TWI741729B - Substrate processing system, valve plate assembly and working method of substrate processing system - Google Patents

Abstract

A substrate processing system, a valve plate assembly, and a working method of the substrate processing system, wherein the substrate processing system includes: a first cavity, the first cavity has a first substrate transfer port; the second cavity, the second cavity has a first Two substrate transfer ports, the second cavity and the first cavity are arranged in a horizontal direction; a sealed shell located between the first cavity and the second cavity, the sealed shell communicates with the first substrate transfer port and the second substrate transfer port ; The first valve plate located in the sealing shell; the second valve plate located in the sealing shell, the second valve plate and the first valve plate are stacked up and down; the first driving device is used to move the first valve plate to seal the first valve plate A substrate transfer port; a second driving device for moving the second valve plate to seal the second substrate transfer port. The substrate processing system of the present invention has higher processing efficiency for substrates.

Description

Substrate processing system, valve plate assembly and working method of substrate processing system

The invention relates to the field of semiconductors, and in particular to a working method of a substrate processing system, a valve plate assembly and a substrate processing system.

The existing substrate processing system is usually a vacuum cluster equipment (Cluster), which includes a front-end module of the equipment, a load lock chamber (Load Lock), a transfer chamber, and a process chamber surrounding the transfer chamber. Among them, a robotic arm (Robot) is installed in the transfer cavity. The robotic arm is used to take the substrate to be processed from the load lock chamber and place it in any process chamber. In the process chamber, the substrate to be processed is processed. After the processing of the substrate to be processed is completed, the robotic arm then takes the processed substrate out of the processing chamber and moves the processed substrate to the outside atmosphere.

In the existing substrate processing system, a valve plate is provided between the transfer chamber and the process chamber, and between the transfer chamber and the load lock chamber. When the valve plate needs to be replaced, removing the valve plate will destroy the vacuum environment of the transfer chamber, the process chamber and the load lock chamber, making it difficult for the substrate processing system to continue processing the substrate to be processed. Therefore, the frequency of shutdown of the existing substrate processing system Higher, the processing efficiency of the substrate to be processed is lower.

The technical scheme of the present invention to solve the technical problem is to provide a working method of a substrate processing system, a valve plate assembly and a substrate processing system, so as to improve the processing efficiency of the substrate to be processed by the substrate processing system.

In order to solve the above technical problems, the present invention provides a substrate processing system, including: a first cavity, the first cavity has a first substrate transfer port; a second cavity, the second cavity has a second substrate transfer port, and a second cavity It is arranged in the horizontal direction with the first cavity; the sealed shell located between the first cavity and the second cavity, the sealed shell communicates with the first substrate transfer port and the second substrate transfer port; the first valve located in the sealed shell Plate; the second valve plate located in the sealing shell, the second valve plate and the first valve plate are stacked up and down; the first drive device is used to move the first valve plate to seal the first substrate transfer port; the second drive The device is used to move the second valve plate to seal the second substrate transfer port.

Preferably, both the first driving device and the second driving device include an up-and-down power device and a horizontal power device. A valve plate or a second valve plate moves in the horizontal direction.

Preferably, the sealing shell includes a first opening and a second opening, the first opening corresponds to the first substrate transfer port, and the second opening corresponds to the second substrate transfer port.

Preferably, when the opening area of the first opening is larger than the opening area of the first substrate transfer port, the first valve plate is used to seal the first substrate transfer port or the first opening.

Preferably, when the opening area of the first opening is less than or equal to the opening area of the first substrate transfer port, the first valve plate is used to seal the first opening.

Preferably, a sealing device is provided on the side of the first valve plate to achieve close contact with the first substrate transfer port or the first opening.

Preferably, there is a first step around the first substrate transfer port or around the first opening, the first valve plate is provided with a sealing step matching the first step, and the first valve plate further includes a sealing step provided on the sealing step. The sealing device is used to realize the seal between the sealing step and the first step.

Preferably, when the opening area of the second opening is larger than the opening area of the second substrate transfer port, the second valve plate is used to seal the second substrate transfer port or the second opening.

Preferably, when the opening area of the second opening is less than or equal to the opening area of the second substrate transfer port, the second valve plate is used to seal the second opening.

Preferably, a sealing device is provided on the side of the second valve plate to achieve close contact with the second substrate transfer port or the second opening.

