TWI681071B - 生成薄無機膜之方法 - Google Patents
生成薄無機膜之方法 Download PDFInfo
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- TWI681071B TWI681071B TW104125077A TW104125077A TWI681071B TW I681071 B TWI681071 B TW I681071B TW 104125077 A TW104125077 A TW 104125077A TW 104125077 A TW104125077 A TW 104125077A TW I681071 B TWI681071 B TW I681071B
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- 238000000034 method Methods 0.000 title claims abstract description 61
- 230000008569 process Effects 0.000 title claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 85
- 239000007787 solid Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000003446 ligand Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 29
- 239000001257 hydrogen Substances 0.000 claims abstract description 28
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 26
- 125000004665 trialkylsilyl group Chemical group 0.000 claims abstract description 19
- 125000003118 aryl group Chemical group 0.000 claims abstract description 17
- 150000002431 hydrogen Chemical class 0.000 claims description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 6
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- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 abstract description 9
- 239000000443 aerosol Substances 0.000 abstract description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 14
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- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
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Images
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
本發明屬於在基板上生成薄無機膜之方法,特定言之原子層沈積方法之領域。
隨著當前小型化發展,例如在半導體工業中,對基板上薄無機膜之需要增加,同時對該等膜之品質的要求變得更加嚴格。薄無機膜供不同目的使用,諸如障壁層、介電質、精細結構之分隔器或電接觸。已知若干生成薄無機膜之方法。其中之一為將成膜化合物自氣態沈積於基板上。為了在適中溫度下使金屬或半金屬原子變為氣態,需要例如藉由使金屬或半金屬與適合配位體錯合來提供揮發性前驅物。此等配位體需要在將錯合金屬或半金屬沈積至基板上之後移除。
WO 2012/057 884 A1揭示用於過渡金屬之含氮配位體及其在原子層沈積方法中之用途。
WO 2008/141 439 A1揭示過渡金屬與含磷光體配位體之錯合物及其作為氫氣生成中之催化劑之用途。
本發明之一目標為提供在經濟上可行之條件下在固體基板上生成具有高品質及可再生性之無機膜之方法。需要此方法可在包含金屬
之前驅物在其與固體基板接觸之前儘可能少地分解之情況下進行。同時,需要提供前驅物在沈積於固體基板上之後容易地分解之方法。其亦旨在提供使用可容易地經改質且仍保持穩定之金屬前驅物以便使前驅物之特性適應特定需要的方法。
及將該通式(I)之化合物自該氣態或霧態沈積至固體基板上,其中R11、R12、R13、R14、R15、R16、R17、R18彼此獨立地為氫、烷基、芳基或三烷基矽烷基,R21、R22、R23、R24彼此獨立地為烷基、芳基或三烷基矽烷基,n為1或2,M為金屬或半金屬,X為與M配位之配位體,且m為0至3之整數。
本發明進一步關於通式(I)之化合物之用途,其中R11、R12、R13、R14、R15、R16、R17、R18彼此獨立地為氫、烷基、芳基或三烷基矽烷基,
