TWI698492B - 伸縮性膜材料組成物、伸縮性膜、及其形成方法 - Google Patents
伸縮性膜材料組成物、伸縮性膜、及其形成方法 Download PDFInfo
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- TWI698492B TWI698492B TW108104019A TW108104019A TWI698492B TW I698492 B TWI698492 B TW I698492B TW 108104019 A TW108104019 A TW 108104019A TW 108104019 A TW108104019 A TW 108104019A TW I698492 B TWI698492 B TW I698492B
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- Prior art keywords
- stretchable film
- stretchable
- polysiloxane
- film
- urethane
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 20
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 68
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 53
- -1 polysiloxane backbone Polymers 0.000 claims description 111
- 239000000463 material Substances 0.000 claims description 40
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 23
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 13
- 125000002947 alkylene group Chemical group 0.000 claims description 12
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- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000001033 ether group Chemical group 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
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- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 4
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- 239000000243 solution Substances 0.000 description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical group C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
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- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical group CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 2
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- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical group CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
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Abstract
本發明提供有優良的伸縮性及強度且膜表面之撥水性優異、非黏質的伸縮性膜中適合使用的伸縮性膜材料組成物、使用了該伸縮性膜材料組成物之伸縮性膜、 及其形成方法。一種伸縮性膜材料組成物,含有具下列通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯及具下列通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯。
Description
本發明係關於兼具伸縮性、強度、撥水性及非黏著性之伸縮性膜材料組成物、伸縮性膜、及其形成方法。
近年來隨著物聯網(IoT,Internet of Things)之普及,穿戴式器件之開發進展。能夠連接於網路的鐘錶、眼鏡為其代表例。又,在醫療領域、運動領域,也需要能夠隨時監測身體狀態的穿戴式器件,為今後成長的領域。
就穿戴式器件而言,可揭示貼附在身體而隨時監控身體狀態之形態。如此的穿戴式器件,通常係由用以檢測來自身體的電訊號之生物體電極、用以將電訊號傳給感測器之配線、成為感測器之半導體晶片、及電池構成。又,通常,也需要用以黏接在皮膚的之黏接墊。針對生物體電極及周邊的配線、黏接墊之結構,詳載於專利文獻1。專利文獻1記載之穿戴式器件中,在生物體電極之周邊配置有聚矽氧系黏接膜,在生物體電極與感測器器件之間以被覆著伸縮性胺甲酸酯膜之蛇腹形狀之可伸縮之銀配線連接。
胺甲酸酯膜的伸縮性及強度高,具有作為伸縮配線之被覆膜的優良機械特性。但是胺甲酸酯膜有水解性,所以會有由於水解導致伸縮性及強度下降的缺點。另一方面,聚矽氧膜無水解性但有強度低的缺點。
有人探討在聚合物主鏈具有胺甲酸酯鍵與矽氧烷鍵兩者之聚矽氧胺甲酸酯聚合物。此聚合物之硬化物,比起聚矽氧單獨時有較高強度,比起聚胺甲酸酯單獨時有較低水解性。但是此聚合物之硬化物,其比起聚胺甲酸酯單獨時之強度低、聚矽氧單獨時之撥水性低,僅能獲得聚矽氧與聚胺甲酸酯中間的強度及撥水性。
高伸縮性的胺甲酸酯膜,會有觸摸時表面發黏的特性。表面若發黏則膜彼此黏連時不會分開,且此膜上實施網版印刷時版與膜會黏在一起而造成印刷不良。另一方面,聚矽氧膜的剝離性高,所以膜彼此不會黏連。惟聚矽氧的強度低,所以薄膜的聚矽氧膜一拉伸便會很容易地碎裂。若在聚矽氧膜上實施網版印刷,不會因為和版黏連而導致印刷不良,但是因為和印墨間的黏著性低,所以硬化後之印墨會剝落。原因是聚矽氧之表面的剝離性高的關係。另一方面,胺甲酸酯膜與印墨間的黏接力高,硬化後之印墨不會剝落。
又,使用了懸吊了聚矽氧之聚胺甲酸酯的膜,伸縮性、強度、撥水性的均衡性優異,但因為膜表面發黏所以會有膜彼此黏連、或網版印刷時膜和版黏連的缺點。以聚矽氧嵌段共聚合於主鏈的聚胺甲酸酯作為基礎的膜,膜表面無發黏感但強度弱。
希望可以開發出高伸縮、高強度、且表面不發黏而能實施網版印刷等印刷,而且印刷後之印墨不剝落的伸縮性膜。
有人提案一種自行車片用皮材,其表面以聚矽氧胺甲酸酯膜覆蓋,內部為胺甲酸酯膜,又更內部為聚烯烴系彈性體(專利文獻2)。藉由最表面為聚矽氧胺甲酸酯膜,耐摩耗性較好。聚矽氧因為表面能量低,不會發黏,藉此,耐摩耗性提高。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2004-033468號公報
[專利文獻2]日本特開2001-018329號公報
(發明欲解決之課題)
基於如此的背景,希望開發出具有和聚胺甲酸酯同程度之優良伸縮性及強度且有和聚矽氧同程度之優良撥水性,且膜彼此不會黏連的自立性之伸縮性膜及其形成方法。
本發明係為了解決上述問題,目的在於提供適合使用在有優良的伸縮性及強度,且膜表面之撥水性優良、非黏質的伸縮性膜中使用的伸縮性膜材料組成物、使用了該伸縮性膜材料組成物之伸縮性膜、及其形成方法。
(解決課題之方式)
為了解決上述課題,本發明提供一種伸縮性膜材料組成物,其含有具下列通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯及具下列通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯。
【化1】
式中,R1
、R4
為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基。R2
、R3
、R5
為同一、非同一之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基。R6
、R11
、R12
、R13
為同一、非同一之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2
R3
)s
-OSiR2
R3
R5
基。R7
、R9
