TWI747389B - Workpiece transfer device, work piece transfer chuck, and work piece transfer method - Google Patents

Abstract

The work transfer device of the present invention is characterized by comprising: a transfer member which is movably provided from a first opposed position opposed to the first substrate to a second opposed position opposed to the second substrate; and an adhesive portion , Arranged on the transfer surface of the transfer member opposite to the plurality of plate-shaped workpieces arranged on the first substrate, and has an adhesive surface that can be elastically deformed; It is arranged further to the outside so as to protrude toward the first receiving surface of the first surface of the first substrate, which is further outside than the plurality of plate-shaped workpieces, and has a hard reaction force surface; the first contact separation driving part makes the transfer member The adhesive part moves closer and moves apart from the first opposite position to the opposite direction relative to the first substrate; and the control part controls the operation of the first contact separation driving part, and the control part controls the following: The transfer member of a contacting and separating driving part moves relatively close to the first substrate, and the adhesive surface abuts against a plurality of plate-shaped workpieces and compresses and deforms while adhering and holding the plurality of plate-shaped workpieces. As the adhesive surface compresses and deforms, it reacts. The force surface abuts on the first receiving surface of the first substrate to stop the relatively close movement of the transfer member and the first substrate based on the first contact separation driving portion.

Description

Workpiece transfer device, work piece transfer chuck, and work piece transfer method

The present invention relates to a workpiece transfer device for receiving a plate-shaped workpiece including micro-elements such as micro LEDs from a first substrate and transferring it to a specific position on a second substrate as a transfer target, and for workpiece transfer The workpiece transfer chuck of the device, and the workpiece transfer method using the workpiece transfer device or the workpiece transfer chuck.

In the past, as this kind of workpiece transfer method, there are the following component mounting methods, including: a component separation step, maintaining the arrangement state of a plurality of components and separating a plurality of components arranged in a specific cycle on the wafer into individual components; a rearrangement step, Operate the separated components and rearrange the components on the temporary substrate; and in the transfer step, transfer the components to the mounting substrate while maintaining the rearranged state on the temporary substrate (for example, refer to Patent Document 1).

As components, they are not limited to LED chips with an angle of 20μm, including thin film transistors.

In the element separation step, after the sapphire substrate used as the element formation wafer is arranged in a plane to form a plurality of elements, separation grooves are formed in a grid shape around each element, and the separation grooves maintain the alignment state to separate the individual elements.

The surface of the temporary substrate (substrate for temporary holding) used in the rearrangement step is coated with an adhesive material layer, and the surface of the adhesive material layer is crimped to the surface side of the element by the close movement of the sapphire substrate and the substrate for temporary holding . Adhesive material layer to the surface side of the component For crimping, the surface of the adhesive material layer is compressed and deformed and adheres to the surface side of the holding element.

Then, by irradiating only the selected element among the plurality of elements from the back surface of the sapphire substrate so that the laser beam of the pulsed ultraviolet laser is transmitted to the surface side, the bonding force with the sapphire substrate is weakened. Subsequently, by pulling away the temporary holding substrate from the sapphire substrate, only the selected element is peeled from the sapphire substrate and transferred to the temporary holding substrate.

After that, the components transferred to the temporary holding substrate are transferred to another temporary substrate. This other temporary substrate is also provided with an adhesive material layer like the substrate for temporary holding, and retransfer is performed in the same manner as the transfer based on the substrate for temporary holding.

Wiring electrodes are formed on the mounting substrate (wiring substrate) used in the transfer step, and the component is crimped to the wiring electrode by bringing another temporary substrate turned over close to the wiring substrate, and the component is firmly fixed (electrically connected) ) On the wiring electrode to complete the installation of the component on the mounting substrate.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2002-118124 A

Miniaturized LED chips among micro-components have been miniaturized for display miniaturization, high resolution, and cost reduction, and efforts are being made to mount the miniaturized LED chips with high speed and high precision. In particular, LEDs used in LED displays require thin-plate (film-like) LED chips with a size of 50μm×50μm or less called micro LEDs to be aligned so that the distance between adjacent chips is less than 1mm and with an accuracy of several μm. High-speed transfer of LED chips And install it.

However, in Patent Document 1, when each element is received from a wafer to a temporary substrate, etc., or when each element is transferred from the temporary substrate to another temporary substrate, etc., only the surface of the adhesive material layer is crimped on the surface side of each element Since the surface of the adhesive material layer is compressed and deformed, it is easy to apply an excessive pressing force on the surface side of each element accompanying the compressive deformation of the surface of the adhesive material layer.

In detail, when the adhesive force is applied to each element for adhesion maintenance, it is necessary to obtain the required adhesive force by compressing and deforming the adhesive material layer by a certain amount of compression force. The necessary deformation (displacement) in the compression deformation from the plane state is usually called "compression allowance" etc. If the adhesive material layer is not pressed to the surface side of each element, the compression deformation equivalent to the compression allowance is performed , You can not get the required adhesion.

Unlike rigid bodies such as metals, which are compressible (elastically deformable) as the adhesive material layer, it is difficult to perform high-precision processing due to its large dimensional error, and it is extremely difficult to fine-tune the amount of compressive deformation on the surface of each element. . Moreover, depending on the processing accuracy of the adhesive material layer and the assembly accuracy of the temporary substrate to the wafer, it is also difficult to move the adhesive material layer of the temporary substrate closer to the components on the wafer in a completely parallel state.

Therefore, when the adhesive material layer is compressed and deformed relative to the surface side of each element, due to the influence of the processing accuracy and assembly accuracy of the adhesive material layer and other changing factors, the surface side of each element is excessively deformed due to excessive pressing force. It is prone to breakage problems such as cracking or chipping. In particular, when the micro component is a brittle thin wafer, the occurrence rate of breakage becomes high, which causes a decrease in yield.

In order to solve this problem, the work transfer device of the present invention starts from the first substrate A plurality of plate-shaped workpieces including minute elements arranged on the first substrate are received and transferred to a specific position of the second substrate as a transfer target. The workpiece transfer device is characterized by including: a transfer member, It is movably arranged from a first opposing position opposite to the first substrate to a second opposing position opposing the second substrate; the adhesive part is provided on the plurality of rows arranged on the first substrate The plate-shaped workpiece is opposed to the transfer surface of the transfer member, and has an adhesive surface that can be elastically deformed in the direction facing the plurality of plate-shaped workpieces; the reaction force support portion is on the transfer surface of the transfer member The first surface of the first substrate is arranged to be more outside than the adhesive portion to protrude toward the first receiving surface that is more outside than the plurality of plate-shaped workpieces in the first surface of the first substrate, and has a reaction force surface that is harder than the adhesive surface; A contact and separation driving portion for moving the adhesive portion of the transfer member relative to the first substrate from the first opposing position to the opposing direction; and a control section for making the first contact The separation driving part performs operation control, and the adhesive force of the adhesive surface is set to be stronger than the holding force of each plate-shaped workpiece of the first holding portion of the first substrate and higher than that of the second holding portion of the second substrate The holding force of each of the plate-shaped workpieces is weak, and the control section controls as follows: by the relatively close movement of the transfer member and the first substrate based on the first contact separation driving section, the adhesion surface and the plurality of While the plate-shaped workpieces are compressed and deformed by contacting them, the plurality of plate-shaped workpieces are adhered and held. Accompanying the compression deformation of the adhesive surface, the reaction force surface abuts against the first receiving surface of the first substrate and stops based on the first The transfer member contacting and separating the driving part and the first substrate move relatively close together.

Furthermore, in order to solve this problem, the workpiece transfer chuck according to the present invention receives from the first substrate a plurality of plate-shaped workpieces including micro-elements arranged on the first substrate, and transfers them to the transfer target The specific position of the second substrate, the aforementioned workpiece transfer card The disc is characterized by comprising: a transfer member provided so as to move relatively close to the receiving position of the plurality of plate-shaped workpieces from a first opposing position opposed to the first substrate, and to move toward the receiving position The transfer of the plurality of plate-shaped workpieces to the transfer position of the second substrate is freely movable; the adhesive part is provided on the transfer surface of the transfer member facing the plurality of plate-shaped workpieces arranged on the first substrate, and It has an adhesive surface that can be elastically deformed in a direction facing the plurality of plate-shaped workpieces; and a reaction force support portion, which is provided on the outside of the transfer surface of the transfer member than the adhesive portion and faces the first In the first surface of the substrate, the first receiving surface that is more outside than the plurality of plate-shaped workpieces protrudes, and has a reaction force surface that is harder than the adhesive surface; the adhesive force of the adhesive surface is set to be higher than that of the first substrate The holding force of each plate-shaped workpiece possessed by a holding portion is stronger and weaker than the holding force of each plate-shaped workpiece possessed by the second holding portion of the second substrate. The opposing position moves relatively close to the first substrate toward the receiving position, abuts against the plurality of plate-shaped workpieces and compresses and deforms while adhering and holding the plurality of plate-shaped workpieces, and the reaction force surface is accompanied by the aforementioned The compression deformation of the adhesive surface at the receiving position abuts against the first receiving surface of the first substrate, and the transfer member stops contacting the first substrate by the reaction force facing the first receiving surface. It moves relatively close.

