TWI682991B - 液晶密封劑及使用該液晶密封劑的液晶顯示單元 - Google Patents
液晶密封劑及使用該液晶密封劑的液晶顯示單元 Download PDFInfo
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- TWI682991B TWI682991B TW105114858A TW105114858A TWI682991B TW I682991 B TWI682991 B TW I682991B TW 105114858 A TW105114858 A TW 105114858A TW 105114858 A TW105114858 A TW 105114858A TW I682991 B TWI682991 B TW I682991B
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- liquid crystal
- sealing agent
- dropping method
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 219
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 56
- 238000007789 sealing Methods 0.000 title claims abstract description 44
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- 238000000034 method Methods 0.000 claims abstract description 63
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Abstract
本發明之課題係關於一種會藉由熱進行硬化之液晶滴下工法用液晶密封劑,本發明提出一種液晶滴下工法用液晶密封劑,其係耐濕試驗後之配線腐蝕性極低,且低液晶污染性、接著強度等之一般特性亦優異,故可實現液晶顯示元件之高精細化、高速應答化、低電壓驅動化、長壽命化者。
上述課題之解決手段為一種液晶滴下工法用液晶密封劑,其含有(A)硬化性化合物,其中,不照射紫外線而僅以130℃進行1小時的熱硬化而得之硬化物,其依照JIS-K7209測定之吸水率為2.0%以下,且依照JIS-K7129測定之透濕度為130g/m2*24h以下。
Description
本發明係關於一種會藉由熱進行硬化之液晶密封劑,且為使用於液晶滴下工法之液晶密封劑。更詳而言之,係關於一種耐濕試驗後之配線腐蝕性極低,且即使在低液晶污染性、接著強度等一般特性亦優異之液晶滴下工法用液晶密封劑。
隨著近年之液晶顯示單元的大型化,就液晶顯示單元之製造方法而言,已提出一種量產性更高之所謂液晶滴下工法(參照專利文獻1、專利文獻2)。具體上係在形成於一基板之液晶密封劑之壩堤(dam)內側滴入液晶後,貼合另一基板,藉此密封液晶之液晶顯示單元的製造方法。
惟,液晶滴下工法係因未硬化狀態之液晶密封劑與液晶接觸,在此時,液晶密封劑之成分會於液晶溶解(溶出)而使液晶之電阻值降低,產生密封附近之顯示不良之問題點。
為解決此課題,現在作為液晶滴下工法用
之液晶密封劑係使用光熱併用型者,並被實用化(專利文獻3、4)。使用此液晶密封劑之液晶滴下工法,其特徵係對被夾持於基板之液晶密封劑照射光而使其一次硬化後,加熱再使其二次硬化。若藉此方法,可藉由光使未硬化之液晶密封劑快速硬化,可抑制液晶密封劑成分在液晶之溶解(溶出)。進一步,僅以光硬化時亦產生光硬化時因硬化收縮等所致之接著強度不足的問題,但若為光熱併用型,則可獲得藉加熱所致之二次硬化而得到緩和應力效果,具有亦可解決如此問題之優點。
藉由使此光熱硬化型之液晶滴下工法用液晶密封劑實用化,液晶滴下工法成為一般所使用之方法。
藉由上述液晶滴下工法之實用化,即使為大型的液晶顯示單元,亦可變得容易製造,其結果與液晶顯示器之普及相關。
另一方面,此液晶滴下工法有時在所製造之液晶顯示單元的品質上仍有缺點。其一,係在耐濕可靠性後之液晶的驅動上產生缺陷之問題。此問題係藉由習知液晶注入方式所製造之液晶顯示單元亦產生的問題,但在藉由液晶滴下工法所製造之液晶顯示單元中為特別顯著。為解決此問題,自以往即進行各種研究。例如,藉由添加熱自由基聚合起始劑、硬化促進劑而使反應率提升、或以對液晶之溶解性低的材料作為構成成分等。
惟,該等之研究,亦未達可充分解決上述課題之液晶滴下工法用液晶密封劑的實現。
[專利文獻1]日本特開昭63-179323號公報
[專利文獻2]日本特開平10-239694號公報
[專利文獻3]日本特許第3583326號公報
[專利文獻4]日本特開2004-61925號公報
[專利文獻5]日本特開2004-126211號公報
[專利文獻6]日本特開2009-8754號公報
[專利文獻7]國際公開2008/004455號
本發明係關於會藉由熱進行硬化之液晶滴下工法用液晶密封劑,提出一種液晶滴下工法用液晶密封劑,其係耐濕試驗後之配線腐蝕性極低,且即使在低液晶污染性、接著強度等一般特性亦優異,故提出可實現液晶顯示元件之高精細化、高速應答化、低電壓驅動化、長壽命化者。
