TWI691570B - Adhesive composition, adhesive sheet and display - Google Patents
Adhesive composition, adhesive sheet and display Download PDFInfo
- Publication number
- TWI691570B TWI691570B TW105119070A TW105119070A TWI691570B TW I691570 B TWI691570 B TW I691570B TW 105119070 A TW105119070 A TW 105119070A TW 105119070 A TW105119070 A TW 105119070A TW I691570 B TWI691570 B TW I691570B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- meth
- adhesive composition
- adhesive layer
- mass
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 212
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 212
- 239000000203 mixture Substances 0.000 title claims abstract description 86
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 59
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 47
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 43
- 239000012790 adhesive layer Substances 0.000 claims description 137
- 239000000178 monomer Substances 0.000 claims description 59
- 239000003431 cross linking reagent Substances 0.000 claims description 32
- 239000000470 constituent Substances 0.000 claims description 22
- 229920000642 polymer Polymers 0.000 claims description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 15
- 238000004132 cross linking Methods 0.000 claims description 10
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 4
- 238000013508 migration Methods 0.000 abstract description 26
- 230000005012 migration Effects 0.000 abstract description 26
- 230000001568 sexual effect Effects 0.000 abstract description 2
- 206010040844 Skin exfoliation Diseases 0.000 description 76
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 64
- 239000010408 film Substances 0.000 description 57
- -1 benzotriazole compound Chemical class 0.000 description 41
- 239000010410 layer Substances 0.000 description 26
- 239000010409 thin film Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 239000011247 coating layer Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 16
- 229920000139 polyethylene terephthalate Polymers 0.000 description 16
- 239000005020 polyethylene terephthalate Substances 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 15
- 238000012360 testing method Methods 0.000 description 14
- 230000003254 anti-foaming effect Effects 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 13
- 239000002904 solvent Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 11
- 230000002265 prevention Effects 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000007667 floating Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000002087 whitening effect Effects 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 239000003999 initiator Substances 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 7
- 238000005227 gel permeation chromatography Methods 0.000 description 7
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 238000010790 dilution Methods 0.000 description 6
- 239000012895 dilution Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 239000005056 polyisocyanate Substances 0.000 description 6
- 229920001228 polyisocyanate Polymers 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 210000001787 dendrite Anatomy 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- 239000005361 soda-lime glass Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 229910003437 indium oxide Inorganic materials 0.000 description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 4
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- MFLLXRJTHGPGEB-UHFFFAOYSA-N 1-propylperoxypropane Chemical compound CCCOOCCC MFLLXRJTHGPGEB-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- RLUFBDIRFJGKLY-UHFFFAOYSA-N (2,3-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1Cl RLUFBDIRFJGKLY-UHFFFAOYSA-N 0.000 description 1
- HGXJDMCMYLEZMJ-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOOC(=O)C(C)(C)C HGXJDMCMYLEZMJ-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- MZVABYGYVXBZDP-UHFFFAOYSA-N 1-adamantyl 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC2CC1(OC(=O)C(=C)C)C3 MZVABYGYVXBZDP-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CZZVAVMGKRNEAT-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)CO.OCC(C)(C)C(O)=O CZZVAVMGKRNEAT-UHFFFAOYSA-N 0.000 description 1
- YRTNMMLRBJMGJJ-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;hexanedioic acid Chemical compound OCC(C)(C)CO.OC(=O)CCCCC(O)=O YRTNMMLRBJMGJJ-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 1
- XOGPDSATLSAZEK-UHFFFAOYSA-N 2-Aminoanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(N)=CC=C3C(=O)C2=C1 XOGPDSATLSAZEK-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- VUDVPVOIALASLB-UHFFFAOYSA-N 2-[(2-cyano-1-hydroxypropan-2-yl)diazenyl]-3-hydroxy-2-methylpropanenitrile Chemical compound OCC(C)(C#N)N=NC(C)(CO)C#N VUDVPVOIALASLB-UHFFFAOYSA-N 0.000 description 1
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- YJQMXVDKXSQCDI-UHFFFAOYSA-N 2-ethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3SC2=C1 YJQMXVDKXSQCDI-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- WWUVJRULCWHUSA-UHFFFAOYSA-N 2-methyl-1-pentene Chemical group CCCC(C)=C WWUVJRULCWHUSA-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- NFPBWZOKGZKYRE-UHFFFAOYSA-N 2-propan-2-ylperoxypropane Chemical compound CC(C)OOC(C)C NFPBWZOKGZKYRE-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- QPIRYFWCAHUZTB-UHFFFAOYSA-N 3,5,5-trimethyl-1-(3,5,5-trimethylhexylperoxy)hexane Chemical compound CC(C)(C)CC(C)CCOOCCC(C)CC(C)(C)C QPIRYFWCAHUZTB-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- LOOUJXUUGIUEBC-UHFFFAOYSA-N 3-(dimethoxymethylsilyl)propane-1-thiol Chemical compound COC(OC)[SiH2]CCCS LOOUJXUUGIUEBC-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- WHNPOQXWAMXPTA-UHFFFAOYSA-N 3-methylbut-2-enamide Chemical compound CC(C)=CC(N)=O WHNPOQXWAMXPTA-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000004420 Iupilon Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- OEFBSWQIIDQIIG-UHFFFAOYSA-N N,N-dimethylaniline propan-2-one Chemical compound CC(C)=O.CN(C)c1ccccc1 OEFBSWQIIDQIIG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000013556 antirust agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- LWMFAFLIWMPZSX-UHFFFAOYSA-N bis[2-(4,5-dihydro-1h-imidazol-2-yl)propan-2-yl]diazene Chemical compound N=1CCNC=1C(C)(C)N=NC(C)(C)C1=NCCN1 LWMFAFLIWMPZSX-UHFFFAOYSA-N 0.000 description 1
- QDVNNDYBCWZVTI-UHFFFAOYSA-N bis[4-(ethylamino)phenyl]methanone Chemical compound C1=CC(NCC)=CC=C1C(=O)C1=CC=C(NCC)C=C1 QDVNNDYBCWZVTI-UHFFFAOYSA-N 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- LISYQMGBXPZIPS-UHFFFAOYSA-N carboxyoxy 2-ethoxyethyl carbonate Chemical compound CCOCCOC(=O)OOC(O)=O LISYQMGBXPZIPS-UHFFFAOYSA-N 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000005345 chemically strengthened glass Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000009791 electrochemical migration reaction Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000005825 oxyethoxy group Chemical group [H]C([H])(O[*:1])C([H])([H])O[*:2] 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- SUVIGLJNEAMWEG-UHFFFAOYSA-N propane-1-thiol Chemical compound CCCS SUVIGLJNEAMWEG-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000005691 triesters Chemical class 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/548—Silicon-containing compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Polymerisation Methods In General (AREA)
Abstract
本發明提供一種能夠有效地防止並抑制遷移之黏著性組成物、黏著片及顯示體。該黏著性組成物形成用於將至少在貼合之側的面具有段差之第1顯示體構成構件與第2顯示體構成構件進行貼合之黏著劑,其中,第1顯示體構成構件和/或第2顯示體構成構件至少在貼合之側的面具有電極,黏著性組成物含有(甲基)丙烯酸酯聚合物(A)、具有巰基之矽烷偶合劑(B)、及活性能量射線硬化性成分(C)。 The present invention provides an adhesive composition, adhesive sheet, and display that can effectively prevent and suppress migration. The adhesive composition forms an adhesive for bonding a first display component member and a second display component member having a step difference at least on the side of the bonding, wherein the first display component member and/ Or the second display component member has an electrode at least on the side of the bonding side, the adhesive composition contains (meth)acrylate polymer (A), a silane coupling agent (B) having a mercapto group, and active energy ray hardening Sexual component (C).
Description
本發明係有關一種能夠使用於觸摸面板等顯示體之黏著性組成物及黏著片、以及使用該等之顯示體者。 The present invention relates to an adhesive composition and adhesive sheet that can be used for a display body such as a touch panel, and a display body using the same.
近年來,智慧型手機、平板電腦等各種行動電子裝置中,多使用觸摸面板作為顯示器。作為觸摸面板的方式,有電阻膜方式、靜電容量方式等,在如上述之行動電子裝置中主要採用靜電容量方式。 In recent years, various mobile electronic devices such as smartphones and tablet computers have used touch panels as displays. As a touch panel method, there are a resistive film method, an electrostatic capacitance method, and the like, and the electrostatic capacitance method is mainly used in the mobile electronic device as described above.
最近謀求觸摸面板的大型化,作為該種觸摸面板用的電極材料,正在對網狀的金屬電極、例如銅電極或銀電極進行研究。但是,若使習知的黏著劑與金屬電極、尤其銅電極或銀電極接觸而使用,則有時會發生離子遷移(=電化學遷移(Electrochemical migration);以下,簡稱為“遷移”。)。具體而言,在正極中電極溶解而發生斷線,或者在負極中由正極成分的析出形成樹枝結晶而發生短路。 Recently, large-scale touch panels have been sought, and as such electrode materials for touch panels, research is being conducted on mesh-shaped metal electrodes, such as copper electrodes or silver electrodes. However, if a conventional adhesive is used in contact with a metal electrode, especially a copper electrode or a silver electrode, ion migration (=electrochemical migration; hereinafter, simply referred to as "migration") may occur. Specifically, in the positive electrode, the electrode dissolves to cause wire breakage, or in the negative electrode, the precipitation of the positive electrode component forms dendrite crystals to cause a short circuit.
在高溫高濕下對電極施加電壓時尤其容易發生該遷移。若發生該種遷移,則觸摸面板無法正常驅動。尤其最近,電極的微細化及窄間距化正在發展中,容易發生由遷移引起之電極的斷線、短路。 This migration is particularly likely to occur when a voltage is applied to the electrode under high temperature and high humidity. If such a migration occurs, the touch panel cannot be driven normally. Especially recently, the miniaturization of electrodes and the narrowing of the pitch are under development, and the disconnection and short circuit of the electrodes due to migration are likely to occur.
然而,專利文獻1中已經揭示含有苯并三唑化合
物作為防鏽劑之觸摸面板用黏著劑組成物。
However,
專利文獻1:日本特開2014-177611號公報 Patent Document 1: Japanese Patent Laid-Open No. 2014-177611
但是,作為防鏽劑之苯并三唑化合物即便具有金屬配線的防腐蝕效果,亦無法充分防止並抑制遷移。 However, even if the benzotriazole compound as a rust inhibitor has an anticorrosive effect for metal wiring, it cannot sufficiently prevent and suppress migration.
本發明係鑑於如上述之實際情況而完成者,其目的為提供一種能夠有效地防止並抑制遷移之黏著性組成物、黏著片及顯示體。 The present invention has been completed in view of the above-mentioned actual circumstances, and its object is to provide an adhesive composition, an adhesive sheet, and a display that can effectively prevent and suppress migration.
為了實現上述目的,第一、本發明提供一種黏著性組成物,其形成用於將至少在貼合之側的面具有段差之第1顯示體構成構件與第2顯示體構成構件進行貼合之黏著劑,該黏著性組成物的特徵為:前述第1顯示體構成構件和/或前述第2顯示體構成構件至少在貼合之側的面具有電極,前述黏著性組成物含有(甲基)丙烯酸酯聚合物(A)、具有巰基之矽烷偶合劑(B)、及活性能量射線硬化性成分(C)(發明1)。 In order to achieve the above object, first, the present invention provides an adhesive composition formed to bond a first display body constituent member and a second display body constituent member having a step difference at least on the side of the bonding side An adhesive, wherein the adhesive composition is characterized in that the first display component member and/or the second display component member has an electrode at least on the surface on the side to be bonded, and the adhesive composition contains (methyl) An acrylate polymer (A), a silane coupling agent having a mercapto group (B), and an active energy ray-curable component (C) (Invention 1).
依由上述發明(發明1)之黏著性組成物得到之黏著劑,尤其藉由具有巰基之矽烷偶合劑(B)的作用,能夠有效地防止並抑制該黏著劑在所接觸之第1顯示體構成構件和/或第2顯示體構成構件的電極中之遷移。 The adhesive obtained from the adhesive composition of the above invention (Invention 1), especially by the action of a silane coupling agent (B) having a mercapto group, can effectively prevent and suppress the adhesive from contacting the first display body Migration among the electrodes constituting the member and/or the second display member.
上述發明(發明1)中,前述具有巰基之矽烷偶合劑(B)係含巰基之寡聚物型矽烷偶合劑為較佳(發明2)。 In the above invention (Invention 1), the thiol group-containing silane coupling agent (B) is preferably a mercapto group-containing oligomer type silane coupling agent (Invention 2).
上述發明(發明1、2)中,構成前述具有巰基之矽烷偶合劑(B)之有機矽化合物的巰基當量為100g/莫耳以上且1000g/莫耳以下為較佳(發明3)。
In the above inventions (
上述發明(發明1~3)中,前述黏著性組成物中之前述具有巰基之矽烷偶合劑(B)的含有量相對於前述(甲基)丙烯酸酯聚合物(A)100質量份為0.01質量份以上且5質量份以下為較佳(發明4)。
In the above invention (
上述發明(發明1~4)中,前述黏著性組成物中之前述活性能量射線硬化性成分(C)的含有量相對於前述(甲基)丙烯酸酯聚合物(A)100質量份為0.5質量份以上且50質量份以下為較佳(發明5)。
In the above invention (
上述發明(發明1~5)中,前述(甲基)丙烯酸酯聚合物(A)含有3質量%以上且35質量%以下的含羥基單體來作為構成該聚合物之單體單元為較佳(發明6)。
In the above invention (
上述發明(發明1~6)中,前述黏著性組成物還含有交聯劑(D)為較佳(發明7)。
In the above inventions (
第二、本發明提供一種黏著片,其特徵為:具有使前述黏著性組成物(發明1~7)熱交聯而成之硬化前黏著劑層(發明8)。
Second, the present invention provides an adhesive sheet characterized by having a pre-hardened adhesive layer (Invention 8) formed by thermally cross-linking the aforementioned adhesive composition (
上述發明(發明8)中,前述黏著片包括兩片剝離片,前述黏著劑層以與前述兩片剝離片的剝離面接觸之方式被前述剝離片所夾持為較佳(發明9)。 In the above invention (Invention 8), the adhesive sheet includes two release sheets, and the adhesive layer is preferably held between the release sheets so as to be in contact with the release surfaces of the two release sheets (Invention 9).
第三、本發明提供一種顯示體,其包括:至少在 貼合之側的面具有段差之第1顯示體構成構件;第2顯示體構成構件;及將前述第1顯示體構成構件與前述第2顯示體構成構件相互貼合之黏著劑層,該顯示體的特徵為:前述第1顯示體構成構件和/或前述第2顯示體構成構件至少在貼合之側的面具有電極,前述黏著劑層係藉由活性能量射線的照射使前述黏著片(發明8、9)的硬化前黏著劑層硬化而得到者(發明10)。 Third, the present invention provides a display body, which includes: at least The surface of the bonded side has a first display component member having a step difference; a second display component member; and an adhesive layer for bonding the first display component member and the second display component member to each other, the display The feature of the body is that the first display body constituent member and/or the second display body constituent member have electrodes at least on the surface on the side where they are bonded, and the adhesive layer is formed by irradiating the active energy ray to the adhesive sheet ( Invention 8 and 9) obtained by hardening the adhesive layer before curing (Invention 10).
依本發明之黏著性組成物、黏著片及顯示體,能夠有效地防止並抑制遷移。 The adhesive composition, adhesive sheet and display according to the present invention can effectively prevent and suppress migration.
1‧‧‧黏著片 1‧‧‧ Adhesive sheet
10‧‧‧硬化前黏著劑層 10‧‧‧adhesive layer before hardening
12a、12b‧‧‧剝離片 12a, 12b ‧‧‧ peeling sheet
2‧‧‧觸控面板 2‧‧‧Touch panel
3‧‧‧顯示體模組 3‧‧‧Display module
4、11‧‧‧黏著劑層 4, 11‧‧‧ adhesive layer
5a‧‧‧第1薄膜感測器 5a‧‧‧The first thin film sensor
5b‧‧‧第2薄膜感測器 5b‧‧‧The second thin film sensor
51‧‧‧基材薄膜 51‧‧‧ Base film
52‧‧‧印刷層 52‧‧‧Printed layer
6‧‧‧覆蓋材 6‧‧‧Cover material
7‧‧‧印刷層 7‧‧‧Printed layer
第1圖係本發明的一實施形態之黏著片的剖面圖。 Fig. 1 is a cross-sectional view of an adhesive sheet according to an embodiment of the present invention.
第2圖係表示觸摸面板的一構成例之剖面圖。 FIG. 2 is a cross-sectional view showing a configuration example of a touch panel.
第3圖係試驗例3的遷移防止效果評價中之評價基準的參考圖像。 FIG. 3 is a reference image of an evaluation criterion in the evaluation of the migration prevention effect of Test Example 3.
以下,對本發明的實施形態進行說明。 Hereinafter, embodiments of the present invention will be described.
〔黏著性組成物〕 [Adhesive composition]
本實施形態之黏著性組成物(以下,有時稱為“黏著性組成物P”。)係形成於將至少在貼合之側的面具有段差之第1顯示體構成構件與第2顯示體構成構件進行貼合之黏著劑之黏著性組成物,第1顯示體構成構件和/或第2顯示體構成構件至少在貼合之側的面具有電極。並且,黏著性組成物P含有(甲 基)丙烯酸酯聚合物(A)、具有巰基之矽烷偶合劑(B)、及活性能量射線硬化性成分(C),還含有交聯劑(D)為較佳。 The adhesive composition of the present embodiment (hereinafter, sometimes referred to as "adhesive composition P") is formed on the first display body constituent member and the second display body that have a step difference at least on the surface on the side to be bonded The adhesive composition of the adhesive to which the constituent members are bonded, the first display body constituent member and/or the second display body constituent member have electrodes on at least the surface on the side where they are bonded. In addition, the adhesive composition P contains (a Group) acrylate polymer (A), a silane coupling agent having a mercapto group (B), and an active energy ray-curable component (C), and further containing a crosslinking agent (D) is preferred.
