TWI608191B - Light-emitting diode bulb with heat dissipation structure - Google Patents

Description

Light-emitting diode bulb with heat dissipation structure

An object of at least one embodiment of the present invention is to provide a light-emitting diode bulb having a heat dissipation structure, and more particularly to a light-emitting diode bulb using an external heat-dissipating ring.

Traditional lighting equipment mainly uses incandescent lamps or power-saving bulbs as light source components, but incandescent lamps or power-saving bulbs have always had problems such as high energy consumption and short service life. In recent years, related technologies of light-emitting diodes have been continuously developed, and high-power, high-luminance light-emitting diodes have been developed, and the light-emitting diodes save nearly 50% of energy compared with conventional tungsten light bulbs, and have up to 4 With a service life of 100,000 hours, the LED has a tendency to gradually replace traditional lighting equipment in the market.

Government agencies such as the Energy Bureau of the Ministry of Economic Affairs have actively promoted the "LED Street Light Application Demonstration Project" in recent years. From 1997 to 103, they assisted local governments in completing nearly 310,000 LED street lamp replacements. After completion, LED street lamps accounted for nearly 17% of the total number of street lamps in the country. The Clinton Climate Initiatives (CCI) of the United States also plans to replace the existing 140,000 street lamps in Los Angeles with light-emitting diodes by 2016. It is estimated that road lighting in Los Angeles will be completed by 2016. It will save 40% of energy consumption and reduce carbon dioxide emissions by 40,000 metric tons per year.

In addition to public lighting equipment, the share of LEDs in the lighting market has also increased year by year. Thanks to the maturity of the manufacturing technology of the light-emitting diodes, the price is gradually reduced, making the general public The acceptance of the light-emitting diodes has gradually increased, and many households, businesses, and industries have adopted light-emitting diodes as the light source components of various devices. At present, LEDs have advantages in flashlights, displays, handheld mobile devices, indoor lighting, etc., and the market share has increased year by year. Industry reports indicate that the penetration rate of LEDs in the global lighting market will exceed 30% in 2014. And drive the output value of $35.3 billion.

However, the photoelectric conversion efficiency of the current LED is still not mature. In actual use, the light-emitting diode converts most of the energy into waste heat, which causes the temperature of the junction between the light-emitting diode and the printed circuit board (hereinafter referred to as the junction surface of the light-emitting diode) to be too high. This not only causes energy loss and waste, but also reduces the luminous efficiency and product life of the light-emitting diode. For example, when the photoelectric conversion efficiency of the light-emitting diode is greatly reduced by the high temperature, the light-emitting diode not only needs to consume more power to maintain the illuminance, but also generates more heat energy to cause the temperature to rise further and fall into a malignant In the loop. Among them, the light-emitting diode bean lamp has a smaller space and a higher density of the light-emitting diode wafer than the general light-emitting diode lamp, so that the heat is easily concentrated in the tiny bean lamp and causes the light-emitting diode chip. The problem of the junction temperature is too high.

Most of the existing light-emitting diode heat sinks use a heat dissipating mechanism to solve the problem that the LED junction temperature is too high, but these designs have problems of being difficult to manufacture, large in size, and high in cost. For example, in the prior art, a cooling device such as a blower is mounted on the illuminator of the illuminating diode, and the temperature of the junction surface of the illuminating diode is reduced by forced convection. In the past, there have also been techniques for installing a water-cooled heat sink on the back side of a printed circuit board that stores high thermal conductivity liquid inside the heat sink and conducts heat away from the printed circuit board by convection of the liquid. The above technology not only occupies a large amount of space inside the lamp, but also has difficulty in manufacturing technology and relatively high cost. In view of the volume problem, these conventional heat dissipation mechanisms cannot be used in light-emitting diode bean lamps. On the tiny structure.

In view of this, the current field of light-emitting diode bulbs still lacks a simple, small heat dissipation structure.

