TWI622341B - Computing system - Google Patents

Abstract

A computing system includes a housing, a heat dissipating component, and an arithmetic component. The housing has an accommodating space and an air inlet and at least one air outlet respectively communicating with opposite ends of the accommodating space. The heat dissipating component comprises a heat dissipation module, a system fan and a power supply unit fan. The heat dissipation module is located in the accommodating space and surrounds a central heat convection channel. The system fan is located in the accommodating space to drive air through the central heat convection passage. The power supply unit fan is located within the central heat convection passage to drive air through at least the central heat convection passage. The computing component includes a power supply unit located within the central thermal convection channel.

Description

Computing system

The present invention relates to a computing system, and more particularly to a computing system that can improve heat dissipation efficiency.

With the rapid development of the electronics industry, desktop computers have long been one of the indispensable electronic products in life. In addition to high-capacity storage devices, high-performance processors, and excellent operating systems, lightweight desktops are becoming a market trend as quality of life improves and personal characteristics are increasingly valued. Therefore, the research direction of the industry began to focus on the appearance of desktop computers, hoping to develop a lightweight desktop computer with innovative visual design, small size and light weight, in order to enhance consumers' desire to purchase.

As the lightweight desktop computer has improved overall appearance, the configuration of its internal electronic components will also be adjusted as the appearance changes. For example, the compact electronic components of the desktop will be placed closer together, making the concept of a traditional cooling system difficult to apply directly. Therefore, how to effectively dissipate lightweight desktop computers is bound to become one of the topics to be solved by researchers.

The present invention provides a computing system for improving the heat dissipation efficiency of a lightweight desktop computer.

The computing system disclosed by the present invention comprises a housing, a heat dissipating component and an arithmetic component. The housing has an accommodating space and an air inlet and at least one air outlet respectively communicating with opposite ends of the accommodating space. The heat dissipating component comprises a heat dissipation module, a system fan and a power supply unit fan. The heat dissipation module is located in the accommodating space and surrounds a central heat convection channel. The system fan is located in the accommodating space to drive air through the central heat convection passage. The power supply unit fan is located within the central heat convection passage to drive air through at least the central heat convection passage. The computing component includes a power supply unit, and the power supply unit is located in the central heat convection channel.

The computing system disclosed by the present invention can make the internal pressure of the system more rapidly formed by the system fan and the power supply unit fan, so that the air can be quickly discharged through the system from the air outlet to effectively remove the heat in the system. can.

Moreover, since the power supply unit fan is located in the central heat convection passage of the system, it is ensured that the airflow for heat dissipation passes through the central heat convection passage, and the heat dissipation of the electronic components in the central heat convection passage is enhanced, in addition to lifting the system. The overall heat dissipation efficiency also reduces the load on the system fan and has energy-saving effects.

The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

1 to 2, FIG. 1 is a schematic diagram of a computing system in accordance with an embodiment of the present invention, and FIG. 2 is a schematic diagram of a computing system removing an annular sidewall according to an embodiment of the present invention. The present invention provides a computing system 1 that can be, but is not limited to, a desktop computer. In the present embodiment, the computing system 1 includes a housing 10, a heat dissipation component 20 and an arithmetic component 30. The housing 10 includes a top cover 11, a base 12 and an annular side wall 14. The annular side wall 14 is connected between the top cover 11 and the base 12 such that the overall appearance of the housing 10 is slightly cylindrical. In addition, the top cover 11 and the base 12 together with the annular side wall 14 surround an accommodating space S1. The heat dissipating component 20 and the computing component 30 are both accommodated in the accommodating space S1 of the casing 10 . The heat dissipating component 20 can be combined with the housing 10 to dissipate heat from the computing component 30. In the present embodiment, the arithmetic component 30 generally refers to a general term for various electronic components in the computing system 1.