Preferably, the periphery of the second substrate transfer port or the periphery of the second opening is provided with a second step, the second valve plate is provided with a sealing step matching the second step, and the second valve plate further includes a sealing step provided on the sealing step. The sealing device is used to realize the seal between the sealing step and the second step.

Preferably, the first cavity is a process cavity and the second cavity is a transfer cavity.

Preferably, when the number of process chambers is greater than one, the process chambers greater than one surround the transfer chamber; each process chamber and the transfer chamber are provided with a first valve plate, a second valve plate and a sealing shell.

Preferably, the first cavity is a load lock cavity and the second cavity is a transmission cavity.

Preferably, the size of the first valve plate and the second valve plate are equal or not equal.

The invention provides a valve plate assembly for a substrate processing system, comprising: a first valve plate; a second valve plate stacked up and down with the first valve plate; and a sealing shell located on the periphery of the first valve plate and the second valve plate , The sealing shell has a first opening and a second opening along the horizontal direction; the first driving device is used to move the first valve plate in the up and down direction and the horizontal direction; the second driving device is used to move the second valve plate in the up and down direction And horizontal movement.

Preferably, both the first valve plate and the second valve plate include a sealing device.

Preferably, the sealing device is arranged on the side wall of the first valve plate and/or the second valve plate.

Preferably, a first step is provided around the first opening, the first valve plate is provided with a sealing step matching the first step, and the sealing device of the first valve plate is located on the sealing step; the second opening is provided with a first step around the second opening. Two steps, the second valve plate is provided with a sealing step matching the second step, and the sealing device of the second valve plate is located on the sealing step.

Preferably, the first driving device and the second driving device both include an upper and lower power device and a horizontal power device. The upper and lower power devices are used to move the first valve plate or the second valve plate up and down, and the horizontal power device is used to make the first valve The plate or the second valve plate moves in the horizontal direction.

Correspondingly, the present invention further provides a working method of a substrate processing system, including: providing the above-mentioned substrate processing system; using a first driving device to move the first valve plate to seal the first substrate transfer port, and/or using the second The driving device moves the second valve plate to seal the second substrate transfer port.

Preferably, when the first valve plate seals the first substrate transfer port, the second valve plate is replaced; or, when the second valve plate seals the second substrate transfer port, the first valve plate is replaced.

Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

In the substrate processing system provided by the technical scheme of the present invention, the first valve plate is used to seal the first substrate transfer port, which is beneficial to ensure that a vacuum environment is maintained in the first cavity; the second valve plate is used to seal the second substrate transfer port , Which helps to ensure that the vacuum environment is maintained in the second cavity. When the first valve plate needs maintenance, make the second valve plate seal the second substrate transfer port, and the vacuum environment can still be maintained in the second cavity. When the second valve plate needs maintenance, the first valve plate is sealed to the first valve plate. The substrate transfer port can still maintain a vacuum environment in the first cavity. When the vacuum environment can still be maintained in the first cavity or the second cavity, the process processing can be continued in the first cavity or the second cavity without shutting down. Therefore, it is beneficial to reduce the frequency of shutdown and improve the processing efficiency of the substrate to be processed .

As described in the prior art, the substrate processing system in the prior art has low processing efficiency for the substrate to be processed. In order to solve the above technical problems, the technical solution of the present invention provides a substrate processing system and a valve for the substrate processing system. The working method of the board assembly and the substrate processing system, wherein the substrate processing system includes: a first cavity, the first cavity has a first substrate transfer port; the second cavity, the second cavity has a second substrate transfer port, and the The two cavities and the first cavity are arranged in the horizontal direction; the sealed shell located between the first cavity and the second cavity, the sealed shell communicates with the first substrate transfer port and the second substrate transfer port; the second substrate located in the sealed shell A valve plate; a second valve plate located in the sealing shell, the second valve plate is located above the first valve plate; a first drive device for moving the first valve plate to seal the first substrate transfer port; a second drive The device is used to move the second valve plate to seal the second substrate transfer port. The substrate processing system provided by the present invention has higher processing efficiency for the substrate to be processed.

In order to make the above objectives, features and beneficial effects of the present invention more obvious and understandable, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

Fig. 1 is a top view of a substrate processing system according to the present invention.

Please refer to FIG. 1, the substrate processing system includes: a process chamber 100, a transfer chamber 101 and a load lock chamber 102, and the process chamber 100 and the load lock chamber 102 surround the transfer chamber 101.