本發明人等為解決上述驅動缺陷之課題,經精心研究之結果,發現其為耐濕試驗後之配線腐蝕所導致者,該配線腐蝕係因在黑色矩陣下之紫外線的硬化不足,而影響到幾乎只透過熱所硬化的位置之透濕性與吸水性,遂完成本案發明。
亦即,本發明係有關以下之1)至14)者。在本說明書中,記載為「(甲基)丙烯酸」時,係意指「丙烯酸」及/或「甲基丙烯酸」。又「液晶滴下工法用液晶密封劑」係亦有時僅記載為「液晶密封劑」。
1)一種液晶滴下工法用液晶密封劑,係含有(A)硬化性化合物,其中,不照射紫外線而僅以130℃進行1小時的熱硬化而得之硬化物,其依照JIS-K7209測定之吸水率為2.0%以下,且依照JIS-K7129測定之透濕度為130g/m2*24h以下。
2)如前述1)所述之液晶滴下工法用液晶密封劑,更含有(B)熱自由基聚合起始劑。
3)如前述1)或2)所述之液晶滴下工法用液晶密封劑,其中,前述成分(B)熱自由基聚合起始劑為於分子內不含有氧-氧鍵(-O-O-)及氮-氮鍵(-N=N-)之熱自由基聚合起始劑。
4)如前述1)至3)中任一項所述之液晶滴下工法用液晶密封劑,更含有(C)光自由基聚合起始劑。
5)如前述1)至4)中任一項所述之液晶滴下工法用液晶密封劑,更含有(D)填充劑,該填充劑在液晶密封劑總量中的含有率為20質量%以上。
6)如前述1)至5)中任一項所述之液晶滴下工法用液晶密封劑,其中,前述成分(D)為(D-1)有機填充劑與(D-2)無機填充劑之混合物。
7)如前述1)至6)中任一項所述之液晶滴下工法用液晶密
封劑,其中,前述成分(D-2)無機填充劑在液晶密封劑總量中的含有率為20質量%以上。
8)如前述1)至7)中任一項所述之液晶滴下工法用液晶密封劑,其中,前述成分(A)硬化性化合物為環氧基(甲基)丙烯酸酯化合物。
9)如前述1)至7)中任一項所述之液晶滴下工法用液晶密封劑,其中,前述成分(A)硬化性化合物為環氧基(甲基)丙烯酸酯化合物與環氧化合物之混合物。
10)如前述1)至9)中任一項所述之液晶滴下工法用液晶密封劑,更含有(E)熱硬化劑。
11)如前述10)所述之液晶滴下工法用液晶密封劑,其中,前述成分(E)熱硬化劑為有機酸醯肼。
12)如前述1)至11)中任一項所述之液晶滴下工法用液晶密封劑,更含有(F)矽烷偶合劑。
13)一種液晶顯示單元之製造方法,其係具有下述步驟:在由2片基板所構成之液晶顯示單元中,在形成於一基板之前述1)至12)中任一項所述之液晶滴下工法用液晶密封劑之壩堤內側滴入液晶後,貼合另一基板,隨後藉光及/或熱進行硬化。
14)一種液晶顯示單元,係以使前述1)至12)中任一項所述之液晶滴下工法用液晶密封劑硬化而得之硬化物被密封者。
本發明之液晶滴下工法用液晶密封劑係可
將配線腐蝕作最大限抑制,且即使於低液晶污染性、接著強度亦優異,故作為液晶顯示元件用液晶密封劑極為有用。
第1圖係顯示有關遮光部之硬化寬度的圖。於經蝕刻鍍覆鉻之玻璃基板的中央塗佈已添加有1w%之5μm之玻璃纖維的液晶密封劑,使用黑色矩陣基板作為對向基盤並貼合,以夾具予以固定(紫外線照射前)。再從經蝕刻鉻之玻璃基板側照射3000mJ/cm2之紫外線後,剝離已貼合之2片基板,以顯微鏡確認在鉻之下被遮光之部分,測定遮光部之硬化寬度。
本發明之液晶密封劑係含有(A)硬化性化合物。
成分(A)係只要係會藉由光或熱進行聚合反應者即可,無特別限定,可舉例如具有(甲基)丙烯醯基之硬化性化合物、具有環氧基之硬化性化合物等。
具有(甲基)丙烯醯基之硬化性化合物係可舉例如(甲基)丙烯酸酯、環氧基(甲基)丙烯酸酯等。(甲基)丙烯酸酯係可舉例如甲基丙烯酸苯甲酯、甲基丙烯酸環己酯、二甲基丙烯酸甘油酯、三丙烯酸甘油酯、EO改質三丙烯酸甘油酯、新戊四醇丙烯酸酯、三羥甲基丙烷三丙烯酸酯、參(丙烯醯氧基乙基)三聚異氰酸酯、二新戊四醇六丙烯酸酯、氟乙醇胺三丙烯酸酯等。環氧基(甲基)丙烯酸酯係可藉由環氧化合物與(甲基)丙烯酸之反應以公知方法製得。成為原
料之環氧化合物係無特別限定,但以2官能以上之環氧化合物為較佳,可舉例如雙酚A型環氧化合物、雙酚F型環氧化合物、雙酚S型環氧化合物、酚酚醛清漆型環氧化合物、甲酚酚醛清漆型環氧化合物、雙酚A酚醛清漆型環氧化合物、雙酚F酚醛清漆型環氧化合物、脂環式環氧化合物、脂肪族鏈狀環氧化合物、縮水甘油基酯型環氧化合物、縮水甘油基胺型環氧化合物、乙內醯脲型環氧化合物、三聚異氰酸酯型環氧化合物、具有三酚甲烷骨架之酚酚醛清漆型環氧化合物、其他、鄰苯二酚、間苯二酚等二官能酚類之二縮水甘油基醚化物、二官能醇類之二縮水甘油基醚化物、及其等之鹵化物、氫化物等。該等之中,從液晶污染性之觀點而言,具有間苯二酚骨架之環氧化合物為較佳,例如為間苯二酚二縮水甘油基醚等。又,環氧基與(甲基)丙烯醯基之比率係無限定,可從步驟適合性及液晶污染性之觀點作適當選擇。
因此,較佳之具有(甲基)丙烯醯基之硬化性化合物係具有(甲基)丙烯醯氧基,並且具有間苯二酚骨架之硬化性化合物,例如,間苯二酚二縮水甘油基醚之丙烯酸酯、間苯二酚二縮水甘油基醚之甲基丙烯酸酯。
具有環氧基之硬化性化合物係可舉例如環氧化合物。該環氧化合物係無特別限定,但以2官能以上之環氧化合物為較佳,可舉例如雙酚A型環氧化合物、雙酚F型環氧化合物、雙酚S型環氧化合物、酚酚醛清漆型環氧化合物、甲酚酚醛清漆型環氧化合物、雙酚A酚醛清漆型環氧化合