其中,本發明中之“黏著劑”係指使黏著性組成物熱交聯而得到之硬化前黏著劑藉由活性能量射線的照射硬化者。同樣地,“黏著劑層”係指使黏著性組成物熱交聯而形成之硬化前黏著劑層藉由活性能量射線的照射硬化之層。並且,本說明書中,(甲基)丙烯酸酯係指丙烯酸酯及甲基丙烯酸酯這兩者。其他類似術語亦相同。另外,“聚合物”中亦包含“共聚物”的概念。另外,關於顯示體及顯示體構成構件將於後述。 The "adhesive" in the present invention refers to a person that is cured by irradiation of active energy rays before curing the adhesive obtained by thermally crosslinking the adhesive composition. Similarly, the "adhesive layer" refers to a layer that is hardened by irradiation of active energy rays before the hardened adhesive layer formed by thermally crosslinking the adhesive composition. In this specification, (meth)acrylate refers to both acrylate and methacrylate. Other similar terms are also the same. In addition, the concept of "copolymer" is also included in "polymer". In addition, the display and the display component will be described later.
藉由本實施形態之黏著性組成物P含有具有巰基之矽烷偶合劑(B),當由黏著性組成物P得到之黏著劑與電極接觸時,在正極中可以防止並抑制電極溶解,在負極中可以防止並抑制形成樹枝結晶。亦即,可以有效地防止並抑制在電極中之遷移(有時將本效果稱為“遷移防止效果”)。藉此,即使上述黏著劑與例如被微細化、窄間距化之電極接觸時,亦可以防止電極的斷線及短路。尤其,當上述電極為觸摸面板的電極時,可以防止由電極的斷線及短路引起之觸摸面板的驅動不良。 Since the adhesive composition P of this embodiment contains a silane coupling agent (B) having a mercapto group, when the adhesive obtained from the adhesive composition P comes into contact with the electrode, the positive electrode can prevent and suppress the dissolution of the electrode, and the negative electrode Can prevent and inhibit the formation of dendrite crystals. That is, it is possible to effectively prevent and suppress migration in the electrode (this effect is sometimes referred to as "migration prevention effect"). With this, even when the above-mentioned adhesive comes into contact with, for example, an electrode that is made finer and narrower in pitch, it is possible to prevent wire breakage and short circuit of the electrode. In particular, when the electrode is an electrode of a touch panel, it is possible to prevent defective driving of the touch panel due to disconnection and short circuit of the electrode.
其中,作為上述電極,例如可以舉出由銅、銀等構成之金屬電極(包括網狀、柵狀者)、由錫摻雜氧化銦(ITO)等構成之透明導電膜(包含圖案化者)等。在上述電極中,將以未氧化之金屬為主成分之金屬電極、具體而言由銅或銀構成之金屬電極為較佳。與ITO等金屬氧化物相比,未氧化之金屬 的離子化傾向較高,但依由本實施形態之黏著性組成物P得到之黏著劑,即使在該情況下,亦可以有效地防止電極的斷線及短路。 Among them, as the above-mentioned electrode, for example, a metal electrode composed of copper, silver, etc. (including a mesh, a grid), a transparent conductive film composed of tin-doped indium oxide (ITO), etc. (including a patterned one) Wait. Among the above electrodes, a metal electrode mainly composed of an unoxidized metal, specifically, a metal electrode composed of copper or silver is preferred. Compared with metal oxides such as ITO, unoxidized metals Although the ionization tendency is high, the adhesive obtained from the adhesive composition P of this embodiment can effectively prevent disconnection and short circuit of the electrode even in this case.
並且,由含有具有巰基之矽烷偶合劑(B)之黏著性組成物P得到之黏著劑層在與作為被黏物之顯示體構成構件之界面存在源自具有巰基之矽烷偶合劑(B)之成分,藉此成為與顯示體構成構件之黏附性較高且段差追隨性優異者。具體而言,即使在將使黏著性組成物P熱交聯而形成之硬化前黏著劑層貼附於具有段差之顯示體構成構件並使該硬化前黏著劑層藉由活性能量射線的照射硬化而作為黏著劑層之後,暴露在高溫高濕條件(例如,在85℃、85%RH下72小時)之情況下,亦可以抑制在段差附近產生氣泡、浮起、剝離等(高溫高濕條件下之段差追隨性優異)。藉此,可以抑制在段差附近產生光的反射損失,能夠良好地維持顯示體的畫質。 In addition, the adhesive layer obtained from the adhesive composition P containing the silane coupling agent (B) having a mercapto group exists at the interface with the display member constituting the adherend from the silane coupling agent (B) having a mercapto group The components thereby have high adhesion to the display constituent member and excellent step followability. Specifically, even before the hardened adhesive layer formed by thermally cross-linking the adhesive composition P is attached to the display member having a step difference, the hardened adhesive layer is hardened by irradiation of active energy rays After being used as an adhesive layer, when exposed to high-temperature and high-humidity conditions (for example, at 85°C and 85%RH for 72 hours), it can also suppress the generation of bubbles, floating, peeling, etc. near the step (high-temperature and high-humidity conditions) (The following step is excellent in followability). With this, it is possible to suppress the reflection loss of light in the vicinity of the step difference, and it is possible to maintain the image quality of the display body satisfactorily.
另外,使上述硬化前黏著劑層藉由活性能量射線的照射硬化而成之黏著劑層由於內聚力較高,且顯示比較高的彈性模量,因此抗起泡性優異。並且,在該黏著劑層的與被黏物之界面存在源自具有巰基之矽烷偶合劑(B)之成分,與顯示體構成構件之黏附性較高,因此成為上述抗起泡性更加優異者。例如,即使籍由上述黏著劑層貼合顯示體構成構件之顯示體置於高溫高濕條件下(例如,在85℃、85%RH下72小時)且從由塑膠板等構成之顯示體構成構件產生逸氣之情況下,亦可以抑制在黏著劑層與顯示體構成構件的界面上產生氣泡、浮起、剝離等起泡現象(blister)。 In addition, the adhesive layer formed by hardening the adhesive layer before hardening by irradiation of active energy rays has high cohesion and exhibits a relatively high elastic modulus, so it has excellent anti-foaming properties. In addition, there is a component derived from the silane coupling agent (B) having a mercapto group at the interface between the adhesive layer and the adherend, and the adhesion to the display constituent member is high, so it is more excellent in the above anti-foaming property . For example, even if the display body bonded to the display body structure member by the above-mentioned adhesive layer is placed under high temperature and high humidity conditions (for example, at 85°C, 85%RH for 72 hours) and is composed of a display body composed of a plastic plate or the like In the case of outgassing from the member, it is also possible to suppress the occurrence of blistering phenomena such as bubbles, floating, and peeling on the interface between the adhesive layer and the display member.
(1)(甲基)丙烯酸酯聚合物(A) (1) (Meth)acrylate polymer (A)
(甲基)丙烯酸酯聚合物(A)藉由含有烷基的碳數為1~20的(甲基)丙烯酸烷基酯來作為構成該聚合物之單體單元,能夠顯現較佳的黏著性。從該種觀點考慮,(甲基)丙烯酸酯聚合物(A)含有下限值為50質量%以上的烷基的碳數為1~20的(甲基)丙烯酸烷基酯來作為構成該聚合物之單體單元為較佳,含有60質量%以上尤為佳,含有70質量%以上為進一步較佳。若含有50質量%以上的上述(甲基)丙烯酸烷基酯,則(甲基)丙烯酸酯聚合物(A)能夠發揮較佳的黏著性。並且,(甲基)丙烯酸酯聚合物(A)含有上限值為97質量%以下的上述(甲基)丙烯酸烷基酯來作為構成該聚合物之單體單元為較佳,含有90質量%以下尤為佳,含有85質量%以下為進一步較佳。藉由含有97質量%以下的上述(甲基)丙烯酸烷基酯,能夠將較佳量的其他單體成分導入到(甲基)丙烯酸酯聚合物(A)中。 (Meth) acrylate polymer (A) By containing an alkyl (meth) acrylate alkyl ester having 1 to 20 carbon atoms as a monomer unit constituting the polymer, it can exhibit better adhesion . From this viewpoint, the (meth)acrylate polymer (A) contains an alkyl (meth)acrylate having a lower limit of 50% by mass or more and an alkyl group having 1 to 20 carbon atoms as the constituent polymer The monomer unit of the substance is preferable, and it is more preferably 60% by mass or more, and further preferably 70% by mass or more. If the above (meth)acrylic acid alkyl ester is contained in an amount of 50% by mass or more, the (meth)acrylate polymer (A) can exhibit better adhesion. Further, the (meth)acrylate polymer (A) preferably contains the above-mentioned alkyl (meth)acrylate having an upper limit of 97% by mass or less as a monomer unit constituting the polymer, and contains 90% by mass The following is particularly preferable, and the content of 85% by mass or less is even more preferable. By containing 97 mass% or less of the above-mentioned (meth)acrylic acid alkyl ester, a preferable amount of other monomer components can be introduced into the (meth)acrylate polymer (A).
作為烷基的碳數為1~20的(甲基)丙烯酸烷基酯,例如可以舉出(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛脂、(甲基)丙烯酸正癸酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異冰片酯、(甲基)丙烯酸金剛烷基酯等,其中,從進一步提高黏著性之觀點考慮,含有烷基 的碳數為4~8的(甲基)丙烯酸酯為較佳。該等可以單獨使用,亦可以組合兩種以上使用。另外,烷基的碳數為1~20的(甲基)丙烯酸烷基酯中之烷基係指直鏈狀、支鏈狀或環狀的烷基。 Examples of the alkyl (meth)acrylate having 1 to 20 carbon atoms in the alkyl group include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and (meth) Group) n-butyl acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, (meth)acrylic acid N-decyl ester, n-dodecyl (meth)acrylate, myristyl (meth)acrylate, cetyl (meth)acrylate, octadecyl (meth)acrylate, ( Cyclohexyl meth)acrylate, isobornyl (meth)acrylate, adamantyl (meth)acrylate, etc. Among them, from the viewpoint of further improving the adhesiveness, it contains an alkyl group (Meth)acrylate having 4 to 8 carbon atoms is preferred. These can be used alone or in combination of two or more. In addition, the alkyl group in the alkyl (meth)acrylate having 1 to 20 carbon atoms means a linear, branched or cyclic alkyl group.
並且,作為烷基的碳數為1~20的(甲基)丙烯酸烷基酯,組合使用作為均聚物之玻璃轉變溫度(Tg)超過0℃之(70℃以上為較佳的)硬單體和作為均聚物之玻璃轉變溫度(Tg)為0℃以下的軟單體亦為較佳。這是因為,籍由軟單體保持黏著性及柔軟性,並且由硬單體提高內聚力,藉此能夠設為顯示器面板(觸摸面板)中之段差追隨性及抗起泡性更加優異者。 In addition, as a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms, a combination of a homopolymer having a glass transition temperature (Tg) exceeding 0°C (70°C or more is preferred) is used in combination Also, a soft monomer having a glass transition temperature (Tg) of 0°C or less as a homopolymer is also preferred. This is because the soft monomer maintains the adhesiveness and flexibility, and the hard monomer improves the cohesive force, whereby it can be set to be more excellent in step followability and anti-foaming resistance in a display panel (touch panel).
上述硬單體與軟單體的質量比係5:95~40:60為較佳,20:80~30:70尤為佳。 The mass ratio of the hard monomer to the soft monomer is preferably 5:95~40:60, especially 20:80~30:70.
作為上述硬單體,例如可以舉出丙烯酸甲酯(Tg10℃)、甲基丙烯酸甲酯(Tg105℃)、丙烯酸異冰片酯(Tg94℃)、甲基丙烯酸異冰片酯(Tg180℃)、丙烯酸金剛烷基酯(Tg115℃)、甲基丙烯酸金剛烷基酯(Tg141℃)等。該等可以單獨使用,亦可以組合兩種以上使用。 Examples of the hard monomers include methyl acrylate (Tg10°C), methyl methacrylate (Tg105°C), isobornyl acrylate (Tg94°C), isobornyl methacrylate (Tg180°C), and adamantine Alkyl ester (Tg115°C), adamantyl methacrylate (Tg141°C), etc. These can be used alone or in combination of two or more.
在上述硬單體中,從防止對黏著性及透明性等其他特性之悪影響並且進一步發揮硬單體的性能之觀點考慮,丙烯酸甲酯、甲基丙烯酸甲酯及丙烯酸異冰片酯為較佳。若還考慮黏著性,則丙烯酸甲酯及甲基丙烯酸甲酯更為佳,甲基丙烯酸甲酯尤為佳。 Among the above-mentioned hard monomers, methyl acrylate, methyl methacrylate, and isobornyl acrylate are preferable from the viewpoint of preventing influence on other properties such as adhesion and transparency and further exerting the performance of the hard monomer. If adhesiveness is also considered, methyl acrylate and methyl methacrylate are more preferred, and methyl methacrylate is particularly preferred.
作為上述軟單體,較佳地可以舉出具有碳數為2 ~12的直鏈狀或支鏈狀的烷基之丙烯酸烷基酯。例如,較佳地可以舉出丙烯酸2-乙基己酯(Tg-70℃)、丙烯酸正丁酯(Tg-54℃)等。該等可以單獨使用,亦可以組合兩種以上使用。 As the above soft monomer, preferably, it has a carbon number of 2 ~12 straight chain or branched chain alkyl acrylate alkyl ester. For example, 2-ethylhexyl acrylate (Tg-70°C), n-butyl acrylate (Tg-54°C), etc. are preferably mentioned. These can be used alone or in combination of two or more.
(甲基)丙烯酸酯聚合物(A)含有含反應性官能基單體來作為構成該聚合物之單體單元為較佳。源自該含反應性官能基單體之反應性官能基與後述之交聯劑(D)進行反應,藉此形成交聯結構(三維網狀結構),可以得到具有所希望的內聚力之硬化前黏著劑。 The (meth)acrylate polymer (A) preferably contains a monomer containing a reactive functional group as a monomer unit constituting the polymer. The reactive functional group derived from the reactive functional group-containing monomer reacts with a cross-linking agent (D) described later, thereby forming a cross-linked structure (three-dimensional network structure), and can obtain a desired cohesion before hardening Adhesive.
作為(甲基)丙烯酸酯聚合物(A)中作為構成該聚合物之單體單元而含有之含反應性官能基單體,較佳地可以舉出在分子內具有羥基之單體(含羥基單體)、在分子內具有羧基之單體(含羧基單體)、在分子內具有胺基之單體(含胺基單體)等。在該等之中,與交聯劑(D)之反應性及耐濕熱白化性優異且對電極之悪影響較少的含羥基單體尤為佳。 As the reactive functional group-containing monomer contained in the (meth)acrylate polymer (A) as a monomer unit constituting the polymer, preferably, a monomer having a hydroxyl group in the molecule (hydroxyl group-containing monomer) Monomer), a monomer having a carboxyl group in the molecule (carboxyl group-containing monomer), a monomer having an amine group in the molecule (amine group-containing monomer), etc. Among these, a hydroxyl group-containing monomer excellent in reactivity with the cross-linking agent (D) and resistance to moist heat and whitening, and having little effect on the electrode's hull is particularly preferred.
作為含羥基單體,例如可以舉出(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丁酯、(甲基)丙烯酸4-羥基丁酯等(甲基)丙烯酸羥基烷基酯等。其中,從所得到之(甲基)丙烯酸酯聚合物(A)中之羥基與交聯劑(D)之反應性及與其他單體之共聚性的觀點考慮,(甲基)丙烯酸2-羥基乙酯或(甲基)丙烯酸4-羥基丁酯為較佳。該等可以單獨使用,亦可以組合使用兩種以上。 Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, and 2-(meth)acrylic acid. Hydroxybutyl (meth)acrylate such as hydroxybutyl ester, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and the like. Among them, from the viewpoint of the reactivity of the hydroxyl group in the obtained (meth)acrylate polymer (A) with the crosslinking agent (D) and the copolymerization with other monomers, (meth)acrylic acid 2-hydroxyl Ethyl ester or 4-hydroxybutyl (meth)acrylate is preferred. These can be used alone or in combination of two or more.
作為含羧基單體,例如可以舉出丙烯酸、甲基丙 烯酸、巴豆酸、馬來酸、衣康酸、檸康酸等乙烯性不飽和羧酸。其中,從所得到之(甲基)丙烯酸酯聚合物(A)中之羧基與交聯劑(D)之反應性及與其他單體之共聚性的觀點考慮,丙烯酸為較佳。該等可以單獨使用,亦可以組合使用兩種以上。 Examples of the carboxyl group-containing monomer include acrylic acid and methylpropyl Ethylene acid, crotonic acid, maleic acid, itaconic acid, citraconic acid and other ethylenically unsaturated carboxylic acids. Among them, acrylic acid is preferred from the viewpoint of the reactivity of the carboxyl group and the crosslinking agent (D) in the obtained (meth)acrylate polymer (A) and the copolymerizability with other monomers. These can be used alone or in combination of two or more.
作為含胺基單體,例如可以舉出(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸正丁基胺基乙酯等。該等可以單獨使用,亦可以組合兩種以上使用。 Examples of the amine group-containing monomer include aminoethyl (meth)acrylate and n-butylaminoethyl (meth)acrylate. These can be used alone or in combination of two or more.
