TWI907037B - Tester coupling portion and docking assembly - Google Patents

Abstract

The invention relates to a test handler. Specifically according to an embodiment of the invention a tester coupling portion can be provided, which can be coupled with any one of a tester and a test handler provided with a socket base capable of accommodating equipment and includes a docking board, wherein the docking board is formed with an opening portion and a plurality of guide portions therein, the opening portion is configured to expose the equipment provided in the socket base to the test handler, in order for being detachably coupled to the tester, the guide portion is provided with a shape of one of a slot and a protrusion, and at least a part of the plurality of guide portions is coupled with a plurality of guide components formed in the tester, so that the docking board can be coupled with the tester.

Description

Tester joint and mating components Invention field

This invention relates to a tester connection.

Invention Background

A test handler is a device that supports testing of semiconductor components and other devices manufactured using predetermined processes. Based on the test results, the electronic components are categorized and then loaded onto a customer tray.

In order for a test processor to test devices such as semiconductor components, a tester is needed to electrically connect and test the devices. This tester is manufactured separately from the test processor and can be transported separately. On the other hand, in order to use both the test processor and the tester, the tester needs to be securely connected to the test processor. Traditionally, this connection has been secured using bolts.

However, for stable equipment operation, regular or irregular inspections are necessary, and when a problem occurs with the tester, it is essential to separate the tester from the test processor. Because this separation is performed by the user placing their hand inside the test processor and directly loosening the bolt connections, it is difficult to separate the tester from the test processor once it has been connected.

Furthermore, repeated separation and reassembly of the test processor and tester can damage the threads formed in the socket base, which is part of the tester. Replacing the socket base requires reconnecting a large amount of wiring around it, and the replacement process is time-consuming. Additionally, if the wiring is not accurately reconnected after replacing the socket base, there is a possibility of needing to replace the entire tester.

Therefore, a tester junction is needed that allows for easy integration and separation of the tester and test processor.

Invention Summary

The embodiments of the present invention were invented in consideration of the above background, and are intended to provide a tester connector that can be easily coupled to and detached from a tester.

Additionally, a tester joint is designed to prevent condensation from occurring around the equipment during testing.

According to one aspect of the invention, a tester coupling can be provided, which can be coupled to either a tester or a processor having a socket base that accommodates a device. The coupling includes a mating plate having formed a plurality of openings and guides. The openings expose the device disposed in the socket base to the processor. For detachable coupling to the tester, the guides have a shape of slots and protrusions. At least a portion of the plurality of guides engages with a plurality of tester guides formed in the tester, thereby enabling the mating plate to engage with the tester.

Furthermore, a tester assembly can be provided, which can be coupled to either a tester or a processor having a socket base that accommodates a device, comprising: a mating component capable of coupling to the socket base; and a mating plate having an opening for exposing the device disposed in the socket base to the processor and surrounding at least a portion of the mating component, wherein when the tester approaches within a predetermined distance of the mating plate, the mating plate can fix the position of the socket base relative to the mating plate by supporting the mating component.

Furthermore, a tester assembly can be provided, wherein the mating component includes an auxiliary mating unit capable of being connected to the socket base. The mating plate includes a locking device, which, for selectively supporting the auxiliary mating unit, is provided with a clamping member. The clamping member is driven to move forward and backward toward the auxiliary mating unit, supporting the auxiliary mating unit connected to the socket base. Thus, the locking device can fix the position of the socket base relative to the mating plate.

Furthermore, a tester coupling can be provided, wherein the auxiliary coupling unit includes a roller portion that rotates by contacting a clamping member advancing toward the auxiliary coupling unit, the clamping member being driven to move back and forth toward the roller portion.

Furthermore, a tester assembly can be provided, the mating component including a cleaning kit that forms a cleaning flow path with the socket base, through which a humidity-regulating fluid flows.

Furthermore, a tester coupling can be provided, wherein a coupling hole is formed in the mating assembly, and a coupling protrusion formed in the socket base can be inserted through the coupling hole. The mating plate can be fixed in position relative to the socket base by engaging with the coupling protrusion through the coupling hole.

Furthermore, a mating assembly can be provided, capable of being coupled to either a tester having a receptacle base capable of accommodating a device or a processor transferring the device to the tester, comprising: an auxiliary mating unit connectable to the receptacle base; and a cleaning kit that, together with the receptacle base, forms a cleaning flow path through which humidity-regulating fluid received from either the tester or the processor flows.

According to embodiments of the present invention, it has the advantage of being easily integrated with and separated from a tester.

Additionally, it has the effect of preventing condensation from occurring around the testing equipment.

1: Processor

2: Tester

2a: Socket base

2b: Combination protuberance

10: Tester Joint

20:Substrate

30: Framework

40: First Shuttle Unit

41: First Loading Area

42: First Exchange Area

43: First Unloading Area

50: Second Shuttle Unit

51: Second Loading Area

52: Second Exchange Area

53: Second Unloading Area

60: Component Supply Unit

70: Temperature Regulator

80: Loading Section

90: Unloading Section

100: Connecting plate

110: Connecting base

111:Opening part

112, 113: Guiding Department

114: Fastening Hole

120: Locking device

121: Clamping component

122: Drive Unit

130: Operations Department

200: Connecting Components

201: Connecting Hole

202: Combined Roller

210: Main Interface Unit

211: Auxiliary temperature regulation unit; heating device

212: Bimetallic

213: Shielding Body

214: Main column pin

220: Temperature Control Unit

221: Main Body

221a: Transfer flow path

222: Fluid inlet

223: Blocking component

230: Auxiliary Interoperability Unit

231: Assisting the Connecting Entity

232: Roll section

233: Protrusion

234: Auxiliary Train Selling

240: Cleaning Kit

241: Cleaning inlet

242: Kit Array of Holes

250: Contact area

260: Manifold

270: Array of components

Figure 1 is a top view of a processor according to an embodiment of the present invention.