為單鍵、亞甲基、或伸乙基,R7
及R9
之碳數之合計為1或2。R8
為氫原子或碳數1~4之直鏈狀之烷基,R10
為氫原子或甲基。A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可以有醚基。m、n為1~100之範圍之整數,p為2~10之範圍之整數,q、r、s為0~20之範圍之整數。
若為如本發明之伸縮性膜材料組成物,則會成為有優良的伸縮性及強度且膜表面之撥水性優異、非黏質的伸縮性膜中適合使用的伸縮性膜材料組成物。
又,前述聚矽氧主鏈型胺甲酸酯宜有下列通式(3)-1及/或(3)-2表示之在末端具(甲基)丙烯酸酯基之結構較佳。
【化2】
式中,R1
~R5
、m、n、p同前所述,R14
為氫原子、甲基。t、u為1分子中之單元數,為1≦t≦100、1≦u≦3之範圍之整數。
又,前述聚矽氧懸吊型胺甲酸酯宜有下列通式(4)-1及/或(4)-2表示之在末端具(甲基)丙烯酸酯基之結構較佳。
【化3】
式中,R2
、R3
、R5
~R13
、q、r同前所述,R14
為氫原子、甲基。t、u為1分子中之單元數,且為1≦t≦100、1≦u≦3之範圍之整數。
若使用如此的在末端具有(甲基)丙烯酸酯基之結構者,則能夠適合使用在有更優良的伸縮性及強度,且膜表面之撥水性也更優良的伸縮性膜。
又,前述聚矽氧主鏈型胺甲酸酯之含有比例,宜為前述聚矽氧懸吊型胺甲酸酯之50質量%以下較佳。
又,前述聚矽氧主鏈型胺甲酸酯之含有比例,宜為前述聚矽氧懸吊型胺甲酸酯之25質量%以下較佳。
前述聚矽氧主鏈型胺甲酸酯之含有比例,宜為前述聚矽氧懸吊型胺甲酸酯之15質量%以下較佳。
聚矽氧主鏈型胺甲酸酯若為如此之含有比例,能夠適合使用在有更優良的強度的伸縮性膜。
又,本發明提供含有前述伸縮性膜材料組成物且前述聚矽氧主鏈型胺甲酸酯配向在表面的伸縮性膜。
若為如本發明之伸縮性膜,則會成為有優良的伸縮性及強度且膜表面的撥水性優異、非黏質的伸縮性膜。
又,前述伸縮性膜宜為在JIS K 6251規定之拉伸試驗之伸縮率為20~1000%之範圍者較佳。
若為如此的伸縮率的伸縮性膜,特別適合作為伸縮配線之被覆膜使用。
又,前述伸縮性膜宜為可作為接觸有伸縮性之導電性配線之膜使用者較佳。
本發明之伸縮性膜特別適合使用在如此的用途。
又,本發明提供一種伸縮性膜之形成方法,係形成伸縮性膜之方法,係於前述伸縮性膜材料組成物成膜後,利用加熱及/或照光進行硬化。
若為如此的伸縮性膜之形成方法,能夠輕易地形成有優良的伸縮性及強度且膜表面之撥水性優異、非黏質的伸縮性膜。
(發明之效果)
如上,若為本發明之伸縮性膜,可成為具有和聚胺甲酸酯為同程度之優良的伸縮性及強度,且膜表面具有和主鏈為矽氧烷鍵之聚矽氧乃同程度或更好之優良的撥水性、表面沒有發黏感的非黏質性的伸縮性膜。若形成膜內部為懸吊了聚矽氧之聚胺甲酸酯且膜表面係聚矽氧嵌段共聚在主鏈之聚胺甲酸酯的膜,則高強度、高伸縮、高撥水、非黏性的特性皆可以符合。本發明之伸縮性膜材料組成物,特徵為摻混了聚矽氧主鏈型胺甲酸酯及聚矽氧懸吊型胺甲酸酯。若塗佈此材料,則聚矽氧主鏈型胺甲酸酯會配向在膜表面。藉由使其硬化,可形成由聚矽氧主鏈型胺甲酸酯覆蓋了表面的膜。因此若為本發明之伸縮性膜,則在穿戴式器件中,不僅適合使用在將生物體電極與感測器予以連接的配線部,也特別適合作為能承載生物體電極、感測器全體的伸縮性膜、覆蓋感測器、配線的表覆膜使用。
聚胺甲酸酯有充分的伸縮性及強度,但是有撥水性低,會因水解造成強度與伸縮性降低的缺點,聚矽氧的撥水性高但有強度低的缺點。又,主鏈上有胺甲酸酯鍵與矽氧烷鍵兩者的聚矽氧胺甲酸酯聚合物的硬化物,膜表面的發黏感小,撥水性優異,但有強度低的缺點,以在側鏈懸吊了聚矽氧之胺甲酸酯為基礎的膜,高強度、高伸縮、高撥水,但有表面發黏的缺點。基於如此的背景,希望開發出和聚胺甲酸酯有同程度之優良的伸縮性及強度且膜表面之強度也充分高,且有和聚矽氧為同程度或更好之優良的撥水性及非黏質的伸縮性膜中適合使用的伸縮性膜材料組成物、使用了該伸縮性膜材料組成物之伸縮性膜、及其形成方法。
本案發明人等針對上述課題努力研究,結果發現:藉由以在高伸縮、高強度、高撥水性但表面發黏的聚矽氧懸吊型胺甲酸酯摻混了強度低但表面不發黏的主鏈具聚矽氧及胺甲酸酯兩者的聚矽氧主鏈型胺甲酸酯的材料形成膜,並使聚矽氧主鏈型胺甲酸酯配向在膜表面,膜內部成為聚矽氧懸吊型胺甲酸酯,藉此可形成高伸縮、高強度、高撥水性、無黏質性,膜彼此不會黏連的優良的伸縮性膜,特別適合作為用以形成穿戴式器件中的伸縮配線之伸縮性基板膜、或是用以覆蓋前述伸縮性配線、器件之伸縮性膜,乃完成本發明。
