TWI746589B - Substrate breaking system - Google Patents

Abstract

The present invention provides a substrate cutting system that can omit the inspection operation of the operator to improve the operation efficiency after the cracking.

The substrate cutting system 1 includes a substrate cutting device 3, a substrate inspection device 5, and a substrate conveying device 11. The substrate cutting device 3 is a device for cutting off the end A of the bonded substrate G. The bonded substrate G has a first substrate G1 formed on the surface with a scribe line S for cutting off the end material GL, and a second substrate G2 bonded to the back surface of the first substrate G1. The substrate inspection device 5 inspects the removal state of the end of the bonded substrate G. The substrate conveying device 11 rotates the suction parts 47 a to 47 a to d that suck the bonded substrate G around the support 41 a to convey the bonded substrate G. The substrate cutting device 3 and the substrate inspection device 5 are arranged on the rotation path of the suction parts 47a to 47d.

Description

Substrate breaking system

The present invention relates to a substrate cutting system, in particular to a substrate cutting system for cutting off the end of a self-adhesive substrate.

Generally, the manufacturing process of a liquid crystal panel includes a cleavage process of cutting out a substrate unit that is a prototype of the liquid crystal panel from a so-called bonded substrate in which the first substrate and the second substrate are bonded.

For example, a color filter is formed on the first substrate, and a thin film transistor (TFT) for driving liquid crystal and terminals for external connection are formed on the second substrate. Since the terminals of the second board are connected to external devices, they must be exposed. Here, in the breaking step, in addition to the step of breaking the first substrate and the second substrate along the scribing line to form the outer shape of the substrate unit, it further includes following the scribing line in order to expose the terminals formed on the second substrate. A step of breaking the end of the first substrate facing the terminal (for example, refer to Patent Document 1).

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2003-241173 A

Patent Document 1 describes a method for cutting a liquid crystal panel in which a thin film transistor array substrate and a color filter substrate are opposed to each other and bonded together, and the ends are cut and removed to expose the terminals. .

The substrate unit generated as described above is then used for subsequent processing steps such as further grinding and cleaning. In order to smoothly advance the subsequent processing steps, in the rupture step, it is necessary to reliably remove the end of the first substrate to expose the terminals of the substrate unit. Therefore, it is necessary for the operator to check whether the terminals of each substrate unit are properly exposed, and based on the inspection results to separate the substrate units for subsequent processing steps.

The purpose of the present invention is to provide a substrate cutting system that can omit the inspection operation of the operator to improve the operation efficiency after the cracking.

The following describes a plurality of aspects as a means to solve the problem. These aspects can be combined arbitrarily as needed.

A substrate cutting system of one aspect of the present invention includes a cutting device, an inspection device, and a transport device.

The breaking device is used to cut off the end of the bonded substrate. The bonded substrate has: a first substrate formed with a scribe line for cutting off the end on the surface; and a second substrate bonded to the back surface of the first substrate.

The inspection device inspects the removal state of the end of the bonded substrate.

The conveying device rotates the suction part that sucks the bonded substrate around the pillar to convey the bonded substrate.

A breaking device and an inspection device are arranged on the rotation path of the suction part of the conveying device.

In this system, the cutting device cuts off the end of the bonded substrate, and then the conveying device conveys the bonded substrate to the inspection device. Furthermore, after that, the inspection device inspects the removal state of the end of the bonded substrate. After the inspection, the transport device takes out the bonded substrate from the inspection device.

As mentioned above, the inspection work of the operator can be omitted, so that the work efficiency after the fracture becomes higher.

It is feasible to arrange an unloading device on the rotation path of the suction part to move the substrate inspected by the inspection device to the next process.

It is feasible to arrange a discarding portion on the rotation path of the suction portion to discard the substrates inspected by the inspection device.

It is feasible that the breaking device, the inspection device, the unloading device, and the discarding part are arranged at equal intervals around the pillars of the conveying device.

In the substrate breaking system of the present invention, the inspection work of the operator can be omitted, so that the work efficiency after breaking becomes higher.

