TWI603102B - Electronic parts conveying apparatus and electronic parts inspection apparatus - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

In the prior art, for example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) device is known, and the electronic component inspection device is assembled to transport the IC device to the inspection portion. Electronic parts transfer device up to the socket. When inspecting the IC device, the IC device is placed in the socket, and the IC device is positioned relative to the socket, so that a plurality of probe pins (electrodes) disposed at the socket are in contact with the terminals of the IC device.

Further, Patent Document 1 discloses that the electronic component inspection device has a pair of terminals, and when the electronic component is inspected, one terminal is brought into contact with the front surface of the electronic component terminal of the electronic component, and the other terminal is brought into contact with the back surface. .

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-30151

However, in the electronic component inspection apparatus described in Patent Document 1, when the electronic component inspection device and the electronic component are electrically connected when the electronic component is inspected, one terminal and one front side are respectively provided in one electronic component terminal. And the back contact, so the total contact area of the terminal in contact with the terminal of one electronic component is small, and the part in contact with the terminal of the electronic component is The total area is small. Therefore, there is a problem that the resistance becomes large and the flow of a large current cannot be checked.

Further, in the electronic component inspection device described in Patent Document 1, it is difficult to bring a plurality of terminals into contact with the front and back surfaces of one electronic component terminal.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus that can flow a large current to an electronic component held in a holding portion by a simple configuration.

The present invention has been made in order to solve at least a part of the above problems, and can be realized in the following aspects or application examples.

[Application Example 1]

An electronic component transporting apparatus according to the present invention includes: a gripping portion that grips an electronic component; and a holding portion that holds the electronic component; and the gripping portion includes a first component of an electronic component that is in contact with the electronic component In the first terminal portion of the portion, the holding portion includes a second terminal portion that is in contact with a second portion of the electronic component terminal of the electronic component that is different from the first portion, and the first terminal portion and the second terminal portion At least one of the plurality of terminals includes a plurality of terminals.

With this configuration, at least one of the first terminal portion and the second terminal portion can increase the total cross-sectional area of the terminal by a simple configuration, and the total area of the portion in contact with the electronic component terminal can be increased. The electric resistance can be made small, and a large current can flow in the electronic component held by the holding portion. Thereby, the flow of the large current can be checked for the electronic component held in the holding portion.

[Application Example 2]

In the electronic component conveying device of the present invention, preferably, the grasping portion is grasped. In the case where the electronic component is held by the holding portion, the first terminal portion and the second terminal portion are in contact with the electronic component terminal.

Thereby, in the state where the grip portion grips the electronic component, the holding portion holds the electronic component, whereby a large current can flow in the electronic component.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, preferably, the first terminal portion has a first elastic member that biases the terminal of the first terminal portion, and at least a part of the terminal of the first terminal portion is biased toward The terminal of the first terminal portion is displaced in a direction opposite to the direction, and the second terminal portion has a second elastic member that biases the terminal of the second terminal portion, and at least a part of the terminal of the second terminal portion faces The direction in which the terminals of the second terminal portion are biased in the opposite direction is displaced.

Thereby, a plurality of terminals can be easily brought into contact with the electronic component terminals.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, preferably, the grip portion has a third terminal portion that is electrically connected to the first terminal portion, and the holding portion has a fourth terminal portion, and the first terminal portion and the second terminal portion When the terminal portion is in contact with the electronic component terminal, the third terminal portion is in contact with the fourth terminal portion.

As a result, the movable range of the grip portion is enlarged as compared with the case where the third terminal portion and the fourth terminal portion are electrically connected in advance by wiring or the like, and the wiring is less likely to be broken, and the device can be prevented from being complicated.

[Application 5]

In the electronic component conveying apparatus of the present invention, it is preferable that at least one of the third terminal portion and the fourth terminal portion includes a plurality of terminals.

Thereby, the contact area between the third terminal portion and the fourth terminal portion can be increased, whereby the electric resistance can be reduced, and a large current can flow in the electronic component held by the holding portion.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, it is preferable that the second terminal portion and the fourth terminal portion are electrically connected.

Thereby, the wiring can be simplified.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, preferably, the gripping portion includes: a grip portion main body that grips the electronic component; and a housing that is provided with the first terminal portion and that is opposite to the grip portion body Unloading freely.

Thereby, the first terminal portion can be covered by the casing, and the first terminal portion can be protected. Moreover, since the casing is detachable, the repair, inspection, or replacement of the components can be easily and quickly performed.

[Application Example 8]

In the electronic component conveying apparatus of the present invention, preferably, the grip portion has a first recess that positions the electronic component at a specific position of the grip portion, and the retaining portion has the electronic component positioned at the holding portion The second recess of the specific position.

Thereby, the electronic component can be easily and quickly positioned at a specific position of the grip portion and a specific position of the holding portion.

[Application Example 9]

In the electronic component conveying apparatus of the present invention, it is preferable that the number of the terminals of the first terminal portion is smaller than the number of the terminals of the second terminal portion.

Since the wiring of the first terminal portion is longer than the wiring of the second terminal portion, the electric resistance can be made smaller, and a large current can flow in the electronic component held by the holding portion.

[Application Example 10]

In the electronic component conveying apparatus of the present invention, it is preferable that the terminal of the first terminal portion and the terminal of the second terminal portion face each other when the terminal is in contact with the electronic component terminal.

By this, it is possible to prevent the force applied from the terminal of the first terminal portion and the terminal of the second terminal portion to the electronic component terminal in a state where the terminal of the first terminal portion and the terminal of the second terminal portion are in contact with the electronic component terminal. dispersion. Thereby, it is possible to suppress contact failure between the electronic component terminal and the terminal of the first terminal portion and the terminal of the second terminal portion.

[Application Example 11]

In the electronic component conveying apparatus of the present invention, it is preferable that the terminal of the first terminal portion and the terminal of the second terminal portion do not oppose each other when the terminal is in contact with the electronic component terminal.

Thereby, the electronic component terminal is slightly bent in a state in which the terminal of the first terminal portion and the terminal of the second terminal portion are in contact with the electronic component terminal, and the terminal of the electronic component terminal and the first terminal portion and the second terminal portion are slightly bent. The contact area of the terminal is increased to make the resistance small.

[Application Example 12]

In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component has a main body portion, and the electronic component terminal protrudes toward the outer side of the main body portion.

