TWI617817B - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

The electronic component conveying apparatus of the present invention includes a first member and a contact member of a plurality of second members that are in contact with the electronic component, and at least one of the first member and the plurality of second members has a thermal conductivity of 16 (W/(m‧K)) or more. Moreover, the electronic component inspection device according to the present invention includes: an abutting member having at least a first member and a plurality of second members that are in contact with the electronic component; and an inspection portion that inspects the electronic component; and the first member And at least one of the plurality of second members has a thermal conductivity of 16 (W/(m‧K)) or more.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

An electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) component has been known, and an electronic component inspection device is assembled to transfer an IC component to an inspection. The electronic component transport device of the holding unit of the department. When the IC element is inspected, the IC element is placed in the holding portion, and the plurality of probes provided in the holding portion are brought into contact with the respective terminals of the IC element. There is a case where the IC element is inspected by heating or cooling the IC element to a specific temperature, and in this case, control for maintaining the temperature of the electronic component at the set temperature (target temperature) is performed. Moreover, in the inspection of IC components, it is desirable to reduce the inspection cost by performing inspection of a plurality of IC components at a time.

Patent Document 1 discloses a device having a plurality of abutting portions that abut against an electronic component when inspecting an electronic component, and press the electronic component against the holding portion. In this device, a plurality of electronic components can be simultaneously pressed against the holding portion by a plurality of abutting portions, so that inspection of a plurality of electronic components can be performed at one time.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-28923

However, in the device described in Patent Document 1, a plurality of abutting portions are spaced apart from each other. In the meantime, when the electronic components are inspected, when the heat generation of the plurality of electronic components is different from each other, a temperature difference is generated between the plurality of electronic components, so that it is difficult to be under the same conditions. Check multiple electronic parts.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can suppress a temperature difference between a plurality of electronic components.

The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples.

[Application Example 1]

An electronic component conveying apparatus according to the present invention includes: a first member and a contact member of a plurality of second members that are in contact with the electronic component; and at least one of the first member and the plurality of second members The thermal conductivity is 16 (W/(m‧K)) or more.

As a result, by sharing a specific member for a plurality of second members, it is possible to reduce the size and the number of parts can be reduced.

Further, by setting the thermal conductivity as described above, it is possible to suppress a temperature difference between a plurality of electronic components. Specifically, for example, when the amount of heat generated by the electronic component that one of the two second members abuts is different from the amount of heat generated by the electronic component that the other one is in contact with, the amount of heat generation is large. The heat of the electronic component is transmitted to the electronic component having a small amount of heat by the abutting member, thereby suppressing a temperature difference between the two electronic components.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, it is preferable that the contact member has a thermal conductivity of 16 (W/(m‧K)) or more.

Thereby, a temperature difference between a plurality of electronic parts can be suppressed.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, preferably, the abutting member has In the third member, the third member is disposed in at least one of the first member and the plurality of second members, and has a thermal conductivity of 16 (W/(m‧K)) or more.

Thereby, it is possible to suppress the conduction of heat by the third member, and it is possible to suppress a temperature difference between the plurality of electronic components.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, preferably, the first member and the plurality of second members are integrally formed.

Thereby, it is possible to suppress the transfer of heat between the first member and the second member, and it is possible to suppress a temperature difference between the plurality of electronic components. Moreover, it is possible to realize a high-precision configuration such as dimensional accuracy.

[Application 5]

In the electronic component conveying apparatus of the present invention, preferably, the first member and the plurality of second members each include at least one of aluminum and copper as a constituent material thereof.

Thereby, the thermal conductivity of the first member and the second member can be improved, and a temperature difference between the plurality of electronic components can be suppressed.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat dissipating portion is disposed in the contact member.

Thereby, the temperature of the electronic component can be adjusted by cooling the electronic component.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, it is preferable that the heating member is disposed on the contact member.

Thereby, the temperature of the electronic component can be adjusted by heating the electronic component.

[Application Example 8]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat capacity (J/K) of the abutting member is 250 times or more of the heat capacity of the electronic component.

Thereby, the abutting member absorbs heat generated by the electronic component, thereby suppressing an increase in temperature of the electronic component, and suppressing a temperature difference between the plurality of electronic components.

[Application Example 9]

An electronic component inspection apparatus according to the present invention includes: a contact member having a first member and a plurality of second members that are in contact with the electronic component; and an inspection unit that inspects the electronic component; At least one of the member and the plurality of second members has a thermal conductivity of 16 (W/(m‧K)) or more.

As a result, by sharing a specific member for a plurality of second members, it is possible to reduce the size and the number of parts can be reduced.

Further, by setting the thermal conductivity as described above, it is possible to suppress a temperature difference between a plurality of electronic components. Specifically, for example, when the amount of heat generated by the electronic component that one of the two second members abuts is different from the amount of heat generated by the electronic component that the other one is in contact with, the amount of heat generation is large. The heat of the electronic component is transmitted to the electronic component having a small amount of heat by the abutting member, thereby suppressing a temperature difference between the two electronic components.

1‧‧‧Checking device

2‧‧‧Supply Department

3‧‧‧Supply side alignment

4‧‧‧Transportation Department

5‧‧‧Inspection Department

6‧‧‧Recycling side alignment

7‧‧Recycling Department

8‧‧‧Control Department

9‧‧‧IC components

10‧‧‧Transporting device

11‧‧‧Abutment

12‧‧‧ Cover

14‧‧‧ body

41‧‧‧ Shuttle

42‧‧‧Supply robot

43‧‧‧Check the robot

44‧‧‧Recycling robot

51‧‧‧ Keeping Department

100‧‧‧Flow Adjustment Department

111‧‧‧Foundation

131‧‧‧Solenoid valve

132‧‧‧throttle valve

133‧‧‧ pump

141‧‧‧1st body

142‧‧‧2nd body

210‧‧‧ cylinder

211‧‧‧Cylinder tube

212‧‧‧ tube body

213‧‧‧ Backplane

214‧‧‧Piston

215‧‧‧ gas inlet

220‧‧‧Component suction cup

231‧‧‧1st link

232‧‧‧2nd link

233‧‧‧ pillar

234‧‧‧ screws

235‧‧‧Insulation materials

240‧‧‧heat block

241‧‧‧heater

242‧‧‧ Flowmeter

243‧‧‧temperature sensor

260‧‧‧Contact block (an example of abutment member)

261‧‧‧1st contact part (one example of the second member)

