TWI627510B - Substrate processing device - Google Patents

Abstract

The object of the present invention is to reduce the vibration to the exposure unit, and to perform the exposure using the exposure unit more appropriately. Substrate processing device (U3), which includes a vibration isolator (131) provided on the installation surface (E), and an exposure unit (121) disposed on the vibration isolator (131) to perform exposure processing on the supplied substrate (P) And a position adjustment unit (120) and a driving unit (122) provided on the setting surface (E) and in a non-contact independent state setting with the exposure unit (121) as a processing unit for processing the exposure unit (121) .

Description

Substrate processing device

The present invention relates to a substrate processing apparatus, a component manufacturing system, a component manufacturing method, and a pattern forming apparatus for forming a pattern for an electronic component on a substrate.

Conventionally, as disclosed in Japanese Patent Application Laid-Open No. 9-219353, as a substrate processing apparatus, an exposure apparatus that exposes a component pattern on a substrate provided on a mobile stage that moves on a platform is widely known. The platform of this exposure device is supported on a base by a frame member having a vibration isolation mechanism. The moving carrier moves in the X direction on a movable guide provided on the platform. The movable guide moves in the Y direction on the platform by two linear motors provided on the base. Two linear motors are set on both sides in the X direction of the base and move the movable guide in the Y direction in a non-contact manner. That is to say, each linear motor has a mover and a fixer. The fixer is fixed on the abutment, and the mover is fixed on both sides of the movable guide in the X direction. The mover and the fixer are in a non-contact state. In the exposure device of the aforementioned Japanese Patent Application Laid-Open No. 9-219353, since the movable element and the fixed element of the linear motor are in a non-contact state, the vibration caused by interference is suppressed from being transmitted to the platform through the movable guide and the moving stage.

The exposure device of the aforementioned Japanese Patent Application Laid-Open No. 9-219353 uses two linear motors to move the movable guide on the platform in the Y direction. Similarly, the movement of the movable stage relative to the movable guide is also performed using a linear motor. In this case, the linear motor also moves the moving stage to the X direction without contact. mobile. However, since the mobile carrier is moved by relatively movable guides on the platform, vibrations caused by the movement of the mobile carrier may be transmitted to the platform.

In addition, the exposure device of the aforementioned Japanese Patent Application Laid-Open No. 9-219353 is not limited to this structure, although the exposure is performed by holding the substrate on a moving stage, and there is also a case where a thin film substrate is supplied in a continuous state, and an element pattern is provided on the supplied substrate. Scanning exposure. In this case, there is a possibility that the substrate vibrates when the substrate is supplied.

The various aspects of the present invention have been made in view of the above-mentioned problems, and an object thereof is to provide a substrate processing apparatus, a component manufacturing system, and a component that can further reduce the vibration to the exposure unit and can perform exposure using the exposure unit very suitably. Manufacturing method and pattern forming device.

A first aspect of the present invention is a substrate processing apparatus including: a vibration isolation table provided on a setting surface; an exposure unit disposed on the vibration isolation table to perform exposure processing on a supplied substrate; and a processing unit configured to The exposure unit is set on the setting surface and in an independent state without contact with the exposure unit, and the exposure unit is processed.

In the aforementioned substrate processing apparatus according to the first aspect of the present invention, the processing unit includes a position adjustment unit that adjusts the position of the substrate supplied to the exposure unit in the width direction; the position adjustment unit has: a base A table is provided on the setting surface; a width moving mechanism is provided on the base table, and the substrate is moved in the width direction of the substrate relative to the base table; and a fixed roller is provided on the base table, and After the position adjustment by the width moving mechanism, the substrate is guided to the exposure unit, and the position relative to the base is fixed.

The aforementioned substrate processing apparatus according to the first aspect of the present invention may further include: a first substrate detecting section fixed on the base, detecting a position of the substrate supplied to the fixed roller in a width direction; and a control section, Controlling the width shift according to the detection result of the first substrate detecting section A moving mechanism to correct the position of the substrate supplied to the fixed roller in the width direction to the first target position.

According to the first aspect of the substrate processing apparatus of the present invention, the position adjustment unit may further include a roller position adjustment mechanism that adjusts the position of the fixed roller relative to the exposure unit; and further includes: a second substrate detection unit, which is fixed at On the vibration isolation table, the position of the substrate supplied to the exposure unit is detected; and the control unit controls the roller position adjustment mechanism based on the detection result of the second substrate detection unit so as to be supplied to the exposure unit. The position of the substrate is corrected to the second target position.

The aforementioned substrate processing apparatus according to the first aspect of the present invention may further include: a pressing mechanism for pressing the substrate supplied from the position adjustment unit to the exposure unit to impart tension; and a second substrate detection section for providing The position of the substrate supplied to the exposure unit is detected on the vibration isolation table; and the control unit controls the pressing mechanism according to the detection result of the second substrate detection unit to adjust the amount of pressing on the substrate.

The substrate processing apparatus according to the first aspect of the present invention, wherein the processing unit includes a driving unit that drives the exposure unit; the exposure unit includes a photomask holding member that holds a photomask illuminated by the illumination light, and supports from the photomask A substrate supporting member of the substrate projected by the projection light; the driving unit includes a mask-side driving portion that drives the mask holding member to move the mask in the scanning direction, and moves the substrate in the scanning direction The substrate-side driving portion of the substrate supporting member is driven.

In the substrate processing apparatus according to the first aspect of the present invention, the exposure unit includes a first frame supporting the mask holding member and a second frame supporting the substrate supporting member; and the vibration isolation table includes The first vibration isolator between the installation surface and the first frame, and A second vibration isolator between the mounting surface and the second frame.

In the substrate processing apparatus according to the first aspect of the present invention, the exposure unit includes a frame supporting the mask holding member and the substrate supporting member; and the vibration isolation table is provided between the installation surface and the frame.

In the substrate processing apparatus according to the first aspect of the present invention, the mask holding member holds the mask having a mask surface having a first curvature radius centered on the first axis; The mask holding member is driven by rotation to move the mask in the scanning direction; the substrate supporting member supports the substrate along a supporting surface with a second curvature radius centered on the second axis; The substrate supporting member is driven to rotate to move the substrate in the scanning direction.

In the aforementioned substrate processing apparatus according to the first aspect of the present invention, the photomask holding member holds the photomask having a flat photomask surface; and the photomask-side driving section drives the photomask holding member in a straight line, Moving the photomask in the scanning direction; the substrate supporting member supports the substrate along a supporting surface with a second radius of curvature centered on the second axis; and the substrate-side driving section drives the substrate supporting member to rotate so that The substrate moves in the scanning direction.

In the substrate processing apparatus according to the first aspect of the present invention, the mask holding member holds the mask having a mask surface having a first curvature radius centered on the first axis; the mask-side driving section, The photomask holding member is rotated to drive the photomask in the scanning direction; the substrate supporting member has a pair of support rollers that support both sides of the substrate in the scanning direction to be rotatable so that the substrate has a flat surface. ; The substrate-side driving section drives the pair of support rollers to rotate the substrate in the scanning direction by rotating.

A second aspect of the present invention is a component manufacturing system including the substrate processing apparatus of the first aspect of the present invention, a substrate supply apparatus that supplies the substrate to the substrate processing apparatus, And a substrate recovery device that recovers the substrate processed by the substrate processing device.

According to the second aspect of the present invention, in the component manufacturing system, the substrate supply device includes a first bearing portion, and the substrate is rotatably supported by a supply roll wound in a roll shape; and a first lifting mechanism. To raise and lower the first bearing portion; an entering angle detecting unit for detecting an entering angle of the substrate sent from the supply reel to the first roller to which the substrate is to be wound; and a control unit detecting based on the entering angle The detection result of the control unit controls the first lifting mechanism to correct the entry angle to the target entry angle.

In the aforementioned component manufacturing system according to a second aspect of the present invention, the substrate recovery device includes a second bearing unit that rotatably supports a recovery roll wound on the substrate after being processed by the substrate processing device. A second lifting mechanism that raises and lowers the second bearing portion; a discharge angle detection portion that detects a discharge angle of the substrate relative to a second roller wound around the substrate sent to the recycling roll; and a control portion, based on The detection result of the discharge angle detection unit controls the second lifting mechanism to correct the discharge angle to a target discharge angle.

A third aspect of the present invention is a component manufacturing method, which includes an operation of exposing the substrate using the substrate processing apparatus of the first aspect of the present invention, and processing the substrate subjected to the exposure process to form the photomask. Patterned motion.

According to a fourth aspect of the present invention, a pattern is formed at a predetermined position on the sheet-like substrate while the long flexible sheet-like substrate is being transported in the longitudinal direction, and includes: a patterning device, and the patterning device A transport unit including a plurality of guide rollers for transporting the sheet substrate along a predetermined transport path in a longitudinal direction, and a portion provided on a part of the transport path for forming the pattern at the predetermined position on the surface of the sheet substrate A pattern forming section; a vibration-removing device provided between a base surface on which the patterning device is provided and the patterning device; a position adjusting device connected to the pattern The forming devices are separately provided on the base surface, and include guide rollers for sending the sheet substrate toward the conveying section of the patterning device, and adjust the sheet in a width direction orthogonal to the length direction of the sheet substrate. The position of the substrate; the substrate error measurement unit measures the position change, posture change of the sheet substrate in the width direction, or the deformation of the sheet substrate in the width direction relative to the pattern forming portion. Change information; and a control device that controls the position adjustment device according to the change information.

In the aforementioned pattern forming apparatus according to a fourth aspect of the present invention, the substrate error measuring unit can measure the change information by detecting an edge in the width direction of the sheet substrate or a mark formed on the sheet substrate. .

According to a fourth aspect of the present invention, in the pattern forming apparatus, the substrate error measuring section is provided in at least one of the patterning apparatus and the position adjusting apparatus.

A fifth aspect of the present invention is a patterning device that forms a pattern at a predetermined position on a sheet-like substrate while conveying a long flexible sheet-like substrate in a longitudinal direction, and includes: a patterning device, The patterning device includes a conveying unit including a plurality of guide rollers for conveying the sheet substrate along a predetermined conveying path in a lengthwise direction, and the predetermined position provided on a part of the conveying path on the surface of the sheet substrate. A pattern forming portion for forming the pattern; a vibration-removing device is provided between the base surface on which the patterning device is provided and the patterning device; a position adjusting device is provided on the base surface independently of the patterning device, and includes A guide roller for feeding the sheet substrate toward the conveying section of the patterning device, and adjusting the position of the sheet substrate in a width direction orthogonal to the length direction of the sheet substrate; a position error measuring section measures Change information of a relative position change of the patterning device and the position adjustment device; and a control device that controls the position adjustment device according to the change information.

The pattern forming apparatus according to a fifth aspect of the present invention may be provided in the patterning apparatus, and on the upstream side of the transport path with respect to the pattern forming section, under a state of a predetermined tension in the longitudinal direction, so that the A tiltable adjustment roller arranged in a manner that the conveying path of the sheet substrate is bent; the control device tilts the adjustment roller according to the change information to adjust the width direction position of the sheet substrate conveyed to the pattern forming portion.

A sixth aspect of the present invention is a component manufacturing system that, while conveying a long flexible sheet substrate in a lengthwise direction, sequentially performs a first treatment and a second treatment on the sheet substrate, and the device includes: : The first processing unit is provided on a predetermined base surface, and includes a plurality of rollers for transporting the sheet substrate along a predetermined transport path in a length direction, and applying the first treatment to the sheet substrate; the second treatment The unit is provided on the base surface, and includes a plurality of rollers that transport the sheet substrate sent from the first processing unit along a predetermined transport path in a longitudinal direction, and applies the second treatment to the sheet substrate; A device for isolating or suppressing vibration transmission between the abutment surface and the first processing unit, or vibration transmission between the abutment surface and the second processing unit, or between the first processing unit and the second processing unit Vibration transmission; The change measurement unit measures changes in the relative position of the first processing unit and the second processing unit, or is related to changes in the position of the sheet-like substrate transferred from the first processing unit to the second processing unit Change information; and position adjustment The device adjusts the position of the sheet substrate carried into the second processing unit in the width direction orthogonal to the length direction according to the change information.

According to the sixth aspect of the present invention, in the component manufacturing system, the second processing unit may include a pattern for forming an electronic component in a longitudinal direction of the sheet substrate, and projecting a light-sensing layer formed on a surface of the sheet substrate. An exposure device corresponding to the light energy of a pattern, or by coating an ink containing any of a conductive material, an insulating material, and a semiconductor material on the surface of the sheet substrate. A patterning device for any one of the printing devices that draws the pattern.

In the aforementioned component manufacturing system according to a sixth aspect of the present invention, the first processing unit is a single or a plurality of pre-treatments for performing processing equivalent to the step before the processing is performed on the sheet substrate by the patterning device. Device configuration; the position adjusting device is provided on the conveying path of the sheet substrate and is disposed in the pre-processing device preceding the patterning device, or between the previous pre-processing device and the patterning device.

According to the sixth aspect of the present invention, in the component manufacturing system, the position adjustment device includes a plurality of rotating rollers which are guided and conveyed after the sheet substrate is bent in the longitudinal direction, and a part of the plurality of rotating rollers is rotated. A drive mechanism that moves in parallel with the direction of the rotation center axis, and a control unit that controls the drive mechanism based on the change information measured by the change measurement unit.

According to the sixth aspect of the present invention, in the component manufacturing system, the position adjustment device includes a plurality of rotating rollers which are guided and conveyed after the sheet substrate is bent in the longitudinal direction, and a part of the plurality of rotating rollers is rotated. A driving section having a tilted rotation center axis, and a control section for controlling the driving section based on the change information measured by the change measuring section.

In the aforementioned component manufacturing system according to a sixth aspect of the present invention, the change measurement section includes a conveyance path of the sheet substrate disposed between the first processing unit and the second processing unit, and will be positively aligned with the longitudinal direction. The change in the inclination related to the width direction of the sheet substrate is used as a sensor for detecting the change information.

According to the aforementioned aspects of the present invention, it is possible to provide a substrate processing apparatus, a component manufacturing system, a component manufacturing method, and a pattern forming apparatus that can further reduce the vibration to the exposure unit and can perform the exposure using the exposure unit very suitably.

1‧‧‧component manufacturing system

2‧‧‧ substrate supply device

4‧‧‧ substrate recovery device

5‧‧‧ Higher-level control device (control section)

11‧‧‧Mask holding mechanism

12, 12a‧‧‧ substrate support mechanism (substrate transfer mechanism)

13, 13a‧‧‧lighting institution

16‧‧‧ Lower control device (control part)

21‧‧‧Mask stage

21a‧‧‧mask holding cylinder

22‧‧‧Mask side drive

23‧‧‧Transfer component

25‧‧‧ rotating tube

25a‧‧‧End side area of rotating barrel

25c‧‧‧ Ruler board

26‧‧‧ Substrate-side driver

28‧‧‧Guide roller

61‧‧‧The first optical system

62‧‧‧Second Optical Department

63‧‧‧ projection field diaphragm

64‧‧‧ Focus Correction Optical Component

65‧‧‧Image moving optical components

66‧‧‧Optical member for magnification correction

67‧‧‧rotation correction mechanism

70‧‧‧The first deflection member

71‧‧‧1st lens group

72‧‧‧ 1st concave mirror

80‧‧‧The second deflection member

81‧‧‧ 2nd lens group

82‧‧‧ 2nd concave mirror

93‧‧‧Guide roller

94‧‧‧Drive roller (capstan roller)

111‧‧‧The first bearing section

112‧‧‧The first lifting mechanism

114‧‧‧ Entered the angle detection section

120, 120a‧‧‧Position adjustment unit

121, 121a ~ 121c‧‧‧ exposure unit

121d‧‧‧dust cover

122‧‧‧Drive unit

123‧‧‧The first substrate inspection section

124‧‧‧Second substrate inspection section

125‧‧‧ abutment

126‧‧‧fixed roller

127‧‧‧ transport roller

128‧‧‧ abutment position adjustment mechanism

130‧‧‧Pressing mechanism

131‧‧‧Damper

131a‧‧‧The first vibration isolation table

131b‧‧‧Second vibration isolator

132‧‧‧device frame

132a‧‧‧Frame 1

132b‧‧‧Frame 2

135‧‧‧The first lower frame

135a‧‧‧foot

135b‧‧‧upper face

136‧‧‧The first upper frame

136a‧‧‧foot

136b‧‧‧upper face

137‧‧‧arm

139‧‧‧ lower part

140‧‧‧bearing department

141‧‧‧air bearing

143‧‧‧ holding member

145‧‧‧washer member

146‧‧‧ Pillar Framework

151‧‧‧Pressing member

152‧‧‧Lifting mechanism

160‧‧‧Position adjustment unit

161‧‧‧Second bearing section

162‧‧‧The second lifting mechanism

164‧‧‧Exhaust angle detection section

165‧‧‧3rd substrate inspection section

167‧‧‧Transport roller

170‧‧‧ abutment

180‧‧‧ Device frame

181‧‧‧Face under the device frame

182‧‧‧bearing department

183‧‧‧Middle

184‧‧‧foot

185‧‧‧upper face

186‧‧‧arm

196‧‧‧Drive roller

197‧‧‧air carrier

198‧‧‧1 / 4 wave plate

202a, 202b‧‧‧Testing Department

204‧‧‧ Lower control device

206‧‧‧Actuator

207b‧‧‧Ontology framework

210‧‧‧ exposure head

212‧‧‧lower control device

214‧‧‧Substrate adjustment section

214a‧‧‧bearing

208‧‧‧Second substrate inspection section

216‧‧‧ Irradiation

218‧‧‧Light receiving system

220‧‧‧light projection department

222‧‧‧ cylindrical lens

224, 226‧‧‧Mirror

228‧‧‧ Department of Imaging Optics

230‧‧‧Photographic element

230a‧‧‧shooting area

234‧‧‧ Relative position detection unit

236‧‧‧The first detection department

238‧‧‧Second Detection Section

240a, 240b ‧‧‧light projection department

242a, 242b‧‧‧ Light receiving section

244‧‧‧photodiode

252‧‧‧ collection lens

254‧‧‧Drawing optical element (light modulator)

256‧‧‧ Absorber

258‧‧‧Collimating lens

260‧‧‧Reflector

262‧‧‧ cylindrical lens

264‧‧‧Focus lens

266‧‧‧Reflector

268‧‧‧ polygon mirror (light scanning member)

270‧‧‧Reflector

272‧‧‧f-θ lens

274‧‧‧ cylindrical lens

A3‧‧‧ pattern formation area

A4‧‧‧pattern non-formation area

A7‧‧‧Exposure area

AM1, AM2‧‧‧ aiming microscope

AR1, AR2‧‧‧‧Adjustment roller

AX1‧‧‧rotation centerline

AX2‧‧‧rotation axis

AX3a, AX3b‧‧‧rotation axis

BT1 ~ BT3‧‧‧‧Treatment tank

BX2‧‧‧ 2nd optical axis

BX3‧‧‧3rd optical axis

CL‧‧‧ center plane

CUr, CUs‧‧‧ Coil Unit

DR1‧‧‧Press roller

DR2‧‧‧Coating roller

DT1, DT2‧‧‧Position Sensor

DU1 ~ DU5‧‧‧Drawing unit

E‧‧‧Setting surface

ECV‧‧‧Adjust greenhouse

EH‧‧‧Read head

EL1‧‧‧illuminating beam

EL2‧‧‧ Projected Beam

EPC1, EPC2, EPC3, EPC3a‧‧‧Edge Position Controller

FR1‧‧‧ supply reel

FR2‧‧‧Recycling roll

Gp1‧‧‧coating mechanism

Gp2‧‧‧drying mechanism

HA1‧‧‧Heating room

HA2‧‧‧cooling room

IL‧‧‧ Department of Lighting Optics

IL1 ~ IL6‧‧‧Lighting Module

ILa1 ~ ILa6‧‧‧Lighting Module

IR1 ~ IR6‧‧‧Lighting area

Ks‧‧‧ alignment mark

M, MB‧‧‧Photomask

MA‧‧‧Cylinder Mask

MUr, MUs‧‧‧magnet unit

NA‧‧‧Drive roller

P‧‧‧ substrate

P2‧‧‧bearing surface

P3 ~ P6‧‧‧‧ 1st ~ 4th reflecting surface

P7‧‧‧Middle image plane

PA1 ~ PA6‧‧‧‧ projection area

PBS‧‧‧polarized beam splitter

R2, R3, R4, R5, R6, R7‧‧‧ drive rollers

Rs3‧‧‧Guide roller

RT‧‧‧ Rotator

RT1, RT2, RT3 ‧‧‧ tension roller

PA1 ~ PA6‧‧‧‧ projection area

PL‧‧‧ Projection Optics

PL1 ~ PL6‧‧‧‧Projection Module

Rfa‧‧‧curvature radius

SG1, SG2‧‧‧Position Sensor

U1 ~ Un‧‧‧Processing device

FIG. 1 is a diagram showing the configuration of a component manufacturing system according to the first embodiment.