(甲基)丙烯酸酯聚合物(A)含有下限值為3質量%以上的含羥基單體來作為構成該聚合物之單體單元為較佳,含有10質量%以上尤為佳,含有15質量%以上為進一步較佳。並且,(甲基)丙烯酸酯聚合物(A)含有上限值為35質量%以下的含羥基單體來作為構成該聚合物之單體單元為較佳,含有30質量%以下尤為佳,含有25質量%以下為進一步較佳。若(甲基)丙烯酸酯聚合物(A)以上述量含有含羥基單體來作為單體單元,則在所得到之黏著劑中會殘留既定量的羥基。羥基係親水性基,若該種親水性基在黏著劑中存在既定量,則即使在黏著劑置於高溫高濕條件下之情況下,與在該高溫高濕條件下浸入黏著劑中之水分之相容性亦良好,其結果,可以抑制恢復常溫常濕時的黏著劑的白化(耐濕熱白化性優異)。 The (meth)acrylate polymer (A) preferably contains a hydroxyl group-containing monomer with a lower limit of 3% by mass or more as a monomer unit constituting the polymer, and preferably contains 10% by mass or more, and contains 15% by mass % Or more is further preferable. Further, the (meth)acrylate polymer (A) preferably contains a hydroxyl group-containing monomer with an upper limit value of 35% by mass or less as a monomer unit constituting the polymer, and particularly preferably contains 30% by mass or less. 25 mass% or less is more preferable. If the (meth)acrylate polymer (A) contains a hydroxyl group-containing monomer as the monomer unit in the above amount, a certain amount of hydroxyl groups will remain in the obtained adhesive. Hydroxyl group hydrophilic group, if the hydrophilic group has a certain amount in the adhesive, even if the adhesive is placed under high temperature and high humidity conditions, and the water immersed in the adhesive under the high temperature and high humidity conditions The compatibility is also good, and as a result, it is possible to suppress the whitening of the adhesive when returning to normal temperature and humidity (excellent moisture-heat whitening resistance).
作為白化抑制程度,施加高溫高濕條件之後恢復常溫常濕時的黏著劑層的霧度值(按照JIS K7136:2000測定之值)係1.0%以下為較佳,0.9%以下尤為佳,0.8%以下為進一步較佳。另外,黏著劑層在常態時亦具有如上述般的霧度值 為較佳。若霧度值為1.0%以下,則透明性非常高,成為適合用於光學用途者。 As the degree of whitening inhibition, the haze value of the adhesive layer (value measured in accordance with JIS K7136: 2000) after returning to normal temperature and humidity after applying high temperature and high humidity conditions is preferably 1.0% or less, more preferably 0.9% or less, 0.8% The following are further preferred. In addition, the adhesive layer also has a haze value as described above under normal conditions Is better. If the haze value is 1.0% or less, the transparency is very high, making it suitable for optical applications.
但是,若如上所述般親水性基在黏著劑中存在既定量,則黏著劑容易吸進水,與該黏著劑接觸之電極中容易發生遷移。但是,本實施形態之黏著性組成物P藉由含有具有巰基之矽烷偶合劑(B),能夠有效地防止並抑制所接觸之電極中發生遷移。 However, if the hydrophilic group exists in the adhesive in a predetermined amount as described above, the adhesive easily absorbs water, and the electrode in contact with the adhesive is likely to migrate. However, the adhesive composition P of this embodiment contains a silane coupling agent (B) having a mercapto group, which can effectively prevent and suppress migration in the contacted electrode.
(甲基)丙烯酸酯聚合物(A)不含含羧基單體來作為構成該聚合物之單體單元為較佳,但容許含有既定量。這是因為,羧基係酸成分,因此通常擔心對象構件的遷移,但由含有具有巰基之矽烷偶合劑(B)之黏著性組成物P得到之黏著劑,即使存在羧基,亦能夠發揮遷移防止效果。具體而言,容許在(甲基)丙烯酸酯聚合物(A)中以5質量%以下、較佳地以2質量%以下的量含有含羧基單體來作為單體單元。 The (meth)acrylate polymer (A) preferably does not contain a carboxyl group-containing monomer as the monomer unit constituting the polymer, but it is allowed to contain a certain amount. This is because the carboxyl acid component is generally concerned about migration of the target member, but the adhesive obtained from the adhesive composition P containing the silane coupling agent (B) having a mercapto group can exert a migration prevention effect even if there is a carboxyl group . Specifically, the (meth)acrylate polymer (A) is allowed to contain a carboxyl group-containing monomer as a monomer unit in an amount of 5% by mass or less, preferably 2% by mass or less.
(甲基)丙烯酸酯聚合物(A)根據需要可以含有其他單體來作為構成該聚合物之單體單元。作為其他單體,還為了不妨礙含反應性官能基單體的作用,係不含具有反應性之官能基之單體為較佳。作為該種其他單體,例如可以舉出(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基丙酯、(甲基)丙烯醯基嗎啉等具有非交聯性的3級胺基之(甲基)丙烯酸酯、(甲基)丙烯醯胺、二甲基丙烯醯胺、乙酸乙烯酯、苯乙烯等。該等可以單獨使用,亦可以組合兩種以上使用。 The (meth)acrylate polymer (A) may contain other monomers as a monomer unit constituting the polymer, if necessary. As other monomers, in order not to hinder the function of the reactive functional group-containing monomer, a monomer containing no reactive functional group is preferred. Examples of such other monomers include methoxyalkyl (meth)acrylates such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate, and (meth)acrylic acid. Non-crosslinkable tertiary amine groups such as N,N-dimethylaminoethyl, (meth)acrylic acid N,N-dimethylaminopropyl, (meth)acryloylmorpholine, etc. (Meth)acrylate, (meth)acrylamide, dimethylacrylamide, vinyl acetate, styrene, etc. These can be used alone or in combination of two or more.
(甲基)丙烯酸酯聚合物(A)的聚合形態可以係無規共聚物,亦可以係嵌段共聚物。 The polymerized form of the (meth)acrylate polymer (A) may be a random copolymer or a block copolymer.
(甲基)丙烯酸酯聚合物(A)的重量平均分子量的下限值係20萬以上為較佳,30萬以上尤為佳,40萬以上為進一步較佳。若(甲基)丙烯酸酯聚合物(A)的重量平均分子量的下限值為上述以上,則所得到之黏著劑成為高溫高濕條件下之段差追隨性更加優異者。另外,本說明書中之重量平均分子量係藉由凝膠滲透層析(GPC)法測定之標準聚苯乙烯換算的值。 The lower limit of the weight average molecular weight of the (meth)acrylate polymer (A) is preferably 200,000 or more, more preferably 300,000 or more, and further preferably 400,000 or more. If the lower limit value of the weight average molecular weight of the (meth)acrylate polymer (A) is the above or more, the obtained adhesive will become more excellent in step followability under high temperature and high humidity conditions. In addition, the weight average molecular weight in this specification is the value of standard polystyrene measured by the gel permeation chromatography (GPC) method.
並且,(甲基)丙烯酸酯聚合物(A)的重量平均分子量的上限值係100萬以下為較佳,90萬以下尤為佳,70萬以下為進一步較佳。若(甲基)丙烯酸酯聚合物(A)的重量平均分子量的上限值為上述以下,則所得到之硬化前黏著劑層成為貼附時的段差追隨性更加優異者。 Furthermore, the upper limit of the weight average molecular weight of the (meth)acrylate polymer (A) is preferably 1 million or less, more preferably 900,000 or less, and further preferably 700,000 or less. If the upper limit of the weight average molecular weight of the (meth)acrylate polymer (A) is equal to or less than the above, the obtained adhesive layer before curing becomes more excellent in step followability when attaching.
另外,在黏著性組成物P中,(甲基)丙烯酸酯聚合物(A)可以單獨使用一種,亦可以組合使用兩種以上。 In addition, in the adhesive composition P, the (meth)acrylate polymer (A) may be used alone or in combination of two or more.
(2)具有巰基之矽烷偶合劑(B) (2) Silane coupling agent with mercapto group (B)
具有巰基之矽烷偶合劑(B)由在分子內具有至少1個巰基、具有至少1個烷氧基矽烷基之有機矽化合物構成。若考慮所得到之黏著劑的用途,則具有巰基之矽烷偶合劑(B)係具有光透過性者、例如實質上透明者為較佳。 The silane coupling agent (B) having a mercapto group is composed of an organic silicon compound having at least one mercapto group and at least one alkoxysilyl group in the molecule. Considering the use of the obtained adhesive, the silane coupling agent (B) having a mercapto group is preferably light-transmissive, for example, substantially transparent.
作為具有巰基之矽烷偶合劑(B)的具體例,可以舉出3-巰丙基三甲氧基矽烷、3-巰丙基三乙氧基矽烷、3-巰丙基二甲氧基甲基矽烷等含巰基之低分子型矽烷偶合劑;3-巰丙基三甲氧基矽烷、3-巰丙基三乙氧基矽烷、3-巰丙基二甲氧基甲基矽烷等含巰基之矽烷化合物與甲基三乙氧基矽烷、乙基三乙氧基矽烷、甲基三甲氧基矽烷、乙基三甲氧基矽烷等含烷基之矽烷化合物的共縮合物等含巰基之寡聚物型矽烷偶合劑等。其中,遷移防止效果更加優異且作業性亦良好的含巰基之寡聚物型矽烷偶合劑為較佳,含巰基之矽烷化合物與含烷基之矽烷化合物的共縮合物尤為佳,3-巰丙基三甲氧基矽烷與甲基三乙氧基矽烷的共縮合物為進一步較佳。該等可以單獨使用一種,亦可以組合兩種以上使用。 Specific examples of the silane coupling agent (B) having a mercapto group include 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyldimethoxymethylsilane Mercapto-containing low-molecular-weight silane coupling agent; 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyldimethoxymethylsilane and other mercapto group-containing silane compounds Mercapto-containing oligomer type silanes such as co-condensates with alkyl-containing silane compounds such as methyltriethoxysilane, ethyltriethoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, etc. Coupling agent, etc. Among them, a thiol group-containing oligomer-type silane coupling agent with better migration prevention effect and good workability is preferred, and a co-condensate of a mercapto group-containing silane compound and an alkyl group-containing silane compound is particularly preferred, 3-mercaptopropane The co-condensate of trimethoxysilane and methyltriethoxysilane is further preferred. These can be used alone or in combination of two or more.
構成具有巰基之矽烷偶合劑(B)之有機矽化合物的巰基當量的下限值係100g/莫耳以上為較佳,120g/莫耳以上尤為佳,150g/莫耳以上為進一步較佳。藉由如上述設定下限值,將與(甲基)丙烯酸酯聚合物(A)之極性差設在適當的範圍內,從而能夠設為上述矽烷偶合劑(B)在黏著性組成物P中之分散性較佳者。 The lower limit value of the mercapto group equivalent of the organosilicon compound constituting the silane coupling agent (B) having a mercapto group is preferably 100 g/mole or more, more preferably 120 g/mole or more, and even more preferably 150 g/mole or more. By setting the lower limit value as described above, the polarity difference from the (meth)acrylate polymer (A) is set within an appropriate range, so that the silane coupling agent (B) can be set in the adhesive composition P The better the dispersion.
構成具有巰基之矽烷偶合劑(B)之有機矽化合物的巰基當量的上限值係1000g/莫耳以下為較佳,800g/莫耳以下尤為佳,500g/莫耳以下為進一步較佳。藉由如上述設定上限值,能夠防止由與(甲基)丙烯酸酯聚合物(A)之相分離引起之光學特性的惡化。 The upper limit value of the mercapto group equivalent of the organosilicon compound constituting the silane coupling agent (B) having a mercapto group is preferably 1,000 g/mole or less, more preferably 800 g/mole or less, and further preferably 500 g/mole or less. By setting the upper limit value as described above, it is possible to prevent deterioration of optical characteristics caused by phase separation from the (meth)acrylate polymer (A).
黏著性組成物P中之具有巰基之矽烷偶合劑(B)的含有量相對於(甲基)丙烯酸酯聚合物(A)100質量份,下限值係0.01質量份以上為較佳,0.05質量份以上尤為佳,0.1質量份以上為進一步較佳。並且,上限值係5質量份以下 為較佳,1.5質量份以下尤為佳,1.0質量份以下為進一步較佳。藉由具有巰基之矽烷偶合劑(B)的含有量在上述範圍,成為遷移防止效果更加優異者。 The content of the mercapto group-containing silane coupling agent (B) in the adhesive composition P is preferably 0.01 mass parts or more relative to 100 mass parts of the (meth)acrylate polymer (A), and 0.05 mass parts is preferable More preferably, it is more than 0.1 part by mass, and more preferably 0.1 part by mass or more. Also, the upper limit is 5 parts by mass or less Preferably, 1.5 parts by mass or less is particularly preferable, and 1.0 parts by mass or less is even more preferable. When the content of the silane coupling agent (B) having a mercapto group is in the above-mentioned range, it becomes a more excellent migration prevention effect.
並且,(甲基)丙烯酸酯聚合物(A)每100g的、矽烷偶合劑(B)中之巰基的莫耳數(巰基量)的下限值係0.01mmol以上為較佳,0.1mmol以上尤為佳,0.2mmol以上為進一步較佳。並且,上述莫耳數的上限值係30mmol以下為較佳,5mmol以下尤為佳,1.5mmol以下為進一步較佳。藉由矽烷偶合劑(B)的巰基相對於(甲基)丙烯酸酯聚合物(A)之莫耳數在上述範圍,能夠設為遷移防止效果更加優異者。 In addition, the lower limit of the number of moles (mercapto group) of the mercapto group in the silane coupling agent (B) per 100 g of the (meth)acrylate polymer (A) is preferably 0.01 mmol or more, particularly 0.1 mmol or more Preferably, 0.2 mmol or more is more preferable. In addition, the upper limit of the molar number is preferably 30 mmol or less, more preferably 5 mmol or less, and further preferably 1.5 mmol or less. When the molar number of the mercapto group of the silane coupling agent (B) relative to the (meth)acrylate polymer (A) is within the above range, it can be considered that the migration prevention effect is more excellent.
(3)活性能量射線硬化性成分(C) (3) Active energy ray hardening component (C)
若黏著性組成物P含有活性能量射線硬化性成分(C),則使該黏著性組成物P熱交聯而成之硬化前黏著劑藉由活性能量射線的照射硬化時,活性能量射線硬化性成分(C)相互聚合,推斷該聚合之活性能量射線硬化性成分(C)係纏繞於(甲基)丙烯酸酯聚合物(A)的交聯結構(三維網狀結構)者。具有該種高次結構之黏著劑由於內聚力較高且顯示比較高的彈性模量,因此抗起泡性優異。 If the adhesive composition P contains the active energy ray-curable component (C), the active energy ray hardenability when the pre-curing adhesive prepared by thermally cross-linking the adhesive composition P is irradiated with active energy rays The components (C) are mutually polymerized, and it is estimated that the polymerized active energy ray-curable component (C) is entangled in the cross-linked structure (three-dimensional network structure) of the (meth)acrylate polymer (A). The adhesive with such a high-order structure has high cohesion and a relatively high elastic modulus, so it has excellent anti-foaming properties.
活性能量射線硬化性成分(C)只要係藉由活性能量射線的照射而硬化從而得到上述效果之成分,則並沒有特別限制,可以係單體、寡聚物或聚合物中的任何一種,亦可以係該等的混合物。其中,較佳地可以舉出與(甲基)丙烯酸酯聚合物(A)等之相容性優異之分子量小於1000的多官能丙烯酸酯系單體。 The active energy ray-curable component (C) is not particularly limited as long as it is hardened by active energy ray irradiation to obtain the above-mentioned effects, and may be any of monomers, oligomers, or polymers. It can be a mixture of these. Among them, preferably, a polyfunctional acrylate monomer having a molecular weight of less than 1,000 and having excellent compatibility with (meth)acrylate polymer (A) or the like is mentioned.
作為分子量小於1000的多官能丙烯酸酯系單體,例如可以舉出1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、新戊二醇己二酸酯二(甲基)丙烯酸酯、羥基新戊酸新戊二醇二(甲基)丙烯酸酯、二環戊酯二(甲基)丙烯酸酯、己內酯改性二環戊基二(甲基)丙烯酸酯、環氧乙烷改性磷酸二(甲基)丙烯酸酯、二(丙烯醯氧基乙基)異氰脲酸酯、烯丙基化環己基二(甲基)丙烯酸酯、乙氧基化雙酚A二丙烯酸酯、9,9-雙[4-(2-丙烯醯氧基乙氧基)苯基]茀等2官能型;三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、丙酸改性二季戊四醇三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、環氧丙烷改性三羥甲基丙烷三(甲基)丙烯酸酯、三(丙烯醯氧基乙基)異氰脲酸酯、ε-己內酯改性三-(2-(甲基)丙烯醯氧基乙基)異氰脲酸酯等3官能型;二甘油四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯等4官能型;丙酸改性二季戊四醇五(甲基)丙烯酸酯等5官能型;二季戊四醇六(甲基)丙烯酸酯、己內酯改性二季戊四醇六(甲基)丙烯酸酯等6官能型等。在上述之中,從所得到之黏著劑的抗起泡性的觀點考慮,季戊四醇三(甲基)丙烯酸酯及ε-己內酯改性三-(2-(甲基)丙烯醯氧基乙基)異氰脲酸酯為較佳。該等可以單獨使用一種,亦可以組合使用兩種以上。 Examples of the multifunctional acrylate monomer having a molecular weight of less than 1000 include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and neopentyl diacrylate. Alcohol di(meth)acrylate, polyethylene glycol di(meth)acrylate, neopentyl glycol adipate di(meth)acrylate, hydroxypivalate neopentyl glycol di(meth) Acrylate, dicyclopentyl di(meth)acrylate, caprolactone modified dicyclopentyl di(meth)acrylate, ethylene oxide modified di(meth)acrylate, di(propylene) Acetyloxyethyl) isocyanurate, allylated cyclohexyl di(meth)acrylate, ethoxylated bisphenol A diacrylate, 9,9-bis[4-(2-propenyl) Oxyethoxy)phenyl] stilbene and other 2-functional types; trimethylolpropane tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, propionic acid modified dipentaerythritol tri(meth)acrylic acid Ester, pentaerythritol tri (meth) acrylate, propylene oxide modified trimethylol propane tri (meth) acrylate, tri (acryloyloxyethyl) isocyanurate, ε-caprolactone modified 3-functional types such as tri-(2-(meth)acryloyloxyethyl) isocyanurate; 4-functional types such as diglycerol tetra(meth)acrylate and pentaerythritol tetra(meth)acrylate; Propionic acid modified dipentaerythritol penta(meth)acrylate and other 5 functional types; dipentaerythritol hexa(meth)acrylate, caprolactone modified dipentaerythritol hexa(meth)acrylate and other 6 functional types. Among the above, from the viewpoint of the anti-foaming property of the obtained adhesive, pentaerythritol tri(meth)acrylate and ε-caprolactone modified tri-(2-(meth)acryloyloxyethyl Radical) isocyanurate is preferred. These can be used alone or in combination of two or more.
