TWI620695B - Package for packaging electronic components - Google Patents

Abstract

The invention provides a cover tape for packaging electronic parts, which does not block even when stored in a rolled state in a high-temperature environment at 60 ° C for a long time or in a high-temperature and humidity environment at a temperature of 40 ° C and a humidity of about 90%. It can be stored stably, and the antistatic property can be stably maintained. Alternatively, the static electricity generated by friction can be suppressed on the surface opposite to the surface of the sealing layer. This cover tape for packaging electronic parts includes a base material layer, a sealing layer provided on one side of the base material layer, and a conductive polymer layer provided on the other side of the base material layer.

Description

Packaging body for electronic parts packaging

The present invention relates to a cover tape for packaging electronic parts.

This case claims priority based on Japanese Patent Application No. 2014-013989 filed in Japan on January 29, 2014 and Japanese Patent Application No. 2014-198471 filed in Japan on September 29, 2014, and the contents are incorporated herein.

In recent years, the surface mounting of electronic components has made great progress, and the surface mounting technology has also greatly improved. The development of higher-performance and smaller chip-type electronic components has increased rapidly. The use of carrier tape ) As one of these packaging forms for transportation and storage. Such electronic parts are stored in the pockets of these carrier tapes, and are sealed with a cover tape of a cover body.

The cover tape is usually stored in a wound state until it is used for a carrier tape. During the storage in a wound state, the front and back surfaces of the cover tape are in contact. Therefore, the front and back surfaces of the cover tape may appear to be in a sticky or close state, and blocking may occur.

Adhesion means that when the cover tape stored in the rolled state is manufactured in a manufacturing step or unrolled by a tape packaging machine, the front and back surfaces of the cover tape stored in the rolled state are contacted during the storage period and become pseudo-adhesive or The close state cannot be expanded at all, or cannot be expanded stably.

Based on the above situation, many cover tapes have not been developed so far.

For example, a method including an anti-blocking agent in a sealing material (Patent Document 1), a method of adding an antistatic agent to an adhesive (Patent Document 2), and a glass transition temperature of 40 ° C for preventing blocking are known. The above method is used as a sealing material (Patent Document 3); a method in which the heat-sealing layer contains an ethylene-vinyl acetate copolymer resin, a fatty acid ammonium-based anti-blocking agent, and a granular anti-blocking agent (Patent Document 4); A method in which the sealing layer contains a thermoplastic resin and a π-electron conjugated conductive polymer dissolved in the thermoplastic resin (Patent Document 5); a method in which a structure having an antistatic and anti-blocking layer is laminated (Patent Document 6) ); A method (Patent Document 7) and the like in which the anti-adhesion layer is provided on the heat-sealing layer in a stripe pattern by a gravure printing method.

The cover tape includes at least a base material layer and a sealing layer. Conventional methods such as the methods of Patent Documents 1 to 7 use a method in which the sealing layer contains an anti-adhesion agent or a method of providing an anti-adhesion layer on the surface of the sealing layer. Improving the sealing layer is not a satisfactory anti-adhesion countermeasure.

In addition, the cover tape may be transported by a ship, a truck, or the like in a wound state during the wrapping, and may be stored at a high temperature of about 60 ° C. for a long time during the transportation period. When exposed to such a storage environment, the cover tape is prone to adhesion and becomes a cause of abnormality.

Furthermore, in countries such as Southeast Asia, the covering tape in a rolled state may be stored in a high-temperature and humid environment for a long time. When exposed to such an environment, the cover tape in the state of the rolled material is liable to stick, which is a cause of abnormality.

However, conventional anti-blocking methods such as Patent Documents 1 to 7 do not assume a case where the covering tape in a rolled state is stored at a high temperature of about 60 ° C. for a long time or a case where it is stored under a high temperature and humidity environment for a long time. Therefore, it is a problem that frequent adhesion occurs when the covering tape is transported in a rolled state, or when it is stored in a high temperature and humid area for a long time.

In addition, when the cover tape in a rolled state is stored in a high-temperature and humid environment for a long time, the antistatic property of the surface of the base material layer of the cover tape is reduced, and environmental dust (dust existing in the environment) is adhered to the storage. In the case of carrying the pockets of the tape and sealing the electronic parts with the cover tape.

Conventional antistatic methods are generally a method of kneading a surfactant having an antistatic function on a base material layer or applying a surfactant on the surface of a base material layer (Patent Document 8).

However, the surfactant has low antistatic property under low humidity, and the surfactant is water-soluble, so the water resistance is low. In particular, when the carrier tape is used to store small electronic parts, the cover tape is easily peeled if the cover tape is adhered and placed after the electronic parts are stored.

Based on the above situation, in recent years, a conductive packaging material has been developed with respect to an antistatic conductive packaging material for treating the surface of a substrate layer instead of a surfactant, which has a substrate and a conductive layer, and the conductive layer A layer containing a conductive polymer (a) and a carbon nanotube (c) (Patent Document 9). Patent Document 9 describes that a PET (polyethylene terephthalate) sheet is used as a base layer; polyethylene dioxythiophene polystyrene sulfonate is used as a conductive polymer; the conductive layer may contain colloidal silicon dioxide (h) ; The surface resistance value of conductive packaging materials at a temperature of 25 ° C and a relative humidity of 15% is 10 ¹ to 10 ¹² Ω; the visible transmittance of conductive packaging materials is more than 80%; it can be used as a cover for packaging electronic components Belt etc.

In addition, a conductive coating composition capable of forming a cover tape for packaging electronic parts and forming a conductive coating film having high transparency and a small change in resistance over time even when exposed to air has been developed. The conductive coating composition includes a water-soluble or water-dispersible π-conjugated conductive polymer, a water-soluble antioxidant, and water (Patent Document 10). In the embodiment of Patent Document 10, it is shown that An aqueous dispersion is applied to a conductive coating composition of a PET film, and the aqueous dispersion system is used as a polymer of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid which are water-dispersible π-conjugated conductive polymers. Complex.

However, when the conductive layer of Patent Document 9 or the conductive coating composition of Patent Document 10 is applied to a substrate layer, the conductive layer or the conductive coating composition may have insufficient adhesion or cause The problem is that the followability of the coating film to the substrate layer is low, and the coating film is broken with the progress of the cover tape forming step, and the conductivity is rapidly lost. In addition, the cover tapes of Patent Document 9 or Patent Document 10 do not assume that the cover tape is stored in a high temperature and humidity environment such as an air temperature of 40 ° C and a humidity of about 90%. In such an environment, the conventional cover tape has a base material. The problem that the antistatic property of the layer is greatly reduced.

In addition, with the miniaturization of electronic devices in recent years, the mounted electronic components have also undergone rapid development in miniaturization and weight reduction. As a result, the cover tape may attach electronic parts to the cover tape due to static electricity generated by friction between the cover tape and electronic parts during transportation, or static electricity generated when the cover tape is peeled off, which causes problems such as defective pick-up and other process abnormalities.

