HK1245421B - Device manufacturing system, and pattern formation apparatus - Google Patents

Abstract

　The purpose of the present invention is to suitably perform exposure using an exposure unit by further reducing vibration imparted to the exposure unit. A substrate processing apparatus (U3) is provided with: a shock-absorbing table (131) provided on a placement surface (E); an exposure unit (121), provided on the shock-absorbing table (131), for performing an exposure process on a supplied substrate (P); and a position adjustment unit (120) and a drive unit (122) provided on the placement surface (E) and provided, as processing units for performing a process on the exposure unit (121), in an independent state out of contact with the exposure unit (121).

Description

Device manufacturing system and pattern forming device

This application is a divisional application of the invention patent application with PCT international application number PCT/JP2014/066885, application date June 25, 2014, national application number 201480049332.7, and invention name "Substrate processing device, device manufacturing system, device manufacturing method and pattern forming device".

Technical Field

The present invention relates to a substrate processing device, a device manufacturing system, a device manufacturing method and a pattern forming device for forming a pattern for an electronic device on a substrate.

Background Art

Conventionally, as shown in Japanese Patent Application Laid-Open No. 9-219353, as a substrate processing device, there is known an exposure device for exposing a device pattern on a substrate disposed on a movable stage that moves on a flat plate. The flat plate of the exposure device is supported on a base via a mounting component having a vibration reduction mechanism. The movable stage moves in the X direction on a movable guide disposed on the flat plate. The movable guide moves in the Y direction on the flat plate by two linear motors disposed on the base. The two linear motors are disposed on both sides of the base in the X direction, and move the movable guide in the Y direction in a non-contact manner. That is, each linear motor has a mover and a stator, the stator is fixed on the base, and on the other hand, the mover is respectively fixed on both sides of the movable guide in the X direction, and the mover and the stator are in a non-contact state. In the exposure device of Japanese Patent Application Laid-Open No. 9-219353, since the mover and the stator of the linear motor are in a non-contact state, the vibration generated by external disturbance is suppressed from being transmitted to the flat plate via the movable guide and the movable stage.

Summary of the invention

In the exposure device of the above-mentioned Japanese Patent Application Laid-Open No. 9-219353, the movable guide is moved on the flat plate in the Y direction by two linear motors, and similarly, the movement of the movable stage relative to the movable guide is also performed by the linear motor. In this case, the linear motor also moves the movable stage in the X direction in a non-contact manner. However, since the movable stage is moved on the flat plate relative to the movable guide, the vibration generated by the movement of the movable stage may be transmitted to the flat plate.

In addition, the exposure device of the above-mentioned Japanese Patent Publication No. 9-219353 performs exposure by holding a substrate on a movable stage, but is not limited to this structure, and there is also a case where a film-like substrate is continuously supplied and a device pattern is scanned and exposed on the supplied substrate. In this case, the substrate may vibrate when the substrate is supplied.

The solution of the present invention is developed in view of the above-mentioned problems, and its purpose is to provide a substrate processing device, a device manufacturing system, a device manufacturing method and a pattern forming device that can further reduce the vibration caused to the exposure unit and perform good exposure through the exposure unit.

The first scheme of the present invention is a substrate processing device, comprising: a vibration-damping table, which is arranged on a setting surface; an exposure unit, which is arranged on the above-mentioned vibration-damping table and performs exposure processing on a supplied substrate; and a processing unit, which is arranged on the above-mentioned setting surface and is arranged in a non-contact independent state with the above-mentioned exposure unit, and processes the above-mentioned exposure unit.

The first scheme of the present invention is the above-mentioned substrate processing device, and it can also be that the above-mentioned processing unit includes a position adjustment unit for adjusting the position in the width direction of the above-mentioned substrate supplied to the above-mentioned exposure unit, and the above-mentioned position adjustment unit has: a base, which is arranged on the above-mentioned setting surface; a width-direction moving mechanism, which is arranged on the above-mentioned base and moves the above-mentioned substrate relative to the above-mentioned base in the width direction of the above-mentioned substrate; and a fixed roller, which is arranged on the above-mentioned base and guides the above-mentioned substrate after the position is adjusted by the above-mentioned width-direction moving mechanism toward the above-mentioned exposure unit, and the position of the fixed roller relative to the above-mentioned base is fixed.

The first scheme of the present invention is the above-mentioned substrate processing device, and it may also be that it further comprises: a first substrate detection unit, which is fixedly arranged on the above-mentioned base, and detects the position of the above-mentioned substrate supplied to the above-mentioned fixed roller in the width direction; and a control unit, which controls the above-mentioned width direction moving mechanism based on the detection result of the above-mentioned first substrate detection unit, thereby correcting the position of the above-mentioned substrate supplied to the above-mentioned fixed roller in the width direction to the first target position.

The first scheme of the present invention is the above-mentioned substrate processing device, and it can also be that the above-mentioned position adjustment unit also has a roller position adjustment mechanism for adjusting the position of the above-mentioned fixed roller relative to the above-mentioned exposure unit, and the above-mentioned substrate processing device also has: a second substrate detection unit, which is fixedly arranged on the above-mentioned vibration reduction table to detect the position of the above-mentioned substrate supplied to the above-mentioned exposure unit; and a control unit, which controls the above-mentioned roller position adjustment mechanism based on the detection result of the above-mentioned second substrate detection unit, thereby correcting the position of the above-mentioned substrate supplied to the above-mentioned exposure unit to the second target position.

The first scheme of the present invention is the above-mentioned substrate processing device, and it can also be that it also has: a pushing mechanism, which pushes the above-mentioned substrate supplied from the above-mentioned position adjustment unit to the above-mentioned exposure unit in a manner of imparting tension; a second substrate detection unit, which is fixedly arranged on the above-mentioned vibration reduction table, and detects the position of the above-mentioned substrate supplied to the above-mentioned exposure unit; and a control unit, which controls the above-mentioned pushing mechanism based on the detection result of the above-mentioned second substrate detection unit, thereby adjusting the pushing amount of the above-mentioned substrate.

The first scheme of the present invention is the above-mentioned substrate processing device, and it can also be that the above-mentioned processing unit includes a driving unit for driving the above-mentioned exposure unit, and the above-mentioned exposure unit has: a mask holding component for holding a mask illuminated by the illumination light; and a substrate supporting component for supporting the above-mentioned substrate projected with the projection light from the above-mentioned mask, and the above-mentioned driving unit has: a mask side driving part for driving the above-mentioned mask holding component in order to move the above-mentioned mask along the scanning direction; and a substrate side driving part for driving the above-mentioned substrate supporting component in order to move the above-mentioned substrate along the scanning direction.

The first scheme of the present invention is the above-mentioned substrate processing device, and it can also be that the above-mentioned exposure unit has: a first frame supporting the above-mentioned mask holding component; and a second frame supporting the above-mentioned substrate supporting component, and the above-mentioned vibration-damping table includes a first vibration-damping table arranged between the above-mentioned setting surface and the above-mentioned first frame, and a second vibration-damping table arranged between the above-mentioned setting surface and the above-mentioned second frame.

A first aspect of the present invention is the substrate processing apparatus, wherein the exposure unit includes a frame that supports the mask holding member and the substrate supporting member, and the vibration-damping table is provided between the installation surface and the frame.

The first scheme of the present invention is the above-mentioned substrate processing device, and it can also be that the above-mentioned mask holding component holds the above-mentioned mask having a mask surface with a first axis as the center and a first curvature radius, the above-mentioned mask side driving unit moves the above-mentioned mask along the scanning direction by rotating the above-mentioned mask holding component, the above-mentioned substrate supporting component supports the above-mentioned substrate along a supporting surface with a second axis as the center and a second curvature radius, and the above-mentioned substrate side driving unit moves the above-mentioned substrate along the scanning direction by rotating the above-mentioned substrate supporting component.

The first scheme of the present invention is the above-mentioned substrate processing device, and it can also be that the above-mentioned mask holding component holds the above-mentioned mask having a planar mask surface, the above-mentioned mask side driving unit moves the above-mentioned mask along the scanning direction by linearly driving the above-mentioned mask holding component, the above-mentioned substrate supporting component supports the above-mentioned substrate along a supporting surface with a second axis as the center and a second curvature radius, and the above-mentioned substrate side driving unit moves the above-mentioned substrate along the scanning direction by rotationally driving the above-mentioned substrate supporting component.

The first scheme of the present invention is the above-mentioned substrate processing device, and it can also be that the above-mentioned mask holding component holds the above-mentioned mask having a mask surface with a first axis as the center and a first curvature radius, the above-mentioned mask side driving unit moves the above-mentioned mask along the scanning direction by rotating the above-mentioned mask holding component, the above-mentioned substrate supporting component has a pair of supporting rollers, which can rotatably support both sides of the above-mentioned substrate in the scanning direction in a manner that the above-mentioned substrate has a plane, and the above-mentioned substrate side driving unit moves the above-mentioned substrate along the scanning direction by rotating the above-mentioned pair of supporting rollers.

The second scheme of the present invention is a device manufacturing system, comprising: a substrate processing device of the first scheme of the present invention; a substrate supply device for supplying the above-mentioned substrate to the above-mentioned substrate processing device; and a substrate recovery device for recovering the above-mentioned substrate after being processed by the above-mentioned substrate processing device.

The second scheme of the present invention is the above-mentioned device manufacturing system, and it can also be that the above-mentioned substrate supply device has: a first bearing portion, which rotatably supports the supply roll, wherein the supply roll is obtained by winding the above-mentioned substrate into a roll; a first lifting mechanism, which lifts and lowers the above-mentioned first bearing portion; an entry angle detection portion, which detects the entry angle of the above-mentioned substrate sent out from the above-mentioned supply roll relative to the first roller to wind the above-mentioned substrate; and a control portion, which controls the above-mentioned first lifting mechanism based on the detection result of the above-mentioned entry angle detection portion, thereby correcting the above-mentioned entry angle to the target entry angle.

The second scheme of the present invention is the above-mentioned device manufacturing system, and it can also be that the above-mentioned substrate recovery device has: a second bearing portion, which rotatably supports the recovery roll, wherein the recovery roll winds up the above-mentioned substrate processed by the above-mentioned substrate processing device; a second lifting mechanism, which lifts and lowers the above-mentioned second bearing portion; a discharge angle detection portion, which detects the discharge angle of the above-mentioned substrate sent to the above-mentioned recovery roll relative to the second roller to wind up the above-mentioned substrate; and a control portion, which controls the above-mentioned second lifting mechanism based on the detection result of the above-mentioned discharge angle detection portion, thereby correcting the above-mentioned discharge angle to the target discharge angle.

A third aspect of the present invention is a device manufacturing method, comprising: performing exposure processing on the substrate using the substrate processing apparatus of the first aspect of the present invention; and forming a pattern of the mask by processing the substrate after the exposure processing.

The fourth scheme of the present invention is a pattern forming device, which forms a pattern at a specified position on a sheet substrate while conveying a long flexible sheet substrate in the long-side direction, and comprises: a patterning device, which has a conveying section including a plurality of guide rollers for conveying the sheet substrate in the long-side direction along a specified conveying path, and a pattern forming section which is provided at a part of the conveying path and forms the pattern at the specified position on the surface of the sheet substrate; a vibration reduction device, which is provided between a base surface on which the patterning device is provided and the patterning device; a position adjustment device, which It is independently arranged from the patterning device and is arranged on the base surface, including a guide roller for sending the sheet substrate toward the conveying portion of the patterning device and adjusting the position of the sheet substrate in a width direction orthogonal to the long side direction of the sheet substrate; a substrate error measuring portion, which is on the upstream side relative to the pattern forming portion in the conveying path, and measures change information related to the position change, posture change, or deformation of the sheet substrate in the width direction of the sheet substrate; and a control device, which controls the position adjustment device based on the change information.

A fourth aspect of the present invention is the pattern forming apparatus, wherein the substrate error measuring section may measure the change information by detecting an edge in a width direction of the sheet substrate or a mark formed on the sheet substrate.

A fourth aspect of the present invention is the pattern forming apparatus, wherein the substrate error measuring section may be provided on at least one of the patterning apparatus and the position adjusting apparatus.

The fourth scheme of the present invention is a pattern forming device, which forms a pattern at a specified position on a long flexible sheet substrate while conveying it along the long side direction, and comprises: a patterning device, which has a conveying section including a plurality of guide rollers for conveying the sheet substrate along a specified conveying path in the long side direction, and a pattern forming section which is provided on a part of the conveying path and forms the pattern at the specified position on the surface of the sheet substrate; a vibration damping device, which is provided between a base surface on which the patterning device is provided and the patterning device; a position adjustment device, which is provided independently of the patterning device and is provided on the base surface, and includes guide rollers for conveying the sheet substrate toward the conveying section of the patterning device and adjusting the position of the sheet substrate in a width direction orthogonal to the long side direction of the sheet substrate; a position error measuring section, which measures change information related to the relative position change of the patterning device and the position adjustment device; and a control device, which controls the position adjustment device based on the change information.

The fourth scheme of the present invention is the above-mentioned pattern forming device, and may also be a device having a tiltable adjustment roller, which is arranged in the above-mentioned patterning device and is located on the upstream side relative to the above-mentioned pattern forming portion in the above-mentioned conveying path, and is configured to bend the above-mentioned conveying path of the above-mentioned sheet substrate under a state in which a prescribed tension is applied in the above-mentioned long side direction. The above-mentioned control device adjusts the position in the width direction of the sheet substrate conveyed to the pattern forming portion by tilting the above-mentioned adjustment roller based on the above-mentioned change information.

The fifth scheme of the present invention is a device manufacturing system, which transports a long flexible sheet substrate along the long side direction while performing a first treatment and a second treatment on the sheet substrate in sequence, and comprises: a first treatment unit, which is arranged on a specified base surface, includes a plurality of rollers for transporting the sheet substrate along a specified transport path in the long side direction, and performs the first treatment on the sheet substrate; a second treatment unit, which is arranged on the base surface, includes a plurality of rollers for transporting the sheet substrate transported from the first treatment unit along a specified transport path in the long side direction, and performs the second treatment on the sheet substrate; and a vibration-proof device. A device that suppresses or isolates the vibration transmission between the above-mentioned base surface and the above-mentioned first processing unit, or the vibration transmission between the above-mentioned base surface and the above-mentioned second processing unit, or the vibration transmission between the above-mentioned first processing unit and the above-mentioned second processing unit; a change measuring unit that measures change information related to the relative position change between the above-mentioned first processing unit and the above-mentioned second processing unit, or the position change of the above-mentioned sheet substrate conveyed from the above-mentioned first processing unit to the above-mentioned second processing unit; a position adjustment device that adjusts the position of the above-mentioned sheet substrate conveyed into the above-mentioned second processing unit in the width direction orthogonal to the long side direction based on the above-mentioned change information.

The fifth scheme of the present invention is the above-mentioned device manufacturing system, and it can also be that the above-mentioned second processing unit is a patterning device including one of an exposure device and a printing device, wherein the exposure device projects light energy corresponding to the above-mentioned pattern onto a photosensitive layer formed on the surface of the above-mentioned sheet substrate in order to form a pattern for electronic devices in the long side direction of the above-mentioned sheet substrate, and the printing device draws the above-mentioned pattern on the surface of the above-mentioned sheet substrate by applying ink containing one of conductive material, insulating material, and semiconductor material.

The fifth scheme of the present invention is the above-mentioned device manufacturing system, and it can also be that the above-mentioned first processing unit is composed of a single or multiple pre-processing devices that implement a processing equivalent to the pre-process of the processing implemented on the above-mentioned sheet substrate by the above-mentioned patterning device, and the above-mentioned position adjustment device is arranged in the above-mentioned pre-processing device arranged immediately before the above-mentioned patterning device on the conveying path of the above-mentioned sheet substrate, or between the above-mentioned immediately preceding pre-processing device and the above-mentioned patterning device.

The fifth scheme of the present invention is the above-mentioned device manufacturing system, and it can also be that the above-mentioned position adjustment device has: a plurality of rotating rollers that bend the above-mentioned sheet substrate in the long side direction and guide it for transportation; a driving mechanism that causes a part of the plurality of rotating rollers to move parallel to the direction of the rotation center axis; and a control unit that controls the above-mentioned driving mechanism based on the above-mentioned change information measured by the above-mentioned change measuring unit.

The fifth scheme of the present invention is the above-mentioned device manufacturing system, and it can also be that the above-mentioned position adjustment device has: a plurality of rotating rollers that bend the above-mentioned sheet substrate in the long side direction and guide it for transportation; a driving unit that tilts the rotation center axis of some of the plurality of rotating rollers; and a control unit that controls the above-mentioned driving unit based on the above-mentioned change information measured by the above-mentioned change measuring unit.

The fifth scheme of the present invention is the above-mentioned device manufacturing system, and it can also be that the above-mentioned change measuring unit includes a sensor, which is arranged on the conveying path of the above-mentioned sheet substrate between the above-mentioned first processing unit and the above-mentioned second processing unit, and detects the inclination change of the above-mentioned sheet substrate in the width direction orthogonal to the above-mentioned long side direction as the above-mentioned change information.

According to the aspects of the present invention, it is possible to provide a substrate processing apparatus, a device manufacturing system, a device manufacturing method, and a pattern forming apparatus that can further reduce vibration applied to an exposure unit and can perform good exposure by the exposure unit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing a configuration of a device manufacturing system according to a first embodiment.

FIG. 2 is a diagram showing a simplified configuration of the device manufacturing system according to the first embodiment.

FIG. 3 is a diagram showing a partial configuration of the exposure apparatus (substrate processing apparatus) according to the first embodiment.

FIG. 4 is a diagram showing a partial configuration of the exposure apparatus according to the first embodiment shown in FIG. 3 .

FIG. 5 is a diagram showing the overall structure of the exposure unit according to the first embodiment.

FIG. 6 is a diagram showing the arrangement of the illumination area and the projection area of the exposure unit shown in FIG. 5 .

FIG. 7 is a diagram showing a configuration of a projection optical system of the exposure unit shown in FIG. 5 .

FIG. 8 is a flowchart showing the device manufacturing method according to the first embodiment.

FIG. 9 is a diagram showing a partial configuration of an exposure apparatus (substrate processing apparatus) according to a second embodiment.

FIG. 10 is a diagram showing the overall structure of the exposure unit of the second embodiment of FIG. 9 .

FIG. 11 is a diagram showing the overall structure of an exposure unit according to a third embodiment.

FIG. 12 is a diagram showing the structure of an exposure apparatus according to a fourth embodiment.

FIG. 13 is a diagram showing a substrate being transported in the exposure apparatus shown in FIG. 12 as viewed from the +Z direction side.

FIG. 14 is a diagram when the substrate P conveyed between the last roller on the position adjustment unit side and the first roller on the exposure unit side shown in FIG. 13 is viewed from the −Y direction side.

FIG. 15 is a diagram showing a substrate conveyed by the rotating drum shown in FIG. 12 as viewed from the −X direction side.

FIG. 16 is a diagram showing the structure of the substrate adjustment unit shown in FIG. 12 .

17A is a diagram showing the structure of the second substrate detection unit shown in FIG. 12 , FIG. 17B is a diagram showing the light beam irradiated onto the substrate by the second substrate detection unit, and FIG. 17C is a diagram showing the light beam received by the second substrate detection unit.

FIG. 18 is a diagram showing a configuration of a relative position detection unit shown in FIG. 12 .

