TWI680931B - A stacking method for a thin plate - Google Patents
A stacking method for a thin plate Download PDFInfo
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- TWI680931B TWI680931B TW108105035A TW108105035A TWI680931B TW I680931 B TWI680931 B TW I680931B TW 108105035 A TW108105035 A TW 108105035A TW 108105035 A TW108105035 A TW 108105035A TW I680931 B TWI680931 B TW I680931B
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- 238000000034 method Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims description 59
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 239000010408 film Substances 0.000 description 46
- 239000010409 thin film Substances 0.000 description 9
- 238000002955 isolation Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Abstract
Description
本發明係有關一種薄板堆疊方法,尤指一種可以有效提高基板與薄膜堆疊成薄板之效率,並可以讓複數個層疊之薄板相互交叉以方便作業人員快速的分離者。 The invention relates to a method for stacking thin plates, in particular to a method which can effectively improve the efficiency of stacking a substrate and a thin film into a thin plate, and can allow a plurality of stacked thin plates to cross each other to facilitate quick separation of operators.
在印刷電路板的製造過程中,基板在曝光之前,皆會在基板之上、下表面分別形成光阻層及黏附於光阻層表面之薄膜,在曝光之後,再將薄膜剝離以使光阻層外露,以進行後續之顯影及蝕刻程序。而在上述具有光阻層的基板與薄膜成型為一薄板之前,目前主要是以人工之方式進行堆疊,將基板與各薄膜依次上下層疊之後,再分別將薄膜黏附在基板之上、下表面上。 In the manufacturing process of printed circuit boards, before the substrate is exposed, a photoresist layer and a film adhered to the surface of the photoresist layer are formed on the top and bottom surfaces of the substrate, respectively, and after the exposure, the film is peeled off to make the photoresist The layer is exposed for subsequent development and etching procedures. Before the above-mentioned substrate with a photoresist layer and the thin film are formed into a thin plate, at present, it is mainly stacked manually. After the substrate and the thin films are sequentially stacked up and down, the thin film is adhered to the upper and lower surfaces of the substrate respectively .
惟,上述以人工堆疊之方式不但速度慢、精準度不高,且在堆疊之後不易將各組尚未黏附之薄板分開以進行下一步之作業,有鑑於此,為了提供一種有別於習用技術之結構,並改善上述之缺點,發明人積多年的經驗及不斷的研發改進,遂有本發明之產生。 However, the above manual stacking method is not only slow and not accurate, but it is not easy to separate each group of unadhered sheets after the stacking for the next step. In view of this, in order to provide a technology that is different from conventional technology Structure, and to improve the above-mentioned shortcomings, the inventor accumulated many years of experience and continuous research and development and improvement, then the invention came into being.
本發明之一目的在提供一種薄板堆疊方法,俾能解決習用基板與各薄膜係以人工方式進行堆疊之問題,而能經由數個機器手臂之搬移及數個偵測器之偵測以控制基板、薄膜與薄板皆能維持在固定之一高度 上,藉以快速進行堆疊作業、增加堆疊精準度、方便作業人員操作,以提高整體作業之效率。 An object of the present invention is to provide a method for stacking thin plates, which can solve the problem of stacking conventional substrates and thin films manually, and can control the substrates by the movement of several robot arms and the detection of several detectors , Film and sheet can be maintained at a fixed height In order to quickly perform stacking operations, increase the accuracy of stacking, and facilitate the operation of operators, to improve the efficiency of the overall operation.
為達上述之目的,本發明所設之薄板堆疊方法,係包括下列步驟:a.將層疊之基板及層疊之薄膜分別放置定位在一第一支撐座與一第三支撐座之頂面上,第一支撐座、第二支撐座及第三支撐座依序相鄰併列;b.以一第二機具之一第二吸附件吸附一薄膜之後,將薄膜水平轉動一角度,再橫向搬移並放置在第二支撐座之頂面上;c.以一第一機具之一第一吸附件吸附一基板之後,將基板水平轉動一角度,再橫向搬移並放置在第二支撐座頂面之薄膜上方,讓基板與薄膜完全重疊;d.再以第二吸附件吸附另一薄膜之後,將另一薄膜橫向搬移並放置在第二支撐座頂面之基板上方,讓基板與二個薄膜完全重疊以組成尚未黏附之一薄板;以及e.重覆步驟b至步驟d,而基板與二個薄膜水平轉動另一角度,藉以讓複數個薄板以相互交叉之方式層疊於第二支撐座之頂面上。 To achieve the above purpose, the thin plate stacking method provided by the present invention includes the following steps: a. Place the stacked substrate and the stacked film on top surfaces of a first support base and a third support base, respectively; The first support base, the second support base and the third support base are juxtaposed next to each other in sequence; b. After adsorbing a film with a second suction member of a second machine, the film is horizontally rotated by an angle, and then laterally moved and placed On the top surface of the second support base; c. After adsorbing a substrate with a first suction member of a first machine, the substrate is rotated horizontally at an angle, and then laterally moved and placed above the film on the top surface of the second support base To allow the substrate and the film to completely overlap; d. After absorbing another film with the second adsorbent, move the other film laterally and place it on the top surface of the second support base, so that the substrate and the two films completely overlap. Consisting of a thin plate that has not been adhered; and e. repeating steps b to d, and the substrate and the two films are horizontally rotated by another angle, so that a plurality of thin plates are stacked on the top surface of the second support base in a manner of crossing each other .