1: Substrate breaking system

3: Substrate breaking device (an example of breaking device)

5: Substrate inspection device (an example of inspection device)

7: Board unloading device (an example of unloading device)

9: Board waste part (an example of waste part)

11: Substrate conveying device (an example of conveying device)

21: head

21a: pressing part

21b: Adsorption part

22: Stage

23: External piping

27: Inspection Department Conveyor

27a: Placement position

27b: Check location

29: Inspection Department

31: Gate

31a: Rod

33: Displacement sensor

35: Direct Acting Mechanism

37: Conveyor of moving out department

37a: Placement position

37b: Move out location

39: Abandoned Slot

41: Rotating part

41a: Pillar

41b: arm

43: drive motor

45a: No. 1 holding device

45b: 2nd holding device

45c: 3rd holding device

45d: 4th holding device

47a: The first adsorption part

47b: The second adsorption part

47c: The third adsorption part

47d: The fourth adsorption part

49a: The first elevator

49b: The second lifting part

49c: 3rd lifting part

49d: 4th lifting part

81: Controller

A: End

G: Substrate (an example of bonded substrate)

G1: The first substrate

G2: Second substrate

GL: End material

M1: Drive mechanism

M2: Drive mechanism

P: Vacuum pump

S: underline

Fig. 1 is a schematic plan view of a substrate cutting system as an embodiment of the present invention.

Figure 2 is a schematic diagram of the substrate breaking device.

Fig. 3 is a schematic perspective view of the substrate conveying device.

Fig. 4 is a schematic perspective view of the substrate inspection device.

Figure 5 is a block diagram showing the control structure of the substrate breaking system.

Figure 6 is a flow chart showing the control action of the substrate breaking system.

Figure 7 is a flow chart showing the control action of the substrate breaking system.

Figure 8 is a flow chart showing the control action of the substrate cutting system.

Figure 9 is a flow chart showing the control action of the substrate breaking system.

Fig. 10 is a schematic diagram of a substrate cutting device for explaining the substrate cutting action.

Fig. 11 is a schematic diagram of a substrate cutting device for explaining the substrate cutting action.

Fig. 12 is a schematic diagram of a substrate cutting device for explaining the substrate cutting action.

FIG. 13 is a schematic diagram of a substrate cutting device for explaining the substrate cutting operation.

Fig. 14 is a schematic diagram of a substrate cutting device for explaining the substrate cutting action.

FIG. 15 is a schematic plan view of a substrate cutting system for explaining the substrate inspection operation and subsequent processing.

Fig. 16 is a schematic plan view of a substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 17 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 18 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 19 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 20 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

Fig. 21 is a schematic plan view of a substrate cutting system for explaining substrate inspection operations and subsequent processing.

Fig. 22 is a schematic plan view of a substrate cutting system for explaining substrate inspection operations and subsequent processing.

1. The first embodiment (1) Substrate breaking system

The substrate cutting system 1 will be explained using Figs. 1 to 4. Fig. 1 is a schematic plan view of a substrate cutting system as an embodiment of the present invention. Figure 2 is a schematic diagram of the substrate breaking device. Fig. 3 is a schematic perspective view of the substrate conveying device. Fig. 4 is a schematic perspective view of the substrate conveying device.

The substrate cutting system 1 is a system that removes the end material GL located at the end A of one surface of the bonded substrate G (hereinafter referred to as "substrate G"), performs inspection, and then performs subsequent processing based on the inspection result.

The substrate cutting system 1 has a substrate cutting device 3. The substrate cutting device 3 removes the end material GL located at the end A of one surface of the substrate G. The substrate cutting device 3 is a cutting device for cutting off the end A of the bonded substrate. As shown in FIG. 2, the board|substrate G is comprised by the 1st board|substrate G1, and the 2nd board|substrate G2 bonded to the 1st board|substrate G1. Here, a scribing line S is formed on the surface of the first substrate G1, and the end material GL is removed along the scribing line S.

The substrate cutting system 1 has a substrate inspection device 5. The substrate inspection apparatus 5 is an apparatus for inspecting the end removal state of the substrate G from which the end material GL is removed.

The substrate cutting system 1 has a substrate unloading device 7. The substrate unloading device 7 is an apparatus for unloading the substrate G whose inspection result is normal to the next process.

The substrate cutting system 1 has a substrate discarding part 9. The board discarding part 9 is a place where the board G whose inspection result is bad and is not re-disconnected is discarded.

The substrate cutting system 1 has a substrate conveying device 11. The substrate transfer device 11 is a device that transfers the substrate G between the substrate cutting device 3, the substrate inspection device 5, and the substrate unloading device 7.

