TWI688581B - (Meth)acrylate resin manufacturing method, optical member manufacturing method, curable composition manufacturing method, cured product manufacturing method - Google Patents
(Meth)acrylate resin manufacturing method, optical member manufacturing method, curable composition manufacturing method, cured product manufacturing method Download PDFInfo
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- TWI688581B TWI688581B TW105113067A TW105113067A TWI688581B TW I688581 B TWI688581 B TW I688581B TW 105113067 A TW105113067 A TW 105113067A TW 105113067 A TW105113067 A TW 105113067A TW I688581 B TWI688581 B TW I688581B
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- Prior art keywords
- meth
- manufacturing
- acrylate
- acrylate resin
- resin
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- 239000004925 Acrylic resin Substances 0.000 title claims abstract description 46
- 239000000203 mixture Substances 0.000 title claims abstract description 30
- 230000003287 optical effect Effects 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- -1 aromatic diglycidyl ether compound Chemical class 0.000 claims abstract description 46
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 24
- DCUFMVPCXCSVNP-UHFFFAOYSA-N methacrylic anhydride Chemical compound CC(=C)C(=O)OC(=O)C(C)=C DCUFMVPCXCSVNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 238000006243 chemical reaction Methods 0.000 claims abstract description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 24
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
- 125000003545 alkoxy group Chemical group 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 239000007858 starting material Substances 0.000 claims 1
- 238000004383 yellowing Methods 0.000 abstract description 14
- 238000010521 absorption reaction Methods 0.000 abstract description 11
- 239000000376 reactant Substances 0.000 abstract description 3
- 150000002148 esters Chemical class 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 57
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 16
- 239000000758 substrate Substances 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 11
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 10
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 238000005886 esterification reaction Methods 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 8
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 238000007664 blowing Methods 0.000 description 8
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 8
- 239000003112 inhibitor Substances 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 8
- 238000010992 reflux Methods 0.000 description 8
- 238000012719 thermal polymerization Methods 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 7
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 7
- 239000007800 oxidant agent Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 0 CCOC(*)C(*)C(C)Oc1ccc(C2(c(cccc3)c3-c3c2cccc3)c(cc2)ccc2OC(C)C(C)*)cc1 Chemical compound CCOC(*)C(*)C(C)Oc1ccc(C2(c(cccc3)c3-c3c2cccc3)c(cc2)ccc2OC(C)C(C)*)cc1 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- FGGRLKWCMJMSKS-UHFFFAOYSA-N (2-phenoxy-2-phenylethyl) prop-2-enoate Chemical compound C=1C=CC=CC=1C(COC(=O)C=C)OC1=CC=CC=C1 FGGRLKWCMJMSKS-UHFFFAOYSA-N 0.000 description 1
- SZCWBURCISJFEZ-UHFFFAOYSA-N (3-hydroxy-2,2-dimethylpropyl) 3-hydroxy-2,2-dimethylpropanoate Chemical compound OCC(C)(C)COC(=O)C(C)(C)CO SZCWBURCISJFEZ-UHFFFAOYSA-N 0.000 description 1
- LGPAKRMZNPYPMG-UHFFFAOYSA-N (3-hydroxy-2-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OC(CO)COC(=O)C=C LGPAKRMZNPYPMG-UHFFFAOYSA-N 0.000 description 1
- XNDAUZRSIAEAAR-HNNXBMFYSA-N (4s)-5-amino-4-[3-[4-(5-methylthiophen-2-yl)phenyl]propanoylamino]-5-oxopentanoic acid Chemical group S1C(C)=CC=C1C1=CC=C(CCC(=O)N[C@@H](CCC(O)=O)C(N)=O)C=C1 XNDAUZRSIAEAAR-HNNXBMFYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- JEAPEYGGHJNSII-UHFFFAOYSA-N 1-(4-morpholin-4-ylphenyl)butan-2-one Chemical compound C1=CC(CC(=O)CC)=CC=C1N1CCOCC1 JEAPEYGGHJNSII-UHFFFAOYSA-N 0.000 description 1
- LHNVRSJRNUEEAB-UHFFFAOYSA-N 1-(4-nonylphenoxy)ethane-1,2-diol Chemical compound CCCCCCCCCC1=CC=C(OC(O)CO)C=C1 LHNVRSJRNUEEAB-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- VYMSWGOFSKMMCE-UHFFFAOYSA-N 10-butyl-2-chloroacridin-9-one Chemical compound ClC1=CC=C2N(CCCC)C3=CC=CC=C3C(=O)C2=C1 VYMSWGOFSKMMCE-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CZZVAVMGKRNEAT-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)CO.OCC(C)(C)C(O)=O CZZVAVMGKRNEAT-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- FIOCEWASVZHBTK-UHFFFAOYSA-N 2-[2-(2-oxo-2-phenylacetyl)oxyethoxy]ethyl 2-oxo-2-phenylacetate Chemical compound C=1C=CC=CC=1C(=O)C(=O)OCCOCCOC(=O)C(=O)C1=CC=CC=C1 FIOCEWASVZHBTK-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- OKISUZLXOYGIFP-UHFFFAOYSA-N 4,4'-dichlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=C(Cl)C=C1 OKISUZLXOYGIFP-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- 125000004864 4-thiomethylphenyl group Chemical group 0.000 description 1
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- QJRDFTBOWBUKPS-UHFFFAOYSA-N C(C1=CC=CC=C1)(=O)C1=CC=CC=C1.CC=1C=C(C(=O)C2=CC(=CC=C2)C)C=CC1OC Chemical class C(C1=CC=CC=C1)(=O)C1=CC=CC=C1.CC=1C=C(C(=O)C2=CC(=CC=C2)C)C=CC1OC QJRDFTBOWBUKPS-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- HDONYZHVZVCMLR-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1 Chemical compound N=C=O.N=C=O.CC1CCCCC1 HDONYZHVZVCMLR-UHFFFAOYSA-N 0.000 description 1
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- TUOBEAZXHLTYLF-UHFFFAOYSA-N [2-(hydroxymethyl)-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(CC)COC(=O)C=C TUOBEAZXHLTYLF-UHFFFAOYSA-N 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- ZNMSDGGOBMBEPZ-UHFFFAOYSA-N [ClH]1C=CCC1 Chemical compound [ClH]1C=CCC1 ZNMSDGGOBMBEPZ-UHFFFAOYSA-N 0.000 description 1
- BVENPFSZWRULOR-UHFFFAOYSA-N [phenoxy(phenyl)methyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(Oc1ccccc1)c1ccccc1 BVENPFSZWRULOR-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000010504 bond cleavage reaction Methods 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
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- C08F20/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
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- Polymers & Plastics (AREA)
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- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Resins (AREA)
Abstract
本發明提供一種硬化物之耐熱性或耐吸濕性、耐黃變性優異之(甲基)丙烯酸酯樹脂、含有其之光硬化性組成物與其硬化物、及使用上述光硬化性組成物而成之光學構件。本發明係一種特徵在於將芳香族二環氧丙醚化合物(A)、(甲基)丙烯酸(B)、及甲基丙烯酸酐(C)作為必需之反應成分的反應物的(甲基)丙烯酸酯樹脂、含有其之光硬化性組成物與其硬化物、及使用上述光硬化性組成物而成之光學構件。 The present invention provides a (meth)acrylate resin excellent in heat resistance, moisture absorption resistance, and yellowing resistance of a cured product, a photocurable composition containing the same, and a cured product thereof, and a product obtained by using the above photocurable composition Optical components. The present invention is a (meth)acrylic acid characterized by a reactant in which an aromatic diglycidyl ether compound (A), (meth)acrylic acid (B), and methacrylic anhydride (C) are essential reaction components An ester resin, a photocurable composition containing it and its cured product, and an optical member using the photocurable composition.
