TWI624889B - Sorter for testing electronic components - Google Patents

Abstract

The present invention relates to a sorting machine for testing electronic components. In the sorting machine for testing electronic components according to the present invention, a pressurizing of an electronic component to make the electronic component electrically connected to a test socket of a tester is added. The pusher of the pressure part includes a propulsion member having a fluid passage through which a cooling fluid passes, and at least one heater provided to apply heat to the propulsion member. According to the present invention, the temperature required during the test of the electronic component can be maintained by the cooling fluid and the heater, and therefore the reliability of the test can be improved.

Description

Sorter for testing electronic components

The present invention relates to a sorting machine for testing electronic components produced, and in particular, to a pressurizing section for pressurizing electronic components and temperature adjustment of electronic components.

A sorting machine is a device that provides support so that manufactured electronic components can be tested by a tester, and can sort electronic components into grades based on the test results.

The sorting machine has been published by Korean Patent Publication No. 10-2002-0053406 (hereinafter referred to as 'Prior Art 1') or Japanese Patent Publication No. 2011-247908 (hereinafter referred to as 'Prior Art 2'). Be public.

FIG. 1 is a schematic diagram of a conventional sorting machine TH.

The existing sorting machine TH includes a supply section SP, a pressurizing section PP, and a recovery section WP.

The supply unit SP supplies the electronic components loaded on the customer tray to the pressurizing unit PP.

The pressurizing section PP electrically connects the electronic components supplied by the supply section SP to the tester through a socket board SB connected to the main body of the tester. The socket substrate SB is provided with a plurality of test sockets TS electrically connected to the electronic components.

The recovery unit WP collects the tested electronic components from the pressurizing unit PP, sorts them based on the test results, and stacks them on empty customer trays.

As described above, the supply unit SP, the pressurizing unit PP, and the recovery unit WP may have various forms and configurations according to the purpose of use of the sorter.

This invention relates to the pressurizing part PP and temperature adjustment function in the said structure.

As shown in the schematic diagram in FIG. 2, the pressurizing section PP includes a pressurizer 210 ′ (named “indexing head” in the prior art 1 and a “pressing device” in the prior art 2), a vertical mover 220 ', Horizontal mover 230' and socket guide 240 '.

The pressurizer 210 'includes a pusher 212' for pressurizing each electronic component to a corresponding test socket TS (named "inspection socket" in the prior art 2).

As shown in FIG. 3, the pusher 212 'presses the electronic component D toward the lower surface of the pressurizing portion PR. Then, the pusher 212 'sucks and holds the electronic component D on the lower surface of the pressurizing portion PR by vacuum pressure. To this end, a vacuum passage VW capable of applying a vacuum pressure is formed in the thruster 212 '. In addition, guide holes GH are formed on both sides of the pressurizing site PR. Such a thruster 212 'has a temperature sensor 212'c for sensing the temperature of the thruster 212' itself. The temperature of the electronic component pressurized by the pusher 212 'is indirectly measured by the temperature sensor 212'c.

The presser 210 'is lowered while holding the electronic component, so that the electronic component is electrically connected to the test plug located on the socket substrate SB. Block TS. For this purpose, the pressurizer 210 'is configured to be capable of horizontal movement and vertical movement.

The vertical mover 220 'raises and lowers the pressurizer 210', so that the pressurizer 210 'advances to the socket substrate SB side or retreats from the socket substrate SB side. This operation of the vertical mover 220 ′ is performed when the electronic component is moved from the electronic component reciprocating portion (named “slide table” in the prior art 2) by the pressurizer 210 ′ to hold or release the electronic component D, and to make the electronic component D Electrically connected to or disconnected from the test socket TS.

The horizontal mover 230 'moves the pressurizer 210' horizontally in the front-rear direction. The horizontal movement of the presser 210 'is performed when the upper position of the reciprocating portion and the upper position of the socket substrate SB are moved.

The socket guide 240 'guides the test socket TS of the socket substrate SB at an accurate position. In the socket guide 240 ', an exposure hole EH capable of exposing the test socket TS to the pusher 212' side is formed at a position corresponding to the test socket and the pusher 212 '. The socket guide 240 'is provided with a guide pin GP that aligns the position of the pusher 212' with the guide hole GH inserted into the pusher 212 '. That is, the guide pin GP finally induces a delicate electrical connection between the held electronic component and the test socket TS by the pusher 212 '. Such a socket guide SG is a sorting machine which is realized by a method in which the sorting machine is not equipped with a test tray, or the pusher 212 having the function of grasping the electronic component D as described above presses the electronic component D to the testing socket TS. Is especially useful.

