TWI593046B - Bonding device and bonding method - Google Patents

Description

Bonding device and joining method

The present invention relates to a joining device and a joining method, and relates to a joining device and a joining method that do not require a change in the time-dependent change of a constituent member required for joining.

A part of a process of mounting a wafer (semiconductor wafer) on a substrate such as a wiring board and a lead frame, and assembling the package, has a bonding process of adsorbing and bonding the wafer from the wafer to the substrate.

During the bonding process, it is necessary to properly bond the bonding faces of the substrate. However, when the substrate surface is joined by a DAF (wafer fixing sheet), it is heated to a high temperature of about 80 to 160 °C. There are also heat generation and temperature changes from the drive unit that performs the XYZ axis operation. The change in the positional deviation of the constituent members or the like due to heating, the heat generation of the driving portion, and the change in the temperature of the atmosphere may occur. However, due to the problem of the structure of the bonding head, in one camera, both the wafer and the chuck, or both the substrate and the chuck cannot be viewed from directly above. Therefore, the wafer cannot be properly bonded to the mounting position.

A conventional solution to the above problem of changing over time The technique is as disclosed in Patent Document 1. As disclosed in Patent Document 1, as shown in Fig. 11, in order to simultaneously image a wafer and a substrate, the plurality of cameras 21a and 21b are tilted and an optical mirror having a transparent plate 12 and reflection films 12p and 12q provided on the transparent plate is used. A structure in which a wafer is mounted on a substrate. Further, since the symbols in the eleventh and eleventh drawings are the symbols of Patent Document 1, they have the same meanings as the symbols used in the embodiments and the drawings of the present invention, and the two are not identical.

In addition, the technique of viewing the wafer and the substrate simultaneously by one camera is not disclosed in Patent Document 2 of the prior art of Patent Document 1. Patent Document 2 discloses that, for example, an optical system including a half mirror and a vertical mirror is a technique in which a reflector is inserted between a wafer and a substrate, and the wafer and the substrate are simultaneously imaged from the front side.

[Practical Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-103667

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2000-244195

On the other hand, the development of a chip-on-chip layering technique by miniaturization and thinning of recent packages and chip-to-chip generation due to thinning of wafers is more severe in the bonding of wafers. The positioning is necessary.

The technique disclosed in Patent Document 1 occurs in a tilt imaging process by a meandering error in a transparent plate and a reflective film constituting an optical system. Further, since the wafer and the substrate can be simultaneously imaged as shown in Fig. 11, there is a problem that the mounting position accuracy cannot be obtained with certainty. Also, multiple cameras are necessary.

In Patent Document 2, the posture of the reflector changes due to the change in time caused by the high heat or the like of the drive mechanism that reciprocates the optical system, that is, the reflector, so that the position of the wafer and the substrate cannot be performed. Deviation from the problem of correctly detecting and failing to mount accurately.

In view of the above-described problems, the present invention provides a wafer bonding machine and a bonding method having high reliability, and it is possible to bond the wafer with high precision without being affected by changes in the time required for the constituent members at the time of bonding.

The present invention has the following features as an example in order to achieve the above object.

The bonding apparatus of the present invention includes a tool that can move and mount the wafer, and an imaging device that images the mounting position on which the wafer is placed from above. The tool is provided with a tool that can hold and hold the wafer. The chuck allows the imaging means to recognize the configuration of both the wafer held by the chuck and the placement position.

And the bonding method of the present invention has: sucking the wafer a step of lowering the chuck to be held from a substantially upper position toward a mounting position on which the wafer is placed; and a portion of the step of descending from the upper side of the wafer and the mounting position to image from directly above Camera steps.

Further, the bonding method of the present invention includes a step of lowering the chuck for holding and holding the wafer from a substantially upper position toward a mounting position on which the wafer is placed, and a step of lowering the wafer toward the mounting position by the chuck And an imaging step of the imaging means directly above the both of the placement positions from the upper side.

Further, in the chuck of the present invention, there is no possibility that the space between the imaging means and the wafer held by the tool hinders imaging. In one embodiment, the other side of the chuck that sucks the wafer is positioned at a position different from the line on which the tool can be placed, so that the wafer provided by the chuck can be identified by recognizing the camera. Observed morphology.

Further, the tool of the present invention further has a lifting mechanism for lifting and lowering the chuck, and the chuck may be located at a position different from the center of gravity of the center of gravity of the lifting mechanism.

The position where the chuck is located at a center of gravity different from the center of gravity of the lifting mechanism means that the chuck is located at a position different from the position of the center of gravity of the lifting mechanism by the chuck located in the lifting mechanism. The form of one is a form in which a crank can be exemplified. In other words, when one of the straight lines along the crank has an elevating mechanism, the other straight line along the crank is provided with a collet. Here, the length of the center of the crank may be shortened. That is, the straight line of the entrance in the crank and the straight line of the exit are parallel and do not cross each other.