Description
本發明係關於一種硬化物之耐熱性或耐吸濕性、耐黃變性優異之(甲基)丙烯酸酯樹脂、含有其之光硬化性組成物與其硬化物、及光學構件。 The present invention relates to a (meth)acrylate resin excellent in heat resistance, moisture absorption resistance, and yellowing resistance of a cured product, a photocurable composition containing the same, a cured product thereof, and an optical member.
搭載於CCD或CMOS等影像感測器之晶載透鏡(on-chip lens)廣泛利用藉由對熱塑性樹脂賦予點圖案,並利用熱流使之球面透鏡形狀化之熔融法所製造者,但球面透鏡由於色像差較大,故而高精細、高感度化存在極限。又,難以利用該熔融法實現窄間隙之透鏡賦形。作為可減少色像差且可實現窄間隙之透鏡賦形之技術,提出有藉由非球面透鏡形狀之模對光硬化性樹脂進行賦形之形狀轉印法。光硬化性樹脂係由具有(甲基)丙烯醯基等光聚合性基之樹脂或單體等構成,藉由包含大量低分子量成分而可實現低黏度化,故而係可實現微細之形狀賦形之材料。然而,於用於晶載透鏡用途時耐熱性或耐濕性並不足而容易產生黃變或變形。 The on-chip lens mounted on an image sensor such as CCD or CMOS is widely manufactured by a melting method that applies a dot pattern to a thermoplastic resin and shapes the spherical lens by heat flow, but the spherical lens Due to the large chromatic aberration, there is a limit to high definition and high sensitivity. In addition, it is difficult to use this fusion method to achieve narrow gap lens shaping. As a technique for forming lenses with reduced chromatic aberrations and narrow gaps, there has been proposed a shape transfer method in which a photocurable resin is shaped by a mold with an aspheric lens shape. The photocurable resin is composed of a resin or monomer having a photopolymerizable group such as (meth)acryloyl group, etc. It can achieve a low viscosity by containing a large amount of low molecular weight components, so it can achieve fine shape shaping Of material. However, when used for crystal-mounted lens applications, heat resistance or moisture resistance is not sufficient, and yellowing or deformation is likely to occur.
作為耐吸濕性等優異之光硬化性樹脂,例如已知有使雙酚A型環氧樹脂與甲基丙烯酸酐反應而獲得之光硬化性樹脂(參照專利文獻 1)。此種芳香環含有率較高之樹脂雖表現出相對較高之耐熱性,但於用於晶載透鏡用途時耐熱性及耐濕性均不足而容易產生黃變或變形。 As a photocurable resin excellent in moisture resistance and the like, for example, a photocurable resin obtained by reacting a bisphenol A type epoxy resin with methacrylic anhydride is known (see Patent Document 1). Although such a resin having a high aromatic ring content shows relatively high heat resistance, when used for crystal-mounted lens applications, both heat resistance and moisture resistance are insufficient, and yellowing or deformation is likely to occur.
[專利文獻1]日本特開2008-038029號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2008-038029
因此,本發明所欲解決之課題在於提供一種硬化物之耐熱性或耐吸濕性、耐黃變性優異之(甲基)丙烯酸酯樹脂、含有其之光硬化性組成物與其硬化物、及光學構件。 Therefore, the problem to be solved by the present invention is to provide a (meth)acrylate resin excellent in heat resistance, moisture absorption resistance, and yellowing resistance of a cured product, a photocurable composition containing the cured product, a cured product thereof, and an optical member .
本發明者等人為了解決上述課題而進行了努力研究,結果發現,使芳香族二環氧丙醚化合物與(甲基)丙烯酸及甲基丙烯酸酐反應而獲得之甲基丙烯酸酯樹脂其硬化物之耐熱性或耐吸濕性、耐黃變性優異,從而完成了本發明。 The inventors of the present invention conducted intensive studies to solve the above-mentioned problems, and found that the cured product of the methacrylate resin obtained by reacting the aromatic diglycidyl ether compound with (meth)acrylic acid and methacrylic anhydride The present invention has been completed by being excellent in heat resistance, moisture absorption resistance, and yellowing resistance.
即,本發明係關於一種(甲基)丙烯酸酯樹脂,其特徵在於:其係將芳香族二環氧丙醚化合物(A)、(甲基)丙烯酸(B)、及甲基丙烯酸酐(C)作為必需之反應成分的反應物。 That is, the present invention relates to a (meth)acrylate resin characterized in that it is an aromatic diglycidyl ether compound (A), (meth)acrylic acid (B), and methacrylic anhydride (C ) As reactants of necessary reaction components.
本發明進而係關於一種(甲基)丙烯酸酯樹脂,其特徵在於:具有下述通式(1)所表示之分子結構,
(式中,R2分別獨立地為氫原子、碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,R3分別獨立地為碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,n為1~4之整數) (In the formula, R 2 is independently any one of a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and R 3 is independently a number of carbon atoms. (Any of 1-4 alkyl, alkoxy of 1 to 4 carbon atoms, phenyl, n is an integer of 1 to 4)
Y為氫原子或甲基丙烯醯基],且樹脂中所存在之Y之至少一個為甲基丙烯醯基。 Y is a hydrogen atom or a methacryloyl group], and at least one of Y present in the resin is a methacryloyl group.
本發明進而係關於一種含有上述(甲基)丙烯酸酯樹脂、及光聚合起始劑之光硬化性組成物。 The present invention further relates to a photocurable composition containing the above (meth)acrylate resin and a photopolymerization initiator.
本發明進而係關於一種上述硬化性組成物之硬化物。 The present invention further relates to a cured product of the above curable composition.
本發明進而係關於一種使用硬化性組成物而成之光學構件。 The present invention further relates to an optical member formed using a curable composition.
