TWI677947B - Assembly device for electronic parts - Google Patents

Abstract

Provides conductive connection even for extremely small components The feeding of the material can control the supply position or quantity with high precision, prevent the conductive adhesive from drying during operation, and suppress the waste parts (packages) to the smallest assembly device.

The assembly device is equipped with a conveyance for conveying electronic parts Means (3), holding means (21) for holding the component (10) of the electronic part, and coating means (6) for coating and bonding material, the component (10) is mounted on the mounting member (20) to assemble the electronic part Assembly device, the coating means (6) directly coats the bonding material (N) to the component (10) held by the coating holding means (21), and the conveying means (3) is coated with the bonding material (N) Carry the component (10) or the mounting member (20) in a manner above the mounting member (20) corresponding to the component (10).

Description

Assembly device for electronic parts

The present invention relates to an assembly device that attaches and assembles small parts to a package.

Conventionally, in a crystal vibrator, a conductive adhesive material is supplied to a specific position of a package body (part container), and an element sheet (a crystal chip) having an electrode formed thereon is mounted and fixed to electrically connect the electrode and the package body to conductivity. pattern.

For example, an assembly device for a crystal vibrator has a supply (coating) platform for a conductive adhesive and a mounting platform for a crystal wafer. The package provided on the platform in the supply platform supplies conductive adhesive. material. Specifically, the nozzle of the dispenser is inserted into the package, the conductive adhesive is supplied, and the nozzle is moved to the next package to supply the conductive adhesive, and the conductive adhesive is continuously supplied to the package by repeating this. . Thereafter, a crystal wafer is sequentially mounted on each package on the mounting platform, and the package is fixed to the package with a conductive adhesive (for example, refer to Patent Documents 1 and 2).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-91695

[Patent Document 2] Japanese Patent Laid-Open No. 2004-15792

[Summary of Invention]

However, at present, the crystal chip and the package on which the crystal chip is mounted are becoming smaller as the electronic component is miniaturized, and the application (supply) of the conductive adhesive material becomes difficult. Specifically, the following various types of components are produced. problem.

First, when the conductive adhesive is supplied to the package, the nozzle (or needle) of the dispenser comes into contact with the inner wall of the package, and the positional deviation of the supply position causes a deviation in the supply amount (application amount). In order to solve such a problem, the nozzle (or needle) is inserted to tilt the inner wall (side wall and bottom surface) of the package body, and a method of supplying conductive adhesive is also used. However, as the crystal chip and the package body become smaller and smaller, This technique is restricted. The positional deviation or the deviation of the supply position of the conductive adhesive material has a small effect when the component is large to some extent, but when the component is extremely small, there is a problem that short-circuits between the electrodes are likely to occur, increasing defective components.

Second, a shape error (deformation of the bottom surface) occurs in each package. Due to the variation in the position of the bottom surface of each package, that is, the position of the coating surface of the conductive adhesive, there is also a variation in the coating amount of the conductive adhesive. Therefore, when applying a conductive adhesive to a package, it is necessary to control the coating amount with high accuracy in accordance with the shape error of the package.

Third, as in the past, after the supply platform supplies conductive adhesives to a plurality of packages, the method of mounting the components on each package by the mounting platform cannot evade a certain degree from coating when mounting the components. Time. At this time, if the coating amount is large to some extent, the influence due to the passage of time is small, but when the component is small and the supply amount of the conductive adhesive is small, there is a fixed coating of the conductive adhesive to the component. Problems before drying.

Fourth, after the conductive adhesive is supplied to the package, when the production line is stopped for a long time while the component is being mounted, the conductive adhesive is dried in the package without the component installed, so these have to be discarded. There is also the problem of an increase in discarded packages.

In addition, the above problem is not limited to the crystal vibrator, and when a piezoelectric element (piezoelectric element) or MEMS (Micro Electro Mechanical Systems) other than the crystal vibrator is mounted and fixed to a package or a substrate by an adhesive material. Similarly, further improvement is required in the assembly device of extremely small electronic parts.

The present invention has been made in view of the above-mentioned problems, and its purpose is to provide the supply of conductive adhesive materials even for extremely small components, to control the supply position or the amount of supply with high precision, and to prevent conduction during work. Drying of the adhesive material can suppress waste parts (packages) into the smallest assembly device.

(1) The assembly device for electronic parts of the present invention includes: a base (102); a rotating platform (130), which is arranged to rotate freely with respect to the base; at least 3 or more component holding units (140), It is arranged along the circumferential direction of the rotating platform 130; the suction nozzle (142) is provided on the component holding component and holds the component supplied to the component supply area; and the nozzle rotating unit is configured by The component holding unit is provided to rotate the suction nozzle about a horizontal axis so that the front end of the suction nozzle rotates; a component supply device (110) is arranged below the component holding unit and supplies a component supply area (103). ) A component that supplies electronic parts; a mounting member supply device (170) that is arranged below the component holding unit and supplies a mounting member to a mounting area (105) where the component held by the suction nozzle is mounted; And a coating unit (116), which is arranged above the component holding unit, and a coating area (104) between the component supply area and the mounting area, The component held by the suction nozzle is coated with a bonding material. In the component supply area, after the suction nozzle holds the component, the component holding unit is moved from the component supply area to the coating area by a rotating platform. The nozzle rotation unit rotates the suction nozzle to raise the component, the component holding unit moves from the coating area to the mounting area through the rotation platform, and the nozzle rotation unit rotates the suction nozzle to make the Component drops.

(2) Assembly of electronic parts as described in (1) above The device further includes: a first external elastic device (150), which is fixedly disposed in the component supply area, applies external force to the component holding unit, and brings the suction nozzle close to the component in the component supply area; and 2 An external spring pressing device (150) is fixedly disposed in the mounting area, and applies an external force to the component holding unit so that the component held by the suction nozzle approaches the mounting member.

(3) The electronic component assembling device according to the above (1) or (2), and the rotation stage is configured to set the first to third parts of the rotation stage with respect to the component supply region, the coating region, and the mounting region. The component holding unit stops.

(4) The electronic component assembling device according to the above (1) or (2), and the nozzle rotation unit further rotates the adsorption nozzle around a vertical axis (θ direction).

(5) The assembly device for electronic parts as described in (1) or (2) above, and the first and second external spring devices apply external force to the component holding unit to move only the suction nozzle in a vertical direction. .

(6) The electronic component assembling device according to the above (1) or (2), and a camera (118) is arranged above the component supply area and the coating area, and the nozzle rotation unit Before the imaging area of the camera is rotated, the suction nozzle is rotated to raise the component, and the posture of the component obtained by the camera is used to determine the application position of the adhesive to the component in the coating area.

(7) Electronic parts as described in (1) or (2) above In the assembly device, the above-mentioned element is any one of a quartz chip, a piezoelectric element, and a MEMS element.

(8) The electronic component assembling device according to the above (1) or (2), and the coating unit is such that at least a part of the bonding material protrudes from an end portion of the element in a plan view. The element is coated with the adhesive material.

(9) The electronic component assembling device according to the above (1) or (2), and the coating unit is configured to apply the bonding material from a lower surface side to a side surface when the component is mounted.

With the assembly device of the present invention, the following excellent effects can be obtained: even for extremely small components, the conductive adhesive material can be supplied, the supply position or the supply amount can be controlled with high precision, and the conduction during operation can be prevented Drying of the adhesive material minimizes waste parts (packages).

Furthermore, even when an existing supply nozzle (precision nozzle) is used, the remaining adhesive material can be supplied to the outside of the component with respect to the size of the extremely small coating area (electrode) of the component. Therefore, it is possible to prevent the bonding materials protruding from the coating area on the mounting surface from contacting each other, and to prevent defects such as short-circuiting between the electrodes.

1.101‧‧‧Assembly device

10‧‧‧ Components

20‧‧‧Mounting member

21‧‧‧component holding mechanism

24‧‧‧ Element holding mechanism driving unit

140‧‧‧component holding unit

6, 116, 206, 306‧‧‧‧ coating device (coating unit)

30, 130‧‧‧ rotating platform

Fig. 1 (a) is a top view showing the overall configuration of an assembling apparatus according to a first embodiment of the present invention. (b) is a front view of the component holding mechanism of the assembly device related to the first embodiment of the present invention. (c) is a side view of a component holding mechanism of the assembly device according to the first embodiment of the present invention.

FIG. 2 is a diagram showing the operation of the assembly device related to the first embodiment of the present invention, (a) is a top view showing a component supply device, (b) is a front view of a component holding mechanism, (c), ( d) a front view and a side view of the component holding mechanism, and (e) is a front view of the component holding mechanism.

Fig. 3 (a) is a side view of a coating device related to an embodiment of the present invention. (b) and (c) are plan views showing a device coated with a conductive adhesive.

Fig. 4 is a front view showing the overall configuration of an assembling device according to a second embodiment of the present invention.

Fig. 5 is a side view showing the overall configuration of an assembling device according to a second embodiment of the present invention.

Fig. 6 is a plan view (top view) showing the overall configuration of an assembling device according to a second embodiment of the present invention.

FIG. 7 is a diagram showing a configuration of a posture acquiring means according to a second embodiment of the present invention.

FIG. 8 is a schematic diagram of a flow of image signals and the like in an assembly apparatus according to a second embodiment of the present invention.

FIG. 9 (a) is a schematic view showing an image of a component that has been picked up and conveyed to a mounting area. (b) is the time when the camera A schematic view of an image of a mounting member.

Fig. 10 is a top view illustrating the operation of the assembling apparatus according to the second embodiment of the present invention.

Fig. 11 is a side view showing a coating apparatus according to a third embodiment of the present invention.

