TWI627110B - Package structure for packaging substrate storage container - Google Patents

Abstract

The packing structure 1 for the package substrate storage container 2 of the present invention includes a packing box 10, an upper cushioning material 30, a lower cushioning material 40, a first rigid body 50, and a first shock absorbing material 60. The first rigid body 50 having a plate shape is disposed in the packing box 10, and has a flat upper surface 51 and a lower surface 52, respectively, and the upper surface 51 of the first rigid body 50 abuts against the lower end surface of the lower cushioning material 40. . The first damper 60 is disposed in the packing box 10 and has an upper surface 51 and a lower surface 52, and the upper surface 62 of the first damper 60 is slidable relative to the lower surface 52 of the first rigid body 50. The surface of the first rigid body 50 abuts against the lower surface 52 of the first rigid body 50.

Description

Package structure for packaging a substrate storage container

The present invention relates to a package structure for packaging a substrate storage container for housing a substrate such as a wafer.

In a container for accommodating a substrate such as a semiconductor wafer, a substrate storage container including a container body and a lid is known. When the substrate storage container is bundled and transported in a packing box, a cushioning material made of a resin foam and a cushioning material formed of a plastic sheet are placed in the packing box. These cushioning materials hold the substrate storage container in the packing box, and reduce the impact and vibration transmitted from the outside of the packing case to the substrate storage container (see Patent Document 1 below).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-132331

However, there is now a need to further reduce the packing configuration that transmits impact and vibration to the substrate storage container, rather than the conventional bale construction using the cushioning material.

It is an object of the present invention to provide a substrate for packaging The packing structure of the nano container can strongly suppress the transmission of the impact and the vibration to the plurality of substrates accommodated in the substrate storage container when the substrate storage container is transported.

The packaging structure system for packaging a substrate storage container of the present invention is for packaging a packaging structure for storing and transporting a substrate storage container for a substrate made of a semiconductor wafer, and includes: a packing box; and an upper cushioning material The lower cushioning material is placed on the upper portion of the substrate storage container, and the lower cushioning material is placed on the substrate storage container, and the upper cushioning material and the lower cushioning material are sandwiched in the vertical direction. The container is disposed in the packing box; the first rigid body having a plate shape is disposed in the packing box, and has a flat upper surface and a lower surface, respectively, and the upper surface of the first rigid body is abutted a lower end surface of the lower cushioning material; and a first damping material disposed in the packing box, having an upper surface and a lower surface, and the upper surface of the first damper is capable of being opposite to the foregoing The lower surface of the first rigid body is slid to face the lower surface of the first rigid body, and the upper cushioning material and the lower cushioning material are provided to accommodate the substrate in which the semiconductor wafer is housed. The above-mentioned upper cushioning material or the lower cushioning material is not directly plastically deformed, and the hardness of the shape of the upper cushioning material and the lower cushioning material itself can be maintained, and the substrate storage container can be held in the vertical direction in the packing box. The position in the orthogonal direction and the mounting posture, and having a softness capable of absorbing at least a part of the impact that is applied to the packing box and transmitted to the substrate storage container via the upper cushioning material and the lower cushioning material; 1 The upper surface of the rigid body is lower than the aforementioned lower part The lower end surface of the cushioning material is large; and the first rigid system has a hardness capable of maintaining the shape of the first rigid body itself so that the entire lower surface of the first rigid body can abut against the upper surface of the first damper; In the first damper material, the substrate storage container in which the semiconductor wafer is accommodated is directly placed on the first damper, and the substrate storage container is elastically deformed, and the substrate storage container is removed. The softness of the original elastic properties of the shape.

Further, it is preferable that the first damper material is formed by laminating a plurality of plate-shaped first dampers each having a flat upper surface and a lower surface in the vertical direction, and adjacent to each other in the stacking direction. The upper surface of the plate-shaped first damper material on the side is slidably contacted with the lower surface of the upper plate-shaped first damper material on the upper side, and the second rigid body having a plate shape is provided. Each of the bundled boxes has a flat upper surface and a lower surface, and an upper surface of the second rigid body is slidably surface-contacted to a lower surface of the lowermost layer-shaped first shock absorbing material; The second rigid system has a hardness capable of maintaining the shape of the second rigid body itself so that the lower surface of the plate-shaped first damper material that can contact the lowermost layer of the entire upper surface of the second rigid body can be abutted.

Moreover, it is preferable that the second damper is disposed in the packing box and has an upper surface and a lower surface, and the upper surface of the second damper is detachable from the second rigid body. The lower surface slidably abuts against the lower surface of the second rigid body, and the second damper material has a condition that the substrate storage container in which the semiconductor wafer is accommodated is directly placed on the second damper Elastic deformation, removal of the substrate storage container placed thereon will restore the softness of the original shape Sex.

In addition, it is preferable that the second damper material is formed by laminating the plate-shaped second damper materials having the upper surface and the lower surface of the plurality of sheets in the vertical direction, and the lower side adjacent to each other in the stacking direction. The upper surface of the plate-shaped second damper material and the lower surface of the plate-shaped second damper material on the upper side have a flat shape, respectively, and the plate-shaped second damper which is adjacent to the lower side in the stacking direction The upper surface of the material is in contact with the lower surface of the upper plate-shaped second shock absorbing material on the upper side so as to be slidable.

Moreover, it is preferable that the upper surface of the second damper material has an upper protruding portion that protrudes upward, and the upper protruding portion abuts against the second surface so as to be slidable relative to a lower surface of the second rigid body. The lower surface of the rigid body.

Further, preferably, the lower surface of the second damper material has a lower protruding portion that protrudes downward, and the lower protruding portion abuts the packing box so as to be slidable relative to an inner surface of the packing box Inside.

Further, it is preferable that the side surface of the second damper in the direction orthogonal to the vertical direction always abuts against the inner surface of the packing box.

Further, it is preferable that the side surface of the first damper in the direction orthogonal to the vertical direction always abuts against the inner surface of the packing box.

Moreover, it is preferable that the upper shock absorbing material is placed on the upper portion of the upper cushioning material in the packing box, and the upper shock absorbing material has the substrate storage container in which the semiconductor wafer is housed. The upper shock absorbing material is placed on the upper portion to be elastically deformed, and the substrate storage container placed thereon is removed to restore the original shape. The softness of nature.

