TWI669365B - Silicone adhesive composition and adhesive article with excellent substrate adhesion - Google Patents
Silicone adhesive composition and adhesive article with excellent substrate adhesion Download PDFInfo
- Publication number
- TWI669365B TWI669365B TW104119599A TW104119599A TWI669365B TW I669365 B TWI669365 B TW I669365B TW 104119599 A TW104119599 A TW 104119599A TW 104119599 A TW104119599 A TW 104119599A TW I669365 B TWI669365 B TW I669365B
- Authority
- TW
- Taiwan
- Prior art keywords
- mass
- group
- parts
- groups
- carbon atoms
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 132
- 239000000853 adhesive Substances 0.000 title claims abstract description 101
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 101
- 239000000758 substrate Substances 0.000 title claims abstract description 44
- 239000013464 silicone adhesive Substances 0.000 title description 7
- -1 polysiloxane Polymers 0.000 claims abstract description 116
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 94
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims abstract description 64
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 44
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 40
- 150000003377 silicon compounds Chemical class 0.000 claims abstract description 36
- 150000001875 compounds Chemical class 0.000 claims abstract description 34
- 239000003054 catalyst Substances 0.000 claims abstract description 25
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 21
- 125000000962 organic group Chemical group 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910004283 SiO 4 Inorganic materials 0.000 claims abstract description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 66
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 29
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 125000005843 halogen group Chemical group 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 125000001931 aliphatic group Chemical group 0.000 claims description 10
- 125000001033 ether group Chemical group 0.000 claims description 10
- 239000002985 plastic film Substances 0.000 claims description 8
- 229920006255 plastic film Polymers 0.000 claims description 8
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 150000002894 organic compounds Chemical class 0.000 claims description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 10
- 150000001721 carbon Chemical class 0.000 claims 1
- 125000005375 organosiloxane group Chemical group 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 63
- 150000002430 hydrocarbons Chemical group 0.000 description 48
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 40
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 28
- 229920002554 vinyl polymer Polymers 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 23
- 238000011282 treatment Methods 0.000 description 16
- 125000003118 aryl group Chemical group 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 14
- 229910052697 platinum Inorganic materials 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- 239000002253 acid Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 10
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 10
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 239000007795 chemical reaction product Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000000123 paper Substances 0.000 description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 239000004480 active ingredient Substances 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 6
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000002318 adhesion promoter Substances 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 5
- 125000000753 cycloalkyl group Chemical group 0.000 description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 5
- 125000006038 hexenyl group Chemical group 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 5
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 150000001335 aliphatic alkanes Chemical class 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 4
- 229910052794 bromium Inorganic materials 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 4
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- SCZZNWQQCGSWSZ-UHFFFAOYSA-N 1-prop-2-enoxy-4-[2-(4-prop-2-enoxyphenyl)propan-2-yl]benzene Chemical compound C=1C=C(OCC=C)C=CC=1C(C)(C)C1=CC=C(OCC=C)C=C1 SCZZNWQQCGSWSZ-UHFFFAOYSA-N 0.000 description 3
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 230000003472 neutralizing effect Effects 0.000 description 3
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- KBSDLBVPAHQCRY-UHFFFAOYSA-N 307496-19-1 Chemical group C1CC=CCC1CC[Si](O1)(O2)O[Si](O3)(C4CCCC4)O[Si](O4)(C5CCCC5)O[Si]1(C1CCCC1)O[Si](O1)(C5CCCC5)O[Si]2(C2CCCC2)O[Si]3(C2CCCC2)O[Si]41C1CCCC1 KBSDLBVPAHQCRY-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RFIAUHDYYXYZQE-UHFFFAOYSA-N C(=C)[Si](N[Si](C)(C)C=C)(C)C.[Pt] Chemical compound C(=C)[Si](N[Si](C)(C)C=C)(C)C.[Pt] RFIAUHDYYXYZQE-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 2
- 239000003623 enhancer Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 239000005453 ketone based solvent Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 229910052762 osmium Inorganic materials 0.000 description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- YGSFNCRAZOCNDJ-UHFFFAOYSA-N propan-2-one Chemical compound CC(C)=O.CC(C)=O YGSFNCRAZOCNDJ-UHFFFAOYSA-N 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- KJDMMCYMVUTZSN-UHFFFAOYSA-N (1-ethynylcyclohexyl)oxy-trimethylsilane Chemical compound C[Si](C)(C)OC1(C#C)CCCCC1 KJDMMCYMVUTZSN-UHFFFAOYSA-N 0.000 description 1
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- ZCTILCZSUSTVHT-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-yloxy(trimethyl)silane Chemical compound CC(C)CC(C)(C#C)O[Si](C)(C)C ZCTILCZSUSTVHT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical class OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 208000032544 Cicatrix Diseases 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XMSXQFUHVRWGNA-UHFFFAOYSA-N Decamethylcyclopentasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XMSXQFUHVRWGNA-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003302 alkenyloxy group Chemical group 0.000 description 1
- 125000005452 alkenyloxyalkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 239000002519 antifouling agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- NFCHUEIPYPEHNE-UHFFFAOYSA-N bis(2,2-dimethylbut-3-ynoxy)-dimethylsilane Chemical compound C#CC(C)(C)CO[Si](C)(C)OCC(C)(C)C#C NFCHUEIPYPEHNE-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 238000003426 chemical strengthening reaction Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 1
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- CUQOHAYJWVTKDE-UHFFFAOYSA-N potassium;butan-1-olate Chemical compound [K+].CCCC[O-] CUQOHAYJWVTKDE-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 230000037387 scars Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- VNRWTCZXQWOWIG-UHFFFAOYSA-N tetrakis(trimethylsilyl) silicate Chemical compound C[Si](C)(C)O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C VNRWTCZXQWOWIG-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
本發明之課題在於提供以1次的塗布而與基材的密著性提高為可能之聚矽氧黏著劑組成物及黏著性物品。 It is an object of the present invention to provide a polysiloxane adhesive composition and an adhesive article which make it possible to improve the adhesion with a substrate by a single application.
本發明之解決手段為一種聚矽氧黏著劑組成物,其包含下述(A)~(F)成分; The solution of the present invention is a polysiloxane adhesive composition, which contains the following components (A) to (F);
(A)在1分子中具有至少2個含有烯基的有機基之有機聚矽氧烷, (A) an organopolysiloxane having at least two alkenyl-containing organic groups in one molecule,
(B)含有R2 3SiO1/2單位及SiO4/2單位,以(R2 3SiO1/2單位)/(SiO4/2單位)所表示的莫耳比為0.6~1.0之聚有機矽氧烷, (B) Contains R 2 3 SiO 1/2 units and SiO 4/2 units, and the molar ratio represented by (R 2 3 SiO 1/2 units) / (SiO 4/2 units) is 0.6 to 1.0. Organosiloxane
(C)在1分子中具有至少3個Si-H基之有機氫聚矽氧烷, (C) an organohydrogenpolysiloxane having at least 3 Si-H groups in one molecule,
(D)鉑族金屬系觸媒, (D) Platinum group metal catalyst,
(E)在1分子中具有1個以上之以下述式(3)所表示的重複單位且具有1個以上之Si-H基的化合物 (E) A compound having one or more repeating units represented by the following formula (3) in one molecule and having one or more Si-H groups
(F)於100g中含有0.15莫耳以上烯基的矽化合物。 (F) A silicon compound containing an alkenyl group of 0.15 mol or more in 100 g.
Description
本發明關於基材密著性經改善之聚矽氧黏著劑及黏著性物品。 The invention relates to a polysiloxane adhesive with improved substrate adhesion and an adhesive article.
所謂的黏著劑,就是接著劑之一種,多以在基材上塗布黏著劑而使硬化之黏著膠帶或黏著標籤等之形式使用,以此為我們平常看到之使用黏著劑的物品之具代表性者。此等物品係使用於為了識別物品之標籤,使用於為了行李之梱包,或為了接合複數的物品等,用途涉及多方面。 The so-called adhesive is a kind of adhesive. It is often used in the form of an adhesive tape or an adhesive label that is hardened by applying an adhesive on the substrate. This is a representative of the articles that are commonly used with adhesives. Sex. These items are used to identify items, to be used for luggage bags, or to join multiple items, etc., and they are used for many purposes.