物、雙酚F酚醛清漆型環氧化合物、脂環式環氧化合物、脂肪族鏈狀環氧化合物、縮水甘油基酯型環氧化合物、縮水甘油基胺型環氧化合物、乙內醯脲型環氧化合物、三聚異氰酸酯型環氧化合物、具有三酚甲烷骨架之酚酚醛清漆型環氧化合物、其他、二官能酚類之二縮水甘油基醚化物、二官能醇類之二縮水甘油基醚化物、及其等之鹵化物、氫化物等。該等之中,從液晶污染性之觀點,較佳係雙酚型環氧化合物、酚醛清漆型環氧化合物。
具有(甲基)丙烯醯氧基之硬化性化合物、具有環氧基之硬化性化合物亦可混合2種以上而使用,混合使用(甲基)丙烯酸化環氧化合物與環氧化合物為本案發明特佳之一態様。
在本發明之液晶密封劑中的成分(A)之含量通常為30至75質量%,較佳係40至65質量%。又,特別在併用環氧化合物與(甲基)丙烯酸化環氧化合物時,成分(A)中之環氧化合物的含量通常為3至30質量%,較佳為5至20質量%,更佳為8至15質量%。
本發明之液晶密封劑係不照射紫外線而僅以130℃進行1小時之熱硬化的硬化物依照JIS-K7209(D法)測定之吸水率為2.0%以下者(其中,試驗條件係使用60℃、90%之環境)。被液晶密封劑吸收之水分係用以促進液晶密封劑中之有機物的分解,甚至將分解物、雜質離子運出至液晶密封劑外。
此吸水率較佳係1.8%以下,更佳係1.6%以下。
本發明之液晶密封劑係不照射紫外線而僅以130℃進行1小時之熱硬化的硬化物依照JIS-K7129(A法)之方法測定的透濕度為130g/m2*24h以下者。因為穿透液晶密封劑之水分係對配線腐蝕之影響很大。又,若使用Systech illinois公司製Lyssy L80-5000,可依照JIS-K7129(A法)測定。設定試驗溫度係以60℃進行。
此透濕度較佳係110g/m2*24h以下,更佳係90g/m2*24h以下。
本發明之液晶密封劑係可使用(B)熱自由基聚合起始劑,以使硬化速度、硬化度提升。
熱自由基聚合起始劑係只要係會藉加熱產生自由基,而開始連鏈聚合反應之化合物即可,並無特別限定,但可舉例如有機過氧化物、偶氮化合物、苯偶姻化合物、苯偶姻醚化合物、苯乙酮化合物、四苯基-1,2-乙二醇(benzopinacol)等,以四苯基-1,2-乙二醇為適宜使用。例如,作為有機過氧化物,可以取得下述市售品:KayamekRTMA、M、R、L、LH、SP-30C、Perkadox CH-50L、BC-FF、Cadox B-40ES、Perkadox 14、TrigonoxRTM22-70E、23-C70、121、121-50E、121-LS 50E、21-LS50E、42、42LS、KayaesterRTMP-70、TMPO-70、CND-C70、OO-50E、AN、KayabutylRTMB、Perkadox 16、KayacarbonRTMBIC-75、AIC-75(化藥AKZO股份有限公司製)、PermekRTMN、H、S、F、D、G、PerhexaRTMH、HC、 TMH、C、V、22、MC、PercureRTMAH、AL、HB、PerbutylRTMH、C、ND、L、PercumylRTMH、D、PeroylRTMIB、
IPP、PeroctaRTMND、(日油股份有限公司製)等。
又,作為偶氮化合物,可以取得下述市售品:VA-044、V-070、VPE-0201、VSP-1001(和光純藥工業股份有限公司製)等。本說明書中,上標之RTM係意指註冊商標。
成分(B)較佳者係於分子內不具有氧-氧鍵(-O-O-)或氮-氮鍵(-N=N-)之熱自由基聚合起始劑。於分子內具有氧-氧鍵(-O-O-)或氮-氮鍵(-N=N-)之熱自由基聚合起始劑會於產生自由基時產生大量之氧或氮,故會於液晶密封劑中以殘存氣泡之狀態進行硬化,有降低接著強度等特性之虞。以四苯基-1,2-乙二醇系之熱自由基聚合起始劑(包含四苯基-1,2-乙二醇經化學修飾者)為特別適宜。具體上係可舉例如四苯基-1,2-乙二醇、1,2-二甲氧基-1,1,2,2-四苯基乙烷、1,2-二乙氧基-1,1,2,2-四苯基乙烷、1,2-二苯氧基-1,1,2,2-四苯基乙烷、1,2-二甲氧基-1,1,2,2-四(4-甲基苯基)乙烷、1,2-二苯氧基-1,1,2,2-四(4-甲氧基苯基)乙烷、1,2-雙(三甲基矽氧基)-1,1,2,2-四苯基乙烷、1,2-雙(三乙基矽氧基)-1,1,2,2-四苯基乙烷、1,2-雙(第三丁基二甲基矽氧基)-1,1,2,2-四苯基乙烷、1-羥基-2-三甲基矽氧基-1,1,2,2-四苯基乙烷、1-羥基-2-三乙基矽氧基-1,1,2,2-四苯基乙烷、1-羥基-2-第三丁基二甲基矽氧基-1,1,2,2-四苯基乙烷等,較佳係1-羥基-2-三甲基矽氧基-1,1,2,2-四苯基乙烷、1-羥基-2-三乙基矽氧基-1,1,2,2-四苯基乙烷、1-羥基-2-第三丁基二甲基矽氧基-1,1,2,2-四苯基乙烷、1,2-雙(三甲基矽
氧基)-1,1,2,2-四苯基乙烷,更佳係1-羥基-2-三甲基矽氧基-1,1,2,2-四苯基乙烷、1,2-雙(三甲基矽氧基)-1,1,2,2-四苯基乙烷,特佳係1,2-雙(三甲基矽氧基)-1,1,2,2-四苯基乙烷。