FIG. 2 is a diagram showing a simplified configuration of the component manufacturing system of the first embodiment.

FIG. 3 is a diagram showing a partial configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment.

FIG. 4 is a diagram showing a partial configuration of an exposure apparatus according to the first embodiment shown in FIG. 3. FIG.

FIG. 5 is a diagram showing the overall configuration of an exposure unit according to the first embodiment.

FIG. 6 is a diagram showing the arrangement of the illumination area and the projection area of the exposure unit shown in FIG. 5.

FIG. 7 is a diagram showing a configuration of a projection optical system of the exposure unit shown in FIG. 5.

Fig. 8 is a flowchart showing a device manufacturing method according to the first embodiment.

FIG. 9 is a diagram showing a partial configuration of an exposure apparatus (substrate processing apparatus) according to a second embodiment.

FIG. 10 is a diagram showing the overall configuration of an exposure unit according to the second embodiment of FIG. 9. FIG.

FIG. 11 is a diagram showing the overall configuration of an exposure unit according to a third embodiment.

Fig. 12 is a diagram showing a configuration of an exposure apparatus according to a fourth embodiment.

FIG. 13 is a diagram when the substrate conveyed in the exposure apparatus shown in FIG. 12 is viewed from the + Z direction side.

FIG. 14 is a diagram when the substrate P transferred between the last roller on the position adjustment unit side and the first roller on the exposure unit side shown in FIG. 13 is viewed from the −Y direction side.

FIG. 15 is a diagram when the substrate carried by the rotating cylinder shown in FIG. 12 is viewed from the −X direction side.

FIG. 16 is a diagram showing a configuration of a substrate adjustment section shown in FIG. 12.

FIG. 17A is a diagram showing the configuration of the second substrate detection unit shown in FIG. 12, FIG. 17B is a diagram showing a light beam irradiated to the substrate by the second substrate detection unit, and FIG. 17C is a light beam received by the second substrate detection unit Illustration.

FIG. 18 is a diagram showing a configuration of a relative position detection unit shown in FIG. 12.

FIG. 19 is a diagram showing a scanning line of a point light scanned on a substrate with the exposure head shown in FIG. 12 and a view aligned with a microscope.

FIG. 20 is a diagram showing a configuration of a drawing unit of the exposure head shown in FIG. 12.

Preferred embodiments of the substrate processing apparatus, the component manufacturing system, the component manufacturing method, and the pattern forming apparatus according to various aspects of the present invention will be described below, with reference to the accompanying drawings and the following detailed description. In addition, aspects of the present invention are not limited to these embodiments, and include various changes or improvements. That is to say, the constituent elements described below include things that are easily conceivable by the practitioner and those that are substantially the same, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, and changes of constituent elements can be made without departing from the scope of the present invention.

[First Embodiment]

The substrate processing apparatus of the first embodiment is an exposure apparatus that applies an exposure process to a substrate. The exposure apparatus is equipped with a component manufacturing system that applies various processes to the exposed substrate to manufacture electronic components. First, a component manufacturing system will be described.

<Component manufacturing system>

FIG. 1 is a diagram showing a configuration of a component manufacturing system 1 according to the first embodiment. The component manufacturing system 1 shown in FIG. 1 is a production line (flexible display production line) for manufacturing flexible displays as electronic components (sometimes also referred to as components). Examples of the flexible display include an organic EL display. This component manufacturing system 1 is configured to send out the substrate P from a supply roll FR1 in which a flexible substrate (sheet substrate) P is wound into a roll, and to continuously perform various processes on the substrate P to be sent out. , Will The processed substrate P is wound by a so-called roll-to-roll method in which the reel FR2 is wound. In the component manufacturing system 1 of the first embodiment, it is shown that the film-like sheet substrate P is sent out from the supply roll FR1, and the substrate P sent out from the supply roll FR1 is sequentially passed through n processing units U1, U2. Examples after U3, U4, U5, ..., Un are wound around the reel FR2. Hereinafter, the substrate P as a processing target of the element manufacturing system 1 will be described first.

The substrate P is a foil made of a metal or an alloy such as a resin film and stainless steel. For the material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, and polycarbonate can be used. One or two or more kinds of materials such as ester resin, polystyrene resin, and polyvinyl alcohol resin. In addition, the thickness and rigidity (Young's coefficient) of the substrate P may be in a range that does not cause creases and irreversible wrinkles due to bending on the substrate P during transportation. When manufacturing flexible display panels, touch panels, color filters, electromagnetic wave prevention filters, and other electronic components, PET (polyethylene terephthalate) with a thickness of 25 μm to 200 μm is used. ) Or PEN (polyethylene naphthalate) and other resin sheets.

The substrate P is preferably selected such that, for example, the coefficient of thermal expansion is significantly small, and the amount of deformation caused by heat in various processes performed on the substrate P can be substantially ignored. In addition, an inorganic filler such as titanium oxide, zinc oxide, aluminum oxide, or silicon oxide can be mixed into the resin film as a base material to reduce the coefficient of thermal expansion. In addition, the substrate P may be a single-layered body of ultra-thin glass having a thickness of about 100 μm produced by a float method or the like, or a laminated body in which the above-mentioned thin resin film, a foil of aluminum, copper, or the like is bonded to the extremely thin glass.

The flexibility of the substrate P refers to a property that the substrate P can be flexed without exerting a degree of weight on the substrate P without causing shear or breakage. And flexibility includes weight Degree of force and bent nature. In addition, the degree of flexibility varies depending on the material, size, and thickness of the substrate P, the layer structure of the film formed on the substrate P, temperature, humidity, and the environment. In any case, as long as the substrate P is correctly wound around various conveyance direction changing members such as the conveyance rollers and the rotating drum provided in the conveyance path provided in the component manufacturing system 1 of the present embodiment, it will not be produced by bending. Creases, breaks (cavities or cracks), and smooth transfer of the substrate P are all in the range of flexibility.

The substrate P configured in this manner is wound into a roll shape to become a supply roll FR1, and this supply roll FR1 is mounted on the component manufacturing system 1. The component manufacturing system 1 equipped with the supply roll FR1 repeatedly performs various processes for manufacturing one component on the substrate P sent out from the supply roll FR1. Therefore, the processed substrate P is in a state where a plurality of electronic components are connected. That is, the substrate P sent out from the supply roll FR1 is a multi-sided substrate. In addition, the substrate P may be a person whose surface is modified and activated by a predetermined pretreatment in advance, or a fine partition wall structure (concavo-convex structure) formed on the surface for precise patterning.

The processed substrate P and the processed substrate P are wound into a roll shape and recovered as a recovery roll FR2. The reel FR2 is mounted on a cutting device (not shown). A cutting device equipped with a recycling roll FR2 divides (cuts) the processed substrate P into individual components, thereby forming a plurality of components. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (direction of the short side), and more than 10 m in the length direction (length direction). Of course, the size of the substrate P is not limited to the above-mentioned size.

Next, a component manufacturing system 1 will be described with reference to FIG. 1. Figure 1 is an orthogonal coordinate system in which the X, Y and Z directions are orthogonal. The X direction is the direction in which the substrate P is transported in the horizontal plane, and the direction connecting the supply roll FR1 and the recovery roll FR2. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. Y direction supply roll FR1 and roll for recycling The axis direction of the tube FR2. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction.

Element manufacturing system 1 includes a substrate supply device 2 for supplying a substrate P, a processing device U1 to Un that performs various processes on the substrate P supplied from the substrate supply device 2, and a method for recovering the substrate P that is processed by the processing devices U1 to Un. The substrate recovery device 4 and each device of the control element manufacturing system 1 have a higher-level control device 5.

A supply roll FR1 is rotatably mounted on the substrate supply device 2. The substrate supply device 2 includes a drive roller R1 that sends out a substrate P from a mounted supply roll FR1, and an edge position controller EPC1 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller R1 rotates while holding the front and back surfaces of the substrate P, and sends out the substrate P from the supply roll FR1 toward the conveying direction (+ X direction) of the recovery roll FR2, thereby supplying the substrate P to the process Device U1 ~ Un. At this time, the edge position controller EPC1 moves the substrate P to the position of the substrate P in the width direction end (edge) relative to the target position within a range of ± tens of μm to ± tens of μm The width direction is to correct the position of the substrate P in the width direction.

A reel roll FR2 is rotatably mounted on the substrate recovery device 4. The substrate recovery device 4 includes a driving roller R2 that pulls the processed substrate P toward the recovery roll FR2 side, and an edge position controller EPC2 that adjusts the position of the substrate P in the width direction (Y direction). The substrate recovery device 4 rotates while holding the front and back surfaces of the substrate P with the driving roller R2, pulls the substrate P in the conveying direction, and rotates the recovery roll FR2 to wind the substrate P accordingly. At this time, the edge position controller EPC2 is configured in the same manner as the edge position controller EPC1, and the position of the substrate P in the width direction is corrected to prevent the width direction end (edge) of the substrate P from being uneven in the width direction.

The processing device U1 is a coating device that applies a photosensitive functional liquid to the surface of the substrate P supplied from the substrate supply device 2. As the photosensitive functional liquid, for example, a photoresist or a photosensitive agent is used. Silane coupling agent, UV curing resin solution, other photosensitive plating reduction solution, etc. The processing device U1 is sequentially provided with a coating mechanism Gp1 and a drying mechanism Gp2 from the upstream side in the conveying direction of the substrate P. The coating mechanism Gp1 includes a pressure roller DR1 that winds the substrate P, and a coating roller DR2 that faces the pressure roller DR1. The coating mechanism Gp1 holds the substrate P with the pressure roller DR1 and the coating roller DR2 in a state where the supplied substrate P is wound on the pressure roller DR1. The coating mechanism Gp1 rotates the pressure roller DR1 and the coating roller DR2 to apply the photosensitive functional liquid with the coating roller DR2 while moving the substrate P in the conveying direction. The drying mechanism Gp2 blows dry air such as hot air or dry air to remove the solute (solvent or water) contained in the photosensitive functional liquid, and dries the substrate P coated with the photosensitive functional liquid to form a photosensitivity on the substrate P. Functional layer.

The processing device U2 is a heating device that heats the substrate P transferred from the processing device U1 to a predetermined temperature (for example, about several 10 to 120 ° C.) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P. The processing device U2 is provided with a heating chamber HA1 and a cooling chamber HA2 in this order from the upstream side in the transport direction of the substrate P. The heating chamber HA1 is provided with a plurality of rollers and a plurality of air turn bars inside, and the plurality of rollers and a plurality of air turn bars constitute a conveying path of the substrate P. A plurality of rollers are provided so as to contact the back surface of the substrate P, and a plurality of air reversing levers are provided on the surface side of the substrate P in a non-contact state. The plurality of rollers and the plurality of air reversing levers are elongated conveying paths of the substrate P, and meandering conveying paths. The substrate P in the heating chamber HA1 is heated to a predetermined temperature while being conveyed along a meandering conveyance path. The cooling chamber HA2 cools the substrate P to the ambient temperature so that the temperature of the substrate P heated in the heating chamber HA1 is consistent with the ambient temperature of the post-processing (processing device U3). The cooling chamber HA2 is provided with a plurality of rollers and a plurality of rollers in the same manner as the heating chamber HA1 and is arranged in a meandering conveying path in order to lengthen the conveying path of the substrate P. The substrate P in the cooling chamber HA2 is cooled while being transported along a meandering transport path. Cooling A driving roller R3 is provided on the downstream side in the conveying direction of the chamber HA2, and the driving roller R3 rotates while holding the substrate P passing through the cooling chamber HA2, thereby supplying the substrate P to the processing device U3.

The processing device (substrate processing device) U3 is an exposure device that projects a pattern such as a circuit or a wiring for a substrate (photosensitive substrate) P supplied from the processing device U2 with a photosensitive functional layer formed on the surface. The details will be described later. The processing unit U3 illuminates the penetrating mask M with an illumination beam, and projects and exposes the projection beam obtained by reflecting the illumination beam by the mask M on a part wound around a rotating tube (support tube) 25. Substrate P on the outer peripheral surface. The processing device U3 includes a driving roller R4 that transports the substrate P supplied from the processing device U2 to the downstream side in the conveying direction, and an edge position controller EPC3 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller R4 rotates while holding both the front and back surfaces of the substrate P to feed the substrate P to the downstream side in the conveying direction, thereby supplying the substrate P to the exposure position. The edge position controller EPC3 has the same configuration as the edge position controller EPC1, and corrects the position of the substrate P in the width direction so that the width direction of the substrate P at the exposure position becomes the target position. In addition, the processing device U3 includes two sets of driving rollers R5 and R6 that transport the substrate P to the downstream side in the conveying direction in a state where the slack DL is given to the substrate P after exposure. The two sets of driving rollers R5 and R6 are in the conveying direction of the substrate P. Arranged at predetermined intervals. The driving roller R5 rotates on the upstream side of the substrate P being conveyed, and the driving roller R6 rotates on the downstream side of the substrate P being conveyed, thereby supplying the substrate P to the processing device U4. At this time, since the substrate P is provided with the slack DL, it is possible to absorb the variation in the conveying speed which is located downstream of the driving roller R6 in the conveying direction, and it is possible to cut off the influence of the variation in the conveying speed on the exposure processing of the substrate P. In addition, an alignment microscope AM1 is provided in the processing device U3 to perform alignment of the image of a part of the mask pattern of the mask M and the relative position of the substrate P and detect an alignment mark or the like formed on the substrate P in advance. , AM2.

The processing device U4 is the exposed substrate P after being transported from the processing device U3. Wet processing equipment that performs wet development processing and electroless plating processing. The processing device U4 includes three processing tanks BT1, BT2, and BT3 and a plurality of rollers for transporting the substrate P in the vertical direction (Z direction). The plurality of rollers are arranged such that the substrate P sequentially passes through the conveying paths inside the three processing tanks BT1, BT2, and BT3. A driving roller R7 is provided downstream of the processing tank BT3 in the conveying direction. The driving roller R7 rotates while holding the substrate P passing through the processing tank BT3 to supply the substrate P to the processing apparatus U5.

Although not shown, the processing device U5 is a drying device for drying the substrate P transferred from the processing device U4. The processing device U5 adjusts the moisture content of the processing device U4 to be adhered to the substrate P by wet processing, and adjusts the moisture content to a predetermined moisture content. The substrate P dried by the processing device U5 is transported to the processing device Un after passing through several processing devices. After being processed by the processing apparatus Un, the substrate P is wound on the reel FR2 for recycling of the substrate recovery apparatus 4.

The higher-level control device 5 controls the substrate supply device 2, the substrate recovery device 4, and a plurality of processing devices U1 to Un. The higher-level control device 5 controls the substrate supply device 2 and the substrate recovery device 4, and transfers the substrate P from the substrate supply device 2 to the substrate recovery device 4. In addition, the higher-level control device 5 controls a plurality of processing devices U1 to Un in synchronization with the conveyance of the substrate P to perform various processes on the substrate P. This higher-level control device 5 includes a computer and a storage medium storing a program, and the computer executes the program stored in the storage medium to perform the function of the higher-level control device 5 of the first embodiment.

Moreover, in the component manufacturing system 1 of the first embodiment, the substrate P sent from the supply roll FR1 is sequentially exemplified by being passed around the n processing units U1 to Un and then wound around the recovery roll FR2. But it is not limited to this constitution. For example, the component manufacturing system 1 may have a structure in which the substrate P delivered from the supply roll FR1 is wound around the recovery roll FR2 after passing through a processing device. at this time When different processing is performed on the substrate P, the substrate supply device 2 and the substrate recovery device 4 are used to supply the substrate P to different processing devices again.

<Simplified component manufacturing system>

Next, in order to make it easy to grasp the special part of the present invention, the component manufacturing system 1 in which the component manufacturing system 1 in FIG. 1 is simplified will be described with reference to FIG. 2. FIG. 2 is a diagram showing a simplified configuration of the component manufacturing system 1 according to the first embodiment. As shown in FIG. 2, the simplified component manufacturing system 1 includes a substrate supply device 2, a processing device U3 (hereinafter referred to as an exposure device) as an exposure device, a substrate recovery device 4, and a higher-level control device 5. 2 is an orthogonal coordinate system orthogonal to the X direction, the Y direction, and the Z direction, and is the same orthogonal coordinate system as that of FIG. 1. In the simplified component manufacturing system 1, the substrate supply device 2 has a configuration in which the edge position controller EPC1 is omitted. This is because the edge position controller EPC3 is already provided in the exposure device U3. First, the substrate supply device 2 will be described with reference to FIG. 2.

<Substrate supply device>

The substrate supply device 2 includes a first bearing portion 111 on which the supply roll FR1 is mounted, and a first lifting mechanism 112 that raises and lowers the first bearing portion 111. The substrate supply device 2 includes an entry angle detection unit 114, and the entry angle detection unit 114 is connected to the host controller 5. Here, in the first embodiment, the higher-level control device 5 functions as a control device (control unit) as the substrate supply device 2. In addition, as a control device of the substrate supply device 2, a lower-level control device that controls the substrate supply device 2 may be provided, and the lower-level control device controls the substrate supply device 2.

The first bearing portion 111 rotatably supports the supply reel FR1. When the supply roll FR1 supported by the first bearing portion 111 is supported (sent out) toward the exposure device U3, the diameter of the supply roll FR1 decreases as the substrate P is sent out. Therefore, from supply roll FR1 The position at which the substrate P is sent out varies depending on the amount by which the substrate P is sent out.