構成黏著劑用的基礎材料係有幾個種類,大致區分為橡膠系、丙烯酸系、聚矽氧系等。橡膠系黏著劑係自古以來使用之泛用的基礎材料,價格便宜,使用於泛用的膠帶等製品。丙烯酸系黏著劑係以聚丙烯酸酯作為基礎而使用者,由於化學特性等比橡膠系更優異,亦可適用於比橡膠系更高機能的黏著製品。聚矽氧系黏著劑係由高黏度的聚矽氧生橡膠(樹膠)與聚矽氧樹脂所構成,由於 主鏈具有多數的矽氧烷鍵,而具有各式各樣的優異特徵,具體地可舉出耐熱性、耐寒性、耐候性、耐藥品性及電絕緣性等。 There are several types of base materials used to form adhesives, which are roughly classified into rubber-based, acrylic, and silicone-based. Rubber-based adhesives have been widely used as basic materials since ancient times. They are inexpensive and used in products such as general-purpose tapes. Acrylic adhesives are based on polyacrylates and are used by users. Because of their chemical properties, they are better than rubber-based adhesives. They are also suitable for adhesive products with higher performance than rubber-based adhesives. Polysiloxane adhesive is composed of high viscosity polysiloxane (rubber) and polysiloxane resin. The main chain has many siloxane bonds and has various excellent characteristics. Specific examples include heat resistance, cold resistance, weather resistance, chemical resistance, and electrical insulation.
聚矽氧黏著劑係活用如前述的優異特性,使用於耐熱膠帶或工程用的遮蔽膠帶、具有難燃性的雲母膠帶等產業用之高機能膠帶,使用在縱然於使用條件之嚴苛環境下亦能發揮特性之情況下使用。然而,近年來聚矽氧黏著劑之需求係急速擴大,其主要原因為採用配備於智慧型手機或平板終端等上的觸控面板之製品市場之擴大。觸控面板係由於在許多的情況中以人的手指直接操作,為了防止顯示器之污髒或損傷等,貼合畫面保護膜而使用。此畫面保護膜之黏著層所使用之大部分係聚矽氧黏著劑,此係利用聚矽氧黏著劑對於被附體的優異潤濕性或重做(rework)性等特徵。 Polysiloxane adhesives make use of the excellent properties described above. They are used in industrial high-performance tapes such as heat-resistant tapes, masking tapes for engineering, and mica tapes with flame resistance. They are used under severe conditions even under the conditions of use. It can also be used in the case of exhibiting characteristics. However, the demand for polysiloxane adhesives has expanded rapidly in recent years, mainly due to the expansion of the market for products using touch panels equipped on smart phones or tablet terminals. In many cases, a touch panel is directly operated by a human finger, and a screen protection film is used in order to prevent the display from being soiled or damaged. Most of the adhesive layers used in this screen protection film are polysiloxane adhesives, which make use of the characteristics of the polysiloxane adhesive's excellent wettability or rework properties to the adherend.
用於畫面保護膜的基材係塑膠製的薄膜,多使用具有透明性的PET等之聚酯薄膜。然而,與紙基材比較下,塑膠薄膜可說是與黏著劑的密著性差。茲認為此係因為塑膠薄膜係表面平坦,且與凹凸大的紙比較下,黏著劑深入基材內的錨固效果弱。若密著性差,則有在以輥捲取時發生透背,或在貼附於被附體而時間經過後於剝離之際,發生黏著層轉移至被附體等之問題。 The base material for the screen protection film is a plastic film, and polyester films such as PET having transparency are often used. However, compared with paper substrates, plastic films can be said to have poor adhesion to adhesives. It is believed that this is because the surface of the plastic film is flat, and the anchoring effect of the adhesive deep into the substrate is weak compared with the paper with large unevenness. If the adhesiveness is poor, there is a problem that the backing occurs when it is taken up by a roll, or the adhesive layer is transferred to the attached body when it is attached to the attached body and peeled off after time has passed.
以往,為了此密著性之改善,採取各式各樣的對策,有使用密著性良好的基材,將基材電暈處理等之方法。又,底漆處理亦為廣泛進行之方法,對於聚矽氧黏 著劑用的底漆組成物,亦進行開發(參照專利文獻1~3)。底漆處理雖然非常有效果,但增加1個塗布步驟者係最大的缺點,成本和生產性會成為問題。作為有效的對策,考慮在聚矽氧黏著劑中添加密著性提高之成分,以1次的塗布確保密著性之方法。如此的添加劑雖亦存在(參照專利文獻4~6),但要求密著性的進一步改善。又,於專利文獻7中,記載選擇地接著於有機樹脂之添加劑,但對象為聚矽氧橡膠組成物,沒有言及聚矽氧黏著劑。 Conventionally, in order to improve the adhesion, various measures have been taken, such as using a substrate with good adhesion and corona treatment of the substrate. In addition, primer treatment is also a widely performed method. For polysiloxane A primer composition for a coating agent has also been developed (see Patent Documents 1 to 3). Although the primer treatment is very effective, adding one coating step is the biggest disadvantage, and cost and productivity will become a problem. As an effective countermeasure, a method of adding a component having improved adhesiveness to a polysiloxane adhesive and securing the adhesiveness with a single application is considered. Although such additives exist (see Patent Documents 4 to 6), further improvement in adhesion is required. Further, in Patent Document 7, an additive that is selectively attached to an organic resin is described, but the subject is a silicone rubber composition, and there is no mention of a silicone adhesive.
[專利文獻1]特公平6-39584號公報 [Patent Document 1] Japanese Patent Publication No. 6-39584
[專利文獻2]特開平7-3215號公報 [Patent Document 2] JP 7-3215
[專利文獻3]特開2012-149240號公報 [Patent Document 3] JP 2012-149240
[專利文獻4]特開2003-105089號公報 [Patent Document 4] JP 2003-105089
[專利文獻5]日本發明專利第3232004號公報 [Patent Document 5] Japanese Invention Patent No. 3232004
[專利文獻6]特表2010-500462號公報 [Patent Document 6] Special Publication No. 2010-500462
[專利文獻7]日本發明專利第3324166號公報 [Patent Document 7] Japanese Invention Patent No. 3324166
於是,本發明中,目的在於提供以1次的塗布而與基材的密著性提高為可能之聚矽氧黏著劑組成物及 黏著性物品。 Then, the objective of this invention is to provide the polysiloxane adhesive composition which can improve the adhesiveness with a base material by a single application, and Adhesive items.
本發明者為了達成上述目的而專心致力檢討,結果得知藉由添加具有特定構造的密著提升劑成分,而得到與基材的密著性提高之聚矽氧黏著劑組成物,終於完成本發明。 The present inventors devoted their efforts to the review in order to achieve the above-mentioned objective. As a result, they learned that by adding an adhesion promoter component having a specific structure, a polysiloxane adhesive composition with improved adhesion to the substrate was obtained. invention.
因此,本發明提供下述聚矽氧黏著劑組成物及黏著性物品。 Therefore, the present invention provides the following polysiloxane adhesive composition and adhesive article.
[I].一種聚矽氧黏著劑組成物,其包含下述(A)~(F)成分;(A)以下述平均組成式(1)所表示,在1分子中具有至少2個含有烯基的有機基,於100g中含有烯基0.0007~0.05莫耳之有機聚矽氧烷:100~40質量份,
[II].一種黏著性物品,其係具備基材與形成在此基材的至少一面上之黏著層的黏著性物品,該黏著層係藉由將上述聚矽氧黏著劑組成物塗布於基材的至少一面上,使硬化而得。 [II]. An adhesive article, which is an adhesive article having a substrate and an adhesive layer formed on at least one side of the substrate, the adhesive layer is formed by coating the polysiloxane adhesive composition on a substrate Hardened on at least one side of the material.
若將由本發明所得之聚矽氧黏著劑組成物塗布於基材上而使用,則可得到與基材的密著性良好之黏著性物品。 When the polysiloxane adhesive composition obtained by the present invention is applied to a substrate and used, an adhesive article having good adhesion to the substrate can be obtained.
