TWI621381B - Laminated body with metal foil with carrier - Google Patents

Abstract

An object of the present invention is to provide a laminate which is excellent in operability and which is easy to handle the high density and multilayering of a wiring circuit. The laminate system uses two sheets to make the metal foil contact the surface of the metal carrier in a peelable manner. The metal foil with a carrier is obtained by laminating the above metal carriers.

Description

Laminate with metal foil with carrier

The present invention relates to a laminate having a metal foil with a carrier. More specifically, it relates to a laminate for manufacturing a single-sided or two-layer multilayer laminated board or an extremely thin hollow substrate used for a printed wiring board.

In general, a printed wiring board is made of a dielectric material called a "prepreg" which is impregnated with a substrate such as a synthetic resin sheet, a glass plate, a glass nonwoven fabric, or paper. Obtained by synthetic resin. Further, a sheet of conductive copper or copper alloy foil or the like is bonded to one side of the prepreg. The laminate thus assembled is generally referred to as a CCL (Copper Clad Laminate) material. The surface of the copper foil that is in contact with the prepreg is usually a rough surface in order to increase the joint strength. A foil of aluminum, nickel, zinc or the like is sometimes used instead of copper or copper alloy foil. These thicknesses are about 5 to 200 μm. The commonly used CCL (Copper Clad Laminate) material is shown in Fig. 1.

Patent Document 1 proposes a metal foil with a carrier made of a synthetic resin-made plate-shaped carrier and a metal foil which is mechanically peeled off on at least one surface of the carrier, and the carrier is described. The metal foil is available for assembly of printed wiring boards. Further, it is disclosed that the peel strength of the plate-shaped carrier and the metal foil is preferably from 1 gf/cm to 1 kgf/cm. According to the attached Since the metal foil of the carrier supports the entire surface of the copper foil by the synthetic resin, it is possible to prevent wrinkles from occurring on the copper foil during the lamination. Further, since the metal foil and the synthetic resin of the carrier are adhered to each other without a gap, when the surface of the metal foil is plated or etched, it can be put into the chemistry for gold plating or etching. In the liquid medicine. Further, since the coefficient of linear expansion of the synthetic resin is at the same level as the copper foil which is a constituent material of the substrate and the prepreg after polymerization, the circuit is not displaced, so that the occurrence of defective products is reduced, and the yield is excellent. effect.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-272589

The metal foil with a carrier described in the patent document 1 is an epoch-making invention that contributes greatly to the reduction of the manufacturing cost by simplifying the manufacturing steps of the printed wiring board and improving the yield. However, the use of the printed wiring board is used for its purpose. There is still room for research. In the metal foil with such a carrier, a resin substrate having a thickness of about 200 μm such as a prepreg is used as a core and a resin-made plate-shaped carrier. On the other hand, as the wiring circuit is increased in density and multilayered, the total number of buildup layers is 20 or more. In this case, in the case where the core is a normal prepreg, the entire buildup substrate is present. In the case where the thickness exceeds 2 mm, the manufacturing equipment cannot be handled by the prior art, and the metal foil with a carrier is also required to be a thinner core, that is, a carrier.

Further, from the viewpoints of practical use, for example, strength, or deterioration in quality due to dents, deformation, and the like, there is a problem in operability in simply reducing the carrier.

The present inventors have achieved good results in realizing a metal foil as in the prior art carrier. Efforts have been made to study the high-density and multilayered laminated body of the wiring circuit. As a result, it has been found that the carrier is made of a metal plate or a metal foil, and the two metal foils with the carrier are in a prescribed pattern. The layering can be carried out to solve the problem, and the present invention has been completed.

That is, the present invention relates to the following.

(1) A laminated body obtained by laminating two metal foils which are obtained by peeling a metal foil to a surface of a metal carrier, and laminating the metal carriers.

(2) The laminate according to (1), which is obtained by directly laminating the above metal carriers with each other via an adhesive as needed.

(3) The laminate according to (1) or (2), wherein the metal carriers are bonded to each other.

(4) The laminate according to (1), which is obtained by laminating the metal carriers described above with an inorganic substrate or a metal plate.

(5) The laminate according to any one of (1) to (4), wherein the metal carrier and the metal foil are bonded together using a release layer.

(6) The laminate according to (5), wherein the peel strength between the metal carrier and the metal foil is 0.5 gf/cm or more and 200 gf/cm or less.

(7) The layered body of (5) or (6), wherein the surface of the metal carrier on the side in contact with the metal foil has a ten-point average roughness (Rz jis) of 3.5 μm or less.

(8) The laminate according to any one of (5) to (7) wherein, after at least one of heating at 220 ° C for 3 hours, 6 hours or 9 hours, the peeling strength of the metal layer to the metal sheet is 0.5. Gf/cm or more and 200 gf/cm or less.

(9) The laminate according to any one of (1) to (8), which has a thickness of from 8 to 500 μm.

(10) The laminate according to any one of (1) to (9), which is provided with a hole.

(11) The laminate according to (10), wherein the diameter of the hole is 0.01 mm to 10 mm, and the hole is provided at 1 to 10.

The laminate according to any one of (1) to (11), wherein the at least one metal foil is a copper foil or a copper alloy foil.

(13) The laminated body according to any one of (1) to (12), wherein at least a part of the outer periphery of the laminated portion of the metal carrier and the metal foil is covered with a resin when viewed from the surface of the metal foil.

(14) The laminate according to (13), wherein the entire outer periphery of the laminated portion of the metal carrier and the metal foil is covered with a resin when viewed from the surface of the metal foil.

(15) The laminate according to (13) or (14), wherein the resin contains a thermosetting resin.

The laminate according to any one of (13) to (15), wherein the resin contains a thermoplastic resin.

The layered body according to any one of (13) to (16), wherein a hole is provided on the outer side of the metal layer of the resin.

(18) The laminate according to (17), wherein the diameter of the hole is 0.01 mm to 10 mm, and the hole is provided at 1 to 10.

(19) A laminated body obtained by cutting the layered body of any one of (1) to (18) along a layer of the metal carrier and the metal foil when the surface of the metal foil is viewed from above.

(20) A method of producing a multilayer metal-clad laminate comprising: laminating a resin or a metal layer one or more times in a surface direction of at least one of the metal foils of the laminate according to any one of (1) to (19).

(21) A method of manufacturing a multilayer metal-clad laminate comprising: (1) to (19) Any one of the laminated layers of the metal foil, the one-sided or two-sided metal-clad laminate, the laminate of any one of (1) to (19), the metal layer or the metal layer of the resin-coated substrate More than 1 time.

(22) The method for producing a multilayer metal laminated board according to (20) or (21), comprising: performing the laminated body on at least one side of a layer of the metal carrier and the metal foil when the surface of the metal layer is viewed from above. The step of cutting off.

(23) The method for producing a multilayer metal-clad laminate according to any one of (20) to (22), further comprising the step of separating the metal foil of the laminate from the metal carrier and separating the metal foil.

(24) The method for producing a multilayer metal-clad laminate according to (22) or (23), further comprising the step of separating the metal foil of the laminated body of the cut portion from the metal carrier and separating the metal foil.

(25) The manufacturing method according to (23) or (24), comprising the step of removing a part or all of the metal foil separated by peeling by etching.

(26) A multilayer metal-clad laminate obtained by the production method of any one of (20) to (25).

(27) A method for producing a build-up substrate, comprising the step of forming one or more build-up wiring layers in the direction of at least one of the metal foils of the laminate according to any one of (1) to (19).

(28) The method for producing a build-up substrate according to (27), wherein the build-up wiring layer is formed by at least one of a subtractive method, a full addition method, or a semi-additive method.

(29) A method for producing a build-up substrate, comprising: laminating resin in a direction of at least one metal foil of the laminate of any one of (1) to (19), a single-sided or double-sided wiring substrate, a single-sided or Two-sided metal-clad laminate, laminated body of any one of (1) to (19), resin-attached substrate The metal layer, wiring, circuit or metal layer is more than one time.

(30) The method for producing a build-up substrate according to (29), further comprising: a single-sided or double-sided wiring substrate, a single-sided or double-sided metal-clad laminate, a metal layer, a metal foil of the laminate, and a metal carrier of the laminate A resin having a metal layer of a resin substrate, a metal layer of a metal layer with a resin substrate, or a resin hole, and a step of conducting and plating the side surface and the bottom surface of the hole.

(31) The method for producing a build-up substrate according to (29) or (30), further comprising the step of forming a metal layer constituting the single-sided or double-sided wiring substrate to form a single-sided or double-sided metal-clad layer A step of forming a wiring on at least one of a metal layer of the board, a metal foil constituting the laminate, a metal layer of a metal layer to which the resin substrate is attached, and a metal layer.

The method for producing a build-up substrate according to any one of (29) to (31), further comprising: laminating the laminate of any one of (1) to (19) on the surface on which the wiring is formed.

(33) The method for producing a build-up substrate according to any one of (27) to (32), comprising: at least one of a laminate of the metal carrier and the metal foil when the laminate is placed on a surface of the metal foil in a plan view The step of cutting off the surface.

(34) A method of producing a build-up wiring board, further comprising: in the method for producing a build-up substrate according to any one of (27) to (33), wherein the metal foil of the laminate is peeled off from the metal carrier The step of separation.

(35) A method of producing a build-up wiring board, further comprising: in the method for producing a build-up substrate according to (33), the metal foil of the laminated body of the cut portion is peeled off from the metal carrier to be separated The steps.

(36) The method for producing a build-up wiring board according to (34) or (35), further comprising the step of removing a part or all of the metal foil separated by peeling by etching.

(37) A build-up wiring board obtained by the production method of any one of (34) to (36).

(38) A method of producing a printed circuit board, comprising the step of producing a build-up wiring board by the manufacturing method according to any one of (34) to (36).

(39) A method of producing a printed circuit board, comprising the step of producing a build-up substrate by the manufacturing method according to any one of (26) to (33).

(40) A build-up substrate obtained by the production method of any one of (26) to (33).

According to the present invention, it is possible to provide a laminate which can achieve high operability and can easily cope with the increase in density and multilayer of the wiring circuit.

10‧‧‧Laminated mold

11‧‧‧Layer

11a‧‧‧metal foil

11b‧‧‧ release layer

11c‧‧‧metal carrier

11d‧‧‧Inorganic substrates and / or metal plates

12‧‧‧Prepreg

13‧‧‧ Inner core

Page 14‧‧‧

15‧‧ ‧

16‧‧‧Additional layer

20‧‧‧Layered body

21‧‧‧Resin

22‧‧‧Metal carrier

23‧‧‧Metal foil

24‧‧‧ release layer

30‧‧‧Layered body

31‧‧‧Resin

32‧‧‧metal foil

40‧‧‧Layered body

41‧‧‧Resin

42‧‧‧ openings

50‧‧‧Layered body

51‧‧‧Resin

52‧‧‧ openings

60‧‧ ‧ laminated body

61‧‧‧Inorganic substrates and / or metal plates

Fig. 1 shows an example of the configuration of the CCL.

Fig. 2 shows a typical configuration example of the laminated body of the present invention.

Fig. 3 shows another typical configuration example of the laminated body of the present invention.

Fig. 4 is a cross-sectional view taken along line A-A' of the configuration example of Fig. 3.

Fig. 5 shows another typical configuration example of the laminated body of the present invention.

Fig. 6 shows another typical configuration example of the laminated body of the present invention.

Fig. 7 shows another typical configuration example of the laminated body of the present invention.

Fig. 8 shows an example of assembly of a multilayer CCL using the laminate of the present invention.

Fig. 9 shows an example of assembly of a multilayer CCL using the laminate of the present invention.

Fig. 10 shows another typical configuration example of the laminated body of the present invention.

Fig. 11 shows another typical configuration example of the laminated body of the present invention.

Fig. 12 shows another typical configuration example of the laminated body of the present invention.