Thereby, the first terminal portion and the second terminal portion can be easily brought into contact with the electronic component terminal.

[Application Example 13]

An electronic component inspection device according to the present invention includes: a grip portion that grips an electronic component; a holding portion that holds the electronic component; and an inspection portion that inspects the electronic component; the grip portion is provided to abut The first part of the electronic component terminal of the electronic component In the first terminal portion, the holding portion includes a second terminal portion that is in contact with a second portion of the electronic component terminal of the electronic component that is different from the first portion, and the first terminal portion and the second terminal portion are at least One includes a plurality of terminals.

With this configuration, at least one of the first terminal portion and the second terminal portion can increase the total cross-sectional area of the terminal by a simple configuration, and the total area of the portion in contact with the electronic component terminal can be increased. The electric resistance can be made small, and a large current can flow in the electronic component held by the holding portion. Thereby, the flow of the large current can be checked for the electronic component held in the holding portion.

1‧‧‧Checking device

2‧‧‧Supply Department

3‧‧‧Supply side alignment

4‧‧‧Transportation Department

5‧‧‧Inspection Department

6‧‧‧Recycling side alignment

7‧‧Recycling Department

8‧‧‧Control Department

9‧‧‧IC devices

10‧‧‧Transporting device

11‧‧‧Base

12‧‧‧ 盖部

13‧‧‧Upper base

14‧‧‧Upper casing

15‧‧‧ Adapters

16‧‧‧ Lower housing

17‧‧‧Relay substrate

18‧‧‧Relay substrate

21‧‧‧1st terminal part

22‧‧‧ Probe pin

23‧‧‧2nd terminal section

24‧‧‧ probe pin

25‧‧‧4th Terminal

26‧‧‧ probe pin

27‧‧‧ probe pin

41‧‧‧Transport shuttle

42‧‧‧Supply robot

43‧‧‧Check the robot

44‧‧‧Recycling robot

51‧‧‧Check socket

91‧‧‧ Body Department

92‧‧‧ terminals

111‧‧‧ base surface

131‧‧‧ wall

132‧‧‧ recess

133‧‧‧Protruding

161‧‧‧ wall

162‧‧‧ recess

163‧‧‧ Highlights

171‧‧‧Conductor

172‧‧‧3rd terminal section

173‧‧‧Apartment

174‧‧‧Connecting Department

175‧‧‧ terminals

181‧‧‧ terminals

191‧‧‧ wiring

192‧‧‧ wiring

193‧‧‧ wiring

201‧‧‧ Circuitry

202‧‧‧ Circuitry

203‧‧‧ Circuitry

220‧‧‧From the script body

221‧‧‧1st component

222‧‧‧ second component

223‧‧‧3rd building block

341‧‧‧mounting table

411‧‧‧ Bag Department

421‧‧‧Support framework

422‧‧‧Mobile framework

423‧‧‧Hand unit

431‧‧‧Support framework

432‧‧‧Mobile framework

433‧‧‧Hand unit

434‧‧‧Adsorption nozzle

441‧‧‧Support framework

442‧‧‧Mobile framework

443‧‧‧Hand unit

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1;

Fig. 3 is a perspective view showing a hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1 and an inspection socket of the inspection unit.

Fig. 4 is a perspective view showing a hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1 and an inspection socket of the inspection unit.

Fig. 5 is a perspective view showing a hand unit of a conveying unit of the electronic component inspection device shown in Fig. 1;

Fig. 6 is a perspective view showing an inspection socket of an inspection unit of the electronic component inspection device shown in Fig. 1;

Fig. 7 is a cross-sectional view schematically showing the hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1 and the inspection socket of the inspection unit.

Fig. 8 is a cross-sectional view schematically showing a hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1 and an inspection socket of the inspection unit.

Fig. 9 is a cross-sectional view showing the hand unit of the transport unit and the inspection socket of the inspection unit of the electronic component inspection device shown in Fig. 1;

Fig. 10 is a cross-sectional view showing a hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1 and an inspection socket of the inspection unit.

Fig. 11 is a perspective view showing a hand unit of a conveying unit of the electronic component inspection device shown in Fig. 1;

Fig. 12 is a perspective view showing a relay substrate of a hand unit of a conveying unit of the electronic component inspection device shown in Fig. 1;

Fig. 13 is a view schematically showing a first terminal portion and a second terminal portion of the electronic component inspection device shown in Fig. 1;

FIG. 14 is a circuit diagram showing the first terminal portion, the second terminal portion, the third terminal portion, the fourth terminal portion, the wiring, and the like of the electronic component inspection device shown in FIG. 1 .

FIG. 15 is a view schematically showing a first terminal portion and a second terminal portion in the second embodiment of the electronic component inspection device according to the present invention.

FIG. 16 is a circuit diagram showing a first terminal portion, a second terminal portion, a third terminal portion, a fourth terminal portion, wiring, and the like in the third embodiment of the electronic component inspection device according to the present invention.

FIG. 17 is a cross-sectional view schematically showing the hand unit of the transport unit and the inspection socket of the inspection unit in the fourth embodiment of the electronic component inspection device according to the present invention.

FIG. 18 is a cross-sectional view schematically showing the hand unit of the transport unit and the inspection socket of the inspection unit in the fourth embodiment of the electronic component inspection device according to the present invention.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.

<First embodiment>

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1; 3 and 4 are perspective views showing the hand unit of the conveying unit and the inspection socket of the inspection unit of the electronic component inspection device shown in Fig. 1 . Fig. 5 is a perspective view showing a hand unit of a conveying unit of the electronic component inspection device shown in Fig. 1; Fig. 6 is a perspective view showing an inspection socket of an inspection unit of the electronic component inspection device shown in Fig. 1; 7 and 8 are cross-sectional views schematically showing the hand unit of the transport unit and the inspection socket of the inspection unit of the electronic component inspection device shown in Fig. 1 . 9 and 10 are cross-sectional views showing the hand unit of the transport unit and the inspection socket of the inspection unit of the electronic component inspection device shown in Fig. 1 . Fig. 11 is a perspective view showing a hand unit of a conveying unit of the electronic component inspection device shown in Fig. 1; Fig. 12 is a perspective view showing a relay substrate of a hand unit of a conveying unit of the electronic component inspection device shown in Fig. 1; Fig. 13 is a view schematically showing a first terminal portion and a second terminal portion of the electronic component inspection device shown in Fig. 1; FIG. 14 is a circuit diagram showing the first terminal portion, the second terminal portion, the third terminal portion, the fourth terminal portion, the wiring, and the like of the electronic component inspection device shown in FIG. 1 .