作為活性能量射線硬化性成分(C),亦可以使用活性能量射線硬化型的丙烯酸酯系寡聚物。該丙烯酸酯系寡聚物為重量平均分子量50,000以下者為較佳。作為該種丙烯酸 酯系寡聚物的例子,可以舉出聚酯丙烯酸酯系、環氧丙烯酸酯系、胺基甲酸酯丙烯酸酯系、聚醚丙烯酸酯系、聚丁二烯丙烯酸酯系、矽酮丙烯酸酯系等。 As the active energy ray-curable component (C), an active energy ray-curable acrylate oligomer can also be used. It is preferable that the acrylate-based oligomer has a weight average molecular weight of 50,000 or less. As this kind of acrylic Examples of ester oligomers include polyester acrylates, epoxy acrylates, urethane acrylates, polyether acrylates, polybutadiene acrylates, and silicone acrylates. Department etc.
上述丙烯酸酯系寡聚物的重量平均分子量為50,000以下為較佳,500~50,000尤為佳,3,000~40,000為進一步較佳。該等丙烯酸酯系寡聚物可以單獨使用一種,亦可以組合使用兩種以上。 The weight average molecular weight of the acrylate oligomer is preferably 50,000 or less, more preferably 500 to 50,000, and even more preferably 3,000 to 40,000. One type of these acrylate oligomers may be used alone, or two or more types may be used in combination.
並且,作為活性能量射線硬化性成分(C),亦可以使用在側鏈中導入有具有(甲基)丙烯醯基之基團之加成丙烯酸酯系聚合物。該種加成丙烯酸酯系聚合物可藉由使用(甲基)丙烯酸酯與在分子內具有交聯性官能基之單體的共聚物,並使該共聚物的交聯性官能基的一部分、與具有能與(甲基)丙烯醯基以及交聯性官能基發生反應的基團之化合物進行反應來得到。 In addition, as the active energy ray-curable component (C), an addition acrylate polymer in which a group having a (meth)acryloyl group is introduced into the side chain can also be used. This kind of addition acrylate polymer can be obtained by using a copolymer of (meth)acrylate and a monomer having a crosslinkable functional group in the molecule, and making a part of the crosslinkable functional group of the copolymer, It is obtained by reacting with a compound having a group capable of reacting with a (meth)acryloyl group and a crosslinkable functional group.
上述加成丙烯酸酯系聚合物的重量平均分子量為5萬~90萬左右為較佳,10萬~50萬左右尤為佳。 The weight average molecular weight of the above-mentioned addition acrylate-based polymer is preferably about 50,000 to 900,000, and particularly preferably about 100,000 to 500,000.
活性能量射線硬化性成分(C)既可以從前述多官能丙烯酸酯系單體、丙烯酸酯系寡聚物及加成丙烯酸酯系聚合物中選擇使用一種,亦可以組合使用兩種以上,亦可以與該等以外的活性能量射線硬化性成分組合使用。 The active energy ray-curable component (C) may be one kind selected from the aforementioned multifunctional acrylate monomers, acrylate oligomers, and addition acrylate polymers, or two or more kinds may be used in combination, or Used in combination with other active energy ray hardening components.
從提高所得到之黏著劑的內聚力而設為抗起泡性優異者之觀點考慮,黏著性組成物P中之活性能量射線硬化性成分(C)的含有量相對於(甲基)丙烯酸酯聚合物(A)100質量份,下限值係0.5質量份以上為較佳,1.0質量份以上更 為佳,3.0質量份以上尤為佳。另一方面,從防止活性能量射線硬化性成分(C)與(甲基)丙烯酸酯聚合物(A)相分離之觀點考慮,上述含有量的上限值係50質量份以下為較佳,20質量份以下更為佳,若進一步考慮使抗起泡性變得更加良好之觀點,則12質量份以下尤為佳。 The content of the active energy ray-curable component (C) in the adhesive composition P is polymerized relative to the (meth)acrylate from the viewpoint of improving the cohesive force of the obtained adhesive and making it excellent in anti-foaming property. 100 parts by mass of the substance (A), the lower limit is preferably 0.5 parts by mass or more, more preferably 1.0 parts by mass or more Preferably, 3.0 parts by mass or more is particularly preferable. On the other hand, from the viewpoint of preventing phase separation of the active energy ray curable component (C) and the (meth)acrylate polymer (A), the upper limit of the content is preferably 50 parts by mass or less, 20 A mass part or less is more preferable, and further considering the viewpoint of making the anti-foaming property more favorable, it is particularly preferably 12 mass parts or less.
(4)交聯劑(D) (4) Crosslinking agent (D)
黏著性組成物P含有交聯劑(D)為較佳。黏著性組成物P藉由含有交聯劑(D),使(甲基)丙烯酸酯聚合物(A)交聯而形成三維網狀結構,能夠進一步提高所得到之黏著劑的內聚力,從而進一步提高高溫高濕條件下之段差追隨性。 It is preferable that the adhesive composition P contains a crosslinking agent (D). The adhesive composition P contains a cross-linking agent (D) to cross-link the (meth)acrylate polymer (A) to form a three-dimensional network structure, which can further increase the cohesive force of the obtained adhesive, thereby further improving The step followability under high temperature and high humidity conditions.
作為交聯劑(D),只要係與(甲基)丙烯酸酯聚合物(A)所具有之反應性基進行反應者即可,例如可以舉出異氰酸酯系交聯劑、環氧系交聯劑、胺系交聯劑、三聚氰胺系交聯劑、氮丙啶系交聯劑、聯胺系交聯劑、醛系交聯劑、噁唑啉系交聯劑、金屬醇鹽系交聯劑、金屬螯合系交聯劑、金屬鹽系交聯劑、銨鹽系交聯劑等。當(甲基)丙烯酸酯聚合物(A)含有含羥基單體來作為構成該聚合物之單體單元時,使用與該羥基之反應性優異之異氰酸酯系交聯劑為較佳。另外,交聯劑(D)可以單獨使用一種,或者組合兩種以上使用。 The crosslinking agent (D) may be any one that reacts with the reactive group of the (meth)acrylate polymer (A), and examples thereof include isocyanate-based crosslinking agents and epoxy-based crosslinking agents. , Amine-based crosslinking agent, melamine-based crosslinking agent, aziridine-based crosslinking agent, amine-based crosslinking agent, aldehyde-based crosslinking agent, oxazoline-based crosslinking agent, metal alkoxide-based crosslinking agent, Metal chelate-based cross-linking agent, metal salt-based cross-linking agent, ammonium salt-based cross-linking agent, etc. When the (meth)acrylate polymer (A) contains a hydroxyl group-containing monomer as a monomer unit constituting the polymer, it is preferable to use an isocyanate-based crosslinking agent excellent in reactivity with the hydroxyl group. In addition, the crosslinking agent (D) may be used alone or in combination of two or more.
異氰酸酯系交聯劑係至少含有聚異氰酸酯化合物者。作為聚異氰酸酯化合物,例如可以舉出甲苯二異氰酸酯、二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族聚異氰酸酯、六亞甲基二異氰酸酯等脂肪族聚異氰酸酯、異佛爾酮二異氰酸酯、氫化二苯基甲烷二異氰酸酯等脂環式聚異氰酸酯等 及該等的縮二脲體、異氰脲酸酯體、以及乙二醇、丙二醇、新戊二醇、三羥甲基丙烷、蓖麻油等作為與含低分子活性氫化合物之反應物之加成物等。其中,從與羥基之反應性的觀點考慮,三羥甲基丙烷改性的芳香族聚異氰酸酯為較佳,三羥甲基丙烷改性甲苯二異氰酸酯尤為佳。 The isocyanate-based crosslinking agent contains at least a polyisocyanate compound. Examples of the polyisocyanate compound include aromatic polyisocyanates such as toluene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate, aliphatic polyisocyanates such as hexamethylene diisocyanate, and isophorone diisocyanate. , Hydrogenated diphenylmethane diisocyanate, alicyclic polyisocyanate, etc. And such biuret bodies, isocyanurate bodies, and ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, castor oil, etc. as reactants with low molecular active hydrogen compounds Adults, etc. Among them, from the viewpoint of reactivity with hydroxyl groups, trimethylolpropane-modified aromatic polyisocyanate is preferred, and trimethylolpropane-modified toluene diisocyanate is particularly preferred.
黏著性組成物P中之交聯劑(D)的含有量相對於(甲基)丙烯酸酯聚合物(A)100質量份,下限值係0.001質量份以上為較佳,0.01質量份以上尤為佳,0.02質量份以上為進一步較佳。並且,上限值係10質量份以下為較佳,5質量份以下尤為佳,1質量份以下為進一步較佳。 The content of the cross-linking agent (D) in the adhesive composition P is preferably 0.001 parts by mass or more, and more preferably 0.01 parts by mass or more with respect to 100 parts by mass of the (meth)acrylate polymer (A). Preferably, 0.02 parts by mass or more is more preferable. In addition, the upper limit value is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and further preferably 1 part by mass or less.
藉由交聯劑(D)的含有量在上述範圍,成為所得到之黏著劑的內聚力較佳者,黏著劑的高溫高濕條件下之段差追隨性進一步得到提高。 When the content of the cross-linking agent (D) is in the above range, the resulting adhesive has better cohesion, and the step followability of the adhesive under high temperature and high humidity conditions is further improved.
(5)光聚合起始劑(E) (5) Photopolymerization initiator (E)
當使硬化前黏著劑硬化時使用紫外線來作為對硬化前黏著劑照射之活性能量射線時,黏著性組成物P還含有光聚合起始劑(E)為較佳。如此,藉由含有光聚合起始劑(E),能夠使活性能量射線硬化性成分(C)高效地聚合,並且能夠減少聚合硬化時間及活性能量射線的照射量。 When ultraviolet rays are used as active energy rays irradiated to the adhesive before hardening when the adhesive before hardening is hardened, it is preferable that the adhesive composition P further contains a photopolymerization initiator (E). In this way, by containing the photopolymerization initiator (E), the active energy ray-curable component (C) can be efficiently polymerized, and the polymerization hardening time and the irradiation amount of the active energy ray can be reduced.
作為該種光聚合起始劑(E),例如可以舉出安息香、安息香甲醚、安息香乙醚、安息香異丙醚、安息香正丁醚、安息香異丁醚、苯乙酮、二甲基胺基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基-2-苯基苯乙酮、2-羥基-2-甲基-1-苯基丙-1-酮、1-羥基環己基苯基酮、2-甲基-1-[4-(甲硫基) 苯基]-2-嗎啉代-丙-1-酮、4-(2-羥基乙氧基)苯基-2-(羥基-2-丙基)酮、二苯甲酮、對苯基二苯甲酮、4,4’-二乙基胺基二苯甲酮、二氯二苯甲酮、2-甲基蒽醌、2-乙基蒽醌、2-叔丁基蒽醌、2-胺基蒽醌、2-甲基噻噸酮、2-乙基噻噸酮、2-氯噻噸酮、2,4-二甲基噻噸酮、2,4-二乙基噻噸酮、苄基二甲基縮酮、苯乙酮二甲基縮酮、對二甲基胺基苯甲酸酯、寡聚[2-羥基-2-甲基-1[4-(1-甲基乙烯基)苯基]丙酮]、2,4,6-三甲基苯甲醯基-二苯基-氧化膦等。該等可以單獨使用,亦可以組合使用兩種以上。 Examples of the photopolymerization initiator (E) include benzoin, benzoin methyl ether, benzoin ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, and dimethylaminobenzene Acetone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenyl Propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio) Phenyl]-2-morpholino-propan-1-one, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl) ketone, benzophenone, p-phenyl di Benzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 2- Aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, Benzyl dimethyl ketal, acetophenone dimethyl ketal, p-dimethylamino benzoate, oligo[2-hydroxy-2-methyl-1[4-(1-methylethylene Group) phenyl] acetone], 2,4,6-trimethylbenzyl-diphenyl-phosphine oxide, etc. These can be used alone or in combination of two or more.
黏著性組成物P中之光聚合起始劑(E)的含有量相對於活性能量射線硬化性成分(C)100質量份,下限值係0.1質量份以上為較佳,1質量份以上尤為佳。並且,上限值係30質量份以下為較佳,10質量份以下尤為佳。 The content of the photopolymerization initiator (E) in the adhesive composition P is preferably 100 parts by mass or less relative to the active energy ray-curable component (C), and the lower limit is preferably 0.1 part by mass or more, particularly 1 part by mass or more good. In addition, the upper limit value is preferably 30 parts by mass or less, and more preferably 10 parts by mass or less.
(6)各種添加劑 (6) Various additives
黏著性組成物P中根據需要可以添加在丙烯酸系黏著劑中通常使用之各種添加劑、例如抗靜電劑、增黏劑、抗氧化劑、紫外線吸收劑、光穩定劑、軟化劑、填充劑、折射率調整劑、具有巰基之矽烷偶合劑(B)以外的其他矽烷偶合劑等。但是,防鏽劑尤其苯并三唑系防鏽劑具有阻礙黏著性組成物P的交聯之作用,因此不含為較佳。 To the adhesive composition P, various additives commonly used in acrylic adhesives, such as antistatic agents, tackifiers, antioxidants, ultraviolet absorbers, light stabilizers, softeners, fillers, and refractive indexes may be added as needed. Modifiers, silane coupling agents other than mercapto group-containing silane coupling agents (B), etc. However, the rust inhibitor, especially the benzotriazole-based rust inhibitor, has an effect of inhibiting the crosslinking of the adhesive composition P, and therefore it is not preferred.
另外,黏著性組成物P係表示在黏著劑層中以原狀態或反應之狀態殘存之各種成分的混合物者,在乾燥製程等中被去除之成分例如後述的聚合溶劑及稀釋溶劑不含於黏著性組成物P中。 In addition, the adhesive composition P represents a mixture of various components remaining in the original state or the state of reaction in the adhesive layer, and the components removed during the drying process, such as the polymerization solvent and the dilution solvent described later, are not included in the adhesive Sexual composition P.
(7)黏著性組成物的製造 (7) Manufacture of adhesive composition
黏著性組成物P能夠藉由製造(甲基)丙烯酸酯聚合物(A)並將所得到之(甲基)丙烯酸酯聚合物(A)、具有巰基之矽烷偶合劑(B)及活性能量射線硬化性成分(C)混合,並且根據需要加入交聯劑(D)、光聚合起始劑(E)及添加劑而製造。 The adhesive composition P can be produced by manufacturing a (meth)acrylate polymer (A) and obtaining the (meth)acrylate polymer (A), a silane coupling agent having a mercapto group (B), and active energy rays The hardenable component (C) is mixed, and a crosslinking agent (D), a photopolymerization initiator (E) and additives are added as needed to manufacture.
(甲基)丙烯酸酯聚合物(A)能夠藉由將構成聚合物之單體單元的混合物利用通常的自由基聚合法進行聚合而製造。(甲基)丙烯酸酯聚合物(A)的聚合根據需要能夠使用聚合起始劑並藉由溶液聚合法等來進行。作為聚合溶劑,例如可以舉出乙酸乙酯、乙酸正丁酯、乙酸異丁酯、甲苯、丙酮、己烷、甲乙酮等,亦可以並用兩種以上。 The (meth)acrylate polymer (A) can be produced by polymerizing a mixture of monomer units constituting the polymer by a normal radical polymerization method. The polymerization of the (meth)acrylate polymer (A) can be carried out by a solution polymerization method using a polymerization initiator as needed. Examples of the polymerization solvent include ethyl acetate, n-butyl acetate, isobutyl acetate, toluene, acetone, hexane, and methyl ethyl ketone. Two or more of them may be used in combination.
作為聚合起始劑,可以舉出偶氮系化合物、有機過氧化物等,亦可以並用兩種類以上。作為偶氮系化合物,例如可以舉出2,2'-偶氮二異丁腈、2,2'-偶氮二(2-甲基丁腈)、1,1'-偶氮二(環己烷1-甲腈)、2,2'-偶氮二(2,4-二甲基戊腈)、2,2'-偶氮二(2,4-二甲基-4-甲氧基戊腈)、二甲基2,2'-偶氮二(2-甲基丙酸酯)、4,4'-偶氮二(4-氰基戊酸)、2,2'-偶氮二(2-羥基甲基丙腈)、2,2'-偶氮二[2-(2-咪唑啉-2-基)丙烷]等。 Examples of the polymerization initiator include azo compounds and organic peroxides, and two or more types may be used in combination. Examples of the azo-based compound include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), and 1,1'-azobis(cyclohexyl) Alkane 1-carbonitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethyl-4-methoxypentane Nitrile), dimethyl 2,2'-azobis (2-methyl propionate), 4,4'-azobis (4-cyanovaleric acid), 2,2'-azobis ( 2-hydroxymethylpropionitrile), 2,2'-azobis[2-(2-imidazolin-2-yl)propane], etc.
作為有機過氧化物,例如可以舉出過氧化苯甲醯、過氧苯甲酸叔丁酯、氫過氧化異丙苯、過氧化二碳酸二異丙酯、過氧化二碳酸二正丙酯、二(2-乙氧基乙基)過氧化二碳酸酯、過氧化新癸酸叔丁酯、過氧化新戊酸叔丁酯、(3,5,5-三甲基己醯)過氧化物、二丙醯過氧化物、二乙醯過氧化物等。 Examples of organic peroxides include benzoyl peroxide, tert-butyl peroxybenzoate, cumene hydroperoxide, diisopropyl peroxide, di-n-propyl peroxide, and di-n-propyl peroxide. (2-ethoxyethyl) peroxydicarbonate, tert-butyl peroxyneodecanoate, tert-butyl peroxypivalate, (3,5,5-trimethylhexyl) peroxide, Dipropylamide peroxide, diethylamide peroxide, etc.
