50-100:0, more preferably 55:45-100:0, and still more preferably 60:40-100:0. [0063] The resin composition of the present invention may include unfired hydrotalcite as long as it is within a range that exhibits the effects of the present invention. The amount is preferably 0 to 20% by mass, more preferably 0 to 10% by mass, still more preferably 0 to 5% by mass, and most preferably 0 with respect to the total nonvolatile content of the resin composition. That is, the resin composition of the present invention preferably does not contain unfired hydrotalcite. Although the unfired hydrotalcite does not affect the transmittance of the cured resin composition, the increase in water content may reduce the moisture shielding property due to the high water content. For example, when the amount exceeds 20% by mass , Same as the semi-fired hydrotalcite, there is a suspense that the dark spots will increase in the initial stage. Semi-fired hydrotalcite: the better quality of unfired hydrotalcite is 50:50-100:0, more preferably 55:45-100:0, even more preferably 60:40-100:0, and more Preferably it is 65:35-100:0, particularly preferably 70:30-100:0. [0064] Examples of the semi-fired hydrotalcite include "DHT-4C" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle diameter: 400 nm), and "DHT-4A-2" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle diameter: 400nm) and so on. On the other hand, examples of the fired hydrotalcite include "KW-2200" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle diameter: 400nm), and examples of the unfired hydrotalcite include "DHT-4A" (Kyowa Produced by Chemical Industry Corporation, average particle diameter: 400nm), etc. [0065] <(C) Hardening agent and (D) Hardening accelerator> The resin composition of the present invention contains a hardening agent. That is, the sealing layer is a cured product obtained by curing a resin composition. The curing agent is not particularly limited as long as it has a function of curing the thermosetting resin. From the viewpoint of suppressing thermal degradation of light-emitting elements such as organic EL elements during the curing treatment of the resin composition, the curing agent is preferably at a temperature of 140°C or less (preferably 120°C or less), Harden thermosetting resin. Only one type of hardener may be used, or two or more types may be used in combination. [0066] As the curing agent, an epoxy resin curing agent which is particularly preferable as a thermosetting resin is exemplified. Examples include ionic liquids, acid anhydride compounds, imidazole compounds, tertiary amine compounds, dimethylurea compounds, amine adduct compounds, organic acid dihydrazine compounds, organic phosphine compounds, dicyandiamide compounds, grade 1 and grade 2 Amine compounds, etc. [0067] The hardener is preferably one or more selected from ionic liquids, acid anhydride compounds, imidazole compounds, tertiary amine compounds, dimethylurea compounds, and amine adduct compounds, and more preferably selected from ionic liquids, One or more of acid anhydride compounds, imidazole compounds, tertiary amine compounds, and dimethylurea compounds. [0068] Especially as the hardener of the present invention, it is an ionic liquid that can harden thermosetting resins (especially epoxy resins) at temperatures below 140°C (preferably below 120°C), that is, It is a salt that can melt in a temperature range of 140°C or less (preferably 120°C or less), and is preferably a salt that has a curing effect of thermosetting resins (especially epoxy resins). Ionic liquids are desirably used in a state of being uniformly dissolved in thermosetting resins (especially epoxy resins). In addition, ionic liquids are useful for improving the moisture barrier properties of the cured resin composition. [0069] In addition to the curing agent, the resin composition of the present invention may also contain a curing accelerator for the purpose of adjusting the curing time. Only one type of hardening accelerator may be used, or two or more types may be used in combination. As the hardening accelerator, a hardening accelerator of an epoxy resin, which is particularly preferable as a thermosetting resin, is exemplified. For example, an imidazole compound, a tertiary amine compound, a dimethylurea compound, an amine adduct compound, etc. are mentioned. The hardening accelerator is preferably one or more selected from an imidazole compound, a tertiary amine compound, and a dimethylurea compound. [0070] As the cation constituting the ionic liquid as the hardener in the present invention, imidazolium ion, piperidinium ion, pyrrolidinium ion, pyrazolium ion, Guanidinium ion, pyridine Ammonium-based cations such as onium ions; phosphonium-based cations such as tetraalkylphosphonium cations (such as tetrabutylphosphonium ion, tributylhexylphosphonium ion, etc.); phosphonium-based cations such as triethylphosphonium ion, etc. [0071] As the anion constituting the ionic liquid used as the hardener in the present invention, halogenated anions such as fluoride ion, chloride ion, bromide ion, iodide ion, etc.; alkyl group such as methanesulfonate ion, etc. Sulfuric acid anion; trifluoromethanesulfonic acid ion, hexafluorophosphonic acid ion, trifluoroginseng (pentafluoroethyl) phosphonic acid ion, bis(trifluoromethanesulfonyl) iminium ion, trifluoroacetic acid ion, four Fluorine-containing compound anions such as fluoroboric acid ion; phenolic anion such as phenol ion, 2-methoxyphenol ion, 2,6-di-tert-butylphenol ion, etc.; aspartic acid ion, glutamine acid ion And other acidic amino acid ions; neutral amino acid ions such as glycine ion, alanine ion, phenylalanine ion, etc.; N-benzylalanine ion, N-acetylphenylalanine ion Ions, N-acetylamino acid ions, etc., represented by the following general formula (1); formic acid ion, acetate ion, capric acid ion, 2-pyrrolidone-5-carboxylic acid ion, Carboxylic acid anions such as α-lipoic acid ion, lactic acid ion, tartrate ion, hippocampus ion, N-methyl hippocampus ion, and benzoic acid ion. [0072][0073] (However, R is a linear or branched alkyl group having 1 to 5 carbon atoms, or a substituted or unsubstituted phenyl group, and X represents the side chain of an amino acid). [0074] As the amino acid in the formula (1), for example, aspartic acid, glutamic acid, glycine, alanine, phenylalanine, etc., are exemplified. Among them, glycine is preferred. [0075] Among the above, the cation is preferably an ammonium-based cation or a phosphonium-based cation, and more preferably an imidazolium ion and a phosphonium ion. More specifically, the imidazolium ion is 1-ethyl-3-methylimidazolium ion, 1-butyl-3-methylimidazolium ion, 1-propyl-3-methylimidazolium ion, and the like. [0076] Furthermore, the anion is preferably a phenolic anion, an N-amino acid ion or carboxylic acid anion represented by the general formula (1), and more preferably an N-amino acid ion or a carboxylic acid anion . [0077] As a specific example of the phenolic anion, 2,6-di-tert-butylphenol ion can be cited. In addition, specific examples of carboxylic