Under these circumstances, a technique has been proposed for a cover tape for packaging electronic parts that can prevent abnormality due to static electricity.

For example, Patent Document 11 discloses a cover tape which is provided with a sealing layer on a base material layer in order to suppress static electricity generated when peeled from a carrier tape, and the sealing layer includes a polyolefin resin and a polyether / polyolefin copolymer. Thing.

In addition, Patent Document 12 discloses a cover tape, which is characterized by limiting the surface resistance value of the sealing layer to 10 ⁴ to 10 ¹² Ω / □ (23) in order to suppress static electricity generated by friction between the cover tape and electronic parts. ℃ -15% RH)).

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-188509

[Patent Document 2] Japanese Patent Laid-Open No. 2009-035645

[Patent Document 3] Japanese Patent Laid-Open No. 2001-106256

[Patent Document 4] Japanese Patent Laid-Open No. 2001-315847

[Patent Document 5] Japanese Patent Laid-Open No. 2004-262548

[Patent Document 6] Japanese Patent Laid-Open No. 2004-051105

[Patent Document 7] Japanese Patent Laid-Open No. 2004-001876

[Patent Document 8] Japanese Patent Laid-Open No. 63-105061

[Patent Document 9] Japanese Patent Laid-Open No. 2005-081766

[Patent Document 10] Japanese Patent Laid-Open No. 2010-196022

[Patent Document 11] Japanese Patent Application Publication No. 2012-214252

[Patent Document 12] Japanese Patent Application Publication No. 2012-30897

The problem of the first embodiment of the present invention is to provide a cover tape that does not stick even under long-term storage in a rolled state in a high-temperature environment of 60 ° C or a high-temperature and humid environment with an air temperature of 40 ° C and a humidity of about 90%. In addition, it can be stably stored, and the antistatic property can be stably maintained.

The technique disclosed in Patent Document 11 is a technique for suppressing static electricity generated when the cover tape is peeled from the carrier tape, and the technique disclosed in Patent Document 12 is a technique for suppressing static electricity generated by friction between the cover tape and electronic parts. .

In other words, the technologies disclosed in Patent Documents 11 and 12 focus only on the surface of the sealing layer among the surfaces of the cover tape.

However, with the miniaturization and weight reduction of electronic parts, micro static electricity may become the cause of abnormal process, so the importance of static electricity countermeasures against cover tapes is increasing day by day. Therefore, it is necessary to also discuss the state of charge generation that has not been considered as a problem so far, and to suppress the generation of static electricity as much as possible.

For example, when a carrier tape sealed with a cover tape is transported while being wound on a reel, the bottom surface of the carrier tape and the surface of the cover tape (the side opposite to the surface of the sealant layer) (Surface) friction occurs, and the static electricity generated by this friction must be suppressed.

In other words, not only the surface of the sealing layer, but also a countermeasure against static electricity on a surface opposite to the surface of the sealing layer that has not been explored so far.

Therefore, a second aspect of the present invention is to provide a cover tape for packaging electronic parts, which can suppress static electricity generated by friction on the surface opposite to the surface of the sealing layer.

The present inventors have intensively studied in order to solve the above-mentioned problems. As a result, it was found that a cover tape for packaging electronic parts can solve all the problems mentioned above. It has at least a base material layer and a sealing layer. The base material layer has a light transmittance of 85% or more. In the range of more than 50% and less than 50%, it has a surface resistance value of 1 × 10 ⁹ Ω / □ or less. Especially, the base material layer contains at least one kind of biaxial selected from polyester, polypropylene, and nylon. Stretch film, a cover tape for packaging electronic parts, which has a conductive polymer layer on the surface of the base material layer. The first embodiment of the present invention is further discussed repeatedly based on these knowledge and insights, and the result is eventually achieved.

That is, the first embodiment of the present invention includes the following aspects.

[1] A cover tape for packaging electronic parts, comprising at least a base material layer and a sealing layer, wherein the base material layer has a light transmittance of 85% or more, and a relative humidity of 12% or more under a temperature environment of 25 ° C Within 50%, it has a surface resistance value of 1 × 10 ⁹ Ω / □ or less.

[2] The cover tape for packaging electronic parts according to [1], wherein the base material layer includes at least one biaxially stretched film selected from polyester, polypropylene, and nylon, and the surface of the base material layer With a conductive polymer layer.

[3] The cover tape for packaging electronic parts according to [1] or [2], wherein the conductive polymer layer contains poly (3,4-ethylenedioxythiophene).

[4] The cover tape for packaging electronic parts according to [3], wherein the conductive polymer layer further contains polystyrenesulfonic acid.

[5] The cover tape for packaging electronic parts according to any one of [1] to [4], wherein the sealing layer has a relative humidity of less than 12% and less than 50% in a temperature environment of a temperature of 25 ° C, and has a value of less than Surface resistance value of 1 × 10 ¹¹ Ω / □.

[6] The cover tape for packaging electronic parts according to any one of [1] to [5], wherein the conductive polymer layer contains silicon dioxide particles.

The above-mentioned subject of the second embodiment of the present invention is achieved by the second embodiment of the present invention described in the following [7] to [13].

[7] A cover tape for packaging electronic parts, comprising a base material layer, a sealing layer provided on one side of the base material layer, and a conductive polymer layer provided on the other side of the base material layer, The tribostatic voltage on the surface of the conductive polymer layer is -2200 to 2200V.

[8] The cover tape for packaging electronic parts according to the above [7], wherein the tribostatic voltage on the surface of the conductive polymer layer is -800 to 800V.

[9] The cover tape for packaging electronic parts according to the above [7] or [8], wherein the conductive polymer layer includes: a positive compound, and a triboelectric series thereof is located in comparison with the conductive polymer. The material of the friction object of the object layer is more positive; with negative compounds, the triboelectric sequence is more negative than that of the material of the friction object.

[10] The cover tape for packaging electronic parts according to any one of the above [7] to [9], wherein the conductive polymer layer contains an ester compound.

[11] The cover tape for packaging electronic parts according to any one of the above [7] to [10], wherein the conductive polymer layer includes at least one of an aziridine compound and a ring-opening compound thereof.

[12] The cover tape for packaging electronic parts according to any one of the above [7] to [11], wherein the base material layer provided with the conductive polymer layer is provided at a temperature of 25 ° C and a humidity of 12 to 65 The surface resistance value under the environment of% RH is 1 × 10 ¹¹ Ω / □ or less.

[13] The cover tape for packaging electronic parts according to any one of the above [7] to [12], wherein a total light transmittance of the base material layer is 85% or more.

The above-mentioned problems of the first embodiment and the second embodiment of the present invention are achieved simultaneously by the third embodiment of the present invention described in the following [14] to [15].

[14] The cover tape for packaging electronic parts according to any one of [1] to [13], comprising a base material layer, a sealing layer provided on one side of the base material layer, and a base material provided on the base material layer. Another layer A cover tape for packaging electronic parts on one side of the conductive polymer layer, wherein the conductive polymer layer includes at least one of an aziridine compound and a ring-opening compound thereof, and poly (3,4-ethylenedioxythiophene) ).