In the following, for the sake of convenience, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is referred to as "X direction", the direction parallel to the Y axis is referred to as "Y direction", and the direction parallel to the Z axis is referred to as "Z direction". In addition, the upstream side of the transport direction of the electronic component is simply referred to as "upstream side", and the downstream side of the transport direction of the electronic component is simply referred to as "downstream side". Moreover, the "level" mentioned in the specification of the present invention is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.

Further, the upper side in FIGS. 3 to 11 and 13 is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower" (the same as in the other embodiments).

In addition, in FIG. 7 and FIG. 8, only one of the probe pins of the first terminal portion is shown, and the conductor portion of the relay substrate or the like is omitted (the same applies to the other embodiments) .

In addition, in FIG. 3 to FIG. 11 , four inspection sockets and a transportation unit of the inspection unit are respectively illustrated. One of the four hand units (the same is true for the other embodiments).

In addition, in FIG. 14, each of the four inspection sockets and one of the four hand units of the transport unit are shown, and the wiring related to one terminal of the IC device 9 is shown (other embodiments) The map is also the same).

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used for, for example, an IC device, an LCD (Liquid Crystal Display), a CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, and a complementary CMOS image. A device that inspects and tests (hereinafter referred to as "inspection") the electrical characteristics of electronic components such as the detector. In the following, for convenience of explanation, a description will be given of a case where an IC device is used as the electronic component to be inspected, and the IC device is referred to as "IC device 9". In the following, an IC (System In Package) will be described as an example of the IC device 9.

First, the IC device 9 will be described.

As shown in FIG. 3, the IC device 9 is a SIP, and has a main body portion 91 and a plurality of terminals (electronic component terminals) 92 provided outside the main body portion 91. The shape of the main body portion 91 is not particularly limited. However, in the present embodiment, the shape is formed in a plate shape, and the thickness is in the Z direction from the state in which the IC device 9 is held in the inspection socket 51 (in the case where the IC device 9 is held). It forms a quadrilateral. Furthermore, in the present embodiment, the quadrilateral is a square or a rectangle. Further, the number of the terminals 92 is not particularly limited, but is six in the present embodiment. The terminals 92 are formed in a rod shape and protrude from one of the four sides of the body portion 91 toward the outer side of the body portion 91. That is, each terminal 92 protrudes from the main body portion 91 in one direction.

Next, the inspection apparatus 1 will be described.

As shown in FIG. 1, the inspection apparatus 1 is equipped with the conveyance apparatus (electronic component conveyance apparatus) 10. That is, the inspection apparatus 1 includes the supply unit 2, the supply side array unit 3, the transport unit 4, the inspection unit 5, the collection side array unit 6, the collection unit 7, and the control unit 8 that controls the respective units. Further, the inspection apparatus 1 includes a susceptor 11 for arranging the supply unit 2, the supply side arranging unit 3, and transporting The portion 4, the inspection portion 5, the collection-side arranging portion 6 and the collection portion 7, and the lid portion 12 are covered on the susceptor so as to accommodate the supply-side arranging portion 3, the conveying portion 4, the inspection portion 5, and the collection-side arranging portion 6. 11. Further, the upper surface of the susceptor 11, that is, the pedestal surface 111 is substantially horizontal, and the constituting members of the supply side arranging portion 3, the conveying portion 4, the inspection portion 5, and the recovery side arranging portion 6 are disposed on the base surface 111. Further, in addition, the inspection apparatus 1 may have a heater or a chamber or the like for heating the IC device 9 as needed.

The inspection apparatus 1 is configured such that the supply unit 2 supplies the IC device 9 to the supply side array unit 3, the supply side array unit 3 arranges the supplied IC devices 9, and the transport unit 4 arranges the ICs. The device 9 is transported to the inspection unit 5, and the inspection unit 5 inspects the transported IC device 9. The transport unit 4 transports/arranges the IC device 9 that has been inspected to the recovery side array unit 6, and the collection unit 7 collects and collects the array side on the recovery side. 6 IC device 9. According to such an inspection apparatus 1, the supply, inspection, and recovery of the IC device 9 can be automatically performed. In the inspection apparatus 1, the transport apparatus (electronic component transport apparatus) 10 includes a supply unit 2, a supply side array unit 3, a transport unit 4, an inspection unit 5, a recovery side array unit 6, a recovery unit 7, and control. Department 8 and so on. The transport device 10 performs transport of the IC device 9 and the like.

Hereinafter, the conveyance unit 4, the inspection unit 5, and the control unit 8 will be described based on FIGS. 2 to 14 .

Control Department

The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs inspection of electrical characteristics of the IC device 9 disposed in the inspection unit 5, for example, based on a program stored in a memory (not shown). Moreover, the drive control unit controls the driving of each of the supply unit 2, the supply-side arranging unit 3, the transport unit 4, the collection-side arranging unit 6, and the recovery unit 7, and carries out the transport of the IC device 9.

"Transport Department"

As shown in FIG. 2, the transport unit 4 is a unit that transports the IC device 9 disposed on the mounting table 341 of the supply-side arranging unit 3 to the inspection unit 5, and the inspection is completed. The IC device 9 inspected by the unit 5 is transported to the recovery side array unit 6. The transport unit 4 includes a transport shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.

- Handling shuttle -

The transport shuttle 41 is a transport shuttle for transporting the IC device 9 on the mounting table 341 to the vicinity of the inspection unit 5, and further transports the IC device 9 that has been inspected by the inspection unit 5 to the inspection. The vicinity of the collection side alignment portion 6 is collected. In the transport shuttle 41, four pocket portions 411 for accommodating the IC device 9 are formed in parallel in the X direction. Further, the transport shuttle 41 is guided by the linear motion guide, and is reciprocally movable in the X direction by a drive source such as a linear motor.