In addition, electronic components generate self-heating during the test procedure. The self-heating of electronic components such as a CPU that requires calculations is particularly large. In addition, self-heating raises the temperature of the electronic component and prevents the electronic component from being tested while maintaining an appropriate temperature suitable for the test conditions.

In Korean Granted Patent No. 10-0706216 or Korean Publication No. 10-2009-0102625 (hereinafter referred to as 'existing technology 3'), a heat sink is provided in order to adjust the temperature of electronic components. However, according to the prior art 3, the structure of a thruster is complicated, and productivity and durability are reduced.

In Korean Published Patent No. 10-2008-0086320 (hereinafter referred to as 'Prior Art 4'), an air through-hole is formed in a thruster in order to adjust the temperature of an electronic component, and the air-through hole is supplied from a pipe for adjusting the temperature air. However, the prior art 4 is difficult to be applied in the case of a thruster 212 that needs to hold a structure of an electronic component. This is because the thruster needs to be equipped with both a vacuum suction function and a function of ejecting temperature adjustment air, which are opposite to each other.

In addition, the above method adjusts the temperature of the electronic component by operating the temperature adjustment function, and its response is slow, so the reliability is reduced accordingly.

An object of the present invention is to provide a technology capable of adjusting the temperature of an electronic component pressurized by a propeller using a cooling fluid and a heater.

The sorting machine for testing electronic components according to the present invention as described above includes: a supply section for supplying electronic components; and a pressurizing section for pressing the electronic components such that the electronic components supplied through the supply section and The test socket of the tester is electrically connected; the adjustment unit supplies a cooling fluid for adjusting the temperature of the electronic component electrically connected to the test socket by the pressurizing unit; the recovery unit recovers the electronics that have been tested by the tester A control unit for controlling the respective components, wherein the pressurizing unit includes: a pressurizer including a pusher for pressurizing an electronic component to the test socket side; and a mover for causing the pressure increase A presser advances to or retreats from the test socket side to cause the pusher to pressurize or depressurize the electronic component to the test socket side. The pusher includes: a pusher member having A fluid passage through which a cooling fluid supplied by the regulating unit passes; at least one heater is provided in the propulsion member and is provided to apply heat to the propulsion member.

The thruster has at least one setting groove for setting the at least one heater.

The at least one heater is provided in a gap between the fluid passage and a contact end of the thruster that is in contact with an electronic component.

The installation area of the heater is closer to the electronic component than the formation area of the fluid passage, and the installation area of the heater does not overlap the formation area of the fluid passage.

There is a control gap between the installation area of the heater and the formation area of the fluid path to perform control so that the electronic component is more affected by the heat applied to the electronic component by the heater than by the fluid The effect of cold air applied to the electronic components by the pathway.

The installation area of the heater and the formation area of the fluid passage have overlapping areas overlapping each other, and the heater is separated from the propulsion member at least in the overlapping area.

The thruster includes a heat conducting member that intervenes at a portion where the heater is in contact with the thrust member.

The adjusting section continuously supplies a cooling fluid that adjusts at least one of a flow rate, a flow rate, and a temperature according to a test temperature condition of the electronic component to the fluid passage.

The control unit adjusts a heat generation amount of the heater and adjusts a test temperature of an electronic component pressurized by the thruster.

The pressurizer includes: a setting plate provided with the pusher; a setting structure for setting the pusher on the setting plate; a contact plate interposed between the pusher and electronic components, Instead, the pressing force of the thruster is transmitted to an electronic component, wherein the contact plate is detachably provided.

The contact plate has a contact cap capable of inserting a pressing portion of the pusher.

A front surface of the pressing portion is in contact with a contact end surface of the contact cap.

According to the present invention, by continuously passing a cooling fluid through the propeller, the heat generated by the self-heating of the electronic component can be continuously absorbed, and heat can be applied by the heater when necessary, so that the electronic component that meets the test conditions can be quickly performed. The temperature adjustment will greatly improve the reliability of the test.

Hereinafter, the preferred embodiments according to the present invention will be described with reference to the accompanying drawings, and repeated descriptions will be omitted or compressed as much as possible for the sake of brevity.