The first lifting mechanism 112 is provided between the installation surface E and the first bearing portion 111. The first lifting mechanism 112 moves the first bearing portion 111 together with the supply roll FR1 in the Z direction (vertical direction). The first lifting mechanism 112 is connected to the higher-level control device 5. The higher-level control device 5 moves the first bearing portion 111 in the Z direction by the first lifting mechanism 112, that is, the position where the substrate P is fed out from the supply roll FR1 is at a predetermined position .

The entry angle detection unit 114 detects the entry angle θ 1 of the substrate P entering the conveyance roller 127 of the exposure device U3 described later. The entry angle detection unit 114 is provided around the conveyance roller 127. Here, the entering angle θ 1 is a straight line (Z axis) extending in the vertical direction passing the central axis of the conveying roller 127 in the XZ plane. (Parallel) and the angle formed by the substrate P on the upstream side of the transfer roller 127. The entry angle detection unit 114 outputs a detection result to the connected higher-level control device 5.

The higher-level control device 5 controls the first lifting mechanism 112 based on the detection result of the entering angle detection unit 114. Specifically, the higher-level control device 5 controls the first lifting mechanism 112 so that the entry angle θ 1 becomes a predetermined target entry angle. That is, the larger the amount of the substrate P sent from the supply roll FR1 and the smaller the diameter of the supply roll FR1, the larger the entry angle θ1 with respect to the target entry angle. Therefore, the higher-level control device 5 moves the first elevating mechanism 112 to the lower side (downward) in the Z direction, thereby reducing the entering angle θ 1 and correcting the entering angle θ 1 to the target entering angle. In this way, the higher-level control device 5 performs feedback control on the first lifting mechanism 112 based on the detection result of the entry angle detection unit 114 so that the entry angle θ 1 becomes the target entry angle. Therefore, since the substrate supply device 2 can constantly supply the substrate P at the target entry angle with respect to the conveying roller 127, the influence of the change in the entry angle θ 1 on the substrate P can be reduced. The feedback control may be P (proportional) control, PI (proportional integral) control, or PID (proportional integral derivative) control. Either control.

<Exposure device (substrate processing device)>

Next, the exposure apparatus U3 shown in FIG. 2 will also be described with reference to FIG. 3. The exposure device U3 includes a position adjustment unit 120, an exposure unit 121, a driving unit 122 (see FIG. 3), a pressing mechanism 130, and a vibration isolator (vibration isolator) 131. The vibration isolator 131 is provided on the installation surface E to reduce the vibration (so-called ground vibration) from the installation surface E to the body of the exposure unit 121. The position adjustment unit 120 is provided on the installation surface E and includes the edge position controller EPC3 shown in FIG. 1. The position adjustment unit 120 is disposed adjacent to the substrate supply device 2 in the X direction. The exposure unit 121 is provided on the vibration isolation table 131, and the position adjustment unit 120 is disposed on the opposite side of the substrate supply device 2 in the X direction. The driving unit 122 (see FIG. 3) is provided on the installation surface E, and is disposed adjacent to the exposure unit 121 in the Y direction. That is, the position adjusting unit 120, the exposure unit 121, and the driving unit 122 are disposed at different positions on the installation surface E. In addition, the exposure unit 121, the position adjustment unit 120, and the driving unit 122 (see FIG. 3) are mechanically in a non-coupled state (a non-contact independent state).

As described above, the position adjustment unit 120 and the driving unit 122 are provided on the installation surface E. On the other hand, the exposure unit 121 is provided on the installation surface E through the vibration isolation table 131. Therefore, the exposure unit 121, the position adjustment unit 120, and the driving unit 122 have different vibration modes. In other words, the exposure unit 121 is provided in a state that is isolated from the position adjustment unit 120 and the driving unit 122 in terms of vibration transmission (a state in which vibration is not easily transmitted to each other, that is, a state in which vibration is effectively isolated).

The exposure device U3 includes a first substrate detection unit 123 and a second substrate detection unit 124 that detect the position of the substrate P. The first substrate detection unit 123 and the second substrate detection unit 124 are connected to the host controller 5. In addition, in the exposure device U3, similarly to the substrate supply device 2, the function of the higher-level control device 5 is also a control device (control unit) of the exposure device U3. Of course, as exposure equipment When the control device of U3 is set, a lower-level control device for controlling the exposure device U3 can also be provided, and the lower-level control device can be configured to control the exposure device U3.

<Position adjustment unit>

As shown in FIG. 2, the position adjustment unit 120 includes a base 125, the aforementioned edge position controller EPC3 (width moving mechanism), and a fixed roller 126. The base 125 is provided on the installation surface E, and supports the edge position controller EPC3 and the fixed roller 126. The base 125 may also be a vibration isolation platform having a vibration isolation function. A base position adjustment mechanism 128 is provided on the base 125 to adjust the position of the base 125 in the Y direction or the rotation direction around the Z axis. The abutment position adjustment mechanism 128 is connected to the upper control device 5. The upper control device 5 can adjust the positions of the edge position controller EPC3 and the fixed roller 126 provided on the abutment 125 by controlling the abutment position adjustment mechanism 128. That is, the function of the abutment position adjustment mechanism 128 is a roller position adjustment mechanism that adjusts the position of the fixed roller 126 in the Y direction relative to the exposure unit 121.

The edge position controller EPC3 can move on the base 125 in the width direction (Y direction) of the substrate P. The edge position controller EPC3 includes a plurality of rollers including a transfer roller 127 provided on the most upstream side in the transfer direction of the transfer substrate P. The transfer roller 127 guides the substrate P supplied from the substrate supply device 2 into the position adjustment unit 120. The edge position controller EPC3 is connected to the higher-level control device 5, and is controlled by the higher-level control device 5 based on the detection result of the first substrate detection unit 123.

The fixed roller 126 guides the substrate P whose position is adjusted in the width direction by the edge position controller EPC3 to the exposure unit 121. The fixed roller 126 is rotatable, and the position relative to the base 125 is fixed. Therefore, by moving the substrate P in the width direction with the edge position controller EPC3, the position of the substrate P entering the fixed roller 126 in the width direction can be adjusted.

The first substrate detection unit 123 detects a position in the width direction of the substrate P transferred from the edge position controller EPC3 to the fixed roller 126. The first substrate detection unit 123 is fixed to the base 125. Therefore, the first substrate detection unit 123 has the same vibration mode as the edge position controller EPC3 and the fixed roller 126. The first substrate detection unit 123 detects an edge position of an end portion of the substrate P that is in contact with the fixed roller 126. The first substrate detection unit 123 outputs a detection result to the connected higher-level control device 5.

The second substrate detection unit 124 detects the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121. The second substrate detection unit 124 is fixed to a vibration isolation table 131 on which the exposure unit 121 is provided. Therefore, the second substrate detection unit 124 and the exposure unit 121 have the same vibration mode. The second substrate detection unit 124 is provided on the introduction side of the introduction substrate P of the exposure unit 121. Specifically, the second substrate detection unit 124 is provided adjacent to the guide roller 28 at a position upstream of the guide roller 28 provided on the most upstream side in the conveying direction of the exposure unit 121. The second substrate detection unit 124 detects the positions of the substrate P supplied to the exposure unit 121 in the width direction (Y direction) and the vertical direction (Z direction). The second substrate detection unit 124 outputs a detection result to the connected higher-level control device 5.

The higher-level control device 5 controls the edge position controller EPC3 based on the detection result of the first substrate detection unit 123. Specifically, the host controller 5 calculates the center position in the Y direction from the positions of the edges (both edges in the Y direction) of the two ends of the substrate P entering the fixed roller 126 detected by the first substrate detection unit 123, and The difference between the predetermined first target position (target center position). Next, the upper control device 5 performs feedback control on the edge position controller EPC3 so that the difference is 0, moves the substrate P in the width direction, and corrects the center position of the substrate P relative to the fixed roller 126 in the width direction to the first position. Target center position. Since the edge position controller EPC3 can maintain the position of the substrate P relative to the fixed roller 126 in the width direction at the first target position, the position deviation of the substrate P relative to the fixed roller 126 in the width direction can be reduced. In this case, the feedback control may be any of P control, PI control, and PID control.

In addition, the high-level control device 5 controls based on the detection result of the second substrate detection unit 124. Manufacturing abutment position adjustment mechanism 128. Specifically, the higher-level control device 5 calculates a difference between the center position obtained from the positions in the widthwise both ends of the substrate P detected by the second substrate detection unit 124 and a predetermined second target center position. Next, the higher-level control device 5 performs feedback control on the abutment position adjustment mechanism 128 so that the difference is 0, adjusts the position of the abutment 125 with the abutment position adjustment mechanism 128, and adjusts the fixed roller 126 relative to the guide roller 28 accordingly. Position in the Y direction. At this time, the upper-level control device 5 adjusts the position of the fixed roller 126 to avoid the substrate P from being twisted and being displaced in the width direction. For example, the upper control device 5 adjusts its position so that the axial direction of the fixed roller 126 is parallel to the axial direction of the guide roller 28. The upper control device 5 can adjust the position of the fixed roller 126 in the Y direction or the rotation direction around the Z axis by the abutment position adjustment mechanism 128, so that the center position in the width direction of the substrate P supplied to the exposure unit 121 can be maintained at the first position. (2) The target center position can reduce the twist of the substrate P and the positional deviation in the width direction. In this case, the feedback control may be any of P control, PI control, and PID control.

As described above, the position adjustment unit 120 can correct the position of the substrate P supplied to the fixed roller 126 in the width direction to the first target position, and correct the position of the substrate P supplied to the guide roller 28 of the exposure unit 121 to the second target position. target location.

In the first embodiment, the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 is corrected, but is not limited to this configuration. For example, the position supplied from the substrate supply device 2 to the position adjustment unit 120 may be corrected. The position of the substrate P. In this case, a substrate detection unit is provided on the upstream side of the conveyance roller 127 in the conveyance direction, and a roll position adjustment mechanism for adjusting the position of the supply roll FR1 is provided. The reel position adjusting mechanism can also be controlled by the host control device 5 based on the detection result of the substrate detection section to adjust the supply reel FR1. Similarly, the position of the substrate P supplied from the exposure unit 121 to the substrate recovery device 4 may be corrected.

<Exposure unit>

Next, the configuration of the exposure unit 121 of the exposure apparatus U3 of the first embodiment will be described with reference to FIGS. 2 to 7. FIG. 3 is a diagram showing a partial configuration of the exposure apparatus (substrate processing apparatus) U3 of the first embodiment, and FIG. 4 is a diagram showing a configuration of a driving section of the substrate support mechanism 12 in FIG. 3. FIG. 5 is a diagram showing the overall configuration of the exposure unit 121 according to the first embodiment. FIG. 6 is a diagram showing the arrangement of the illumination area IR and the projection area PA of the exposure unit 121 shown in FIG. 5. FIG. 7 is a diagram showing a configuration of a projection optical system PL of the exposure unit 121 shown in FIG. 5.

The exposure unit 121 shown in FIG. 2 to FIG. 5 is a so-called scanning exposure device, and is conveyed by a plurality of guide rollers 28 and a rotatable cylindrical rotating cylinder 25 constituting a substrate support mechanism (substrate transfer mechanism) 12. The substrate P is transported in the direction (scanning direction), and the image of the mask pattern formed on the planar mask M is projected and exposed on the surface of the substrate P while scanning. 3 and 4 are views of the exposure unit 121 viewed from the -X side, and Figs. 5 and 7 are orthogonal coordinate systems orthogonal to the X direction, Y direction, and Z direction, and are the same orthogonal coordinates as Fig. 1. system.

First, the mask M used for the exposure unit 121 will be described. The photomask M is a transparent sheet-shaped photomask in which a photomask pattern is formed with a light-shielding layer such as chromium on one surface of a flat glass plate. It is used while being held on a mask stage 21 described later. The photomask M has a pattern non-formation area in which a photomask pattern is not formed, and is mounted on the photomask stage 21 in the pattern non-formation area. The photomask M can be released relative to the photomask stage 21.

The photomask M may be the whole or a part of a panel pattern corresponding to one display element, or may be a multi-faceted one having a panel pattern corresponding to a plurality of display elements. In the mask M, a plurality of patterns for the panel may be repeatedly formed in the scanning direction (X direction) of the mask M, or a small pattern for the panel may be formed in a direction orthogonal to the scanning direction (Y Direction) is repeatedly formed. In addition, the mask M may be a pattern for a panel on which a first display element is formed, and a pattern for a panel on a second display element that is different in size from the first display element.

As shown in FIGS. 3 and 5, in addition to the above-mentioned alignment microscopes AM1 and AM2, the exposure unit 121 provided on the vibration isolation table 131 also includes a device frame 132, a mask holding mechanism 11 that supports a mask stage 21, The substrate supporting mechanism 12, the projection optical system PL, and a lower-level control device (control unit) 16. This exposure unit 121 is irradiated with the illumination light beam EL1 from the illumination mechanism 13 and projects the penetrating light (imaging beam) generated from the mask pattern of the mask M held by the mask holding mechanism 11 on the substrate supported on the substrate The substrate P of the rotating cylinder 25 of the support mechanism 12 projects a part of the mask pattern on the surface of the substrate P to form an image.

The lower-level control device 16 controls each part of the exposure device U3 and causes each part to perform processing. The lower-level control device 16 may be a part or all of the upper-level control device 5 of the component manufacturing system 1. The lower control device 16 may be another device controlled by the upper control device 5 and different from the upper control device 5. The lower control device 16 includes, for example, a computer.

The vibration isolation table 131 is provided on the installation surface E, and supports the device frame 132. Specifically, as shown in FIG. 3, the vibration isolation table 131 includes a first vibration isolation table 131 a provided outside in the Y direction, and a second vibration isolation table 131 b provided inside the first vibration isolation table 131 a.

The device frame 132 is provided on the first vibration isolation table 131a and the second vibration isolation table 131b, and supports the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection optical system PL. The device frame 132 includes a first frame 132 a that supports the mask holding mechanism 11, an illumination mechanism 13, and the projection optical system PL, and a second frame 132 b that supports the substrate support mechanism 12. The first frame 132a and the second frame 132b are separately provided, and are arranged so that the first frame 132a covers the second frame 132b. The first frame 132a is provided on the first vibration isolation table 131a, and the second frame 132b is provided on the second vibration isolation table 131b.

The first frame 132a includes a first lower frame 135 provided on the first vibration isolation table 131a, a first upper frame 136 provided above the Z direction of the first lower frame 135, and a first upper frame 136. The arm portion 137 is configured. The first lower frame 135 includes a leg portion 135 a standing on the first vibration isolation table 131 a and an upper surface portion 135 b supported by the leg portion 135 a. The upper surface portion 135 b supports the projection optical system PL through the holding member 143. The holding member 143 is dynamically supported by a washer member 145 composed of metal balls and the like disposed at three positions on the upper surface portion 135b when viewed from the XY plane. The leg part 135a is arrange | positioned at the predetermined position, and the rotation axis AX2 of the rotating cylinder 25 mentioned later is inserted in the Y direction.

The first upper frame 136, similar to the first lower frame 135, has a leg portion 136a standing on the upper surface portion 135b, and an upper surface portion 136b supported by the leg portion 136a. The upper surface portion 136b supports the mask holding mechanism 11 (light Cover stage 21). The arm portion 137 is erected on the upper surface portion 136 b and supports the lighting mechanism 13 so that the lighting mechanism 13 is positioned above the mask holding mechanism 11.

The second frame 132b is composed of a pair of bearing portions 140 provided on the upper and lower surface portions 139 of the second vibration isolation table 131b and separated from the lower surface portion 139 in the Y direction. An air bearing 141 is provided on the pair of bearing portions 140 so as to support a rotation axis AX2 as a rotation center of the rotation cylinder 25.

The mask holding mechanism 11 includes a mask stage (mask holding member) 21 that holds the mask M, a not-shown moving mechanism (linear guide, air bearing, etc.) for moving the mask stage 21, And a transmission member 23 for transmitting power to the moving mechanism. The photomask stage 21 is formed in a frame shape surrounding the pattern forming area of the photomask M, and is provided on the top surface of the first upper frame 136 by a photomask-side driving section (a driving source such as a motor) provided in the driving unit 122. 136b, moving in the X direction which is the scanning direction. The driving force transmitted from the transmission member 23 is provided to linearly drive the photomask stage 21 by a moving mechanism.

In this embodiment, the mask stage 21 is positioned in the X direction for scanning exposure. The linear movement, therefore, the mask-side driving unit (driving source) 22 includes a magnet track (fixer) of a linear motor fixed to the pillar frame 146 in the X direction, and the transmission member 23 includes a pair of magnet tracks at a certain distance from the magnet track. The coil unit (movable element) of the linear motor. In addition, in FIG. 3, the holding member 143 that supports the projection optical system PL on the side of the device frame 132 is provided with a surface corresponding to the exposure position of the projection optical system PL among the outer peripheral surface (or the surface of the substrate P) of the rotating cylinder 25. The displacement sensor SG1 having a height change and the displacement sensor SG2 which measures a position change in the Z direction of the photomask M from the lower side of the photomask stage 21.

On the other hand, as shown in FIG. 2 and FIG. 3, the rotary cylinder 25 supporting the substrate P around a half-circle is provided on a substrate-side driving section (a driving source of a rotary motor or the like) provided in the driving unit 122 shown in FIG. 3. ) 26 Spin. As also shown in FIG. 5, the rotating cylinder 25 is formed in a cylindrical shape having an outer peripheral surface (peripheral surface) having a radius of curvature Rfa around a rotation axis AX2 extending in the Y direction. Here, a plane including the center line of the rotation axis AX2 and a plane parallel to the YZ plane is the center plane CL (see FIG. 5). A part of the circumferential surface of the rotary cylinder 25 is a support surface P2 that supports the substrate P with a predetermined tension. In other words, the rotating cylinder 25 winds the substrate P around the support surface P2 with a constant tension, and thereby supports the substrate P in a stable cylindrical curved shape.

Each of the air bearings 141 is rotatably supported by the bearing portions 140 on both sides of the rotation shaft AX2, and the rotation shaft AX2 is rotatably supported in a non-contact state. In the present embodiment, the rotary shaft AX2 is supported by air bearings 141 at both ends of the rotary cylinder 25, but a general bearing that is processed into a ball or needle with high precision may be used. As shown in FIG. 2 and FIG. 5, a plurality of guide rollers 28 are provided on the upstream side and the downstream side of the substrate P in the conveying direction via the rotating cylinder 25, respectively. For example, four guide rollers 28 are provided, and two guide rollers 28 are arranged on the upstream side and the downstream side in the transport direction, respectively.

As described above, the substrate support mechanism 12 will be carried from the position adjustment unit 120 The substrate P is guided to the rotating drum 25 by two guide rollers 28. The substrate supporting mechanism 12 rotates the rotating cylinder 25 by the substrate-side driving portion 26 through the rotation axis AX2, and thereby carries the substrate P introduced into the rotating cylinder 25 to the guide roller 28 while supporting the substrate P on the supporting surface P2 of the rotating cylinder 25. The substrate support mechanism 12 guides the substrate P transferred to the guide roller 28 to the substrate recovery device 4.