以下,詳細說明本發明。 Hereinafter, the present invention will be described in detail.
(A)以下述平均組成式(1)所表示,在1分子中具有至少2個含有烯基的有機基,於100g中含有烯基 0.0007~0.05莫耳之有機聚矽氧烷:100~40質量份。 (A) is represented by the following average composition formula (1), and has at least two alkenyl-containing organic groups in one molecule, and contains alkenyl groups in 100 g 0.0007 ~ 0.05 mole of organic polysiloxane: 100 ~ 40 parts by mass.
R1係相同或異種之碳數1~10的1價烴基,R1中至少2個係包含碳數2~10之含有烯基的有機基。作為1價烴基,例如可舉出甲基、乙基、丙基、丁基等之烷基、環己基等之環烷基、苯基等之芳基等,再者,此等之基的碳原子所鍵結的氫原子之一部分或全部亦可被鹵素原子或其他的基所取代,作為取代基,可例示三氟甲基、3,3,3-三氟丙基等。其中,較佳為飽和的脂肪族基或芳香族基,更佳為甲基、苯基。 R 1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms of the same or different species, and at least 2 of R 1 are alkenyl-containing organic groups having 2 to 10 carbon atoms. Examples of the monovalent hydrocarbon group include alkyl groups such as methyl, ethyl, propyl, and butyl, cycloalkyl groups such as cyclohexyl, aryl groups such as phenyl, and the like, and carbons of such groups Some or all of the hydrogen atoms to which the atoms are bonded may be substituted with a halogen atom or other groups. Examples of the substituent include trifluoromethyl, 3,3,3-trifluoropropyl, and the like. Among these, a saturated aliphatic group or an aromatic group is preferable, and a methyl group and a phenyl group are more preferable.
作為含有烯基的有機基,較佳為碳數2~10者,例如可舉出乙烯基、烯丙基、己烯基、辛烯基等之烯基、丙烯醯基丙基、丙烯醯基甲基、甲基丙烯醯基丙基等之丙烯醯基烷基、及甲基丙烯醯基烷基、環己烯基乙基等之環烯基烷基、乙烯氧基丙基等之烯氧基烷基等。其中較佳為乙烯基。 As the alkenyl group-containing organic group, those having 2 to 10 carbon atoms are preferred, and examples thereof include alkenyl groups such as vinyl, allyl, hexenyl, and octenyl, allyl propyl, and allyl propyl Acrylomethylalkyl groups such as methyl, methacrylomethylpropyl, etc., and cycloalkenylalkyl groups such as methacrylomethylalkyl, cyclohexenylethyl, and alkenyloxy groups such as vinyloxypropyl Alkyl and the like. Among them, vinyl is preferred.
(A)中所含有的烯基之量,係有機聚矽氧烷100g中0.0007~0.05莫耳,較佳為0.001~0.04莫耳,更 佳為0.001~0.03莫耳。若比0.0007莫耳更小,則交聯密度變小,有發生黏著層的內聚破壞之情況,若比0.05莫耳更大,則黏著層變硬,有得不到適當的黏著力或黏性之情況。 The amount of alkenyl groups contained in (A) is 0.0007 to 0.05 mol, preferably 0.001 to 0.04 mol in 100 g of organic polysiloxane. It is preferably 0.001 to 0.03 moles. If it is smaller than 0.0007 moles, the crosslinking density becomes smaller, and cohesive failure of the adhesive layer may occur. If it is larger than 0.05 moles, the adhesive layer becomes hard, and proper adhesion or adhesion cannot be obtained. Sexual situation.
a為2以上之整數,b為1以上之整數,c為0以上之整數,d為0以上之整數,50≦a+b+c+d≦15,000,較佳為200≦a+b+c+d≦12,000。a+b+c+d若比50小,則交聯點變過多,而有反應性降低之虞,若比15,000大,則由於組成物的黏度變非常高,有難以攪拌混合等作業性變差之虞。 a is an integer of 2 or more, b is an integer of 1 or more, c is an integer of 0 or more, d is an integer of 0 or more, 50 ≦ a + b + c + d ≦ 15,000, preferably 200 ≦ a + b + c + d ≦ 12,000. If a + b + c + d is smaller than 50, the cross-linking point becomes too large, and the reactivity may decrease. If it is larger than 15,000, the viscosity of the composition becomes very high, and workability such as difficulty in mixing and mixing may become difficult. Worse.
(A)成分通常係使用觸媒使八甲基環四矽氧烷等之環狀低分子矽氧烷進行開環聚合而製造,但由於在聚合後含有原料的環狀低分子矽氧烷,較佳為使用在加熱及減壓下邊使惰性氣體通入反應生成物中邊餾去該環狀低分子矽氧烷者。 The component (A) is usually produced by ring-opening polymerization of a cyclic low-molecular-weight siloxane such as octamethylcyclotetrasiloxane using a catalyst, but since the cyclic low-molecular-weight siloxane containing a raw material is contained after polymerization, Preferably, the cyclic low-molecular-weight siloxane is distilled off while passing an inert gas into the reaction product under heating and reduced pressure.
作為(A)成分,可舉出以下述通式所表示者,惟不受此等所限定。 The component (A) includes, but is not limited to, those represented by the following general formula.
R1-1R1-2 2SiO(R1-2 2SiO)pSiR1-2 2R1-1 R 1-1 R 1-2 2 SiO (R 1-2 2 SiO) p SiR 1-2 2 R 1-1
R1-1R1-2 2SiO(R1-2 2SiO)p(R1-1R1-2SiO)qSiR1-2 2R1-1 R 1-1 R 1-2 2 SiO (R 1-2 2 SiO) p (R 1-1 R 1-2 SiO) q SiR 1-2 2 R 1-1
R1-2 3SiO(R1-2 2SiO)p(R1-1R1-2SiO)qSiR1-2 3 R 1-2 3 SiO (R 1-2 2 SiO) p (R 1-1 R 1-2 SiO) q SiR 1-2 3
R1-1 3SiO(R1-2 2SiO)p(R1-1R1-2SiO)qSiR1-1 3 R 1-1 3 SiO (R 1-2 2 SiO) p (R 1-1 R 1-2 SiO) q SiR 1-1 3
R1-1R1-2 2SiO(R1-2 2SiO)p(R1-1R1-2SiO)qSiR1-2 2R1-1(式中,R1-1係相同或異種之含有烯基的有機基,R1-2係相同或異種之碳數1~10的1價烴基,p≧50,q≧1(惟,在分子中(R1-1R1-2SiO)q以外不具有R1-1時,q≧2))。 R 1-1 R 1-2 2 SiO (R 1-2 2 SiO) p (R 1-1 R 1-2 SiO) q SiR 1-2 2 R 1-1 (where R 1-1 is the same Or different kinds of alkenyl-containing organic groups, R 1-2 is the same or different kind of monovalent hydrocarbon group with 1 to 10 carbon atoms, p ≧ 50, q ≧ 1 (however, in the molecule (R 1-1 R 1- 2 When SiO) q does not have R 1-1 , q ≧ 2)).
作為R1-1、R1-2,可舉出以上述R1所例示者。再者,較佳為50≦p≦15,000,較佳為1≦q≦1,000,更佳為2≦q≦1,000。 Examples of R 1-1 and R 1-2 include those exemplified by R 1 described above. Furthermore, it is preferably 50 ≦ p ≦ 15,000, more preferably 1 ≦ q ≦ 1,000, and even more preferably 2 ≦ q ≦ 1,000.
作為更具體的(A)成分,可舉出以下述通式所表示者,惟不受此等所限定。再者,下述式中的Me、Vi、Ph各自表示甲基、乙烯基、苯基。 The more specific (A) component includes, but is not limited to, those represented by the following general formula. In addition, Me, Vi, and Ph in the following formula each represent a methyl group, a vinyl group, and a phenyl group.