R21、R22、R23、R24彼此獨立地為烷基、芳基或三烷基矽烷基,n為1或2,M為金屬或半金屬,X為與M配位之配位體,且m為0至3之整數,該化合物用於在固體基板上之膜形成方法。
圖1、圖4、圖7、圖9、圖12、圖13、圖15及圖17分別描繪化合物C-1、C-6、C-7、C-8、C-9、C-10、C-11及C-12之紅外線(IR)波譜。
圖2、圖5、圖8、圖10、圖14、圖16、圖18及圖19分別描繪化合物C-2、C-6、C-7、C-8、C-10、C-11、C-12及C-13之熱解重量分析(TGA)。
圖3描繪化合物C-2之差示掃描熱量測定分析(DSC)。
圖6及圖11分別描繪化合物C-6及C-8之晶體結構。
本發明之較佳具體實例可在實施方式及申請專利範圍中發現。不同具體實例之組合屬於本發明之範疇。
在根據本發明之方法中,使通式(I)之化合物變為氣態或霧態。配位體L通常經由磷原子及氮原子兩者鍵結至金屬M,因此配位體L通常佔據金屬M之三個配位位點,亦即配位體L通常為三牙配位體。氮原子可帶有氫原子或其可經去質子化。
R11、R12、R13、R14、R15、R16、R17、R18彼此獨立地為氫、烷基、芳基或三烷基矽烷基。R21、R22、R23、R24彼此獨立地為烷基、芳基或三烷基
矽烷基。
烷基可為直鏈或分支鏈的。直鏈烷基之實例為甲基、乙基、正丙基、正丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基。分支鏈烷基之實例為異丙基、異丁基、第二丁基、第三丁基、2-甲基-戊基、2-乙基-己基、環丙基、環己基、二氫茚基、降冰片基。較佳地,烷基為C1至C8烷基,更佳為C1至C6烷基,尤其為C1至C4烷基。烷基可例如經如氟、氯、溴、碘之鹵素取代;經如氰化物、氰酸酯、硫氰酸酯之假鹵素取代;經醇取代;經諸如甲氧基或乙氧基之烷氧基取代;或經諸如三甲基矽烷基或二甲基-第三丁基矽烷基之三烷基矽烷基取代。經三烷基矽烷基取代之烷基之較佳實例為三甲基矽烷基甲基。
芳基包括芳族烴,諸如苯基、萘基、蒽基、菲基,及雜芳族基團,諸如吡咯基、呋喃基、噻吩基、吡啶基、喹啉基、苯并呋喃基、苯并噻吩基、噻吩并噻吩基。若干此等基團或此等基團之組合亦可能如聯苯、噻吩并苯基或呋喃基噻吩基。芳基可例如經如氟、氯、溴、碘之鹵素取代;經如氰化物、氰酸酯、硫氰酸酯之假鹵素取代;經醇取代;經烷基鏈取代;經烷氧基鏈取代;或經三烷基矽烷基取代。芳族烴為較佳,苯基為更佳。
三烷基矽烷基可帶有相同或不同烷基。較佳地,三烷基矽烷基帶有C1至C6烷基,更佳C1至C4烷基。具有相同烷基之三烷基矽烷基之實例為三甲基矽烷基、三乙基矽烷基、三正丙基矽烷基、三異丙基矽烷基、三環己基矽烷基。具有不同烷基之三烷基矽烷基之實例為二甲基第三丁基矽烷基、二甲基環己基矽烷基、甲基-二異丙基矽烷基。
較佳地,R11、R12、R13、R14、R15、R16、R17、R18彼此獨立地為
氫或甲基。更佳地,R11、R12、R13、R14、R15、R16、R17、R18中之至少四者為氫,且其餘取代基為甲基,例如R11、R13、R16及R18為氫,且R12、R14、R15及R17為甲基或R14、R15及R17為甲基且其餘取代基為氫;甚至更佳R11、R12、R13、R14、R15、R16、R17、R18中之至少六者為氫,且其餘取代基為甲基,例如R14及R15為甲基且其餘取代基為氫,或R17及R15為甲基且其餘取代基為氫,或R17及R12為甲基且其餘取代基為氫,或R14為甲基且其餘取代基為氫,或R17為甲基且其餘取代基為氫。尤其較佳地,R11、R12、R13、R14、R15、R16、R17、R18為氫。
較佳地,R21、R22、R23、R24彼此獨立地為烷基。較佳地,R21、R22、R23、R24相同,更佳地,R21、R22、R23、R24為相同烷基。
所有R11、R12、R13、R14、R15、R16、R17、R18、R21、R22、R23、R24可為單獨的或可能其中兩者或兩者以上形成環。舉例而言,R21及R22可形成包括磷原子之環或R23及R24可形成包括磷原子之環。此外,R13及R15可形成包括氮原子之環。在此情況下,L較佳採用形式L'。
R31、R32及R33彼此獨立地為如上文對R11至R18所描述之氫、烷基、芳基或三烷基矽烷基。
此外,R11及R12可形成環及/或R17及R18可形成環,例如環丙基環、環丁基環、環戊基環或環己基環。另外可能的是,R11及R13形成環及/或R15及
R17形成環。
較佳地,通式(I)之化合物之分子量為至多1000g/mol,更佳至多800g/mol,尤其至多600g/mol。
根據本發明之通式(I)之化合物可含有1或2個配位體L,亦即n為1或2。較佳地,n為1。若n為2,則兩個配位體L可彼此相同或不同,較佳其相同。
根據本發明,通式(I)之化合物中之M可為任何金屬或半金屬。金屬包括鹼土金屬,諸如Be、Mg、Ca、Sr、Ba;主族金屬,諸如Al、Ga、In、Sn、Tl、Pb、Bi;過渡金屬,諸如Sc、Ti、V、Cr、Mn、Fe、Co、Ni、Cu、Zn、Y、Zr、Nb、Mo、Tc、Ru、Rh、Pd、Ag、Cd、Hf、Ta、W、Re、Os、Ir、Pt、Au、Hg、Tl、Pb或Bi;鑭系元素,諸如La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Lu。半金屬包括B、Si、Ge、As、Sb。較佳為過渡金屬,尤其為Ni或Co。