-Supply robots -

The supply robot 42 transports the IC device 9 disposed on the mounting table 341 to the robot of the transport shuttle 41. Such a supply robot 42 has a support frame 421 supported by the base 11 and a moving frame 422 supported by the support frame 421 and reciprocally movable in the Y direction with respect to the support frame 421; and 4 hand units ( The gripping robot 423, which is supported by the moving frame 422. Each of the hand units 423 includes an elevating mechanism and an adsorption nozzle, and the IC device 9 can be gripped by suction.

- Check the robot -

The inspection robot 43 transports the IC device 9 housed in the transport shuttle 41 to the inspection unit 5, and transports the IC device 9 that has finished the inspection from the inspection unit 5 to the transport shuttle 41. Further, the inspection robot 43 can also apply a specific inspection pressure to the IC device 9 by pressing the IC device 9 against the inspection portion 5 at the time of inspection. Such an inspection robot 43 has a support frame 431 supported by the base 11 and a moving frame 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431; and 4 hand units ( A gripping robot) (grip) 433, which is supported by the moving frame 432.

Each of the hand units 433 includes an elevating mechanism and an adsorption nozzle 434 (see FIG. 5), and the IC device 9 can be grasped (held) by adsorption. Furthermore, the so-called grip is, for example, a suction containing the IC device 9. The concept of attaching and holding the IC device 9, clamping the IC device 9, and the like. Each of the hand units 433 is the same, and therefore one of them will be described below.

As shown in FIGS. 3 to 5, the hand unit 433 has a base (grip body) 13 and an upper casing (housing) 14 which are gripped by the upper surface of the IC device 9 by suction, and are detachably coupled to the mobile unit. Frame 432.

Further, as shown in FIGS. 5 and 11, the upper casing 14 is detachably attached to the upper base 13. The method of attaching the upper casing 14 to the upper base 13 is not particularly limited, and can be performed, for example, by screwing or fitting. Since the upper casing 14 is detachably attached to the upper base 13, the repair, inspection, or replacement of the components of the hand unit 433 can be easily and quickly performed. Further, the upper casing 14 may not be detached from the upper base 13, or the upper casing 14 may be integrated with the upper base 13.

Further, a pair of wall portions (first wall portions) 131 are formed at a lower portion of the upper base 13. Further, in a state in which the upper casing 14 is attached to the upper base 13, a recess (first recess) 132 into which the main body portion 91 of the IC device 9 is inserted is formed by the upper casing 14 and the pair of wall portions 131. That is, the body portion 91 of the IC device 9 abuts and is positioned on the inner surface (wall portion 131) of the recess 132. Further, in the present embodiment, the concave portion 132 is formed in a quadrangular shape, and is opened on one side, that is, on the right side in Fig. 5 . Further, the first concave portion is not limited to being formed of one member, and as described above, it may be formed by, for example, being surrounded by a wall portion or a convex portion. Further, it is not limited to the case of being surrounded over the entire circumference, and as described above, it also includes a case where a part is opened.

Further, a through hole is formed in the upper base 13, and an adsorption nozzle 434 is inserted and fixed to the through hole. Further, the opening of the adsorption nozzle 434 is opened at the bottom surface of the concave portion 132. A pipe body connected to a suction pump (not shown) is connected to an upper end portion of the adsorption nozzle 434, and the IC device 9 is sucked by the operation of the suction pump. Furthermore, the drive of the suction pump is controlled by the control unit 8.

Further, the upper end portion of the adsorption nozzle 434 also serves as a connection portion for detachably connecting the upper base 13 to the movable frame 432.

Further, a protruding portion 133 which protrudes toward the left side in Fig. 5 is formed on the upper left portion of Fig. 5 of the upper base 13. A relay substrate 17 is provided on a lower surface of the protruding portion 133.

As shown in FIG. 12, the number of the relay substrates 17 is the same as the number of the terminals 92 of the IC device 9, that is, has six conductor portions 171. Since each conductor portion 171 is the same, one of them will be described below.

The conductor portion 171 has a third terminal portion 172, a contact portion 173 that abuts (conducts) the first terminal portion 21 (probe pin 22), and a connection portion 174 that connects the third terminal portion 172. It is electrically connected to the abutting portion 173. The third terminal portion 172 is electrically connected to the first terminal portion 21 via the contact portion 173 and the connection portion 174 .

Further, in the present embodiment, the third terminal portion 172 includes one terminal 175. The terminal 175 and the abutting portion 173 are exposed on the lower surface of the relay substrate 17, respectively. In addition, the shape of the third terminal portion 172, that is, the shape of the terminal 175 is not particularly limited. However, in the present embodiment, the circular shape is formed when viewed from the thickness direction of the relay substrate 17.

Here, in the present embodiment, the third terminal portion 172 includes one terminal 175, but preferably includes a plurality of terminals (not shown). Thereby, the contact area between the third terminal portion 172 and the fourth terminal portion can be increased, whereby the electric resistance can be reduced, and a large current can flow in the IC device 9 held by the inspection socket 51.

The shape of the upper casing 14 is not particularly limited. However, in the present embodiment, the upper casing 14 has a rectangular parallelepiped shape. The housing 14 has the function of covering each of the probe pins 22. Thereby, each probe pin 22 can be protected.

As shown in FIGS. 5, 7, and 9, the upper housing 14 is provided with a plurality of probe pins 22 that are abutted (electrically connected) to the upper surface (first portion) of each terminal 92 of the IC device 9. . In this case, when the IC device 9 is grasped by the hand unit 433, the probe pins 22 abut against the upper surface of each terminal 92 of the IC device 9, or may be grasped at the hand unit 433. When the IC device 9 is pressed against the inspection socket 51 after the IC device 9, the probe pins 22 abut against the upper surface of each terminal 92.

The latter can be realized, for example, by constituting the upper base 13 in the following manner. In other words, a portion (not shown) of the upper base 13 that grips the IC device 9 is formed of a member different from the other portions of the upper base 13, and is biased upward by an elastic member (not shown) such as a spring. It can move up and down. Further, in a state where the hand unit 433 grips the IC device 9, the terminal 92 of the IC device 9 and the probe pin 22 of the hand unit 433 are separated.

Further, if the unit 433 grips the IC device 9 and the check socket 51 holds the IC device 9, the hand unit 433 presses the IC device 9 toward the lower side, and only the upper base 13 grasps the IC device 9 The portion is moved toward the upper side against the spring pressure of the spring, whereby the terminal 92 of the IC device 9 abuts against the probe pin 22 of the hand unit 433. With such a configuration, it is possible to prevent the IC device 9 from being detached from the hand unit 433 when the hand unit 433 presses the IC device 9 toward the lower side.