FIG. 19 is a diagram showing a scanning line of a spot light scanned on a substrate by the exposure head shown in FIG. 12 and an alignment microscope.

FIG. 20 is a diagram showing a configuration of a drawing unit of the exposure head shown in FIG. 12 .

DETAILED DESCRIPTION

Hereinafter, preferred embodiments are listed, and the substrate processing device, device manufacturing system, device manufacturing method and pattern forming device of the scheme of the present invention are described in detail with reference to the accompanying drawings. In addition, the scheme of the present invention is not limited to these embodiments, and also includes schemes in which various changes or improvements are applied. That is to say, among the structural elements described below, substantially the same structural elements that can be easily thought of by those skilled in the art are included, and the structural elements described below can be appropriately combined. In addition, various structural elements can be omitted, replaced or changed within the scope of the gist of the present invention.

[First embodiment]

The substrate processing apparatus of the first embodiment is an exposure apparatus that performs exposure processing on a substrate, and is incorporated into a device manufacturing system that performs various processing on the exposed substrate to manufacture electronic devices. First, the device manufacturing system will be described.

＜Device manufacturing system＞

FIG. 1 is a diagram showing the structure of a device manufacturing system 1 according to the first embodiment. The device manufacturing system 1 shown in FIG. 1 is a production line (flexible display production line) for manufacturing a flexible display as an electronic device (also referred to as a device). As a flexible display, there is, for example, an organic EL display. The device manufacturing system 1 is a so-called roll-to-roll method, that is, a flexible substrate (sheet substrate) P is wound into a roll to obtain a supply roll FR1, the substrate P is sent out from the supply roll FR1, and after various treatments are continuously applied to the sent substrate P, the processed substrate P is rolled up with a recovery roll FR2. In the device manufacturing system 1 according to the first embodiment, an example is shown in which a substrate P as a film sheet is sent out from the supply roll FR1, and the substrate P sent out from the supply roll FR1 passes through n processing devices U1, U2, U3, U4, U5, ... Un in sequence until it is rolled up on the recovery roll FR2. First, the substrate P that is the processing object of the device manufacturing system 1 is described.

The substrate P uses, for example, a resin film, a foil made of a metal or alloy such as stainless steel, etc. As the material of the resin film, one or more resins including, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl alcohol copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin can be used. In addition, regarding the thickness and rigidity (Young's modulus) of the substrate P, as long as creases and/or irreversible wrinkles caused by buckling are not generated on the substrate P during transportation, such a range is sufficient. As electronic devices, in the case of manufacturing flexible display panels, touch panels, color filters, electromagnetic wave protection filters, etc., resin sheets such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) with a thickness of about 25μm to 200μm are used.

For the substrate P, it is desirable to select a material whose expansion coefficient is not significantly large, so that the deformation caused by the heat in the various treatments applied to the substrate P can be substantially ignored. In addition, if inorganic fillers such as titanium oxide, lead oxide, aluminum oxide, silicon oxide, etc. are mixed in the resin film serving as the base, the thermal expansion coefficient can also be reduced. In addition, the substrate P can be a single layer of extremely thin glass with a thickness of about 100 μm manufactured by a float method, etc., or it can be a laminated body formed by pasting the above-mentioned resin film or a metal layer (foil) such as aluminum or copper on the extremely thin glass.

In addition, the flexibility of the substrate P refers to the property of being able to bend the substrate P without shearing or breaking even if a force of the degree of its own weight is applied to the substrate P. In addition, the property of bending due to a force of the degree of its own weight is also included in flexibility. In addition, the degree of flexibility will vary depending on the material, size, thickness, layer structure formed on the substrate P, environment including temperature and humidity, etc. of the substrate P. In short, as long as the substrate P can be smoothly conveyed without being buckled, creased, or damaged (destroyed or broken) when it is correctly wound on various conveying rollers, rotating drums and other conveying direction conversion components provided on the conveying path within the device manufacturing system 1 of this embodiment, it can be said to be within the range of flexibility.

The substrate P thus constructed becomes a supply reel FR1 by being wound into a roll, and the supply reel FR1 is installed on the device manufacturing system 1. The device manufacturing system 1 equipped with the supply reel FR1 repeatedly performs various processes for manufacturing electronic devices on the substrate P sent out from the supply reel FR1. Therefore, the processed substrate P becomes a state in which a plurality of electronic devices are connected. In other words, the substrate P sent out from the supply reel FR1 becomes a substrate for platemaking. In addition, the substrate P can be preliminarily surface-modified and activated by a predetermined pretreatment, or a fine partition structure (concave-convex structure) for precision patterning can be formed on the surface.

The processed substrate P is recovered as a recycling roll FR2 by being wound into a roll. The recycling roll FR2 is installed on a cutting device not shown in the figure. The cutting device equipped with the recycling roll FR2 divides (cuts) the processed substrate P according to each electronic component, thereby becoming a plurality of electronic components. Regarding the size of the substrate P, for example, the size in the width direction (the direction of the short side) is about 10 cm to 2 m, and the size in the length direction (the direction of the long side) is more than 10 m. In addition, the size of the substrate P is not limited to the above-mentioned size.

The device manufacturing system 1 is described below with reference to FIG1 . FIG1 shows an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction is the conveying direction of the substrate P in the horizontal plane, and is the direction connecting the supply roll FR1 and the recovery roll FR2. The Y direction is the direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Y direction is the axial direction of the supply roll FR1 and the recovery roll FR2. The Z direction is the direction orthogonal to the X direction and the Y direction (vertical direction).

The device manufacturing system 1 includes: a substrate supply device 2 for supplying a substrate P; processing devices U1 to Un for performing various processes on the substrate P supplied by the substrate supply device 2; a substrate recovery device 4 for recovering the substrate P processed by the processing devices U1 to Un; and an upper control device (control unit) 5 for controlling each device of the device manufacturing system 1.

A supply roll FR1 is rotatably mounted on the substrate supply device 2. The substrate supply device 2 comprises: a driving roller R1 that delivers the substrate P from the mounted supply roll FR1; and an edge position controller EPC1 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller R1 rotates while clamping the front and back surfaces of the substrate P, and delivers the substrate P in the conveying direction (+X direction) from the supply roll FR1 toward the recovery roll FR2, thereby supplying the substrate P to the processing devices U1 to Un. At this time, the edge position controller EPC1 moves the substrate P in the width direction so that the position of the edge of the end portion of the substrate P in the width direction is converged to a range of about ± a dozen μm to several tens of μm relative to the target position, thereby correcting the position of the substrate P in the width direction.

A recovery roll FR2 is rotatably mounted on the substrate recovery device 4. The substrate recovery device 4 comprises: a driving roller R2 for pulling the processed substrate P toward the recovery roll FR2; and an edge position controller EPC2 for adjusting the position of the substrate P in the width direction (Y direction). The substrate recovery device 4 pulls the substrate P in the conveying direction by rotating the driving roller R2 while clamping the front and back surfaces of the substrate P, and rotates the recovery roll FR2, thereby rolling up the substrate P. At this time, the edge position controller EPC2 is constructed in the same manner as the edge position controller EPC1, and corrects the position of the substrate P in the width direction to avoid deviation of the end edge of the substrate P in the width direction in the width direction.

The processing device U1 is a coating device that applies a photosensitive functional liquid to the surface of the substrate P supplied from the substrate supply device 2. As the photosensitive functional liquid, for example, a photoresist, a photosensitive silane coupling agent, a UV curing resin liquid, a photosensitive electroplating reduction solution, etc. are used. The processing device U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 in order from the upstream side of the conveying direction of the substrate P. The coating mechanism Gp1 has a pressure roller DR1 for winding the substrate P, and a coating roller DR2 opposite to the pressure roller DR1. The coating mechanism Gp1 clamps the substrate P by the pressure roller DR1 and the coating roller DR2 while winding the supplied substrate P around the pressure roller DR1. In addition, the coating mechanism Gp1 rotates the pressure roller DR1 and the coating roller DR2, so that the substrate P is coated with the photosensitive functional liquid by the coating roller DR2 while moving in the conveying direction. The drying mechanism Gp2 blows drying air such as hot air or dry air to remove the solute (solvent or water) contained in the photosensitive functional liquid, thereby drying the substrate P coated with the photosensitive functional liquid, thereby forming a photosensitive functional layer on the substrate P.

The processing device U2 is a heating device that heats the substrate P conveyed from the processing device U1 to a specified temperature (for example, several tens of degrees Celsius to about 120 degrees Celsius) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P. The processing device U2 is provided with a heating chamber HA1 and a cooling chamber HA2 in order from the upstream side of the conveying direction of the substrate P. The heating chamber HA1 is provided with a plurality of rollers and a plurality of air turn bars inside thereof, and the plurality of rollers and the plurality of air turn bars constitute the conveying path of the substrate P. The plurality of rollers are arranged in a manner of rotationally contacting with the back side of the substrate P, and the plurality of air turn bars are arranged on the surface side of the substrate P in a non-contact state. The plurality of rollers and the plurality of air turn bars are configured as a serpentine conveying path in order to lengthen the conveying path of the substrate P. The substrate P passing through the heating chamber HA1 is heated to a specified temperature while being conveyed along the serpentine conveying path. The cooling chamber HA2 cools the substrate P to the ambient temperature in order to make the temperature of the substrate P heated in the heating chamber HA1 consistent with the ambient temperature of the subsequent process (processing device U3). The cooling chamber HA2 is provided with a plurality of rollers therein, and the plurality of rollers are configured as a serpentine conveying path in order to lengthen the conveying path of the substrate P, similarly to the heating chamber HA1. The substrate P passing through the cooling chamber HA2 is cooled while being conveyed along the serpentine conveying path. A driving roller R3 is provided on the downstream side in the conveying direction of the cooling chamber HA2, and the driving roller R3 rotates while clamping the substrate P after passing through the cooling chamber HA2, thereby supplying the substrate P toward the processing device U3.

The processing device (substrate processing device) U3 is an exposure device that projects a pattern of a circuit or wiring for a display panel onto a substrate P supplied from the processing device U2 and having a photosensitive functional layer formed on the surface. The details will be described later. The processing device U3 illuminates the transmission type mask M with an illumination light beam, and projects the projection light beam obtained by illuminating the mask M with the illumination light beam onto the substrate P wound on a part of the outer peripheral surface of the rotating drum (supporting drum) 25 for exposure. The processing device U3 has a driving roller R4 that transports the substrate P supplied from the processing device U2 to the downstream side in the conveying direction, and an edge position controller EPC3 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller R4 rotates while clamping the front and back surfaces of the substrate P, and sends the substrate P to the downstream side in the conveying direction, thereby supplying the substrate P toward the exposure position. The edge position controller EPC3 is configured in the same manner as the edge position controller EPC1, and corrects the position of the substrate P in the width direction in such a way that the width direction of the substrate P at the exposure position becomes the target position. In addition, the processing device U3 has two sets of driving rollers R5 and R6, which convey the substrate P to the downstream side in the conveying direction while giving a slack DL to the exposed substrate P. The two sets of driving rollers R5 and R6 are arranged at a predetermined interval in the conveying direction of the substrate P. The driving roller R5 rotates while clamping the upstream side of the conveyed substrate P, and the driving roller R6 rotates while clamping the downstream side of the conveyed substrate P, thereby supplying the substrate P toward the processing device U4. At this time, since the substrate P is given a slack DL, it can absorb the change in conveying speed generated on the downstream side of the conveying direction compared with the driving roller R6, thereby preventing the influence of the change in conveying speed on the exposure processing of the substrate P. In addition, in the processing device U3, there are provided alignment microscopes AM1 and AM2 for detecting alignment marks pre-formed on the substrate P in order to align the image of a part of the mask pattern of the mask M with the substrate P relative to each other.

The processing device U4 is a wet processing device that performs wet development processing, non-electrolytic plating processing, etc. on the exposed substrate P transported from the processing device U3. The processing device U4 has three processing tanks BT1, BT2, and BT3 layered in the vertical direction (Z direction) and a plurality of rollers for transporting the substrate P. The plurality of rollers are arranged in such a way that the substrate P passes through the inside of the three processing tanks BT1, BT2, and BT3. A driving roller R7 is provided on the downstream side of the processing tank BT3 in the transport direction, and the driving roller R7 rotates while clamping the substrate P after passing through the processing tank BT3, thereby supplying the substrate P toward the processing device U5.

Although not shown in the figure, the processing device U5 is a drying device that dries the substrate P transported from the processing device U4. The processing device U5 adjusts the moisture content attached to the substrate P after the wet processing in the processing device U4 to a predetermined moisture content. The substrate P dried by the processing device U5 is transported to the processing device Un via several processing devices. And, after being processed in the processing device Un, the substrate P is rolled up by the recovery roll FR2 of the substrate recovery device 4.

The upper control device 5 performs overall control over the substrate supply device 2, the substrate recovery device 4, and the plurality of processing devices U1 to Un. The upper control device 5 controls the substrate supply device 2 and the substrate recovery device 4 to transport the substrate P from the substrate supply device 2 to the substrate recovery device 4. In addition, the upper control device 5 controls the plurality of processing devices U1 to Un in synchronization with the transport of the substrate P to perform various processes on the substrate P. The upper control device 5 includes a computer and a storage medium storing a program, and the computer functions as the upper control device 5 of the first embodiment by executing the program stored in the storage medium.

In addition, in the device manufacturing system 1 of the first embodiment, an example is shown in which the substrate P sent from the supply roll FR1 passes through n processing devices U1 to Un in sequence until it is rolled up on the recovery roll FR2, but it is not limited to this structure. For example, the device manufacturing system 1 may also be a structure in which the substrate P sent from the supply roll FR1 passes through one processing device and is rolled up on the recovery roll FR2. At this time, when the substrate P is subjected to different processing, the substrate supply device 2 and the substrate recovery device 4 are used to supply the substrate P to different processing devices again.

＜Simplified device manufacturing system＞

Next, in order to easily understand the characteristic part of the present invention, the device manufacturing system 1 after simplifying the device manufacturing system 1 of Figure 1 is described with reference to Figure 2. Figure 2 is a diagram showing the structure of the device manufacturing system 1 of the first embodiment when it is simplified. As shown in Figure 2, the simplified device manufacturing system 1 has a substrate supply device 2, a processing device U3 as an exposure device (hereinafter referred to as an exposure device), a substrate recovery device 4, and an upper control device 5. In addition, in Figure 2, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal is the same orthogonal coordinate system as Figure 1. In addition, in the simplified device manufacturing system 1, the substrate supply device 2 is a structure in which the edge position controller EPC1 is omitted. The reason is that the edge position controller EPC3 is provided in the exposure device U3. First, the substrate supply device 2 is described with reference to Figure 2.

＜Substrate supply device＞

The substrate supply device 2 has a first bearing portion 111 on which the supply roll FR1 is mounted, and a first lifting mechanism 112 for lifting and lowering the first bearing portion 111. In addition, the substrate supply device 2 has an entry angle detection portion 114, and the entry angle detection portion 114 is connected to the upper control device 5. Here, in the first embodiment, the upper control device 5 functions as a control device (control portion) of the substrate supply device 2. In addition, it can also be configured that, as the control device of the substrate supply device 2, a lower control device for controlling the substrate supply device 2 is provided, and the substrate supply device 2 is controlled by the lower control device.

The first bearing 111 is rotatably supported by the supply roll FR1. When the supply roll FR1 supported by the first bearing 111 supplies (delivers) the substrate P toward the exposure device U3, the roll diameter of the supply roll FR1 gradually decreases in accordance with the delivery amount of the substrate P. Therefore, the position where the substrate P is delivered from the supply roll FR1 changes according to the delivery amount of the substrate P delivered.

The first lifting mechanism 112 is provided between the installation surface E and the first bearing portion 111. The first lifting mechanism 112 moves the first bearing portion 111 along the Z direction (vertical direction) together with the supply roll FR1. The first lifting mechanism 112 is connected to the upper control device 5, and the upper control device 5 moves the first bearing portion 111 along the Z direction through the first lifting mechanism 112, thereby enabling the position where the substrate P is delivered from the supply roll FR1 to become a predetermined position.

The entry angle detection unit 114 detects the entry angle θ1 of the substrate P entering the conveying roller 127 of the exposure device U3 described later. The entry angle detection unit 114 is provided around the conveying roller 127. Here, the entry angle θ1 is the angle between a straight line (parallel to the Z axis) extending in the vertical direction passing through the center axis of the conveying roller 127 in the XZ plane and the substrate P on the upstream side of the conveying roller 127. The entry angle detection unit 114 outputs the detection result to the connected upper control device 5.

The upper control device 5 controls the first lifting mechanism 112 based on the detection result of the entry angle detection unit 114. Specifically, the upper control device 5 controls the first lifting mechanism 112 in such a way that the entry angle θ1 becomes a predetermined target entry angle. That is, if the amount of substrate P fed from the supply roll FR1 increases, the roll diameter of the supply roll FR1 becomes smaller, thereby increasing the entry angle θ1 relative to the target entry angle. Therefore, the upper control device 5 moves the first lifting mechanism 112 to the lower side of the Z direction (descends), thereby reducing the entry angle θ1, and correcting the entry angle θ1 to the target entry angle. In this way, the upper control device 5 performs feedback control on the first lifting mechanism 112 based on the detection result of the entry angle detection unit 114 so that the entry angle θ1 becomes the target entry angle. Therefore, since the substrate supply device 2 can always supply the substrate P at the target entry angle relative to the conveying roller 127, the influence of the change in the entry angle θ1 on the substrate P can be reduced. In addition, as feedback control, any control such as P control, PI control, and PID control may be used.

＜Exposure equipment (substrate processing equipment)＞

Next, the exposure device U3 shown in FIG. 2 is described with reference to FIG. 3 . The exposure device U3 includes a position adjustment unit 120, an exposure unit 121, a drive unit 122 (refer to FIG. 3 ), a push mechanism 130, and a vibration reduction table (vibration-proof device) 131. The vibration reduction table 131 is provided on the installation surface E to reduce the transmission of vibration (so-called floor vibration) from the installation surface E to the main body of the exposure unit 121. The position adjustment unit 120 is provided on the installation surface E and is configured to include the above-mentioned edge position controller EPC3 shown in FIG. 1 . The position adjustment unit 120 is provided adjacent to the substrate supply device 2 in the X direction. The exposure unit 121 is provided on the vibration reduction table 131 and is provided on the opposite side of the substrate supply device 2 in the X direction across the position adjustment unit 120. The drive unit 122 (refer to FIG. 3 ) is provided on the installation surface E and is provided adjacent to the exposure unit 121 in the Y direction. That is, the position adjustment unit 120, the exposure unit 121, and the drive unit 122 are provided at different positions on the installation surface E. In addition, the exposure unit 121 is in a mechanically non-coupled state (non-contact independent state) with the position adjustment unit 120 and the driving unit 122 (see FIG. 3 ).

As can be seen from the above, the position adjustment unit 120 and the driving unit 122 are provided on the installation surface E, while the exposure unit 121 is provided on the installation surface E via the vibration reduction table 131. Therefore, the exposure unit 121 becomes a vibration mode different from that of the position adjustment unit 120 and the driving unit 122. In other words, the exposure unit 121 is provided in a state where the position adjustment unit 120 and the driving unit 122 are blocked from vibration transmission (a state where vibration is difficult to be transmitted to each other, that is, a state where vibration is effectively isolated).