金屬或半金屬M可為任何氧化態。較佳地,M接近於經推測其於固體基板上之最終膜中所處之氧化態。舉例而言,若需要氧化態0之金屬或半金屬膜,則通式(I)之化合物中之金屬或半金屬M應較佳為氧化態0或-1或+1。另一實例為金屬應具有氧化態+4之金屬氧化物膜。在此情況下,在通式(I)之化合物中之M應較佳為氧化態+4或+3或+5。更佳地,通式(I)之化合物中之M與經推測其於固體基板上之最終膜中所處相同的氧化態。在此情況下,氧化或還原不為必要的。
根據本發明,通式(I)之化合物中之配位體X可為與M配位之任何配位體。若X帶有電荷,則通常選擇m使得通式(I)之化合物電
荷呈中性。若一個以上此類配位體存在於通式(I)之化合物中,亦即m>1,則其可彼此相同或不同。若m為3,則兩個配位體X可相同且其餘X與此等X不同。X可在金屬或半金屬M之任何配位體層(ligand sphere)中,例如在內部配位體層中、在外部配位體層中或僅鬆散地結合至M。另外可能的是,若一個以上配位體X存在於通式(I)之化合物,則配位體X在不同配位體層中。較佳地,X在M之內部配位體層中。
根據本發明之通式(I)之化合物中之配位體X包括鹵素(如氟、氯、溴或碘)及假鹵素(如氰化物、異氰化物、氰酸酯、異氰酸酯、硫氰酸酯、異硫氰酸酯或疊氮化物)之陰離子。此外,X可為任何胺配位體,其中配位氮原子為脂族的,如二烷基胺、哌啶、嗎啉、六甲基二矽氮烷;胺基醯亞胺中;或為芳族的,如吡咯、吲哚、吡啶或吡嗪中。胺配位體之氮原子通常在配位至M之前經去質子化。此外,X可為醯胺配位體,諸如甲醯胺或乙醯胺;脒基配位體,諸如乙脒;或胍基配位體,諸如胍。亦有可能X為氧原子配位至金屬或半金屬之配位體。實例為烷醇鹽、四氫呋喃、乙醯基丙酮酸鹽、乙醯丙酮或1,1,1,5,5,5-五氟乙醯丙酮。X之其他適合的實例包括均配位至M之氮原子與氧原子兩者,包括二甲胺基-異丙醇。亦適用於X之配位體為經由磷原子配位至M之配位體。此等包括三烷基膦,諸如三甲基膦、三-第三丁基膦、三環己基膦,或芳族膦,諸如三苯基膦或三甲苯基膦。
其他適合配位體X為烷基陰離子,如甲基、乙基或丁基陰離子。另一可能配位體X為氫化物。X亦可為以π鍵與M配位之不飽和烴。不飽和烴包括烯烴,如乙烯、丙烯、異丁烯、環己烯、環辛烯、環辛
二烯、苯乙烯;及炔烴,如乙炔、丙炔、2-丁炔。X亦可為不飽和陰離子烴,其可經由陰離子及不飽和鍵(諸如烯丙基或2-甲基-烯丙基)使兩者配位。環戊二烯陰離子及經取代之環戊二烯陰離子亦適用於X。X之另一適合實例為一氧化碳CO或氧化氮NO。尤佳的是一個X為NO且另一個X為CO。亦可使用含有多個配位至M之原子的分子。實例為聯吡啶、鄰三聯吡啶、乙二胺、伸乙基二(雙苯基膦)。
具有低汽化溫度之小配位體對於X較佳。尤佳配位體X為一氧化碳、氰化物、溴化物、甲基、乙烯、環辛烯或2-丁炔。在例如經表面結合質子質子化後可容易地轉化成揮發性中性化合物之小陰離子配位體對於X較佳。實例包括甲基、乙基、丙基、二甲醯胺、二乙醯胺、烯丙基、2-甲基-烯丙基。
用於根據本發明之方法之通式(I)之化合物在高純度下使用以達成最佳結果。高純度意謂所用物質含有至少90wt%通式(I)之化合物,較佳至少95wt%通式(I)之化合物,更佳至少98wt%通式(I)之化合物,特定言之至少99wt%通式(I)之化合物。純度可藉由根據DIN 51721(Prüfung fester Brennstoffe-Bestimmung des Gehaltes an Kohlenstoff und Wasserstoff-Verfahren nach Radmacher-Hoverath,2001年8月)之元素分析來測定。
在根據本發明之方法中,使通式(I)之化合物變為氣態或霧態。此可藉由將通式(I)之化合物加熱至高溫來達成。在任何情況下均必須選擇低於通式(I)之化合物之分解溫度的溫度。較佳地,加熱溫度在略高於室溫至300℃,更佳30℃至250℃,甚至更佳40℃至200℃,尤其50
℃至150℃範圍內。
使通式(I)之化合物變為氣態或霧態之另一方式為如例如在US 2009/0 226 612 A1中所述之直接液體注入(DLI)。在此方法中,通式(I)之化合物典型地溶解於溶劑中且在載氣或真空中噴灑。視通式(I)之化合物之蒸氣壓、溫度及壓力而定,通式(I)之化合物被變成氣態或變成霧態。可使用多種溶劑,其限制條件為通式(I)之化合物在彼溶劑中顯示足夠溶解度,諸如至少1g/l,較佳至少10g/l,更佳至少100g/l。此等溶劑之實例為配位溶劑,諸如四氫呋喃、二噁烷、二乙氧基乙烷、吡啶,或非配位溶劑,諸如己烷、庚烷、苯、甲苯或二甲苯。溶劑混合物亦為適合的。包含通式(I)之化合物之氣霧應含有極精細液滴或固體粒子。較佳地,液滴或固體粒子具有不超過500nm,更佳不超過100nm之重量平均直徑。液滴或固體粒子之重量平均直徑可藉由如ISO 22412:2008中所述之動態光散射來測定。亦有可能的是通式(I)之化合物之一部分呈氣態且剩餘部分呈霧態,其例如歸因於通式(I)之化合物之有限蒸氣壓,其導致呈霧態之通式(I)之化合物之部分蒸發。
較佳在減壓下使通式(I)之化合物變為氣態或霧態。以此方式,該方法通常可在較低加熱溫度下進行,使得通式(I)之化合物之分解減少。亦可使用加壓以將呈氣態或霧態之通式(I)之化合物推向固體基板。出於此目的,諸如氮氣或氬氣之惰性氣體常用作載氣。較佳地,壓力為10巴至10-7毫巴,更佳1巴至10-3毫巴,尤其1至0.01毫巴,諸如0.1毫巴。
在根據本發明之方法中,使通式(I)之化合物自氣態或霧