Further, the tool of the present invention may be a chuck located at a position separated from a side portion where the chuck is lifted and lowered.

Further, the tool of the present invention may be a bonding head in which a wafer is pseudo-compressed at a mounting position, that is, a mounting position, and may further have a final pressing head for positively pressing a wafer that is falsely pressed.

Further, according to the present invention, when the wafer to be adsorbed on the chuck is placed on the placement position, the imaging means can capture the side of the wafer.

Further, in the present invention, when the wafer to be adsorbed on the chuck is placed on the placement position, the image pickup means may image the two opposite sides including the two corner portions of the wafer.

Further, the tool of the present invention may have a chuck winding means for rotating the chuck in a plane parallel to the position to be placed.

Further, according to the present invention, the image of the chuck that is sucked and held by the position of the wafer to be placed is corrected by the control device according to the image obtained by the image capturing step, and the wafer is placed in a predetermined place to be placed. The steps are also ok.

Further, in the moving step of the present invention, the tool is moved by a tool having a lifting mechanism for raising and lowering the chuck, and the wafer may be adsorbed by a chuck located at a position different from the center of gravity of the lifting mechanism.

Further, the step of lowering the present invention is a step of lowering the wafer by a bonding head which is falsely pressed to the mounting position, that is, the mounting position, and further has a method of positively pressing the wafer to be falsely pressed. The step of joining the formal press head is also possible.

Further, the imaging step in the step of descending the present invention may be a step of imaging one side of the wafer.

Further, the imaging step in the step of descending in the present invention may be a step of imaging the two opposite sides including the two corners of the wafer.

Further, the tool of the present invention may have a chuck winding means for rotating the chuck in a plane parallel to the placement position.

According to the present invention, it is possible to provide a wafer bonding machine and a bonding method having high reliability, and it is possible to bond the wafer with high precision without being affected by changes in the necessary constituent members over time during bonding.

11‧‧‧ wafer identification camera

12‧‧‧Supply stage

13‧‧‧ pick up head

13c‧‧‧ chuck

13m‧‧‧ Lifting Department

21‧‧‧Intermediate stage camera

22‧‧‧Intermediate stage

23‧‧‧ False press head

23a‧‧‧ Telescopic actuator

23b‧‧‧Rolling shaft

23c‧‧‧ chuck

23d‧‧‧Separation Department

23p‧‧‧Driver

23s‧‧‧Chuck Holder

23w‧‧‧The side of the body of the false press head

23k‧‧‧Attraction cable

23E‧‧‧ Lifting drive shaft

23H‧‧‧The body of the false press head

23T‧‧‧ Chuck revolving mechanism

25‧‧‧Rolling drive

31‧‧‧ Pressing camera

32‧‧‧Installation stage

33‧‧‧Formal compression head

33c‧‧‧ chuck

34‧‧‧ heating device

41‧‧‧Lower camera

100‧‧‧ wafer bonding machine

D‧‧‧ wafer (semiconductor wafer)

L‧‧‧Separation distance

P‧‧‧Substrate

Pm‧‧‧ substrate mark

W‧‧‧ wafer

θ d‧‧‧ wafer tilt

θ p‧‧‧ tilt of the substrate

[Fig. 1] A schematic side view showing a main part of an embodiment of a preferred wafer bonding machine of the present invention.

[Fig. 2] A schematic view showing an embodiment of a pickup head for picking up a wafer from a wafer.

[Fig. 3] A schematic view showing an embodiment of a final press-fit head for integrally pressing a wafer onto a substrate.

[Fig. 4] is a structural view showing an embodiment of the pseudo-compression head of the present invention in which a wafer is picked up from an intermediate stage, and a new wafer is pseudo-compressed on a substrate or a wafer which has been mounted.

[Fig. 5] shows another embodiment of the collet of the false press head of the present invention Example of the example.

[Fig. 6] A view showing an operational flow of the pseudo pressure combining head of the present invention.

[Fig. 7] (a) is an intentional view of the wrap of the wafer on the stage, and (b) is a view showing the deviation of the wrap of the substrate on the mounting stage 32.

[Fig. 8] A diagram showing the first half of the process of the entire wafer bonding machine of the present invention.

[Fig. 9] A view showing the second half of the process of the entire wafer bonding machine of the present invention.

[Fig. 10] A view showing an example of the chuck revolving mechanism of the present invention.

[Fig. 11] shows a diagram of a conventional technique.