Next, please refer to FIG. 3. FIG. 3 is an exploded view of the computing system removing the annular side wall according to an embodiment of the present invention. In the present embodiment, the base 12 of the housing 10 has an air inlet 121, and the top cover 11 has three air outlets 111. The air inlet 121 and the air outlet 111 communicate with the opposite ends of the accommodation space S1, respectively. It should be noted that, in the illustration of the present invention, the size, proportion or appearance of the air inlet 121 and the air outlet 111 are only a simplified embodiment for the sake of brevity, and are not intended to limit the present invention.

Specifically, the air inlet 121 on the base 12 is a honeycomb structure composed of a plurality of minute intake passages 1211. The honeycomb structure can increase the structural strength of the base 12 in addition to air circulation. Each of the air outlets 111 is also a honeycomb structure composed of a plurality of channels. In the present embodiment, the material constituting the gas outlet 111 is, for example, stamped from a steel material, and the opening ratio of each gas outlet 111 is, for example, 64%, but the invention is not limited thereto. For example, in other embodiments, each of the air outlets 111 may be a mesh structure having a plurality of minute air holes or a structure of only one opening. In addition, the present invention is not limited to the number of air outlets 111, and the user can adjust according to actual needs.

Next, the heat dissipation assembly 20 includes a heat dissipation module 21, a system fan 22, and a power supply unit fan 23. The computing component 30 includes a power supply unit (PSU) 31. In addition, the computing system 1 also includes a Main logic board (MLB) 60. The above components are located between the base 12 and the top cover 11, that is, the above components are all located in the accommodating space S1.

Specifically, the main logic board 60 is disposed on the base 12. The power supply fan 23 can be, but is not limited to, an axial flow fan that is assembled to the power supply unit 31 and is housed in the heat dissipation module 21 together with the power supply unit 31. Further, in the present embodiment, the power supply fan 23 is adjacent to the air inlet 121 of the base 12. The heat dissipation module 21 is disposed on the main logic board 60. The system fan 22 can be, but is not limited to, an axial fan, which is located on one side of the heat dissipation module 21 and between the top cover 11 and the heat dissipation module 21 and adjacent to the air outlet 111 of the top cover 11.

Next, the heat dissipation module 21 will be described first. First, please refer to FIG. 4A to FIG. 3 in conjunction with FIG. 3 , which are different in the calculation system according to an embodiment of the present invention. An exploded view of the viewing angle, and FIG. 5 is a cross-sectional view of the heat sink fin and the heat pipe in the computing system in accordance with an embodiment of the present invention. 4A is an exploded view from the perspective of FIG. 3, and FIGS. 4B-4C are exploded views of different angles of view from FIG. 4A. In addition, the position of the system fan 22 is additionally illustrated in FIG. 5, but for the sake of simplicity of the drawings, the system fan 22 is only indicated by dashed lines.

In this embodiment, the heat dissipation module 21 includes three heat dissipation fins 211a, 211b, and 211c, three heat conduction sheets 212a, 212b, and 212c and a plurality of heat pipes 213. The computing component 30 further includes a central processing unit (CPU) 32, a plurality of graphics processing units (GPUs) 33, a plurality of memory units 34, and a plurality of storage units (solid state). Drive, SSD) 35a, a hard disk drive (HDD) 35b and an input/output unit (I/O) 36. Further, in the present embodiment, the computing system 1 further includes three brackets 40a, 40b, 40c and three main circuit boards 50a, 50b, 50c.

Specifically, the three brackets 40a, 40b, 40c are assembled to each other and erected on the main logic board 60, and are configured to have a triangular prism shape. The three main circuit boards 50a, 50b, 50c are respectively disposed on the three brackets 40a, 40b, 40c. The circuit boards 50a, 50b, 50c are electrically connected to the main logic board 60. The three heat radiating fins 211a, 211b, 211c surround the main circuit boards 50a, 50b, 50c and correspond to the main circuit boards 50a, 50b, 50c, respectively. However, the present invention is not limited to the number of the above-mentioned brackets, the main circuit board and the heat dissipation fins, and the user can adjust according to actual needs. For example, in other embodiments, the number of brackets may be four or more, and the phase composition is a columnar structure having a quadrangular cross section. In this case, the number of the main circuit board and the heat dissipation fins corresponding to the bracket is also Can be increased to four.