In addition, the exposure device U3 has a first substrate detection unit 123 and a second substrate detection unit 124 for detecting the position of the substrate P. The first substrate detection unit 123 and the second substrate detection unit 124 are connected to the upper control device 5. In addition, in the exposure device U3, similarly to the substrate supply device 2, the upper control device 5 also functions as a control device (control unit) of the exposure device U3. In addition, it can also be configured so that as a control device of the exposure device U3, a lower control device for controlling the exposure device U3 is provided, and the exposure device U3 is controlled by the lower control device.

＜Position adjustment unit＞

As shown in FIG. 2 , the position adjustment unit 120 includes a base 125, the edge position controller EPC3 (width direction moving mechanism) and a fixed roller 126. The base 125 is provided on the installation surface E, and supports the edge position controller EPC3 and the fixed roller 126. The base 125 may also be a vibration reduction table having a vibration reduction function. A base position adjustment mechanism 128 is provided on the base 125 for adjusting the position of the base 125 in the Y direction or in the rotation direction around the Z axis. The base position adjustment mechanism 128 is connected to the upper control device 5, and the upper control device 5 can adjust the positions of the edge position controller EPC3 and the fixed roller 126 provided on the base 125 together by controlling the base position adjustment mechanism 128. That is, the base position adjustment mechanism 128 functions as a roller position adjustment mechanism for adjusting the position of the fixed roller 126 in the Y direction relative to the exposure unit 121.

The edge position controller EPC3 can move on the base 125 in the width direction (Y direction) of the substrate P. The edge position controller EPC3 has a plurality of rollers including a conveying roller 127 provided at the most upstream side of the conveying direction in which the substrate P is conveyed. The conveying roller 127 guides the substrate P supplied from the substrate supply device 2 to the inside of the position adjustment unit 120. The edge position controller EPC3 is connected to the upper control device 5 and is controlled by the upper control device 5 based on the detection result of the first substrate detection unit 123.

The fixed roller 126 guides the substrate P whose position is adjusted in the width direction by the edge position controller EPC3 toward the exposure unit 121. The fixed roller 126 is rotatable and its position relative to the base 125 is fixed. Therefore, by moving the substrate P in the width direction by the edge position controller EPC3, the position in the width direction of the substrate P entering the fixed roller 126 can be adjusted.

The first substrate detection unit 123 detects the position in the width direction of the substrate P conveyed from the edge position controller EPC3 to the fixed roller 126. The first substrate detection unit 123 is fixed to the base 125. Therefore, the first substrate detection unit 123 has the same vibration mode as the edge position controller EPC3 and the fixed roller 126. The first substrate detection unit 123 detects the position of the edge of the end of the substrate P that is in rotational contact with the fixed roller 126. The first substrate detection unit 123 outputs the detection result to the connected upper control device 5.

The second substrate detection unit 124 detects the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121. The second substrate detection unit 124 is fixed on the vibration reduction table 131 on which the exposure unit 121 is installed. Therefore, the second substrate detection unit 124 becomes the same vibration mode as the exposure unit 121. The second substrate detection unit 124 is provided on the introduction side of the introduction substrate P of the exposure unit 121. Specifically, the second substrate detection unit 124 is provided at a position on the upstream side of the guide roller 28 provided on the most upstream side in the conveying direction of the exposure unit 121, adjacent to the guide roller 28. The second substrate detection unit 124 detects the position of the substrate P supplied to the exposure unit 121 in the width direction (Y direction) and the vertical direction (Z direction). The second substrate detection unit 124 outputs the detection result to the connected upper control device 5.

The upper control device 5 controls the edge position controller EPC3 based on the detection result of the first substrate detection unit 123. Specifically, the upper control device 5 calculates the difference between the center position in the Y direction obtained based on the position of the edges (two edges in the Y direction) of the two ends of the substrate P that are in rotational contact with the fixed roller 126 (entering the fixed roller 126) detected by the first substrate detection unit 123, and the predetermined first target position (target center position). Then, the upper control device 5 performs feedback control on the edge position controller EPC3 in such a way that the difference becomes zero, so that the substrate P moves in the width direction and the center position of the substrate P in the width direction relative to the fixed roller 126 is corrected to the first target center position. Therefore, since the edge position controller EPC3 can maintain the position of the substrate P in the width direction relative to the fixed roller 126 at the first target position, the position deviation of the substrate P in the width direction relative to the fixed roller 126 can be reduced. In addition, in this case, the feedback control may be any control such as P control, PI control, PID control, etc.

In addition, the upper control device 5 controls the base position adjustment mechanism 128 based on the detection result of the second substrate detection unit 124. Specifically, the upper control device 5 calculates the difference between the center position obtained based on the positions of the two ends of the substrate P in the width direction detected by the second substrate detection unit 124 and the predetermined second target center position. Then, the upper control device 5 performs feedback control on the base position adjustment mechanism 128 in such a way that the difference becomes zero, and adjusts the position of the base 125 through the base position adjustment mechanism 128, thereby adjusting the position of the fixed roller 126 relative to the guide roller 28 in the Y direction. At this time, the upper control device 5 adjusts the position of the fixed roller 126 in such a way as to avoid distortion and positional displacement in the width direction on the substrate P. For example, the upper control device 5 adjusts the position in such a way that the axial direction of the fixed roller 126 is parallel to the axial direction of the guide roller 28. Furthermore, the upper control device 5 adjusts the position of the fixed roller 126 along the Y direction or the rotation direction around the Z axis through the base position adjustment mechanism 128, thereby maintaining the center position in the width direction of the substrate P supplied to the exposure unit 121 at the second target center position, thereby reducing the distortion and positional deviation in the width direction of the substrate P. In addition, in this case, the feedback control may be any control such as P control, PI control, PID control, etc.

In this way, the position adjustment unit 120 can correct the position in the width direction of the substrate P supplied to the fixed roller 126 to the first target position, and can correct the position of the substrate P supplied to the guide roller 28 of the exposure unit 121 to the second target position.

In addition, in the first embodiment, the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 is corrected, but the present invention is not limited to this structure. For example, the position of the substrate P supplied from the substrate supply device 2 to the position adjustment unit 120 may be corrected. In this case, a roll position adjustment mechanism for adjusting the position of the supply roll FR1 may be provided while a substrate detection unit is provided on the upstream side in the conveying direction of the conveying roller 127. And, the upper control device 5 controls the roll position adjustment mechanism based on the detection result of the substrate detection unit, thereby adjusting the supply roll FR1. Similarly, the position of the substrate P supplied from the exposure unit 121 to the substrate recovery device 4 may be corrected.

＜Exposure unit＞

Next, the structure of the exposure unit 121 of the exposure device U3 of the first embodiment is described with reference to FIGS. 2 to 7. FIG. 3 is a diagram showing a partial structure of the exposure device (substrate processing device) U3 of the first embodiment, and FIG. 4 is a diagram showing the structure of the drive unit of the substrate support mechanism 12 in FIG. 3. FIG. 5 is a diagram showing the overall structure of the exposure unit 121 of the first embodiment. FIG. 6 is a diagram showing the arrangement of the illumination area IR and the projection area PA of the exposure unit 121 shown in FIG. 5. FIG. 7 is a diagram showing the structure of the projection optical system PL of the exposure unit 121 shown in FIG. 5.

The exposure unit 121 shown in FIGS. 2 to 5 is a so-called scanning exposure device, which projects and exposes the image of the mask pattern formed on the planar mask M onto the surface of the substrate P while conveying the substrate P in the conveying direction (scanning direction) by a plurality of guide rollers 28 constituting the substrate support mechanism (substrate conveying mechanism) 12 and a rotatable cylindrical rotating drum 25. In addition, FIGS. 3 and 4 are views of the exposure unit 121 viewed from the -X side, and FIGS. 5 and 7 are orthogonal coordinate systems in which the X direction, the Y direction, and the Z direction are orthogonal, which are the same orthogonal coordinate systems as FIG. 1 .

First, the mask M used in the exposure unit 121 is described. The mask M is made of, for example, a transmissive flat mask in which a mask pattern is formed with a light shielding layer such as chrome on one surface (mask surface P1) of a glass plate with good flatness, and is used while being held on a mask stage 21 described later. The mask M has a pattern non-formation region where no mask pattern is formed, and is mounted on the mask stage 21 at the pattern non-formation region. The mask M can be released relative to the mask stage 21.

In addition, the mask M may be formed with the whole or part of the panel pattern corresponding to one display device, or may be a patchwork formed with panel patterns corresponding to multiple display devices. In addition, on the mask M, multiple panel patterns may be repeatedly formed along the scanning direction (X direction) of the mask M, or multiple small panel patterns may be repeatedly formed along the direction orthogonal to the scanning direction (Y direction). Moreover, the mask M may also be formed with a panel pattern for a first display device and a panel pattern for a second display device having a different size from the first display device.

As shown in Fig. 3 and Fig. 5, the exposure unit 121 disposed on the vibration reduction table 131 has, in addition to the alignment microscopes AM1 and AM2 described above, a device frame 132, a mask holding mechanism 11 supporting the mask stage 21, a substrate supporting mechanism 12, a projection optical system PL, and a lower-level control device (control unit) 16. The exposure unit 121 receives irradiation from the illumination beam EL1 from the illumination mechanism 13, projects the transmitted light (imaging beam) generated from the mask pattern of the mask M held by the mask holding mechanism 11 onto the substrate P on the rotating drum 25 supported by the substrate supporting mechanism 12, and forms a projection image of a portion of the mask pattern onto the surface of the substrate P.

The lower-level control device 16 controls each part of the exposure device U3 so that each part performs processing. The lower-level control device 16 may be a part or all of the upper-level control device 5 of the device manufacturing system 1. In addition, the lower-level control device 16 may be a device that is controlled by the upper-level control device 5 and is different from the upper-level control device 5. The lower-level control device 16 includes, for example, a computer.

The vibration-damping table 131 is provided on the installation surface E and supports the device frame 132. Specifically, as shown in Fig. 3, the vibration-damping table 131 includes a first vibration-damping table 131a provided outside in the Y direction and a second vibration-damping table 131b provided inside the first vibration-damping table 131a.

The device frame 132 is provided on the first vibration-damping platform 131a and the second vibration-damping platform 131b, and supports the mask holding mechanism 11, the substrate supporting mechanism 12, the lighting mechanism 13, and the projection optical system PL. The device frame 132 includes a first frame 132a that supports the mask holding mechanism 11, the lighting mechanism 13, and the projection optical system PL, and a second frame 132b that supports the substrate supporting mechanism 12. The first frame 132a and the second frame 132b are provided independently, and the first frame 132a is arranged to cover the second frame 132b. The first frame 132a is provided on the first vibration-damping platform 131a, and the second frame 132b is provided on the second vibration-damping platform 131b.

The first frame 132a is composed of a first lower frame 135 provided on the first vibration-damping platform 131a, a first upper frame 136 provided above the first lower frame 135 in the Z direction, and an arm 137 provided upright on the first upper frame 136. The first lower frame 135 has a leg 135a provided upright on the first vibration-damping platform 131a, and an upper surface 135b supported by the leg 135a, and the projection optical system PL is supported on the upper surface 135b via a holding member 143. The holding member 143 is kinematically supported by spacer members 145 such as metal balls provided at three locations on the upper surface 135b when viewed in the XY plane. The leg 135a is provided at a predetermined position so that the rotation axis AX2 of the rotating drum 25 described later is inserted in the Y direction.

The first upper frame 136 also has a leg portion 136a erected on the upper surface portion 135b and an upper surface portion 136b supported by the leg portion 136a, similarly to the first lower frame 135. The upper surface portion 136b supports the mask holding mechanism 11 (mask carrier 21). The arm portion 137 is erected on the upper surface portion 136b to support the lighting mechanism 13 so that the lighting mechanism 13 is located above the mask holding mechanism 11.

The second frame 132b is composed of a lower surface portion 139 erected on the second vibration-damping platform 131b and a pair of bearing portions 140 erected on the lower surface portion 139 and spaced apart in the Y direction. The pair of bearing portions 140 are provided with air bearings 141 that axially support the rotation axis AX2 that is the rotation center of the rotating drum 25.

The mask holding mechanism 11 includes: a mask stage (mask holding member) 21 holding the mask M, a moving mechanism (linear guide, air bearing, etc.) (not shown) for moving the mask stage 21, and a transmission member 23 for transmitting power to the moving mechanism. The mask stage 21 is configured in a frame shape surrounding the pattern forming area of the mask M, and is moved along the X direction, which is the scanning direction, on the upper surface portion 136b of the first upper frame 136 by a mask side driving portion (a driving source such as a motor) 22 provided on the driving unit 122. The driving force transmitted from the transmission member 23 is provided for the linear drive of the mask stage 21 through the moving mechanism.

In the present embodiment, the mask stage 21 moves linearly in the X direction for scanning exposure, and therefore, the mask side drive unit (drive source) 22 includes a magnet track (stator) of a linear motor fixed on the support frame 146 in a manner extending in the X direction, and the transmission component 23 includes a coil unit (mover) of the linear motor opposite to the magnet track with a fixed gap. In addition, in FIG. 3, a displacement sensor SG1 is provided on the holding component 143 that supports the projection optical system PL on the side of the device frame 132, which measures the height change of the surface of the outer peripheral surface of the rotating drum 25 (or the surface of the substrate P) corresponding to the exposure position based on the projection optical system PL; and a displacement sensor SG2 is provided to measure the position change of the mask M in the Z direction from the lower side of the mask stage 21.

On the other hand, as shown in FIG. 2 and FIG. 3, the rotating drum 25 that winds and supports the substrate P in a roughly half-circumference range is rotated by the substrate-side driving section (driving source such as a rotating motor) 26 provided in the driving unit 122 shown in FIG. 3. At the same time, as shown in FIG. 5, the rotating drum 25 is formed into a cylindrical shape, and the cylindrical shape has an outer peripheral surface (circumferential surface) with a curvature radius of Rfa centered on the rotation axis AX2 extending along the Y direction. Here, the surface that includes the center line of the rotation axis AX2 and is parallel to the YZ plane is set as the center plane CL (refer to FIG. 5). A part of the circumferential surface of the rotating drum 25 becomes a supporting surface P2 that supports the substrate P with a specified tension. In other words, the rotating drum 25 winds the substrate P on its supporting surface P2 with a fixed tension, thereby being able to support the substrate P in a stable cylindrical curved surface shape.

Each air bearing 141 that axially supports the rotating shaft AX2 through the bearing parts 140 on both sides axially supports the rotating shaft AX2 rotatably in a non-contact state. In addition, in the present embodiment, the rotating shaft AX2 is supported by the air bearings 141 at both ends of the rotating drum 25, but it can also be a common bearing using a ball or needle roller processed with high precision. As shown in Figures 2 and 5, a plurality of guide rollers 28 are respectively arranged on the upstream side and the downstream side of the conveying direction of the substrate P across the rotating drum 25. For example, there are four guide rollers 28, two of which are arranged on the upstream side of the conveying direction, and two of which are arranged on the downstream side of the conveying direction.

Therefore, the substrate support mechanism 12 guides the substrate P conveyed from the position adjustment unit 120 toward the rotating drum 25 via the two guide rollers 28. The substrate support mechanism 12 rotates the rotating drum 25 via the rotating axis AX2 through the substrate side driving unit 26, thereby conveying the substrate P introduced into the rotating drum 25 toward the guide rollers 28 while being supported by the supporting surface P2 of the rotating drum 25. The substrate support mechanism 12 guides the substrate P conveyed to the guide rollers 28 toward the substrate recovery device 4.

Here, an example of the structure of the substrate-side driving unit 26 is described with reference to FIG. 4. In FIG. 4, a disc-shaped scale plate 25c having a radius substantially the same as the radius Rfa of the outer peripheral surface 25a of the rotating drum 25 is fixedly provided coaxially with the rotation axis AX2 on at least one end side of the rotating drum 25 on which the substrate P is wound. A diffraction grating is formed at a fixed interval in the circumferential direction on the outer peripheral surface of the scale plate 25c, and the rotation angle of the rotating drum 25 or the circumferential movement amount of the surface 25a of the rotating drum 25 is measured by optically detecting the diffraction grating by the encoder measurement head EH. The rotation angle information of the rotating drum 25 measured by the reading head EH is also used as a feedback signal for the servo control of the motor that rotates the rotating drum 25. In addition, in FIG. 4, the displacement sensor SG1 is configured to measure the displacement (radial displacement) of the height position of the surface of the substrate P, but it can also be configured to measure the displacement (radial displacement) of the height position of the surface of the region 25b on the end side of the rotating drum 25 that is not covered by the substrate P.

On the end side of the rotating shaft AX2 supported by the air bearing 141, there is provided a rotor RT in which magnet units Mur of a rotating motor generating torque around the rotating shaft AX2 are arranged in a ring shape, and a magnet unit MUs for a voice coil motor that applies axial thrust to the rotating shaft AX2. On the stator side of the support frame 146 fixed to FIG. 3, there are provided a coil unit CUr arranged in a manner opposite to the magnet unit Mur around the rotor RT, and a coil unit CUs wound in a manner surrounding the magnet unit MUs. With such a structure, the rotating drum 25 (and the scale plate 25c) integrated with the rotating shaft AX2 can be smoothly rotated by the torque applied to the rotor RT.

In addition, the voice coil motor (MUs, CUs) generates thrust in the direction of the rotation axis AX2 (Y direction) even during the rotation of the rotating drum 25, so that the rotating drum 25 (and the scale plate 25c) can be slightly moved in the Y direction. Thus, the slight positional deviation in the Y direction of the substrate P during scanning exposure can be corrected one by one.

In addition, in the configuration of Fig. 4, a displacement sensor DT1 for measuring the displacement of the end surface Tp of the rotation axis AX2 in the Y direction, or a displacement sensor DT2 for measuring the displacement of the end surface of the scale plate 25c in the Y direction is provided, and the position change in the Y direction of the rotating drum 25 during scanning exposure can be measured sequentially in real time. Therefore, by servo-controlling the voice coil motors (MUs, CUs) based on the measurement signals from these displacement sensors DT1 and DT2, the position of the rotating drum 25 in the Y direction can be positioned with high accuracy.

Here, as shown in FIG6 , the exposure device U3 of the first embodiment is assumed to be a so-called multi-lens exposure device. In addition, FIG6 shows a plan view of the illumination area IR (IR1 to IR6) on the mask M held on the mask stage 21 as viewed from the -Z side (the left figure of FIG6 ), and a plan view of the projection area PA (PA1 to PA6) on the substrate P supported by the rotating drum 25 as viewed from the +Z side (the right figure of FIG6 ). The reference symbol Xs in FIG6 represents the scanning direction (rotation direction) of the mask stage 21 and the rotating drum 25. The multi-lens exposure device U3 irradiates the illumination light beam EL1 to the multiple (for example, six in the first embodiment) illumination areas IR1 to IR6 on the mask M, respectively, and projects the multiple projection light beams EL2 obtained by illuminating the illumination light beams EL1 on the respective illumination areas IR1 to IR6 to the multiple (for example, six in the first embodiment) projection areas PA1 to PA6 on the substrate P for exposure.