Figure 2 is a perspective view of the tester assembly of an embodiment of the present invention.

Figure 3 is a bottom perspective view of the tester assembly shown in Figure 2.

Figure 4 is an exploded perspective view of the tester assembly shown in Figure 2.

Figure 5 shows a side view of the locking device moving toward the roller in Figure 2.

Figure 6 is a perspective view of the auxiliary docking unit, cleaning kit, and socket base shown in Figure 2.

Figure 7 is a cross-sectional view of the main docking unit in Figure 2.

Figure 8 is a cross-sectional view of the temperature control unit in Figure 2.

Figure 9 is a bottom view of the cleaning kit shown in Figure 7.

Figure 10 is a perspective view of the mating assembly and socket base of the second embodiment of the present invention.

Detailed Explanation of Preferred Embodiments

The following sections will describe in detail, with reference to the accompanying drawings, specific embodiments used to implement the spirit of this invention.

Furthermore, in describing this invention, detailed descriptions of elements or functions that are deemed to obscure the main points of this invention will be omitted.

Furthermore, when referring to a component as "connecting," "supporting," "transmitting," "supplying," "connecting," "combining," "securely connecting," or "fixing" to another component, it should be understood that it can directly connect, support, transmit, supply, connect, combine, securely connect, or fix to another component, but other components may exist in between.

The terms used in this specification are for illustrative purposes only and are not intended to limit the invention. Unless the context clearly indicates otherwise, the singular includes the plural.

Furthermore, terms including ordinal numbers such as first and second can be used to describe various constituent elements, but the corresponding constituent elements are not limited by these terms. These terms are only used to distinguish one constituent element from another.

As used in the instruction manual, "including" means to specify a particular characteristic, region, integer, step, action, element, and/or component, without excluding the existence or addition of other specific characteristics, regions, integers, steps, actions, elements, components, and/or groups.

Furthermore, this instruction manual explains the representation of surfaces such as the bottom surface based on the illustrations in the accompanying drawings. It should be noted that changing the orientation of the corresponding object will result in different representations. Also, in this instruction manual, the vertical direction can be the same as the vertical direction in Figure 4.

The tester connector 10 of one embodiment of the present invention can be coupled to either the processor 1 or the tester 2. The tester 2 will be described first below.

Tester 2 can test devices received from processor 1. Tester 2 may be provided with a socket base 2a, in which a socket is formed. The device under test can be installed in this socket. The device under test can be loaded into the socket base 2a via the component supply unit 60 described later.

Tester 2 can be combined with and electrically connected to processor 1. Tester 2 can be positioned below processor 1 to allow the socket base 2a to be raised and lowered, and the raised and lowered socket base 2a can be combined with processor 1. This raising of tester 2 can be driven by a manipulator (not shown).

The specific structure of the processor 1, including the tester junction 10 of this embodiment, will be described below with reference to the accompanying drawings.

Processor 1 can test equipment manufactured through a specific process, classify it into different grades based on the test results, and load it onto a customer pallet. Processor 1 can be detachably combined with tester 2. This processor 1 may include a tester assembly 10, a substrate 20, a frame 30, a first shuttle unit 40, a second shuttle unit 50, a component supply unit 60, a temperature regulation unit 70, a loading unit 80, and an unloading unit 90.

The tester connector 10 will be described in detail below.

The substrate 20 may provide a portion that bonds to the tester coupling portion 10. The bottom surface of this substrate 20 can bond to the tester coupling portion 10, and the substrate 20 can be securely connected to the tester coupling portion 10 by bolts.

The frame 30 supports the tester assembly 10, the substrate 20, the first shuttle unit 40, the second shuttle unit 50, the component supply unit 60, the temperature regulation unit 70, the loading unit 80, and the unloading unit 90.

The first shuttle unit 40 can move the equipment under test from the first loading area 41 to the first exchange area 42, and then move the equipment under test from the first exchange area 42 to the first unloading area 43.

The second shuttle unit 50 can move the equipment under test from the second loading area 51 to the second exchange area 52, and move the equipment being tested from the second exchange area 52 to the second unloading area 53.

The component supply unit 60 can move the device under test from the first switching area 42 and the second switching area 52 to the socket base 2a, or move the device already tested from the socket base 2a to the first switching area 42 and the second switching area 52.

The temperature regulating unit 70 can heat or cool the equipment before supplying it to the first shuttle unit 40 and the second shuttle unit 50.

The loading section 80 provides space for mounting the equipment to be tested by the tester 2.

The unloading section 90 can provide space for loading the equipment that has been tested by the tester 2.

