201236533 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電子裝置，且特別是有關於一種具有 被動散熱元件的電子裝置。 【先前技術】201236533 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic device, and more particularly to an electronic device having a passive heat dissipating component. [Prior Art]
Ik著電子科技的發展與進步，各式各樣的電子裝置被開發 來滿足使用者的需求’其中這些電子I置的散熱能力攸關著其 内部元件的運作，進而影響電子裝置的穩定度。以使用被動散 熱元件的電子裝置來說’被動散熱元件的散熱鰭片可以增加電 子裝置的散熱面積，以提高散熱能力。然而，若被動散熱元件 的本身6史汁不當或擺设位置不當，除了會威脅電子裝置的穩定 度與使用壽命外’甚至會有安全性的問題。 圖1是習知之一種電子裝置的示意圖。請參照圖i，電子 裝置100包括殼體110、處理器130以及散熱墊15〇。處理器 130配置於殼體ι10内，而散熱墊15〇配置於處理器上並 接觸殼體110的頂部112。藉此，處理器13〇所產^的熱可透 過散熱墊150而傳導至殼體110表面以進行散熱。 然而，此種散熱方式將造成頂部112之位於散熱墊15〇上 方的，域之溫度過高，進而有不符安規的疑慮。但若不將熱導 引至殼體uo (即散熱墊150不接觸殼體110的頂部112)， 則會大幅降低電子裝置100的散熱能力，進而導致電子裝置 100内部之溫度規格較低的電池、硬碟等超出溫度規格。這樣 來除了可能造成電子裝置1〇〇當機外，甚至可能降低苴使 用壽命。 〃 201236533 【發明内容】 本發明提供一種電子裝置，以提高散熱效果並符合溫度安 規。 為達上述優點，本發明提出一種電子裝置，其包括殼體、 發熱元件與被動散熱元件。殼體具有相對的進氣口與出氣口， 且此進氣口與出氣口設置於殼體之相對的二第一側壁。發熱元 件配置於殼體内。被動散熱元件配置於發熱元件上，且此被動 散熱兀件具有底部、二第二側壁以及多個散熱鰭片。其中，這 些第一侧壁連接於底部之相對兩邊並接觸殼體的頂部，進氣口 與出氣口位於這些第二側壁之間，且第二侧壁沿著從進氣口朝 向出氣口的預定方向延伸，以於進氣口與出氣口之間形成流 道此外，政熱縛片連接於底部並位於這些第二側壁之間，每 一散熱鰭片沿著所述預定方向設置，且此些散熱鰭片與殼體的 頂部之間存有間距。 在本發明之一實施例中，上述之被動散熱元件更具有至少 翼邛，連接於一第二側壁之至少其中之一，且翼部接觸殼體 的頂部。 在本發明之一實施例中，上述之每一翼部包括至少一散熱 片。 在本發明之一實施例中，上述之被動散熱元件的底部與第 二侧壁接觸殼體的第一側壁，且進氣口與出氣口位於被動f欠熱 元件的底部與殼體的頂部之間。 在本發明之一實施例中’上述之殼體更具有至少一容置空 間，位於第二側壁之至少其中之一旁，且此電子裝置更包括至 少一系統元件，配置於此容置空間。 201236533 在本發明之一實施例中，上述之至少一系統元件包括儲存 元件、電池、電源供應器及記憶體模組至少其中之一。 在本發明之一實施例中，上述之發熱元件包括中央處理 器。 在本發明之一實施例中，上述之電子裝置更包括一電路 板，配置於殼體内，以承載發熱元件。 在本發明之一實施例中，上述殼體之頂部的材質包括金 屬。 在本發明之電子裝置中，由於外部冷空氣可由進氣 口進入 流道内，以與被動散熱元件進行熱交換，使發熱元件產生的廢 熱月匕從出軋口排出，所以能提高散熱效率。此外，被動散熱元 件並未將熱集中傳導至殼體之位於發熱元件正上方的區域，所 以可避免過熱的情形，進而符合溫度安規。 為讓本發明之上述和其他目的、特徵和優點能更明顯易 懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 g圖2是本發明一實施例之一種電子裝置的立體圖，而圖3 疋，2之電子裝置的剖面示意圖，其中為了清楚呈現電子裝置 之殼體内部的元件，在圖2中省略了殼體的頂部。請參照圖2 與圖3，本實施例之電子裝置200包括殼體210、發熱元件23〇 ，及被動散熱元件250。殼體210具有相對的進氣口 212與出 氣口 214，且進氣口 212與出氣口 214設置於殼體210之相對 的一第一侧壁216。發熱元件230配置於殼體210内。被動散 熱tl件25〇酉己置於發熱元件23〇上，用以幫助發熱元件23 熱。被動散熱元件250具有底部252、二第二側壁254以及^ 201236533 個散熱鰭片256。此二第二側壁254連接於該底部252 兩邊並接觸殼體210的頂部2U，進氣口 212與出氣口 對 於二第二側壁254之間，且此二第二侧壁254沿著從/ 2Π朝向出氣口 214的預定方向D延伸。如此，可於進= 犯與出氣σ 214之間形成—流道2丨3，藉此導引流體（如 子裝置200外部的冷空氣）於此流道213中流動，增加殼體 210内部的自然對流。此外，散熱鰭片256連接於底部並 位於二第二側壁254之間，且每一散熱鰭片256沿著預定方向 D延伸設置，以增加流體與被動散熱元件25〇的接觸面積。 除此之外，殼體210例如更具有至少一容置空間s，位於 至少其中一個第二側壁254的旁邊，而本實施例是以兩個容置 空間S為例。每一容置空間s可用以容納電子裝置2〇〇的至少 一系統元件270。系統元件270例如為儲存元件、電池、電源 供應器或s己憶體模組’但不以此為限。發熱元件230例如是中 央處理器，但在其他實施例中亦可為微處理器，且不侷限於上 述兩者。而且’電子裝置200可更包括一電路板290 ’配置於 殼體210内，用以承載發熱元件230。 在本實施例中’發熱元件230與被動散熱元件250的底部 252相接觸，所以發熱元件230所產生的廢熱會經由被動散熱 元件250的底部252傳導至散熱鰭片256。自進氣口 212進入 流道213中的冷空氣將帶走散熱鰭片256的廢熱並從出氣口 214排出。由於本實施例之殼體210具有進氣口 212與出氣口 214,以使冷空氣能流入殼體210内，所以能提高電子裝置2〇〇 的散熱能力，進而防止殼體210内部各元件的溫度超過溫度規 格。此外，散熱鰭片256與殼體210的頂部211之間存有間距， 此不僅可增加進入流道213的氣體量外，還可避免廢熱直接傳 201236533 導至殼體210頂部211之位於發熱元件230正上方的區域，進 而避免該區域溫度超出安全規格。另外，發熱元件230與被動 發熱元件250的接觸面更可塗佈散熱膏240 ’用以提升熱傳導 效率。 上述之殼體210的材質可為金屬或其他熱的良導體，端看 設計需求而定。除此之外，被動散熱元件250可更具有至少一 翼部258，每一翼部258連接於其中一個第二側壁254，且翼 部258接觸殼體210的頂部211。在本實施例是以兩個翼部258 為例，每一翼部258例如是一散熱片’以將發熱元件230產生 的廢熱經由被動散熱元件250的底部252均勻地傳導至殼體 210。如此，可擴大散熱面積，以減少殼體21〇頂部211的局 部區域產生溫度高於安全規格的情形。而且，翼部258的設計 更可增加容置空間S内氣流流速，以避免系統元件270的溫度 過高。 另外，在圖4所示的另一實施例中，被動散熱元件25〇, 的翼部258’也可以是多個散熱片沿預定方向D排列而成，其 與翼部258的差別僅在於散熱片的數量不同，應用方式並無 不同’故在此不再資述。 需注意的是，若灰塵進入容置空間S中，可能會導致系統 元件270與電路板290受損，且灰塵堆積亦會降低散熱能力。 為了避免此現象，在本實施例之電子裝置2〇〇中，可使被動散 熱元件250的底部252與二第二側壁254接觸殼體210的第一 側壁216 ’且進氣口 212與出氣口 214除位於二第二侧壁254 之間外，更位於被動散熱元件250的底部252與殼體210的頂 部211之間。如此，可防止由進氣口 212或出氣口 214進入流 道213内的灰塵或液體進入容置空間s中，進而避免系統元件 201236533 270的穩定性受影響。 綜上所述，本發明之電子裝置至少具有下列優點其中之 1·由於外部冷空氣可由進氣口進入流道内，以與被動散熱 元件進行熱交換，使發熱元件產生的廢熱能從出氣口排出’所 以能提南散熱效率。 