FIG. 12 is a diagram illustrating a fourth embodiment of the present invention. (A) is a top view showing a method for supplying a general bonding material by a supply nozzle, and (b) is a view showing a general bonding method by a supply nozzle. A side view of the method of material supply.

FIG. 13 (a) is a top view showing a method for supplying a general bonding material according to a fourth embodiment of the present invention, and (b) and (c) are side views.

Fig. 14 is a side view showing a method for supplying a bonding material by a supply nozzle according to a fourth embodiment of the present invention.

FIG. 15 is a side view illustrating a method for supplying a bonding material by a supply needle and a supply nozzle.

Fig. 16 is a side sectional view showing a supply nozzle according to a fourth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the following example, an assembly device that manufactures a crystal vibrator by mounting a component (crystal) on a mounting member (package) will be described.

(First implementation type)

First, the overall configuration of the assembling device 1 according to the first embodiment of the present invention will be described with reference to FIG. 1. FIG. 1 (a) is a top view showing a main part of the assembling device. Fig. 1 (b) is a front view of a part of the component supply device 2 viewed from the Y direction (the lower side of Fig. 1 (a)), and Fig. 1 (c) is a view of the component supply from the X direction (the left side of Fig. 1 (a)) A side view of a part of the device 2. In each figure, a part of the structure is appropriately omitted to simplify the drawing.

As shown in FIG. 1, the assembling device 1 includes a component supply device for supplying components (here, a crystal wafer) 10 of electronic parts (here, a crystal vibrator) 2, a transfer device 3 for carrying electronic parts, and a supply mounting member ( Here, a box-shaped ceramic package with an opened upper portion) 20, a mounting member supply device 5, a coating device 6 for applying (supplying) a conductive adhesive N to the element 10, and a posture for obtaining posture information of the mounting member 20. The information acquisition means 11, the analysis unit 12, and the position adjustment unit 13 are devices for assembling electronic components by mounting the component 10 on the mounting member 20. In addition, although the illustration and detailed description are omitted, the assembly device 1 includes various inspections of the central control device that controls the entire assembly device 1, the components 10 during and after assembly, the mounting member 20, and the state of the electronic components after assembly. Device, a means of discarding electronic parts that are judged to be defective in various inspection devices.

In addition, the plane size of the element 10 in this embodiment is 1 mm square or less (1 mm or less x 1 mm or less), and the mounting member 20 is a mounting surface having a size of 1 mm or less (1 mm or less x 1 mm or less).

The mounting member supply device 5 takes out the mounting members 20 one by one from the mounting member tray 51 of the plurality of mounting members 20 before the mounting, and supplies the mounting members 20 to the conveying device 3. In addition, the transfer of the mounting member 20 from the mounting member supply device 5 to the transfer device 3 is performed by the transfer arm 51A that enters and exits to the transfer device 3 (moves to the Y direction in FIG. 1 (a)). In addition, the present invention is not limited to this example. Even if the entire trays in which the mounting members 20 are arranged in a row are used, the mounting members 20 are supplied, or from the supply platform in which the mounting members 20 are freely distributed on the platform, the images are identified and each of them is picked The structure of the attachment member 20 may be sufficient.

The conveyance device 3 includes a disc-shaped rotating platform (turntable) 31 that rotates about a vertical axis (the axis in the Z direction in FIG. 1), and a component holding mechanism 32 that is arranged on the periphery of the disc. In the rotating platform 31, a supply area 311 for supplying the mounting member 20, a posture information acquisition area 312 for acquiring posture information of the mounting member 20, and mounting (mounting) of the component 10 on the mounting member 20 are set along the circumferential direction. ) Area 313, and a recovery area 314 for recovering and assembling the electronic components (the component 10 and the mounting member 20), and in the supply area 311, the supplied mounting members 20 are transported one by one to the mounting area 313 from the mounting member supply device 5. The component 10 is mounted on the mounting member 20 in the mounting area 313 and the assembled electronic components are recovered in the recovery area 314.

The component holding mechanism 32 has, for example, a suction nozzle (not shown), and a negative pressure generating hole 321 is formed at the front end of the suction nozzle. The suction nozzle attracts and holds the supply pressure in the supply area 311 by the negative pressure applied to the negative pressure generating hole 321. The mounting member 20 to which the mounting member supply device 5 is supplied. The rotary platform 31 is freely rotatable by a motor (not shown), so that the rotary movement of the component holding mechanism 32 arranged on the rotary platform 31 can be performed. In this embodiment, although 16 component holding mechanisms 32 are arranged in the circumferential direction with respect to the rotary table 31, it is preferable to include at least 3 or more. More preferably, it has 5 or more.

In addition, in the present embodiment, the structure of the conveying device 3 is exemplified by the turntable mechanism of the rotating platform 31, but it is not limited to this. For example, a linear motion mechanism that reciprocates on a linear motion track may be used. .

The posture information acquisition means 11 is a camera positioned above the Z direction of the posture information acquisition 312 on the transport path of the mounting member 20, and images the mounting member 20 before mounting. The analysis unit 12 derives, based on the imaging results of the posture information acquisition means (camera) 11, the mounting member 20 carried by the carrying device 3 and the component 10 held by the component holding mechanism 21 to be mounted on the mounting member 20 Relative position offset. In addition, the position adjustment unit 13 adjusts the position of the component 10 held by the component holding mechanism 21 based on the derivation result of the analysis unit 12.

The component supply device 2 includes a component holding mechanism 21 and a component holding mechanism driving unit 24. The component supply device 2 removes the components 10 (pick-up) from a component tray 22 where a plurality of components 10 are arranged before mounting, and supplies the components 10 to the mounting members 20 that are transported to the mounting area 313. Above, and join the mounting member 20 and the element 10.

The component holding mechanism driving unit 24 holds the component holding mechanism 21 in the vertical axis direction (Z side as shown in Figs. (A) and (b)). Direction), horizontal axis direction (X, Y direction) can move freely. The component holding mechanism 21 includes, as shown in Fig. (C), a suction nozzle 25 capable of rotating around a rotation axis R extending in the X direction and rotating about a vertical axis (θ direction), and a suction nozzle 25 A camera 26 that can move in the X, Y, and Z directions at the same time. The suction nozzle 25 and the camera 26 are also driven by the component holding mechanism driving section 24.

The coating device 6 is arranged in the movement path of the component holding mechanism 21 and is arranged near the mounting area 313 of the rotary table 31. The component 10 held by the component holding mechanism 21 is directly coated with a conductive adhesive (such as silver paste). .

FIG. 2 is a diagram showing the operation of the component supply device 2. The same figure (a) is an overall top view of the component supply device 2. In the same figure, the four sequential positions of one component holding mechanism 21 are shown. In addition, the same figure (b) is a front view of the component holding mechanism 21 in the first region 201 viewed from the Y direction from the lower side of FIG. 2 (a), and the left figure of the same figure (c) is from FIG. 2 (a) A side view of the component holding mechanism 21 and the fixed camera 23 in the second area 202 viewed from the left side in the X direction. The right view of the same figure (c) is a front view viewed from the Y direction from the lower side of FIG. 2 (a). . Moreover, the left view of the same figure (d) is a front view of the component holding mechanism 21 and the coating device 6 in the third area 203 when viewed from the Y direction from the lower side of FIG. 2 (a). A side view seen from the X direction on the left side of FIG. 2 (a). In addition, the same figure (e) is a front view of the component holding mechanism 21 and the component holding mechanism 32 in the fourth region 204 viewed from the Y direction on the lower side of FIG. 2 (a).

As shown in Fig. (A), the component supply device 2 moves along the X direction, and sets a component holding area (first area) 201 for picking up the component 10, and a component posture information acquisition area for acquiring posture information of the component 10 ( Second region) 202, a coating region (third region) 203 where the conductive adhesive is applied to the element 10, and a region (fourth region) 204 where the element 10 is mounted (mounted) on the mounting member 20. The mounting area 204 in the component supply device 2 and the mounting area 313 in the conveying device 2 coincide.

As shown in FIG. 2 (b), the component holding mechanism driving section 24 in the component holding area 201 moves the component holding mechanism 21 in the horizontal direction (X, Y directions in FIG. 2 (a)), and is specifically held by the camera 26 Object element 10 (left). Thereafter, the component holding mechanism 21 is moved only in the horizontal direction, and the suction nozzle 25 is arranged above the component 10 to be held. In addition, the component holding mechanism driving unit 24 moves the suction nozzle 25 to the vertical direction (Z direction in FIG. 2 (a)), and further rotates the θ direction about the vertical axis to dispose the components of the multiple components 10 before mounting The components 10 are taken out one by one with the tray 22 (right figure).

As shown in Fig. (C), the component holding mechanism driving unit 24 moves the component holding mechanism 21 to the component posture information acquisition area (second area) 202 while reversing the direction of the suction nozzle 25 to vertical direction. . That is, as shown by the dashed line on the left in Figure (c), the suction nozzle 25 with its front end directed downward in the vertical direction is rotated in the α direction with the rotation axis R as the center, and is slightly omitted so that the front end is directed upward in the vertical direction. 180 ° reverse.

The component 10 is arranged on the component tray 22 in the component holding area 201 of the same figure (b) so that the upper surface becomes upward at the time of mounting, and the component holding mechanism 21 is sucked from above (the upper surface side at the time of mounting) by the suction nozzle 25 Holding element 10. Further, in the component posture information acquisition area 202 shown in the same figure (c), the lower side of the component 10 at the time of mounting is held in a vertical upward direction.