態沈積於固體基板上。固體基板可為任何固體材料。此等材料包括例如金屬、半金屬、氧化物、氮化物及聚合物。基板亦可為不同材料之混合物。金屬之實例為鋁、鋼、鋅及銅。半金屬之實例為矽、鍺及砷化鎵。氧化物之實例為二氧化矽、二氧化鈦及氧化鋅。氮化物之實例為氮化矽、氮化鋁、氮化鈦及氮化鎵。聚合物之實例為聚對苯二甲酸伸乙酯(PET)、聚乙烯萘-二甲酸(PEN)及聚醯胺。
固體基板可具有任何形狀。此等形狀包括薄片板、膜、纖維、多種尺寸之粒子及具有溝槽或其他壓痕之基板。固體基板可具有任何尺寸。若固體基板具有粒子形狀,則粒子之尺寸可在低於100nm至若干公分,較佳1μm至1mm範圍內。為避免粒子或纖維在通式(I)之化合物沈積至其上時彼此黏著,較佳使其保持運動。此可例如藉由攪拌、藉由旋轉鼓輪或藉由流體化床技術來達成。
若基板與通式(I)之化合物接觸,則沈積發生。一般而言,沈積製程可以兩種不同方式進行:將基板加熱至高於或低於通式(I)之化合物之分解溫度。若基板經加熱至高於通式(I)之化合物之分解溫度,則通式(I)之化合物在固體基板之表面上持續分解,只要更多呈氣態或霧態之通式(I)之化合物到達固體基板之表面即可。此方法通常稱為化學氣相沈積(CVD)。通常,隨著有機材料自金屬或半金屬M解吸附,在固體基板上形成均質組成物(例如金屬或半金屬氧化物或氮化物)之無機層。通常,將固體基板加熱至在300℃至1000℃範圍內,較佳350℃至600℃範圍內之溫度。
或者,基板低於通式(I)之化合物之分解溫度。典型地,
固體基板所處的溫度等於或低於使通式(I)之化合物變為氣態或霧態之位置處的溫度,其常在室溫下或僅略高於室溫。較佳地,基板之溫度比使通式(I)之化合物變為氣態或霧態之位置處的溫度低至少30℃。較佳地,基板之溫度為室溫至400℃,更佳為100℃至300℃,諸如150℃至220℃。
通式(I)之化合物至固體基板上之沈積為物理吸附或化學吸附過程。較佳地,通式(I)之化合物經化學吸附在固體基板上。可藉由使具有具所討論之基板表面之石英晶體的石英微量天平暴露於呈氣態或霧態之通式(I)之化合物來判定通式(I)之化合物是否化學吸附至固體基板。藉由石英晶體之本徵頻率來記錄質量增加。若已發生化學吸附,則在抽空置放石英晶體之腔室後,質量應不減少至初始質量,而是殘留約單層之殘餘通式(I)之化合物。在發生通式(I)之化合物至固體基板之化學吸附的大多數情況下,M之x射線光電子光譜(XPS)信號(ISO 13424 EN-Surface chemical analysis-X-ray photoelectron spectroscopy-Reporting of results of thin-film analysis;2013年10月)由於與基板之鍵形成而發生變化。
若在根據本發明之方法中之基板之溫度保持低於通式(I)之化合物之分解溫度,則典型地,單層沈積在固體基板上。一旦通式(I)之分子沈積在固體基板上,在其上進一步沈積通常變得較不可能。因此,通式(I)之化合物沈積於固體基板上較佳為自我限制性製程步驟。自我限制性沈積製程步驟之典型層厚度為0.01nm至1nm,較佳為0.02nm至0.5nm,更佳為0.03nm至0.4nm,特定言之為0.05nm至0.2nm。層厚度典型地藉由如PAS 1022 DE(Referenzverfahren zur Bestimmung von optischen und dielektrischen Materialeigenschaften sowie der Schichtdicke dunner Schichten
mittels Ellipsometrie;2004年2月)中所述之橢圓偏振法量測。
常需要堆積比剛剛描述之彼等層厚的層。為達成此目標,在根據本發明之方法中,較佳藉由移除所有L及X來分解所沈積之通式(I)之化合物。在此後,較佳進一步沈積通式(I)之化合物。此工序較佳進行至少兩次,更佳至少10次,尤其至少50次。在本發明之上下文中,移除所有L及X意謂移除所沈積之通式(I)之化合物中L及X總重量之至少95wt%,較佳至少98wt%,尤其至少99wt%。分解可以各種方式實現。固體基板之溫度可提高至高於分解溫度。
此外,可將沈積之通式(I)之化合物暴露於電漿,如氧電漿或氫電漿;暴露於氧化劑,如氧氣、氧自由基、臭氧、氧化亞氮(N2O)、一氧化氮(NO)、二氧化氮(NO2)或過氧化氫;暴露於還原劑,如氫、醇、肼或羥胺;或溶劑,如水。較佳使用氧化劑、電漿或水以獲得金屬氧化物或半金屬氧化物之層。暴露於水、氧電漿或臭氧較佳。暴露於水尤其較佳。若需要元素金屬或半金屬之層,則較佳使用還原劑。較佳實例為氫、氫自由基、氫電漿、氨、氨自由基、氨電漿、肼、N,N-二甲基肼、矽烷、二矽烷、三矽烷、環五矽烷、環六矽烷、二甲基矽烷、二乙基矽烷或三矽烷胺;更佳為氫、氫自由基、氫電漿、氨、氨自由基、氨電漿、肼、N,N-二甲基肼、矽烷;尤其氫。還原劑可直接引起沈積之通式(I)之化合物分解或其可在沈積之通式(I)之化合物經不同試劑(例如水)分解後施加。暴露於還原劑較佳。金屬氮化物之層較佳使用氨或肼。咸信小分子容易接近金屬或半金屬M,係因為兩個亞胺基甲基與配位體L中之吡咯單元之共軛使得配位體L之芳族部分平坦。典型地,觀測到所生成膜之短分解時間及高純
度。
包含自我限制性製程步驟及後續自我限制性反應之沈積方法通常稱為原子層沈積(ALD)。等效表述為分子層沈積(MLD)或原子層磊晶法(ALE)。因此,根據本發明之方法較佳為ALD方法。ALD方法由George(Chemical Reviews 110(2010),111-131)詳細描述。