acid anions include acetate ion, capric acid ion, 2-pyrrolidone-5-carboxylate ion, formate ion, α-lipoic acid ion, lactic acid ion, tartrate ion, hippocamic acid ion, and N -Methyl hippocampus ion, etc., among them, acetate ion, 2-pyrrolidone-5-carboxylate ion, formate ion, lactate ion, tartrate ion, hippocampus ion, N-methyl hippocampus ion are particularly preferred. Acetate ion, capric acid ion, N-methyl hippocampus ion, formate ion. In addition, specific examples of N-amino acid ions represented by general formula (1) include N-anisyl alanine ions, N-acetylphenylalanine ions, and aspartic acid ions. , Glycine ion, N-acetylglycine ion, etc., of which N-benzylalanine ion, N-acetylphenylalanine ion, N-acetylglycine ion are preferred , Particularly preferred is N-acetylglycine ion. [0078] As specific ionic liquids, for example, 1-butyl-3-methylimidazolium lactate, tetrabutylphosphonium-2-pyrrolidone-5-carboxylate, tetrabutylphosphonium acetate, Tetrabutylphosphonium caprate, tetrabutylphosphonium trifluoroacetate, tetrabutylphosphonium α-lipoate, tetrabutylphosphonium formate, tetrabutylphosphonium lactate, bis(tetrabutylphosphonium) ) Salt, tetrabutyl phosphonium salt of hippocampus, tetrabutyl phosphonium salt of N-methyl hippocampus, benzoyl-DL-alanine tetrabutyl phosphonium salt, tetrabutyl N-acetylphenylalanine Phosphonium salt, 2,6-di-tert-butylphenol tetrabutyl phosphonium salt, L-aspartic acid monotetrabutyl phosphonium salt, glycine tetrabutyl phosphonium salt, N-acetylglycine tetra Butyl phosphonium salt, 1-ethyl-3-methylimidazolium lactate, 1-ethyl-3-methylimidazolium acetate, 1-ethyl-3-methylimidazolium formate, hippocampus 1-ethyl-3-methylimidazolium salt, 1-ethyl-3-methylimidazolium salt of N-methyl hippocampus, bis(1-ethyl-3-methylimidazolium) tartrate, N -Acetylglycine 1-ethyl-3-methylimidazolium salt, particularly preferably tetrabutylphosphonium decanoate, N-acetglycine tetrabutylphosphonium salt, 1-ethyl-3- Methyl imidazolium acetate, 1-ethyl-3-methylimidazolium formate, 1-ethyl-3-methylimidazolium hippocampus, 1-ethyl-3-methyl N-methyl hippocampus Glyimidazolium salt. [0079] As a synthesis method of the above-mentioned ionic liquid, although there are precursors composed of cation sites such as alkyl imidazolium, alkyl pyridinium, alkyl ammonium and alkyl sulfonium ions, and anion sites containing halogens, Make NaBF4
, NaPF6
, CF3
SO3
Na or LiN(SO2
CF3
)2
The anion exchange method for reaction, the amine-based substance is reacted with the acid ester to introduce the alkyl group, and the organic acid residue becomes the anion-like acid ester method, and the amine is neutralized with the organic acid to obtain the neutralization of the salt Law, etc., but not limited to these. By the neutralization method of anions and cations and solvents, anions and cations can be used in equal amounts, and the solvent in the resulting reaction solution can be distilled off. It can also be used directly, and then poured into organic solvents (methanol, toluene, ethyl acetate, acetone) Etc.) There is no harm in liquid concentration. [0080] Examples of the acid anhydride compound used in the hardener of the present invention include tetraphthalic anhydride, methyltetraphthalic anhydride, hexaphthalic anhydride, methylhexaphthalic anhydride, and methyl tetraphthalic anhydride. Kinadic anhydride, dodecenyl succinic anhydride, etc. As specific examples of the acid anhydride compound, RIKACID TH, TH-1A, HH, MH, MH-700, and MH-700G (all manufactured by Nippon Rika Co., Ltd.) can be cited. [0081] As the imidazole compound used in the hardener and hardening accelerator of the present invention, for example, 1H-imidazole, 2-methyl-imidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4- Methyl imidazole, 1-cyanoethyl-2-ethyl-4-methyl-imidazole, 2-undecylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl- 2-undecylimidazolium trimellitate (Trimellitate), 2,4-diamino-6-(2'-undecylimidazolyl-(1'))-ethyl-s-tri Oxazine, 2-phenyl-4,5-bis(hydroxymethyl)-imidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-phenyl-imidazole, 2 -Dodecyl-imidazole, 2-heptadecylimidazole, 1,2-dimethyl-imidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino -6-(2'-methylimidazolyl-(1')-ethyl-s-triazine, 2,4-diamino-6-(2'-methylimidazolyl-(1'))- Ethyl-s-triazine isocyanuric acid adducts, etc. As specific examples of imidazole compounds, Curezol 2MZ, 2P4MZ, 2E4MZ, 2E4MZ-CN, C11Z, C11Z-CN, C11Z-CNS, C11Z-A, 2PHZ, 1B2MZ, 1B2PZ, 2PZ, C17Z, 1.2DMZ, 2P4MHZ-PW, 2MZ-A, 2MA-OK (all manufactured by Shikoku Chemical Co., Ltd.), etc. [0082] As the hardening agent and hardening accelerator in the present invention Specific examples of tertiary amine-based compounds include DBN (1,5-diazabicyclo[4.3.0]non-5-ene), DBU (1,8-diazabicyclo[5.4.0]undec-7-ene), 2-ethylhexanoate of DBU, phenate of DBU, p-toluenesulfonate of DBU, U-CAT SA 102 (manufactured by San-Apro: DBU octylate), DBU formate Etc. DBU-organic acid salt, ginseng (dimethylaminomethyl)phenol (TAP), etc. [0083] As specific examples of the dimethylurea compound of the hardener and hardening accelerator of the present invention, there can be mentioned DCMU (3-(3,4-dichlorophenyl)-1,1-dimethylurea), U-CAT3512T (manufactured by San-Apro) and other aromatic dimethylurea, U-CAT3503N (San- Aliphatic dimethyl urea etc. made by Apro Corporation. Among them, aromatic dimethyl urea is preferably used from the viewpoint of curability. [0084] Amine as the hardening agent and hardening accelerator in the present invention The adduct compound includes, for example, an epoxy adduct compound obtained by stopping the addition reaction of a tertiary amine to an epoxy resin in the middle. As a specific example of an amine adduct compound, Amicure PN- 2 3. Amicure MY-24, Amicure PN-D, Amicure MY-D, Amicure PN-H, Amicure MY-H, Amicure PN-31, Amicure PN-40, Amicure PN-40J (all manufactured by Ajinomoto Fine Techno) Wait. [0085] Specific examples of the organic acid dihydrazine compound in the hardener of the present invention include Amicure VDH-J, Amicure UDH, and Amicure LDH (all manufactured by Ajinomoto Fine Techno). [0086] As the organic phosphine compound of the hardener and hardening accelerator of the present invention, for example, triphenylphosphine, tetraphenylphosphonium tetra-p-tolyl borate, tetraphenylphosphonium tetraphenyl borate, Three-tert-butyl phosphonium tetraphenyl borate, (4-methylphenyl) triphenyl phosphonium thiocyanate, tetraphenyl phosphonium thiocyanate, butyl triphenyl phosphonium thiocyanate, Triphenylphosphine triphenylborane and so on. Specific examples of the organic phosphine compound include TPP, TPP-MK, TPP-K, TTBUP-K, TPP-SCN, TPP-S (manufactured by Beixing Chemical Industry Co., Ltd.), and the like. [0087] Examples of the dicyandiamide compound used as the hardener in the present invention include dicyandiamide. Specific examples of the dicyandiamide compound include DICY7 and DICY15 (all manufactured by Mitsubishi Chemical Corporation), which are finely pulverized dicyandiamide products. [0088] As the primary and secondary amine compounds