Hereinafter, an embodiment of the present invention will be described using a drawing or the like. Further, the following description is only intended to illustrate the use of an embodiment of the present invention, and is not intended to limit the scope of the invention. Therefore, those skilled in the art can adopt embodiments in which these elements or all elements are equally replaced, and these embodiments are also included in the scope of the present invention.

Further, in the description of the drawings, the same reference numerals are attached to the components having the common functions, and the repetition of the description is avoided as much as possible.

Fig. 1 is a schematic side view showing a main part of a first embodiment of a preferred wafer bonding machine of the present invention. The wafer bonding machine 100 is The wafer D is picked up from the supply stage 12, once placed on the intermediate stage 22, and picked up again from the intermediate stage 22, and placed on the mounting stage 32 for bonding work, and falsely pressed (joined). After the final press-fitting, the device is mounted on the substrate P.

The wafer bonding machine 100 has the following three configurations and control devices 50 in addition to the configuration described later. First, the lower view camera 41 provided between the intermediate stage 22 and the mounting stage 32 observes the state of the wafer D adsorbed from the lower side in the movement of the dummy nip head 23 to be described later. Secondly, it is provided in the heating device 34 of the mounting stage 32, and it is easy to perform false pressing and final pressing by heating. Thirdly, the posture of the wafer D to be mounted can be corrected by the revolving drive device 25 that rotates the intermediate stage 22 by a surface parallel to the mounting surface. The control device 50 includes a CPU (central processor, central processor unit) not shown, a ROM (read only memory) stored in a control program, and a RAM for data storage (dynamic random access memory, The random access memory, the control bus, and the like control the elements constituting the wafer bonding machine 100, and perform the placement control described below. Further, the posture in the present invention is a posture in which the position and the rotation angle are defined.

First, the structure of the pickup head 13 shown in Fig. 2 and the processing generated thereby will be described. Fig. 2(a) is a side view of the pickup head 13, and Fig. 2(b) is a view showing the lift head 13m and the like removed from the pickup head 13 (the chuck 13c), and the wafer D is invisible from above. So it is shown by the dotted line. The pickup head 13 picks up the wafer D from the wafer W of the supply stage 12, and moves it on the path indicated by the one-point lock line shown in FIG. The sheet D is placed on the intermediate stage 22. The pickup head 13 is a lifting portion 13m that is raised and lowered along the guide rail 13g of the main body 13H, and the chuck 13c cannot be seen from directly above. Therefore, the camera 11 is recognized in advance by the wafer, and the picked-up wafer D (semiconductor wafer) is imaged from directly above, and the posture of the wafer D is detected. Based on the detection result, the posture of the pickup head 13 is corrected, and the wafer D is picked up. This posture places the wafer D on the intermediate stage 22. The chuck 13c is for adsorbing and detaching the wafer D by the adsorption holes, and the wafer D as a whole is adsorbed and held. In particular, in order to easily pick up a corrugated wafer having a thickness of, for example, 20 μm, the entire wafer is preferably adsorbed and held.

Next, before describing the dummy press-fit head 23 shown in Fig. 4 having the features of the present invention, the structure of the main press-fit head 33 shown in Fig. 3 and the final press-fitting process generated therefrom will be described. Fig. 3(a) is a side view of the main press-fit head 33, and Fig. 3(b) is a view showing the lifter 33m and the like removed from the upper press-fit head 33 (the chuck 33c), since the wafer D is It is not visible from the top and is shown by the dotted line. The dummy press head 23 is pseudo-compressed on the mounted stage 32 or on the wafer that has been mounted, and is moved toward the intermediate stage 22. Thereafter, the main press-fit head 33 is moved by the path indicated by the broken line shown in FIG. 1 toward the position of the pseudo-compressed wafer D, and is lowered by the chuck 33c. As shown in FIG. 3(b), since the pressing area of the chuck 33c is set to be sufficiently wider than the pressed area of the wafer D, the positioning accuracy of the final pressing head 33 can be made even if it is not strict. There is no need to correct the posture. Further, the chuck 33c is included, and it is not necessary to provide an adsorption mechanism in the main press head 33. Further, reference numeral 33H denotes a main body of the main press-fit head, and reference numeral 33g denotes a guide rail provided on the main body 33H, and 33m is A lifting portion that is fixed to the guide rail 33g of the main body 33H is displayed.

After the main press-fit head 33 is moved from the position of the wafer D which is formally pressed, the state of the wafer D which is formally pressed is imaged and inspected by the press-fit camera 31. When an abnormality such as cracking of the wafer D occurs, the subsequent processing of the next substrate P is performed without performing the lamination processing. Further, the camera and the press-fit camera 31 may be separately provided during the inspection. In addition, in the first figure, since the wafer D is stacked one on another at three positions of one substrate P, the dummy nip head 23 to be described later moves to the right end of the mounting stage 32. The order is placed in 3 places. Further, the moving position of the right end of the main press-fit head 33 is a retracted position when the pseudo-compression head 23 falsely presses the substrate P at the right end.