上述四苯基-1,2-乙二醇係由東京化成工業股份有限公司、和光純藥工業股份有限公司等所市販。又,使四苯基-1,2-乙二醇之羥基醚化係可藉周知之方法而容易地合成。又,使四苯基-1,2-乙二醇之羥基矽基醚化係可藉由使對應之四苯基-1,2-乙二醇及各種矽基化劑在吡啶等鹼性觸媒下加熱之方法而合成製得。矽基化劑係可舉例如一般所知之三甲基矽基化劑的三甲基氯矽烷(TMCS)、六甲基二矽氮烷(HMDS)、N,O-雙(三甲基矽基)三氟乙醯胺(BSTFA)或作為三乙基矽基化劑之三乙基氯矽烷(TECS)、作為第三丁基二甲基矽基化劑之第三丁基甲基矽烷(TBMS)等。該等試藥係可由矽衍生物廠商等容易地取得。矽基化劑之反應量係以相對於對象化合物之羥基1莫耳為1.0至5.0倍莫耳為較佳。更佳係1.5至3.0倍莫耳。若少於1.0倍莫耳,反應效率差,反應時間變長,故促進熱分解。若多於5.0倍莫耳,回收時分離變差,或精製變困難。
成分(B)係以粒徑微細化,且均勻分散為較佳。其平均粒徑若太大,於製造窄間隙之液晶顯示單元時,會成為使上下玻璃基板貼合時之間隙無法順利進行等不良原因,故以5μm以下為較佳,更佳係3μm以下。又,即使無止盡地微細化亦無妨,但通常下限為0.1μm左右。粒徑係可以雷射繞射/散射式粒度分布測定器(乾式)(股份有
限公司Seishin企業製;LMS-30)測定。
成分(B)之含量在液晶密封劑之總量中,以0.0001至10質量%為較佳,更佳係0.0005至5質量%,以0.001至3質量%為特佳。
本發明之液晶密封劑可使用(C)光自由基聚合起始劑,設為光熱併用型之液晶密封劑。
光自由基聚合起始劑係只要係會藉由紫外線或可見光之照射產生自由基,而起始連鏈聚合反應之化合物即可,無特別限定,但可列舉例如苯甲基二甲基縮醛、1-羥基環己基苯基酮、二乙基硫雜蒽酮、二苯基酮、2-乙基蒽醌、2-羥基-2-甲基丙醯苯、2-甲基-[4-(甲基硫)苯基]-2-嗎啉基-1-丙烷、2,4,6-三甲基苯甲醯基二苯基氧化膦、樟腦醌、9-茀酮、二苯基二硫醚等。具體上係可舉例如IRGACURERTM651、184、2959、127、907、369、379EG、819、784、754、500、OXE01、OXE02、DAROCURERTM1173、LUCIRINRTMTPO(任一者均為BASF公司製)、SEIKUOLRTMZ、BZ、BEE、BIP、BBI(任一者均為精工化學股份有限公司製)等。
又,從液晶污染性之觀點,使用於分子內具有(甲基)丙烯酸基者為較佳,適宜使用例如2-甲基丙烯醯氧基乙基異氰酸酯與1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2甲基-1-丙烷-1-酮之反應生成物。此化合物係可以國際公開第2006/027982號記載之方法製造而得。
又,從提升因配線或黑色矩陣而未充分照射到光之遮光部的硬化性之觀點,在乙腈中測定之350nm中的吸光係
數為500ml‧g-1‧cm以上時較佳。例如IRGACURERTM651907、369、379EG、819、784、OXE01、OXE02、LUCIRINRTMTPO(任一者均為BASF公司製)、二乙基硫雜蒽酮、二苯甲酮等。
在本發明之液晶密封劑中可使用之成分(C)光自由基聚合起始劑之在液晶密封劑中之含量,在本發明之液晶密封劑的總量中通常為0.1至20質量%,較佳係0.2至15質量%。
本發明之液晶密封劑係可使用(D)填充劑,以使接著強度提升。此填充劑可為(D-1)有機填充劑,亦可為(D-2)無機填充劑,也可為其混合物,但從分別具有之不同功能,以兩者之混合物時為較佳。
液晶密封劑之總量中,(D)填充劑之含有率通常為5至70質量%,較佳係10至60質量%。進一步,(D)填充劑之含有率為20質量%以上時,能特別顯著地發揮本案發明之效果,特佳係20至50質量%。
成分(D-1)有機填充劑係可舉例如胺基甲酸酯微粒子、丙烯酸微粒子、苯乙烯微粒子、苯乙烯烯烴微粒子及聚矽氧微粒子。又,聚矽氧微粒子係以KMP-594、KMP-597、KMP-598(信越化學工業製)、TorayfilRTME-5500、9701、EP-2001(Dow Corning Toray公司製)為較佳,胺基甲酸酯微粒子係以JB-800T、HB-800BK(根上工業股份有限公司)為較佳,苯乙烯微粒子係以RabalonRTMT320C、T331C、SJ4400、SJ5400、SJ6400、SJ4300C、SJ5300C、SJ6300C(三菱化學製)為較佳,苯乙烯烯烴微粒子係以SeptonRTMSEPS2004、
SEPS2063為較佳。
該等有機填充劑係可單獨使用,也可併用2種以上。可使用2種以上而為核殼構造。該等之中,較佳係丙烯酸微粒子、聚矽氧微粒子。
使用上述丙烯酸微粒子時,由2種類之丙烯酸橡膠所構成之核殼構造的丙烯酸橡膠時為較佳,特佳係核層為丙烯酸正丁酯,殼層為甲基丙烯酸甲酯者。此係由AICA工業股份有限公司所販賣之ZefiacRTMF-351。
又,上述聚矽氧微粒子係可舉例如有機聚矽氧烷交聯物粉體、直鏈之二甲基聚矽氧烷交聯物粉體等。複合聚矽氧橡膠係可舉例如於上述聚矽氧橡膠之表面被覆聚矽氧化合物(例如聚有機矽倍半氧烷化合物)者。該等之微粒子中,特佳係直鏈之二甲基聚矽氧烷交聯粉末的聚矽氧橡膠或聚矽氧化合物被覆直鏈二甲基聚矽氧烷交聯粉末的複合聚矽氧橡膠微粒子。該等者係可單獨使用,亦可併用2種以上。又,較佳係橡膠粉末之形狀為添加後之粘度增黏少的球狀。本發明之液晶密封劑中,使用成分(D)時,在液晶密封劑之總量中通常為5至50質量%,較佳係5至40質量%。
成分(D-2)無機填充劑係可舉例如二氧化矽、碳化矽、氮化矽、氮化硼、碳酸鈣、碳酸鎂、硫酸鋇、硫酸鈣、雲母、滑石、黏土、氧化鋁、氧化鎂、氧化鋯、氫氧化鋁、氫氧化鎂、矽酸鈣、矽酸鋁、矽酸鋰鋁、矽酸鋯、鈦酸鋇、玻璃纖維、碳纖維、二硫化鉬、石綿等,較佳係熔融二氧