[15] The cover tape for packaging electronic parts according to [14], wherein the conductive polymer layer further contains polystyrenesulfonic acid.

The cover tape for packaging electronic parts according to the first embodiment of the present invention does not cause adhesion even when it is stored in a rolled state in a high-temperature environment at 60 ° C or a high-temperature and humidity environment at a temperature of 40 ° C and a humidity of about 90% , Can be stably stored, and can maintain antistatic stability.

According to the cover tape for packaging electronic parts according to the second embodiment of the present invention, it is possible to suppress static electricity generated by friction on the surface of the conductive polymer layer, that is, the surface opposite to the surface of the sealing layer.

The cover tape for packaging electronic parts according to the third embodiment of the present invention can simultaneously exhibit the effects of the first embodiment of the present invention and the second embodiment of the present invention.

1‧‧‧ substrate layer

2‧‧‧Sealing layer

3‧‧‧ conductive polymer layer

10‧‧‧ Cover tape for electronic parts packaging (cover tape)

10a‧‧‧ Surface of cover tape (surface of conductive polymer layer)

20‧‧‧ bearing belt

20a‧‧‧ the underside of the carrier tape

30‧‧‧ pedestal

40‧‧‧ rubber body

50‧‧‧ insulator

60‧‧‧ Probe

70‧‧‧bearing belt

80‧‧‧ support

100‧‧‧ package

[Fig. 1] A schematic perspective view showing an example of a state in which a cover tape for packaging electronic parts according to a second embodiment of the present invention is sealed to a carrier tape.

[Fig. 2] A schematic cross-sectional view showing an example of a cover tape for packaging electronic parts according to a second embodiment of the present invention.

[Fig. 3] A schematic perspective view for explaining a method for measuring the frictional electrostatic voltage of the cover tape for packaging electronic parts in Example 13. [Fig.

[First Embodiment]

The cover tape for electronic component packaging according to the first embodiment of the present invention (hereinafter sometimes simply referred to as a cover tape) is characterized by having at least a base material layer and a sealing layer, wherein the base material layer has a light transmittance of 85% or more, In a temperature environment of 25 ° C, the relative humidity is within the range of 12% to 50%, and has a surface resistance value of 1 × 10 ⁹ Ω / □ or less.

The cover tape according to the first embodiment of the present invention includes at least a base material layer and a heat-sealing layer.

As the base material layer, as long as it has mechanical strength capable of withstanding external forces applied during tape processing or heat-sealing of a carrier tape, and heat resistance capable of withstanding heat-sealing, films of various materials can be appropriately processed according to the application. Specific examples include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, nylon 6, nylon 66, polypropylene, polymethylpentene, poly Vinyl chloride, polyacrylate, polymethacrylate, polyimide, polyetherimide, polyaromatic ester, polyfluorene, polyetherfluorene, polyphenylene ether, polycarbonate, ABS resin, etc. as the substrate layer Examples of film materials.

In the first embodiment of the present invention, the base material layer is preferably a biaxially stretched film containing at least one selected from polyester, polypropylene, and nylon, and a biaxially stretched film containing polyester. A film is more preferred, and a biaxially-stretched polyethylene terephthalate film (hereinafter referred to as an O-PET film) is particularly preferred.

The base material layer must have a light transmittance of 85% or more. If the light transmittance of the base material layer is 85% or more, the transparency of the cover tape can be maintained, so that the electronic parts can be identified or inspected by a sensor or the like. When the light transmittance is less than 85%, the transparency of the cover tape may become low, making it impossible to perform identification or inspection of electronic components such as sensors.

The surface of the base material layer is preferably provided with a conductive polymer layer. At this time, in the first embodiment of the present invention, the base material layer provided with the conductive polymer layer is stable and has a relative humidity of 12% to 50% in a temperature environment of 25 ° C. × 10 ⁹ Surface resistance value below Ω / □. In addition, since the conductive polymer layer is provided on the surface of the base material layer, even if the cover tape of the first embodiment of the present invention is stored in a rolled state in a high-temperature environment at 60 ° C for a long period of 30 days or more, blocking does not occur. And, even if it is stored in a high temperature and humidity environment with a temperature of 40 ° C and a humidity of about 90% for more than 30 days, the antistatic property can be stably maintained.

The conductive polymer layer used in the first embodiment of the present invention contains at least a conductive polymer and a soluble polymer having an anionic group.

The conductive polymer is not particularly limited. From the viewpoint of excellent transparency, low volume intrinsic resistance, and excellent antistatic performance when added in small amounts, a π-conjugated conductive polymer is preferred.

The π-conjugated conductive polymer is not particularly limited as long as it is an organic polymer composed of a π-conjugated main chain. Examples include polypyrroles, polythiophenes, polyacetylenes, and polyphenylenes. (polyphenylene), poly (phenylene vinylene), polyaniline, polyacene, polythiophene, and copolymers thereof. From the viewpoint of stability in the air, polypyrroles, polythiophenes, and polyanilines are preferred.

Specific examples of the π-conjugated conductive polymer include polypyrrole, poly (N-methylpyrrole), poly (3-methylpyrrole), poly (3-ethylpyrrole), and poly (3-n-pyrrole). Propylpyrrole), poly (3-butylpyrrole), poly (3-octylpyrrole), poly (3-decylpyrrole), poly (3-dodecylpyrrole), poly (3,4-dimethyl Methylpyrrole), poly (3,4-dibutylpyrrole), poly (3-carboxypyrrole), poly (3-methyl-4-carboxypyrrole), poly (3-methyl-4-carboxyethylpyrrole) ), Poly (3-methyl-4-carboxybutylpyrrole), poly (3-hydroxypyrrole), poly (3-methoxypyrrole), poly (3-ethoxypyrrole), poly (3-butoxy Pyrrole), poly (3-methyl-4-hexyloxypyrrole), poly (thiophene), poly (3-methylthiophene), poly (3-ethylthiophene), poly (3-propylthiophene), Poly (3-butylthiophene), poly (3-hexylthiophene), poly (3-heptylthiophene), poly (3-octylthiophene), poly (3-decylthiophene), poly (3-dodecylthiophene) Thiophene), poly (3-octadecylthiophene), poly (3-bromothiophene), poly (3-chlorothiothiophene), poly (3-iodothiophene), poly (3-cyanothiophene), Poly (3-phenylthiophene), poly (3,4-dimethylthiophene), poly (3,4-dibutylthiophene), poly (3-hydroxythiophene), poly (3-methoxythiophene) , Poly (3-ethoxythiophene), poly (3-butoxythiophene), poly (3-hexyloxythiophene), poly (3-heptyloxythiophene), poly (3-octyloxy) Thiophene), poly (3-decyloxythiophene), poly (3-dodecyloxythiophene), poly (3-octadecyloxythiophene), poly (3-methyl-4-methoxy (Thiophene), poly (3,4-ethylenedioxythiophene), poly (3-methyl-4-ethoxythiophene), poly (3-carboxythiophene), poly (3-methyl-4-carboxythiophene) Poly (3-methyl-4-carboxyethylthiophene), poly (3-methyl-4-carboxybutylthiophene), polyaniline, poly (2-methylaniline), poly (3-isobutylaniline) , Poly (2-anilinesulfonic acid), poly (3-anilinesulfonic acid), and the like.