亦即,本發明係一種伸縮性膜材料組成物,含有具下列通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯及具下列通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯。
【化4】
式中,R1
、R4
為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基。R2
、R3
、R5
為同一、非同一之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基。R6
、R11
、R12
、R13
為同一、非同一之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2
R3
)s
-OSiR2
R3
R5
基。R7
、R9
為單鍵、亞甲基、或伸乙基,R7
及R9
之碳數之合計為1或2。R8
為氫原子或碳數1~4之直鏈狀之烷基,R10
為氫原子或甲基。A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可以有醚基。m、n為1~100之範圍之整數,p為2~10之範圍之整數,q、r、s為0~20之範圍之整數。
以下針對本發明詳細說明,但本發明不限定於此等。
<伸縮性膜材料組成物>
[聚矽氧主鏈型胺甲酸酯]
本發明之伸縮性膜材料組成物中含有的聚矽氧主鏈型胺甲酸酯,具有通式(1)-1及/或(1)-2表示之結構。
【化5】
式中,R1
、R4
為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基。R2
、R3
、R5
為同一、非同一之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基。m、n為1~100之範圍之整數,p為2~10之範圍之整數。
R1
、R4
之具體例可列舉亞甲基、伸乙基、伸丙基、伸丁基等。又,R2
、R3
、R5
之具體例可列舉甲基、乙基、異丙基、3,3,3-三氟丙基、苯基等。
又,具有通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯,宜具有通式(3)-1及/或(3)-2表示之在末端具有(甲基)丙烯酸酯基之結構較佳。
【化6】
式中,R1
~R5
、m、n、p同前所述,R14
為氫原子、甲基。t、u為1分子中之單元數,為1≦t≦100、1≦u≦3之範圍之整數。
就用以形成具有通式(1)-1及/或(1)-2之結構之聚矽氧主鏈型胺甲酸酯的聚矽氧化合物而言,可列舉下列通式(1)-1’、(1)-2’表示之化合物。
【化7】
式中,R1
~R5
、m、n、p同前所述。
[聚矽氧懸吊型胺甲酸酯]
本發明之伸縮性膜中含有的聚矽氧懸吊型胺甲酸酯層,具有通式(2)-1及/或(2)-2表示之結構。
【化8】
式中,R2
、R3
、R5
為同一、非同一之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基。R6
、R11
、R12
、R13
為同一、非同一之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2
R3
)s
-OSiR2
R3
R5
基。R7
、R9
為單鍵、亞甲基、或伸乙基,R7
及R9
之碳數之合計為1或2。R8
為氫原子或碳數1~4之直鏈狀之烷基,R10
為氫原子或甲基。A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可以有醚基。q、r、s為0~20之範圍之整數。
又,具有通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯,宜具有通式(4)-1及/或(4)-2表示之在末端具(甲基)丙烯酸酯基之結構較佳。
【化9】
式中,R2
、R3
、R5
~R14
、A、X、q、r、t、u同前所述。
通式(2)-1’表示之懸吊了短鏈聚矽氧之二醇化合物,例如可藉由使甘油單烯丙醚與具有SiH基之短鏈矽氧烷化合物於鉑觸媒中反應而獲得。通式(2)-1’表示之二醇化合物具體而言可例示如下。
通式(2)-2’表示之懸吊了短鏈聚矽氧之二醇化合物,例如可藉由使二羥基二烯基化合物與具有SiH基之短鏈矽氧烷化合物於鉑觸媒中反應而獲得。通式(2)-2’表示之二醇化合物具體而言可例示如下。
為了形成本發明之伸縮性膜材料組成物使用的具通式(1)-1、(1)-2、(2)-1、(2)- 2所示之結構之樹脂,可藉由以通式(1)-1’、(1)-2’、(2)-1’、(2)-2’所示之具有含矽基之化合物作為原料,使它們與異氰酸酯化合物反應而形成。