The inside of the process chamber 100 (Process Module, PM) is a vacuum environment, which is used to process the semiconductor process on the substrate to be processed.

The transfer chamber 101 (Transfer Module, TM) is in a vacuum environment, and there is a robot arm in the transfer chamber 101 for moving the substrate to be processed in the transfer chamber 101 into one of the process chambers 100.

The load lock chamber 102 (Load lock) is used to switch between an atmospheric environment and a vacuum environment.

2 is a schematic cross-sectional structure diagram of a substrate processing system according to the present invention.

Please refer to FIG. 2, the first cavity 200 has a first substrate transfer port 201; the second cavity 202 has a second substrate transfer port 203, and the second cavity 202 and the first cavity 200 are arranged along the horizontal direction X1; the sealing shell 204 Located between the first cavity 200 and the second cavity 202, the sealed shell 204 is in communication with the first substrate transfer port 201 and the second substrate transfer port 203; the first valve plate 205 located in the sealed shell 204; located in the sealed shell 204 The second valve plate 206, the second valve plate 206 and the first valve plate 205 are stacked up and down; the first driving device 207 is used to move the first valve plate 205 to seal the first substrate transfer port 201; The driving device 208 is used to move the second valve plate 206 to seal the second substrate transfer port 203.

In one embodiment, the first chamber 200 is a process chamber, and the process chamber is in a vacuum environment. The substrate to be processed is processed in a semiconductor process in the first chamber 200. The semiconductor process includes: a plasma etching process, the first chamber 200 The first substrate transfer port 201 is used to move in or out the substrate to be processed. The second cavity 202 is a transfer cavity. The second cavity 202 has a robotic arm (not shown in the figure). The robotic arm is used to grab the substrate to be processed and move in or out of the substrate to be processed through the second substrate transfer port 203 .

In another embodiment, the first cavity 200 is a transmission cavity, and the second cavity 202 is a load lock cavity.

The second cavity 202 and the first cavity 200 are arranged along the horizontal direction X1. There is a sealed shell 204 between the second cavity 202 and the first cavity 200, and the sealed shell 204 is connected to the second cavity 202 and the first cavity 200, respectively.

In this embodiment, the sealing shell 204 includes a first opening 209 and a second opening 210, the first opening 209 corresponds to the first substrate transfer port 201, and the second opening 210 corresponds to the second substrate transfer port 203.

In this embodiment, the first driving device 207 and the second driving device 208 both include an upper and lower power device (not shown in the figure) and a horizontal power device (not shown in the figure). The upper and lower power device is used to make the first valve The plate 205 or the second valve plate 206 moves in the up and down direction Y1, so that the first valve plate 205 can be opposed to the first substrate transfer port 201, the second valve plate 206 is opposed to the second substrate transfer port 203, and the first valve The projection of the plate 205 on the sealed shell 204 can cover the first substrate transfer port 201, the projection of the second valve plate 206 on the sealed shell 204 can cover the second substrate transfer port 203, and the horizontal power device is used to make the first valve The plate 205 is pressed to the first opening 209 to seal the first substrate transfer port 201, or the second valve plate 206 is pressed to the second opening 210 to seal the second substrate transfer port 203.

In this embodiment, when the first valve plate 205 needs maintenance or replacement, the first valve plate 205 needs to be disassembled. When the first valve plate 205 is removed, the second valve plate 206 seals the second opening 210, which helps to ensure the vacuum environment in the second cavity 202; similarly, when the second valve plate 206 needs maintenance or replacement, the first valve plate 206 The plate 205 seals the first opening 209, so that the vacuum environment in the first cavity 200 is not destroyed, so that the processing process of the first cavity 200 or the second cavity 202 is not interrupted, therefore, it is beneficial to improve the processing efficiency of the substrate to be processed .

In this embodiment, the method of disassembling the first valve plate 205 includes: disassembling the first valve plate 205 and the first driving device 207 at the same time; the method of disassembling the second valve plate 206 includes: disassembling the second valve plate 206 and the second valve plate 206 at the same time. Drive 208.

In this embodiment, the substrate processing system further includes: supporting feet (not shown in the figure) at the bottoms of the first cavity 200 and the second cavity 202, an equipment board located below the supporting feet, and a supporting column located below the equipment board .