Next, the structure of the joint head shown in Fig. 4 having the feature of the present invention, that is, the pseudo-nip head 23, and the process generated therefrom will be described. Fig. 4(a) is a view showing the structure of the elevation drive shaft 23E that raises and lowers the chuck 23c. Fig. 4(b) is a view of the chuck 23c and the chuck holding portion 23s as seen from the arrow A side in Fig. 4(a). Fig. 4(c) is a view in which the wafer D and the chuck 23c are imaged from above by the recognition camera when the wafer D is picked up from the intermediate stage 22. In Fig. 4(c), the left and right sides of the wafer D can be identified.

The squeezing head 23 includes a main body 23H and an elevating drive shaft 23E that elevates and lowers the chuck 23c. The main body 23H has a head unit that moves toward the conveyance direction (X direction) of the substrate P shown in FIG. Y drive shaft (not shown) and Y moving in the Y direction connecting the intermediate stage 22 and the mounting stage 32 which are perpendicular to the conveyance direction (X direction) Drive shaft (not shown). The false press head 23 does not have a rotation angle in the XY plane of the correction wafer D, that is, an inclined rotation axis. The correction of the tilt is performed by the winding of the intermediate stage 22. In the present embodiment, the simplification of the control when the pseudo-compression head 23 does not have the winding axis can be achieved when the substrate P is falsely pressed.

The lift drive shaft 23E moves up and down along the guide rail 23g provided on the side portion 23w of the main body 23H of the dummy press head 23. The lift drive shaft 23E has a chuck 23c provided at its tip end and having an adsorption hole for sucking the wafer D, and a chuck holding portion 23s for holding the chuck 23c; and a guide 23g fixed to the body 23H. The moving lifting portion 23m; and the L-shaped separating portion 23d that is separated from the side portion 23w that raises and lowers the lifting portion 23m of the chuck 23c by only the separation distance L. In the chuck 23c and the chuck holding portion 23s, in order to adsorb the wafer D, there is an adsorption hole that communicates with the suction device (not shown) through the suction cable 23k. Further, in the present embodiment, the shape formed by the separating portion 23d and the chuck holding portion 23s has a shape such as a crank that optimally transmits the false pressing force, but is not necessarily limited to the above shape. It is important that the chuck 23c is separated only by the predetermined separation distance L.

The separation distance L is, for example, a structure in which the pseudo-compression head 23 can be avoided when the wafer D is picked up from the intermediate stage 22 by the pseudo-compression head 23, and can be fixed to the intermediate stage 22 by the intermediate stage 22 The intermediate stage camera 21 directly above is the distance at which both the wafer D and the chuck 23c are simultaneously imaged. Moreover, the separation distance L is a substrate P which is pseudo-compressed by the dummy pressing head 23 on the mounting stage 32 or has been mounted. In the case of the wafer D, the structure of the pseudo-compression head 23 which is an obstacle can be avoided, and the press-fit camera 31 which is moved toward the pseudo-pressing (mounting) position can complete the substrate P or has been mounted. The distance between the wafer D and the new wafer D (the chuck 23c) can be simultaneously captured. Further, each time the substrate P transported onto the mounting stage 32 is one, the press-fit camera 31 is fixed. For example, obstacles, such as lifts and rails. The false press head 23 has the same structure as the pick-up head 11 shown in Fig. 2, but the intermediate head camera 21 and the press camera are attached to the side portion 23w as shown in Fig. 2 The field of view of 31 is shielded by the lifting portion 23m and the guide rail 23g.

In the chuck 23c, when the wafer D is sucked, the intermediate stage camera 21 or the press camera 31 (the camera or the imaging means) can recognize the position of the wafer D with respect to the chuck 23c when viewed from directly above. The construction of the posture. The identifiable structure refers to a structure in which at least one side of the wafer D enters the field of view of the camera when viewed from the upper side when the chuck 23 is held by the wafer D. The identifiable structure refers to a portion of the wafer D exposed from the chuck 23c when the camera is seen from the upper side of the wafer toward the lower side, and the wafer 23 that is held by the wafer D is viewed from above. A configuration in which two or more sides of D enter the field of view of the camera is preferred. For example, in Fig. 4(c), the two sides of the relatively short side of the wafer D can be seen. Others, for example, have a configuration in which the 2 to 4 corners of the wafer D can be seen as shown in FIGS. 5(a) and 5(b), or as shown in FIG. 5(c), the wafer D The four sides can be seen in the structure and so on. Moreover, the chuck holding portion 23s and the chuck 23c In the case where the cross-sectional shape is the same, the relationship between the wafer D and the wafer D is made clear, and a flat plate having two sides larger than the chuck 23c and shorter than the long side of the wafer D is provided on the upper portion of the chuck 23c, and the above character is replaced. It is also possible to perform the chuck 23c.