Each of the probe pins 22 is arranged in a lattice shape such that the direction of the central axis thereof is in the vertical direction, and is provided in plural numbers with respect to one terminal 92 of the IC device 9. The one first terminal portion 21 includes a plurality of probe pins (terminals) 22 that are in contact with one terminal 92.

By providing a plurality of probe pins 22 for one terminal 92, the total area of the portion in contact with the terminal 92 of the first terminal portion 21 can be increased, whereby the electric resistance can be reduced and the electric resistance can be reduced. The IC device 9 held by the inspection socket 51 flows a large current. Thereby, the flow of the large current can be checked for the IC device 9 held by the inspection socket 51.

In addition, the number of the probe pins 22 with respect to the one terminal 92 is not particularly limited as long as it is plural, and can be appropriately set depending on various conditions such as the magnitude of the current flowing in. The number of the current can be determined according to the allowable current value of the pin. For example, if the inspection current is 80 A and the allowable current value of the pins is 1 A/piece, it is 80 or more. Further, it is also possible to reduce the number of balances with the number of the pins 24 side. Furthermore, in the present embodiment, the number is five.

If the number of probe pins 22 with respect to one terminal 92 is less than the above-described lower limit value, depending on other conditions, there is a possibility that a current of a specific magnitude cannot flow to the IC device 9 held by the inspection socket 51. Moreover, if the number of probe pins 22 with respect to one terminal 92 is more than the above The upper limit value makes it difficult to set the probe pin 22 depending on other conditions.

Moreover, the number of probe pins 22 with respect to one terminal 92 is preferably less than the number of probe pins 24 described below with respect to one terminal 92, and more preferably less than one terminal 92. The number of probe pins 24 is described.

In the middle of the wiring from the first terminal portion 21 to the control portion 8, the relay substrate 17 or the probe pins 26 and the like described below are included, and the length of the wiring is longer than the second terminal portion 23 to the control portion 8 described below. The length of the wiring is such that the number of probe pins 22 relative to one terminal 92 is made smaller than the number of probe pins 24, so that the resistance can be made smaller and can be held in the inspection socket 51. The IC device 9 flows a large current.

Further, when the number of probe pins 22 with respect to one terminal 92 is a, and the number of probe pins 24 with respect to one terminal 92 is b, a/b is not particularly limited. Although it can be suitably set according to various conditions, it is preferable to set it in the range of 0.1 or more and 1 or less, and it is more preferable to set it as the range of 0.1 or more and 0.8 or less. Further, in the present embodiment, a/b is 5/6.

If the a/b is smaller than the lower limit value, the number of probe pins 22 with respect to one terminal 92 is too small according to other conditions, and it is impossible to flow a specific current to the IC device 9 held by the inspection socket 51. After that. Further, when the a/b is larger than the upper limit value, depending on other conditions, there is no possibility that the electric resistance can be made smaller by making the a smaller than b.

Further, the arrangement of the probe pins 22 with respect to one terminal 92 is not particularly limited. However, in the present embodiment, the probe pins 22 are arranged in one row. Furthermore, the probe pins 22 can also be configured, for example, in a plurality of rows. Since each probe pin 22 is the same, one of them will be described below.

The probe pin 22 includes a script body 220 including a first member 221, a second member 222, and a third member 223, and a first member 221 disposed in the script body 220 as a first member 221 facing the script body 220. A coil spring (not shown) of the biasing member that is biased in the direction of elongation, and a coil spring (first elastic member) (not shown) that is a biasing member that biases the second member 222 in the direction in which the script body 220 is extended.

The first member 221 is displaceable relative to the third member 223 by the elastic deformation of the coil spring in the direction in which the IC device 9 moves when the inspection socket 51 holds the IC device 9 (the axial direction of the probe pin 22). (sliding), that is, it is displaceable in a direction opposite to the direction in which the coil spring biases the first member 221. Similarly, the second member 222 can be moved in the direction in which the IC device 9 moves when the inspection socket 51 holds the IC device 9 by the elastic deformation of the coil spring with respect to the third member 223 (the axial direction of the probe pin 22) The displacement (sliding), that is, the displacement in the opposite direction to the direction in which the coil spring biases the second member 222. Thereby, each of the probe pins 22 can be easily brought into contact with the terminal 92 of the IC device 9 and the abutting portion 173 of the relay substrate 17.

-Recycling robots -

The collection robot 44 is a robot that transports the IC device 9 that has been inspected by the inspection unit 5 to the collection-side arranging unit 6. Such a recycling robot 44 has a support frame 441 supported by the base 11 and a moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441; and 4 hand units ( The gripping robot 443 is supported by the moving frame 442. Each of the hand units 443 includes an elevating mechanism and an adsorption nozzle, and the IC device 9 can be gripped by suction.

The transfer unit 4 transports the IC device 9 as follows. First, the transport shuttle 41 moves to the left in the drawing, and the supply robot 42 transports the IC device 9 on the mount 341 to the transport shuttle 41 (STEP 1). Next, the transport shuttle 41 moves toward the center, and the inspection robot 43 transports the IC device 9 on the transport shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 transports the IC device 9 that has finished the inspection by the inspection unit 5 to the transport shuttle 41 (STEP 3). Then, the transport shuttle 41 moves to the right side in the drawing, and the recovery robot 44 transports the inspected IC device 9 on the transport shuttle 41 to the recovery side array portion 6. By repeating such STEPs 1 to STEP 3, the IC device 9 can be transported to the recovery side arranging unit 6 via the inspection unit 5.

In the above, the configuration of the transport unit 4 has been described. However, as the configuration of the transport unit 4, the IC device 9 on the mounting table 341 can be transported to the inspection unit 5, and the IC device 9 that has finished the inspection is arranged toward the recovery side. There is no particular limitation on the movement of the department 6. For example, the handling can be omitted The shuttle 41 transports the self-mounted table 341 to the inspection unit 5 and the self-inspection unit 5 to the collection-side arranging unit 6 by using one of the supply robot 42, the inspection robot 43, and the collection robot 44.