A soluble polymer having an anionic group is used to solubilize a π-conjugated conductive polymer. The soluble polymer having an anionic group is coordinated to the π-conjugated conductive polymer via the anionic group. As a result, the π-conjugated conductive polymer and the soluble polymer having an anionic group form a complex, and the The dopant of the yoke-based conductive polymer exerts its function.

A soluble polymer having an anionic group (hereinafter sometimes referred to as a polyanion) is one having a constituent unit having at least an anionic group. The anionic group of polyanion functions as a dopant for the π-conjugated conductive polymer, and improves the conductivity and heat resistance of the π-conjugated conductive polymer.

Specific examples of the polyanion include polyethylene sulfonic acid, polystyrene sulfonic acid, polyallyl sulfonic acid, polypropylene sulfonic acid, polymethacrylic acid sulfonic acid, and poly (2-propylene fluorenyl group). Amidin-2-methylpropanesulfonate Acid), polyisoprenesulfonic acid, polyethylenecarboxylic acid, polystyrenecarboxylic acid, polyallylic acid, polyacrylic acid, polymethacrylic acid, poly (2-acrylamide) 2-methylpropanecarboxylic acid), polyisoprenecarboxylic acid, polyacrylic acid, and the like. These may be homopolymers or copolymers of two or more kinds.

Among these, polystyrenesulfonic acid, polyacrylic acid, and polymethacrylic acid are more preferred, and polystyrenesulfonic acid is particularly preferred. Polystyrene sulfonic acid, polyacrylic sulfonic acid, and polymethacrylic sulfonic acid decompose on their own by absorbing thermal energy, and mitigate the thermal decomposition of the π-conjugated conductive polymer component, so they have excellent heat resistance and environmental resistance. . In addition, it has excellent compatibility and dispersibility with a binder added to the conductive polymer layer as needed.

Among these conductive polymers, poly (3,4-ethylenedioxythiophene) is more preferred from the viewpoint of conductivity and heat resistance, and it is preferable to prevent the cover tape from being exposed to a high temperature (60 ° C) environment. From the viewpoint of adhering to each other and maintaining the antistatic properties in a high temperature environment of 40 ° C, poly (3,4-ethylenedioxythiophene): a complex with polystyrenesulfonic acid (ie, PEDOT / PSS) is further Better. The reason why PEDOT / PSS exhibits particularly excellent anti-adhesion effect is presumed as follows. That is to say, it is believed that the conductive polymer layer containing PEDOT / PSS can be speculated that its surface energy becomes lower, so that it becomes difficult for the substance to adhere to the surface of the conductive polymer layer. Moreover, the binder used in PEDOT / PSS is generally Thermosetting resin, and thermosetting resin has the characteristics of not softening due to heat after curing and excellent weather resistance. Therefore, the cover tape is not easy to deteriorate and adhere.

The amount of the soluble polymer having an anionic group is preferably in the range of 0.1 to 10 mol, and more preferably in the range of 1 to 7 mol relative to 1 mol of the π-conjugated conductive polymer. If the amount of the soluble polymer is less than 0.1 mol relative to 1 mol of the π-conjugated conductive polymer, there is a tendency that the doping effect on the π-conjugated conductive polymer becomes weak, and the conductive Sexual insufficiency. In addition, if the amount of the soluble polymer is more than 10 mols relative to 1 mol of the π-conjugated conductive polymer, the content ratio of the π-conjugated conductive polymer decreases, and it is still difficult to obtain sufficient conductivity. Sex.

The conductive polymer layer used in the first embodiment of the present invention may contain various additives in addition to the conductive polymer and the soluble polymer having an anionic group. Examples of other additives include a polymer having a binder function, an antistatic enhancer, a polymer having an electron attracting group, an inorganic filler, an organic filler, and other additives. It is more preferable to contain silicon dioxide particles.

The conductive polymer layer used in the first embodiment of the present invention is a solution in which a conductive polymer, a soluble polymer having an anionic group, and other additives are dissolved in a solvent to form a conductive polymer solution, and is applied to the base. The surface of the layer.

Examples of the solvent include water, methanol, ethanol, isopropanol, butanol, propylene carbonate, N-methylpyrrolidone, dimethylformamide, dimethylacetamide, cyclohexane, and acetone. , Methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, butyl acetate, and the like. The solvent may be used singly or in a mixture of two or more kinds.

Examples of the method for applying the conductive polymer solution include gravure printing, corner coating, and roll coating. After the conductive polymer solution is applied, it can be dried by a known drying method.

The thickness of the conductive polymer layer is preferably 0.020 to 2.0 μm. As long as the thickness is within this range, the conductive polymer layer will form a conductive network, and at the same time, the light transmittance of the substrate layer will be stabilized to be 85% or more. The thickness of the conductive polymer layer is more preferably 0.020 to 1.0 μm, and particularly preferably 0.020 to 0.5 μm. When the thickness of the conductive polymer layer is thinner than 0.020 μm, the conductive polymer layer is easily peeled, and if it is larger than 2.0 μm, the light transmittance of the base material layer becomes less than 85%.

In the first embodiment of the present invention, the sealing layer is not particularly limited as long as it is conventionally known. In a temperature environment of 25 ° C, the relative humidity is within the range of 12% to 50%, and it is better to have a surface resistance value of less than 1 × 10 ¹¹ Ω / □.

[Second Embodiment]

Hereinafter, the form of a cover tape (hereinafter referred to as a "cover tape" as appropriate) for packaging electronic components for implementing the second embodiment of the present invention will be described with reference to the drawings.

覆盖 Cover tape for electronic parts packaging≫

First, a configuration of a cover tape according to a second embodiment of the present invention will be described with reference to FIGS. 1 and 2.

As shown in FIG. 1, the cover tape 10 is used as a cover material of a carrier tape 20, wherein the carrier tape 20 is continuously provided with concave pockets 21 according to the shape of the electronic component.

Specifically, the cover tape 10 seals (eg, heat-seals) the surface of the carrier tape 20 and seals the opening of the pocket 21 of the carrier tape 20. Thereby, the electronic components stored in the pocket 21 of the carrier tape 20 can be protected from being dropped or mixed with foreign matter during transportation.

The cover tape 10 is integrated with the carrier tape 20 to form a packaging body 100 for electronic parts. In addition, when the package 100 is transported while being wound on a reel, the bottom surface 20 a of the carrier tape 20 and the surface 10 a of the cover tape 10 come into contact (friction).

As shown in FIG. 2, the cover tape 10 includes a base material layer 1, a sealing layer 2 provided on one surface side of the base material layer 1, and a conductive polymer layer 3 provided on the other surface side of the base material layer 1.