Fig. 13 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

Fig. 14 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

Fig. 15 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

Fig. 16 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

Fig. 17 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

In the laminated system according to an embodiment of the present invention, two metal foils with a metal foil which is detachably contacted with the surface of the metal carrier are used, and the metal substrates are interposed between the inorganic substrates and/or the metal plates as needed. Obtained by layering.

One configuration example of the metal foil with a carrier suitable for use in the present invention is shown in Fig. 2. Fig. 2 shows a laminate obtained by laminating two metal foils 11a with the metal foil 11a adhered to both sides of the metal carrier 11c and laminating the metal carriers. Further, the metal carrier 11c and the metal foil 11a are bonded together via the following release layer 11b.

The metal foil constituting the carrier of the laminate is similar in construction to the CCL shown in Fig. 1, but in the metal foil of the carrier, the metal carrier and the metal foil are finally separated, and thus have a structure which can be easily peeled off by hand. In this respect, CCL is not stripped, so the structure and function are completely different.

Further, another configuration example of the metal foil with a carrier suitable for use in the present invention is shown in Fig. 10. In Fig. 10, a metal foil including two metal carriers 11c which are detachably adhered to the metal foil 11a in the same manner as in Fig. 2 is interposed between the inorganic substrate and/or the metal plate 11d as described below. A laminate obtained by laminating.

Since the metal carrier and the metal foil of the embodiment of the laminated body used in the present invention are separated or peeled off after all, the adhesion is not excessively high, but it is preferably provided with plating in the process of producing a printed circuit board. The degree of adhesion that does not peel off during the chemical treatment step. From such a viewpoint, the peeling strength between the metal layers is preferably 0.5 gf/cm or more, preferably 1 gf/cm or more, preferably 2 gf/cm or more, preferably 3 gf/cm or more, preferably 5 gf/cm. The above is preferably 10 gf/cm or more, more preferably 30 gf/cm or more, still more preferably 50 gf/cm or more, and further preferably 200 gf/cm or less, more preferably 150 gf/cm or less, and further preferably It is 80 gf/cm or less. When the metal layers have adhesiveness to each other, by setting the peeling strength between the metal layers to such a range, peeling does not occur at the time of conveyance or processing, and the peeling can be easily performed by hand.

The adjustment of the peel strength for achieving such adhesion can be easily achieved by performing a specific surface treatment on the surface of the metal carrier as described below.

Further, the laminated body of the present invention may further comprise a resin which covers at least a part of the outer periphery of the laminated portion of the metal carrier and the metal foil when the surface of the metal foil is viewed in plan. Good all.

That is, as a preferred aspect, it is conceivable that the resin covers the entire metal foil and covers the entire circumference of the laminated portion of the metal foil and the metal carrier when viewed from the surface of the metal foil (FIG. 3); the resin-coated metal foil The entire surface is covered with a state 2 of one of the outer circumferences of the laminated portion of the metal foil and the metal carrier (for example, FIG. 4); the resin covers the laminated portion of the metal foil and the metal carrier in such a manner as to have an opening portion when the surface of the metal foil is viewed from above. On the outer circumference, the metal foil is exposed in the opening 3 (for example, FIG. 5 and FIG. 6).

3 and 4 show a typical configuration example of a laminated body. Fig. 3 is a plan view of the configuration example, and Fig. 4 is a cross-sectional view taken along line A-A' of the configuration example.

In Figs. 3 and 4, the two metal foils of the carrier which are formed by bringing the metal carrier 22 into contact with the metal foil 23 via the release layer 24 are formed by laminating the metal carriers 22, and the resin 31 covers the two. The sheet metal foil 23 is entirely integral and covers the entire circumference of the layer of the metal carrier 22 and the metal foil 23.

With such a configuration, the laminated portion of the metal carrier and the metal foil is covered with the resin in a plan view of the surface of the metal foil, and it is possible to prevent other members from being touched in the lateral direction of the portion, that is, in the lateral direction with respect to the lamination direction. As a result, the peeling of the metal foil during the operation can be reduced. Further, by covering the outer periphery of the laminated portion without exposing the outer periphery of the laminated portion, it is possible to prevent the chemical solution from penetrating into the interface in the chemical chemical treatment step such as the step of adding the layer, and it is possible to prevent corrosion or erosion of the metal layer.

Further, as another typical configuration example of the present invention, as shown in Fig. 5, a portion of the laminated portion of the metal carrier and the metal foil may be exposed in plan view. That is, in FIG. 5, the metal foil 32 is not covered by the resin 31 in the side direction, but the metal foil is not separated from the metal carrier. From the point of view, the same effect can be obtained in this aspect. The side surface which is not covered by the resin 31 is in a state in which the laminated portion is exposed, so that it is difficult to prevent the chemical solution from infiltrating from the direction. Therefore, in the case where the corrosion or erosion of the metal foil becomes a serious problem, it is necessary to prevent the penetration of the chemical liquid from four directions, and in this case, the aspect of Fig. 3 is preferable.

Further, in the laminate of FIGS. 3 to 5, for example, a laminate obtained by laminating the metal foils of the carrier of the present invention with two sheets of resin is sandwiched, and the plate-like resin is maintained in order to maintain the structure. Heating each other is followed. This heating is then carried out by hot pressing at a temperature at which the resin flows. Alternatively, even if heating is not performed, it is sufficient if there is a certain degree of adhesion. Therefore, when the resins are closely adhered to each other, an adhesive such as an epoxy resin-based adhesive can be suitably used. Further, the adhesion can be effectively exhibited when the region in which the plate-shaped resin is subsequently or heated is within a certain range. From this point of view, the ratio (Sa/Sb) of the area (Sa) of the metal foil and the area (Sb) of the plate-shaped resin in a plan view is 0.6 or more and less than 1.0, preferably 0.80 or more and 0.95 or less. It is preferable to ensure that the plate-like resins are adhered to each other or heated to a necessary sufficient area. Further, in another aspect, the ratio of the area (Sp) of the two sheets of the plate-like resin and the area (Sq) of the plate-like resin including the above-mentioned subsequent or heated surface is followed by or heating. (Sp/Sq) is preferably 0.001 or more and 0.2 or less, preferably 0.01 or more and 0.20 or less, and it is also preferable to ensure a sufficient area for adhering or heating the plate-shaped resins to each other. The area and shape of the two plate-shaped resins laminated on the respective metal foils are preferably the same or different. In the case where the area and shape of the two plate-shaped resins are different, the values of Sa and Sq are values of a plate-shaped resin having a large area.

Further, the shape of the resin is not limited as long as it can cover the laminated portion of the metal foil and the metal carrier. That is, the shape of the resin in a plan view is disclosed in FIGS. 3 to 5. It is a square shape, but it can also be set to a shape other than it. On the other hand, the metal layer may have a shape other than a square.

Here, the metal layer with a carrier is such that the laminate 20 (or laminate 30) shown in FIG. 3, FIG. 4 (or FIG. 5) is along the resin-containing 21-metal foil 23-release layer 24-metal carrier 22- Release layer 24 - Metal foil 23 - The surface of the laminated structure of the resin 21, that is, the cutting line B is obtained by cutting. Alternatively, as described below, the cutting of the metal foil and the metal carrier may be performed along the surface of the metal foil. Alternatively, the wiring layer, the resin, the buildup layer, and the like may be laminated on the laminate, and then the metal layer may be separated by cutting at the predetermined position to form a multilayer metal laminate or a build-up substrate. The state in which the metal layer is exposed on the outermost surface.

By providing the thus-exposed metal layer for circuit formation, the manufacturing cost reduction effect can be maintained and the productivity can be improved by simplifying the manufacturing steps of the printed circuit board and improving the yield as before.

When the surface of the metal foil of the laminated body is viewed in a plan view, in the region occupied by the laminated body, in the case where the outer side of the use region of the laminated body (for example, the finally formed circuit) has sufficient space, the metal in the laminated body The space on the outer side of the use region in the layer or the resin in the case where the laminate is covered with a resin on the laminate layer as described below is provided with a hole having a diameter of about 0.01 mm to 10 mm at a position of 1 to 10 using a drill or the like. about. Here, the diameter means the smallest diameter of the circle surrounding the hole. The hole thus provided can be used as a mechanism for fixing a positioning pin or the like when manufacturing the multilayer metal laminated board described below or when manufacturing a build-up substrate. One of the cross sections of the laminated body that has passed through the opening is illustrated in Fig. 12 . In Fig. 12, an example is disclosed in which a metal carrier of two metal foils with carrier metal having a metal carrier 22 and a metal foil 23 which is detachably contactable to the surface of the metal carrier is used at the end with an adhesive 112 The layered body obtained by joining, in the When the laminate is viewed, a hole 114 is formed inside the adhesive 112. Further, before the opening, the metal foil and the metal carrier are formed in the same shape, and the ends are aligned, that is, in the case of being rectangular, the positions of the four corners in the plan view are not overlapped, and thus It is preferable to make the alignment at the time of opening the hole easy.

Further, in the present invention, the metal carrier and the metal foil are adhered to each other via a release layer. As a suitable release layer, for example, any release layer or intermediate layer known to those skilled in the art for copper foil with a carrier (very thin copper foil with a carrier) can be used. For example, it is preferred that the release layer be composed of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, or alloys thereof, or such hydrates, or oxides thereof. Or a layer of any one or more of organic substances. The release layer can also be composed of a plurality of layers. Further, the release layer may have a function of preventing diffusion. Here, the function of preventing diffusion means that it has an effect of preventing the element from the base material from diffusing to the side of the extremely thin copper layer.

In one embodiment of the present invention, the release layer 24 of FIG. 4 is composed of an element group including Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al from the metal carrier 22 side. a single metal layer of an element or an alloy layer containing one or more elements selected from the group of elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al (these have a function of preventing diffusion), and A layer of a hydrate or an oxide or an organic substance containing one or more elements selected from the group consisting of elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al is laminated thereon.

Further, for example, the release layer 24 may be a single metal layer containing any one of elemental groups of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, and Zn from the side of the metal carrier 22 or An alloy layer containing one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, and Zn, and then containing Cr, Ni, Co, Fe, Mo, Ti a single metal layer of any one of the element groups of W, P, Cu, Al, Zn or an element group selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, and Zn An alloy layer of one or more elements. Further, the total adhesion amount of each element may be, for example, 1 to 50000 μg/dm ² , and for example, the adhesion amount may be 1 to 6000 μg/dm ² .

Preferably, the release layer 24 is composed of two layers including a Ni layer and a Cr layer. In this case, lamination is performed such that the Ni-containing layer is located at the interface with the metal carrier 22 and the Cr-containing layer is located at the interface with the metal foil 23 (for example, a copper foil or an ultra-thin copper layer).

The release layer 24 can be wet-plated by, for example, electroplating, electroless plating, and immersion plating, or sputtering, CVD (Chemical Vapor Deposition), and PVD (Physical Vapor Deposition). It is obtained by dry plating such as. From the viewpoint of cost, electroplating is preferred.

Further, for example, the release layer 24 may be formed by sequentially laminating a nickel layer, a nickel-phosphorus alloy layer or a nickel-cobalt alloy layer, and a chromium layer or a chromium-containing layer on the carrier. Since the adhesion force of nickel and copper is higher than the adhesion force of chromium and copper, in the case where the metal foil 23 is an extremely thin copper layer of a copper foil with a carrier, it becomes extremely thin copper when the ultra-thin copper layer is peeled off. The layer is peeled off from the interface between the chrome layer or the chromium-containing layer. Further, in the nickel of the release layer 24, an effect of preventing the barrier component which is a carrier constituent element from diffusing from the carrier to the metal foil 23 (for example, a copper foil or an extremely thin copper layer) can be prevented. The amount of nickel in the adhesion of the release layer 24 is preferably ² or less 100μg / dm ² or more and 40000μg / dm, more preferably 100μg / dm ² or more and 4000μg / dm ² or less, more preferably 100μg / dm ² or more and 2500μg /dm ² or less, more preferably 100 μg/dm ² or more and less than 1000 μg/dm ² , and the amount of chromium deposited in the release layer 24 is preferably 5 μg/dm ² or more and 100 μg/dm ² or less. In the case where the release layer 24 is provided only on one side of the metal carrier 22, it is preferable to provide a rust-proof layer such as a Ni plating layer on the opposite side of the metal carrier 22. Further, the chromium-containing layer may be a chromate treatment layer or a chromium alloy plating layer. The chrome layer can also be a chrome layer.