根據本發明,可提供一種硬化物之耐熱性或耐吸濕性、耐黃變性優異之(甲基)丙烯酸酯樹脂、含有其之光硬化性組成物與其硬化物、及光學構件。 According to the present invention, it is possible to provide a (meth)acrylate resin excellent in heat resistance, moisture absorption resistance, and yellowing resistance of a cured product, a photocurable composition containing the cured product, a cured product thereof, and an optical member.
圖1係於實施例1中獲得之(甲基)丙烯酸酯樹脂(1)之GPC圖。 FIG. 1 is a GPC chart of the (meth)acrylate resin (1) obtained in Example 1. FIG.
以下,對本發明詳細地進行說明。 Hereinafter, the present invention will be described in detail.
本發明之(甲基)丙烯酸酯樹脂之特徵在於:其係將芳香族二環氧丙醚化合物(A)、(甲基)丙烯酸(B)、及甲基丙烯酸酐(C)作為必需之反應成分的反應物。即,本發明藉由將(甲基)丙烯酸(B)與甲基丙烯酸酐(C)併用作為芳香族二環氧丙醚化合物(A)之(甲基)丙烯酸酯化劑,而與習知之所謂環氧丙烯酸酯樹脂相比,成功地實現了硬化物之耐熱性或耐吸濕性、耐黃變性優異之光硬化性樹脂材料。 The (meth)acrylate resin of the present invention is characterized in that it is an aromatic diglycidyl ether compound (A), (meth)acrylic acid (B), and methacrylic anhydride (C) as necessary reactions The reactants of the ingredients. That is, the present invention uses (meth)acrylic acid (B) and methacrylic anhydride (C) together as a (meth)acrylic esterifying agent for aromatic diglycidyl ether compound (A), and The so-called epoxy acrylate resin has successfully achieved a photocurable resin material excellent in heat resistance, moisture absorption resistance, and yellowing resistance of the cured product.
本發明所使用之芳香族二環氧丙醚化合物(A)例如可列舉:雙酚型環氧樹脂、聯苯型環氧樹脂、苯醚型環氧樹脂、萘醚型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、二環戊二烯-苯酚加 成反應型環氧樹脂等,更具體而言,可列舉下述結構式(3-1)~(3-8)之任一者所表示之化合物等。 Examples of the aromatic diglycidyl ether compound (A) used in the present invention include bisphenol epoxy resin, biphenyl epoxy resin, phenyl ether epoxy resin, naphthalene ether epoxy resin, and phenol Alkyl epoxy resin, naphthol aralkyl epoxy resin, dicyclopentadiene-phenol addition The reaction type epoxy resin, etc., More specifically, the compound etc. which are represented by any one of following structural formula (3-1)-(3-8) are mentioned.
式中,R2分別獨立地為氫原子、碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,R3分別獨立地為碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,G表示環氧丙基,又,n為1~4之整數) In the formula, R 2 is independently any one of a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a phenyl group, and R 3 is each independently having 1 carbon atom Either alkyl group of ~4, alkoxy group of 1 to 4 carbon atoms, phenyl group, G represents epoxypropyl group, and n is an integer of 1 to 4)
該等既可分別單獨使用,亦可併用2種以上。其中,就獲得硬化物之耐熱性或耐吸濕性、耐黃變性優異之甲基丙烯酸酯樹脂之方面而言,較佳為上述結構式(3-1)表示之化合物。 These can be used individually or in combination of two or more. Among them, in terms of obtaining a methacrylate resin excellent in heat resistance, moisture absorption resistance, and yellowing resistance of the cured product, the compound represented by the above structural formula (3-1) is preferable.
上述(甲基)丙烯酸(B)可為丙烯酸或甲基丙烯酸之任一者,亦可併用兩者。其中,就成為硬化物之耐熱性優異之(甲基)丙烯酸酯樹脂之方面而言,較佳為甲基丙烯酸。又,就對硬化物進行加熱時不易產生氣體之方面而言,較佳為丙烯酸。 The (meth)acrylic acid (B) may be either acrylic acid or methacrylic acid, or both. Among them, methacrylic acid is preferred from the viewpoint of the (meth)acrylate resin having excellent heat resistance as a cured product. In addition, acrylic acid is preferred in that it hardly generates gas when the cured product is heated.
於本發明之(甲基)丙烯酸酯樹脂之製造中,關於上述芳香族二環氧丙醚化合物(A)、(甲基)丙烯酸(B)、及甲基丙烯酸酐(C)之反應比率,相對於芳香族二環氧丙醚化合物(A)中之環氧基1莫耳,較佳為於合計為0.9~1.1莫耳之範圍內使用(甲基)丙烯酸(B)與甲基丙烯酸酐(C)。 In the production of the (meth)acrylate resin of the present invention, regarding the reaction ratio of the aromatic diglycidyl ether compound (A), (meth)acrylic acid (B), and methacrylic anhydride (C), It is preferable to use (meth)acrylic acid (B) and methacrylic anhydride relative to 1 mole of epoxy group in the aromatic diglycidyl ether compound (A) in a range of 0.9 to 1.1 mole in total (C).
又,就成為硬化物之耐熱性或耐吸濕性、耐黃變性優異之甲基丙烯酸酯樹脂之方面而言,較佳為(甲基)丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]之值為1/9~6/4之範圍。 Moreover, in terms of a methacrylate resin that is excellent in heat resistance, moisture absorption resistance, and yellowing resistance, which is a cured product, it is preferable that (meth)acrylic acid (B) and methacrylic anhydride (C) The ear ratio [(B)/(C)] is in the range of 1/9~6/4.
於本發明中,(甲基)丙烯酸酯樹脂之製造方法並無特別限定,例如可列舉如下方法,即:於酯化反應觸媒、抗氧化劑、聚合抑制劑之存在下視需要使用有機溶劑,使芳香族二環氧丙醚化合物(A)、(甲基)丙烯酸(B)、及甲基丙烯酸酐(C)於100~150℃之溫度範圍內反應5~12小時左右。 In the present invention, the production method of the (meth)acrylate resin is not particularly limited, and for example, the following method may be mentioned: an organic solvent is used in the presence of an esterification catalyst, an antioxidant, and a polymerization inhibitor as needed, The aromatic diglycidyl ether compound (A), (meth)acrylic acid (B), and methacrylic anhydride (C) are reacted in a temperature range of 100 to 150°C for about 5 to 12 hours.
利用此種方法製造之本發明之(甲基)丙烯酸酯樹脂例如可列舉具有下述通式(1)所表示之分子結構,
[式中,R1為氫原子或甲基,X為下述通式(2-1)~(2-8)之任一者所表示之結構部位,
(式中,R2分別獨立地為氫原子、碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,R3分別獨立地為碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,n為1~4之整數) (In the formula, R 2 is independently any one of a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and R 3 is independently a number of carbon atoms. (Any of 1-4 alkyl, alkoxy of 1 to 4 carbon atoms, phenyl, n is an integer of 1 to 4)
Y為氫原子或甲基丙烯醯基],且樹脂中所存在之Y之至少一個為甲基丙烯醯基者。 Y is a hydrogen atom or a methacryloyl group], and at least one of Y present in the resin is a methacryloyl group.