(2) Substrate breaking device

The substrate cutting device 3 will be described using FIG. 2. The substrate cutting device 3 has a plurality of heads 21 and stages 22.

The plurality of heads 21 are supported side by side in the vertical direction of the paper in FIG. 2 by a supporting mechanism such as a bracket not shown in the figure. Each head 21 is movable up and down by the drive mechanism M1, and has a pressing part 21a and a suction part 21b. The stage 22 mounts the substrate G so that the first substrate G1 is positioned above it. In addition, the substrate G has the end material GL located on the outer side of the end surface of the self-carrying table 22, that is, the carrier 22 The placement surface does not exist below the end material GL. The stage 22 is movable in the left-right direction in FIG. 2 by a drive mechanism M2 including a drive motor, a guide mechanism, and the like.

The pressing portion 21a of the head 21 presses the end material GL with respect to the substrate G from the side of the first substrate G1. Thereby, the end material GL is divided along the scribe line S.

The suction portion 21b is arranged on the side of the pressing portion 21a (the side along the moving direction of the stage 22). The suction part 21b is formed of a porous material, and is connected to the vacuum pump P via a passage or the like provided inside the head 21 and an external pipe 23.

The lower surface of the pressing portion 21a becomes a pressing surface that is in contact with the end material GL and is pressed downward. In addition, the lower surface of the suction portion 21b is formed to protrude downward (on the side of the first substrate G1) than the pressing surface, and serves as a suction surface for sucking the end material GL.

(3) Board inspection device

The substrate inspection device 5 will be described with reference to FIG. 3. The board inspection apparatus 5 has an inspection part conveyor 27 (an example of a conveying part). The inspection department conveyor 27 is a belt conveyor. The inspection part conveyor 27 moves the board|substrate G between the mounting position 27a and the inspection position 27b on it. The placement position 27a and the inspection position 27b are arranged side by side in the left-right direction in FIG. 1, but their orientation is not particularly limited.

The substrate inspection apparatus 5 has an inspection unit 29. The inspection part 29 has the gate 31 which straddles the inspection position 27b, and the displacement sensor 33 provided movably in the longitudinal direction below the rod 31a of the gate 31. The displacement sensor 33 irradiates the substrate G with laser light and measures the height of the surface of the substrate G based on the reflected light, for example. The displacement sensor 33 is moved along the rod 31a of the gate electrode 31 by the linear motion mechanism 35 (FIG. 5).

As described above, when the substrate G is supplied to the placement position 27 a, the inspection section conveyor 27 transports the substrate G from the placement position 27 a to the inspection section 29. When the inspection is completed, the inspection section conveyor 27 transports the substrate G from the inspection section 29 to the placement position 27a.

(4) Board unloading device

As shown in FIG. 1, the board|substrate carry-out apparatus 7 has the carry-out part conveyor 37. The unloading part conveyor 37 is a belt conveyor.

The unloading part conveyor 37 moves the board|substrate G between the mounting position 37a and the unloading position 37b on it.

(5) Board waste section

As shown in FIG. 1, the substrate discarding portion 9 has a discarding groove 39. The waste tank 39 has an opening opened on the upper side.

(6) Board transfer device

The substrate conveying device 11 will be described with reference to Figs. 1 and 4. The substrate conveying device 11 has a rotating unit 41. The rotating part 41 has a pillar 41a extending in the vertical direction, and four arms 41b extending in the horizontal direction from the upper end of the pillar 41a. The four arms 41b are arranged at 90-degree intervals in plan view. The pillar 41a can be rotated around the vertical axis by the driving motor 43 (FIG. 5), and is the axis of rotation. As described above, since the substrate transfer device 11 has the drive motor 43 as a single drive source, the structure is simple and easy to control.

The substrate transfer device 11 has a first holding device 45a, a second holding device 45b, a third holding device 45c, and a fourth holding device 45d, which are attached to the lower portion of the tip of the arm 41b. The first holding device 45a to the fourth holding device 45d respectively have: a first suction portion 47a, a second suction portion 47b, a third suction portion 47c, and a fourth suction portion 47d having an opening facing downward; In this way, the first lifting portion 49a, the second lifting portion 49b, the third lifting portion 49c, and the fourth lifting portion 49d of the first to fourth suction portions 47a to 47d are supported. The first to fourth suction parts 47a to 47d are connected by vacuum pumps not shown. The first to fourth lifting parts 49a to 49d are, for example, air cylinders.