Conventional light-emitting diode bulbs have the disadvantage that the junction temperature of the light-emitting diode wafer is too high. In order to improve the above problems, at least one embodiment of the present invention provides a light-emitting diode bulb having a heat dissipation structure, and more particularly to a light-emitting diode bulb using an external heat-dissipating ring. The light-emitting diode bulb with heat dissipation structure can reduce the temperature of the junction surface of the LED, improve the optical performance, extend the life of the product, and has the advantages of easy manufacture, simple geometry, small size and low cost.

A light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention includes a lamp cover, a base, a printed circuit board, a light-emitting diode, and a heat-dissipating ring. The pedestal is connected to the lamp cover, and an internal space is formed by the pedestal and the lamp cover, and the printed circuit board is disposed in the internal space. The light emitting diode is connected to the printed circuit board and controlled by the printed circuit board. Finally, the heat ring is attached to the outside of the base.

Some embodiments of the present invention enhance the thermal performance of a light-emitting diode bulb by employing an external heat dissipation structure. The light-emitting diode bulb with the heat dissipation structure of the embodiment can effectively relieve the problem of overheating of the junction temperature caused by the excessive density of the light-emitting diode in the bulb while maintaining the volume of the bulb, and at the same time, the waste heat self-luminous diode bulb The pedestal is carried to the external heat dissipation structure to reduce the damage of the waste heat to the light-emitting diode.

Some embodiments of the present invention employ a heat-dissipating structure of a particular geometry, thereby improving the appearance of the rigid and modularized light-emitting diodes of the past. The embodiment hides the heat dissipation structure in the beauty The design of the blade and the petal shape fins improves the problem of the chilly appearance of the heat dissipation structure of the masses in the past, thereby promoting the willingness of the masses to use and increasing the permeability of the light-emitting diode.

110, 210, 310, 410, 510‧‧‧ lampshades

120, 220, 320, 420, 520‧‧‧ pedestals

130, 230, 330, 430, 530‧‧‧ Printed circuit boards

131, 231, 331, 431, 531‧‧ ‧Lighting diodes

140, 240, 340, 440, 540‧‧ ‧ heat ring

150, 250, 350, 450, 550‧‧ ‧ lamp holders

241A, 241B‧‧‧heating bracket

343‧‧‧Extension

445‧‧‧Vertical fins

547, 547A, 547B‧‧‧ horizontal fins

1A is a side view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention.

1B is a top view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention.

2A is a side view of a light-emitting diode bulb with a heat dissipation structure according to a portion of the present invention, which includes a heat dissipation bracket.

2B is a top view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention, which includes a heat dissipation bracket.

2C is a side view of a light-emitting diode bulb with a heat dissipation structure according to a portion of the present invention, which includes a heat dissipation bracket.

2D is a top view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention, which includes a heat dissipation bracket.

3 is a side view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention, including an extension.

4A is a side view of a light-emitting diode bulb with a heat dissipation structure according to a portion of the present invention, including vertical fins.

4B is a top view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention, including vertical fins.

5A is a side view of a light-emitting diode bulb with a heat dissipation structure, including horizontal fins, in accordance with some embodiments of the present invention.

FIG. 5B is a top view of a light-emitting diode bulb with a heat dissipation structure according to a part of the present invention, which includes horizontal fins.

5C is a side view of a light-emitting diode bulb with a heat dissipation structure, including horizontal fins, in accordance with some embodiments of the present invention.

5D is a top view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention, including horizontal fins.

At least one embodiment of the present invention is a light emitting diode bulb having a heat dissipation structure. The light-emitting diode bulb with a heat dissipation structure may include a conventional light-emitting diode bulb and a heat-dissipating ring; wherein the heat-dissipating ring is externally applied to the base of the conventional light-emitting diode and attached to the base Take away the waste heat generated by the light-emitting diode chip. In a preferred embodiment, the light-emitting diode bulb is a light-emitting diode bean lamp.

At least one embodiment of the present invention is a light emitting diode bulb having a heat dissipation structure. The light-emitting diode bulb with a heat dissipation structure comprises a lamp cover, a base, a printed circuit board, a light-emitting diode and a heat-dissipating ring. The pedestal is connected to the lamp cover, and the pedestal and the lamp cover co-construct an internal space and the printed circuit board is disposed in the internal space. The light emitting diode is connected to the printed circuit board, and the activity of the light emitting diode is controlled by the printed circuit board. Finally, the heat ring is attached to the outside of the base.