Further, the release layer may also be formed of an adhesive.

Further, the metal foil is brought into contact with the carrier in a peelable manner, and the metal foil and the carrier are joined by using a bonding method such as ultrasonic welding.

Further, as shown in FIG. 6, the laminated body 40 may have an opening 42 when viewed from at least one surface thereof, and a structure in which the metal foil 23 is exposed in the opening. FIG. 6 discloses a case where an opening portion is provided on both surfaces of the laminated body.

The opening portion can be obtained by a conventional photolithography technique, or a technique of etching only the opening portion after laminating a masking tape or a masking sheet, or a laminate obtained by bringing two metal layers into contact with a resin by pressurization. It is formed by crimping or thermocompression bonding. The opening portion may be formed inside the end portion (outer periphery) of the metal layer in plan view, or may reach at least a part of the outer periphery of the metal layer or the outer portion of the laminated portion of the two metal layers.

Further, as shown in FIG. 7, when the metal foil 23 is exposed, the resin 51 covers only the layer of the metal carrier 22 and the metal foil 23, that is, the end portion of the outer periphery of the metal foil 23 of the release layer 24. Even in such a laminate 50, it is possible to prevent the chemical solution from entering the release layer 24 during the lamination process, which is the use of the laminate as described below.

Although the production method of the present invention is as described above, in the practice of the present invention, other steps may be included between or before the above steps within a range that does not adversely affect the above steps. For example, the cleaning step of cleaning the surface of the metal carrier may also be performed prior to forming the release layer.

Further, in the manufacturing process of the multilayer printed wiring board, heat treatment is often performed in the build-up pressurization step or the desmear step. Therefore, the more the number of layers, the harsher the thermal history of the laminate. Therefore, in consideration of application to, in particular, a multilayer printed wiring board, After the desired thermal history, it is preferred that the peel strength between the metal support and the metal foil is within the ranges described above.

Therefore, in a further preferred embodiment of the present invention, the metal carrier is assumed to be heated under the heating process of the multilayer printed wiring board, for example, after heating at 220 ° C for at least one of 3 hours, 6 hours or 9 hours. The peeling strength with the metal foil is preferably 0.5 gf/cm or more, preferably 1 gf/cm or more, preferably 2 gf/cm or more, preferably 3 gf/cm or more, preferably 5 gf/cm or more. It is preferably 10 gf/cm or more, preferably 30 gf/cm or more, more preferably 50 gf/cm or more. Further, the peel strength is preferably 200 gf/cm or less, preferably 150 gf/cm or less, and more preferably 80 gf/cm or less.

With respect to the peel strength after heating at 220 ° C, it is preferable that the peel strength of both of them after 3 hours and after 6 hours or after 6 hours and 9 hours satisfies the above range from the viewpoint of a plurality of layers. Further, it is preferred that all of the peel strengths satisfy the above range after 3 hours, 6 hours, and 9 hours.

In the present invention, the peel strength is measured in accordance with the 90-degree peel strength measuring method specified in JIS C6481.

Hereinafter, specific constituent elements of each material for realizing such peel strength will be described.

As the metal carrier or the metal foil, a copper or copper alloy plate or foil is representative, and a plate or foil of aluminum, nickel, zinc or the like can also be used. In particular, in the case of using a copper or copper alloy foil, an electrolytic foil or a rolled foil can be used. The metal foil is not limited. However, in consideration of the wiring used as the printed circuit board, the thickness thereof is generally 0.1 μm or more, preferably 0.3 μm or more, preferably 0.5 μm or more, preferably 1 μm or more, preferably 1.5 μm or more, preferably 2 μm or more, and 400 Μm or less, preferably 120 μm or less, preferably 50 μm or less, preferably 35 μm or less, preferably 25 μm or less, preferably 15 μm or less, preferably 10 μm or less, preferably 7 μm or less, preferably 5 μm or less. Preferably, it is 4 μm or less. As the metal foil used for the metal foil with a carrier, a metal foil of the same thickness may be used, or a metal foil of a different thickness may be used.

Here, the thickness of the metal carrier is typically about 3 to 900 μm, or about 3 to 500 μm, or about 3 to 300 μm, in consideration of a core material used for wiring or a printed circuit board for manufacturing a printed circuit board. Or it is about 3 to 125 μm, and it is preferable to be thinner than a resin substrate such as a conventional prepreg. Further, in the laminated body of the present invention, two such metal foils with a carrier are used, and the metal carriers are brought into contact with each other and laminated. Therefore, the laminate of the metal foil with the conventional carrier can be used, and the operability can be improved based on the strength of the laminate or the occurrence of quality defects caused by dents, deformation, and the like. It is maintained. Further, since a thin laminated body can be produced, it can be used in conventional manufacturing equipment, and can cope with high density and multilayer of wiring circuits.

From this point of view, the thickness of the laminate of the present invention shown in Fig. 2 is typically 6 to 1800 μm, preferably 6 to 1500 μm, preferably 6 to 1000 μm, preferably 6 to 800 μm, preferably 8 to 500 μm, preferably 8 to 250 μm, preferably 10 to 200 μm, preferably 10 to 180 μm, preferably 10 to 160 μm, preferably 10 to 150 μm, preferably 10 to 120 μm, preferably 10 ~100 μm, preferably 10 to 80 μm.

Various surface treatments can also be carried out for the metal carrier or metal foil used. For example, metal plating for imparting heat resistance (Ni plating, Ni-Zn alloy plating, Cu-Ni alloy plating, Cu-Zn alloy plating, Zn plating, Cu-Ni-Zn alloy plating) , Co-Ni alloy plating, etc.), chromate treatment for imparting rust resistance or discoloration resistance (including the chromate treatment solution containing 1 For the above-mentioned alloying elements such as Zn, P, Ni, Mo, Zr, Ti, etc.), roughening treatment for adjusting the surface roughness (for example, by electroplating copper particles or Cu-Ni-Co alloy plating, Cu -Ni-P alloy plating, Cu-Co alloy plating, Cu-Ni alloy plating, Cu-W alloy plating, Cu-As alloy plating, Cu-As-W alloy plating, etc. Processed). The roughening treatment of course has an effect on the peel strength of the metal foil and the metal carrier, and the chromate treatment also has a large influence. The chromate treatment is important from the viewpoint of rust resistance or discoloration resistance, but it is noticeable that the peel strength is remarkably improved, and therefore it is also useful as a means for adjusting the peel strength.

Further, the lamination of the metal carriers may be carried out by, for example, the following method, in addition to simply superposing them. Furthermore, the metal carriers may be bonded to each other before the metal foil is brought into contact with the metal carrier, or after the metal foils of the carrier are overlapped with each other, in particular by the method of producing irregularities on the surface of the carrier layer. In this case, the metal carriers may be joined to each other, and then laminated so that the metal foil does not contact the joint portion.

(a) Metallurgical joining method: welding (arc welding, TIG (Tungsten Inert Gas) welding, MIG (Metal Inert Gas) welding, resistance welding, seam welding, spot welding), crimping (ultrasonic welding, friction stir welding), butt welding; (b) mechanical joining method: caulking, joining by rivets (joining by self-piercing rivets, joining by rivets), stitching; c) Physical bonding method: adhesive, (double-sided) tape

One metal layer may be partially or completely joined to one or the other of the other metal layer by a bonding method, and one metal layer may be laminated with another metal layer to form a metal layer in a separable manner. a laminate formed by contact. Where a metal layer is weakly bonded to another metal layer and a metal layer is laminated with another metal layer, even if not The joint between one metal layer and the other metal layer is removed, and one metal layer and the other metal layer may be separated. Moreover, in the case where one metal layer is strongly bonded to the other metal layer, the joint of one metal layer and the other metal layer can be removed by cutting or chemical polishing (etching, etc.), mechanical polishing, or the like. This separates one metal layer from another.

In the present invention, when the resin is bonded to the surface of the metal foil, the peel strength is preferably higher. In this case, for example, it is preferable to carry out surface treatment such as roughening treatment by setting a rough surface (M surface) of a metal layer (for example, an electrolytic copper foil) to the surface of the resin, and to obtain chemical and physical properties. The adhesion caused by the anchoring effect is increased.

In the case where the resin is used to cover the laminate, the resin is not particularly limited, and a thermosetting resin such as a phenol resin, a polyimide resin, an epoxy resin, polyethylene, polypropylene, or polyphenyl can be used. Ethylene, polyurethane, styrene butadiene resin emulsion, acrylonitrile butadiene resin emulsion, carboxyl modified styrene butadiene copolymer resin emulsion, acrylic resin emulsion, natural rubber, turpentine, fluororesin (poly Tetrafluoroethylene, polyvinylidene fluoride, etc.), anthracene resin, anthrone; or a thermoplastic resin such as polyethylene, polypropylene, polystyrene, acrylic resin, thermoplastic polyurethane, or thermoplastic natural rubber. More typically, a heat resistant resin which does not melt at 250 ° C and/or has a glass transition temperature of 200 ° C or higher, such as a fluororesin (polytetrafluoroethylene, polyvinylidene fluoride, etc.), is preferably used. A heat resistant resin which does not melt at 250 ° C and has a glass transition temperature of 200 ° C or higher, such as a polyimide resin or a liquid crystal polymer resin (LCP resin). Further, the resin is preferably a resin which is resistant to chemical liquid chemicals, particularly acid resistance and gel residue resistance. In addition, the term "slag removal treatment" as used herein refers to the process of removing the metal foil by etching or the like after the hole is formed by the laser and/or the drill, or after the metal foil is bonded to the surface of the resin. The resin or the metal foil such as the residue of the copper foil is removed by the treatment liquid, The "degreasing solution" refers to the treatment liquid used at this time. Further, the viscosity of the resin may be 0.5 Pa ‧ or more, 1 Pa ‧ s or more, 5 Pa ‧ s or more, 10 Pa ‧ s or more, and 10000 Pa ‧ s or less, 5000 Pa ‧ s or less, and 3,000 Pa ‧ s or less. The range below s is measured in accordance with JIS Z 8803 (2011) and using JIS Z 8803 (2011) "6 Viscosity measurement method using a thin tube viscometer 6.2.3 Ubbel viscometer" for more than 100 Pa‧ The range of s is measured by "Sensitivity measurement method by a ball ball viscometer" of JIS Z 8803 (2011).

Also, a prepreg can be used. The prepreg which is attached to the front of the metal foil is preferably in the B-stage state. Since the linear expansion coefficient of the prepreg (C-stage) is 12 to 18 (×10 ^-6 /°C), 16.5 (×10 ^-6 /°C) of the copper foil as a constituent material of the substrate, or the SUS pressure plate Since 17.3 (×10 ^-6 /°C) is substantially equal, circuit misalignment caused by a phenomenon in which the size of the substrate before and after pressurization is different from the size at the time of design (scaling change) is less likely to occur, which is advantageous in this respect. Further, as a synergistic effect of these advantages, there is an extremely thin hollow substrate which can produce a plurality of layers. The prepreg used herein may be the same as or different from the prepreg constituting the circuit substrate.

In the case of using a prepreg, when the metal foil with a carrier is viewed from the side of the metal foil, the penetration of the chemical liquid to the side surface of the laminate is effectively suppressed, and it is preferable to use a one-size larger one. From the viewpoint of preventing the prepreg from expanding and oozing during pressurization and effectively preventing contamination of other layers, it is preferred to laminate a metal foil or a metal carrier having a larger size on the B-stage prepreg.

Further, it is preferable that the thermal expansion coefficient of the resin is within +10% or -30% of the thermal expansion coefficient of the metal foil and the metal carrier. Thereby, it is possible to effectively prevent the circuit from being displaced due to the difference in thermal expansion between the metal foil and the metal carrier and the resin, thereby reducing the occurrence of defective products and improving the yield.