A fixed camera 23 is arranged in the component posture information acquisition area 202, and the component holding mechanism drive 24 moves the component holding mechanism 21 directly below the fixed camera 23. Further, the posture information of the element 10 is acquired by the fixed camera 23. Based on the posture information of the component 10 and the posture information of the mounting member 20 of the conveying device 3, the relative positional deviation amount of the two is derived, and the position of the component holding mechanism 21 is adjusted based on the derived result (same as (c) on the right).

As shown in FIG. (D), in the coating area 203, the component holding mechanism driving section 24 moves the component holding mechanism 21 to perform the coating device 6 by the camera 26 of the component holding mechanism 21 as in FIG. (B). The position of the supply nozzle 61 is aligned (left figure), and a conductive adhesive is applied to the element 10 by the coating device 6. After that, the component holding mechanism driving unit 24 rotates the suction nozzle 25 in the β direction with the rotation axis R as the center, and rotates the component 10 slightly upward and downward by 180 ° (right view).

As shown in FIG. (E), in the mounting area 204, the component holding mechanism driving section 24 moves the component holding mechanism 21, and the position of the mounting member 20 held by the component holding mechanism 32 is aligned by the camera 26 (left (Figure), and the suction nozzle 25 is moved up, down, left and right to connect Close the mounting member 20 and the component 10 and install them (right picture).

Although the moving structure of the component holding mechanism 21 (suction nozzle 25) can be various, for example, a cylinder or the like can be moved in the up-down, left-right direction, and a motor can be used in the rotation direction. In other cases, for example, a ball screw mechanism or a rack and pinion mechanism using a screw shaft and a nut may be used in the vertical and horizontal directions.

The application positions of the coating device 6 and the conductive adhesive N will be described with reference to FIG. 3. 3 (a) is a side view showing a main part of the coating device 6, and FIGS. 3 (b) and (c) are bottom views of the element 10 showing a coating position of the conductive adhesive N.

The coating device 6 is equipped with a dispenser having a supply nozzle 61 that can supply the conductive adhesive N in a specific amount, and directly applies the conductive adhesive N from above the element 10 to the lower side when the element 10 is mounted. The coating device 6 aligns the positions of the two electrodes 11 and 12 formed on the element 10 and the supply nozzle 61, and lowers the supply nozzle 61 to apply (supply) the conductive adhesive N to the element 10. In this embodiment, the coating device 6 is fixed, and the suction nozzle 25 for holding the component 10 is moved to the X direction, the Y direction, and the Z direction (and the θ direction) by the component holding mechanism driving section 24 to perform coating. The positioning mechanism of the cloth device 6 may be a configuration in which the coating device 6 (supply nozzle 61) can be moved to the X direction, the Y direction, and the Z direction (and the θ direction) as shown by a dotted line by a driving means.

As shown in Figures (b) and (c), the element 10 of this embodiment is a crystal wafer constituting a crystal vibrating piece, and a borrow is formed on its surface. The electrodes 11 and 12 are made of a thin-film metal layer. The electrodes 11 and 12 are formed on both ends of one side of the element (crystal piece) 10 as shown in FIG. (B), and are opposite to the element (crystal piece) 10 as shown in FIG. (C). Each of the two sides has a slightly central portion. A conductive adhesive N is applied to each of the two electrodes 11 and 12. The two-dot chain line indicates the mounting member 20.

[Operation of assembling device]

Next, the operation of the assembling device 1 will be described with reference to FIGS. 1 to 3 again.

First, the mounting member supply device 5 removes the mounting members 20 one by one from the mounting member tray 51 (refer to FIG. 1) of the plurality of mounting members 20 before the installation, and supplies the mounting members 20 to the supply area 311 of the transportation device 3. To the member holding mechanism 32. The mounting member 20 of this embodiment is a box-shaped body opened upward, and is supplied to the member holding mechanism 32 so that the opening portion becomes upward. The member holding mechanism 32 sucks and holds the mounting member 20 through the suction hole 321.

As the rotating platform 31 rotates, the mounting member 20 held by the component holding mechanism 32 is rotated and transported around the counterclockwise. The attachment member 20 is imaged by the camera 11 in the posture information acquisition area (hereinafter, the imaging area) 312. The imaging result is transmitted to the analysis unit 12 with the posture and position information of the mounting member 20.

A plurality of components 10 are arranged on the component tray 22 so that the upper surface becomes upward when mounted. Component holding machine for component supply device 2 The structural driving unit 24 moves the component holding mechanism 21 (suction nozzle 25) to the component holding area 201 (FIG. 2 (a)), and performs positional alignment by the camera 26 to pick up the component 10 from above the component 10 (FIG. 2 ( b)).

After that, the component holding mechanism driving section 24 reverses the suction nozzle 25 up and down, and moves the component holding mechanism 21 (the suction nozzle 25) to the component posture information acquisition area 202 (Fig. 2a), and fixes the camera 23 Acquire the posture information of the element 10 (FIG. 2 (c)). The posture information 10 of the element 10 is transmitted to the analysis unit 12 (refer to FIG. 1 (a)), and the relative position shift amount from the corresponding mounting member 20 is derived. Based on the derived results, the position adjustment unit 13 controls the element holding mechanism driving unit 24 to move the suction nozzle 25 to the X, Y, Z, and θ directions to adjust the position and posture of the element 10.

Thereafter, the component holding mechanism driving unit 24 moves the component holding mechanism 21 (suction nozzle 25) to the application area 203 (FIG. 2 (a)). In the coating area 203, the camera 26 of the component holding mechanism 21 is used to align the position of the electrode 11 of the component 10 and the coating device 6 (supply nozzle 61), so that the component 10 is close to directly below the supply nozzle 61. The electrode 11 of the element 10 is coated (supplied) with a conductive adhesive N (FIG. 2 (d), FIG. 3). Next, the positions of the electrode 12 of the element 10 and the supply nozzle 61 are aligned, and the electrode 12 of the element 10 is coated (supplied) with a conductive adhesive N.

When the conductive adhesive N is applied, the element holding mechanism driving unit 24 moves the element holding mechanism 21 to the X direction (the right side in the X direction in FIG. 2 (a)). The component holding mechanism driving section 24 The suction nozzle 25 is turned upside down again before entering the mounting area 204. More specifically, as shown in FIG. 2 (d), it is rotated in the β direction. Then, at a position rotated slightly 90 ° in the β direction (the position indicated by the dotted line in the right figure in FIG. 2 (d)), the coating amount of the conductive adhesive N is applied by the coating amount detection unit 120. (See Fig. 2 (a)), when the coating amount is abnormal, it is discarded as a defective component. When the coating amount is normal, the suction nozzle 25 rotates slightly to the right in the β direction by 90 °. By the rotation of the suction nozzle 25, the element 10 held by the suction nozzle 25 is reversed up and down. That is, the component 10 held by the adsorption nozzle 25 below the coating device 6 such that the lower surface becomes upward at the time of mounting is held by the adsorption so that the upper surface becomes upward at the time of installation before entering the mounting area 204. Nozzle 25.

Thereafter, the component holding mechanism driving unit 24 moves the component holding mechanism 21 (suction nozzle 25) to the mounting area 204 (FIG. 2 (a)). The mounting member 20 carried by the carrying device 3 in the carrying area 204 (the carrying area 313) stands by. The component holding mechanism driving section 24 uses the camera 26 to photograph the position of the mounting member 20. The position adjustment unit 13 is used to adjust the position as necessary to move the suction nozzle 25 to accommodate the component 10 inside the mounting member 20. The inside is joined to the element 10, and this is mounted (Fig. 1 (a), Fig. 2 (e)).

The component holding mechanism 32 transfers the joined mounting member 20 and the component 10 (electronic component) to the recovery area 314, and recovers the electronic component (crystal oscillator) in the recovery area 314 (see FIG. 1 (a)).

In this way, the above operation is repeated, and the assembling device 1 has high precision. Assemble the crystal vibrator moderately. That is, according to the assembling method of the electronic components of the assembling device 1 described above, the components 10 arranged on the component tray 22 such that the upper side becomes upward at the time of mounting are taken out one by one by the component holding mechanism 21 In addition, the element 10 is reversed up and down, and the conductive adhesive material N is directly coated by the coating device 6 on the lower side when the element 10 is mounted, and the position of the element 10 and the mounting member 20 is aligned, stored and bonded to The mounting member 20 that rotates the element 10 upside down and is rotated and assembles the crystal vibrator with high accuracy.

With such a configuration, since the conductive adhesive N is directly applied to the element 10 and does not need to be supplied to the mounting member (package) 20, it is not necessary even when the element 10 or the mounting member 20 is minimized. There is a possibility that the suction nozzle 61 of the coating device 6 (dispenser) may come into contact with the inner wall of the mounting member 20, and it is possible to suppress the supply position from being shifted or the supply amount (application amount) from being shifted due to the supply to the mounting member 20. Accordingly, even when the element 10 is extremely small, a short circuit between the electrodes 11 and 12 can be prevented, and an increase in defective elements can be avoided.

Furthermore, since the conductive adhesive N is directly applied to the element 10, it is not necessary to control the coating amount with high accuracy in accordance with the shape error of the mounting member 20.

Furthermore, since the coating device 6 is disposed near the mounting area 313 of the conveying device 1 and the conductive adhesive N is applied to the element 10, the mounting device 20 is mounted in the mounting area 313, so that it can be shortened compared to the past. The time from coating to bonding to the mounting member 20 can avoid the problem that the conductive adhesive N is dried before the element 10 is fixed.