As shown in FIG. 4, a sorting machine TH (hereinafter referred to as a “sorting machine”) for testing electronic components according to the present invention includes: a pair of loading plates 111, 112, a first mover 120, and a pair of reciprocating movements. Shuttles MS1, MS2, pressurizing section 200, adjustment section 300, second mover 420, and control section 500.

Electronic components can be loaded on the loading plates 111 and 112. Such loading plates 111, 112 have heaters, so that the loaded electronic components can be heated to a temperature required for testing. Obviously, the heater operation will be suspended during the normal temperature test.

The first mover 120 moves the electronic components of the customer tray CT ₁ to the loading plates 111 and 112, or moves the electronic components of the loading plates 111 and 112 to the moving reciprocating portion MS1 located in the current left direction. For this reason, the first mover 120 is provided so as to be movable in the left-right direction and the front-rear direction (see arrows a and b).

Electronic components can be mounted on the moving reciprocating sections MS1 and MS2, and the moving reciprocating sections MS1 and MS2 can be moved in the left-right direction through the test position TP (see arrows c ₁ and c ₂ ).

The pressurizing section 200 electrically connects the electronic components loaded in the moving reciprocating sections MS1 and MS2 located at the test position TP to the test socket TS below it. To this end, referring to the solid line portion of FIG. 5, the pressurizing section 200 includes a pressurizer 210, a vertical mover 220, a horizontal mover 230, and a socket guide 240.

The pressurizer 210 includes a head 211 and eight thrusters 212.

The head 211 is provided so as to be able to be raised and lowered by the vertical mover 220, and eight thrusters 212 are provided. This head 211 has a channel structure for supplying cooling fluid to eight thrusters 212 or for providing vacuum pressure. Obviously, further components (pipes or channel structures) for supplying cooling fluid or vacuum pressure to the propeller can also be considered.

Each of the eight thrusters 212 is provided for pressurizing an electronic component. Therefore, 8 electronic components are electrically connected to the Tester at a time. Obviously, the number of the pushers 212 provided to the pressurizer 210 may be different depending on the product. Such a thruster 212 will be described in detail below.

The vertical mover 220 raises and lowers the pressurizer 210 (see arrow d). According to this, the pressurizer 210 can advance to or retreat from the socket substrate SB side, and can advance to or retreat from the moving reciprocating portions MS1 and MS2.

The horizontal mover 230 moves the pressurizer 210 in the front-rear direction (see arrow e). Therefore, the pressurizer 210 can be electrically connected to the test socket TS after the electronic component is alternately held by the moving reciprocating portion of the symbol MSI and the moving reciprocating portion of the symbol MS2.

For reference, the area defined as the test position TP may be equipped with a test chamber. In addition, if a test chamber is provided, the pressurizing part 200 or at least the pressurizer 210 will be located inside the test chamber. Obviously, the inside of the test chamber is adjusted to the temperature required to test the electronic components.

The socket guide 240 guides the test socket TS of the socket substrate SB at an accurate position.

The socket guide 240 guides the test socket TS of the socket substrate SB at an accurate position. In the socket guide 240, An exposure hole EH sufficient to expose the test socket TS to the pusher 212 side is formed at a position corresponding to the test socket TS and the pusher 212. The socket guide 240 is provided with a guide pin GP that aligns the position of the pusher 212 with a guide hole GH (see FIG. 6) inserted into the pusher 212. Such a socket guide 240 may be divided into a socket guide SL formed with an exposure hole EH through which the test socket TS can be inserted, and a docking board DP that guides the correct position of the socket guide SL to be combined. In the case where the socket guide SL and the docking board DP are divided, the socket guide SL is integrated with the socket board SB and integrated into the docking board DP provided in the sorting machine TH when the equipment is installed. For the integration of the socket guide SL and the docking board DP, the socket guide SL is provided with an integration pin AP for guiding integration, and the docking board DP is formed with an integration hole AH through which the integration pin AP can be inserted. Obviously, as in the prior art, a case where the socket guide and the docking plate are integrally combined can be considered.

5, the adjustment part 300 includes a fluid supplier 310 and a flow control valve 320.

The fluid supplier 310 supplies a cooling fluid for reducing the temperature of the electronic components to the pressurizer 210. Such a fluid supplier 310 includes a pump 311 for pumping a predetermined amount of cooling fluid, and a cooling module 312 for cooling the cooling fluid to a predetermined temperature.