In addition, in order to solve this problem, the work transfer method according to the present invention receives from the first substrate a plurality of plate-shaped works including micro-elements arranged on the first substrate, and transfers them to the specified second substrate. Position, the work piece transfer method described above is characterized in that it includes the step of moving closer, so that the adhesive portion provided on the transfer surface of the transfer member opposes the plurality of plate-shaped work pieces arranged on the first substrate. The reaction force support portion and the first substrate on the transfer surface of the transfer member that are more outside than the adhesive portion In the first surface of the first surface, the first receiving surface that is more outside than the plurality of plate-shaped workpieces is placed, the transfer member is moved relatively close to the first substrate; the abutting step is moved relatively close In the adhesive portion of the transfer surface, the adhesive surface that can be elastically deformed in the direction facing the plurality of plate-shaped workpieces abuts the plurality of plate-shaped workpieces while supporting the reaction force of the transfer member The reaction force surface of the part, which is harder than the adhesive surface, is in contact with the first receiving surface of the first substrate; and the separating and moving step is to separate and move the transfer member from the first substrate, and the adhesive force of the adhesive surface is set In order to be stronger than the holding force of the plate-shaped workpieces possessed by the first holding portion of the first substrate and weaker than the holding force of the plate-shaped workpieces possessed by the second holding portion of the second substrate, the abutting step Wherein, by abutting against the plurality of plate-shaped workpieces, the adhesive surface is compressed and deformed to adhere and hold the plurality of plate-shaped workpieces, and at the same time, the reaction force accompanying the compression deformation of the adhesive surface faces the first The contact of the first receiving surface of the substrate stops the transfer member from moving closer to the first substrate.

1: Transfer parts

1a: Transfer surface

2: Adhesive part

2a: Adhesive surface

2b: base

3: Reaction force support part

3a: Reaction surface

4: The first contact separation driving part

5: Conveying drive part

6: The second contact separation driving part

7: Control Department

10: The first substrate

10a: First surface

10b: The first receiving surface

11: The first holding part

20: Second substrate

20a: second surface

20b: second receiving surface

21: Holding part (second holding part)

A: Workpiece transfer device

C: Workpiece transfer chuck

L1: first interval

L2: second interval

P1: The first opposite position

P2: Receiving location

P3: The second opposite position

P4: Handover position

W: plate-shaped workpiece

W1: Surface side

W2: back side

Fig. 1 is an explanatory diagram showing the overall structure of a work transfer device and a work transfer chuck according to an embodiment (first embodiment) of the present invention, and a "selective transfer method" as a work transfer method, Fig. 1 (a) is a longitudinal sectional front view of the initial state, Fig. 1(b) is a top view of the first substrate along the line (1B)-(1B) of Fig. 1(a), and Fig. 1(c) is taken along Fig. 1 (a) The bottom view of the transfer member of the (1C)-(1C) line.

Figure 2 is an explanatory diagram of the workpiece receiving process and the workpiece handover process, Figure 2(a) is an enlarged longitudinal sectional front view of the workpiece receiving process (abutting step), and Figure 2(b) is the workpiece handing over process (abutting step) Enlarge the front view of the longitudinal section.

Figure 3 is based on "selecting transfer method" repeatedly performing "thinning selection sequence" and "partial transfer order" Fig. 3(a) is an enlarged longitudinal sectional front view of the workpiece receiving process (abutting step), and Fig. 3(b) is an enlarged longitudinal sectional front view of the workpiece transferring process (abutting step).

Figure 4 is an explanatory diagram showing in detail the workpiece receiving process and the workpiece handover process. Figure 4(a) is a partial enlarged longitudinal sectional front view of the workpiece receiving process (abutting step), and Figure 4(b) is the workpiece handing process (abutting) Rely on the partial enlarged longitudinal section front view of step).

Fig. 5 is an explanatory diagram showing a modification of the adhesive portion, Fig. 5(a) is a longitudinal sectional front view of an initial state, and Fig. 5(b) is a longitudinal sectional front view of a workpiece receiving process (abutting step).

Fig. 6 is an explanatory diagram showing a modification of the reaction force support portion, and Figs. 6(a) to 6(c) are reduced bottom views of the transfer member made of soft material.

Fig. 7 is an explanatory diagram showing a modification of the reaction force support portion, and Figs. 7(a) to 7(c) are reduced bottom views of the transfer member made of a hard material.

8 is an explanatory diagram of the work transfer device and work transfer chuck of the embodiment of the present invention (the second embodiment), and when the "full transfer method" is adopted as the work transfer method, FIG. 8(a) is The longitudinal sectional front view of the initial state, Fig. 8(b) is an enlarged bottom view of the transfer member along the line (8B)-(8B) of Fig. 8(a), and Fig. 8(c) is the workpiece receiving process (butting against Step) enlarged longitudinal section front view.

Fig. 9 is an enlarged longitudinal sectional front view of the adhesive portion when it moves closer in a non-parallel state with respect to the plate-shaped workpiece.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

As shown in Figures 1 to 8, the workpiece transfer device A of the embodiment of the present invention is used to receive and hold (hold) a plurality of plate-shaped workpieces W arranged on the first substrate 10 from the first substrate 10, and transport them to After the second substrate 20 as the transfer target, it is transferred to the second substrate 20 The specific position of the conveying chuck device. In particular, it is an adhesive transport chuck device that holds (holds) a plurality of plate-shaped workpieces W by an adhesive member that can be used even in a vacuum atmosphere or a reduced pressure atmosphere.

That is, the work transfer device A according to the embodiment of the present invention can also be arranged in the variable pressure chamber B in which the indoor pressure is adjustable, and includes the work transfer chuck C.

In detail, the work transfer device A and the work transfer chuck C according to the embodiment of the present invention, as main constituent elements, include: The position P1 is relatively free to move toward the receiving position P2; the adhesive part 2 is provided on the transfer surface 1a of the transfer member 1 opposed to the plurality of plate-shaped workpieces W arranged on the first substrate 10; and the reaction force support part 3, The transfer surface 1a of the transfer member 1 is provided on the outside of the adhesive portion 2.

In addition, the work transfer device A according to the embodiment of the present invention, as a main component, includes: a first contact separation driving portion 4 that causes the adhesion portion 2 of the transfer member 1 to face the first substrate 10 from the first opposing position P1 Relatively approaching and separating movement; the conveying drive unit 5, which moves the transfer member 1 from the first opposed position P1 to the second opposed position P3 opposed to the second substrate 20; the second contact separating drive unit 6 , The adhesive portion 2 of the transfer member 1 is moved closer and separated from the second opposing position P3 toward the second substrate 20; and the control portion 7 controls the operation of the first contact separation driving portion 4 and the like.

In addition, the transfer member 1 is usually arranged to face the first substrate 10 or the second substrate 20 in the vertical direction. Hereinafter, the vertical facing direction is referred to as the “Z direction”. Hereinafter, the direction along the first substrate 10 or the second substrate 20 that crosses the Z direction is referred to as "XY direction".

The plurality of plate-shaped workpieces W are formed in a smooth, substantially rectangular (right-angled quadrilateral including a rectangle and a square) thin plate or film shape at least on the surface side W1 thereof, and A plurality of plate-shaped workpieces W are arranged on the first surface 10a of the first substrate 10.

As a specific example of a plurality of plate-shaped workpieces W, there are mainly 50μm×50μm or less called micro LEDs, more specifically 30μm×30μm or less, more specifically, LED chips with an angle of several tens of μm, or other micro LED chips. Miniaturized components such as devices.

The tiny components also include extremely thin fragile plates such as glass or thin-film components.

In addition, as other examples of the plurality of plate-shaped workpieces W, micro elements with an angle of less than 100 μm, fine flat bodies other than micro elements, or general-sized workpieces such as LED wafers such as an angle of 300 μm can also be included.

In the case of the example shown in the figure, a plurality of plate-shaped workpieces W are all set to the same size.

In the component mounting method described in Japanese Patent Application Laid-Open No. 2002-118124, which is the prior art of the present invention, a plurality of components (one side of about 5 μm to 100 μm) are formed on a wafer (sapphire substrate) for component formation in a specific period. Light-emitting diodes), and maintain the arrangement of a plurality of elements and separate them into individual elements.

Furthermore, in the component mounting method described in Japanese Patent Application Laid-Open No. 2002-118124, the rearrangement step of rearranging the components by manipulating the separated components includes intermittently selecting components at intervals equivalent to integer multiples of the cycle. The selection sequence is selected among the rearrangements, and the transfer step of transferring each component to the mounting substrate while maintaining the rearranged state includes a partial transfer sequence of transferring the selected component to a part of the mounting substrate.

When multiple components are mounted on the mounting substrate, a selective transfer method of repeated thinning selection sequence and partial transfer sequence is adopted.

In the thinning selection sequence, only the selected component of the arranged plural components is temporarily transferred to the temporary substrate (substrate for temporary holding) for rearrangement. In the partial transfer sequence, the temporary transfer is temporarily transferred to the temporary substrate ( The components of the substrate for temporary holding are transferred to another temporary The substrate is finally officially transferred from another temporary substrate to the mounting substrate (wiring substrate).

The plurality of plate-shaped workpieces W in the present invention correspond to the "plural components" in the component mounting method described in Japanese Patent Application Laid-Open No. 2002-118124, and the transfer member 1 of the present invention corresponds to a "temporary substrate (substrate for temporary holding)" "Or "another temporary substrate". The first substrate 10 of the present invention corresponds to "a wafer for element formation (sapphire substrate)" or the like.