Furthermore, by providing an imaging area between the supply area 311 to the mounting area 313 of the conveying device 1, the posture of the mounting member 20 can be imaged in the imaging area 312 and the position of the components waiting in the mounting area 313 can be aligned. That is, in the mounting area 313, the alignment of the component 10 and the mounting member 20 is completed (because the time for positioning in the mounting area 313 can be shortened), the component 10 can be coated with conductive material in the coating device 6. The adhesive material N is then joined to the mounting member 20 in a short time. According to this, even if the amount of the conductive adhesive N supplied to the element 10 is small, it can be prevented from being dried and joined to the mounting member 20.

Furthermore, in the assembly process, the conductive adhesive N is coated with the coating device 6, and the component 10 before being mounted on the mounting member 20 is only one component 10 held by the suction nozzle 25 of the component holding mechanism 21. Therefore, even when the production line is stopped for a long time in the assembly process, it is possible to suppress the number of discarded components (for example, one) to a minimum due to the drying of the conductive adhesive coating.

In addition, since the assembly device 1 of the first embodiment can mount the component holding mechanism 20 later, it can be realized and compared by improving the conventional assembly device (the assembly device that supplies conductive bonding materials to the mounting members and joins the components) Assembly device corresponding to cheap and extremely small components.

(Second embodiment)

Next, a second embodiment of the present invention will be described with reference to FIGS. 4 to 10.

FIG. 4 is a front view of the assembling device 101. Figure 5 shows the assembly Left side view of the device 101. FIG. 6 is a plan view (top view) of the assembling device 101. In addition, in each drawing, a part of the configuration is appropriately omitted to simplify the drawing. In addition, the same constituent elements as those in the first embodiment are denoted by the same symbols, and detailed descriptions thereof are omitted.

As shown in FIG. 4, the assembling device 101 includes a base 102, a component supply device 110 arranged on the base 102 (the upper left side in FIG. 4), and a rocking device arranged on the base 102. Robot arm 120, a rotation platform 130 rotatably arranged on the robot arm 120, and a plurality of component holding units 140 (four in this embodiment) arranged along the circumferential direction on the outer peripheral surface of the rotation platform 130 , Coating unit 116, two external elastic devices 150 arranged on the robot arm 120, a rotary platform driving means 160 for rotating the rotary platform 130, a posture information obtaining means 180 arranged on the right side of the base 102, A central control device 190 that controls the entire assembly device 101, a mounting member supply device 170, and an assembly inspection device (not shown) are provided on the base 102 (the upper right side in FIG. 4).

The abutment 102 is a slightly rectangular parallelepiped member. Inside the base 102, a central control device 190 or a power supply device (not shown) is provided. A column member 102a is disposed on the deep side end portion of the upper surface of the base table 102, and a robot arm carriage 102b that supports the robot arm 120 movably (swings freely) is disposed above the column member 102a.

In this embodiment, a component supply region for supplying the component 10 from the component supply device 110 to the component holding unit 140 is set on a portion above the base 102 (the upper left portion in FIG. 4). 103. Furthermore, a coating area 104 is provided on a part of the upper surface of the base 102 (the upper center portion in FIG. 4) to apply a conductive adhesive to the element 10. A part of the upper part of the base 102 (the upper right part in FIG. 4) is provided to accommodate the component 10 held by the component holding unit 140 and to be joined to the mounting member 20 placed on the mounting member supply device 170. Mounting (installation) area 105. In addition, a posture information acquisition area 106 is provided in a part of the mounting area 105 in which posture information acquisition means 180 is arranged. A discard area 135 (refer to FIG. 5) for discarding the rejection to the discard tray 135 is provided on the central deep side portion (side of the rocking means 180) of the upper surface of the base 102.

The component supply device 110 includes a plurality of components 10. The postures of the elements 10 may be randomly arranged, or the plurality of elements 10 may be arranged in a matrix shape by adjusting the postures. Specifically, the component supply device 110 includes a mounting tray 115 on which the component 10 is mounted, a mounting tray moving means 119 configured from an XY stage, and a camera (CMOS camera or CCD camera) 117 for positioning the component 10. . A plurality of components 10 are placed on the placing tray 115. The mounting tray 119 is not shown in the figure, and is formed by combining a linear motion device driven by a motor at a right angle to each other. The mounting tray moving means 119 in this embodiment mode can move the mounting tray 115 in a vertical direction and a horizontal direction (the up-down direction (X direction) and the left-right direction (Y direction) in FIG. 5). The placing tray moving means 119 sequentially arranges the components one by one in accordance with the photographing result of the component 10 generated by the camera 117 so as to correspond directly below the suction nozzle 142 of the component holding unit 140 in the component supply area 103. 10.

The robot arm 120 is a wrist-shaped member that extends from the robot arm carriage 102 b to the front of the component supply device 110. A rotating platform 130 is rotatably held by the robot arm 120, and an external spring pressing device 150 and a rotating platform driving means 160 are provided. The external biasing device 150 is provided above each of the component supply region 103 and the mounting region 105 side.

The rotating platform 130 is a slightly disc-shaped member, and four component holding units 140 are arranged on the outer peripheral surface at equal intervals (at an interval of 90 ° in this embodiment). The rotation platform 130 is held in the robot arm 120 so that a rotation axis becomes an up-down direction (vertical direction) in the operation position shown in the figure. In addition, the rotation stage 130 rotates in a clockwise or counterclockwise direction, and all the component holding units 140 are configured to pass through the component supply area 103, the coating area 104, the mounting area 105 (posture information acquisition area 106), and discard in order. Above area 135. In this example, when any one of the component holding units 140 is located opposite to the component supply area 103, the other three component holding units 140 are located in the mounting area 105 (posture information acquisition area 106) and the waste area. 135 opposite positions (see FIG. 6).

The component holding unit 140 has a suction nozzle 142, and takes out (picks) the components 10 on the component supply device 110 one by one and holds them. In addition, the component holding unit 140 includes a nozzle rotation unit (not shown), and the suction nozzle 142 is a method in which the front end of the suction nozzle 142 is reversed up and down by the nozzle rotation unit (the direction opposite to the α direction or the α direction in FIG. 4) Rotate freely around the horizontal axis, which can make the component 10 upside down turn. In addition, the adsorption nozzle 142 can rotate freely about a vertical axis (the direction opposite to the θ direction or the θ direction in FIG. 4), and the posture of the element 10 can be adjusted.

The element holding unit 140 of the suction holding element 10 rotates about a vertical axis as it rotates about a vertical axis of the rotation platform 130 (see FIG. 6). In addition, the component holding unit 140 rotates about the vertical axis, and simultaneously rotates the suction nozzle 142 about the horizontal axis by reversing up and down in the vertical direction. As the moving structure of the suction nozzle 142, for example, a motor or the like can be used.

Here, the component 10 is arranged on the component supply device 110 so that the upper surface becomes upward when mounted. That is, the component holding unit 140 sucks and holds the component 10 from above (upper side at the time of mounting) in the component supply region 103 from the front end of the suction nozzle 142, and the component holding unit 140 itself also rotates about the vertical axis and is in the coating area. In 104, the adsorption nozzle 142 is rotated slightly 180 ° so that the front end of the adsorption nozzle 142 (element 10) is above the vertical direction. Moreover, in this example, as shown by the dotted line in FIG. 4, before reaching the coating area 104, the rotation of the adsorption nozzle 142 is completed (upside down and upside down), and the posture of the element 10 is acquired with the camera 118 located above. And complete the position alignment of the coating area 104.

The component holding unit 140 then rotates toward the center of the vertical axis. In the mounting area 105, the front end (component) of the suction nozzle 142 is positioned below the vertical direction, the suction nozzle 142 is reversed up and down, and the front end of the suction nozzle 142 faces downward. In this state, it moves to the mounting area 103 where the mounting member 20 stands by.

Coating unit (coating device) 116 series and the first embodiment Similarly, a dispenser (refer to FIG. 3) that can move the supply nozzle 156 in the vertical direction is disposed between the component supply area 103 and the mounting area 105. The component 10 held by the component holding unit 140 and conveyed is coated (supplied). ) Conductive adhesive (for example, silver paste). Specifically, in the coating region 104, the supply nozzle 156 is lowered by the suction nozzle 142 which is turned upside down, and the supply nozzle 156 is lowered from above the component 10 at a specific position. (On the electrodes 11, 12) A specific amount of a conductive adhesive is applied.

One of the two external urging devices 150 is disposed above the component supply area 103. In addition, the other external compression device 150 is disposed above the mounting area 105. One external spring pressing device 150 applies an external force to the component holding unit 140 located on the component supply area 103 to move the suction nozzle 142 of the component holding unit 140 to a direction close to the component supply area 103 (below). The other external spring pressing device 150 applies an external force to the component holding unit 140 located on the mounting area 105 to move the suction nozzle 142 of the component holding unit 140 to a direction close to the mounting area 105 (below).

The rotation platform driving means 160 is fixed below the robot arm 120 and is located between the robot arm 120 and the rotation platform 130. In this embodiment, the rotating platform driving means 160 is a stator fixed to the robot arm 120 and a hollow DD (direct drive) motor composed of a cylindrical rotor rotating around the periphery of the stator. A through hole is formed in the center portion of the stator in the axial direction. The rotating platform 130 is fixed to the rotor in a state where a hollow shaft (not shown) is inserted into the through hole.

Further, a configuration may be adopted in which a camera is disposed below the coating area 104 and the mounting area 105 and the coating amount of the conductive adhesive is detected.