The thickness of the resin is not particularly limited, and may be rigid or flexible. If it is too thick, it may adversely affect the heat distribution in hot pressing. On the other hand, if it is too thin, it may be bent, resulting in a printed wiring board. Since the production step is not performed, it is usually 5 μm or more and 1000 μm or less, preferably 50 μm or more and 900 μm or less, and more preferably 100 μm or more and 400 μm or less.

Further, in a state in which at least a part of the surface of the metal foil is covered with a resin in a plan view, the thickness of the resin layer is preferably as small as possible, and is typically 50 μm or less, preferably 40 μm or less, and more preferably 30 μm or less. Typically, it is 1 μm or more, preferably 2 μm or more, and more preferably 5 μm or more. Here, the thickness of the resin layer herein means a thickness t of a portion of the resin 41 covering the metal foil 23 when the laminated body 40 is viewed as shown in FIG. 6, for example.

Further, from the viewpoint of yield, it is preferable to provide an opening portion in a plan view of the laminated body, and to connect the wiring at the end portion of the metal foil 23, perpendicular to the wiring and perpendicular to the wiring of the end portion of the metal layer in a plan view. The width of the resin in the direction, for example, the width w of the resin 41 from the end of the opening 42 of the resin 41 to the end of the metal foil 23 in the aspect shown in Fig. 6 is typically 10 mm or less, preferably It is 5 mm or less, more preferably 3 mm or less, and is typically 0.1 mm or more, preferably 0.2 mm or more, and further preferably 0.5 mm or more. If the width of the resin layer is too large, it is not preferable from the viewpoint of yield, and if it is too small, the effect of effectively infiltrating the chemical solution from the end of the opening portion is effectively reduced.

Therefore, in the case where the surface of the metal foil of the laminate of the present invention is covered with a resin, in a preferred embodiment, the peel strength of the surface of the resin and the metal foil is adjusted to a preferred range (for example, 800 gf/cm). The above), and the surface roughness of the bonding surface is set to 0.4 μm in terms of the ten-point average roughness (Rz jis) of the surface of the metal foil measured in accordance with JIS B 0601:2001. The above is preferable, preferably 0.5 μm or more, preferably 0.8 μm or more, preferably 1.0 μm or more, more preferably 1.2 μm or more, more preferably 1.5 μm or more, and still more preferably 2.0 μm or more. Further, it is not necessary to particularly set the upper limit, and it is preferably 10.0 μm or less, preferably 8.0 μm or less, preferably 7.0 μm or less, preferably 6.0 μm or less, and preferably 5.0 μm or less.

Further, in a preferred embodiment of the laminated body of the present invention, in order to form a circuit by an Embedding Method and to provide a circuit or wiring on the metal foil, in order to bond the metal foil to the circuit or The peeling strength between the wiring, or the resin embedded in the circuit or the wiring is adjusted to the above preferred range, and the surface roughness of the surface on the opposite side of the side on which the metal carrier of the metal foil exists is based on JIS B 0601: The ten-point average roughness (Rz jis) measured in 2001 is preferably 3.5 μm or less, more preferably 3.0 μm or less. Among them, it is preferable to reduce the surface roughness in an unrestricted manner, which leads to an increase in cost, and therefore it is preferably 0.1 μm or more, and more preferably 0.3 μm or more.

A metal foil with a carrier formed by bringing a metal foil into contact with the metal carrier so as to be embedded in the resin, and at least a part of the outer periphery of the laminated portion is covered with a resin when the metal foil is viewed from above. As a condition for producing the hot pressing thereof, in the case of using a prepreg (for example, a plate-like prepreg) as a resin, it is preferably a glass having a pressure of 30 to 40 kg/cm ² or higher than the prepreg. Hot pressing is carried out at a temperature of the temperature.

Further, an inorganic substrate and/or a metal plate may be interposed between the metal carriers of the laminate shown in FIGS. 2 to 7. An example in which an inorganic substrate or a metal plate is used for the laminated body shown in Fig. 6 is shown in Fig. 11 .

In Fig. 11, the laminated body 60 is formed by using two metal foils in which the metal foil 23 is detachably contacted with the surface of the metal carrier 22, and the inorganic carrier is interposed between the metal carriers 22 The substrate and/or the metal plate 61 are obtained by laminating. This inorganic substrate or metal plate 61 functions as a core material described below.

Examples of such an inorganic substrate include ceramics, aluminum nitride, and aluminum oxide. Further, examples of the metal plate include an aluminum plate, an aluminum alloy plate, a nickel plate, a nickel alloy plate, a stainless steel plate, a copper alloy plate, a copper plate, an iron plate, an iron alloy plate, a zinc plate, and a zinc alloy plate. The thickness of the inorganic substrate and/or the metal plate is not particularly limited, and is, for example, 1 μm or more, preferably 2 μm or more, more preferably 5 μm or more, still more preferably 10 μm or more, particularly preferably 15 μm or more, and 10,000 μm or less. It is 5000 μm or less, more preferably 1000 μm or less, further preferably 300 μm or less, and particularly preferably 200 μm or less.

Moreover, the inorganic substrate, the metal plate, and the metal carrier can be laminated by using an adhesive, soldering, various bonding methods described above, or the like, and can be adhered to each other in a peelable manner.

Further, by laminating the laminated body 60 shown in Fig. 11 along the line B (or the line C), for example, a laminated body as shown in Fig. 10 can be obtained.

Further, from another viewpoint, the present invention provides the use of the above laminated body. Firstly, a method for producing a multilayer metal-clad laminate comprising: laminating a resin or a metal layer one or more times in a direction of a surface of at least one of the metal foils, that is, a direction substantially perpendicular to a surface of the metal foil; For example, 1~10 times. Here, the metal layer may be a layer containing a metal as described above as a metal foil and a metal carrier, and is typically in the form of a foil or a plate.

Secondly, a method for producing a multi-layer metal-clad laminate comprising: a resin layer, a single-sided or two-sided metal-clad laminate, or a laminate of the present invention, in the direction of at least one of the metal foils of the laminate; The laminate shown in Figure 2 or Figure 10 or Figure 3 to Figure 7 The laminate obtained by cutting the resin-covered laminate or the laminate of the inorganic substrate and/or the metal plate interposed between the metal carriers, the metal layer with the resin substrate, or the metal layer shown in FIG. More than 1 time. Further, the laminate may be arbitrarily selected from the group consisting of a resin, a single-sided or double-sided metal-clad laminate, a laminate of the present invention, and a metal layer. Moreover, as the metal layer to which the resin substrate is attached, a metal foil or the like having a carrier of a conventional resin carrier or a metal carrier can be suitably used.

In the above method for producing a multilayer metal laminated board, the method may be characterized in that the metal foil is peeled off from the metal carrier and separated in a portion of the metal foil in a peelable state. Here, the portion of the metal foil in the peelable state is assumed to be the metal foil of the laminate shown in FIG. 2, instead of the laminate covered with the resin shown in FIGS. 3 to 7, but even FIG. 2 In the method of joining the metal laminates, for example, a metallurgical joining method or a mechanical joining method, the metal foil may be peeled off from the metal carrier by a cutting step as described below.

Moreover, the step of cutting the laminated body on at least one surface of the layer of the metal foil and the metal carrier, for example, the metal foil of the laminated body, when the surface of the metal layer is viewed in plan may be included. In this case, the method further includes the step of separating and separating the metal foil of the laminated body after the cutting from the metal carrier. In the above method for producing a multilayer metal laminated board, the method further comprises the step of cutting the laminated body on at least one surface of the layer of the metal foil and the metal carrier when the surface of the metal foil is viewed in plan.

Furthermore, the method further includes the step of removing a part or all of the metal foil by etching after separating the metal foil from the metal carrier.

Thirdly, a method for producing a build-up substrate comprising: laminating a resin, a single-sided or two-sided wiring substrate, and a single side to a surface direction of at least one of the metal foils of the laminate; Or a double-sided metal-clad laminate, a laminate of the present invention, a laminate obtained by the laminate shown in Fig. 2 or Fig. 10 or a laminate covered with a resin as shown in Figs. 3 to 7 or a laminate obtained by Fig. 11 or It is shown that the metal substrate is interposed with a laminate of an inorganic substrate and/or a metal plate, a metal layer with a resin substrate, a wiring, a circuit, or a metal layer, for example, 1 to 10 times. Furthermore, the laminate is only required to be used as many times as required, and each of the laminates can be composed of a resin, a single-sided or double-sided wiring substrate, a single-sided or double-sided metal-clad laminate, a laminate of the present invention, and a metal layer. Choose arbitrarily. In the same manner as described above, as the metal layer to which the resin substrate is attached, a conventional metal foil with a carrier or the like can be suitably used.

Fourthly, there is provided a method for producing a build-up substrate comprising the step of laminating one or more build-up wiring layers in a direction of at least one of the metal foils of the laminate. At this time, the build-up wiring layer can be formed by at least one of a subtractive method or a full additive method or a semi-additive method.

Here, the fourth application of the laminated body, that is, the so-called subtractive method in the method of manufacturing the build-up substrate, means that the metal-clad laminate or the wiring substrate (including the printed wiring board and the printed circuit) is selectively removed by etching or the like. A method of forming a conductor pattern on an undesired portion of the metal layer on the board). The full addition method is a method in which a metal layer is not used as a conductor layer, and a conductor pattern is formed by electroless plating and/or electroplating, and the semi-additive method is performed by electroless plating on, for example, a seed layer including a metal layer. After the metal is deposited and subjected to electroplating, etching, or a combination of the two to form a conductor pattern, a method of etching the removed seed layer to obtain a conductor pattern is performed.

The method for producing a build-up substrate described above may further include: a single-sided or double-sided wiring substrate, a single-sided or double-sided metal-clad laminate, a metal foil of a laminate, a metal carrier of a laminate, a metal layer, and a resin substrate Metal layer resin, metal layer with resin substrate The metal layer or the resin is perforated, and the step of conducting plating is performed on the side and the bottom surface of the hole. Further, the method further includes the step of forming a metal layer constituting the single-sided or double-sided wiring substrate, a metal layer constituting the single-sided or double-sided metal-clad laminate, a metal foil constituting the laminate, and a metal plated with the resin substrate. A step of forming a wiring on at least one of the metal layer of the layer and the metal layer.

In the method of manufacturing the build-up substrate described above, the laminate of the present invention may be laminated on the surface on which the wiring is formed, that is, the laminate shown in FIG. 2 or FIG. 10 or as shown in FIGS. 3 to 7. The step of forming the laminate obtained by the resin or the laminate obtained by interposing the inorganic substrate and/or the metal plate between the metal supports as shown in FIG.

Further, the term "surface formed with wiring" means a portion where wiring is formed on each surface which is formed during the layering process, and for the build-up substrate, the final product, including the semi-finished product thereof.

In the method for producing a build-up substrate described above, the method may include a step of separating and separating the metal foil from the metal carrier in a portion of the metal foil in a peelable state. Here, the portion of the metal foil in the peelable state is assumed to be the metal foil of the laminate shown in FIG. 2, and is not the laminate covered by the resin shown in FIGS. 3 to 7, but even FIG. 2 In the method of bonding the metal laminate, for example, a metallurgical joining method or a mechanical joining method, the metal foil may be peeled off from the metal carrier by a cutting step as described below.

Moreover, the step of cutting the laminated body on at least one surface of the layer of the metal foil and the metal carrier, for example, the metal foil of the laminated body, when the surface of the metal layer is viewed in plan may be included. In this case, the method further includes the step of separating and separating the metal foil of the laminated body after the cutting from the metal carrier. In the above method for manufacturing a build-up substrate, the method further includes: When the surface of the metal foil is viewed, the step of cutting the laminated body on at least one of the layers of the metal foil and the metal carrier. Alternatively, in the case where the metal carriers are joined or welded to each other or subsequently, the laminate may be cut inside the joint, the weld or the subsequent portion when the laminate is viewed in plan. Further, the joint portions of the metal carriers may be removed by chemical polishing such as cutting, grinding, mechanical polishing, or etching.