2. 在一實施例中，除了可透過散熱鰭片散熱外，被動散熱 元件的翼部亦可將廢熱均勻地傳導至殼體的頂部，所以能擴大 散熱面積。With the development and advancement of electronic technology, various electronic devices have been developed to meet the needs of users. The heat dissipation capability of these electronic devices is related to the operation of their internal components, which in turn affects the stability of electronic devices. In the case of an electronic device using a passive heat dissipating component, the heat radiating fins of the passive heat dissipating component can increase the heat dissipating area of the electronic device to improve the heat dissipating capability. However, if the passive heat dissipating component itself is improperly placed or improperly placed, it may pose a safety problem in addition to threatening the stability and service life of the electronic device. 1 is a schematic diagram of a conventional electronic device. Referring to FIG. 1, the electronic device 100 includes a housing 110, a processor 130, and a heat dissipation pad 15A. The processor 130 is disposed within the housing ι10, and the thermal pad 15 is disposed on the processor and contacts the top 112 of the housing 110. Thereby, the heat generated by the processor 13 can be conducted to the surface of the casing 110 through the heat dissipation pad 150 for heat dissipation. However, this type of heat dissipation will cause the top 112 to be located above the thermal pad 15 , and the temperature of the domain is too high, and there is a concern that the safety is not met. However, if the heat is not guided to the housing uo (ie, the heat dissipation pad 150 does not contact the top 112 of the housing 110), the heat dissipation capability of the electronic device 100 is greatly reduced, thereby causing the battery having a lower temperature specification inside the electronic device 100. , hard disk, etc. exceed the temperature specifications. In this way, in addition to possibly causing the electronic device to crash, it may even reduce the life of the crucible. 〃 201236533 SUMMARY OF THE INVENTION The present invention provides an electronic device to improve heat dissipation and to comply with temperature regulations. To achieve the above advantages, the present invention provides an electronic device including a housing, a heat generating component, and a passive heat dissipating component. The housing has opposite air inlets and outlets, and the air inlet and the air outlet are disposed on opposite first side walls of the housing. The heating element is disposed in the housing. The passive heat dissipating component is disposed on the heating element, and the passive heat dissipating component has a bottom portion, two second sidewalls, and a plurality of heat dissipating fins. Wherein the first side walls are connected to opposite sides of the bottom and contact the top of the casing, the air inlet and the air outlet are located between the second side walls, and the second side wall is arranged along the air inlet to the air outlet. a direction extending to form a flow path between the air inlet and the air outlet. Further, a heat sealing tab is connected to the bottom and located between the second side walls, and each of the heat dissipation fins is disposed along the predetermined direction, and the There is a gap between the heat sink fins and the top of the housing. In an embodiment of the invention, the passive heat dissipating component further has at least one wing connected to at least one of the second side walls, and the wing contacts the top of the housing. In an embodiment