含有R2 3SiO1/2單位(式中,R2獨立地表示不具有脂肪族不飽和鍵之碳數1~10的1價烴基或碳數2~6的烯基)及SiO4/2單位,以(R2 3SiO1/2單位)/(SiO4/2單位) 所表示的莫耳比為0.5~1.0之有機聚矽氧烷。此莫耳比未達0.5時,黏著力或黏性有降低之虞,超過1.0時,黏著力或保持力有降低之虞。再者,上述莫耳比較佳為0.6~0.9。 Contains R 2 3 SiO 1/2 units (wherein R 2 independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms or an alkenyl group having 2 to 6 carbon atoms having no aliphatic unsaturated bond) and SiO 4/2 The unit is an organic polysiloxane having a molar ratio of 0.5 to 1.0 expressed by (R 2 3 SiO 1/2 unit) / (SiO 4/2 unit). When the Mohr ratio is less than 0.5, there is a possibility that the adhesive force or stickiness may be reduced. When it exceeds 1.0, the adhesive force or the holding force may be lowered. In addition, the above-mentioned mole is preferably 0.6 to 0.9.
R2獨立地表示不具有脂肪族不飽和鍵之碳數1~10的1價烴基或碳數2~6的烯基,作為碳數1~10的1價烴基,較佳為甲基、乙基、丙基、丁基等之碳數2~6的烷基、苯基、甲苯基等之碳數6~10的芳基。作為碳數2~6的烯基,較佳為乙烯基、烯丙基、丁烯基等。 R 2 independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms or an alkenyl group having 2 to 6 carbon atoms having no aliphatic unsaturated bond. As the monovalent hydrocarbon group having 1 to 10 carbon atoms, methyl and ethyl are preferred. Alkyl, propyl, butyl and the like having 2 to 6 carbons, alkyl, phenyl, tolyl and the like having 6 to 10 carbons. The alkenyl group having 2 to 6 carbon atoms is preferably a vinyl group, an allyl group, a butenyl group, or the like.
(B)成分係除了R2,還可含有矽烷醇基或水解性的烷氧基,其含量較佳為(B)成分之總質量的0.01~4.0質量%,更佳為0.05~3.5質量%。上述含量若比0.01質量%更少,則黏著劑的內聚力有變低之虞,若比4.0質量%更多,則黏著劑的黏性有降低之虞。作為烷氧基,可舉出甲氧基、乙氧基、異丙氧基、丁氧基、苯氧基等,於使用時較佳為甲氧基。 The component (B) may contain a silanol group or a hydrolyzable alkoxy group in addition to R 2 , and the content thereof is preferably 0.01 to 4.0% by mass, and more preferably 0.05 to 3.5% by mass of the total mass of the component (B). . If the content is less than 0.01% by mass, the cohesive force of the adhesive may be reduced. If it is more than 4.0% by mass, the viscosity of the adhesive may be reduced. Examples of the alkoxy group include a methoxy group, an ethoxy group, an isopropoxy group, a butoxy group, and a phenoxy group, and a methoxy group is preferred in use.
(B)成分亦可併用2種以上。又,於不損害本發明的特性之範圍內,亦可在(B)中含有R2 2SiO3/2單位、R2SiO2/2單位。 (B) A component may use 2 or more types together. In addition, as long as the characteristics of the present invention are not impaired, R 2 2 SiO 3/2 units and R 2 SiO 2/2 units may be contained in (B).
(B)成分係可在觸媒存在下之進行縮合反應而得。此係使表面上所存在的水解性基彼此反應之作業,期望黏著力的提高等之效果。只要使用鹼性觸媒,在室溫~回流下使反應,視需地進行中和即可。 The component (B) can be obtained by performing a condensation reaction in the presence of a catalyst. This is an operation for reacting the hydrolyzable groups present on the surface with each other, and an effect such as improvement of adhesion is expected. As long as a basic catalyst is used, the reaction can be performed at room temperature to reflux, and neutralization can be performed as needed.
作為鹼性觸媒,可舉出氫氧化鋰、氫氧化 鈉、氫氧化鉀、氫氧化鈣等之金屬氫氧化物;碳酸鈉、碳酸鉀等之碳酸鹽;碳酸氫鈉、碳酸氫鉀等之碳酸氫鹽;甲氧化鈉、丁氧化鉀等之金屬烷氧化物;丁基鋰等之有機金屬;矽醇化鉀;氨氣、氨水、甲胺、三甲胺、三乙胺等之氮化合物等,較佳為氨氣或氨水。縮合反應之溫度係可在室溫至有機溶劑的回流溫度下進行。反應時間係沒有特別的限定,但可為0.5~20小時,較佳為1~16小時。再者,於反應結束後,視需要可添加中和鹼性觸媒用的中和劑。作為中和劑,可舉出氯化氫、二氧化碳等之酸性氣體;醋酸、辛酸、檸檬酸等之有機酸;鹽酸、硫酸、磷酸等之礦酸等。作為鹼性觸媒,當使用氨氣或氨水、低沸點的胺化合物時,可使氮等的惰性氣體通氣而餾去。 Examples of the alkaline catalyst include lithium hydroxide and hydroxide Metal hydroxides of sodium, potassium hydroxide, calcium hydroxide, etc .; carbonates of sodium carbonate, potassium carbonate, etc .; bicarbonates of sodium bicarbonate, potassium bicarbonate, etc .; metal alkane such as sodium methoxide, potassium butoxide, etc. Oxides; organometals such as butyl lithium; potassium silicides; nitrogen compounds such as ammonia, ammonia, methylamine, trimethylamine, triethylamine, etc., preferably ammonia or ammonia. The temperature of the condensation reaction can be performed from room temperature to the reflux temperature of the organic solvent. The reaction time is not particularly limited, but may be 0.5 to 20 hours, and preferably 1 to 16 hours. After the reaction is completed, a neutralizing agent for neutralizing a basic catalyst may be added as necessary. Examples of the neutralizing agent include acid gases such as hydrogen chloride and carbon dioxide; organic acids such as acetic acid, caprylic acid, and citric acid; and mineral acids such as hydrochloric acid, sulfuric acid, and phosphoric acid. As an alkaline catalyst, when ammonia gas, ammonia water, or a low-boiling amine compound is used, an inert gas such as nitrogen can be vented and distilled off.
(A)成分之配合量為100~40質量份,(B)成分之配合量為60~0質量份,亦有不含(B)成分之情況。(A)、(B)成分之合計為100質量份。(A)、(B)成分之配合質量比係(A)/(B)=100/0~40/60,從以薄膜或膠帶等來使用時的黏著力之點來看,較佳為100/0~70/30,更佳為100/0~80/20,尤佳為100/0~90/10。(B)成分之比例若超過60,則有密著性變差之情況。 The blending amount of the component (A) is 100 to 40 parts by mass, and the blending amount of the component (B) is 60 to 0 parts by mass, and the component (B) may not be contained. The total of the components (A) and (B) is 100 parts by mass. The mass ratio of the components (A) and (B) is (A) / (B) = 100/0 ~ 40/60. From the point of adhesion when used with a film or tape, it is preferably 100. / 0 ~ 70/30, more preferably 100/0 ~ 80/20, and even more preferably 100/0 ~ 90/10. (B) When the ratio of a component exceeds 60, adhesiveness may worsen.
以下述平均組成式(2)所表示,在1分子中具有至少3個Si-H基之有機氫聚矽氧烷 An organohydrogenpolysiloxane having at least 3 Si-H groups in one molecule as represented by the following average composition formula (2)
R3 eHfSiO(4-e-f)/2 (2)(式中,R3獨立地表示非取代或取代之碳數1~10的1價烴基,e>0,f>0,且0<e+f≦3)。 R 3 e H f SiO (4-ef) / 2 (2) (wherein R 3 independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, e> 0, f> 0, and 0 <e + f ≦ 3).