In other words, the first substrate 10 referred to in the present invention is not limited to wafers for forming elements whose at least the surface side is made of sapphire or gallium arsenide as shown in FIGS. Sub-substrate.

The first surface 10a of the first substrate 10 that faces the transfer member 1 described later in the Z direction has a first holding portion 11 that temporarily fixes a plurality of plate-shaped workpieces W separated from each other in a detachable manner. The first holding portion 11 is provided on the inner side of the first surface 10a. Therefore, with respect to the inner part of the first surface 10a, the plurality of plate-shaped workpieces W are held by the first holding portion 11 so as to be unable to move while being arranged in the X direction or the Y direction in a specific period.

In addition, a first receiving surface 10b is provided at a location on the outside of the first holding portion 11 of the first surface 10a.

When the specific example of the first substrate 10 is shown in the figure, it is composed of a carrier substrate having a rectangular first surface 10a, etc., and a temporary fixing layer that becomes the first holding portion 11 is laminated on substantially the entire first surface 10a . In the inner part of the first surface 10a, a plurality of plate-shaped workpieces W are arranged in a grid shape at a specific period in the X direction and the Y direction, respectively. The first holding portion (temporary fixing layer) 11 preferably disposes an adhesive material composed of a UV curable resin or the like that can be separated by irradiation of laser light or the like so as to project toward the transfer member 1 so as to be elastically deformable in the Z direction.

Also, in the example shown in the figure, on the outer side of the surface of the first holding portion (temporary fixing layer) 11 The first receiving surface 10b is integrally formed. In addition, although not shown as another example, it is also possible to laminate only the inner part of the first surface 10a as the temporary fixing layer of the first holding portion 11, and to change the outer part of the surface of the first surface 10a to the first Receiving surface 10b.

In the present invention, the second substrate 20 corresponds to "mounting substrate (wiring substrate)" or the like.

That is, the second substrate 20 referred to in the present invention is not limited to the mounting substrate (wiring substrate) or circuit substrate as shown in FIG. 2 or FIG. 3, but also includes a carrier substrate for workpiece transportation.

The second surface 20 a of the second substrate 20 facing the transfer member 1 described later in the Z direction has a second holding portion 21 against which a plurality of plate-shaped workpieces W transported by the transfer member 1 abut. The second holding portion 21 is provided on the inner side of the second surface 20a. Therefore, with respect to the second surface 20a of the second substrate 20, the plurality of plate-shaped workpieces W are held by the second holding portion 21 in a state of being arranged in a specific period from the transfer member 1 toward the X direction or the Y direction. move.

Furthermore, a second receiving surface 20b is provided on the outside of the second holding portion 21 in the second surface 20a.

When the specific example of the second substrate 20 is shown in the figure, it is composed of a carrier substrate having a rectangular second surface 20a, etc., and a temporary fixing layer that becomes the second holding portion 21 is laminated on substantially the entire second surface 20a . The second holding portion (temporary fixing layer) 21 preferably arranges an adhesive material made of paste or the like so as to be elastically deformable in the Z direction and protrude toward the transfer member 1. At least the inner part of the temporary fixing layer is the same as the wiring electrode or the conductive material for bonding in the component mounting method described in JP-A-2002-118124, and is configured to be crimped by the back side W2 of a plurality of plate-shaped workpieces W and deformed At the same time play the role of electrical connection.

In the example shown in the figure, the outer part of the surface of the second holding part (temporary fixing layer) 21 The second receiving surface 20b is integrally formed. In addition, although not shown as another example, it is also possible to laminate the temporary fixing layer of the second holding portion 21 only on the inner part of the second surface 20a, and change the outer part of the surface of the second surface 20a to the second Receiving surface 20b.

When the workpiece transfer device A and the workpiece transfer chuck C as the first embodiment of the present invention are shown in Figs. 1 to 7, they are examples used in the above-mentioned "selective transfer method".

In the "selection of transfer method", first as the "thinning selection order", as shown in FIG. The aligned state is temporarily transferred to the adhesive portion 2 of the transfer member 1 described later and rearranged (received). Next, as the "partial transfer sequence", as shown in FIG. 2(b), the plate-shaped workpiece W received by the transfer member 1 is transported toward the second substrate 20 as the transfer target, and then transferred to the second substrate 20. The second holding portion 21 of the substrate 20 (transferring). Next, as shown in FIG. 3(a) and FIG. 3(b), the "thinning selection sequence" and the "partial transfer sequence" are repeated several times. Thereby, only the selected plate-shaped workpiece W among the plurality of plate-shaped workpieces W arranged on the first substrate 10 is intermittently received at an interval equivalent to an integer multiple of the arrangement period of each plate-shaped workpiece W in the first substrate 10 , Maintaining the interval state of an integer multiple of the arrangement period, and transferring to the second substrate 20 for rearrangement.

In addition, when the work transfer device A and the work transfer chuck C as the second embodiment of the present invention are shown in FIG. 8, the "full transfer method" is used instead of the "select transfer method".

In the "full transfer method", as shown in FIG. 8(a) and FIG. 8(c), the plurality of plate-shaped workpieces W arranged on the first substrate 10 are all kept in their aligned state and are adhered by the transfer member 1 described later部2 Received. Next, although not shown, it is conveyed and delivered toward the second substrate 20 as the transfer target.

As shown in Figures 1 to 8, the transfer member 1 is, for example, a rigid body such as metal, synthetic quartz, or ceramic, and has a controlled flatness and uniform thickness, thereby being formed to be non-warped (deflection) deformable It is composed of a flat plate or the like, and has a transfer surface 1a on one surface.

The transfer member 1 is arranged so that the transfer surface 1a is opposed to the first holding portion 11 of the first substrate 10 or the second holding portion 21 of the second substrate 20 in parallel in the Z direction, and is supported to maintain the parallel state. It can move freely in the Z direction and XY direction.

The transfer surface 1a of the transfer member 1 is formed into a rectangle or the like depending on the shape of the first surface 10a of the first substrate 10 or the second surface 20a of the second substrate 20.

The transfer surface 1a has an adhesive part 2 arranged so as to be compressible and deformable in a direction (Z direction) facing a plurality of plate-shaped workpieces W, and a reaction force support part 3 arranged outside the adhesive part 2.

The adhesive portion 2 is formed on the transfer surface 1a of a material that can be elastically deformed in the thickness direction (Z direction) of the transfer member 1, and the surface side W1 of the plurality of plate-shaped workpieces W arranged on the first substrate 10 is in the Z direction The upper end faces parallel to each other and has a smooth adhesive surface 2a.

The adhesive surface 2a of the adhesive portion 2 is arranged on the inner side of the front end surface so as to face the first holding portion 11 of the first substrate 10 or the second holding portion 21 of the second substrate 20 in the Z direction, and has a specific Adhesion. The adhesive force of the adhesive surface 2a is set to be stronger than the holding force of each plate-shaped workpiece W possessed by the first holding portion 11 of the first substrate 10, and is set to be stronger than the holding force of each plate-like workpiece W possessed by the second holding portion 21 of the second substrate 20 The holding force of the workpiece W is weak. Thereby, the plate-shaped workpiece W from the first holding portion 11 can be received to the adhesive surface 2a, and the plate-shaped workpiece W can be transferred to the second holding portion 21 from the adhesive surface 2a.

In addition, as shown in FIG. 4(a), the transfer member 1 moves relatively close to the first substrate 10 in the Z direction by the first contact separation driving portion 4 described later, so that the adhesion of the adhesive portion 2 The surface 2a is in contact with the surface side W1 of the plurality of plate-shaped workpieces W. It is configured that the adhesive portion 2 is compressed and deformed in the Z direction by the pressing force based on the subsequent close movement. The amount of compression of the adhesive portion 2 on the surface side W1 of the plurality of plate-shaped workpieces W is set so that the adhesive force required for lifting each plate-shaped workpiece W can be obtained by continuous pressure bonding of the adhesive surface 2a.

In addition, as shown in FIG. 4(b), the transfer member 1 relatively moves closer to the second substrate 20 in the Z direction by the second contact separation driving portion 6 described later, so that the back side of the plurality of plate-shaped workpieces W W2 abuts on the second holding portion 21 of the second substrate 20. It is configured that the adhesive portion 2 is compressed and deformed in the Z direction by the pressing force based on the subsequent close movement. The amount of compression of the adhesive portion 2 on the surface side W1 of the plurality of plate-shaped workpieces W is set to be required when the second holding portion 21 is adhered to the back side W2 of each plate-shaped workpiece W by continuous pressure bonding of the adhesive surface 2a The squeezing force.

Examples of the cross-sectional shape of the adhesive portion 2 include the convex shape shown in FIGS. 1 to 4, etc., or the cylindrical shape shown in FIGS. 5(a) and 5(b), or FIGS. 8(a)~ The plate shape shown in Figure 8(c), etc.

In the convex shapes shown in FIGS. 1 to 4, the base portion 2b of the adhesive portion 2 is laminated along the transfer surface 1a, and only the adhesive surface 2a partially protrudes from a part of the base portion 2b. In the columnar shape of Figs. 5(a) and 5(b), a columnar adhesive portion 2 is formed in a part of the transfer surface 1a, and the adhesive surface 2a' partially protrudes from the transfer surface 1a at the front end surface thereof. In the plate shape of Fig. 8(a) to Fig. 8(c), a flat plate-shaped adhesive portion 2 is laminated along the transfer surface 1a, and the front end surface has a smooth adhesive surface 2a".