Inspection Department

The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC device 9. As shown in FIG. 2, the inspection unit 5 has four inspection sockets (holding portions) 51 that hold the IC device 9. When the IC device 9 is inspected, one IC device 9 is held in one inspection socket 51. In addition, the term "holding" refers to, for example, the concept of housing the IC device 9, housing the IC device 9, and the like. Each of the inspection sockets 51 is the same, and therefore, one of them will be described below.

As shown in FIGS. 3, 4, and 6, the inspection socket 51 has an adapter portion 15 and a lower casing 16 that holds the IC device 9, and is detachably provided to the base 11.

Further, the lower casing 16 is detachably attached to the adapter portion 15. The method of attaching the lower casing 16 to the adapter portion 15 is not particularly limited, and can be performed, for example, by screwing or fitting. Since the lower casing 16 is detachably attached to the adapter portion 15, the repair, inspection, or replacement of the components of the inspection socket 51 can be easily and quickly performed. Further, the lower casing 16 may not be removed from the adapter portion 15, or the lower casing 16 may be integrated with the adapter portion 15.

The adapter portion 15 has a function of an interface, and is a relay portion that electrically connects each wiring of the inspection socket 51 and the control portion 8, and is detachably provided to the susceptor 11 (see FIG. 2).

Further, a wall portion (second wall portion) 161 is formed in an upper portion of the lower casing 16, and a recess portion (second recess portion) 162 into which the main body portion 91 of the IC device 9 is inserted is formed by the wall portion 161. That is, the main body portion 91 of the IC device 9 is positioned in contact with the inner surface (wall portion 161) of the concave portion 162. Furthermore, in the present embodiment, the concave portion 162 is formed in a quadrangular shape. Further, as described above, the second concave portion is not limited to being formed of one member, and includes a case where it is formed by, for example, enclosing a plurality of wall portions or convex portions. Further, as described above, it is not limited to the case of being surrounded by the entire circumference, and the case where a part is opened is also included.

Further, on the left side of FIG. 6 of the concave portion 162 of the lower casing 16, a plurality of probe pins 24 abutting on the lower surface (second portion) of each terminal 92 of the IC device 9 are provided. In this case, when the IC device 9 is held by the inspection socket 51, each probe pin 24 abuts against the lower surface of each terminal 92 of the IC device 9, and may also be used to hold the IC device at the inspection socket 51. After the hand unit 433 presses the IC device 9 against the inspection socket 51, each probe pin 22 abuts against the lower surface of each terminal 92. The latter can be realized in the same manner as in the case of the above-described upper base 13.

The probe pins 24 are arranged in a lattice shape such that the direction of the central axis thereof is in the vertical direction, and a plurality of pins are provided for one terminal 92 of the IC device 9. The one second terminal portion 23 includes a plurality of probe pins (terminals) 24 that are in contact with one terminal 92.

By providing a plurality of probe pins 24 for one terminal 92, the total area of the portion in contact with the terminal 92 of the second terminal portion 23 can be increased, whereby the electric resistance can be reduced. The IC device 9 held by the inspection socket 51 flows a large current. Thereby, the flow of the large current can be checked for the IC device 9 held by the inspection socket 51.

In addition, the number of the probe pins 24 with respect to the one terminal 92 is not particularly limited as long as it is plural, and can be appropriately set depending on various conditions such as the magnitude of the current flowing in. The number of probe pins 22 and probe pins 24 is determined for checking the current value. For example, when the inspection current is 80 A and the allowable current of the probe pin is 1 A/piece, the number of necessary is 80 or more. When there are 50 probe pin 22 sides, the probe pin 24 side is 30 or more. Furthermore, in the present embodiment, the number is six.

If the number of probe pins 24 with respect to one terminal 92 is less than the above-described lower limit value, depending on other conditions, there is a possibility that a current of a specific magnitude cannot flow to the IC device 9 held by the inspection socket 51. Further, if the number of probe pins 24 with respect to one terminal 92 is larger than the above upper limit value, it is difficult to provide the probe pins 24 according to other conditions.

Further, the arrangement of the probe pins 24 with respect to one terminal 92 is not particularly limited. However, in the present embodiment, the probe pins 24 are arranged in one row. Furthermore, the probe pin 24 can also be used, for example. Configured as multiple lines.

Further, the positional relationship between the probe pin 22 and the probe pin 24 is not particularly limited. However, in the present embodiment, as shown in FIG. 13, the probe pin 22 and the probe pin 24 are in contact with each other. The terminals 92 do not oppose each other in the state. That is, the probe pins 24 are disposed between the adjacent two probe pins 22. In other words, the probe pins 22 are disposed between the adjacent two probe pins 24. Thereby, in a state where the probe pins 22 and 24 abut against the terminal 92, the terminal 92 is slightly bent, the contact area between the terminal 92 and the probe pins 22 and 24 is increased, and the electric resistance can be made small.

Further, as the probe pin 24, the same as the probe pin 22 described above can be used. In this case, the "first elastic member" appearing in the description of the probe pin 22 is referred to as "the second elastic member".

Further, on the upper left side of the lower casing 16 in Fig. 6, a projecting portion 163 which protrudes toward the upper side in Fig. 6 is formed.

A plurality of probe pins 26 are provided on the protruding portion 163. Each of the probe pins 26 is disposed such that the direction of the central axis thereof is the vertical direction. The probe pins 26 are attached to the IC device 9 by the hand unit 433, and the inspection socket 51 holds the IC device 9, and the probe pins 22 and 24 abut against the terminal 92 of the IC device 9, abutting Each terminal 175 (third terminal portion 172) of the relay substrate 17 is relayed. The probe pin 26 is provided one by one with respect to one terminal 175 of the relay substrate 17. Therefore, one of the fourth terminal portions 25 includes one probe pin (terminal) 26.

Here, in the present embodiment, the fourth terminal portion 25 includes one probe pin 26, but preferably includes a plurality of probe pins (terminals) (not shown). Thereby, the contact area between the third terminal portion 172 and the fourth terminal portion 25 can be increased, whereby the electric resistance can be reduced, and a large current can flow in the IC device 9 held by the inspection socket 51.

Next, the wiring from each probe pin 22 to the control unit 8 and the wiring from each probe pin 24 to the control unit 8 will be described. However, the wirings of the probe pins 22 that abut against the terminals 92 of the IC device 9 are the same, and therefore one of them will be described below. The grounding is the same as the wiring of the probe pins 24 of the respective terminals 92. Therefore, one of them will be described below.