In addition, in FIG. 4, the third suction portion 47c is indicated by a solid line ascending position, and is indicated by a dashed line as the rising position. Location.

As shown in FIG. 1, the substrate cutting device 3, the substrate inspection device 5, the substrate unloading device 7, and the substrate discarding part 9 are arranged around the pillar 41 a of the rotating part 41 of the substrate conveying device 11. Specifically, the devices are arranged at 90-degree intervals in the order described above.

The tip of the arm 41b of the rotating portion 41, that is, the first to fourth holding devices 45a to 45d, can be located above the substrate cutting device 3, the substrate inspection device 5, the substrate removal device 7, and the substrate discarding portion 9.

It is feasible that the first to fourth holding devices 45a to 45d use the first to fourth lifting parts 49a to 49d to lower the first to fourth suction parts 47a to 47d, respectively, and then use the first to fourth suction parts 47a to 47d sucks or releases the substrate G located in the substrate cutting device 3, the substrate inspection device 5, or the substrate unloading device 7, and then the first to fourth suction parts 47a to 47d are raised.

(7) The control structure of the substrate breaking system

The control structure of the substrate cutting system 1 will be explained using FIG. 5. Figure 5 is a block diagram showing the control structure of the substrate breaking system.

The substrate cutting system 1 has a controller 81. The controller 81 is a computer system having a processor (such as a CPU), a memory device (such as ROM, RAM, HDD, SSD, etc.), and various interfaces (such as an A/D converter, a D/A converter, a communication interface, etc.). The controller 81 performs various control actions by executing programs stored in the memory portion (corresponding to part or all of the memory area of the memory device).

The controller 81 may be composed of a single processor, or may be composed of a plurality of independent processors for each control.

Part or all of the functions of each element of the controller 81 can be executed as executable programs in the computer system constituting the controller 81. In addition, one of the functions of each element of the controller 81 The points can also be made up of customized ICs.

The inspection part conveyor 27, the linear motion mechanism 35, the drive motor 43, the 1st adsorption|suction part 47a-the 4th adsorption|suction part 47d, and the 1st raising/lowering part 49a-the 4th raising/lowering part 49d are connected to the controller 81. The controller 81 sends control signals to these devices to control them.

The displacement sensor 33 is connected to the controller 81. The controller 81 receives the detection signal from the displacement sensor 33, and judges the state of the substrate G and future processing based on it.

In addition, although not shown in the figure, the controller 81 is connected with a sensor for detecting the size, shape, and position of the substrate G, sensors and switches for detecting the state of each device, and an information input device.

(8) Basic actions of the substrate breaking system

The basic operation of the substrate cutting system 1 will be explained using FIGS. 6-22. Figures 6-9 are flowcharts showing the control actions of the substrate breaking system. Figures 10-14 are schematic diagrams of the substrate cutting device used to illustrate the substrate cutting action. Figures 15-22 are schematic plan views of a substrate cutting system for explaining substrate inspection operations and subsequent processing.

The control flow chart described below is an example, and each step can be omitted and replaced as needed. In addition, multiple steps may be executed at the same time, and some or all of them may be executed overlappingly.

Furthermore, each block of the control flowchart is not limited to a single control action, and can be replaced with a plurality of control actions represented by a plurality of blocks.

In addition, prior to the following breaking operation, the substrate G is prepared, and a scribe line S is formed on the surface of the first substrate G1 (the surface on the side where the second substrate G2 is not bonded) by a scribe line forming device not shown.

In step S1, the substrate G is placed on the substrate cutting device 3.

Specifically, the substrate G is placed on the placement surface of the stage 22. More specifically, as shown in FIG. 2, the first substrate G1 with the scribe line S formed on the surface is positioned above, and the scribe line S and the end The substrate G is arranged such that the part (the part that becomes the end material) GL is located on the outside of the mounting surface of the self-mounting table 22. Furthermore, the end material GL is positioned directly below the pressing portion 21a of the head 21 and is deviated from the suction part 21b (when the head 21 is lowered, the suction part 21b is not in contact with the end material GL). .

In step S2, the substrate cutting device 3 performs a cutting operation.