When the wafer D is adsorbed, the chuck holding portion 23s and the separation portion 23d have a size in which the wafer D does not become obstructed by the posture recognition of the chuck 23c when viewed from directly above. For example, the vertical and horizontal dimensions of the cross-sectional area of the collet holding portion 23s and the separation portion 23d in parallel with each other are smaller than the vertical and horizontal dimensions when the chuck 23c is viewed from above.

Next, the wafer D is picked up from the intermediate stage 22 by the dummy nip head 23, and the operation flow necessary for the dummy pressing on the mounting stage 32 will be described using FIG.

First, in the first drawing, when the substrate P is transported onto the mounting stage 32, as shown in Fig. 7(a), the mounting position and the pasting of the wafer D on the substrate P indicated by the reference mark are attached. The chuck 23c at the mounting position or the mounting position is simultaneously imaged from the upper side by the single press camera 31, and the rotation angle of the substrate P with respect to the chuck is also detected as the inclination θp (step S1). Further, the corner mark shown in Fig. 7(b) is only an example of the substrate mark Pm, and the position where the wafer D is placed on the substrate P can be displayed. As shown in Fig. 7(b), the dummy nip head 23 is moved right above the wafer D placed on the intermediate stage 22 (step S2). The wafer D placed on the intermediate stage 22 and the chuck 23c which is lowered directly above the wafer D are simultaneously imaged from one directly by the intermediate stage camera 21, and the wafer D is detected for the chuck. The rotation angle of 23c is also the inclination θ d (step S3). The inclination of the wafer D on the intermediate stage 22 is such that the inclination θ p of the substrate P on the mounting stage 32 is reversed (θ p - θ d ) (step S4). Further, the inclinations θ p and θ d and the angle (θ p - θ d) in the steps S1, S2, and S4 are positive from the recognition clock seen by the recognition camera. In steps S1 and S3, it is detected that the inclination of the rotation angle and the position of each of the center positions of the substrate P and the wafer D are deviated from the position of the center position of the chuck 23c.

Next, the dummy press head 23 is lowered to adsorb and hold the wafer D (step S5). As a result, the dummy nip head 23 adsorbs and holds the wafer D by the inclination θ p of the substrate P. Thereafter, the dummy nip head 23 is moved upward above the substrate P on the mounting stage 32 (step S6). In steps S1 and S3, the inclination of the rotation angle and the position of each of the center positions of the substrate P and the wafer D from the center position of the chuck 23c are detected, and the positional deviation may be corrected during the movement.

Then, both of the wafer D adsorbed and held by the pseudo-compression head 23c and the substrate mark Pm on the substrate are simultaneously imaged from the upper side by the press-fit camera 31, and the corners of the wafer D are simultaneously The pseudo-compression head 23 is moved in the XY direction so that the corner portions of the substrate mark Pm match each other, and the pseudo-compression is performed (step S7). For example, when both the wafer D and the substrate symbol Pm on the substrate P are simultaneously imaged from the oblique direction, an error caused by the tilt occurs, and the position cannot be accurately aligned by a unit of several μm. After the false pressing, the false pressing head 23 is again moved directly above the intermediate stage 22 (step S8)

Thereafter, although the new wafer D is placed on the wafer D into the lamination process, However, since the laminate of the wafer D is inclined so as to become the inclination θ p of the substrate P, the substrate P is replaced with the wafer D to be mounted and the processing of steps S2 to S8 is repeated until the predetermined number of layers is formed (step S9).

In general, in the process shown in the sixth embodiment, the positional shift of the intermediate stage camera 21, the press-fit camera 31, the pseudo-compression head 23, and the like, and the change in the rotation angle and the like occur with time.

However, according to the above-described embodiment, it is possible to detect the posture of the wafer D with respect to the mounting position which changes with time by the component which changes with time, and it is possible to directly recognize the camera (imaging means) from one above. From time to time, the placed wafer D and the mounting position are often placed on the side of the feedback.

Therefore, according to the present embodiment described above, even if the constituent elements constituting the first embodiment change over time, they are not affected, and the wafer can be correctly attached to the mounting position.

According to the present embodiment described above, between the intermediate stage camera 21 and the intermediate stage 22 of one unit, and between the press camera 31 and the mounting stage 32 of one unit, optical for imaging is not provided. Therefore, there is no positional deviation caused by the optical system, and it can be correctly mounted.