Furthermore, the method further includes the step of removing a part or all of the metal foil by etching after separating the metal foil from the metal carrier.

Further, in the above-described method for producing a multilayer metal-clad laminate and a method for producing a build-up substrate, the layers may be laminated by thermocompression bonding. The thermocompression bonding can be carried out each time the layer is laminated, or can be concentrated after a certain degree of lamination, or can be concentrated in the last one.

In particular, the present invention provides a method of manufacturing the above-described build-up substrate, comprising performing at least one of the following steps: a single-sided or double-sided wiring substrate, a single-sided or two-sided copper-clad laminate, a laminate of the present invention, ie, FIG. 2 or The laminate shown in FIG. 10 or the laminate obtained by cutting the resin-covered laminate shown in FIGS. 3 to 7 or the inorganic substrate and/or the metal plate interposed between the metal carriers as shown in FIG. a metal foil of the laminate, a metal carrier of the laminate, a metal layer, a resin of a metal layer with a resin substrate, a metal layer of a metal layer with a resin substrate, or a resin opening, and are formed on the side and the bottom surface of the hole Conductive plating, followed by forming a metal foil and a circuit portion of the single-sided or double-sided wiring substrate, a metal foil constituting a single-sided or double-sided copper-clad laminate, a metal foil constituting the laminate, and a metal layer of a metal layer with a resin substrate Or the step of forming a circuit on the metal layer.

Hereinafter, a method of producing a four-layer CCL using the laminate of the present invention will be described as a specific example of the above-described use. The laminated system used here makes the metal shown in Figure 2 The body 11c and the metal foil 11a are formed in a separable manner by being separated from each other via the peeling layer 11b. A prepreg 12 having a desired number of sheets, a two-layer printed circuit board called an inner core 13, or a two-layer metal clad laminate, a prepreg 12, and a metal layer with a resin are sequentially stacked on the laminate. Complete a set of 4 layers of CCL assembly units. Next, the unit 14 (generally referred to as "page") is repeated about 10 times to form a pressurized assembly 15 (collectively referred to as "book") (Fig. 8). Thereafter, the book stack 15 is placed on the hot press by the build-up mold 10, and press molding is performed at a predetermined temperature and pressure to simultaneously produce a plurality of four-layer CCL. As the build-up mold 10, for example, a stainless steel flat plate can be used. The flat plate is not limited, and for example, a thick plate of about 1 to 10 mm can be used. Regarding CCL of 4 or more layers, it is generally possible to produce in the same step by increasing the number of layers of the inner core.

In the following, as a specific example of the above-described application, a method of manufacturing a hollow build-up substrate using the laminated body 11 in which the metal foil 11a is separated by the release layer 11b is used as an example. The metal foil with the carrier formed by contacting the metal carrier 11c is formed so that the metal carrier 11c is in contact with each other. In this method, the buildup layer 16 of the desired number of layers is laminated on both sides of the laminate 11, and finally the two metal foils 11a are peeled off from the metal carrier 11c (see Fig. 9).

Further, for example, a build-up substrate can be produced by sequentially laminating a resin as an insulating layer, a two-layer circuit substrate, and a resin as an insulating layer on the laminated body of the present invention, and sequentially superimposing the present invention thereon The laminated body is obtained to obtain a final laminated body, and is cut at the level of the metal foil of the final laminated body and the metal carrier.

Further, as another method, a resin as an insulating layer and a metal layer as a conductor layer are sequentially laminated on the laminated body of the present invention. Secondly, the step of half-etching the entire surface of the metal layer to adjust the thickness may be included as needed. Second, the specified position of the metal layer of the layer Laser processing is performed to form a via hole penetrating the metal layer and the resin, and after the desmear treatment for removing the dross in the via hole is performed, electroless plating is performed on the entire surface or a part of the bottom surface, the side surface, and the metal layer of the via hole. An interlayer connection is formed and further electroplating is performed as needed. For portions of the metal layer that do not require electroless plating or electroplating, a plating resist may be formed in advance before the respective plating is performed. Further, when the adhesion between the electroless plating layer, the plating layer, and the plating resist layer and the metal layer is insufficient, the surface of the metal layer may be chemically roughened in advance. In the case where a plating resist is used, the plating resist is removed after plating. Next, an unnecessary portion of the metal layer, the electroless plated portion, and the plated portion is removed by etching to form a circuit. Thereafter, the buildup substrate can be produced by cutting on the layer of the metal foil of the laminate and the metal carrier. It is also possible to repeat the steps from the lamination of the resin and the copper foil to the formation of the circuit to form a multi-layered build-up substrate.

Further, on the outermost surface of the build-up substrate, the laminate of the present invention, that is, the laminate shown in Fig. 2 or Fig. 10 or the laminate covered with the resin shown in Figs. 3 to 7 or Fig. 11 may be used. The laminate obtained by cutting the inorganic substrate and/or the metal plate between the metal carriers is placed in contact with each other and laminated. Furthermore, in the case where the laminated body is finally adhered, the cutting may be performed in advance on the layer of the metal foil and the metal carrier of the laminated body until the front stage, or until the last laminated body is adhered. The cutting is not performed, but at the end, the cutting is performed in such a manner that the laminated layer of the metal foil and the metal carrier of all the laminated bodies includes the cut surface, and is cut at one time.

Here, as the resin substrate for producing the build-up substrate, a prepreg containing a thermosetting resin can be suitably used.

Further, as another method, an opening is provided on the resin covering the laminate of the present invention, and a resin having an exposed surface area of the exposed metal foil is used as a resin of the insulating layer, for example, a prepreg or a photosensitive resin. Thereafter, a via hole is formed at a predetermined position of the resin. In use, for example, prepreg In the case of a resin, the via holes can be formed by laser processing. After the laser processing, the desmear treatment for removing the dross in the via hole can be performed. Further, when a photosensitive resin is used as the resin, the resin of the formation portion of the via hole can be removed by photolithography. Next, electroless plating is performed on the bottom surface, the side surface of the via hole, and the entire surface or a part of the resin to form an interlayer connection, and further electroplating is performed as needed. For the portion of the resin that does not require electroless plating or electroplating, it is also possible to form a plating resist layer in advance before performing the respective plating. Further, when the adhesion between the electroless plating layer, the plating layer, and the plating resist layer and the resin is insufficient, the surface of the resin may be chemically roughened in advance. In the case where a plating resist is used, the plating resist is removed after plating. Next, an unnecessary portion of the electroless portion or the plating portion is removed by etching to form an electric circuit. Thereafter, the buildup substrate can be produced by cutting on the layer of the metal foil of the laminate and the metal carrier. It is also possible to repeat the steps from the lamination of the resin to the formation of the circuit to form a multi-layered build-up substrate.

Further, on the outermost surface of the build-up substrate, the laminate of the present invention, that is, the laminate shown in Fig. 2 or Fig. 10 or the laminate covered with the resin shown in Figs. 3 to 7 or Fig. 11 may be used. The laminate obtained by cutting the inorganic substrate and/or the metal plate between the metal carriers is placed in contact with each other and laminated. Furthermore, in the case where the laminated body is finally adhered, the cutting may be performed in advance on the layer of the metal foil and the metal carrier of the laminated body to the front stage, or may be adhered to the last laminated body. Since the cutting is not performed, the cutting is performed in such a manner that the laminated surface of the metal foil and the metal carrier of all the laminated bodies includes the cut surface, and is cut at one time.

Moreover, as another method, the layering method shown in FIG. 13 to FIG. 15 is mentioned.

That is, in Fig. 13, the prepregs 115, 116 are laminated on the respective metal foils 23 of the laminate in which the metal foils of the carrier shown in Fig. 12 are stacked on the metal carrier side, and then the laminated circuits are laminated. Metal layers 117, 118 are formed. After the lamination, the cutting is performed along the cutting line B. When performing this series of operations, the hole 114 functions as a positioning hole, and even if the surface layer prepreg or the metal layer is on the hole 114, it is possible to irradiate ultrasonic waves and radiation (electromagnetic radiation (X-rays and gamma rays). Or detecting the position by particle radiation (α-ray, β-ray, neutron beam, electron beam, meson beam, proton beam, etc.) or electromagnetic wave. Further, in consideration of the popularity or ease of use of the device, it is preferred to use X-rays or gamma rays, and it is more preferable to use X-rays.

Then, in Fig. 14, the inside of the hole 114 of the laminated body obtained in Fig. 13 is opened with a hole 124 penetrating in the lamination direction. Thus, a person can also observe the hole. Further, by opening the hole 124 inside the hole 114, it is possible to prevent the chemical liquid from infiltrating between the metal layer and the metal layer of the laminate.

Further, in Fig. 15, the metal layers 117, 118 of the outermost layer of the laminated body obtained in Fig. 14 are formed into circuits, and the circuit regions 122, 123 are provided to obtain the build-up substrate 121. Thereafter, as shown in FIG. 16, the build-up substrate 121 obtained in FIG. 15 may further form the build-up layer 132, and continue to form the build-up layer as needed, and finally set along the inner side of the hole 124 in plan view. The cutting line B is cut to be divided into two substrates 133, 134 at the interface of the metal layer along the arrow D. Further, as shown in FIG. 15, the predetermined cutting line B set along the inner side of the hole 124 may be cut in a plan view, and the metal carrier 23 may be separated from each other to obtain two build-up substrates, and as shown in FIG. It is shown that the buildup layer 142 is continuously formed on both sides of each of the build-up substrates 141, and the buildup layer may be formed only on one side.

With respect to the hollow build-up substrate produced in this manner, wiring is formed on the surface through a plating step and/or an etching step, and the metal foil and the metal carrier are peeled and separated to complete the build-up wiring board. After the separation and separation, for the peeling surface, wiring can be formed, and etching can also be performed. The metal foil is removed to form a multilayer build-up wiring board. Further, the printed circuit board is completed by mounting electronic components on the build-up wiring board. Further, an electronic component can be directly mounted on the hollow build-up substrate before peeling, and a printed circuit board can also be obtained.

[Examples]

The embodiments and comparative examples of the present invention are disclosed below, but are not intended to limit the invention, but are intended to provide a better understanding of the invention and its advantages.

<Experimental Example 1>

According to the following procedure, a laminate having two sheets of ultra-thin copper foil with a carrier as shown in Fig. 2 was produced.

As the carrier, a strip of electrolytic copper foil (JTC manufactured by JX Nippon Mining & Metal Co., Ltd.) having a thickness of 35 μm was prepared. The shiny surface of the copper foil was plated by a roll-to-roll type continuous plating line under the following conditions, thereby forming a Ni layer having an adhesion amount of 4000 μm/dm ² .

(1) Ni layer (Ni-containing layer, release layer: base plating layer 1)

The S layer of the copper foil carrier was subjected to electroplating by a roll-to-roll type continuous plating line under the following conditions, thereby forming a Ni layer having an adhesion amount of 1000 μg/dm ² . The specific plating conditions are described below.

Nickel sulfate: 270~280g/L

Nickel chloride: 35~45g/L

Nickel acetate: 10~20g/L

Boric acid: 30~40g/L

Gloss agent: saccharin, butynediol, etc.

Sodium lauryl sulfate: 55~75ppm

pH: 4~6

Bath temperature: 55~65°C

Current density: 10A/dm ²

(2) Cr layer (containing Cr layer, peeling layer: base plating 2)

Next, the surface of the Ni layer formed in (1) is subjected to water washing and pickling, and then subjected to electrolytic chromate treatment on the Ni layer under the following conditions on a roll-to-roll type continuous plating line. This adhered to the Cr layer of the adhesion amount of 11 μg/dm ² .

Potassium dichromate 1~10g/L, zinc 0g/L

pH: 7~10

Liquid temperature: 40~60°C

Current density: 2A/dm ²

(3) Very thin copper layer

Next, after the surface of the Cr layer formed in (2) is washed with water and pickled, then on a continuous roll-on line of a roll-to-roll type, electroplating is performed on the Cr layer under the following conditions, thereby forming a thickness of An extremely thin copper layer of 2 μm is used to make an extremely thin copper foil with a carrier.