In addition, the shape of the adhesive surface 2a is different between the "selective transfer method" and the "full transfer method" described above.

That is, in the "selection of transfer method" shown in FIGS. 1 to 7, the adhesive surface 2a is only connected to the first A plurality or one of the plate-shaped workpieces W selected from the plurality of plate-shaped workpieces W arranged on the first holding portion 11 of the substrate 10 is arranged to face each other.

In the example shown in the figure, a plurality of adhesive surfaces 2a formed to be approximately the same size as the surface side W1 of each plate-shaped workpiece W is arranged to be intermittently repositioned at intervals equivalent to an integer multiple of the arrangement period of the plurality of plate-shaped workpieces W Row (the order of thinning selection). In addition, the cross-sectional shape of the adhesive portion 2 shown in FIGS. 6(a) to 6(c) and FIGS. 7(a) to 7(c) is either a convex shape or a columnar shape.

In contrast, in the "full transfer method" shown in FIG. 8, the adhesive portion 2 is arranged so as to face the plurality of plate-shaped workpieces W arranged on the first holding portion 11 of the first substrate 10. Or one.

In the illustrated example, the cross-sectional shape of the adhesive portion 2 is a flat plate shape, and an adhesive surface 2a formed to cover all the dimensions of the surface side W1 of the plurality of plate-shaped workpieces W is arranged. In addition, although not shown as another example, the cross-sectional shape of the adhesive portion 2 can be changed from a flat plate shape to a convex shape or a cylindrical shape, and it can be formed to be approximately the same as the surface side W1 of each plate-shaped workpiece W. The plurality of adhesive surfaces 2a of the size are arranged in a grid at the same period as the plurality of plate-shaped workpieces W arranged on the first holding portion 11 of the first substrate 10.

The reaction force support portion 3 is formed on the transfer surface 1 a of a soft material having a deformation rate substantially the same as that of the elastically deformable material used as the adhesive portion 2 or a hard material having a smaller deformation rate than the elastically deformable material used as the adhesive portion 2. The reaction force support portion 3 has a smooth reaction force surface 3a before its end face facing the first receiving surface 10b of the first substrate 10 or the second receiving surface 20b of the second substrate 20 in parallel in the Z direction.

The reaction force surface 3a is arranged in parallel with the adhesion surface 2a of the adhesion portion 2 at a location on the outer side of the transfer surface 1a of the transfer member 1 than the inner portion where the adhesion portion 2 is arranged.

As shown in FIG. 4(a), the protrusion amount of the reaction force surface 3a with respect to the first receiving surface 10b is set such that the first substrate 10 and the transfer member 1 are in the Z direction by the first contact separation driving portion 4 described later When moving relatively close and the first interval L1 between the two reaches a certain dimension, the repulsive force based on the contact between the reaction force surface 3a and the first receiving surface 10b will not cause the first substrate 10 and the transfer member 1 to become The first interval L1 is smaller than a certain size. In detail, due to the relatively close movement of the first substrate 10 and the transfer member 1, the adhesive surface 2a is in contact with the surface side W1 of the plurality of plate-shaped workpieces W, and the adhesive portion 2 is compressed and deformed in the Z direction. At the moment of measurement, the compression deformation of the adhesive portion 2 is stopped. That is, it is set to prevent excessive compression of the plurality of plate-like workpieces W by the adhesive portion 2 at the time when the adhesive force required for lifting the plate-shaped workpiece W is obtained by the compression deformation of the adhesive portion 2 in the Z direction Deformation to obtain an adhesive force that conforms to the thickness of each plate-shaped workpiece W.

In addition, as shown in FIG. 4(b), the protrusion amount of the reaction force surface 3a with respect to the second receiving surface 20b is set so that the transfer member 1 and the second substrate 20 are at Z When the second interval L2 between the two reaches a certain dimension, the transfer member 1 and the second substrate will not be caused by the repulsive force based on the abutment between the reaction force surface 3a and the second receiving surface 20b. The second interval L2 of 20 is smaller than a certain size. In detail, due to the relatively close movement of the transfer member 1 and the second substrate 20, the back side W2 of the plurality of plate-shaped workpieces W abuts against the second holding portion 21 of the second substrate 20, and the adhesive portion 2 is in contact with The compression deformation of the adhesive part 2 is stopped at the time when the compression deformation is a certain amount in the Z direction. That is, it is set to prevent the adhesion of the adhesion portion 2 at the time when the pressing force required when the back side W2 of each plate-shaped workpiece W is adhered to the second holding portion 21 is obtained by compressing and deforming the adhesion portion 2 in the Z direction. Excessive compression and deformation of a plurality of plate-shaped workpieces W, thereby obtaining a pressing force corresponding to the thickness of each plate-shaped workpiece W.

Furthermore, the reaction force support portion 3 is arranged to surround the inner part of the transfer surface 1a of the transfer member 1 where the adhesive part 2 is arranged, and a part of the reaction force support part 3 has a part of the reaction force support part 3 that has a communication between the inner part and the outer part of the adhesive part 2 The airway 3b is preferable.

In addition, the size (area) of the reaction force surface 3 a in the reaction force support portion 3 differs depending on the constituent material of the reaction force support portion 3. That is, as shown in Figure 1 (c) and Figure 8 (b) or Figure 6 (a), Figure 6 (b), Figure 6 (c), the constituent material of the reaction force support portion 3 is made of the same material as the adhesive portion 2 When the elastic material of the material is integrally formed or integrally formed, the adhesive part 2 and the reaction force support part 3 can be replaced at the same time as the adhesive part 2 deteriorates over time.

As the shape of the reaction force support portion 3 made of a soft material, the trapezoidal shape shown in Fig. 1(c) and Fig. 8(b), the long rectangular shape shown in Fig. 6(a), or the figure The short rectangular shape shown in 6(b), or the thick L-shaped shape shown in Fig. 6(c), etc.

In the trapezoidal shape of FIGS. 1(c) and 8(b), a plurality of (4) trapezoidal reaction force support members 31 are scattered along the outer edge of the transfer surface 1a formed into a rectangle or the like. Between the plurality of reaction force support members 31 and at the corners of the transfer surface 1a, air passages 3b are arranged. In the long rectangular shape of Fig. 6(a), a plurality of (4) long rectangular reaction force support members 32 are dispersedly arranged with the air passage 3b interposed therebetween. In the short rectangular shape of FIG. 6(b), a plurality of (8) short rectangular reaction force support members 33 are dispersedly arranged with the air passage 3b interposed therebetween. In the thick L-shape of FIG. 6(c), plural (4) thick L-shaped reaction force support members 34 are arranged with the air passage 3b therebetween.

In addition, although it is not shown as another example, the shape, number, etc. of the reaction force support part 3 can be changed to a shape, number, etc. other than the example shown in the figure.

In addition, when the constituent material of the reaction force support portion 3 is a hard material with a smaller deformation rate than the elastically deformable material that becomes the adhesive portion 2, as shown in Figs. 7(a), 7(b), and Figs. As shown in 7(c), the deformation rate in the Z direction is small, so even if the total receiving area is reduced due to the downsizing of the reaction force support portion 3, a specific repulsive force can be obtained.

As the shape of the reaction force supporting portion 3 made of a hard material, the right-angled rectangular shape shown in Figure 7(a), the rounded shape shown in Figure 7(b), or the rounded corner shape shown in Figure 7(b), or the shape shown in Figure 7(c) can be cited. The thin L shape and so on.

In the right-angled rectangular shape of FIG. 7(a), a plurality of (4) rectangular-shaped reaction force support members 35 are dispersedly arranged at 4 corners of the transfer surface 1a with the air passage 3b interposed therebetween. In the rounded shape of FIG. 7(b), a plurality of (8) rounded-shaped reaction force support members 36 are arranged dispersedly between the four corners of the transfer surface 1a and the outer edge with the air passage 3b therebetween. Location. In the thin L-shape of FIG. 7(c), a plurality of (4) thin L-shaped reaction force support members 37 are dispersedly arranged with the air passage 3b therebetween.

In addition, although it is not shown as another example, the shape, number, etc. of the reaction force support part 3 can be changed to a shape, number, etc. other than the example shown in the figure.

The first contact separation driving portion 4 is formed from a plurality of plates arranged on the adhesion portion 2 of the transfer member 1 from the first opposing position P1 of the transfer member 1 away from the first substrate 10 to the adhesion portion 2 and the first substrate 10 The surface side W1 of the workpiece W is in contact with (crimped) the receiving position P2, and is composed of an actuator that moves relatively close and moves apart in the Z direction.

The actuator, etc., which becomes the first contact separation driving unit 4, is controlled by the control unit 7 to be described later to operate either one of the transfer member 1 or the first substrate 10, or both the transfer member 1 and the first substrate 10 A method in which the transfer surface 1a (adhesive surface 2a, reaction force surface 3a) and the first surface 10a (first holding portion 11, first receiving surface 10b) are kept parallel to each other in the Z direction. move.