The thickness of the entire cover tape 10 is preferably 20 to 100 μm, and more preferably 40 to 60 μm. When the thickness of the entire cover tape 10 is within a predetermined range, when the cover tape 10 is sealed to the carrier tape 20, the cover tape 10 can be prevented from being twisted, and workability can be improved.

Next, each layer constituting the cover tape 10 will be described.

<Base material layer>

The base material layer 1 is a main layer constituting the cover tape 10. In addition, as long as the base material layer 1 has mechanical strength that can withstand external forces applied when the cover tape 10 is processed, heat-sealed on the carrier tape 20, and used, and heat resistance that can withstand heat from heat-sealing, Uses a variety of materials to process films.

(Base material layer: total light transmittance)

The total light transmittance of the substrate layer 1 is preferably 85% or more, and more preferably 90% or more.

Since the total light transmittance of the base material layer 1 is equal to or greater than a predetermined value, it is possible to properly check whether the electronic component is correctly stored in the pocket 21 of the carrier tape 20 through the cover tape 10.

The total light transmittance of the base material layer 1 can be measured by a method prescribed by JIS K7105-1981.

Examples of the material of the base material layer 1 include polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, polyimide resins, and polycarbonates. Ester-based resin, ABS resin, etc. Among these, as the material of the substrate layer 1, a polyester resin is more preferable, and polyethylene terephthalate which can improve the mechanical strength is particularly preferable. In addition, when a polyamide-based resin is selected as the material of the substrate layer 1, a nylon 6 capable of improving mechanical strength and flexibility is preferable. In addition, the base material layer 1 may include a lubricating material as long as its characteristics are not impaired.

In addition, the material of the base material layer 1 may be selected so that the surface resistance value becomes equal to or lower than a predetermined value described later, and the total light transmittance becomes equal to or higher than the aforementioned predetermined value.

The base material layer 1 may be a single-layer film composed of any one of the resins described above, or may be a laminate of two or more layers selected from the aforementioned resins.

In addition, as the base material layer 1, an unstretched film may be used. In order to improve the mechanical strength of the cover tape 10 as a whole, it is preferable to use a film that extends in a uniaxial direction or a biaxial direction.

The thickness of the substrate layer 1 is preferably 9 to 25 μm, and more preferably 9 to 16 μm.

With the thickness of the base material layer 1 being below a specified value, the rigidity of the cover tape 10 will not become too high. Even if a torsional stress is applied to the sealed carrier tape 20, the cover tape 10 can follow the carrier tape 20 Deformation can reduce the possibility of peeling. In addition, since the thickness of the base material layer 1 is equal to or greater than a predetermined value, the mechanical strength of the cover tape 10 becomes an appropriate value, and even if the cover tape 10 is peeled from the carrier tape 20 at high speed, the possibility of the cover tape 10 breaking can be reduced.

<Sealing layer>

The sealing layer 2 is a layer provided on one surface side of the base material layer 1 and is a layer that contacts the carrier tape 20 when the cover tape 10 is sealed (for example, heat-sealed) to the carrier tape 20.

The sealing layer 2 is composed of an acrylic resin or a polyester resin and an antistatic agent. Examples of the antistatic agent include any one selected from metal fillers such as tin oxide, zinc oxide, titanium oxide, and carbon, and surfactants such as polyoxyethylene alkylamine, quaternary ammonium, and alkyl sulfonate. One or a mixture of these. In addition, carbon includes various shapes of fillers composed of carbon, such as carbon black, white carbon, carbon fiber, and carbon tube.

The sealing layer 2 may contain oxide particles selected from silicon, magnesium, and calcium as a main component in order to prevent adhesion during transportation, such as silicon dioxide, talc, or polyethylene particles. Any one of acrylate particles and polystyrene particles, or an alloy thereof.

In order that the sealing layer 2 can discharge static electricity quickly, it is preferable to prepare a material so that the surface resistance value becomes 10 ⁴ to 10 ¹² Ω / □ (measurement conditions: 23 ° C. to 15% RH).

The thickness of the sealing layer 2 is preferably 1 to 15 μm, and more preferably 1 to 5 μm, which can appropriately perform sealing operations and peeling operations.

<Conductive polymer layer>

The conductive polymer layer 3 is a layer provided on the other surface side of the base material layer 1 (on the side opposite to the surface side on which the sealing layer 2 is provided), and constitutes a layer constituting the surface 10 a of the cover tape 10.

(Conductive polymer layer: tribostatic voltage)

The frictional electrostatic voltage of the conductive polymer layer 3 is -2200 to 2200V, preferably -800 to 800V, and particularly preferably -500 to 500V. In other words, the absolute value of the frictional electrostatic voltage of the conductive polymer layer 3 is 2200 V or less, preferably 800 V or less, and particularly preferably 500 V or less.

When the frictional electrostatic voltage of the conductive polymer layer 3 is within a predetermined range, the static electricity generated on the surface of the conductive polymer layer 3 due to friction can be suppressed.

Specifically, when the carrier tape 20 sealed by the cover tape 10 is transported while being wound on a reel, the bottom surface 20a of the carrier tape 20 and the surface 10a of the cover tape 10 are caused by vibration during transportation. (Conductive polymer layer 3) generates friction, but static electricity generated by such friction can be suppressed.

The frictional electrostatic voltage of the conductive polymer layer 3 can be removed by static elimination of the cover tape 10 and a material to be rubbed (a polystyrene-based carrier tape 20 described later), and then the cover tape 10 (conductive The surface of the polymer layer 3 is rubbed (for example, speed: about 100 mm / s, distance: about 50 mm) twice with respect to the material of the friction target in one direction, and is measured by a known surface potentiometer. In addition, it can be obtained by directly measuring the tribostatic voltage on the surface of the conductive polymer layer 3, or the tribostatic voltage of the material to be rubbed can be measured and calculated from the measurement results.

(Conductive polymer layer: object to be rubbed)

Although the bottom surface 20a of the carrier tape 20 is assumed to be the rubbing target of the conductive polymer layer 3 (hereinafter referred to as a "friction target" as appropriate) as described above, it is not limited to this. Substances that are likely to come into contact with the conductive polymer layer 3 during the mounting step are regarded as objects.

The material to be rubbed by the conductive polymer layer 3 (hereinafter referred to as “material for rubbing” as appropriate) is not limited to polystyrene and polyethylene terephthalate used as the material of the carrier tape 20. Ester, polycarbonate, and the like also include polyethylene and rubber (materials such as processed natural rubber and synthetic rubber) that may come into contact with the packaging body 100 during the transportation of the packaging body 100 or the mounting steps of electronic components.

(Conductive polymer layer: positive compound, negative compound)

The conductive polymer layer 3 is composed of a "positive compound" which has a galvanic electric sequence on a more positive side than the material of the friction object, and a conductive polymer layer 3 which contains a "positive compound" on a more positive side than the material of the friction object. The "negative compound" is preferred.