As shown in FIG. 14 , the six probe pins 24 are electrically connected to the one wiring 192 by the adapter portion 15 , and the probe pins 26 are electrically connected to the wiring 191 by the adapter portion 15 . Further, the wirings 191 and 192 are electrically connected to the control unit 8 independently.

Thereby, the IC device 9 is grasped by the hand unit 433, and the inspection socket 51 holds the IC device 9. The probe pins 22 and the probe pins 24 abut against the terminal 92 of the IC device 9, and the probe pin 26 In a state in which the terminal 175 of the relay substrate 17 is abutted, the circuits 201 and 202 that electrically connect the terminal 92 of the IC device 9 to the control unit 8 are formed.

Furthermore, one of the six probe pins 24 can be made independent, and the probe pins 24 can be electrically connected to the control unit 8 independently. Thereby, the independent probe pin 24 can be used, and the voltage can be measured, for example, by a 4-terminal method or the like. The measurement result of the voltage can be used, for example, to distinguish whether the other probe pins 24 abut against the terminals 92 of the IC device 9.

Similarly, one of the five probe pins 22 can be made independent, and the probe pins 22 can be electrically connected to the control unit 8 independently. Thereby, the independent probe pin 22 can be used, and the voltage can be measured, for example, by a 4-terminal method or the like. The measurement result of the voltage can be used, for example, to distinguish whether the other probe pins 22 abut against the terminals 92 of the IC device 9.

Further, each of the probe pins 24 may be electrically connected to the control unit 8 independently. Similarly, each probe pin 22 can be electrically connected to the control unit 8 independently.

Next, the opponent unit 433 transports the IC device 9 to the inspection socket 51, and the operation when the socket 51 holds the IC device 9 and performs the inspection of the IC device 9 will be described.

As shown in FIGS. 3, 7, and 9, first, the IC device 9 is attracted to the adsorption nozzle 434 by a suction pump (not shown), and the IC device 9 is grasped by the hand unit 433. At this time, the body portion 91 of the IC device 9 is inserted into the concave portion 132 to abut and be positioned on the inner surface of the concave portion 132. Then, the hand unit 433 carries the IC device 9 to the inspection socket 51.

Next, as shown in FIGS. 4, 8, and 10, the hand unit 433 will be the body portion of the IC device 9. 91 is inserted into the recess 162 of the inspection socket 51. Then, the body portion 91 of the IC device 9 is inserted into the recess 132 and abuts and is positioned on the inner surface of the recess 132, and is held by the inspection socket 51.

Next, the hand unit 433 presses the IC device 9 toward the lower side. Thereby, the terminals 92 of the IC device 9 are sandwiched by the probe pins 22 and the probe pins 24, and are inspected by the probe pins 22 and the probe pins 24, and are inspected. The socket 51 is held.

Further, each probe pin 26 abuts on each terminal 175 of the relay substrate 17.

In the above, each terminal 92 of the IC device 9 is electrically connected to the control unit 8 via each probe pin 22 and each probe pin 24 .

Next, the inspection of the IC device 9 is performed. The inspection of the IC device 9 is performed based on the program stored in the control unit 8.

As described above, in the electronic component inspection apparatus 1, the probe terminals 22 and 24 are brought into contact with the terminals 92 of the IC device 9 in the first terminal portion 21 and the second terminal portion 23 by a simple configuration. The total area of the portion becomes large, whereby the electric resistance can be made small, so that a large current can flow in the IC device 9 held by the inspection socket 51. Thereby, the IC device 9 can be inspected for flowing large current.

Further, since the first terminal portion 21 is provided in the hand unit 433 and the second terminal portion 23 is provided in the inspection socket 51, the first terminal portion 21 and the second terminal portion 23 can be easily brought into contact with the terminal 92 of the IC device 9 .

Moreover, since the configuration of the hand unit 433 and the inspection socket 51 is simple, it is possible to easily reduce the size of the hand unit 433 and the inspection socket 51. Thereby, the number of installations per unit area of the hand unit 433 and the inspection socket 51 can be increased, and the number of IC devices 9 that can be simultaneously inspected can be increased.

<Second embodiment>

Fig. 15 is a view schematically showing a first terminal portion and a second terminal portion in the second embodiment of the electronic component inspection device of the present invention.

Hereinafter, the second embodiment will be described, but it is different from the first embodiment described above. The point is described as a center, and the description of the same matters is omitted.

As shown in FIG. 15, in the inspection apparatus 1 of the second embodiment, the probe pin 22 and the probe pin 24 are opposed to each other in a state of being in contact with the terminal 92. That is, the central axis of the probe pin 22 coincides with the central axis of the probe pin 24. Thereby, the force applied from the probe pins 22 and 24 to the terminal 92 can be suppressed from being dispersed in the state in which the probe pins 22 and 24 abut against the terminal 92. Thereby, the contact failure between the terminal 92 and the probe pins 22 and 24 can be suppressed.

According to the second embodiment described above, the same effects as those of the first embodiment described above can be exhibited.

<Third embodiment>

Fig. 16 is a circuit diagram showing a first terminal portion, a second terminal portion, a third terminal portion, a fourth terminal portion, wiring, and the like in the third embodiment of the electronic component inspection device according to the present invention.

In the following, the third embodiment will be described, but the description of the same matters will be omitted.

As shown in Fig. 16, in the inspection apparatus 1 of the third embodiment,

As shown in FIG. 16 , the six probe pins 24 are electrically connected to the one wiring 192 by the adapter portion 15 , and the probe pins 26 are electrically connected to the wiring 191 by the adapter portion 15 . Further, the wirings 191 and 192 are combined to form one wiring 193 in the middle, and are electrically connected to the control unit 8. That is, each probe pin 24 and the probe pin 26 are electrically connected.

Thereby, the IC device 9 is grasped by the hand unit 433, and the inspection socket 51 holds the IC device 9. The probe pins 22 and the probe pins 24 abut against the terminal 92 of the IC device 9, and the probe pin 26 In a state in which the terminal 175 of the relay substrate 17 is abutted, a circuit 203 for electrically connecting the terminal 92 of the IC device 9 to the control unit 8 is formed.