In this embodiment, since the first valve plate 205 and the second valve plate 206 are stacked on top of each other, the area occupied by the first valve plate 205 and the second valve plate 206 is equal to the area occupied by the first valve plate 205 only. If they are the same or close to each other, the center of gravity of the substrate processing system does not shift or slightly shifts, so that the original support feet and support columns do not need to be redesigned, which helps reduce the design difficulty.

In this embodiment, when the first cavity 200 is a process cavity and the second cavity 202 is a transfer cavity, if the number of process cavities is greater than one, a plurality of process cavities surround the transfer cavity, and each process cavity and the transfer cavity There are a first valve plate 205, a second valve plate 206 and a sealing shell 204 therebetween.

In this embodiment, the size of the first valve plate 205 and the second valve plate 206 are equal.

In other embodiments, the sizes of the first valve plate and the second valve plate are not equal.

3 is a schematic diagram of the structure of the first valve plate sealing the first substrate transfer port in the substrate processing system of FIG. 2.

In this embodiment, the opening area of the first opening 209 is equal to the opening area of the first substrate transfer port 201, and the first driving device 207 is used to make the first valve plate 205 seal the first opening 209. In other embodiments, the opening area of the first opening is smaller than the opening area of the first substrate transfer port, and the first driving device causes the first valve plate to seal the first opening; or, the opening area of the first opening is larger than that of the first substrate For the opening area of the transfer port, the first driving device makes the first valve plate seal the first substrate transfer port or the first opening.

In this embodiment, the side of the first valve plate 205 is provided with a sealing device 205a. When the first valve plate 205 seals the first opening 209, the sealing device 205a is used to achieve a tight fit with the first opening 209.

In this embodiment, when the second valve plate 206 needs to be maintained or replaced, the first valve plate 205 seals the first opening 209, which is beneficial to ensure the vacuum environment in the first cavity 200, so that the processing in the first cavity 200 is not possible. Is interrupted, therefore, it is helpful to improve the processing efficiency of the substrate processing system.

4 is a schematic diagram of the structure of the second valve plate sealing the second substrate transfer port in the substrate processing system of FIG. 2.

In this embodiment, the opening area of the second opening 210 is equal to the opening area of the second substrate transfer port 203, and the second driving device 208 is used to make the second valve plate 206 seal the second opening 210.

In other embodiments, the opening area of the second opening is smaller than the opening area of the second substrate transfer port, and the second driving device causes the second valve plate to seal the second opening; or, the opening area of the second opening is larger than that of the second substrate For the opening area of the transfer port, the first driving device makes the second valve plate seal the second substrate transfer port or the second opening.

In this embodiment, the side of the second valve plate 206 is provided with a sealing device 206a. When the second valve plate 206 seals the second opening 210, the sealing device 206a is used to achieve a tight fit with the second opening 210.

In this embodiment, when the first valve plate 205 needs to be maintained or replaced, the second valve plate 206 seals the second opening 210, which is beneficial to ensure the vacuum environment in the second cavity 202, so that the processing in the second cavity 202 is not possible. Is interrupted, therefore, it is helpful to improve the processing efficiency of the substrate processing system.

5 is a schematic cross-sectional structure diagram of another substrate processing system according to the present invention.

5, the first cavity 300 has a first substrate transfer port 301; the second cavity 302 has a second substrate transfer port 303, the second cavity 302 and the first cavity 300 are arranged along the horizontal direction X2; the sealing shell 304 Located between the first cavity 300 and the second cavity 302, the sealed shell 304 is in communication with the first substrate transfer port 301 and the second substrate transfer port 303; the first valve plate 305 located in the sealed shell 304; located in the sealed shell 304 The second valve plate 306, the second valve plate 306 and the first valve plate 305 are stacked up and down; the first drive device 307 is used to move the first valve plate 305 to seal the first substrate transfer port 301; the second drive The device 308 is used to move the second valve plate 306 to seal the second substrate transfer port 303.

In this embodiment, the sealing shell 304 includes a first opening 309 and a second opening 310, the first opening 309 corresponds to the first substrate transfer port 301, and the second opening 310 corresponds to the second substrate transfer port 303.