Specifically, as shown in FIG. 10, the controller 81 lowers the head 21, and presses the end material GL downward by the pressing part 21a. At this time, since there is no mounting surface of the stage 22 under the end material GL, by pressing the end material GL part by the pressing portion 21a, a crack can be formed on the first substrate G1 starting from the scribe line S, and the end The material GL is completely removed.

Next, as shown in FIG. 11, the controller 81 raises the head 21, and further moves the stage 22 in the left direction of FIG. 11. At this time, the stage 22 is moved so that the suction portion 21b of the head 21 is located directly above the end material GL.

Next, as shown in FIG. 12, the controller 81 lowers the head 21 and makes the suction part 21b abut on the end material GL. Thereby, the end material GL is sucked and held by the sucking portion 21b. In this state, as shown in FIG. 13, the head 21 is raised. Thereby, the end material GL is cut away from the first substrate G1. Thereafter, as shown in FIG. 14, the controller 81 retreats the stage 22 (moves to the right in the drawing), and retreats the substrate G from below the head 21. Then, when the suction is released by the suction part 21b, the end material GL will drop toward the end material placement place.

Next, steps S3 to S5 are used to describe the operation of the substrate transport device 11 to transport the substrate G from the substrate cutting device 3 to the substrate inspection device.

In step S3, the first suction portion 47a of the first holding device 45a performs a descending/supplying/rising operation. At this time, as shown in FIG. 15, the first holding device 45 a is positioned above the substrate G. Specifically, the controller 81 drives the first lifting portion 49a to lower the first suction portion 47a, and drives the first suction portion 47a, the substrate G is sucked to the first suction portion 47a, and the first lifting portion 49a is driven to raise the first suction portion 47a. As a result, the substrate G is lifted from the stage 22 of the substrate cutting device 3.

In step S4, the rotating part 41 of the substrate conveying device 11 is rotated by 90 degrees. Specifically, the controller 81 drives the driving motor 43 to rotate the rotating part 41 clockwise by 90 degrees as shown in the figure. As a result, as shown in FIG. 16, the substrate G is positioned above the placement position 27 a of the inspection part conveyor 27 of the substrate inspection apparatus 5.

In step S5, the first suction portion 47a of the first holding device 45a performs a descending/releasing/rising operation. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to de-suction the substrate G from the first suction portion 47a, and drives the first elevating portion 49a to cause the The 1 suction portion 47a rises. As a result, as shown in FIGS. 3 and 16, the substrate G is placed on the placement position 27 a of the inspection part conveyor 27 of the substrate inspection apparatus 5.

In step S6, the inspection part conveyor 27 moves the board|substrate G toward the inspection position 27b. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-mentioned operations. As a result, as shown in FIGS. 3 and 17, the substrate G is placed on the inspection position 27 b of the inspection part conveyor 27.

In step S7, the displacement sensor 33 detects the disconnection state. Specifically, the controller 81 drives the linear motion mechanism 35 to move the displacement sensor 33 along the rod 31 a, and receives a detection signal from the displacement sensor 33. At this time, the displacement sensor 33 detects the distance between the non-processed portion of the substrate G and the end material removal portion. Thus, the height information of the end material removal part is obtained.

In step S8, the controller 81 determines whether the disconnection state is normal. If yes, the process moves to step S10 (FIG. 7), if not, the process moves to step S9.

In step S9, the controller 81 determines whether or not to perform re-disconnection. If yes, the process moves to step S15 (FIG. 8), if not, the process moves to step S19 (FIG. 9).

Hereinafter, using steps S10~S14 of FIG. 7 to explain that the step S8 is yes, that is, the substrate is disconnected It is an action under normal circumstances.

In step S10, the inspection part conveyor 27 moves the board|substrate G to the mounting position 27a. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-mentioned operations. As a result, as shown in FIG. 18, the board|substrate G is arrange|positioned at the mounting position 27a.

Next, the operation of the substrate transfer device 11 to transfer the substrate G from the substrate inspection device 5 to the substrate transfer device 7 will be described using steps S11 to S13.

In step S11, the first suction part 47a of the first holding device 45a performs a descending/suction/rising operation. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to adsorb the substrate G to the first suction portion 47a, and drives the first elevating portion 49a to cause the first The suction part 47a rises. As a result, the substrate G is lifted from the substrate inspection apparatus 5.