Copper concentration: 80~120g/L

Sulfuric acid concentration: 80~120g/L

Electrolyte temperature: 50~80°C

Current density: 100A/dm ²

Ultra-thin copper foil with the carrier obtained by the above treatment (thickness of extremely thin copper layer) 2 μm, the ultra-thin copper layer was roughened to form a surface roughness: Rz 0.6 μm), and the rough surface (rough surface: M surface) of the ultra-thin copper foil was subjected to rough plating as described below. Hereinafter, the processing conditions are disclosed. These are all steps for forming a roughened layer on the ultra-thin copper foil constituting the ultra-thin copper foil with a carrier in the laminate of the present invention. The ratio of the roughening particles to the limiting current density was set to 2.50.

(liquid composition 1)

Cu: 15g/L

H ₂ SO ₄ : 100g/L

W: 3mg/L

Sodium lauryl sulfate addition: 10ppm

(plating temperature 1) 50 ° C

After the roughening treatment, normal plating as shown below was performed. Hereinafter, the processing conditions are disclosed.

(liquid composition 2)

Cu: 40g/L

H ₂ SO ₄ : 100g/L

(plating temperature 1) 40 ° C

(current condition 1)

Current density: 30A/dm ²

Coulomb amount: 150As/dm ²

Next, an electrolytic chromate treatment is performed on the heat-resistant and rust-preventing layer.

Electrolytic chromate treatment (chromium, zinc treatment (acid bath))

CrO ₃ : 1.5g / L

ZnSO ₄ ‧7H ₂ O: 2.0g/L

Na ₂ SO ₄ : 18g/L

pH: 4.6

Bath temperature: 37 ° C

Current density: 2.0A/dm ²

Time: 1~30 seconds

(pH adjustment is carried out using sulfuric acid or potassium hydroxide)

Next, a decane treatment (by coating) is performed on the chromate coating layer. The conditions for the treatment of decane are as follows.

0.2% 3-glycidoxypropyltrimethoxydecane

Further, regarding the ultra-thin copper foil with each carrier, the peel strength of each of the ultra-thin copper foil and the metal carrier was 13 gf/cm and 10 gf/cm.

The two metal carriers of the ultra-thin copper foil with the carrier thus obtained are brought into contact with each other, and an ultrasonic welding machine is used from the ultra-thin copper foil layer at an ultrasonic frequency of 20 kHz, an output of 100 to 450 W, an amplitude of 65 μm, and a pressing force of 100. Under the condition of ~400 kgf/cm ² , two sheets of ultra-thin copper foil with a carrier were joined to obtain a laminate of the structure shown in Fig. 2 .

<Experimental Example 2>

According to the following procedure, a laminate having two sheets of ultra-thin copper foil with a carrier as shown in Fig. 2 was produced.

The same procedure as in Experimental Example 1 was carried out except that the formation of the peeling layer and the treatment after the roughening treatment of the ultra-thin copper foil were carried out under the following conditions. Further, after the chromate treatment, the thickness of the extremely thin copper layer of the deposited layer was 3 μm.

(formation of peeling layer)

(1) "Ni-Zn": nickel-zinc alloy plating

Under the conditions for forming the nickel plating layer, zinc in the form of zinc sulfate (ZnSO ₄ ) is added to the nickel plating solution, and the zinc concentration is adjusted in the range of 0.05 to 5 g/L to form a nickel-zinc alloy plating layer.

The Ni adhesion amount was 3000 μg/dm ² and the Zn adhesion amount was 250 μg/dm ² .

(2) "Organic": treatment of the formation of organic layers

Spraying a solution containing carboxybenzotriazole (CBTA) having a concentration of 1 to 30 g/L at a liquid temperature of 40 ° C and a pH of 5 for 20 to 120 seconds on the nickel-zinc alloy plating layer formed as described above, and spraying deal with. The thickness of the organic layer was 25 μm.

(roughening treatment)

The roughening treatment 1, the roughening treatment 2, the rust prevention treatment, the chromate treatment, and the decane coupling treatment were sequentially performed under the following conditions. Further, the thickness of the ultra-thin copper foil was set to 3 μm.

‧Coarse processing 1

Liquid composition: copper 10~20g/L, sulfuric acid 50~100g/L

Liquid temperature: 25~50°C

Current density: 1~58A/dm ²

Coulomb amount: 4~81As/dm ²

‧Coarse processing 2

Liquid composition: copper 10~20g/L, nickel 5~15g/L, cobalt 5~15g/L

pH: 2~3

Liquid temperature: 30~50°C

Current density: 24~50A/dm ²

Coulomb amount: 34~48As/dm ²

‧Anti-rust treatment

Liquid composition: nickel 5~20g/L, cobalt 1~8g/L

pH: 2~3

Liquid temperature: 40~60°C

Current density: 5~20A/dm ²

Coulomb amount: 10~20As/dm ²

‧Chromate treatment

Liquid composition: potassium dichromate 1~10g/L, zinc 0~5g/L

pH: 3~4

Liquid temperature: 50~60°C

Current density: 0~2A/dm ²

Coulomb amount: 0~2As/dm ²

‧decane coupling treatment

Coating a diamine decane aqueous solution (diamine decane concentration: 0.1 to 0.5% by weight)

Further, regarding the ultra-thin copper foil with each carrier, the peel strength of each of the ultra-thin copper foil and the metal carrier was 5 gf/cm and 8 gf/cm.

The two metal carriers of the ultra-thin copper foil with the carrier obtained in this way are brought into contact with each other, and the friction stir welding, the speed of the star rod is 200-1000 rpm, and the load of the stirring head is 100-2000 N from the ultra-thin copper foil layer. Under the conditions, two sheets of ultra-thin copper foil with a carrier were joined to obtain a laminate of the structure shown in Fig. 2.

<Experimental Example 3>

According to the following procedure, a laminate having two sheets of ultra-thin copper foil with a carrier as shown in Fig. 2 was produced.

Two sheets of ultra-thin copper foil with a carrier were obtained in the same manner as in the experimental example 2. Further, regarding the ultra-thin copper foil with each carrier, the peel strength of each of the ultra-thin copper foil and the metal carrier was 5 gf/cm and 8 gf/cm.

Then, the metal carriers of the two extremely thin copper foils with the carrier were adhered to each other via an adhesive to obtain a laminate of the structure shown in Fig. 2.

<Experimental Example 4>

In the procedure of Experimental Example 1, the metal carriers of the extremely thin copper foil with the carrier were joined by seam welding instead of the ultrasonic welding, and the same procedure as in Experimental Example 1 was carried out. A laminated body having two sheets of extremely thin copper foil with a carrier as shown.

Further, before the layer was covered with a resin, the peel strength of each of the ultra-thin copper foil and the metal carrier was measured for each of the ultra-thin copper foils with the carrier, and as a result, it was 13 gf/cm and 10 gf/cm.

<Experimental Example 5>

In the procedure of Experimental Example 2, the metal carriers of the extremely thin copper foil with the carrier were bonded to each other by TIG welding instead of the friction stir welding, except that the same procedure as in Experimental Example 2 was carried out. A laminated body having two sheets of extremely thin copper foil with a carrier as shown.

Further, before the layer was covered with the resin, the peel strength of each of the ultra-thin copper foil and the metal carrier was measured for each of the ultra-thin copper foils with the carrier, and as a result, it was 5 gf/cm and 8 gf/cm.

<Experimental Example 6>

In the procedure of Experimental Example 3, the thickness of the metal carrier was set to 100 μm, and two metal carriers of the ultra-thin copper foil with the carrier were pre-joined to each other instead of using the adhesive, followed by Further, a laminate having two sheets of extremely thin copper foil with a carrier shown in Fig. 2 was produced in the same manner as in Experimental Example 3.

Further, before the layer was covered with the resin, the peel strength of each of the ultra-thin copper foil and the metal carrier was measured for each of the ultra-thin copper foils with the carrier, and as a result, it was 5 gf/cm and 8 gf/cm.

<Experimental Example 7>

In the procedure of Experimental Example 1, the thickness of the metal carrier was set to 70 μm, and the metal carriers of the two extremely thin copper foils with the carrier were joined to each other by a self-piercing rivet instead of being joined by ultrasonic welding. A laminate having two sheets of ultra-thin copper foil with a carrier as shown in Fig. 2 was produced in the same manner as in Experimental Example 1.

Further, before the layer was covered with a resin, the peel strength of each of the ultra-thin copper foil and the metal carrier was measured for each of the ultra-thin copper foils with the carrier, and as a result, it was 13 gf/cm and 10 gf/cm.

<Experimental Example 8>

The surface of the two copper foils of the laminate obtained in Experimental Example 2 was brought into contact with the aluminum plate, and the aluminum plate was used as a mask from one side of the laminate, that is, in a lateral direction with respect to the laminate direction, and Epoxy resin (viscosity: 2.0 Pa‧ s) was applied in the opposite direction.

Further, for the two ultra-thin copper foils, an aluminum plate having a shape such that at least one side of the opposite side is exposed when the laminated body is viewed from the ultra-thin copper foil is used. It also covers the surface of extremely thin copper foil. Further, the application of the resin is performed by covering the aluminum plate with one side surface on the outer side of the ultra-thin copper foil and facing the side surface.

That is, a laminated body having the cross-sectional structure shown in Fig. 6 is obtained along the direction including the opposite end sides of the one side covered by the resin.

<Experimental Example 9>

With respect to the surfaces of the two copper foils of the laminate obtained in Experimental Example 3, the aluminum plate was brought into contact therewith, and the aluminum plate was used as a mask from one side of the laminate, that is, in a lateral direction with respect to the laminate direction, and The epoxy resin (viscosity: 0.5 Pa‧ s) was applied in the opposite direction.

Further, for the two ultra-thin copper foils, an aluminum plate having a shape such that when the laminate is viewed from the ultra-thin copper foil, the opposite side edges of at least one side are covered. Outside. Further, the coating of the resin is performed by covering the aluminum foil with one side surface on the outer side of the ultra-thin copper foil and facing the side surface.

That is, a laminate having the cross-sectional structure shown in Fig. 7 is obtained in a direction including one of the opposite sides of the opposite side of the resin covering side.

<Experimental Example 10>

The surface of the two copper foils of the laminate obtained in Experimental Example 4 was brought into contact with the aluminum plate, and the aluminum plate was set as a mask from one side of the laminate, that is, in a lateral direction with respect to the laminate direction, And coated with epoxy resin (viscosity: 300Pa‧s) in the opposite direction.

Further, for the two ultra-thin copper foils, an aluminum plate having a shape such that at least one side of the opposite side is exposed when the laminated body is viewed from the ultra-thin copper foil is used. It also covers the surface of extremely thin copper foil. Further, the coating of the resin is performed by covering the aluminum foil with one side surface on the outer side of the ultra-thin copper foil and facing the side surface.

That is, a laminated body having the cross-sectional structure shown in Fig. 6 is obtained along the direction including the opposite end sides of the one side covered by the resin.

<Experimental Example 11>

The surface of the two copper foils of the laminate obtained in Experimental Example 5 was brought into contact with the aluminum plate, and the aluminum plate was used as a mask, and the entire side of the laminate was oriented, that is, transverse to the laminate direction. The epoxy resin (viscosity: 1 Pa ‧) was applied in all directions.

Further, for the two ultra-thin copper foils, an aluminum plate having a shape such that when the laminate is viewed from the ultra-thin copper foil, the outer surface of one of the opposite ends is covered.

That is, a laminated body having the cross-sectional structure shown in Fig. 7 is obtained along the direction including one of the opposite ends.

<Experimental Example 12>

The surface of the two copper foils of the laminate obtained in Experimental Example 6 was brought into contact with the aluminum plate, and the aluminum plate was used as a mask, and the entire direction from the side of the laminate, that is, the transverse direction with respect to the laminate direction Coated epoxy resin (viscosity: 3000 Pa‧ s).