262‧‧‧2nd contact part (one example of the second member)

263‧‧‧ base

271‧‧‧Intermediate components

272‧‧‧Intermediate components

290‧‧‧The Ministry of Cooling

291‧‧‧ radiator

292‧‧‧jet nozzle

341‧‧‧mounting table

411‧‧‧Bag

421‧‧‧Support box

422‧‧‧ moving box

423‧‧‧Hand unit

431‧‧‧Support box

432‧‧‧ moving box

433‧‧‧Hand unit

441‧‧‧Support box

442‧‧‧ moving box

443‧‧‧Hand unit

2121‧‧‧ Thin wall

2141‧‧‧ front end

2142‧‧‧ base end

2401‧‧‧vacuum guide path

2402‧‧‧vacuum guide path

2911‧‧‧ Base

2912‧‧‧ Heat sink

2921‧‧‧ spray holes

D1‧‧‧Room 1

Room D2‧‧‧

G‧‧‧Air

H‧‧‧ Height

P2‧‧‧Links

P3‧‧‧Links

S101‧‧‧Steps

S102‧‧‧Steps

S103‧‧‧Steps

S104‧‧‧Steps

S105‧‧‧Steps

S106‧‧‧Steps

S107‧‧‧Steps

S108‧‧‧Steps

X‧‧‧ axis (direction)

Y‧‧‧ axis (direction)

Z‧‧‧ axis (direction)

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1;

Fig. 3 is a perspective view showing a hand unit of a conveying unit of the electronic component inspection device shown in Fig. 1;

Fig. 4 is a side view showing the hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1;

Fig. 5 is a cross-sectional view showing a hand unit of a conveying portion of the electronic component inspection device shown in Fig. 1;

Fig. 6 is a cross-sectional view showing the hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1;

Fig. 7 is a block diagram showing the main part of the electronic component inspection apparatus shown in Fig. 1.

Fig. 8 is a side view showing a contact block in a modified example of the electronic component inspection device shown in Fig. 1.

Fig. 9 is a block diagram showing the essential part of a second embodiment of the electronic component inspection device of the present invention.

Fig. 10 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 9.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.

<First embodiment>

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1; Fig. 3 is a perspective view showing a hand unit of a conveying unit of the electronic component inspection device shown in Fig. 1; Fig. 4 is a side view showing the hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1; 5 and 6 are cross-sectional views showing the hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1, respectively. Fig. 7 is a block diagram showing the main part of the electronic component inspection apparatus shown in Fig. 1. Fig. 8 is a side view showing a contact block in a modified example of the electronic component inspection device shown in Fig. 1.

In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, the upstream side of the transport direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Moreover, the so-called "level" in the specification of the present application is not limited At the full level, as long as it does not hinder the transfer of the electronic components, it also includes a state of being slightly inclined (for example, less than about 5°) with respect to the horizontal.

In addition, the upper side in FIGS. 3 to 6 is referred to as "upper", "upper" or "base", and the lower side is referred to as "lower", "lower" or "front end", and the lower side is referred to as "right". , the left side is called "left". Further, in FIGS. 3 to 6, one of the plurality of hand units of the transport unit is shown.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is, for example, a device for inspecting and testing electrical characteristics of an electronic component including the following components (hereinafter referred to as "inspection"), and the above components are IC components such as BGA (Ball Grid Array) package or LGA (Land Grid Array) package, LCD (Liquid Crystal Display), OLED (Organic Electroluminescence Display) Display elements such as light-emitting displays and electronic paper, CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, CMOS image sensor), CCD (Charge Coupled Device), and acceleration sensor Various sensors such as a gyro sensor, a pressure sensor, and various oscillators including a crystal oscillator. In the following, for the sake of convenience of explanation, the case where the IC component is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC component 9".

As shown in Fig. 1, the inspection apparatus 1 includes a supply unit 2, a supply side array unit 3, a conveyance unit 4, an inspection unit 5, a collection side array unit 6, a collection unit 7, and a control unit 8 that controls the respective units. Further, the inspection apparatus 1 includes a base 11, which is provided with a supply unit 2, a supply side array unit 3, a transport unit 4, an inspection unit 5, a collection side array unit 6, and a recovery unit 7, and a cover unit 12 for housing supply The side array portion 3, the transport portion 4, the inspection portion 5, and the recovery side array portion 6 are covered on the base 11. In addition, the base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the supply side arrangement part 3, the conveyance part 4, the inspection part 5, and the collection side arrangement part 6 are arrange|positioned by this base surface 111. Moreover, the inspection device 1 can also be used as needed There is a heater or a chamber for heating the IC element 9.

The inspection apparatus 1 is configured such that the supply unit 2 supplies the IC element 9 to the supply side array unit 3, the supplied IC element 9 is arranged in the supply side array unit 3, and the transport unit 4 arranges the IC elements 9 The inspection unit 5 inspects the IC unit 9 that has been transported, and the transport unit 4 transports the IC elements 9 that have been inspected to the collection side array unit 6 and the collection unit 7 collects and collects them on the recovery side. The IC element 9 of the portion 6 is arranged. According to such an inspection apparatus 1, the supply, inspection, and recovery of the IC element 9 can be automatically performed. In addition, the inspection apparatus 1 includes a configuration other than the inspection unit 5, that is, the supply unit 2, the supply side array unit 3, the transport unit 4, the collection side array unit 6, the collection unit 7, and the control unit 8 A transport device (electronic component transport device) 10 is formed. The transport device 10 performs transport of the IC component 9 and the like.

Hereinafter, the configuration of the transport unit 4 and the inspection unit will be described.

≪Transportation Department≫

As shown in FIG. 2, the transport unit 4 transports the IC component 9 disposed on the mounting table 341 of the supply-side arranging unit 3 to the inspection unit 5, and transports the IC component 9 that has been inspected by the inspection unit 5 to the collection unit. The unit of the side alignment portion 6. The transport unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.

-shuttle-

The shuttle 41 is used to transport the IC component 9 on the mounting table 341 to the vicinity of the inspection unit 5, and further to transport the IC component 9 that has been inspected by the inspection unit 5 to the vicinity of the collection-side alignment unit 6. shuttle. The shuttles 41 are arranged in the X direction to form four pockets 411 for accommodating the IC elements 9. Further, the shuttle 41 is guided by a linear motion guide, and can be reciprocated in the X direction by a drive source such as a linear motor.