In step S12, the rotating part 41 rotates 90 degrees. Specifically, the controller 81 drives the driving motor 43 to rotate the rotating part 41 clockwise by 90 degrees as shown in the figure. As a result, as shown in FIG. 19, the substrate G is positioned above the placement position 37 a of the unloading portion conveyor 37 of the substrate unloading device 7.

In step S13, the first suction portion 47a of the first holding device 45a performs a descending/releasing/rising operation. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to de-suction the substrate G from the first suction portion 47a, and drives the first elevating portion 49a to cause the The 1 suction portion 47a rises. As a result, as shown in FIG. 19, the substrate G is placed on the placement position 37 a of the transport conveyor 37 of the substrate transport device 7.

In step S14, the unloading part conveyor 37 conveys the board|substrate G. Specifically, the controller 81 drives the unloading part conveyor 37 to perform the above-mentioned operations. As a result, as shown in FIG. 20, the board|substrate G moved to the carrying-out position 37b side.

Thereafter, the process returns to step S1. At this time, the subsequent substrate holding operation is performed by the third holding device 45c. In addition, since the third holding device 45c is already arranged in the substrate cutting device 3 Above, so there is no need to rotate the rotating part 41.

As described above, the substrate cutting device 3 cuts away the end material GL to which the substrate G is bonded, and then the substrate conveying device 11 conveys the substrate G to the substrate inspection device 5. Furthermore, the substrate inspection apparatus 5 inspects the removal state of the end portion of the substrate G thereafter. After the inspection, the substrate transport device 11 takes out the substrate G from the substrate inspection device 5. As mentioned above, the inspection work of the operator can be omitted, so that the work efficiency after the fracture becomes higher.

Hereinafter, using steps S15 to S18 of FIG. 8 to describe the case where the step S9 is yes, that is, the re-breaking is performed.

In step S15, the inspection part conveyor 27 moves the board|substrate G to the mounting position 27a. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-mentioned operations. As a result, as shown in FIG. 18, the board|substrate G is arrange|positioned at the mounting position 27a.

Next, using steps S16 to S18, the operation of the substrate transfer device 11 to transfer the substrate G from the substrate inspection device 5 to the substrate cutting device 3 will be described.

In step S16, the first suction unit 47a of the first holding device 45a performs a descending/suction/rising operation. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to adsorb the substrate G to the first suction portion 47a, and drives the first elevating portion 49a to cause the first The suction part 47a rises. As a result, the substrate G is lifted from the substrate inspection apparatus 5.

In step S17, the rotating part 41 rotates 270 degrees. Specifically, the controller 81 drives the driving motor 43 to rotate the rotating part clockwise by 270 degrees as shown in the figure. As a result, as shown in FIG. 19, the substrate G is positioned above the placement position 37 a of the unloading portion conveyor 37 of the substrate unloading device 7.

In step S18, the first suction portion 47a of the first holding device 45a performs a descending/releasing/rising operation. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to release the suction of the substrate G from the first suction portion 47a, and drives the first elevating portion 49a to raise the first suction portion 47a. As a result, as shown in FIG. 21, the substrate G is placed on the stage 22 of the substrate cutting device 3.

Thereafter, the process returns to step S2. At this time, the subsequent substrate holding operation is performed by the first holding device 45a. In addition, since the first holding device 45a is already arranged above the substrate cutting device 3, the rotating portion 41 does not need to be rotated.

As described above, the substrate transfer device 11 transfers the substrate G from the substrate inspection device 5 to the substrate cutting device 3. Therefore, the substrate G judged to be defective by the substrate inspection device 5 is returned to the substrate cutting device 3, and then the end material GL is cut off again.

Hereinafter, using steps S19 to S22 of FIG. 9 to describe the case where the step S9 is no, that is, no re-breaking is performed.

In step S19, the inspection part conveyor 27 moves the board|substrate G to a mounting position. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-mentioned operations. As a result, as shown in FIG. 18, the board|substrate G is arrange|positioned at the mounting position 27a.

Next, the operation of the substrate transfer device 11 to transfer the substrate G from the substrate inspection device 5 to the substrate discarding portion 9 will be described using steps S20 to S22.

In step S20, the first suction unit 47a of the first holding device 45a performs a descending/suction/rising operation. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to adsorb the substrate G to the first suction portion 47a, and drives the first elevating portion 49a to cause the first The suction part 47a rises. As a result, the substrate G is lifted from the substrate inspection apparatus 5.