Next, a configuration example of the substrate-side driving section 26 will be described with reference to FIG. 4. In FIG. 4, at least one end of the rotating tube 25 wound around the substrate P is provided with a disk-shaped ruler plate 25c having a diameter substantially the same as the radius Rfa of the outer peripheral surface 25a of the rotating tube 25 coaxially with the rotating axis AX2. . A diffraction grating is formed on the outer peripheral surface of the scale plate 25c at a certain interval in the circumferential direction. The diffraction grating is optically detected by the reading head EH for encoder measurement, and the rotation angle of the rotary cylinder 25 is measured according to this. Or the amount of movement of the surface 25a of the rotating cylinder 25 in the circumferential direction. The rotation angle information of the rotating cylinder 25 measured by the reading head EH is also used as a feedback signal for the servo control of the motor that rotates the rotating cylinder 25. In addition, in FIG. 4, although the displacement sensor SG1 is configured to measure the displacement (radial displacement) of the height position on the surface of the substrate P, it can also be configured to measure the end of the rotating cylinder 25 not covered by the substrate P. Displacement (displacement in the radial direction) of the height position of the surface of the partial region 25b.

On the end side of the rotating shaft AX2 supported by the air bearing 141, a magnet unit Mur, which is a rotary motor that generates a torque around the rotating shaft AX2, is provided with a rotary element RT arranged in a ring shape, and an axial thrust is given to the rotating shaft AX2. Magnet unit MUs for voice coil motors. As shown in FIG. 3, it is fixed to the stator side of the pillar frame 146, and is provided with a coil unit CUr arranged to face the magnet unit MUr around the rotor RT, and a coil unit CUr wound around the magnet unit MUs. Coil unit CUs. With this configuration, the rotating cylinder 25 (and the scale plate 25c) integrated with the rotating shaft AX2 can be smoothly rotated with the torque given to the rotor RT.

In addition, since the voice coil motors (MUs, CUs) also rotate during the rotation of the rotating barrel 25, Since the thrust in the rotation axis AX2 direction (Y direction) is generated, the rotary cylinder 25 (and the scale plate 25c) can be moved slightly in the Y direction. Accordingly, a slight positional deviation of the substrate P in the Y direction during the scanning exposure can be corrected one by one.

In the configuration of FIG. 4, a displacement sensor DT1 that measures the Y-direction displacement of the end surface Tp of the rotation axis AX2, or a displacement sensor DT2 that measures the Y-direction displacement of the end surface of the scale plate 25c, The position change in the Y direction of the rotating barrel 25 during the scanning exposure can be measured one by one in real time. Therefore, as long as the servo control of the voice coil motors (MUs, CUs) is performed based on the measurement signals from the displacement sensors DT1 and DT2, the Y-direction position of the rotary cylinder 25 can be accurately positioned.

Here, as shown in FIG. 6, the exposure apparatus U3 of the first embodiment is set as an exposure apparatus of a so-called multi-lens method. In addition, FIG. 6 shows a plan view of the illumination region IR (IR1 to IR6) held on the reticle M of the reticle stage 21 viewed from the −Z side (left view of FIG. 6), and the + Z side A plan view of a projection area PA (PA1 to PA6) supported on the substrate P of the rotary cylinder 25 is observed (right view in FIG. 6). The symbol Xs in FIG. 6 represents the scanning direction (rotational direction) of the mask stage 21 and the rotating cylinder 25. The multi-lens exposure device U3 illuminates a plurality of (one in the first embodiment, for example, six) illumination areas IR1 to IR6 on the reticle M, and illuminates each of the illumination areas EL1 and each illumination area EL1. The plurality of projection light beams EL2 obtained from IR1 to IR6 are projected and exposed to a plurality of (for example, six in the first embodiment) projection areas PA1 to PA6 on the substrate P.

First, a plurality of illumination regions IR1 to IR6 illuminated by the illumination mechanism 13 will be described. As shown in FIG. 6, a plurality of illumination areas IR1 to IR6 are arranged in two rows in the scanning direction of the substrate P with the center plane CL interposed therebetween. The illumination areas IR1, IR3, and IR5 are arranged on the mask M on the upstream side in the scanning direction. Illumination areas IR2, IR4, and IR6 are arranged on the mask M on the downstream side in the direction. Each lighting area IR1 ~ IR6 is an elongated trapezoidal region having parallel short sides and long sides extending in the width direction (Y direction) of the mask M. At this time, each of the illumination areas IR1 to IR6 of the trapezoid is an area whose short side is located on the center plane CL side and whose long side is located outside. The odd-numbered illumination areas IR1, IR3, and IR5 are arranged at predetermined intervals in the Y direction. In addition, even-numbered illumination areas IR2, IR4, and IR6 are also arranged at predetermined intervals in the Y direction. At this time, the illumination area IR2 is arranged between the illumination area IR1 and the illumination area IR3 in the Y direction. Similarly, the illumination area IR3 is also arranged between the illumination area IR2 and the illumination area IR4 in the Y direction. The illumination area IR4 is arranged between the illumination area IR3 and the illumination area IR5 in the Y direction. The illumination area IR5 is arranged between the illumination area IR4 and the illumination area IR6 in the Y direction. Each of the illumination areas IR1 to IR6 is arranged so that the triangular portion of the hypotenuse of the adjacent trapezoidal illumination area overlaps when viewed from the scanning direction of the mask M. In the first embodiment, although each of the illumination areas IR1 to IR6 is a trapezoidal area, it may be a rectangular area.

The photomask M includes a pattern forming area A3 in which a photomask pattern is formed, and a pattern non-forming area A4 in which a photomask pattern is not formed. The pattern non-formation area A4 is a low-reflection area that absorbs the illumination light beam EL1 and is arranged in a frame shape around the pattern formation area A3. The illumination areas IR1 to IR6 are configured to cover the full width in the Y direction of the pattern forming area A3.

The illuminating mechanism 13 emits an illumination light beam EL1 that illuminates the mask M. The illumination mechanism 13 includes a light source device and an illumination optical system IL. The light source device includes a lamp light source such as a mercury lamp, a solid-state light source such as a laser diode, or a light emitting diode (LED). Illumination light emitted by the light source device is, for example, far-ultraviolet light (DUV light) such as glow lines (g-line, h-line, i-line), KrF excimer laser light (wavelength 248 nm), and ArF excimer laser light (Wavelength 193nm) and so on. After the illuminance distribution of the illumination light emitted from the light source device is uniformized, it is guided to the illumination optical system IL through a light guide member such as an optical fiber.

The illumination optical system IL is provided with a plurality of illumination modules IL1 to IL6 (for example, six in the first embodiment) corresponding to the plurality of illumination regions IR1 to IR6. A plurality of illumination modules IL1 to IL6 respectively emit an illumination beam EL1 from a light source device. Each of the lighting modules IL1 to IL6 guides the lighting beam EL1 incident from the light source device to each of the lighting areas IR1 to IR6. That is, the lighting module IL1 guides the illumination light beam EL1 to the illumination area IR1. Similarly, the illumination modules IL2 to IL6 guide the illumination light beam EL1 to the illumination areas IR2 to IR6. The plurality of illumination modules IL1 to IL6 are arranged in two rows in the scanning direction of the mask M with the center plane CL interposed therebetween. The lighting modules IL1, IL3, and IL5 are arranged on the arrangement side (the left side in FIG. 5) of the lighting areas IR1, IR3, and IR5 with respect to the center plane CL. The lighting modules IL1, IL3, and IL5 are arranged at predetermined intervals in the Y direction. In addition, the lighting modules IL2, IL4, and IL6 are arranged on the arrangement side (right side in FIG. 5) of the lighting areas IR2, IR4, and IR6 with respect to the center plane CL. The lighting modules IL2, IL4 and IL6 are arranged at predetermined intervals in the Y direction. At this time, the lighting module IL2 is arranged between the lighting module IL1 and the lighting module IL3 in the Y direction. Similarly, the lighting module IL3 is disposed between the lighting module IL2 and the lighting module IL4 in the Y direction. The lighting module IL4 is arranged between the lighting module IL3 and the lighting module IL5 in the Y direction. The lighting module IL5 is disposed between the lighting module IL4 and the lighting module IL6 in the Y direction. In addition, the lighting modules IL1, IL3, and IL5 and the lighting modules IL2, IL4, and IL6 are symmetrically arranged with respect to the center plane CL as viewed from the Y direction.

Each of the plurality of illumination modules IL1 to IL6, for example, includes a plurality of optical components such as an integrator optical system, a rod lens, a fly-eye lens, etc., and illuminates each illumination area IR1 to IR6 with an illumination beam EL1 having a uniform illumination distribution. In the first embodiment, a plurality of illumination modules IL1 to IL6 are arranged on the upper side in the Z direction of the mask M. Each of the plurality of illumination modules IL1 to IL6 illuminates each illumination region IR of a mask pattern formed on the mask M from above the mask M.

Next, the plurality of projection areas PA1 exposed by the projection optical system PL projection will be described. ~ PA6. As shown in FIG. 6, the plurality of projection areas PA1 to PA6 on the substrate P are arranged corresponding to the plurality of illumination areas IR1 to IR6 on the mask M. That is, the plurality of projection areas PA1 to PA6 on the substrate P are arranged in two rows in the conveying direction across the center plane CL, and the projection areas PA1, PA3, and In PA5, the projection areas PA2, PA4, and PA6 are arranged on the substrate P on the downstream side in the conveying direction. Each of the projection areas PA1 to PA6 is an elongated trapezoidal area having short sides and long sides extending in the width direction (Y direction) of the substrate P. At this time, each of the projection areas PA1 to PA6 of the trapezoid is an area in which the short side is located on the center plane CL side and the long side is located outside. The projection areas PA1, PA3, and PA5 are arranged at predetermined intervals in the width direction. In addition, the projection areas PA2, PA4, and PA6 are also arranged at predetermined intervals in the width direction. At this time, the projection area PA2 is in the axial direction of the rotation axis AX2, and is arranged between the projection area PA1 and the projection area PA3. Similarly, the projection area PA3 is also in the axial direction of the rotation axis AX2, and is arranged between the projection area PA2 and the projection area PA4. The projection area PA4 is arranged between the projection area PA3 and the projection area PA5 in the axial direction of the rotation axis AX2. The projection area PA5 is arranged between the projection area PA4 and the projection area PA6 in the axial direction of the rotation axis AX2. Each of the projection areas PA1 to PA6 is the same as each of the illumination areas IR1 to IR6, and when viewed from the conveying direction of the substrate P, the triangular portions of the hypotenuse of the projection area PA adjacent to the trapezoid are overlapped. At this time, the projection area PA has a shape in which the exposure amount in the overlapping area of the adjacent projection area PA is substantially the same as the exposure amount in the non-repeating area. The projection areas PA1 to PA6 are arranged so as to cover the full width in the Y direction of the exposure area A7 that is exposed on the substrate P.

Here, in FIG. 5, when viewed in the XZ plane, the length from the center point of the illumination area IR1 (and IR3, IR5) on the mask M to the center point of the illumination area IR2 (and IR4, IR6) is set to From the projection area PA1 (and PA3, PA5) on the substrate P attached to the support surface P2 The perimeter of the center point to the center point of the projection area PA2 (and PA4, PA6) is substantially equal.

As shown in FIG. 5, the projection optical system PL is provided with a plurality of (for example, six in the first embodiment) projection modules PL1 to PL6 corresponding to the plurality of projection areas PA1 to PA6. A plurality of projection modules PL1 to PL6 respectively emit a plurality of projection light beams EL2 from a plurality of illumination areas IR1 to IR6. Each projection module PL1 to PL6 directs each projection light beam EL2 from the mask M to each projection area PA1 to PA6. That is, the projection module PL1 guides the projection light beam EL2 from the illumination area IR1 to the projection area PA1. Similarly, the projection modules PL2 to PL6 guide the projection light beam EL2 from the illumination area IR2 to IR6 to the projection areas PA2 to PA6. The plurality of projection modules PL1 to PL6 are arranged in two rows in the scanning direction of the mask M across the center plane CL. The projection modules PL1, PL3, and PL5 are disposed on the arrangement side of the projection areas PA1, PA3, and PA5 (the left side in FIG. 5) with respect to the center plane CL. The projection modules PL1, PL3, and PL5 are arranged at predetermined intervals in the Y direction. In addition, the projection modules PL2, PL4, and PL6 are disposed on the arrangement side of the projection areas PA2, PA4, and PA6 (the right side in FIG. 5) with respect to the center plane CL. The projection modules PL2, PL4, and PL6 are arranged at predetermined intervals in the Y direction. At this time, the projection module PL2 is disposed between the projection module PL1 and the projection module PL3 in the axial direction of the rotation axis AX2. Similarly, the projection module PL3 is disposed between the projection module PL2 and the projection module PL4 in the axial direction of the rotation axis AX2. The projection module PL4 is disposed between the projection module PL3 and the projection module PL5 in the axial direction of the rotation axis AX2. The projection module PL5 is disposed between the projection module PL4 and the projection module PL6 in the axial direction of the rotation axis AX2. The projection modules PL1, PL3, and PL5 and the projection modules PL2, PL4, and PL6 are symmetrically arranged with the center plane CL as the center when viewed from the Y direction.

The plurality of projection modules PL1 to PL6 are arranged correspondingly to the plurality of lighting modules IL1 to IL6. That is, the projection module PL1 projects the image of the mask pattern of the illumination area IR1 illuminated by the illumination module IL1 onto the projection area PA1 on the substrate P. Similarly, the projection modules PL2 ~ PL6 The images of the mask patterns in the illumination areas IR2 to IR6 illuminated by the illumination modules IL2 to IL6 are projected onto the projection areas PA2 to PA6 on the substrate P.

Next, each of the projection modules PL1 to PL6 will be described with reference to FIG. 7. In addition, since each of the projection modules PL1 to PL6 has the same configuration, the projection module PL1 will be described as an example.

The projection module PL1 projects an image of a mask pattern in the illumination region IR (illumination region IR1) on the mask M onto a projection region PA on the substrate P. As shown in FIG. 7, the projection module PL1 includes a first optical system 61 that images an image of a mask pattern in the illumination area IR on the intermediate image plane P7, and at least a part of the intermediate image that images the first optical system 61. The second optical system 62 is formed on the projection area PA of the substrate P, and the projection field diaphragm 63 is disposed on the intermediate image plane P7 forming the intermediate image. The projection module PL1 includes a focus correction optical member 64, an image movement optical member 65, a magnification correction optical member 66, and a rotation correction mechanism 67.

The first optical system 61 and the second optical system 62 are, for example, a telecentric refracting optical system in which a Dyson system is deformed. In the first optical system 61, an optical axis (hereinafter, referred to as a second optical axis BX2) is substantially orthogonal to the center plane CL. The first optical system 61 includes a first deflection member 70, a first lens group 71, and a first concave mirror 72. The first deflecting member 70 is a triangular ridge having a first reflecting surface P3 and a second reflecting surface P4. The first reflection surface P3 is a surface that reflects the projection light beam EL2 from the mask M and makes the reflected projection light beam EL2 enter the first concave mirror 72 through the first lens group 71. The second reflecting surface P4 is a surface of the projection field beam 63 reflected by the projection light beam EL2 reflected by the first concave mirror 72 after passing through the first lens group 71 and reflecting the incident projection light beam EL2. The first lens group 71 includes various lenses, and the optical axes of the various transmission lenses are arranged on the second optical axis BX2. The first concave mirror 72 is a pupil surface that is formed by a plurality of point light sources generated by the fly-eye lens, and transmits images from the fly-eye lens through the illumination field diaphragm to various lenses of the first concave mirror 72.

The projection light beam EL2 from the mask M passes through the focus correction optical member 64 and the image movement optical member 65, is reflected by the first reflecting surface P3 of the first deflection member 70, and is emitted through a field of view in the upper half of the first lens group 71.入 第一 槽 面镜 72。 Enter the first concave mirror 72. The projection light beam EL2 incident on the first concave mirror 72 is reflected by the first concave mirror 72 and enters the second reflecting surface P4 of the first deflection member 70 through the field of view in the lower half of the first lens group 71. The projection light beam EL2 incident on the second reflection surface P4 is reflected by the second reflection surface P4 and enters the projection field diaphragm 63.

The projection field diaphragm 63 has an opening that defines the shape of the projection area PA. That is, the shape of the projection area PA is defined by the opening shape of the projection field diaphragm 63.

The second optical system 62 has the same configuration as the first optical system 61, and is disposed symmetrically to the first optical system 61 with the intermediate image plane P7 interposed therebetween. The second optical system 62 has an optical axis (hereinafter, referred to as a third optical axis BX3) substantially orthogonal to the center plane CL, and is parallel to the second optical axis BX2. The second optical system 62 includes a second deflection member 80, a second lens group 81, and a second concave mirror 82. The second deflecting member 80 includes a third reflecting surface P5 and a fourth reflecting surface P6. The third reflection surface P5 is a surface that reflects the projection light beam EL2 from the projection field diaphragm 63 and makes the reflected projection light beam EL2 enter the second concave mirror 82 through the second lens group 81. The fourth reflecting surface P6 is a surface of the projection light beam EL2 reflected by the second concave mirror 82 and passing through the second lens group 81 to reflect the incident projection light beam EL2 toward the projection area PA. The second lens group 81 includes various lenses, and the optical axes of the various lenses are arranged on the third optical axis BX3. The second concave mirror 82 is a pupil surface where most of the point light source images formed by the first concave mirror 72 are imaged through the various lenses of the projection field diaphragm 63 to the second concave mirror 82 from the first concave mirror 72.

The projection light beam EL2 from the projection field diaphragm 63 is reflected by the third reflecting surface P5 of the second deflection member 80 and then enters the second concave mirror 82 through the field of view of the upper half of the second lens group 81. The projection light beam EL2 incident on the second concave mirror 82 is reflected by the second concave mirror 82 and passes through the second lens group 81 The lower field of view enters the fourth reflecting surface P6 of the second deflection member 80. The projection light beam EL2 that has entered the fourth reflecting surface P6 is reflected by the fourth reflecting surface P6, and then is projected onto the projection area PA by the magnification correction optical member 66. Accordingly, the image of the mask pattern in the illumination area IR is projected on the projection area PA at equal magnification (× 1).

The focus correction optical member 64 is disposed between the mask M and the first optical system 61. The focus correction optical member 64 corrects the focus state of the image of the mask pattern projected on the substrate P. The focus correction optical member 64 is, for example, one in which two pieces of wedge-shaped cymbals are inverted (in the X direction in FIG. 7) and overlapped to make the entire transparent parallel flat plate. The thickness of the parallel flat plate can be changed by sliding the pair of cymbals in the oblique direction without changing the interval between the surfaces facing each other. Accordingly, the effective optical path length of the first optical system 61 is finely adjusted, and the focus state of the image of the mask pattern formed on the intermediate image plane P7 and the projection area PA is finely adjusted.

The image moving optical member 65 is disposed between the mask M and the first optical system 61. The optical member 65 for image movement adjusts the image of the mask pattern projected on the substrate P to be movable in the image plane. The image moving optical member 65 is composed of a transparent parallel plate glass that can be tilted in the XZ plane in FIG. 6 and a transparent parallel plate glass that can be tilted in the YZ plane in FIG. 7. By adjusting the inclination amounts of the two parallel plate glasses, the image of the mask pattern formed on the intermediate image plane P7 and the projection area PA can be shifted slightly in the X direction and the Y direction.