化矽、結晶二氧化矽、氮化矽、氮化硼、碳酸鈣、硫酸鋇、硫酸鈣、雲母、滑石、黏土、氧化鋁、氫氧化鋁、矽酸鈣、矽酸鋁,較佳係雲母、氧化鋁、滑石。該等無機填充劑係可混合2種以上而使用。
無機填充劑之平均粒徑若太大,於製造窄間隙之液晶單元時,會成為使上下玻璃基板貼合時之間隙形成無法順利進行等不良原因,故2000nm以下為適當,較佳係1000nm以下,更佳係300nm以下。較佳之下限係10nm左右,更佳係100nm左右。粒徑係以雷射繞射/散射式粒度分布測定器(乾式)(Seishine企業股份有限公司製;LMS-30)測定。
在本發明之液晶密封劑中使用無機填充劑時,其在液晶密封劑之總量中,可為10至50質量%左右,但為20質量%以上時,本願發明之效果為更顯著者。特佳係20至50質量%。
本發明之液晶密封劑係可含有(E)熱硬化劑。
熱硬化劑係與上述成分(B)熱自由基聚合起始劑相異,意指不會受加熱而產生自由基之熱硬化劑。具體而言,係可透過非共價電子對或分子內之陰離子而親核性進行反應者,可舉例如多元胺類、多元酚類、有機酸醯肼化合物等。但不受該等限定。該等之中,有機酸醯肼化合物特別適宜使用。可舉例如芳香族醯肼之對苯二甲酸二醯肼、間苯二甲酸二醯肼、2,6-萘甲酸二醯肼、2,6-吡啶二醯肼、1,2,4-苯三醯肼、1,4,5,8-萘甲酸四醯肼、均苯四甲酸四醯
肼等。又,若為脂肪族醯肼化合物,例如甲醯肼、乙醯肼、丙酸醯肼、草酸二醯肼、丙二酸酸二醯肼、琥珀酸二醯肼、戊二酸二醯肼、己二酸二醯肼、庚二酸二醯肼、癸二酸二醯肼、1,4-環己烷二醯肼、酒石酸二醯肼、蘋果酸二醯肼、亞胺基二乙酸二醯肼、N,N’-六亞甲基雙半卡肼、檸檬酸三醯肼、氮基乙酸三醯肼、環己烷三羧酸三醯肼、1,3-雙(肼基羰基乙基)-5-異丙基乙內醯脲等具有乙內醯脲骨架、較佳為具有纈胺酸乙內醯脲骨架(乙內醯脲環之碳原子被異丙基取代之骨架)之二醯肼化合物、參(1-肼基羰基甲基)三聚異氰酸酯、參(2-肼基羰基乙基)三聚異氰酸酯、參(1-肼基羰基乙基)三聚異氰酸酯、參(3-肼基羰基丙基)三聚異氰酸酯、雙(2-肼基羰基乙基)三聚異氰酸酯等。從硬化反應性與潜在性之均衡而言,較佳係間苯二甲酸二醯肼、丙二酸二醯肼、己二酸二醯肼、參(1-肼基羰基甲基)三聚異氰酸、參(1-肼基羰基乙基)三聚異氰酸酯、參(2-肼基羰基乙基)三聚異氰酸酯、參(3-肼基羰基丙基)三聚異氰酸酯,特佳係參(2-肼基羰基乙基)三聚異氰酸酯。
成分(E)係可單獨使用,亦可混合2種類以上。在本發明之液晶密封劑中使用成分(E)時,其在液晶密封劑總量中,通常為0.1至10質量%,較佳係1至5質量%。
本發明之液晶密封劑可添加矽烷偶合劑作為成分(F),以使接著強度或耐濕性提升。
成分(F)係可舉例如3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷、3-環氧丙氧基
丙基甲基二乙氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷、N-(2-胺基乙基)3-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基)3-胺基丙基甲基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-硫醇基丙基三甲氧基矽烷、乙烯基三甲氧基矽烷、N-(2-(乙烯基苯甲基胺基)乙基)3-胺基丙基三甲氧基矽烷鹽酸鹽、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-氯丙基甲基二甲氧基矽烷、3-氯丙基三甲氧基矽烷等。該等之矽烷偶合劑係信越化學工業股份有限公司等所販售之KBM系列、KBE系列等,故可容易地從市場取得。本發明之液晶密封劑中使用成分(F)時,其在液晶密封劑總量中以0.05至3質量%為適宜。
本發明之液晶密封劑係進一步依需要可調配有機酸或咪唑等硬化促進劑、自由基聚合抑制劑、顏料、調平劑、消泡劑、溶劑等添加劑。
上述硬化促進劑係可舉例如有機酸或咪唑等。
有機酸係可舉例如有機羧酸或有機磷酸等,惟有機羧酸時為較佳。具體上係可舉例如鄰苯二甲酸、間苯二甲酸、對苯二甲酸酞酸、偏苯三甲酸、二苯甲酮四羧酸、呋喃二羧酸等芳香族羧酸、琥珀酸、己二酸、十二碳二酸、癸二酸、硫代二丙酸、環己烷二羧酸、參(2-羧基甲基)三聚異氰酸酯、參(2-羧基乙基)三聚異氰酸酯、參(2-羧基丙基)三聚異氰酸酯、雙(2-羧基乙基)三聚異氰酸酯等。
又,咪唑化合物係可舉例如2-甲基咪唑、2-苯基咪唑、
2-十一碳基咪唑、2-十七碳基咪唑、2-苯基-4-甲基咪唑、1-苯甲基-2-苯基咪唑、1-苯甲基-2-甲基咪唑、1-氰乙基-2-甲基咪唑、1-氰乙基-2-苯基咪唑、1-氰乙基-2-十一碳基咪唑、2,4-二胺基-6(2’-甲基咪唑(1’))乙基-s-三、2,4-二胺基-6(2’-十一碳基咪唑(1’))乙基-s-三、2,4-二胺基-6(2’-乙基-4-甲基咪唑(1’))乙基-s-三、2,4-二胺基-6(2’-甲基咪唑(1’))乙基-s-三/三聚異氰酸加成物、2-甲基咪唑三聚異氰酸之2:3加成物、2-苯基咪唑三聚異氰酸加成物、2-苯基-3,5-二羥基甲基咪唑、2-苯基-4-羥基甲基-5-甲基咪唑、1-氰乙基-2-苯基-3,5-二氰乙氧基甲基咪唑等。