First, the multiple illumination areas IR1 to IR6 illuminated by the illumination mechanism 13 are described. As shown in FIG. 6 , the multiple illumination areas IR1 to IR6 are arranged in two rows along the scanning direction of the substrate P across the center plane CL, and the illumination areas IR1, IR3 and IR5 are arranged on the mask M on the upstream side of the scanning direction, and the illumination areas IR2, IR4 and IR6 are arranged on the mask M on the downstream side of the scanning direction. Each illumination area IR1 to IR6 is an elongated trapezoidal area having parallel short sides and long sides extending along the width direction (Y direction) of the mask M. At this time, each trapezoidal illumination area IR1 to IR6 is an area whose short side is located on the center plane CL side and whose long side is located on the outside. The odd-numbered illumination areas IR1, IR3 and IR5 are arranged at a predetermined interval along the Y direction. In addition, the even-numbered illumination areas IR2, IR4 and IR6 are arranged at a predetermined interval along the Y direction. At this time, the illumination area IR2 is arranged between the illumination area IR1 and the illumination area IR3 in the Y direction. Similarly, illumination region IR3 is arranged between illumination region IR2 and illumination region IR4 in the Y direction. Illumination region IR4 is arranged between illumination region IR3 and illumination region IR5 in the Y direction. Illumination region IR5 is arranged between illumination region IR4 and illumination region IR6 in the Y direction. When viewed from the scanning direction of mask M, each illumination region IR1 to IR6 is arranged so that the triangular portions of the hypotenuse portions of adjacent trapezoidal illumination regions overlap. In addition, in the first embodiment, each illumination region IR1 to IR6 is a trapezoidal region, but may be a rectangular region.

In addition, the mask M has a pattern forming area A3 where a mask pattern is formed, and a pattern non-forming area A4 where no mask pattern is formed. The pattern non-forming area A4 is a low-reflection area that absorbs the illumination light beam EL1, and is configured to surround the pattern forming area A3 in a frame shape. The illumination areas IR1 to IR6 are configured to cover the entire width of the pattern forming area A3 in the Y direction.

The lighting mechanism 13 emits an illumination beam EL1 for illuminating the light shield M. The lighting mechanism 13 includes a light source device and an illumination optical system IL. The light source device includes, for example, a lamp light source such as a mercury lamp, a solid light source such as a laser diode or a light emitting diode (LED). The illumination light emitted by the light source device is, for example, a bright line (g line, h line, i line) emitted from a lamp light source, a far ultraviolet light (DUV light) such as a KrF excimer laser (wavelength 248nm), an ArF excimer laser (wavelength 193nm), etc. The illumination distribution of the illumination light emitted from the light source device is uniformized and introduced into the illumination optical system IL via a light guide component such as an optical fiber.

The illumination optical system IL is provided with a plurality of (for example, six in the first embodiment) illumination modules IL1 to IL6 corresponding to the plurality of illumination regions IR1 to IR6. The illumination light beam EL1 from the light source device is incident on the plurality of illumination modules IL1 to IL6, respectively. Each illumination module IL1 to IL6 guides the illumination light beam EL1 incident from the light source device to each illumination region IR1 to IR6, respectively. That is, the illumination module IL1 guides the illumination light beam EL1 to the illumination region IR1, and similarly, the illumination modules IL2 to IL6 guide the illumination light beam EL1 to the illumination region IR2 to IR6. The plurality of illumination modules IL1 to IL6 are arranged in two rows along the scanning direction of the mask M across the center plane CL. The illumination modules IL1, IL3, and IL5 are arranged on the arrangement side of the illumination regions IR1, IR3, and IR5 relative to the center plane CL (the left side of FIG. 5 ). The illumination modules IL1, IL3, and IL5 are arranged at predetermined intervals along the Y direction. In addition, the lighting modules IL2, IL4 and IL6 are arranged on the arrangement side of the lighting regions IR2, IR4 and IR6 relative to the center plane CL (the right side of FIG. 5 ). The lighting modules IL2, IL4 and IL6 are arranged at predetermined intervals along the Y direction. At this time, the lighting module IL2 is arranged between the lighting module IL1 and the lighting module IL3 in the Y direction. Similarly, the lighting module IL3 is arranged between the lighting module IL2 and the lighting module IL4 in the Y direction. The lighting module IL4 is arranged between the lighting module IL3 and the lighting module IL5 in the Y direction. The lighting module IL5 is arranged between the lighting module IL4 and the lighting module IL6 in the Y direction. In addition, the lighting modules IL1, IL3 and IL5 and the lighting modules IL2, IL4 and IL6 are arranged symmetrically with the center plane CL as the center when viewed from the Y direction.

The plurality of illumination modules IL1 to IL6 respectively include a plurality of optical components such as an integrator optical system, a rod lens, and a fly-eye lens, and illuminate the respective illumination regions IR1 to IR6 with an illumination light beam EL1 having a uniform illumination distribution. In the first embodiment, the plurality of illumination modules IL1 to IL6 are arranged on the upper side in the Z direction of the mask M. The plurality of illumination modules IL1 to IL6 respectively illuminate the respective illumination regions IR of the mask pattern formed on the mask M from the upper side of the mask M.

Next, the multiple projection areas PA1 to PA6 projected and exposed by the projection optical system PL are described. As shown in FIG. 6 , the multiple projection areas PA1 to PA6 on the substrate P are arranged corresponding to the multiple illumination areas IR1 to IR6 on the mask M. That is, the multiple projection areas PA1 to PA6 on the substrate P are arranged in two rows across the center plane CL along the conveying direction, and the projection areas PA1, PA3 and PA5 are arranged on the substrate P on the upstream side of the conveying direction (scanning direction), and the projection areas PA2, PA4 and PA6 are arranged on the substrate P on the downstream side of the conveying direction. Each projection area PA1 to PA6 is an elongated trapezoidal area having short sides and long sides extending along the width direction (Y direction) of the substrate P. At this time, each projection area PA1 to PA6 of the trapezoidal shape is an area whose short side is located on the center plane CL side and whose long side is located on the outside. The projection areas PA1, PA3 and PA5 are arranged at a predetermined interval in the width direction. In addition, the projection areas PA2, PA4 and PA6 are arranged at a predetermined interval in the width direction. At this time, projection area PA2 is arranged between projection area PA1 and projection area PA3 in the axial direction of rotation axis AX2. Similarly, projection area PA3 is arranged between projection area PA2 and projection area PA4 in the axial direction of rotation axis AX2. Projection area PA4 is arranged between projection area PA3 and projection area PA5 in the axial direction of rotation axis AX2. Projection area PA5 is arranged between projection area PA4 and projection area PA6 in the axial direction of rotation axis AX2. Each projection area PA1~PA6 is arranged in a manner that the triangular portions of the hypotenuse portions of adjacent trapezoidal projection areas PA overlap (overlap) when viewed from the conveying direction of substrate P, similarly to each illumination area IR1~IR6. At this time, projection area PA is a shape in which the exposure amount in the overlapping area of adjacent projection areas PA is substantially the same as the exposure amount in the non-overlapping area. Moreover, projection areas PA1~PA6 are arranged in a manner that covers the entire width of exposure area A7 to be exposed on substrate P in the Y direction.

Here, in Figure 5, when observed in the XZ plane, the length from the center point of illumination area IR1 (and IR3, IR5) on the mask M to the center point of illumination area IR2 (and IR4, IR6) is set to be substantially equal to the circumference from the center point of projection area PA1 (and PA3, PA5) on the substrate P that imitates the support surface P2 to the center point of projection area PA2 (and PA4, PA6).

In addition, as shown in FIG. 5 , the projection optical system PL is provided with a plurality of (for example, six in the first embodiment) projection modules PL1 to PL6 corresponding to the plurality of projection areas PA1 to PA6. A plurality of projection light beams EL2 from a plurality of illumination areas IR1 to IR6 are incident on the plurality of projection modules PL1 to PL6, respectively. Each projection module PL1 to PL6 guides each projection light beam EL2 from the mask M to each projection area PA1 to PA6, respectively. That is, the projection module PL1 guides the projection light beam EL2 from the illumination area IR1 to the projection area PA1, and similarly, the projection modules PL2 to PL6 guide each projection light beam EL2 from the illumination area IR2 to IR6 to the projection area PA2 to PA6. The plurality of projection modules PL1 to PL6 are arranged in two rows along the scanning direction of the mask M across the center plane CL. The projection modules PL1, PL3, and PL5 are arranged on the arrangement side of the projection areas PA1, PA3, and PA5 relative to the center plane CL (the left side of FIG. 5 ). The projection modules PL1, PL3, and PL5 are arranged at a predetermined interval along the Y direction. In addition, projection modules PL2, PL4 and PL6 are arranged on the arrangement side of projection areas PA2, PA4 and PA6 relative to the center plane CL (the right side of FIG. 5 ). Projection modules PL2, PL4 and PL6 are arranged at a predetermined interval along the Y direction. At this time, projection module PL2 is arranged between projection module PL1 and projection module PL3 in the axial direction of rotation axis AX2. Similarly, projection module PL3 is arranged between projection module PL2 and projection module PL4 in the axial direction of rotation axis AX2. Projection module PL4 is arranged between projection module PL3 and projection module PL5 in the axial direction of rotation axis AX2. Projection module PL5 is arranged between projection module PL4 and projection module PL6 in the axial direction of rotation axis AX2. In addition, projection modules PL1, PL3 and PL5 are arranged symmetrically with projection modules PL2, PL4 and PL6 with center plane CL as the center when viewed from the Y direction.

A plurality of projection modules PL1 to PL6 are provided corresponding to a plurality of illumination modules IL1 to IL6. That is, projection module PL1 projects the image of the mask pattern of illumination area IR1 illuminated by illumination module IL1 to projection area PA1 on substrate P. Similarly, projection modules PL2 to PL6 project the image of the mask pattern of illumination area IR2 to IR6 illuminated by illumination modules IL2 to IL6 to projection areas PA2 to PA6 on substrate P.

Next, each of the projection modules PL1 to PL6 will be described with reference to Fig. 7. In addition, each of the projection modules PL1 to PL6 has the same structure, so the description will be made taking the projection module PL1 as an example.

The projection module PL1 projects the image of the mask pattern in the illumination area IR (illumination area IR1) on the mask M onto the projection area PA on the substrate P. As shown in FIG7 , the projection module PL1 includes: a first optical system 61 for imaging the image of the mask pattern in the illumination area IR onto the intermediate image plane P7; a second optical system 62 for imaging at least a portion of the intermediate image formed by the first optical system 61 onto the projection area PA of the substrate P again; and a projection field stop 63 disposed on the intermediate image plane P7 for forming the intermediate image. In addition, the projection module PL1 includes a focus correction optical component 64, an image shift optical component 65, a magnification correction optical component 66, and a rotation correction mechanism 67.

The first optical system 61 and the second optical system 62 are telecentric reflective-refractive optical systems obtained by deforming a Dyson system, for example. The optical axis of the first optical system 61 (hereinafter referred to as the second optical axis BX2) is substantially orthogonal to the center plane CL. The first optical system 61 includes a first deflection component 70, a first lens group 71, and a first concave mirror 72. The first deflection component 70 is a triangular prism having a first reflection surface P3 and a second reflection surface P4. The first reflection surface P3 is a surface that reflects the projection light beam EL2 from the mask M and allows the reflected projection light beam EL2 to pass through the first lens group 71 and enter the first concave mirror 72. The second reflection surface P4 is a surface that allows the projection light beam EL2 reflected by the first concave mirror 72 to pass through the first lens group 71 and enter, and reflects the incident projection light beam EL2 toward the projection field aperture 63. The first lens group 71 includes various lenses, and the optical axes of the various lenses are arranged on the second optical axis BX2. The first concave mirror 72 is disposed on a pupil plane where a plurality of point light sources generated by the fly-eye lens are imaged through various lenses from the fly-eye lens to the first concave mirror 72 via an illumination field stop.

The projection light beam EL2 from the mask M passes through the focus correction optical component 64 and the image shift optical component 65, is reflected by the first reflection surface P3 of the first deflection component 70, passes through the field of view area of the upper half of the first lens group 71, and is incident on the first concave mirror 72. The projection light beam EL2 incident on the first concave mirror 72 is reflected by the first concave mirror 72, passes through the field of view area of the lower half of the first lens group 71, and is incident on the second reflection surface P4 of the first deflection component 70. The projection light beam EL2 incident on the second reflection surface P4 is reflected by the second reflection surface P4, and is incident on the projection field aperture 63.

The projection field aperture 63 has an opening that defines the shape of the projection area PA. That is, the shape of the opening of the projection field aperture 63 defines the shape of the projection area PA.

The second optical system 62 has the same structure as the first optical system 61, and is symmetrically arranged with respect to the first optical system 61 via the intermediate image plane P7. The optical axis of the second optical system 62 (hereinafter referred to as the third optical axis BX3) is substantially orthogonal to the center plane CL and is parallel to the second optical axis BX2. The second optical system 62 includes a second deflection member 80, a second lens group 81, and a second concave mirror 82. The second deflection member 80 includes a third reflection surface P5 and a fourth reflection surface P6. The third reflection surface P5 is a surface that reflects the projection light beam EL2 from the projection field aperture 63, and causes the reflected projection light beam EL2 to pass through the second lens group 81 and enter the second concave mirror 82. The fourth reflection surface P6 is a surface that allows the projection light beam EL2 reflected by the second concave mirror 82 to pass through the second lens group 81 and enter, and causes the incident projection light beam EL2 to reflect toward the projection area PA. The second lens group 81 includes various lenses, and the optical axes of the various lenses are arranged on the third optical axis BX3. The second concave mirror 82 is arranged on the pupil plane where the multiple point light source images formed in the first concave mirror 72 are formed through the various lenses from the first concave mirror 72 to the second concave mirror 82 via the projection field aperture 63.

The projection light beam EL2 from the projection field aperture 63 is reflected by the third reflection surface P5 of the second deflection member 80, passes through the field of view area of the upper half of the second lens group 81, and is incident on the second concave mirror 82. The projection light beam EL2 incident on the second concave mirror 82 is reflected by the second concave mirror 82, passes through the field of view area of the lower half of the second lens group 81, and is incident on the fourth reflection surface P6 of the second deflection member 80. The projection light beam EL2 incident on the fourth reflection surface P6 is reflected by the fourth reflection surface P6, passes through the magnification correction optical member 66, and is projected onto the projection area PA. As a result, the image of the mask pattern in the illumination area IR is projected onto the projection area PA at the same magnification (×1).

The focus correction optical component 64 is arranged between the mask M and the first optical system 61. The focus correction optical component 64 adjusts the focusing state of the image of the mask pattern projected onto the substrate P. The focus correction optical component 64 is a component formed by, for example, overlapping two wedge-shaped prisms in opposite directions (in FIG. 7 , opposite directions with respect to the X direction) to form a transparent parallel flat plate as a whole. By sliding the pair of prisms along the inclined direction without changing the interval between the opposing surfaces, the thickness of the parallel flat plate can be made variable. In this way, the actual effective optical path length of the first optical system 61 is finely adjusted, and the focusing (punt) state of the image of the mask pattern formed on the intermediate image plane P7 and the projection area PA is finely adjusted.

The image shifting optical component 65 is disposed between the mask M and the first optical system 61. The image shifting optical component 65 adjusts the image of the mask pattern projected on the substrate P so that it can move within the image plane. The image shifting optical component 65 is composed of a transparent parallel plate glass that can be tilted within the XZ plane of FIG. 6 and a transparent parallel plate glass that can be tilted within the YZ plane of FIG. 7. By adjusting the tilt amounts of the two parallel plate glasses, the image of the mask pattern formed on the intermediate image plane P7 and the projection area PA can be slightly shifted in the X direction and the Y direction.

The optical component 66 for magnification correction is arranged between the second deflection component 80 and the substrate P. The optical component 66 for magnification correction is configured by coaxially arranging three lenses, such as a concave lens, a convex lens, and a concave lens, at a predetermined interval, fixing the front and rear concave lenses, and moving the middle convex lens along the optical axis (main light) direction. As a result, the image of the mask pattern formed in the projection area PA can maintain a telecentric imaging state while isotropically enlarging or reducing only a small amount. In addition, the optical axis of the three lens groups constituting the optical component 66 for magnification correction is tilted in the XZ plane in a manner parallel to the main light of the projection light beam EL2.

The rotation correction mechanism 67 slightly rotates the first deflection member 70 about an axis perpendicular to the second optical axis BX2 by, for example, an actuator (not shown). The rotation correction mechanism 67 can slightly rotate the image of the mask pattern formed on the intermediate image plane P7 within the plane P7 by rotating the first deflection member 70.

In the projection modules PL1 to PL6 thus configured, the projection light beam EL2 from the mask M is emitted from the illumination region IR in the normal direction of the mask surface P1, and enters the first optical system 61. The projection light beam EL2 entering the first optical system 61 is transmitted through the focus correction optical component 64 and the image shift optical component 65, is reflected on the first reflection surface (plane mirror) P3 of the first deflection component 70 of the first optical system 61, passes through the first lens group 71, and is reflected on the first concave mirror 72. The projection light beam EL2 reflected by the first concave mirror 72 passes through the first lens group 71 again, is reflected on the second reflection surface (plane mirror) P4 of the first deflection component 70, and enters the projection field aperture 63. The projection light beam EL2 passing through the projection field aperture 63 is reflected on the third reflection surface (plane mirror) P5 of the second deflection component 80 of the second optical system 62, passes through the second lens group 81, and is reflected on the second concave mirror 82. The projection light beam EL2 reflected by the second concave mirror 82 passes through the second lens group 81 again, is reflected on the fourth reflection surface (plane mirror) P6 of the second deflection member 80, and is incident on the magnification correction optical member 66. The projection light beam EL2 emitted from the magnification correction optical member 66 is incident on the projection area PA on the substrate P, and the image of the mask pattern displayed in the illumination area IR is projected on the projection area PA at the same magnification (×1).

＜Drive unit control＞

Next, control of the drive unit 122 will be described with reference to Fig. 3. The drive unit 122 includes a mask-side drive unit 22 and a substrate-side drive unit 26 attached to a support frame 146 provided on the installation surface E.

As described above, the mask side drive unit 22 is composed of a magnet track (stator) of a linear motor and a coil unit (mover) of a linear motor, the magnet track being fixed on the support frame 146 in a manner extending in the X direction, and the coil unit of the linear motor being fixed on the transmission member 23 coupled to the mask carrier 21 and facing the magnet track with a fixed gap. In addition, as shown in FIG. 4 above, the substrate side drive unit 2 includes: a rotary motor composed of a coil unit Cur fixed as a stator on the support frame 146 side and a magnet unit MUr fixed as a mover on the rotor RT on the rotation axis AX2 side of the rotating drum 25; and a voice coil motor (MUs, CUs) that applies a thrust in the direction of the rotation axis AX2 (Y direction) to the rotating drum 25 from the support frame 146 side. As such, the mask side drive unit 22 and the substrate side drive unit 26 are structures capable of directly transmitting power to the transmission member 23 and the rotation axis AX2 in a non-contact manner (direct drive method), but are not limited to the above structure. For example, the substrate-side drive unit 26 may include an electric motor and a magnetic gear, the electric motor may be fixed to the support frame 146 side, and the magnetic gear may be interposed between the output shaft of the electric motor and the rotation axis AX2.