另外,在上述聚合製程中,藉由配合2-巰基乙醇等鏈轉移劑,能夠調節所得到之聚合物的重量平均分子量。 In addition, in the above polymerization process, by blending a chain transfer agent such as 2-mercaptoethanol, the weight average molecular weight of the obtained polymer can be adjusted.
若得到(甲基)丙烯酸酯聚合物(A),則在(甲基)丙烯酸酯聚合物(A)的溶液中添加具有巰基之矽烷偶合劑(B)、活性能量射線硬化性成分(C)以及根據需要之交聯劑(D)、光聚合起始劑(E)、添加劑及稀釋溶劑並充分混合,藉此得到由溶劑稀釋之黏著性組成物P(塗佈溶液)。 When the (meth)acrylate polymer (A) is obtained, the silane coupling agent (B) having a mercapto group and the active energy ray-curable component (C) are added to the solution of the (meth)acrylate polymer (A) And, if necessary, the crosslinking agent (D), the photopolymerization initiator (E), the additive, and the dilution solvent are thoroughly mixed, thereby obtaining the adhesive composition P (coating solution) diluted by the solvent.
作為上述稀釋溶劑,例如使用己烷、庚烷、環己烷等脂肪族烴、甲苯、二甲苯等芳香族烴、二氯甲烷、二氯乙烷等鹵代烴、甲醇、乙醇、丙醇、丁醇、1-甲氧基-2-丙醇等醇、丙酮、甲乙酮、2-戊酮、異佛爾酮、環己酮等酮、乙酸乙酯、乙酸丁酯等酯、乙基溶纖劑等溶纖劑系溶劑等。 As the dilution solvent, for example, aliphatic hydrocarbons such as hexane, heptane, cyclohexane, aromatic hydrocarbons such as toluene and xylene, halogenated hydrocarbons such as dichloromethane and dichloroethane, methanol, ethanol, propanol, Alcohols such as butanol, 1-methoxy-2-propanol, acetone, methyl ethyl ketone, 2-pentanone, isophorone, cyclohexanone and other ketones, ethyl acetate, butyl acetate and other esters, ethyl cellosolve Cellosolve and other solvents.
作為如此製備之塗佈溶液的濃度、黏度,只要在可塗層之範圍即可,並沒有特別限制,可以根據狀況適當選定。例如,稀釋成黏著性組成物P的濃度成為10~40質量%。另外,當得到塗佈溶液時,稀釋溶劑等的添加並非必要條件,只要黏著性組成物P為可塗層之黏度等,則亦可以不添加稀釋溶劑。此時,黏著性組成物P成為將(甲基)丙烯酸酯聚合物(A)的聚合溶劑直接作為稀釋溶劑之塗佈溶液。 The concentration and viscosity of the coating solution prepared in this way are not particularly limited as long as they can be coated, and can be appropriately selected according to the situation. For example, the concentration diluted to the adhesive composition P becomes 10 to 40% by mass. In addition, when a coating solution is obtained, addition of a dilution solvent or the like is not a necessary condition, and as long as the adhesive composition P has a coatable viscosity or the like, the dilution solvent may not be added. At this time, the adhesive composition P becomes a coating solution using the polymerization solvent of the (meth)acrylate polymer (A) directly as the dilution solvent.
〔黏著片〕 〔Adhesive sheet〕
如第1圖所示,本實施形態之黏著片1由如下構成:兩片剝離片12a、12b;及以與該等兩片剝離片12a、12b的剝離面接觸之方式被該兩片剝離片12a、12b所夾持之硬化前黏著劑層10。但是,在黏著片1中剝離片12a、12b並非必須構成要
件,係在使用黏著片1時被剝離、去除者。另外,本說明書中之剝離片的剝離面係指在剝離片中具有剝離性之面,係包含實施剝離處理之面及即使未實施剝離處理亦顯示剝離性之面這兩者。
As shown in FIG. 1, the
(1)硬化前黏著劑層 (1) Adhesive layer before hardening
硬化前黏著劑層10係使前述黏著性組成物P熱交聯而形成為層狀者,係籍由活性能量射線的照射而硬化之前階段者。硬化前黏著劑層10的厚度(按照JIS K7130測定之值)的下限值係10μm以上為較佳,25μm以上尤為佳,50μm以上為進一步較佳。藉由硬化前黏著劑層10的厚度的下限值為上述以上,在使硬化前黏著劑層10硬化而得到之黏著劑層中可以充分發揮優異之黏著力。並且,硬化前黏著劑層10的厚度的上限值係300μm以下為較佳,250μm以下尤為佳,100μm以下為進一步較佳。藉由硬化前黏著劑層10的厚度的上限值為上述以下,加工性變得良好。另外,硬化前黏著劑層10可以以單層形成,亦可以將複數層積層而形成。 The adhesive layer 10 before hardening is formed by thermally cross-linking the adhesive composition P to form a layer, and is the one before hardening by irradiation with active energy rays. The lower limit of the thickness of the adhesive layer 10 (value measured in accordance with JIS K7130) before curing is preferably 10 μm or more, more preferably 25 μm or more, and still more preferably 50 μm or more. When the lower limit value of the thickness of the adhesive layer 10 before hardening is the above, the adhesive layer obtained by hardening the adhesive layer 10 before hardening can fully exhibit excellent adhesive force. In addition, the upper limit of the thickness of the adhesive layer 10 before curing is preferably 300 μm or less, more preferably 250 μm or less, and even more preferably 100 μm or less. When the upper limit of the thickness of the adhesive layer 10 before hardening is the above or less, the workability becomes good. In addition, the adhesive layer 10 before hardening may be formed as a single layer, or may be formed by laminating a plurality of layers.
(2)剝離片 (2) Peel off piece
作為剝離片12a、12b並沒有特別限定,可以使用公知的塑膠薄膜。例如,可以使用聚乙烯薄膜、聚丙烯薄膜、聚丁烯薄膜、聚丁二烯薄膜、聚甲基戊烯薄膜、聚氯乙烯薄膜、氯乙烯共聚物薄膜、聚對苯二甲酸乙二酯薄膜、聚萘二甲酸乙二酯薄膜、聚對苯二甲酸丁二酯薄膜、聚氨酯薄膜、乙烯乙酸乙烯酯薄膜、離聚物樹脂薄膜、乙烯.(甲基)丙烯酸共聚物薄膜、乙烯.(甲基)丙烯酸酯共聚物薄膜、聚苯乙烯薄膜、聚碳酸
酯薄膜、聚醯亞胺薄膜、氟樹脂薄膜等。並且,亦可以使用該等的交聯薄膜。另外,亦可以係該等的積層薄膜。
The
上述剝離片12a、12b的剝離面(尤其與硬化前黏著劑層10接觸之面)實施有剝離處理為較佳。作為剝離處理中所使用之剝離劑,例如可以舉出醇酸系、矽酮系、氟系、不飽和聚酯系、聚烯烴系、蠟系的剝離劑。另外,在剝離片12a、12b中,將一個剝離片設為剝離力較大的重剝離型剝離片,將另一個剝離片設為剝離力較小的輕剝離型剝離片為較佳。
It is preferable that the peeling surfaces of the above-mentioned
對於剝離片12a、12b的厚度並沒有特別限制,通常係20~150μm左右。
The thickness of the
(3)黏著片的製造 (3) Manufacture of adhesive sheet
作為黏著片1的一製造例,在一個剝離片12a(或12b)的剝離面塗佈上述黏著性組成物P的塗佈液,並進行加熱處理而使黏著性組成物P熱交聯來形成塗佈層之後,在該塗佈層上重疊另一個剝離片12b(或12a)的剝離面。當需要熟化期間時,上述塗佈層藉由經過熟化期間而成為硬化前黏著劑層10,當不需要熟化期間時,上述塗佈層直接成為硬化前黏著劑層10。藉此,得到上述黏著片1。另外,亦可以由使塗佈之黏著性組成物P的稀釋溶劑等揮發時的乾燥處理兼作加熱處理。
As a manufacturing example of the
當進行加熱處理時,加熱溫度係50~150℃為較佳,70~120℃尤為佳。並且,加熱時間係30秒~10分鐘為較佳,50秒~2分鐘尤為佳。當設置熟化期間時,作為其條件,例如在常溫(例如,23℃、50%RH)下1~2周左右為較佳。 When performing heat treatment, the heating temperature is preferably 50 to 150°C, and particularly preferably 70 to 120°C. Moreover, the heating time is preferably 30 seconds to 10 minutes, and more preferably 50 seconds to 2 minutes. When the aging period is set, the condition is preferably about 1 to 2 weeks at normal temperature (for example, 23° C., 50% RH).
作為塗佈上述黏著性組成物P的塗佈液之方法, 例如可以利用棒塗佈法、刮刀塗佈法、輥塗佈法、刮板塗佈法、模具塗佈法、凹版塗佈法等。 As a method of applying the coating liquid of the adhesive composition P, For example, a bar coating method, a blade coating method, a roll coating method, a blade coating method, a die coating method, a gravure coating method, or the like can be used.
作為黏著片1的另一製造例,在一個剝離片12a的剝離面塗佈上述黏著性組成物P的塗佈液,並進行加熱處理而使黏著性組成物P進行交聯來形成塗佈層,從而得到帶塗佈層之剝離片12a。並且,在另一個剝離片12b的剝離面塗佈上述黏著性組成物P的塗佈液,並進行加熱處理而使黏著性組成物P進行交聯來形成塗佈層,從而得到帶塗佈層之剝離片12b。並且,將帶塗佈層之剝離片12a與帶塗佈層之剝離片12b以兩個塗佈層相互接觸之方式進行貼合。當需要熟化期間時,上述積層之塗佈層經由熟化期間而成為硬化前黏著劑層10,當不需要熟化期間時,上述積層之塗佈層直接成為硬化前黏著劑層10。藉比,可以得到上述黏著片1。根據該製造例,即使在硬化前黏著劑層10較厚的情況下,亦能夠穩定地進行製造。
As another manufacturing example of the
(4)凝膠分率 (4) Gel fraction
使黏著性組成物P熱交聯而成之硬化前黏著劑的凝膠分率的下限值係20%以上為較佳,30%以上尤為佳,40%以上為進一步較佳。若硬化前黏著劑的凝膠分率的下限值為上述以上,則藉由活性能量射線照射硬化而成之黏著劑的內聚力變高,成為抗起泡性更加優異者。並且,上述凝膠分率的上限值係90%以下為較佳,80%以下尤為佳,75%以下為進一步較佳。若硬化前黏著劑的凝膠分率的上限值為上述以下,則硬化前黏著劑層10不會變得過硬,成為貼附時的段差追隨性優異者。 The lower limit of the gel fraction of the adhesive before hardening obtained by thermally crosslinking the adhesive composition P is preferably 20% or more, more preferably 30% or more, and even more preferably 40% or more. If the lower limit value of the gel fraction of the adhesive before hardening is above the above, the cohesive force of the adhesive hardened by active energy ray irradiation will become higher and it will become more excellent in anti-foaming property. In addition, the upper limit of the gel fraction is preferably 90% or less, more preferably 80% or less, and further preferably 75% or less. If the upper limit of the gel fraction of the adhesive before hardening is the above or less, the adhesive layer 10 before hardening will not become too hard, and it will be excellent in the step followability at the time of attachment.
另一方面,使上述硬化前黏著劑藉由活性能量射 線的照射硬化而成之黏著劑的凝膠分率的下限值係50%以上為較佳,60%以上尤為佳,70%以上為進一步較佳。若黏著劑的凝膠分率的下限值為上述以上,則該黏著劑的內聚力變高,成為抗起泡性更加優異者。並且,上述凝膠分率的上限值係99%以下為較佳,96%以下尤為佳,94%以下為進一步較佳。若黏著劑的凝膠分率的上限值為上述以下,則能夠維持適當的黏著力,並能夠維持良好的起泡性能。另外,硬化前黏著劑及黏著劑的凝膠分率的測定方法如後述之試驗例所示。 On the other hand, the active agent The lower limit of the gel fraction of the adhesive hardened by irradiation of the wire is preferably 50% or more, more preferably 60% or more, and further preferably 70% or more. If the lower limit value of the gel fraction of the adhesive is above the above, the cohesive force of the adhesive becomes high, and it becomes more excellent in the anti-foaming property. In addition, the upper limit of the gel fraction is preferably 99% or less, more preferably 96% or less, and even more preferably 94% or less. If the upper limit of the gel fraction of the adhesive is equal to or less than the above, proper adhesion can be maintained and good foaming performance can be maintained. In addition, the method of measuring the adhesive fraction and the gel fraction of the adhesive before hardening is shown in the test example described later.
(5)黏著力 (5) Adhesion
本實施形態之黏著片1對鈉鈣玻璃之黏著力的下限值係5N/25mm以上為較佳,7N/25mm以上尤為佳,10N/25mm以上為進一步較佳。若黏著片1的黏著力的下限值為上述以上,則能夠有效地防止在保管中剝離片剝離,或者在搬送製程中與被黏物之間產生剝離等。另一方面,上述黏著力的上限值並沒有特別限制,若考慮使用時之剝離片12a、12b從硬化前黏著劑層10之剝離容易度等,則50N/25mm以下為較佳,30N/25mm以下尤為佳。若還進一步考慮再加工性,則26N/25mm以下為較佳。在該情況下,即使發生誤貼合,亦可以輕鬆地再利用顯示體構成構件。
The lower limit of the adhesive force of the
上述黏著力基本上係指藉由按照JIS Z0237:2009之180度剝離法測定之黏著力,係將測定樣品設為25mm寬度、100mm長度,將該測定樣品貼附於被黏物,並在0.5MPa、50℃下加壓20分鐘之後,在常壓、23℃、50%RH的條件下放置24小時,其後以剝離速度300mm/min測定者。 The above-mentioned adhesive force basically means the adhesive force measured by the 180-degree peeling method according to JIS Z0237:2009. The measurement sample is set to 25 mm width and 100 mm length. After pressurizing at MPa and 50°C for 20 minutes, it was left under normal pressure, 23°C and 50% RH for 24 hours, and then measured at a peeling speed of 300 mm/min.
並且,使本實施形態之黏著片1的硬化前黏著劑層10藉由活性能量射線的照射硬化而作為黏著劑層時之、該黏著片對鈉鈣玻璃之黏著力的下限值係5N/25mm以上為較佳,7N/25mm以上尤為佳,10N/25mm以上為進一步較佳。若黏著片1的黏著力的下限值為上述以上,則成為抗起泡性更加優異者。另一方面,上述黏著力的上限值並沒有特別限制,通常係50N/25mm以下。
Furthermore, when the adhesive layer 10 before hardening of the
上述黏著力基本上係指藉由按照JIS Z0237:2009之180度剝離法測定之黏著力,係將測定樣品設為25mm寬度、100mm長度,將該測定樣品貼附於被黏物,並在0.5MPa、50℃下加壓20分鐘之後,藉由活性能量射線的照射使硬化前黏著劑層硬化而作為黏著劑層,接著,在常壓、23℃、50%RH的條件下放置24小時之後,以剝離速度300mm/min測定者。 The above-mentioned adhesive force basically means the adhesive force measured by the 180-degree peeling method according to JIS Z0237:2009. The measurement sample is set to 25 mm width and 100 mm length, and the measurement sample is attached to the adherend and is within 0.5 After pressurizing at MPa and 50°C for 20 minutes, the adhesive layer before hardening is cured by irradiation of active energy rays to serve as an adhesive layer, and then, after being left under normal pressure, 23°C and 50% RH for 24 hours , Measured at a peeling speed of 300 mm/min.
〔顯示體〕 〔Display Body〕
本實施形態之顯示體包括:至少在貼合之側的面具有段差之第1顯示體構成構件;第2顯示體構成構件;及將第1顯示體構成構件與第2顯示體構成構件相互貼合之黏著劑層。第1顯示體構成構件和/或第2顯示體構成構件至少在貼合之側(黏著劑層側)的面具有電極。作為較佳的構成,第2顯示體構成構件至少在貼合之側的面具有電極。 The display body of this embodiment includes: a first display body structural member having a step difference at least on the side of the bonding side; a second display body structural member; and attaching the first display body structural member and the second display body structural member to each other Combine the adhesive layer. The first display body constituent member and/or the second display body constituent member have electrodes on at least the surface on the side to be bonded (adhesive layer side). As a preferable configuration, the second display component member has an electrode at least on the surface on the side to be bonded.
上述黏著劑層係使前述硬化前黏著劑層藉由活性能量射線的照射而硬化者。其中,活性能量射線係指在電磁波或帶電粒子束中具有能量子者,具體而言,可以舉出紫外線、電子束等。在活性能量射線中,操作輕鬆的紫外線尤為佳。 The above-mentioned adhesive layer is one in which the adhesive layer before hardening is hardened by irradiation of active energy rays. Among them, the active energy rays refer to those having energetics in electromagnetic waves or charged particle beams, and specific examples include ultraviolet rays and electron beams. In the active energy ray, ultraviolet light is particularly easy to operate.
紫外線的照射能夠藉由高壓水銀燈、融合H燈、氙燈等來進行,關於紫外線的照射量,照度為50~1000mW/cm2左右為較佳。並且,光量為50~10000mJ/cm2為較佳,80~5000mJ/cm2更為佳,200~2000mJ/cm2尤為佳。另一方面,電子束的照射能够藉由電子束加速器等來進行,電子束的照射量為10~1000krad左右為較佳。 The irradiation of ultraviolet rays can be performed by a high-pressure mercury lamp, a fusion H lamp, a xenon lamp, and the like, and the irradiation amount of ultraviolet rays is preferably about 50 to 1000 mW/cm 2 . Moreover, the light quantity is preferably 50 to 10000 mJ/cm 2 , more preferably 80 to 5000 mJ/cm 2 , and particularly preferably 200 to 2000 mJ/cm 2 . On the other hand, the irradiation of the electron beam can be performed by an electron beam accelerator or the like, and the irradiation amount of the electron beam is preferably about 10 to 1000 krad.