Referring to Figures 2 to 4, the tester connector 10 provides a portion for connecting with the tester 2 and space for loading or unloading equipment into the tester 2. This tester connector 10 can be connected to the bottom surface of the substrate 20 and can be fastened to the substrate 20 by bolts. Furthermore, when the tester connector 10 is connected to the tester 2, the position of the tester 2 can be aligned and fixed. In this specification, the tester connector 10 can be directly/indirectly connected to or disconnected from the tester 2 by hard-connection or automatic-connection methods described later. Connecting means that the tester connector 10 is connected to or linked to the tester 2, while disconnecting means releasing the connection. On the other hand, while the tester connector 10 has been described as being included in the processor 1 in this specification, it can be a separate structure not included in the processor 1. Therefore, the tester connector 10 can also be coupled to either the processor 1 or the tester 2. Such a tester connector 10 may include a mating plate 100 and a mating assembly 200.

The mating plate 100 provides a portion for connection with the tester 2. This mating plate 100 can be directly/indirectly connected to the tester 2 via hard-pairing or automatic-pairing. The mating plate 100 may include a mating base 110, a locking device 120, and an operating section 130.

Referring to Figure 3, the mating base 110 provides a portion for engaging with the tester 2 and space for the device to pass through the tester 2. An opening 111 can be formed in this mating base 110 to expose the device disposed in the socket base 2a to the processor 1. In other words, the opening 111 exposes the device disposed in the socket base 2a to the component supply unit 60. This opening 111 can be formed from the center of the mating base 110.

The docking base 110 can provide a portion for engagement with the tester 2. This docking base 110 can engage with the tester 2 when the tester 2 is raised towards the bottom surface of the docking base 110 via a manipulator. Referring to FIG3, guide portions 112 and 113 can be formed in the docking base 110. For detachable engagement with the tester 2, the guide portions 112 and 113 can have one of the shapes of a groove and a protrusion. The groove can be a slot leading to a predetermined depth from the docking base 110, and the protrusion can be a pin or rod protruding from the docking base 110. Additionally, the guide portion 112 can have a hole shape. In this way, the mating base 110 can be coupled to the tester 2 by engaging at least a portion of one of the plurality of guide portions 112, 113 with a tester guide (not shown) formed on the tester 2. Corresponding to the shape of the guide portions 112, 113, the tester guide may have one of the shapes of a protrusion and a groove. Additionally, a fastening hole 114 can be formed in the mating base 110 to insert a bolt (not shown) for fastening to the substrate 20. The bolt inserted into this fastening hole 114 is fastened to the substrate 20, thereby allowing the mating base 110 to be coupled to the substrate 20.

The hard-pairing method will be explained below with reference to FIG3. Hard-pairing can be achieved by engaging a groove-shaped guide portion 112 formed on the mating base 110 with a tester guide formed on the tester 2. In other words, as the tester 2 rises toward the bottom surface of the mating base 110, the tester guide inserts into the groove-shaped guide portion 112 of the mating base 110, thereby engaging the mating plate 100 with the tester 2. Furthermore, during hard-pairing, the tester guide is inserted into the groove-shaped guide portion 112, thereby aligning the positions of the tester 2 relative to the mating base 110. When hard-pairing is complete, the socket base 2a of the tester 2 can be tightly attached to the bottom surface of the mating base 110, and the position of the socket base 2a can be below the opening 111.

On the other hand, the types of testers 2 can vary depending on the manufacturer. Furthermore, the position of the tester guide formed on the tester 2 can differ depending on the type of tester 2, and the size and shape of the tester guide can also vary. Accordingly, multiple slot-shaped guide portions 112 can be formed in the mating base 110, and these multiple slot-shaped guide portions 112 can be formed at different positions on the mating base 110 to insert tester guides disposed in various types of testers 2. Additionally, the multiple slot-shaped guide portions 112 can have different sizes and shapes to insert tester guides disposed in various types of testers 2. Therefore, the multiple slot-shaped guide portions 112 included in the mating base 110 of this embodiment can be combined with guides formed on various types of testers 2, i.e., tester guides with different positions, sizes, and shapes. In other words, various types of testers 2 can be hard-connected to the mating board 100.

Additionally, a protruding guide portion 113 can be formed on the mating base 110, and a grooved tester guide member can be formed on the tester 2. Therefore, during hard mating, the protruding tester guide member of the tester 2 is first inserted into the grooved guide portion 112 of the mating base 110 for a first calibration, and then the protruding guide portion 113 of the mating base 110 is inserted into the grooved tester guide member for a second calibration. As described above, more than one calibration is performed during hard mating, thereby allowing for precise adjustment of the position of the tester 2 relative to the mating base 110. Multiple protruding guide portions 113 and grooved tester guide members can be formed. Furthermore, the groove-shaped guide portion 112 used for the first calibration can be formed at a position further away from the opening 111 than the protruding guide portion 112 used for the second calibration. This protruding tester guide for the first calibration can be longer and thicker than the protruding guide portion 113 used for the second calibration. Because of the different shapes of these protrusions for the first and second calibrations, more precise positional correction can be achieved during the second calibration.

Alternatively, a first correction can be performed using the protruding guide portion 113, and a second correction using the grooved guide portion 112. In this case, the protruding guide portion 113 can be formed at a position further away from the opening 111 than the grooved guide portion 112. Furthermore, the protruding guide portion 113 used for the first correction can be shorter and thinner than the protruding tester guide used for the second correction.