The posture information acquisition means 180 is composed of a camera (CMOS camera, CCD camera, etc.) (not shown), and is arranged in the posture information acquisition area 106 (a part of the mounting area 105). The camera images the component 10 held by the suction nozzle 142 of the component holding unit 140 located in the posture information acquisition area 106 from directly below, and images the mounting component 20 that is supplied to the mounting area 105 and is on standby from directly above. That is, the camera waits for the component 10 being carried toward the mounting area 105, and images the component 10 from below, and obtains tilt information related to the horizontal plane of the component 10 as image information. Further, the camera images the mounting member 20 waiting in the mounting area 105 from above, and obtains tilt information related to the horizontal plane of the mounting member 20 as image information. In addition, the camera is electrically connected to the central control device 190 and sends the image information obtained by imaging to the central control device 190. Furthermore, based on the image information of the posture obtained by the camera, the height of the inner bottom surface of the mounting member 20 of the joint element 10 is detected, and the posture (position, height) of the correction element 10 and / or the posture (position of the mounting member 20) are matched with ,height).

The central control device 190 is provided with a control device such as a CPU, ROM, and RAM, and directly controls the component supply device 110, the external spring device 150, the rotary platform driving means 160, the posture information obtaining means 180, the mounting member supply device 170, and the like. The central control device 190 series The imaging results of the comparison posture information acquisition means (camera) 180 also function as an analysis unit that derives the relative position shift amount G of the mounting member 20 and the element 10.

The mounting member supply device 170 includes a full-row tray 121 on which a plurality of recessed portions arranged in a matrix are formed, and a full-row tray moving means 117 composed of an X-Y platform. The mounting members 20 before assembling are mounted on the recessed portions of the entire row of trays 121. The entire tray moving means 117 is omitted in the figure, and is constituted by a linear motion device driven by a motor at a right angle to each other. In this embodiment, the entire tray moving means 117 can move the entire tray 101 in the up-down direction and the left-right direction in FIG. 4.

The entire tray moving means 117 is provided in a manner corresponding to directly below the suction nozzle 42 of the component holding unit 140 located in the loading area 105, and sequentially supplies the plurality of mounting members 20 to the loading area one by one before the components 10 are transferred. 105. The full-row tray moving means 117 functions as a position adjustment unit that adjusts the position of the mounting member 20 based on the relative position shift amount G derived from the central control device 190. In the region to be carried 105, the component 10 sucked and held by the component holding unit 140 is stored in the mounting member 20 and joined. By repeating this operation, the components 10 are mounted on all the mounting members 20 placed on the recessed portions of the entire tray 121. When the assembly of all the mounting members 20 is completed, the entire tray 121 is carried to the next process.

7 to 9, the posture information obtaining means 180 will be further described. FIG. 7 is a diagram showing the configuration of the posture information acquisition means 180, and FIG. 8 is a schematic diagram illustrating the flow of the image signal in the assembling device 101. Sketch map. FIG. 9 (a) is a schematic view showing an image of the component 10 that is captured and carried to the mounting area 105. The same figure (b) is a schematic view showing an image of the mounting member 20 standing by in the mounting area 105. In addition, although the drawing is simplified in FIG. 8 and the mounting member 20 is shown in a rectangular parallelepiped shape, the mounting member 20 is actually a package of a box-shaped body opened upward.

As shown in Figure 7. In this embodiment, the posture information acquisition means 180 is composed of two cameras 180 (camera 181 for mounting components and camera 182 for components) and a light guide unit 183, and is arranged in the video information acquisition area 106 ( Part of the mounting area 105). The camera 181 for mounting members and the camera 182 for components are respectively a CMOS camera or a CCD camera.

The camera 181 is a mounting member 20 that is supplied to the mounting area 105 by taking an image from directly above via the light guide element 183 before the element 10 is carried. That is, the camera 181 images the mounting member 20 supplied to the mounting area 105, and obtains position information about the horizontal direction of the mounting member 20 as image information. In addition, the camera 181 is electrically connected to the central control device 190, and sends image information obtained by imaging to the central control device 190.

The camera 182 is an image taken from directly below via the light guide unit 183 in the posture information acquisition area 106, and the posture is adjusted by the nozzle rotation unit, and then the component 10 is transported to the mounting area 105. That is, the camera 182 captures the mounting member 10 supplied to the mounting area 105, and obtains position information about the horizontal direction of the mounting member 10 as image information. Furthermore, the camera 182 is electrically connected to the central control device 190, and The acquired portrait information is sent to the central control device 190. The central control device 190 derives the relative position shift amount G of the mounting member 20 and the element 10 based on the imaging results of the cameras 181 and 182. Specifically, as shown in FIG. 9 (a), it is assumed that the camera 182 is used to obtain the imaging result of the area where the element 10 is located in, for example, the upper left, and as shown in FIG. 9 (b), the camera 181 is used to obtain the installation. A case where the component 20 is located in, for example, the imaging result of the lower right area. At this time, the relative position shift amount is derived to an amount shown by an arrow G connecting the upper left region from the lower right region. The central control device 190 operates the entire tray moving means (position adjustment unit) 117 according to the relative position offset G, and adjusts the installation in a manner that the position in the horizontal plane of the mounting member 20 is the same as the position in the horizontal plane of the element 10 The horizontal position of the member 20.

In addition, although the case where only the position shift amount G in the X-Y plane direction is derived is shown here, the rotation shift amount can also be derived. At this time, before deriving the position shift amount G in the XY plane direction, once the image is captured by the up and down cameras 181 and 182, the rotation shift amount is analyzed by the central control device 190, and the rotation shift amount is close to zero. In this manner, the angle of the element 10 is adjusted by rotating the suction nozzle 142. After that, the holding posture of the imaging element 10 is again obtained, and the position shift amount G in the X-Y plane direction is derived, so that the horizontal position of the mounting member 20 is adjusted in a manner close to zero. When the suction nozzle 142 of the element 10 is held in an eccentric state, when the position of the rotation direction is aligned, the element 10 is shifted to the X-Y plane direction.

The light guide element 183 is provided with a light collection unit 183a from below The camera 181 guides light to the mounting member side light path (not shown) of the camera 181, and the camera 181 has an imaging mounting member 20, and the camera is provided with an element side light path (not shown) that guides light from the upper light collecting portion 183b to the camera 182 182 imaging element 10. The light guide unit 183 is a box-type unit having a plurality of optical systems (optical paths) with built-in mirrors, lenses, and lenses, and has a size of about 10 mm square. The light guide unit 183 is driven by an advancing and retreating unit (not shown), and advances and retreats the lower side lighting section 183a and the upper side lighting section 183b to the mounting area 105 as necessary. The advancing and retracting unit is such that the lower daylighting portion 183a enters directly above the mounting member 20 waiting in the mounting area 105 before the camera 181 captures the mounting member 20 (see FIG. 8). In addition, the advancing and retracting unit is provided before the camera 182 captures the mounting member 10, and the upper daylighting portion 183b is entered between the mounting member 20 and the element 10 waiting in the mounting area 105 (see FIG. 8). In addition, the order of reaching the mounting area 105 is that after the mounting member 20 waits in the mounting area 105 or the standby operation is the same, the light guide unit 183 enters the mounting area 105 by the advancing and retracting unit, and then the component 10 is transported to the mounting area 105.

Accordingly, the light guide unit 183 is attached to the camera 181 to capture the mounting member 20, and the lower light collecting portion 183a is disposed directly above the mounting member 20 waiting in the mounting area 105, and imaging can be performed from directly above the mounting member 20. When the light guide unit 183 is attached to the camera 182 and the imaging element 10, the upper light collecting portion 183b is disposed between the mounting member 20 waiting in the mounting area 105 and the element 10 transported to the mounting area 105. Just below the camera. And, the light guide unit 183 series It is preferable to reduce the thickness t of the portion disposed between the element 10 and the mounting member 20 and to reduce the stroke during assembly. Therefore, the thickness t of the portion of the light guide unit 183 is preferably 10 mm or less, and more preferably 8 mm or less. The thickness t is limited due to the built-in optical system, and can actually be reduced to 8 mm.

In addition, although the position information acquisition means 180 shown in Figs. 7 (a) and (b) has two cameras 181 and 182 arranged in the horizontal direction, even if the device 101 is assembled, as shown in Fig. 7 (c), Two cameras 181 and 182 may be arranged in a vertical direction.

[Operation of assembling device]

Next, an operation of the assembling device 101 according to the second embodiment will be described. 10 (a) to 10 (f) are plan views showing the operation of the assembling device 101. In addition, for ease of explanation, the four component holding units 140 are labeled with the component holding units 140A to 140D, and the operation of the component holding unit 140A will be mainly described. In addition, since the other component holding units 140B to 140D have the same operation as that of the component holding unit 140A, description thereof is omitted.

First, as shown in FIG. 10 (a), the component supply device 110 arranges a plurality of components 10 in a state of adjusting the direction and posture.

With the component supply device 110, after the plurality of components 10 are arranged in the component supply area 103 (or at the same time), the rotary platform 130 is rotated about 90 ° counterclockwise to move the suction nozzle 142 of the component holding unit 140A to the substrate. 10 phases of components arranged in the component supply area 103 Toward the upper position (see Fig. 10 (b)).

The rotating platform 130 is stationary for a certain period of time in the state of the same figure (b). While the rotating platform 130 is stationary, the component holding unit 140A is pushed by the external urging device 150 to bring the suction nozzle 142 close to the component 10 arranged in the component supply area 103. Then, the suction nozzle 142 sucks and holds the element 10. After that, the pressing force (or reducing the pressing force) caused by the external spring pressing device 150 is released, whereby the suction nozzle 142 rises.