具有上述通式(1)所表示之分子結構之樹脂成分具體而言可列舉下述通式(1-1)~(1-3)之任一者所表示之化合物。 Specific examples of the resin component having the molecular structure represented by the general formula (1) include the compounds represented by any of the following general formulas (1-1) to (1-3).
[式中,R1為氫原子或甲基,X為下述通式(2-1)~(2-8)之任一者所表示之結構部位,
(式中,R2分別獨立地為氫原子、碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,R3分別獨立地為碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,n為1~4之整數)] (In the formula, R 2 is independently any one of a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and R 3 is independently a number of carbon atoms. (1~4 alkyl group, 1-4 carbon atoms alkoxy group, phenyl group, n is an integer of 1-4)]
就硬化物之耐熱性或耐吸濕性、耐黃變性優異之方面而言,本發明之甲基丙烯酸酯樹脂根據原料之添加量而算出之(甲基)丙烯醯基當量較佳為160~230g/當量之範圍。 In terms of excellent heat resistance, moisture absorption resistance, and yellowing resistance of the cured product, the (meth)acryloyl equivalent of the methacrylate resin of the present invention calculated according to the amount of raw materials added is preferably 160 to 230 g /Equivalent range.
本發明之光硬化性組成物含有上述甲基丙烯酸酯樹脂與光聚合起始劑。 The photocurable composition of the present invention contains the above methacrylate resin and a photopolymerization initiator.
此處所使用之光聚合起始劑例如可列舉:如二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、苯偶醯二甲基縮酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、4-(2-羥基乙氧基)苯基-(2-羥基-2-丙基)酮、1-羥基環己基苯基酮、2-甲基-2-嗎啉基(4-硫代甲基苯基)丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)丁酮之苯乙酮系;如安息香、安息香甲醚、安息香異丙醚之安息香類;如2,4,6-三甲基安息香二苯基氧化膦之醯基氧化膦系;苯偶醯、苯甲醯甲酸甲酯等分子內鍵裂解型光聚合起始劑;或如二苯甲酮、鄰苯甲醯基苯甲酸甲酯-4-苯基二苯甲酮、4,4'-二氯二苯甲酮、羥基二苯甲酮、4-苯甲醯基-4'-甲基-二苯硫醚、丙烯基化二苯甲酮、3,3',4,4'-四(過氧化第三丁基羰基)二苯甲酮、3,3'-二甲基-4-甲氧基二苯甲酮之二苯甲酮系;如2-異丙基9-氧硫、2,4-二甲基9-氧硫、2,4-二乙基9-氧硫、2,4-二氯9-氧硫之9-氧硫系;如米其勒酮、4,4'-二乙基胺基二苯甲酮之胺基二苯甲酮系;及10-丁基-2-氯吖啶酮、2-乙基蒽醌、9,10-菲醌、樟腦醌等分子內奪氫型光聚合起始劑。該等既可分別單獨使用,亦可併用2 種以上。 Examples of the photopolymerization initiator used here include: diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, benzoyl dimethyl ketal, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)one , 1-hydroxycyclohexylphenyl ketone, 2-methyl-2-morpholinyl (4-thiomethylphenyl) propane-1-one, 2-benzyl-2-dimethylamino-1 -Acetophenone of (4-morpholinylphenyl) butanone; such as benzoin of benzoin, benzoin methyl ether, benzoin isopropyl ether; such as 2,4,6-trimethyl benzoin diphenylphosphine oxide Acyl phosphine oxide series; Intramolecular bond cleavage type photopolymerization initiators such as benzoyl acetoyl and methyl benzoate; or such as benzophenone, methyl o-benzoyl benzoate-4-phenyldi Benzophenone, 4,4'-dichlorobenzophenone, hydroxybenzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, propenated benzophenone, 3, 3',4,4'-tetrakis (third butylcarbonyl peroxide) benzophenone, 3,3'-dimethyl-4-methoxybenzophenone benzophenone series; such as 2 -Isopropyl 9-oxysulfur , 2,4-Dimethyl 9-oxysulfur , 2,4-Diethyl 9-oxysulfur , 2,4-Dichloro 9-oxysulfur 9-Oxine Series; such as Michelerone, 4,4'-diethylaminobenzophenone amine benzophenone series; and 10-butyl-2-chloroacridone, 2-ethylanthraquinone , 9,10-phenanthrenequinone, camphorquinone and other intramolecular hydrogen abstraction photopolymerization initiators. These can be used individually or in combination of two or more.
該等光聚合起始劑之市售品例如可列舉:「Irgacure-184」、「Irgacure-149」、「Irgacure-261」、「Irgacure-369」、「Irgacure-500」、「Irgacure-651」、「Irgacure-754」、「Irgacure-784」、「Irgacure-819」、「Irgacure-907」、「Irgacure-1116」、「Irgacure-1664」、「Irgacure-1700」、「Irgacure-1800」、「Irgacure-1850」、「Irgacure-2959」、「Irgacure-4043」、「Darocure-1173」(Ciba Specialty Chemicals公司製造)、「Lucirin TPO」(BASF公司製造)、「Kayacure-DETX」、「Kayacure-MBP」、「Kayacure-DMBI」、「Kayacure-EPA」、「Kayacure-OA」(日本化藥股份有限公司製造)、「Vicure-10」、「Vicure-55」(Stauffer Chemical公司製造)、「Trigonal P1」(akzo公司製造)、「Sandray 1000」(SANDOZ公司製造)、「DEAP」(Upjohn公司製造)、「Quantacure-PDO」、「Quantacure-ITX」、「Quantacure-EPD」(Ward Blenkinsop公司製造)等。 Examples of commercially available products of these photopolymerization initiators include: "Irgacure-184", "Irgacure-149", "Irgacure-261", "Irgacure-369", "Irgacure-500", "Irgacure-651" , "Irgacure-754", "Irgacure-784", "Irgacure-819", "Irgacure-907", "Irgacure-1116", "Irgacure-1664", "Irgacure-1700", "Irgacure-1800", "" Irgacure-1850'', ``Irgacure-2959'', ``Irgacure-4043'', ``Darocure-1173'' (manufactured by Ciba Specialty Chemicals), ``Lucirin TPO'' (manufactured by BASF), ``Kayacure-DETX'', ``Kayacure-MBP '', ``Kayacure-DMBI'', ``Kayacure-EPA'', ``Kayacure-OA'' (manufactured by Nippon Kayaku Co., Ltd.), ``Vicure-10'', ``Vicure-55'' (manufactured by Stauffer Chemical), ``Trigonal P1 '' (manufactured by Akzo), ``Sandray 1000'' (manufactured by SANDOZ), ``DEAP'' (manufactured by Upjohn), ``Quantacure-PDO'', ``Quantacure-ITX'', ``Quantacure-EPD'' (manufactured by Ward Blenkinsop), etc. .