Next, the entire process of the wafer bonding machine 100 will be described with reference to FIGS. 8 and 9. In the eighth and ninth drawings, for the sake of easy understanding, an example in which the mounting position of only one of the substrates P is different from that of the first embodiment is used. In the following description, the processing in each stage will be described in each step shown in the drawing. In Figure 8 and Figure 9, in When there is an arrow under each camera, it is displayed that the camera is performing imaging processing.

Figure 8 (a):

In the mounting stage 32, the chuck 23c is moved right above the conveyed substrate P, and the image is detected by the press camera 31, and the state of the substrate P is inspected, and the process of step S1 of FIG. 6 is performed to detect the substrate. The rotation angle is also the inclination θ p .

In the supply stage 12, the wafer D is picked up from the wafer W by the pickup head 13, and placed on the intermediate stage 22.

Figure 8 (b):

In the intermediate stage 22, the chuck 23c is moved right above the wafer D to be placed, and the intermediate stage camera 21 performs the process of step S3 of Fig. 6, and the rotation angle of the wafer D is also detected as the inclination θ. d.

In the supply stage 12, the pickup operation of the next wafer D is carried out by the pickup head 13 returned to the supply stage 12.

Further, in the mounting stage 32, if the wafer D is present as indicated by a broken line, the main pressing head 33 performs the final pressing.

Figure 8 (c):

In the intermediate stage 22, according to the processing of step S4 of Fig. 6, the intermediate stage 22 is rotated by the revolving drive unit 25 (θ p - θ d ) to perform θ correction.

Further, when the mounting stage 32 is subjected to the final press-fitting by the eighth drawing (b), after the end of the process, the press-fit camera 31 captures the pressed state and moves toward the retracted position. When an abnormality is detected, the subsequent lamination processing is aborted.

Figure 9 (d):

In the intermediate stage 22, the process of step S5 of Fig. 6 is performed, and the wafer D is adsorbed and held by the tilt θp of the substrate P by the dummy nip head 23.

Figure 9 (e):

In the intermediate stage 22, the process of step S6 of Fig. 6 is performed, and the wafer D is picked up by the dummy nip head 23 and directed toward the mounting stage 32. In the middle, the wafer D is imaged from below by the lower-view camera 41, and the inclination θ p of the wafer is confirmed, and the presence or absence of the adsorption holding state and the garbage may be grasped.

In the supply stage 12, the next wafer D picked up is transported toward the intermediate stage 22.

Figure 9 (f):

The next wafer D is placed in the intermediate stage 22 by the pickup head 13.

In the mounting stage 32, the wafer conveyed by the dummy nip head 23 is placed on the substrate P or has been mounted by the dotted line in accordance with the processing of step S7 of Fig. 6 by the press-fit camera 31. Displayed on wafer D.

After the processing of Fig. 9(f), the layering process is entered, and the process returns to the eighth drawing (b) of the final pressing. In this case, in the mounting stage 32, the wafer D shown by the broken line in FIGS. 8(a) to 9(e) is a solid line. When the predetermined number of layers is formed, the processing proceeds to the new substrate to be transported or the substrate of the adjacent production line in Fig. 1, and therefore returns to Fig. 8(a).

Further, for example, the load of the false press-fitted false-compression head (Light Place Load) is 0.5 to 2 [N] (Short Place Time: 0.1 to 0.5 [s]), and the formal pressure of the final press-fit The Heavy Place Load is 1~70[N] (Heavy Place Time: 0.5[s] or more).

According to the embodiment described above, the positional alignment of the false presses does not need to be placed on the intermediate stage as in the conventional posture of arranging the wafer, or the posture of the wafer is detected by the lower view camera, but It is only necessary to perform the positional alignment of the mounting stage, so that the mounting time of the entire wafer bonding machine can be reduced.

Next, a second embodiment of the preferred wafer bonding machine of the present invention will be described. The point different from the first embodiment of the present embodiment is that the first is the pseudo-compression head 23, the second is the change of the control method of the operation of the pseudo-compression head 23 with the first change, and the accompanying intermediate stage 22 Changes.

In the first embodiment, the dummy press head 23 does not have a function of rotating the chuck 23c. In the present embodiment, the chuck revolving mechanism 23T is provided in the dummy nip head 23 in such a manner that the rotation angle correction can be performed simultaneously with the positional deviation correction in the X and Y directions. Chuck revolving mechanism 23T, is in the fake Before the press-fitting or before the false press-fitting, the press-fit camera 31 can perform the chuck 23c in a state where the substrate P or the wafer D that has been mounted and the wafer D adsorbed by the chuck 23c are often imaged at the same time. Revolve around. When the wafer D adsorbed and held by the chuck 23c is approached from above the substrate P or the wafer D that has been mounted, or in the vicinity of the contact, the camera 31 is pressed, and the chuck 23c can be adsorbed from time to time. Both the wafer D and the substrate P or the wafer D that has been mounted are imaged.