和上述通式(1)-1’、(1)-2’、(2)-1’、(2)-2’表示之化合物反應之異氰酸酯化合物具體而言可列舉如下。
上述異氰酸酯化合物之中,尤其藉由使具有(甲基)丙烯酸酯基之異氰酸酯化合物與通式(1)-1’、(1)-2’、(2)-1’、(2)-2’表示之化合物反應,可獲得通式(3)-1、(3)-2、(4)-1、(4)-2表示之在末端具(甲基)丙烯酸酯基之化合物。藉由使具羥基之具(甲基)丙烯酸酯基之化合物與異氰酸酯化合物反應,也可獲得通式(3)-1、(3)-2、 (4)-1、(4)-2表示之末端具(甲基)丙烯酸酯基之化合物。
上述異氰酸酯化合物和通式(1)-1’、(1)-2’、(2)-1’、(2)-2’表示之化合物的反應性高,所以有時難以控制。又,異氰酸酯化合物有時保存中會和大氣中之水分反應而導致異氰酸酯基失活,所以保存時需要十分小心充分防止濕度等。為了防止該等情事,有時會使用異氰酸酯基用取代基予以保護的具封端異氰酸酯基之化合物。
封端異氰酸酯基,係因加熱而封端基脫保護,成為異氰酸酯基者,具體而言可列舉經醇、苯酚、硫醇、亞胺、酮亞胺(ketimine)、胺、內醯胺、吡唑、肟、β-二酮等取代之異氰酸酯基。
為了使封端異氰酸酯基之脫保護溫度低溫化,也可添加觸媒。此觸媒已知有二月桂酸二丁基錫等有機錫、鉍鹽、2-乙基己酸鋅、乙酸鋅等羧酸鋅。
尤其日本特開2012-152725號公報揭示:藉由就羧酸而言含有α,β-不飽和羧酸鋅作為封端異氰酸酯解離觸媒,能夠使脫保護反應低溫化。
又,除了上述通式(1)-1’、(1)-2’、(2)-1’、(2)-2’表示之化合物、異氰酸酯化合物,也可加入有多數羥基之化合物。藉由添加如此的有多數羥基之化合物,可進行鏈長延長、分子間交聯。
藉由進行鏈長延長,能夠使伸縮性、強度更好。例如藉由導入兩末端為羥基的聚醚系之鏈長延長劑,伸縮性會提高。兩末端為羥基之聚酯系之鏈長延長劑會使伸縮性及強度皆更好,若導入聚碳酸酯系鏈長延長劑,則強度會顯著提高。
作為有多數羥基之化合物具體而言可列舉如下。
又,也可添加有胺基的化合物。異氰酸酯基若與胺基反應,會形成脲鍵。胺甲酸酯鍵與脲鍵的部分稱為硬鏈段,藉由該等的氫鍵,強度提高。因此,不僅是胺甲酸酯鍵,又增加脲鍵,能夠使強度提高。
由含有鏈長延長之聚醚、聚酯、聚碳酸酯之二醇化合物形成的部分稱為軟鏈段。該等中伸縮性最高的是聚醚,其次伸縮性按順序由高而低是聚酯、聚碳酸酯。按拉伸強度的順序則是和伸縮性的順序顛倒。藉由軟鏈段之種類、重複單元的選擇,能夠調整強度及伸縮性。
本發明之伸縮性膜形成中使用的聚矽氧胺甲酸酯樹脂宜為重量平均分子量為500以上者較佳。若為如此者,適合用在本發明之伸縮性膜。又,樹脂之重量平均分子量之上限値宜為500,000以下較佳。
就本發明之伸縮性膜材料組成物而言,係含有通式(1)-1及/或(1)-2表示之聚矽氧主鏈型胺甲酸酯與通式(2)-1及/或(2)-2表示之聚矽氧懸吊型胺甲酸酯之組成物。若塗佈此組成物,聚矽氧主鏈型胺甲酸酯會配向在表面。聚矽氧主鏈型胺甲酸酯與聚矽氧懸吊型胺甲酸酯之混合比率,宜聚矽氧主鏈型胺甲酸酯為聚矽氧懸吊型胺甲酸酯之50質量%以下較佳,更佳為25%以下,又更佳為15%以下。聚矽氧主鏈型胺甲酸酯之比率越高,膜全體的強度越低,所以較少為理想。聚矽氧主鏈型胺甲酸酯,以少量添加即能覆蓋膜表面,顯出非黏性的表面特性。
若為如此的伸縮性膜材料組成物,可成為和聚胺甲酸酯有同程度的優良的伸縮性及強度且膜表面有聚矽氧為同程度的優良的撥水性且具無發黏感的表面的伸縮性膜中適合使用之伸縮性膜材料組成物。
<伸縮性膜>
又,本發明提供含有前述伸縮性膜材料組成物且前述聚矽氧主鏈型胺甲酸酯配向在表面的伸縮性膜。
又,本發明之伸縮性膜,在JIS K 6251規定的拉伸試驗中的伸縮率為20~1000 %較佳。若為如此的伸縮率,特別適合使用於作為伸縮配線的被覆膜。
又,本發明之伸縮性膜宜作為接觸有伸縮性之導電性配線之膜較佳。本發明之伸縮性膜特別適合於如此的用途。也可作為形成了導電性配線之伸縮性基板使用,也可作為覆蓋導線性配線的表覆膜使用。
若為如以上說明之本發明之伸縮性膜,可成為和聚胺甲酸酯有同程度的優良的伸縮性及強度且膜表面有和聚矽氧同程度的優良的撥水性且具無發黏感的表面的伸縮性膜。
<伸縮性膜之形成方法>
又,本發明提供一種伸縮性膜之形成方法,係形成上述伸縮性膜之方法,將前述伸縮性膜材料組成物成膜後,加熱及/或照光而硬化。