The conductive polymer layer 3 includes a positive compound and a negative compound. When the conductive polymer layer 3 rubs against a friction object, the positive compound is charged to become a positive polarity, and the negative compound is charged to become a negative polarity. Perform electrical neutralization. As a result, the frictional electrostatic voltage of the conductive polymer layer 3 can be reliably set within the aforementioned predetermined range, and the static electricity generated by the friction of the surface of the conductive polymer layer 3 can be reliably suppressed.

The position of the triboelectric series can be measured by changing the measurement target of the above-mentioned method of measuring the triboelectric voltage.

As the positive compound, when the material to be rubbed is assumed to be polystyrene or rubber, aziridinyl compounds and ring-opening compounds thereof can be cited.

Here, the aziridinyl compound refers to a compound having an aziridinyl group, and examples thereof include N, N′-hexamethylene-1,6-bis (1-aziridinylcarboxamide), N, N ′ -Diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate), N, N′-toluene-2 , 4-bis (1-aziridinecarboxamidine), triethylene melamine, trimethylolpropane-tri-β (2-methylaziridine) propionate, bis-m-xylylenediamine -1-2-methylaziridine, tri-1-aziridinylphosphine oxide, gins-2-methylaziridinephosphine oxide, and the like. Examples of commercially available products include Chemitite PZ-33 and DZ-22E manufactured by Japan Catalysts Corporation.

In addition, "its ring-opening compound" (a ring-opening compound of an aziridinyl compound) means a compound in which the aziridinyl group in the aforementioned aziridinyl compound is in a ring-opening state.

As the negative compound, when it is assumed that the material to be rubbed is polystyrene or rubber, an ester compound can be cited.

Here, the ester compound refers to a compound formed by bonding an organic acid or an inorganic acid with an alcohol through a dehydration reaction, and examples thereof include polyethylene terephthalate, polybutylene terephthalate, and polynaphthalene. Ethylene formate, derivatives thereof, and the like.

The content rate of the positive compound and the content rate of the negative compound of the conductive polymer layer 3 is not particularly limited, and may be appropriately set in consideration of the mechanical characteristics of the entire conductive polymer layer 3 and the cover tape 10.

In addition, by adjusting the content of the positive compound and the negative compound of the conductive polymer layer 3, the tribostatic voltage of the conductive polymer layer 3 can be set to a desired value. In addition, positive compounds and negative compounds have various charging tendencies (distances from the material of the friction object in the triboelectric sequence) due to different substances. Therefore, by properly selecting the positive and negative compounds to be used, it is possible to conduct electricity. The frictional electrostatic voltage of the polymer layer 3 is set to a desired value.

The conductive polymer layer 3 preferably contains a conductive polymer in order to reduce the surface resistance value, and it is also preferable to include a surfactant in order to improve the wettability or uniformity when forming the layer.

Examples of the conductive polymer include polyaniline and polypyrrole. Polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) -based compounds are applicable. In addition, as the surfactant, a low molecular type or a polymer type may be used, and halothane may be applied.

(Base material layer + conductive polymer layer: surface resistance value)

The base material layer 1 provided with the conductive polymer layer 3 preferably has a surface resistance value of 1 × 10 ¹¹ Ω / □ or less under an environment of a temperature of 25 ° C. and a humidity of 12 to 65% RH, and 1 × 10 ⁹ Ω / □ or less is better.

Since the surface resistance value of the base material layer 1 provided with the conductive polymer layer 3 is equal to or lower than a predetermined value, static electricity can be quickly discharged even when charged. In addition, since the surface resistance value of the base material layer 1 provided with the conductive polymer layer 3 is kept below a predetermined value under the aforementioned environment, even if the working environment such as peeling of the cover tape 10 is in a dry state, static electricity can be quickly discharged. , Can prevent the occurrence of abnormalities based on static electricity.

The surface resistance value of the base material layer 1 on which the conductive polymer layer 3 is provided. It can be measured by a method prescribed by JISK6911-1995.

<Other layers>

(middle layer)

The cover tape 10 may be provided with an intermediate layer (not shown) between the base material layer 1 and the sealing layer 2. The intermediate layer can improve the cushioning property of the entire cover tape 10 and improve the adhesion between the cover tape 10 and the carrier tape 20 during sealing.

The intermediate layer contains a resin, and examples of the resin include an olefin-based resin, a styrene-based resin, and a cyclic olefin-based resin. Among them, by using an olefin-based resin, the effect of improving adhesion can be assured.

In order to ensure the improvement effect of adhesion, the thickness of the intermediate layer 3 is preferably 10 to 30 μm, and more preferably 15 to 25 μm.

(Adhesive layer)

The cover tape 10 may be provided with an adhesive layer (not shown) between the layers. The adhesive layer can improve the adhesion between the layers.

The adhesive layer contains a resin and a conductive substance. Examples of the resin include a urethane-based dry laminating adhesive resin or a tackifying coating adhesive resin. Generally, polyester polyols are exemplified. Or a combination of a polyester composition such as a polyether polyol and an isocyanate compound. Examples of the conductive substance include any one of metal fillers such as tin oxide, zinc oxide, titanium oxide, and carbon, and organic conductive materials such as conductive polymers, or mixtures thereof. In addition, carbon includes various shapes of fillers composed of carbon, such as carbon black, white carbon, carbon fiber, and carbon tube.

In addition, there is no question as to whether there is a substance-to-substance reaction where a plurality of substances are "contained" in each layer of the cover tape 10. Specifically, when the conductive polymer layer 3 contains an aziridinyl compound as a positive compound, the aziridinyl compound may or may not react with other compounds (negative compounds, etc.), or may The compound is contained in the conductive polymer layer 3 after the reaction.

≫Manufacturing method of cover tape for electronic parts packaging≫

The manufacturing method of the cover tape 10 according to the second embodiment of the present invention is not particularly limited, and examples thereof include forming a conductive polymer layer 3 by coating a predetermined material on one surface of the base material layer 1 and drying the same, and A method of laminating the sealing layer 2 on the other side of the base material layer 1 by extrusion lamination. In addition, after the sealing layer 2 sheet is formed by extrusion processing, it may be laminated on the other surface of the base material layer 1 and laminated.

When an intermediate layer (not shown) is provided, it may be laminated on the other side of the base material layer 1 by an extrusion lamination method, or formed in advance and laminated on the other side of the base material layer 1. In the case where an adhesive layer (not shown) is provided, the material of the adhesive layer may be applied to the target surface by a conventionally known coating method.

According to the cover tape 10 according to the second embodiment of the present invention described above, the frictional electrostatic voltage on the surface of the conductive polymer layer 3 is within a predetermined range, so that static electricity generated on the surface due to friction can be suppressed.

In the cover tape 10 according to the second embodiment of the present invention, since the conductive polymer layer 3 includes a positive compound and a negative compound, the frictional electrostatic voltage on the surface of the conductive polymer layer 3 can be reliably set to a predetermined range. In this case, static electricity generated on the surface due to friction can be reliably suppressed.