Further, the central processing unit 32 and the plurality of memory units 34 are both disposed on the main circuit board 50a. The central processing unit 32 is in thermal contact with the heat dissipation fins 211a via the thermal conductive sheets 212a. The two graphics processing units 33 are respectively disposed on the main circuit board 50b and the main circuit board 50c, and are in thermal contact with the heat dissipation fins 211b, 211c via the thermal conductive sheets 212b, 212c, respectively. The two storage units 35a are also disposed on the main circuit boards 50b, 50c, respectively. The input and output unit 36 is an assembled independent electronic component assembly that can be directly inserted and assembled on the main logic board 60 and located outside the heat dissipation fin 211a. The other storage unit 35b is disposed on the input and output unit 36 and located between the heat dissipation fins 211a and the input and output unit 36. In this embodiment, the power supply unit 31, the central processing unit 32, the graphics processing unit 33, the memory unit 34, the storage unit 35a, and the input and output unit 36 are electrically connected to each other via the main logic board 60.

In addition, in the present embodiment, the heat pipes 213 are respectively disposed through the heat dissipation fins 211a, 211b, and 211c, but the heat dissipation fins 211a, 211b, and 211c are not connected in series. That is, the heat dissipation fins 211a, 211b, and 211c are thermally insulated from each other. Thereby, it is possible to effectively prevent lower temperature electronic components from being affected by higher temperature electronic components. However, the present invention is not limited thereto. For example, in other embodiments, two or three of the heat dissipation fins 211a, 211b, and 211c may be connected in series by the heat pipe 213. Thereby, the heat dissipation fins 211a, 211b can share the work of dissipating heat to the central processing unit 32 and the graphics processing unit 33.

Next, as shown in FIG. 5, the heat dissipation fins 211a, 211b, and 211c each have a heat absorption surface 2111a and a heat dissipation surface 2111b opposed to each other. The heat absorbing surfaces 2111a of the heat radiating fins 211 are surfaces on the heat radiating fins 211a, 211b, and 211c that are in thermal contact with the heat conducting sheets 212a, 212b, and 212c, respectively. In the present embodiment, the heat absorbing surfaces 2111a of the heat dissipation fins 211a, 211b, and 211c collectively surround a central heat convection passage 24, and the heat dissipation surfaces 2111b of the heat dissipation fins 211a, 211b, and 211c and the casing 10 are annular. A peripheral thermal convection passage 25 is formed between the side walls 14. In the present embodiment, the central heat convection passage 24 and the peripheral heat convection passage 25 extend from the air inlet 121 of the base 12 to the air outlet 111 of the top cover 11.

Therefore, referring to FIG. 5 and FIGS. 4A-4C, the brackets 40a, 40b, 40c, the main circuit boards 50a, 50b, 50c and the heat conducting fins 212a, 212b, 212c on the heat radiating fins 211a, 211b, 211c are both located in the center. Thermal convection channel 24. In the computing component 30, the power supply unit 31, the central processing unit 32, the graphics processing unit 33, the memory unit 34 and the storage unit 35a are also located in the central thermal convection channel 24, and the input and output unit 36 and the storage unit 35b are Located in the peripheral thermal convection channel 25.

It should be noted that the present invention is not limited to the number of the heat dissipation fins described above. The thermal conductive sheets provided corresponding to the heat dissipating fins are optional, and the number thereof is not intended to limit the present invention. Therefore, the shape of the central heat convection passage surrounded by the heat dissipation fins may also vary depending on the number of heat dissipation fins.