Fig. 10 is a view showing an example of a condition that satisfies such a condition, that is, 23T of the chuck revolving mechanism. The chuck revolving mechanism 23T is a field B shown by a broken line in Fig. 4 in Fig. 4(a), and is supported by the separating portion 23d by a mechanism (not shown).

The chuck revolving mechanism 23T has a winding shaft 23b extending from the axial center of the chuck holding portion 23s, and a surface parallel to the suction surface of the chuck 23c from both ends of the winding shaft 23b. The two ends are two drive levers 23p that are perpendicularly disposed around the rotating shaft 23b, and two telescopic actuators 23a that extend and contract the two drive rods 23p.

In this mechanism, by expanding and contracting the two telescopic actuators 23a in opposite directions to each other, the center of the shaft of the chuck holding portion 23s, that is, the center of the suction area of the chuck can be rotated, and the rotation angle can be easily adjusted. .

In the present embodiment, by having the chuck rewinding mechanism 23T, in the mounting position, the substrate P or the mounted wafer D and the chuck 23c can be adsorbed by one press camera 31. The wafer D is often imaged from the top side, and the position and the rotation angle of the chuck 23c are controlled and mounted. Therefore, in this embodiment, it is not necessary to be placed in advance. The inclination θ p of the substrate P and the inclination θ d of the wafer D of the intermediate stage 22 are detected, and it is not necessary to perform the rotation angle correction by the intermediate stage 22 . Therefore, in the present embodiment, the orbiting drive unit 25 of the intermediate stage 22 is also unnecessary.

According to the embodiment described above, by using the dummy press-bonding head 23 of the present embodiment, the substrate P or the wafer D to be mounted and the new wafer D (the chuck 23c) are often simultaneously The imaging and the rotation angle correction can also be performed simultaneously with the positional deviation correction in the X and Y directions. Along with this, even if the rotation angle of the substrate P is not detected in advance, that is, the inclination θ p and the rotation angle of the wafer D of the intermediate stage 22 are the inclination θ, and the rotation by the intermediate stage 22 is possible. Angle correction is also unnecessary, so a reduction in man-hours can be achieved.

Further, in the present embodiment described above, the constituent elements constituting the first embodiment are changed over time, because the substrate P or the wafer D to be mounted and the new wafer can be placed in the mounting position. D (the chuck 23c) is constantly imaged at the same time, and the new wafer D is brought to the mounting position, and the chuck 23c is controlled. Therefore, it can be mounted without being affected by changes over time.

Further, in the present embodiment described above, the pseudo-compression is also different from Patent Document 2 in which only the state position shown in Fig. 11 is possible, since the substrate P or the wafer D to be mounted can be used. The newly mounted wafer D is often imaged from directly above, and the positions of the two are aligned, so that it can be mounted with high precision.

That is, because the chuck holds the held wafer until it is loaded Before the contact with the wafer is placed, the camera included in the camera can be imaged from both the front side of the wafer and the place where the wafer is placed. Therefore, the position error caused by the tilt does not occur, and the image can be taken. The focus is on the camera. Further, as described above, after the chuck for holding and holding the wafer is brought into contact with the place where the wafer is placed, it is necessary to correct the positional relationship between the wafer and the place where the wafer is placed, in accordance with the image captured by the camera included in the camera. In the case of the control device, the image of the wafer and the place where the wafer is placed is compared with the image of the wafer and the place where the wafer is placed, and the position of the wafer and the place where the wafer is placed is determined. The position of the wafer may be corrected by changing the value above or below. This is because the wafer adsorbed to the chuck can be corrected by contact with the position of the place where the wafer is placed, and the wafer can be adsorbed on the chuck and the distance at which the wafer is placed can be prevented from deviating. The effect of the correction.

In the first and second embodiments described above, an example of a wafer bonding machine having an intermediate stage and performing false pressing and final pressing is shown. For example, the bonding head of the present invention can be attached to the wafer and the mounting position while being viewed from the top of the identification camera by the identification camera, and the bonding head of the present invention can be applied to the patent document. The placement of the positive and negative bonding machine shown in 2 and the receipt of the wafer.