-Supply robots -

The supply robot 42 transports the IC component 9 placed on the mounting table 341 to the robot of the shuttle 41. The supply robot 42 has a support frame 421 supported by the base 11 , a moving frame supported by the support frame 421 and reciprocally movable in the Y direction with respect to the support frame 421 . 422, and four hand units (holding robots) 423 supported by the moving frame 422. Each of the hand units 423 includes an elevating mechanism and an adsorption nozzle, and can be held by the adsorption of the IC element 9.

- Check the robot -

The inspection robot 43 transports the IC component 9 housed in the shuttle 41 to the inspection unit 5, and transports the IC component 9 that has been inspected from the inspection unit 5 to the shuttle 41. Further, the inspection robot 43 can also press the IC element 9 against the inspection unit 5 at the time of inspection, and apply a specific inspection pressure to the IC element 9. The inspection robot 43 has a support frame 431 supported by the base 11, a moving frame 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431, and two hand units supported by the moving frame 432. (holding robot) 433. The arrangement of the respective hand units 433 is not particularly limited, and in the illustrated arrangement, the respective hand units 433 are arranged in the X direction.

Each of the hand units 433 includes an elevating mechanism and a contact block 260 (see FIG. 3) described below, and can be held (adsorbed and held) by adsorbing the IC element 9. Each of the hand units 433 is the same, and therefore, one of them will be described below.

The hand unit 433 is detachably fixed to the moving frame 432 by, for example, screwing or the like.

As shown in FIGS. 3 to 6, the hand unit 433 has a cylinder 210 fixed to the moving frame 432 and an element chuck 220 coupled to the front end of the cylinder 210.

The cylinder 210 has a cylinder tube 211 that is fixed to the moving frame 432. The cylinder tube 211 has a tubular tube body 212 and a cylindrical back plate 213 disposed at a base end portion of the tube body 212. The cylinder chamber 212 and the back plate 213 are formed in the cylinder chamber to be movable in the Z direction. A piston 214 is provided. The front end portion 2141 of the piston 214 protrudes toward the distal end side from the tube body 212, and the outer peripheral portion of the proximal end portion 2142 is connected to the proximal end portion of the tube body 212 by the elastically deformable thin portion 2121 over one circumference. Further, the base end portion of the cylinder chamber is divided into a first chamber D1 located on the upper side and a second chamber D2 located on the lower side by the base end portion 2142 and the thin portion 2121 of the piston 214.

The piston 214 is provided by a coil spring (not shown) provided in another member via the above-mentioned other The member is pressed upwards. In other words, the piston 214 is lifted by the coil spring, and the base end portion 2142 (the surface on the first chamber D1 side) of the piston 214 is located at a position abutting against the back plate 213 in a state where the cylinder 210 is not actuated (hereinafter, It is called the top position).

Further, a gas introduction port 215 that penetrates the back plate 213 and communicates with the first chamber D1 is formed in a central portion of the back plate 213. The gas introduction port 215 is in communication with a connection port (not shown). Further, the connection port is connected to an electro-pneumatic regulator (not shown), and when air is supplied from the air conditioner to the first chamber D1, the piston 214 is elastic against the coil spring from the uppermost end position by the pressure of the air. Move below (see Figure 6). By setting the pressure in the first chamber D1 to a specific pressure, the IC element 9 disposed in the holding portion 51 can be pressed with an appropriate pressure. Therefore, the conduction between the IC element 9 and the holding portion 51 can be surely achieved, and the breakage of the IC element 9 can be suppressed. Furthermore, the drive of the electric air conditioner is controlled by the control unit 8.

The component chuck 220 disposed on the lower side of the cylinder 210 as described above includes a first coupling block 231 fixed to a lower surface (front end surface) of the front end portion 2141 of the piston 214, and a second coupling block 232 fixed to the second portion 1 the lower surface of the joint block 231; four pillars 233, which are fixed to the lower surface of the second joint block 232, and have excellent heat insulation; the heating block 240 is fixed to the lower surface of each of the pillars 233; a block (contact member) 260 detachably fixed to the lower surface of the heating block 240, and a heat sink (heat radiating portion) 291 disposed between the second connecting block 232 and the heating block 240 and fixed to the heating block 240 above the surface. Further, the radiator 291 is provided with an injection nozzle (fluid injection portion) 292 that ejects air (fluid) G as a cooling gas. The cooling unit 290 that cools the IC element 9 is formed by the injection nozzle 292 and the heat sink 291. Further, in addition to the contact block 260, any member may be detachably formed.

Further, the heating block 240 is formed with a through hole that is open to the lower surface and the left side surface, and the through hole functions as the vacuum guiding path 2401. Further, a coupling port P2 is attached to one end of the vacuum guiding path 2401. Further, the connection port P2 is connected to a pump for sucking air and a pump for discharging air (none of which are shown). Similarly, the heating block 240 is formed with a through hole that is open to the lower surface and the side surface of the right side, and the through hole serves as a vacuum guiding path 2402. And play the function. Further, a coupling port P3 is attached to one end of the vacuum guiding path 2402. Further, the connection port P3 is connected to a pump for sucking air and a pump for discharging air (none of which are shown). Furthermore, the drive of each of the above pumps is controlled by the control unit 8.

The contact block 260 has a plate-shaped base portion (first member) 263, a first contact portion (second member) 261 provided on the lower surface of the base portion 263 and in contact with (contacts) the IC element 9, and different from the above The IC element 9 contacts (contacts) the second contact portion (second member) 262. Each of the first contact portion 261 and the second contact portion 262 is formed in a tubular shape and protrudes downward from the lower surface of the base portion 263.

Further, in the present embodiment, the contact block 260, that is, the base portion 263, the first contact portion 261, and the second contact portion 262 are integrally formed. Thereby, it is possible to suppress the transfer of heat between the base portion 263 and the first contact portion 261 and between the base portion 263 and the second contact portion 262, and it is possible to suppress the temperature between the two IC elements 9 as described below. difference. Further, the contact block 260 can be configured to have high precision such as dimensional accuracy. The method of integrally forming the contact block 260 is not particularly limited, and examples thereof include a method of cutting the contact block 260 from the ingot (base material), or casting or the like.

Further, the contact block 260 is not limited thereto. For example, the base portion 263 and the first contact portion 261 may be formed by different members, and the base portion 263 and the second contact portion 262 may be formed by different members. Further, as shown in FIG. 8, an intermediate member (third member) 271 may be interposed between the base portion 263 and the first contact portion 261, and similarly, between the base portion 263 and the second contact portion 262. An intermediate member (third member) 272 is interposed. Further, any of the intermediate member 271 and the intermediate member 272 described above may be omitted.