在本發明之液晶密封劑中使用硬化促進劑時,其在液晶密封劑之總量中,通常為0.1至10質量%,較佳係1至5質量%。
上述自由基聚合抑制劑係只要係與產生自光自由基聚合起始劑或熱自由基聚合起始劑等之自由基進行反應而抑制聚合之化合物即可,無特別限定,可使用醌系、哌啶系、受阻酚系、亞硝基系等。具體上係可舉例如萘醌、2-羥基萘醌、2-甲基萘醌、2-甲氧基萘醌、2,2,6,6-四甲基哌啶-1-氧化物(2,2,6,6-tetramethylpiperidine-1-oxyl)、2,2,6,6-四甲基-4-羥基哌啶-1-氧化物、2,2,6,6-四甲基-4-甲氧基哌啶-1-氧化物、2,2,6,6-四甲基-4-苯氧基哌啶-1-氧化物、氫醌、2-甲基氫醌、2-甲氧基氫醌、對苯醌、丁基化羥基茴香醚、2,6-二-第三丁基-4-乙基酚、2,6-二-第三丁基甲酚、硬脂基β-(3,5-二第三丁基-4-羥基苯基)丙酸酯、
2,2’-亞甲基雙(4-乙基-6-第三丁基酚)、4,4’-硫代雙-3-甲基-6-第三丁基酚)、4,4’-亞丁基雙(3-甲基-6-第三丁基酚)、3,9-雙[1,1-二甲基-2-[β-(3-第三丁基-4-羥基-5-甲基苯基)丙醯氧基]乙基]、2,4,8,10-四氧雜螺[5,5]十一烷、肆-[亞甲基-3-(3’,5’-二-第三丁基-4’-羥基苯基丙酸酯)甲烷、1,3,5-參(3’,5’-二-第三丁基-4’-羥基苯甲基)-第二-三-2,4,6-(1H,3H,5H)三酮、對甲氧基酚、4-甲氧基-1-萘酚、硫代二苯基胺、N-亞硝基苯基羥基胺之鋁鹽、商品名Adekastab LA-81、商品名Adek stab LA-82(ADEKA股份有限公司製)等,但不限定於該等。該等之中,以萘醌系、氫醌系、亞硝基系哌啶系之自由基聚合抑制劑為較佳,以萘醌、2-羥基萘醌、氫醌、2,6-二-第三丁基-P-甲酚、Polystop 7300P(伯東股份有限公司製)為更佳,以Polystop 7300P(伯東股份有限公司製)為最佳。
自由基聚合抑制劑之含量係本發明之液晶密封劑總量中,以0.0001至1質量%為較佳,以0.001至0.5質量%為更佳,以0.01至0.2質量%為特佳。
作為製得本發明之液晶密封劑的方法之一例係有下列所示之方法。首先,使(A)成分、依需要之(C)成分加熱溶解。然後,冷卻至室溫後,依需要而添加(F)成分,進一步依需要添加(B)成分、(D)成分、(E)成分以及消泡劑、調平劑、溶劑等,藉由公知之混合裝置例如三輥研磨機、砂磨機、球磨機等均勻地予以混合,以金屬網目進行濾過,藉此可製造本發明之液晶密封劑。
本發明之液晶顯示單元係於基板將已形成預定之電極的一對基板以預定之間隔相對向配置,周圍以本發明之液晶密封劑予以密封,於其間隙封入液晶者。所封入之液晶的種類係無特別限定。於此,所謂基板係由玻璃、石英、塑膠、矽等所構成之至少一面具有光透過性之組合的基板所構成。其製法係於本發明之液晶密封劑添加玻璃纖維等間隔物(間隙控制材)後,於該一對基板之一面使用點膠機、或網版印刷裝置等而塗佈該液晶密封劑之後,依需要,以80至120℃進行暫時硬化。其後,於該液晶密封劑之壩堤內側滴入液晶,於真空中使另一玻璃基板重合,進行間隙形成(gap formation)。形成間隙後,以90至130℃進行硬化1至2小時,藉此製得本發明之液晶顯示單元。又,使用作為光熱併用型時,係藉紫外線照射機對液晶密封劑部照射紫外線而使其光硬化。紫外線照射量較佳係500至10000mJ/cm2,更佳係1000至6000mJ/cm2之照射量為較佳。其後依需要,以90至130℃進行1至2小時硬化,藉此製得本發明之液晶顯示單元。如此方式所得之本發明的液晶顯示單元係無液晶污染所致之顯示不良,為接著性、耐濕可靠性優異者。間隔物係可舉例如玻璃纖維、二氧化矽顆粒、聚合物顆粒等。其直徑係依目的而異,但通常為2至8μm,較佳係4至7μm。其使用量係相對於本發明之液晶密封劑100質量%,通常為0.1至4質量%,較佳係0.5至2質量%,更佳係0.9至1.5質量%左右。
本發明之液晶密封劑係具有降低配線腐蝕
之效果。此結果,可消除耐濕試驗後之驅動缺陷。而且,於低液晶污染性亦優異,更且,其硬化物係於接著強度、耐熱性等各種硬化物特性亦優異。從以上,藉由使用本發明之液晶密封劑,可實現可靠性優之液晶顯示單元。又,使用本發明之液晶密封劑而製作之液晶顯示單元係充分滿足電壓保持率高,離子密度低之作為液晶顯示單元必要的特性。
以下,藉實施例更詳細說明本發明,但本發明係不限定於實施例。又,只要無特別記載,本文中「份」及「%」係採質量基準。
安裝有溫度計、滴入漏斗、冷卻管、攪拌器之燒瓶中添加間苯二酚5500g、表氯醇37000g、四甲氯化銨500g,並在攪拌下溶解,升溫至70℃。然後,將片狀之氫氧化鈉4000g費時100份分鐘分批添加後,再以70℃進行後反應1小時。反應結束後,加入水15000g進行水洗後,在130℃減壓下,從油層餾去過量之表氯醇等。於殘留物中加入甲基異丁基酮22200g,並溶解,升溫至70℃。在攪拌下,加入30%之氫氧化鈉水溶液1000g,進行反應1小時後,以水5550g進行水洗3次,在180℃減壓下餾去甲基異丁
基酮,製得間苯二酚二縮水甘油基醚10550g。所得之環氧化合物的環氧當量為129g/eq。