上述光聚合起始劑之添加量例如係於相對於光硬化性組成物100質量份為1~20質量份之範圍內使用。 The added amount of the photopolymerization initiator is, for example, used within a range of 1 to 20 parts by mass relative to 100 parts by mass of the photocurable composition.
本發明之光硬化性組成物此外亦可含有上述甲基丙烯酸酯樹脂以外之其他(甲基)丙烯酸酯化合物或光敏劑、硬化促進劑、有機溶劑、非反應性樹脂、填料、無機填充劑、有機填充劑、偶合劑、黏著賦予劑、消泡劑、調平劑、密接助劑、脫模劑、潤滑劑、紫外線吸收劑、抗氧化劑、熱穩定劑、塑化劑、難燃劑、顏料、染料等添加劑成分。 The photocurable composition of the present invention may further contain other (meth)acrylate compounds other than the above methacrylate resins or photosensitizers, curing accelerators, organic solvents, non-reactive resins, fillers, inorganic fillers, Organic fillers, coupling agents, adhesion-imparting agents, defoamers, leveling agents, adhesion aids, mold release agents, lubricants, ultraviolet absorbers, antioxidants, heat stabilizers, plasticizers, flame retardants, pigments , Dyes and other additive components.
上述其他(甲基)丙烯酸酯化合物例如可列舉:(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸正戊酯、
(甲基)丙烯酸正己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸環氧丙酯、嗎福啉(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-丁氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸2-(2-乙氧基乙氧基)乙酯、4-壬基苯氧基乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸四氫糠酯、己內酯改質(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸環己基甲酯、(甲基)丙烯酸環己基乙酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸雙環戊酯、(甲基)丙烯酸二環戊氧基乙酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苯氧基2-甲基乙酯、(甲基)丙烯酸苯氧基乙氧基乙酯、(甲基)丙烯酸對異丙苯基苯氧基乙酯、(甲基)丙烯酸苯氧基苄酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、(甲基)丙烯酸苯基苄酯、丙烯酸苯基苯氧基乙酯、六氫鄰苯二甲酸2-丙烯醯氧基乙酯、下述通式(4)或(5)所表示之含茀骨架之單(甲基)丙烯酸酯化合物等單(甲基)丙烯酸酯化合物;
[式中,X為氫原子或羥基,R1及R4分別獨立地為氫原子或碳原子數為1~3之烷基,R2為氫原子或甲基,R3為直接鍵或亞甲基,m為0或1] [In the formula, X is a hydrogen atom or a hydroxyl group, R 1 and R 4 are independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, R 2 is a hydrogen atom or a methyl group, and R 3 is a direct bond or sub Methyl, m is 0 or 1]
[式中,2個X分別獨立地為氫原子或羥基,2個R1分別獨立地為氫原子或碳原子數為1~3之烷基,R2為氫原子或甲基,m及n分別獨立地為0或1] [In the formula, two Xs are each independently a hydrogen atom or a hydroxyl group, two R 1 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, R 2 is a hydrogen atom or a methyl group, m and n Independently 0 or 1]
乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、雙酚A二(甲基)丙烯酸酯、雙酚F二(甲基)丙烯酸酯、二(甲基)丙烯酸雙環戊酯、二(甲基)丙烯酸甘油酯、新戊二醇羥基新戊酸酯二(甲基)丙烯酸酯、己內酯改質羥基新戊酸新戊二醇二(甲基)丙烯酸酯、四溴雙酚A二(甲基)丙烯酸酯、羥基新戊醛改質三羥甲基丙烷二(甲基)丙烯酸酯、1,4-環己烷二甲醇二(甲基)丙烯酸酯、雙[(甲基)丙烯醯基甲基]聯苯、下述通式(6)或(7)所表示之含茀骨架之二(甲基)丙烯酸酯化合物等二(甲基)丙烯酸酯化合物;
[式中,X分別獨立地為氫原子或羥基,R1分別獨立地為氫原子或碳原子數為1~3之烷基,R2分別獨立地為氫原子或甲基,R3分別獨立地為直接鍵或亞甲基,m及n分別獨立地為0或1] [In the formula, X is independently a hydrogen atom or a hydroxyl group, R 1 is independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, R 2 is independently a hydrogen atom or a methyl group, and R 3 is independently Ground is a direct bond or methylene, m and n are independently 0 or 1]
[式中,2個X分別獨立地為氫原子或羥基,2個R1分別獨立地為氫原子或碳原子數為1~3之烷基,2個R2分別獨立地為氫原子或甲基,m及n分別獨立地為0或1] [In the formula, 2 Xs are each independently a hydrogen atom or a hydroxyl group, 2 R 1 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and 2 R 2 are each independently a hydrogen atom or a methyl group Basis, m and n are independently 0 or 1]
三羥甲基丙烷三(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、三(甲基)丙烯酸甘油酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯等3官能以上之(甲基)丙烯酸酯化合物;使丁烷-1,4-二異氰酸酯、六亞甲基二異氰酸酯、2,2,4-三甲基六亞甲基二異氰酸酯、2,4,4-三甲基六亞甲基二異氰酸酯、苯二甲基二異氰酸酯、間四甲基苯二甲基二異氰酸酯、環己烷-1,4-二異氰酸酯、異佛爾酮二異氰酸酯、離胺酸二異氰酸酯、二環己基甲烷-4,4'-二異氰酸酯、1,3-雙(異氰酸酯基甲基)環己烷、甲基環己烷二異氰酸酯、1,5-萘二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、2,2'-雙(對苯基異氰酸酯)丙烷、4,4'-二苄基二異氰酸酯、二烷基二苯甲烷二異氰酸酯、四烷基二苯甲烷二異氰酸酯、1,3-苯二異氰酸酯、1,4-苯二異氰酸酯、甲苯二異氰酸酯等二異氰酸酯化合物或該等之尿酸酯改質體與丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、丙烯酸4-羥基丁酯、二丙烯酸甘油酯、三羥甲基丙烷二丙烯酸酯、新戊四醇三丙烯酸酯、二新戊四醇五丙烯酸酯等含羥基之(甲基)丙烯酸酯化合物反應而獲得之(甲基)丙 烯酸胺酯等。該等其他(甲基)丙烯酸酯化合物既可分別單獨使用,亦可併用2種以上。 Trimethylolpropane tri(meth)acrylate, neopentaerythritol tri(meth)acrylate, glyceryl tri(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, di Neopentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate and other (meth) acrylate compounds with more than 3 functions; make butane-1,4-diisocyanate, hexamethylene Methyl diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, xylylene diisocyanate, m-tetramethylbenzene diisocyanate Methyl diisocyanate, cyclohexane-1,4-diisocyanate, isophorone diisocyanate, amine diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, 1,3-bis(isocyanate group (Methyl) cyclohexane, methylcyclohexane diisocyanate, 1,5-naphthalene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,2'-bis (p-phenylisocyanate) propane, 4, 4'-dibenzyl diisocyanate, dialkyldiphenylmethane diisocyanate, tetraalkyldiphenylmethane diisocyanate, 1,3-benzenediisocyanate, 1,4-benzenediisocyanate, toluene diisocyanate and other diisocyanate compounds Or the modified urate and 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, glycerol diacrylate, trimethylolpropane diacrylate, neopentyl alcohol (Meth)propane obtained from the reaction of hydroxyl-containing (meth)acrylate compounds such as triacrylate and dipentaerythritol pentaacrylate Amino acid esters, etc. These other (meth)acrylate compounds may be used alone or in combination of two or more.