Then, as shown in Fig. (C), the rotating platform 130 rotates again around the counterclockwise. During the rotation of the rotary platform 130, the component holding unit 140A rotates the suction nozzle 142 about the horizontal axis, and reverses the front end of the suction nozzle 142 and the component 10 held by it. Furthermore, after the up-down inversion of the suction nozzle 142 is completed, the state (orientation) of the element 10 is image-recognized by the camera 118.

In addition, during this period, the camera 181 recognizes the image of the state of the mounting member 20 in the mounting area 105 (posture information acquisition area 106) on standby. In addition, the image recognition performed by the camera 181 may be completed before the element 10 reaches the mounting area 105, and is not limited to this timing. Furthermore, the entry of the light guide unit 183 into the mounting area 105 is completed before image recognition by the camera 181.

As shown in Figure (d), when the rotating platform 130 rotates around the counterclockwise and the component holding unit 140A rotates slightly from the position shown in Figure (b) by 90 °, the component 10 held by the component holding unit 140A is carried. To the coating area 106. Even in this position, the component holding unit 140A It is reversed so that the front end (element 10) of the suction nozzle 142 is positioned above the vertical direction and held. The component 10 held by the suction nozzle 142 is held in the suction nozzle 142 by being reversed up and down from the top surface at the time of mounting (see FIG. (B)) to the bottom surface at the time of mounting. That is, the element 10 is held from below (upper side at the time of mounting). Then, in this state, it remains still for a specific time.

While the rotation stage 30 is stopped, the nozzle rotation unit (not shown) of the component holding unit 140A rotates the suction nozzle 142 of the component holding unit 140A toward θ only at an appropriate angle based on the image information captured by the camera 118. The posture of the element 10 held by the suction nozzle 142 is adjusted.

While the rotary stage 130 is stationary, the coating unit 116 lowers the supply nozzle 156 from above the element 10, and applies (supplies) a conductive material to a specific area of the element 10 (the electrodes 11, 12 (see FIG. 3)). material.

After the conductive adhesive material N is applied, the amount of the coating portion of the conductive adhesive material N is detected by a coating amount detection unit (not shown). When there is an abnormality in the coating amount, the component 10 is not mounted on the mounting member 20, for example, it is rotated counterclockwise by 180 ° in the right direction, and the component 10 with the abnormality is discharged to the waste tray 135 (see FIG. 10 (f)).

During the rotation of the rotary table 30, as described above, the next component 10 is arranged at an appropriate position in the component supply area 103 (directly below the suction nozzle 42 of the component holding unit 140B). Moreover, during the period when the rotating platform 130 is at rest, as in the above, it is located in Yuyuan The suction nozzle 142 of the component holding unit 140B facing the component supply region 103 sucks and holds the component 10 arranged in the component supply region 103.

After the conductive adhesive material N is applied, the rotary platform 130 is rotated about 90 ° around the counterclockwise, and then stands still for a specific time (see FIG. 10 (e)). Accordingly, the component 10 held by the component holding unit 140A reaches the mounting area 105. During the rotation of the rotary platform 130, the component holding unit 140A rotates the suction nozzle 142 approximately 180 ° around the horizontal axis (vertical up-down). Accordingly, the element 10 is reversed upside down again, that is, the element 10 is held by the suction nozzle 142 so that the upper surface becomes upward when mounted.

While the rotating platform 130 is stationary, the camera 182 recognizes the image of the state of the component 10 carried to the posture information acquisition area 106. The light guide unit 183 quickly retreats after taking a picture with the camera 182. The result of the image recognition performed by the camera 182 is in the central control device 190, and the result of the image recognition performed by the camera 181 is compared to derive the relative position offset G of the mounting member 20 and the component 10. The entire tray moving means 117 of the mounting member supply device 170 performs position correction by moving the mounting member 20 in the X-Y direction based on the relative position shift amount G. After that, the external urging device 50 presses the element holding unit 140A. As a result, the suction nozzle 142 of the component holding unit 140A is lowered, and the component 10 is housed in the mounting member 20 waiting in the mounting area 105 and is joined to assemble an electronic component (crystal oscillator).

And, even if the component 10 is mounted on the mounting structure in the above, After the component 20, an assembly inspection device (not shown), the assembled state of the imaging element 10 and the mounting member 20 are used to determine whether the assembled state is good or not. That is, based on the image information of the component 10 and the mounting member 20 photographed by the assembly inspection device, when the assembly state is judged to be defective by a position shift or the like, the component holding unit 140A waiting in the mounting area 105 is sucked The nozzle 142 sucks the component 10 and the mounting member 20 which are judged to be defective. In addition, the rotating platform 130 rotates counterclockwise slightly by 90 °, and discharges the component 10 and the mounting member 20 which are determined to be defective to the waste tray 135 (see FIG. 10 (f)).

In addition, based on the image information captured by the posture information acquisition means 180 or the camera 182, the component 10 judged to be unable to control the posture or position is not mounted in the mounting area 105. At this stage, the component 10 is discharged to waste The tray 135 side (see FIG. 10 (f)).

In this way, the above operation is repeated, and the assembling device 101 assembles the crystal oscillator with high accuracy. That is, according to the assembling method of the electronic components of the assembling device 101 described above, the components 10 placed in the component supply device 110 are taken out one by one in the component supply area 103 so that the upper surface becomes upward at the time of mounting. 140 holds, while rotating and conveying around the vertical axis, while reversing the component 10 up and down about the horizontal axis, and directly applying conductivity in the coating area 104 by the coating unit 116 from above on the lower side when the component 10 is mounted Next, the material N is reversed up and down around the horizontal axis, and after the component 10 and the mounting member 20 are aligned in the mounting area 105, it is stored and bonded to the mounting member 20 to achieve high precision. Assemble the crystal vibrator moderately.

With such a configuration, since the conductive adhesive N is directly applied to the element 10 and does not need to be supplied to the mounting member (package) 20, it is not necessary even when the element 10 or the mounting member 20 is minimized. The supply nozzle 156 of the coating device 116 (dispenser) may come into contact with the inner wall of the mounting member (package) 20, and it is possible to suppress the supply position from being shifted or the supply amount (application amount) due to the supply to the mounting member 20 The deviation. Accordingly, even when the element 10 is extremely small, a short circuit between the electrodes 11 and 12 can be prevented, and an increase in defective elements can be avoided.

Furthermore, since the conductive adhesive N is directly applied to the element 10, it is not necessary to control the coating amount with high accuracy in accordance with the shape error of the mounting member 20.

In addition, since the element 10 is coated with the conductive adhesive N on the coating area 104 and is mounted on the mounting member 20 immediately thereafter, the time from coating (to the mounting member 20) to bonding can be shortened compared to the past, and Even if the amount of the conductive adhesive N to be supplied is small, the problem of drying before the element 10 is fixed can be avoided.

In addition, the number of the elements 10 mounted on the mounting member 20 by applying the conductive adhesive N to the elements 10 held by the element holding unit 140 can be reduced. That is, as shown in FIG. 10, when the number of the element holding units 140 is four, the conductive adhesive N is applied, and the number of the elements 10 mounted on the mounting member 20 is one or two (though In response to an increase in the number of component holding units 140, there are at most a few). Therefore, in the assembly process, even when the production line is stopped for a long time, Since the electrically conductive adhesive N is a small number of the components 10 before being mounted on the mounting member 20, it is possible to suppress the application of the electrically conductive adhesive N to minimize the number of waste components due to drying.

Furthermore, since the assembly device 101 holds the component holding unit 140 of the component 10 arranged in the circumferential direction of the turntable, the suction nozzle 142 can be rotated about 180 degrees (or 360 degrees) about the horizontal axis, so it is more than the first embodiment. The component holding mechanism 21 that moves in the horizontal direction can save space in the assembling device 101 (the base 102 that performs the actual operation).

Furthermore, in this assembly device 101, the light guide unit 183 is used to adjust the approximate position of the mounting member 20 waiting in the mounting area 105 before the component 10 is transported, so that no waiting time is wasted. Furthermore, in the assembling device 101, the posture of the element 10 held by the suction nozzle 142 is adjusted during the rotational movement of the rotary platform 130 (during the movement trajectory), so no wasted waiting time is generated. In addition, in the assembling device 101, since the relative position with the mounting member 20 of the component 10 held by the suction nozzle 142 is finally adjusted after being transported to the mounting area 105, it is not affected by the mechanical accuracy of the conveying device , You can make correct and exact adjustments. Furthermore, not only the entire tray moving means 117 of the mounting member supply device 170 is driven, but since the relative positional displacement of the component 10 and the mounting member 20 can be eliminated, there is no need to complicate the device.

In addition, the assembly device 101 is provided with a plurality of component holding units 140 having suction nozzles 142 in the circumferential direction of the rotary table 30. Therefore, the first element holding A process in which the holding unit 140 adsorbs and holds the element 10, a process in which the second element holding unit 140 applies a conductive adhesive to the element 10, a process in which the third element holding unit 140 assembles the element 10 on the mounting member 20, and the like.

Further, the assembling apparatus 101 includes posture information acquisition means 180 that respectively acquires posture information of the component 10 held by the component holding unit 140 and posture information of the mounting member 20 that is waiting in the waiting area 105. The posture information acquisition means 180 includes a camera 181 from the lower imaging element 10 at the same position as the box in the imaging area, and a camera 182 that photographs the mounting member 20 from above. The mounting member 20 and the element 10 are derived from the imaging results of the two cameras 181 and 182 Relative position offset G. With the miniaturization of the component 10 and the mounting member 20, the position alignment at the time of assembly is also required to be highly accurate. However, according to this embodiment mode, the component 10 and the component 10 can be performed with high accuracy in a short time and space-saving manner. The positions of the mounting members 20 are aligned.