實施時,第一支撐座、第二支撐座及第三支撐座依序相鄰併列於一框架上。 During implementation, the first support base, the second support base, and the third support base are sequentially adjacent to each other on a frame.
實施時,框架上設有一第三偵測器,在步驟b中,當第三偵測器偵測到薄膜之頂端位置下降時,係以一第三升降機構帶動第三支撐座上升,使薄膜之頂端維持在固定之一高度上。 During the implementation, a third detector is provided on the frame. In step b, when the third detector detects that the top position of the film is lowered, a third lifting mechanism is used to drive the third support base up to make the film The top is maintained at a fixed height.
實施時,框架上設有一第一偵測器,在步驟c中,當第一偵測器偵測到基板之頂端位置下降時,係以一第一升降機構帶動第一支撐座上升,使基板之頂端維持在固定之一高度上。 During implementation, a first detector is provided on the frame. In step c, when the first detector detects that the top position of the substrate is lowered, a first lifting mechanism is used to drive the first support base to rise to make the substrate The top is maintained at a fixed height.
實施時,框架上設有一第二偵測器,在步驟d中,當第二偵 測器偵測到薄板之頂端位置上升時,係以一第二升降機構帶動第二支撐座下降,使薄板之頂端維持在固定之一高度上。 During implementation, there is a second detector on the frame. In step d, when the second detector When the detector detects that the top position of the thin plate rises, it uses a second lifting mechanism to drive the second support base down, so that the top of the thin plate is maintained at a fixed height.
實施時,基板之頂端、薄膜之頂端與薄板之頂端係維持在同一水平之一高度上。 During implementation, the top of the substrate, the top of the film and the top of the thin plate are maintained at the same level.
為進一步了解本發明,以下舉較佳之實施例,配合圖式、圖號,將本發明之具體構成內容及其所達成的功效詳細說明如下。 In order to further understand the present invention, the following provides preferred embodiments, in conjunction with the drawings and drawing numbers, and describes in detail the specific components of the present invention and the achieved effects as follows.
1‧‧‧薄板堆疊系統 1‧‧‧Thin plate stacking system
11,11’‧‧‧薄板 11,11’‧‧‧ Thin sheet
12‧‧‧基板 12‧‧‧ substrate
13,14‧‧‧薄膜 13,14‧‧‧film
2‧‧‧第一機具 2‧‧‧The first machine
21‧‧‧第一支柱 21‧‧‧First Pillar
22‧‧‧第一機器手臂 22‧‧‧The first robot arm
23‧‧‧第一吸附件 23‧‧‧The first adsorption piece
231‧‧‧第一板架 231‧‧‧The first plate rack
232‧‧‧第一吸盤 232‧‧‧First sucker
3‧‧‧第二機具 3‧‧‧Second machine
31‧‧‧第二支柱 31‧‧‧Second Pillar
32‧‧‧第二機器手臂 32‧‧‧Second robot arm
33‧‧‧第二吸附件 33‧‧‧Second adsorption piece
331‧‧‧第二板架 331‧‧‧Second plate rack
332‧‧‧第二吸盤 332‧‧‧Second sucker
4‧‧‧框架 4‧‧‧Frame
41‧‧‧置物架 41‧‧‧Rack
42‧‧‧第一支撐座 42‧‧‧First support
421‧‧‧第一升降機構 421‧‧‧First lifting mechanism
422‧‧‧第一偵測器 422‧‧‧ First detector
43‧‧‧第二支撐座 43‧‧‧Second support
431‧‧‧第二升降機構 431‧‧‧Second lifting mechanism
432‧‧‧第二偵測器 432‧‧‧Second detector
44‧‧‧第三支撐座 44‧‧‧The third support
441‧‧‧第三升降機構 441‧‧‧The third lifting mechanism
442‧‧‧第三偵測器 442‧‧‧The third detector
第1圖係為薄板之元件分解圖。 Figure 1 is an exploded view of the components of the thin plate.