The magnification correction optical member 66 is disposed between the second deflection member 80 and the substrate P. The magnification correction optical member 66 is configured by arranging three lenses, such as a concave lens, a convex lens, and a concave lens, coaxially at a predetermined interval, fixing the front and rear concave lenses, and moving the middle convex lens in the optical axis (principal light) direction. According to this, the image of the mask pattern formed in the projection area PA can be enlarged or reduced in an equal manner while maintaining a telecentric imaging state. In addition, constitutive magnification correction The optical axes of the three lens groups of the positive-use optical member 66 are inclined in the XZ plane and are parallel to the main ray of the projection light beam EL2.

The rotation correction mechanism 67 is, for example, an actuator (not shown) that rotates the first deflection member 70 slightly around an axis perpendicular to the second optical axis BX2. The rotation correction mechanism 67 can rotate the first deflection member 70 so that the image of the mask pattern formed on the intermediate image plane P7 rotates slightly within the plane P7.

In the projection modules PL1 to PL6 configured in this manner, the projection light beam EL2 from the mask M is emitted from the illumination area IR toward the normal direction of the mask surface P1, and enters the first optical system 61. The projection light beam EL2 that has entered the first optical system 61 passes through the focus correction optical member 64 and the image moving optical member 65 and is reflected by the first reflecting surface (planar mirror) P3 of the first deflection member 70 of the first optical system 61. Is reflected by the first concave mirror 72 through the first lens group 71. The projection light beam EL2 reflected by the first concave mirror 72 passes through the first lens group 71 and is reflected by the second reflecting surface (planar mirror) P4 of the first deflection member 70 again, and enters the projection field diaphragm 63. The projection light beam EL2 passing through the projection field diaphragm 63 is reflected on the third reflecting surface (planar mirror) P5 of the second deflection member 80 of the second optical system 62 and is reflected on the second concave mirror 82 through the second lens group 81. The projection light beam EL2 reflected by the second concave mirror 82 passes through the second lens group 81 and is reflected by the fourth reflecting surface (planar mirror) P6 of the second deflection member 80 again, and enters the magnification correction optical member 66. The projection light beam EL2 emitted from the magnification correction optical member 66 enters the projection area PA on the substrate P, and the image of the mask pattern appearing in the illumination area IR is projected onto the projection area PA at equal magnification (× 1).

<Control of drive unit>

Next, control of the driving unit 122 will be described with reference to FIG. 3. The driving unit 122 includes a mask-side driving portion 22 and a substrate-side driving portion 26 mounted on a pillar frame 146 provided on the installation surface E. to make.

As described above, the mask-side driving section 22 is composed of a magnet track (fixer) fixed to the pillar frame 146 and extending in the X direction, and a transmission member 23 fixed to the mask stage 21. A coil unit (movable element) of a linear motor opposed to the magnet track at a constant pitch is formed. As shown in FIG. 4, the substrate-side driving unit 26 includes a coil unit Cur fixed to the support frame 146 side as a stator and a rotor RT fixed to the rotation axis AX2 side of the rotating cylinder 25 as a movable element. A rotary motor constituted by a magnet unit MUr and a voice coil motor (MUs, CUs) that applies a thrust force in a direction (Y direction) to the rotary shaft AX2 to the rotary cylinder 25 from the pillar frame 146 side. As described above, the photomask-side driving section 22 and the substrate-side driving section 26 are structures (direct drive method) capable of directly transmitting power to the transmission member 23 and the rotation axis AX2 in a non-contact manner, but are not limited to the above-mentioned configurations. For example, the substrate-side driving unit 26 may include an electric motor and a magnetic gear, the electric motor may be fixed to the pillar frame 146 side, and a magnetic gear may be installed between the output shaft and the rotation axis AX2 of the electric motor.

In the configuration of the driving unit 122 in the above manner, the lower control device 16 shown in FIG. 5 moves the photomask stage 21 and the rotating cylinder 25 in synchronization. Therefore, the image of the mask pattern formed on the mask surface P1 of the mask M is continuously and repeatedly projected onto the surface P of the substrate P (wound along the support surface P2 (25a in FIG. 4) wound around the rotating cylinder 25) Curved surface). In the exposure device U3 of the first embodiment, after scanning and exposure are performed by synchronously moving the mask M in the + X direction, it is necessary to return (rewind) the mask M to the initial position in the -X direction. Therefore, when the rotary cylinder 25 is continuously rotated at a constant speed to continuously transport the substrate P at a constant speed, the pattern exposure on the substrate P is not performed during the rewinding operation of the photomask M, but the substrate P is transported. The direction jump (separation) forms a pattern for a panel. However, in practice, it is assumed that the speed of the substrate P (here, the peripheral speed) ) And the speed of the reticle M are 50 mm / s to 100 mm / s. Therefore, when the reticle stage 21 is driven at a maximum speed of 500 mm / s, for example, when the reticle M is rolled back, it can be reduced (narrowed) on the substrate P The margin between the pattern for the panel formed in the conveying direction.

In this embodiment, a laser interferometer or a linear encoder can be used to accurately measure the movement position and speed of the photomask stage 21 in the X direction, and the reading head EH of the scale plate 25c in FIG. 4 can accurately measure the rotating cylinder 25. The position and speed of the outer peripheral surface are accurately ensured to synchronize the mask M and the substrate P in the position of the scanning exposure direction and the speed.

<Pressing mechanism>

Next, the pressing mechanism 130 will be described with reference to FIG. 2. The pressing mechanism 130 is provided between the position adjustment unit 120 and the exposure unit 121. The pressing mechanism 130 presses the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 to apply tension. The pressing mechanism 130 includes a pressing member 151 and a lifting mechanism 152 that raises and lowers the pressing member 151. The pressing member 151 presses the substrate P in a contact or non-contact state. The pressing member 151 is, for example, an air turn bar having an air ejection port and a suction port for making a non-contact state with the substrate P, or a friction roller that contacts the substrate P. The lifting mechanism 152 lifts and lowers the pressing member 151 in a direction that is pressed from one surface (back surface) of the substrate P to the other surface (front surface), that is, in the Z direction. The lifting mechanism 152 is connected to the higher-level control device 5 and is controlled by the higher-level control device 5 based on the detection result of the second substrate detection unit 124.

The higher-level control device 5 controls the pressing mechanism 130 based on the detection result of the second substrate detection unit 124. Specifically, the higher-level control device 5 calculates the position displacement amount of the substrate P per unit time (for example, several milliseconds) from the position of the substrate P detected by the second substrate detection unit 124. The upper control device 5 adjusts the movement amount of the pressing member 151 in the Z direction based on the calculated displacement amount. In other words, the higher the control device 5 is, the larger the calculated displacement amount is, the greater the vibration of the substrate P is, that is, it controls the lifting The mechanism 152 raises the pressing member 151 in the Z direction. The upper control device 5 raises the pressing member 151 in the Z direction to apply tension to the substrate P, and the vibration of the substrate P is damped by the pressing member 151.

<Substrate recovery device>

Next, the substrate recovery device 4 will be described with reference to FIG. 2 again. The substrate recovery device 4 includes a position adjustment unit 160, a second bearing portion 161 on which the recovery roll FR2 is mounted, and a second lifting mechanism 162 that raises and lowers the second bearing portion 161. The substrate recovery device 4 also includes a discharge angle detection unit 164 and a third substrate detection unit 165. The discharge angle detection unit 164 and the third substrate detection unit 165 are connected to the higher-level control device 5. Here, in the first embodiment, the higher-level control device 5 is the same as the substrate supply device 2 as the control device (control unit) of the substrate recovery device 4. In addition, as a control device of the substrate recovery device 4, a lower-level control device that controls the substrate recovery device 4 may be provided, and a configuration in which the lower-level control device controls the substrate recovery device 4 may be provided.

The position adjustment unit 160 includes the edge position controller EPC2 shown in FIG. 1. The configuration of the position adjustment unit 160 is similar to that of the position adjustment unit 120 of the exposure device U3, and includes a base 170 and an edge position controller EPC2. The base 170 is provided on the installation surface E, and supports the edge position controller EPC2. The base 170 may be a vibration isolation platform having a vibration isolation function.

The edge position controller EPC2 can move on the base 170 in the width direction (Y direction) of the substrate P. The edge position controller EPC2 includes a plurality of rollers including a transport roller 167 provided at the most downstream side in the transport direction of the substrate P. The conveyance roller 167 guides the substrate P discharged from the position adjustment unit 160 to the recovery roll FR2. The edge position controller EPC2 is connected to the higher-level control device 5, and is received by the higher-level control device 5 based on the detection result of the third substrate detection unit 165.

The third substrate detection unit 165 detects the return from the edge position controller EPC2. The position of the substrate P of the take-up reel FR2 in the width direction. The third substrate detection unit 165 is fixed to the second lifting mechanism 162. Therefore, the third substrate detection unit 165 and the recovery roll FR2 have the same vibration mode. The third substrate detection unit 165 detects the position where the back is recovered to the edge of the end portion of the substrate P of the reel FR2 for recovery. The third substrate detection unit 165 outputs the detection result to the connected higher-level control device 5.

The higher-level control device 5 controls the edge position controller EPC2 based on the detection result of the third substrate detection unit 165. Specifically, the higher-level control device 5 calculates the difference between the position of the edge of the end of the substrate P that has been recovered by the third substrate detection unit 165 and recovered to the recovery roll FR2 and the predetermined third target position. Next, the upper control device 5 performs feedback control on the edge position controller EPC2 so that the difference is zero, moves the substrate P in the width direction, and sets the position of the substrate P in the width direction relative to the reel FR2 to the third position. target location. Therefore, the edge position controller EPC2 can maintain the position of the substrate P relative to the reel FR2 in the width direction at the third target position. Therefore, since the position of the substrate P relative to the recycling roll FR2 in the width direction can be maintained constant, the end faces in the axial direction of the recycling roll FR2 can be aligned. In this case, the feedback control may be any of P control, PI control, and PID control.

The second bearing portion 161 rotatably supports the recovery roll FR2. When the recovery roll FR2, which is supported on the second bearing portion 161, is used to recover the substrate P, the diameter of the recovery roll FR2 increases with the amount of the recovery substrate P. Therefore, the position of the substrate P to be recovered in the recovery roll FR2 changes with the amount of the substrate P to be recovered.

The second lifting mechanism 162 is provided between the installation surface E and the second bearing portion 161. The second lifting mechanism 162 moves the second bearing portion 161 in the Z direction (vertical direction) together with the recovery roll FR2. The second lifting mechanism 162 is connected to the higher-level control device 5. The higher-level control device 5 can move the second bearing portion 161 in the Z direction by the second lifting mechanism 162, and the position of the substrate P will be recovered by the recovery roll FR2. Set to the predetermined position.

The ejection angle detection unit 164 detects the ejection angle θ 2 of the substrate P ejected from the conveyance roller 167 of the edge position controller EPC2. The discharge angle detection unit 164 is provided around the conveyance roller 167. Here, the discharge angle θ 2 is in the XZ plane, and the angle between the straight line extending in the vertical direction by the central axis of the transfer roller 167 and the substrate P on the downstream side of the transfer roller 167. The discharge angle detection unit 164 outputs the detection result to the connected upper control device 5.

The higher-level control device 5 controls the second lifting mechanism 162 based on the detection result of the discharge angle detection unit 164. Specifically, the higher-level control device 5 controls the second lifting mechanism 162 so that the discharge angle θ 2 becomes a predetermined target discharge angle. That is, when the substrate P is recovered to the recovery roll FR2, the larger the diameter of the recovery roll FR2, the smaller the discharge angle θ2 with respect to the target discharge angle. Therefore, the upper control device 5 moves (raises) the second lifting mechanism 162 to the upper side in the Z direction to increase the discharge angle θ 2 and corrects the discharge angle θ 2 to the target discharge angle. As described above, the higher-level control device 5 performs feedback control on the second lifting mechanism 162 based on the detection result of the discharge angle detection unit 164 so that the discharge angle θ 2 becomes the target discharge angle. Therefore, since the substrate recovery device 4 can constantly discharge the substrate P from the conveyance roller 167 at the target discharge angle, it is possible to reduce the influence on the substrate P caused by the change in the discharge angle θ 2. In this case, the feedback control may be any of P control, PI control, and PID control.

<Element Manufacturing Method>

Next, a device manufacturing method will be described with reference to FIG. 8. Fig. 8 is a flowchart showing a device manufacturing method according to the first embodiment.

The element manufacturing method shown in FIG. 8 is to first design the function and performance of a display panel formed using, for example, an organic EL and other self-luminous elements, and design a circuit required by CAD or the like. Pattern and wiring pattern (step S201). Next, a mask M of a desired layer amount is produced based on various patterns of each layer designed by CAD or the like (step S202). A supply roll FR1 on which a flexible substrate P (resin film, metal foil film, plastic, etc.) as a base material of the display panel is wound is prepared (step S203). In addition, the roll-shaped substrate P prepared in this step S203 may be one whose surface has been modified as necessary, or which has been previously formed with a bottom layer (for example, through minute irregularities of an imprint method), or laminated with light in advance. Inductive functional film or transparent film (insulating material).

Next, an electrode constituting a display panel element or a substrate layer composed of wiring, an insulating film, a TFT (thin film semiconductor), and the like is formed on the substrate P, and a light emission composed of a self-emitting element such as an organic EL is laminated on the substrate. Layer (display pixel portion) (step S204). In this step S204, although the conventional lithography process is used to expose the photoresist layer using the exposure device U3 described in the previous embodiments, it also includes a substrate P pattern coated with a photosensitive silane coupling agent instead of the photoresist. Exposure comes from an exposure process that forms a water-repellent pattern on the surface, a wet process that exposes a photo-sensitive catalyst layer pattern and forms a metal film pattern (wiring, electrodes, etc.) by an electroless plating method, or a silver-containing process Conductive printing process for drawing patterns such as conductive ink of rice particles, ink containing insulating materials, or ink containing semiconductor materials (thick pentabenzene, semiconductor nanorods, etc.).

Next, for each display panel element that is continuously manufactured on the long substrate P by a roll method, the substrate P is cut, or a protective film (environmental barrier layer) or a color filter film is laminated on the surface of each display panel element. The components are assembled (step S205). Next, a step of checking whether the display panel element can operate normally or whether it satisfies the desired performance and characteristics is performed (step S206). Through the above method, a display panel (flexible display) can be manufactured.

As described above, in the first embodiment, the exposure can be set through the vibration isolator 131 on the installation surface E. The unit 121 sets the exposure unit 121, the position adjustment unit 120, and the driving unit 122 in independent states. That is, in the first embodiment, the exposure unit 121, the position adjustment unit 120, and the driving unit 122 can be isolated by the vibration isolation table 131, that is, different vibration modes can be created. Therefore, the exposure unit 121 can reduce the vibration from the position adjustment unit 120 and the driving unit 122 by the vibration isolation table 131.

In the first embodiment, the position of the substrate P with respect to the fixed roller 126 in the width direction can be maintained at the first target position. Therefore, since the substrate P can be supplied to the same position to the fixed roller 126, the position of the substrate P supplied from the fixed roller 126 in the width direction can be maintained constant. As described above, in the first embodiment, since the position of the substrate P sent from the fixed roller 126 in the width direction can be maintained constant, it is possible to reduce the influence of the position variation of the substrate P in the width direction on the vibration and the like of the substrate P.

In the first embodiment, the position of the substrate P with respect to the conveyance roller 127 can be maintained at the second target position. Therefore, in the first embodiment, the position of the substrate P supplied to the exposure unit 121 can be maintained constant. Accordingly, in the first embodiment, since the position of the substrate P supplied to the transfer roller 127 can be made constant, it is possible to reduce the influence of the variation in the position of the substrate P on the vibration and the like of the substrate P.

In the first embodiment, the substrate P can be pressed by the pressing mechanism 130 to reduce the vibration of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121.

In the first embodiment, the device frame 132 can be separated into a first frame 132a and a second frame 132b, the photomask stage 21 can be supported on the first frame 132a, and the rotary tube 25 can be supported on the second frame 132b. Therefore, the first frame 132a and the second frame 132b can be provided in separate states, respectively. That is, the first frame 132a can be isolated from the second frame 132b, that is, different vibration modes can be created. Therefore, transmission of vibration between the first frame 132a and the second frame 132b can be reduced.

In the first embodiment, the substrate P of the transfer roller 127 that can be supplied from the supply roll FR1 to the position adjustment unit 120 of the exposure apparatus U3 can be maintained at a constant angle θ 1 with respect to the transfer roller 127. Therefore, it is possible to influence the displacement of the low factor entry angle θ 1 on the substrate P.

Moreover, in the first embodiment, the discharge angle θ 2 of the substrate P supplied from the position adjustment unit 160 of the substrate recovery device 4 to the recovery roll FR2 with respect to the transfer roller 167 can be maintained constant. Therefore, the influence of the displacement of the discharge angle θ 2 on the substrate P (the uneven winding of the substrate P to the recovery roll FR2) can be reduced.

[Second Embodiment]

Next, an exposure apparatus U3 according to the second embodiment will be described with reference to FIG. 9. In addition, in the description of the second embodiment, in order to avoid duplication, only the parts different from the first embodiment will be described, and the same components as those in the first embodiment will be given the same symbols as in the first embodiment. Explain. FIG. 9 is a diagram showing a partial configuration of an exposure apparatus (substrate processing apparatus) U3 of the second embodiment. In the exposure unit 121 of the exposure device U3 of the first embodiment, the device frame 132 is separated into a first frame 132a and a second frame 132b, and the exposure unit 121a of the exposure device U3 of the second embodiment is a single device. Frame 180.

In the exposure unit 121a of the second embodiment, the device frame 180 is provided on the vibration isolator 131, and supports and holds the mask holding mechanism 11, the substrate supporting mechanism 12, the illumination mechanism 13, and the projection optical system of the transmission-type cylindrical mask MA. PL. The device frame 180 is composed of a lower surface portion 181 provided on the vibration isolation table 131, a pair of bearing portions 182 standing on the lower surface portion 181, a middle portion 183 supported on the pair of bearing portions 182, and a standing portion. A leg portion 184 on the upper portion 183, an upper portion 185 supported by the leg portion 184, and an arm portion 186 standing on the upper portion 185 are formed.

The pair of bearing portions 182 are provided with rotating cylinders of the shaft-supporting substrate supporting mechanism 12, respectively. The air bearing 141 of the rotating shaft AX2 of 25. Each air bearing 141 pivotally supports the rotation shaft AX2 in a non-contact state so as to be rotatable. A projection optical system PL is provided on the intermediate portion 183 through the holding member 143. A washer member 145 is provided at three positions between the holding member 143 and the intermediate portion 183. The holding member 143 is dynamically supported on the intermediate portion 183 by three washer members 145. The upper surface portion 185 is provided with a driving roller (capstan roller) 94 that supports the mask holding mechanism 11 (hollow cylindrical body) and drives the cylindrical mask MA to rotate about the rotation center line AX1. The illumination mechanism 13 is arranged inside the mask holding mechanism 11 and illuminates the illumination areas IR (IR1 to IR6) on the cylindrical mask MA from the inside in an arrangement shown in the left diagram in FIG. 6.