In step S21, the rotating part 41 rotates 180 degrees. Specifically, the controller 81 drives the driving motor 43 to rotate the rotating part clockwise by 180 degrees as shown in the figure. As a result, as shown in FIG. 22, the substrate G is positioned above the waste groove 39 of the substrate waste portion 9.

In step S22, the first suction portion 47a of the first holding device 45a performs descending/releasing/rising action. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to de-suction the substrate G from the first suction portion 47a, and drives the first elevating portion 49a to cause the The 1 suction portion 47a rises. As a result, as shown in FIG. 22, the substrate G is thrown into the waste groove 39 of the substrate waste portion 9.

Thereafter, the process returns to step S1. At this time, the subsequent substrate holding operation is performed by the second holding device 45b. In addition, since the second holding device 45b is already arranged above the substrate cutting device 3, the rotating portion 41 does not need to be rotated.

2. Other implementation forms

The foregoing has described one embodiment of the present invention, but the present invention is not limited to the above-mentioned embodiment, and various changes can be made without departing from the spirit of the invention. In particular, the plural embodiments and modifications described in this specification can be combined arbitrarily as needed.

(1) The number of arms of the substrate conveying device is not limited to 4. The number of arms can be 1 to 3, or 5 or more.

(2) The rotation direction of the rotating part of the substrate conveying device is not limited to the clockwise direction in the drawing. It can be the counterclockwise direction of the diagram, or the clockwise direction and the counterclockwise direction can be combined appropriately.

(3) The angle between the devices arranged around the substrate conveying device is not limited to the aforementioned embodiment.

(4) In the foregoing embodiment, after the inspection, it is determined whether the substrate G is returned to the substrate cutting device 3 or discarded, but this determination may not be performed. In this case, the substrate G whose breaking state is bad must be returned to the substrate breaking device 3 or must be discarded.

(5) The shape and transport structure of the substrate transport device are not limited to the foregoing embodiment. For example, the transfer between the devices can be performed by using a plurality of transfer devices that are independent of each other.

(6) The substrate holding structure of the substrate conveying device is not limited to the aforementioned embodiment.

(7) The sensor of the substrate inspection device is not limited to the aforementioned embodiment.

[Industrial availability]

The present invention can be widely applied to a substrate cutting system for cutting off the ends of a self-bonding substrate.

1: Substrate breaking system

3: Substrate breaking device (an example of breaking device)

5: Substrate inspection device (an example of inspection device)

7: Board unloading device (an example of unloading device)

9: Board waste part (an example of waste part)

11: Substrate conveying device (an example of conveying device)

27: Inspection Department Conveyor

27a: Placement position

27b: Check location

29: Inspection Department

31: Gate

37: Conveyor of moving out department

37a: Placement position

37b: Move out location

39: Abandoned Slot

41: Rotating part

41a: Pillar

41b: arm

45a: No. 1 holding device

45b: 2nd holding device

45c: 3rd holding device

45d: 4th holding device

G: Substrate (an example of bonded substrate)

Claims (5)

A substrate breaking system, comprising: a breaking device for cutting off the end of a bonded substrate, the bonded substrate having a first substrate on which a scribe line for cutting off the end is formed on the surface, and the bonding The second substrate on the back side of the first substrate; an inspection device that inspects the removal state of the end of the bonded substrate; and a conveying device that rotates the suction part that sucks the bonded substrate around the axis to transport the bonded substrate The substrate; and the above-mentioned breaking device and the above-mentioned inspection device are arranged on the rotation path of the above-mentioned adsorption part. Such as the substrate cutting system of claim 1, which further includes an unloading device for unloading the substrate inspected by the inspection device to the next step, and the unloading device is arranged on the rotation path of the suction part. The substrate cutting system of claim 1, which further includes a discarding part for discarding the substrates inspected by the inspection device, and the discarding part is arranged on the rotation path of the suction part. Such as the substrate cutting system of claim 2, which further includes a discarding part for discarding the substrates inspected by the inspection device, and the discarding part is arranged on the rotation path of the suction part. The substrate cutting system according to any one of claims 1 to 4, wherein the cutting device, the inspection device, the unloading device, and the discarding part are arranged at equal intervals around the axis.

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