作為R3之碳數1~10的1價烴基,例如可舉出甲基、乙基、丙基、丁基等之烷基、環己基等之環烷基、乙烯基、烯丙基、己烯基、辛烯基等之烯基、苯基等之芳基等。再者,此等之基的碳原子所鍵結的氫原子之一部分或全部亦可被鹵素原子或其他的基所取代,可例示三氟甲基、3,3,3-三氟丙基等。其中,較佳為飽和的脂肪族基或芳香族基,更佳為甲基、苯基。上述平均組成式(2)中,e>0,f>0,0<e+f≦3。 Examples of the monovalent hydrocarbon group having 1 to 10 carbon atoms of R 3 include alkyl groups such as methyl, ethyl, propyl, and butyl, cycloalkyl groups such as cyclohexyl, vinyl, allyl, and hexane. Alkenyl groups such as alkenyl, octenyl, and aryl groups such as phenyl. In addition, a part or all of the hydrogen atoms bonded to the carbon atoms of these groups may be substituted by a halogen atom or other groups. Examples include trifluoromethyl, 3,3,3-trifluoropropyl and the like. . Among these, a saturated aliphatic group or an aromatic group is preferable, and a methyl group and a phenyl group are more preferable. In the average composition formula (2), e> 0, f> 0, and 0 <e + f ≦ 3.
作為(C)成分,可例示下述通式(8)者,惟不受此所限定。 The component (C) may be exemplified by the following general formula (8), but is not limited thereto.
R25 3Si-O-(R26 2Si-O)t-(R27HSi-O)u-SiR28 3 (8)(式中,R25、R28各自獨立地表示碳數1~10的1價烴基或氫原子,R26、R27各自獨立地表示碳數1~10的1價烴基,t為0≦t≦100,u為3≦u≦80)。 R 25 3 Si-O- (R 26 2 Si-O) t- (R 27 HSi-O) u -SiR 28 3 (8) (where R 25 and R 28 each independently represent a carbon number of 1 to 10 R 26 and R 27 each independently represent a monovalent hydrocarbon group having 1 to 10 carbon atoms, t is 0 ≦ t ≦ 100, and u is 3 ≦ u ≦ 80).
作為R26、R27之碳數1~10的1價烴基,例如可舉出甲基、乙基、丙基、丁基等之烷基、環己基等之環烷基、乙烯基、烯丙基、己烯基、辛烯基等之烯基、苯基等之芳基等。再者,此等之基的碳原子所鍵結的氫原子之一部分或全部亦可被鹵素原子或其他的基所取代,作為取代基,可舉出三氟甲基、3,3,3-三氟丙基等。作為R26、R27,較佳為飽和的脂肪族基或芳香族基,更佳為甲基、 苯基。R25、R28係碳數1~10的1價烴基或氫原子。作為R25、R28之碳數1~10的1價烴基,可例示與上述同樣者,t為0≦t≦100,較佳為0≦u≦80或0<u≦80,u為3≦u≦80,較佳為5≦u≦70。 Examples of the monovalent hydrocarbon group having 1 to 10 carbon atoms of R 26 and R 27 include alkyl groups such as methyl, ethyl, propyl, and butyl, cycloalkyl groups such as cyclohexyl, vinyl, and allyl. Alkenyl, such as alkyl, hexenyl, octenyl, and aryl, such as phenyl. In addition, part or all of the hydrogen atoms bonded to the carbon atoms of these groups may be substituted with a halogen atom or other groups. Examples of the substituent include trifluoromethyl, 3,3,3- Trifluoropropyl etc. R 26 and R 27 are preferably a saturated aliphatic group or an aromatic group, and more preferably a methyl group or a phenyl group. R 25 and R 28 are monovalent hydrocarbon groups or hydrogen atoms having 1 to 10 carbon atoms. Examples of the monovalent hydrocarbon group having 1 to 10 carbon atoms of R 25 and R 28 are the same as those described above, t is 0 ≦ t ≦ 100, preferably 0 ≦ u ≦ 80 or 0 <u ≦ 80, and u is 3 ≦ u ≦ 80, preferably 5 ≦ u ≦ 70.
通式(8)中的t係滿足0≦t≦100之整數,較佳為0≦t≦80或0<t≦80。通式(8)中的u係滿足3≦u≦80之整數,較佳為4≦u≦70。 T in the general formula (8) satisfies an integer of 0 ≦ t ≦ 100, and preferably 0 ≦ t ≦ 80 or 0 <t ≦ 80. U in the general formula (8) satisfies an integer of 3 ≦ u ≦ 80, and preferably 4 ≦ u ≦ 70.
(C)成分通常係使用酸觸媒使八甲基環四矽氧烷等之環狀低分子矽氧烷與四甲基環四矽氧烷等之含有Si-H的矽氧烷進行開環聚合而製造,但由於在聚合後含有原料的環狀低分子矽氧烷,較佳為使用在加熱及減壓下使用邊使惰性氣體通入反應生成物中邊餾去該環狀低分子矽氧烷者。 (C) The component is usually a ring-opening cyclic low-molecular-weight siloxane such as octamethylcyclotetrasiloxane and Si-H-containing siloxane such as tetramethylcyclotetrasiloxane with an acid catalyst. It is produced by polymerization, but since the cyclic low-molecular-weight siloxane containing raw materials is contained after the polymerization, it is preferable to use the cyclic low-molecular-weight silicon while distilling off the cyclic low-molecular-weight silicon while heating and depressurizing the reaction product Oxane
作為表示(C)成分的具體構造者,可舉出如以下所示者等,但不受此等所限定。再者,下述式中的Me各自表示甲基。 Examples of the specific structure of the component (C) include, but are not limited to, those shown below. In the following formulae, Me each represents a methyl group.
(C)的成分之配合量係相對於(A)、(B)成分的合計烯基,Si-H基係以莫耳比(Si-H基/烯基)成為0.2~15之量,較佳以成為0.5~10之範圍的方式配合。未達0.2時,交聯密度變低,藉此有內聚力、保持力變低之虞。另一方面,若超過15,則交聯密度變高,會得不到適度的黏著力及黏性。 The compounding amount of the component (C) is 0.2 to 15 in terms of the molar ratio (Si-H group / alkenyl group) to the total alkenyl group of the (A) and (B) components. It is preferably used in a range of 0.5 to 10. When it is less than 0.2, the crosslinking density becomes low, and there is a possibility that the cohesive force and the holding force become low. On the other hand, if it exceeds 15, the crosslinking density will become high, and moderate adhesive force and stickiness will not be obtained.
(D)成分係用以使(A)、(B)成分的烯基及(B)的Si-H基進行氫矽烷化附加而硬化的鉑族金屬系觸媒。作為此觸媒之中心金屬,可舉出鉑、鈀、銥、銠、鋨、釕等作為例子,其中鉑為較宜。作為鉑觸媒,可舉出氯鉑酸、氯鉑酸的醇溶液、氯鉑酸與醇之反應物、氯鉑酸與烯烴化合物之反應物、氯鉑酸與含乙烯基的矽氧烷之反應物等。 The component (D) is a platinum group metal catalyst used to harden the alkenyl group (A) and (B) component and the Si-H group (B) by hydrosilylation. Examples of the center metal of the catalyst include platinum, palladium, iridium, rhodium, osmium, ruthenium, and the like, among which platinum is preferred. Examples of the platinum catalyst include chloroplatinic acid, an alcohol solution of chloroplatinic acid, a reaction product of chloroplatinic acid and an alcohol, a reaction product of chloroplatinic acid and an olefin compound, and a reaction product of chloroplatinic acid and vinyl-containing siloxane. Reactants, etc.
(D)成分之配合量,係相對於上述(A)~(C)成分之總量,以金屬量計為1~500ppm,較佳為2~450ppm。若未達1ppm,則由於反應慢,硬化成為不充分而有不發揮黏著力或保持力的各種特性之虞,若超過500ppm,則有缺乏硬化物的柔軟性之情況。 The amount of the component (D) is 1 to 500 ppm, and preferably 2 to 450 ppm, based on the total amount of the components (A) to (C). If it is less than 1 ppm, the reaction may be slow and the curing may be insufficient, and various properties such as adhesion or holding force may not be exhibited. If it exceeds 500 ppm, the flexibility of the cured product may be insufficient.
(E)在1分子中具有1個以上之以下述式(3)所表示的重複單位且具有1個以上之Si-H基的化合物。 (E) A compound having one or more repeating units represented by the following formula (3) in one molecule and having one or more Si-H groups.
