TWI612595B - 接合裝置、接合系統、接合方法及電腦記憶媒體 - Google Patents
接合裝置、接合系統、接合方法及電腦記憶媒體 Download PDFInfo
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- TWI612595B TWI612595B TW104124749A TW104124749A TWI612595B TW I612595 B TWI612595 B TW I612595B TW 104124749 A TW104124749 A TW 104124749A TW 104124749 A TW104124749 A TW 104124749A TW I612595 B TWI612595 B TW I612595B
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- 238000001179 sorption measurement Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 374
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Landscapes
- Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-161632 | 2014-08-07 | ||
| JP2014161632 | 2014-08-07 | ||
| JP2015093838A JP6382769B2 (ja) | 2014-08-07 | 2015-05-01 | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
| JP2015-093838 | 2015-05-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201622028A TW201622028A (zh) | 2016-06-16 |
| TWI612595B true TWI612595B (zh) | 2018-01-21 |
Family
ID=55530167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104124749A TWI612595B (zh) | 2014-08-07 | 2015-07-30 | 接合裝置、接合系統、接合方法及電腦記憶媒體 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6382769B2 (ja) |
| KR (1) | KR102407491B1 (ja) |
| TW (1) | TWI612595B (ja) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102749376B1 (ko) | 2016-11-02 | 2025-01-06 | 삼성전자주식회사 | 기판 본딩 장치 및 그를 이용한 반도체 소자의 제조 방법 |
| JP6820189B2 (ja) | 2016-12-01 | 2021-01-27 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
| KR102397545B1 (ko) * | 2017-05-02 | 2022-05-12 | 삼성전자주식회사 | 척 스테이지 이물질 감지 장치 |
| KR102395194B1 (ko) | 2017-06-21 | 2022-05-06 | 삼성전자주식회사 | 웨이퍼 본딩 장치 및 그 장치를 포함한 웨이퍼 본딩 시스템 |
| US10497667B2 (en) | 2017-09-26 | 2019-12-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for bond wave propagation control |
| WO2019146424A1 (ja) * | 2018-01-23 | 2019-08-01 | 東京エレクトロン株式会社 | 基板処理装置、および基板処理方法 |
| KR102421610B1 (ko) * | 2018-07-31 | 2022-07-14 | 캐논 톡키 가부시키가이샤 | 정전척 시스템, 성막 장치, 흡착 방법, 성막 방법 및 전자 디바이스의 제조방법 |
| KR102225956B1 (ko) | 2018-10-19 | 2021-03-12 | 세메스 주식회사 | 다이 본딩 장치, 기판 본딩 장치, 다이 본딩 방법 및 기판 본딩 방법 |
| WO2020184231A1 (ja) | 2019-03-14 | 2020-09-17 | 東京エレクトロン株式会社 | 接合システム、および接合方法 |
| JP7717553B2 (ja) | 2021-09-17 | 2025-08-04 | キオクシア株式会社 | 接合装置及び接合方法 |
| WO2025204964A1 (ja) * | 2024-03-26 | 2025-10-02 | 東京エレクトロン株式会社 | 接合装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201205707A (en) * | 2010-02-26 | 2012-02-01 | Tokyo Electron Ltd | Joining method, program, and computer recording medium |
| TW201304034A (zh) * | 2011-04-26 | 2013-01-16 | 尼康股份有限公司 | 基板保持裝置、基板貼合裝置、基板保持方法、基板貼合方法、積層半導體裝置及疊合基板 |
| TW201308445A (zh) * | 2011-03-04 | 2013-02-16 | 東京威力科創股份有限公司 | 接合方法、電腦記憶媒體、接合裝置及接合系統 |
| TW201332037A (zh) * | 2011-09-07 | 2013-08-01 | 東京威力科創股份有限公司 | 接合方法、電腦記憶媒體及接合系統 |
| US20140208556A1 (en) * | 2013-01-25 | 2014-07-31 | Tokyo Electron Limited | Joining device and joining system |
| US20140208557A1 (en) * | 2013-01-25 | 2014-07-31 | Tokyo Electron Limited | Joining device and joining system |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1358871A (en) | 1971-06-25 | 1974-07-03 | Pye Ltd | Crane load indicator arrangement |
| JP2006054289A (ja) * | 2004-08-11 | 2006-02-23 | Nikon Corp | 基板保持装置、ステージ装置、露光装置、及びデバイスの製造方法 |
| JP4899879B2 (ja) * | 2007-01-17 | 2012-03-21 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| JP2013120902A (ja) * | 2011-12-08 | 2013-06-17 | Tokyo Electron Ltd | 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム |
| JP5538613B1 (ja) * | 2013-11-13 | 2014-07-02 | 東京エレクトロン株式会社 | 接合装置及び接合システム |
-
2015
- 2015-05-01 JP JP2015093838A patent/JP6382769B2/ja active Active
- 2015-07-30 TW TW104124749A patent/TWI612595B/zh active
- 2015-08-06 KR KR1020150110982A patent/KR102407491B1/ko active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201205707A (en) * | 2010-02-26 | 2012-02-01 | Tokyo Electron Ltd | Joining method, program, and computer recording medium |
| TW201308445A (zh) * | 2011-03-04 | 2013-02-16 | 東京威力科創股份有限公司 | 接合方法、電腦記憶媒體、接合裝置及接合系統 |
| TW201304034A (zh) * | 2011-04-26 | 2013-01-16 | 尼康股份有限公司 | 基板保持裝置、基板貼合裝置、基板保持方法、基板貼合方法、積層半導體裝置及疊合基板 |
| TW201332037A (zh) * | 2011-09-07 | 2013-08-01 | 東京威力科創股份有限公司 | 接合方法、電腦記憶媒體及接合系統 |
| US20140208556A1 (en) * | 2013-01-25 | 2014-07-31 | Tokyo Electron Limited | Joining device and joining system |
| US20140208557A1 (en) * | 2013-01-25 | 2014-07-31 | Tokyo Electron Limited | Joining device and joining system |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102407491B1 (ko) | 2022-06-13 |
| TW201622028A (zh) | 2016-06-16 |
| JP2016039364A (ja) | 2016-03-22 |
| KR20160018411A (ko) | 2016-02-17 |
| JP6382769B2 (ja) | 2018-08-29 |
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