22‧‧‧Intermediate stage

23‧‧‧ False press head

23c‧‧‧ chuck

23d‧‧‧Separation Department

23E‧‧‧ Lifting drive shaft

23g‧‧‧rail

23H‧‧‧The body of the false press head

23k‧‧‧Attraction cable

23m‧‧‧ Lifting Department

23s‧‧‧Chuck Holder

23w‧‧‧The side of the body of the false press head

D‧‧‧ wafer

Claims (16)

A bonding apparatus includes: a tool that can move and mount a wafer, and an imaging device that images a mounting position on which the wafer is placed from above; the tool includes a device that can hold and hold the wafer The chuck allows the image pickup means to recognize both the wafer held by the chuck and the placement position; and the chuck is configured to mount the wafer adsorbed on the chuck at the placement position; The imaging means can image one side of the wafer or two opposite sides including two corners of the wafer. The bonding apparatus according to claim 1, wherein the chuck has a form in which a space between the imaging means and the wafer held by the tool is prevented from being imaged. The joining device according to claim 1, wherein the tool further includes a lifting mechanism that moves the chuck up and down, and the chuck is located at a center of gravity different from a center of gravity of the lifting mechanism. The joining device according to claim 1, wherein the tool is a chuck located at a position separated from a side portion where the chuck is raised and lowered. A joining device according to any one of claims 1 to 4, wherein The tool is a bonding head in which the wafer is falsely pressed to the mounting position, that is, a mounting position, and further has a final pressing head for positively pressing the wafer that is falsely pressed; the pressure of the front pressing head The combined area is larger than the pressed area of the aforementioned wafer. The bonding apparatus according to any one of claims 1 to 4, wherein the wafer is placed on a substrate or a wafer mounted on the substrate, and the substrate has a plurality of the mounting positions. The joining device according to claim 6, wherein the tool has a chuck revolving means for rotating the chuck in a plane parallel to the mounting position. The joining device of claim 7, wherein the chuck winding means has: a rotating shaft rod extending from a shaft center of the chuck holding portion; and the chuck at the both ends of the winding shaft The two adsorption rods are provided in the plane parallel to the adsorption surface, and the two drive rods are disposed perpendicularly to the rotation axis rods, and the two telescopic actuators that respectively extend and contract the two drive rods. A bonding method includes a step of lowering a chuck for holding and holding a wafer from a substantially upper position toward a mounting position on which the wafer is placed, and a step of lowering the step by the step of positioning the wafer and the mounting position Photographed by the camera directly above the camera In the image capturing step, one side of the wafer or two opposite sides including the two corners of the wafer are imaged. The bonding method according to claim 9, further comprising: correcting a position of the chuck that adsorbs and holds the wafer by a control device with respect to a position at which the wafer is to be placed, according to an image obtained by the image capturing step The step of placing the wafer on a predetermined place to be placed. The joining method of claim 9, wherein the moving step is a step of moving a tool having a lifting mechanism that raises and lowers the chuck, and is located at a center of gravity different from a center of gravity of the lifting mechanism The aforementioned chuck of the position adsorbs the aforementioned wafer. The joining method according to any one of claims 9 to 11, wherein the step of lowering is a step of lowering the bonding head produced by falsely pressing the wafer to the mounting position, that is, the mounting position. Further, there is further provided a step of bonding the dummy wafer to be positively pressed by a formal press-fitted press-bonding head; the press-bonding area of the final press-bonding head is larger than the pressed-bonded area of the wafer. The bonding method according to any one of claims 9 to 11, wherein the wafer is placed on a substrate or a wafer that has been mounted on the substrate, before The substrate has a plurality of the above-described placement positions. The joining method of claim 13, wherein the placing step is performed by a chuck winding means in a plane parallel to the adsorption surface of the chuck according to the image obtained by the image capturing step The chuck is rotated to correct the position of the chuck, and the wafer is placed in a predetermined place to be placed. The joining method of claim 14, wherein the chuck winding means has: a rotating shaft rod extending from a shaft center of the chuck holding portion, and the chuck at the both ends of the winding shaft The two adsorption rods are provided in the plane parallel to the adsorption surface, and the two drive rods are disposed perpendicularly to the rotation axis rods, and the two telescopic actuators that respectively extend and contract the two drive rods. A bonding method comprising: (a) a step of picking up a wafer to move the wafer to a substrate on which the wafer is placed, or a wafer to be mounted; and (b) a chuck for holding and holding the wafer a step of lowering the head from the upper side toward the placement position; (c) an imaging step of imaging from directly above by an imaging means located directly above both the wafer and the placement position; (d) according to the imaging step The obtained image is wound around the chuck in a plane parallel to the adsorption surface of the chuck by a chuck winding means, and the position of the chuck is corrected to falsely press the wafer to a predetermined load. a step of placing the place; and (e) a formal press-fitting by positively pressing the previously pressed wafer a step of bonding the head; the imaging means imaging one side of the wafer or two opposite sides including the two corners of the wafer; and performing the above (a) to (e) on the plurality of mounting positions of the substrate Steps to join.