1A and FIG. 1B are respectively a side view and a plan view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention. The light-emitting diode bulb having a heat dissipation structure includes a top cover 110 and a bottom base 120; wherein the cover 110 and the base 120 are combined to form a main structure of the light-emitting diode bulb having a heat dissipation structure, and the base 110 and the base 110 A total space is constructed between the seats 120. Printed electricity The road board 130 is disposed in the internal space, and the light emitting diode 131 is disposed thereon. In FIG. 1A, a collection of a lamp cover 110, a susceptor 120, a printed circuit board 130, and a light-emitting diode 131 is provided on the socket 150 via a connection between the susceptor 120 and the socket 150. When the susceptor 120 is coupled to the socket 150, the LED 201 can receive power from the socket 150 and be controlled by the printed circuit board 130. Further, the heat dissipation ring 140 is disposed outside the susceptor 120 and attached to the susceptor 120; more specifically, the heat dissipation ring 140 is attached to the outside of the block where the susceptor 120 is not used for connection with the socket 150. Therefore, the waste heat of the junction between the LEDs 131 and the printed circuit board 130 can be removed to the outer heat dissipation ring 140.

In some embodiments of FIG. 1A, the lampshade 110 is made of a highly light transmissive material, such as a translucent optical body of glass or plastic; in the preferred embodiment, the lampshade 110 is made of glass. The material of the susceptor 120 is a highly thermally conductive material, and is selected from the group consisting of ceramic, glass, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, and combinations thereof. The structure of the printed circuit board 130 is as in the conventional printed circuit board, and the metal core board is mainly used. The material of the heat dissipating ring 140 is a high thermal conductive material, such as a group consisting of free ceramics, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, iron, copper, aluminum, glass or a combination thereof; In a preferred embodiment, the material of the heat dissipating ring 140 is a highly thermally conductive metal such as copper or aluminum. The lamp holder 150 is structured as a conventional lamp holder, and the bottom end is provided with an electrical component that can be electrically connected to an external circuit. In addition, the material of the lamp holder 150 is a high thermal conductive material, and may be selected from the group consisting of ceramics, glass, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, and combinations thereof; In the example, the base of the socket 150 is ceramic. The susceptor 120 and the heat-dissipating ring 140 are evenly coated with a high thermal conductive paste, and the two are connected together.

2A and 2B are side and top views of a light-emitting diode bulb having a heat dissipation structure according to some embodiments of the present invention. The light-emitting diode bulb having the heat dissipation structure in the embodiment of FIGS. 2A and 2B has a similar structure and material to the embodiment of FIGS. 1A and 1B; in the embodiment of FIGS. 2A and 21B, the heat dissipation is provided. The light-emitting diode bulb of the structure comprises a lamp cover 210, a base 220, a printed circuit board 230, a light-emitting diode 231 and a heat-dissipating ring 240. The pedestal 220 is connected to the lamp cover 210, and an internal space is formed by the pedestal 220 and the lamp cover 210, and the printed circuit board 230 is disposed in the internal space. The light emitting diode 231 is connected to the printed circuit board 230 and controlled by the printed circuit board 231. Finally, the heat dissipation ring 240 is attached to the outside of the base 220.

However, in FIGS. 2A and 2B, the light-emitting diode bulb having a heat dissipation structure further includes a heat dissipation bracket 241A. The material of the heat dissipation bracket 241A is a high thermal conductive material, such as a group of optional free ceramics, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, iron, copper, aluminum, glass or a combination thereof; In a preferred embodiment, the material of the heat dissipation bracket 241A is a highly thermally conductive metal such as copper or aluminum. One end of the heat dissipation bracket 241A extends to the outside of the base 220 and is coupled to the heat dissipation ring 240, and the other end penetrates into the internal space to be coupled with the metal core of the printed circuit board 230; therefore, the light emitting diode 231 is connected to the printed circuit board 230. The waste heat can be removed along the heat dissipation ring 240 that is transmitted to the outer side along the heat dissipation bracket 241A. In the embodiment of FIGS. 2A and 2B, the heat dissipating bracket 241A is disposed closer to the pedestal 220 than the illuminating diode 231 to avoid obscuring the path of the light emitted by the illuminating diode 231 toward the hood 210.