In addition, the number, specifications, and positions of the central processing unit 32, the graphics processing unit 33, the memory unit 34, and the storage unit 35 are optional, and the user can adjust according to requirements, and is not intended to limit the present invention. Moreover, the manner in which the electronic components in the arithmetic component 30 are assembled with the circuit board is not intended to limit the present invention.

Next, please refer to Figure 3 and Figure 5 at the same time. The system fan 22 is horizontally placed on one side of the central heat convection passage 24. Specifically, the system fan 22 has an air inlet 121 facing the base 12 of the air inlet 22s1. In the present embodiment, the air inlet 22s1 of the system fan 22 overlaps at least a portion of the cross section of the central heat convection passage 24 and at least a portion of the cross section of the peripheral heat convection passage 25. Thus, the range of suction airflow generated by system fan 22 during operation will encompass at least a portion of central thermal convection passage 24 and peripheral thermal convection passage 25.

The power supply unit 31 and the power supply fan 23 mounted thereon are both located in the central heat convection passage 24. Specifically, in the present embodiment, the power supply unit fan 23 is vertically disposed, and has an air inlet 23s1 facing the gap between the brackets. Therefore, the power supply unit fan 23 can generate a suction airflow to draw air into the central heat convection passage 24 during operation.

When the computing system 1 is in operation, the system fan 22 and the power supply unit fan 23 will also start to operate, and the two fans will generate a negative pressure between the air inlet 121 of the base 12 to attract the air outside the system into the housing 10. Space S1. Moreover, since the air inlet 22s1 of the system fan 22 overlaps at least a portion of the cross section of the central heat convection passage 24 and at least a portion of the cross section of the peripheral heat convection passage 25, the air of the accommodation space S1 in the air can be driven. The central heat convection passage 24 and the peripheral heat convection passage 25 flow to form an air flow. Furthermore, since the power supply unit fan 23 is located in the central heat convection passage 25, it is ensured that air is at least attracted to the central heat convection passage 24.

Specifically, please refer to FIGS. 6-7, which are partial cross-sectional views of a computing system in accordance with an embodiment of the present invention, and FIG. 7 is another portion of a computing system in accordance with an embodiment of the present invention. Cross-sectional view.

First, as shown in FIG. 6, after the air is drawn into the accommodating space S1, the air is split into a central airflow 241 passing through the central heat convection passage 24 and circulated through the peripheral heat through the blocking of the heat dissipation module 21. Two air flows of the peripheral airflow 251 of the track 25. However, the first thing to remind is that the airflow in Figure 6 is for illustrative purposes only. In fact, the airflow is not limited to that shown in Figure 6.

The central airflow 241 flows through the central heat convection passage 24 to directly directly connect the power supply unit 31, the central processing unit 32, the graphics processing unit 33, the memory unit 34, and the storage unit 35a located in the central thermal convection passage 24. Cool down. At the same time, the heat is also transmitted to the peripheral heat convection passage 25 through the heat dissipation fins 211a, 211b, and 211c, and then radiated by the peripheral airflow 251 to achieve a two-pronged heat dissipation effect. The input/output unit 36 and the storage unit 35b located in the peripheral heat convection passage 25 can dissipate heat by the flow of the peripheral airflow 251.

In addition, in the present embodiment, since the power supply unit fan 23 is disposed in the central heat convection passage 24, it is ensured that air is sucked into the central heat convection passage 24, contributing to the reinforcement of circulation to the central heat convection passage 24. The intensity of the airflow inside helps to improve heat dissipation efficiency.

Next, as shown in FIG. 7, a positive pressure difference is generated between the system fan 22 and the air outlet 111, and the central airflow 241 after passing through the central heat convection passage 24 and the peripheral airflow 251 passing through the peripheral thermal convection passage 25 can be The system fan 22 is combined into an exhaust stream 26 and forces the exhaust stream 26 to exit the computing system 1 via the air outlet 111 of the top cover 11.