In this embodiment, the opening area of the first opening 309 is equal to the opening area of the first substrate transfer port 301, and the first opening 309 has a first step 311 around the first opening 309, and the first valve plate 305 has the same opening area as the first step 311. The matching sealing step 305a and the sealing device 305b located on the sealing step 305a; the opening area of the second opening 310 is equal to the opening area of the second substrate transfer port 303, and the second opening 310 is surrounded by a second step 312, The second valve plate 306 has a sealing step 306a matching the second step 312 and a sealing device 306b located on the sealing step 306a.

In other embodiments, the opening area of the first opening is smaller than the opening area of the first substrate transfer port, the first opening is surrounded by a first step, the first valve plate is used to seal the first opening; the opening area of the second opening It is smaller than the opening area of the second substrate transfer port, and there is a second step around the second opening, and the second valve plate is used to seal the second opening; or, the opening area of the first opening is larger than the opening of the first substrate transfer port Area, there is a first step around the first substrate transfer port, the first valve plate is used to seal the first opening or the second substrate transfer port; the opening area of the second opening is larger than the opening area of the second substrate transfer port, And there is a second step around the second substrate transfer port, and the second valve plate is used to seal the second opening or the second substrate transfer port.

6 is a schematic diagram of the structure of the first valve plate sealing the first substrate transfer port in the substrate processing system of FIG. 5.

In this embodiment, there is a first step 311 around the first opening 309. The first valve plate 305 is provided with a sealing step 305a matching the first step 311 and a sealing device 305b located on the sealing step 305a. The first driving device 307 matches the sealing step 305a with the first step 311, and the sealing device 305b is used to realize the seal between the sealing step 305a and the first step 311.

In this embodiment, the first valve plate 305 includes a sealing device 305b arranged on the sealing step 305a. When the first valve plate 305 is used to seal the first step 311 by the driving device, the driving force applied will not be affected by the first valve. The number of plates of the plate 305 is reduced, but all are transferred to the sealing device 305b on the top of the first valve plate 305. Therefore, a better sealing effect can be achieved with only a small driving force. In addition, the first valve plate 305 is used to seal the first step 311, and the rigidity of the material of the first valve plate 305 is relatively low.

In other embodiments, the opening area of the first opening is smaller than the opening area of the first substrate transfer port, and the first driving device causes the first valve plate to seal the first opening; or, the opening area of the first opening is larger than that of the first substrate For the opening area of the transfer port, the first driving device makes the first valve plate seal the first substrate transfer port or the first opening.

In this embodiment, when the second valve plate 306 needs to be maintained or replaced, the first valve plate 305 seals the first opening 309, which is beneficial to ensure the vacuum environment in the first cavity 300, so that the processing in the first cavity 300 is not effective. Is interrupted, therefore, it is helpful to improve the processing efficiency of the substrate processing system.

FIG. 7 is a schematic diagram of the structure of the second valve plate sealing the second substrate transfer port in the substrate processing system of FIG. 5.

In this embodiment, there is a second step 312 around the second opening 310. The second valve plate 306 is provided with a sealing step 306a matching the second step 312 and a sealing device 306b located on the sealing step 306a. The device 308 matches the sealing step 306 a with the second step 312, and the sealing device 306 b is used to achieve the seal between the sealing step 306 a and the second step 312.

In this embodiment, the second valve plate 306 includes a sealing device 306b arranged on the sealing step 306a. When the second valve plate 306 is used to seal the second step 312 by the driving device, the driving force applied will not be affected by the second valve. The number of plates of the plate 306 is reduced, but all are transferred to the sealing device 306b on the top of the second valve plate 306. Therefore, a better sealing effect can be achieved with a small driving force. In addition, the second valve plate 306 is used to seal the second step 312, and the rigidity of the material of the second valve plate 306 is relatively low.

In other embodiments, the opening area of the second opening is smaller than the opening area of the second substrate transfer port, and the second driving device causes the second valve plate to seal the second opening; or, the opening area of the second opening is larger than that of the second substrate For the opening area of the transfer port, the second driving device makes the second valve plate seal the second substrate transfer port or the second opening.

In this embodiment, when the first valve plate 305 needs to be maintained or replaced, the second valve plate 306 seals the second opening 310, which is beneficial to ensure the vacuum environment in the second cavity 302, so that the processing in the second cavity 302 is not effective. Is interrupted, therefore, it is helpful to improve the processing efficiency of the substrate processing system.

Fig. 8 is a schematic structural diagram of a valve plate assembly for a substrate processing system according to the present invention; Fig. 9 is a side view of a first valve plate in the valve plate assembly of Fig. 8.