The flow control valve 320 controls the supply amount of the cooling fluid supplied by the fluid supplier 310.

The pump 311, the cooling module 312, and the flow control valve 320 of the adjustment unit 300 as described above are controlled by the control unit 500. Therefore, the temperature, the supply flow rate, and the supply flow rate of the cooling fluid supplied to the thruster 212 can be adjusted according to the test temperature conditions of the electronic components. Therefore, when the temperature, supply flow rate and supply flow rate of the cooling fluid are determined according to the test temperature conditions, the fluid supplier 310 continuously supplies the adjusted cooling fluid to the propeller 212 at the determined temperature, supply flow rate and supply flow rate.

The second mover 420 sorts the electronic components that have been tested on the moving reciprocating parts MS1 and MS2 located on the right side based on the test results, and moves them to the customer tray CT ₂ . To this end, the second mover 420 may move in the left-right direction (see arrow f) or move in the front-rear direction (see arrow g).

The control unit 500 controls each of the above-mentioned configurations.

In the above-mentioned configuration, the loading plates 111 and 112 and the first mover 120 side for supplying the electronic components of the customer tray CT ₁ to the pressurizing section 200 may be defined as the supply section SP for supplying electronic components for use in testing The electronic component that the tester completes the test and moves to the second mover 420 side of the customer tray CT ₂ may be defined as the recycling section WP. One of the pair of moving reciprocating sections MS1 and MS2 functions as a supply section SP or a recovery section WP depending on its position.

The thruster 212 will be described in more detail.

As shown in the schematic cross-sectional view of FIG. 6, the propeller 212 includes a propelling member 212 a, two heaters 212 b, a first temperature sensor 212 c, and a second temperature sensor 212 d.

The pushing member 212a has a "T" shape in cross section, and is divided into an upper joint portion 212a-1 and a lower contact portion 212a-2.

The bonding portion 212a-1 is bonded to the head 211. A guide hole GH through which the guide pin GP of the socket guide 240 can be inserted is formed in this coupling portion 212a-1.

The contact portion 212a-2 is a portion having a narrower width than the bonding portion 212a-1, and the contact end CE, which is the lower end surface of the contact portion 212a-2, contacts the electronic component. A setting groove IS for setting the heater 212b is formed in this contact portion 212a-2. The installation groove IS is formed for inserting and installing the heater 212b, so the installability of the heater 212b is improved, and the area where the cylindrical heater 212b contacts the pushing member 212a can be increased, so that the heat of the heater 212b can be quickly It is provided to the propulsion member 212a.

A fluid passage FT and a vacuum passage VW are formed in such a pushing member 212a.

The fluid passage FT is formed so that the cooling fluid entering through the inlet IH located at the bonding portion 212a-1 moves to the contact portion 212a-2 and then exits through the outlet OH located at the bonding portion 212a-1. Therefore, the cooling fluid reaching the propulsion member 212a from the fluid supplier 310 passes through the fluid passage FT and leaves the propulsion member 212a.

The purpose of forming the vacuum passage VW is to apply a vacuum pressure to the electronic component in order to attract and hold the electronic component.

The heater 212b is provided in the installation groove IS of the contact portion 212a-2, and is provided in order to apply heat to an electronic component that is in contact with the contact portion 212a-2. This heater 212b is provided in a gap between the fluid passage FT and the contact end CE of the propulsion member 212a. The contact end CE is a lower end surface of the pushing member 212a, and is in contact with the electronic component. Therefore, the installation area IA of the heater 212b is closer to the electronic component than the formation area FA of the fluid passage FT.

The installation area IA of the heater 212b and the formation area FA of the fluid passage FT preferably do not overlap. The reason is that the main heating condition of the heater 212b is generated when the temperature of the electronic component is lower than the test temperature condition, so as to minimize the heat of the heater 212b absorbed by the cooling fluid of the fluid path FT, and to make the heat of the heater 212b Transfer to electronic parts in a short time. Therefore, it is preferable that a control gap CA exists between the installation area IA of the heater 212b and the formation area FA of the fluid passage FT, so that the electronic component is more affected by the heat applied to the electronic component via the heater 212b than the fluid passage FT. Applied air conditioning.