According to the present invention, it is possible to provide a packaging structure for packaging a substrate storage container, and it is possible to strongly suppress the transmission of impact and vibration to a plurality of substrates accommodated in the substrate storage container when the substrate storage container is transported.

1, 1A‧‧‧Package structure for packing substrate storage containers

2‧‧‧Substrate storage container

10‧‧‧ bundled boxes

11‧‧‧1st side panel

12‧‧‧2nd side panel

13‧‧‧front board

14‧‧‧ Backplane

15‧‧‧ top board

16‧‧‧floor

20‧‧‧Upper shock absorber

21, 31, 51, 62, 71, 811, 821, 831 ‧ ‧ upper surface

22, 42, 52, 63, 72, 812, 822, 832‧‧‧ lower surface

23, 33, 34, 43, 44, 53, 64, 73, 813, 823, 833 ‧ ‧ side

30‧‧‧Upper cushioning material

32‧‧‧ lower

40‧‧‧Lower cushioning material

41‧‧‧ upper

50‧‧‧1st rigid body

60‧‧‧1st damping material

61‧‧‧ plate-shaped first shock absorber

70‧‧‧2nd rigid body

80‧‧‧2nd damping material

81‧‧‧Upper plate-shaped second shock absorber

82‧‧‧ plate-shaped second shock absorbing material

83‧‧‧ Lower side plate-shaped second shock absorbing material

110‧‧‧Cylinder

151‧‧‧front board

152‧‧‧ rear panel

153‧‧‧left board

154‧‧‧right board

202‧‧‧Container body

203‧‧‧ cover

205‧‧‧Substrate support plate

220‧‧‧ wall

221‧‧‧ container body opening

227‧‧‧Substrate storage space

321, 411‧‧ ‧ recess

331, 341, 421, 431, 441‧‧ ‧ convex

814‧‧‧Upper protrusion

834‧‧‧ under the protrusion

D1‧‧‧ direction

D11‧‧‧ Forward direction

D12‧‧‧post direction

D2‧‧‧Up and down direction

D21‧‧‧Up direction

D22‧‧‧down direction

D3‧‧‧ direction

D31‧‧‧Left direction

D32‧‧‧Right direction

W‧‧‧Substrate

Fig. 1 is an exploded perspective view showing a packing structure 1 for a package substrate storage container according to the first embodiment of the present invention.

Fig. 2 is a perspective view showing the packing box 10 of the packing structure 1 for packaging the substrate storage container according to the first embodiment of the present invention.

Fig. 3 is a plan view showing the packing box 10 of the packing structure 1 for packaging the substrate storage container according to the first embodiment of the present invention.

Fig. 4 is a cross-sectional view taken along line A-A of Fig. 3.

Fig. 5 is a cross-sectional view taken along line B-B of Fig. 3.

Fig. 6 is an exploded perspective view showing the substrate storage container 2 in which the packaging structure 1 for packaging the substrate storage container according to the first embodiment of the present invention is packaged.

Fig. 7 is an exploded perspective view showing a packing structure 1A for packaging a substrate storage container according to a second embodiment of the present invention.

Fig. 8 is a plan view showing the packing box 10 of the packing structure 1A for packaging the substrate storage container according to the second embodiment of the present invention.

Fig. 9 is a cross-sectional view taken along line C-C of Fig. 8.

Fig. 10 is a cross-sectional view taken along line D-D of Fig. 8.

[Formation of the Invention]

In the following, the package structure 1 for packaging the substrate storage container according to the first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is an exploded perspective view showing a packing structure 1 for a package substrate storage container according to the first embodiment of the present invention. Fig. 2 is a perspective view showing the packing box 10 of the packing structure 1 for packaging the substrate storage container according to the first embodiment of the present invention. Fig. 3 is a plan view showing the packing box 10 of the packing structure 1 for packaging the substrate storage container according to the first embodiment of the present invention. Fig. 4 is a cross-sectional view taken along line A-A of Fig. 3. Fig. 5 is a cross-sectional view taken along line B-B of Fig. 3. Fig. 6 is an exploded perspective view showing the substrate storage container 2 in which the packaging structure 1 for packaging the substrate storage container according to the first embodiment of the present invention is packaged.

Here, for convenience of explanation, the direction from the back plate 14 of the packing box 10 to be described later toward the front plate 13 (the lower left direction in the first drawing) is defined as the front direction D11, and the opposite direction of the direction is defined as The rear direction D12 defines the two directions as the front-rear direction D1. Further, the direction from the bottom plate 16 to be described later to the top plate 15 (upward direction in the first drawing) is defined as the upper direction D21, the opposite direction of the direction is defined as the downward direction D22, and the two directions are defined as the up and down direction D2. . Further, the direction from the second side plate 12 to be described later to the first side plate 11 (the upper left direction in the first drawing) is defined as the left direction D31, and the opposite direction of the direction is defined as the right direction D32, and the two directions are defined. It is the left and right direction D3.

As shown in FIG. 6, the substrate storage container 2 which is bundled by the packaging structure 1 for packaging the substrate storage container has the container main body 202. And a cover 203.

The container body 202 has a cylindrical wall portion 220 in which the container body opening portion 221 is formed at one end portion and the other end portion is closed. A substrate storage space 227 is formed in the container body 202. The substrate housing space 227 is surrounded by the wall portion 220. A substrate supporting plate portion 205 and a rear retainer (not shown) are disposed in a portion of the wall portion 220 where the substrate housing space 227 is formed. A plurality of substrates W can be housed in the substrate housing space 227.

The substrate supporting plate-like portion 205 is provided in the substrate housing space 227 in a paired manner on the wall portion 220. When the container main body opening portion 221 is not closed by the lid body 203, the substrate supporting plate portion 205 can support the edge portions of the plurality of sheet substrates W in a state in which the adjacent substrates W are arranged in parallel with each other at a predetermined interval. When the container body opening portion 221 is closed by the lid body 203, a rear bracket (not shown) can support the rear portion of the edge portion of the plurality of sheet substrates W.

The lid body 203 can be detachably attached to the container body opening portion 221, and the container body opening portion 221 can be closed. A front retainer (not shown) is attached to the lid body 203. The front bracket (not shown) is a part of the lid body 203 and is a portion facing the substrate accommodation space 227 when the container body opening portion 221 is closed by the lid body 203. The front bracket (not shown) is disposed in pair with the rear bracket (not shown).