With the first contact separation driving part 4, the adhesive part 2 of the transfer member 1 is as shown in Figure 4(a) As shown, moving from the first opposite position P1 toward the receiving position P2 to receive a plurality of plate-shaped workpieces W, and moving separately from the receiving position P2 toward the first opposite position P1 after finishing receiving. Specifically, at the receiving position P2, the adhesive surface 2a1 of the adhesive portion 2 abuts (press-contacts) the surface side W1 of the plurality of plate-shaped workpieces W, and the adhesive portion 2 is compressed and deformed. At approximately the same time, the reaction force support portion 3 abuts (crimps) the first receiving surface 10b of the first substrate 10 and stops further the transfer member 1 and the first substrate 10 based on the first contact separation driving portion 4 Move relatively close.

When the specific example of the first contact separation driving unit 4 is the example shown in FIGS. 1 to 8, the transfer member 1 is lowered toward the first substrate 10.

In addition, although not shown as another example, it is possible to make changes such as raising the first substrate 10 instead of the transfer member 1, or moving both the transfer member 1 and the first substrate 10 closer to or apart from each other.

The conveying and driving section 5 moves the adhesive portion 2 of the transfer member 1 from the first opposing position P1 where the transfer member 1 is away from the first substrate 10 to the second opposing position P3 where the transfer member 1 is away from the second substrate 20. A drive source that moves relative to the X direction or Y direction that crosses the Z direction.

The driving source that becomes the conveying driving unit 5 is composed of an actuator or the like, and is controlled by the control unit 7 described later to operate as follows: the transfer member 1 or any one of the first substrate 10 and the second substrate 20 separately arranged, or the rotation The imprint member 1 and both the first substrate 10 and the second substrate 20 move relatively in the X direction, the Y direction, or the like.

When the specific example of the conveyance driving unit 5 is the example shown in FIGS. 1 to 8, only the transfer member 1 is reciprocated from the first substrate 10 toward the second substrate 20.

Also, although not shown as another example, it is also possible to replace the transfer member 1 with the first The first substrate 10 and the second substrate 20 are moved, or the transfer member 1 and the first substrate 10 and the second substrate 20 are moved mutually, and other changes are made.

The second contact separation driving portion 6 is constituted by an actuator or the like, which causes the adhesive portion 2 of the transfer member 1 to move from the second opposed position P3 of the transfer member 1 away from the second substrate 20 to being received by the adhesive portion 2 The transfer position P4 at which the back side W2 of the plurality of plate-shaped workpieces W and the second substrate 20 are in contact (crimped) relatively moves closer and apart in the Z direction.

The actuator, etc., which becomes the second contact separation drive unit 6 is controlled by the control unit 7 described later to operate either one of the transfer member 1 or the second substrate 20 or both the transfer member 1 and the second substrate 20 A method in which the transfer surface 1a (adhesive surface 2a, reaction force surface 3a) and the second surface 20a (second holding portion 21, second receiving surface 20b) are kept parallel to each other in the Z direction. move.

The plurality of plate-shaped workpieces W received by the adhesive portion 2 of the transfer member 1 by the second contact separation driving portion 6 move closer to the delivery position P4 from the second opposing position P3 as shown in FIG. 4(b) The transfer of a plurality of plate-shaped workpieces W is performed, and after the transfer is completed, the transfer position P4 is separated and moved toward the second opposing position P3. In detail, at the handover position P4, the back side W2 of the plurality of plate-shaped workpieces W received by the adhesive surface 2a of the adhesive portion 2 abuts (press-bonds) the second holding portion 21 of the second substrate 20 to make the adhesive portion 2 Compression deformation. At approximately the same time, the reaction force support portion 3 abuts (crimps) the second receiving surface 20b of the second substrate 20 and stops further contact between the transfer member 1 and the second substrate 20 based on the second contact separation driving portion 6 Move relatively close.

When the specific example of the second contact separation driving unit 6 is the example shown in FIGS. 1 to 8, the transfer member 1 is lowered toward the second substrate 20.

Also, as another example, although not shown in the figure, it is possible to replace the transfer member 1 and raise the first The second substrate 20, or the transfer member 1 and the second substrate 20 may be moved closer to or separated from each other.

The control unit 7 is a control circuit (not shown) that is electrically connected with the first contact separation drive unit 4, the transport drive unit 5, and the second contact separation drive unit 6, as well as the indoor pressure adjustment mechanism of the transformation chamber B, etc. The controller. The controllers that become the control unit 7 sequentially perform operation control at preset timings in accordance with a program preset in the control circuit.

The program of the control circuit set in the control section 7 is described as a work transfer method using the work transfer device A and the work transfer chuck C.

The workpiece transfer method of the workpiece transfer device A and the workpiece transfer chuck C based on the embodiment of the present invention includes the workpiece receiving process of receiving the workpiece from the first substrate 10 to the transfer member 1 as the main steps and the slave transfer The process of transferring the workpiece to the second substrate 20 by the printing member 1.

The workpiece receiving process includes: an approaching moving step, making the adhesive portion 2 of the transfer member 1 move closer to the first holding portion 11 of the first substrate 10 along with the relative approaching movement of the first substrate 10 and the transfer member 1, and make The reaction force supporting portion 3 of the transfer member 1 moves closer to the first receiving surface 10b of the first substrate 10; A receiving surface 10b abuts; and a separating and moving step, which separates and moves the transfer member 1 from the first substrate 10.

In the approaching and moving step of the workpiece receiving process, the adhesion portion 2 of the transfer member 1 is moved relatively close to the plurality of plate-shaped workpieces W arranged on the first substrate 10 in the Z direction by the first contact separation driving portion 4 . At approximately the same time, the reaction force support portion 3 of the transfer member 1 is moved relatively close to the first receiving surface 10b of the first substrate 10 in the Z direction.

In the abutting step of the workpiece receiving process, the adhesion portion 2 of the transfer member 1 is abutted (pressure-bonded) with the surface side W1 of the plurality of plate-shaped workpieces W by the subsequent first contact separation driving portion 4 to perform adhesion. Therefore, the surface side W1 of a plurality of plate-shaped workpieces W is adhered and held on the adhesive surface 2a of the adhesive portion 2.

Then, at approximately the same time, the reaction force support portion 3 of the transfer member 1 is brought into abutment (pressure contact) with the first receiving surface 10 b of the first substrate 10. Therefore, the further relative movement of the transfer member 1 and the first substrate 10 by the first contact separation driving unit 4 is stopped.

In the separation and movement step of the workpiece receiving process, the transfer member 1 is separated and moved from the first substrate 10 by the first contact separation driving part 4. At this time, the adhesive force of the adhesive surface 2a is set to be stronger than the holding force of each plate-shaped workpiece W possessed by the first holding portion 11 of the first substrate 10. Therefore, the plurality of plates received by the adhesive portion 2 of the first substrate 10 The back side W2 of the shaped workpiece W is peeled off from the first holding portion 11 of the first substrate 10 to complete the workpiece receiving process.

The work transfer process includes: an approaching movement step, as the transfer member 1 moves closer to the second substrate 20, the adhesive portion 2 of the transfer member 1 moves closer to the second holding portion 21 of the second substrate 20, and transfers The reaction force support portion 3 of the member 1 moves closer to the second receiving surface 20b of the second substrate 20; in the abutting step, the adhesive portion 2 is brought into contact with the second holding portion 21 of the second substrate 20 and the reaction force support portion 3 Abutting with the second receiving surface 20b; and the separating and moving step, separating and moving the transfer member 1 from the second substrate 20.

In the approaching moving step of the workpiece handover process, the second contact separation driving portion 6 causes the plurality of plate-shaped workpieces W received by the adhesive portion 2 of the transfer member 1 to be at Z relative to the second holding portion 21 of the second substrate 20 Move relatively close in the direction. At approximately the same time, the reaction force support portion 3 of the transfer member 1 is moved relatively close to the second receiving surface 20b of the second substrate 20 in the Z direction.

In the abutment step of the workpiece transfer process, the second substrate is separated from the back side W2 of the plurality of plate-shaped workpieces W received by the adhesive surface 2a of the adhesive portion 2 of the transfer member 1 by the subsequent second contact and separation driving portion 6 The second holding portion 21 of 20 abuts (pressure-bonds) to perform adhesion. Therefore, the back side W2 of the plurality of plate-shaped workpieces W is adhered and held by the second holding portion 21 of the second substrate 20.

Next, at approximately the same timing, the reaction force support portion 3 of the transfer member 1 is brought into contact with the second receiving surface 20 b of the second substrate 20 (pressure contact). Therefore, the further relative movement of the transfer member 1 and the second substrate 20 by the second contact separation driving portion 6 is stopped.

In the separation and movement step of the workpiece transfer process, the transfer member 1 is separated and moved from the second substrate 20 by the second contact separation driving part 6. At this time, the adhesive force of the adhesive surface 2a is set to be weaker than the holding force of each plate-shaped workpiece W possessed by the second holding portion 21 of the second substrate 20, and therefore the adhesive portion 2 of the first substrate 10 is held from the second holding part 21 to the second holding part. The surface side W1 of the plurality of plate-shaped workpieces W in the second holding portion 21 of the substrate 20 is peeled off, and the workpiece transfer process is completed.

On the other hand, the adhesive portion 2 is compressed and deformed in the Z direction as the transfer member 1 and the first substrate 10 or the second substrate 20 come into contact with each of the plate-shaped workpieces (compression contact), but gradually approaches the adhesion. The elastic deformation limit of part 2 eventually leads to reaching the elastic deformation limit. The adhesive portion 2 exceeding the elastic deformation limit cannot be compressed further, and the subsequent close movement becomes an excessive pressing force, which causes the plate-shaped workpiece W to be excessively deformed and becomes a cause of damage such as cracking or chipping.

