TWI673799B - A molding structure of molding resin type module and molding method thereof - Google Patents

Abstract

A packaging structure and a packaging method for a mold-sealing resin-type module include preparing a circuit substrate, forming a circuit pattern layer and a plurality of electrical contacts on at least one surface; applying an insulating layer to the circuit pattern layer, Avoid the placement of electrical contacts and electronic components, so that a gap is formed between the bottom of the electronic components and the circuit board; solder the electrical pins of the electronic components to the electrical contacts, and the soldering area PAD of the electrical contacts is reduced. Up to 85% ~ 95% of the component soldering area; and heating the sealing resin material to cover the exposed surfaces of the electronic components and circuit substrates to form a packaging module, in which the molding resin material can flow into the gap at the bottom of the electronic component and be covered with solder to prevent packaging In the process, the solder melts and overflows the electrical contacts, which solves the short circuit problem caused by the spilled tin during the conventional packaging process.

Description

Packaging structure of sealing resin module and packaging method

The invention relates to a circuit substrate structure used for a molding resin type module and a packaging method thereof, and more particularly, to a circuit that is not prone to cause short circuit and overflow of tin in electrical contacts of the circuit substrate during a resin packaging module packaging process. Circuit substrate structure and method for packaging circuit substrate.

In view of the miniaturization of electronic devices, the internal semiconductors, electronic components or electronic circuits are packaged into modules, and the current packaging technology is moving towards high density, miniaturization and high performance for stable development. The encapsulation technology of the molding resin type module is a technology that uses semiconductor materials such as epoxy resin to encapsulate semiconductors, electronic components or electronic circuits into modules. This technology uses resin encapsulation. In a manufacturing process or a transfer molding process, a resin material such as an epoxy resin is heated and melted, and then sealed in a module mold, and then it is hardened to form a module.

However, during the hot-melt encapsulation of the mold-sealing resin material, the solder on the electrical contacts of the circuit board of the packaged module is often re-melted due to heating, resulting in tin overflow between adjacent electrical contacts on the circuit board. Causes short-circuit phenomenon, which is especially easy to occur under the surface mount soldering parts (SMD) using surface mount soldering technology (SMT). As shown in Figure 1, it is the traditional mold-sealing resin module. A schematic side view of a circuit board and an SMD component.

In addition to the circuit pattern layer and the electrical contacts 11 distributed on the surface of the conventional SMT circuit substrate 10, an insulating solder resist layer 12 is also coated. The insulating solder resist layer 12 covers almost the entire area except that the electrical contacts 11 are avoided. The circuit substrate allows the solder to stay on the electrical contact 11 only to prevent short circuit caused by the solder overflow. However, because the size of the SMD element 13 (such as resistance, capacitance, inductance, etc.) is quite small, or when the SMD element is an integrated circuit (IC) element 14, the distance between adjacent electrical pins 15 is quite close, and the SMD element 13 or the IC component 14 will be close to the surface of the circuit substrate 10. When the molding resin is manufactured, the molding material 16 will be blocked and stay at the periphery of the SMD component 13 or the IC component 14. The solder on the point 12 will melt due to heating, so that the solder 17 is squeezed by the molding material 16 and overflows the electrical contact 12 along the lower side of the SMD component 13 or the periphery of the IC component 14, instead, it will cause the solder 17 to stay at The insulating solder resist layer 12 often causes short circuits due to solder 17 overflowing between the adjacent electrical contacts 12 of the circuit board 10.

In view of the shortcomings of the above-mentioned conventional technologies, the main object of the present invention is to provide a packaging structure and a packaging method for a mold-sealing resin module, which can fill the bottom of the SMD component with the mold-sealing resin and prevent the solder from melting during the packaging process. The electrical contacts are overflowed, which can solve the short circuit problem caused by the overflow of tin during the conventional packaging process.