將上述合成例1所得之間苯二酚二縮水甘油基醚181.2g溶解於甲苯266.8g,再加入二丁基羥基甲苯0.8g作為聚合抑制劑,升溫至60℃。其後,加入環氧基當量100%的丙烯酸117.5g,再升溫至80℃,於其中添加作為反應觸媒之三甲基氯化銨0.6g,以98℃攪拌約30小時。將所得之反應液進行水洗,餾去甲苯,藉此,製得作為目的之間苯二酚二縮水甘油基醚之丙烯酸酯化物253g。
將雙酚A型環氧化合物282.5g(製品名:YD-8125,新日鐵化學股份有限公司製)溶解於甲苯266.8g,於其中加入二丁基羥基甲苯0.8g作為聚合抑制劑,升溫至60℃。其後,加入環氧基當量100%的丙烯酸酸117.5g,再升溫至80℃,於其中添加作為反應觸媒之三甲基氯化銨0.6g,以98℃攪拌約30小時,製得反應液。將此反應液進行水洗,餾去甲苯,藉此,製得作為目的之雙酚A型環氧化合物的丙烯酸酯化物395g。
將市售四苯基-1,2-乙二醇(東京化成工業股份有限公
司製)100份(0.28莫耳)溶解於二甲基甲醛350份。於其中加入作為鹼生觸媒之吡啶32份(0.4莫耳)、作為矽基化劑之BASFA(信越化學工業股份有限公司製)150份(0.58莫耳),升溫至70℃,攪拌2小時。冷卻所得之反應液,一邊攪拌,一邊加入水200份,使生成物沉澱,以及使未反應矽基化劑失去活性。使沉澱之生成物過濾分離後,充分水洗。然後,所得之生成物溶解於丙酮,加入水而使其再結晶,進行精製。製得目的之1,2-雙(三甲基矽氧基)-1,1,2,2-四苯基乙烷105.6份(產率88.3%)。
以HPLC(高速液體色層分析)分析後之結果,純度係99.0%(面積百分率)。
以下述表1所示之比率以合成例1合成之化合物、以合成例2合成之化合物等硬化性化合物(成分(A))中加入光自由基聚合起始劑(成分(C)),以90℃加熱溶解。冷卻至室溫,加入熱自由基聚合起始劑(成分(B))、矽烷偶合劑(成分(F))、熱硬化劑(成分(E))、有機填充劑(成分(D-1))、無機填充劑(成分(D-2))等,攪拌之後,以三輥研磨機分散,以金屬網目(635網目)濾過,調製液晶滴下工法用密封劑(實施例1至5、比較例1至4)。
將實施例、比較例所製造之液晶密封劑夾在聚對苯二
甲酸乙二酯(PET)膜,作為厚度100μm之薄膜者投入於130℃烘箱中1小時,並使其硬化,硬化後,剝離PET膜,獲得密封劑硬化膜之後,將此切成20mm×50mm之短籤狀,作為試樣片。將所得之試樣片依據JIS-K7209 D法在25℃、50%RH之條件中使其安定化24小時之後,測定初期重量,在60℃、90%RH之條件下使其吸水24小時之後,測定重量,作為吸水後重量。測定後依下述式算出吸水率。
吸水率(%)=((吸水後重量(g)-初期重量(g))/初期重量(g))×100(%)
藉由與吸水率同様之方法製作密封劑硬化膜,切成90mm×90mm之正方形狀,作為試樣片。將此試樣片依據JIS-K7129 A法之Systech Illinois公司製之透濕度測定裝置Lyssy L80-5000在60℃之溫度條件下進行透濕度之測定。
使用實施例、比較例所製造之液晶密封劑,製作單元間隙5μm之評價用液晶單元,確認出在高溫高濕度試驗之電極腐蝕的發生。有關其試驗方法表示於下。
於液晶密封劑各2g中添加直徑5μm之玻璃纖維0.02g作為間隔物而進行混合攪拌脫泡,填充於5ml注射筒中。於附ITO透明電極之玻璃基板,利用點膠機(SHOTMASTER 300:武蔵Engineering股份有限公司製),將預先已填充於
注射筒之液晶密封劑塗佈成30mm×40mm之長方形密封圖案,然後,將液晶(MLC-3007:Merk股份有限公司製)之微小滴滴入於密封圖案框內。再於另一片之ITO玻璃基板散布面內間隔物(Natocospacer KSEB-525F:Natoco股份有限公司製:貼合後之間隙寬5μm),並予以熱固著,使用貼合裝置在真空中與先前之滴入液晶之基板貼合後,連通大氣而形成間隙。由於想定為很難對密封劑照射紫外線之配線遮光部,故以金屬鹵素燈(Ushio電機股份有限公司製)照射低照射量500mJ/cm2(100mW/cm2下5秒)之紫外線使密封圖案半硬化,再進一步投入於130℃烘箱中1小時,使密封圖案熱硬化,製作評價用液晶單元。以Function generator(FG-281:股份有限公司TEXIO‧Technology製)施加10V 100Hz之正弦波電壓的狀態於60℃ 90%RH之高溫高濕條件下投入所得之評價用液晶單元240小時,其後藉由顯微鏡觀察評價用密封部,依下述之基準進行電極腐蝕之評價。
○:於密封周邊部未觀察到ITO電極之腐蝕。
△:於密封周邊部稍觀察到ITO電極之腐蝕。
×:於密封周邊部觀察到ITO電極之腐蝕。
對於實施例、比較例所製造之各液晶密封劑,於10ml小瓶(vial)之底部塗抹密封劑100mg左右,然後,從其上方,以所塗布之各密封劑的10倍量加入液晶(MLC-3007:
Merk股份有限公司製)。加熱所得之小瓶,以130℃保持1小時後,冷卻至室溫30分鐘。以傾析法(decantation)分取各別之液晶的上清液,以數位超高電阻計(R8340:股份有限公司Advantest製)測定電阻值,為相對於無密封劑之液晶的值之比電阻值,依據以下之基準進行判定。
○:5.0×1012以上
△:5.0×1011以上、未達5.0×1012
×:未達5.0×1011