In addition, the positions of the first contact portion 261 and the second contact portion 262 are not particularly limited, and are appropriately set according to the respective conditions. However, in the present embodiment, the first contact portion 261 and the second contact portion 262 are opposite to the base portion. The center of 263 is arranged in point symmetry.

Further, the distance between the lower surface of the base portion 263 and the lower surface of the first contact portion 261 (the surface on which the IC element 9 abuts) and the distance between the lower surface of the base portion 263 and the lower surface of the second contact portion 262, That is, the heights H (see FIG. 4) of the first contact portion 261 and the second contact portion 262 are not particularly limited. The setting is appropriately set according to each condition, but is preferably 5 mm or less, and more preferably 4 mm or less. Further, the lower limit of the height H is not particularly limited, but the height H is preferably 1 mm or more, and more preferably 2 mm or more.

Further, a portion of the contact block 260 where the first contact portion 261 is provided is formed with a through hole that is open to the lower surface (front end surface) and the upper surface (base end surface), and the through hole communicates with the vacuum guiding path 2401. Similarly, a portion of the contact block 260 where the second contact portion 262 is provided is formed with a through hole that is open to the lower surface and the upper surface, and the through hole communicates with the vacuum guiding path 2402.

In a state in which the IC element 9 is disposed in the first contact portion 261 of the contact block 260, the specific pump is driven to suck air, and the through hole of the first contact portion 261 is in a negative pressure state. The contact portion 261 holds (adsorbs and holds) the IC element 9. Further, the specific pump is driven to supply air, and the negative pressure state of the through hole of the first contact portion 261 is released, whereby the IC element 9 that is being held by the first contact portion 261 can be released. Further, the second contact portion 262 may be subjected to the same operation as described above, and the IC element 9 may be held by the second contact portion 262 or released. In this manner, the two IC elements 9 can be held by one hand unit 433.

Further, when the first contact portion 261 and the second contact portion 262 of the contact block 260 are respectively attached to the IC element 9, when the IC unit 9 is pressed against the holding portion 51 by the hand unit 433, the IC element 9 is brought into contact with the IC element 9. Then, the portion of the IC element 9 is pressed. Furthermore, when the IC component 9 is inspected, the hand unit 433 can press the IC component 9 regardless of whether the IC component 9 is held or the IC component 9 is not held, and the IC component 9 is held. In the state in which the IC element 9 is pressed without being held, the setting of the pressing of the IC element 9 can be appropriately performed.

Further, at least one of the base portion 263, the first contact portion 261, and the second contact portion 262 of the contact block 260 preferably has a thermal conductivity of 16 (W/(m‧K)) or more, preferably 200 (W/(m‧K)) or more, more preferably 300 (W/(m‧K)) or more. Further, the upper limit of the thermal conductivity is not particularly limited, but the thermal conductivity is preferably 10,000 (W/(m‧K)) or less, more preferably 7,000 (W/(m ‧ K)) or less. Furthermore, as shown in FIG. 8, the contact block 260 has a middle In the case of the members 271 and 272, the thermal conductivities of the intermediate members 271 and 272 are the same as described above.

Thereby, the contact block 260 can function as one of the IC element 9 held by the first contact portion 261 and the IC element 9 held by the second contact portion 262 to transfer heat to the other. Features. In other words, in the inspection apparatus 1, as described below, temperature control is performed such that the temperature of the IC element 9 becomes a specific set temperature (target temperature) suitable for inspection, and the thermal conductivity is set as described above. When the IC element 9 is inspected, when the amount of heat generated by the IC element 9 held by the first contact portion 261 is different from the amount of heat generated by the IC element 9 held by the second contact portion 262, the IC having a large amount of heat generation The heat of the element 9 is transmitted to the IC element 9 having a small amount of heat by the contact block 260, so that a temperature difference between the two IC elements 9 can be suppressed.

However, when the thermal conductivity is less than the above lower limit value, the contact block 260 does not function sufficiently as a heat transfer portion, and it is difficult to suppress a temperature difference between the two IC elements 9.

Furthermore, in the present specification, the thermal conductivity of the contact block 260 is the average of the thermal conductivity of the entire contact block 260. For example, when the contact block 260 includes a plurality of members having different thermal conductivities, the thermal conductivity varies depending on the location of the contact block 260, so the average value of the thermal conductivity of the entire contact block 260 is taken as the heat of the contact block 260. Conductivity.

Further, the heat capacity (J/K) of the contact block 260 is not particularly limited, but is preferably 250 times or more, more preferably 500 times or more, and still more preferably 500 times or more and 2000 times or less of the heat capacity of the IC element 9.

Thereby, the contact block 260 absorbs the heat generated by the IC element 9, so that the temperature rise of the IC element 9 can be suppressed, and a temperature difference between the two IC elements 9 can be suppressed.

However, if the heat capacity (J/K) of the contact block 260 is less than the above lower limit value, it is difficult to suppress a temperature difference between the two IC elements 9 although it is affected by other conditions.

Here, as one example, the following is used to indicate the amount of heat Q (W) generated per unit time. (1), the condition for determining the heat capacity of the contact block 260 when the temperature of the IC element 9 rises to 2K when the IC element 9 is energized is obtained, and the heat capacity of the contact block 260 is about 261 of the heat capacity of the IC element 9. The result of the double. Further, in this calculation, when the IC element 9 has been energized, the amount of heat generated from the IC element 9 per unit time is 13.98 (W). From this result, it is also known that the heat capacity of the contact block 260 is preferably 250 times or more the heat capacity of the IC element 9 as described above.

Q=W×C×(T1-T2)/(h×3600×η)...(1)

Here, in the above formula (1), each parameter is as follows.