In order to solve this problem, the deformation displacement when a compressive force is applied to the adhesive portion 2 by the close movement of the transfer member 1 and the first substrate 10 or the second substrate 20 and the compression force obtained by the deformation displacement are measured in advance. Correlation, and it is better to set the deformation displacement of the adhesive portion 2 in an appropriate range when compressed according to the measured value. That is, with respect to the adhesive part 2, the step It is better to set the reaction force support portion 3 in stages.

The compressive force of the adhesive part 2 narrows the distance between the transfer member 1 and the first substrate 10 due to the close movement of the first contact separation driving part 4, and the adhesive surface 2a of the adhesive part 2 and the surface of the plurality of plate-like workpieces W The side W1 comes into contact with each other. This compressive force can be obtained by installing a load sensor (not shown) such as a load cell on either the first substrate 10 or the transfer member 1, or by monitoring the driving torque of the first contact separation driving part 4 Measure.

However, when the plurality of plate-shaped workpieces W are micro-elements such as micro LEDs, the contact surface with the adhesive part 2 is positively small. Therefore, the deformation displacement or compressive force when the adhesive part 2 is compressed is also small, so it is extremely difficult to detect.

Therefore, in the work transfer device A and the work transfer chuck C of the embodiment of the present invention, the reaction force support portion 3 is provided on the transfer surface 1a of the transfer member 1 on the outside of the adhesive portion 2, and the transfer member 1 When moving closer to the first substrate 10, the adhesive surface 2a of the adhesive portion 2 is in contact with the surface side W1 of the plurality of plate-shaped workpieces W, and the reaction force support portion 3 is in contact with the first receiving surface 10b of the first substrate 10 catch. At this time, it is necessary to set the contact area between the reaction force support portion 3 and the first receiving surface 10b to an area that can also be detected by a load sensor such as a load cell or the driving torque of the first contact separation driving portion 4.

That is, the pressure-receiving area of the adhesive portion 2 of the transfer member 1 with respect to the plurality of plate-shaped workpieces W of the first substrate 10 is enlarged, whereby the compressive stress per unit area is reduced and at the same time it becomes easy to generate a reaction force.

Thereby, it is possible to accurately detect the deformation displacement or compression force of the adhesive part 2 when compressed, and it is possible to set the deformation displacement during compression of the adhesive part 2 within an appropriate range based on the correlation measured in advance.

Next, the transfer surface 1a of the transfer member 1 is more outside than the adhesive part 2. The function of disposing the reaction force support part 3 will be described.

. In the approaching movement step of the workpiece receiving process, even when it is difficult to obtain a reaction force as when the adhesive part 2 abuts a few plate-shaped workpieces W, after the adhesive part 2 abuts the few plate-shaped workpieces W, the reaction force support part 3 It abuts against the first receiving surface 10b of the first substrate 10, thereby generating a significant reaction force and can accurately detect the contact displacement with a small number of plate-shaped workpieces W.

For example, as shown in Figure 2 (a), Figure 2 (b) and Figure 3 (a), Figure 3 (b) as shown in the "select the transfer method", even if the adhesive surface 2a of the adhesive portion 2 is only connected to the first When a small number of plate-shaped workpieces W among the plurality of plate-shaped workpieces W arranged on the substrate 10 abut, the contact displacement between the adhesive surface 2a of the adhesive portion 2 and the surface side W1 of the small number of plate-shaped workpieces W can also be accurately detected.

. In the abutment step of the workpiece receiving process, even when the adhesive portion 2 excessively presses a plurality of plate-shaped workpieces W, the reaction force based on the support portion 3 and the first receiving surface 10b is generated relative to the pressing based on the adhesive portion 2 The reaction force of the contact becomes the compression resistance relative to the squeezing force.

Thereby, it is possible to prevent an excessive compressive force from being applied to each plate-shaped workpiece W, and it is also possible to prevent plastic deformation, cracks, or breakage of the adhesive portion 2 of the fine structure.

. In the approaching moving step of the workpiece receiving process, as shown in FIG. 9, even when the adhesive portion 2 moves closer to the plurality of plate-shaped workpieces W in a non-parallel state, the reaction force support portion 3 is also attached to the plate-shaped workpiece W Before the part 2 comes into contact with the first receiving surface 10b, it comes into contact with the first receiving surface 10b and receives a pressing force, thereby generating a reaction force, and it is possible to accurately detect whether or not the pressing force is abnormal.

In the example shown in FIG. 9, the reaction force support portion 3 is formed in a frame shape along the outer edge of the transfer surface 1 a of the transfer member 1. As the adhesive surface 2a of the transfer member 1 and the reaction force support portion 3 move closer while being inclined with respect to the first receiving surface 10b of the first substrate 10, the reaction The outer edge 3a' of the reaction force surface 3a of the force supporting portion 3 first abuts the first receiving surface 10b. Therefore, the inclination of the transfer member 1 with respect to the first substrate 10 can be detected in advance.

In addition, it can also be configured to propagate minute vibrations from the transfer member 1 to the adhesion surface 2a of the adhesion portion 2 and the like when the respective plate-shaped workpieces W are received or delivered by the pressure bonding of the adhesion portion 2.

In addition, even if the surface side W1 of each plate-shaped workpiece W has fine unevenness, and each plate-shaped workpiece W is a micro-LED or a thin fragile plate or other small element or a flat body, it has fine unevenness on the surface side W1. The fact is immutable. In the same way, the adhesive surface 2a of the adhesive portion 2 also has fine irregularities.

In addition, the adhesive material constituting the adhesive surface 2a is softer than the surface side W1 of each plate-shaped workpiece W and is easily deformed.

Therefore, for the following reasons, when the surface side W1 of the plurality of plate-shaped workpieces W arranged on the first substrate 10 is pressed against the adhesive surface 2a of the adhesive portion 2 (the abutment step of the workpiece receiving process), each The surface side W1 of the plate-shaped workpiece W and the adhesive surface 2a of the adhesive portion 2 are adhered with more than necessary strength, and it is difficult to peel off in the subsequent transfer process (the abutment step of the workpiece transfer process).

As the primary cause of the difficulty in peeling, the fine concavities and convexities of the adhesive surface 2a of the adhesive portion 2 are elastically compressed and deformed by the external pressing force, which causes the air in the fine concavities and convexities of the adhesive surface 2a to be squeezed out. After the pressing force is released, the fine irregularities of the adhesive surface 2a are restored (expanded) and deformed. Therefore, a decompression space is generated between the fine irregularities on the surface side W1 of each plate-shaped workpiece W and it is difficult to peel off.

As the second reason for the difficulty in peeling, the surface side W1 of each plate-shaped workpiece W is buried in the soft adhesive surface 2a of the adhesive portion 2 due to the external pressing force. Therefore, the adhesion of the adhesive surface 2a The material is wound around the outer peripheral edge of each plate-shaped workpiece W and is difficult to peel off.

Therefore, the operation of the work transfer device A and the work transfer chuck C of the embodiment of the present invention can also be the "atmospheric operation" performed in an atmospheric atmosphere, but the "reduced pressure operation" performed under a reduced pressure atmosphere is Better.

In the "decompression operation", as shown in Figure 2 or Figure 3, the workpiece transfer device A is arranged inside the variable pressure chamber B with adjustable indoor pressure, and the first contact separation drive is performed in the chamber of the variable pressure chamber B The receiving of each plate-shaped work W from the first substrate 10 to the transfer member 1 in the section 4, the transport of each plate-shaped work W by the conveying drive section 5, and the secondary contact separation drive section 6 from the transfer member 1 The transfer to the second substrate 20 is preferable.

The variable pressure chamber B is formed inside a chamber (not shown), and has a chamber pressure adjusting mechanism (not shown) that adjusts the interior of the variable pressure chamber B from an atmospheric atmosphere to a reduced-pressure atmosphere with a certain degree of vacuum.

The chamber pressure adjustment mechanism is composed of an exhaust source such as a vacuum pump, and is operated and controlled by the control unit 7.

As a control example of the chamber pressure adjusting mechanism, it is preferable to control the inside of the variable pressure chamber B to a first reduced pressure atmosphere whose pressure is lower than the atmospheric pressure when each plate-shaped workpiece W is received. It is preferable to control the atmospheric pressure when carrying out the transfer to the second substrate 20 and when it is handed over. When peeling the adhesive part 2 from each plate-shaped workpiece W, it is preferable to control it to the 2nd reduced pressure atmosphere whose pressure is the same as or lower than the 1st reduced pressure atmosphere.

As a specific example of the first reduced-pressure atmosphere or the second reduced-pressure atmosphere, it is set such that the first reduced-pressure atmosphere is approximately 90Kpa, the second reduced-pressure atmosphere is approximately 80Kpa, etc., gradually decrease from the atmospheric pressure (approximately 101.3KPa) P0 by approximately 10Kpa Left and right are better.

According to the work transfer device A, the work transfer chuck C, and the work transfer method of this embodiment of the present invention, the transfer structure is The component 1 moves closer to the first substrate 10 (Z direction) from the first opposing position P1 away from the first substrate 10.