In order to achieve the above object, the main technical feature of the present invention is to provide a packaging structure of a mold-sealed resin module, which includes a circuit substrate, at least one surface of which has a circuit pattern layer and a plurality of electrical contacts, for the The electrical pins are soldered to the electrical contacts; an insulating layer is distributed over the On the electronic circuit layer, but avoid the placement of electrical contacts and electronic components, so that a gap is formed between the bottom of the electronic component and the circuit substrate; and a mold resin material covers the exposed surfaces of the electronic component and the circuit substrate, forming a A packaging module, in which a molding resin material can flow into a gap at the bottom of an electronic component and be covered with solder.

In order to achieve the above object, a second technical feature of the present invention is to provide a method for packaging a mold-sealing resin module, the steps of which include: preparing a circuit substrate, forming a circuit pattern layer and a plurality of electrical contacts on at least one surface; Apply an insulating layer to the circuit pattern layer to avoid the placement of electrical contacts and electronic components, so that a gap is formed between the bottom of the electronic component and the circuit substrate; the electrical pins of the electronic component are soldered to the electrical connection with solder Point; and heating the sealing resin material to cover the exposed surface of the electronic component and the circuit substrate to form a packaging module, wherein the sealing resin material can flow into the gap at the bottom of the electronic component and be covered with solder.

In order to achieve the above object, another technical feature of the present invention is to provide a packaging structure and a packaging method for the above-mentioned mold-molded resin module, wherein a soldering area PAD of an electrical contact on a circuit substrate is reduced to 85% of an electronic component soldering area. ~ 95%.

10‧‧‧SMT circuit board

11‧‧‧ Electric contact

12‧‧‧Insulation solder mask

13‧‧‧SMD components

14‧‧‧Integrated Circuit (IC) Components

15‧‧‧electric pin

16‧‧‧Moulding material

17‧‧‧ Spill Tin

20‧‧‧circuit board

21‧‧‧Circuit pattern layer

22‧‧‧electric contact

30‧‧‧ Insulation

31‧‧‧ Placement of electronic components

40‧‧‧Electronic components

41‧‧‧electric pin

42‧‧‧Gap

45‧‧‧Soldering

50‧‧‧sealing resin material

FIG. 1 is a schematic side view of a circuit board and an SMD component of a conventional resin-molded module.

Fig. 2 is a schematic side view of a part of a circuit board of the present invention.

FIG. 3 is a schematic side view of a part of a circuit board coated with an insulating layer according to the present invention. Illustration.

FIG. 4 is a schematic side view of a part of a circuit board provided with electronic components according to the present invention.

FIG. 5 is a schematic side view of the present invention encapsulating a circuit substrate with a mold-sealing resin material into a packaging module.

In order to allow your reviewers to further understand the technology, means and effects adopted by the present invention to achieve the intended purpose, please refer to the following detailed description and accompanying drawings of the present invention. I believe that the purpose, features and characteristics of the present invention can be derived from this. A thorough and specific understanding is obtained, however, the drawings are provided for reference and description only, and are not intended to limit the present invention.

Please refer to FIG. 2 to FIG. 5 for examples of the packaging process of the mold-sealing resin module of the present invention. First, please refer to FIG. 2, which is a schematic side view of a part of the circuit substrate of the present invention. The packaging structure of the mold-sealed resin-type module of the present invention includes a circuit substrate 20, and the material of the circuit substrate 20 may include a FR-4 substrate material, a FR-5 substrate material, or a BT Flip Chip substrate material. A circuit pattern layer 21 is distributed on at least one surface of the circuit substrate 20. The circuit pattern layer 21 includes a plurality of electrical contacts 22. The circuit pattern layer 21 is formed by etching a metal layer on the circuit substrate 20. The material of the metal layer may be copper (Cu), but the present invention is not limited to this material. The circuit substrate of the present invention may be a single-sided printed circuit board with a circuit pattern layer on one side, or a double-sided printed circuit board with a circuit pattern layer on both sides, or a multilayer printed circuit with multiple circuit pattern layers.