對硬化前黏著劑層之活性能量射線的照射係籍由該硬化前黏著劑層將第1顯示體構成構件與第2顯示體構成構件相互貼合之後,隔著第1顯示體構成構件及第2顯示體構成構件中的使活性能量射線透過之構件而進行為較佳。 The irradiation of the active energy ray to the adhesive layer before hardening is performed by bonding the first display body constituent member and the second display body constituent member to each other through the adhesive layer before hardening, and the first display body constituent member and the second 2 It is preferable to perform the transmission of active energy rays among the display component members.
若對硬化前黏著劑層照射活性能量射線,則活性能量射線硬化性成分(C)聚合而硬化。藉由活性能量射線的照射使硬化前黏著劑層硬化而得到之黏著劑層成為抗起泡性非常優異者。 When the active energy ray is irradiated to the adhesive layer before hardening, the active energy ray hardening component (C) polymerizes and hardens. The adhesive layer obtained by hardening the adhesive layer before hardening by irradiation of active energy rays becomes very excellent in anti-foaming property.
作為顯示體,例如可以舉出液晶(LCD)顯示器、發光二極體(LED)顯示器、有機電致發光(有機EL)顯示器、電子紙等,亦可以係觸摸面板。並且,作為顯示體,亦可以係構成該等的一部分之構件。 Examples of the display include a liquid crystal (LCD) display, a light emitting diode (LED) display, an organic electroluminescence (organic EL) display, and electronic paper. A touch panel may also be used. Furthermore, as a display, it may be a member that constitutes a part of these.
第1顯示體構成構件可以係玻璃板、塑膠板等,此外,係由包含該等之積層體等構成之保護面板為較佳。第1顯示體構成構件在黏著劑層側的面具有段差,具體而言,具有由印刷層形成之段差為較佳。該印刷層一般形成為邊框狀。 The first display body constituent member may be a glass plate, a plastic plate, or the like. In addition, a protective panel composed of a laminate or the like including these is preferable. The first display component member has a step on the surface of the adhesive layer side, specifically, it is preferable to have a step formed by a printed layer. The printed layer is generally formed in a frame shape.
作為上述玻璃板並沒有特別限定,例如可以舉出化學強化玻璃、無鹼性玻璃、石英玻璃、鈉鈣玻璃、含鋇.鍶 玻璃、鋁矽酸鹽玻璃、鉛玻璃、硼矽酸鹽玻璃、鋇硼矽酸鹽玻璃等。玻璃板的厚度並沒有特別限定,通常係0.1~5mm,0.2~2mm為較佳。 The glass plate is not particularly limited, and examples thereof include chemically strengthened glass, alkali-free glass, quartz glass, soda lime glass, and barium-containing. strontium Glass, aluminosilicate glass, lead glass, borosilicate glass, barium borosilicate glass, etc. The thickness of the glass plate is not particularly limited, but it is usually 0.1 to 5 mm, preferably 0.2 to 2 mm.
作為上述塑膠板並沒有特別限定,例如可以舉出丙烯酸板、聚碳酸酯板等。塑膠板的厚度並沒有特別限定,通常係0.2~5mm,0.4~3mm為較佳。 The plastic plate is not particularly limited, and examples thereof include acrylic plates and polycarbonate plates. The thickness of the plastic plate is not particularly limited, but it is usually 0.2-5 mm, preferably 0.4-3 mm.
另外,在上述玻璃板或塑膠板的一面或兩面可以設置各種功能層(電極層、矽氧層、硬塗層、防眩層等),亦可以積層光學構件。 In addition, various functional layers (electrode layer, silicon oxide layer, hard coat layer, anti-glare layer, etc.) may be provided on one or both surfaces of the glass plate or plastic plate, and optical members may also be laminated.
構成印刷層之材料並沒有特別限定,可以使用印刷用的公知的材料。印刷層的厚度亦即段差的高度的下限值係3μm以上為較佳,5μm以上更為佳,7μm以上尤為佳,10μm以上最為佳。若下限值為上述以上,則使得電配線難以從視認者側觀察到等能夠充分確保隱蔽性。並且,上限值係50μm以下為較佳,35μm以下更為佳,25μm以下尤為佳,20μm以下為進一步較佳。藉由上限值為上述以下,能夠防止黏著劑層對該印刷層之段差追隨性惡化。 The material constituting the printed layer is not particularly limited, and known materials for printing can be used. The lower limit of the thickness of the printed layer, that is, the height of the step is preferably 3 μm or more, more preferably 5 μm or more, particularly preferably 7 μm or more, and most preferably 10 μm or more. If the lower limit value is above the above, it becomes difficult for the electrical wiring to be viewed from the viewer side, etc., and the concealability can be sufficiently ensured. In addition, the upper limit value is preferably 50 μm or less, more preferably 35 μm or less, particularly preferably 25 μm or less, and further preferably 20 μm or less. When the upper limit value is equal to or less than the above, it is possible to prevent the adhesive layer from following the step difference of the printed layer from deteriorating.
第2顯示體構成構件係應貼合於第1顯示體構成構件之光學構件、顯示體模組(例如,液晶(LCD)模組、發光二極體(LED)模組、有機電致發光(有機EL)模組等)、作為顯示體模組的一部分之光學構件、或包含顯示體模組之積層體,係至少在黏著劑層側的面具有電極者為較佳。 The second display body component is an optical member, display body module (for example, liquid crystal (LCD) module, light-emitting diode (LED) module, organic electroluminescence that should be attached to the first display body component (Organic EL) module, etc.), an optical member that is part of the display module, or a laminate including the display module, preferably has electrodes at least on the surface on the adhesive layer side.
作為上述光學構件,例如可以舉出電極薄膜、透明導電性薄膜、薄膜感測器、金屬奈米線薄膜、線柵偏光薄膜 等。 Examples of the optical member include electrode films, transparent conductive films, film sensors, metal nanowire films, and wire grid polarizing films. Wait.
作為上述電極,例如可以舉出由銅、銀等構成之金屬電極(包括網狀、柵狀者)、由錫摻雜氧化銦(ITO)等構成之透明導電膜(包括圖案化者)等。如上所述,在上述電極中,以未氧化之金屬為主成分之金屬電極、具體而言由銅或銀構成之金屬電極為較佳。 Examples of the above-mentioned electrodes include metal electrodes (including meshes and grids) made of copper and silver, and transparent conductive films (including patterners) made of tin-doped indium oxide (ITO). As described above, among the above electrodes, a metal electrode mainly composed of an unoxidized metal, specifically, a metal electrode composed of copper or silver is preferred.
作為本實施形態之顯示體的一例,在第2圖中示出靜電容量方式的觸摸面板2。觸摸面板2構成為包括:顯示體模組3;在之上經由黏著劑層4而積層之第1薄膜感測器5a;在之上經由第1黏著劑層11而積層之第2薄膜感測器5b;在之上經由第2黏著劑層11而積層之覆蓋材6。在覆蓋材6的第2黏著劑層11側的面形成有印刷層7,因此存在由印刷層7的有無而形成之段差。本實施形態中,覆蓋材6相當於上述第1顯示體構成構件,第2薄膜感測器5b相當於上述第2顯示體構成構件。
As an example of the display body of this embodiment, the touch panel 2 of the capacitance type is shown in FIG. 2. The touch panel 2 is configured to include: a
本實施形態中之第1黏著劑層11及第2黏著劑層11考慮該等的遷移防止效果,兩者均設為使上述黏著片1的硬化前黏著劑層10藉由活性能量射線的照射而硬化者。但是,本發明並不限定於此,第1黏著劑層11亦可以由其他黏著劑或黏著片形成。作為該情況的黏著劑,可以舉出丙烯酸系黏著劑、橡膠系黏著劑、矽酮系黏著劑、胺基甲酸酯系黏著劑、聚酯系黏著劑、聚乙烯醚系黏著劑等,其中,丙烯酸系黏著劑為較佳。
The first
黏著劑層4可以由上述黏著片1的硬化前黏著劑
層10形成,亦可以由其他黏著劑或黏著片形成。在後者的情況下,作為構成黏著劑層4之黏著劑,可以舉出丙烯酸系黏著劑、橡膠系黏著劑、矽酮系黏著劑、氨基甲酸酯系黏著劑、聚酯系黏著劑、聚乙烯醚系黏著劑等,其中,丙烯酸系黏著劑為較佳。
The adhesive layer 4 can be made of the adhesive before hardening of the above-mentioned
本實施形態中之第1薄膜感測器5a及第2薄膜感測器5b分別包括基材薄膜51及形成於基材薄膜51之電極52。作為基材薄膜51並沒有特別限定,例如可以使用聚對苯二甲酸乙二酯薄膜、丙烯酸薄膜、聚碳酸酯薄膜等。
The first
電極52例如由金屬電極和圖案化透明導電膜等構成,該金屬電極由銅、銀等構成,該圖案化透明導電膜由錫摻雜氧化銦(ITO)等構成。
The
第1薄膜感測器5a的電極52及第2薄膜感測器5b的電極52通常係一個構成X軸方向的電路圖案,另一個構成Y軸方向的電路圖案。
The
本實施形態中之第2薄膜感測器5b的電極52在第2圖中位於第2薄膜感測器5b的上側。另一方面,第1薄膜感測器5a的電極52在第2圖中位於第1薄膜感測器5a的上側,但並不限定於此,亦可以位於第1薄膜感測器5a的下側。
The
以下,對上述觸摸面板2的製造方法的一例進行說明。 Hereinafter, an example of the method of manufacturing the touch panel 2 will be described.
作為黏著片1,準備第1黏著片1及第2黏著片1。從第1黏著片1剝離一個剝離片12a,並將露出之硬化前黏著劑層10(第1硬化前黏著劑層10)以與第1薄膜感測器5a的電極52接觸之方式與該第1薄膜感測器5a貼合。並且,從第2黏著片1剝離一個剝離片12a,並將露出之硬化前黏著劑層10(第2硬化前黏著劑層10)以與第2薄膜感測器5b的電極52接觸之方式與該第2薄膜感測器5b貼合。
As the
並且,剝離第1黏著片中之另一個剝離片12b,並以露出之第1硬化前黏著劑層10與上述第2薄膜感測器5b中之與積層有第2硬化前黏著劑層10之側相反側的面(第1薄膜感測器5a的基材薄膜51的露出面)接觸之方式將兩者貼合。藉此,得到剝離片12b、第2硬化前黏著劑層10、第2薄膜感測器5b、第1硬化前黏著劑層10及第1薄膜感測器5a依次積層而成之積層體。
Then, the
接著,在上述積層體的第1薄膜感測器5a側的面(第1薄膜感測器5a的基材薄膜51的露出面)貼合設置於剝離片上之黏著劑層4。接著,從上述積層體剝離剝離片12b,並對露出之第2硬化前黏著劑層10以覆蓋材6的印刷層7側與該第2硬化前黏著劑層10接觸之方式貼合該覆蓋材6。此時,第2硬化前黏著劑層10由於貼附時的段差追隨性優異,因此可以抑制在籍由印刷層7形成之段差附近產生間隙及浮起。藉由上述貼合,可以得到覆蓋材6、第2硬化前黏著劑層10、第2薄膜感測器5b、第1硬化前黏著劑層10、第1薄膜感測器5a、黏著劑層4及剝離片依次積層而成之構成體。
Next, the adhesive layer 4 provided on the release sheet is bonded to the surface of the layered product on the side of the
接著,從上述構成體的任一側、較佳地從覆蓋材6側對第2硬化前黏著劑層10及第1硬化前黏著劑層10照射活
性能量射線,使第2硬化前黏著劑層10及第1硬化前黏著劑層10硬化來分別作為第2黏著劑層11及第1黏著劑層11。
Next, the second pre-cured adhesive layer 10 and the first pre-cured adhesive layer 10 are irradiated from either side of the above-mentioned structure, preferably from the
最後,從上述構成體剝離剝離片,並以露出之黏著劑層4與顯示體模組3接觸之方式將該構成體貼合於顯示體模組3。藉此,製造第2圖所示之觸摸面板2。
Finally, the release sheet is peeled off from the above-mentioned structure, and the structure is bonded to the
即使在上述觸摸面板2置於高溫高濕條件下並以該狀態對電極52施加電壓之情況下,藉由與電極52接觸之黏著劑層11含有源自具有巰基之矽烷偶合劑(B)之成分,可以有效地抑制電極52的遷移。藉此,可以防止由電極52的斷線及短路引起之觸摸面板2的驅動不良。
Even when the above-mentioned touch panel 2 is placed under high temperature and high humidity conditions and a voltage is applied to the
並且,上述黏著劑層11即使在高溫高濕條件下段差追隨性亦優異,因此即使在觸摸面板2在高溫高濕條件下暴露既定時間之情況下,亦可以有效地抑制在籍由印刷層7形成之段差附近產生氣泡、浮起、剝離等。
In addition, the
另外,即便上述觸摸面板2置於高溫高濕條件下而從覆蓋材6、第2薄膜感測器5b或第1薄膜感測器5a產生逸氣,由於黏著劑層11的抗起泡性優異,因此亦可以抑制在黏著劑層11與覆蓋材6、第2薄膜感測器5b或第1薄膜感測器5a的界面上產生氣泡、浮起、剝離等起泡。
In addition, even if the touch panel 2 is placed under high-temperature and high-humidity conditions to generate outgassing from the
以上說明之實施形態係為了便於理解本發明而記載者,並非為了限定本發明而記載者。因此,上述實施形態中所揭示之各要件係還包含本發明的技術技範圍所屬之所有設計變更和均等物之趣旨。 The above-described embodiments are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, the requirements disclosed in the above embodiments also include all design changes and equivalents of the technical scope of the present invention.
例如,可以省略黏著片1中之剝離片12a、12b中的任一個。
For example, any of the
以下,藉由實施例對本發明進行進一步具體的說明,但本發明的範圍並非限定於該等實施例者。 Hereinafter, the present invention will be further specifically described by examples, but the scope of the present invention is not limited to those examples.
〔實施例1〕 [Example 1]
1.(甲基)丙烯酸酯共聚物的製備 1. Preparation of (meth)acrylate copolymer
使丙烯酸2-乙基己酯60質量份、甲基丙烯酸甲酯20質量份及丙烯酸2-羥基乙酯20質量份共聚而製備(甲基)丙烯酸酯聚合物(A)。利用後述之方法測定該(甲基)丙烯酸酯聚合物(A)的分子量之結果,重量平均分子量(Mw)為60萬。 60 parts by mass of 2-ethylhexyl acrylate, 20 parts by mass of methyl methacrylate and 20 parts by mass of 2-hydroxyethyl acrylate were copolymerized to prepare a (meth)acrylate polymer (A). As a result of measuring the molecular weight of the (meth)acrylate polymer (A) by the method described later, the weight average molecular weight (Mw) was 600,000.
2.黏著性組成物的製備 2. Preparation of adhesive composition
將上述製程1中所得到之(甲基)丙烯酸酯聚合物(A)100質量份(固形成分換算值;以下相同)、作為具有巰基之矽烷偶合劑(B)之3-巰丙基三甲氧基矽烷與甲基三乙氧基矽烷的共縮合物(Shin-Etsu Chemical Co.,Ltd.製,商品名“X-41-1810”,寡聚物型,巰基當量:450g/莫耳)0.20質量份、作為活性能量射線硬化性成分(C)之ε-己內酯改性三-(2-丙烯醯氧乙基)異氰脲酸酯(Shin-Nakamura Chemical Co.,Ltd.製,產品名“NK Ester A-9300-1CL”)2.5質量份、作為交聯劑(D)之三羥甲基丙烷改性甲苯二異氰酸酯(Nippon Polyurethane Industry Co.,Ltd.製,產品名“Coronate L”)0.23質量份、作為光聚合起始劑(E)之將二苯甲酮與1-羥基環己基苯基酮以1:1的質量比混合而成者(BASF公司製,產品名“IRGACURE 500“)0.25質量份進行混合並充分攪拌,並且利 用甲乙酮稀釋,藉此得到固形成分濃度36質量%的黏著性組成物的塗佈溶液。 100 parts by mass of (meth)acrylate polymer (A) obtained in the above process 1 (converted value of solid content; the same below), 3-mercaptopropyltrimethoxy, which is a silane coupling agent (B) having a mercapto group Co-condensate of trisilane and methyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name "X-41-1810", oligomer type, mercapto equivalent: 450 g/mole) 0.20 Mass parts, ε-caprolactone modified tri-(2-acryloyloxyethyl)isocyanurate (manufactured by Shin-Nakamura Chemical Co., Ltd., as active energy ray hardening component (C), product Name "NK Ester A-9300-1CL") 2.5 parts by mass, trimethylolpropane modified toluene diisocyanate (made by Nippon Polyurethane Industry Co., Ltd. as a crosslinking agent (D), product name "Coronate L" ) 0.23 parts by mass, as a photopolymerization initiator (E), a mixture of benzophenone and 1-hydroxycyclohexyl phenyl ketone in a mass ratio of 1:1 (manufactured by BASF, product name "IRGACURE 500" ") 0.25 parts by mass are mixed and fully stirred, and It was diluted with methyl ethyl ketone to obtain a coating solution of an adhesive composition having a solid content concentration of 36% by mass.
其中,將(甲基)丙烯酸酯聚合物(A)設為100質量份(固形成分換算值)時的黏著性組成物的各配合(固形成分換算值)示於表1。另外,表1中所記載之縮寫等的詳細內容如下所示。 In addition, Table 1 shows each blending (solid content conversion value) of the adhesive composition when the (meth)acrylate polymer (A) is 100 parts by mass (solid content conversion value). The details of the abbreviations and the like described in Table 1 are as follows.