根據本發明之方法之一特別優點為通式(I)之化合物極其通用,因此方法參數可在廣泛範圍中變化。因此,根據本發明之方法包括CVD方法以及ALD方法兩者。
視如ALD方法進行之根據本發明之方法之工序數而定,生成多種厚度之膜。較佳地,使通式(I)之化合物沈積至固體基板上及分解沈積之通式(I)之化合物之工序進行至少兩次。此工序可重複多次,例如10次至500次,諸如50次或100次。通常,此工序重複不超過1000次。理想地,膜之厚度與所進行之工序數成比例。然而,實務上,對於前30至50個工序觀測到一定程度的比例偏差。假定固體基板之表面結構之不規則性導致此非比例性。
根據本發明之方法之一個工序可耗費數毫秒至若干分鐘,較佳0.1秒至1分鐘,尤其1秒至10秒。在低於通式(I)之化合物之分解溫度的溫度下之固體基板暴露於通式(I)之化合物的時間愈長,形成具有愈少缺陷之愈規則膜。
根據本發明之方法產生膜。膜可為沈積之式(I)化合物之僅一個單層、通式(I)之化合物的若干連續沈積及分解之層或若干不同層,其中膜中之至少一個層藉由使用通式(I)之化合物生成。膜可含有缺陷,如
孔洞。然而,此等缺陷通常構成低於一半之由膜覆蓋之表面積。膜較佳為無機膜。為生成無機膜,所有有機配位體L及配位體X必須自膜移除,如上文所描述。更佳地,膜為元素金屬膜。視如上所述之膜形成方法而定,膜可具有0.1nm至1μm或更高之厚度。較佳地,膜具有0.5nm至50nm之厚度。膜較佳具有極均一膜厚度,其意謂基板上不同位置之膜厚度變化極小,通常小於10%,較佳小於5%。此外,膜較佳為基板表面上之保形膜。測定膜厚度及均一性之適合的方法為XPS或橢圓偏振法。
膜可用於電子元件。電子元件可具有多種尺寸之結構特徵,例如100nm至100μm。形成用於電子元件之膜的方法尤其較適用於極精細結構。因此,尺寸小於1μm之電子元件較佳。電子元件之實例為場效電晶體(FET)、太陽能電池、發光二極體、感測器或電容器。在諸如發光二極體或光感測器之光學器件中,根據本發明之膜用以提高反射光之層的反射指數。感測器之實例為氧感測器,其中例如若製備金屬氧化物膜,則根據本發明之膜可充當氧導體。在金屬氧化物半導體場效電晶體(MOS-FET)中,膜可充當介電層或充當擴散障壁。亦可由元素鎳-矽沈積於固體基板上之膜製造半導體層。
較佳電子元件為電晶體。膜可充當介電質、精細結構之分隔器或充當電晶體中之電接觸,較佳充當電接觸。若電晶體由矽製成,則有可能在沈積鎳或鈷及加熱之後,一些矽擴散至鎳中以形成例如NiSi或CoSi2。
實施例
通用程序
用約20mg樣品進行熱解重量分析。其在氬氣流中以5℃/min
之速率加熱。
對於差示掃描熱量測定(DSC)量測,將20mg樣品置放於具有進氣口之坩堝中且使用Mettler TA 8000量測。以2.5K/min之速率將溫度自30℃提高至500℃。
所有實驗及操作在氬氣氛圍下使用標準舒倫克(Schlenk)技術進行。在使用之前將所有設備抽空且用氬氣淨化3次。在氮淨化手套工作箱中完成所有起始材料之稱重。僅使用無空氣及無水溶劑。
核磁共振(NMR)波譜中之縮寫具有習知含義:s為單峰,d為二重峰,t為三重峰,q為四重峰,ddd為二重峰之二重峰之二重峰,m為多重峰,br為寬峰。
實施例1
將3.3g(10.372mmol)NiBr2.DME(97%純度)裝入燒瓶中且懸浮於50ml THF中。懸浮液之顏色自紫色經由藍色變化至灰藍色。在8分鐘內在24-28℃下將30.9g(10.117mmol)之雙(二異丙基膦基乙基)胺於THF中之10%溶液轉移至加料漏斗中且添加至NiBr2.DME懸浮液(稍微放熱反應)。添加後,反應混合物之顏色自綠色變化至橙紅色。在室溫下攪拌混合物65小時。將所得橙色懸浮液蒸發至乾燥,殘餘物溶解於60mL二氯甲烷中且在矽藻土上過濾。用5ml二氯甲烷將矽藻土墊洗滌3次,且用10mL二氯甲烷洗滌一次。將200ml乙醚添加至因此獲得之澄清橙色濾液中,此
時結晶出橙色固體。藉由過濾來收集固體,用5ml乙醚洗滌四次且乾燥。獲得4.78g(90.3%)C-1。
1H-NMR(CD2Cl2,500MHz,RT)δ(ppm):7.1(s(br),1 H,NH),3.1(br,2 H,NCH2),2.4(m,2 H,PCH(CH3)2),2.2(m,6 H,PCH2(2),NCH2(2),PCH(CH3)2(2)),1.7(m,2 H,PCH2),1.6、1.5,1.4及1.3(td,24 H,PCH(CH3)2)。
13C-NMR(CD2Cl2,125MHz,RT)δ(ppm):53.61(t,NCH2),24.06(t,PCH(CH3)2),23.29(t,PCH(CH3)2),20.4(t,PCH2),18.51,18,26,17,24及16.89(s,PCH(CH3)2)。
31P-NMR(CD2Cl2,202MHz,RT)δ(ppm):56.89(s)。
LIFDI-MS(CD2Cl2溶液):m/z=521,計算值M=[C16H37Br2NNiP2]:521.012146,m/z=442,計算值M+=[C16H37BrNNiP2]+:442.093260。
C-1之IR波譜在圖1中描繪。
實施例2
在反應前將設備抽空且用氬氣淨化3次。在氬氣氛圍下進行反應,使用無空氣及無水溶劑。