W: mass (kg)

C: specific heat (J/kg.K)

T1: temperature at rise (K)

T2: temperature before rising (K)

h: rise time (hours)

η: efficiency (η is 0.7 or more and 1 or less, and is set to "0.7" in the present embodiment)

Further, the constituent materials of the contact block 260 (the base portion 263, the first contact portion 261, the second contact portion 262, and the intermediate members 271 and 272) are not particularly limited, but are preferably rigid, and examples thereof include the above-described thermal conductivity. Various metal materials (including alloys, intermetallic compounds) and the like. Specific examples thereof include silver (412 (W/(m‧K))), copper (371 (W/(m‧K))), aluminum (195 (W/(m‧K))), and magnesium. (150 (W/(m‧K))), chromium (96 (W/(m‧K))), iron (79 (W/(m‧K))), carbon steel (58 (W/(m) ‧K))), various metals such as titanium (17 (W/(m‧K))), or alloys or intermetallic compounds containing at least one of these, and oxides and nitrides of the metals Carbide, etc. In this case, as a constituent material of the contact block 260, at least one of aluminum and copper is preferably contained. Thereby, the thermal conductivity of the contact block 260 can be improved. In addition, examples of the alloy include stainless steel such as SUS304 (16.7 (W/(m‧K))), SUS316 (16.7 (W/(m‧K))), and the like. Furthermore, the value in the above brackets is "thermal conductivity".

Further, the constituent materials of the heating block 240 and the heat sink 291 are not particularly limited, but are preferably hard and have a high thermal conductivity. The material which is hard and has high thermal conductivity is not particularly limited, and specific examples thereof are the same as those of the above-described contact block 260.

The heat sink 291 has a plate-shaped base portion 2911 and a plurality of fins 2912 protruding upward from the base portion 2911. Each of the fins 2912 is arranged in the X direction. The heat sink 291 is disposed in a space formed by each of the pillars 233 (a space between the heating block 240 and the second coupling block 232). Further, the heat sink 291 is thermally connected by, for example, using a material such as solder to fix the lower surface of the base portion 2911 to the upper surface of the heating block 240. In this manner, the heat sink 291 is disposed on the contact block 260 via the heating block 240. Further, the heat sink 291 is provided in the second connection block 232 in a non-contact manner. In other words, a gap is formed between the heat sink 291 and the second connecting block 232. Thereby, heat exchange between the heat sink 291 and the second connection block 232 is suppressed, and the heat dissipation effect of the heat sink 291 is improved. The size of the above gap can be simply controlled by adjusting the height of each of the pillars 233.

Further, each of the pillars 233 is screwed to the heating block 240 and the second coupling block 232 by screws 234. Further, a heat insulating material 235 is provided between the head of each of the screws 234 and the heating block 240.

The injection nozzle 292 has a plurality of injection holes 2921 which are sprayed with air G and are arranged in one line. The injection nozzles 292 are disposed such that the respective injection holes 1721 are arranged along the arrangement (X direction) of the fins 2912 of the heat sink 291, and are configured to eject the air G from the respective injection holes 1721 to the respective fins 2912. That is, the following pump 133 that discharges air (compressed air) is connected to the injection nozzle 292. The drive of the pump 133 is controlled by the control unit 8. By blowing the air G to the heat sink 291, the IC element 9 can be cooled via the heat sink 291, the heating block 240, and the contact block 260. Further, since the injection nozzle 292 is fixed to the second coupling block 232 via the fixing tool, the relative position to the heat sink 291 is kept constant. Therefore, the air G can be stably ejected toward the radiator 291, thereby stably cooling the radiator 291.

Further, by setting the fluid ejected from the ejection nozzle 292 to air, the processing can be changed. It's simple, and it can be cost-reduced. Further, for example, by using air cooled by a refrigerating cooler or the like, the cooling performance of the IC element 9 can be improved. However, the fluid to be ejected from the injection nozzle 292 is not limited to air, and for example, a gas such as nitrogen gas, argon gas, carbon dioxide gas, fluorine gas, or various insulating gases including such a mixed gas may be used. Further, a temperature adjustment unit that adjusts the temperature of the air (fluid) injected from the injection nozzle 292 may be provided.

In the heating block 240, two rod-shaped heaters (heating portions) 241 are buried. Further, each heater 241 extends in the X direction. The heating block 240 in which the heater 241 is embedded is located between the heat sink 291 and the contact block 260 and disposed on the contact block 260. The driving of the heater 241 is controlled by the control unit 8. When the heater 241 generates heat, the heat is conducted to the IC element 9 via the heating block 240 and the contact block 260, and the temperature of the IC element 9 rises. Thereby, the electrical characteristics of the IC component 9 in a high temperature environment can be inspected.

The heater 241 is not particularly limited as long as the IC element 9 can be heated, and for example, an alumina heater, an aluminum nitride heater, a tantalum nitride heater, a tantalum carbide heater, or a boron nitride heater can be used. Various ceramic heaters, various types of heaters using electric heating wires such as nichrome wires, and the like. Further, the heater 241 is not limited to a rod shape, and for example, a flat surface may be used. In addition, the heating unit is not limited to the heater 241, and examples thereof include a Peltier element and the like.

Further, a temperature sensor 243 is embedded in the heating block 240. The temperature sensor 243 indirectly detects the temperature of the IC element 9 by detecting (detecting) the temperature of the heating block 240. The detection result of the temperature sensor 243, that is, the signal output from the temperature sensor 243 is input to the control unit 8, and the control unit 8 grasps the temperature detected by the temperature sensor 243. Furthermore, as described above, the heating block 240 and the contact block 260 are made of a material having a high thermal conductivity, whereby the temperature difference between the IC element 9 and the heating block 240 is small, and the temperature sensor 243 is buried in the heating block 240. The temperature of the IC component 9 can also be detected very accurately.

As the temperature sensor 243, as long as the temperature of the IC element 9 can be detected, it is not special. For example, a Pt sensor such as a platinum sensor, a thermocouple, a thermal resistor, or the like can be used. Further, when the IC element 9 has a built-in thermosensitive diode or the like, the temperature sensor 243 may be omitted, and the temperature of the IC element 9 may be detected by the thermosensitive diode.

Further, the temperature sensor 243 of the present embodiment is arranged to indirectly detect the temperature of the IC element 9, but the arrangement is not particularly limited as long as the temperature of the IC element 9 can be detected, for example, It can be constructed directly by detecting the temperature of the IC element 9. Specifically, the temperature sensor 243 may also be disposed to be exposed on the lower surface of the component chuck 220 so as to be in contact with any of the IC elements 9 when pressed. Further, in the inspection apparatus 1, in consideration of the thermal resistance of the heating block 240 and the contact block 260, the temperature detected by the temperature sensor 243 plus the specific corrected temperature may be used as the temperature of the IC element 9.