2C and 2D are side and top views of a light-emitting diode bulb having a heat dissipation structure according to some embodiments of the present invention. The light-emitting diode bulb with heat dissipation structure in FIGS. 2C and 2D has similar structure and material to the embodiment of FIGS. 2C and 2D; in the embodiment of FIGS. 2C and 2D, the light-emitting diode bulb with heat dissipation structure includes The lamp cover 210, the susceptor 220, the printed circuit board 230, the light-emitting diode 231, and the heat-dissipating ring 240. The pedestal 220 is connected to the lamp cover 210, and an internal space is formed by the pedestal 220 and the lamp cover 210, and the printed circuit board 230 is disposed in the internal space. The light emitting diode 231 is connected to the printed circuit board 230 and controlled by the printed circuit board 230. Finally, the heat ring 240 Then, it is attached to the outside of the base 220.

However, in FIGS. 2C and 2D, the light-emitting diode bulb having a heat dissipation structure further includes a heat dissipation bracket 241B. The material of the heat dissipating bracket 241B is also a high thermal conductive material, such as a group of optional free ceramics, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, iron, copper, aluminum, glass or a combination thereof. In a preferred embodiment, the material of the heat dissipation bracket 241B is a highly thermally conductive metal such as copper or aluminum. One end of the heat dissipation bracket 241B extends to the outside of the base 220 and is coupled to the heat dissipation ring 240, and the other end penetrates into the internal space to be coupled with the metal core of the printed circuit board 230; therefore, the light emitting diode 231 is connected to the printed circuit board 230. The waste heat can be removed along the heat dissipation ring 240 that is transmitted to the outer side along the heat dissipation bracket 241B. In the embodiment of FIGS. 2C and 2D, the heat dissipation bracket 241B is circumferentially disposed along the circumference of the side of the printed circuit board 230 to avoid shielding the light emitted from the LED 231 from being emitted toward the lamp cover 210, and simultaneously lifting the heat dissipation bracket 241B and The contact area of the printed circuit board 230.

3 is a side view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention. The light-emitting diode bulb having the heat dissipation structure in the embodiment of FIG. 3 has a similar structure and material as the embodiment of FIGS. 1A and 1B; in the embodiment of FIG. 3, the light-emitting diode bulb having the heat dissipation structure includes the lamp cover 310 and the base. The holder 320, the printed circuit board 330, the light emitting diode 331 and the heat dissipation ring 340. The pedestal 320 is connected to the lamp cover 310, and an internal space is formed by the pedestal 320 and the lamp cover 310, and the printed circuit board 330 is disposed in the internal space. The light emitting diode 331 is connected to the printed circuit board 330 and controlled by the printed circuit board 330. Finally, the heat dissipation ring 340 is attached to the outside of the base 320.

In FIG. 3, however, the light-emitting diode bulb having a heat dissipation structure further includes an extension 343. The material of the extension 343 is a highly thermally conductive material, such as a group of optional free ceramics, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, iron, copper, aluminum, glass, or combinations thereof; In the preferred embodiment, the extension 343 extends partially or entirely of the heat ring 340. Delay One end of the long section 343 is connected to the heat dissipation ring 340, and the other end is connected to the socket 350. Therefore, the waste heat of the junction between the LED 331 and the printed circuit board 330 can be removed through the heat dissipation ring 340, and the extension 343 can be further The waste tropical to lamp holder 350 is removed through the lamp holder 350.