上述式(3)中,R4~R11係互相相同或異種的氫原子、鹵素原子、羥基或碳數1~6的1價烴基。作 為鹵素原子,可舉出氟、氯、溴等,作為碳數1~6的1價烴基,可舉出甲基、乙基、丙基、異丙基、丁基等。其中,較佳為氫原子、碳數1~6的烴基,更佳為氫原子、甲基。 In the formula (3), R 4 to R 11 are hydrogen atoms, halogen atoms, hydroxyl groups, or monovalent hydrocarbon groups having 1 to 6 carbon atoms which are the same or different from each other. Examples of the halogen atom include fluorine, chlorine, and bromine. Examples of the monovalent hydrocarbon group having 1 to 6 carbon atoms include methyl, ethyl, propyl, isopropyl, and butyl. Among these, a hydrogen atom and a hydrocarbon group having 1 to 6 carbon atoms are preferred, and a hydrogen atom and a methyl group are more preferred.
X係選自上述式(4)的2價有機基,R12~R13係互相相同或異種的氫原子、鹵素原子、羥基或碳數1~6的1價烴基。作為鹵素原子,可舉出氟、氯、溴等,作為碳數1~6的1價烴基,可舉出甲基、乙基、丙基、異丙基、丁基等。於此等之中,較佳為氫原子、碳數1~6的烴基,特佳為氫原子、甲基。g為1以上之整數,較佳為1~8,更佳為1~5。g比8更大時,由於重複單位之中所佔的烷基變多,與基材的密著性有變差之情況。 X is a divalent organic group selected from the above formula (4), and R 12 to R 13 are hydrogen atoms, halogen atoms, hydroxyl groups, or monovalent hydrocarbon groups having 1 to 6 carbon atoms which are the same or different from each other. Examples of the halogen atom include fluorine, chlorine, and bromine. Examples of the monovalent hydrocarbon group having 1 to 6 carbon atoms include methyl, ethyl, propyl, isopropyl, and butyl. Among these, a hydrogen atom and a hydrocarbon group having 1 to 6 carbon atoms are preferred, and a hydrogen atom and a methyl group are particularly preferred. g is an integer of 1 or more, preferably 1 to 8, and more preferably 1 to 5. When g is larger than 8, since the number of alkyl groups in the repeating unit increases, the adhesion with the substrate may be deteriorated.
Y係獨立地為碳數1~6的烴基,於構造中可具有醚基。作為碳數1~6的2價烴基,可舉出如下者。 The Y system is independently a hydrocarbon group having 1 to 6 carbon atoms, and may have an ether group in the structure. Examples of the divalent hydrocarbon group having 1 to 6 carbon atoms include the following.
又,於分子中亦可包含醚基,可舉出如下述者。 Further, an ether group may be contained in the molecule, and examples thereof include the following.
作為表示式(3)的具體構造者,可舉出如以下所示者等,惟不受此等所限定。再者,下述式中之Me表示甲基。 Specific examples of the structure of the expression (3) include, but are not limited to, those shown below. Note that Me in the following formula represents a methyl group.
作為含有Si-H基的基,例如可舉出以後述平均組成式(9)所表示的在1分子中具有至少2個Si-H基之化合物,具體地可舉出自下述化合物中去掉至少1個氫原子後之基(惟,具有至少1個Si-H基)。(E)成分亦 可在分子末端具有含Si-H基的基。 Examples of the Si-H group-containing group include a compound having at least two Si-H groups in one molecule represented by the average composition formula (9) described below, and specifically, it is removed from the following compounds A radical after at least one hydrogen atom (but having at least one Si-H group). (E) Ingredients also It may have a Si-H group-containing group at the molecular terminal.
作為(E)成分,例如可舉出如以下所示者等,惟不受此等所限定。Z1、Z2為0~10,較佳為0~4。 As (E) component, the following are mentioned, for example, However, It is not limited to these. Z1 and Z2 are 0 to 10, preferably 0 to 4.
(E)成分係聚矽氧硬化性組成物用基材密著提升劑,為提高聚矽氧樹脂與基材的密著性之主成分。茲認為(E)中存在的式(3)之鏈段係有效於基材密著,推測芳香環係特別地發揮機能。可認為當基材為塑膠時,在塑膠中亦含有芳香環,其芳香環的π電子彼此係作用,藉由堆積(stacking)效應提高密著性。再者,茲認為具有Si-H基的鏈段存在於芳香環鏈段附近,因Si-H基與基材表面的官能基之鍵結生成亦有助於密著性提升。 (E) The component is a base material adhesion promoter for a silicone curable composition, and is a main component for improving the adhesion between the silicone resin and the substrate. It is considered that the segment of the formula (3) existing in (E) is effective for adhesion of the base material, and it is presumed that the aromatic ring system particularly functions. It is considered that when the base material is plastic, an aromatic ring is also contained in the plastic, and the π electrons of the aromatic rings interact with each other, and the adhesion is improved by a stacking effect. Furthermore, it is believed that a segment having a Si-H group exists near the aromatic ring segment, and the formation of a bond between the Si-H group and a functional group on the surface of the substrate also contributes to the improvement of adhesion.
相對於(A)~(C)成分之總量100質量份,(E)成分之配合量為0.01~10質量份,更佳為0.05~5質量份,尤佳為0.1~3質量份,特佳為0.1~1質量 份。配合量未達0.01質量份,則得不到充分的密著提升效果,另一方面,若超過10質量份,則由於聚矽氧黏著劑組成物中的Si-H基變多,有發生黏著劑轉移到被附體之情況。 With respect to 100 parts by mass of the total amount of the components (A) to (C), the compounding amount of the component (E) is 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass, and even more preferably 0.1 to 3 parts by mass. Preferably 0.1 ~ 1 quality Serving. If the blending amount is less than 0.01 parts by mass, a sufficient adhesion-improving effect cannot be obtained. On the other hand, if it exceeds 10 parts by mass, the Si-H group in the polysiloxane adhesive composition increases and adhesion may occur. When the agent is transferred to the attached body.
(E)成分例如可藉由使以下述式(5)所表示的有機化合物(E1)與在1分子中具有至少2個Si-H基的化合物(E2),在觸媒存在下進行氫矽烷化附加而得。 The (E) component can be hydrosilane in the presence of a catalyst, for example, by using an organic compound (E1) represented by the following formula (5) and a compound (E2) having at least two Si-H groups in one molecule. Added from.
上述式(5)中,R14~R21係互相相同或異種的氫原子、鹵素原子、羥基或碳數1~6的1價烴基。作為鹵素原子,可舉出氟、氯、溴等,作為碳數1~6的1 價烴基,可舉出甲基、乙基、丙基、異丙基、丁基等。其中,較佳為氫原子、碳數1~6的烴基,更佳為氫原子、甲基。 In the formula (5), R 14 to R 21 are hydrogen atoms, halogen atoms, hydroxyl groups, or monovalent hydrocarbon groups having 1 to 6 carbon atoms which are the same or different from each other. Examples of the halogen atom include fluorine, chlorine, and bromine. Examples of the monovalent hydrocarbon group having 1 to 6 carbon atoms include methyl, ethyl, propyl, isopropyl, and butyl. Among these, a hydrogen atom and a hydrocarbon group having 1 to 6 carbon atoms are preferred, and a hydrogen atom and a methyl group are more preferred.
W係選自上述式(6)的2價有機基,R22~R23係互相相同或異種的氫原子、鹵素原子、羥基或碳數1~6的1價烴基。作為鹵素原子,可舉出氟、氯、溴等,作為碳數1~6的1價烴基,可舉出甲基、乙基、丙基、異丙基、丁基等。於此等之中,較佳為氫原子、碳數1~6的烴基,更佳為氫原子、甲基。m為1以上之整數,較佳為1~8,更佳為1~5。m比8更大時,由於重複單位之中所佔的烷基變多,與基材的密著性有變差之情況。 W is a divalent organic group selected from the above formula (6), and R 22 to R 23 are hydrogen atoms, halogen atoms, hydroxyl groups, or monovalent hydrocarbon groups having 1 to 6 carbon atoms which are the same or different from each other. Examples of the halogen atom include fluorine, chlorine, and bromine. Examples of the monovalent hydrocarbon group having 1 to 6 carbon atoms include methyl, ethyl, propyl, isopropyl, and butyl. Among these, a hydrogen atom and a hydrocarbon group having 1 to 6 carbon atoms are preferred, and a hydrogen atom and a methyl group are more preferred. m is an integer of 1 or more, preferably 1 to 8, and more preferably 1 to 5. When m is larger than 8, since the number of alkyl groups in the repeating unit increases, the adhesion with the substrate may be deteriorated.