Thus, a constantly flowing airflow will be formed within the computing system 1 to continuously dissipate heat from the electronic components within the computing component 30. Wherein, since the air inlet 121 and the air outlet 111 are located below and above the system, respectively, the direction of the airflow is downward and upward, which helps the lighter hot air to be discharged upward and the air circulation is smoother. For example, please refer to FIGS. 8A-8B. FIGS. 8A-8B are temperature distribution diagrams of a computing system during operation according to an embodiment of the present invention. As can be seen from the figure, by the above design of the computing system 1, hot air can be effectively discharged to the top of the system, maintaining the internal electronic components in a low temperature state, thereby avoiding the problem of overheating of the system.

In addition, referring to FIG. 3, in the present embodiment, the position of the air outlet 111 substantially corresponds to the three heat dissipation fins 211a, 211b, and 211c, so that the heat dissipation fins 211a, 211b, and 211c are diverged. The heat can flow to the air outlet 111 more quickly.

It should be reminded, however, that the flow of air within the computing system 1 is not limited by the flow direction described above, such as when there are electronic components that traverse the central thermal convection passage 24 and the peripheral thermal convection passage 25, the central airflow 241 and the peripheral airflow. 251 can circulate through the gaps at the junction of the two channels to collectively dissipate heat from the electronic components.

In addition, the present invention is not limited to the manner in which the system fan 22 and the power supply unit fan 23 are disposed, and the user can adjust according to actual needs to change the flow field in the system.

Next, the following table 1 can be further cooperated, and Table 1 is an example of the implementation of the embodiment. Specifically, Table 1 presents two examples for comparison. One example is the embodiment, which is a computing system equipped with a system fan and a power supply unit fan. Another example is a comparative example, and only a system fan is provided. Among them, two examples are tested under the condition that the rotational speed of the central processing unit is equal to the operation of the graphics processing unit.

As can be seen from Table 1, in a system with only a system fan, the overall fan consumes up to 7.2 watts of power. In contrast, in the computing system in which the system fan and the power supply unit fan are simultaneously equipped in this embodiment, since the power supply unit fan is located in the central heat convection passage, it is ensured that the air is at least attracted to the central heat convection passage. The ability to dissipate heat from the electronic components in the central thermal convection channel is enhanced, so that the system fan can operate at only 5 watts without inputting high power. Therefore, the power supply unit fan can operate at a power of 0.8 watts, so that the sum of power consumed by the two fans is lower than 7.2 watts in the comparative example. It can be seen that the design of the system fan and the power supply unit fan at the same time in this embodiment has an energy saving effect. In addition, in the present embodiment, since the system fan can operate at a high power without a long time, it also contributes to prolonging the service life of the system fan.

In summary, the computing system disclosed by the present invention enables the internal pressure of the system to be more quickly formed by the system fan and the power supply unit fan, so that the air can flow more centrally to the central heat convection channel, thereby rapidly It is discharged from the air outlet through the system to effectively remove heat energy from the system.

Moreover, since the power supply unit fan is located in the central heat convection passage of the system, it is ensured that the airflow for heat dissipation passes through the central heat convection passage, and the heat dissipation of the electronic components in the central heat convection passage is enhanced, in addition to lifting the system. The overall heat dissipation efficiency also reduces the load on the system fan and has energy-saving effects.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1‧‧‧ Computing System