As described in the above hard-pairing method, during the process of the tester 2 rising towards the bottom surface of the mating base 110, the protruding tester guide is inserted into the groove-shaped guide portion 112 of the mating base 110, and the protruding guide portion 113 is inserted into the groove-shaped tester guide, thereby connecting the mating base 110 and the tester 2. However, this is only an example, and either the groove-shaped guide portion 112 or the protruding guide portion 113 may also be formed in the mating base 110. Therefore, during hard mating, the protruding guide portion 113 of the mating base 110 is inserted into the groove-shaped tester guide, thereby engaging the mating base 110 with the tester 2; or the protruding tester guide is inserted into the groove-shaped guide portion 112 of the mating base 110, thereby engaging the mating base 110 with the tester 2.

The locking device 120 supports the auxiliary mating unit 230 of the mating assembly 200 (described later) and secures the socket base 2a to the mating base 110. In other words, the locking device 120 secures the relative position of the socket base 2a to the mating base 110 by supporting the auxiliary mating unit 230 connected to the socket base 2a. The locking device 120 may include a clamping member 121 and a driving part 122.

Referring to Figure 5, in order to selectively support the auxiliary docking unit 230, the clamping member 121 can be driven to move forward and backward toward the auxiliary docking unit 230. This clamping member 121 can secure the auxiliary docking unit 230 by supporting the roller portion 232 of the auxiliary docking unit 230. Furthermore, the clamping member 121 can move forward and backward toward the roller portion 232 and can be driven by the driving unit 122. Multiple clamping members 121 can be provided, and multiple clamping members 121 can support the auxiliary docking unit 230 at different positions. In this specification, as shown in Figure 5, the clamping member 121 moves toward the roller 232 and supports the roller 232 on one side. However, this is only an example; the roller 232 can also be held on both sides. In this locking device 120, the auxiliary mating unit 230 is integrated with the socket base 2a, so that the socket base 2a is not directly supported, but rather the auxiliary mating unit 230 is supported to fix the position of the socket base 2a.

The drive unit 122 can move the clamping member 121 forward and backward toward the roller portion 232. For example, the drive unit 122 can be a hydraulic cylinder, and the clamping member 121 can be driven by hydraulic pressure from the hydraulic cylinder. Alternatively, multiple drive units 122 can be provided, and multiple clamping members 121 can be driven.

The operating unit 130 can control the operation of multiple drives 122. In other words, the operating unit 130 can operate the clamping member 121 or stop operation via multiple drives 122. This operating unit 130 can be located on one side of the docking base 110.

The automatic mating method will be explained below. Automatic mating involves locking the auxiliary mating unit 230 to secure the socket base 2a when the tester 2 is raised via the operator. In other words, in the automatic mating method, when the tester 2 approaches below a predetermined distance from the mating plate 100, the mating plate 100 supports the mating assembly 200, thereby securing the socket base 2a relative to the mating plate 100. Thus, the mating assembly 200 can be used not only to secure the socket base 2a but also to determine its position. Furthermore, if higher precision is required, similar to the hard mating method, the position of the socket base 2a can be guided by at least one pin (e.g., the main alignment pin 214).

This automatic mating can be controlled by the operating unit 130. When the tester 2 rises towards the bottom of the mating base 110 and approaches a predetermined distance below the mating base 110, the operating unit 130 can rotate at a predetermined angle. When the operating unit 130 rotates at the predetermined angle, multiple drive units 122 can drive multiple clamping members 121 to move them towards the auxiliary mating unit 230. Upon completion of the automatic mating, the multiple clamping members 121 can support the auxiliary mating unit 230 at different positions, and the socket base 2a connected to the auxiliary mating unit 230 can be fixed to the underside of the opening 111.

To disengage the automatic connection, when the operating unit rotates at the angle before the drive unit 122 is driven, the operation of multiple drive units 122 can be stopped. Furthermore, the driving of multiple clamping members 121 will stop, and the multiple clamping members 121 will move towards the multiple drive units 122, thereby releasing the support of the auxiliary connection unit 230. When the support of the auxiliary connection unit 230 is released, the fixing of the socket base 2a can be released.

On the other hand, this manual describes automatic mating following a hard connection, but automatic mating can be performed independently of the hard connection. Therefore, the socket base 2a can be secured by automatic mating even without a hard connection.

Referring to Figures 4 and 6, when the socket base 2a is raised and positioned below the opening 111 via hard or automatic mating, the mating assembly 200 can align and fix the position of the socket base 2a. Furthermore, the mating assembly 200 can adjust the temperature of a portion or the outer perimeter of the socket base 2a, and also adjust the temperature of the equipment supported on the socket base 2a. The mating assembly 200 can prevent condensation by reducing the humidity around the socket base 2a. This mating assembly 200 can pre-cool or preheat the equipment by supplying a temperature-regulating fluid to the equipment before testing, and can adjust the temperature of the equipment during testing and even after testing is completed. On the other hand, the mating assembly 200 can supply a temperature regulating fluid to the socket base 2a to regulate the device temperature before performing hard or automatic mating. This mating assembly 200 may include a main mating unit 210, a temperature regulating unit 220, an auxiliary mating unit 230, and a cleaning kit 240.

When the socket base 2a rises and is positioned below the opening 111, the main connection unit 210 can align the socket base 2a to a predetermined position. Additionally, the main connection unit 210 can heat the socket base 2a. This main connection unit 210 may include an auxiliary temperature regulation unit 211, a bimetallic strip 212, a shield 213, and a main alignment pin 214.