The first temperature sensor 212c is provided for measuring the temperature of the propulsion member 212a, and the second temperature sensor 212d is provided for measuring the temperature of the electronic component. Therefore, the second temperature sensor 212d is preferably provided on the contact end CE side of the contact portion 212a-2 so as to be in contact with the electronic component.

Next, the operation of the sorter TH as described above will be described.

The first mover 120 moves the electronic components to be tested to the loading plates 111 and 112 and preheats the electronic components, and then moves the preheated electronic components to the moving reciprocating sections MS1 and MS2 on the left side. If it is not necessary to preheat the electronic components, the first mover 120 may directly move the electronic components from the customer tray CT ₁ to the moving reciprocating sections MS1 and MS2.

If the moving reciprocating sections MS1 and MS2 are moved to the test position TP, the pressurizing section 200 grips the electronic components from the moving reciprocating sections MS1 and MS2 and then brings the held electronic components into contact with the test socket TS, so that the electronic components and the test The socket TS is electrically connected. In this state, the test of the electronic component is performed, and the temperature of the electronic component is adjusted in the procedure of the test.

In the present invention, the temperature of the electronic component is adjusted by the heater 212b.

In consideration of the test temperature condition of the electronic component and the heat generation of the electronic component itself, the cooling fluid is continuously supplied to the propeller 212 under preset conditions. That is, the cooling fluid is continuously supplied to the propeller 212 in a state where the temperature, the flow velocity, and the flow rate are fixedly set.

However, if the temperature of the electronic component is reduced from the range of the test temperature condition due to the influence of the cooling fluid according to various test variables, the control unit 500 that grasps the temperature of the electronic component through the second temperature sensor 212d causes the heater 212b to operate , And then transfer the heat to the electronic components, so that the temperature of the electronic components returns to the range of the test temperature conditions. That is, the control part 500 adjusts the test temperature of the electronic component pressurized by the pusher 212 by adjusting the heat generation amount of the heater 212b.

In addition, when the test is completed, the pressurizing section 200 moves the electronic components currently located at the test position TP to the moving reciprocating sections MS1 and MS2, and the second mover 420 moves the electronic components from the moving reciprocating sections MS1 and MS2 to the right. To the customer tray CT ₂ . ＜ Application example for thruster ＞

FIG. 7 is a schematic sectional view of a thruster 712 according to an application example in which the thruster 212 of FIG. 6 is applied.

The thruster 712 of FIG. 7 includes a thrust member 712a, two heaters 712b, a first temperature sensor 712c, a second temperature sensor 712d, a heat conducting member 712e, a guide member 712f, and a fixing member 712g.

The pushing member 712a has a "T" shape in cross section and is divided into an upper joint portion 712a-1 and a lower contact portion 712a-2.

The bonding portion 712a-1 is bonded to the head.

The contact portion 712a-2 is a portion having a narrower width than the bonding portion 712a-1, and the contact end CE, which is a lower end surface of the contact portion 712a-2, contacts the electronic component. A setting groove IS for setting the heater 712b is formed in this contact portion 712a-2.

Similarly, a fluid passage FT through which a cooling fluid passes and a vacuum passage VW for supplying a vacuum pressure to an electronic component are formed in the propulsion member 712a.

The heater 712b is provided in the installation groove IS of the contact portion 712a-2, and is provided in order to apply heat to an electronic component that is in contact with the contact portion 712a-2.

In this application example, there is an overlapping area RA that overlaps between the installation area IA of the heater 712b and the formation area FA of the fluid passage FT. Therefore, in order to minimize the heat generated by the heater 712b being taken away by the cooling fluid, at least in the overlap region RA, there is a gap G between the heater 712b and the propulsion member 712a, so that they are preferably spaced apart from each other. In the present embodiment, the heat conducting member 712e may be interposed at a contact portion between the heater 712b and the pushing member 712a, thereby generating the above-mentioned gap G. However, it is also possible to realize generation of a gap between the heater and the propulsion member in an overlapping area by providing various examples such as a curved heater or further cutting off the propulsion member.

Since the first temperature sensor 712c and the second temperature sensor 712d are the same as the first temperature sensor 212c and the second temperature sensor 212d configured in the propulsion member 212a of FIG. 6, description thereof is omitted.

The heat-conducting member 712e is provided in order to generate a gap between the heater 712b and the propulsion member 712a in the overlapping area RA and to quickly transfer the heat of the heater 712b to the propulsion member 712a.