Next, please refer to FIG. 3, which is a schematic side view of a part of a circuit substrate coated with an insulating layer according to the present invention. In the present invention, a circuit substrate 20 is coated on the circuit pattern layer 21 The edge layer 30, and the insulating layer 30 avoids the electrical contact 22 and the placement position 31 of the electronic component, so that when the electronic component is placed on the circuit substrate 20, a gap is formed between the electronic component and the circuit substrate 20. The material of the insulating layer 30 may be formed of polyimide, polyethylene naphtalate, or polyethylene terephthalate. The insulating layer 30 can limit the solder to stay on the electrical contact 22 and prevent the solder from exceeding the welding range of the electrical contact 22.

Next, please refer to FIG. 4, which is a schematic side view of a part of a circuit board provided with electronic components according to the present invention. The present invention then places the electronic component 40 on the circuit substrate 20, and the electrical pin 41 of the electronic component 40 is placed on the electrical contact 22, and the electrical pin 22 is soldered on the electrical contact 41 with solder 45. In the present invention, In the embodiment of the present invention, a surface-mount technology (SMT) can be used to pass the circuit substrate 20 configured with the electronic component 40 through a tin furnace, that is, all electrical pins 22 can be soldered to the electrical contacts 41 by solder 45, and The electronic component can be a surface-mount device (SMD) resistor, capacitor, inductor, or integrated circuit (IC). As shown in FIG. 4, because the electronic component 40 is placed without the insulating layer 30, when the electronic component 40 is placed on the circuit substrate 20, there will be a gap 42 between the bottom of the electronic component 40 and the circuit substrate 20. This gap 42 can be filled with molding material.

Finally, please refer to FIG. 5. FIG. 5 is a schematic side view of the present invention encapsulating a circuit substrate with a mold-sealing resin material into a packaging module. In the present invention, at least part of the exposed surfaces of the electronic components 40 and the circuit substrate 20 is covered with a mold-sealing resin material 50, such as an epoxy resin (Resin) material, which becomes a liquid after heating, to form a package. Module. In the embodiment of the present invention, a mold (not shown) can be prepared first, the circuit substrate 20 on which the electronic component 40 is arranged is placed in the mold, and the mold-sealing resin material 50 is heated and melted into a liquid state and poured into the mold. Waiting in the mold After cooling, the mold sealing resin material 50 is hardened to form a packaging module.

In the embodiment of the present invention, the insulation layer 30 on the circuit substrate 20 of the present invention is different from the conventional insulation layer in that the conventional insulation layer only avoids uncoated electrical contacts. In addition to the electrical contact 22, the insulating layer of the present invention avoids the placement position of the electronic component 40. Therefore, the bottom of the electronic components 40 does not have the insulating layer 30. Therefore, the bottom of the electronic component 40 and the circuit substrate 20 may A gap 42 is formed. When the liquid molding resin material 50 covers the exposed surfaces of the electronic component 40 and the circuit substrate 20, the liquid molding resin material 50 flows into the above-mentioned gap 42, so that the electrical pins or contacts 22 are made. The solder 45 on the upper side is covered by the mold sealing resin material 50.

In addition, the present invention is different from the traditional one in that the soldering area (PAD) of the electrical contacts 22 on the circuit substrate 20 is smaller than the soldering area of the electrical pins 41 of the electronic component 40, as shown in sections 4a and 4b. As shown in the figure, the soldering area (PAD) of the electrical contacts 22 on the circuit substrate 20 of the present invention can be reduced to between 85% and 95% of the soldering area of the electronic components 40. In this way, when the molding resin material 50 is filled for packaging, even if the solder 45 is melted again due to heating, the solder 45 will only remain on the soldering area (PAD) of the electrical contact 22 and will not overflow, plus electronic components There is a gap 41 at the bottom of the 40 to allow the molding resin material 50 to flow into the bottom of the electronic component 40. The solder 45 on the electrical contact 22 and the electrical pin 41 is completely covered, so the solder 45 will not melt and flow and cause a short circuit. Situation.