When the container body opening portion 221 is closed by the lid body 203, the front bracket (not shown) can support the front portion of the edge portion of the plurality of sheet substrates W. When the container body opening portion 221 is closed by the lid body 203, the front bracket (not shown) cooperates with the rear bracket (not shown) to support the plurality of substrates W, Thus, the plurality of substrates W are supported in a state in which the adjacent substrates W are arranged in parallel with each other at a predetermined interval.

The substrate W (see FIG. 6) accommodated in the substrate storage container 2 is a thin substrate which is used in the industry, such as a disk-shaped silicon wafer, a glass wafer, and a sapphire wafer. The substrate W of the present embodiment is a tantalum wafer having a diameter of 300 mm (millimeter; mm) to 450 mm.

As shown in Fig. 1, the packaging structure 1 for packaging the substrate storage container 2 includes a packing box 10, an upper shock absorbing material 20, an upper cushioning material 30, a lower cushioning material 40, and a first rigid body 50. The first shock absorbing material 60, the second rigid body 70, and the second shock absorbing material 80. The packaging structure 1 for packaging the substrate storage container 2 is used for housing and transporting the substrate W composed of a semiconductor wafer, and the substrate storage container 2 is bundled.

As shown in FIGS. 1 and 2, the packing box 10 is composed of a so-called corrugated plastic box, and has a first side plate 11, a second side plate 12, a front plate 13, and a back plate 14. The top plate 15 and the bottom plate 16. The first side plate 11 and the second side plate 12 have a parallel positional relationship. The front plate 13 and the back plate 14 have a parallel positional relationship. The top plate 15 and the bottom plate 16 have a parallel positional relationship. The first side plate 11, the second side plate 12, the front plate 13, and the back plate 14 each have a rectangular shape. The first side plate 11, the second side plate 12, the front plate 13, and the back plate 14 constitute a quadrangular columnar tubular body 110 having an opening formed at the upper end and the lower end.

The top plate 15 includes a front plate 151, a rear plate 152, a left plate 153, and a right plate 154 each having a rectangular shape (see FIG. 2). The front plate 151 is integrally connected to the upper side of the front plate 13. Rear plate 152 is a The body is connected to the upper side of the backboard 14. The left side plate 153 is integrally connected to the upper side of the first side plate 11. The right side plate 154 is integrally connected to the upper side of the second side plate 12.

The front plate 151 and the rear plate 152 are formed in a positional relationship (formed in a horizontal positional relationship) orthogonal to the front plate 13 and the back plate 14, and the upper end opening of the cylindrical body 110 is partially closed. Further, the left side plate 153 and the right side plate 154 are formed in a positional relationship (formed in a horizontal positional relationship) orthogonal to the first side plate 11 and the second side plate 12, and the upper end of the cylindrical body 110 is formed. The opening is completely closed. Since the bottom plate 16 has the same configuration as the top plate 15, the description of the bottom plate 16 is omitted.

The upper shock absorbing material 20 is elastically deformed when the substrate storage container 2 in which the substrate W is housed is placed directly on the upper shock absorbing material 20, and the substrate storage container 2 that has been removed is restored to its original shape. It is composed of a material having flexibility of elastic properties, and is composed of sponge in the present embodiment. The upper shock absorbing material 20 has a rectangular plate shape which is defined by the inner surface of the cylindrical body 110 in a cross section of the cylindrical body 110 which is cut in a direction parallel to the left-right direction D3 and the front-rear direction D1. The rectangular shape is uniform. The upper shock absorbing material 20 has a rectangular upper surface 21 and a lower surface 22 which are parallel to the positional relationship between the left-right direction D3 and the front-rear direction D1, and are placed in the uppermost portion of the packing box 10 and placed on the upper portion of the upper cushioning material 30. . The entire surface of the side surface 23 of the upper shock absorbing material 20 having a positional relationship parallel to the vertical direction D2 always abuts against the inner surface of the cylindrical body 110. The side surface 23 of the upper shock absorbing material 20 is not bonded to the inner surface of the cylindrical body 110, and can slide with respect to the inner surface of the cylindrical body 110.

The upper cushioning material 30 has a substrate W even if it is accommodated. When the substrate storage container 2 is directly placed on the upper cushioning material 30, plastic deformation does not occur, and the hardness of the shape of the upper cushioning material 30 itself can be maintained. Specifically, the upper cushioning material 30 can hold the position and the mounting posture of the substrate storage container 2 in the direction orthogonal to the vertical direction D2 in the packing box 10, and can be applied to the packing box 10 again. The upper cushioning material 30 is configured to transmit a soft material that is absorbed by at least a part of the impact of the substrate storage container 2 to be absorbed. Therefore, the upper cushioning material 30 is plastically deformed when it is subjected to a strong impact than a predetermined impact, and the shape cannot be restored, but can be absorbed against a weaker impact than a predetermined impact, and hardly under the impact of this degree. Deformation. The upper cushioning material 30 is harder than the upper shock absorbing material 20, the first shock absorbing material 60, and the second shock absorbing material 80, and is softer than the first rigid body 50 and the second rigid body 70. In the present embodiment, the upper cushioning material 30 is made of styrene foam.

The upper cushioning material 30 has a substantially rectangular parallelepiped shape. The upper surface 31 of the upper cushioning material 30 is composed of a flat surface. Three convex portions 331 are provided on the front and rear side faces 33 of the upper cushioning material 30, and four rectangular parallelepiped convex portions 341 are provided on the left and right side faces 34 of the upper cushioning material 30. The lower portion 32 of the upper cushioning material 30 has a concave portion 321 . The concave portion 321 has a shape slightly the same as that of the lid body 203 of the substrate storage container 2, and the lid portion 203 is engaged with the concave portion 321 .

The upper cushioning material 30 is formed such that the upper surface 31 is parallel to the positional relationship between the left-right direction D3 and the front-rear direction D1 so that the upper surface 31 of the upper cushioning material 30 abuts against the lower surface 22 of the upper shock absorbing material 20 in the packing box. The inside of 10 is placed on the upper portion of the substrate storage container 2. The lower surface 22 of the upper shock absorbing material 20 is not bonded to the upper surface 31 of the upper cushioning material 30, and the upper portion is reduced. The lower surface 22 of the seismic material 20 is slidable relative to the upper surface 31 of the upper cushioning material 30. Further, the front end faces of the convex portions 331 and 341 of the upper cushioning material 30 are always in contact with the inner surface of the tubular body 110 in the packing box 10. The front end faces of the convex portions 331 and 341 are not bonded to the inner surface of the tubular body 110, and can slide with respect to the inner surface of the tubular body 110.