used in the hardener of the present invention, for example, aliphatic amines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and trimethylhexamethylene two Amine, 2-methylpentamethylene diamine, 1,3-diaminomethylcyclohexane, dipropylene diamine, diethylaminopropylamine, bis(4-aminocyclohexyl)methane , Norbornene diamine, 1,2-diaminocyclohexane, etc., alicyclic amine N-aminoethylpiperazine, 1,4-bis(3-aminopropyl)piperazine, etc., Aromatic amines diaminodiphenylmethane, m-phenylenediamine, m-xylenediamine, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenylmethane, Diethyltoluenediamine and so on. As a specific example of the primary and secondary amine compounds, Kayahard A-A (manufactured by Nippon Kayaku Co., Ltd.: 4,4'-diamino-3,3'-dimethyldiphenylmethane) and the like can be cited. [0089] In the resin composition of the present invention, the amount of the hardening agent is preferably 0.1-40% by mass, more preferably 0.5-38 parts by mass, and still more preferably 1~ 35 parts by mass. If the amount is less than 0.1% by mass, sufficient curability may not be obtained, and if the amount is greater than 40% by mass, the storage stability of the resin composition may be impaired. However, when an ionic liquid is used as a curing agent, the amount of the ionic liquid relative to the total non-volatile content of the resin composition is preferably 0.1-20% by mass from the viewpoint of the moisture barrier properties of the cured product of the resin composition. , More preferably 0.5-18% by mass, still more preferably 1-15% by mass. [0090] When the resin composition of the present invention contains a hardening accelerator, the amount is preferably 0.05-10% by mass, more preferably 0.1-8% by mass, and still more preferably, relative to the total nonvolatile content of the resin composition 0.5-5 mass%. If the amount is less than 0.05% by mass, the curing tends to be delayed and increase the thermal curing time, and when it exceeds 10% by mass, the storage stability of the resin composition tends to decrease. [0091] The thermosetting resin composition of the present invention is preferably used in combination with a curing agent and a curing accelerator. The combination of the curing agent and the curing accelerator is preferably two or more selected from the group consisting of an ionic liquid, an acid anhydride compound, an imidazole compound, a tertiary amine compound, a dimethylurea compound, and an amine adduct compound. [0092] <(E) Thermoplastic resin> From imparting flexibility to the sealing layer (ie, the cured product of the resin composition), coating properties of the resin composition varnish (preventing cracking) when preparing the sealing sheet, etc. From the viewpoint of this, the resin composition of the present invention may contain a thermoplastic resin. Examples of thermoplastic resins include phenoxy resins, polyvinyl acetal resins, polyimide resins, polyimide resins, polyether resins, polyether resins, polyester resins, and (methyl) resins. Acrylic polymers, etc. Only one type of these thermoplastic resins may be used, or two or more types may be used in combination. [0093] From the viewpoints of imparting flexibility to the sealing layer obtained by curing the resin composition, coating properties of the resin composition varnish (prevention of cracking) when preparing the sealing sheet, etc., the weight average molecular weight of the thermoplastic resin It is preferably 15,000 or more, more preferably 20,000 or more. However, when the weight average molecular weight is too large, the compatibility of the thermoplastic resin and the thermosetting resin (especially epoxy resin) tends to decrease. Therefore, the weight average molecular weight is preferably 1,000,000 or less, more preferably 800,000 or less. [0094] The weight average molecular weight in the present invention is measured by the gel permeation chromatography (GPC) method (in terms of polystyrene). The weight average molecular weight by the GPC method, specifically, LC-9A/RID-6A manufactured by Shimadzu Corporation is used as a measuring device, and Shodex K-800P/K-804L/K-804L manufactured by Showa Denko Corporation is used as a column. Use chloroform or the like for movement etc., measure at a column temperature of 40°C, and calculate it using the calibration curve of standard polystyrene. [0095] The thermoplastic resin is not particularly limited as long as the refractive index of the cured product of the resin composition becomes a thermoplastic resin of 1.48 to 1.54. When the refractive index of the thermosetting resin is low, it may be a thermoplastic resin having a refractive index higher than that of the cured product of the resin composition. The refractive index of the thermoplastic resin is preferably from 1.40 to 1.70, more preferably from 1.40 to 1.65. When a plurality of thermoplastic resins are used, the refractive index of the entire mixture of thermoplastic resins is preferably within the above-mentioned range. [0096] As the thermoplastic resin, a phenoxy resin that has good compatibility with thermosetting resins (especially epoxy resins) and can contribute to the improvement of the moisture barrier properties of the cured product of the resin composition . [0097] The phenoxy resin may have an epoxy group similar to the epoxy resin. The weight average molecular weight of the phenoxy resin is preferably 10,000 to 500,000, more preferably 20,000 to 300,000. [0098] Suitable phenoxy resins include those having a skeleton selected from the group consisting of bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, novolak skeleton, biphenyl skeleton, pyrene skeleton, and two One or more of a cyclopentadiene skeleton and a norbornene skeleton. One type or two or more types of phenoxy resin can be used. [0099] Examples of commercially available phenoxy resins include YX7200B35 (manufactured by Mitsubishi Chemical Corporation: phenoxy resin containing a biphenyl skeleton), 1256 (manufactured by Mitsubishi Chemical Corporation: phenoxy resin containing a bisphenol A skeleton) Resin), YX6954BH35 (manufactured by Mitsubishi Chemical Corporation: phenoxy resin containing bisphenol acetophenone skeleton), etc. [0100] When the resin composition containing the present invention is a thermoplastic resin, the amount is 0.1-60% by mass, preferably 3-60% by mass, more preferably 5-50% by mass relative to the total nonvolatile content of the resin composition %. [0101] <Coupling agent> The resin composition of the present invention may contain a coupling agent. Examples of the coupling agent include silane coupling agents, aluminate coupling agents, and titanate coupling agents. As the silane coupling agent, for example, 3-glycidoxy propyl trimethoxy silane, 3-glycidoxy propyl triethoxy silane, 3-glycidoxy propyl (dimethoxy propyl) Base) methyl silane and 2-(3,4-epoxycyclohexyl) ethyl trimethoxy silane and other epoxy-based silane coupling agents; 3-mercaptopropyl trimethoxy silane, 3-mercaptopropyl triethyl Mercapto-based silane coupling agents such as oxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane; 3-aminopropyltrimethoxysilane, 3-amine Propyl propyl triethoxy silane, 3-aminopropyl dimethoxy methyl silane, N-phenyl-3-amino propyl trimethoxy silane, N-methylamino propyl trimethoxy silane Silane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropyldimethoxymethylsilane, etc. Amino-based silane coupling agent; ureido-based silane coupling agent such as 3-ureidopropyltriethoxysilane; vinyl trimethoxy silane, vinyl triethoxy silane and vinyl methyl diethoxy Vinyl silane coupling agent such as silane; Styryl silane coupling agent such as p-styryltrimethoxysilane; 3-propenyloxypropyltrimethoxysilane and 3-methacryloxyl Acrylate-based silane coupling agents such as propyltrimethoxysilane; isocyanate-based silane coupling agents such as 3-isocyanatepropyltrimethoxysilane; bis(triethoxysilylpropyl) disulfide, bis(triethoxysilane) Sulfide-based silane coupling agents such as ethoxysilyl propyl) tetrasulfide; phenyl trimethoxy silane, Methacryloxy propyl trimethoxy silane, imidazole silane, triazine silane, etc. . Among these, vinyl-based silane coupling agents and epoxy-based silane coupling agents are preferred, and epoxy-based silane coupling agents are particularly preferred. As the aluminate coupling agent, for example, alkyl acetyl acetate aluminum diisopropylate (for example, "PLENACT AL-M" manufactured by Ajinomoto Fine Techno) can be cited. As specific examples of titanate coupling agents, PLENACT TTS, PLENACT 46B, PLENACT 55, PLENACT 41B, PLENACT 38S, PLENACT 138S, PLENACT 238S, PLENACT 338X, PLENACT 44, PLENACT 9SA (all manufactured by Ajinomoto Fine Techno) )Wait. One type or two or more types of coupling agents can be used. [0102] The amount of the coupling agent in the resin composition of the present invention is preferably 0-15% by mass, more preferably 0.5-10% by mass relative to the total nonvolatile content of the resin composition. [0103] <Inorganic filler> "In the resin composition of the present invention, the water barrier properties of the cured resin composition and the coating properties of the resin composition varnish (prevention of cracking) when preparing the sealing sheet are considered. It can be seen that, in the range where the effect of the present invention is exerted, inorganic fillers other than semi-fired hydrotalcite may be further contained. As such an inorganic filler, in addition to the above-mentioned unfired hydrotalcite and fired hydrotalcite, for example, talc, silica, alumina, barium sulfate, clay, mica, aluminum hydroxide, magnesium hydroxide, Calcium carbonate, magnesium carbonate, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium zirconate, calcium zirconate, silicate Wait. One type or two or more types of inorganic fillers can be used. Furthermore, the particle size of the primary particles of the inorganic filler is preferably 5 μm or less, more preferably 3 μm or less. For example, those with a primary particle diameter of 0.001 to 3 μm, more preferably 0.005 to 2 μm can be used. [0104] The particle form of the inorganic filler is not particularly limited, and a spherical shape, a rectangular parallelepiped shape, a plate shape, a linear shape such as a fiber, and a branched branch shape can be used. The inorganic filler is preferably talc, silica, zeolite, titanium oxide, alumina, zirconia, silicate, mica, magnesium hydroxide, aluminum hydroxide, etc., more preferably talc, silica, particularly preferably talc. As silicon dioxide, amorphous silicon dioxide, fused silicon dioxide, crystalline silicon dioxide, synthetic silicon dioxide wet silicon dioxide, dry silicon dioxide, colloidal silicon dioxide (water dispersible, organic Solvent-dispersed, fumed silica, etc.), from the standpoint of difficulty in precipitation, sedimentation, and easy compounding with resin, organic solvent-dispersed colloidal silica (organic silica sol) is particularly preferred. [0105] Commercially available inorganic fillers can be used. Examples of talc include "FG-15" (average particle size 1.4μm), "D-1000" (average particle size 1.0μm), "D-600" (average particle size 0.6μm) manufactured by Nippon Talc Co., Ltd. . As an example of commercially available spherical fused silica, the spherical fused silica "Adma fine series" manufactured by Admatechs ("SO-C2; average particle size 0.5μm", "SC2500-SQ; average particle size Diameter 0.5μm, silane coupling treatment" etc.) etc. As an example of fuming silica, "Aerosil series" ("A-200: primary particle diameter 5-40nm" etc.) manufactured by Japan Aerosil Co., Ltd. can be cited. As an example of organic solvent-dispersed colloidal silica, "MEK-EC-2130Y" manufactured by Nissan Chemical Industry Co., Ltd. (amorphous silica particle size 10-15nm, non-volatile content 30% by mass, MEK solvent), "PGM-AC-2140Y" manufactured by Nissan Chemical Industry Co., Ltd. (silicon dioxide particle size 10-15nm, non-volatile content 40% by mass, PGM (propylene glycol monomethyl ether) solvent), "MIBK-ST" manufactured by Nissan Chemical Industry Co., Ltd. (Silicon dioxide particle size 10-15nm, non-volatile content 30% by mass, MIBK (methyl isobutyl ketone) solvent), Fuso Chemical Industry Co., Ltd. colloidal silica sol "PL-2L-MEK" (dioxide Silicon particle size 15-20nm, non-volatile content 20% by mass, MEK (methyl ethyl ketone) solvent), etc. [0106] The amount of inorganic fillers other than semi-fired hydrotalcite, from the viewpoint of the moisture shielding properties of the cured resin composition, etc., is preferably 0-30 relative to the total non-volatile content of the resin composition. % By mass, more preferably 0-25% by mass. [0107] In order to improve the moisture shielding and transmittance of the cured resin composition, silica can be blended into the resin composition of the present invention. When silicon dioxide is blended, the amount is preferably 0.1 to 10% by mass relative to the total non-volatile content of the resin composition. When the amount of silicon dioxide is too large, the adhesion tends to decrease. [0108] In order to improve the moisture resistance and adhesion of the cured resin composition, talc can be blended with the resin composition of the present invention. When talc is blended, the amount is preferably 0.01 to 30% by mass, more preferably 0.1 to 20% by mass, and still more preferably 0.5 to 10% by mass relative to the total nonvolatile content of the resin composition. When the amount of talc is too small, it tends to be difficult to exert the effect of improving the moisture resistance and adhesion by the talc, and when the amount of talc is too large, the transparency tends to deteriorate. [0109] <Other additives> The resin composition of the present invention may further contain other additives different from the above-mentioned components, provided that the resin composition of the present invention is in a range that exhibits the effects of the present invention. Examples of such additives include organic fillers such as rubber particles, silicone powder, nylon powder, and fluororesin powder; tackifiers such as Orben and Penton; and