In summary, the present invention provides a mold-sealing resin-type packaging structure and a packaging method thereof. A gap is formed by not coating an insulating layer on the bottom of an electronic component, and the welding area of the electrical contact is smaller than that of the electronic component. The sealing resin material covers the welding and solves the lack of short circuit caused by tin overflow in the traditional packaging process. Therefore, the present invention is quite different from the design of the known person and can improve the overall use value. It has not been seen in publications or publications before its application. Use, since it has met the requirements of the invention patent, the invention patent application is filed according to law.

Claims (23)

A packaging structure of a mold-sealed resin module includes at least: a circuit substrate, and a circuit pattern layer is distributed on at least one surface. The circuit pattern layer includes a plurality of electrical contacts, and the electrical pins of the plurality of electronic components are soldered to the solder. On the electrical contact, and the electrical contacts are respectively located between the circuit substrate and the electronic components corresponding to the electrical contacts; an insulation layer is distributed on the electronic circuit layer, but avoiding these The electrical contacts and the placement positions of the electronic components, and the insulation layer is not provided between the electrical contacts corresponding to the same electronic component, so that a gap is formed between the bottom of the electronic components and the circuit substrate; And a mold resin material covering at least part of the exposed surfaces of the electronic components and the circuit substrate to form a packaging module, wherein the mold sealing resin material can flow into the gap at the bottom of the electronic components during the heating process of the package Inside, the solder on the electrical contacts is covered, and the molding resin material completely covers the outside of the electronic components, so that the electronic components are not exposed after being packaged, wherein the insulation And the sealing resin material are different materials; wherein the circuit substrate and the electronic components are arranged along a first direction, and when viewed in a direction perpendicular to the first direction, the insulating layer and the sealing resin The material and the electrical pins partially overlap, and when viewed in a direction perpendicular to the first direction, the insulating layer does not overlap with the electronic components. According to the encapsulation structure of the encapsulating resin-type module according to item 1 of the patent application scope, wherein the encapsulating resin material portion is located on one side of the electronic components facing the circuit substrate and on the opposite side to the one side . According to the packaging structure of the mold-sealed resin-type module according to item 1 of the scope of the patent application, the soldering area of the electrical contacts on the circuit substrate is smaller than the soldering area of the electrical pins of the electronic components. According to the packaging structure of the mold-sealed resin-type module described in item 3 of the scope of the patent application, the electrical contact soldering area (PAD) is reduced to 85% -95% of the soldering area of the electronic components. According to the encapsulation structure of the mold-molded resin-type module according to item 1 of the scope of the patent application, the circuit substrate is a surface-mount device (SMD) that uses surface-mount technology (SMT). The electronic components include resistors, capacitors, inductors or integrated circuit (IC) electrical pins soldered to the electrical contacts. According to the package structure of the mold-sealed resin-type module according to item 1 of the scope of the patent application, the material of the circuit substrate includes a FR-4 substrate material, a FR-5 substrate material, or a BT Flip Chip substrate material. According to the packaging structure of the mold-sealed resin-type module according to item 1 of the scope of the patent application, the circuit substrate is a single-sided printed circuit board, a double-sided printed circuit board, or a multilayer printed circuit board. According to the encapsulation structure of the mold-sealing resin-type module according to item 1 of the scope of the patent application, the insulating layer may be made of polyimide or polynaphthalene dicarboxylic acid. It is formed by polyethylene naphtalate or polyethy leneterephthalate. According to the packaging structure of the mold-sealed resin-type module according to item 1 of the scope of the patent application, the circuit pattern layer is formed by etching a metal layer on a circuit substrate. According to the encapsulation structure of the mold-sealed resin-type module according to item 9 of the scope of the patent application, the material of the metal layer is copper (Cu). According to the packaging structure of the mold-sealing resin-type module according to item 1 of the scope of the patent application, the mold-sealing resin material includes an epoxy resin (Resin) material. A