本發明之光硬化性組成物其硬化物尤其表現出較高之耐熱性、耐濕性及耐黃變性,因此可用於電子零件或成形品用途、塗佈用途等各種用途。尤其是可有效利用耐黃變性優異之特徵而較佳地用於光學構件用途。作為光學構件,例如可列舉:眼鏡透鏡、CCD或CMOS等影像感測器用晶載透鏡、菲涅耳透鏡、稜鏡透鏡等塑膠透鏡;及光學用保護劑、硬塗劑、抗反射膜、光纖、光波導、全像圖、稜鏡透鏡、LED密封材料、太陽光電池用塗佈材等。 The photo-curable composition of the present invention exhibits particularly high heat resistance, moisture resistance, and yellowing resistance, and thus can be used for various applications such as electronic parts, molded products, and coating applications. In particular, it can effectively utilize the characteristics of excellent yellowing resistance and is preferably used for optical member applications. Examples of optical members include plastic lenses such as eyeglass lenses, crystal sensors for CCD or CMOS image sensors, Fresnel lenses, and prism lenses; and optical protective agents, hard coating agents, anti-reflection films, and optical fibers , Optical waveguides, holograms, lenticular lenses, LED sealing materials, coating materials for solar cells, etc.
上述晶載透鏡或稜鏡透鏡例如係藉由使用了形成有透鏡圖案之模具或者樹脂模等賦形模之形狀轉印法而製造。具體而言,可列舉如下方法,即:將光硬化性組成物塗佈於賦形模,使透明基材重疊於組成物表面,並自該透明基材側照射活性能量線而使之硬化。此處所使用之透明基材可列舉由丙烯酸樹脂、聚碳酸酯樹脂、聚酯樹脂、聚苯乙烯樹脂、氟樹脂、聚醯亞胺樹脂構成之塑膠基材或玻璃等。 The above-mentioned crystal lens or prism lens is manufactured by, for example, a shape transfer method using a forming mold such as a mold in which a lens pattern is formed or a resin mold. Specifically, a method may be mentioned in which a photocurable composition is applied to a shaping die, a transparent substrate is superposed on the surface of the composition, and active energy rays are irradiated from the transparent substrate side to be cured. Examples of the transparent substrate used herein include a plastic substrate made of acrylic resin, polycarbonate resin, polyester resin, polystyrene resin, fluororesin, and polyimide resin, or glass.
利用該方法製造之透鏡薄片既可貼附於透明基材而直接使用,亦可將透明基材剝離後以透鏡單獨之狀態使用。於貼附於透明基材而直接使用之情形時,為了提高透鏡與透明基材之接著性,較佳為預先對透明基材表面實施底塗處理等接著性提高處理。另一方面,於將透明基材剝離後使用之情形時,較佳為以可容易地將該透明基材剝離之方式利用聚矽氧或氟系剝離劑對透明基材之表面預先進行處理。 The lens sheet manufactured by this method can be directly attached to a transparent substrate and used directly, or it can be used as a lens alone after peeling off the transparent substrate. In the case of attaching to a transparent substrate and using it directly, in order to improve the adhesion between the lens and the transparent substrate, it is preferable to perform an adhesion improvement treatment such as primer coating on the surface of the transparent substrate in advance. On the other hand, in the case where the transparent substrate is peeled off and used, it is preferable to pretreat the surface of the transparent substrate with a polysiloxane or a fluorine-based peeling agent so that the transparent substrate can be easily peeled off.
於將本發明之光硬化性組成物用於此種賦形透鏡用之情形 時,較理想為併用本發明之甲基丙烯酸酯樹脂與上述其他(甲基)丙烯酸酯化合物,並將光硬化性組成物之黏度(25℃)調整為成為100mPa‧s~800mPa‧s之範圍。所使用之其他(甲基)丙烯酸酯化合物係根據所需之性能而適當選擇,例如較理想為以硬化物之折射率成為1.5560以上之方式進行調整。 When the photocurable composition of the present invention is used for such a shaped lens It is preferable to use the methacrylate resin of the present invention together with the other (meth)acrylate compounds described above, and adjust the viscosity (25°C) of the photocurable composition to the range of 100 mPa‧s to 800 mPa‧s . The other (meth)acrylate compound used is appropriately selected according to the required performance, for example, it is more preferable to adjust the refractive index of the hardened product to 1.5560 or more.
[實施例] [Example]
以下,利用實施例及比較例對本發明更詳細地進行說明。 Hereinafter, the present invention will be described in more detail using examples and comparative examples.
實施例1(甲基)丙烯酸酯樹脂(1)之製造 Example 1 Production of (meth)acrylate resin (1)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.6質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加甲基丙烯酸86質量份、甲基丙烯酸酐154質量份、三苯基膦1.8質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(1)。根據(甲基)丙烯酸酯樹脂(1)之原料之添加量而算出之(甲基)丙烯醯基當量為205g/當量。再者,甲基丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為5/5。 Into a flask equipped with a thermometer, stirrer, and reflux cooler, 374 parts by mass of bisphenol A epoxy resin (Epiclon 850-S manufactured by DIC Co., Ltd. epoxy equivalent 187g/equivalent) was added as an 0.6 parts by mass of dibutylhydroxytoluene as an oxidizing agent, 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 86 parts by mass of methacrylic acid, 154 parts by mass of methacrylic anhydride, and 1.8 parts by mass of triphenylphosphine are added, While blowing air, the esterification reaction was carried out at 110° C. for 10 hours to obtain a (meth)acrylate resin (1). The (meth)acryloyl equivalent calculated based on the amount of raw material added to the (meth)acrylate resin (1) is 205 g/equivalent. Furthermore, the molar ratio [(B)/(C)] of methacrylic acid (B) and methacrylic anhydride (C) is 5/5.