此時,利用異氰酸酯基與羥基之反應來合成胺甲酸酯聚合物,並於其中形成通式(3)-1、(3)-2、(4)-1、(4)-2表示之末端(甲基)丙烯酸酯基後,可製作混合了具通式(3)-1及/或(3)-2表示之結構之化合物與具通式(4)-1及/或(4)-2表示之結構之化合物的組成物溶液。該組成物溶液成膜後,通式(3)-1及/或(3)-2之聚矽氧主鏈型胺甲酸酯會配向在膜表面。為了加速配向可以加熱,也可於組成物中添加有機溶劑。之後以加熱及/或照光使其硬化,可藉此形成聚矽氧主鏈型胺甲酸酯配向在表面的伸縮性膜。
也可藉由使(甲基)丙烯酸酯以自由基反應而交聯以實施伸縮性膜材料組成物之硬化。自由基交聯之方法宜係添加自由基發生劑。自由基發生劑有因熱分解而產生自由基之熱自由基發生劑、因照光而產生自由基之光自由基發生劑。
熱自由基發生劑可列舉偶氮系自由基發生劑、過氧化物系自由基發生劑,偶氮系自由基發生劑可列舉2,2’-偶氮雙異丁腈(AIBN)、2,2’-偶氮雙(2,4-二甲基戊腈)、2,2’-偶氮雙(2-甲基丙酸)二甲酯、2,2’-偶氮雙(4-甲氧基-2,4-二甲基戊腈)、2,2’-偶氮雙(環己烷-1-甲腈)、4,4’-偶氮雙(4-氰基戊酸)等。過氧化物系自由基發生劑可列舉過氧化苯甲醯、過氧化癸醯、過氧化月桂醯、過氧化琥珀酸、過氧化-2-乙基己酸第三丁酯、過氧化三甲基乙酸第三丁酯、過氧化-2-乙基己酸1,1,3,3-四甲基丁酯等。
光自由基發生劑可列舉苯乙酮、4,4’-二甲氧基二苯乙二酮、二苯乙二酮、苯偶因、二苯基酮、2-苯甲醯基苯甲酸、4,4’-雙(二甲胺基)二苯基酮、4,4’-雙(二乙胺基)二苯基酮、苯偶因甲醚、苯偶因乙醚、苯偶因異丙醚、苯偶因丁醚、苯偶因異丁醚、4-苯甲醯基苯甲酸、2,2’-雙(2-氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑、2-苯甲醯基苯甲酸甲酯、2-(1,3-苯并間二氧雜環戊烯-5-基)-4,6-雙(三氯甲基)-1,3, 5-三、2-苄基-2-(二甲胺基)-4’-啉代苯丁酮、4,4’-二氯二苯基酮、2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,4-二乙基硫𠮿-9-酮、二苯基(2,4,6-三甲基苯甲醯基)氧化膦、1,4-二苯甲醯基苯、2-乙基蒽醌、1-羥基環己基苯基酮、2-羥基-2-甲基苯丙酮、2-羥基-4’-(2-羥基乙氧基)-2-甲基苯丙酮、2-異亞硝基苯丙酮、2-苯基-2-(對甲苯磺醯氧基)苯乙酮(BAPO)、樟腦醌。
又,熱或光自由基發生劑之添加量宜相對於樹脂100質量份為0.1~50質量份之範圍較理想。
又,也可以添加有多數的(甲基)丙烯酸酯、硫醇的交聯劑。藉此,能夠使自由基交聯的效率更好。
也可以添加有烷基、芳基之單體、有含矽基、經氟取代之烷基、芳基之單體。藉此,能夠使溶液之黏度下降,形成更薄膜之伸縮性膜。該等單體若有聚合性雙鍵,則膜硬化時會在膜中固定化。
有烷基、芳基之單體,可列舉丙烯酸異莰酯、丙烯酸月桂酯、丙烯酸十四酯、硬脂基丙烯酸酯、丙烯酸異硬脂酯、丙烯酸二十二酯、丙烯酸金剛烷酯、苯氧基乙二醇丙烯酸酯、苯氧基二乙二醇丙烯酸酯、2~6官能之丙烯酸酯。2官能之丙烯酸酯可列舉1,6-己烷二醇二丙烯酸酯、1,9-壬烷二醇二丙烯酸酯、異壬烷二醇二丙烯酸酯、1,10-癸烷二醇二丙烯酸酯、新戊二醇二丙烯酸酯、2-羥基-3-甲基丙烯酸基丙基丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、二丙二醇二丙烯酸酯、三丙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、聚四亞甲基二醇二丙烯酸酯、聚乙烯聚丙二醇二丙烯酸酯、二㗁烷二醇二丙烯酸酯、三環癸烷二甲醇二丙烯酸酯、9,9-雙[4-(2-羥基乙氧基)苯基]茀丙烯酸酯、乙氧基化雙酚A二丙烯酸酯、丙氧基化雙酚A二丙烯酸酯、乙氧基化丙氧基化雙酚A二丙烯酸酯,3官能之丙烯酸酯可列舉三羥甲基丙烷三丙烯酸酯、 乙氧基化三羥甲基丙烷三丙烯酸酯、丙氧基化三羥甲基丙烷三丙烯酸酯、甘油三丙烯酸酯、乙氧基化甘油三丙烯酸酯、丙氧基化甘油三丙烯酸酯、參(2-丙烯醯氧基乙基)異氰尿酸酯、己內酯改性參(2-丙烯醯氧基乙基)異氰尿酸酯、新戊四醇三丙烯酸酯,4官能之丙烯酸酯可列舉新戊四醇四丙烯酸酯、乙氧基化新戊四醇四丙烯酸酯、丙氧基化新戊四醇四丙烯酸酯、二(三羥甲基)丙烷四丙烯酸酯、乙氧基化二(三羥甲基)丙烷四丙烯酸酯、丙氧基化二(三羥甲基)丙烷四丙烯酸酯, 5-6官能之丙烯酸酯可列舉二新戊四醇聚丙烯酸酯、乙氧基化二新戊四醇聚丙烯酸酯、丙氧基化二新戊四醇聚丙烯酸酯。也可使用前述丙烯酸酯變更為甲基丙烯酸酯而得的單體。