silicone, fluorine, and polymer defoamers. Or leveling agent; adhesion imparting agent for triazole compounds, thiazole compounds, triazine compounds, porphyrin compounds, etc.; etc. [0110] <Refractive Index> In the present invention, the refractive index of the solid resin (such as solid epoxy resin, phenoxy resin, etc.) and the refractive index of the cured resin composition are both light at 25°C with a wavelength of 594nm. The refractive index is based on the value measured by the prism coupler method. In detail, the prism coupler method can be used to measure the refractive index of the sample by measuring the critical angle of the interface between a prism with a known refractive index and the sample in contact with the prism. As a measuring device of the prism coupler method, for example, a prism coupler (model 2010/M) manufactured by Metricon Corporation can be used. When measuring the refractive index of a solid resin or phenoxy resin in a solution containing a solvent, apply a uniform film thickness on the glass support, and use it in a thermal cycle oven to volatilize enough solvent for measurement. . The refractive index of liquid resin (for example, liquid epoxy resin, etc.) is a value measured by a measurement method using a multi-wavelength Abbe refractometer at 25°C. As the multi-wavelength Abbe refractometer, for example, DR-M2 manufactured by Atago Corporation can be used. [0111] <Parallel line transmittance of hardened layer> In the present invention, it is preferable that the hardened layer of a resin composition with a thickness of 20 μm has a parallel line transmittance of 80-100% to D65 light. Such a hardened layer can be regarded as transparent by visual observation. [0112] The resin composition of the present invention can easily form a cured product (sealing layer) of the resin composition having excellent parallel line transmittance by appropriately adopting the above-mentioned preferable conditions. The transmittance of the cured product layer (sealing layer) of the resin composition with a thickness of 20 μm to the parallel line of D65 light is preferably 80-100%, more preferably 85-100%. The parallel line transmittance of the cured product to D65 light was performed as described in the examples described later, and a laminate of the cured product of the resin composition sandwiched between the glass plates was formed, and it was calculated by using air as a reference. Although the above-mentioned value of the parallel line transmittance of D65 light is a measured value of a cured layer of a resin composition with a thickness of 20 μm, the thickness of the cured layer is generally 3 to 200 μm. [0113] <Manufacturing method of resin composition> The resin composition of the present invention with a cured product having a refractive index of 1.48 to 1.54 can be achieved by using a component having the same refractive index as the aforementioned refractive index, or blending lower Refractive index resin and high refractive index resin are prepared by adjusting the refractive index of the entire resin within the above range. The resin composition of the present invention can be produced by mixing such components and, if necessary, an organic solvent, etc., using a kneading roll, a rotary mixer, or the like. [0114] <Use> The resin composition of the present invention and the sealing sheet described later, for example, are used in electronic parts such as semiconductors, solar cells, high-brightness LEDs, LCDs, and EL elements, preferably organic EL elements, solar Sealing of optical semiconductors such as batteries. The resin composition and the sealing sheet of the present invention are particularly suitable for use in the sealing of organic EL devices. Specifically, in order to be applied to the upper and/or surrounding (side) of the light-emitting part of the organic EL element and to protect the light-emitting part of the organic EL element from the outside, the resin composition and sealing sheet of the present invention can be used. [0115] A sealing layer can be formed by applying the resin composition of the present invention to a sealing object and hardening the coating film. In addition, the sealing sheet forming the layer of the resin composition of the present invention can be prepared on the support, the sealing sheet is laminated on the necessary place of the sealing object, and the resin composition layer can be transferred to the coated object. Harden to form a sealing layer. [0116] <Sheet for sealing> The layer of the resin composition of the present invention is formed on a support by a method known to those skilled in the art, such as preparing the resin composition and dissolving it in organic A solvent-based resin composition varnish is prepared by coating the varnish on a support, and then drying the coated varnish by heating or hot air blowing to form a resin composition layer. [0117] As the support used for the sealing sheet, polyolefins such as polyethylene, polypropylene, polyvinyl chloride, cycloolefin polymers, polyethylene terephthalate (hereinafter sometimes referred to as "PET"), polyethylene naphthalate and other polyester, polycarbonate, polyimide and other plastic films. As a plastic film, PET is especially preferred. In addition, the support may be metal foil such as aluminum foil, stainless steel foil, and copper foil. In addition to matting treatment and corona treatment, the support can also be subjected to mold release treatment. As a mold release process, the mold release process by the mold release agent, such as a silicone resin type mold release agent, an alkyd resin type mold release agent, a fluororesin type mold release agent, etc. is mentioned, for example. [0118] In order to improve the moisture resistance of the sealing sheet, a plastic film with a barrier layer can be used as a support. Examples of the barrier layer include nitrides such as silicon nitride, oxides such as aluminum oxide, stainless steel foil, and metal foil such as aluminum foil. As the plastic film, the above-mentioned plastic film can be cited. Commercial products can be used for plastic films with barrier layers. In addition, it can be a film composed of laminated metal foil and plastic film. For example, commercial products of polyethylene terephthalate film with aluminum foil include "AL1N30 with PET" manufactured by Tokai Toyo Aluminum Sales Co., Ltd., "AL3025 with PET" manufactured by Fukuda Metal Co., Ltd., and "AL3025 with PET" manufactured by PANAC. Alpet" and so on. [0119] The support may be subjected to mold release treatment, matting treatment, corona treatment, etc. with silicone resin-based mold release agents, alkyd resin-based mold release agents, fluororesin-based mold release agents, etc. In the present invention, when the support has a release layer, the release layer can also be regarded as a part of the support. Although the thickness of the support is not particularly limited, from the viewpoint of handleability and the like, it is preferably 20 to 200 μm, and more preferably 20 to 125 μm. [0120] Examples of organic solvents