第2圖係為薄板堆疊系統之立體外觀圖。 Figure 2 is a perspective external view of a thin plate stacking system.
第3圖係為薄板堆疊系統之正視圖。 Figure 3 is a front view of the thin plate stacking system.
第4圖係為本創作之較佳實施例之使用狀態圖。 Figure 4 is a usage state diagram of the preferred embodiment of this creation.
第5圖係為本創作之較佳實施例在放置基板時之使用狀態圖。 Figure 5 is a state diagram of the preferred embodiment of the creation when the substrate is placed.
第6圖係為本創作之較佳實施例在順時針方向放置薄膜及基板時之使用狀態示意圖。 FIG. 6 is a schematic view of the use state of the preferred embodiment of the creation when the film and the substrate are placed clockwise.
第7圖係為本創作之較佳實施例在逆時針方向放置薄膜及基板時之使用狀態示意圖。 FIG. 7 is a schematic view of the use state of the preferred embodiment of the creation when the film and the substrate are placed counterclockwise.
請參閱第1~3圖所示,其為一薄板堆疊系統1,供堆疊尚未黏附之複數個薄板11。其中,薄板11係為印刷電路板之類的平板,包括一基板12,基板12之上表面及下表面分別具有一薄膜(13,14),實施時,薄膜(13,14)之數量亦可分別為一層以上。而薄板堆疊系統1係包括一第一機具2、一第
二機具3、一框架4、一置物架41、一第一支撐座42、一第二支撐座43以及一第三支撐座44。
Please refer to Figures 1 to 3, which is a thin plate stacking system 1 for stacking a plurality of
第一機具2具有一第一支柱21,第一支柱21之底端安裝在地面上,第一支柱21之頂端具有一第一機器手臂22,第一機器手臂22之一端連結一第一吸附件23,第一吸附件23包括一第一板架231及複數個分佈結合在第一板架231上之第一吸盤232,複數個第一吸盤232之底端吸嘴朝下,複數個第一吸盤232之頂端分別連接一空壓機,藉以產生向上吸附之力量以吸取基板12,或停止吸附之力量而讓基板12與複數個第一吸盤232分離並落下。
The
第二機具3具有一第二支柱31,第二支柱31之底端安裝在地面上,第二支柱31之頂端具有一第二機器手臂32,第二機器手臂32之一端連結一第二吸附件33,第二吸附件33包括一第二板架331及複數個分佈結合在第二板架331上之第二吸盤332,複數個第二吸盤332之底端吸嘴朝下,複數個第二吸盤332之頂端分別連接一空壓機,藉以產生向上吸附之力量以吸取薄膜(13,14),或停止吸附之力量而讓薄膜(13,14)與複數個第二吸盤332分離並落下。
The
框架4上具有依序相鄰併列之第一支撐座42、第二支撐座43及第三支撐座44。置物架41相鄰併列在第一支撐座42之一側;第一支撐座42係為一推車,第一支撐座42以可分離之方式連接定位於框架4上,並使第一支撐座42位於第一機具21之第一吸附件23之下方,供承載複數個層疊之基板12;第一支撐座42之底部連接一第一升降機構421,第一升降機構421係為伺服馬達、連桿組及螺桿組之組合,藉以驅動第一支撐座42上升或下降。第一支撐座42頂端之框架4上設有一第一偵測器422,供偵測複數個層疊基板12
之最頂端基板12之位置,並在偵測到最頂端基板12時,讓第一升降機構421帶動第一支撐座42上升,而在沒有偵測到最頂端基板12時,讓第一支撐座42停止在固定之一高度上。
The
第二支撐座43之頂端具有複數個併列之滾筒,供承載複數個層疊之薄板11,第二支撐座43之底部連接一第二升降機構431,第二升降機構431係為伺服馬達、連桿組及螺桿組之組合,藉以驅動第二支撐座43上升或下降。第二支撐座43頂端之框架4上設有一第二偵測器432,供偵測複數個層疊薄板11之最頂端薄板11之位置,並在偵測到最頂端薄板11時,讓第二升降機構431帶動第二支撐座43下降,而在沒有偵測到最頂端薄板11時,讓第二支撐座43停止在固定之一高度上。
The top of the