The cover tape 10 according to the second embodiment of the present invention includes an aziridinyl compound (or a ring-opening compound) as a positive compound and an ester compound as a negative compound. Therefore, when the material to be rubbed is polystyrene or In the case of rubber or the like, it is possible to more reliably suppress static electricity generated by the conductive polymer layer 3 due to friction.

Moreover, according to the cover tape 10 of the second embodiment of the present invention, the surface resistance value of the base material layer 1 on which the conductive polymer layer 3 is provided is equal to or less than a predetermined value, so that static electricity can be quickly discharged even when charged. In addition, since the surface resistance value of the base material layer 1 provided with the conductive polymer layer 3 is kept below a predetermined value under the foregoing environment, even if the working environment such as peeling of the cover tape 10 is in a dry state, static electricity can be quickly discharged. , Can prevent the occurrence of abnormalities based on static electricity.

Furthermore, according to the cover tape 10 of the second embodiment of the present invention, the total light transmittance of the base material layer 1 is equal to or higher than a predetermined value. Therefore, whether or not the electronic component is correctly stored in the carrier tape 20 can be appropriately determined by the cover tape 10 Inspection of Pocket 21.

The cover tape for electronic component packaging according to the third embodiment of the present invention can be manufactured in the same manner as the cover tape for electronic component packaging according to the first embodiment of the present invention and the cover tape for electronic component packaging according to the second embodiment of the present invention. However, the aforementioned conductive polymer layer is characterized by containing at least one of an aziridinyl compound and a ring-opening compound thereof, and poly (3,4-ethylenedioxythiophene). It is preferable that the conductive polymer layer further contains polystyrenesulfonic acid.

[Example]

Examples of the present invention are shown below, but the present invention is not limited by these examples.

The cover tape was evaluated by the following test method.

<Blocking resistance>

The two sheets are laminated on the smooth board in a state in which the two sheets of the cover sheet are laminated in contact with each other, and the two sheets of cover sheet are pressed with a circular plate having a cushioning diameter of 30 mm. After carrying a weight of 1kg on a circular plate, it was stored in various environments for several days. After storage, the two cover tapes were peeled off. Those who could peel without resistance were rated as ○, those who felt resistance but peelable were rated as △, and those who were stuck on the front and back surfaces and could not be peeled off were rated as ×.

<Transmittance>

Store the cover tape in different environments for several days. After storage, the light transmittance was measured according to JIS K7105. When the light transmittance is 85% or more, it is rated as ○, and when the light transmittance is less than 85%, it is rated as x.

<Surface resistance value>

Store the cover tape in various environments for several days. After storage, the surface resistance value of the substrate layer was measured by a surface resistivity meter manufactured by TREK under the conditions of 25 ° C and 30% RH and 25 ° C and 50% RH according to IEC613405-1.

Examples 1 to 12

As the cover tape, the surface of an O-PET substrate layer of CSL-Z7302, a conductive cover tape made by Sumitomo Bakelite, was cleaned with acetone.

The gravure coating method is used to uniformly coat the surface of the base material layer of the cover tape with a mixed polymer solution containing poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid, which is mixed with PEDOT / PSS. 43 parts by mass of an aqueous solution of the compound, 46.3 parts by mass of ion-exchanged water, 0.1 parts by mass of p-toluenesulfonic acid, and 90 parts by mass of an aqueous solution of 0.6 parts by mass of triethylamine were mixed with tetramethylol-methane-ginsin (1-aziridinyl 10 parts by mass of a propionate) / isopropanol solution was dried and UV-cured to produce a cover tape having a conductive polymer layer having a thickness of 150 nm.

The cover tape of the first embodiment of the present invention was stored in the storage environment and storage days shown in Tables 1 and 2, and the surface resistance, light transmittance, and adhesion were evaluated.

The evaluation results of the obtained cover tape for electronic component packaging according to the first embodiment of the present invention are shown in Tables 1 and 2. The storage environment of Examples 3, 6, 9 and 12 is the environment in a 60 ° C oven.

【Table 1】

Comparative Examples 1 to 4

As the cover tape, the surface of the base material layer of CSL-Z7302, a conductive cover tape made by Sumitomo Bakelite, was cleaned with acetone. A polymer surfactant (ACRIT 1SX-1090, manufactured by Taisei Fine Chemical Co., Ltd.), which is a conductive surfactant, was applied to the surface of the base material layer of the cover tape so as to have a thickness of 150 nm to produce a conductive surfactant. Compare the coverage bands.

The comparative cover tape was stored in the storage environment and storage days shown in Table 3, and the surface resistance, light transmittance, and blocking were evaluated.

Table 3 shows the evaluation results of the obtained comparative electronic component packaging tapes.

【table 3】

Examples 13 to 15 and Comparative Example 5

≫Production of test materials≫

A biaxially stretched polyester film (manufactured by Toyobo Co., Ltd .: E5102) having a thickness of 16 μm was prepared as a base material layer.

Then, while a sealing layer is produced on one side of the base material layer, a conductive polymer layer is produced on the other side in the following order.

Add isopropyl alcohol (IPA) and water as a diluent to the PEDOT / PSS dispersion (manufactured by Kenken Chemical Co., Ltd .: WED-SM), and then slowly add triethylamine (Wako Pure Chemical Industries, Ltd .: TEA) as a neutralizer. ) Simultaneously stir for 30 seconds. Then, a positive compound and a negative compound (PLASCOATZ565, Z760, manufactured by Nishinbo Chemical Co., Ltd .: CARBODIIMIDEV-02-L2, manufactured by Nishinbo Chemical Co., Ltd.) were added as a binder resin and stirred for 30 seconds. This solution was applied to the other surface of the base material layer with a coating bar or a gravure coater so that the wet film thickness became 4 μm, and dried at 100 ° C. to prepare a conductive polymer layer. In addition, the blending weight of each test agent is shown in Table 4.

By the above method, a cover tape (test material Nos. 1 to 4) was produced.

【Table 4】

≪Various measurement conditions≫

<Tribostatic voltage>

The tribostatic voltage on the surface of the conductive polymer layers of the test materials 1 to 4 was measured by the following method (see FIG. 3).

(1) A plate-shaped rubber body 40 (1.0 × 10 ¹³ Ω or more) is provided on the base 30 (less than 1.0 × 10 ¹¹ Ω) with wheels, and two square prism-shaped ones are arranged at a predetermined interval thereon. Insulator 50 (1.0 × 10 ¹³ Ω or more, thickness: 10 mm or more). Then, the two insulators 50 are fixed with a double-sided tape to the carrier tape 70 which is supposed to be a friction object. As the carrier tape 70, a 8-mm-wide polystyrene-based sheet (CLEAREN CST2401 manufactured by Denka Co., Ltd.) was used.

In addition, the pedestal 30 with a wheel is in the state of earth at any time.

(2) The carrier tape 70 is neutralized using an ionizer (manufactured by Kasuga Electric Corporation: BLH-H).

(3) Move the pedestal 30 with wheels, and move the carrier tape 70 under the measuring probe 60 of a surface potentiometer (manufactured by TREK Corporation: MODEL 370) to confirm that it has been de-energized.