The lower cushioning material 40 has a hardness that does not cause plastic deformation even when the substrate storage container 2 in which the substrate W is accommodated is directly placed on the lower cushioning material 40, and the shape of the lower cushioning material 40 itself can be maintained. Specifically, the lower cushioning material 40 can hold the position and the mounting posture of the substrate storage container 2 in the direction orthogonal to the vertical direction D2 in the packing box 10, and can be applied to the packing box 10 again. The lower cushioning material 40 is configured to transmit a soft material that is absorbed by at least a part of the impact of the substrate storage container 2 to be absorbed. In the present embodiment, the lower cushioning material 40 is composed of the same styrene foam as the upper cushioning material 30.

The lower cushioning material 40 has a substantially rectangular parallelepiped shape. The upper portion 41 of the lower cushioning material 40 has a concave portion 411. The concave portion 411 has a lower portion of the substrate storage container 2 when the lid body 203 of the substrate storage container 2 is disposed on the upper side (the bottom portion of the wall portion 220 facing the container body opening portion 221 in the substrate storage container 2) The same shape is used to engage the lower portion in the recess 411. In other words, the lower cushioning material 40 is placed in the packing case 10 so that the upper cushioning material 30 and the lower cushioning material 40 sandwich the substrate storage container 2 in the vertical direction D2. Three convex portions 431 are provided on the front and rear side faces 43 of the lower cushioning material 40, and four rectangular parallelepiped convex portions 441 are provided on the left and right side faces 44 of the lower cushioning material 40. The lower surface 42 of the lower cushioning material 40 has 3 in the left-right direction D3. A total of nine lower convex portions 421 are provided in a row and three rows in the front-rear direction D1.

The lower cushioning material 40 is in a positional relationship parallel to the left-right direction D3 and the front-rear direction D1 so that the front end surface of the lower convex portion 421 of the lower cushioning material 40 abuts against the upper surface 51 of the first rigid body 50, and is bundled. The inside of the package 10 is disposed below the substrate storage container 2. The front end surface of the lower convex portion 421 which is the lower end surface of the lower cushioning material 40 is not bonded to the upper surface 51 of the first rigid body 50, and can slide with respect to the upper surface 51 of the first rigid body 50. The front end faces of the convex portions 431 and 441 of the lower cushioning material 40 are always in contact with the inner surface of the tubular body 110 in the packing box 10. The front end faces of the convex portions 431 and 441 are not bonded to the inner surface of the tubular body 110, and can slide with respect to the inner surface of the tubular body 110.

The first rigid body 50 is made of a material that can maintain the shape of the first rigid body 50 itself so that the entire lower surface 52 of the first rigid body 50 can abut against the hardness of the upper surface 62 of the first damper 60. In the present embodiment, the first rigid body 50 is composed of a corrugated board or a plastic sheet. In other words, the first rigid body 50 can absorb vibration and impact by itself, and is made of a hard material capable of maintaining its own shape. Therefore, the first rigid body 50 is harder than the upper shock absorbing material 20, the upper cushioning material 30, the lower cushioning material 40, the first shock absorbing material 60, and the second shock absorbing material 80. The first rigid body 50 has a rectangular plate shape which is defined by the inner surface of the cylindrical body 110 in a cross section of the cylindrical body 110 which is cut in a direction parallel to the left-right direction D3 and the front-rear direction D1. The rectangular shape is uniform.

The first rigid body 50 has a flat upper surface 51 and a lower surface 52, respectively, and the upper surface 51 and the lower surface 52 are parallel to the left and right direction D3. The positional relationship between the front and rear direction D1 is disposed below the lower cushioning material 40 in the packing box 10. The entire surface of the side surface 53 of the first rigid body 50 having a positional relationship parallel to the vertical direction D2 always abuts against the inner surface of the cylindrical body 110. The side surface 53 of the first rigid body 50 is not bonded to the inner surface of the tubular body 110, and can slide with respect to the inner surface of the tubular body 110. The area of the upper surface 51 of the first rigid body 50 is larger than the total area of the front end surface of the lower convex portion 421 which is the lower end surface of the lower cushioning material 40, and the front end surface of all the lower convex portions 421 abuts against the first rigid body 50. Upper surface 51.

When the substrate storage container 2 in which the substrate W is housed is placed directly on the first damper 60, the first damper material 60 is elastically deformed, and the substrate storage container 2 that has been removed is restored. The softness of the elastic nature of the shape. In the present embodiment, the first damper 60 is made of the same sponge as the upper damper 20.

More specifically, the first damper material 60 is formed by laminating five rectangular plate-shaped first dampers 61 each having a flat upper surface 62 and a lower surface 63 and having a flat upper surface 62 and a lower surface 63 in the vertical direction D2. . The plate-shaped first damper material 61 is disposed in the packing case 10 below the first rigid body 50 in a positional relationship in which the upper surface 62 and the lower surface 63 are parallel to the horizontal direction D3 and the front-rear direction D1. The side surface 64 of the plate-shaped first damper material 61 having a positional relationship parallel to the vertical direction D2 always abuts against the inner surface of the cylindrical body 110.

In addition, the upper surface 62 of the plate-shaped first damper 61 that is adjacent to the lower side in the vertical direction D2 as the stacking direction and the lower surface 63 of the plate-shaped first damper 61 that is the upper side are respectively Abut. The upper surface 62 of the plate-shaped first damper material that is adjacent to the lower side in the stacking direction and the lower surface 63 of the plate-shaped first damper material that is the upper side are not bonded, and the like. Phase sliding. The upper surface 62 of the uppermost plate-shaped first damper 61 is not bonded to the lower surface 52 of the first rigid body 50, but is in contact with the surface and is slidable. Therefore, the upper surface 62 of the first damper 60 is in contact with the lower surface 52 of the first rigid body 50 so as to be slidable relative to the lower surface 52 of the first rigid body 50.

The second rigid body 70 has a hardness capable of maintaining the shape of the second rigid body 70 itself so that the lower surface 63 of the plate-shaped first damper 61 that can contact the lowermost layer of the entire upper surface 71 of the second rigid body 70 can be maintained. In the present embodiment, the second rigid body 70 is made of the same corrugated plate or plastic plate as the first rigid body 50. The second rigid body 70 has a rectangular plate shape which is defined by the inner surface of the tubular body 110 in a cross section of the tubular body 110 when it is cut in a plane parallel to the left-right direction D3 and the front-rear direction D1. The rectangular shape is uniform.