In the structure of the driving unit 122 as described above, the lower-level control device 16 shown in FIG5 moves the mask carrier 21 and the rotating drum 25 synchronously. Therefore, the image of the mask pattern formed on the mask surface P1 of the mask M is continuously and repeatedly projected and exposed on the surface (curved surface imitating a circular surface) of the substrate P wound on the supporting surface P2 (25a in FIG4) of the rotating drum 25. In the exposure device U3 of the first embodiment, after scanning exposure is performed in the synchronous movement of the mask M in the +X direction, it is necessary to perform an action (winding) to return the mask M to the initial position in the -X direction. Therefore, when the rotating drum 25 is continuously rotated at a fixed speed and the substrate P is continuously conveyed at a constant speed, during the winding action of the mask M, no pattern exposure is performed on the substrate P, and the panel pattern is formed in a jumping (separated) manner in the conveying direction of the substrate P. However, since in practice the speed of the substrate P during scanning exposure (here is the circumferential speed) and the speed of the mask M are assumed to be 50 mm/s to 100 mm/s, if the mask carrier 21 is driven at a maximum speed of, for example, 500 mm/s when the mask M is rolled back, the blank space between the panel patterns formed on the substrate P in the conveying direction can be narrowed.

In this embodiment, the moving position and speed of the mask carrier 21 in the X direction are accurately measured by a laser interferometer or a linear encoder, and the moving position and speed on the outer peripheral surface of the rotating drum 25 are accurately measured by the reading head EH of the scale plate 25c in Figure 4, thereby accurately ensuring the position synchronization and speed synchronization of the mask M and the substrate P in the scanning exposure direction.

＜Pushing mechanism＞

Next, the pushing mechanism 130 will be described with reference to FIG. 2 . The pushing mechanism 130 is provided between the position adjustment unit 120 and the exposure unit 121. The pushing mechanism 130 pushes in a manner that applies tension to the substrate P supplied from the position adjustment unit 120 to the exposure unit 121. The pushing mechanism 130 includes a pushing member 151 and a lifting mechanism 152 that lifts and lowers the pushing member 151. The pushing member 151 pushes the substrate P in a contact or non-contact state relative to the substrate P. As the pushing member 151, for example, an air flip bar having an air outlet and an air inlet for achieving a non-contact state with the substrate P, or a friction roller that contacts the substrate P, etc. is used. The lifting mechanism 152 lifts and lowers the pushing member 151 in the direction of pushing from one surface (back side) to the other surface (front side) of the substrate P, that is, in the Z direction. The lifting mechanism 152 is connected to the upper control device 5 and is controlled by the upper control device 5 based on the detection result of the second substrate detection unit 124.

The upper control device 5 controls the pushing mechanism 130 based on the detection result of the second substrate detection unit 124. Specifically, the upper control device 5 calculates the position displacement of the substrate P per unit time (for example, several milliseconds) according to the position of the substrate P detected by the second substrate detection unit 124. The upper control device 5 adjusts the movement amount of the pushing component 151 in the Z direction according to the calculated displacement. In other words, the larger the calculated displacement, the larger the vibration of the substrate P is considered to be, and the upper control device 5 controls the lifting mechanism 152 to make the pushing component 151 rise in the Z direction. The upper control device 5 applies tension to the substrate P by making the pushing component 151 rise in the Z direction, so that the vibration of the substrate P is damped by the pushing component 151.

＜Substrate recovery device＞

Next, the substrate recovery device 4 will be described with reference to FIG. 2 again. The substrate recovery device 4 has a position adjustment unit 160, a second bearing portion 161 on which the recovery roll FR2 is mounted, and a second lifting mechanism 162 for lifting and lowering the second bearing portion 161. In addition, the substrate recovery device 4 has a discharge angle detection portion 164 and a third substrate detection portion 165, and the discharge angle detection portion 164 and the third substrate detection portion 165 are connected to the upper control device 5. Here, in the first embodiment, similarly to the substrate supply device 2, the upper control device 5 functions as a control device (control portion) of the substrate recovery device 4. In addition, it can also be configured that, as the control device of the substrate recovery device 4, a lower control device for controlling the substrate recovery device 4 is provided, and the substrate recovery device 4 is controlled by the lower control device.

The position adjustment unit 160 includes the above-mentioned edge position controller EPC2 shown in FIG1. In addition, the position adjustment unit 160 has a substantially similar structure to the position adjustment unit 120 of the exposure device U3, and includes a base 170 and an edge position controller EPC2. The base 170 is provided on the installation surface E and supports the edge position controller EPC2. The base 170 may also be a vibration reduction table having a vibration reduction function.

The edge position controller EPC2 can move on the base 170 in the width direction (Y direction) of the substrate P. The edge position controller EPC2 has a plurality of rollers including a conveying roller 167 provided at the most downstream side in the conveying direction of the substrate P. The conveying roller 167 guides the substrate P discharged from the position adjustment unit 160 to the recovery roll FR2. The edge position controller EPC2 is connected to the upper control device 5 and is controlled by the upper control device 5 based on the detection result of the third substrate detection unit 165.

The third substrate detection unit 165 detects the position in the width direction of the substrate P recovered from the edge position controller EPC2 to the recovery roll FR2. The third substrate detection unit 165 is fixed to the second lifting mechanism 162. Therefore, the third substrate detection unit 165 becomes the same vibration mode as the recovery roll FR2. The third substrate detection unit 165 detects the position of the edge of the end of the substrate P recovered to the recovery roll FR2. The third substrate detection unit 165 outputs the detection result to the connected upper control device 5.

The upper control device 5 controls the edge position controller EPC2 based on the detection result of the third substrate detection unit 165. Specifically, the upper control device 5 calculates the difference between the position of the edge of the end of the substrate P recovered to the recovery roll FR2 detected by the third substrate detection unit 165 and the predetermined third target position. Then, the upper control device 5 performs feedback control on the edge position controller EPC2 in such a way that the difference becomes zero, so that the substrate P moves in the width direction so that the position of the substrate P relative to the recovery roll FR2 in the width direction becomes the third target position. Therefore, the edge position controller EPC2 can maintain the position of the substrate P relative to the recovery roll FR2 in the width direction at the third target position. Thus, since the position of the substrate P relative to the recovery roll FR2 in the width direction can be fixed, the end face of the recovery roll FR2 in the axial direction can be aligned. In addition, in this case, the feedback control can be any control such as P control, PI control, PID control, etc.

The second bearing 161 is rotatably supported by the recovery roll FR2. When the recovery roll FR2 supported by the second bearing 161 recovers the substrate P, the diameter of the recovery roll FR2 gradually increases in accordance with the amount of the recovered substrate P. Therefore, the position where the substrate P is recovered in the recovery roll FR2 changes in accordance with the amount of the recovered substrate P.

The second lifting mechanism 162 is provided between the installation surface E and the second bearing portion 161. The second lifting mechanism 162 moves the second bearing portion 161 along the Z direction (vertical direction) together with the recovery roll FR2. The second lifting mechanism 162 is connected to the upper control device 5, and the upper control device 5 moves the second bearing portion 161 along the Z direction through the second lifting mechanism 162, thereby enabling the position where the substrate P is recovered to a predetermined position by the recovery roll FR2.

The discharge angle detection unit 164 detects the discharge angle θ2 of the substrate P discharged from the conveying roller 167 of the edge position controller EPC2. The discharge angle detection unit 164 is provided around the conveying roller 167. Here, the discharge angle θ2 is an angle formed by a straight line extending in the vertical direction passing through the central axis of the conveying roller 167 in the XZ plane and the substrate P on the downstream side of the conveying roller 167. The discharge angle detection unit 164 outputs the detection result to the connected upper control device 5.

The upper control device 5 controls the second lifting mechanism 162 based on the detection result of the discharge angle detection unit 164. Specifically, the upper control device 5 controls the second lifting mechanism 162 in such a way that the discharge angle θ2 becomes a predetermined target discharge angle. That is, when the amount of substrate P recovered to the recovery roll FR2 increases, the roll diameter of the recovery roll FR2 increases, thereby the discharge angle θ2 relative to the target discharge angle becomes smaller. Therefore, the upper control device 5 makes the discharge angle θ2 larger by moving the second lifting mechanism 162 to the upper side of the Z direction (rising), so as to correct the discharge angle θ2 to the target discharge angle. In this way, the upper control device 5 performs feedback control on the second lifting mechanism 162 based on the detection result of the discharge angle detection unit 164 so that the discharge angle θ2 becomes the target discharge angle. Therefore, since the substrate recovery device 4 can always discharge the substrate P from the conveying roller 167 at the target discharge angle, the influence of the change of the discharge angle θ2 on the substrate P can be reduced. In this case, the feedback control may be any control such as P control, PI control, or PID control.

<Device manufacturing method>

Next, a device manufacturing method will be described with reference to Fig. 8. Fig. 8 is a flowchart showing the device manufacturing method according to the first embodiment.

In the device manufacturing method shown in FIG8 , first, for example, the function/performance design of a display panel based on a self-luminous element such as an organic EL is performed, and the necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). Next, based on the various patterns of each layer designed by CAD or the like, a mask M of the necessary number of layers is produced (step S202). In addition, a supply roll FR1 is prepared in advance, and the supply roll FR1 is rolled up with a flexible substrate P (resin film, metal foil film, plastic, etc.) that becomes the base material of the display panel (step S203). In addition, the roll substrate P prepared in step S203 may be a substrate whose surface has been modified as needed, a substrate on which a base layer (for example, microscopic bumps based on imprinting) has been formed in advance, or a substrate on which a photosensitive functional film and/or a transparent film (insulating material) has been pre-laminated.

Next, a back plane layer composed of electrodes, wiring, insulating film, TFT (thin film semiconductor), etc. constituting the display panel device is formed on the substrate P, and a light-emitting layer (display pixel portion) based on a self-luminous element such as an organic EL is formed by stacking on the back plane (step S204). In this step S204, the conventional photolithography process of exposing the photoresist layer using the exposure device U3 described in the previous embodiments is also included, but it can also include processing based on the following processes: an exposure process of forming a hydrophilic and hydrophobic pattern on the surface by patterning the substrate P coated with a photosensitive silane coupling agent instead of the photoresist layer; a wet process of patterning the photosensitive catalyst layer and forming a metal film pattern (wiring, electrode, etc.) by non-electrolytic plating; or a printing process of drawing a pattern by conductive ink containing conductive materials such as silver nanoparticles, ink containing insulating materials, or ink containing semiconductor materials (pentacene, semiconductor nanotubes, etc.).

Next, the substrate P is cut for each display panel device that is continuously manufactured on the long substrate P in a roll manner, and a protective film (environmentally resistant barrier layer) and a color filter film are attached to the surface of each display panel device to assemble the device (step S205). Next, an inspection process is performed to determine whether the display panel device functions normally or satisfies the desired performance and characteristics (step S206). Through the above, a display panel (flexible display) can be manufactured.

As described above, in the first embodiment, the exposure unit 121 can be installed on the installation surface E via the vibration reduction table 131, and the exposure unit 121, the position adjustment unit 120, and the drive unit 122 can be installed in an independent state. That is, in the first embodiment, the exposure unit 121, the position adjustment unit 120, and the drive unit 122 are isolated from each other by the vibration reduction table 131, that is, they are in different vibration modes. Therefore, the exposure unit 121 can reduce the vibration from the position adjustment unit 120 and the drive unit 122 through the vibration reduction table 131.

In addition, in the first embodiment, the position of the substrate P in the width direction relative to the fixed roller 126 can be maintained at the first target position. Therefore, since the substrate P is supplied to the same position relative to the fixed roller 126, the position in the width direction of the substrate P supplied from the fixed roller 126 can be fixed. Therefore, in the first embodiment, since the position in the width direction of the substrate P sent out from the fixed roller 126 can be fixed, the influence of vibration and the like on the substrate P due to the change in the position in the width direction of the substrate P can be reduced.

In addition, in the first embodiment, the position of the substrate P relative to the conveying roller 127 can be maintained at the second target position. Therefore, in the first embodiment, the position of the substrate P supplied to the exposure unit 121 can be fixed. Therefore, in the first embodiment, since the position of the substrate P supplied to the conveying roller 127 can be fixed, the influence of vibration and the like on the substrate P due to the change in the position of the substrate P can be reduced.

Moreover, in the first embodiment, the substrate P is pressed by the pressing mechanism 130 , thereby making it possible to further reduce the vibration of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 .

In addition, in the first embodiment, the device frame 132 can be separated into the first frame 132a and the second frame 132b, and the mask carrier 21 is supported on the first frame 132a, and the rotating drum 25 is supported on the second frame 132b. Therefore, the first frame 132a and the second frame 132b can be set in an independent state. In other words, the first frame 132a and the second frame 132b can be isolated, that is, they can be in different vibration modes. Therefore, the mutual vibration transmission between the first frame 132a and the second frame 132b can be reduced.

In the first embodiment, the substrate P supplied from the supply roll FR1 to the conveying roller 127 of the position adjustment unit 120 of the exposure device U3 can have a fixed approach angle θ1 with respect to the conveying roller 127. Therefore, the influence of the displacement of the approach angle θ1 on the substrate P can be reduced.

In addition, in the first embodiment, the discharge angle θ2 of the substrate P supplied from the conveying roller 167 of the position adjustment unit 160 of the substrate recovery device 4 to the recovery roll FR2 relative to the conveying roller 167 can be fixed. Therefore, the influence of the displacement of the discharge angle θ2 on the substrate P (uneven winding of the substrate P to the recovery roll FR2) can be reduced.

[Second embodiment]

Next, the exposure device U3 of the second embodiment is described with reference to FIG. 9 . In addition, in the second embodiment, in order to avoid repeated descriptions, only the parts different from the first embodiment are described, and the same structural elements as those in the first embodiment are marked with the same figure marks as those in the first embodiment for description. FIG. 9 is a diagram showing a partial structure of the exposure device (substrate processing device) U3 of the second embodiment. In the exposure unit 121 of the exposure device U3 of the first embodiment, the device frame 132 is separated into the first frame 132a and the second frame 132b, but the exposure unit 121a of the exposure device U3 of the second embodiment is a single device frame 180.

In the exposure unit 121a of the second embodiment, the device frame 180 is provided on the vibration reduction table 131, and supports the mask holding mechanism 11, the substrate supporting mechanism 12, the lighting mechanism 13, and the projection optical system PL that hold the transmission type cylindrical mask MA. The device frame 180 is composed of a lower surface portion 181 provided on the vibration reduction table 131, a pair of bearing portions 182 erected on the lower surface portion 181, an intermediate portion 183 supported on the pair of bearing portions 182, a leg portion 184 erected on the intermediate portion 183, an upper surface portion 185 supported on the leg portion 184, and an arm portion 186 erected on the upper surface portion 185.

Air bearings 141 are provided on a pair of bearing portions 182 for axially supporting the rotation axis AX2 of the rotating drum 25 of the substrate support mechanism 12. Each air bearing 141 axially supports the rotation axis AX2 in a non-contact state. A projection optical system PL is provided on the middle portion 183 via a holding member 143. Spacer members 145 are provided at three locations between the holding member 143 and the middle portion 183. The holding member 143 is supported on the middle portion 183 in a movably manner by the spacer members 145 at three locations. A driving roller (capstan roller) 94 is provided on the upper surface portion 185 for supporting the mask holding mechanism 11 (hollow cylindrical body) and for rotationally driving the cylindrical mask MA around the rotation center line AX1. The lighting mechanism 13 is arranged inside the mask holding mechanism 11, and illuminates the illumination area IR (IR1 to IR6) on the cylindrical mask MA from the inside in an arrangement as shown in the left figure in FIG. 6.

Moreover, a bearing 187 for rotatably supporting the rotating shaft of the driving roller 94 is provided on the upper surface portion 185, and the mask side driving portion 22 for rotationally driving the driving roller 94 is configured similarly to the substrate side driving portion 26 shown in the previous FIG4. Although not shown in the figure, a scale (diffraction grating) or scale plate 25c for encoder measurement similar to that shown in the previous FIG4 is provided at both ends of the rotation center line AX1 direction of the cylindrical mask holding mechanism 11, and the circumferential position of the cylindrical mask MA is precisely measured by the reading head EH arranged opposite thereto.

As described above, in the second embodiment, the mask holding mechanism 11, the substrate supporting mechanism 12, the lighting mechanism 13, and the projection optical system PL can be supported by the single device frame 180. Therefore, in the second embodiment, since the positional relationship between the mask holding mechanism 11, the substrate supporting mechanism 12, the lighting mechanism 13, and the projection optical system PL can be fixed, they can be easily installed without greatly adjusting their positional relationship.

Next, the exposure device U3 (exposure unit 121a) of the second embodiment shown in Figure 9 is described in further detail with reference to Figure 10. In the exposure unit 121a of Figure 10, the mask holding mechanism 11 has a mask holding roller 21a that holds the transmission type mask MA in a cylindrical shape, a guide roller 93 that supports the mask holding roller 21a, a drive roller 94 that drives the mask holding roller 21a around the center line AX1, and a mask side drive unit 22.

The mask holding roller 21a forms a mask surface P1 on the mask MA where the illumination area IR is arranged. In the present embodiment, the mask surface P1 includes a surface (hereinafter referred to as a cylindrical surface) formed by rotating a line segment (generatrix) around an axis (central axis of the cylindrical shape) parallel to the line segment. The cylindrical surface is, for example, the outer peripheral surface of a cylinder, the outer peripheral surface of a column, etc. The mask holding roller 21a is made of, for example, glass or quartz, and is cylindrical with a fixed wall thickness, and its outer peripheral surface (cylindrical surface) forms the mask surface P1. That is, in the present embodiment, the illumination area IR on the mask MA is bent into a cylindrical surface having a fixed radius Rm from the first axis AX1. The portion of the mask holding roller 21a that overlaps with the mask pattern of the mask MA when viewed from the radial direction of the mask holding roller 21a, for example, the central portion other than the two end sides of the mask holding roller 21a in the Y direction, is light-transmissive with respect to the illumination light beam EL1.

The photomask MA is made, for example, as a transmissive flat sheet photomask with a pattern formed by a light-shielding layer such as chrome on one surface of a short strip of extremely thin glass plate (for example, with a thickness of 100 to 500 μm) with good flatness, so that it is bent to imitate the outer peripheral surface of the photomask holding roller 21a, and is used in a state of being wound (pasted) on the outer peripheral surface. The photomask MA has a pattern non-forming area A4 where no pattern is formed, and is installed on the photomask holding roller 21a at the pattern non-forming area A4. The photomask MA can be released relative to the photomask holding roller 21a. Regarding the photomask MA, instead of being wound on the photomask holding roller 21a formed based on a transparent cylindrical base material, a mask pattern based on a light-shielding layer such as chrome can be directly drawn on the outer peripheral surface of the photomask holding roller 21a formed based on a transparent cylindrical base material to form an integrated one. In this case, the photomask holding roller 21a also functions as a supporting member of the photomask MA.

The guide roller 93 and the drive roller 94 extend in the Y direction parallel to the central axis of the mask holding roller 21a. The guide roller 93 and the drive roller 94 are arranged in a manner that they can rotate around an axis parallel to the central axis. The outer diameter of the axial end of each of the guide roller 93 and the drive roller 94 is larger than the outer diameter of other parts, and the end is circumscribed with the mask holding roller 21a. In this way, the guide roller 93 and the drive roller 94 are arranged in a manner that they do not contact the mask MA held on the mask holding roller 21a. The drive roller 94 is connected to the mask side drive unit 22. The drive roller 94 transmits the power from the mask side drive unit 22 to the mask holding roller 21a, thereby rotating the mask holding roller 21a around the central axis AX1.