The guide member 712f is provided for integration between the pusher 712 and the test socket. In this application example, the guide member 712f is provided with a guide pin 712f-1, unlike the thruster 212 of FIG. 6. In this case, it is necessary to form a guide hole in the test socket into which the guide pin 712f-1 can be inserted. In this application example, the guide member 712f is preferably provided with a material having a lower thermal conductivity than the pushing member 712a, so that the cold air of the cooling fluid is minimized by the test socket.

The fixing member 712g is provided for fixing the heater 712b to the pushing member 712a like a cable tie. ＜ Application example ＞

FIG. 8 is an example of a pressurizer 810 in which a thruster 812 having the same technical structure as the thrusters 212 and 712 described above is actually applied, and FIG. 9 is an exploded view of the main components of the pressurizer 810.

For reference, the pressurizer 810 of this example may be equipped with a sorter that supports testing of a packaged semiconductor element as one type of electronic component.

As shown in FIGS. 8 and 9, the pressurizer 810 includes a setting plate 811, a pusher 812, a setting structure 813, a support spring 814, a fluid distributor 815, and a contact plate 816.

Referring to FIG. 10, a thruster 812 is provided on the setting plate 811 with the setting structure 813 as a medium. An installation hole IH is formed in such an installation plate 811 so that the pressurizing portion 812a-1 of the pusher 812 is provided to protrude forward through the installation hole IH.

As shown in the extracted cross-sectional view of FIG. 11, the pusher 812 includes a pusher 812 a, two heaters 812 b, a first temperature sensor 812 c, a second temperature sensor 812 d, a heat conducting member 812 e, a guide member 812 f, and a fixing member 812 g. Such a propulsion member 812a, two heaters 812b, a first temperature sensor 812c, a second temperature sensor 812d, a heat conducting member 812e, a guide member 812f, and a fixing member 812g and the propulsion constituted by the pusher 712 of FIG. 7 The members 712a, the two heaters 712b, the first temperature sensor 712c, the second temperature sensor 712d, the heat conducting member 712e, the guide member 712f, and the fixing member 712g are respectively the same, so descriptions thereof are omitted.

The installation structure 813 is provided for installing the thruster 812 on the installation plate 811. This installation structure 813 includes a coupling plate 813a and a support base 813b.

The coupling plate 813a is coupled to the setting plate 811, and a through hole TH through which the pressurizing portion 812a-2 of the pusher 812 can pass is formed. The coupling plate 813a is formed with an alignment hole AH through which a guide pin 812f-1 of a guide member 812f provided in the pusher 812 is inserted. Therefore, the rear end of the pusher 812 can be aligned by the alignment hole AH.

The support base 813b is provided on the coupling plate 813a with a predetermined gap therebetween, and supports the rear end of the support spring 814 so that the support spring 814 can elastically support the pusher 812.

The support spring 814 elastically supports the rear end of the pusher 812 so that the pusher functions to advance and retreat a predetermined distance.

The fluid distributor 815 is provided to supply a cooling fluid to the fluid passage FT of the thruster 812 provided by the installation structure 813.

The contact plate 816 is interposed between the pusher 812 and the semiconductor element, and has a plurality of contact caps 816a. The contact cap 816a is opened to the rear and is provided with a material having excellent thermal conductivity so that cold air or heat of the pushing member 812a can be quickly transmitted to the semiconductor element.

FIG. 12 shows the relationship between the pusher 812 and the contact cap 816 a in a state where the semiconductor element is electrically connected to the tester via the pressurizer 810.

As shown in FIG. 12, in a state where the front end portion of the pressing portion 812 a-2 is covered by the contact cap 816 a, the pusher 812 pushes away the contact cap 816 a to press the contact cap 816 a to press the semiconductor element D. At this time, the front surface FS of the pressurizing portion 812a-2 makes surface contact with the contact end 816a-1 of the contact cap 816a, so that rapid conduction of hot air or cold air and proper transmission of the pressing force can be achieved. The contact end 816a-1 is the front end of the contact cap 816a that is in surface contact with the semiconductor element.

The above-mentioned thruster in this example does not directly press the semiconductor element, but adopts a structure in which the semiconductor element is pressurized by the contact cap 816a. Therefore, when the specifications of the semiconductor element to be tested are changed, it is only necessary to replace the contact plate 816, so the inconvenience or cost caused by the replacement of components can be reduced, and the start-up rate of the sorter can be improved. For this reason, the contact plate 816 is preferably provided in an easily attachable and detachable manner.