The distance between the carrier tape 70 and the measurement probe 60 is 1 to 2 mm.

(4) The cover tape 10 (width: 8 mm) is wound around a rod-shaped support 80 (less than 1.0 × 10 ⁹ Ω) so that the conductive polymer layer becomes a surface layer. In order to reduce the effect of charging when the support 80 is supported by a hand, it is preferable that the support 80 is composed of a carbon film or a metal conductor.

Then, the cover tape 10 is also destaticized using a static eliminator.

(5) Move the pedestal 30 with wheels to move the carrier tape 70 below the measurement probe 60, and rub the surface of the carrier tape 70 with the cover tape 10 wound around the support 80.

In addition, the friction of the cover tape 10 is one in which the carrier tape 70 is rubbed twice (speed: about 100 mm / s, distance: about 50 mm) in one direction in the length direction while the base 30 with the wheels attached thereto is fixed.

(6) Move the pedestal 30 with wheels, and move the carrier tape 70 under the measuring probe 60 within 5 seconds after the rubbing operation to measure the tribostatic voltage.

(7) From the results of measuring the tribostatic voltage of the carrier tape 70, the tribostatic voltage of the surface of the conductive polymer layer covering the tape 10 was calculated.

In addition, before the rubbing operation, the surfaces of the conductive polymer layers of the carrier tape 70 and the cover tape 10 are charged to 0V by static elimination. Therefore, when the tribostatic voltage of the carrier tape 70 is 100V, the tribostatic voltage of the surface of the conductive polymer layer covering the tape 10 can be calculated as -100V (= 0V-100V).

In the examples 13 to 15, since the electrostatic discharge property of the cover tape 10 is excellent, if the tribostatic voltage on the surface of the conductive polymer layer of the cover tape 10 is directly measured, a large error (undulation) will occur in the measured value. Therefore, the correct value of the tribostatic voltage on the surface of the conductive polymer layer covering the tape 10 is calculated by measuring the carrier tape 70.

In addition, as a reference, the tribostatic voltage on the surface of the sealing layer was also measured. Regarding the measurement method, in addition to (4), the cover tape 10 is wound around the rod-shaped support 80 so that the sealing layer, rather than the conductive polymer layer, becomes the surface layer. 7) Perform the same method.

<Surface resistance value>

The surface resistance value of the base material layer (base material layer + conductive polymer layer, sealing layer) of the test materials 1 to 4 is based on IEC61340 5-1 under the conditions of 25 ° C and 30% RH, and 25 The surface resistance value of the base material layer was measured with a surface resistivity meter manufactured by TREK under the conditions of ℃ and 50% RH.

[Exploration of Results]

As shown in Table 4, the tribostatic voltage (absolute value) of the surface of the conductive polymer layer of Test Material 1 (Example 13) was 413V, and it was found that it can suppress the static electricity generated by the surface due to friction. In addition, the surface resistance value of the base material layer (base material layer + conductive polymer layer) of the test material 1 was 5.0 × 10 ⁶ Ω / □, and it was found that even if it was charged, it could quickly discharge static electricity.

Regarding the test materials 3 and 4 (Examples 14 and 15), the frictional electrostatic voltage (absolute value) of the surface of the conductive polymer layer was equal to or lower than a predetermined value, and it was also found that the frictional electrostatic voltage on the surface can be suppressed from being generated by friction. Static electricity.

On the other hand, in Test Material 2 (Comparative Example 5), since the conductive polymer layer did not contain a positive compound, the frictional electrostatic voltage (absolute value) of the surface of the conductive polymer layer became 3000 V, and it was found that the surface factors could not be sufficiently suppressed. Static electricity generated by friction.

Claims (15)

A packaging body for packaging electronic parts includes a carrier tape for packaging electronic parts, and a cover tape for packaging electronic parts sealed in the carrier tape for packaging electronic parts. The covering tape for packaging electronic parts includes a base material layer, The sealing layer on one side of the base material layer and a conductive polymer layer provided on the other side of the base material layer. The conductive polymer layer includes a positive compound, and its triboelectric series is located in the phase. Compared with the material of the rubbing object of the conductive polymer layer, it is more positive; with negative compounds, the triboelectric sequence is on the more negative side than the material of the rubbing object, and the sealing layer is connected with the A layer in contact with a carrier tape for packaging electronic parts, the conductive polymer layer constituting a surface of the cover tape for packaging electronic parts. For example, the packaging body for packaging electronic parts according to item 1 of the patent application, wherein the base material layer has a light transmittance of 85% or more, the base material layer provided with the conductive polymer layer, and a temperature environment of a temperature of 25 ° C In the range of 12% to 50% relative humidity, the surface resistance value is 1 × 10 ⁹ Ω / □ or less. For example, the packaging body for packaging electronic parts according to item 1 or 2 of the patent application, wherein the base material layer contains at least one type of biaxially stretched film selected from polyester, polypropylene, and nylon. For example, the packaging body for packaging electronic parts according to item 1 or 2 of the patent application, wherein the conductive polymer layer contains poly (3,4-ethylenedioxythiophene). For example, the packaging body for packaging electronic parts according to item 4 of the patent application, wherein the conductive polymer layer further contains polystyrenesulfonic acid. For example, the package for electronic parts packaging in the scope of patent application No. 1 or 2, wherein the sealing layer has a relative humidity of less than 1 × 10 ¹¹ Ω / □ in a range of relative humidity of 12% to 50% under a temperature environment of 25 ° C. Surface resistance. For example, the packaging body for packaging electronic parts according to item 1 or 2 of the application, wherein the conductive polymer layer contains silicon dioxide particles. For example, the packaging body for packaging electronic parts according to item 1 of the patent application, wherein the frictional electrostatic voltage on the surface of the conductive polymer layer is -2200 ~ 2200V. For example, for a packaging body for packaging electronic parts according to item 1 or claim 8, the frictional electrostatic voltage on the surface of the conductive polymer layer is -800 ~ 800V. For example, the electronic component packaging package according to item 1 or 2 of the patent application scope, wherein the conductive polymer layer includes an ester compound. For example, the electronic component packaging package according to item 1 or 2 of the application, wherein the conductive polymer layer includes at least one of an aziridine compound and a ring-opening compound thereof. For example, the package body for electronic part packaging of the scope of application for patent No. 1 or 2, wherein the base material layer provided with the conductive polymer layer has a surface resistance value under an environment of a temperature of 25 ° C. and a humidity of 12 to 65% RH. It is 1 × 10 ¹¹ Ω / □ or less. For example, the packaging body for packaging electronic parts in the first or second application scope of the patent, wherein the total light transmittance of the substrate layer is 85% or more. For example, the packaging body for packaging electronic parts according to item 1 of the application, wherein the conductive polymer layer contains at least one of an aziridine compound and a ring-opening compound thereof, and poly (3,4-ethylenedioxythiophene). ). For example, the electronic component packaging package according to item 14 of the application, wherein the conductive polymer layer further contains polystyrenesulfonic acid.