Please refer to Figure 8, the valve plate assembly includes: a first valve plate 401; a second valve plate 402 stacked up and down with the first valve plate 401; a sealing shell 400 located on the periphery of the first valve plate 401 and the second valve plate 402, The sealing shell 400 has a first opening 405 and a second opening 406 along the horizontal direction X3; a first driving device 403 is used to move the first valve plate 401 in the vertical direction Y3 and the horizontal direction X3; a second driving device 404 is used to move the first valve plate 401 in the vertical direction Y3 and the horizontal direction X3 The second valve plate 402 is moved in the vertical direction Y3 and the horizontal direction X3.

Both the first driving device 403 and the second driving device 404 include an upper and lower power device (not shown in the figure) and a horizontal power device (not shown in the figure). The upper and lower power devices are used to make the first valve plate 401 or the second valve The plate 402 moves in the vertical direction Y3, and the horizontal power device is used to move the first valve plate 401 or the second valve plate 402 in the horizontal direction X3.

In this embodiment, the side wall of the first valve plate 401 is provided with a sealing device 401b, and the method for sealing the first opening 405 of the first valve plate 401 includes: using an up and down power device to move the first valve plate 401 in the up and down direction Y3, Until the first valve plate 401 is opposite to the first opening 405; when the first valve plate 401 is opposite to the first opening 405, the horizontal power device is used to press the first valve plate 401 against the sealing shell 400 to seal the first valve plate 401 First opening 405.

In this embodiment, the side wall of the second valve plate 402 is provided with a sealing device 402b, and the method for the second valve plate 402 to seal the second opening 406 includes: using an up and down power device to move the second valve plate 402 in the up and down direction Y3, Until the second valve plate 402 is opposite to the second opening 406; when the second valve plate 402 is opposite to the second opening 406, the horizontal power device is used to press the second valve plate 402 against the sealing shell 400 to seal the second valve plate 402 The second opening 406.

In this embodiment, the structure of the first valve plate 401 is the same as the structure of the second valve plate 402. Specifically, the side wall of the first valve plate 401 is provided with a sealing device 401b, and the side wall of the second valve plate 402 is provided with a sealing device. 402b.

Next, the first valve plate 401 will be used as an example for description. Please refer to FIG. 9, which is a side view of the first valve plate in the valve plate assembly of FIG. 8.

When the first valve plate 401 moves to a position opposite to the first opening 405 under the action of the upper and lower power devices, the sealing device 401b of the first valve plate 401 faces the first opening 405; When the first opening 405 is pressed to seal the first opening 405 under the action, the sealing device 401b surrounds the first opening 405.

Fig. 10 is a schematic structural diagram of another valve plate assembly for a substrate processing system according to the present invention; Fig. 11 is a side view of a first valve plate in the valve plate assembly of Fig. 10.

10, the valve plate assembly includes: a first valve plate 501; a second valve plate 502 stacked up and down with the first valve plate 501; a sealing shell 500 located on the periphery of the first valve plate 501 and the second valve plate 502, The sealing shell 500 has a first opening 505 and a second opening 506 along the horizontal direction X4; a first driving device 503 is used to move the first valve plate 501 in the vertical direction Y4 and the horizontal direction X4; a second driving device 504 is used to move the first valve plate 501 in the vertical direction Y4 and horizontal direction X4 The second valve plate 502 is moved in the vertical direction Y4 and the horizontal direction X4.

In this embodiment, the first opening 505 is surrounded by a first step 507; the second opening is surrounded by a second step 508, and the first valve plate 501 has a sealing step 501a that matches the first step 507 and a sealing step 501a. The upper sealing device 501b; the second valve plate 502 has a sealing step 502a matching the second step 508 and a sealing device 502b located on the sealing step 502a.

In other embodiments, there is a first step around the first opening, and there is no second step around the second opening, and the first valve plate has a sealing step matching the first step and a sealing device located on the sealing step; or There is no first step around the first opening, and a second step around the second opening. The second valve plate has a sealing step matching the second step and a sealing device located on the sealing step.

In this embodiment, the shape of the first valve plate 501 is the same as the shape of the second valve plate 502. Next, the shape of the first valve plate 501 will be described as an example. Please refer to FIG. 11, which is a side view of the first valve plate 501 in the valve plate assembly of FIG. 10.