The second rigid body 70 has a flat upper surface 71 and a lower surface 72, and the upper surface 71 and the lower surface 72 are parallel to the horizontal direction D3 and the front-rear direction D1, and are disposed in the lowermost layer in the packing box 10. Below the plate-shaped first damper 61. The side surface 73 of the second rigid body 70 having a positional relationship parallel to the vertical direction D2 always abuts against the inner surface of the cylindrical body 110. The side surface 73 of the second rigid body 70 is not bonded to the inner surface of the tubular body 110, and can slide with respect to the inner surface of the cylindrical body 110.

The upper surface 71 of the second rigid body 70 is not bonded to the lower surface 63 of the lowermost plate-shaped first damper, and is slidably surface-contacted. The area of the lower surface 72 of the second rigid body 70 is larger than the area of the abutting surface of the lower surface 72 of the second rigid body 70 that the upper protruding portion 814 of the upper surface 811 of the second damping material 80 to be described later abuts. All the abutting faces are not the second The lower surface 72 of the rigid body 70 is bonded to the surface 72 so as to be slidable.

When the substrate storage container 2 in which the substrate W is accommodated is placed directly on the second shock absorbing material 80, the second damper material 80 is elastically deformed, and the substrate storage container 2 that has been placed is removed. The softness of the elastic nature of the shape. In the present embodiment, the second damper 80 is made of the same sponge as the first damper 60.

The second damper material 80 is formed by laminating the plate-shaped second dampers 81, 82, and 83 having the upper surfaces 811, 821, and 831 and the lower surfaces 812, 822, and 832 in the vertical direction D2. The upper surfaces 821 and 831 of the plate-shaped second dampers 82 and 83 which are adjacent to each other in the vertical direction D2 which is the stacking direction, and the lower surface 812 of the plate-shaped second dampers 81 and 82 which are the upper side. The 822 system has a flat shape. The upper surfaces 821 and 831 of the plate-shaped second damper materials 82 and 83 that are adjacent to each other in the stacking direction are not bonded to the lower surfaces 812 and 822 of the upper plate-shaped second damper material, respectively. Abuts in a slidable manner.

More specifically, the second damper material 80 has an upper plate-shaped second damper material 81 each made of sponge, a plate-shaped second damper material 82, and a lower plate-shaped second damper material 83.

The upper plate-shaped second damper material 81 has a rectangular plate shape having an upper surface 811 and a flat lower surface 812, wherein the upper surface 811 has a plurality of upper protrusions 814. The upper protruding portion 814 protrudes upward. The upper protruding portion 814 is not bonded to the lower surface 72 of the second rigid body 70, and is slidably abutted against the lower surface 72 of the second rigid body 70.

The upper plate-shaped second damper material 81 is disposed below the second rigid body 70 in the packing box 10 in a positional relationship in which the lower surface 812 is parallel to the horizontal direction D3 and the front-rear direction D1. The side surface 813 of the upper plate-shaped second damper material 81 having a positional relationship parallel to the vertical direction D2 always contacts the inner surface of the tubular body 110.

The plate-shaped second damper 82 has a rectangular plate shape having a flat upper surface 821 and a lower surface 822. The upper surface 821 of the plate-shaped second damper material 82 is not affixed to the lower surface 812 of the upper plate-shaped second damper material 81, and is slidably abutted against the upper plate-shaped second damper material 81. Surface 812.

The plate-shaped second damper material 82 is disposed such that the upper surface 821 and the lower surface 822 are parallel to the positional relationship between the left and right direction D3 and the front-rear direction D1, and are disposed below the upper plate-shaped second damper 81 in the packing box 10. The side surface 823 of the plate-shaped second damper material 82 having a positional relationship parallel to the vertical direction D2 always contacts the inner surface of the cylindrical body 110.

The lower plate-shaped second damper material 83 has a rectangular plate shape having a flat upper surface 831 and a lower surface 832, and the lower surface 832 has a plurality of lower protrusions 834. The upper surface 831 of the second plate-shaped second damper material 83 is not bonded to the lower surface 822 of the plate-shaped second damper 82, and is slidably abutted against the lower surface of the plate-shaped second damper 82. 822. The lower protruding portion 834 protrudes downward. The lower protruding portion 834 is not bonded to the inner surface of the bottom plate 16 of the packing box 10, and is slidably abutted against the inner surface of the bottom plate 16 of the packing box 10.

The lower plate-shaped second damper material 83 is a positional relationship in which the surface 831 is parallel to the horizontal direction D3 and the front-rear direction D1, and is disposed in the packing box 10. It is placed below the plate-shaped second damper 82. The side surface 833 of the lower plate-shaped second damper material 83 having a positional relationship parallel to the vertical direction D2 always contacts the inner surface of the tubular body 110.

According to the packing structure 1 for packaging the substrate storage container 2 according to the first embodiment of the above configuration, the following effects can be obtained.

As described above, the packing structure 1 for the package substrate storage container 2 includes the upper cushioning material 30, which is disposed in the upper portion of the substrate storage container 2 in the packing box 10, and the lower cushioning material 40, which is placed thereon. The substrate storage container 2 is placed in the packing box 10 such that the upper cushioning material 30 and the lower cushioning material 40 sandwich the substrate storage container 2 in the vertical direction D2. According to this configuration, the mounting posture and position of the substrate storage container 2 can be stably held in the predetermined mounting posture and position in the packing box 10.

In addition, the packing structure 1 for packaging the substrate storage container 2 includes a first rigid body 50 having a plate shape, and is disposed in the packing box 10, and has a flat upper surface 51 and a lower surface 52, respectively. The upper surface 51 of the first rigid body 50 abuts against the lower end surface of the lower convex portion 421 of the lower cushioning material 40, and the first shock absorbing material 60 is disposed in the packing box 10, and has an upper surface 62 and a lower surface. The upper surface 62 of the first damper 60 is in contact with the lower surface 52 of the first rigid body 50 so as to be slidable relative to the lower surface 52 of the first rigid body 50.