In addition, the mask holding mechanism 11 has a guide roller 93, but the number is not limited and may be more than two. Similarly, the mask holding mechanism 11 has a drive roller 94, but the number is not limited and may be more than two. At least one of the guide roller 93 and the drive roller 94 may be arranged on the inner side of the mask holding roller 21a and in contact with the mask holding roller 21a. In addition, the portion of the mask holding roller 21a that does not overlap with the mask pattern of the mask MA when viewed from the radial direction of the mask holding roller 21a (the two end sides in the Y direction) may be light-transmissive or non-light-transmissive with respect to the illumination light beam EL1. In addition, one or both of the guide roller 93 and the drive roller 94 may be, for example, truncated cone-shaped, and its central axis (rotation axis) is not parallel to the central axis AX1.

The lighting mechanism 13 is constructed in the same manner as in the first embodiment, and a plurality of lighting modules ILa1 to ILa6 of the lighting mechanism 13 are arranged on the inner side of the mask holding roller 21a. The plurality of lighting modules ILa1 to ILa6 respectively guide the lighting beam EL1 emitted from the light source, and irradiate the guided lighting beam EL1 to the mask MA from the inside of the mask holding roller 21a. The lighting mechanism 13 illuminates the lighting area IR of the mask MA held by the mask holding mechanism 11 with uniform brightness through the lighting beam EL1. In addition, the light source can be arranged on the inner side of the mask holding roller 21a, or on the outer side of the mask holding roller 21a. In addition, the light source can be a device (external device) independent of the exposure device U3.

As described above, in the second embodiment, even if the mask MA of the exposure unit 121a is a cylindrical transmission-type mask, the exposure unit 121a can be provided in an independent state (a state where the transmission of vibration is isolated) from the position adjustment unit 120 and the drive unit 122. Therefore, the exposure unit 121a can reduce the vibration from the position adjustment unit 120 and the drive unit 122 through the vibration reduction table 131, and the same effect as the first embodiment can be obtained.

[Third embodiment]

Next, the exposure device U3 of the third embodiment is described with reference to FIG11. In addition, in the third embodiment, only the parts different from the first embodiment and the second embodiment are described to avoid duplication, and the same components as those of the first embodiment and the second embodiment are described by marking the same reference numerals as those of the first or second embodiment. FIG11 shows the overall structure of the exposure unit 121b of the third embodiment, which is a structure that uses a cylindrical reflective mask MB and supports the substrate P in a planar shape.

First, the photomask MB used in the exposure device U3 of the third embodiment is described. The photomask MB is a reflective photomask using, for example, a metal cylindrical body. The photomask MB is formed as a cylindrical body having an outer peripheral surface (circumferential surface) with a curvature radius Rm centered on the first axis AX1 extending along the Y direction, and has a fixed wall thickness in the radial direction. The circumferential surface of the photomask MB is a photomask surface P1 formed with a prescribed photomask pattern. The photomask surface P1 has a high-reflection portion that reflects a light beam with high efficiency in a prescribed direction, and a reflection suppression portion that does not reflect a light beam or reflects a light beam with low efficiency in a prescribed direction, and the photomask pattern is formed by the high-reflection portion and the reflection suppression portion. Such a photomask MB can be manufactured inexpensively because it is a metal cylindrical body.

In addition, the photomask MB only needs to have a circumferential surface with a curvature radius Rm centered on the first axis AX1, and is not limited to a cylindrical shape. For example, the photomask MB may also be an arc-shaped plate having a circumferential surface. In addition, the photomask MB may be in the form of a thin plate, or the thin plate-shaped photomask MB may be bent to have a circumferential surface.

The mask holding mechanism 11 includes a mask holding drum 21b that holds the mask MB. The mask holding drum 21b holds the mask MB with the first axis AX1 of the mask M as the rotation center. The mask-side driving unit 22 is connected to the lower control device 16 and rotates the mask holding drum 21b with the first axis AX1 as the rotation center.

In addition, the mask holding mechanism 11 holds the cylindrical mask M by the mask holding roller 21b, but is not limited to this structure. The mask holding mechanism 11 can also hold the thin plate-shaped mask MB by winding it along the outer peripheral surface of the mask holding roller 21b. In addition, the mask holding mechanism 11 can hold the mask MB as an arc-shaped plate on the outer peripheral surface of the mask holding roller 21b.

The substrate support mechanism 12 has a pair of driving rollers 196 for hanging the substrate P, an air stage 197 for supporting the substrate P in a planar shape, and a plurality of guide rollers 28. The pair of driving rollers 196 are rotated by the substrate-side driving unit 26 to move the substrate P along the scanning direction. The air stage 197 is disposed between the pair of driving rollers 196 and on the back side of the substrate P hung between the pair of driving rollers 196 with a fixed tension, and supports the substrate P in a planar shape in a non-contact state or a low-friction state. The plurality of guide rollers 28 are respectively disposed on the upstream side and the downstream side of the conveying direction of the substrate P across the pair of driving rollers 196. For example, a total of four guide rollers 28 are provided, two of which are disposed on the upstream side of the conveying direction, and two of which are disposed on the downstream side of the conveying direction.

Therefore, the substrate support mechanism 12 guides the substrate P conveyed from the position adjustment unit 120 to the driving roller 196 on one side through the two guide rollers 28. The substrate P guided to the driving roller 196 on one side is guided to the driving roller 196 on the other side, thereby being hung on the pair of driving rollers 196 with a fixed tension. The substrate support mechanism 12 rotates the pair of driving rollers 196 through the substrate side driving unit 26, thereby conveying the substrate P hung on the pair of driving rollers 196 toward the guide roller 28 while being supported by the air stage 197. The substrate support mechanism 12 guides the substrate P conveyed to the guide roller 28 toward the substrate recovery device 4.

When a cylindrical reflective mask MB is used, the lighting mechanism 13 irradiates the illumination light beam EL1 from the outer peripheral side of the mask holding roller 21b. That is, the light source device and the illumination optical system IL of the lighting mechanism 13 are arranged on the outer periphery of the mask holding roller 21b. The illumination optical system IL is an incident illumination system using a polarizing beam splitter PBS. A polarizing beam splitter PBS and a 1/4 wavelength plate 198 are provided between each illumination module IL1 to IL6 of the illumination optical system IL and the mask MB. That is, the illumination modules IL1 to IL6, the polarizing beam splitter PBS, and the 1/4 wavelength plate 198 are provided in order from the incident side of the illumination light beam EL1 from the light source device.

Here, the illumination light beam EL1 emitted from the light source device passes through the illumination modules IL1 to IL6 and enters the polarizing beam splitter PBS. The illumination light beam EL1 incident on the polarizing beam splitter PBS passes through the 1/4 wavelength plate 198 after being reflected by the polarizing beam splitter PBS and illuminates the illumination area IR. The projection light beam EL2 reflected from the illumination area IR passes through the 1/4 wavelength plate 198 again, thereby being converted into a light beam transmitted through the polarizing beam splitter PBS. The projection light beam EL2 passing through the 1/4 wavelength plate 198 enters the projection optical system PL through the polarizing beam splitter PBS.

As described above, in the third embodiment, even when the mask MB of the exposure unit 121b is a cylindrical reflective mask and the substrate P is supported in a planar shape, the exposure unit 121b can be provided in an independent state (a state where the transmission of vibration is isolated) from the position adjustment unit 120 and the drive unit 122. Therefore, the exposure unit 121b can reduce the vibration from the position adjustment unit 120 and the drive unit 122 by the vibration reduction table 131, and the same effect as the second embodiment can be obtained.

[Fourth embodiment]

Next, the exposure device (pattern forming device) U3 of the fourth embodiment is described. In addition, in the fourth embodiment, only the parts different from the first to third embodiments are described to avoid repeated descriptions, and the same structural elements as the first to third embodiments are marked with the same figure marks as the first to third embodiments and their descriptions are omitted.

FIG. 12 is a diagram showing the structure of the exposure device U3 of the fourth embodiment, and FIG. 13 is a diagram when the substrate P transported in the exposure device U3 shown in FIG. 12 is viewed from the upper side (+Z direction). FIG. 14 is a diagram when the substrate P transported between the last roller 126 on the position adjustment unit 120a side shown in FIG. 13 and the first roller AR1 on the exposure unit 121c side is viewed from the -Y direction side, and FIG. 15 is a diagram when the substrate P transported by the rotating drum 25 shown in FIG. 12 is viewed from the -X direction side. The exposure device (processing device) U3 has a position adjustment unit 120a and an exposure unit 121c provided on the downstream side (+X direction side) of the transport direction of the substrate P relative to the position adjustment unit 120a. The position adjustment unit 120a and the exposure unit 121c are provided as independent components. That is, the position adjustment unit 120a and the exposure unit 121c may be arranged in a non-contact independent state, or may be arranged in contact with each other via a bellows-type dust cover 121d or the like covering the conveying path of the substrate P between the position adjustment unit 120a and the exposure unit 121c and the conveying path of the substrate P after the exposure unit 121c, but in a state where the vibration component generated in the position adjustment unit 120a is not directly transmitted to the exposure unit 121c (a state where the transmission of vibration is suppressed). The exposure unit 121c is arranged on the installation surface (base surface) E via a passive or active vibration reduction table (vibration reduction device, vibration isolation device) 131. The position adjustment unit 120a is arranged on the installation surface E via the base 200. Thus, the vibration from other processing devices U1, U2, U4 to Un and the like and the vibration from the position adjustment unit 120a are not transmitted to the exposure unit 121c via the installation surface E. That is, it is possible to block (isolate) the transmission of vibration between the exposure unit 121c and the position adjustment unit 120a and other processing devices U. In other words, the vibration of the position adjustment unit 120a and other processing devices U is isolated from the vibration between the exposure unit 121c. In addition, the base 200 may also be a vibration reduction table (vibration reduction device, vibration isolation device) having a vibration reduction/vibration isolation function.

The position adjustment unit (position adjustment device) 120a has an edge position controller EPC3a, a fixed roller (guide roller) 126, a first substrate detection unit 202, and a lower control device (control unit) 204. The edge position controller EPC3a, the fixed roller 126, and the first substrate detection unit 202 are arranged in the above order from the upstream side (-X direction side) of the conveying direction of the substrate P. The edge position controller EPC3a adjusts (corrects) the position in the width direction of the substrate P conveyed along the long side direction with a specified tension (for example, a fixed value in the range of 20 to 200N) so that the position in the width direction of the substrate P becomes a target position. The edge position controller EPC3a can move in the width direction (Y direction) of the substrate P within the position adjustment unit 120a. The edge position controller EPC3a moves in the Y direction by driving the actuator 206 (refer to Figure 13) to adjust the position in the width direction of the substrate P. The edge position controller EPC3a has guide rollers Rs1, Rs2 and a driving roller NR for conveying the substrate P toward the fixed roller 126. The guide rollers Rs1, Rs2 guide the conveyed substrate P, and the driving roller NR conveys the substrate P while rotating while clamping the front and back surfaces of the substrate P. In addition, reference numeral 207a in FIG. 13 is a supporting member (a frame of the edge position controller EPC3a) that can rotatably support the guide rollers Rs1, Rs2 and the driving roller NR. In addition, reference numeral 207b is a supporting member (a main frame of the position adjustment unit 120a) that supports the first substrate detection unit 202 and rotatably supports the fixed roller 126, and a frame 207a of the edge position controller EPC3a is mounted on the main frame 207b so as to be movable in the Y direction.

The fixed roller 126 guides the substrate P whose position is adjusted in the width direction by the edge position controller EPC3a toward the exposure unit 121c. The substrate P is bent in the long side direction and guided for transportation by the guide rollers Rs1, Rs2, the drive roller NR and the fixed roller 126. The first substrate detection unit (substrate error measuring unit, change measuring unit) 202 detects the position in the width direction of the substrate P transported from the fixed roller 126 toward the exposure unit 121c. Specifically, as shown in FIG. 13, the first substrate detection unit 202 is composed of a detection unit 202a for detecting the Y-direction position of the edge portion Ea on the -Y side of the substrate P in the width direction, and a detection unit 202b for detecting the Y-direction position of the edge portion Eb on the +Y side, and measures the position change in the width direction of the substrate P based on the detection signals from the two detection units 202a and 202b. Furthermore, the first substrate detection unit 202 (202a, 202b) may be a sensor structure that detects (measures) change information related to a change in the posture of the substrate P (a slight tilt), deformation of the substrate P (extension in the width direction), etc., in addition to detecting the position in the width direction of the substrate P. The position in the width direction of the substrate P detected by the first substrate detection unit 202 and the change information of the substrate P are sent to the lower-level control device 204. In addition, the first substrate detection unit 202 may detect the position in the width direction of the substrate P conveyed from the edge position controller EPC3a toward the fixed roller 126.

When the first substrate detection unit 202 is used to measure the posture change of the substrate P, in particular, the slight inclination of the substrate P around the X-axis (in the YZ plane) on the conveying path parallel to the horizontal plane (XY plane) from the fixed roller 126 to the exposure unit 121c, as shown in Fig. 14, a Z sensor capable of measuring the change of the Z position (the height position in the normal direction of the surface of the substrate P) Ze1, Ze2 of the edge portions Ea, Eb of the substrate P is incorporated in each of the detection units 202a, 202b. The detection units 202a, 202b are arranged to be separated from the fixed roller 126 by a fixed distance in the conveying direction of the substrate P. Therefore, when the exposure unit 121c side (roller AR1) is slightly inclined relative to the XY plane relative to the fixed roller 126, the difference between the Z position Ze1 detected by the detection unit 202a and the Z position Ze2 detected by the detection unit 202b changes according to the inclination amount. By calculating the difference in this way, the relative position change ΔZs between the fixed roller 126 (position adjustment unit 120a) and the exposure unit 121c (roller AR1) in the Z direction is offset, thereby accurately calculating the slight tilt (around the X-axis) of the substrate P at the position where the detection parts 202a and 202b are arranged.

If the distance in the Y direction of the Z sensor parts of the detection parts 202a and 202b is Lz (fixed value), the actual inclination amount (angle Δψ) of the substrate P can be calculated by tanΔψ=(Ze1-Ze2)/Lz. In this way, the slight change in the inclination of the substrate P measured by the Z sensor incorporated in the detection parts 202a and 202b also corresponds to the relative inclination change around the Z axis between the fixed roller 126, i.e., the position adjustment unit 120a and the exposure unit 121c. As the Z sensor, an optical or electrostatic non-contact gap sensor or the like can be used. In addition, a fixed tension is also applied to the substrate P between the fixed roller 126 and the first roller (AR1) on the side of the exposure unit 121c in Figure 14 along the long side. Therefore, the possibility of the substrate P bending is small, but bending sometimes occurs when the tension is small, which may cause errors in the measurement of the Z sensor. Therefore, it is preferable to arrange the detection parts 202a and 202b (Z sensor parts) in the vicinity of the first roller (AR1) on the exposure unit 121c side in the longitudinal direction (conveying direction) of the substrate P.

Furthermore, as shown in FIG. 14 , when viewed from the fixed roller 126, if the substrate P is conveyed in a state where the exposure unit 121c (first roller AR1) is tilted in the YZ plane, the parallelism between the conveying direction (-Z direction) of the substrate P bent by the roller AR1 and the XZ plane is impaired, and the substrate P gradually displaces to one side in the width direction (+Y direction or -Y direction) under the action of tension, resulting in the substrate P supported by the rotating drum 25 also gradually displacing in the Y direction. Although the position adjustment unit 120a (edge position controller EPC3a) can function in a manner to correct such displacement of the substrate P in the Y direction, it can also be corrected by the substrate adjustment section 214 (details will be described later) including the roller AR1 provided on the exposure unit 121c side. Therefore, based on the change information related to the slight tilt (around the X-axis) of the substrate P detected by the detection units 202a and 202b, one or both of the position adjustment unit 120a and the substrate adjustment unit 214 can be controlled, thereby making it possible to maintain the position of the substrate P supported on the rotating drum 25 in the Y direction with high accuracy. In addition, regarding the position adjustment in the width direction of the substrate P reaching the rotating drum 25, the position adjustment unit 120a can be used for rough adjustment, and the substrate adjustment unit 214 can be used for fine adjustment.

The lower control device 204 controls the edge position controller EPC3a or the substrate adjustment unit 214 of the position adjustment unit 120a to control the position in the width direction of the substrate P. The lower control device 204 may be a part or all of the upper control device 5, or may be a computer different from the upper control device 5 and controlled by the upper control device 5.

The exposure unit (patterning device) 121c includes a substrate support mechanism 12a, a second substrate detection unit 208, an illumination mechanism 13a, an exposure head (pattern forming unit) 210, and a lower control device (control unit) 212. The exposure unit 121c is accommodated in a temperature control chamber ECV. The temperature control chamber ECV maintains the interior at a predetermined temperature, thereby suppressing the shape change of the substrate P transported therein due to the temperature. The temperature control chamber ECV is arranged on the installation surface E via a passive or active vibration reduction table 131.

The substrate supporting mechanism (conveying unit) 12a supports the substrate P conveyed from the position adjustment unit 120a while conveying it to the downstream side (+X direction), and has a substrate adjustment unit 214, a guide roller Rs3, a tension roller RT1, a rotating drum 25, a tension roller RT2 and driving rollers R5 and R6 in order from the upstream side (-X direction side) of the conveying direction of the substrate P.

The substrate adjustment unit 214 has a plurality of rollers (AR1, RT3, AR2), and transports the substrate P along the transport direction (+X direction) while correcting the distortion and wrinkles generated in the substrate P by adjusting the position in the width direction of the substrate P. The structure of the substrate adjustment unit 214 will be described later. The guide roller Rs3 transports the substrate P, whose position in the width direction of the substrate P is adjusted by the substrate adjustment unit 214, to the rotating drum 25. The rotating drum 25 rotates while holding the portion of the substrate P to be exposed to a prescribed pattern with its circumferential surface, and at the same time transports the substrate P to the side of the driving rollers R5 and R6. The functions of the driving rollers R5 and R6 are as described in the first embodiment above. The tension rollers RT1 and RT2 impart a prescribed tension to the substrate P supported by the rotating drum 25 in a wound manner. 13 denotes a supporting member (main frame of the exposure unit 121c) that rotatably supports the plurality of rollers of the substrate adjustment section 214, the guide roller Rs3, the tension roller RT1, the rotating drum 25, the tension roller RT2, and the driving rollers R5 and R6.

FIG. 16 is a diagram showing the structure of the substrate adjustment section 214. The substrate adjustment section 214 includes adjustment rollers AR1, AR2 and a tension roller RT3. The adjustment rollers AR1, the tension roller RT3 and the adjustment roller AR2 are arranged in the above order from the upstream side (-X direction side) of the conveying direction of the substrate P. The adjustment rollers AR1 and AR2 are arranged in a manner that bends the conveying path of the substrate P under a state of applying a predetermined tension. Specifically, by arranging the tension roller RT3 on the lower side (-Z direction side) of the adjustment rollers AR1 and AR2, the conveying path is bent by the adjustment rollers AR1 and AR2 under a state of applying a predetermined tension. Thus, the substrate P conveyed from the position adjustment unit 120a along the +X direction is bent downward (-Z direction) by the adjustment roller AR1 in a state of applying a predetermined tension and guided to the tension roller RT3, and the substrate P conveyed from the tension roller RT3 to the upper side (+Z direction) is bent in the +X direction by the adjustment roller AR2 in a state of applying a predetermined tension and guided to the guide roller Rs3. Moreover, the tension roller RT3 is axially supported at both ends in the Y direction so as to be movable in parallel in the Z direction, and generates a predetermined force in the -Z direction to apply tension to the substrate P while the substrate P is being conveyed.