第三支撐座44係位於第二機具3之第二吸附件33下方,第三支撐座44之頂端具有複數個併列之滾筒,供承載複數個層疊之薄膜(13,14),第三支撐座44之底部連接一第三升降機構441,第三升降機構441係為伺服馬達、連桿組及螺桿組之組合,藉以驅動第三支撐座44上升或下降。第三支撐座44頂端之框架4上設有一第三偵測器442,供偵測複數個層疊薄膜(13,14)之最頂端薄膜(13,14)之位置,並在偵測到最頂端薄膜(13,14)時,讓第三升降機構441帶動第三支撐座44上升,而在沒有偵測到最頂端薄膜(13,14)時,讓第三支撐座44停止在固定之一高度上。
The
藉此,如第4~7圖所示,本創作薄板堆疊系統1之使用方法之較佳實施例係包括下列步驟: Therefore, as shown in FIGS. 4-7, the preferred embodiment of the method of using the thin-plate stacking system 1 includes the following steps:
a.將層疊之基板12及層疊之薄膜(13,14)分別放置定位在第一支撐座42與第三支撐座44之頂面上,並經由第一偵測器422、第二偵測器432及
第三偵測器442之偵測以分別驅動第一升降機構421、第二升降機構431及第三升降機構441,讓基板12之頂端、薄膜(13,14)之頂端與第二支撐座43之頂端保持在同一水平之固定高度上。
a. Place the stacked
b.以第二機具3之第二吸附件33吸附第三支撐座44頂面之一薄膜13之後,讓第二吸附件33以順時針方向水平轉動以帶動薄膜13水平轉動一角度,再讓第二機器手臂32橫向搬移薄膜13至第二支撐座43之上方,經由複數個第二吸盤332之空氣吸力釋放,讓薄膜13放置在第二支撐座43之頂面上。
b. After the
c.以第一機具2之第一吸附件23吸附第一支撐座42頂面之一基板12之後,讓第一吸附件23以順時針方向水平轉動以帶動基板12水平轉動一角度,再讓第一機器手臂22橫向搬移基板12至第二支撐座43之上方,經由複數個第一吸盤232之空氣吸力釋放,讓基板12放置在第二支撐座43頂面之薄膜13上方,使基板12與薄膜13完全重疊。之後再讓第一吸附件23復位,在吸附第一支撐座42頂面之一隔離膜之後,橫向搬移隔離膜至置物架41之上方,讓隔離膜掉落以收集在置物架41內。上述隔離膜係夾置在二個基板12之間,以阻隔二個基板12。
c. After the
d.再以第二吸附件33吸附第三支撐座44頂面之另一薄膜14之後,將另一薄膜14橫向搬移並放置在第二支撐座43頂面之基板12上方,讓基板12與上、下二個薄膜(13,14)完全重疊以組成尚未黏附之一薄板11。
d. After the
e.如第7圖所示,重覆步驟b至步驟d之動作,此時,基板12與上、下二個薄膜(13,14)係以水平方向轉動另一角度,藉以讓複數個薄板(11,11’)以相互交叉之方式層疊於第二支撐座43之頂面上。
e. As shown in FIG. 7, repeat the operations from step b to step d. At this time, the
在上述步驟b至步驟e中,當基板12之頂端、薄膜(13,14)之頂端與薄板(11,11’)之頂端不在固定之一高度時,分別經由第一升降機構421帶動第一支撐座42上升,第二升降機構431帶動第二支撐座43下降,第三升降機構441帶動第三支撐座44上升,即可使基板12之頂端、薄膜(13,14)之頂端與薄板(11,11’)之頂端維持在固定之一高度上,讓第一吸附件23與第二吸附件33能順暢且有效的搬移薄膜(13,14)與基板12。
In the above steps b to e, when the top end of the
因此,本創作具有以下之優點: Therefore, this creation has the following advantages:
1、本創作在經由二個機器手臂分別搬移基板及薄膜之後,複數個薄板係以相互交叉之方式層疊於第二支撐座之頂面上,因此,可以方便作業人員在堆疊作業完成之後,將各個薄板快速的分離,以節省作業時間。 1. After moving the substrate and the film through the two robot arms separately, a plurality of thin plates are stacked on the top surface of the second support base in a manner of crossing each other. Therefore, it is convenient for the operator to complete the stacking operation. Each sheet is separated quickly to save working time.