2EHA:丙烯酸2-乙基己酯 2EHA: 2-ethylhexyl acrylate
MMA:甲基丙烯酸甲酯 MMA: methyl methacrylate
HEA:丙烯酸2-羥基乙酯 HEA: 2-hydroxyethyl acrylate
X-41-1810:3-巰丙基三甲氧基矽烷與甲基三乙氧基矽烷的共縮合物(Shin-Etsu Chemical Co.,Ltd.製,商品名“X-41-1810”,寡聚物型,巰基當量:450g/莫耳) X-41-1810: Co-condensate of 3-mercaptopropyltrimethoxysilane and methyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name "X-41-1810", oligo Polymer type, mercapto equivalent: 450g/mol)
KBM-803:3-巰丙基三甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製,商品名“KBM-803”,低分子型,巰基當量:196.4g/莫耳) KBM-803: 3-mercaptopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name "KBM-803", low molecular type, mercapto equivalent: 196.4g/mol)
KBM-403:3-縮水甘油醚氧丙基三甲氧基矽烷(Shin-Etsu Silicone Co.,Ltd.製,商品名“KBM-403”,低分子型) KBM-403: 3-glycidyl ether oxypropyl trimethoxysilane (manufactured by Shin-Etsu Silicone Co., Ltd., trade name "KBM-403", low molecular type)
KBE-9007:3-異氰酸酯丙基三乙氧基矽烷(Shin-Etsu Silicone Co.,Ltd.製,商品名“KBE-9007”,低分子型) KBE-9007: 3-isocyanate propyl triethoxysilane (manufactured by Shin-Etsu Silicone Co., Ltd., trade name "KBE-9007", low molecular type)
NK Ester A-9300-1CL:ε-己內酯改性三-(2-丙烯醯氧乙 基)異氰脲酸酯(Shin-Nakamura Chemical Co.,Ltd.製,產品名“NK Ester A-9300-1CL”) NK Ester A-9300-1CL: ε-caprolactone modified tri-(2-propenyl oxyethylene) Base) isocyanurate (manufactured by Shin-Nakamura Chemical Co., Ltd., product name "NK Ester A-9300-1CL")
NK Ester A-TMM-3L:季戊四醇三丙烯酸酯(三酯55質量%)(Shin-Nakamura Chemical Co.,Ltd.製,產品名“NK Ester A-TMM-3L”) NK Ester A-TMM-3L: pentaerythritol triacrylate (triester 55 mass%) (manufactured by Shin-Nakamura Chemical Co., Ltd., product name "NK Ester A-TMM-3L")
3.黏著片的製造 3. Manufacturing of adhesive sheet
在將聚對苯二甲酸乙二酯薄膜的一面利用矽酮系剝離劑進行剝離處理而得到之重剝離型剝離片(LINTEC Corporation製,商品名“SP-PET382150”,厚度:38μm)的剝離處理面上,利用刮刀式塗佈機塗佈上述製程2中所得到之黏著性組成物的塗佈溶液之後,在90℃下加熱處理1分鐘而形成塗佈層(厚度:25μm)。同樣地,在將聚對苯二甲酸乙二酯薄膜的一面利用矽酮系剝離劑進行剝離處理而得到之輕剝離型剝離片(LINTEC Corporation製,產品名“SP-PET382120”)的剝離處理面上,利用刮刀式塗佈機塗佈上述製程2中所得到之黏著性組成物的塗佈溶液之後,在90℃下加熱處理1分鐘而形成塗佈層(厚度:25μm)。 Peeling treatment of a heavy peeling type peeling sheet (product name "SP-PET382150" manufactured by LINTEC Corporation, thickness: 38 μm) obtained by peeling the polyethylene terephthalate film on one side with a silicone peeling agent On the surface, after applying the coating solution of the adhesive composition obtained in the above process 2 with a doctor blade coater, heat treatment was performed at 90°C for 1 minute to form a coating layer (thickness: 25 μm). Similarly, the peeling surface of the light peeling type release sheet (product name "SP-PET382120" manufactured by LINTEC Corporation) obtained by peeling the polyethylene terephthalate film on one side with a silicone-based peeling agent. After coating the coating solution of the adhesive composition obtained in the above process 2 with a blade coater, heat treatment is performed at 90°C for 1 minute to form a coating layer (thickness: 25 μm).
接著,將上述中所得到之帶塗佈層之重剝離型剝離片與上述中所得到之帶塗佈層之輕剝離型剝離片以兩個塗佈層相互接觸之方式進行貼合,並在23℃、50%RH的條件下熟化7天,藉此製作由重剝離型剝離片/硬化前黏著劑層(厚度:50μm)/輕剝離型剝離片構成之黏著片。 Next, the heavy peeling type release sheet with the coating layer obtained in the above and the light peeling type release sheet with the coating layer obtained in the above are laminated in such a manner that the two coating layers are in contact with each other, and the It was cured for 7 days under the conditions of 23° C. and 50% RH, thereby preparing an adhesive sheet composed of a heavy peeling type peeling sheet/adhesive layer before curing (thickness: 50 μm)/a light peeling type peeling sheet.
〔實施例2~10、比較例1~10〕 [Examples 2 to 10, Comparative Examples 1 to 10]
如表1所示般改變矽烷偶合劑(具有巰基之矽烷偶合劑 (B)及其他矽烷偶合劑)的種類及比例、活性能量射線硬化性成分(C)的種類及比例、交聯劑(D)的比例、以及光聚合起始劑(E)的比例,除此以外,與實施例1同樣地製造黏著片。另外,對於比較例7~10,將N,N-雙(2-乙基己基)-(4或5)-甲基-1H-苯并三唑-1-甲胺(BASF公司製,商品名“IRGMET 39”)作為防鏽劑以表1所示之比例配合於黏著性組成物中。並且,比較例1~10的黏著性組成物係活性能量射線非硬化性,一般係使該黏著性組成物熱交聯而得到者成為黏著劑,但方便起見,有時由該黏著劑構成之層亦稱為“硬化前黏著劑層”。 Change the silane coupling agent (silane coupling agent with mercapto group) as shown in Table 1. (B) and other silane coupling agents) types and ratios, types and ratios of active energy ray hardening components (C), crosslinking agents (D), and photopolymerization initiator (E), except Other than this, the adhesive sheet was produced like Example 1. In addition, for Comparative Examples 7 to 10, N,N-bis(2-ethylhexyl)-(4 or 5)-methyl-1H-benzotriazole-1-methylamine (manufactured by BASF, trade name) "IRGMET 39") was added as a rust inhibitor in the adhesive composition in the ratio shown in Table 1. In addition, the adhesive compositions of Comparative Examples 1 to 10 are non-hardening active energy rays. Generally, those obtained by thermally crosslinking the adhesive composition become adhesives, but for convenience, they are sometimes composed of the adhesive The layer is also called "adhesive layer before hardening".
其中,前述重量平均分子量(Mw)係使用凝膠滲透色譜(GPC)在以下條件下測定(GPC測定)之聚苯乙烯換算的重量平均分子量。 Here, the weight average molecular weight (Mw) is a polystyrene-equivalent weight average molecular weight measured (GPC measurement) under the following conditions using gel permeation chromatography (GPC).
.GPC測定裝置:TOSOH CORPORATION製,HLC-8020 . GPC measuring device: made by TOSOH CORPORATION, HLC-8020
.GPC柱(按以下順序通過):TOSOH CORPORATION製 . GPC column (passed in the following order): manufactured by TOSOH CORPORATION
TSK guard column HXL-H TSK guard column HXL-H
TSK gel GMHXL(×2) TSK gel GMHXL (×2)
TSK gel G2000HXL TSK gel G2000HXL
.測定溶劑:四氫呋喃 . Determination solvent: tetrahydrofuran
.測定溫度:40℃ . Measuring temperature: 40℃
〔試驗例1〕(凝膠分率的測定) [Test Example 1] (Measurement of gel fraction)
將實施例及比較例中所得到之黏著片裁剪為80mm×80mm的尺寸,將其硬化前黏著劑層包在聚酯製網(網眼尺寸200) 中,藉由精密天平秤取其質量,減去上述網單獨的質量,藉此計算硬化前黏著劑本身的質量。將此時的質量設為M1。 The adhesive sheets obtained in the examples and comparative examples were cut to a size of 80 mm × 80 mm, and the adhesive layer before being cured was wrapped in a polyester mesh (mesh size 200) In the process, take the mass of the precision balance scale and subtract the mass of the above net to calculate the mass of the adhesive itself before hardening. Let the mass at this time be M1.
接著,在室溫下(23℃),將包在上述聚酯製網中之硬化前黏著劑在乙酸乙酯中浸漬24小時。其後,取出硬化前黏著劑,在溫度23℃、相對濕度50%的環境下風乾24小時,另外,在80℃的烘箱中乾燥12小時。乾燥後,藉由精密天平秤取其質量,減去上述網單獨的質量,藉此計算硬化前黏著劑本身的質量。將此時的質量設為M2。以(M2/M1)×100表示凝膠率(%)。將結果示於表2。 Next, at room temperature (23°C), the pre-curing adhesive wrapped in the polyester net was immersed in ethyl acetate for 24 hours. After that, the adhesive before hardening was taken out, air-dried for 24 hours in an environment with a temperature of 23° C. and a relative humidity of 50%, and dried in an oven at 80° C. for 12 hours. After drying, take the mass with a precision balance scale and subtract the mass of the above net alone to calculate the mass of the adhesive itself before hardening. Let the mass at this time be M2. The gel ratio (%) is represented by (M2/M1)×100. The results are shown in Table 2.
並且,對實施例中所得到之黏著片的硬化前黏著劑層,隔著輕剝離型剝離片籍由紫外線照射裝置(EYE GRAPHICS Co.,Ltd.製,產品名“Eye Grandage ECS-401GX型”)在下述條件下照射紫外線,使硬化前黏著劑層硬化而作為黏著劑層。對於該黏著劑層,與上述硬化前黏著劑層同樣地測定凝膠分率(%)。將結果示於表2。 In addition, the pre-cured adhesive layer of the adhesive sheet obtained in the example was subjected to an ultraviolet irradiation device (manufactured by EYE GRAPHICS Co., Ltd., product name "Eye Grandage ECS-401GX type" through a light peeling type peeling sheet. ) UV rays are irradiated under the following conditions to harden the adhesive layer before curing to serve as an adhesive layer. For this adhesive layer, the gel fraction (%) was measured in the same manner as the adhesive layer before hardening. The results are shown in Table 2.
.光源:高壓水銀燈 . Light source: high pressure mercury lamp
.光量:1000mJ/cm2 . Light quantity: 1000mJ/cm 2
.照度:200mW/cm2 . Illumination: 200mW/cm 2
〔試驗例2〕(黏著力的測定) [Test Example 2] (Measurement of Adhesion)
從實施例及比較例中所得到之黏著片上剝離輕剝離型剝離片,並將暴露之硬化前黏著劑層貼合於具有易接著層之聚對苯二甲酸乙二酯(PET)薄膜(TOYOBO CO.,LTD.製,產品名“PET A4300”,厚度:100μm)的易接著層,從而得到重剝離型 剝離片/硬化前黏著劑層/PET薄膜的積層體。將所得到之積層體裁斷為25mm宽度、100mm長度,將其作為樣品。 Lightly peel off the release sheet from the adhesive sheets obtained in Examples and Comparative Examples, and attach the exposed pre-hardened adhesive layer to a polyethylene terephthalate (PET) film (TOYOBO) with an easy-adhesive layer Made by CO., LTD., product name "PET A4300", thickness: 100μm) easy-to-adhesive layer, to obtain a heavy peel type Laminate of release sheet/adhesive layer before curing/PET film. The obtained laminate was cut into a width of 25 mm and a length of 100 mm, and used as a sample.
在23℃、50%RH的環境下,從上述樣品剝離重剝離型剝離片,並將露出之硬化前黏著劑層貼附於鈉鈣玻璃(Nippon Sheet Glass Co.,Ltd.製)之後,利用KURIHARA CORPORATION製高壓釜在0.5MPa、50℃下加壓20分鐘。其後,在23℃、50%RH的條件下放置24小時之後,使用拉伸試驗機(ORIENTEC Co.,LTD.製,TENSILON)在剝離速度300mm/min、剝離角度180度的條件下測定黏著力(N/25mm)。在此所記載之以外的條件遵照JIS Z 0237:2009來進行測定。將結果示於表2。 In an environment of 23° C. and 50% RH, the heavy-peel release sheet was peeled from the above sample, and the exposed adhesive layer before hardening was attached to soda lime glass (manufactured by Nippon Sheet Glass Co., Ltd.), and then used The autoclave made by KURIHARA CORPORATION was pressurized at 0.5 MPa and 50°C for 20 minutes. Thereafter, after being left under the conditions of 23° C. and 50% RH for 24 hours, the adhesion was measured using a tensile tester (manufactured by ORIENTEC Co., LTD., TENSILON) at a peeling speed of 300 mm/min and a peeling angle of 180 degrees. Force (N/25mm). Conditions other than those described here were measured in accordance with JIS Z 0237:2009. The results are shown in Table 2.
並且,將上述樣品(僅對實施例)如上所述般貼附於鈉鈣玻璃,並利用KURIHARA CORPORATION製高壓釜在0.5MPa、50℃下加壓20分鐘之後,在與試驗例1相同的紫外線照射條件下,隔著PET薄膜而對硬化前黏著劑層照射紫外線,使硬化前黏著劑層硬化而作為黏著劑層。對於具有該黏著劑層之樣品,與上述同樣地測定黏著力(N/25mm)。將結果示於表2。 Then, after the above sample (only for the example) was attached to soda lime glass as described above and pressurized at 0.5 MPa and 50° C. for 20 minutes using an autoclave made by KURIHARA CORPORATION, the same ultraviolet rays as in Test Example 1 were applied. Under irradiation conditions, the adhesive layer before hardening is irradiated with ultraviolet rays through a PET film to harden the adhesive layer before hardening as an adhesive layer. For the sample having this adhesive layer, the adhesive force (N/25 mm) was measured in the same manner as above. The results are shown in Table 2.
〔試驗例3〕(遷移防止效果的評價) [Test Example 3] (Evaluation of migration prevention effect)
(1)配線基板的作製 (1) Fabrication of wiring board
在將銅箔(厚度:18μm)與聚對苯二甲酸乙二酯薄膜(厚度:50μm)積層而成之敷銅積層板(NIKKAN INDUSTRIES Co.,Ltd.製,產品名“NIKAFLEX”)的銅箔表面上,利用網版印刷法印刷蝕刻抗蝕劑圖案。其後,藉由蝕刻去除不需要的銅箔 而形成梳形電極。各電極的線寬為300μm,電極相互間的間隙為50μm。 Copper on a copper-clad laminate (manufactured by NIKKAN INDUSTRIES Co., Ltd., product name "NIKAFLEX") formed by laminating copper foil (thickness: 18 μm) and polyethylene terephthalate film (thickness: 50 μm) On the surface of the foil, a resist pattern is printed and etched by screen printing. Thereafter, the unnecessary copper foil is removed by etching Instead, a comb-shaped electrode is formed. The line width of each electrode is 300 μm, and the gap between the electrodes is 50 μm.
(2)遷移防止效果的評價 (2) Evaluation of migration prevention effect
從實施例及比較例中所得到之黏著片剝離輕剝離型剝離片,並將露出之硬化前黏著劑層貼合於具有易接著層之聚對苯二甲酸乙二酯(PET)薄膜(TOYOBO CO.,LTD.製,產品名“PET A4300”,厚度:100μm)的易接著層,從而得到重剝離型剝離片/硬化前黏著劑層/PET薄膜的積層體。接著,從上述積層體剝離重剝離型剝離片,並將露出之硬化前黏著劑層貼附於上述梳形電極上。 From the adhesive sheets obtained in the examples and comparative examples, the light peeling type release sheet was peeled off, and the exposed pre-hardened adhesive layer was attached to a polyethylene terephthalate (PET) film (TOYOBO) with an easy adhesion layer Made by CO., LTD., product name "PET A4300", thickness: 100 μm) easy-adhesive layer, to obtain a laminate of a heavy peelable release sheet/adhesive layer before curing/PET film. Next, the heavy peeling type peeling sheet was peeled from the laminate, and the exposed adhesive layer before curing was attached to the comb-shaped electrode.
在與試驗例1相同的紫外線照射條件下,隔著PET薄膜而對上述硬化前黏著劑層(僅對實施例)照射紫外線,使硬化前黏著劑層硬化而作為黏著劑層。 Under the same ultraviolet irradiation conditions as in Test Example 1, the above-mentioned pre-curing adhesive layer (only for the example) was irradiated with ultraviolet rays through a PET film to harden the pre-curing adhesive layer to serve as an adhesive layer.
在85℃、85%RH的濕熱條件下靜置如上述所得之樣品,以該狀態對電極間施加5V的電壓來進行遷移試驗。自試驗開始起8小時後、24小時後及48小時後,利用光學顯微鏡(倍率:10倍)對梳形電極進行觀察,並基於以下所示之評價基準評價遷移防止效果。將結果示於表2。 The sample obtained as described above was allowed to stand under humid heat conditions of 85° C. and 85% RH, and a voltage of 5 V was applied between the electrodes in this state to conduct a migration test. After 8 hours, 24 hours, and 48 hours from the start of the test, the comb electrode was observed with an optical microscope (magnification: 10 times), and the migration prevention effect was evaluated based on the evaluation criteria shown below. The results are shown in Table 2.
◎:完全未觀察到電極(正極)的溶解及在電極(負極)中形成樹枝結晶。 ◎: No dissolution of the electrode (positive electrode) and formation of dendrites in the electrode (negative electrode) were observed at all.
○:僅在電極(正極)的端部觀察到溶解,未觀察到在電極(負極)中形成樹枝結晶。 ○: Dissolution was observed only at the end of the electrode (positive electrode), and no dendrite formation was observed in the electrode (negative electrode).
×:觀察到電極(正極)的溶解及在電極(負極)中形成樹枝結晶。 ×: Dissolution of the electrode (positive electrode) and formation of dendrites in the electrode (negative electrode) were observed.
另外,將上述評價基準的參考圖像示於第3圖。 In addition, the reference image of the above-mentioned evaluation criteria is shown in FIG. 3.