Referring to Figure 7, the heating device 211 can change the temperature of the socket base 2a by heating it. When it is necessary to quickly change the temperature of the socket base 2a, which is adjusted to a predetermined temperature range by the temperature regulating unit 220, this heating device 211 heats the socket base 2a, thereby regulating its temperature. For example, the heating device 211 can be a heater that heats the socket base 2a. Multiple such heating devices 211 can be provided.

The bimetallic strip 212 prevents the socket base 2a from overheating. When the socket base 2a overheats, the bimetallic strip 212 automatically cuts off the power supply to the heating device 211, thereby stopping the operation of the heating device 211.

The shield 213 prevents heat generated from the heating device 211 from diffusing to the outside. This shield 213 can be made of insulating material.

Referring to Figures 4 and 6, the main alignment pin 214 can align the position of the socket base 2a. This main alignment pin 214 can be inserted inside the auxiliary alignment pin 234 of the auxiliary mating unit 230, described later. For example, the main alignment pin 214 is inserted into the auxiliary alignment pin 234, which is inserted into the alignment member 270 fixed to the socket base 2a, thereby aligning and fixing the position of the socket base 2a. In this way, the main alignment pin 214 can align and fix the position of the socket base 2a relative to the main mating unit 210.

The temperature regulating unit 220 can supply a temperature-regulating fluid for heating or cooling equipment to the socket base 2a. In other words, a high-temperature fluid can be supplied to the socket base 2a for heating equipment, and a low-temperature fluid can be supplied to the socket base 2a for cooling equipment. This temperature regulating unit 220 can supply a pre-temperature-adjusted fluid (i.e., a high-temperature or low-temperature fluid adjusted to a predetermined temperature) to the equipment. Furthermore, the temperature regulating unit 220 can regulate the temperature around the socket base 2a by supplying the temperature-regulating fluid to the socket base 2a, and can also regulate the temperature of the equipment mounted on the socket base 2a.

The temperature regulating unit 220 can be selectively connected to the contact portion 250 to supply a temperature regulating fluid. For example, when the docking base 110 is connected to the tester 2, the temperature regulating unit 220 will be connected to the contact portion 250, and a temperature regulating fluid for heating or cooling equipment can be supplied to the device of the socket base 2a. Alternatively, when the docking base 110 is disconnected from the tester 2, the temperature regulating unit 220 can be disconnected from the contact portion 250. This temperature regulating unit 220 can supply fluid to multiple contacts 250 simultaneously or independently. Furthermore, the temperature regulation of the temperature regulating unit 220 can be controlled in real time. For example, the temperature regulating unit 220 can be an automatic temperature controller (ATC). This temperature regulation unit 220 can be supported on the main docking unit 210. The temperature regulation unit 220 may include a main body 221, a fluid inlet 222, and a baffle 223.

The main body 221 can support the fluid inlet 222 and the baffle 223. Additionally, the main body 221 can be supported by the main docking unit 210. Referring to FIG8, a transfer flow path 221a can be formed inside this main body 221, in which the temperature regulating fluid supplied from the fluid inlet 222 can flow. The transfer flow path 221a can provide a flow path for causing the temperature regulating fluid supplied from the fluid inlet 222 to flow to a connecting member (not shown). A portion of this transfer flow path 221a can communicate with the fluid inlet 222, and another portion of the transfer flow path 221a can communicate with the contact portion 250 (described later) via the connecting member. Furthermore, when the docking base 110 is separated from the tester 2, the transfer path 221a can be separated from the contact portion 250; when the docking base 110 is attached to the tester 2, it can be connected to the contact portion 250.

Fluid inlet 222 can be supplied with a temperature-regulating fluid for use in heating or cooling equipment from an external source. This fluid inlet 222 can be connected to one end of the main body 221. Alternatively, multiple fluid inlets 222 can be provided and connected to the transfer flow path 221a.

The blocking member 223 prevents the socket base 2a connected to the tester 2 from rising above a predetermined range. In other words, when the socket base 2a rises, the blocking member 223 contacts the auxiliary mating unit 230 connected to the socket base 2a, thereby preventing both the socket base 2a and the auxiliary mating unit 230 from rising above a predetermined range. Furthermore, when the socket base 2a and the auxiliary mating unit 230 rise, the blocking member 223 can be inserted into a groove (not shown) formed in the auxiliary mating unit 230, and can contact the auxiliary mating unit 230 in said groove. This blocking member 223 can be connected to the main body 221 and can protrude from the main body 221. Additionally, multiple blocking elements 223 can be provided, and can be inserted into multiple slots of the auxiliary mating unit 230 to prevent the socket base 2a and the auxiliary mating unit 230 from rising above a predetermined range.

The auxiliary mating unit 230, connected to the cleaning kit 240 which is connected to the socket base 2a, supports both the socket base 2a and the cleaning kit 240. Additionally, when the tester 2 is engaged with the mating base 110, the auxiliary mating unit 230 provides a portion supported by the locking device 120. This auxiliary mating unit 230, supported by the locking device 120, allows the socket base 2a to be positioned below the opening 111. This auxiliary mating unit 230 may include an auxiliary mating body 231, a roller 232, a protrusion 233, and an auxiliary alignment pin 234.