10‧‧‧shell

11‧‧‧Top cover

12‧‧‧Base

13‧‧‧Circular side wall

14‧‧‧Circular side wall

20‧‧‧Heat components

21‧‧‧ Thermal Module

24‧‧‧Central heat convection channel

25‧‧‧External thermal convection channel

22‧‧‧System fan

22s1, 23s1‧‧‧ air inlet

23‧‧‧Power supply unit fan

26‧‧‧Exhaust airflow

30‧‧‧ arithmetic components

31‧‧‧Power supply unit

32‧‧‧Central Processing Unit

33‧‧‧Graphic Processing Unit

34‧‧‧ memory unit

35a, 35b‧‧‧ storage unit

36‧‧‧Input and output unit

37‧‧‧Power supply阜

40a, 40b, 40c‧‧‧ bracket

50a, 50b, 50c‧‧‧ boards

60‧‧‧Main logic board

111‧‧‧ gas outlet

121‧‧‧air inlet

211a, 211b, 211c‧‧‧ heat sink fins

212a, 212b, 212c‧‧‧ Thermal sheet

213‧‧‧ heat pipe

241‧‧‧Central airflow

251‧‧‧peripheral airflow

1211‧‧‧Intake passage

2111a‧‧‧Heat absorption surface

2111b‧‧‧heating surface

S1‧‧‧ accommodating space

1 is a schematic diagram of a computing system in accordance with an embodiment of the present invention. 2 is a schematic illustration of a computing system removing an annular sidewall in accordance with an embodiment of the present invention. 3 is an exploded view of a computing system removing an annular sidewall in accordance with an embodiment of the present invention. 4A-4C are exploded views of heat dissipation components and computing components in a computing system in accordance with an embodiment of the present invention. Figure 5 is a cross-sectional view of a computing system in accordance with an embodiment of the present invention. 6 is a partial cross-sectional view of a computing system in accordance with an embodiment of the present invention. 7 is another partial cross-sectional view of a computing system in accordance with an embodiment of the present invention. 8A-8B are temperature distribution diagrams of a computing system during operation in accordance with an embodiment of the present invention.

Claims (11)

A computing system comprising: a housing having an accommodating space and an air inlet and at least one air outlet respectively connected to opposite ends of the accommodating space; and a heat dissipating component comprising: a heat dissipation module located at the a central heat convection passage is disposed in the accommodating space; a system fan is located in the accommodating space for driving air through the central heat convection passage; and a power supply unit fan is located in the central heat pair The flow channel is configured to drive air through at least the central heat convection channel; an arithmetic component includes a power supply unit, the power supply unit being located in the central heat convection channel. The computing system of claim 1, wherein the heat dissipation module and the housing form a peripheral thermal convection passage, and the system fan is configured to drive the air to circulate through the central heat convection passage and the peripheral heat. Road. The computing system of claim 1, wherein the heat dissipation module comprises a plurality of heat dissipation fins, each of the heat dissipation fins having a heat absorption surface and a heat dissipation surface opposite to each other, and the heat absorption surfaces of the heat dissipation fins Surround the central heat convection channel. The computing system of claim 3, wherein the heat dissipation module further comprises a plurality of thermal conductive sheets that are in thermal contact with the heat absorbing surfaces of the heat dissipation fins. The computing system of claim 3, wherein the computing component further comprises a central processing unit and at least one graphics processing unit located in the central thermal convection channel. The computing system of claim 5, wherein the central processing unit and the at least one graphics processing unit are in thermal contact with the heat dissipation fins, respectively. The computing system of claim 3, wherein the heat sink fins are thermally insulated from one another. The computing system of claim 2, wherein the computing component further comprises at least one memory unit, at least one storage unit and an input and output unit, all located in the peripheral thermal convection channel. The computing system of claim 1 wherein the system fan is located on one side of the central thermal convection channel. The computing system of claim 2, wherein the system fan has an air inlet, at least a portion of a cross section of the air inlet and the central heat convection passage, and at least a portion of a cross section of one of the peripheral heat convection passages Overlapping. The computing system of claim 1, wherein the housing comprises a top cover, an annular side wall and a base, the annular side wall being connected between the top cover and the base, the air inlet being located at the base, The at least one air outlet is located at the top cover, the system fan is adjacent to the at least one air outlet, the power supply unit fan is adjacent to the air inlet, and the central heat convection passage extends from the air inlet to the at least one air outlet Air port.