The adjustment roller AR1 can rotate relative to the rotation axis AX3a through the bearing 214a, and the adjustment roller AR2 can also rotate relative to the rotation axis AX3b through the bearing 214b. The rotation axes AX3a and AX3b are arranged in parallel along the Y direction. The adjustment rollers AR1 and AR2 can be tilted relative to the axis parallel to the Y direction. In other words, one end side (-Y direction side) of the rotation axis AX3a of the adjustment roller AR1 can move slightly in the Z direction and the X direction with the other end side (+Y direction side) as a fulcrum. Similarly, for the adjustment roller AR2, one end side (-Y direction side) of the rotation axis AX3b can move in the X direction and the Z direction with the other end side (+Y direction side) as a fulcrum. The slight movement of one end side (-Y direction side) of the rotation axes AX3a and AX3b is driven by an actuator such as a piezoelectric element not shown. By slightly tilting the adjustment rollers AR1 and AR2, the position of the substrate P in the width direction can be slightly adjusted as the substrate P is transported in the long side direction, and the slight distortion generated in the substrate P and the slight in-plane deformation (or wrinkles) generated by the internal stress of the substrate P can be corrected. In addition, in FIG. 16, the two adjustment rollers AR1 and AR2 are slightly tilted in the XY plane or the YZ plane, but the adjustment rollers AR1 and AR2 can be tilted without tilting them, and the tension roller RT1 can be tilted. Moreover, the adjustment roller AR2 and the tension roller RT1 can be tilted without tilting the adjustment roller AR1.

The second substrate detection unit (substrate error measuring unit, change measuring unit) 208 detects the position in the width direction of the substrate P conveyed from the tension roller RT1 toward the rotating drum 25 in the +Z direction. Specifically, as shown in FIG. 15 , the second substrate detection unit 208 is respectively provided on both end sides in the width direction of the substrate P, and detects the edges of both end portions in the width direction of the substrate P. FIG. 17A is a diagram showing the structure of the second substrate detection unit 208, FIG. 17B is a diagram showing the light beam Bm irradiated to the substrate P by the second substrate detection unit 208, and FIG. 17C is a diagram showing the light beam Bm received by the second substrate detection unit 208. The second substrate detection unit 208 includes an irradiation system 216 for irradiating the light beam Bm, and a light receiving system 218 for receiving the light beam Bm. The irradiation system 216 includes a light projecting unit 220, a cylindrical lens 222, and a reflector 224, and the light receiving system 218 includes a reflector 226, an imaging optical system 228, and an imaging element 230. The light projecting unit 220 includes a light source that emits a light beam Bm, and irradiates the emitted light beam Bm toward the substrate P. The light beam Bm irradiated by the light projecting unit 220 is irradiated onto the substrate P via the cylindrical lens 222 and the reflector 224. As shown in FIG. 17B , the cylindrical lens 222 converges the incident light beam Bm in the Z direction so that the incident light beam Bm becomes a slit-shaped light beam Bm parallel to the Y direction of the substrate P on the substrate P. The length of the light beam Bm irradiated toward the substrate P is set to Lbm. At least a portion of the light beam Bm irradiated toward the substrate P side is reflected by the substrate P, and the remaining portion of the light beam Bm that does not contact the substrate P is not reflected by the substrate P and keeps moving in a straight line.

The slit-shaped light beam Bm reflected by the substrate P is incident on the imaging optical system 228 via the reflector 226. The imaging optical system 228 images the light beam Bm reflected from the reflector 226 on the imaging element 230, and the imaging element 230 captures the incident light beam Bm. As shown in FIG17C , the length of the light beam Bm captured by the imaging element 230 is the length Lbm1 of the light beam Bm reflected by the substrate P, so the position of the edge of the substrate P can be detected by measuring the length Lbm1. With such a structure, the second substrate detection unit 208 can detect the position in the width direction of the substrate P transported from the tension roller RT1 toward the rotating drum 25 along the +Z direction with high accuracy. In addition, by detecting the position of the substrate P, the second substrate detection unit 208 can detect (measure) change information related to the position change in the width direction of the substrate P, the deformation of the substrate P (expansion and contraction in the width direction), and the like. The position in the width direction of the substrate P detected by the second substrate detection unit 208 and the change information of the substrate P are sent to the lower control device 204. Reference numeral 230a denotes an imaging area of the imaging element 230. The first substrate detection unit 202 may have the same structure as the second substrate detection unit 208.

Each alignment microscope (substrate error measuring unit, change measuring unit) AM1, AM2 of the exposure unit 121c is provided with a plurality of alignment microscopes along the width direction of the substrate P, and detects the alignment mark Ks formed on the substrate P as shown in FIG15. In the example shown in FIG15, the alignment mark Ks is formed at fixed intervals along the long side direction of the substrate P on both end sides of the substrate P, and five alignment marks Ks are provided at fixed intervals along the width direction of the substrate P between the exposure areas A7 and the exposure areas A7 arranged along the long side direction of the substrate P. Therefore, in order to detect the alignment mark Ks formed on the substrate P, five alignment microscopes AM1 (refer to FIG19) are provided at fixed intervals along the width direction of the substrate P. By detecting the alignment mark Ks by the alignment microscopes AM1, AM2, the position in the width direction of the substrate P while being supported on the rotating drum 25 and being conveyed can be detected with high precision. In addition, by detecting the position of the alignment mark Ks, the alignment microscopes AM1, AM2 can detect (measure) change information related to position change, posture change, deformation of the substrate P, etc. in the width direction of the substrate P.

The position information of the alignment mark Ks in the long side direction (transportation direction) and the width direction detected by the alignment microscopes AM1 and AM2 is sent to the lower control device 212. The lower control device 212 generates correction information for correcting the pattern forming position based on the obtained position information of the alignment mark Ks and sends it to the exposure head (pattern forming unit) 210, and calculates the position in the width direction of the substrate P and the change information of the substrate P and sends them to the lower control device 204. In addition, the reference numeral 232 in FIG. 15 represents the detection area (detection field of view) of each alignment microscope AM1, and the positions of the five detection areas 232 in the conveyance direction of the substrate P (Z direction in FIG. 15) are set at such a position that the substrate P is stably in close contact with the outer peripheral surface of the rotating drum 25. The size of the detection area 232 on the substrate P is set according to the size of the alignment mark Ks and the alignment accuracy (position measurement accuracy), and is about 100 to 500 μm square.

In addition, as shown in FIG. 12 , a relative position detection unit (position error measurement unit, change measurement unit) 234 is provided between the position adjustment unit 120a and the exposure unit 121c, which detects (measures) the relative position of the position adjustment unit 120a and the exposure unit 121c and the change information related to the position change. FIG. 18 is a diagram showing the structure of the relative position detection unit 234. The relative position detection unit 234 is provided between the position adjustment unit 120a and the exposure unit 121c, and is provided at the end side in the -Y direction and the end side in the +Y direction, respectively. The relative position detection unit 234 has a first detection unit 236 that detects the relative position change of the position adjustment unit 120a and the exposure unit 121c in the YZ plane, and a second detection unit 238 that detects the relative position change of the position adjustment unit 120a and the exposure unit 121c in the XZ plane. Thus, the relative position detection unit 234 can detect the relative position and change information between the position adjustment unit 120 a and the exposure unit 121 c in three dimensions (XYZ space).

The first detection unit 236 includes a light projecting unit 240a that irradiates a laser beam toward the +X direction, and a light receiving unit 242a that receives the laser beam irradiated by the light projecting unit 240a. The second detection unit 238 includes a light projecting unit 240b that irradiates a laser beam toward the +Y direction, and a light receiving unit 242b that receives the laser beam irradiated by the light projecting unit 240b. The light projecting unit 240a of the first detection unit 236 and the light projecting unit 240b of the second detection unit 238 are provided on the surface side (+X direction side) of the position adjustment unit 120a that is opposite to the exposure unit 121c. In addition, the light receiving unit 242b of the first detection unit 236 and the light receiving unit 242b of the second detection unit 238 are provided on the surface side (-X direction side) of the exposure unit 121c that is opposite to the position adjustment unit 120a.

The light receiving parts 242a and 242b are composed of four split sensors. That is, the light receiving parts 242a and 242b have four photodiodes (photoelectric conversion elements) 244, and the position change in the plane perpendicular to the center of the laser beam is detected using the difference in the amount of light received by each of the four photodiodes 244 (the difference in signal level). The laser incident on the light receiving part 242a is light advancing in the +X direction, so the light receiving part 242a detects the position and position change of the center of the laser in the YZ plane perpendicular to the X direction. In addition, the laser incident on the light receiving part 242b is light advancing in the +Y direction, so the light receiving part 242b detects the position and position change of the center of the laser in the XZ plane perpendicular to the Y direction. As a result, the change information related to the relative position and position change of the position adjustment unit 120a and the exposure unit 121c can be detected (measured) in three dimensions. In particular, the relative rotation error around the X axis (relative tilt in the YZ plane) and the relative position error in the Y direction between the position adjustment unit 120a and the exposure unit 121c can be measured in real time by the difference or average of each detection information of the pair of first detection units 236 separated in the Y direction. In addition, the relative rotation error around the Z axis (relative tilt in the XY plane) between the position adjustment unit 120a and the exposure unit 121c can be measured in real time by the difference of each detection information of the pair of second detection units 238 separated in the Y direction.

Returning to the description of FIG. 12 , the lighting mechanism 13a has a laser source, and emits a laser beam (exposure beam) LB for exposure. The laser beam LB may be ultraviolet light having a peak wavelength in a band below 370 nm. The laser beam LB may also be a pulsed light emitting at an oscillation frequency Fs. The laser beam LB emitted by the lighting mechanism 13a is incident on the exposure head 210.

The exposure head 210 has a plurality of drawing units DU (DU1 to DU5) into which the laser light LB from the lighting mechanism 13a is incident. That is, the laser light LB from the lighting mechanism 13a is guided to the light introduction optical system 250 having a reflector, a beam splitter, etc., and then incident on the plurality of drawing units DU (DU1 to DU5). The exposure head 210 is transported by the substrate support mechanism 12a, and a pattern is drawn by the plurality of drawing units DU (DU1 to DU5) on a part of the substrate P supported by the circumferential surface of the rotating drum 25. The exposure head 210 has a plurality of drawing units DU (DU1 to DU5) having the same structure, and thus is a so-called multi-beam type exposure head 210. The drawing units DU1, DU3, and DU5 are arranged on the upstream side (-X direction side) of the conveying direction of the substrate P with respect to the rotation axis AX2 of the rotating drum 25, and the drawing units DU2 and DU4 are arranged on the downstream side (+X direction side) of the conveying direction of the substrate P with respect to the rotation axis AX2 of the rotating drum 25.

Each drawing unit DU converges the incident laser LB on the substrate P into a point light, and scans the point light at high speed along the scanning line by rotating a polygon mirror or the like. The scanning lines L of each drawing unit DU are set to be connected to each other in the Y direction (the width direction of the substrate P) instead of being separated from each other as shown in FIG. 19 . In FIG. 19 , the scanning line L of the drawing unit DU1 is represented by L1, and the scanning line L of the drawing unit DU2 is represented by L2. Similarly, the scanning lines L of the drawing units DU3, DU4, and DU5 are represented by L3, L4, and L5. In this way, the scanning area is shared by each drawing unit DU in such a way that the entire width direction of the exposure area A7 is covered by all the drawing units DU1 to DU5. Furthermore, for example, if the drawing width in the Y direction (the length of the scanning line L) under one drawing unit DU is set to about 20 to 50 mm, the width in the Y direction that can be drawn can be expanded to about 100 to 250 mm by arranging three odd-numbered drawing units DU1, DU3, and DU5 and two even-numbered drawing units DU2 and DU4 in the Y direction, for a total of five drawing units DU. Furthermore, the alignment microscopes AM1 and AM2 are arranged on the upstream side (-X direction side) of the conveying direction of the substrate P compared to the scanning lines L1, L3, and L5, and detect the alignment marks Ks formed on the substrate that is conveyed while being supported in close contact with the circumferential surface of the rotating drum 25.

The drawing unit DU is a known technology as disclosed in International Publication No. 2013/146184 (see FIG36 ), but the drawing unit DU will be briefly described using FIG20 . In addition, since the drawing units DU (DU1 to DU5) have the same structure, only the drawing unit DU2 will be described, and the description of the other drawing units DU will be omitted.

As shown in Figure 20, the drawing unit DU2 has, for example, a focusing lens 252, an optical element for drawing (light modulator) 254, an absorber 256, a collimating lens 258, a reflector 260, a cylindrical lens 262, a focusing lens 264, a reflector 266, a polygonal mirror (light scanning component) 268, a reflector 270, an f-θ lens 272 and a cylindrical lens 274.

The laser light LB incident on the drawing unit DU2 travels from the upper part to the lower part (-Z direction) in the vertical direction, and is incident on the drawing optical element 254 via the condenser lens 252. The condenser lens 252 condenses (converges) the laser light LB incident on the drawing optical element 254 to form a beam waist in the drawing optical element 254. The drawing optical element 254 is transmissive to the laser light LB, and an acousto-optic modulator (AOM) is used, for example.

When the driving signal (high frequency signal) from the lower control device 212 is off, the optical element 254 for drawing transmits the incident laser light LB to the absorber 256 side, and when the driving signal (high frequency signal) from the lower control device 212 is on, the incident laser light LB is diffracted and directed toward the reflector 260. The absorber 256 is a light trap that absorbs the laser light LB to prevent the laser light LB from leaking to the outside. In this way, by turning on/off the driving signal (frequency of ultrasonic waves) for drawing to be applied to the optical element 254 for drawing at high speed according to the pattern data (white and black), the laser light LB is switched toward the reflector 260 or toward the absorber 256. This means that when observed from the substrate P, the intensity of the laser light LB (point light SP) reaching the photosensitive surface is modulated at high speed to one of a high level and a low level (for example, a zero level) according to the pattern data.

The collimating lens 258 makes the laser light LB from the drawing optical element 254 toward the reflector 260 into parallel light. The reflector 260 reflects the incident laser light LB in the -X direction and irradiates it to the reflector 266 via the cylindrical lens 262 and the focusing lens 264. The reflector 266 irradiates the incident laser light LB to the polygon mirror 268. The polygon mirror (rotating polygon mirror) 268 continuously changes the reflection angle of the laser light LB by rotating, and scans the position of the laser light LB irradiated on the substrate P along the scanning direction (the width direction of the substrate P). The polygon mirror 268 rotates at a fixed speed (for example, 10,000 rpm) by a rotation drive source (for example, a motor and a reduction mechanism, etc.) not shown in the figure.

The cylindrical lens 262 provided between the reflector 260 and the reflector 266 cooperates with the focusing lens 264 to focus (converge) the laser light LB on the reflection surface of the polygon mirror 268 in the non-scanning direction (Z direction) orthogonal to the scanning direction. The cylindrical lens 262 can suppress the influence of the reflection surface being tilted relative to the Z direction (tilted from the equilibrium state between the normal line of the XY plane and the reflection surface) and suppress the irradiation position of the laser light LB irradiated on the substrate P from shifting in the X direction.

The laser LB reflected by the polygon mirror 268 is reflected in the -Z direction by the reflector 270 and is incident on the f-θ lens 272 having an optical axis AXu parallel to the Z axis. The f-θ lens 272 is a telecentric system that allows the main light of the laser LB projected on the substrate P to always be the normal line of the surface of the substrate P during scanning, thereby enabling the laser LB to be accurately scanned at a constant speed along the Y direction. The laser LB irradiated from the f-θ lens 272 passes through a cylindrical lens 274 whose generatrix is parallel to the Y direction, and becomes a tiny point light SP of a roughly circular shape with a diameter of about several μm and is irradiated onto the substrate P. The point light (scanning point light) SP is scanned one-dimensionally in one direction along the scanning line L2 extending in the Y direction by the polygon mirror 268.

The lower control device 212 controls the lighting mechanism 13a and the exposure head 210, etc., to impart a pattern to the substrate P. That is, the lower control device 212 controls the lighting mechanism 13a to irradiate the laser LB, and controls the drawing optical element 254 of each drawing unit DU of the exposure head 210 based on the position of the alignment mark Ks detected by the alignment microscope AM1, thereby drawing and exposing the pattern at a predetermined position on the substrate P, that is, the exposure area A7. The lower control device 212 may be part or all of the upper control device 5, or may be a computer controlled by the upper control device 5 and different from the upper control device 5.

Here, by conveying the substrate P to the rotating drum 25 in a state where the long side direction of the substrate P is orthogonal to the rotation axis AX2 of the rotating drum 25 and no distortion or wrinkles are generated on the substrate P, the exposure accuracy of the pattern on the substrate P is improved. Therefore, it is desirable that the rotation axes of the rollers (Rs1 to Rs3, NR, 126, AR1, AR2, RT1 to RT3, R5, R6) for conveying the substrate of the exposure device U3 and the rotating drum 25 are arranged parallel to each other along the Y direction, and the substrate P is conveyed in a manner that the long side direction of the substrate P is orthogonal to the rotation axes of these rollers and the rotating drum 25.

However, in reality, the rotation axes of the rollers (Rs1 to Rs3, NR, 126, AR1, AR2, RT1 to RT3, R5, R6) are slightly offset and the rotation axes of the rollers are not parallel to each other. In addition, due to the relative change of the positions of the position adjustment unit 120a and the exposure unit 121c caused by vibration, etc., the rotation axis of the roller of the position adjustment unit 120a and the rotation axis of the roller of the exposure unit 121c become non-parallel. As a result, minute stress disturbances, distortions, wrinkles, etc. are generated inside the substrate P, and the substrate P is wound in a state where the long side direction is slightly tilted relative to the rotation axis AX2 of the rotating drum 25, or the substrate P is supported on the rotating drum 25 in a state where it is greatly deformed (in-plane strain) compared to the line width dimension of the pattern to be drawn.

Therefore, in the fourth embodiment, the lower control device 204 controls the edge position controller EPC3a and the substrate adjustment unit 214 based on the detection results of the first substrate detection unit 202 , the second substrate detection unit 208 , the alignment microscopes AM1 , AM2 , and the relative position detection unit 234 .

In detail, the lower control device 204 controls the actuator (driving mechanism) 206 of the edge position controller EPC3a based on the position of the substrate P in the width direction detected by the first substrate detection unit 202 and the change information of the substrate P, thereby adjusting the position of the substrate P in the width direction. For example, the lower control device 204 calculates the difference between the center position in the Y direction obtained based on the positions of the edges of the two ends of the substrate P detected by the first substrate detection unit 202 and the target position, and performs feedback control on the actuator 206 in such a way that the calculated difference is zero (0), so that the substrate P moves in the Y direction. In this way, the position of the substrate P in the width direction conveyed from the position adjustment unit 120a can be made the target position, thereby suppressing the generation of slight distortion or wrinkles on the substrate P. In this way, since the position of the substrate P wound on the rotating drum 25 in the Y direction can be fixed with high precision, a plurality of alignment marks Ks arranged in the long side direction of the substrate P can be reliably and continuously captured in the detection area (detection field of view) 232 of each alignment microscope AM1.