In addition, the component supply area 103, the mounting area 105, and the waste area 135 are photographed in this order on a rotation path that rotates in one direction of the component holding unit 140. Therefore, the assembly device 101 can rotate the rotary platform 130 to sequentially transfer the component holding unit 140 from the component supply area 103 to the waste area 135, and these processes can be performed reliably.

In addition, the assembly device 101 further includes a component supply device 110 that arranges the next component 10 in the component supply area 103 and a mounting component supply device that transports the mounting member 20 before assembly to the mounting area 105. 170. Therefore, the rotation platform 130 rotates, and before the arbitrary component holding unit 140 stops in the component supply area 103, the next component 10 is arranged at the component holding position 111. In addition, the assembling device 101 rotates the rotating platform 130, and before the component holding unit 140 stops in the mounting area 105, the mounting member supply device 170 moves the next mounting member 20 to the mounting area 105. Therefore, it is possible to eliminate waste of time and perform high-speed operation.

In addition, the assembling apparatus 101 related to this embodiment mode includes four component holding units 140, but the present invention is not limited to this, and holds other components (for example, six, eight, and twelve). The unit 140 is also available.

In addition, the assembling device 101 is provided with the rotation platform 130 such that the central axis of rotation in the operating position becomes the vertical direction (vertical direction), but it is not limited to this, and even if it is the center of rotation arranged in the operating position The axis may be horizontal or inclined. In addition, the rotation stage 130 may be a shape other than the shape shown in this embodiment.

In addition, although the assembling device 101 has a configuration in which each unit is controlled in an integrated manner by the central control device 190, it is not limited to this, and a dedicated control device may be provided separately.

In addition, the assembling apparatus 101 is not limited to a person in which the robot arm 120 is disposed on the base 102, and may be a person in which the robot arm 120 is disposed in another member or an independent disposition. It should be noted that the robot arm 120 may be configured to perform operations other than swing. For example, it is possible to move only in the downward direction, and it is also possible to swing after linearly moving in the vertical direction. In addition, even if it swings or rotates around a plurality of different rotation axes, The robot arm 120 may be configured.

In addition, the positions of the component supply area 103, the posture information acquisition area 106, the mounting area 105, and the waste area 135 are not limited to the positions shown in this embodiment, and they may be arranged at other positions. In addition, it is possible to provide an area for processing, assembling, inspecting, etc. of parts during transportation.

Moreover, the rotation of the rotation platform 130 is not limited to intermittent rotations that are stationary every 90 °, even if the component holding unit 140 is in a position facing the component supply area 103, posture information acquisition area 106, mounting area 105, and waste area 135, respectively. At this time, the rotating platform 130 may be continuously rotated at a low speed. At this time, the component supply device 110 and the mounting member supply device 170 are preferably in the component supply area 103 or the mounting area 105, and are preferably a rotary platform that rotates in the same direction as the rotary platform 130 and moves at the same speed. That is, in the component supply area 103, the suction nozzle 142 arranged on the rotation stage 130 can suck and supply the component 10 to the component supply device 110 which moves in the same direction and at the same speed during rotation. Further, in the mounting area 105, the component holding unit 140 is a component mounting device supply device 170 that can assemble the component 10 adsorbed on the adsorption nozzle 142 during rotation while moving in the same direction and at the same speed as the component 10.

(Third embodiment)

A third embodiment of the present invention will be described with reference to FIG. 11. FIG. 11 is a side view showing another example of the coating apparatuses 206 and 306 Illustration. FIG. 11 (a) shows a coating device 206 for applying a conductive adhesive to the element 10 by transfer, and FIG. 11 (b) shows another example of a coating device 306 of a dispenser.

As shown in FIG. (A), the coating device 206 includes a stage 210 for forming a film-shaped bonding material MN, a coating needle 211 penetrating upward from below the stage 210, and a blade 212. The stage 210 is supplied with a liquid conductive adhesive, and a film-shaped adhesive MN is formed by the squeegee 212. After that, when the coating needle 211 moves vertically from below the platform 210 and upwards, when the platform 210 is penetrated, a film-shaped adhesive MN is attached to the front end of the coating needle 211. The coating needle 211 to which the film-shaped adhesive MN is attached is in contact with the element 10, and the film-shaped adhesive MN is transferred to the element 10. In addition, although the squeegee 212 that moves in a flat plate shape in the horizontal direction is exemplified herein, the squeegee 212 having a plurality of blades rotating on a circular platform 210 may be used.

With such a configuration, it is easier to control the amount of the conductive adhesive to be applied in a smaller amount than in the case of the dispenser.

Further, as shown in FIG. 11 (b), the coating device 306 may be a dispenser in which the front end (only) of the supply nozzle 307 is bent upward.

When the coating devices 206 and 306 of the third embodiment are used, the upper surface side at the time of mounting can be used to hold the element 10 from above, and the lower surface side at the time of mounting (from below the element 10) can be applied (transferred) ) Film-shaped adhesive MN (conductive adhesive N). That is, it is not necessary to provide the component holding mechanism 21 as in the first embodiment or the second embodiment. The structure in which the component 10 is reversed like the component holding unit 140 can simplify the configuration of the assembling devices 1 and 101.

(Fourth embodiment)

A fourth embodiment of the present invention will be described with reference to FIGS. 12 to 16. FIG. 12 is a diagram showing a state in which a conductive adhesive N is supplied to the element 10 of the present embodiment by a conventional method. FIG. 12 (a) is a top view showing the lower surface at the time of mounting, and FIG. 12 (b). Is a side view. 13 and FIG. 14 are diagrams showing a method for supplying the conductive adhesive N in this embodiment, and FIG. 13 (a) is a top view with the lower surface of the installation being up, and FIG. 13 (b), (c) is a side view, and FIG. 14 is a side view. FIG. 15 is a plan view illustrating the supply needle 71 and the supply nozzle (precision nozzle 61) according to this embodiment, and FIG. 16 is a side sectional view of the supply nozzle (precision nozzle 61) according to this embodiment.

As described above, the element 10 of this embodiment is an extremely small element having a plane size of 1 mm square or less. More specifically, the short side is, for example, 0.4 mm or less, and the long side is 0.6 mm or less. Therefore, the coating area (that is, a part of the electrode 11 and the electrode 12) to which the conductive adhesive N is applied also has a minute size (for example, about 0.1 mm square). In addition, not only the coating area is small, but also the coating areas (electrodes 11, 12) are very close to each other.

For example, as shown in FIG. 3, when the conductive adhesive material N is directly applied to the coating area of the element 10, generally, the conductive adhesive material N is not exposed from the element 10 to the outside, or At least The method of applying the conductive adhesive material N near the center of the cloth area aligns the center position of the supply nozzle 61 (the discharge hole) with the position of the mounting surface of the element 10 (for example, near the center of the coating area). The conductive adhesive N was discharged.

However, in the case of the extremely small component 10 having a plane size of 1 mm square or less in this embodiment, the supply nozzle is aligned with the center position of the discharge hole of the supply nozzle 61 in the area of the mounting surface of the component 10. Next, when the pasty or liquid conductive adhesive N is applied, the conductive adhesive N protrudes from the application area, and there is a problem that the electrodes 11 and 12 come into contact with each other and cause a short circuit.

When specifically described with reference to FIG. 12, the conductive bonding material N of this embodiment is a resin such as epoxy mixed with glass frit (silicon, silicon dioxide) and a silver filler of about 30 μm. The supply nozzle 61 of the device 6 ejects this and applies it. Here, even when the so-called precision nozzle capable of supplying a small amount of the conductive adhesive N is used as the supply nozzle 61, the smallest nozzle diameter (the diameter of the discharge hole 61A) is about 0.1 mm to 0.2 mm (in detail) (Approximately 0.15 mm to 0.2 mm), and once again the standard coating amount is less than 1 cc (for example, approximately 0.3 cc to 0.5 cc).

Therefore, as shown in the figure, in the same manner as the conventional method in the past, the discharge hole 61A of the supply nozzle 61 is made in the area of the mounting surface of the element 10 so as to cover the coating area (electrodes 11, 12) (same as the figure When the center position of (a) is indicated by a thick dashed line) and the conductive adhesive N is supplied in a positional alignment, there is a lot of protrusion from the coating area, and the conductive adhesive The material N is in contact with each other, causing a short circuit between the electrodes 11 and 12.

In addition, it is also considered that the coating amount at a time is less than a specific amount (for example, about 0.3cc to 0.5cc), but at this time, the supply amount varies, and there is a problem that the bonding and support of the element 10 are unstable.

Then, the coating device 6 of this embodiment is applied from the end portion of the element 10 to at least a portion of the conductive adhesive material N from the outside of the element 10 in a plan view, and the conductive adhesive material N is directly applied to the element 10.

Specifically, as shown in FIG. 13, the supply nozzle 61 of the coating device 6 is a known precision nozzle having a tapered shape outside the vicinity of the discharge hole 61A, and the front end portion of the discharge hole 61A is processed into an extremely fine shape. In addition, the diameter of the discharge hole 61A of the supply nozzle 61 is about 0.1 mm to 0.2 mm (in detail, about 0.15 mm to 0.2) as described above, and the standard coating amount at a time is less than 1 cc (for example, , 0.3cc ~ 0.5cc).