Further, the upper surface portion 185 is provided with a bearing 187 for rotatably supporting the rotation shaft of the driving roller 94, a mask-side driving portion 22 that drives the driving roller 94 to rotate, and the substrate-side driving portion shown in FIG. 4 previously. 26 is also constructed. Although not shown, a scale (diffraction grating) or a scale for measuring encoders is provided at both ends of the cylindrical mask holding mechanism 11 in the direction of the rotation center line AX1. The plate 25c accurately measures the position of the cylindrical mask MA in the circumferential direction by using the read heads EH arranged so as to face each other.

As described above, in the second embodiment, the single device frame 180 can support the mask holding mechanism 11, the substrate supporting mechanism 12, the lighting mechanism 13, and the projection optical system PL. Therefore, in the second embodiment, since the positional relationship between the mask holding mechanism 11, the substrate supporting mechanism 12, the lighting mechanism 13, and the projection optical system PL can be fixed, it is easy to easily adjust the positional relationship without having to significantly adjust the positional relationship. Set it.

Next, the exposure apparatus U3 (exposure unit 121a) of the second embodiment shown in FIG. 9 will be described in more detail with reference to FIG. In the exposure unit 121a of FIG. 10, the mask holding mechanism 11 includes a mask holding cylinder 21a that holds the transmission mask MA in a cylindrical shape, a guide roller 93 that supports the mask holding cylinder 21a, and a driving mask holding A driving roller 94 for rotating the cylinder 21a around the center line AX1, and Photomask-side driving section 22.

The mask holding cylinder 21a forms a mask surface P1 arranged in the illumination area IR on the mask MA. In this embodiment, the mask surface P1 includes a surface (hereinafter, referred to as a cylindrical surface) that rotates a line component (general line) around an axis (center axis of a cylindrical shape) parallel to the line component. The cylindrical surface is, for example, a cylindrical outer peripheral surface or a cylindrical outer peripheral surface. The mask holding cylinder 21a is made of, for example, glass, quartz, or the like, and has a cylindrical shape having a certain thickness. The outer peripheral surface (cylindrical surface) forms a mask surface P1. That is, in this embodiment, the illumination area IR on the mask MA is curved into a cylindrical surface shape having a constant radius Rm from the first axis AX1. The portion of the mask holding cylinder 21a that overlaps with the mask pattern of the mask MA as viewed from the radial direction of the mask holding cylinder 21a, for example, the center portion other than both ends in the Y direction of the mask holding cylinder 21a. The illumination beam EL1 is translucent.

The photomask MA is a transmissive planar sheet photomask that is patterned with a light-shielding layer such as chromium on one side of, for example, a short sheet-shaped ultra-thin glass plate with a good flatness (for example, a thickness of 100 to 500 μm). The outer peripheral surface of the photomask holding cylinder 21a is curved, and is used while being wound (attached) to the outer peripheral surface. The photomask MA has a pattern non-formation area A4 in which a pattern is not formed, and is attached to the photomask holding cylinder 21a in the pattern non-formation area A4. The mask MA is releasable with respect to the mask holding cylinder 21a. The reticle MA may be wound around the reticle holding cylinder 21a made of a transparent cylindrical base material, and the perimeter of the reticle holding cylinder 21a made of the transparent cylindrical base material may be directly drawn to form chrome or the like. The mask pattern formed by the light-shielding layer is integrated. In this case, the function of the mask holding cylinder 21a also serves as a support member for the mask MA.

The guide roller 93 and the driving roller 94 extend in a parallel Y direction with respect to the central axis of the mask holding cylinder 21a. The guide roller 93 and the drive roller 94 are provided so as to be rotatable about an axis parallel to the central axis. The outer diameter of the guide roller 93 and the drive roller 94 in the axial direction is larger than that of the other portions. The end is externally connected to the mask holding cylinder 21a. As described above, the guide roller 93 and the driving roller 94 are provided in a manner to avoid contact with the mask MA held by the mask holding cylinder 21a. The driving roller 94 is connected to the mask-side driving portion 22. The driving roller 94 transmits the power from the mask-side driving portion 22 to the mask holding cylinder 21a, thereby rotating the mask holding cylinder 21a about the central axis AX1.

The mask holding mechanism 11 is provided with one guide roller 93, but the number is not limited, and may be two or more. Similarly, although the mask holding mechanism 11 is provided with one driving roller 94, the number is not limited, and may be two or more. At least one of the guide roller 93 and the driving roller 94 may be disposed inside the mask holding cylinder 21a and inwardly connected to the mask holding cylinder 21a. In addition, in the mask holding cylinder 21a, when viewed from the radial direction of the mask holding cylinder 21a, portions that do not overlap with the mask pattern of the mask MA (both ends in the Y direction) may have light transmission to the illumination beam EL1. It may or may not have translucency. One or both of the guide roller 93 and the drive roller 94 may be, for example, a conical trapezoid, and a central axis (rotation axis) thereof is not parallel to the central axis AX1.

The lighting mechanism 13 has the same configuration as the first embodiment, and a plurality of lighting modules ILa1 to ILa6 of the lighting mechanism 13 are arranged inside the mask holding cylinder 21a. Each of the plurality of illumination modules ILa1 to ILa6 guides the illumination beam EL1 emitted from the light source, and irradiates the guided illumination beam EL1 from the inside of the mask holding cylinder 21a to the mask MA. The illumination mechanism 13 illuminates the illumination region IR of the mask MA held by the mask holding mechanism 11 with the illumination light beam EL1 at a uniform brightness. The light source may be arranged inside the mask holding cylinder 21a, or may be arranged outside the mask holding cylinder 21a. Further, the light source may be another device (external device) different from the exposure device U3.

As described above, in the second embodiment, even if the mask MA of the exposure unit 121a is a cylindrical transmission type mask, the exposure unit 121a, the position adjustment unit 120, and the drive unit can be used. 122 are set in independent states (states to isolate vibration transmission). Therefore, the exposure unit 121a can reduce the vibration from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131, and obtain the same effect as the first embodiment described above.

[Third Embodiment]

Next, an exposure apparatus U3 according to the third embodiment will be described with reference to FIG. 11. In addition, in the description of the third embodiment, in order to avoid repetitive descriptions, only parts different from the first embodiment and the second embodiment will be described, and the same constituent elements as those of the first and second embodiments will be given. The same symbols as those in the first or second embodiment will be described. FIG. 11 shows the overall configuration of the exposure unit 121b according to the third embodiment, which is configured by using a cylindrical reflective mask MB and supporting the substrate P in a flat shape.

First, the mask MB used in the exposure apparatus U3 of the third embodiment will be described. The photomask MB is, for example, a reflective photomask using a metal cylindrical body. The photomask MB is a cylindrical body having a peripheral surface (peripheral surface) having a radius of curvature Rm centered on the first axis AX1 extending in the Y direction, and has a certain thickness in the radial direction. The circumferential surface of the mask MB is a mask surface P1 on which a predetermined mask pattern is formed. The mask surface P1 includes a high reflection portion that reflects a light beam with a high efficiency in a predetermined direction and a reflection suppression portion that does not reflect a light beam in a predetermined direction or reflects a light beam with a low efficiency. The mask pattern is formed of a high reflection portion and a reflection suppression portion. Since the photomask MB is a metal cylindrical body, it can be manufactured inexpensively.

The photomask MB is only required to have a circumferential surface with a radius of curvature Rm centered on the first axis AX1, and is not limited to the shape of a cylindrical body. For example, the mask MB may be an arc-shaped plate material having a circumferential surface. In addition, the mask MB may have a thin plate shape, and the thin plate-shaped mask MB is bent to have a circumferential surface.

The mask holding mechanism 11 includes a mask holding cylinder 21b that holds the mask MB. The mask holding cylinder 21b holds the mask MB with the first axis AX1 of the mask M as a rotation center. The mask-side driving unit 22 is connected to the lower-level control device 16 and rotates the mask holding cylinder 21 b with the first axis AX1 as a rotation center.

The mask holding mechanism 11 is not limited to this configuration, although the mask M holds the cylindrical body by the mask holding cylinder 21b. The mask holding mechanism 11 can be held by winding a thin-plate-shaped mask MB along the outer peripheral surface of the mask holding cylinder 21b. In addition, the mask holding mechanism 11 may hold the mask MB of the arc-shaped plate material on the outer peripheral surface of the mask holding cylinder 21b.

The substrate supporting mechanism 12 includes a pair of driving rollers 196 that suspend a substrate P, an air stage 197 that supports the substrate P in a flat shape, and a plurality of guide rollers 28. The pair of driving rollers 196 are rotated by the substrate-side driving portion 26 to move the substrate P in the scanning direction. The air stage 197 is provided between the pair of driving rollers 196 and on the back side of the substrate P mounted between the pair of driving rollers 196 with a certain tension, and supports the substrate P in a non-contact state or a low friction state as a flat surface shape. The plurality of guide rollers 28 are provided on the upstream side and the downstream side of the substrate P in the conveying direction with a pair of driving rollers 196 therebetween. For example, four guide rollers 28 are provided, and two are arranged on the upstream side and the downstream side in the conveying direction, respectively.

Therefore, the substrate supporting mechanism 12 guides the substrate P transported from the position adjustment unit 120 to one driving roller 196 with two guide rollers 28. The substrate P guided to one of the driving rollers 196 is guided to the other driving roller 196 and is hung on the pair of driving rollers 196 with a certain tension. The substrate supporting mechanism 12 rotates the pair of driving rollers 196 by the substrate-side driving portion 26, and thereby the substrate P suspended on the pair of driving rollers 196 is conveyed to the guide roller 28 while being supported by the air stage 197. The substrate support mechanism 12 guides the substrate P transferred to the guide roller 28 to the substrate recovery device 4.

In the case of using the cylindrical reflection mask MB, the illumination mechanism 13 illuminates the illumination light beam EL1 from the outer peripheral side of the mask holding cylinder 21b. In other words, the lighting mechanism 13 has a light source device and an illumination optical system IL system provided on the outer periphery of the mask holding cylinder 21b. The illumination optical system IL is an epi-illumination system using a polarizing beam splitter PBS. A polarizing beam splitter PBS and a quarter-wavelength plate 198 are provided between each of the illumination modules IL1 to IL6 of the illumination optical system IL and the mask MB. That is, from the incident side of the illumination light beam EL1 from the light source device, the illumination modules IL1 to IL6, the polarizing beam splitter PBS, and the 1/4 wavelength plate 198 are sequentially provided.

Here, the illumination beam EL1 emitted from the light source device is incident on the polarizing beam splitter PBS through the illumination modules IL1 to IL6. The illumination beam EL1 incident on the polarizing beam splitter PBS is reflected by the polarizing beam splitter PBS, and then illuminates the illumination area IR through the 1/4 wavelength plate 198. The projection light beam EL2 reflected from the illumination area IR passes through the quarter-wave plate 198 again, and is converted into a light beam transmitted through the polarizing beam splitter PBS. The projection light beam EL2 passing through the 1/4 wavelength plate 198 is incident on the projection optical system PL through the polarizing beam splitter PBS.

As described above, in the third embodiment, the mask MB of the exposure unit 121b is a cylindrical reflective mask, and when the substrate P is supported in a flat shape, the exposure unit 121b and the position adjustment unit 120 can be driven and driven. The units 122 are respectively provided in independent states (states that isolate vibration transmission). Therefore, the exposure unit 121b can reduce the vibration from the position adjustment unit 120 and the driving unit 122 by the vibration isolation table 131, and obtain the same effect as that of the second embodiment described above.

[Fourth Embodiment]

Next, an exposure apparatus (pattern forming apparatus) U3 of the fourth embodiment will be described. In addition, in the description of the fourth embodiment, in order to avoid repetitive descriptions, only the parts different from the first to third embodiments will be described, and the same constituent elements as the first to third embodiments will be given the same as the first to third embodiments. 3 implementation The same symbols are used in the same state, and descriptions thereof are omitted.

FIG. 12 is a diagram showing the configuration of the exposure apparatus U3 of the fourth embodiment, and FIG. 13 is a diagram of the substrate P carried in the exposure apparatus U3 shown in FIG. 12 as viewed from above (+ Z direction). FIG. 14 is a view of the substrate P transferred between the last roller 126 on the position adjustment unit 120a side and the first roller AR1 on the exposure unit 121c side as viewed from the -Y direction side, and FIG. 15 is a view from- A view of the substrate P carried by the rotating drum 25 shown in FIG. 12 when viewed in the X direction side. The exposure device (processing device) U3 includes a position adjustment unit 120a and an exposure unit 121c provided on the downstream side (+ X direction side) of the substrate P in the conveying direction and the relative position adjustment unit 120a. The position adjustment unit 120a and the exposure unit 121c are provided separately. That is, the position adjustment unit 120a and the exposure unit 121c are provided in a non-contact independent state, or though the substrate P transport path between the position adjustment unit 120a and the exposure unit 121c and the substrate P after the exposure unit 121c can be passed The dustproof cover 121d such as the bellows type which covers the conveying path is in contact with each other, but is provided in a state where vibration components generated in the position adjustment unit 120a are not directly transmitted to the exposure unit 121c (state where vibration transmission is suppressed). The exposure unit 121c is provided on the installation surface (base table surface) E through a passive or active vibration isolation table (vibration isolation device, vibration isolation device) 131. The position adjustment unit 120 a is provided on the installation surface E through the base 200. Accordingly, vibrations from other processing devices U1, U2, U4 to Un, and the like and vibrations from the position adjustment unit 120a are not transmitted to the exposure unit 121c through the setting surface E. That is, the vibration transmission between the exposure unit 121c and the position adjustment unit 120a and other processing devices U and the like can be made into an insulated (isolated) state. In other words, the vibration between the position adjustment unit 120a and other processing devices U, and the vibration between the exposure unit 121c are isolated from each other. In addition, the base 200 may be a vibration isolation table (vibration isolation device, vibration isolation device) having vibration isolation and vibration isolation functions.

Position adjustment unit (position adjustment device) 120a with edge position controller The EPC 3a, a fixed roller (guide roller) 126, a first substrate detection section 202, and a lower-level control device (control section) 204. The edge position controller EPC3a, the fixed roller 126, and the first substrate detection unit 202 are provided in the aforementioned order from the upstream side (-X direction side) of the substrate P in the conveying direction. The edge position controller EPC3a adjusts (corrects) the position of the substrate P in the width direction so that the width position of the substrate P that is transported with a predetermined tension (for example, a certain value in the range of 20 to 200 N) in the long direction becomes the target position . The edge position controller EPC3a can move toward the width direction (Y direction) of the substrate P within the position adjustment unit 120a. The edge position controller EPC3a is driven in the Y direction by the actuator 206 (see FIG. 13), and adjusts the position of the substrate P in the width direction. The edge position controller EPC3a includes a guide roller Rs1, Rs2, and a driving roller NR for conveying the substrate P to the fixed roller 126. The guide rollers Rs1 and Rs2 guide the substrate P to be conveyed, and the drive roller NR rotates the substrate P while holding the front and back surfaces of the substrate P while rotating. Reference numeral 207a in FIG. 13 is a support member (frame of the edge position controller EPC3a) that supports the guide rollers Rs1, Rs2, and the drive roller NR as rotatable. Reference numeral 207b refers to a supporting member (main frame of the position adjustment unit 120a) that supports the first substrate detection unit 202 and supports the fixed roller 126. The main body frame 207b includes an edge position controller EPC3a. The frame 207a is mounted so as to be movable in the Y direction.

The fixing roller 126 guides the substrate P whose width position is adjusted by the edge position controller EPC3a to the exposure unit 121c. With the guide rollers Rs1, Rs2, the drive roller NR, and the fixed roller 126, the substrate P is bent in the longitudinal direction and guided and conveyed. The first substrate detection section (substrate error measurement section, change measurement section) 202 detects the position in the width direction of the substrate P that is conveyed from the fixed roller 1261 to the exposure unit 121c. Specifically, as shown in FIG. 13, the first substrate detection unit 202 is a detection unit 202 a that detects a position in the Y direction of the -Y side edge portion Ea in the width direction of the substrate P, and a detection portion 202 a that detects the + Y side edge portion Eb. The detection unit 202b in the Y-direction position is configured based on the detection from the two detection units 202a and 202b. The measurement signal measures the position change in the width direction of the substrate P. Further, in addition to the position detection of the substrate P in the width direction, the first substrate detection unit 202 (202a, 202b) may also detect (measure) the posture change (a slight tilt) of the substrate P, and the deformation (deformation of the substrate P) ( The sensor is configured to change information such as expansion and contraction in the width direction. The position of the substrate P in the width direction and the change information of the substrate P detected by the first substrate detection unit 202 are sent to the lower-level control device 204. The first substrate detection unit 202 may also detect the position in the width direction of the substrate P that is conveyed from the edge position controller EPC3a to the fixed roller 126.

The first substrate detection unit 202 measures the posture change of the substrate P, particularly the small width of the substrate P around the X axis (in the YZ plane) on the conveying path parallel to the horizontal plane (XY plane) from the fixed roller 126 to the exposure unit 121c. In the case of tilt, as shown in FIG. 14, as shown in FIG. 14, it is attached to each of the detection sections 202 a and 202 b, and the Z position (the height position in the direction of the normal line to the normal direction of the surface of the substrate P) Ze1 and Ze2 is assembled to detect the edge portions Ea and Eb of the substrate P Change of Z sensor. The detection sections 202a and 202b are arranged at a distance from the fixed roller 126 in the conveying direction of the substrate P. Therefore, when the exposure section 121c (roller AR1) is slightly inclined with respect to the fixed roller 126 and the XY plane, the detection section 202a is used. The difference between the detected Z position Ze1 and the Z position Ze2 detected by the detection unit 202b varies depending on the amount of tilt. As described above, by obtaining the difference value, the position change ΔZs between the fixed roller 126 (position adjustment unit 120a) and the exposure unit 121c (roller AR1) in the Z direction is cancelled, and the position of the detection unit 202a, 202b is disposed. Slight tilt of substrate P (X axis return ) Can be calculated correctly.

The actual tilt amount (angle Δψ) of the substrate P can be calculated by tanΔψ = (Ze1-Ze2) / Lz if the Y-direction distance of the Z sensor section of the detection sections 202a and 202b is Lz (a fixed value). As described above, the change in the slight tilt of the substrate P measured by the Z sensors assembled in the detection sections 202a and 202b also corresponds to the fixed roller 126, that is, the position adjustment unit 120a and the exposure unit. The relative tilt of 121c around the Z axis changes. As the Z sensor, an optical or capacitive non-contact gap sensor or the like can be used. The substrate P between the fixed roller 126 in FIG. 14 and the first roller (AR1) on the exposure unit 121c side is also given a certain tension in the longitudinal direction. Therefore, although the possibility of deflection of the substrate P therebetween is low, deflection may occur even when the tension is small, and measurement with the Z sensor may cause errors. Therefore, it is preferable that the detection sections 202a and 202b (Z sensor section) are arranged in the longitudinal direction (conveying direction) of the substrate P to be located near the first roller (AR1) on the exposure unit 121c side.