作為形成本發明之伸縮性膜之方法可列舉將上述伸縮性膜材料組成物塗佈在平板基板上、輥上的方法。塗佈伸縮性膜材料組成物之方法,例如:旋塗、桿塗、輥塗、流塗、浸塗、噴塗、刮刀塗佈等。又,宜進行塗佈使塗佈膜厚成為1μm~2mm較佳。
針對有凹凸之零件之密封,宜為使用了柔軟的刮刀的棒塗、輥塗、噴塗等方法、利用網版印刷等僅塗佈在必要部分之方法較佳。又,為了實施各種的塗佈、印刷,需調整混合溶液之黏度。欲為低黏度時則混合有機溶劑,欲為高黏度時則混合二氧化矽等填充劑。
有機溶劑宜為在大氣壓之沸點為115~200℃之範圍的有機溶劑較佳。具體而言,宜選用2-辛酮、2-壬酮、2-庚酮、3-庚酮、4-庚酮、2-己酮、3-己酮、二異丁基酮、甲基環己酮、苯乙酮、甲基苯乙酮、乙酸丙酯、乙酸丁酯、乙酸異丁酯、乙酸戊酯、乙酸丁烯酯、乙酸異戊酯、乙酸苯酯、甲酸丙酯、甲酸丁酯、甲酸異丁酯、甲酸戊酯、甲酸異戊酯、戊酸甲酯、戊烯酸甲酯、巴豆酸甲酯、巴豆酸乙酯、丙二醇單甲醚、乙二醇單甲醚、丙二醇單乙醚、乙二醇單乙醚、丙二醇二甲醚、二乙二醇二甲醚、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯中之1種以上較佳。
利用加熱使末端具有(甲基)丙烯酸酯基之化合物硬化時,加熱硬化例如可藉由熱板、烘箱中或遠紅外線之照射來實施。加熱條件宜為30~150℃、10秒~60分鐘較理想,50~120℃、30秒~20分鐘更理想。烘烤環境為大氣中、鈍性氣體中、真空中皆無妨。
利用照光使末端具有(甲基)丙烯酸酯基之化合物硬化時,照光所為之硬化宜利用波長200~500nm之光進行較佳。光源,例如可使用鹵素燈、氙燈、準分子雷射、金屬鹵化物燈、LED等。又,也可為電子束之照射。照射量設為1mJ/cm2
~100 J/cm2
之範圍較佳。
本發明之伸縮性膜不僅可作為單獨的自立膜使用,也可形成在纖維上、膜上。又,也可作為覆蓋伸縮性配線、器件之膜使用。
在此,圖1~7顯示本發明之伸縮性膜之使用例。圖1係從生物體電極側觀看本發明之伸縮性膜6上所形成之心電計1的概略圖。又,圖2係顯示本發明之伸縮性膜6形成在基板7上之狀態之剖面圖,圖3係顯示在伸縮性膜6上形成了心電計1之狀態之剖面圖,圖4係圖3之心電計1之伸縮之配線3與中心器件4以伸縮性膜6覆蓋之狀態之剖面圖,圖1之心電計1係專利文獻1記載者。如圖1,心電計1係3個生物體電極2以通電電訊號之配線3連接,並且連到中心器件4。
配線3的材料一般而言使用金、銀、鉑、鈦、不銹鋼等金屬、碳等導電性材料。又,為了展現伸縮性,可如專利文獻1記載製成蛇腹形狀之配線,也可在伸縮性薄膜上貼附前述導電性材料的粉末、線化的導電性材料、或印刷含有前述導電性材料的導電印墨、或使用導電性材料與纖維複合成的導電性布來形成配線3。
心電計1需貼附在皮膚,故圖3、4中,為了不使生物體電極2脫離皮膚,在生物體電極2的周邊配置有黏接部5。又,生物體電極2有黏接性時,不一定需要有周邊之黏接部5。
如圖1,在係本發明之伸縮性膜的伸縮性膜6上製作此心電計1。伸縮性膜6中係以表面的發黏少的聚矽氧主鏈型胺甲酸酯層6-2來覆蓋聚矽氧懸吊型胺甲酸酯層6-1,故在其上利用網版印刷等進行印刷時,脫版性良好。脫版性不良時,脫版時會造成印墨剝離,有時印墨不轉印在伸縮膜上,不理想。
也可進一步如圖4所示,以本發明之伸縮性膜6來覆蓋伸縮性的配線3。
再者,也可如圖5,使於圖2形成的伸縮性膜翻轉,於另一側形成同樣之伸縮性膜。使用了此情形之伸縮性膜之心電計之剖面圖示於圖6或圖7。
若為如以上說明之本發明之伸縮性膜之形成方法,可以輕易地形成具有和聚胺甲酸酯為同程度或更好的優良的伸縮性及強度且膜表面有高撥水性及低黏性的伸縮性膜。
[實施例]
以下使用實施例及比較例對於本發明具體說明,但本發明不限於此等。又,重量平均分子量(Mw)代表利用GPC測得之聚苯乙烯換算之重量平均分子量。
在伸縮性膜形成用組成物中作為末端具(甲基)丙烯酸酯基之化合物而摻合的懸吊了聚矽氧之胺甲酸酯(甲基)丙烯酸酯1~8、聚矽氧胺甲酸酯(甲基)丙烯酸酯1~5,如下所示。
伸縮性膜形成用組成物中摻合之作為添加劑之光自由基發生劑1~3如下所示。
光自由基發生劑1:二苯基(2,4,6-三甲基苯甲醯基)氧化膦
光自由基發生劑2:2,2-二甲氧基-2-苯基苯乙酮
光自由基發生劑3:(±)-樟腦醌
伸縮性膜形成用組成物中摻合之有機溶劑如下所示。
有機溶劑:丙二醇單甲醚乙酸酯(PGMEA)
伸縮性膜形成用組成物中摻合之具有烷基、芳基之單體如下所示。
具有烷基、芳基之單體:丙烯酸異莰酯
[實施例、比較例]
按照表1記載之組成,將末端具有(甲基)丙烯酸酯基之聚矽氧胺甲酸酯化合物、光自由基發生劑1~3、有機溶劑混合,製備成伸縮性膜形成用組成物(伸縮性膜材料1~12、比較伸縮性材料1、2)。