method for packaging a mold-sealed resin module includes at least the following steps: preparing a circuit substrate, forming a circuit pattern layer on at least one surface, the circuit pattern layer including a plurality of electrical contacts, and applying an insulating layer to the circuit On the pattern layer, the insulating layer avoids the placement of the electrical contacts and the plurality of electronic components, and the insulation layer is not provided between the electrical contacts corresponding to the same electronic component, so that the electrical components A gap is formed between the bottom and the circuit substrate; the electrical pins of the electronic components are soldered to the electrical contacts with solder, and the electrical contacts are respectively located on the circuit substrate and the electrical contacts respectively. Between the electronic components; and a heat-sealing resin material covering at least a part of the exposed surfaces of the electronic components and the circuit substrate to form a packaging module, wherein the mold-sealing resin material It can flow into the gap at the bottom of the electronic components to cover the solder on the electrical contacts, and the molding resin material completely covers the outside of the electronic components, so that the electronic components are not exposed after being packaged. Wherein the insulating layer and the sealing resin material have different materials; wherein the circuit substrate and the electronic components are arranged along a first direction, and when viewed in a direction perpendicular to the first direction, the insulating layer and the The sealing resin material and the electrical pins partially overlap, and when viewed in a direction perpendicular to the first direction, the insulating layer and the electronic components do not overlap. According to the encapsulation method of the encapsulating resin-type module according to item 12 of the patent application scope, wherein the encapsulating resin material portion is located on the side of the electronic components facing one side of the circuit substrate and the side opposite to the one side . According to the method for packaging a mold-sealed resin-type module according to item 12 of the scope of the patent application, the step of preparing the circuit substrate to form the circuit pattern layer further includes: forming a metal layer on the at least one surface of the circuit substrate; And etching the metal layer to form the circuit pattern layer. According to the method for packaging a mold-sealed resin-type module according to item 14 of the scope of the patent application, the material of the metal layer is copper (Cu). According to the method for packaging a mold-sealed resin-type module according to item 12 of the scope of the patent application, the material of the circuit substrate includes a FR-4 substrate material, a FR-5 substrate material, or a BT flip chip substrate material. The method for packaging a mold-sealed resin-type module according to item 12 of the scope of the patent application, wherein the method is a single-sided printed circuit board, a double-sided printed circuit board, or a multilayer printed circuit board. According to the encapsulation method of the mold-sealing resin-type module according to item 12 of the scope of the patent application, the insulating layer may be made of polyimide, polyethylene naphtalate, or polyethylene terephthalate. Dimethyl (polyethy leneterephthalate). According to the method for packaging a mold-sealed resin-type module according to item 12 of the scope of the patent application, the soldering area of the electrical contacts on the circuit substrate is smaller than the soldering area of the electrical pins of the electronic components. According to the method for packaging a mold-sealed resin-type module according to item 19 of the scope of the patent application, the electrical contact soldering area (PAD) is reduced to 85% -95% of the soldering area of the electronic components. According to the encapsulation method of the mold-molded resin-type module according to item 12 of the scope of the patent application, the step of soldering the electrical pins of the electronic components to the electrical contacts by soldering uses surface-bonding technology (Surface- Mount Technology (SMT) solders the electrical pins of the surface-mount devices (SMD) electronic components including resistors, capacitors, inductors or integrated circuit (IC) to the electrical contacts. According to the method for packaging a mold-sealing resin-type module according to item 12 of the scope of the patent application, the mold-sealing resin material includes an epoxy (Resin) material. According to the method for packaging a mold-sealed resin-type module according to item 12 of the scope of the patent application, wherein in the step of heating the mold-sealing resin material to cover the electronic components and at least a part of the exposed surface of the circuit substrate to form the package module, The method further includes: preparing a mold; placing the circuit board in the mold; heating the mold sealing resin material into a liquid state; and filling the mold sealing resin material in a liquid state into the mold, which is hardened to form the packaging mold after cooling. group.