For reference, the guide member 816a-1 of the contact cap 816a may have a function of aligning the front end portion of the pusher 812.

The temperature adjustment function using the above-mentioned thrusters 212, 712, 812 can be preferably applied to all kinds of sorting machines that pressurize electronic components and are electrically connected to the tester.

Therefore, the present invention is specifically described with reference to the drawings and embodiments, but the above embodiments are only preferred embodiments of the present invention, so it should be understood that the present invention should not be limited to the above embodiments, and the scope of rights of the present invention should include The scope of patent application scope and its equivalent concept.

TH‧‧‧ Sorting machine for testing electronic components

SP‧‧‧Supply Department

WP‧‧‧Recycling Department

SB‧‧‧Socket base

PP‧‧‧Pressure section

TS‧‧‧Test socket

GP‧‧‧Guide Pin

EH‧‧‧ exposed hole

PR‧‧‧Pressure site

D‧‧‧Electronic components

MS1‧‧‧ Mobile Reciprocating Unit

MS2‧‧‧ Mobile Reciprocating Unit

CT ₁ ‧‧‧tray

CT ₂ ‧‧‧Tray

AH‧‧‧Integration hole

AP‧‧‧Integrated Pin

DP‧‧‧ docking board

SL‧‧‧Socket Guide

IS‧‧‧Set slot

FT‧‧‧fluid channel

IH‧‧‧ Entrance

OH‧‧‧Export

VW‧‧‧Vacuum channel

GH‧‧‧Guide hole

CE‧‧‧Contact end

FA‧‧‧Area

CA‧‧‧ Clearance

IA‧‧‧Area

RA‧‧‧ overlapping area

G‧‧‧ Clearance

200‧‧‧Pressure section

210‧‧‧Pressurizer

210’‧‧‧Presser

212‧‧‧thruster

212’‧‧‧ Thruster

212a‧‧‧Propulsion parts

212a-1‧‧‧Combination

212a-2‧‧‧contact

212b‧‧‧heater

212c‧‧‧Sensor

212’c‧‧‧ sensor

212d‧‧‧Sensor

220‧‧‧Vertical Mover

220’‧‧‧vertical mover

230‧‧‧Horizontal mover

230’‧‧‧horizontal mover

240‧‧‧Socket guide

240’‧‧‧Socket guide

300‧‧‧ Regulation Department

310‧‧‧ Fluid Supply

311‧‧‧pump

312‧‧‧cooling module

320‧‧‧flow control valve

500‧‧‧Control Department

712‧‧‧thruster

712a‧‧‧Propulsion parts

712a-1‧‧‧Combination

712a-2‧‧‧Contact Section

712b‧‧‧heater

712c‧‧‧Sensor

712d‧‧‧Sensor

712e‧‧‧Conductive parts

712f‧‧‧Guide

712f-1‧‧‧Guide Pin

712g‧‧‧Fixed parts

810‧‧‧Pressurizer

811‧‧‧setting board

812‧‧‧thruster

812a‧‧‧propulsion parts

812a-1‧‧‧Pressure part

812a-2‧‧‧Pressure part

812b‧‧‧heater

812c‧‧‧Sensor

812d‧‧‧Sensor

812e‧‧‧Conductive component

812f‧‧‧Guide

812f-1‧‧‧Guide Pin

812g‧‧‧Fixed parts

813‧‧‧Set Structure

813a‧‧‧Board

813b‧‧‧Support

814‧‧‧Support spring

815‧‧‧fluid distributor

816‧‧‧contact plate

816a‧‧‧ contact cap

816a-1‧‧‧ contact

1 to 3 are reference views for explaining a conventional sorter for testing electronic components.

FIG. 4 is a plan view of a sorter for testing electronic components according to an embodiment of the present invention.

FIG. 5 is a schematic perspective view of a pressurizing section applied to the sorter of FIG. 4.

FIG. 6 is a schematic extraction cross-sectional view in which a thruster is extracted from a pressurizing portion of FIG. 5.

FIG. 7 is an application example to which the thruster of FIG. 6 is applied.

FIG. 8 is a side view of a presser to which a propeller having the same technical structure as the propeller of FIGS. 6 and 7 is actually applied.