In the upper cushioning material 30 and the lower cushioning material 40, even if the substrate storage container 2 in which the substrate W is accommodated is directly placed on the upper cushioning material 30 or the lower cushioning material 40, plastic deformation does not occur, and the upper cushioning material 30 and the lower portion can be maintained. The hardness of the shape of the cushioning material 40 itself can maintain the substrate storage container 2 in the direction perpendicular to the vertical direction D2 in the packing box 10. The position and the mounting posture have flexibility to absorb at least a part of the impact that is applied to the packing box 10 and then transmitted to the substrate storage container 2 via the upper cushioning material 30 and the lower cushioning material 40.

Further, the upper surface 51 of the first rigid body 50 is larger than the lower end surface of the lower cushioning material 40, and the first rigid body 50 has a shape capable of maintaining the first rigid body 50 itself so that the entire lower surface of the first rigid body 50 can be provided. The 52 surface abuts against the hardness of the upper surface 62 of the first shock absorbing material 60. In addition, the first damper material 60 has elastic deformation when the substrate storage container 2 in which the substrate W is accommodated is directly placed on the first damper 60, and the substrate storage container 2 that has been removed is restored. The softness of the elastic properties of the original shape.

According to the above configuration, the upper surface 51 of the first rigid body 50 is larger than the lower end surface of the lower convex portion 421 of the lower cushioning material 40, and only a part of the upper surface 51 of the first rigid body 50 is configured to abut the lower portion. The entire lower surface of the lower convex portion 421 of the cushioning material 40 can abut against the upper surface 62 of the first damper 60 with the large surface of the lower surface 52 of the first rigid body 50. Therefore, the lower cushioning material 40 can be supported by the entire upper surface 62 of the first shock absorbing material 60 via the first rigid body 50. In this way, the impact can be dispersed by the entire upper surface 51 of the first rigid body 50 and the entire lower surface 52, and the impact and vibration applied to the packing box 10 can be absorbed by the first large damper 60 of a large area. The impact and vibration are transmitted to the lower cushioning material 40 as much as possible.

In addition, the first damper 60 is provided, and the upper surface 62 of the first damper 60 is in contact with the lower surface 52 of the first rigid body 50 so as to be slidable relative to the lower surface 52 of the first rigid body 50. Therefore, by sliding the upper surface 62 of the first damper 60 with respect to the lower surface 52 of the first rigid body 50, it is possible to absorb the vibration of the predetermined frequency applied to the packing box 10, and It is possible to suppress the vibration of the substrate W with respect to the front bracket and the rear bracket as much as possible in the substrate storage container 2. As a result, the substrate W can be suppressed as much as possible before the substrate W and the rear holder are scraped, so that the substrate W is contaminated in the substrate storage container 2.

In addition, the first damper 60 is formed by laminating a plurality of plate-shaped first dampers 61 each having a flat upper surface 62 and a lower surface 63 in the vertical direction D2, and is adjacent to each other in the stacking direction. The upper surface 62 of the plate-shaped first damper 61 on the side is slidably contacted with the lower surface 63 of the upper plate-shaped first damper 61. Therefore, it is possible to effectively absorb the upper surface 62 of the plate-shaped first damper 61 that is adjacent to the lower side in the stacking direction and the lower surface 63 of the plate-shaped first damper 61 that is the upper side. A shock applied to the predetermined frequency of the bale case 10. Further, a plurality of plate-shaped first dampers 61 can be used in reverse. In addition, when any of the plurality of plate-shaped first dampers 61 is damaged or the like, it is possible to replace only the plate-shaped first damper 61 in which the damage or the like occurs.

Further, the second rigid body 70 having a plate shape is disposed in the packing box 10, and has a flat upper surface 71 and a lower surface 72, respectively, and the upper surface 71 of the second rigid body 70 is slidable. The surface of the second rigid body 70 is capable of maintaining the shape of the second rigid body 70 so as to be able to abut against the entire upper surface 71 of the second rigid body 70 so as to be in contact with the lower surface 63 of the lowermost plate-shaped first damper 61. The hardness of the lower surface 63 of the plate-shaped first damper 61 of the lowermost layer is connected. Therefore, it is possible to reinforce the strength of the bottom plate 16 divided into two halves in the same manner as the top plate 15, and to disperse the impact in the upward direction D21 in the drawing, thereby improving the cushioning effect of the damper.

Further, the second damper 80 is provided in the packing box 10 The upper surface 811 and the lower surface 832 are provided, and the upper surface 811 of the second shock absorbing material 80 abuts against the lower surface 72 of the second rigid body 70 so as to be slidable relative to the lower surface 72 of the second rigid body 70. In the second damper material 80, when the substrate storage container 2 in which the substrate W is accommodated is placed directly on the second damper material 80, the substrate storage container 2 is elastically deformed, and the substrate storage container 2 that has been placed is removed. The softness of the original elastic properties of the shape.

Therefore, by sliding the upper surface 811 of the second shock absorbing material 80 with respect to the lower surface 72 of the second rigid body 70, it is possible to effectively absorb the vibration of the predetermined frequency applied to the packing box 10. Further, the second shock absorbing material 80 can effectively absorb the impact applied to the packing box 10.

In addition, the second damper material 80 is formed by laminating the plate-shaped second dampers 81, 82, and 83 having the upper surfaces 811, 821, and 831 and the lower surfaces 812, 822, and 832 in the vertical direction D2. The upper surfaces of the plate-shaped second dampers 82 and 83 which are adjacent to each other in the stacking direction and the lower surfaces 812 and 822 of the plate-shaped second dampers 81 and 82 which are the upper sides have flat shapes, respectively. The upper surfaces 821 and 831 of the plate-shaped second damper materials 82 and 83 that are adjacent to each other in the stacking direction are the lower surfaces 812 and 822 of the upper plate-shaped second dampers 81 and 82. The surface that can slide is abutted.

Therefore, the upper surfaces 821 and 831 of the plate-shaped second damper materials 82 and 83 which are adjacent to each other in the stacking direction, and the lower surface 812 of the plate-shaped second damper materials 81 and 82 which are the upper side, The 822 is slid, and the vibration applied to the predetermined frequency of the packing box 10 can be effectively absorbed. Further, a plurality of plate-shaped second shock absorbing materials 81, 82, and 83 can be used in reverse. In addition, when any of the plurality of plate-shaped second damper materials 81, 82, and 83 is damaged or the like, it is possible to replace only the plate-shaped second damper material in the case where damage or the like occurs.