4A and 4B are a top view and a side view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention. The light-emitting diode bulb with heat dissipation structure in the embodiment of FIG. 4A and FIG. 4B has similar structure and material to the embodiment of FIGS. 1A and 1B; in the embodiment of FIG. 4A and FIG. 4B, the light-emitting diode with heat dissipation structure The light bulb includes a lamp cover 410, a base 420, a printed circuit board 430, a light emitting diode 431, and a heat dissipation ring 440. The pedestal 420 is connected to the lamp cover 410, and an internal space is formed by the pedestal 420 and the lamp cover 410, and the printed circuit board 430 is disposed in the internal space. The light emitting diode 431 is connected to the printed circuit board 430 and controlled by the printed circuit board 430. Finally, the heat dissipation ring 440 is attached to the outside of the base 420.

However, in FIGS. 4A and 4B, the light emitting diode bulb having a heat dissipation structure further includes vertical fins 445. The material of the vertical fins 445 is a highly thermally conductive material, such as a group of optional free ceramics, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, iron, copper, aluminum, glass or a combination thereof. In a preferred embodiment, the vertical fins 445 are made of a highly thermally conductive metal, such as copper or aluminum; in a more preferred embodiment, the vertical fins 445 are extensions of the heat dissipating ring 440. One end of the vertical fin 445 is coupled to the heat dissipation ring 440, and the other end extends outward to expand the heat dissipation area. Therefore, the waste heat of the junction between the LED 431 and the printed circuit board 430 can be removed through the heat dissipation ring 440, and the waste tropical to vertical fins 445 can be further removed through the vertical fins 445.

5A and FIG. 5B are a top view and a side view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention. The light-emitting diode bulb having the heat dissipation structure in the embodiment of FIGS. 5A and 5B has a similar structure and material to the embodiment of FIGS. 4A and 4B; in the embodiment of FIGS. 5A and 5B, The light-emitting diode bulb having a heat dissipation structure includes a lamp cover 510, a base 520, a printed circuit board 530, a light-emitting diode 531, and a heat-dissipating ring 540. The pedestal 520 is connected to the lamp cover 510, and an internal space is formed by the pedestal 520 and the lamp cover 510, and the printed circuit board 530 is disposed in the internal space. The light emitting diode 531 is connected to the printed circuit board 530 and controlled by the printed circuit board 530. Finally, the heat dissipation ring 540 is attached to the outside of the base 520.

However, in FIGS. 5A and 5B, the light-emitting diode bulb having a heat dissipation structure further includes horizontal fins 547. The material of the horizontal fin 547 is a highly thermally conductive material such as a group of optional free ceramics, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, iron, copper, aluminum, glass or a combination thereof. In a preferred embodiment, the material of the horizontal fins 547 is a highly thermally conductive metal, such as copper or aluminum; in a more preferred embodiment, the horizontal fins 547 are extensions of the heat dissipating ring 540. One end of the horizontal fin 547 is coupled to the heat dissipation ring 540, and the other end extends outward to expand the heat dissipation area. Therefore, the waste heat of the junction of the LED 531 and the printed circuit board 530 can be removed through the heat dissipation ring 540, and the waste tropical to horizontal fins 547 can be further removed through the horizontal fins 547.

5C and FIG. 5D are a top view and a side view of a light-emitting diode bulb with a heat dissipation structure according to some embodiments of the present invention. The light-emitting diode bulb with heat dissipation structure in the embodiment of FIG. 5C and FIG. 5D has similar structure and material to the embodiment of FIGS. 5A and 5B; in the embodiment of FIG. 5C and FIG. 5D, the light-emitting diode with heat dissipation structure The light bulb includes a lamp cover 510, a base 520, a printed circuit board 530, a light emitting diode 531, and a heat dissipation ring 540. The pedestal 520 is connected to the lamp cover 510, and an internal space is formed by the pedestal 520 and the lamp cover 510, and the printed circuit board 530 is disposed in the internal space. The light emitting diode 531 is connected to the printed circuit board 530 and controlled by the printed circuit board 530. Finally, the heat dissipation ring 540 is attached to the outside of the base 520.