Z係獨立地為碳數1~6的2價烴基,於構造中可具有醚基。作為碳數1~6的2價烴基,可舉出如以下者。 Z is independently a divalent hydrocarbon group having 1 to 6 carbon atoms, and may have an ether group in the structure. Examples of the divalent hydrocarbon group having 1 to 6 carbon atoms include the following.
又,於分子中亦可包含醚基,可舉出如下述者。 Further, an ether group may be contained in the molecule, and examples thereof include the following.
作為表示(E1)成分的具體構造者,可舉出如以下所示者,惟不受此等所限定。再者,下述式中之Me各自表示甲基。 Specific examples of the component showing the (E1) component include the following, but are not limited thereto. Each of Me in the following formulae represents a methyl group.
(E2)係在1分子中具有至少2個Si-H基的化合物,以下述平均組成式(9)所表示。 (E2) is a compound having at least two Si-H groups in one molecule, and is represented by the following average composition formula (9).
R29 vHwSiO(4-v-w)/2 (9)(式中,R29係獨立地為非取代或取代之碳數1~10的1價烴基,v>0,W>0,且0<v+w≦3)。 R 29 v H w SiO (4-vw) / 2 (9) (wherein R 29 is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, v> 0, W> 0, and 0 <v + w ≦ 3).
作為R29之碳數1~10的1價烴基,具體地例如可舉出甲基、乙基、丙基、丁基等之烷基、環己基等之環烷基、乙烯基、烯丙基、己烯基、辛烯基等之烯基、苯 基等之芳基等。再者,此等之基的碳原子所鍵結的氫原子之一部分或全部亦可被鹵素原子或其他的基所取代,作為取代基,可例示三氟甲基、3,3,3-三氟丙基等。作為R29,較佳為飽和的脂肪族基或芳香族基,更佳為甲基、苯基。 Specific examples of the monovalent hydrocarbon group having 1 to 10 carbon atoms of R 29 include alkyl groups such as methyl, ethyl, propyl, and butyl, cycloalkyl groups such as cyclohexyl, vinyl, and allyl. , Alkenyl such as hexenyl, octenyl, and aryl such as phenyl. In addition, a part or all of the hydrogen atoms bonded to the carbon atoms of these groups may be substituted by a halogen atom or other groups. Examples of the substituent include trifluoromethyl, 3,3,3-tri Fluoropropyl and so on. R 29 is preferably a saturated aliphatic group or an aromatic group, and more preferably a methyl group or a phenyl group.
作為表示(E2)成分的具體構造者,可舉出如以下所示者,惟不受此等所限定。再者,下述式中的Me各自表示甲基。 Examples of the specific structure of the component (E2) include the following, but they are not limited thereto. In the following formulae, Me each represents a methyl group.
(E)係藉由使(E1)與(E2)進行氫矽烷化 附加而得的化合物,但此係使(E1)所具有的烯基與(E2)所具有的Si-H基進行附加者。此時,(E2)所具有的Si-H基係不全部反應,不得不殘留至少1個以上。此係為了在聚矽氧硬化性組成物中添加本發明的化合物使用時,使附加於該組成物用的官能基殘存,藉由附加而對於組成物賦予本發明的化合物之機能。 (E) is by hydrosilylation of (E1) and (E2) A compound obtained by adding, but this is an addition of the alkenyl group of (E1) and the Si-H group of (E2). At this time, not all of the Si-H groups contained in (E2) are reacted, and at least one or more of them must be left. This is to add the function of the compound of the present invention to the composition when the compound of the present invention is added to the polysiloxane curable composition and used.
關於(E1)的烯基與(E2)的Si-H基,若將各自的莫耳數當作me1、me2,則反應時的莫耳比為1<(me2)/(me1)<14,較佳為1<(me2)/(me1)<10,更佳為1<(me2)/(me1)<8。(me2)/(me1)小於1時,附加時所需要的Si-H基係不殘存,(me2)/(me1)大於14時,由於(A1)中之來自(a1)的重複單位變少,有無法發揮充分的機能之情況。 Regarding the alkenyl group of (E1) and the Si-H group of (E2), if the respective mole numbers are taken as me1 and me2, the mole ratio during the reaction is 1 <(me2) / (me1) <14, It is preferably 1 <(me2) / (me1) <10, and more preferably 1 <(me2) / (me1) <8. When (me2) / (me1) is less than 1, the Si-H group required for addition does not remain. When (me2) / (me1) is greater than 14, the number of repeating units from (a1) in (A1) is reduced There may be cases where full functions cannot be exerted.
為了使(E1)的烯基與(E2)的Si-H基進行氫矽烷化附加而硬化,需要鉑族金屬系觸媒,作為中心金屬,可舉出鉑、鈀、銥、銠、鋨、釕等當作例子,其中鉑較佳。作為鉑觸媒,可舉出氯鉑酸、氯鉑酸之醇溶液、氯鉑酸與醇之反應物、氯鉑酸與烯烴化合物之反應物、氯鉑酸與含乙烯基的矽氧烷之反應物等。 In order to harden the alkenyl group of (E1) with the Si-H group of (E2) and harden it, a platinum group metal catalyst is required. Examples of the central metal include platinum, palladium, iridium, rhodium, osmium, Ruthenium and the like are taken as examples, with platinum being preferred. Examples of the platinum catalyst include chloroplatinic acid, an alcohol solution of chloroplatinic acid, a reaction product of chloroplatinic acid and an alcohol, a reaction product of chloroplatinic acid and an olefin compound, and a reaction product of chloroplatinic acid and vinyl-containing siloxane. Reactants, etc.
相對於(E1)與(E2)之總量,鉑族系觸媒之量係較佳為金屬量成為0.1~200ppm之量,更佳為0.3~180ppm。若為0.1ppm以下,則有反應慢而不充分進行之情況,若為200ppm以上,則由於反應結束後的觸媒去除不充分而在化合物中觸媒殘存,保存安定性變差之情 況。 The amount of the platinum group catalyst is preferably 0.1 to 200 ppm, more preferably 0.3 to 180 ppm, relative to the total amount of (E1) and (E2). If it is 0.1 ppm or less, the reaction may be slow and inadequate, and if it is 200 ppm or more, the catalyst may remain in the compound due to insufficient catalyst removal after the reaction and the storage stability may deteriorate. condition.
藉由使(E1)的烯基與(E2)的Si-H基進行氫矽烷化附加而製造(E)者,係可藉由常見方法進行。即,藉由於反應容器內加入具有烯基的(E1)與鉑族系觸媒,添加具有Si-H基的(E2),加熱混合而製造。反應結束後藉由減壓餾去來去除雜質而純化。於製造中,可任意地使用溶劑,具體地可使用甲苯、二甲苯等之芳香族烴系溶劑、己烷、庚烷、辛烷、異辛烷、癸烷、環己烷、甲基環己烷、異烷烴等之脂肪族烴系溶劑、工業用汽油、石油醚、溶劑油等之烴系溶劑、丙酮、甲基乙基酮、2-戊酮、3-戊酮、2-己酮、2-庚酮、4-庚酮、甲基異丁基酮、二異丁基酮、丙酮基丙酮、環己酮等之酮系溶劑等。 The production of (E) by hydrosilylation of the (E1) alkenyl group and the (E2) Si-H group can be performed by a common method. That is, it is produced by adding (E1) having an alkenyl group and a platinum group catalyst into the reaction vessel, adding (E2) having a Si-H group, and heating and mixing. After completion of the reaction, the impurities were purified by distillation under reduced pressure. In the production, a solvent can be arbitrarily used, and specifically, aromatic hydrocarbon solvents such as toluene and xylene, hexane, heptane, octane, isooctane, decane, cyclohexane, and methylcyclohexane can be used. Aliphatic hydrocarbon solvents such as alkanes, isoalkanes, hydrocarbon solvents such as industrial gasoline, petroleum ether, and solvent oil, acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, Ketone solvents such as 2-heptanone, 4-heptanone, methyl isobutyl ketone, diisobutyl ketone, acetone acetone, and cyclohexanone.