As a result, the adhesive portion 2 (adhesive surface 2a) of the transfer member 1 abuts on a plurality of plate-shaped workpieces W (surface side W1), and the adhesive portion 2 is compressed and deformed with subsequent close movement. Along with this compression deformation, the adhesive portion 2 (adhesive surface 2a) and the plurality of plate-shaped workpieces W (surface side W1) are continuously press-bonded, whereby the plurality of plate-shaped workpieces W (surface side W1) are adhered and held on the adhesive portion 2 (adhesive Face 2a).

At approximately the same time as the adhesion of the workpiece, the reaction force supporting portion 3 abuts the first receiving surface 10b of the first substrate 10, and the transfer member 1 of the driving portion 4 is separated from the first substrate 10 based on the first contact. Move closer and stop relatively. Therefore, excessive compression and deformation of the adhesive portion 2 to the plurality of plate-shaped workpieces W (surface side W1) can be avoided, and the adhesive force corresponding to the thickness of each plate-shaped workpiece W can be obtained.

After that, by the first contact separation driving unit 4, the transfer member 1 and the first substrate 10 (in the Z direction) are relatively separated and moved, and the plurality of plate-shaped workpieces W (rear side W2) are removed from the first substrate 10 The first surface 10a peels off. Therefore, a plurality of plate-shaped workpieces W are received from the first substrate 10 to the transfer member 1.

Therefore, it is possible to prevent the plurality of plate-shaped workpieces W from being excessively deformed due to excessive compression of the adhesive portion 2 when receiving the plurality of plate-shaped workpieces W from the first substrate 10 to the transfer member 1.

As a result, compared with the conventional technique in which only the surface of the adhesive material layer is crimped on the surface side of each element when receiving each element, and the surface of the adhesive material layer is compressed and deformed, the plurality of plate-shaped workpieces W can be removed from the first A substrate 10 receives the transfer member 1.

Therefore, even if the plurality of plate-shaped workpieces W are micro-elements such as micro LEDs or thin fragile plates, the occurrence rate of breakage accompanying workpiece reception can be reduced and the yield rate can be improved. improve.

Moreover, when the adhesive part 2 and the reaction force support part 3 are integrally molded or integrally formed with the same material, the adhesive can be replaced at the same time due to wear or decrease in adhesion or flatness accompanying the deterioration of the adhesive part 2 over time. Section 2 and reaction force support section 3. Thereby, the maintenance management of the adhesive part 2 and the reaction force support part 3 becomes easy and it is excellent in convenience.

In addition, when the reaction force supporting portion 3 is formed of a material harder than the constituent material of the adhesive portion 2, the deformation rate in the Z direction is smaller than when the reaction force supporting portion 3 is formed of the same soft material as the adhesive portion 2, so even The contact area of the reaction force support part 3 is relatively narrow and a specific repulsive force can be obtained. Thereby, the transfer surface 1a of the transfer member 1 can be made compact and reduced in weight.

In addition, due to the close movement of the transfer member 1 and the first substrate 10, the adhesive surface 2a of the adhesive portion 2 abuts the surface side W1 of the plurality of plate-shaped workpieces W and simultaneously causes the reaction force support portion 3 and the second When the first receiving surface 10b of a substrate 10 abuts, the deformation displacement and compression force of the adhesive portion 2 when compressed can be accurately detected. Thereby, the deformation displacement when the adhesive portion 2 is compressed can be set in an appropriate range based on the correlation measured in advance, and the breakage rate of the plate-shaped workpiece W can be reliably reduced.

In particular, it is preferable to include: a conveying drive unit 5 that causes the adhesive portion 2 of the transfer member 1 to move from the first opposing position P1 to the second opposing position P3 in a direction (X Direction or Y direction); and the second contact separation driving portion 6 makes the adhesive portion 2 of the transfer member 1 relatively close to the second substrate 20 from the second opposing position P3 toward the opposing direction (Z direction) Moving and separating, the second surface 20a of the second substrate 20 has: a plurality of holding portions (second holding portions) 21 of the plate-shaped workpieces W, which are provided to face the transfer member 1; and a second receiving surface 20b, Set on the outside than the holding part 21, the control part 7 is as follows Row control: The plurality of plate-shaped workpieces W received by the adhesive portion 2 and the holding portion ( The second holding portion) 21 abuts to compress and deform the adhesive portion 2, and the reaction force support portion 3 abuts against the second receiving surface 20b of the second substrate 20 to stop the transfer member 1 based on the second contact separation driving portion 6 It moves relatively close to the second substrate 20.

At this time, after receiving a plurality of plate-shaped workpieces W from the first substrate 10 to the transfer member 1, by the conveying drive unit 5, the transfer member 1 moves from the first opposed position P1 to the second opposed position P3 (at X direction or Y direction) conveying. Then, by the second contact separation driving portion 6, the transfer member 1 moves closer to the second substrate 20 (in the Z direction) from the second opposed position P3 away from the second substrate 20.

Thereby, the plurality of plate-shaped workpieces W (rear side W2) received by the plurality of adhesive portions 2 of the transfer member 1 abuts against the holding portion (second holding portion) 21 of the second substrate 20, and the subsequent approaching movement , A plurality of plate-shaped workpieces W (back side W2) and the holding portion (second holding portion) 21 of the second substrate 20 are crimped, whereby the plurality of plate-shaped workpieces W (back side W2) are held (holded) by adhesion or the like ) On the holding portion (second holding portion) 21 of the second substrate 20.

At approximately the same time as the workpiece is held, the reaction force support portion 3 abuts against the second receiving surface 20b of the second substrate 20, and the transfer member 1 and the second substrate 20 of the second substrate 20 are separated based on the second contact and separation. Move closer and stop. Therefore, excessive compression and deformation of the adhesive portion 2 with respect to the plurality of plate-shaped workpieces W (surface side W1) is avoided, and the excessive repulsive force of the adhesive portion 2 prevents the plate-shaped workpieces W (rear side W2) from being excessively pushed To the holding portion (second holding portion) 21 of the second substrate 20.

After that, by the second contact separation driving portion 6, the transfer member 1 and the second substrate 20 (in the Z direction) relatively separate and move, and the adhesive portion 2 (adhesive surface 2a) of the transfer member 1 is moved from a plurality of The plate-shaped workpiece W (surface side W1) peels off. Therefore, a plurality of plate-shaped workpieces W are transferred from the transfer member 1 to the second substrate 20.

Therefore, it is possible to prevent the plurality of plate-shaped workpieces W from being excessively deformed due to excessive compression of the adhesive portion 2 when the plurality of plate-shaped workpieces W are transferred from the transfer member 1 to the second substrate 20.

As a result, compared with the conventional technique in which only the surface of the adhesive material layer is crimped on the surface side of each element when receiving each element, the surface of the adhesive material layer is compressed and deformed. The printing member 1 receives the second member 20.

Therefore, even if the plurality of plate-shaped workpieces W are micro-elements such as micro LEDs or thin brittle small plates, the occurrence rate of breakage accompanying workpiece transfer can be reduced, and the yield can be improved.

Furthermore, the reaction force support portion 3 of the transfer member 1 has a reaction force surface 3a that is parallel to the first receiving surface 10b of the first substrate 10 or the second receiving surface 20b of the second substrate 20, and the reaction force surface 3a is arranged It is preferable to be parallel to the adhesive surface 2a of the adhesive part 2 and to surround the arrangement part of the adhesive part 2.

At this time, due to the relatively close movement of the transfer member 1 and the first substrate 10, the reaction force surface 3a of the reaction force support portion 3 is connected to the first receiving surface 10b of the first substrate 10 and the second substrate 20. The receiving surface 20b abuts, so that the transfer member 1 is controlled via the reaction force support portion 3 in a posture imitating the first receiving surface 10b and the second receiving surface 20b.

Therefore, the adhesive surface 2a of the adhesive part 2 parallel to the reaction force surface 3a is contact|abutted in parallel with the several plate-shaped workpiece|work W (surface side W1), and is press-contacted.

Therefore, it is possible to prevent the plurality of plate-shaped workpieces W from being excessively deformed due to excessive flattening of the adhesive portion 2 when receiving or transferring the plurality of plate-shaped workpieces W.

As a result, even when the dimensional error is large, it is difficult to perform high-precision processing elasticity When the adhesive part 2 is made of materials, or the transfer member 1 has poor assembly accuracy with respect to the plurality of plate-shaped workpieces W arranged on the first substrate 10, the adhesive part 2 can also be used to squeeze the plurality of plate-shaped workpieces W in parallel. .

Therefore, it is possible to reliably reduce the occurrence rate of breakage accompanying workpiece reception or workpiece delivery, thereby achieving a further improvement in yield. It can receive reliably while reducing the incidence of breakage, thereby achieving an increase in yield.

In addition, the reaction force surface 3a is arranged to surround the placement portion of the adhesive portion 2. Therefore, if the transfer member 1 and the first substrate 10 move closer together, the reaction force surface 3a of the reaction force support portion 3 and the second When the first receiving surface 10b of the substrate 10 or the second receiving surface 20b of the second substrate 20 abuts, the placement portion (inner portion) of the adhesive portion 2 surrounded by the reaction force surface 3a becomes airtight. In this airtight state, due to the compression deformation of the adhesive portion 2, the internal pressure of the inner part surrounded by the reaction force surface 3a may increase excessively.