Further, in the present embodiment, the temperature sensor 243 is embedded in the heating block 240. However, the temperature sensor 243 may be buried in the contact block 260. In this case, the distance from the IC element 9 is also close. The temperature detection accuracy is improved. However, since the contact block 260 is appropriately selected depending on the type and size of the IC element 9, it is assumed that the temperature sensor 243 is disposed in the contact block 260, and the temperature sensor 243 must be disposed in all the contact blocks 260 to be replaced. Lead to increased costs. Therefore, in order to reduce the cost, it is preferable to arrange the temperature sensor 243 in the heating block 240 as in the present embodiment.

According to the hand unit 433, the heating by the heater 241 of the IC element 9 and the cooling by the air G can maintain the temperature of the IC element 9 within a specific temperature range (for example, the set temperature ±) 2 ° C or so). In particular, by the air G, the temperature rise by the self-heating of the IC element 9 can be quickly eliminated, and the temperature of the IC element 9 under inspection can be kept substantially constant, and the IC element 9 can be inspected with higher precision. .

-Recycling robots -

The collection robot 44 is a robot that transports the IC element 9 that has been inspected by the inspection unit 5 to the collection side alignment unit 6. The recovery robot 44 has a support frame 441 supported by the base 11 , is supported by the support frame 441 , and is reciprocally movable in the Y direction with respect to the support frame 441 . The moving frame 442 and the four hand units (holding robots) 443 supported by the moving frame 442. Each of the hand units 443 includes an elevating mechanism and an adsorption nozzle, and can be held by the adsorption of the IC element 9.

The transfer unit 4 transports the IC element 9 as follows. First, the shuttle 41 moves to the left in the drawing, and the supply robot 42 transports the IC component 9 on the mounting table 341 to the shuttle 41 (step 1). Next, the shuttle 41 moves toward the center, and the inspection robot 43 transports the IC component 9 on the shuttle 41 to the inspection unit 5 (step 2). Next, the inspection robot 43 transports the IC component 9 that has been inspected by the inspection unit 5 to the shuttle 41 (step 3). Next, the shuttle 41 moves to the right side in the drawing, and the recovery robot 44 transports the inspected IC element 9 on the shuttle 41 to the recovery side array unit 6 (step 4). By repeating the above steps 1 to 4, the IC element 9 can be transported to the recovery side aligning unit 6 via the inspection unit 5.

In the above, the configuration of the transport unit 4 has been described. However, as the configuration of the transport unit 4, the IC element 9 on the mounting table 341 can be transported to the inspection unit 5, and the IC element 9 that has been inspected can be aligned to the recovery side. 6 Transfer is not particularly limited. For example, the shuttle 41 can be omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 can be transported from the mounting table 341 to the inspection unit 5 and from the inspection unit 5 to the collection side. 6 transfer.

≪Inspection Department≫

The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC element 9. As shown in FIG. 2, the inspection unit 5 has four holding portions 51 on which the IC elements 9 are placed. A plurality of probes (not shown) electrically connected to the terminals of the IC element 9 are provided in the holding portions 51, respectively. Each probe is electrically connected to the control unit 8. When the IC element 9 is inspected, one IC element 9 is placed (held) in one holding portion 51. Each of the terminals of the IC element 9 disposed in the holding portion 51 is pressed against the respective probes by a specific inspection by the pressing of the hand unit 433 of the inspection robot 43. Thereby, each terminal of the IC element 9 is electrically connected (contacted) to each probe, and the IC element 9 is inspected via the probe. The inspection of the IC component 9 is performed based on the program stored in the control section 8.

≪Control Department≫

The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs inspection of electrical characteristics of the IC component 9 disposed in the inspection unit 5, for example, based on a program stored in a memory (not shown). In addition, for example, the drive control unit controls the driving of each of the supply unit 2, the supply-side arranging unit 3, the transport unit 4, the inspection unit 5, the collection-side arranging unit 6, and the collection unit 7, and the IC element 9 is transported. Moreover, the control unit 8 also performs temperature control of the IC element 9.

Next, the temperature control of the IC element 9 will be described. In addition, a mechanism for injecting the air G to the radiator 291 for this temperature control will be described, but a mechanism relating to one injection nozzle 292 will be described as a representative.

As shown in FIG. 7, the inspection apparatus 1 includes a pump (fluid supply unit) 133 that discharges air G, supplies air G to the injection nozzle 292, and a pipe body 14 that connects the pump 133 to the injection nozzle 292. The inner cavity of the pipe body 14 is a flow path for the air G to flow. Further, a solenoid valve (valve) 131 that opens and closes the flow path is provided in the middle of the pipe body 14. Further, the driving of the solenoid valve 131 is controlled by the control unit 8, respectively.

In the inspection apparatus 1, the temperature of the IC element 9 is detected by the temperature sensor 243, and based on the detection result, the temperature of the IC element 9 is set to a specific set temperature (target temperature) suitable for inspection. Perform temperature control.

The solenoid valve 131 is closed before the inspection of the IC component 9. Then, the heater 241 is driven to heat the IC element 9, and the output of the heater 241 is adjusted to adjust the temperature of the IC element 9 to the set temperature. Further, when the temperature of the IC element 9 detected by the temperature sensor 243 is higher than the threshold Tmax which is the upper limit of the allowable range of the set temperature, the output of the heater 241 can be reduced or stopped. At the same time, the pump 133 can be driven to open the solenoid valve 131 and eject the air G from the injection nozzle 292. When the air G is ejected from the ejection nozzle 292, the air G is blown to the heat sink 291, through which the IC element 9 is cooled. In this way, the temperature of the IC element 9 is controlled in such a manner as to be a set temperature.

In the inspection of the IC element 9, there is a case where the IC element 9 is self-heated by energization of the IC element 9, and becomes higher than the set temperature. Therefore, when the temperature of the IC element 9 detected by the temperature sensor 243 is higher than the threshold Tmax which is the upper limit of the allowable range of the set temperature, the output of the heater 241 is reduced or stopped, and the pump is driven. 133, the solenoid valve 131 is opened, and the air G is ejected from the injection nozzle 292.

The air G is ejected from the ejection nozzle 292, and the air G is blown to the heat sink 291, and the IC element 9 is cooled via the heat sink 291. As a result, the temperature of the IC element 9 is controlled so as to become the set temperature.

As described above, according to the inspection apparatus 1, the other members are shared by the first contact portion 261 and the second contact portion 262, so that the size can be reduced and the number of components can be reduced. In particular, the interval between the first contact portion 261 and the second contact portion 262 can be reduced, whereby when a plurality of hand units 433 are arranged and arranged, the plurality of IC elements 9 can be simultaneously held and inspected.