Further, for the two ultra-thin copper foils, an aluminum plate having a shape such that when the laminate is viewed from the ultra-thin copper foil, the opposite ends of each of the opposite sides are exposed, and the cover is covered. The surface of a thin copper foil.

That is, a laminated body having the cross-sectional structure shown in Fig. 6 is obtained along both sides in the direction including the opposite sides.

<Experimental Example 13>

The surface of the two copper foils of the laminate obtained in Experimental Example 7 was brought into contact with the aluminum plate, and the aluminum plate was used as a mask, and the entire direction from the side of the laminate, that is, the transverse direction with respect to the lamination direction Coated epoxy resin (viscosity: 5 Pa‧ s).

Further, for the two ultra-thin copper foils, an aluminum plate having a shape such that when the laminate is viewed from the ultra-thin copper foil, the outer surface of one of the opposite ends is covered.

That is, a laminated body having the cross-sectional structure shown in Fig. 7 is obtained along the direction including one of the opposite ends.

<Experimental Example 14>

The surface of the two copper foils of the laminate obtained in Experimental Example 1 was brought into contact with the aluminum plate, and the aluminum plate was used as a mask, from one side of the laminate, that is, to one lateral direction with respect to the laminate direction, And coated with epoxy resin (viscosity: 15Pa‧s) in the opposite direction.

Further, for the two ultra-thin copper foils, an aluminum plate having a shape such that when the laminate is viewed from the ultra-thin copper foil, the outer side of one end side is covered, and the end side is The opposite end is exposed, and in the second direction orthogonal to the both end sides, the length is covered by 1/4 of the both ends toward the both ends. Further, the application of the resin is performed by covering the side surface of the outer side of the ultra-thin copper foil with the aluminum plate and facing the side surface.

That is, a laminate having a structure in which the resin is wound around the surface of the extremely thin copper foil along the exposed side edge side of the resin-coated side when the ultra-thin copper foil is viewed in plan is obtained (refer to FIG. 6). ), along the opposite end, the resin covers the layer of the metal carrier without rewinding to the surface of the ultra-thin copper foil (see FIG. 7).

<Experimental Example 15>

With respect to the surfaces of the two copper foils of the laminate obtained in Experimental Example 1, a plate-shaped prepreg having a size larger than that of the copper foil was brought into contact therewith.

Further, the plate-shaped prepreg system has a shape in which the entire circumference of the ultra-thin copper foil is covered when the laminate is viewed from the ultra-thin copper foil. Thereafter, heat-pressing is performed by hot pressing to form a laminated layer-shaped prepreg. The laminate has a structure in which a laminate obtained by laminating two metal foils in which the metal foil is peelably contacted with the surface of the metal carrier and laminating the metal carriers with each other is used. All of the resin (Figure 3, Figure 4).

<Experimental Example 16>

According to the following procedure, a laminate having two sheets of ultra-thin copper foil with a carrier as shown in Fig. 10 was produced.

An aluminum plate having a thickness of 100 μm is disposed between a metal carrier of a very thin copper foil with a carrier and a metal carrier of another ultra-thin copper foil with a carrier, and an ultrasonic wave is used on the ultra-thin copper foil layer at an ultrasonic wave frequency 20 kHz, output 300-450 W, amplitude 65 μm, and a pressure of 250-400 kgf/cm ² to bond a very thin copper foil with an carrier, an aluminum plate, and another ultra-thin copper foil with a carrier, as shown in FIG. The laminate of the structure was carried out in the same manner as Experimental Example 1 except for the laminate. Further, the thickness of the ultra-thin copper layer which was laminated after the chromate treatment was 3 μm.

<Experimental Example 17>

With respect to the surfaces of the two copper foils of the laminate obtained in Experimental Example 1, a large plate-shaped prepreg having a size larger than that of the copper foil was brought into contact therewith. Then, the surface of the plate-shaped prepreg on the side opposite to the surface in contact with the copper foil is brought into contact with a larger other copper foil having a larger size than the plate-shaped prepreg.

Further, the plate-shaped prepreg system has a shape in which the entire circumference of the ultra-thin copper foil is covered when the laminate is viewed from the ultra-thin copper foil. In addition, the other copper foil has a shape in which the entire circumference of the plate-shaped prepreg is covered when the laminate is viewed from the ultra-thin copper foil. Thereafter, the laminated body-shaped prepreg and other copper foil are laminated to each other by hot pressing and hot pressing. The laminate has a structure in which a laminate obtained by laminating two metal foils in which the metal foil is peelably contacted with the surface of the metal carrier and laminating the metal carriers with each other is used. All of the resin, and the opposite side of the surface of the plate-like prepreg which is in contact with the laminate has other metal foils.

<Experimental Example 18>

A brass plate (JIS H3100 alloy number C2680) having a thickness of 50 μm is used instead of the aluminum plate having a thickness of 100 μm, and is disposed between a metal carrier of a very thin copper foil with a carrier and a metal carrier of another ultra-thin copper foil with a carrier. A laminate was produced in the same manner as in Experimental Example 16, except that the metal plate and the brass plate were bonded together with an epoxy resin (viscosity: 50 Pa s).

On both sides of the laminate thus produced, the FR-4 prepreg (made by Nanya Plastics Co., Ltd.) and the copper foil (JX Nippon Mining & Metals Co., Ltd.) are sequentially superposed on one side of the metal layer (copper foil) on the surface. ), JTC 12 μm (product name)), and copper foil (JX Nippon Mining & Metal Co., Ltd., JTC 12 μm (product name)), FR-4 prepreg (made by Nanya Plastics Co., Ltd.), copper foil (manufactured by JX Nippon Mining & Metals Co., Ltd., JTC 12μm (product name)), and subjected to hot pressing at 170 ° C for 100 minutes under a pressure of 3 MPa to produce 4 layers or 6 Layer copper clad laminate.

Next, using a laser processing machine, a copper foil penetrating the surface of the above-mentioned four-layer or six-layer copper-clad laminate was placed and a hole of 100 μm in diameter of the insulating layer (hardened prepreg) underneath. Then, the surface of the copper foil existing on the inner layer exposed at the bottom of the hole and the side surface of the hole and the copper foil on the surface of the four-layer-6 copper-clad laminate are copper-plated by electroless copper plating or copper plating. An electrical connection is formed between the copper foil present on the inner layer and the copper foil on the surface of the 4-6 layer copper clad laminate. Next, a portion of the copper foil on the surface of the 4 to 6-layer copper clad laminate is etched using an iron sulphide-based etching solution to form an electric circuit. In this way, 4 to 6 layers of the substrate can be produced.

Then, after the above-mentioned four or six-layer build-up substrate is cut at the position on the metal layer, the metal layer and the metal layer constituting the laminate are separated and separated, thereby obtaining two sets of two or three build-up wiring boards. .

Then, the copper foil as a metal layer in contact with the metal layer (copper foil) on the two sets of 2 or 3 build-up wiring boards is etched to form wiring, thereby obtaining two sets of 2 or 3 build-up wiring boards. .

Thus, generally, in the case of manufacturing a build-up substrate, for example, in the case where a through hole is provided, wrinkles or burrs are often formed at a thin and extremely thin copper foil, which may result in poor quality, but since the ultra-thin copper foil is The metal carrier is supported, so that generation of wrinkles, burrs, and the like can be suppressed during lamination processing.

Claims (56)