實施例2(甲基)丙烯酸酯樹脂(2)之製造 Example 2 Production of (meth)acrylate resin (2)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.6質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加甲基丙烯酸52質量份、甲基丙烯酸酐216質量份、三苯基膦1.8質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(2)。根據(甲基)丙烯酸酯樹 脂(2)之原料之添加量而算出之(甲基)丙烯醯基當量為188g/當量。再者,甲基丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為3/7。 Into a flask equipped with a thermometer, stirrer, and reflux cooler, 374 parts by mass of bisphenol A epoxy resin (Epiclon 850-S manufactured by DIC Co., Ltd. epoxy equivalent 187g/equivalent) was added as an After 0.6 parts by mass of dibutylhydroxytoluene as an oxidizing agent and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 52 parts by mass of methacrylic acid, 216 parts by mass of methacrylic anhydride, and 1.8 parts by mass of triphenylphosphine are added, While blowing air, the esterification reaction was performed at 110° C. for 10 hours to obtain a (meth)acrylate resin (2). According to (meth)acrylate tree The (meth)acryloyl equivalent calculated from the amount of the raw material added to the fat (2) was 188 g/equivalent. Furthermore, the molar ratio [(B)/(C)] of methacrylic acid (B) and methacrylic anhydride (C) is 3/7.
實施例3(甲基)丙烯酸酯樹脂(3)之製造 Example 3 Production of (meth)acrylate resin (3)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.7質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加甲基丙烯酸17質量份、甲基丙烯酸酐278質量份、三苯基膦2.0質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(3)。根據(甲基)丙烯酸酯樹脂(3)之原料之添加量而算出之(甲基)丙烯醯基當量為176g/當量。再者,甲基丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為1/9。 Into a flask equipped with a thermometer, stirrer, and reflux cooler, 374 parts by mass of bisphenol A epoxy resin (Epiclon 850-S manufactured by DIC Co., Ltd. epoxy equivalent 187g/equivalent) was added as an After 0.7 parts by mass of dibutylhydroxytoluene as an oxidizing agent and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 17 parts by mass of methacrylic acid, 278 parts by mass of methacrylic anhydride, and 2.0 parts by mass of triphenylphosphine are added, While blowing air, the esterification reaction was carried out at 110° C. for 10 hours to obtain a (meth)acrylate resin (3). The equivalent of (meth)acryloyl group calculated based on the added amount of the raw material of (meth)acrylate resin (3) was 176 g/equivalent. Furthermore, the molar ratio [(B)/(C)] of methacrylic acid (B) and methacrylic anhydride (C) is 1/9.
實施例4(甲基)丙烯酸酯樹脂(4)之製造 Example 4 Production of (meth)acrylate resin (4)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.6質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加丙烯酸72質量份、甲基丙烯酸酐154質量份、三苯基膦1.8質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(4)。根據(甲基)丙烯酸酯樹脂(4)之原料之添加量而算出之(甲基)丙烯醯基當量為200g/當量。再者,丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為5/5。 Into a flask equipped with a thermometer, stirrer, and reflux cooler, 374 parts by mass of bisphenol A epoxy resin (Epiclon 850-S manufactured by DIC Co., Ltd. epoxy equivalent 187g/equivalent) was added as an 0.6 parts by mass of dibutylhydroxytoluene as an oxidizing agent, 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 72 parts by mass of acrylic acid, 154 parts by mass of methacrylic anhydride, and 1.8 parts by mass of triphenylphosphine were added while blowing The air was allowed to undergo esterification reaction at 110°C for 10 hours to obtain a (meth)acrylate resin (4). The (meth)acryloyl equivalent calculated based on the amount of raw materials added to the (meth)acrylate resin (4) is 200 g/equivalent. Furthermore, the molar ratio [(B)/(C)] of acrylic acid (B) and methacrylic anhydride (C) is 5/5.
實施例5(甲基)丙烯酸酯樹脂(5)之製造 Example 5 Production of (meth)acrylate resin (5)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹 脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.6質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加丙烯酸43質量份、甲基丙烯酸酐216質量份、三苯基膦1.8質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(5)。根據(甲基)丙烯酸酯樹脂(5)之原料之添加量而算出之(甲基)丙烯醯基當量為186g/當量。再者,丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為3/7。 Add bisphenol A epoxy tree to flask equipped with thermometer, stirrer, and reflux cooler 374 parts by mass of epoxy resin (Epiclon 850-S made by DIC Co., Ltd. 187g/equivalent), and 0.6 parts by mass of dibutylhydroxytoluene as an antioxidant and p-methoxyphenol as a thermal polymerization inhibitor After 0.2 parts by mass, 43 parts by mass of acrylic acid, 216 parts by mass of methacrylic anhydride, and 1.8 parts by mass of triphenylphosphine were added, and the esterification reaction was carried out at 110°C for 10 hours while blowing air to obtain (meth)acrylic acid Ester resin (5). The equivalent of (meth)acryloyl group calculated based on the added amount of the raw material of (meth)acrylate resin (5) was 186 g/equivalent. Furthermore, the molar ratio [(B)/(C)] of acrylic acid (B) and methacrylic anhydride (C) is 3/7.
實施例6(甲基)丙烯酸酯樹脂(6)之製造 Example 6 Production of (meth)acrylate resin (6)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.7質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加丙烯酸14質量份、甲基丙烯酸酐278質量份、三苯基膦2.0質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(6)。根據(甲基)丙烯酸酯樹脂(6)之原料之添加量而算出之(甲基)丙烯醯基當量為175g/當量。再者,丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為1/9。 Into a flask equipped with a thermometer, stirrer, and reflux cooler, 374 parts by mass of bisphenol A epoxy resin (Epiclon 850-S manufactured by DIC Co., Ltd. epoxy equivalent 187g/equivalent) was added as an 0.7 parts by mass of dibutylhydroxytoluene as an oxidizing agent, 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 14 parts by mass of acrylic acid, 278 parts by mass of methacrylic anhydride, and 2.0 parts by mass of triphenylphosphine were added while blowing The air was allowed to undergo an esterification reaction at 110°C for 10 hours to obtain a (meth)acrylate resin (6). The (meth)acryloyl equivalent calculated based on the addition amount of the raw material of (meth)acrylate resin (6) is 175 g/equivalent. Furthermore, the molar ratio [(B)/(C)] of acrylic acid (B) and methacrylic anhydride (C) is 1/9.