Referring to Figure 6, the auxiliary mating body 231 can support the roller portion 232, the protrusion 233, and the auxiliary alignment pin 234. This auxiliary mating body 231 can be connected to the cleaning kit 240. Additionally, a groove can be formed in the auxiliary mating body 231, which can contact the stop member 223 of the temperature regulating unit 220. For example, when the auxiliary mating body 231 rises together with the socket base 2a toward the mating base 110, the stop member 223 will insert into the groove formed in the auxiliary mating body 231, thereby bringing the auxiliary mating body 231 into contact with the stop member 223.

When automatic docking is performed, the roller 232 can be a portion supported by the clamping member 121 of the locking device 120. This roller 232 can rotate relative to the auxiliary docking unit 230 to prevent damage to the clamped member 121. Thus, the roller 232 rotates in response to the movement of the clamping member 121, thereby preventing damage to the auxiliary docking unit 230 from the pressure applied by the retracting clamping member 121.

The protrusion 233 can support the auxiliary alignment pin 234, which will be described later. For example, a hole (not shown) for inserting the auxiliary alignment pin 234 can be formed in the protrusion 233, and the protrusion 233 can support the auxiliary alignment pin 234 by inserting it into the hole. This protrusion 233 can be formed protruding from the outer peripheral surface of the auxiliary mating body 231.

Auxiliary alignment pins 234 can align the position of the socket base 2a. These auxiliary alignment pins 234 are inserted into holes formed in alignment members 270 fixed to the socket base 2a, thereby aligning and securing the position of the socket base 2a. Additionally, main alignment pins 214 can be inserted inside the auxiliary alignment pins 234 and can support the main alignment pins 214. These auxiliary alignment pins 234 can be inserted into the kit alignment holes 242 (described later), and by inserting into both the kit alignment holes 242 and the alignment members 270, the position of the socket base 2a is aligned and secured.

The cleaning kit 240 can prevent condensation around the socket base 2a by supplying a humidity-regulating fluid to the socket base 2a. In other words, when the temperature regulation unit 220 supplies a low-temperature temperature-regulating fluid to the equipment to cool it, the cleaning kit 240 can prevent condensation by supplying low-humidity air to the socket base 2a. For example, the humidity-regulating fluid can be dry air or cleaning gas. Furthermore, the cleaning kit 240 can be activated by cutting off power when heating the equipment (e.g., during high-temperature testing) and activating when cooling the equipment (e.g., during low-temperature testing).

A cleaning inlet 241 can be formed in this cleaning kit 240, which can receive fluid from an external device (not shown). Additionally, the cleaning kit 240 can form a cleaning flow path together with the socket base 2a. In other words, the cleaning flow path can be formed by surrounding the cleaning kit 240 and the socket base 2a. Referring to FIG9, when the humidity regulating fluid is supplied from the outside to the cleaning inlet 241, the fluid can be discharged from the cleaning flow path formed inside the cleaning kit 240 in a predetermined direction (e.g., the direction of the arrow in FIG9) to the outside. Multiple cleaning inlets 241 can be formed. In this way, the humidity regulating fluid circulates inside the cleaning kit 240 and is discharged, thereby preventing condensation that may occur in the socket base 2a.

Additionally, a kit alignment hole 242 for inserting auxiliary alignment pins 234 can be formed in the cleaning kit 240.

The contact portion 250 can receive a temperature-regulating fluid for heating or cooling equipment from the temperature regulation unit 220 and supply it to the manifold 260. One side of this contact portion 250 can be selectively connected to the transfer flow path 221a of the temperature regulation unit 220 via a connecting member, and the other side of the contact portion 250 can be connected to the manifold 260. Therefore, when the tester 2 is separated from the docking base 110, the contact portion 250 can be separated from the temperature regulation unit 220. Multiple such contacts 250 can be provided.

The manifold 260 can receive temperature-regulating fluid for heating or cooling equipment from the contact portion 250, and can supply the received fluid around the socket base 2a. Alternatively, the manifold 260 can directly supply the fluid received from the contact portion 250 to the equipment.

The alignment component 270 can provide a portion into which auxiliary alignment pins 234 are inserted. This alignment component 270 can be fixedly supported on one side of the socket base 2a. Therefore, by inserting the auxiliary alignment pins 234 into the alignment component 270, the positions of the socket base 2a and the alignment component 270 relative to the mating base 110 can be aligned and fixed.

The function and effects of processor 1 with the above-described structure will be explained below.

The user can use a hard-pair method to connect the mating plate 100 and the tester 2. During the hard-pairing process, the tester 2 can rise towards the mating plate 100. Thus, as the tester 2 rises towards the bottom surface of the mating base 110, the protruding tester guide will first insert into the slot-shaped guide portion 112 of the mating base 110 for initial calibration, and the protruding guide portion 113 of the mating base 110 can subsequently be inserted into the slot-shaped tester guide for a second calibration. When the hard-pairing is complete, the socket base 2a of the tester 2 can be positioned below the opening 111 formed in the mating base 110, and the position of the socket base 2a can be fixed.