FIG. 9 is an exploded view of the main components of the pressurizer of FIG. 8.

10 to 12 are reference views for explaining main components of the pressurizer of FIG.

no

Claims (9)

A sorting machine for testing electronic components, comprising: a supply section for supplying electronic components; and a pressurizing section for pressing the electronic components so that the electronic components supplied through the supply section and the test socket of the tester are electrically charged. A connection section; a cooling section for supplying a cooling fluid for adjusting a temperature of an electronic component electrically connected to the test socket by the pressurizing section; a recovery section for recovering the electronic component which is tested by the tester; a control section for Controlling the supply section, pressurizing section, adjusting section, and recovery section, wherein the pressurizing section includes: a pressurizer including a pusher for pressurizing an electronic component to the test socket side; a mover, through Advancing the pressurizer to the test socket side or retreating from the test socket side, causing the pusher to press or release the electronic component toward the test socket side, wherein the pusher includes : A propulsion member having a fluid passage through which a cooling fluid supplied from the regulating section passes; at least one heater provided in the propulsion member for heating the propulsion member; wherein There is a control gap between the installation area of the heater and the formation area of the fluid passage, and the electronic component is affected by the heat applied to the electronic component by the heater more than by the fluid by controlling. The effect of cold air applied to the electronic component by the pathway. The sorting machine for testing electronic components as claimed in claim 1, wherein the heater is provided in a gap between the fluid path and a contact end of the thruster that is in contact with the electronic components. As in the sorting machine for testing electronic components as claimed in claim 2, wherein the installation area of the heater is closer to the electronic component than the formation area of the fluid passage, the installation area of the heater and the formation of the fluid passage The regions do not overlap. A sorting machine for testing electronic components, comprising: a supply section for supplying electronic components; and a pressurizing section for pressing the electronic components so that the electronic components supplied through the supply section and the test socket of the tester are electrically charged. A connection section; a cooling section for supplying a cooling fluid for adjusting a temperature of an electronic component electrically connected to the test socket by the pressurizing section; a recovery section for recovering the electronic component which is tested by the tester; a control section for Controlling the supply section, pressurizing section, adjusting section, and recovery section, wherein the pressurizing section includes: a pressurizer including a pusher for pressurizing an electronic component to the test socket side; a mover, through Advancing the pressurizer to the test socket side or retreating from the test socket side, causing the pusher to press or release the electronic component toward the test socket side, wherein the pusher includes : A propulsion member having a fluid passage through which a cooling fluid supplied from the regulating section passes; at least one heater provided in the propulsion member for heating the propulsion member; wherein The propulsion part (212a) includes: a coupling part (212a-1), the coupling part (212a-1) forming an inlet (IH) and an outlet (OH) and a contact part (212a) of the fluid passage (FT). -2), the contact portion (212a-2) has a narrower width than the bonding portion (212a-1), and the contact portion (212a-2) contacts the electronic component, wherein the heater (212b) is Installed in the contact portion (212a-2), wherein the fluid passage (FT) is formed so that the cooling fluid entering through the inlet (IH) moves to the contact portion (212a-2), and then passes through the contact portion (212a-2) The heater exits from the outlet (OH), the installation area of the heater and the formation area of the fluid passage have overlapping areas overlapping each other, and the heater is separated from the propulsion member in the overlapping area. The sorting machine for testing electronic components as claimed in claim 1 or 4, wherein the adjusting section continuously supplies a cooling fluid that has adjusted at least one of a flow rate, a flow rate, and a temperature according to a test temperature condition of the electronic components. Fluid path. The sorting machine for testing electronic components as claimed in claim 5, wherein the control section adjusts a heat generation amount of the at least one heater to adjust a test temperature of the electronic components pressurized by the thruster. The sorting machine for testing electronic components according to claim 1 or 4, wherein the pressurizer includes: a setting plate provided with the pusher; and a structure configured to set the pusher to the A setting plate; a contact plate interposed between the thruster and the electronic component, thereby transmitting the pressurizing pressure of the thruster to the electronic component, wherein the contact plate is detachably provided. A sorting machine for testing electronic components as claimed in claim 7, wherein said contact plate has a contact cap capable of inserting a pressurized portion of said pusher. The sorting machine for testing electronic components as claimed in claim 8, wherein the front surface of the pressurizing portion is in contact with the contact end surface of the contact cap.