of the invention, each of the wings includes at least one heat sink. In an embodiment of the invention, the bottom and the second sidewall of the passive heat dissipating component are in contact with the first sidewall of the housing, and the air inlet and the air outlet are located at the bottom of the passive heat element and the top of the housing. between. In one embodiment of the present invention, the housing has at least one accommodating space, and is located at least one of the second side walls, and the electronic device further includes at least one system component disposed in the accommodating space. 201236533 In one embodiment of the invention, the at least one system component comprises at least one of a storage component, a battery, a power supply, and a memory module. In an embodiment of the invention, the heat generating component comprises a central processor. In an embodiment of the invention, the electronic device further includes a circuit board disposed in the housing to carry the heat generating component. In an embodiment of the invention, the material of the top of the housing comprises metal. In the electronic device of the present invention, since the outside cold air can enter the flow path through the air inlet to exchange heat with the passive heat dissipating member, the waste heat generated by the heat generating element is discharged from the exit port, so that the heat dissipation efficiency can be improved. In addition, the passive heat dissipating component does not conduct heat to the area of the housing directly above the heating element, so that overheating can be avoided and the temperature can be met. The above and other objects, features and advantages of the present invention will become more <RTIgt; [FIG. 2] FIG. 2 is a perspective view of an electronic device according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of the electronic device of FIG. 3, in which the components inside the casing of the electronic device are clearly shown in FIG. The top of the housing is omitted. Referring to FIG. 2 and FIG. 3 , the electronic device 200 of the embodiment includes a housing 210 , a heating element 23 , and a passive heat dissipating component 250 . The housing 210 has an opposite air inlet 212 and an air outlet 214, and the air inlet 212 and the air outlet 214 are disposed on a first side wall 216 of the housing 210. The heating element 230 is disposed in the housing 210. The passive heat sink tl 25 is placed on the heat generating component 23A to help the heat generating component 23 to be heated. The passive heat dissipating component 250 has a bottom 252, two second sidewalls 254, and ^ 201236533 heat sink fins 256. The two second side walls 254 are connected to the two sides of the bottom portion 252 and contact the top portion 2U of the housing 210. The air inlet 212 and the air outlet port are between the second and second side walls 254, and the second side wall 254 is along the second side wall 254. Extending toward a predetermined direction D of the air outlet 214. Thus, a flow path 2丨3 can be formed between the incoming and outgoing gas σ 214, whereby the fluid (such as cold air outside the sub-device 200) flows in the flow path 213 to increase the inside of the housing 210. Natural convection. In addition, the heat dissipation fins 256 are connected to the bottom portion and located between the second sidewalls 254, and each of the heat dissipation fins 256 extends along the predetermined direction D to increase the contact area of the fluid with the passive