Moreover, by setting the thermal conductivity as described above, it is possible to suppress a temperature difference between the two IC elements 9.

Further, since the IC element 9 can be cooled while being heated, the temperature of the IC element 9 can be adjusted with high precision.

<Second embodiment>

Fig. 9 is a block diagram showing the essential part of a second embodiment of the electronic component inspection device of the present invention. Fig. 10 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 9.

In the following, the second embodiment will be described with the exception of the first embodiment, and the description of the same matters will be omitted. In addition, the mechanism for ejecting the air G to the radiator 291 will be described with respect to a mechanism having one injection nozzle 292.

As shown in Fig. 9, the inspection apparatus 1 of the second embodiment includes: a pump (fluid supply) a portion 133, which ejects air G, supplies air G to the injection nozzle 292, a pipe body 14 that connects the pump 133 to the injection nozzle 292, and a flow meter (flow sensor) 242 that ejects the self-injection nozzle 292. The flow rate detecting unit that detects (measures) the flow rate of the air G. The inner cavity of the pipe body 14 is a flow path for the air G to flow.

Further, the flow meter 242 is provided, for example, in the tubular body 14. A signal indicating the flow rate of the air G detected by the flow meter 242 is input to the control unit 8, and the control unit 8 grasps the flow rate of the air G detected by the flow meter 242. Further, as the flow rate meter 242, if it is possible to detect the flow rate of the air G injected from the injection nozzle 292, it may be set in advance in the pipe body 14, or may be a later installer.

Further, as another method of detecting the flow rate of the air G by the flow meter 242, for example, a flow meter 242 is used as the flow meter 242, and the flow meter 242 is disposed in the vicinity of the injection nozzle 292 to detect the flow rate of the air G. The vicinity of the injection nozzle 292 is an internal space of the injection nozzle 292, an opening of the injection nozzle 292, a position at a specific distance from the opening of the injection nozzle 292, and the like.

Further, the tubular body 14 is branched in the middle to branch into the first tubular body 141 and the second tubular body 142, and then merged again. That is, the first pipe body 141 and the second pipe body 142 are connected in parallel. The inner cavity of the first pipe body 141 is a first flow path through which the air G flows, and the inner cavity of the second pipe body 142 is a second flow path through which the air G flows. The cross-sectional area of the inner cavity (first flow path) of the first tube body 141 in the direction orthogonal to the central axis is larger than the inner cavity (second flow path) of the second tube body 142, which is orthogonal to the central axis. The area of the cross section in the direction.

A solenoid valve (valve) 131 that opens and closes the flow path (first flow path) is provided in the middle of the first pipe body 141. Further, a throttle valve (second flow path flow rate adjusting unit) 132 is provided in the middle of the second pipe body 142, and the throttle valve 132 adjusts the opening degree to perform the flow rate of the air G flowing through the second pipe body 142. Adjustment. In this manner, one end of the second tubular body 142 communicates with the upstream side of the electromagnetic valve 131 of the first tubular body 141 (in the present embodiment, the end portion), and the other end of the second tubular body 142 communicates with the other end. The portion of the solenoid valve 131 of the first pipe body 141 on the downstream side (in this embodiment) In the form, it is the end). That is, the second pipe body 142 bypasses the electromagnetic valve 131. Further, the driving of the solenoid valve 131 and the throttle valve 132 is controlled by the control unit 8. In addition, the first pipe body 141, the second pipe body 142, the electromagnetic valve 131, the throttle valve 132, and the like constitute a flow rate adjusting unit 100 that adjusts the flow rate of the air G injected from the injection nozzle 292.

The flow rate adjustment unit 100 is configured to adjust the average flow rate of the air G injected from the injection nozzle 292 to a first average flow rate and a second average flow rate greater than the first average flow rate by the control of the control unit 8. When the solenoid valve 131 is closed and the throttle valve 132 is opened to have a specific opening degree, the average flow rate is the first average flow rate, the electromagnetic valve 131 is opened, and the throttle valve 132 is opened to make the opening degree specific. In the case of the opening degree, the average flow rate is the second average flow rate. Further, the "average flow rate" is an average value per unit time of the flow rate of the air G injected from the injection nozzle 292. Further, since the flow rate of the air G is increased or decreased over time, in the present embodiment, the instantaneous flow rate is used instead of the instantaneous value of the flow rate of the air G.

Before checking the IC element 9, the flow rate adjustment unit 100 sets the average flow rate as the first average flow rate. On the other hand, the above average flow rate during the period in which the IC element 9 is being inspected includes the second average flow rate. Hereinafter, it demonstrates in detail.

First, in the inspection apparatus 1, the temperature of the IC element 9 is detected by the temperature sensor 243, and based on the detection result, the temperature of the IC element 9 is set to a specific set temperature (target temperature) suitable for inspection. The way to control the temperature.

Before the inspection of the IC component 9, the solenoid valve 131 is closed and the throttle valve 132 is opened. Further, the opening degree of the throttle valve 132 is adjusted to a specific opening degree. Then, while the heater 241 is driven to heat the IC element 9, the air G is ejected from the nozzle 292 to the heat sink 291, the IC element 9 is cooled, the balance is obtained, and the temperature of the IC element 9 is adjusted to the set temperature. In this case, since the solenoid valve 131 is closed, the average flow rate of the air G injected from the injection nozzle 292 becomes the first average flow rate.

In the inspection of the IC element 9, there is an energization of the IC element 9, and the IC element 9 spontaneously Heat, and it becomes higher than the set temperature. Therefore, when the temperature of the IC element 9 detected by the temperature sensor 243 is higher than the threshold Tmax which is the upper limit of the allowable range of the set temperature, the output of the heater 241 is reduced or stopped, and the electromagnetic is turned on. The valve 131 causes the average flow rate of the air G injected from the injection nozzle 292 to be the second average flow rate. Thereby, the amount of heat radiated from the heat sink 291 is increased, and the IC element 9 is further cooled. In addition, since the air G is blown to the radiator 291 from before the temperature of the IC element 9 becomes higher than the threshold value Tmax, the responsiveness (cooling response) of the cooling is improved, and the temperature of the IC element 9 can be rapidly lowered. As a result, the temperature of the IC element 9 is controlled so as to become the set temperature.