As shown in FIG. 14, when the substrate P is transported with the exposure unit 121 c (the first roller AR1) inclined in the YZ plane as viewed from the fixed roller 126, the substrate P is transported by the roller AR1. The direction (-Z direction) will not only impair its parallelism with the XZ plane, but will also cause the substrate P to slowly shift to one of the width directions (+ Y direction or -Y direction) due to tension. As a result, the substrate P supported by the rotating cylinder 25 is gradually displaced in the Y direction. Although the function of the position adjustment unit 120a (edge position controller EPC3a) is to correct such a Y-direction displacement of the substrate P, the substrate adjustment unit 214 including a roller AR1 provided on the side of the exposure unit 121c (described later in detail) ) Can also be amended. Therefore, based on the change information related to the slight tilt of the substrate P (around the X axis) detected by the detection sections 202a, 202b, one or both of the position adjustment unit 120a and the substrate adjustment section 214 can be controlled to maintain it with high accuracy. The Y-direction position of the substrate P supported by the rotating cylinder 25. The position adjustment of the substrate P in the width direction until it reaches the rotating tube 25 may be performed by the position adjustment unit 120 a for coarse adjustment and fine adjustment by the substrate adjustment unit 214.

The lower control device 204 controls the edge position controller EPC3a of the position adjustment unit 120a, or the substrate adjustment unit 214, etc., to control the position in the width direction of the substrate P. This lower-level control device 204 may be a part or all of the upper-level control device 5, or may be controlled by a higher-level The device 5 controls another computer different from the higher-level control device 5.

The exposure unit (patterning device) 121c includes a substrate support mechanism 12a, a second substrate detection section 208, an illumination mechanism 13a, an exposure head (pattern forming section) 210, and a lower control device (control section) 212. The exposure unit 121c is housed in the greenhouse ECV. In this greenhouse ECV, the temperature of the substrate P transferred inside is suppressed by keeping the inside at a predetermined temperature. The greenhouse ECV is disposed on the installation surface E through a passive or active vibration isolator 131.

The substrate supporting mechanism (conveying section) 12a is a person who transports the substrate P sent from the position adjustment unit 120a to the downstream side (+ X direction) while supporting it from the upstream side (-X direction side) of the substrate P in the conveying direction. It has a substrate adjustment section 214, a guide roller Rs3, a tension roller RT1, a rotating drum 25, a tension roller RT2, and driving rollers R5 and R6 in this order.

The substrate adjustment unit 214 has a plurality of rollers (AR1, RT3, AR2), and adjusts the position in the width direction of the substrate P, thereby correcting the distortion and wrinkles generated on the substrate P while moving the substrate P in the conveying direction (+ X direction) transport. The structure of the substrate adjustment section 214 will be described later. The guide roller Rs3 conveys the substrate P whose position in the width direction of the substrate P is adjusted by the substrate adjustment unit 214 to the rotating drum 25. The rotating cylinder 25 rotates while holding a portion of the substrate P to be exposed to a predetermined pattern on a circumferential surface, and simultaneously conveys the substrate P to the driving rollers R5 and R6. The functions of the driving rollers R5 and R6 are as described in the first embodiment. The tension rollers RT1 and RT2 are used to apply a predetermined tension to the substrate P that is wound and supported on the rotating drum 25. Reference numeral 215 in FIG. 13 indicates that a plurality of rollers, a guide roller Rs3, a tension roller RT1, a rotating drum 25, a tension roller RT2, and driving rollers R5 and R6 are supported as rotatable supporting members (exposure) The body frame of unit 121c).

FIG. 16 is a diagram showing a configuration of the substrate adjustment section 214. The substrate adjustment unit 214 includes adjustment rollers AR1 and AR2 and a tension roller RT3. Adjustment roller AR1, tension roller RT3 and adjustment roller AR2 are from The substrate P is provided in the order from the upstream side (-X direction side) in the conveying direction. The adjustment rollers AR1 and AR2 are arranged to bend the transport path of the substrate P under a predetermined tension. Specifically, the tension roller RT3 is provided below the adjustment rollers AR1 and AR2 (-Z direction side), and the conveyance path is bent while a predetermined tension is applied by the adjustment rollers AR1 and AR2. In this way, the substrate P transported from the position adjustment unit 120a to the + X direction is bent by the adjustment roller AR1 downward (-Z direction) under the state of a predetermined tension and guided by the tension roller RT3, and from the tension roller RT3 to The substrate P conveyed from above (+ Z direction) is guided by the guide roller Rs3 by being bent in the + X direction by the adjustment roller AR2 under a predetermined tension. In addition, the tension roller RT3 is axially supported at both ends in the Y direction so as to be able to move in the Z direction in parallel. During the transportation of the substrate P, a predetermined spring pressure is generated in the -Z direction to apply tension to the substrate P.

The adjustment roller AR1 can rotate relative to the rotation axis AX3a through the bearing 214a, and the adjustment roller AR2 can also rotate relative to the rotation axis AX3b through the bearing 214b. The rotation axes AX3a and AX3b are provided in parallel along the Y direction. The adjustment rollers AR1 and AR2 can be inclined with respect to an axis parallel to the Y direction. That is, one end side (-Y direction side) of the rotation axis AX3a of the adjustment roller AR1 can be slightly moved in the Z direction and the X direction by using the other end side (+ Y direction side) as a fulcrum. The adjustment roller AR2 is also the same, and one end side (-Y direction side) of the rotation axis AX3b can be moved to the X direction and Z direction by using the other end side (+ Y direction side) as a fulcrum. The slight movement of one end side (-Y direction side) of the rotation axes AX3a and AX3b is driven by an actuator such as a piezoelectric element (not shown). By slightly adjusting the adjustment rollers AR1 and AR2, the position of the width direction of the substrate P can be finely adjusted as the substrate P is transported in the longitudinal direction, and it is possible to correct slight distortions generated in the substrate P and the internal stress of the substrate P There is a slight in-plane deformation (or wrinkle). In FIG. 16, although the two adjustment rollers AR1 and AR2 can be slightly inclined in the XY plane or the YZ plane, the tension roller RT1 can also be adjusted without tilting the adjustment rollers AR1 and AR2. Made tiltable. In addition, the adjustment roller AR1 and the tension roller RT1 may be made tiltable without tilting the adjustment roller AR1.

The second substrate detection section (substrate error measurement section, change measurement section) 208 detects the position of the substrate P that is transported from the tension roller RT1 toward the rotary cylinder 25 in the + Z direction in the width direction. Specifically, as shown in FIG. 15, the second substrate detection units 208 are respectively provided on both ends in the width direction of the substrate P to detect edges in both ends of the substrate P in the width direction. 17A is a diagram showing a configuration of the second substrate detection unit 208, FIG. 17B is a diagram showing a light beam Bm irradiated to the substrate P by the second substrate detection unit 208, and FIG. 17C is a diagram showing a light beam received by the second substrate detection unit 208 Bm figure. The second substrate detection unit 208 includes an irradiation system 216 that irradiates the light beam Bm, and a light receiving system 218 that receives the light beam Bm. The irradiation system 216 includes a light projection unit 220, a cylindrical lens 222, and a reflecting mirror 224, and the light receiving system 218 includes a reflecting mirror 226, an imaging optical system 228, and an imaging element 230. The light projection unit 220 includes a light source that emits a light beam Bm, and irradiates the emitted light beam Bm to the substrate P. The light beam Bm irradiated by the light projecting unit 220 passes through the cylindrical lens 222 and the reflecting mirror 224 and is irradiated on the substrate P. As shown in FIG. 17B, the cylindrical lens 222 converges the incident light beam Bm in the Z direction, and becomes a slit-shaped light beam Bm on the substrate P parallel to the Y direction of the substrate P. The length of the light beam Bm photographed toward the substrate P is set to Lbm. At least a part of the light beam Bm irradiated toward the substrate P side is reflected by the substrate P, and the light beam Bm that is not irradiated to the remainder of the substrate P is not reflected by the substrate P and remains straight.

The slit-shaped light beam Bm reflected on the substrate P passes through the mirror 226 and enters the imaging optical system 228. The imaging optical system 228 images the light beam Bm reflected from the mirror 226 on the imaging element 230, and the imaging element 230 captures the incident light beam Bm. As shown in FIG. 17C, the length of the light beam Bm captured by this photographing element 230 is the length Lbm1 of the light beam Bm reflected on the substrate P. Therefore, measuring the length of this Lbm1 can detect the position of the edge of the substrate P. With this structure, the second substrate inspection The measuring unit 208 can accurately detect the position of the substrate P transferred in the + Z direction from the tension roller RT1 toward the rotating drum 25 in the width direction. In addition, the second substrate detection unit 208 can detect (measure) the change information related to the position change in the width direction of the substrate P, the deformation of the substrate P (the expansion and contraction in the width direction), and the like by detecting the position of the substrate P. The position of the substrate P in the width direction and the change information of the substrate P detected by the second substrate detection unit 208 are sent to the lower-level control device 204. Reference numeral 230a indicates a photographing area of the photographing element 230. The configuration of the first substrate detection unit 202 may be the same as that of the second substrate detection unit 208.

Each of the alignment microscopes (substrate error measurement section and change measurement section) AM1 and AM2 of the exposure unit 121c is provided with a plurality of along the width direction of the substrate P, and the alignment marks formed on the substrate P as shown in FIG. 15 are detected. Ks. In the example shown in FIG. 15, the alignment marks Ks are formed at both ends of the substrate P at a certain interval along the length direction of the substrate P, between the exposure area A7 and the exposure area A7 arranged in the length direction on the substrate P. Five are provided at regular intervals along the width direction of the substrate P. Therefore, in order to detect the alignment marks Ks formed on the substrate P, five alignment microscopes AM1 (refer to FIG. 19) and AM2 are provided at a certain interval in the width direction of the substrate P. By detecting the alignment marks Ks by the alignment microscopes AM1 and AM2, it is possible to detect the position of the substrate P that is transported while being supported by the rotating cylinder 25 in the width direction with high accuracy. In addition, the alignment microscopes AM1 and AM2 can detect (measure) change information related to the position change in the width direction of the substrate P, the posture change, and the deformation of the substrate P by detecting the position of the alignment mark Ks.

The position information of each of the alignment marks Ks detected by the alignment microscopes AM1 and AM2 in the longitudinal direction (conveying direction) and the width direction is sent to the lower control device 212. The lower control device 212 generates correction information for correcting the pattern forming position based on the obtained position information of the alignment mark Ks and sends the correction information to the exposure head (pattern forming section) 210, and calculates the position of the substrate P in the width direction. The change information of the position and the substrate P is sent to the lower control device 204. Reference numeral 232 in FIG. 15 indicates the detection area (detection field of view) of each alignment microscope AM1, and the positions of the five detection areas 232 in the transport direction of the substrate P (Z direction in FIG. 15) are set at The substrate P is firmly in close contact with the outer peripheral surface of the rotating tube 25. Although the size of the detection area 232 on the substrate P is set depending on the size of the alignment mark Ks and the alignment accuracy (position measurement accuracy), it is about 100 to 500 μm square.

As shown in FIG. 12, a relative position detecting unit (for detecting (measuring) change information on the relative position and position change of the position adjusting unit 120a and the exposure unit 121c is provided between the position adjusting unit 120a and the exposure unit 121c ( Position error measurement unit, change measurement unit) 234. FIG. 18 is a diagram showing the configuration of the relative position detection unit 234. The relative position detection section 234 is provided on the −Y direction end side and the + Y direction end side between the position adjustment unit 120 a and the exposure unit 121 c, respectively. The relative position detection unit 234 includes a first detection unit 236 that detects a change in the relative position of the position adjustment unit 120a and the exposure unit 121c on the YZ plane, and a relative position detection unit that detects a change in the relative position of the position adjustment unit 120a and the exposure unit 121c on the XZ plane. The second detection unit 238. In this way, the relative position detection unit 234 can detect the relative position and change information of the position adjustment unit 120a and the exposure unit 121c in three dimensions (XYZ space).

The first detection unit 236 includes a light projecting unit 240a that irradiates laser light in the + X direction, and a light receiving unit 242a that receives laser light irradiated by the light projecting unit 240a. The second detection unit 238 includes a light projecting unit 240b that radiates laser light in the + Y direction, and a light receiving unit 242b that receives laser light irradiated by the light projecting unit 240b. The light projection section 240a of the first detection section 236 and the light projection section 240b of the second detection section 238 are provided on the surface side (+ X direction side) of the position adjustment unit 120a and the exposure unit 121c facing each other. The light receiving portion 242b of the first detection portion 236 and the light receiving portion 242b of the second detection portion 238 are provided in the exposure unit 121c and the position. The facing side (-X direction side) of the facing adjustment unit 120a.

The light-receiving sections 242a and 242b are configured by a four-segment sensor. That is, the light-receiving sections 242a and 242b have four photodiodes (photoelectric conversion elements) 244, and the difference between the received light amount (the difference in signal level) received by each of the four photodiodes 244 is used to detect the difference between the received light and the laser light. The position of the beam center perpendicular to the beam changes. Since the laser light that has entered the light receiving section 242a is light that advances in the + X direction, the light receiving section 242a detects the center position and position change of the laser light in the YZ plane perpendicular to the X direction. In addition, since the laser light that has entered the light receiving section 242b is light traveling in the + Y direction, the light receiving section 242b detects the center position and position change of the laser light in the XZ plane perpendicular to the Y direction. In this way, it is possible to detect (measure) the change information on the relative position and position change of the position adjustment unit 120a and the exposure unit 121c in three dimensions. In particular, it is possible to measure the relative rotation error of the position adjustment unit 120a and the exposure unit 121c about the X axis (relative in the YZ plane) due to the difference and average of the detection information of the first detection unit 236 separated by the Y direction. Relative tilt between Y) and Y. In addition, the relative rotation error (relative tilt in the XY plane) of the position adjustment unit 120a and the exposure unit 121c can be measured in real time by the difference between the detection information of the second detection unit 238 separated by the Y direction.

Returning to the description of FIG. 12, the illumination mechanism 13 a has a laser light source for emitting laser light (exposure light beam) LB used for exposure. The laser light LB may be ultraviolet light having a peak wavelength in a wavelength band below 370 nm. The laser light LB may also be a pulse light that emits light at an oscillation frequency Fs. The laser light LB emitted from the illumination mechanism 13 a is incident on the exposure head 210.

The exposure head 210 includes a plurality of drawing units DU (DU1 to DU5) into which the laser light LB from the illumination mechanism 13a is incident. That is, the laser light LB from the illuminating mechanism 13a is guided by a light introduction optical system 250 having a mirror or a beam splitter, and enters a plurality of drawing units. DU (DU1 ~ DU5). The exposure head 210 draws a pattern on a part of the substrate P conveyed by the substrate supporting mechanism 12a and supported by the peripheral surface of the rotary cylinder 25 by a plurality of drawing units DU (DU1 to DU5). The exposure head 210 has a plurality of drawing units DU (DU1 to DU5) constituting the same, and is referred to as a multi-beam type exposure head 210. The drawing units DU1, DU3, and DU5 are arranged on the upstream side (-X direction side) of the rotation axis AX2 of the rotation cylinder 25, and the drawing units DU2, DU4 are arranged on the substrate P relative to the rotation axis AX2 of the rotation cylinder 25 Downstream side in the transport direction (+ X direction side).

Each drawing unit DU converges the incident laser light LB into spot light on the substrate P, and scans the spot light at high speed along a scanning line with a rotating polygon mirror or the like. As shown in FIG. 19, the scanning lines L of the respective drawing units DU are set to be connected in the Y direction (the width direction of the substrate P) without being separated from each other. In FIG. 19, the scanning line L of the drawing unit DU1 is represented by L1, and the scanning line L of the drawing unit DU2 is represented by L2. Similarly, the scanning lines L of the drawing units DU3, DU4, and DU5 are represented by L3, L4, and L5. As described above, each of the drawing units DU1 to DU5 distributes the scanning area in such a manner that all the width directions of the exposure area A7 are covered. For example, if the drawing width (length of the scanning line L) in the Y direction by one drawing unit DU is set to about 20 to 50 mm, three odd-numbered drawing units DU1, DU3, and DU5, and A total of five even drawing units DU2 and DU4, five drawing units DU, are arranged in the Y direction to expand the width in the Y direction that can be drawn to about 100 to 250 mm. The alignment microscopes AM1 and AM2 are located on the upstream side (-X direction side) of the substrate P in the conveying direction from the scanning lines L1, L3, and L5. An alignment mark Ks formed on the substrate being transported.

This drawing unit DU is a known technique disclosed in International Publication No. 2013/146184 (refer to FIG. 36), and the drawing unit DU will be briefly described using FIG. 20. also, Since each drawing unit DU (DU1 to DU5) has the same configuration, only the drawing unit DU2 will be described, and the description of the other drawing units DU will be omitted.

As shown in FIG. 20, the drawing unit DU2 includes, for example, a collecting lens 252, a drawing optical element (light modulator) 254, an absorber 256, a collimating lens 258, a reflecting mirror 260, a cylindrical lens 262, a focusing lens 264, A reflecting mirror 266, a polygon mirror (light scanning member) 268, a reflecting mirror 270, an f-θ lens 272, and a cylindrical lens 274.

The laser light LB that has entered the drawing unit DU2 advances downward from the vertical direction (-Z direction), and enters the drawing optical element 254 through the light collecting lens 252. The light collecting lens 252 collects (converges) the laser light LB that has entered the optical element 254 for drawing into a beam waist within the optical element 254 for drawing. The optical element 254 for drawing is transparent to the laser light LB, and an acousto-optic element (AOM: Acousto-Optic Modulator) is used, for example.

When the driving optical signal (high-frequency signal) from the lower control device 212 is OFF, the drawing optical element 254 penetrates the incident laser light LB to the absorber 256 side, and the driving signal from the lower control device 212 When the (high-frequency signal) is ON, the incident laser light LB is returned to the reflecting mirror 260. The absorber 256 is a light trap that absorbs the laser light LB to prevent the laser light LB from leaking to the outside. As described above, the drawing driving signal (frequency of ultrasonic waves) to be applied to the drawing optical element 254 is turned on and off at high speed based on the pattern data (white), and the laser light LB is switched to the mirror 260, or Towards the absorber 256. In this case, when viewed on the substrate P, it represents the intensity of the laser light LB (spot light SP) reaching the photosensitive surface, which is adjusted to a high level and a low level (for example, 0 level) at a high speed according to the pattern data. Either.

The collimating lens 258 converts the laser light LB from the drawing optical element 254 toward the reflecting mirror 260 into parallel light. The reflecting mirror 260 reflects the incident laser light LB in the -X direction and transmits it The cylindrical lens 262 and the focusing lens 264 are irradiated on the reflecting mirror 266. The reflecting mirror 266 irradiates the incident laser light LB to the polygon mirror 268. The polygon mirror (rotating polygon mirror) 268 continuously changes the reflection angle of the laser light LB by rotation, and scans the position of the laser light LB irradiated on the substrate P in the scanning direction (the width direction of the substrate P). The polygon mirror 268 is rotated at a certain speed (for example, 10,000 rpm) by a rotation drive source (for example, a motor, a reduction mechanism, etc.), which is not shown.

A cylindrical lens 262 provided between the reflecting mirror 260 and the reflecting mirror 266 is linked with the focusing lens 264 and collects (converges) the laser light LB on the polygon mirror 268 in a non-scanning direction (Z direction) orthogonal to the scanning direction. The reflective surface. With this cylindrical lens 262, even if the aforementioned reflecting surface is inclined with respect to the Z direction (inclined from the normal state of the XY plane and the equilibrium state of the aforementioned reflecting surface), its influence can be suppressed to suppress the irradiation on the substrate P. The irradiation position of the laser light LB is deviated in the X direction.