用各9.9mmol之NiBr2-DME及雙(二異丙基膦基乙基)胺進行實施例1中所述之反應。藉由將所收集之產物C-1溶解於40ml甲醇中來將其轉移至燒瓶中。藉由蒸發來移除甲醇。將固體殘餘物懸浮於150ml THF中,冷卻至0℃,且經10分鐘之過程緩慢添加50ml THF及15.5ml甲基鋰
(1.6M於乙醚中;24.8mmol)之混合物。添加後,觀測到氣體逸出以及反應混合物染成深色。獲得澄清深紅色溶液。攪拌溶液19小時。接著,藉由蒸發移除溶劑且將殘餘物懸浮於500ml戊烷中。藉由過濾移除不溶的部分。在使溶液靜置片刻後,形成大量白色沈澱,其藉由過濾移除。濾液在室溫下保持18小時,其後藉由過濾移除新形成之沈澱。將濾液蒸發至乾燥,此時形成橙色固體。
1H-NMR(C6D6,360MHz,RT)δ(ppm):3.09(4 H),1.90(4 H),1.70(4 H),1.20(12 H),1.09(12 H),-0.73(3 H)。
13C-NMR(C6D6,90MHz,RT)δ(ppm):58.89,25.25,23.67,19.20,17.82,-26.52。
31P-NMR(C6D6,146MHz,RT)δ(ppm):67.62。
C-2之熱解重量分析在圖2中描繪。由熱解重量分析得出,樣品在550℃下損失其85.68%之質量。
C-2之差示掃描熱量測定(DSC)在圖3中描繪且展示在140℃及365℃處之兩個放熱峰。
實施例3
將1.31g(4.117mmol)NiBr2.DME(97%純度)懸浮於25ml THF中。懸浮液之顏色自紫色經藍色變化至灰藍色至紫色。在室溫下將1.98g(4.124mmol)雙(二環己基膦基乙基)胺(97%純度)於40ml THF中之溶
液逐滴添加至NiBr2.DME懸浮液。懸浮液之顏色經藍色變化至橙紅色。在室溫下攪拌混合物66小時。所得橙色懸浮液蒸發至乾燥,殘餘物溶解於80ml二氯甲烷中且在矽藻土上過濾。用10ml二氯甲烷洗滌矽藻土墊四次。將250ml乙醚添加至因此獲得之澄清橙色濾液,此時結晶出橙色固體。藉由過濾來收集固體,用10mL乙醚洗滌兩次且乾燥。獲得1.78g(63.2%)C-3。
1H-NMR(CD2Cl2,500MHz,RT)δ(ppm):6.77(s),3.35(q),3.25(s),2.35(m),2.30(m),2.15(m),1.95(m),1.80(m),1.65(m),1.28(m),1.05(t)。
13C{1H}-NMR(CD2Cl2,125MHz,RT)δ(ppm):53.55(t),33.40(t),32.62(t),28.65(s),28.53(s),28.26(s),27.57(s),26.42(t),26.30(t),26.13(t),25.94(t),25.32(s),25.25(s)21.24(t)。
31P{1H}-NMR(CD2Cl2,202MHz,RT)δ(ppm):48.23(s)。
LIFDI-MS(CD2Cl2溶液):m/z=602,計算值M+=[C28H53BrNNiP2]+:602.2185;m/z=681,計算值M=[C28H53Br2NNiP2]:681.1373。
實施例4
將1.07g(1.564mmol)產物C-3及169mg(3.128mmol)甲醇鈉轉移至燒瓶中且懸浮於50ml THF中。在室溫下攪拌反應混合物15分鐘,之後將其加熱至50℃,維持10分鐘。在加熱後,觀測到顏色自橙色變化至綠色。使反應混合物緩慢冷卻至室溫且再攪拌16小時。將所得綠色懸浮液蒸發至乾燥,且將殘餘物懸浮於25ml正戊烷中。藉由過濾分離固體,
且用5ml正戊烷洗滌3次。將綠色濾液蒸發至乾燥得到呈綠色固體狀之C-4。
1H-NMR(C6D6,500MHz,RT)δ(ppm):2.65(t),2.1(s),1.9-1.5(m),1.3-1.0(m)。
13C{1H}-NMR(C6D6,125MHz,RT)δ(ppm):61.6(t),34.0(t),29,6(s),28.8(s),27.8(t),27.6(t),27.0(s),23.7(s)。
31P{1H}-NMR(C6D6,202MHz,RT)δ(ppm):58.24(s)
LIFDI-MS(C6D6溶液):m/z=601,計算值M=[C28H52BrNNiP2]:601.211184。
實施例5
在室溫下將0.37ml甲基鋰(1.6M於乙醚中;0.592mmol)緩慢添加至326.7mg(0.5415mmol)產物C-4溶解於40ml THF中之溶液中。攪拌反應混合物90小時,之後將其回流24小時。在添加另一0.74ml甲基鋰(1.6M於乙醚中;1.184mmol)後,在室溫下攪拌反應混合物4小時且觀測到顏色變化至橙棕色。將反應混合物蒸發至乾燥以得到呈橙色、固體殘餘物之C-5。
31P-NMR(THF,202MHz,RT)δ(ppm):60.15(s)。
實施例6
在0-5℃下將1.975g(5.198mmol)Co2(CO)8(90%純度)溶解於50ml THF中。在-25℃下經15分鐘之過程緩慢添加溶解於50ml THF中之3.72g(11.55mmol)雙(二異丙基膦基乙基)胺(94.9%純度)溶液。使反應混合物升溫至室溫且攪拌18小時。將所得橙色溶液蒸發至乾燥且將紅色殘餘物溶解於15ml甲醇中。緩慢添加60ml正戊烷後形成橙色懸浮液。藉由過濾分離固體,用15ml正戊烷洗滌兩次且乾燥以得到2.32g(67.9%)呈橙色固體狀之C-6。