2、本創作係經由數個偵測器之偵測以控制基板、薄膜與薄板皆能維持在固定之一高度上,因此,能方便二個機器手臂在同一水平面上分別搬移基板及薄膜,藉以增加堆疊精準度,並提高整體作業之效率。 2. This creation is based on the detection of several detectors to control the substrate, film and thin plate to be maintained at a fixed height. Therefore, it is convenient for the two robot arms to move the substrate and film on the same horizontal plane. Increase stacking accuracy and improve the efficiency of the overall operation.
綜上所述,依上文所揭示之內容,本創作確可達到預期之目的,提供一種能有效的將基板與薄膜堆疊成薄板,並使各個薄板能快速分離以提高作業效率之薄板堆疊方法,極具產業上利用之價值,爰依法提出發明專利申請。 In summary, according to the content disclosed above, this creation can indeed achieve the intended purpose, providing a thin plate stacking method that can effectively stack the substrate and the thin film into thin plates, and can quickly separate the thin plates to improve the operation efficiency , Which is of great industrial value, and filed an application for an invention patent according to law.
1‧‧‧薄板堆疊系統 1‧‧‧Thin plate stacking system
2‧‧‧第一機具 2‧‧‧The first machine
21‧‧‧第一支柱 21‧‧‧First Pillar
22‧‧‧第一機器手臂 22‧‧‧The first robot arm
23‧‧‧第一吸附件 23‧‧‧The first adsorption piece
231‧‧‧第一板架 231‧‧‧The first plate rack
232‧‧‧第一吸盤 232‧‧‧First sucker
3‧‧‧第二機具 3‧‧‧Second machine
31‧‧‧第二支柱 31‧‧‧Second Pillar
32‧‧‧第二機器手臂 32‧‧‧Second robot arm
33‧‧‧第二吸附件 33‧‧‧Second adsorption piece
331‧‧‧第二板架 331‧‧‧Second plate rack
332‧‧‧第二吸盤 332‧‧‧Second sucker
4‧‧‧框架 4‧‧‧Frame
41‧‧‧置物架 41‧‧‧Rack
42‧‧‧第一支撐座 42‧‧‧First support
421‧‧‧第一升降機構 421‧‧‧First lifting mechanism
422‧‧‧第一偵測器 422‧‧‧ First detector
43‧‧‧第二支撐座 43‧‧‧Second support
431‧‧‧第二升降機構 431‧‧‧Second lifting mechanism
432‧‧‧第二偵測器 432‧‧‧Second detector
44‧‧‧第三支撐座 44‧‧‧The third support
441‧‧‧第三升降機構 441‧‧‧The third lifting mechanism
442‧‧‧第三偵測器 442‧‧‧The third detector
Claims (6)
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| TW108105035A TWI680931B (en) | 2019-02-13 | 2019-02-13 | A stacking method for a thin plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108105035A TWI680931B (en) | 2019-02-13 | 2019-02-13 | A stacking method for a thin plate |
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| Publication Number | Publication Date |
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| TWI680931B true TWI680931B (en) | 2020-01-01 |
| TW202030136A TW202030136A (en) | 2020-08-16 |
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| Application Number | Title | Priority Date | Filing Date |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101378048A (en) * | 2007-08-30 | 2009-03-04 | 南茂科技股份有限公司 | Multi-chip stacked packaging structure |
| TW201601972A (en) * | 2014-07-04 | 2016-01-16 | Chan Li Machinery Co Ltd | Packaging bag feeding device |
| TWM564883U (en) * | 2018-03-28 | 2018-08-01 | 時豪 葉 | Stacking and moving apparatus for manufacturing printed circuit boards |
| CN208485336U (en) * | 2018-04-20 | 2019-02-12 | 深圳市动力飞扬自动化设备有限公司 | A kind of rewinding stack plate device for pcb board |
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2019
- 2019-02-13 TW TW108105035A patent/TWI680931B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101378048A (en) * | 2007-08-30 | 2009-03-04 | 南茂科技股份有限公司 | Multi-chip stacked packaging structure |
| TW201601972A (en) * | 2014-07-04 | 2016-01-16 | Chan Li Machinery Co Ltd | Packaging bag feeding device |
| TWM564883U (en) * | 2018-03-28 | 2018-08-01 | 時豪 葉 | Stacking and moving apparatus for manufacturing printed circuit boards |
| CN208485336U (en) * | 2018-04-20 | 2019-02-12 | 深圳市动力飞扬自动化设备有限公司 | A kind of rewinding stack plate device for pcb board |
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| TW202030136A (en) | 2020-08-16 |
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