In addition, the lower control device 204 controls the actuator 206 of the edge position controller EPC3a using the change information related to the relative position and position change between the position adjustment unit 120a and the exposure unit 121c detected by the relative position detection unit 234, thereby being able to correct the position change in the width direction of the substrate P (the displacement of the substrate P in the width direction accompanied by the change in the tilt state) as soon as possible. In addition, the lower control device 204 adjusts the tilt angle of the adjustment rollers AR1 and AR2 of the substrate adjustment unit 214 based on the information related to the relative position and position change detected by the relative position detection unit 234, thereby adjusting the position in the width direction of the substrate P. The adjustment of the tilt angle of the adjustment rollers AR1 and AR2 can be performed by driving the actuator (driving unit) such as the piezoelectric element. Thus, even if the relative positions of the position adjustment unit 120a and the exposure unit 121c change, the position of the substrate P in the width direction transported to the rotating drum 25 can be continuously set at the target position with high precision and high responsiveness, thereby suppressing the generation of slight distortions or wrinkles on the substrate P.

In addition, based on the position of the alignment mark Ks detected by the alignment microscopes AM1 and AM2, the position in the width direction of the substrate P, the slight distortion or wrinkles of the substrate P, and the change information related to the deformation of the substrate P can also be known. Therefore, the lower-level control device 204 controls the edge position controller EPC3a (actuator 206) and the substrate adjustment unit 214 (actuators such as the above-mentioned piezoelectric element) based on the detected position of the alignment mark Ks, thereby adjusting the position in the width direction of the substrate P. As a result, the position in the width direction of the substrate P transported to the rotating drum 25 can be set to the target position with high precision and high responsiveness, thereby suppressing the occurrence of slight distortion or wrinkles on the substrate P.

In addition, the lower control device 204 checks whether the position in the width direction of the substrate P to be conveyed to the rotating drum 25 is located at the target position, whether distortion (tilt) has occurred on the substrate P, etc., based on the position in the width direction of the substrate P detected by the second substrate detection unit 208. In the detection of the distortion (tilt) of the substrate P, when the incident angle of the light beam Bm of the detection system illustrated in FIG. 17A relative to the substrate P is increased and the substrate P is displaced in the normal direction of the surface (in the X direction in FIG. 17A), it is sufficient to use the fact that the reflected image Bm of the light beam Bm is displaced in the Z direction in the imaging area 230a of the imaging element 230. The second substrate detection unit 208 is also provided corresponding to the edge portions Ea and Eb on both sides of the substrate P, respectively. Therefore, by comparing the displacement amount of the image of the reflected light beam Bm in the Z direction in the imaging area 230a (obtaining the difference), the slight tilt amount of the substrate P in the width direction can also be obtained.

Furthermore, when the position in the width direction of the substrate P is not at the target position, the lower control device 204 controls the edge position controller EPC3a (actuator 206) and the substrate adjustment unit 214 (actuator such as the above-mentioned piezoelectric element) based on the position in the width direction of the substrate P detected by the second substrate detection unit 208 and the change information of the substrate P, thereby adjusting the position in the width direction of the substrate P. As a result, the position in the width direction of the substrate P conveyed to the rotating drum 25 can be made the target position.

However, since the second substrate detection unit 208 is arranged at a position where the substrate P is about to be wound around the rotating drum 25, it is difficult to accurately position the pattern to be formed in the exposure area A7 when a significant change in the width direction of the substrate P suddenly occurs at this position, for example, when the alignment mark Ks is separated from the detection area 232 of the alignment microscope AM1. In such a case, before the alignment mark Ks is captured in the detection area 232, an error sequence (an retries operation, etc.) is executed, such as terminating and skipping the pattern formation for the exposure area A7, or temporarily reversing the substrate P by only a certain length, and then re-detecting the alignment mark Ks based on the alignment microscope AM1 while conveying it in the forward direction.

As described above, in the fourth embodiment, the exposure unit 121c and the position adjustment unit 120a can be provided in an independent state (a state where the transmission of vibration is isolated). Therefore, the exposure unit 121c can reduce the vibration from the position adjustment unit 120a through the vibration reduction table 131, and the same effect as the first embodiment can be obtained. In addition, in the fourth embodiment, the lower control device 204 controls the edge position controller EPC3a and the substrate adjustment unit 214 based on the detection results of the first substrate detection unit 202, the second substrate detection unit 208, and the alignment microscopes AM1 and AM2. Thus, the exposure accuracy of the pattern generated by the exposure head 210 on the substrate P can be improved. The lower control device 204 controls the edge position controller EPC3a and the substrate adjustment unit 214 based on the detection results of the relative position detection unit 234. Thus, even if the relative position of the position adjustment unit 120a and the exposure unit 121c changes, the exposure accuracy of the pattern generated by the exposure head 210 on the substrate P can be improved.

In addition, in the fourth embodiment described above, the exposure device U3 is provided with the position adjustment unit 120a and the exposure unit 121c, but the exposure unit 121c may be provided immediately after the position adjustment unit 120a when viewed from the conveying direction of the substrate P. Therefore, the position adjustment unit 120a may not be provided in the exposure device U3. In this case, the position adjustment unit 120a may be provided on the side of the processing device U (U2) immediately before the exposure device U3 as shown in FIG. 1 when viewed from the conveying direction of the substrate P. Alternatively, in the case where the substrate supply device 2 is provided immediately before the exposure device U3, the function of the position adjustment unit 120a is provided in the substrate supply device 2.

In addition, the process immediately before the photopatterning process performed by the exposure device U3, exposure units 121, 121c, etc. (second processing unit) is a set of a process of forming (coating) a liquid photosensitive layer on the surface of the substrate P and a process of drying (baking) the photosensitive layer. However, in the case of using a dry film as the photosensitive layer, it becomes a process (photosensitive layer formation process) of transferring the photosensitive layer on the dry film to the surface of the substrate P as the exposed substrate by pressing using a pressure-contact transfer device such as a lamination device, and there is also a case where a drying process is not required. Therefore, as a pre-processing device (first processing unit) in charge of the process immediately before the photopatterning process, a photosensitive layer forming device that forms a photosensitive layer on the surface of the substrate P, or a drying (heating) device that dries the substrate P, the function of the position adjustment unit 120a can be set on the downstream side (substrate unloading section) of the substrate conveying path in these pre-processing devices or between the pre-processing device and the photopatterning device.

In addition, as a patterning process, when a printer is used, as a process immediately before the patterning process, a process of modifying the entire surface of the substrate P or only the portion corresponding to the pattern formation in order to improve the close adhesion of the ink to the surface of the substrate P (a selective imparting process of imparting liquid repellency/liquid affinity, etc.) is implemented. Such a surface modification process is also implemented in a single or multiple pre-processing devices, so the function of the position adjustment unit 120a can be provided on the downstream side (substrate unloading portion) of the substrate conveying path in the pre-processing device immediately before the printer, or between the pre-processing device and the printer.

In the fourth embodiment, the first substrate detection unit 202 is provided on the position adjustment unit 120a and the second substrate detection unit 208 is provided on the exposure unit 121c, but only one of the first substrate detection unit 202 and the second substrate detection unit 208 may be provided. In addition, both the first substrate detection unit 202 and the second substrate detection unit 208 may not be provided. This is because even without the first substrate detection unit 202 and the second substrate detection unit 208, the position in the width direction of the substrate P can be detected by the alignment microscopes AM1 and AM2.

In the fourth embodiment described above, the processing device U3 is described as an exposure device, but any pattern forming device that can impart a pattern to the substrate P will suffice. As a pattern forming device, for example, in addition to the exposure device, an inkjet printer that imparts a pattern to the substrate P by applying ink can be cited. In this case, the exposure head 210 is replaced with a nozzle head (pattern forming unit) having a plurality of nozzles that draw a pattern on the substrate P by making the ink material into droplets and selectively imparting it, and the exposure units 121, 121a to 121c are replaced with a patterning device having a pattern forming unit. In addition, in the first to third embodiments described above, the processing device U3 can also be a pattern forming device that imparts a pattern to the substrate P.

As described in the above embodiments, in a patterning device such as an exposure device or an inkjet printer that forms a fine pattern for an electronic device on a substrate P, it is important to precisely position and form the pattern on the substrate P. Vibration, which is one of the external disturbance factors that reduces the positioning accuracy, is generated by a compressor or pump for air or liquid built into a nearby processing device, and is transmitted to the exposure head (pattern forming unit) 210, the rotating drum 25 that supports the substrate P, and other supporting parts via the factory floor. In order to isolate the path of the vibration transmission, it is effective to provide a vibration-proof device (vibration-damping table 131, etc.) on the patterning device. In addition, it is desirable to make the factory floor (foundation) as strong as possible and to construct it with a low resonance frequency. In the above embodiments, even if the ground conditions are not so strict, the substrate P can be precisely transported and high-precision patterning can be achieved.

For example, when constructing a production line, in order to prevent the substrate P passing through the patterning device (exposure units 121, 121a to 121c) from shifting in the width direction, the rollers in the patterning device and the rollers in the processing device (position adjustment units 120, 120a) on the upstream side of the patterning device are parallelized, but after starting the processing of the substrate P, there is a case where the ground surface is slightly sunken and tilted locally due to the influence of the device load, etc. over time. Even in such a case, the position displacement and deformation (micro tilt caused by twisting) in the width direction when the substrate P is carried into the patterning device can be measured by the first substrate detection unit 202 (202a, 202b) and the relative position detection unit 234, and correction can be made by the substrate adjustment unit 214 (rollers AR1, RT3, AR2).

In the case of the fourth embodiment, the substrate adjustment unit 214 composed of a plurality of rollers (at least one of which can be tilted) as shown in FIG. 16 is provided on the main frame 215 on the side of the exposure unit 121c as shown in FIG. 12, but it may be provided on the main frame 207b in the position adjustment unit 120a. In this case, in the position adjustment unit 120a (first processing device) and the exposure unit 121c (second processing device) separated from each other in order to isolate or suppress the transmission of vibration, the second substrate detection unit 208 provided on the side of the exposure unit 121c is provided near the guide roller Rs3 or the tension roller RT1, similarly to the second substrate detection unit 124 shown in FIG. 2. In addition, the position adjustment unit 120a (first processing device) and the exposure unit 121c (second processing device) may be independent, and the substrate adjustment unit 214 may be provided on the installation surface E as a separate unit.

When a position adjustment unit 120a or a first substrate detection unit 202 is provided between the exposure unit 121, 121c, etc. (second processing unit) that performs a light patterning process and a pre-processing device (first processing unit) that manages a process immediately before the light patterning process, the position change of the substrate P transported from the first processing unit to the second processing unit can be detected by the first substrate detection unit 202. In addition, when a position adjustment unit 120a or a first substrate detection unit 202 is provided on the downstream side of the transport direction of the substrate P in the first processing unit, the position change of the substrate P transported from the first processing unit to the second processing unit can be detected by the first substrate detection unit 202, and the position change of the substrate P transported from the first processing unit to the second processing unit can also be detected based on the position of the substrate P detected by the first substrate detection unit 202 and the position of the substrate P detected by the second substrate detection unit 208 or the alignment microscopes AM1, AM2. In addition, by detecting the relative position and position change of the position adjustment unit 120a and the exposure unit 121c by the relative position detection unit 234, the position change of the substrate P transported from the first processing unit to the second processing unit can be detected.

Claims (17)

1. A pattern forming device for forming a pattern at a predetermined position on a long flexible sheet substrate while conveying the sheet substrate in the longitudinal direction, characterized in that: A patterning device comprising a conveying section including a plurality of guide rollers for conveying the sheet substrate in a longitudinal direction along a predetermined conveying path, and a pattern forming section provided on a portion of the conveying path and forming the pattern at the predetermined position on the surface of the sheet substrate; A vibration reduction device, which is arranged between the base table surface on which the patterning device is arranged and the patterning device; A position adjustment device, which is independently provided from the patterning device and is provided on the base surface, includes a guide roller for delivering the sheet substrate toward the conveying portion of the patterning device, and adjusts the position of the sheet substrate in a width direction orthogonal to the long side direction of the sheet substrate; a position error measuring unit that measures change information related to a relative position change between the patterning device and the position adjustment device; and a control device for controlling the position adjustment device based on the change information, The conveying section is provided with an inclineable adjustment roller, the adjustment roller being arranged upstream of the pattern forming section in the conveying path so as to bend the conveying path of the sheet substrate while applying a predetermined tension in the long side direction. The control device adjusts the position in the width direction of the sheet substrate conveyed to the pattern forming section by tilting the adjustment roller based on the change information. 2. The pattern forming device according to claim 1, characterized in that The conveying section of the patterning device has a rotating roller, which can rotate around a rotating axis configured to extend along the width direction of the sheet substrate, and the rotating roller has a cylindrical outer peripheral surface with a certain curvature radius relative to the rotating axis, and the rotating roller supports a portion of the long side direction of the sheet substrate along the outer peripheral surface. 3. The pattern forming device according to claim 2, characterized in that The position error measuring unit has a plurality of position detecting units for detecting changes in the relative positions of the patterning device and the position adjusting device in the width direction of the sheet substrate, and changes in the relative tilt and/or relative rotation of the patterning device and the position adjusting device. 4. The pattern forming device according to claim 2, characterized in that A first substrate detection unit is also provided. In order to detect the inclination in the width direction of the sheet substrate sent from the position adjustment device to the conveying unit of the patterning device, the first substrate detection unit measures the difference in the position of the normal direction of the surface of the sheet substrate at the edge portions on both sides of the width direction of the sheet substrate. 5. The pattern forming device according to claim 4, characterized in that The control device adjusts the inclination amount of the adjustment roller provided in the conveying section of the patterning device based on the inclination of the sheet substrate measured by the first substrate detection section, and corrects displacement of the sheet substrate supported by the rotating drum in the width direction. 6. The pattern forming device according to any one of claims 2 to 5, characterized in that The pattern forming part of the patterning device includes one of an exposure device and a printing device, wherein the exposure device projects light energy corresponding to the pattern onto the surface of the sheet substrate supported by the outer peripheral surface of the rotating drum, and the printing device draws the pattern on the surface of the sheet substrate by applying ink. 7. A device manufacturing system, which sequentially performs a first treatment and a second treatment on a long flexible sheet substrate while conveying the sheet substrate in a longitudinal direction, characterized in that: a first processing unit, which is provided on a predetermined base surface and includes a plurality of rollers for conveying the sheet substrate in a longitudinal direction along a predetermined conveying path, and performs the first processing on the sheet substrate; a second processing unit, which is disposed on the base surface and includes a plurality of rollers for conveying the sheet substrate conveyed from the first processing unit along a predetermined conveying path in a longitudinal direction and performs the second processing on the sheet substrate; an anti-vibration device for suppressing or isolating vibration transmission between the base surface and the first processing unit, or between the base surface and the second processing unit, or between the first processing unit and the second processing unit; a change measuring unit that measures change information related to a relative position change between the first processing unit and the second processing unit or a position change of the sheet substrate conveyed from the first processing unit to the second processing unit; a position adjustment device for adjusting the position of the sheet substrate carried into the second processing unit in a width direction perpendicular to the long side direction based on the change information, The position adjustment device comprises: a plurality of rotating rollers for guiding the conveyance of the sheet substrate by bending it in the long side direction; a driving mechanism for moving some of the plurality of rotating rollers parallel to the direction of the rotation center axis; and a control unit for controlling the driving mechanism based on the change information measured by the change measuring unit. 8. The device manufacturing system according to claim 7, characterized in that: The second processing unit is a patterning device including one of an exposure device and a printing device, wherein the exposure device projects light energy corresponding to the pattern onto a photosensitive layer formed on the surface of the sheet substrate in order to form a pattern for electronic devices in the long side direction of the sheet substrate, and the printing device draws the pattern on the surface of the sheet substrate by applying ink containing one of conductive material, insulating material, and semiconductor material. 9. The device manufacturing system according to claim 8, characterized in that: The first processing unit is composed of a single or a plurality of pre-processing devices that perform a process corresponding to a pre-processing step performed on the sheet substrate by the patterning device. The position adjustment device is provided in the pre-processing device provided immediately before the patterning device on the conveyance path of the sheet substrate, or is provided between the immediately preceding pre-processing device and the patterning device. 10. The device manufacturing system according to claim 9, characterized in that: The change measuring section includes a sensor disposed on a conveyance path of the sheet substrate between the first processing unit and the second processing unit and detecting a tilt change in a width direction of the sheet substrate orthogonal to the long side direction as the change information. 11. The device manufacturing system according to any one of claims 7 to 9, characterized in that: The driving mechanism tilts a rotation center axis of a rotating roller other than the rotating roller that moves in parallel among the plurality of rotating rollers. 12. The device manufacturing system according to claim 11, characterized in that: The change measuring section includes a sensor disposed on a conveyance path of the sheet substrate between the first processing unit and the second processing unit and detecting a tilt change in a width direction of the sheet substrate orthogonal to the long side direction as the change information. 13. A device manufacturing system for forming a pattern of an electronic device on a flexible long sheet substrate conveyed in a long-side direction along a predetermined conveying path, characterized in that: a conveying section including a plurality of guide rollers for conveying the sheet substrate along the conveying path in a longitudinal direction; a rotating roller, the rotating roller being provided on a part of the conveying path, rotating about a rotation center arranged to extend along a width direction of the sheet substrate orthogonal to the long side direction, and the rotating roller having a cylindrical outer peripheral surface with a constant radius of curvature relative to the rotation center, and the rotating roller supporting a part of the sheet substrate in the long side direction including a region where the pattern is formed, along the outer peripheral surface; a pattern forming section arranged opposite to the rotating drum and forming a pattern of the electronic device on a surface of a portion of the sheet substrate supported by the outer peripheral surface of the rotating drum; an adjustment roller, which is arranged on the upstream side of the rotating drum on the conveying path as a part of the conveying section, and can rotate around a rotation axis extending in the width direction of the sheet substrate, and can wind and guide a part of the sheet substrate in the long side direction, and can adjust the inclination of the rotation axis by a driving section; a substrate error measuring section disposed on an upstream side relative to the pattern forming section in the conveying path, and measuring change information related to a position change, a posture change, or a deformation of the sheet substrate in the width direction of the sheet substrate; and A control unit controls the driving unit for adjusting the inclination of the adjustment roller based on the change information measured by the substrate error measuring unit. 14. The device manufacturing system according to claim 13, characterized in that: The substrate error measuring unit includes a first substrate detection unit, which is arranged on the upstream side of the adjustment roller on the conveying path, and measures the position of the normal direction of the surface of the sheet substrate at the edge portions on both sides of the width direction of the sheet substrate, and measures the inclination change in the width direction of the sheet substrate based on the difference in their positions to output the change information. 15. The device manufacturing system according to claim 13, characterized in that: The substrate error measuring unit includes a second substrate detecting unit disposed on the upstream side of the rotating drum on the conveying path, and measures a position change of an edge portion in a width direction of the sheet substrate and outputs the change information. 16. The device manufacturing system according to claim 13, characterized in that: The rotating drum is provided with an electric motor composed of a rotor and a stator, wherein the rotor has magnet units arranged in a ring shape around a rotating shaft supported by a bearing as the rotation center, and the stator includes a coil unit fixed to a support frame of the device and arranged in a manner opposite to the magnet unit of the rotor. The rotating drum is driven to rotate in a direct drive manner in which power is directly transmitted from the electric motor. 17. The device manufacturing system according to claim 13, characterized in that: The rotating drum is provided with a first motor and a second motor. The first motor imparts a rotation torque to a rotating shaft supported by a bearing as the rotation center, and the second motor is used to apply an axial thrust to the rotating shaft to slightly move the rotating drum in the width direction of the sheet substrate.