1H-NMR(C6D6,500MHz,RT)δ(ppm):3.65(s(br),1H),3.2(m(br),2H),1.8(m(br),2H),1.55(m(br),4H),1.45(m,4H),0,85(m,6H),0.6(m,12H),0.5(m,6H)。
13C{1H}-NMR(C6D6,125MHz,RT)δ(ppm):199.66,196.53,53.28,25.63,24.91,23.87,16.83,15.97。
31P{1H}-NMR(C6D6,202MHz,RT)δ(ppm):95.35(s)。
LIFDI-MS(C6D6溶液):m/z=420,計算值M+=[C18H37CoNO2P2]+:420.1626。
ESI-(乙腈溶液):m/z=171,計算值M-=[C4O4Co]-:170.97。
C-6之IR波譜在圖4中描繪。
C-6之熱解重量分析在圖5中描繪。自熱解重量分析得出,樣品在500℃下損失其76.52%之質量。
適合於X射線繞射之晶體藉由在0.4℃下儲存濾液獲得。晶體結構藉由標準技術量測且在圖6中展示。
實施例7
1.99g(3.37mmol)產物C-6在60-100℃及1.1.10-2毫巴下熱裂解產生0.63g(1.5mmol)呈橙色固體狀之中性化合物C-7(44.5%)。C-7可藉由在2.7.10-2毫巴及90℃下昇華而得到進一步純化。
1H-NMR(C6D6,500MHz,RT)δ(ppm):2.95(m,2H),1.8(m,2H),1.5(m,2H),105(q,6H),0.75(q,6H)。
13C{1H}-NMR(C6D6,125MHz,RT)δ(ppm):206.55,59.43,24.32,23.28,17.97,16.62。
31P{1H}-NMR(C6D6,202MHz,RT)δ(ppm):102.22(s(br))。
C-7之IR波譜在圖7中描繪。
C-7之熱解重量分析在圖8中描繪。自熱解重量分析得出,樣品在500℃下損失其93.98%之質量。
實施例8
在室溫下經5分鐘之過程將1.993g(4.152mmol)雙(二環己基膦基乙基)胺(97%純度)溶解於25ml THF中之溶液逐滴添加至0.79g(2.076mmol)Co2(CO)8(90%純度)溶解於25ml THF中之溶液中。藉由進一步添加20ml THF來稀釋反應混合物,且在室溫下攪拌16小時。將所得橙色溶液蒸發至乾燥,且將橙色殘餘物溶解於50ml甲醇中以獲得橙色懸浮液。藉由過濾分離固體,用10ml正戊烷洗滌兩次且乾燥以得到呈橙色固體狀之C-8。
1H-NMR(CD2Cl2,500MHz,RT)δ(ppm):3.75(s(br),1H),3.40(s(br),2H),2.1(m(br)),1.84(m(br)),1.70(m(br)),1.28(s(br))。
13C{1H}-NMR(CD2Cl2,125MHz,RT)δ(ppm):55.07,37.41,36.86,29.16,28.41,28.26,27.37,27.21,26.40,26.36,25.29。
31P{1H}-NMR(CD2Cl2,202MHz,RT)δ(ppm):85.62(s)。
LIFDI-MS(THF溶液):m/z=580,計算值M+=[C30H53CoNO2P2]+:580.288353。
C-8之IR波譜在圖9中描繪。
C-8之熱解重量分析在圖10中描繪。自熱解重量分析得出,樣品在500℃下損失其78.04%之質量。
適合於X射線繞射之晶體藉由在0.4℃下儲存濾液獲得。晶體結構藉由標準技術量測且在圖11中展示。
實施例9
在室溫下經5分鐘之過程將0.99g(2.05mmol)雙(二環己基膦基乙基)胺(97%純度)溶解於20ml THF中之溶液逐滴添加至355mg(2.05mmol)Co(CO)3(NO)溶解於15ml THF中之溶液中。在室溫下攪拌反應混合物18小時,之後將所得橙色溶液蒸發至乾燥。將橙色殘餘物懸浮於24ml甲醇中。藉由過濾分離固體且乾燥從而得到呈米色固體狀之C-9。
1H-NMR(C6D6,500MHz,RT)δ(ppm):3.28(t),2.24(m(br)),2.05(m(br)),1.88(d(br)),1.68(d(br)),1.6-1.05(m(br)),1.05-0.85(m(br))。
13C{1H}-NMR(C6D6,125MHz,RT)δ(ppm):41.92,36.92,28.30,27.89,27.08,26.99,26.69,26.66,26.61,26.59,26.40,26.31,25.38,20.79。
31P{1H}-NMR(C6D6,202MHz,RT)δ(ppm):49.56(s)。
C-9之IR波譜在圖12中描繪。
實施例10
在-30℃下經5分鐘之過程將2.22g(5.56mmol)2,6-雙(二第三丁基膦基甲基)吡啶(99%純度)溶解於25mL THF中之溶液逐滴添加至1.06g(2.78mmol)Co2(CO)8(90%純度)溶解於25ml THF中之溶液中。將
反應混合物升溫至室溫,且攪拌22小時。將反應混合物蒸發至乾燥得到暗紅色殘餘物,將其懸浮於50ml甲醇中。藉由過濾分離固體且乾燥以得到呈暗紅色固體狀之C-10。
1H-NMR(CD2Cl2,500MHz,RT)δ(ppm):7.8(s,1H,CH),7.45(s,2H,CH),3.65(s,4H,PCH2),1.35(8,36H,C(CH3)3)。
13C{1H}-NMR(CD2Cl2,125MHz,RT)δ(ppm):164.65,140.57,121.06,35.3,33.99,28.38。