A laminated body obtained by using two metal foils with a metal foil which is detachably contacted with a surface of a metal carrier, and which are laminated with each other; and the two metal sheets with a carrier In at least one of the foils, after at least one of heating at 220 ° C for 3 hours, 6 hours or 9 hours, the peeling strength of the metal foil and the metal carrier is 0.5 gf / cm or more and 200 gf / cm or less. The laminate according to the first aspect of the patent application is obtained by directly laminating the metal carriers with each other via an adhesive as needed. The laminate of claim 1, wherein the metal carriers are joined to each other. The laminate of claim 2, wherein the metal carriers are joined to each other. The laminate according to the first aspect of the patent application is obtained by laminating the metal carriers with each other via an inorganic substrate or a metal plate. The laminate according to the first aspect of the patent application is obtained by laminating the metal carrier and the metal foil using a release layer. The laminate according to the second aspect of the patent application is obtained by laminating the metal carrier and the metal foil using a release layer. The laminate according to the third aspect of the patent application is obtained by laminating the metal carrier and the metal foil using a release layer. The laminate according to the fourth aspect of the patent application is obtained by laminating the metal carrier and the metal foil using a release layer. The laminate according to claim 5, wherein the metal carrier is bonded to the metal foil by using a release layer. The laminate according to any one of claims 6 to 10, wherein the release layer is made of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, or the like An alloy, or a hydrate of the above, or a layer of any one or more of the oxides or organic substances, and consisting of a plurality of layers, or the release layer is made of Cr, Ni, Co from the side of the metal carrier a single metal layer composed of any one of elemental groups of Fe, Mo, Ti, W, P, Cu, Al or selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al An alloy layer composed of one or more elements of the element group, and one or more elements of the element group selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al a hydrate or a layer composed of an oxide or an organic material, or the release layer is composed of elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, and Zn from the side of the metal carrier. a single metal layer composed of any one of the elements or an alloy composed of one or more elements selected from the group consisting of elements of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, and Zn a layer, a single metal layer composed of any one of elemental groups of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn or selected from the group consisting of Cr, Ni, Co, Fe, An alloy layer composed of one or more elements of an element group of Mo, Ti, W, P, Cu, Al, and Zn. The laminate according to any one of claims 1 to 10, wherein a peel strength between the metal carrier and the metal foil is 0.5 gf/cm or more and 200 gf/cm or less. The laminate according to any one of the preceding claims, wherein the peel strength between the metal carrier and the metal foil is 0.5 gf/cm in one or both of the metal foils with the carrier. Above and below 200gf/cm. The laminate of any one of claims 1 to 10, wherein the two sheets are provided with a carrier In one or both of the metal foils, the ten-point average roughness (Rz jis) of the surface of the metal carrier on the side in contact with the metal foil is 3.5 μm or less. The laminate according to any one of claims 1 to 10, wherein one of the two sheets of the metal foil with the carrier is heated at 220 ° C for 3 hours, 6 hours or 9 hours, After heating under two or three conditions, the peel strength of the metal foil and the metal carrier is 0.5 gf/cm or more and 200 gf/cm or less. The laminate according to any one of claims 1 to 10, which has a thickness of 8 to 500 μm. The laminate according to any one of claims 1 to 10, which is provided with a hole. For example, the laminated body of claim 17 wherein the diameter of the hole is 0.01 mm to 10 mm, and the hole is provided with 1 to 10 places. The laminate according to any one of claims 1 to 10, wherein the at least one metal foil is a copper foil or a copper alloy foil. The laminate according to any one of claims 1 to 10, wherein at least a portion of the outer periphery of the laminated portion of the metal carrier and the metal foil or the metal carrier and the metal foil when viewed from the surface of the metal foil The entire outer periphery of the laminated portion is covered with a resin. The laminate according to claim 20, which satisfies any one, two, three or four of the following items (21-1) to (21-4), (21-1) the resin contains thermosetting property (21-2) the resin comprises a thermoplastic resin; (21-3) a hole is provided on the outer side of the metal foil of the resin; (21-4) a hole is provided on the outer side of the metal foil of the resin, The diameter of the hole is 0.01 mm to 10 mm, and the hole is provided with 1 to 10 places. A laminated body obtained by laminating two metal foils on a surface of a metal carrier in a peelable manner, and the metal carriers are laminated with each other, wherein the metal foil is viewed from above At least a part of the surface of the metal foil and the surface of the metal foil in the plan view and the surface of the metal foil are covered with a resin, and the resin covering the surface of the metal foil has a resin thickness of 5 μm or more. The laminate according to claim 22, which is obtained by laminating the metal carriers with each other via an inorganic substrate or a metal plate, and satisfying one, two, or three of the following items (3) to (10) , four, five, six, seven or eight, (3) using a release layer to bond the metal carrier to the metal foil; (4) at least one or two of the metal foils with the carrier, The peeling strength between the metal carrier and the metal foil is 0.5 gf/cm or more and 200 gf/cm or less; (5) at least one or two sheets of the metal foil of the carrier, the surface of the metal carrier on the side in contact with the metal foil a ten point average roughness (Rz jis) of 3.5 μm or less; (6) at least one or two sheets of the metal foil of the carrier, after heating at 220 ° C for at least one of heating for 3 hours, 6 hours or 9 hours, The metal foil and the metal carrier have a peeling strength of 0.5 gf/cm or more and 200 gf/cm or less; (7) a thickness of 8 to 500 μm; (8) a hole is provided; and (9) a hole having a diameter of 0.01 mm to 10 mm There are 1 to 10 places; (10) at least one or two of the metal foils are copper foil or copper alloy foil. For example, in the case of the 22nd item of the patent scope, it satisfies any one, two, three, four, five, six, seven, eight, nine of the following items (1) to (11). Ten or Eleven, (1) the metal carriers are directly laminated to each other by an adhesive as needed; (2) the metal carriers are bonded to each other; (3) the metal carrier is bonded to the metal foil using a release layer; (4) at least one or two sheets of the metal foil with the carrier, the peel strength between the metal carrier and the metal foil is 0.5 gf/cm or more and 200 gf/cm or less; (5) at least one or two sheets of the carrier In the metal foil, the ten-point average roughness (Rz jis) of the surface of the metal carrier on the side in contact with the metal foil is 3.5 μm or less; (6) at least one or two sheets of the metal foil with the carrier, after passing through 220 After heating at °C for at least one, two or three conditions of heating for 3 hours, 6 hours or 9 hours, the peeling strength of the metal foil and the metal carrier is 0.5 gf/cm or more and 200 gf/cm or less; (7) thickness 8~500μm; (8) provided with holes; (9) holes with a diameter of 0.01mm~10mm are provided with 1~10; (10) at least one or two of the metal foils are copper foil or copper alloy foil. A laminate according to any one of claims 22 to 24, which satisfies any one, two, three, four or five of the following items (25-1) to (25-5), (25) -1) covering the entire periphery of the laminated portion of the metal carrier and the metal foil with a resin when viewed from the surface of the metal foil; (25-2) the resin contains a thermosetting resin; (25-3) the resin contains thermoplastic a resin; (25-4) a hole is provided on an outer side of the metal foil of the resin; (25-5) A hole is provided on the outer side of the metal foil of the resin, the diameter of the hole is 0.01 mm to 10 mm, and the hole is provided at 1 to 10. A laminate which is obtained by cutting a laminate of the metal carrier and the metal foil when viewed from the surface of the metal foil in a plan view. A multi-layered laminate obtained by laminating a surface layer of the respective metal foils in the laminate of any one of claims 1 to 26. A multilayer laminated body obtained by laminating two metal foils with a metal foil which is peelably contacted with a surface of a metal carrier, and laminated the metal carriers with each other to form a laminate The surface area of the metal foil is a layered resin, and the thickness of the resin covering the surface of the metal foil is 5 μm or more, and the area of the metal foil in a plan view is Sa, and the two sheets of the resin are When the area in the plan view is larger than or equal to the other sheet-like resin, the area of the one-plate resin is Sb, and Sa/Sb is less than 1.0. For example, the multi-layered laminate of claim 28, which satisfies one, two or three of the following items, (1) the Sa ratio of Sa and Sb is 0.6 or more; (2) the ratio of Sa and Sb Sa/Sb is 0.80 or more; (3) The ratio Sa of Sa and Sb is 0.95 or less. The multi-layered laminate according to the twenty-eighth aspect of the invention, wherein the area of the two plate-shaped resins in the plan view is set to Sp, and the area of the two plate-shaped resins in plan view is larger than that of the other plate. When the area of the resin or the same plate-like resin is Sq, the ratio Sp/Sq of Sp and Sq satisfies one, two or three of the following items, (1) The ratio Sp/Sq of Sp and Sq is 0.001 or more; (2) The ratio Sp/Sq of Sp and Sq is 0.20 or less; (3) The ratio Sp/Sq of Sp and Sq is 0.01 or more. The multi-layered laminate according to claim 29, wherein the area of the two plate-shaped resins in the plan view is set to Sp, and the area of the two plate-shaped resins in plan view is larger than that of the other plate. When the area of the resin or the same plate-like resin is Sq, the ratio Sp/Sq of Sp and Sq satisfies one, two or three of the following items, (1) the ratio Sp/Sq of the Sp and Sq is 0.001 or more; (2) The ratio Sp/Sq of Sp and Sq is 0.20 or less; (3) The ratio of Sp/Sq of Sp and Sq is 0.01 or more. A multilayer laminated body obtained by laminating two metal foils with a metal foil which is peelably contacted with a surface of a metal carrier, and laminated the metal carriers with each other to form a laminate The surface area of the metal foil is a layered resin, and the area of the two plate-shaped resins in the plan view is set to Sp, and the area of the two plate-shaped resins in plan view is larger than the other plate shape. When the area of the resin or the sheet-like resin of the same resin is Sq, the ratio Sp/Sq of Sp and Sq is 0.001 or more. For example, the multi-layered laminate of claim 32 satisfies one or both of the following items: (1) the ratio Sp/Sq of the Sp and Sq is 0.20 or less; (2) the ratio of the Sp to Sq Sp/Sq It is 0.01 or more. A multi-layered laminate according to any one of claims 27 to 33, which satisfies any one, two, three, four, five, six, seven of the following items (11) to (21) , eight, nine, ten or eleven, (11) the build-up system obtains the metal carriers by directly laminating them with an adhesive as needed; (12) the metal carriers are bonded to each other in the laminate; (13) the laminate system intervenes the metal carriers (14) one piece of the laminated body or two pieces of the metal foil with the carrier, wherein the metal carrier and the metal foil are bonded together by using a release layer; (15) In at least one or two of the metal foils of the carrier, the peel strength between the metal carrier and the metal foil is 0.5 gf/cm or more and 200 gf/cm or less; (16) at least one of the laminates or In the metal foil with the carrier, the ten-point average roughness (Rz jis) of the surface of the metal carrier on the side in contact with the metal foil is 3.5 μm or less; (17) at least one or two of the laminated body In the metal foil of the carrier, the peeling strength of the metal foil and the metal carrier is 0.5 gf/cm or more after heating by heating at 220 ° C for at least one, two or three conditions of 3 hours, 6 hours or 9 hours. 200gf/cm or less; (18) the thickness of the laminate is 8~500μ (19) the laminated body is provided with a hole; (20) in the laminated body, the hole having a diameter of 0.01 mm to 10 mm is provided with 1 to 10; (21) at least one metal foil of the laminated body is Copper foil or copper alloy foil. A multi-layered laminate according to any one of claims 28 to 33, which satisfies any one, two, three, four, five or six of the following items (31) to (36), (31) In the laminated body, at least a part of the outer periphery of the laminated portion of the metal carrier and the metal foil is covered with a resin when the surface of the metal foil is viewed from above; (32) in the laminate, when the surface of the metal foil is viewed from above, the entire outer periphery of the laminated portion of the metal carrier and the metal foil is covered with a resin; (33) the laminate contains a thermosetting resin; 34) In the laminate, the resin comprises a thermoplastic resin; (35) in the laminate, a hole is provided on the metal foil or the metal carrier of the resin; (36) the laminate has a diameter of 0.01 mm. There are 1~10 holes in the 10mm hole. The multi-layer laminate according to any one of claims 27 to 33, which is obtained by further laminating a metal layer on the surface of the respective resin. A multi-layer laminate according to claim 34, which is formed by further laminating a metal layer on the surface of the respective resin. A multi-layered laminate according to claim 35, which is formed by further laminating a metal layer on the surface of the respective resin. The multi-layer laminate according to claim 36, wherein the area of the metal layer in a plan view is larger than the area of the metal layer and the metal foil. The multi-layer laminate according to claim 37, wherein the area of the metal layer in plan view is larger than the area of the metal layer and the metal foil. The multi-layer laminate according to claim 38, wherein the area of the metal layer in a plan view is larger than the area of the metal layer and the metal foil. The multi-layered laminate according to claim 36, wherein the laminated body is provided with a through hole. For example, the multi-layered laminate of claim 39, wherein the laminate is provided with a through-layer hole. A multi-layered laminate obtained by cutting a multilayered layered body of claim 42 along a layer of the resin and the metal layer when viewed from the surface of the metal layer. A multi-layered laminate according to claim 44, wherein a hole penetrating the entire multilayered body is provided inside the hole. A multilayer laminated body obtained by cutting a multilayered layered body according to any one of claims 27 to 33 along a layer of the metal carrier and the metal foil when the surface of the metal foil is viewed from above. A multilayer laminated body obtained by cutting a multilayered layered body of claim 36 along a layer of the resin and the metal layer in a plan view of the surface of the metal layer. A multilayer laminated body obtained by cutting a multilayered layered body of claim 39 along a layer of the resin and the metal layer when the surface of the metal layer is viewed from above. A multilayer laminated body obtained by cutting a multilayered layered body of claim 43 along a layer of the resin and the metal layer in a plan view of the surface of the metal layer. The multi-layered laminate according to claim 49, wherein a hole penetrating the entire multilayered body is provided inside the hole. A method of manufacturing a multi-layered metal laminate, comprising: at least one of a laminate of any one of claims 1 to 26 or a multilayer laminate of any one of claims 27 to 50 or A laminated resin of a surface of a metal foil, a single-sided or double-sided metal-clad laminate, a laminate of any one of claims 1 to 26, and a multilayered layer of any one of claims 27 to 50 The metal layer or the metal layer of the resin substrate is provided one or more times. The manufacturing method of the multi-layer metal laminate according to claim 51, which comprises any one of the following 52-1 to 52-4, two, three or four steps: 52-1: the layer along the layer a step of cutting at least one surface of the layer of the metal carrier and the metal foil when viewed from the surface of the metal layer; 52-2: a step of separating the metal foil of the laminate from the metal carrier for separation; 52-3 : the laminated body is cut along at least one surface of the metal carrier and the metal foil when viewed from the surface of the metal layer, and the metal foil of the laminated body of the cut portion is peeled off from the metal carrier Step of performing separation; 52-4: a step of separating the metal foil of the laminate from the metal carrier and separating, and removing a part or all of the metal foil separated by peeling by etching. A method of manufacturing a build-up substrate, comprising: at least one or two of a laminate of any one of claims 1 to 26 or a multilayer laminate of any one of claims 27 to 50; A laminate of a metal foil, a one-sided or two-sided wiring substrate, a single-sided or two-sided metal-clad laminate, a laminate of any one of claims 1 to 26, and a patent application range of items 27 to 50 One or more layers of a laminate, a metal layer with a resin substrate, a wiring, a circuit, a metal layer, or a build-up wiring layer are used once or more. The method for producing a build-up substrate according to claim 53, comprising the step of cutting the laminate along at least one surface of the metal carrier and the metal foil when viewed from the surface of the metal foil. A method for manufacturing a build-up wiring board, which further comprises one, two or three steps of 55-1 to 55-3 in the method for manufacturing a build-up substrate according to claim 53 or 54: 55- 1: a step of separating the metal foil of the laminate from the metal carrier to perform separation; 55-2: cutting the laminated body along at least one surface of the layer of the metal carrier and the metal foil when the surface of the metal foil is viewed from above, and peeling off the metal foil of the laminated body from the metal carrier And a step of performing separation; 55-3: a step of separating the metal foil of the laminate from the metal carrier to separate, and removing part or all of the metal foil separated by peeling by etching. A method of manufacturing a printed circuit board, comprising: a step of manufacturing a build-up wiring board by the manufacturing method of claim 55 or a method of manufacturing a build-up substrate by the manufacturing method of claim 53 or 54 step.