Further, the upper surface 811 of the second damper member 80 has an upper protruding portion 814 that protrudes upward, and the upper protruding portion 814 abuts against the second rigid body so as to be slidable relative to the lower surface 72 of the second rigid body 70. The lower surface 72 of 70. By the upper protruding portion 814 sliding relative to the lower surface 72 of the second rigid body 70, it is possible to effectively absorb the shock of a predetermined frequency applied to the packing box 10. Further, since the upper protruding portion 814 is partially crushed by the lower surface 72 of the second rigid body 70, the impact applied to the packing box 10 can be effectively absorbed.

Further, the lower surface 832 of the second damper member 80 has a lower protruding portion 834 that protrudes downward, and the lower protruding portion 834 abuts against the packing box so as to be slidable relative to the inner surface of the bottom plate 16 of the packing box 10. The inner surface of the bottom plate 16 of 10. By the lower projection 834 sliding relative to the inner surface of the bottom plate 16 of the packing box 10, it is possible to effectively absorb the vibration of the predetermined frequency applied to the packing box 10. Further, the lower protruding portion 834 abuts against the inner surface of the bottom plate 16 of the packing box 10 and is partially crushed, whereby the impact applied to the packing box 10 can be effectively absorbed.

Further, the side faces 813, 823, and 833 of the second damper 80 in the direction orthogonal to the vertical direction D2 always abut against the inner surface of the packing box 10. Therefore, by sliding the side surfaces 813, 823, and 833 of the second damper 80 on the inner surface of the packing box 10, it is possible to effectively absorb the vibration of the predetermined frequency applied to the packing box 10.

Further, the side surface 64 of the first damper material 60 in the direction orthogonal to the vertical direction D2 always abuts against the inner surface of the packing box 10. Therefore, by sliding the side surface 64 of the first damper material 60 on the inner surface of the packing box 10, it is possible to effectively absorb the vibration of the predetermined frequency applied to the packing box 10.

Further, the upper shock absorbing material 20 is placed on the upper surface 31 of the upper cushioning material 30 in the packing box 10, and the upper shock absorbing material 20 has the substrate storage container 2 in which the substrate W is housed. The portion of the shock absorbing material 20 is elastically deformed, and the substrate storage container 2 placed thereon is removed to restore the flexibility of the original shape. Therefore, it is possible to absorb the impact and vibration of a predetermined frequency applied to the upper portion of the packing box 10.

In the following, the package structure 1A for packaging the substrate storage container 2 according to the second embodiment of the present invention will be described. Fig. 7 is an exploded perspective view showing the packing structure 1A for binding the substrate storage container 2 according to the second embodiment of the present invention. Fig. 8 is a plan view showing the packing box 10 of the packing structure 1A for packaging the substrate storage container according to the second embodiment of the present invention. Fig. 9 is a cross-sectional view taken along line C-C of Fig. 8. Fig. 10 is a cross-sectional view taken along line D-D of Fig. 8.

In the second embodiment, the second damper 80 is formed of three plate-shaped second dampers 82 having flat upper surfaces 821 and lower surfaces 822 in the vertical direction. D2 is laminated to form. Further, the first embodiment is different from the first embodiment in that the upper shock absorbing material 20 is not provided. The rest of the configuration is the same as that of the first embodiment, and the same components are denoted by the same reference numerals, and their description is omitted.

The upper surface 821 of the uppermost plate-shaped second damper material 82 among the three plate-shaped second damper materials 82 is not affixed to the lower surface 72 of the second rigid body 70, and is slidably slidable. The lower surface 72 of the second rigid body 70 is connected to the upper surface 821 of the plate-shaped second damper 82 of the intermediate layer among the three plate-shaped second dampers 82, and the second plate of the uppermost layer is not reduced. The lower surface 822 of the seismic material 82 is bonded or the like to slidably contact the uppermost plate. The lower surface 822 of the second damper material 82. The lower surface 822 of the plate-shaped second damper material 82 of the intermediate layer among the three plate-shaped second damper materials 82 is not the plate shape of the lowermost layer. The upper surface 821 of the damper material 82 is slidably contacted, and slidably contacts the upper surface 821 of the lowermost plate-shaped second damper 82. The lowermost layer among the three plate-shaped second dampers 82 The lower surface 822 of the plate-shaped second damper material 82 is not bonded to the inner surface of the bottom plate 16 of the packing box 10, and is slidably abutted against the inner surface of the bottom plate 16 of the packing box 10.

Each of the plate-shaped second damper materials 82 has a positional relationship in which the upper surface 821 and the lower surface 822 are parallel to the horizontal direction D3 and the front-rear direction D1, and is disposed below the second rigid body 70 in the packing box 10. The side surface 823 of the plate-shaped second damper material 82 having a positional relationship parallel to the vertical direction D2 always contacts the inner surface of the cylindrical body 110.

According to the packing structure 1A for binding the substrate storage container 2 of the second embodiment of the above configuration, the following effects can be obtained.

The second damper material 80 is configured by laminating three plate-shaped second dampers 82 each having a flat upper surface 821 and a lower surface 822 in the vertical direction D2. Therefore, the upper surface 821 of the uppermost plate-shaped second damper material 82 can slide with respect to the lower surface 72 of the second rigid body 70 with a larger area, and can effectively absorb the predetermined frequency applied to the packing box 10. shock. Further, the lower surface 822 of the lowermost plate-shaped second shock absorbing material 82 can slide with respect to the inner surface of the bottom plate 16 of the packing box 10 with a larger area, and can effectively absorb the predetermined application to the lower portion of the packing box 10. The vibration of the frequency. In other words, in the present embodiment, it is possible to more effectively absorb the vibration of the predetermined frequency applied to the packing box 10 than the packing structure 1 of the first embodiment.

The present invention is not limited to the above embodiments, and can Modifications are made within the technical scope of the patent application. For example, the materials of the upper shock absorbing material 20, the first shock absorbing material 60, the second shock absorbing material 80, the upper cushioning material 30, the lower cushioning material 40, the first rigid body 50, and the second rigid body 70 are not limited thereto. The material of each embodiment. For example, the first rigid body 50 and the second rigid body 70 may be configured by a veneer or a slate.

Further, the packing box 10 is constituted by a so-called plastic corrugated board box in the above, but is not limited thereto. For example, a corrugated cardboard box and an aluminum frame can also be used.