31P{1H}-NMR(CD2Cl2,202MHz,RT)δ(ppm):85.57(s)。
C-10之IR波譜在圖13中描繪。
C-10之熱解重量分析在圖14中描繪。自熱解重量分析得出,樣品在500℃下損失其76.15%之質量。
實施例11
在0℃將0.28g(1.64mmol)Ni(CO)4裝入燒瓶中。在0℃下添加10mL甲苯作為溶劑,之後將0.5g(1.64mmol)雙(二異丙基膦基乙基)胺(94.9%純度)緩慢添加至反應混合物中。在0℃下攪拌反應混合物1小時且緩慢升溫至室溫。在室溫下攪拌18小時後,無色反應混合物變為綠色。將反應混合物蒸發至乾燥後,獲得綠色固體,將其再溶解於10ml戊烷中,且蒸發至乾燥3次。獲得0.47g(72.7%)呈綠色固體狀之C-11。
1H-NMR(C6D6,500MHz,RT)δ(ppm):2.95(s(br),1H,NH),
2.54(m,2H,NCH2),1.74(m,2H,PCH2),1.32(q,2H,PCH),1.08(ddd,12H,PCH(CH3)2)。
13C{1H}-NMR(C6D6,125MHz,RT)δ(ppm):202.41(s,CO),43.13(s,NCH2),25.91(m,PCH),22.86(m,PCH2),15.58(t,PCH(CH)3),18.11(t,PCH(CH)3)。
31P{1H}-NMR(C6D6,202MHz,RT)δ(ppm):34.81(s)。
LIFDI-MS(C6D6溶液):m/z=391,計算值M+=[C17H37NNiOP2]+:391.17038。
C-11之IR波譜在圖15中描繪。
C-11之熱解重量分析在圖16中描繪。自熱解重量分析得出,樣品在500℃下損失其84.3%之質量。
實施例12
在室溫下經5分鐘之過程將0.91g(4.49mmol)雙(二甲基膦基乙基)胺(95%純度)溶解於20ml THF中之溶液緩慢添加至1.7g(4.47mmol)Co2(CO)8(90%純度)溶解於50ml THF中之溶液中。在室溫下攪拌反應混合物18小時,之後將其加熱至回流,維持5天。將所得橙色溶液蒸發至乾燥以獲得呈暗綠色固體狀之C-12。
1H-NMR(CD2Cl2,500MHz,RT)δ(ppm):3.5,3.0,2.4,1.9,1.5(所有峰均極寬)。
13C{1H}-NMR(CD2Cl2,125MHz,RT)δ(ppm):74.92,70.53,35.20,25.20,17.75。
31P{1H}-NMR(CD2Cl2,202MHz,RT)δ(ppm):48,75(s)。
C-12之IR波譜在圖17中描繪。
C-12之熱解重量分析在圖18中描繪。自熱解重量分析得出,樣品在500℃下損失其58.85%之質量。
實施例13
C-13購自Sigma Aldrich。
31P{1H}-NMR(THF-d8,202MHz,RT)δ(ppm):52.92(d)。
C-13之熱解重量分析在圖19中描繪。自熱解重量分析得出,樣品在500℃下損失其43.76%之質量。
Claims (13)
- 如申請專利範圍第1項之方法,其中該通式(I)之化合物經化學吸附在該固體基板之表面上。
- 如申請專利範圍第1項或第2項之方法,其中藉由移除所有配位體L及X分解該沈積之通式(I)之化合物。
- 如申請專利範圍第3項之方法,其中將該沈積之通式(I)之化合物暴露於還原劑。
- 如申請專利範圍第3項之方法,其中將該通式(I)之化合物沈積至固 體基板上及分解該沈積之通式(I)之化合物之工序進行至少兩次。
- 如申請專利範圍第5項之方法,其中該方法之一個工序耗費0.1秒至1分鐘。
- 如申請專利範圍第1項或第2項之方法,其中該固體基板之溫度為100至300℃。
- 如申請專利範圍第1項或第2項之方法,其中將該通式(I)之化合物與惰性氣體混合,之後沈積到該固體基板上。
- 如申請專利範圍第1項或第2項之方法,其中在沈積時之壓力為1至0.01毫巴。
- 如申請專利範圍第1項或第2項之方法,其中M為Ni或Co。
- 如申請專利範圍第1項或第2項之方法,其中R11、R12、R13、R14、R15、R16、R17及R18為氫。
- 如申請專利範圍第1項或第2項之方法,其中R21、R22、R23及R24彼此獨立地為烷基。
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| US10647651B2 (en) | 2015-10-12 | 2020-05-12 | Basf Se | Hydroformylation process for producing 1,6-disubstituted hexane derivatives |
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| CN111727272B (zh) * | 2017-12-20 | 2023-04-28 | 巴斯夫欧洲公司 | 产生含金属膜的方法 |
| US11377454B2 (en) * | 2018-04-17 | 2022-07-05 | Basf Se | Aluminum precursor and process for the generation of metal-containing films |
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