如第1圖所示,於經蝕刻鍍覆鉻之玻璃基板中央塗佈添加有3μm之玻璃纖維1w%之液晶密封劑,使用黑色矩陣基板作為對向基板並貼合,以夾具予以固定(紫外線照射前)。再從經蝕刻鉻之玻璃基板側照射3000mJ/cm2之紫外線後,剝除貼合之2片基板,以顯微鏡確認在鉻之下被遮光之部分,測定遮光部之硬化寬度。
○:30μm以上
△:10μm以上、未達30μm
×:未達10μm
A-1:間苯二酚二縮水甘油基醚之全丙烯酸化物(合成例1)
A-2:雙酚A型環氧樹脂之全丙烯酸化物(合成例2)
A-3:己內酯改質(6莫耳)二新戊四醇六丙烯酸酯(日本化藥股份有限公司製:DPCA-60)
A-4:雙酚A型環氧樹脂(日本化藥股份有限公司製:RE-310S)
A-5:雙酚A型環氧樹脂高分子量體(新日鐵住金化學製:YD-012)
A-6:環氧乙烷改質雙酚S型環氧樹脂(以日本專利第4211942號記載之方法合成)
B-1:1,2-雙(三甲基矽氧基)-1,1,2,2-四苯基乙烷(合成例3以噴射研磨機為粉碎至平均1.9μm者)
B-2:4,4’-偶氮雙(4-氰戊酸)與聚乙二醇之聚縮合物(分子量:2000)(和光純藥工業股份有限公司製:VPE-0201)
C-1:2-甲基丙烯醯氧乙基異氰酸酯及1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮之反應生成物(以國際公開2006/027982號記載之方法合成)
C-2:1,2-辛二酮,1-[4-(苯基硫)-2-(O-苯甲醯基肟)](BASF製:IRGACURE OXE-01
C-3:2,4-二乙基硫雜蒽酮(日本化藥股份有限公司製:DETX-S)
D-1-1:聚甲基丙烯酸酯系有機微粒子(AICA工業股份有限公司製:F-351S)
D-2-1:球狀二氧化矽(信越化学工業股份有限公司製:X-24-9163A)
D-2-2:球狀二氧化矽(Tokuyama股份有限公司製:Sunseal SSP-07DM)
E-1:參(2-肼基羰基乙基)三聚異氰酸酯微粉碎品(日本Finechem股份有限公司製:HCIC、以噴射研磨機微粉碎至1.5μm者)
F-1:3-環氧丙氧基丙基三甲氧基矽烷(JNC股份有限公司製:Sila-Ace S-510)
F-2:N-2(胺基乙基)3-胺基丙基三乙氧基矽烷(信越化學工業股份有限公司製:KBM-603)
O-1:亞硝基系哌啶衍生物(伯東股份有限公司製:Polystop 7300P)
O-2:參(3-羧基乙基)三聚異氰酸酯(四國化成工業股份有限公司製:CIC酸、以噴射研磨機微粉碎至平均粒徑1.5μm者)
從表1之結果可知,僅藉由熱所硬化之硬化物的吸水率、透濕度為一定以下之實施例1至5係無配線腐蝕,且顯示出低液晶污染性亦優異的結果。另一方面,比較例記載之液晶密封劑係有配線腐蝕,於液晶顯示單元之長期可靠性上有問題。從此事實來看,可謂本案發明係耐濕試驗後之可靠性優的液晶密封劑,且使用此液晶密封劑所製造之液晶顯示單元的可靠性亦優異。
本發明之液晶密封劑係對液晶顯示特性影響極小,故可使液晶顯示元件之高精細化、高速應答化、低電壓驅動化、長壽命化成為可能。又,接著強度或耐濕可靠性優異,故可實現可靠性高之液晶顯示元件的製造。
Claims (12)
- 一種液晶滴下工法用液晶密封劑,係含有(A)硬化性化合物、(D)填充劑及(E)熱硬化劑,其中,該填充劑在液晶密封劑總量中的含有率為20質量%以上,不照射紫外線而僅以130℃進行1小時的熱硬化而得之硬化物,其依照JIS-K7209測定之吸水率為2.0%以下,且依照JIS-K7129測定之透濕度為130g/m2*24h以下。
- 如申請專利範圍第1項所述之液晶滴下工法用液晶密封劑,更含有(B)熱自由基聚合起始劑。
- 如申請專利範圍第1或2項所述之液晶滴下工法用液晶密封劑,其中,前述成分(B)熱自由基聚合起始劑為於分子內不含有氧-氧鍵(-O-O-)及氮-氮鍵(-N=N-)之熱自由基聚合起始劑。
- 如申請專利範圍第1或2項所述之液晶滴下工法用液晶密封劑,更含有(C)光自由基聚合起始劑。
- 如申請專利範圍第1或2項所述之液晶滴下工法用液晶密封劑,其中,前述成分(D)為(D-1)有機填充劑與(D-2)無機填充劑之混合物。
- 如申請專利範圍第5項所述之液晶滴下工法用液晶密封劑,其中,前述成分(D-2)無機填充劑在液晶密封劑總量中的含有率為20質量%以上。
- 如申請專利範圍第1或2項所述之液晶滴下工法用液晶 密封劑,其中,前述成分(A)硬化性化合物為環氧基(甲基)丙烯酸酯化合物。
- 如申請專利範圍第1或2項所述之液晶滴下工法用液晶密封劑,其中,前述成分(A)硬化性化合物為環氧基(甲基)丙烯酸酯化合物與環氧化合物之混合物。
- 如申請專利範圍第1或2項所述之液晶滴下工法用液晶密封劑,其中,前述成分(E)熱硬化劑為有機酸醯肼。
- 如申請專利範圍第1或2項所述之液晶滴下工法用液晶密封劑,更含有(F)矽烷偶合劑。
- 一種液晶顯示單元之製造方法,其係具有下述步驟:在由2片基板所構成之液晶顯示單元中,在形成於一基板之申請專利範圍第1至10項中任一項所述之液晶滴下工法用液晶密封劑之壩堤內側滴入液晶後,貼合另一基板,隨後藉光及/或熱進行硬化。
- 一種液晶顯示單元,係以使申請專利範圍第1至10項中任一項所述之液晶滴下工法用液晶密封劑硬化所得之硬化物被密封者。
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