include acetone, methyl ethyl ketone (hereinafter also referred to as "MEK"), ketones such as cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, and propylene glycol. Acetates such as monomethyl ether acetate and carbitol acetate, cellosolve, carbitols such as butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformol Amine, dimethylacetamide, N-methylpyrrolidone, etc. Any one of the organic solvents may be used alone, or two or more of them may be used in combination. [0121] Although the drying conditions are not particularly limited, they are usually suitable for about 50 to 100°C for about 3 to 15 minutes. [0122] The thickness of the resin composition layer after drying is usually 3 μm to 200 μm, preferably 5 μm to 100 μm, and more preferably 5 μm to 50 μm. [0123] The resin composition layer can be protected by a protective film. By protecting it with a protective film, it is possible to prevent the adhesion or scars of dust on the surface of the resin composition layer. The protective film preferably uses the same plastic film as the support. In addition, the protective film may be subjected to mold release treatment in addition to matting treatment and corona treatment. Although the thickness of the protective film is not particularly limited, it is usually 1 to 150 μm, preferably 10 to 100 μm. [0124] If the sealing sheet is used for the support with moisture-proof and high transmittance support, the sealing sheet can be directly hardened to form the sealing layer by laminating the sealing sheet on the necessary places of the sealing object. , Form a sealed structure with high humidity resistance. As a support with such moisture resistance and high transmittance, a plastic film with inorganic substances such as silicon oxide (silicon dioxide), silicon nitride, SiCN, and amorphous silicon vapor deposited on the surface can be cited. Examples of plastic films include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, polyesters such as polyethylene terephthalate and polyethylene naphthalate, polycarbonates, and polyamides. Imines and so on. As a plastic film, PET is especially preferred. Examples of commercially available plastic films with moisture resistance include TECHBARRIER HX, AX, LX, and L series (manufactured by Mitsubishi Plastics Corporation), or X-BARRIER (manufactured by Mitsubishi Plastics Corporation), which improves the moisture-proof effect. As the support, a multi-layer structure having two or more layers can be used. [0125] <Organic EL device> When manufacturing an organic EL device that seals an organic EL element from the cured resin composition of the present invention, it is suitable to use the above-mentioned sealing sheet for sealing. That is, when the sealing sheet-based resin composition layer is protected by a protective film, after peeling this off, the sealing sheet and the resin composition layer are directly connected to the sealing object (for example, the organic EL element on the organic EL element forming substrate) Lamination is done in a contact way. The lamination method can be batch type or continuous type with rolls. After lamination, the support is peeled off, and the thermosetting operation of the resin composition layer described later is performed. When the support of the sealing sheet is a moisture-proof support, after the sealing sheet is laminated, the support is directly subjected to the thermosetting operation of the resin composition layer described later without peeling off the support. [0126] The curing of the resin composition layer is usually performed by thermal curing. As this means, for example, heating by pressing by a hot air circulation oven, an infrared heater, a heat gun, a high-frequency induction heating device, and a heating tool, etc. can be cited. From the viewpoint that the cured resin composition layer (sealing layer) can be adhered to the sealed object with sufficient adhesive strength, the curing temperature is preferably 50°C or higher, more preferably 55°C or higher, and the curing time is preferably 10 minutes or more, more preferably 20 minutes or more. [Examples] [0127] Hereinafter, although the present invention will be specifically described with examples, the present invention is not limited to these examples. However, in the following description, unless otherwise specified, the unit of concentration, water absorption, etc. other than transmittance, namely "%" and the unit of blending amount, namely "parts" means "mass%" and "parts by mass", respectively . Still, as the hydrotalcite, all commercially available hydrotalcites are used. [0128] <Synthesis Example 1> Synthesis of ionic liquid hardener The N-acetylglycine tetrabutylphosphonium salt of ionic liquid hardener was synthesized in the following order. To 20.0 g of a 41.4% tetrabutylphosphonium hydroxide aqueous solution (manufactured by Beixing Chemical Industry Co., Ltd.), 3.54 g of N-acetylglycine (manufactured by Tokyo Chemical Industry Co., Ltd.) was added at 0°C and stirred for 10 minutes. After stirring, the reaction solution was concentrated at 60 to 80°C for 2 hours at a pressure of 40 to 50 mmHg using an evaporator, and at 90°C for 5 hours. The obtained concentrate was dissolved in 14.2 ml of ethyl acetate (manufactured by Junsei Chemical Co., Ltd.) at room temperature to prepare a solution, and the obtained solution was concentrated using an evaporator at a pressure of 40-50 mmHg at 70-90°C for 3 hours to obtain 11.7 g (purity: 96.9%) of N-acetyl glycine tetrabutyl phosphonium salt as an oily compound. [0129] <Example 1> kneaded liquid hydrogenated bisphenol A epoxy resin ("YX8000" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205) 60 parts, and commercially available hydrotalcite A (semi-calcined water) Talc, BET specific surface area: 13m2
/g, average particle diameter: 400 nm) 40 parts, and then dispersed in a 3-roll mill to obtain a mixture. Dissolve 1.5 parts of a hardening accelerator ("U-CAT3512T" manufactured by San-Apro) in a phenoxy resin solution ("YX7200B35" manufactured by Mitsubishi Chemical Corporation, solvent: MEK, non-volatile content: 35%) 114.3 parts (resin 40 parts) of the mixture, blend the previously prepared mixture, and 3 parts of the ionic liquid hardener (N-acetylglycine tetrabutyl phosphonium salt), and uniformly disperse it with a high-speed rotary mixer to obtain a resin composition Varnish. [0130] Next, the resin composition varnish is applied to a support (polyethylene terephthalate film treated with a silicone-based release agent, thickness 38 μm, hereinafter referred to as "release PET film"), and dried Afterwards, the thickness of the resin composition layer was uniformly coated with a die coater so that the thickness of the resin composition layer was 20 μm, and after drying at 80°C for 5 minutes, a release PET film was placed on the surface of the resin composition layer as a protective film to obtain sealing Thin slices. [0131] <Example 2> Except for replacing the hydrotalcite A, use the commercially available hydrotalcite B (semi-fired hydrotalcite, BET specific surface area: 15m2