However, in FIG. 5C and FIG. 5D, the light-emitting diode bulb with the heat dissipation structure is further integrated. The step includes horizontal fins 547A and horizontal fins 547B. The material of the horizontal fin 547A and the horizontal fin 547B is a high thermal conductive material, such as optional free ceramic, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, iron, copper, aluminum, glass or A group of combinations; in a preferred embodiment, the material of the horizontal fins 547A and the horizontal fins 547B is a highly thermally conductive metal, such as copper or aluminum; in a more preferred embodiment, the horizontal fins 547A and the horizontal fins Sheet 547B is an extension of heat sink ring 540. One end of the horizontal fin 547A and the horizontal fin 547B is coupled to the heat dissipation ring 540, and the horizontal fin 547A and the horizontal fin 547B have different heights. Therefore, the waste heat of the surface of the light-emitting diode 531 and the printed circuit board 530 can be removed through the heat-dissipating ring 540, and the waste tropical to horizontal fins 547A and the horizontal fins 547B can be further excluded.

The variations between the above embodiments can be arbitrarily combined and modified in geometric shape, quantity and material. Modifications in combination, for example, in some embodiments, the heat dissipation bracket 241A in the embodiment of FIG. 2A can be used together with the extension section 343 of FIG. 3; and in some embodiments, the heat dissipation bracket 241A in the embodiment of FIG. 2A can be used. Used in conjunction with the vertical fins 445 of Figure 4A. Modifications in geometric shape, for example, in some embodiments, the vertical fins 445 in the embodiment of Figure 4A can be modified to the geometry of the petals or blades, thereby creating an effect of blending into the surrounding environment; and in some embodiments, The horizontal fins 547 in the 5A embodiment are warped upward in an arc shape during the outward extension, thereby producing the effect of the concave lens focusing the light beam. Modifications in quantity, for example, in some embodiments, the vertical fins 445 in the embodiment of FIG. 4A can be increased in number to increase the fin density, thereby increasing the heat dissipation area to enhance the heat dissipation effect; and in some embodiments, FIG. 5C In addition to the horizontal fins 547A at the first horizontal plane and the horizontal fins 547B at the second horizontal plane, the third horizontal plane and other planar fins may be added in the embodiment. The modification of the material is, for example, in some embodiments, the vertical fin 445 in the embodiment of FIG. 4A can be changed to glass, and the light transmission property can enhance the optical of the LED bulb. Performance; while in some embodiments, the horizontal fins 547 of the FIG. 5A embodiment can be altered to a highly thermally conductive metal having a surface that is polished to enhance the concentrated reflective performance of the horizontal fins 547.

An embodiment of the present invention is a light-emitting diode bulb having an aesthetic design and having a heat dissipation structure after modifying the structure of FIG. 1A. The modification is incorporated in the light-emitting diode bulb of FIG. 1A with a heat dissipation structure, with the heat dissipation bracket 241A of FIG. 2A, the extension 343 of FIG. 3, and the horizontal fins 547A, 547B of FIG. 5C. Among them, the two horizontal fins 547A, 547B are made of transparent glass, and each layer contains five petal fins. In the light-emitting diode bulb with the heat dissipation structure of the embodiment, the heat dissipation structure can carry the waste heat from the base of the light-emitting diode bulb to the outside, and the horizontal fins can improve the light-emitting property of the transparent glass. The effect of the optical performance of the diode, and the appearance of the light-emitting diode due to the petal-like geometric shape. This embodiment uses a special geometry heat dissipation structure to improve the stiffness and the appearance of the conventional LED in the process of improving the heat dissipation performance, and to improve the overall design and aesthetics of the LED bulb.

An embodiment of the present invention is another light-emitting diode bulb having a heat dissipation structure which is obtained by modifying the structure of FIG. 1A. The modification is incorporated in the light-emitting diode bulb of the heat dissipation structure of FIG. 1A, the heat-dissipating bracket 241A of FIG. 2A, the extension 343 of FIG. 3, the horizontal fin 547 of FIG. 5A, and the horizontal fins 547A and 547B of FIG. 5C. . The materials of the horizontal fins 547, 547A and 547B may be high thermal conductivity non-metal materials such as graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide and the like. In order to enhance its optical properties such as concentrating or reflectivity, the aforementioned high thermal conductivity non-metallic outer surface may be plated with a high reflectivity metal coating such as copper, iron, silver, chromium, titanium or aluminum. In the light-emitting diode bulb with a heat dissipation structure in this embodiment, the horizontal fins have high heat dissipation performance due to these non-metal materials having high thermal conductivity, and the horizontal fins are changed due to the high reflectivity metal coating on the outer surface thereof. Optical properties allow it to be concentrated Or a reflection effect. This embodiment uses a composite material to improve the optical performance of the light-emitting diode during the process of improving heat dissipation.