比較製造例1(甲基)丙烯酸酯樹脂(1')之製造 Comparative Manufacturing Example 1 Manufacturing of (meth)acrylate resin (1')
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.5質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加甲基丙烯酸172質量份、三苯基膦1.6質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲 基)丙烯酸酯樹脂(1')。根據(甲基)丙烯酸酯樹脂(1')之原料之添加量而算出之(甲基)丙烯醯基當量為273g/當量。 Into a flask equipped with a thermometer, stirrer, and reflux cooler, 374 parts by mass of bisphenol A epoxy resin (Epiclon 850-S manufactured by DIC Co., Ltd. epoxy equivalent 187g/equivalent) was added as an 0.5 parts by mass of oxidizing agent dibutylhydroxytoluene, 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 172 parts by mass of methacrylic acid and 1.6 parts by mass of triphenylphosphine were added, while blowing air at 110°C It waits for 10 hours for the esterification reaction to obtain (A Base) acrylate resin (1'). The (meth)acryloyl equivalent calculated based on the amount of the (meth)acrylate resin (1') added is 273 g/equivalent.
比較製造例2(甲基)丙烯酸酯樹脂(2')之製造 Comparative Manufacturing Example 2 Manufacturing of (meth)acrylate resin (2')
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.5質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加丙烯酸144質量份、三苯基膦1.6質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(2')。根據(甲基)丙烯酸酯樹脂(2')之原料之添加量而算出之(甲基)丙烯醯基當量為259g/當量。 Into a flask equipped with a thermometer, stirrer, and reflux cooler, 374 parts by mass of bisphenol A epoxy resin (Epiclon 850-S manufactured by DIC Co., Ltd. epoxy equivalent 187g/equivalent) was added as an 0.5 parts by mass of oxidizing agent dibutylhydroxytoluene and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 144 parts by mass of acrylic acid and 1.6 parts by mass of triphenylphosphine were added, while blowing air at 110°C, etc. The esterification reaction was carried out for 10 hours to obtain (meth)acrylate resin (2'). The (meth)acryloyl equivalent calculated based on the amount of the (meth)acrylate resin (2') added is 259 g/equivalent.
實施例7~12、比較例1、2 Examples 7-12, Comparative Examples 1, 2
使用實施例1~6及比較製造例1、2中所獲得之(甲基)丙烯酸酯樹脂並根據下述要領製備硬化性組成物及硬化物,進行各種評價試驗。將結果示於表1。 Using the (meth)acrylate resins obtained in Examples 1 to 6 and Comparative Manufacturing Examples 1 and 2, a curable composition and a cured product were prepared according to the following procedures, and various evaluation tests were performed. The results are shown in Table 1.
硬化性組成物之製備 Preparation of hardening composition
向(甲基)丙烯酸酯樹脂100g中添加光聚合起始劑(BASF公司製造之『Irgacure184D』)1g,製備硬化性組成物。 1 g of a photopolymerization initiator ("Irgacure 184D" manufactured by BASF) was added to 100 g of (meth)acrylate resin to prepare a curable composition.
玻璃轉移溫度之測定 Determination of glass transition temperature
將先前所獲得之硬化性組成物以膜厚成為100μm之方式塗佈於丙烯酸板上,並利用高壓水銀燈照射2000mJ/cm2之紫外線而獲得硬化物。 The curable composition obtained previously was applied on an acrylic plate so that the film thickness became 100 μm, and ultraviolet light of 2000 mJ/cm 2 was irradiated with a high-pressure mercury lamp to obtain a cured product.
自所獲得之硬化物切出6mm×25mm之試片,使用黏彈性測定裝置(DMA:Rheometrics公司製造之固體黏彈性測定裝置「RSA-G2」,拉伸法: 頻率1Hz,升溫速度3℃/min)將彈性模數變化成為最大(tan δ變化率最大)之溫度評價為玻璃轉移溫度。 A 6 mm×25 mm test piece was cut out of the obtained hardened material, and a viscoelasticity measuring device (DMA: solid viscoelasticity measuring device “RSA-G2” manufactured by Rheometrics Corporation) was used. The stretching method: At a frequency of 1 Hz and a temperature increase rate of 3°C/min), the temperature at which the elastic modulus changes to the maximum (tan δ change rate is maximum) is evaluated as the glass transition temperature.
吸水率之測定 Determination of water absorption
自與玻璃轉移溫度之測定所使用者相同之硬化物切出6mm×25mm之試片,並將其於23℃之水中浸漬24小時。將浸漬前後之重量變化率評價為吸水率。 A 6 mm×25 mm test piece was cut out from the same hardened material as the user of the glass transition temperature measurement and immersed in water at 23° C. for 24 hours. The weight change rate before and after immersion was evaluated as the water absorption rate.
耐黃變性之評價 Evaluation of yellowing resistance
將先前所獲得之硬化性組成物以膜厚成為100μm之方式塗佈於玻璃板上,並利用高壓水銀燈照射2000mJ/cm2之紫外線而獲得積層膜。 The curable composition obtained previously was applied to a glass plate so that the film thickness became 100 μm, and ultraviolet light of 2000 mJ/cm 2 was irradiated with a high-pressure mercury lamp to obtain a laminated film.
將所獲得之積層膜於265℃之烘箱中加熱3分鐘。針對加熱前後之試片測定420nm光之穿透率(%),並根據兩值之差量進行評價。 The obtained laminated film was heated in an oven at 265°C for 3 minutes. The transmittance (%) of light at 420 nm was measured for the test pieces before and after heating, and the evaluation was based on the difference between the two values.
產生氣體之評價 Evaluation of gas generation
將先前所獲得之硬化性組成物以膜厚成為100μm之方式塗佈於玻璃板上,並利用高壓水銀燈照射1000mJ/cm2或2000mJ/cm2之紫外線而獲得積層膜。 The curable composition previously obtained was coated on a glass plate so that the film thickness became 100 μm, and ultraviolet light of 1000 mJ/cm 2 or 2000 mJ/cm 2 was irradiated with a high-pressure mercury lamp to obtain a laminated film.
將所獲得之積層膜於265℃之加熱板上加熱3分鐘。目視觀察此時是否產生氣體並進行評價。未產生氣體:○,產生氣體且存在發泡:× The obtained laminated film was heated on a hot plate at 265°C for 3 minutes. Observe visually whether gas is generated at this time and evaluate. No gas generation: ○, gas generation and foaming: ×
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| JP2008170767A (en) * | 2007-01-12 | 2008-07-24 | Ricoh Co Ltd | Electrophotographic photosensitive member, image forming method using the same, image forming apparatus, and process cartridge for image forming apparatus |
| JP2009069241A (en) * | 2007-09-11 | 2009-04-02 | Ricoh Co Ltd | Electrophotographic apparatus and process cartridge |
| JP5512043B2 (en) | 2011-06-01 | 2014-06-04 | ラオン テック カンパニー リミテッド | Solar cell module support assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107531831A (en) | 2018-01-02 |
| JP6168241B2 (en) | 2017-07-26 |
| TW201706319A (en) | 2017-02-16 |
| WO2016181784A1 (en) | 2016-11-17 |
| JPWO2016181784A1 (en) | 2017-05-25 |
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