TWI626322B - 鈦銅箔、延展銅產品、電子設備部件以及自動調焦攝影機模組 - Google Patents
鈦銅箔、延展銅產品、電子設備部件以及自動調焦攝影機模組 Download PDFInfo
- Publication number
- TWI626322B TWI626322B TW106111227A TW106111227A TWI626322B TW I626322 B TWI626322 B TW I626322B TW 106111227 A TW106111227 A TW 106111227A TW 106111227 A TW106111227 A TW 106111227A TW I626322 B TWI626322 B TW I626322B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- titanium copper
- rolling
- titanium
- solder
- Prior art date
Links
- 239000011889 copper foil Substances 0.000 title claims abstract description 65
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 title claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 239000010949 copper Substances 0.000 title claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 13
- 238000005096 rolling process Methods 0.000 claims abstract description 32
- 239000010936 titanium Substances 0.000 claims abstract description 19
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 239000011888 foil Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 41
- 239000000463 material Substances 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 6
- 238000005498 polishing Methods 0.000 description 41
- 238000005097 cold rolling Methods 0.000 description 16
- 239000000126 substance Substances 0.000 description 15
- 230000032683 aging Effects 0.000 description 10
- 238000000227 grinding Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 229910000881 Cu alloy Inorganic materials 0.000 description 6
- 229910017945 Cu—Ti Inorganic materials 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005098 hot rolling Methods 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 238000005554 pickling Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 206010044565 Tremor Diseases 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910018100 Ni-Sn Inorganic materials 0.000 description 2
- 229910018532 Ni—Sn Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
- G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/28—Systems for automatic generation of focusing signals
- G02B7/282—Autofocusing of zoom lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
- G03B13/34—Power focusing
- G03B13/36—Autofocus systems
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Lens Barrels (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016073347A JP6391621B2 (ja) | 2016-03-31 | 2016-03-31 | チタン銅箔、伸銅品、電子機器部品およびオートフォーカスカメラモジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201736610A TW201736610A (zh) | 2017-10-16 |
| TWI626322B true TWI626322B (zh) | 2018-06-11 |
Family
ID=60003791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106111227A TWI626322B (zh) | 2016-03-31 | 2017-03-31 | 鈦銅箔、延展銅產品、電子設備部件以及自動調焦攝影機模組 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6391621B2 (ja) |
| KR (1) | KR101959620B1 (ja) |
| CN (1) | CN107267798B (ja) |
| TW (1) | TWI626322B (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6780187B2 (ja) * | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
| CN209803436U (zh) * | 2018-07-25 | 2019-12-17 | 台湾东电化股份有限公司 | 光学组件驱动机构 |
| JP6650987B1 (ja) | 2018-11-09 | 2020-02-19 | Ｊｘ金属株式会社 | チタン銅箔、伸銅品、電子機器部品及びオートフォーカスカメラモジュール |
| JP6953465B2 (ja) * | 2019-03-27 | 2021-10-27 | Ｊｘ金属株式会社 | チタン銅箔及びチタン銅箔の製造方法 |
| JP6878541B2 (ja) * | 2019-09-25 | 2021-05-26 | Ｊｘ金属株式会社 | ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー |
| JP6907282B2 (ja) * | 2019-09-25 | 2021-07-21 | Ｊｘ金属株式会社 | ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー |
| CN216595693U (zh) * | 2020-12-18 | 2022-05-24 | 台湾东电化股份有限公司 | 光学元件驱动机构 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200806811A (en) * | 2006-06-12 | 2008-02-01 | Nippon Mining & Amp Metals Co Ltd | Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil |
| TW201410886A (zh) * | 2012-07-19 | 2014-03-16 | Jx Nippon Mining & Metals Corp | 高強度鈦銅箔及其製造方法 |
| TW201542047A (zh) * | 2014-03-31 | 2015-11-01 | Jx Nippon Mining & Metals Corp | 附載體之銅箔、印刷配線板、積層體、電子機器及印刷配線板之製造方法 |
| TW201546302A (zh) * | 2013-10-04 | 2015-12-16 | Ｊｘ日鑛日石金屬股份有限公司 | 壓延銅箔、使用其之覆銅積層板、印刷配線板、電子機器、電路連接構件之製造方法及電路連接構件 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723849A (en) | 1980-07-18 | 1982-02-08 | Matsushita Electric Ind Co Ltd | Gas detector and its manufacture |
| JP4068413B2 (ja) | 2002-08-16 | 2008-03-26 | 日鉱金属株式会社 | Ｃｕ−Ｔｉ合金およびその製造方法 |
| JP5961371B2 (ja) * | 2011-12-06 | 2016-08-02 | Ｊｘ金属株式会社 | Ｎｉ−Ｃｏ−Ｓｉ系銅合金板 |
| JP6289804B2 (ja) * | 2012-09-04 | 2018-03-07 | 大日本印刷株式会社 | 板バネの製造方法 |
| US9405089B2 (en) * | 2014-05-22 | 2016-08-02 | Texas Instruments Incorporated | High-temperature isotropic plasma etching process to prevent electrical shorts |
| JP6073268B2 (ja) * | 2014-08-29 | 2017-02-01 | Ｊｘ金属株式会社 | 高強度チタン銅箔及びその製造方法 |
-
2016
- 2016-03-31 JP JP2016073347A patent/JP6391621B2/ja active Active
-
2017
- 2017-03-29 CN CN201710196683.6A patent/CN107267798B/zh active Active
- 2017-03-30 KR KR1020170040844A patent/KR101959620B1/ko active Active
- 2017-03-31 TW TW106111227A patent/TWI626322B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200806811A (en) * | 2006-06-12 | 2008-02-01 | Nippon Mining & Amp Metals Co Ltd | Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil |
| TW201410886A (zh) * | 2012-07-19 | 2014-03-16 | Jx Nippon Mining & Metals Corp | 高強度鈦銅箔及其製造方法 |
| TW201546302A (zh) * | 2013-10-04 | 2015-12-16 | Ｊｘ日鑛日石金屬股份有限公司 | 壓延銅箔、使用其之覆銅積層板、印刷配線板、電子機器、電路連接構件之製造方法及電路連接構件 |
| TW201542047A (zh) * | 2014-03-31 | 2015-11-01 | Jx Nippon Mining & Metals Corp | 附載體之銅箔、印刷配線板、積層體、電子機器及印刷配線板之製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017179566A (ja) | 2017-10-05 |
| CN107267798B (zh) | 2019-07-05 |
| JP6391621B2 (ja) | 2018-09-19 |
| KR101959620B1 (ko) | 2019-03-18 |
| CN107267798A (zh) | 2017-10-20 |
| TW201736610A (zh) | 2017-10-16 |
| KR20170113408A (ko) | 2017-10-12 |
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