heat dissipation member 25A. In addition, the housing 210 has, for example, at least one accommodating space s located beside the at least one of the second side walls 254, and the present embodiment is exemplified by two accommodating spaces S. Each of the housing spaces s can be used to accommodate at least one system component 270 of the electronic device 2''. The system component 270 is, for example, a storage component, a battery, a power supply, or a suffix module, but is not limited thereto. The heat generating component 230 is, for example, a central processor, but may be a microprocessor in other embodiments, and is not limited to the above. Moreover, the electronic device 200 may further include a circuit board 290 disposed in the housing 210 for carrying the heat generating component 230. In the present embodiment, the heat generating component 230 is in contact with the bottom 252 of the passive heat dissipating component 250, so the waste heat generated by the heat generating component 230 is conducted to the heat radiating fins 256 via the bottom 252 of the passive heat radiating component 250. The cold air entering the flow passage 213 from the air inlet 212 will take away the waste heat of the heat radiating fins 256 and be discharged from the air outlet 214. Since the housing 210 of the embodiment has the air inlet 212 and the air outlet 214 so that cold air can flow into the housing 210, the heat dissipation capability of the electronic device 2 can be improved, thereby preventing various components inside the housing 210. The temperature exceeds the temperature specification. In addition, there is a space between the heat dissipating fins 256 and the top 211 of the housing 210, which not only increases the amount of gas entering the flow path 213, but also prevents the waste heat from directly passing through the 201236533 to the top of the housing 210 at the top of the housing 211. The area directly above 230, which in turn prevents the temperature in the area from exceeding safety specifications. In addition, the contact surface of the heat generating component 230 and the passive heat generating component 250 can be coated with the thermal grease 240' to enhance heat transfer efficiency. The material of the above-mentioned housing 210 may be a good conductor of metal or other heat, depending on the design requirements. In addition, the passive heat dissipating member 250 can further have at least one wing portion 258, each wing portion 258 being coupled to one of the second side walls 254, and the wing portion 258 contacting the top portion 211 of the housing 210. In the present embodiment, the two wings 258 are taken as an example, and each of the wings 258 is, for example, a heat sink </ RTI> to uniformly conduct waste heat generated by the heat generating component 230 to the casing 210 via the bottom 252 of the passive heat radiating element 250. In this way, the heat dissipation area can be enlarged to reduce the situation where the temperature of the local area of the top portion 211 of the casing 21 is higher than the safety specification. Moreover, the design of the wings 258 can increase the flow rate of the air within the housing space S to avoid excessive temperature of the system components 270. In addition, in another embodiment shown in FIG. 4, the wing portion 258' of the passive heat dissipating member 25A may also be a plurality of fins arranged in a predetermined direction D, which differs from the wing portion 258 only in heat dissipation. The number of films is different and the