On the other hand, the user can automatically connect the mating plate 100 to the tester 2. During automatic mating, the tester 2 can be raised towards the mating plate 100. When the tester 2 is positioned on the bottom surface of the mating base 110, the user can rotate the operating unit 130 to drive multiple locking devices 120. When the operating unit 130 rotates, the multiple driving units 122 cause multiple clamping members 121 at different positions to move towards the rollers 232 of the auxiliary mating unit 230. The multiple clamping members 121 can fix the position of the socket base 2a connected to the auxiliary mating unit 230 by supporting the auxiliary mating unit 230.

When the socket base 2a is positioned below the opening 111 of the mating plate 100 using at least one of hard-connection and automatic-connection methods, the main alignment pin 214 can be inserted into the auxiliary alignment pin, and the auxiliary alignment pin 234 can be inserted into the kit alignment hole 242 and the alignment component 270. In this manner, the main alignment pin 214 is inserted into the alignment component 270 and the auxiliary alignment pin 234, the alignment component 270 being fixed in the socket base 2a, and the auxiliary alignment pin 234 being inserted into the kit alignment hole 242, thereby allowing the main alignment pin 214 to align and fix the position of the socket base 2a. When the position of the socket base 2a is aligned and fixed by the main alignment pin 214, the tester 2 can be electrically connected to the socket base 2a to perform equipment testing.

On the other hand, during testing, the temperature control unit 220 can adjust the equipment temperature of the socket base 2a. This temperature control unit 220 receives temperature-regulating fluid for heating or cooling from the fluid inlet 222 and supplies it to the contact section 250. The fluid flowing to the contact section 250 can be supplied to the equipment via the manifold 260. The equipment temperature regulation by this temperature control unit 220 can be controlled in real time. Furthermore, when cooling the equipment via the temperature control unit 220, the cleaning kit 240 supplies dry air to the socket base 2a, thereby preventing condensation that may occur around the socket base 2a. The operation of this cleaning kit 240 can be performed simultaneously with the equipment temperature regulation.

Upon completion of testing, the equipment at the socket base 2a can be moved to either the first switching area 42 or the second switching area 52 via the component supply unit 60.

The processor 1 of this invention allows for easy connection and disconnection from the tester 2. Furthermore, it allows for temperature regulation during testing. Additionally, when the auxiliary connection unit 230 is damaged, it can be disconnected from the socket base 2a, and only the auxiliary connection unit 230 is replaced, thus eliminating the need to replace the socket base 2a.

On the other hand, besides this structure, according to the second embodiment of the invention, the main docking unit 210, temperature regulation unit 220, auxiliary docking unit 230, and cleaning kit 240 can be omitted from the docking assembly 200. The second embodiment of the invention will be further described below with reference to FIG. 10. In describing the second embodiment, the differences compared to the above-described embodiment will be mainly described, and the same descriptions and reference numerals are used in the above-described embodiment.

A hole (not shown) can be formed in the mating base 110, which can engage with a mating protrusion 2b of the socket base 2a. The mating base 110 can engage with the mating protrusion 2b, which passes through the mating hole 201 (described later), thereby fixing its position relative to the mating base 110.

The mating component 200 can be coupled to the socket base 2a and supported on the mating base 110. A mating hole 201 can be formed in the mating component 200, into which a mating protrusion 2b of the socket base 2a can be inserted. Multiple mating holes 201 and mating protrusions 2b can be formed. Therefore, by inserting multiple mating protrusions 2b of the socket base 2a into multiple mating holes 201 of the mating component 200, the position of the socket base 2a relative to the mating component 200 can be fixed. Furthermore, when the mating protrusion 2b is inserted into the mating hole 201, the mating component 200 and the socket base 2a can be fastened together by bolts.

A connecting roller 202 can be provided in the mating assembly 200. This connecting roller 202 can rotate to prevent damage to the locking device 120. Additionally, the connecting roller 202 can be supported by the locking device 120.

The function and effects of the processor 1 in the second embodiment of the present invention will be explained below.

The user can assemble the socket base 2a and the mating assembly 200 before assembling the tester 2 and the mating plate 100. The user can secure the socket base 2a to the mating assembly 200 by inserting the multiple mating protrusions 2b of the socket base 2a into the multiple mating holes 201 of the mating assembly 200. Alternatively, the other parts of the mating assembly 200 and the socket base 2a can be fastened together with bolts.

When the socket base 2a is securely connected to the mating component 200, the tester 2 can rise toward the bottom surface of the mating plate 100. The mating protrusion 2b of the socket base 2a, which passes through the mating hole 201 of the mating component 200, can be inserted into the hole formed in the mating base 110. In this way, the mating protrusion 2b of the socket base 2a is inserted into both the mating hole 201 of the mating component 200 and the hole formed in the mating base 110, thereby aligning and fixing the position of the mating component 200 into the mating base 110. In addition, when the socket base 2a is provided below the opening 111, the user can drive the locking device 120 through the operating part 130. The clamping member 121 of the locking device 120 supports the connecting roller 202 of the mating assembly 200, thereby fixing the mating assembly 200 and the socket base 2a in a certain position on the mating plate 100.

This tester coupling 10 allows the socket base 2a to be easily engaged or disengaged from the mating base 110 via the mating assembly 200.

From the above discussion, it will be understood that the present invention can be embodied in various exemplary forms, including but not limited to the following:

Example 1: A tester coupling for coupling with either a tester or a processor of a socket base having a receiving device, characterized in that it includes a mating plate having an opening and a plurality of guide portions, the opening for exposing the device disposed in the socket base to the processor, and the guide portions having a groove and a protrusion shape for detachable coupling with the tester, at least a portion of the plurality of guide portions coupling with a plurality of tester guides formed in the tester, thereby coupling the mating plate with the tester.