The laser light LB reflected by the polygon mirror 268 is reflected in the -Z direction by the mirror 270 and enters the f-θ lens 272 having an optical axis AXu parallel to the Z axis. The f-θ lens 272 is a telecentric system in which the main ray of the laser light LB projected on the substrate P is at all times the normal line of the surface of the substrate P during scanning, so that the laser light LB can be accurately moved at a constant velocity in the Y direction. scanning. The laser light LB radiated from the f-θ lens 272 passes through the cylindrical lens 274 whose bus bar is parallel to the Y direction, and becomes a small circular spot light SP having a diameter of about several μm, which is irradiated on the substrate P. The spot light (scanning spot light) SP performs one-dimensional scanning in one direction by a polygon mirror 268 along a scanning line L2 extending in the Y direction.

The lower control device 212 controls the lighting mechanism 13a, the exposure head 210, and the like, and applies a pattern to the substrate P. That is, the lower control device 212 controls the illuminating mechanism 13a to irradiate the laser light LB and controls the drawing optical element 254 included in each drawing unit DU of the exposure head 210 based on the position of the alignment mark Ks detected by the alignment microscope AM1. At a predetermined position on the substrate P, that is, In other words, an exposure pattern is drawn on the exposure area A7. The lower-level control device 212 may be a part or all of the upper-level control device 5, or may be another computer controlled by the upper-level control device 5 and different from the upper-level control device 5.

Here, the substrate P is transported to the rotating cylinder 25 in a state where the length direction of the substrate P is orthogonal to the rotation axis AX2 of the rotating cylinder 25 and the substrate P is not twisted or wrinkled. . Therefore, it is preferable that the rollers (Rs1 to Rs3, NR, 126, AR1, AR2, RT1 to RT3, R5, and R6) and the rotation axis of the rotating tube 25 can be aligned with each other in the Y direction. It is preferable to arrange the substrates P in parallel, and transport the substrates P in such a manner that the longitudinal direction of the substrates P is orthogonal to the rotation axes of the rollers and the rotating drum 25.

However, in reality, the rollers (Rs1 to Rs3, NR, 126, AR1, AR2, RT1 to RT3, R5, and R6) are set to slightly deviate from the rotation axis, and the rotation axes of the rollers are not parallel to each other. In addition, the position of the position adjustment unit 120a and the exposure unit 121c may be relatively changed due to vibration or the like, which may cause the rotation axis of the roller of the position adjustment unit 120a and the rotation axis of the roller of the exposure unit 121c to be non-parallel. In this way, a slight stress disorder, distortion, or wrinkle will be generated inside the substrate P, so that the winding is performed in a state where the length direction of the substrate P is slightly inclined with respect to the rotation axis AX2 of the rotary cylinder 25, resulting in the The pattern P is supported by the rotating cylinder 25 in a state where the line width dimension is relatively deformed (in-plane distortion).

Therefore, in the fourth embodiment, the lower control device 204 controls the edge position controller EPC3a based on the detection results of the first substrate detection unit 202, the second substrate detection unit 208, the alignment microscope AM1, AM2, and the relative position detection unit 234. And substrate adjustment section 214.

In detail, the lower-position control device 204 controls the edge position controller EPC3a based on the position of the substrate P in the width direction and the change information of the substrate P detected by the first substrate detection unit 202. The actuator (drive mechanism) 206 adjusts the position of the substrate P in the width direction. For example, the lower control device 204 calculates the difference between the center position in the Y direction and the target position obtained from the edge positions of both ends of the substrate P detected by the first substrate detection unit 202 so that the calculated difference is zero (0) In this way, the actuator 206 performs feedback control to move the substrate P in the Y direction. Accordingly, the position in the width direction of the substrate P transferred from the position adjustment unit 120a can be made the target position, and the substrate P can be prevented from generating slight twists, wrinkles, and the like. In this way, the Y-direction position of the substrate P wound around the rotating cylinder 25 can be maintained at a high accuracy, and the plurality of alignment marks Ks arranged in the length direction of the substrate P can be detected in the detection area of each alignment microscope AM1 ( Detection field of view) 232 is continuously captured.

In addition, the lower-level control device 204 can control the actuator 206 of the edge position controller EPC3a by using change information related to the relative positions and position changes of the position adjustment unit 120a and the exposure unit 121c detected by the relative position detection unit 234. The position change of the substrate P in the width direction (the displacement of the substrate P with the change in the tilted state in the width direction) is corrected in advance. In addition, the lower control device 204 can adjust the inclination angles of the adjustment rollers AR1 and AR2 of the substrate adjustment unit 214 based on information related to the relative position and the position change detected by the relative position detection unit 234, thereby adjusting the width of the substrate P in the width direction. Its location. The adjustment of the tilt angles of the adjustment rollers AR1 and AR2 can be performed by driving an actuator (driving unit) of the aforementioned piezoelectric element or the like. In this way, even when the relative positions of the position adjustment unit 120a and the exposure unit 121c are changed, the position of the substrate P transported to the rotary drum 25 in the width direction can be continuously set at the target position with high accuracy and high responsiveness. To suppress the generation of minute twists or wrinkles on the substrate P.

In addition, from the positions of the alignment marks Ks detected by the alignment microscopes AM1 and AM2, it is also known that the position of the substrate P in the width direction, and the posture change and deformation of the substrate P, such as the small twists and wrinkles of the substrate P, can be known. Change information. Therefore, the lower control device 204 is based on the detected alignment. The position of the mark Ks controls the edge position controller EPC3a (actuator 206) and the substrate adjusting section 214 (actuator such as the aforementioned piezoelectric element) to adjust the position of the substrate P in the width direction. In this way, the position of the substrate P transported to the rotating drum 25 in the width direction can be set to the target position with high accuracy and high responsiveness, and the occurrence of slight distortion or wrinkles on the substrate P can be suppressed.

In addition, the lower control device 204 confirms whether the position of the substrate P in the width direction is located at the target position or the substrate P based on the position of the substrate P in the width direction immediately before being transported to the rotary drum 25 detected by the second substrate detection unit 208. Distortion (tilt) may occur. The detection of the distortion (tilt) of the substrate P is to increase the incident angle of the light beam Bm to the substrate P using the detection system illustrated in FIG. 17A, and the substrate P is shifted to the surface normal direction (the X direction in FIG. 17A). In this case, it is sufficient to use the reflection image Bm of the light beam Bm in the shooting area 230a of the photographing element 230 to shift in the Z direction. Since the second substrate detection unit 208 is also provided corresponding to each of the edge portions Ea, Eb on both sides of the substrate P, by comparing the offset (differentiation) of the image of the reflected light beam Bm in the Z direction within the shooting area 230a, It is also possible to obtain a slight amount of inclination in the width direction of the substrate P.

When the position of the substrate P in the width direction is not the target position, the lower control device 204 controls the edge position controller EPC3a (to the edge position controller EPC3a based on the position of the substrate P in the width direction and the change information of the substrate P detected by the second substrate detection unit 208) The actuator 206) and the substrate adjustment unit 214 (the actuator of the aforementioned piezoelectric element or the like) adjust the position of the substrate P in the width direction. This allows the position of the substrate P to be transferred to the rotating drum 25 in the width direction to be the target position.

However, since the second substrate detection unit 208 is disposed at a position immediately before the substrate P is wound around the rotating drum 25, a large change in the width direction of the substrate P occurs suddenly at this position, for example, the alignment mark Ks is detached. When the positional deviation of the detection area 232 of the microscope AM1 is large, it is difficult to precisely position the pattern to be formed in the exposure area A7. This situation In this case, procedures such as terminating the pattern formation of the exposed area A7 and skipping it, or temporarily reversing the substrate P back to a certain length, and then carrying it forward in the forward direction and performing re-detection of the alignment mark Ks using the alignment microscope AM1 (Retry the operation, etc.) until the alignment mark Ks is captured in the detection area 232.

As described above, the fourth embodiment can also set the exposure unit 121c and the position adjustment unit 120a in an independent state (a state where vibration transmission is blocked), respectively. Therefore, the exposure unit 121c can reduce the vibration from the position adjustment unit 120a by the vibration isolation table 131, and obtain the same effect as the first embodiment described above. Furthermore, in the fourth embodiment, the lower control device 204 controls the edge position controller EPC3a and the substrate adjustment unit 214 based on the detection results of the first substrate detection unit 202, the second substrate detection unit 208, and the alignment microscopes AM1 and AM2. . Accordingly, the exposure accuracy of the pattern of the substrate P using the exposure head 210 can be improved. The lower control device 204 controls the edge position controller EPC3a and the substrate adjustment unit 214 based on the detection result of the relative position detection unit 234. According to this, even when the relative position of the position adjustment unit 120a and the exposure unit 121c is changed, the accuracy of the exposure of the pattern of the substrate P using the exposure head 210 can be improved.

In the fourth embodiment described above, although the position adjustment unit 120a and the exposure unit 121c are provided in the exposure device U3, as long as it is viewed from the transport direction of the substrate P, the exposure unit 121c is provided immediately after the position adjustment unit 120a. Just make up. Therefore, the position adjustment unit 120a may not be provided in the exposure device U3. In this case, the position adjustment unit 120a may be disposed on the processing device U (U2) side provided before the exposure device U3 shown in FIG. 1 as viewed from the conveying direction of the substrate P. Alternatively, in a case where the substrate supply device 2 is provided before the exposure device U3, the function of the position adjustment unit 120a may be provided in the substrate supply device 2.

In addition, the exposure device U3, the exposure units 121, 121c, and the like (the second processing unit The step preceding the photo-patterning step is a step of forming (coating) a liquid photosensitive layer on the surface of the substrate P and a step of drying (baking) the photosensitive layer. However, when a dry film is used as the photosensitive layer, the step of transferring the photosensitive layer on the dry film to the surface of the substrate P as the substrate to be exposed is carried out using a compression bonding transfer device such as a laminator (photosensitive layer). The formation step) may not require a drying step. Therefore, as the processing device (first processing unit) before the previous step of the photo-patterning step, the photosensitive layer forming device for forming a photosensitive layer on the surface of the substrate P, or the drying (heating) device for drying the substrate P, can be used here. The function of the position adjustment unit 120a provided on the downstream side (substrate carrying-out portion) of the substrate conveying path in the pre-processing device, or between the pre-processing device and the photo-patterning device.

When a printing machine is used as the patterning step, as a previous step, in order to improve the adhesion of the ink to the surface of the substrate P, the entire surface of the substrate P or only the portion to be patterned is modified. (Selection of liquid repellency / lyophilicity, etc.). Since these surface modification treatment steps are also implemented by a single or multiple pre-processing devices, the substrate conveyance path downstream (substrate carrying-out section) in the pre-processing device can be installed before the printing press, or the pre-processing device and the The function of the position adjustment unit 120a is provided between the printing presses.

In the fourth embodiment described above, although the first substrate detection unit 202 is provided in the position adjustment unit 120a and the second substrate detection unit 208 is provided in the exposure unit 121c, only the first substrate detection unit 202 and the second substrate detection may be provided. Any one of the sections 208. In addition, both of the first substrate detection unit 202 and the second substrate detection unit 208 may not be provided. This is because the position of the substrate P in the width direction can be detected with the alignment microscopes AM1 and AM2 even if the first substrate detection section 202 and the second substrate detection section 208 are not provided.

In the fourth embodiment described above, the processing device U3 is used as the exposure device. The description is provided as long as it is a patterning device that applies a pattern to the substrate P. Examples of the pattern forming apparatus include an inkjet printer that applies a pattern of ink to the substrate P in addition to an exposure apparatus. In this case, the exposure head 210 is replaced with a nozzle head (pattern forming portion) having a plurality of nozzles for selectively applying a pattern of ink as a liquid droplet to the substrate P, and the exposure units 121, 121a to 121c are provided. The patterning device was replaced with a patterning device. In the same manner as in the first to third embodiments, the processing device U3 may be a pattern forming device that applies a pattern to the substrate P.

As described in each of the above embodiments, it is very important how to form a precise positioning pattern on the substrate P in an exposure device that forms a fine pattern for electronic components on the substrate P and a patterning device such as an inkjet printer. Vibration, which is one of the interfering factors that will cause its positioning accuracy to decrease, is generated from air compressors and liquid compressors or pumps built in nearby processing equipment and transmitted to the supporting exposure head (pattern) through the factory floor (Forming portion) 210 and supporting members such as the rotating cylinder 25 of the substrate P. It is effective to isolate the vibration transmission path, and it is effective to provide an anti-vibration device (such as a vibration isolation table 131) in the patterning device. In addition, although the factory floor (foundation) is preferably as solid as possible and constructed with a low resonance frequency, in the above embodiments, even if the ground conditions are not so strict, the substrate P can be accurately conveyed for patterning with high accuracy. .

For example, when constructing a production line, in order to avoid the substrate P passing through the patterning device (exposure units 121, 121a to 121c) from shifting in the width direction, the roller in the patterning device and the upstream processing device (position adjustment of the patterning device) The parallelization operation of the rollers in the units 120 and 120a), but after the processing of the substrate P is started, due to the influence of the load of the device and the like, there may be a slight depression in the ground and a tilt. In this case, the first substrate detection unit 202 (202a, 202b) and the relative position detection unit 234 can measure the positional displacement and deformation of the substrate P in the width direction when the substrate P is carried into the patterning device (a slight tilt caused by distortion). The substrate adjustment section 214 (roller AR1 , RT3, AR2).

In the case of the fourth embodiment, the substrate adjusting portion 214 composed of a plurality of rollers (at least one of which can be tilted) shown in FIG. 16 is a main body frame provided on the side of the exposure unit 121c shown in FIG. 12. 215, but the main body frame 207b in the position adjustment unit 120a may be provided. In this case, in the position adjustment unit 120a (the first processing device) and the exposure unit 121c (the second processing device) that are separated from each other in order to isolate or suppress transmission of vibration, a second substrate detection unit 208 provided on the exposure unit 121c side, Similar to the second substrate detection unit 124 shown in FIG. 2, it is provided near the guide roller Rs3 or the tension roller RT1. Furthermore, the substrate adjustment unit 214 may be provided on the installation surface E as a separate unit separately from both the position adjustment unit 120a (the first processing device) and the exposure unit 121c (the second processing device).

A position adjustment unit 120a or a first substrate is provided between the exposure units 121, 121c, etc. (the second processing unit) that performs the light patterning step and the processing device (the first processing unit) before the previous step of the functional patterning step. In the case of the detection unit 202, the first substrate detection unit 202 can detect a change in the position of the substrate P that is transferred from the first processing unit to the second processing unit. When the position adjustment unit 120a or the first substrate detection unit 202 is provided on the downstream side of the substrate P in the conveying direction in the first processing unit, the first substrate detection unit 202 can detect the conveyance from the first processing unit to the second The position change of the substrate P of the processing unit can also be detected from the position of the substrate P detected by the first substrate detection unit 202 and the position of the substrate P detected by the second substrate detection unit 208 or the alignment microscopes AM1 and AM2. The position of the substrate P transferred from the first processing unit to the second processing unit changes. In addition, the relative position and position change of the position adjustment unit 120a and the exposure unit 121c can be detected by the relative position detection unit 234, so that the position change of the substrate P transferred from the first processing unit to the second processing unit can be detected.

Claims (9)

A substrate processing apparatus includes a vibration isolator on an installation surface, and an exposure unit disposed on the vibration isolator and performing exposure processing on a supplied substrate. The substrate processing apparatus is characterized in that it includes: position adjustment The unit has: a base, provided in an independent state in non-contact with the exposure unit, and provided on the setting surface for adjusting the position of the substrate supplied to the exposure unit in the width direction; a width moving mechanism, On the base, the substrate is moved in the width direction of the substrate relative to the base; and a fixed roller is provided on the base and guides the substrate after the position adjustment by the width moving mechanism is directed to the exposure unit. And the position relative to the base is fixed; the first substrate detecting section is fixed on the base and detects the position of the substrate supplied to the fixed roller in the width direction; and the control section is based on the first substrate The detection result of the detection unit controls the width moving mechanism to correct the position of the substrate supplied to the fixed roller in the width direction to the first target position. For example, the substrate processing apparatus of the first patent application range, wherein the position adjustment unit further includes a roller position adjustment mechanism for adjusting the position of the fixed roller relative to the exposure unit; and further includes: a second substrate detection section, which is fixed to the substrate Detecting the position of the substrate supplied to the exposure unit on the vibration-removing stage; and a control unit that controls the roller position adjustment mechanism based on the detection result of the second substrate detection unit to supply the The position of the substrate is corrected to the second target position. For example, the substrate processing apparatus of the scope of application for patent No. 1 further includes: a pressing mechanism for pressing the substrate supplied from the position adjustment unit to the exposure unit to impart tension; a second substrate detecting section is provided at On the vibration isolation table, a position of the substrate supplied to the exposure unit is detected; and a control unit controls the pressing mechanism according to a detection result of the second substrate detection unit to adjust a pressing amount on the substrate. For example, the substrate processing apparatus according to any one of claims 1 to 3, further comprising a driving unit for driving the exposure unit; the exposure unit includes a mask holding member for holding a mask for illuminating the illumination light, and a support from A substrate supporting member of the substrate on which the projection light of the mask is projected; the driving unit includes a mask-side driving section that drives the mask holding member to move the mask in the scanning direction, and The substrate-side driving portion of the substrate supporting member is driven to move in the scanning direction. For example, the substrate processing apparatus according to item 4 of the patent application, wherein the exposure unit has a first frame supporting the mask holding member and a second frame supporting the substrate supporting member; the vibration isolation table includes a A first vibration isolator between the installation surface and the first frame, and a second vibration isolator between the installation surface and the second frame. For example, the substrate processing apparatus according to claim 4 in the patent application, wherein the exposure unit has a frame supporting the mask holding member and the substrate supporting member; and the vibration isolation table is provided between the installation surface and the frame. For example, the substrate processing apparatus of the fourth scope of the patent application, wherein the mask holding member holds the mask having a mask surface with a first radius of curvature centered on the first axis; the mask-side driving section, The mask holding member is driven by rotation to move the mask in the scanning direction; the substrate supporting member supports the substrate along a supporting surface with a second radius of curvature centered on the second axis; the substrate-side driving section, by The substrate supporting member is driven to rotate to move the substrate in the scanning direction. For example, the substrate processing apparatus of claim 4 in which the photomask holding member holds the photomask having a flat photomask surface; the photomask-side driving section drives the photomask holding member in a straight line, Moving the photomask in the scanning direction; the substrate supporting member supports the substrate along a supporting surface with a second radius of curvature centered on the second axis; and the substrate-side driving section drives the substrate supporting member to rotate so that The substrate moves in the scanning direction. For example, the substrate processing apparatus of claim 4 in which the mask holding member holds the mask having a mask surface with a first curvature radius centered on the first axis; the mask-side driving section, The photomask holding member is rotated to drive the photomask in the scanning direction; the substrate supporting member has a pair of support rollers that support both sides of the substrate in the scanning direction to be rotatable so that the substrate has a flat surface. ; The substrate-side driving section drives the pair of support rollers to rotate the substrate in the scanning direction by rotating.