However, the coating device 6 is a part of the radial direction of the discharge hole 61A of the supply nozzle 61 (shown as a thick dashed line in the same figure (a)) when the conductive adhesive N is applied in a plan view from the top, Positioning is performed so that the end (corner) of the element 10 protrudes, and at this position, the element 10 is coated with a conductive adhesive N. As shown in Figures (b) and (c), the element 10 is held by the suction nozzle 25 so that the lower surface becomes upward when mounted, and the coating device 6 is formed on the element by a supply nozzle 61 (discharge hole 61A) pair. After the center positions of the two electrodes 11 and 12 on 10 are shifted, and a part of the radial direction of the discharge hole 61A protrudes from the end (corner) of the element 10, the position is aligned. The nozzle 61 is lowered, and the conductive adhesive N is directly applied to the element 10.

Accordingly, the conductive adhesive material N is applied to the element 10 in such a manner that at least a portion thereof protrudes from the end portion (edge (corner portion) of the element 10) of the element 10 in a plan view (see FIG. (A)). Alternatively, the part of the conductive adhesive N protruding from the end of the element 10 is wrapped around at least the side surface of the element 10, and is coated from the lower side of the element 10 to the side surface (see FIG. (B)) or the same. Figure (c).

In this state, as shown in FIG. 14 (a), the suction nozzle 25 is reversed and moved to house the component 10 inside the mounting member 20, and the component 10 is bonded to the mounting member by the conductive adhesive N. 20 inside bottom surface and install this.

After accommodating the component 10 in the mounting member 20, as shown in Fig. (A), the conductive adhesive material N may be pressed by the suction nozzle 25 or the like before the conductive adhesive N is fixed. According to this, the remaining conductive adhesive material N protruding from the mounting surface of the element 10 is wrapped around the lower surface and the side surface of the element 10, and even when a gap is created between the lower surface of the element 10 and the mounting member 20, it can be closely contacted. Element 10 and mounting member 20.

Furthermore, even when the component 10 is housed in the mounting member 20 as shown in FIGS. (B) and (c), the portion coated with the conductive adhesive material N of the component 10 is lowered to the other side. The element 10 is inclined, and at the timing when the conductive adhesive N under the element 10 is in contact with the bottom surface of the mounting member 20, the element 10 may be released from the suction nozzle 25. According to this, the component 10 sinks due to its own weight, and the component 10 and the mounting member 20 can be brought into close contact.

In this way, even when a known supply nozzle (precision nozzle) 61 is used in this embodiment, the remaining conductive adhesive material N ( For example, the conductive adhesive material N) in an amount of about one-fourth of the coating amount (about 0.25 cc) is supplied to the outside of the element 10. Therefore, the conductive adhesive materials N protruding from the application area on the mounting surface can be prevented from contacting each other, and defects such as short circuits between the electrodes 11 and 12 can be prevented.

In addition, since the conductive adhesive N is supplied to the coating area in an almost complete manner, sufficient adhesiveness can be maintained, and the element 10 can be stabilized and supported. In addition, the remaining conductive adhesive N enters between the element 10 and the mounting member 20 and also contacts the side surface of the mounting member 20, so that the element 10 can be reliably joined to the mounting member 20.

Here, referring to FIG. 15, the known supply needle 70 and the precision nozzle 61 of this embodiment will be further described. The figure shows a state in which a conductive adhesive material N is supplied to the extremely small mounting member 20 on which the element 10 of this embodiment is mounted using a supply needle 70 (see (a)) and a precision nozzle 61 (see (b)). Side view.

In the conventional technology, when a conductive package N is supplied to a minute package (mounting member 20), a supply needle 70 having a long and narrow needle shape outside the vicinity of the ejection hole 70A is used to apply the mounting member 20 to the mounting member 20. The inner wall (side wall and bottom surface) is slanted, and the coating method is inserted (see (a)). However, since the supply needle 70 has a long and thin outer shape, the diameter of the discharge hole 70H is limited to maintain strength. That is, in the present situation, the precision nozzle 61 having a tapered tip shape The outer shape becomes larger, but the diameter of the discharge hole 61A can be reduced. That is, even if the supply needle 70 is inserted obliquely to the extremely small mounting member 20, it is extremely difficult to supply a small amount of the conductive adhesive N.

In addition, since the precision nozzle 61 having a tapered tip has a large outer size, when the conductive adhesive N is supplied to the extremely small mounting member 20, the side wall (side surface) of the mounting member 20 interferes with the precision nozzle 1, which is very It is difficult to bring the precision nozzle 61 close to a specific coating area inside the mounting member 20 (see Fig. (B)).

In this way, it is extremely difficult (or impossible) to apply the conductive adhesive material to the extremely small mounting member 20 on which the component 10 of this embodiment is mounted, even if it is either the supply needle 70 or the precision nozzle 61. N.

In this embodiment, instead of the mounting member 20, since the conductive adhesive N is directly supplied to the element 10, the problem of interference between the mounting member 20 and the precision nozzle 61 does not occur. Therefore, a supply nozzle (precision nozzle) 61 having a larger outer shape than the supply needle 70 (the discharge hole 61A is smaller than the supply needle 70) can be used.

In addition, as shown in FIG. 16, the supply nozzle 61 according to this embodiment includes, for example, a temperature adjustment mechanism 61H at the peripheral portion, and thereby the conductive adhesive N can be maintained at normal temperature (for example, about 25 ° C.). The temperature adjustment mechanism 61H may be a temperature adjustment mechanism capable of heating / cooling using, for example, a Peltier element, or a temperature adjustment mechanism for heating / cooling by using a heater such as a coil, water flow, or the like. .

Conductive adhesive N (for example, silver paste) It is kept in a frozen state, and is thawed during use, and is supplied at a normal temperature by a temperature adjustment mechanism 61H.

The supply nozzle (precision nozzle) 61 may be connected to the coating device 6 by a deformable pipe or the like. According to this, as shown in FIG. 11 (b), the pipe can be deformed so that the conductive adhesive N is supplied so that the front end of the supply nozzle 61 faces upward.

As described above, the coating device (coating unit) of this embodiment is described by taking the case where the conductive adhesive is coated on one element at a plurality of places (two places) by moving in the left and right directions (X, Y directions) as an example. However, for example, a plurality of (two) coating devices may be provided on the conveyance path of the element 10 of the second embodiment. At this time, the coating is applied at the first position by the first coating device, and thereafter, the element is moved and applied at the second position by the second coating device. With such a configuration, since it is not necessary to move the supply nozzle to the element 10, high-precision position alignment can be performed.

In this embodiment, the conductive paste is exemplified as the material of the conductive adhesive applied to the element 10, but it is not particularly limited thereto. For example, it may be a chemical material that is fully exhibited by the subsequent heating process.

Furthermore, even if a cleaning device is provided, the cleaning device has a cleaning surface formed by fibers or a grindstone, and comes into contact with the front end of the adsorption nozzle to periodically wipe the adhered conductive adhesive.

In addition, the component mounting device and the component mounting method of the present invention are not limited to the above-mentioned embodiments, as long as various changes can be made without departing from the gist of the present invention.

[Feasibility of industrial use]

The present invention can be widely used in the field of manufacturing electronic parts.

Claims (9)

An electronic component assembling device includes: a base (102); a rotating platform (130), which is arranged to rotate freely with respect to the base; and at least 3 or more component holding units (140), which are arranged along The rotating platform 130 is arranged in the circumferential direction; the suction nozzle (142) is provided on the component holding component and holds the component supplied to the component supply area; and the nozzle rotating unit is provided on the component. The holding unit rotates the suction nozzle about a horizontal axis by rotating the front end of the suction nozzle; the component supply device (110) is arranged below the component holding unit and supplies electronic components to the component supply area (103). A component; a mounting member supply device (170) which is arranged below the component holding unit and supplies the mounting member to a mounting area (105) where the component held by the suction nozzle is mounted; and coating A unit (116) is disposed above the component holding unit, and a coating area (104) between the component supply area and the mounting area is configured to pass the above The component held by the nozzle is coated with a bonding material. After the component is held by the suction nozzle in the component supply area, the component holding unit is moved from the component supply area to the coating area by a rotating platform. The nozzle rotation unit rotates the suction nozzle to raise the component, the component holding unit moves from the coating area to the mounting area through the rotation platform, and the nozzle rotation unit rotates the suction nozzle to cause the component decline. The electronic component assembling device according to claim 1, comprising: a first external spring device (150), which is fixedly arranged in the component supply area, applies external force to the component holding unit, and brings the suction nozzle close to The component in the component supply area; and a second external spring device (150), which is fixedly disposed in the mounting area, and applies external force to the component holding unit to bring the component held in the suction nozzle close to the component. The above mounting member. The electronic component assembling device according to claim 1 or 2, wherein the rotating platform stops the first to third component holding units with respect to the component supply area, the coating area, and the mounting area. The electronic component assembling device according to claim 1 or 2, wherein the nozzle rotation unit further rotates the adsorption nozzle around a vertical axis (θ direction). The electronic component assembling device according to claim 1 or 2, wherein the first and second external pressing devices move the suction nozzle in a vertical direction only by applying an external force to the component holding unit. The electronic component assembling device according to claim 1 or 2, wherein a camera (118) is arranged above the component supply area and the coating area, and the nozzle rotation unit is located at an imaging area reaching the camera. Previously, the suction nozzle was rotated to raise the component, and the position where the adhesive was applied to the component in the coating area was determined by the posture of the component being taken by the camera. The electronic component assembling device according to claim 1 or 2, wherein the above-mentioned element is any one of a quartz chip, a piezoelectric element, and a MEMS element. The electronic component assembling device according to claim 1 or 2, wherein the coating unit is configured to coat at least a part of the adhesive material from an end portion of the element in a plan view, and apply the adhesive to the element. material. The electronic component assembling device according to claim 1 or 2, wherein the coating unit coats the bonding material from a lower surface side to a side surface when the component is mounted.