When the first valve plate 501 seals the first opening 505, the sealing device 501b of the first valve plate 501 contacts the first step 507 around the first opening 505 to seal the first opening 505.

In other embodiments, the shapes of the first valve plate and the second valve plate are different. One of the first valve plate and the second valve plate has the structure shown in FIG. 8 and the other has the structure shown in FIG. 10 structure.

FIG. 12 is a process flow chart of the working method of the substrate processing system according to the present invention.

12, the working method of the substrate processing system includes: Step S1: Provide the above-mentioned substrate processing system; Step S2: Use the first driving device to move the first valve plate to seal the first substrate transfer port, and/or use The second driving device moves the second valve plate to seal the second substrate transfer port.

The first valve plate is used to seal the first substrate transfer port, which is beneficial to ensure that the vacuum environment is maintained in the first cavity; the second valve plate is used to seal the second substrate transfer port, which is beneficial to ensure that the vacuum environment is maintained in the second cavity. When the first valve plate needs maintenance, make the second valve plate seal the second substrate transfer port, and the vacuum environment can still be maintained in the second cavity. When the second valve plate needs maintenance, the first valve plate is sealed to the first valve plate. The substrate transfer port can still maintain a vacuum environment in the first cavity. When the valve plate is maintained, the vacuum environment can still be maintained in the first cavity or the second cavity, so that the process processing can be continued in the first cavity or the second cavity without shutting down. Therefore, it is beneficial to reduce the frequency of downtime and improve The processing efficiency of the substrate to be processed.

Although the present invention is disclosed as above, the present invention is not limited to this. Anyone with ordinary knowledge in the field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope of the patent application.

100: process cavity 101: Transmission cavity 102: Load lock cavity 200,300: first cavity 201,301: The first substrate transfer port 202,302: second cavity 203, 303: second substrate transfer port 204, 304: sealed shell 205,305,401,501: the first valve plate 205a, 206a, 305b, 306b, 401b, 402b, 501b, 502b: sealing device 206, 306, 402, 502: the second valve plate 207, 307, 403, 503: the first drive device 208, 308, 404, 504: second drive device 209,309,405,505: first opening 210, 310, 406, 506: second opening 305a, 306a, 501a, 502a: sealing steps 311,507: First Step 312,508: second step 400,500: sealed shell S1, S2: steps X1, X2, X3, X4: horizontal direction Y1, Y2, Y3, Y4: up and down direction

Figure 1 is a top view of a substrate processing system according to the present invention; 2 is a schematic diagram of a cross-sectional structure of a substrate processing system according to the present invention; 3 is a schematic view of the structure of the first valve plate sealing the first substrate transfer port in the substrate processing system of FIG. 2; 4 is a schematic structural view of the second valve plate sealing the second substrate transfer port in the substrate processing system of FIG. 2; 5 is a schematic cross-sectional structure diagram of another substrate processing system according to the present invention; 6 is a schematic structural view of the first valve plate sealing the first substrate transfer port in the substrate processing system of FIG. 5; FIG. 7 is a schematic structural view of the second valve plate sealing the second substrate transfer port in the substrate processing system of FIG. 5; FIG. Figure 8 is a schematic structural view of a valve plate assembly for a substrate processing system according to the present invention; Figure 9 is a side view of the first valve plate in the valve plate assembly of Figure 8; Figure 10 is a schematic structural view of another valve plate assembly for a substrate processing system according to the present invention; Figure 11 is a side view of the first valve plate in the valve plate assembly of Figure 10; FIG. 12 is a flowchart of the working method of the substrate processing system according to the present invention.

200: first cavity

201: The first substrate transfer port

202: second cavity

203: second substrate transfer port

204: Sealed shell

205: The first valve plate

206: The second valve plate

207: The first drive device

208: second drive device

209: The first opening

210: second opening

X1: horizontal direction

Y1: Up and down direction

Claims (22)