The following table is a temperature result tested in accordance with some embodiments of the present invention to present the heat dissipation effect of the embodiment. The temperatures listed in the table are in degrees Celsius (°C); where X represents a conventional light-emitting diode lamp with no heat dissipation structure, and the measured temperature is 126.53 °C. In the table, A to E and Y to Z respectively represent components used in the light-emitting diode lamp bubble; A represents a heat-dissipating ring, B represents a heat-dissipating ring and a vertical fin, C represents a heat-dissipating ring and a layer of steel horizontal fins, D Represents a heat sink ring with a layer of aluminum horizontal fins, E for a heat sink ring and a layer of glass horizontal fins, X for no extension, and Y for extensions.

The following table is a temperature result tested for some of the examples of the present invention, which is a subsequent portion of the test results in the above table. In the table, F to J represent the components used in the light-emitting diode lamp bubble; F represents the heat-dissipating ring and a layer of three-piece horizontal fins, G represents the heat-dissipating ring and a layer of four-piece horizontal fins, and H represents the heat-dissipating ring and the layer. Five-piece horizontal fins, I for the heat-dissipation ring and a layer of horizontal fins, J for the heat-dissipation ring and two horizontal fins.

The above embodiments are merely illustrative of the technical idea and the features of the present invention, and are intended to enable those skilled in the art to fully understand the contents of the present invention and It is intended that the scope of the invention is to be construed as being limited by the scope of the invention.

110‧‧‧shade

120‧‧‧Base

130‧‧‧Printed circuit board

131‧‧‧Lighting diode

140‧‧‧heating ring

150‧‧‧ lamp holder

Claims (9)

A light-emitting diode bulb having a heat dissipation structure, comprising: a lamp cover; a base connected to the lamp cover; and the lamp cover and the base form an internal space; a printed circuit board disposed in the inner space At least one light-emitting diode connected to the printed circuit board, wherein the at least one light-emitting diode is controlled by the printed circuit board; a heat-dissipating ring attached to the outside of the base; and a heat-dissipating bracket One end extends to the outside of the base and is coupled to the heat dissipation ring, and the other end penetrates into the internal space to be coupled to the printed circuit board. The light-emitting diode bulb with a heat dissipation structure according to claim 1, comprising: a plurality of fins disposed outside the heat dissipation ring. The light-emitting diode bulb with a heat dissipation structure according to claim 2, wherein the material of the plurality of fins is a high thermal conductive material. The light-emitting diode bulb having a heat dissipation structure according to claim 3, wherein the high thermal conductive material is selected from the group consisting of ceramics, graphite, aluminum nitride, aluminum oxide, gallium nitride, gallium oxide, tantalum carbide, iron, copper, A group of aluminum, glass, or a combination thereof. The light-emitting diode bulb with a heat dissipation structure according to claim 3, wherein the plurality of fins are a plurality of vertical fins. The light-emitting diode bulb having a heat dissipation structure according to claim 3, wherein the plurality of fins are a plurality of horizontal fins. The light-emitting diode bulb with a heat dissipation structure according to claim 6, wherein the plurality of horizontal fins are arranged on a first plane and a second plane. The light-emitting diode bulb with a heat dissipation structure according to claim 1, wherein the heat dissipation bracket is circumferentially disposed along a circumference of a side of the printed circuit board. The light-emitting diode bulb with a heat dissipation structure according to claim 1, wherein the base is combined with a socket, and the LED bulb comprises: an extension section connecting the heat dissipation ring and the lamp holder.