(伸縮性膜之製作)
在聚乙烯基板上以塗佈棒塗佈伸縮性材料1~12、比較伸縮性材料1、2,於100℃烘烤5分鐘,於基板上製作成伸縮性膜。之後於氮氣環境下以1,000W的氙燈照射500mJ/cm2
之光,使伸縮性膜硬化。
(膜厚、接觸角、伸縮率、強度之測定)
測定硬化後之伸縮性膜(實施例1~12、比較例1、2)之膜厚、及表面之水之接觸角,並求以手指觸摸時的黏感。又,測定伸縮性膜表面之水之接觸角後,從基板將伸縮性膜剝離,依據JIS K 6251之方法測定伸縮率及強度。結果示於表2。
如表2,本發明之伸縮性膜,撥水性、強度、伸縮性高,且表面之黏性低。
另一方面,比較例1之由懸吊了聚矽氧之胺甲酸酯單獨材料製得的膜,撥水性、強度、伸縮性高但是表面有黏性,膜彼此黏連,比較例2之由聚矽氧主鏈型胺甲酸酯單獨材料製得的膜,表面沒有黏性但是強度差。
由以上可知若為本發明之伸縮性膜,因為有優良的伸縮性及強度且膜表面之撥水性及低黏性優異,所以具有穿戴式器件等中使用的伸縮性的配線可印刷、 作為覆蓋伸縮性配線、器件之膜的優良的特性。
又,本發明不限於上述實施形態。上述實施形態係例示,凡和本發明之申請專利範圍記載之技術思想有實質上相同構成且發揮同樣作用效果者皆包括在本發明之技術範圍內。
1‧‧‧心電計
2‧‧‧生物體電極
3‧‧‧配線
4‧‧‧中心器件
5‧‧‧黏接部
6‧‧‧伸縮性膜
6-1‧‧‧聚矽氧懸吊型胺甲酸酯層
6-2‧‧‧聚矽氧主鏈型胺甲酸酯層
7‧‧‧基板
【圖1】顯示從生物體電極側觀察形成在本發明之伸縮性膜上之心電計的概略圖。
【圖2】顯示本發明之伸縮性膜形成在基板上之狀態之剖面圖。
【圖3】顯示在本發明之伸縮性膜上形成心電計之狀態之剖面圖。
【圖4】顯示以伸縮性膜覆蓋圖3之配線與中心器件之狀態之剖面圖。
【圖5】顯示使圖2製作的膜在基板上翻轉,並於其上重疊伸縮性膜而製作之狀態之剖面圖。
【圖6】顯示在圖5之伸縮性膜上形成心電計之狀態之剖面圖。
【圖7】顯示以伸縮性膜之圖6之配線與中心器件之狀態之剖面圖。
1‧‧‧心電計
2‧‧‧生物體電極
3‧‧‧配線
4‧‧‧中心器件
5‧‧‧黏接部
6‧‧‧伸縮性膜
Claims (9)
- 一種伸縮性膜材料組成物,其特徵為:含有具下列通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯及具下列通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯;該聚矽氧主鏈型胺甲酸酯之含有比例為該聚矽氧懸吊型胺甲酸酯之50質量%以下;
式中,R1、R4為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基;R2、R3、R5為同一、非同一之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基;R6、R11、R12、R13為同一、非同一之碳數1~6之直鏈狀、分支狀、 環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2R3)s-OSiR2R3R5基;R7、R9為單鍵、亞甲基、或伸乙基,R7及R9之碳數之合計為1或2;R8為氫原子或碳數1~4之直鏈狀之烷基,R10為氫原子或甲基;A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可以有醚基;m、n為1~100之範圍之整數,p為2~10之範圍之整數,q、r、s為0~20之範圍之整數。 - 如申請專利範圍第1或2項之伸縮性膜材料組成物,其中,該聚矽氧主鏈型胺甲酸之含有比例為該聚矽氧懸吊型胺甲酸酯之25質量%以下。
- 如申請專利範圍第1或2項之伸縮性膜材料組成物,其中,該聚矽氧主鏈型胺甲酸酯之含有比例為該聚矽氧懸吊型胺甲酸酯之15質量%以下。
- 一種伸縮性膜,含有如申請專利範圍第1至5項中任一項之伸縮性膜材料組成物且該聚矽氧主鏈型胺甲酸酯配向在表面。
- 如申請專利範圍第6項之伸縮性膜,其中,該伸縮性膜在JIS K 6251規定之拉伸試驗中的伸縮率為20~1000%之範圍內。
- 如申請專利範圍第6或7項之伸縮性膜,其中,該伸縮性膜係作為接觸具有伸縮性之導電性配線的膜使用。
- 一種伸縮性膜之形成方法,其特徵為:將如申請專利範圍第1至5項中任一項之伸縮性膜材料組成物成膜後,利用加熱及/或照光進行硬化。
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