Therefore, it is preferable that a part of the reaction force support portion 3 has an air passage 3b communicating with the inside and outside of the placement portion of the adhesive portion 2. At this time, even if the internal pressure of the placement portion (inner portion) of the adhesive portion 2 surrounded by the reaction force surface 3a rises, it can be drawn to the outer portion through the air passage 3b to prevent excessive internal pressure rise.

In addition, the transfer member 1 and the adhesive portion 2 and the first substrate 10 or the second substrate 20 are arranged inside the pressure transformation chamber B. The pressure transformation chamber B has a chamber pressure adjustment mechanism controlled by the operation of the control unit 7. The control unit 7 With the chamber pressure adjusting mechanism, when a plurality of plate-shaped workpieces W are received by the adhesive part 2, the variable pressure chamber B is controlled to a first reduced pressure atmosphere with a pressure lower than the atmospheric pressure, and the second contact separation driving part 6 When it is transferred to the second substrate 20, it returns to the atmospheric pressure, and when the adhesive portion 2 is peeled from the plurality of plate-shaped workpieces W by the second contact separation drive portion 6, the pressure is controlled to be the same as or lower than the first pressure-reduced atmosphere. Second, a reduced pressure atmosphere is preferred.

At this time, even if the surface side W1 of the plurality of plate-shaped workpieces W and the adhesion surface 2a of the adhesive portion 2 are elastically compressed and deformed due to the pressing force, or the surface of the plurality of plate-shaped workpieces W is caused by the pressing force The side W1 is embedded in the adhesive surface 2a of the soft adhesive portion 2 so that the adhesive material of the adhesive portion 2 is coiled around the outer peripheral edge of each plate-shaped workpiece W, and it is not difficult to peel off later.

Therefore, by controlling the internal pressure of the variable pressure chamber B, it is possible to more reliably perform adhesion and peeling of a plurality of plate-shaped workpieces W.

As a result, it is possible to reliably receive a plurality of plate-shaped workpieces W from the first substrate 10 and to be reliably delivered to a specific position of the second substrate 20, and the delivery accuracy can be further improved.

In addition, in the illustrated example in the above embodiment, the case where the first substrate 10 is composed of a carrier substrate having a rectangular first surface 10a has been described, but it is not limited to this, and the first substrate may be 10 Change to wafers for element formation, etc.

Furthermore, the case where the second substrate 20 is composed of a carrier substrate having a rectangular second surface 20a has been described, but it is not limited to this, and the second substrate 20 may be changed to a mounting substrate (wiring substrate) Or circuit boards, etc.

Even in these cases, the same functions and advantages as the first and second embodiments described above can be obtained.

1a: Transfer surface

2: Adhesive part

2a: Adhesive surface

2b: base

3: Reaction force support part

3a: Reaction surface

4: The first contact separation driving part

6: The second contact separation driving part

10: The first substrate

10a: First surface

10b: The first receiving surface

11: The first holding part

20: Second substrate

20a: second surface

20b: second receiving surface

21: Holding part (second holding part)

A: Workpiece transfer device

C: Workpiece transfer chuck

L1: first interval

L2: second interval

P1: The first opposite position

P2: Receiving location

P3: The second opposite position

P4: Handover position

W: plate-shaped workpiece

W1: Surface side

W2: back side

Claims (5)

A work transfer device, characterized in that it receives from a first substrate a plurality of plate-shaped work pieces including tiny elements arranged on the first substrate, and transfers them to a specific position of a second substrate as a transfer target, and have: The transfer member is movably arranged from a first opposed position opposed to the first substrate to a second opposed position opposed to the second substrate; The adhesive portion is provided on the transfer surface of the transfer member facing the plurality of plate-shaped workpieces arranged on the first substrate, and has an elastically deformable direction in a direction facing the plurality of plate-shaped workpieces Adhesive surface A reaction force support portion is provided on the transfer surface of the transfer member on the outside than the adhesive portion, and faces the first receiving surface on the first surface of the first substrate that is on the outside than the plurality of plate-shaped workpieces It is protruding and has a reaction force surface that is harder than the aforementioned adhesive surface; A first contact and separation driving portion for moving the adhesive portion of the transfer member relative to the first substrate from the first opposing position to the opposing direction relatively close and separated; and The control part, which controls the operation of the aforementioned first contact separation driving part, The adhesive force of the adhesive surface is set to be stronger than the holding force of the plate-shaped workpieces of the first holding portion of the first substrate and higher than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate. Weak, The control unit performs control as follows: by the relatively close movement of the transfer member and the first substrate based on the first contact separation drive unit, the adhesive surface is compressed and deformed by abutting against the plurality of plate-shaped workpieces At the same time, the plurality of plate-shaped workpieces are adhered and held. Accompanying the compression and deformation of the adhesive surface, the reaction force surface abuts on the first receiving surface of the first substrate and stops the transfer member based on the first contact separation driving portion Move relatively close to the aforementioned first substrate. Such as the workpiece transfer device of claim 1, which has: A conveying drive unit that moves the adhesive portion of the transfer member from the first opposed position to the second opposed position in a direction that intersects the opposed direction; and A second contact and separation driving portion for moving the adhesive portion of the transfer member relative to the second substrate from the second opposing position to the opposing direction relatively close and separated; The second surface of the second substrate has: a second holding portion of the plurality of plate-shaped workpieces, which is provided opposite to the transfer member; and a second receiving surface, which is provided closer to the second holding portion Outside The control unit performs control as follows: the plurality of plate-shaped workpieces and the second substrate received by the adhesive surface by the relatively close movement of the transfer member and the second substrate based on the second contact separation driving unit When the second holding portion abuts and compresses and deforms the adhesive surface, the plurality of plate-shaped workpieces are held by the second holding portion. As the adhesive surface compresses and deforms, the reaction force surface and the second substrate The second receiving surface abuts to stop the relatively close movement of the transfer member and the second substrate based on the second contact separation driving portion. Such as the workpiece transfer device of claim 2, where The reaction force surface is opposed to the first receiving surface of the first substrate or the second receiving surface of the second substrate in parallel, and the reaction force surface is arranged parallel to the adhesive surface of the adhesive portion and surrounds the adhesive portion The configuration site. A work transfer chuck is characterized in that it receives a plurality of plate-shaped work pieces including tiny elements arranged on the first substrate from a first substrate, and transfers them to a specific position of a second substrate of a transfer target, and have: The transfer member is arranged to move the plurality of plate-shaped workpieces from the receiving position toward the receiving position of the plurality of plate-shaped workpieces while moving relatively close to the receiving position of the plurality of plate-shaped workpieces from the first opposing position opposed to the first substrate The workpiece is transferred freely to the transfer position of the aforementioned second substrate; The adhesive portion is provided on the transfer surface of the transfer member facing the plurality of plate-shaped workpieces arranged on the first substrate, and has an elastically deformable direction in a direction facing the plurality of plate-shaped workpieces Adhesive surface; and A reaction force support portion is provided on the transfer surface of the transfer member on the outside than the adhesive portion, and faces the first receiving surface on the first surface of the first substrate that is on the outside than the plurality of plate-shaped workpieces It is protruding and has a reaction force surface that is harder than the aforementioned adhesive surface; The adhesive force of the adhesive surface is set to be stronger than the holding force of the plate-shaped workpieces of the first holding portion of the first substrate and higher than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate. Weak, As the transfer member moves from the first opposing position to the receiving position relative to the first substrate, the adhesive surface abuts against the plurality of plate-shaped workpieces and compresses and deforms while adhering and holding the Multiple plate-shaped workpieces, The reaction force surface abuts against the first receiving surface of the first substrate in accordance with the compression deformation of the adhesive surface at the receiving position, The relatively close movement of the transfer member with respect to the first substrate is stopped by the abutment of the reaction force surface with the first receiving surface. A method for transferring workpieces, characterized in that a plurality of plate-shaped workpieces including tiny components arranged on the first substrate are received from a first substrate, and transferred to a specific position on the second substrate, and includes: In the approaching moving step, the adhesive portion provided on the transfer surface of the transfer member is opposed to the plurality of plate-shaped workpieces arranged on the first substrate, and at the same time, the transfer surface of the transfer member is larger than the adhesive portion In a state where the reaction force support portion further to the outside faces the first receiving surface of the first surface of the first substrate that is more outside than the plurality of plate-shaped workpieces, the transfer member is opposed to the first substrate Move closer to the ground; The abutting step involves contacting the plurality of plate-shaped workpieces with the adhesive surface of the adhesive portion relatively close to the moving transfer surface that can be elastically deformed in a direction opposed to the plurality of plate-shaped workpieces, Making the reaction force surface of the reaction force support portion of the transfer member that is harder than the adhesive surface abut against the first receiving surface of the first substrate; and A separating and moving step of separating and moving the transfer member from the first substrate, The adhesive force of the adhesive surface is set to be stronger than the holding force of the plate-shaped workpieces of the first holding portion of the first substrate and higher than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate. Weak, In the abutting step, by abutting against the plurality of plate-shaped workpieces, the adhesive surface compresses and deforms and adheres to hold the plurality of plate-shaped workpieces, and at the same time, the reaction force surface interacts with each other by the reaction force accompanying the compression deformation of the adhesive surface. In response to the contact of the first receiving surface of the first substrate, the transfer member is stopped from further moving closer to the first substrate.

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