Example 2: A tester assembly, coupled to either a tester or a processor, comprising a socket base for accommodating a device, characterized in that it includes: a mating component coupled to the socket base; and a mating plate having an opening for exposing the device disposed in the socket base to the processor and surrounding at least a portion of the mating component, wherein when the tester approaches within a predetermined distance of the mating plate, the mating plate fixes the position of the socket base relative to the mating plate by supporting the mating component.

Example 3: The tester assembly as described in Example 2, characterized in that the mating component includes an auxiliary mating unit connected to the socket base. The mating plate includes a locking device. To selectively support the auxiliary mating unit, the locking device is provided with a clamping member that is driven to move forward and backward toward the auxiliary mating unit. The clamping member supports the auxiliary mating unit connected to the socket base, thereby fixing the locking device in position relative to the socket base of the mating plate.

Example 4: The tester coupling as described in Example 3, characterized in that the auxiliary coupling unit includes a roller portion that rotates by contacting a clamping member advancing toward the auxiliary coupling unit, the clamping member being driven to move back and forth toward the roller portion.

Example 5: The tester coupling as described in Example 2, characterized in that the mating assembly includes a cleaning kit, which, together with the socket base, forms a cleaning flow path, through which a humidity regulating fluid flows.

Example 6: The tester coupling as described in Example 2, characterized in that a coupling hole is formed in the mating component, and a coupling protrusion formed in the socket base is inserted through the coupling hole. The mating plate is fixed in position relative to the socket base by engaging with the coupling protrusion through the coupling hole.

Example 7: A mating assembly, coupled to either a tester having a socket base for accommodating a device or a processor for transferring the device to the tester, characterized in that it includes a cleaning kit that, together with the socket base, forms a cleaning flow path through which a humidity-regulating fluid received from either the tester or the processor flows.

Although embodiments of the invention have been described with specific examples, these are merely illustrative, and the invention is not limited thereto, but should be interpreted in the broadest sense based on the fundamental ideas disclosed in this specification. Those skilled in the art can combine/substitute the disclosed embodiments to implement patterns of shapes not shown, but this does not depart from the scope of the invention. Furthermore, those skilled in the art can readily modify or alter the embodiments disclosed in this specification, and it is clearly understood that such modifications or alterations also fall within the scope of the invention.

1: Processor 10: Tester Assembly 20: Substrate 30: Frame 40: First Shuttle Unit 41: First Loading Area 42: First Exchange Area 43: First Unloading Area 50: Second Shuttle Unit 51: Second Loading Area 52: Second Exchange Area 53: Second Unloading Area 60: Component Supply Unit 70: Temperature Regulation Unit 80: Loading Unit 90: Unloading Unit

Claims (5)

A tester assembly capable of engaging with either a tester or a processor disposed on a socket base for accommodating a device, characterized in that it includes a mating component capable of engaging with the socket base; the mating component includes a main mating unit for heating the socket base, and a temperature regulating unit that supplies a temperature regulating fluid for heating or cooling the device to the socket base; the main mating unit includes: a heating device for changing the temperature of the socket base by heating the socket base; a bimetallic element that automatically cuts off power when the socket base overheats, thereby stopping the operation of the heating device; and a shield to prevent heat generated from the heating device from diffusing to the outside. The tester assembly as described in claim 1, wherein the temperature regulating unit comprises: a fluid inlet for receiving the temperature regulating fluid from the outside; a baffle for preventing the socket base connected to the tester from rising above a predetermined range when the tester assembly is engaged with the tester; and a main body for supporting at least one of the fluid inlet and the baffle; the fluid inlet being connected to one end of the main body; and a transfer path formed on the main body for allowing the temperature regulating fluid received from the fluid inlet to flow. The tester assembly as described in claim 1, wherein the mating component further comprises: an auxiliary mating unit capable of being connected to the socket base; and a cleaning kit capable of forming a cleaning flow path together with the socket base, through which a humidity regulating fluid flows; the main mating unit further comprises a main alignment pin aligning the positions of the socket base; the auxiliary mating unit comprises an auxiliary alignment pin aligning the positions of the socket base; the cleaning kit has a kit alignment hole formed therein capable of inserting the auxiliary alignment pin; the main alignment pin is inserted inside the auxiliary alignment pin; the auxiliary alignment pin is inserted into the kit alignment hole. The tester assembly as described in claim 3, wherein the mating assembly further includes an alignment component providing a portion for inserting the auxiliary alignment pin; when the auxiliary alignment pin is inserted into the kit alignment hole and the alignment component, the position of the socket base is aligned and fixed. A mating assembly capable of engaging with either a tester having a socket base for accommodating a device or a processor for transferring the device to the tester, characterized in that it further comprises: a temperature regulating unit for supplying a temperature regulating fluid for heating or cooling the device to the socket base; a contact portion connected to the temperature regulating unit; and a manifold for receiving, through the contact portion, the temperature regulating fluid for heating or cooling the device from the temperature regulating unit and transferring it to the device; the temperature regulating unit is configured to engage with the processor; and the contact portion is detachable from the temperature regulating unit when the processor is disconnected from the tester.