After the inspection of the IC element 9 is completed, the electromagnetic valve 131 is closed, and the average flow rate of the air G injected from the injection nozzle 292 is the first average flow rate, and the inspection of the next IC element 9 is prepared.

Here, the first average flow rate a is not particularly limited and is appropriately set depending on each condition, but is preferably 1 mL/sec or more and 500 mL/sec or less, more preferably 10 mL/sec or more and 100 mL/sec or less.

When the first average flow rate a is larger than the above upper limit value, the output of the heater 241 must be increased and the energy consumption is increased, although it is affected by other conditions.

Further, when the first average flow rate a is smaller than the lower limit value, the cooling responsiveness in the case of cooling the IC element 9 is lowered although it is affected by other conditions.

In addition, the second average flow rate b is not particularly limited, and is appropriately set according to each condition, and is preferably 2 mL/sec or more and 1000 mL/sec or less, more preferably 20 mL/sec or more and 200 mL/sec or less.

When the second average flow rate b is larger than the above upper limit value, the energy consumption is increased although it is affected by other conditions.

Further, when the second average flow rate b is smaller than the lower limit value, the cooling responsiveness in the case of cooling the IC element 9 is lowered although it is affected by other conditions.

In addition, the ratio (b/a) of the first average flow rate a to the second average flow rate b is not particularly limited, and is appropriately set according to each condition, but is preferably 1.5 or more, more preferably 2 or more and 10 or less.

If b/a is larger than the above upper limit value, the energy consumption is increased although it is affected by other conditions.

Further, when b/a is less than the above lower limit value, the cooling responsiveness in the case of cooling the IC element 9 is lowered although it is affected by other conditions.

Next, the control operation of the control unit 8 in controlling the average flow rate of the air G ejected from the injection nozzle 292 will be described.

First, as shown in FIG. 10, before the inspection of the IC element 9, the average flow rate of the air G ejected from the ejection nozzle 292 is set to the first average flow rate (step S101). Then, as described above, the temperature of the IC element 9 is detected by the temperature sensor 243, and based on the detection result, the temperature is controlled such that the temperature of the IC element 9 becomes the set temperature.

Then, it is judged whether or not the inspection of the IC element 9 has been started (step S102), and when the inspection has started, the temperature T of the IC element 9 is detected by the temperature sensor 243 (step S103), and the pair is detected. Whether or not the temperature T is greater than the threshold value Tmax which is the upper limit of the allowable range of the set temperature is determined (step S104).

When it is determined in step S104 that the detected temperature T is equal to or less than the threshold value Tmax, the average flow rate is set to the first average flow rate (step S105). That is, when the current average flow rate is the first average flow rate, the current average flow rate is maintained, and when the current average flow rate is the second average flow rate, the average flow rate is changed to the first average flow rate.

Moreover, when it is determined in step S104 that the detected temperature T is greater than the threshold value Tmax, the average flow rate is made the second average flow rate (step S106). That is, when the current average flow rate is the second average flow rate, the current average flow rate is maintained, and when the current average flow rate is the first average flow rate, the average flow rate is changed to the second average flow rate. Also, in this case, as described above, the output of the heater 241 is reduced or stopped.

Then, it is judged whether or not the inspection of the IC component 9 has ended (step S107), and the inspection is performed. When the check is not completed, the process returns to step S103, and the steps from step S103 onward are performed again. When the inspection of the IC element 9 is completed, the inspection of the next IC element 9 is prepared so that the average flow rate is the first average flow rate (step S108). That is, when the current average flow rate is the first average flow rate, the current average flow rate is maintained, and when the current average flow rate is the second average flow rate, the average flow rate is changed to the first average flow rate. At this point, the program ends.

As described above, according to the inspection apparatus 1, the cooling responsiveness can be improved when the IC element 9 is cooled. Thereby, in the control of maintaining the temperature of the IC element 9 at the set temperature of the inspection, when the temperature of the IC element 9 is higher than the set temperature, the temperature of the IC element 9 can be rapidly lowered.

Further, it is desirable that the temperature of the contact block 260 in contact with the IC element 9 is the set temperature to be inspected, and the temperature of the heat sink 291 is as low as possible. That is, if the temperature gradient between the contact block 260 and the heat sink 291 is large, the cooling response is better. Therefore, by disposing the heater 241 between the heat sink 291 and the contact block 260, the contact block 260 is enlarged. Temperature gradient between the heat sink 291 and the heat sink 291. Thereby, the IC element 9 can be quickly cooled via the heat sink 291. Also, the IC element 9 can be easily heated via the contact block 260.

Further, according to the second embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced with any configuration having the same function. Further, any other constituents may be added to the present invention.

Further, the present invention may be a combination of any two or more of the above-described configurations (features).

Further, in the above embodiment, the number of the second members is two. However, the present invention is not limited thereto, and may be three or more.

Claims (10)

An electronic component transporting apparatus comprising: a first member and a plurality of second members abutting against the electronic component; and at least one of the first member and the plurality of second members The thermal conductivity is 16 (W/(m‧K)) or more, and the first member is integrally formed with the plurality of second member systems. The electronic component conveying apparatus of claim 1, wherein the abutting member has a thermal conductivity of 16 (W/(m‧K)) or more. The electronic component conveying apparatus according to claim 1 or 2, wherein the abutting member has a third member, and the third member is disposed at least one of the first member and the plurality of second members, and thermal conductivity It is 16 (W/(m‧K)) or more. The electronic component conveying apparatus according to claim 1 or 2, wherein a height of the first member and the plurality of second members is 1 mm or more and 5 mm or less. The electronic component conveying apparatus according to claim 1 or 2, wherein the first member and the plurality of second members each comprise at least one of aluminum and copper as a constituent material thereof. The electronic component transport apparatus according to claim 1 or 2, wherein the abutting member is provided with a heat radiating portion. The electronic component conveying apparatus according to claim 1 or 2, wherein the abutting member is provided with a heating portion. The electronic component transporting apparatus according to claim 1 or 2, wherein the heat capacity (J/K) of the abutting member is 250 times or more of a heat capacity of the electronic component. The electronic component conveying apparatus according to claim 1 or 2, wherein the first member and the plurality of second members are integrally formed by cutting or casting. An electronic component inspection device comprising: a contact member having a first member and a plurality of second members that are in contact with the electronic component; An inspection unit that inspects the electronic component; and at least one of the first member and the plurality of second members has a thermal conductivity of 16 (W/(m‧K)) or more, and the first member It is formed integrally with the plurality of second member systems.