/g, average particle diameter: 400 nm), other than that of Example 1, a resin composition varnish was produced, and a sealing sheet was obtained. [0132] <Example 3> "In addition to the substituted phenoxy resin solution (114.3 parts), a solid hydrogenated bisphenol A epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 1000) solution (solvent) was used instead : MEK, non-volatile matter: 40%), except for 100 parts (40 parts of resin), and otherwise in the same manner as in Example 2, a resin composition varnish was produced, and in the same manner as in Example 1, a sealing sheet was obtained. [0133] <Example 4> "Except for replacing 1.5 parts of the hardening accelerator ("U-CAT3512T" manufactured by San-Apro)) to 2 parts of an imidazole hardener ("1B2MZ" manufactured by Shikoku Kasei Co., Ltd.), other things were implemented In Example 2, the resin composition varnish was produced in the same manner as in Example 1, and the sealing sheet was obtained. [0134] <Example 5> kneaded liquid hydrogenated bisphenol A epoxy resin ("YX8000" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205) 30 parts, and an acid anhydride hardener (made by New Japan Rika Corporation "MH -700") 30 copies of commercially available hydrotalcite B (BET specific surface area: 13m2
/g, average particle diameter: 400 nm) 40 parts, and then dispersed in a 3-roll mill to obtain a mixture. In 100 parts (40 parts resin) of a solid hydrogenated bisphenol A epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 1000) (solvent: MEK, non-volatile content: 40%), Disperse the mixture with the pre-prepared 3-roll mill and 2 parts of DBU-octyl acid salt hardening accelerator ("U-CAT SA102" manufactured by San-Apro) in a high-speed rotary mixer. Resin composition varnish. "Except for using the obtained resin composition varnish, it carried out similarly to Example 1, and obtained the sheet|seat for sealing. [0135] <Example 6> "Except for changing the amount of phenoxy resin solution (Mitsubishi Chemical Corporation "YX7200B35", solvent: MEK, non-volatile content: 35%)) to 57.2 parts (resin 20 parts), and then used A solution of solid hydrogenated bisphenol A epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) (solvent: MEK, non-volatile content: 40%) 50 parts (resin 20 parts) was carried out in the same manner as in Example 2. The resin composition varnish was manufactured, and it carried out similarly to Example 1, and obtained the sheet|seat for sealing. [0136] <Example 7> "Except for changing the amount of phenoxy resin solution ("YX7200B35" manufactured by Mitsubishi Chemical Corporation, "YX7200B35", solvent: MEK, non-volatile content: 35%)) to 85.7 parts (30 parts of resin), and then used A mixture of liquid bisphenol A type epoxy resin and liquid bisphenol F type epoxy resin ("ZX-1059" manufactured by Nippon Steel Chemical Industry Co., Ltd., epoxy equivalent: about 165), except for 10 parts. In Example 2, the resin composition varnish was produced in the same manner as in Example 1, and the sealing sheet was obtained. [0137] <Comparative Example 1> "In addition to replacing the liquid hydrogenated bisphenol A epoxy resin, a mixture of liquid bisphenol A epoxy resin and liquid bisphenol F epoxy resin was used (Nippon Steel Chemical Industry Co., Ltd.) Except for the preparation of "ZX-1059") 60 parts, the others were carried out in the same manner as in Example 2 to produce a resin composition varnish, and the same procedure as in Example 1 was carried out to obtain a sealing sheet. [0138] <Comparative Example 2> Except that 40 parts of commercially available hydrotalcite C (fired hydrotalcite, average particle diameter: 400 nm) was used instead of hydrotalcite A, the same procedure as in Example 1 was carried out to produce a resin composition Varnish, and obtain a sealing sheet. [0139] <Comparative Example 3> Except that 40 parts of commercially available hydrotalcite D (unfired hydrotalcite, average particle diameter: 400 nm) was used instead of hydrotalcite A, the same procedure as in Example 1 was carried out to produce a resin composition It is a varnish, and a sealing sheet is obtained. [0140] <Water absorption rate of hydrotalcite> Weigh 1.5g of each hydrotalcite on a balance scale, and measure the initial mass. Let stand for 200 hours under atmospheric pressure in a small environmental tester (SH-222 manufactured by Espec) set at 60℃ and 90%RH (relative humidity), measure the mass after moisture absorption, and use the above formula (i) to obtain saturated water absorption Rate. The results are shown in Table 1. [0141] <Thermal weight reduction rate of hydrotalcite> TG/DTA EXSTAR6300 manufactured by Hitachi High-Tech Co., Ltd. was used to perform thermogravimetric analysis of each hydrotalcite. Weigh 10 mg of hydrotalcite in an aluminum sample pan, and in an uncovered open state, the temperature is increased from 30°C to 550°C at a temperature increase rate of 10°C/min under an environment with a nitrogen flow rate of 200 mL/min. Using the above formula (ii), the thermal weight loss rate at 280°C and 380°C is obtained. The results are shown in Table 1. [0142] <Powder X-ray diffraction> The measurement of "Powder X-ray diffraction" was performed by a powder X-ray diffraction device (manufactured by PANalytical, Empyrean) to the cathode CuKα (1.5405Å), voltage: 45V, current: 40mA , Sampling width: 0.0260˚, scanning speed: 0.0657˚/s, measurement of diffraction angle range (2θ): 5.0131～79.9711˚. The peak search system uses the peak search function of the software attached to the diffraction device to "minimum significance: 0.50, minimum peak element: 0.01˚, maximum peak element: 1.00˚, peak base width: 2.00˚, method: the second derivative Minimum” condition. Detect two split peaks that appear in the range of 8～18˚ 2θ, or the peak that has a shoulder by the synthesis of the two peaks, and measure the peak that appears on the low-angle side or the diffraction intensity of the shoulder (= low-angle side diffraction intensity), and the peak of the high-angle side or shoulder diffraction strength (= high-angle side diffraction intensity), calculate the relative intensity ratio (= low-angle side diffraction intensity/high-angle side diffraction strength). The results are shown in Table 1. [0143][0144] From the results of saturated water absorption, thermal weight reduction, and powder X-ray diffraction, hydrotalcite A, hydrotalcite B, hydrotalcite E, and hydrotalcite F are "semi-fired hydrotalcite", and hydrotalcite C is " "Fired hydrotalcite", hydrotalcite D is "unfired hydrotalcite". [0145] <The refractive index of the cured resin composition> The sealing sheet prepared in the Examples and Comparative Examples was cut into a length of 70 mm and a width of 25 mm, and the protective film (release PET) was peeled off from the cut sealing sheet. Film), apply the sealing sheet to a glass plate (microscope slide with length 76mm, width 26mm and thickness 1.2mm, white slide glass S1112 made by Songnang Glass Industry Co., Ltd., edge grinding No. 2) using a batch vacuum laminator (Manufactured