A substrate processing system, including: A first cavity, the first cavity having a first substrate transfer port; A second cavity, the second cavity has a second substrate transfer port, the second cavity and the first cavity are arranged in a horizontal direction; A sealed shell located between the first cavity and the second cavity, the sealed shell communicating with the first substrate transfer port and the second substrate transfer port; A first valve plate located in the sealed housing; A second valve plate located in the sealing shell, the second valve plate and the first valve plate are stacked up and down; A first driving device for moving the first valve plate to seal the first substrate transfer port; A second driving device is used to move the second valve plate to seal the second substrate transfer port. The substrate processing system according to claim 1, wherein the first driving device and the second driving device both include an up-and-down power device and a horizontal power device, and the up-and-down power device is used to make the first valve plate or the The second valve plate moves up and down, and the horizontal power device is used to move the first valve plate or the second valve plate in a horizontal direction. The substrate processing system according to claim 1, wherein the sealed housing includes a first opening and a second opening, the first opening corresponds to the first substrate transfer port, and the second opening corresponds to the second substrate Corresponding to the film transmission port. The substrate processing system according to claim 3, wherein when the opening area of the first opening is greater than the opening area of the first substrate transfer port, the first valve plate is used to seal the first substrate transfer port or The first opening. The substrate processing system according to claim 3, wherein when the opening area of the first opening is less than or equal to the opening area of the first substrate transfer port, the first valve plate is used to seal the first opening. The substrate processing system according to claim 3, wherein a sealing device is provided on the side of the first valve plate to achieve close contact with the first substrate transfer port or the first opening. The substrate processing system according to claim 3, wherein a first step is provided around the first substrate transfer port or the first opening, and the first valve plate is provided with a first step matching the first step. A sealing step, the first valve plate further includes a sealing device arranged on the sealing step, and the sealing device is used to achieve a seal between the sealing step and the first step. The substrate processing system according to claim 3, wherein when the opening area of the second opening is larger than the opening area of the second substrate transfer port, the second valve plate is used to seal the second substrate transfer port or The second opening. The substrate processing system according to claim 3, wherein when the opening area of the second opening is less than or equal to the opening area of the second substrate transfer port, the second valve plate is used to seal the second opening. The substrate processing system according to claim 3, wherein a sealing device is provided on the side of the second valve plate to achieve close contact with the second substrate transfer port or the second opening. The substrate processing system according to claim 3, wherein a second step is provided around the second substrate transfer port or the second opening, and the second valve plate is provided with a second step matching the second step. A sealing step, the second valve plate further includes a sealing device arranged on the sealing step, and the sealing device is used to achieve a seal between the sealing step and the second step. The substrate processing system according to claim 1, wherein the first cavity is a process cavity, and the second cavity is a transfer cavity. The substrate processing system according to claim 12, wherein when the number of the process chambers is greater than one, the process chambers greater than one surround the transfer chamber; each of the process chambers and the transfer chamber has the The first valve plate, the second valve plate and the sealing shell. The substrate processing system according to claim 1, wherein the first cavity is a load lock cavity, and the second cavity is a transfer cavity. The substrate processing system according to claim 1, wherein the size of the first valve plate and the second valve plate are equal or not equal. A valve plate assembly for a substrate processing system, including: A first valve plate; A second valve plate stacked up and down with the first valve plate; A sealing shell located on the periphery of the first valve plate and the second valve plate, the sealing shell having a first opening and a second opening along the horizontal direction; A first driving device for moving the first valve plate in the vertical and horizontal directions; A second driving device is used to move the second valve plate in the vertical and horizontal directions. The valve plate assembly according to claim 16, wherein the first valve plate and the second valve plate both include a sealing device. The valve plate assembly according to claim 17, wherein the sealing device is disposed on a side wall of the first valve plate and/or the second valve plate. The valve plate assembly according to claim 17, wherein a first step is provided around the first opening, the first valve plate is provided with a sealing step matching the first step, and the sealing of the first valve plate The device is located on the sealing step; a second step is provided around the second opening, the second valve plate is provided with the sealing step matching the second step, and the sealing device of the second valve plate is located on the sealing step superior. The valve plate assembly according to claim 16, wherein the first driving device and the second driving device each include an up-and-down power device and a horizontal power device, and the up-and-down power device is used to make the first valve plate or the second The two valve plates move up and down, and the horizontal power device is used to move the first valve plate or the second valve plate in a horizontal direction. A working method of a substrate processing system includes: Provide the substrate processing system according to any one of claim 1 to 15; The first drive device is used to move the first valve plate to seal the first substrate transfer port, and/or the second drive device is used to move the second valve plate to seal the second substrate transfer port. The working method according to claim 21, wherein when the first valve plate seals the first substrate transfer port, the second valve plate is replaced; or, when the second valve plate seals the second substrate transfer port When, replace the first valve plate.

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