application method is not different. Therefore, it is not mentioned here. It should be noted that if dust enters the accommodating space S, the system component 270 and the circuit board 290 may be damaged, and dust accumulation may also reduce heat dissipation capability. In order to avoid this phenomenon, in the electronic device 2 of the embodiment, the bottom 252 and the second sidewall 254 of the passive heat dissipating component 250 can be brought into contact with the first sidewall 216 ′ of the housing 210 and the air inlet 212 and the air outlet. The 214 is located between the second sidewall 254 and the bottom 252 of the passive heat dissipating component 250 and the top 211 of the housing 210. In this way, dust or liquid entering the flow path 213 from the air inlet 212 or the air outlet 214 can be prevented from entering the accommodating space s, thereby preventing the stability of the system component 201236533 270 from being affected. In summary, the electronic device of the present invention has at least the following advantages: 1. The external cold air can enter the flow channel through the air inlet to exchange heat with the passive heat dissipating component, so that the waste heat generated by the heat generating component can be discharged from the air outlet. 'So it can improve the cooling efficiency of the South. 2. In one embodiment, in addition to dissipating heat through the fins, the wings of the passive heat dissipating component can also conduct waste heat evenly to the top of the casing, thereby expanding the heat dissipating area.
3. 由於被動散熱元件的第二側壁可以隔絕灰塵或液體進 入容置空間中，以避免系統元件的穩定度受灰塵或液體的影響 而降低。 雖然本發明已以較佳實施例揭露如上然其並非用以限定 本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍 内’些$之更動與潤飾’因此本發明之保護範圍當視後 附之申請專利範圍所界定者為準。 【圖式簡單說明】 =習知之一種電子裝置的示意圖。 圖2疋本發明一實施例之 圖国1兩種電子裝置的立體透視圖。 圖3疋圖1之電子襞置的剖面圖。 圖4是本發明另一實施例 意圖。 1]之電子裝置的被動散熱元件示 【主要元件符號說明】 100 :電子裝置 201236533 110 :殼體 112 :頂部 130 :處理器 150 :散熱墊 200 :電子裝置 210 :殼體 211 :頂部 212 :進氣口 213 :流道 214 :出氣口 216 :第一側壁 230 :發熱元件 240 :散熱膏 250、250’ ：被動散熱元件 252 :底部 254 :第二侧壁 256 :散熱鰭片 258、258’ ：翼部 270 :系統元件 290 :電路板 D:預定方向 S:容置空間3. Since the second side wall of the passive heat dissipating component can prevent dust or liquid from entering the accommodating space, the stability of the system components is prevented from being affected by dust or liquid. While the present invention has been described in its preferred embodiments, it is not intended to limit the invention, and the scope of the present invention may be modified and modified without departing from the spirit and scope of the invention. This is subject to the definition of the scope of the patent application. [Simple description of the schema] = Schematic diagram of an electronic device of the prior art. Figure 2 is a perspective perspective view of two electronic devices of Figure 1 in an embodiment of the present invention. Figure 3 is a cross-sectional view of the electronic device of Figure 1. Fig. 4 is an illustration of another embodiment of the present invention. 1] Passive heat dissipating component of electronic device [Main component symbol description] 100: Electronic device 201236533 110: Housing 112: Top 130: Processor 150: Thermal pad 200: Electronic device 210: Housing 211: Top 212: Air port 213: flow path 214: air outlet 216: first side wall 230: heat generating element 240: heat-dissipating paste 250, 250': passive heat-dissipating element 252: bottom 254: second side wall 256: heat-dissipating fins 258, 258': Wing 270: system component 290: circuit board D: predetermined direction S: accommodation space