by Nichigo-Morton, V-160) lamination. The lamination conditions were a temperature of 80°C, a pressure reduction time of 30 seconds, and a pressure of 0.3 MPa for 30 seconds. Then, the support (release PET film) of the sealing sheet was peeled off, and thermally cured in a thermal cycle oven at 130°C for 60 minutes to obtain a laminate of a cured resin composition layer and glass, which is a sample for evaluation. [0146] A prism coupler (model 2010/M) manufactured by Metricon was used, and a laser light with a wavelength of 594 nm was used to measure the refractive index. The prism in the device by the air pressure transmission coupling head is in contact with the surface of the hardened layer of the aforementioned evaluation sample, and the evaluation sample is set. While irradiating the laser, the angle between the prism and the sample is changed to perform total reflection. The laser light introduced by the photodetector propagates from the air to the inside of the sample at a value called the mode angle, and reaches the laser light of the detector. At first, the light intensity drops sharply. Confirm the position (dip) of the light transfer mode to determine the refractive index. The results are shown in Table 2. [0147] <Parallel line transmittance of the cured resin composition> The sealing sheet prepared in the Examples and Comparative Examples was cut into a length of 70 mm and a width of 25 mm, and the protective film was peeled off from the cut sealing sheet. Mold PET film), apply the sealing sheet to a glass plate (microscope slide with length 76mm, width 26mm and thickness 1.2mm, white slide glass S1112 made by Songlang Glass Industry Co., Ltd., edge grinding No. 2) using batch vacuum layer Laminating using a press (manufactured by Nichigo-Morton, V-160). The lamination conditions were a temperature of 80°C, a pressure reduction time of 30 seconds, and a pressure of 0.3 MPa for 30 seconds. Then, the support (releasing PET film) of the sealing sheet was peeled off, and on the exposed resin composition layer, the glass plate was laminated in the same manner as above to produce a laminate. The obtained laminate was heated in a thermal cycle oven at 130°C for 60 minutes to obtain a laminate having a cured product of the resin composition between the glass plates (evaluation sample, thickness of the cured product: 20 μm). [0148] Using the haze meter HZ-V3 (halogen lamp) manufactured by Suga Testing Machine Co., Ltd., and air as a reference, the parallel line transmittance Tp (%) of the sample for light measurement and evaluation in D65 was evaluated with the following standards. The results are shown in Table 2. (Parallel line transmittance standard) good (○): 85% or more acceptable (△): less than 85%, 80% or more not good (×): less than 80% [0149] <Light-emitting area reduction start time> except The aluminum foil/PET composite film "AL1N30 with PET" (aluminum foil: 30μm, PET: 25μm, manufactured by Tokai Toyo Aluminium Sales Co., Ltd.) was used as the support, and the rest was performed in the same manner as in the respective examples and comparative examples to obtain The sealing sheet of the same resin composition layer as in each example and comparative example. [0150] The alkali-free glass 50mm×50mm square is washed with boiled isopropanol for 5 minutes, and dried at 150°C for more than 30 minutes. Using this glass, using a mask whose distance from the end was set to 3mm, a calcium film (purity 99.8%) (thickness 300nm) was deposited. In the glove box, the alkali-free glass vapor-deposited with a calcium film and the sealing sheet having the same resin composition layer as in the respective examples and comparative examples were heated with a thermal laminator (Rami Packer DAiSY A4 (LPD2325) manufactured by Fujipura) ) Fit, to modulate the laminated body. The obtained laminate was heated at a temperature of 130° C. for 60 minutes to harden the resin composition layer to obtain a sample for evaluation. [0151] Calcium becomes transparent when it comes into contact with water and becomes calcium oxide. Therefore, the moisture penetration of the evaluation sample can be evaluated by measuring the distance (mm) from the end of the evaluation sample to the calcium film. Therefore, the evaluation sample containing the calcium film was used as a model of an organic EL device containing an organic EL element. [0152] First, the distance from the end of the evaluation sample to the calcium film is measured with the Measuring Microscope MF-U manufactured by Mitutoyo Corporation, and this value is set as X2. [0153] Next, put the sample for evaluation in a constant temperature and humidity tank set at a temperature of 85°C and a humidity of 85%RH. The sealing distance X1 (mm) from the end of the evaluation sample to the calcium film after the input of the constant temperature and humidity tank is compared to the distance from the end of the evaluation sample to the calcium film before the input of the constant temperature and humidity tank When the sealing distance X2 (mm) of X2 is increased by 0.1 mm, the sample for evaluation is taken out of the constant temperature and humidity tank, and this time is taken as the decrease start time t (time). [0154] Calculate the constant K according to the following Fick's diffusion formula. X1=K√t (where X1 is the sealing distance (mm) from the end of the evaluation sample to the calcium film after the input of the constant temperature and humidity tank, and t is the time when the reduction becomes X1=X2+0.1 (Time), X2 is the sealing distance (mm) from the end of the evaluation sample to the calcium film before being put into the constant temperature and humidity tank. [0155] Using the obtained K, the time when X1 becomes a value of 5 mm is calculated as the light-emitting area reduction start time, and evaluated based on the following criteria. The higher the moisture shielding property, the more it can slow down the penetration speed of moisture, and the light-emitting area decreases and the start time increases. The results are shown in Table 2. Still, the "h" in the unit listed in Table 2 means "hour". (The benchmark for the start time of the luminous area reduction) Good (○): more than 300 hours possible (△): less than 300 hours, more than 200 hours poor (×): less than 200 hours [0156] In Table 2, except for implementation In addition to the results of the refractive index of the cured product obtained in the examples and comparative examples, the types and amounts of the components used are also described. [0157][Industrial Applicability] [0158] According to the sealing resin composition of the present invention, a sealing layer with excellent moisture barrier properties and transparency can be formed. Therefore, the sealing resin composition and the sealing sheet of the present invention can be suitably used for the sealing of devices weak to moisture, such as organic EL devices. [0159] This case is based on Japanese Patent Application No. 2016-196395 filed by Japan, and the contents are all included in the description of this case.