According to the third embodiment described above, the same effects as those of the first embodiment described above can be exhibited.

Furthermore, the third embodiment can also be applied to the second embodiment.

<Fourth embodiment>

17 and FIG. 18 are each a cross-sectional view showing the inspection unit of the hand unit and the inspection unit of the transport unit in the fourth embodiment of the electronic component inspection device according to the present invention.

In the following, the fourth embodiment will be described, but the description will be focused on the differences from the first embodiment, and the description of the same matters will be omitted.

In the fourth embodiment, the third terminal portion is provided in the upper casing 14, and the fourth terminal portion is provided in the lower casing 16.

That is, as shown in FIG. 17, in the inspection apparatus 1 of the fourth embodiment, the number of the terminals 175 of the relay substrate 17 is the same at the end portion on the left side in FIG. 17 of the upper casing 14 (in the present embodiment). In the form of six (6) terminal pins (third terminal portion) 27. Each of the probe pins 27 is disposed such that the direction of the central axis thereof is in the up-and-down direction, and is in contact with (conductive) the respective terminals 175 of the relay substrate 17.

Further, a relay substrate 18 is provided on the upper surface of the lower casing 16. The relay substrate 18 has terminals (fourth terminal portions) 181 which are the same as the number of probe pins 27 (six in the present embodiment).

Moreover, each of the probe pins 27 is held by the hand unit 433 to grip the IC device 9, and the inspection socket 51 holds the IC device 9, and the probe pins 22 and 24 abut against the terminal 92 of the IC device 9, abutting Each terminal 181 of the substrate 18 is relayed.

According to the fourth embodiment described above, the same effects as those of the first embodiment described above can be exhibited.

Furthermore, the fourth embodiment can also be applied to the second embodiment and the third embodiment.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced with any configuration having the same function. Further, any other constituents may be added to the present invention.

Furthermore, the present invention may be obtained by combining any two or more of the above-described configurations (features).

Further, in the above-described embodiment, the first terminal portion and the second terminal portion each have a plurality of terminals. However, the present invention is not limited thereto, and at least one of the first terminal portion and the second terminal portion may have plural numbers. Just a terminal. In other words, the first terminal portion may have a plurality of terminals, the second terminal portion may have one terminal, or the first terminal portion may have one terminal, and the second terminal portion may have a plurality of terminals.

In addition, the electronic component is not limited to the SIP of the above embodiment, and examples thereof include ZIP (Zig-zag In-line Packag, Sawtooth In-Line Package), SOP (Small Outline Package), and QFP. (Plastic Quad Flat Package, quad flat package), etc. In other words, in the above-described embodiment, the terminals of the electronic component protrude in one direction. However, the terminal of the electronic component may protrude in two directions, three directions, or four directions, for example.

1‧‧‧Checking device

2‧‧‧Supply Department

3‧‧‧Supply side alignment

4‧‧‧Transportation Department

5‧‧‧Inspection Department

6‧‧‧Recycling side alignment

7‧‧Recycling Department

8‧‧‧Control Department

10‧‧‧Transporting device

11‧‧‧Base

12‧‧‧ 盖部

111‧‧‧ base surface

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Claims (14)

An electronic component transporting apparatus comprising: a gripping portion that grips an electronic component; and a holding portion that holds the electronic component; and the gripping portion includes a first component of an electronic component terminal that abuts the electronic component a first terminal portion of the portion and a third terminal portion that is electrically connected to the first terminal portion; the holding portion includes a second terminal portion that is in contact with a second portion of the electronic component terminal of the electronic component that is different from the first portion The at least one of the first terminal portion and the second terminal portion includes a plurality of terminals, and the first terminal portion and the third terminal portion are at different heights in the grip portion. The electronic component transporting apparatus according to claim 1, wherein the first terminal portion and the second terminal portion are in contact with the electronic component when the gripping portion grips the electronic component and the holding portion holds the electronic component Terminal. The electronic component conveying apparatus according to claim 2, wherein the first terminal portion has a first elastic member that biases the terminal of the first terminal portion; and at least a part of the terminal of the first terminal portion is capable of biasing the first portion The terminal of the one terminal portion is displaced in a direction opposite to the direction; the second terminal portion has a second elastic member that biases the terminal of the second terminal portion; and at least a portion of the terminal of the second terminal portion can be biased The terminal of the second terminal portion is displaced in a direction opposite to the direction. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the holding portion has a fourth terminal portion; When the first terminal portion and the second terminal portion are in contact with the electronic component terminal, the third terminal portion is in contact with the fourth terminal portion. The electronic component transport device of claim 4, wherein at least one of the third terminal portion and the fourth terminal portion includes a plurality of terminals. The electronic component transport apparatus of claim 4, wherein the second terminal portion is electrically connected to the fourth terminal portion. The electronic component transport device of claim 5, wherein the second terminal portion is electrically connected to the fourth terminal portion. The electronic component transporting apparatus according to any one of claims 1 to 3, wherein the gripping portion includes: a grip portion main body that grips the electronic component; and a housing that is provided with the first terminal portion and that is opposite The grip body is detachably attached. The electronic component transporting apparatus according to any one of claims 1 to 3, wherein the gripping portion has a first recessed portion that positions the electronic component at a specific position of the gripping portion; and the retaining portion has the electronic component positioned a second recess at a specific position of the holding portion. The electronic component transporting apparatus according to any one of claims 1 to 3, wherein the number of the terminals of the first terminal portion is smaller than the number of the terminals of the second terminal portion. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the terminal of the first terminal portion and the second terminal portion are opposed to each other when abutting against the electronic component terminal. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the terminal of the first terminal portion and the second terminal portion do not oppose each other when abutting against the electronic component terminal. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the electronic zero The member has a body portion, and the electronic component terminal protrudes to the outside of the body portion. An electronic component inspection device comprising: a grip portion that grips an electronic component; a holding portion that holds the electronic component; and an inspection portion that inspects the electronic component; and the grip portion has a contact a first terminal portion of the first portion of the electronic component terminal of the electronic component and a third terminal portion that is electrically connected to the first terminal portion; and the holding portion includes an electronic component terminal that is in contact with the electronic component, different from the first component a second terminal portion of the second portion; at least one of the first terminal portion and the second terminal portion includes a plurality of terminals; and the first terminal portion and the third terminal portion are different in the grip portion The height.