Further, the upper shock absorbing material 20, the first rigid body 50, the second rigid body 70, the first damper 60, and the second damper 80 have side faces 23, 53, 73 which are in a positional relationship parallel to the vertical direction D2. The entire surface of the front surface of the convex portions 331, 341, 431, and 441 of the entire surface of the 64, 813, 823, and 833 and the upper cushioning material 30 and the lower cushioning material 40 always abuts against the inner surface of the cylindrical body 110 in the above-described manner. Is not limited by this.

For example, a part of the side surface may always abut against the inner surface of the cylindrical body 110, and a part of the side surface may slide on the inner surface of the cylindrical body 110. Alternatively, the entire surface of the side surface and the front end surface may not completely abut against the inner surface of the cylindrical body 110.

In addition, in the above-described first damper material 60, a plurality of rectangular plate-shaped first damaging materials 61 each having a flat upper surface 62 and a lower surface 63 and having a flat upper surface 62 and a lower surface 63 are laminated in the vertical direction D2. Composition, but not limited to this. For example, the number of the plate-shaped first damper members 61 is not limited to the number of sheets in the present embodiment. Further, it may be composed of a single first shock absorbing material made of sponge and having a flat upper surface and a lower surface.

In the same manner, the second damper member 80 is formed by laminating the rectangular plate-shaped second damper members 81, 82, and 83 each having a plurality of sponges in the vertical direction D2. Limited. For example, the number of the plate-shaped second damper materials 82 is not limited to the number of sheets in the present embodiment. Further, it may be composed of a single thick second shock absorbing material made of sponge and having a flat upper surface and a lower surface.

Further, the substrate storage container is not limited to the substrate storage container having the shape of the embodiment.

Claims (8)

A packaging structure for packaging a substrate storage container, which is a packaging structure for packaging and transporting a substrate storage container for a substrate made of a semiconductor wafer, comprising: a packing box; and an upper cushioning material The lower cushioning material is placed on the upper portion of the substrate storage container, and the lower cushioning material is placed on the substrate storage container, and the upper cushioning material and the lower cushioning material are sandwiched in the vertical direction. The first rigid body having a plate shape is disposed in the packing box, and has a flat upper surface and a lower surface, respectively, and the upper surface of the first rigid body is in contact with each other. The lower end surface of the lower cushioning material and the first shock absorbing material are disposed in the packing box, and have an upper surface and a lower surface, and the upper surface of the first damper is permeable to the first rigid body The lower surface sliding surface faces the lower surface of the first rigid body; and the upper cushioning material and the lower cushioning material have the substrate storage container in which the semiconductor wafer is accommodated The upper cushioning material or the lower cushioning material is not plastically deformed, and the hardness of the shape of the upper cushioning material and the lower cushioning material itself can be maintained, and the substrate storage container can be held in the direction perpendicular to the vertical direction in the packing box. a position and a mounting posture, and having at least a portion of an impact that can be transmitted to the substrate storage container by the upper cushioning material and the lower cushioning material to be absorbed The upper surface of the first rigid body is larger than the lower end surface of the lower cushioning material, and the first rigid system has a shape capable of maintaining the first rigid body itself so as to be able to cover the entire lower surface of the first rigid body. Abutting the hardness of the upper surface of the first damper; the first damper material has a substrate storage container in which the semiconductor wafer is accommodated, and the first damper is placed on the substrate. The elastic deformation and the removal of the substrate storage container placed thereon restore the flexibility of the original shape, and the first shock absorbing material has a plate shape having a flat upper surface and a lower surface, respectively. (1) The damper material is stacked in the vertical direction; the upper surface of the plate-shaped first damper material that is adjacent to the lower side in the stacking direction is the lower surface of the plate-shaped first damper material that is the upper side. The slidable surface is in contact with the surface, and the second rigid body having a plate shape is disposed in the packaging box, and has a flat upper surface and a lower surface, respectively, and the upper surface of the second rigid body is slidable Way to face a lower surface of the plate-shaped first damper material of the lowermost layer; and the second rigid system has a plate capable of maintaining the shape of the second rigid body itself so as to be able to abut the lowermost layer with the entire upper surface of the second rigid body The hardness of the lower surface of the first shock absorbing material. The package structure for packaging a substrate storage container according to claim 1, wherein the second shock absorbing material is disposed in the packaging box and has an upper surface a surface of the second damper member that abuts against a lower surface of the second rigid body so as to be slidable relative to a lower surface of the second rigid body, and the second damper material possesses When the substrate storage container in which the semiconductor wafer is accommodated is directly placed on the second shock absorbing material, the substrate storage container is elastically deformed, and the substrate storage container placed thereon is returned to the original shape and the elastic property is restored. Sex. The package structure for packaging a substrate storage container according to claim 2, wherein the second damper material is formed by laminating the plate-shaped second damper material having the upper surface and the lower surface of each of the plurality of sheets in the vertical direction. The upper surface of the plate-shaped second damper material that is adjacent to the lower side in the stacking direction and the lower surface of the plate-shaped second damper material that is the upper side have a flat shape, respectively, and are adjacent in the stacking direction. The upper surface of the plate-shaped second damper material that is connected to the lower side is slidably contacted with the lower surface of the upper plate-shaped second damper material on the upper side. The package structure for packaging a substrate storage container according to claim 2, wherein the upper surface of the second damper has an upper protruding portion that protrudes upward, and the upper protruding portion is responsive to the second The lower surface of the rigid body abuts against the lower surface of the second rigid body. The package structure for packaging a substrate storage container according to claim 2, wherein the lower surface of the second damper has a lower protruding portion that protrudes downward, and the lower protruding portion is detachable from the package The inner surface of the box is slid to abut the inner surface of the aforementioned packing box. a package structure for packaging a substrate storage container according to claim 2, The side surface of the second shock absorbing material in the direction orthogonal to the vertical direction always abuts against the inner surface of the packing box. The package structure for packaging a substrate storage container according to claim 1, wherein the side surface of the first damper in a direction orthogonal to the vertical direction is always in contact with the inner surface of the packing box. The package structure for packaging a substrate storage container according to claim 1, wherein the upper shock absorbing material is placed on the upper portion of the upper cushioning material in the packing box; When the substrate storage container in which the semiconductor wafer is accommodated is placed directly on the upper shock absorbing material, the substrate storage container is elastically deformed, and the substrate storage container placed thereon is removed to restore the flexibility of the original shape.