〔試驗例4〕(段差追隨性的評價) [Experiment Example 4] (Evaluation of step followability)
(a)評價用樣品的製作 (a) Preparation of samples for evaluation
在玻璃板(NSG Precision Co.,Ltd.製造,產品名“Corning Glass EAGLE XG”,縱90mm×橫50mm×厚度0.5mm)的表面網版印刷紫外線硬化型油墨(Teikoku Printing Inks Mfg.Co.,Ltd.製造,產品名“POS-911油墨”),使得塗佈厚度成為5μm、10μm、15μm及20μm中的任意一種的邊框狀(外形:縱90mm×橫50mm,寬5mm)。接著,照射紫外線(80W/cm2,金屬鹵化物燈兩個,燈高為15cm,帶速為10~15m/分鐘),以使印刷之上述紫外線硬化型油墨硬化,從而製作藉由印刷而具有段差(段差的高度:5μm、10μm、15μm及20μm中的任意一種)之附帶段差之玻璃板。 Ultraviolet hardening ink (Teikoku Printing Inks Mfg. Co., is printed on the surface of a glass plate (manufactured by NSG Precision Co., Ltd., product name "Corning Glass EAGLE XG", 90 mm long x 50 mm wide x 0.5 mm thick) The product name "POS-911 Ink" manufactured by Ltd.) makes the thickness of the coating be any of 5 μm, 10 μm, 15 μm, and 20 μm (outer shape: vertical 90 mm × horizontal 50 mm, width 5 mm). Next, irradiate ultraviolet rays (80W/cm 2 , two metal halide lamps, lamp height is 15cm, belt speed is 10~15m/min) to harden the printed ultraviolet curable ink, so as to produce by printing A glass plate with a step (the height of the step: any of 5 μm, 10 μm, 15 μm, and 20 μm) with a step.
從在實施例及比較例中所得之黏著片剝離輕剝離型剝離片,並將所露出之硬化前黏著劑層貼合於具有易接著層之聚對苯二甲酸乙二酯(PET)薄膜(TOYOBO Co.,Ltd.製造,PET A4300,厚度:100μm)的易接著層。接著,剝離重剝離型剝離片,並揭開硬化前黏著劑層。之後,使用積層機(FUJIPLA Inc.製造,產品名“LPD3214”)以硬化前黏著劑層覆蓋邊框狀的整個印刷面之方式將上述積層體積層到各附帶段差的玻璃板上。 The light peeling type release sheet was peeled off from the adhesive sheets obtained in Examples and Comparative Examples, and the exposed pre-hardened adhesive layer was attached to a polyethylene terephthalate (PET) film having an easy adhesion layer ( Easy adhesion layer manufactured by TOYOBO Co., Ltd., PET A4300, thickness: 100 μm). Next, the heavy peeling type peeling sheet is peeled off, and the adhesive layer before hardening is peeled off. Then, using a laminating machine (manufactured by FUJIPLA Inc., product name "LPD3214"), the above-mentioned laminated volume was layered onto each glass plate with a step such that the adhesive layer before hardening covered the entire printing surface in a frame shape.
在與試驗例1相同的紫外線照射條件下,隔著PET薄膜而對上述硬化前黏著劑層(僅對實施例)照射紫外線,使硬化前黏著劑層硬化而作為黏著劑層。 Under the same ultraviolet irradiation conditions as in Test Example 1, the above-mentioned pre-curing adhesive layer (only for the example) was irradiated with ultraviolet rays through a PET film to harden the pre-curing adhesive layer to serve as an adhesive layer.
(b)評價用樣品的評價 (b) Evaluation of samples for evaluation
在50℃、0.5MPa的條件下,對如上述所得之評價用樣品進行30分鐘高壓釜處理之後,在常壓、23℃、50%RH下放置24小時。接著,在85℃、85%RH的耐久條件下保管72小時。其後,目視確認黏著劑層(尤其由印刷層形成之段差的附近),並依照以下基準評價段差追隨性。將結果示於表2。 Under the conditions of 50° C. and 0.5 MPa, the sample for evaluation obtained as described above was autoclaved for 30 minutes and then left at normal pressure, 23° C. and 50% RH for 24 hours. Next, it was stored under endurance conditions of 85°C and 85% RH for 72 hours. Thereafter, the adhesive layer (especially in the vicinity of the step formed by the printed layer) was visually confirmed, and the step followability was evaluated according to the following criteria. The results are shown in Table 2.
◎:完全沒有氣泡及浮起。 ◎: No bubbles and floating at all.
○:在段差附近觀察到少於10個的氣泡。 ○: Less than 10 bubbles were observed near the step.
×:存在氣泡和/或浮起。 ×: There are bubbles and/or floating.
〔試驗例5〕(抗起泡性的評價) [Test Example 5] (Evaluation of anti-foaming property)
將實施例及比較例中所得到之黏著片的硬化前黏著劑層夾在一面設有由錫摻雜氧化銦(ITO)構成之透明導電膜之聚對苯二甲酸乙二酯(PET)薄膜(OIKE & Co.,Ltd.製,ITO薄膜,厚度:125μm)的透明導電膜與聚碳酸酯板(Mitsubishi Gas Chemical Company,Inc.製,產品名“Iupilon.sheet MR58”,厚度:1mm)之間而得到積層體。 A polyethylene terephthalate (PET) film with a transparent conductive film made of tin-doped indium oxide (ITO) sandwiched on one side of the pre-hardened adhesive layer of the adhesive sheet obtained in Examples and Comparative Examples (Oike & Co., Ltd., ITO film, thickness: 125μm) transparent conductive film and polycarbonate plate (Mitsubishi Gas Chemical Company, Inc., product name "Iupilon. sheet MR58", thickness: 1mm) From time to time, a laminate is obtained.
在50℃、0.5MPa的條件下,對所得到之積層體進行30分鐘高壓釜處理。並且,對於實施例的積層體,在與試驗例1相同的紫外線照射條件下,隔著PET薄膜而照射紫外線,使硬化前黏著劑層硬化而作為黏著劑層。 Under the conditions of 50°C and 0.5 MPa, the obtained laminate was subjected to autoclave treatment for 30 minutes. Furthermore, the laminate of the examples was irradiated with ultraviolet rays through the PET film under the same ultraviolet irradiation conditions as in Test Example 1, and the adhesive layer before curing was cured as an adhesive layer.
將如上述所得之樣品在常壓、23℃、50%RH下放置15小時之後,在85℃、85%RH的高溫高濕條件下保管72小時。其後,目視確認黏著劑層與被黏物的界面上之氣泡、浮起或剝離,並依照以下基準評價抗起泡性。將結果示於表2。 After the sample obtained as described above was left at normal pressure, 23° C., and 50% RH for 15 hours, it was stored under high temperature and high humidity conditions at 85° C. and 85% RH for 72 hours. Thereafter, bubbles, floating or peeling at the interface of the adhesive layer and the adherend were visually confirmed, and the anti-foaming resistance was evaluated according to the following criteria. The results are shown in Table 2.
◎......完全沒有氣泡、浮起及剝離。 ◎...... No bubbles, floating and peeling at all.
○......僅產生直径0.2mm以下的氣泡。 ○......Only bubbles with a diameter of 0.2 mm or less are generated.
×......產生直怪超過0.2mm的氣泡、浮起或剝離。 ×......Bubble, floating or peeling that exceeds 0.2mm straight.
〔試驗例6〕(耐濕熱白化性的評價) [Test Example 6] (Evaluation of Dampness and Whitening Resistance)
將實施例或比較例中所得到之黏著片的硬化前黏著劑層利用厚度1.1mm的兩片無鹼性玻璃夾住而得到積層體。並且,對於實施例的積層體,在與試驗例1相同的紫外線照射條件下,隔著一個玻璃而照射紫外線,使硬化前黏著劑層硬化而作為黏著劑層。 The pre-hardened adhesive layer of the adhesive sheet obtained in the example or the comparative example was sandwiched between two pieces of non-alkali glass with a thickness of 1.1 mm to obtain a laminate. Furthermore, the laminate of the examples was irradiated with ultraviolet rays through a glass under the same ultraviolet irradiation conditions as in Test Example 1, and the adhesive layer before curing was cured to serve as an adhesive layer.
在85℃、85%RH的條件下,將如上述所得之樣品保管120小時。其後,恢復23℃、50%RH的常溫常濕,依照以下基準目視確認白化的有無來,評價耐濕熱白化性,並且測定黏著劑層的霧度值。關於霧度值,使樣品恢復常溫常濕之後在30分鐘以內,使用霧度計(NIPPON DENSHOKU INDUSTRIES Co.,LTD.製,產品名“NDH2000”)按照JIS K7136:2000進行測定。將結果示於表2。 Under the conditions of 85° C. and 85% RH, the sample obtained as described above was stored for 120 hours. After that, normal temperature and humidity at 23° C. and 50% RH were restored, the presence or absence of whitening was visually confirmed according to the following criteria, the humidity-heat whitening resistance was evaluated, and the haze value of the adhesive layer was measured. The haze value was measured within 30 minutes after returning the sample to normal temperature and humidity using a haze meter (manufactured by NIPPON DENSHOKU INDUSTRIES Co., Ltd., product name "NDH2000") in accordance with JIS K7136:2000. The results are shown in Table 2.
○:即使恢復常溫常濕亦未確認到白化。或者,一部分發生白化,但在30分鐘以內消失。 ○: Even if normal temperature and humidity were restored, no whitening was confirmed. Alternatively, some of them may be whitened, but disappear within 30 minutes.
×:整體發生白化。或者,一部分發生白化之後,即使在常溫常濕下保管亦無法恢復原狀態。 ×: Whitening occurred overall. Or, after a part of whitening occurs, it cannot be restored to its original state even if it is stored under normal temperature and humidity.
【表1】
由表2可知,實施例中所得到之黏著片係遷移防止效果、段差追隨性、抗起泡性及耐濕熱白化性中的任一個均 優異者。 It can be seen from Table 2 that any of the adhesive sheet obtained in the examples has the effects of migration prevention, step-following, blistering resistance, and heat-heat-whitening resistance. Outstanding.
本發明之黏著性組成物及黏著片例如可以較佳地用於使用銅電極或銀電極之靜電容量方式的觸摸面板。並且,本發明之顯示體例如較佳地作為使用銅電極或銀電極之靜電容量方式的觸摸面板。 The adhesive composition and the adhesive sheet of the present invention can be preferably used for a touch panel using an electrostatic capacitance method using copper electrodes or silver electrodes, for example. In addition, the display body of the present invention is preferably used as a capacitive touch panel using a copper electrode or a silver electrode, for example.
1‧‧‧黏著片 1‧‧‧ Adhesive sheet
10‧‧‧硬化前黏著劑層 10‧‧‧adhesive layer before hardening
12a、12b‧‧‧剝離片 12a, 12b ‧‧‧ peeling sheet
Claims (9)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015131941A JP6554344B2 (en) | 2015-06-30 | 2015-06-30 | Adhesive sheet and display |
| JP2015-131941 | 2015-06-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201708475A TW201708475A (en) | 2017-03-01 |
| TWI691570B true TWI691570B (en) | 2020-04-21 |
Family
ID=57725179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105119070A TWI691570B (en) | 2015-06-30 | 2016-06-17 | Adhesive composition, adhesive sheet and display |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6554344B2 (en) |
| KR (1) | KR102478197B1 (en) |
| CN (1) | CN106318281B (en) |
| TW (1) | TWI691570B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7184035B2 (en) * | 2017-06-23 | 2022-12-06 | 三菱ケミカル株式会社 | PHOTOCURABLE ADHESIVE SHEET, LAYER FOR CONSTRUCTION OF IMAGE DISPLAY DEVICE, METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE, AND METHOD FOR Suppressing Corrosion of Conductive Member |
| JP7170387B2 (en) * | 2017-08-21 | 2022-11-14 | リンテック株式会社 | Adhesive sheet and display |
| JP7132702B2 (en) * | 2017-08-30 | 2022-09-07 | リンテック株式会社 | DISPLAY BODY AND METHOD OF MANUFACTURING DISPLAY BODY |
| JP2019044024A (en) * | 2017-08-30 | 2019-03-22 | リンテック株式会社 | Adhesive sheet, display body and method for manufacturing display body |
| JPWO2019151509A1 (en) * | 2018-02-02 | 2021-01-28 | 東亞合成株式会社 | Active energy ray-curable composition and its use |
| CN108587484A (en) * | 2018-03-28 | 2018-09-28 | 广州慧谷工程材料有限公司 | A kind of optical film adhesive for being bonded entirely and its preparation method and application and based on its optical film |
| JP7273501B2 (en) * | 2018-12-27 | 2023-05-15 | リンテック株式会社 | Adhesive sheet, structure, and method for producing structure |
| JP7348727B2 (en) * | 2019-02-12 | 2023-09-21 | 日東電工株式会社 | reinforcing film |
| TWI716251B (en) * | 2019-04-15 | 2021-01-11 | 萬達光電科技股份有限公司 | Touch display device |
| JP7429544B2 (en) * | 2020-01-17 | 2024-02-08 | リンテック株式会社 | Laminated film, printed body, and method for producing printed body |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201504376A (en) * | 2013-06-28 | 2015-02-01 | Lintec Corp | Adhesive composition, adhesive agent and adhesive sheet |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007317563A (en) * | 2006-05-26 | 2007-12-06 | Sumitomo Electric Ind Ltd | Adhesive for circuit connection |
| JP5162908B2 (en) * | 2006-05-26 | 2013-03-13 | 住友化学株式会社 | Optical laminate having polarizing film with adhesive and set of polarizing film |
| JP2008166314A (en) * | 2006-12-26 | 2008-07-17 | Sumitomo Bakelite Co Ltd | Semiconductor device and epoxy resin composition for sealing |
| JP5552338B2 (en) * | 2010-03-12 | 2014-07-16 | リンテック株式会社 | Adhesive composition, adhesive and adhesive sheet |
| JP2012153827A (en) * | 2011-01-27 | 2012-08-16 | Seiko Instruments Inc | Electrode corrosion inhibitor and light emitting device using the electrode corrosion inhibitor |
| JP5278628B1 (en) * | 2011-09-20 | 2013-09-04 | Dic株式会社 | Adhesive sheet for metal surface sticking |
| JP6071224B2 (en) * | 2012-03-28 | 2017-02-01 | リンテック株式会社 | Adhesive sheet |
| JP2014047254A (en) * | 2012-08-30 | 2014-03-17 | Nitto Denko Corp | Double-sided adhesive sheet, laminate and removal method of plate |
| JP6112893B2 (en) * | 2013-02-13 | 2017-04-12 | リンテック株式会社 | Adhesive composition, adhesive and adhesive sheet |
| JP6271156B2 (en) | 2013-02-14 | 2018-01-31 | 日東電工株式会社 | Adhesive composition, adhesive layer, adhesive sheet, optical member, and touch panel |
| JP5967007B2 (en) * | 2013-04-24 | 2016-08-10 | 王子ホールディングス株式会社 | Adhesive sheet, method of using the same, and laminate |
| KR101806813B1 (en) * | 2013-04-24 | 2017-12-08 | 오지 홀딩스 가부시키가이샤 | Adhesive sheet and laminate, and method for producing same |
| JP6325777B2 (en) * | 2013-06-28 | 2018-05-16 | リンテック株式会社 | Adhesive sheet and laminate |
| KR101882560B1 (en) * | 2014-08-01 | 2018-07-26 | 삼성에스디아이 주식회사 | Adhesive composition, adhesive film, optical member and adhesive sheet |
-
2015
- 2015-06-30 JP JP2015131941A patent/JP6554344B2/en active Active
-
2016
- 2016-06-17 TW TW105119070A patent/TWI691570B/en active
- 2016-06-23 KR KR1020160078623A patent/KR102478197B1/en active Active
- 2016-06-24 CN CN201610472169.6A patent/CN106318281B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201504376A (en) * | 2013-06-28 | 2015-02-01 | Lintec Corp | Adhesive composition, adhesive agent and adhesive sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201708475A (en) | 2017-03-01 |
| JP6554344B2 (en) | 2019-07-31 |
| CN106318281B (en) | 2020-10-09 |
| CN106318281A (en) | 2017-01-11 |
| KR102478197B1 (en) | 2022-12-15 |
| JP2017014379A (en) | 2017-01-19 |
| KR20170003413A (en) | 2017-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI691570B (en) | Adhesive composition, adhesive sheet and display | |
| TWI619793B (en) | Adhesive sheet and laminated body | |
| TWI676667B (en) | Adhesive sheet and laminated body | |
| TWI753903B (en) | Adhesive sheet, display body and manufacturing method of the same | |
| JP2017075281A (en) | Adhesive sheet and display body | |
| JP6251293B2 (en) | Adhesive sheet and display body manufacturing method | |
| JP7304683B2 (en) | Adhesive sheets and laminates | |
| CN106103622B (en) | Adhesives and Adhesive Sheets | |
| JP2016216624A (en) | Adhesive sheet and display body | |
| JPWO2015155844A1 (en) | Adhesive sheet and laminate | |
| JPWO2016063405A6 (en) | Adhesive sheet and display body manufacturing method | |
| JP2018173549A (en) | Adhesive composition, adhesive, adhesive sheet, and display body | |
| JP6270941B2 (en) | Adhesive, adhesive sheet, and display body manufacturing method | |
| TWI746441B (en) | Adhesive composition, adhesive, adhesive sheet and display body | |
| JP2020114903A (en) | Pressure sensitive adhesive compositions, pressure sensitive adhesives, pressure sensitive adhesive sheet, and display body | |
| JP2023150617A (en) | Adhesive sheet and display | |
| TWI772262B (en) | adhesive sheet | |
| TW202436561A (en) | Adhesive sheet and display body | |
| JP2024106142A (en) | Pressure-sensitive adhesive sheet, laminate, and method for producing laminate | |
| CN121002139A (en) | Adhesive sheet and display body | |
| JP2018127625A (en) | Active energy ray-curable adhesive sheet and laminate |