於100g中含有0.15莫耳以上烯基的矽化合物。 100 g of a silicon compound containing an alkenyl group of 0.15 mol or more was contained.
(F)成分係抑制經時地對於被附體的黏著力之上升用的成分。若使用(E)之密著提升劑,則基材密著變良好,同時當使用聚矽氧硬化性組成物作為黏著性物品的接著劑時,由於對於被附體黏著力經時地上升,(F)係有效於抑制其。關於其理由,推測係藉由對於聚矽氧黏著劑之乙烯基量少的基礎材料,添加少量但乙烯基量多的添加劑,由於黏著層全體的交聯密度變大,而黏著層之硬度上升,難以深入被附體。 (F) A component is a component which suppresses the increase of the adhesive force with respect to an adherend over time. When the adhesion enhancer (E) is used, the adhesion of the substrate is improved. At the same time, when a silicone curable composition is used as an adhesive for an adhesive article, the adhesion to the adherend increases over time. (F) is effective for suppressing it. The reason for this is presumably that by adding a small amount of an additive with a large amount of vinyl to the base material having a small amount of vinyl in the polysiloxane adhesive, the hardness of the adhesive layer increases due to the increase in the crosslinking density of the entire adhesive layer. It is difficult to penetrate deeply.
(F)成分中所含有的烯基之量,係有機聚矽 氧烷每100g,為0.15莫耳以上,較佳為0.18莫耳以上,更佳為0.20莫耳以上。比0.15莫耳更少時,黏著力上升的抑制效果會變弱。上限係沒有特別的限定,但可為2.0莫耳以下。又,較佳為於1分子中具有至少1個矽氧烷鍵者。 (F) The amount of alkenyl groups contained in the component is an organic polysilicon The oxane is 0.15 mol or more per 100 g, preferably 0.18 mol or more, and more preferably 0.20 mol or more. If it is less than 0.15 mol, the effect of suppressing the increase in adhesion becomes weak. The upper limit is not particularly limited, but may be 2.0 mol or less. Moreover, it is preferable to have at least one siloxane bond in one molecule.
作為烯基,較佳為碳數2~10者,例如可舉出乙烯基、烯丙基、己烯基、辛烯基等之烯基、丙烯醯基丙基、丙烯醯基甲基、甲基丙烯醯基丙基等之丙烯醯基烷基、甲基丙烯醯基烷基、環己烯基乙基等之環烯基烷基、乙烯氧基丙基等之烯氧基烷基等。其中,較佳為乙烯基。 The alkenyl group is preferably one having 2 to 10 carbon atoms, and examples thereof include alkenyl groups such as vinyl, allyl, hexenyl, and octenyl, acrylmethyl, propylmethyl, and methyl Acrylofluorenylalkyl such as propylenepropenylpropyl, cyclopropenylalkyl such as methacrylfluorenylalkyl, cycloalkenylalkyl such as cyclohexenylethyl, and alkenyloxyalkyl such as vinyloxypropyl. Among them, vinyl is preferred.
(F)成分之黏度(25℃)係較佳為0.1~20,000mPa‧s之範圍,更佳為1~10,000mPa‧s之範圍。再者,黏度係藉由旋轉黏度計測定之值。 (F) The viscosity (25 ° C) of the component is preferably in the range of 0.1 to 20,000 mPa · s, and more preferably in the range of 1 to 10,000 mPa · s. The viscosity is a value measured by a rotary viscometer.
作為(F)成分之例,可舉出以下述平均組成式(10)所表示,於100g中含有0.15莫耳以上烯基的矽化合物。式中,n為0.1~100,p為0.1~100,q為0.01~10。 Examples of the component (F) include a silicon compound represented by the following average composition formula (10) and containing 0.15 mol or more of an alkenyl group in 100 g. In the formula, n is 0.1 to 100, p is 0.1 to 100, and q is 0.01 to 10.
作為(F)成分的具體例,尚可舉出如以下所示者,但不受此等所限定。再者,下述式中的Me、Vi各自表示甲基、乙烯基。 Specific examples of the (F) component include the following, but are not limited thereto. In addition, Me and Vi in the following formula each represent a methyl group and a vinyl group.
相對於(A)~(C)成分之總量100質量份,(F)成分之配合量為0.01~10質量份,較佳為0.05~5質量份,更佳為0.1~3質量份。若比0.01質量份更少,則前述黏著力上升抑制效果變弱,若比10質量份更 多,則由於交聯點過多而有硬化性變差之情況。 The compounding amount of the (F) component is 0.01 to 10 parts by mass, preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 3 parts by mass with respect to 100 parts by mass of the total amount of the components (A) to (C). If it is less than 0.01 parts by mass, the aforementioned effect of suppressing the increase in adhesive force is weakened, and if it is less than 10 parts by mass If there are too many, the hardening property may deteriorate due to too many crosslinking points.
(G)成分係控制劑,控制劑係在調配聚矽氧黏著劑組成物或塗布於基材上時添加,為了不使在加熱硬化以前附加反應開始而處理液發生增黏或凝膠化。反應控制劑係配位於附加反應觸媒的鉑族金屬上而抑制附加反應,於加熱硬化時配位係脫離而展現催化活性。附加反應硬化型聚矽氧組成物中所習用的反應控制劑係皆可使用。作為具體例,可舉出3-甲基-1-丁炔-3-醇、3-甲基-1-戊炔-3-醇、3,5-二甲基-1-己炔-3-醇、乙炔基環己醇(1-乙炔基-1-環己醇)、3-甲基-3-三甲基矽烷氧基-1-丁炔、3-甲基-3-三甲基矽烷氧基-1-戊炔、3,5-二甲基-3-三甲基矽烷氧基-1-己炔、1-乙炔基-1-三甲基矽烷氧基環己烷、雙(2,2-二甲基-3-丁炔氧基)二甲基矽烷、1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷、1,1,3,3-四甲基-1,3-二乙烯基二矽氧烷、馬來酸酯、己二酸酯等。 (G) A component-based control agent, which is added when a polysiloxane adhesive composition is formulated or coated on a substrate, so that the treatment liquid does not thicken or gelatinize so as not to start an additional reaction before heat curing. The reaction control agent is arranged on the platinum group metal of the additional reaction catalyst to suppress the additional reaction, and the coordination system is detached during heat hardening to exhibit catalytic activity. Any reaction control agent conventionally used in the additional reaction-hardening polysiloxane composition can be used. Specific examples include 3-methyl-1-butyne-3-ol, 3-methyl-1-pentyne-3-ol, 3,5-dimethyl-1-hexyne-3-ol Alcohol, ethynylcyclohexanol (1-ethynyl-1-cyclohexanol), 3-methyl-3-trimethylsilyloxy-1-butyne, 3-methyl-3-trimethylsilane Oxy-1-pentyne, 3,5-dimethyl-3-trimethylsilyloxy-1-hexyne, 1-ethynyl-1-trimethylsilyloxycyclohexane, bis (2 , 2-dimethyl-3-butynyloxy) dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1, 1,3,3-tetramethyl-1,3-divinyldisiloxane, maleate, adipate, and the like.
相對於(A)~(C)成分之總量100質量份,(G)控制劑之配合量較佳為0.01~5質量份,更佳為0.05~2質量份。 The blending amount of the (G) control agent is preferably 0.01 to 5 parts by mass, and more preferably 0.05 to 2 parts by mass with respect to 100 parts by mass of the total amount of the components (A) to (C).
(H)成分係藉由添加至聚矽氧黏著劑組成物中,而在組成物的交聯網絡中製作矽氧烷的側基(pendant)用 之成分,由於矽氧烷的側基存在,可達成抑制對於被附體的黏著力之經時地上升的任務。使用聚矽氧硬化性組成物作為黏著性物品的接著劑時,對於被附體的黏著力係經時地上升,但藉由使用(H)成分,基材密著成為良好,同時可抑制對於被附體的黏著力上升。 The (H) component is added to the polysiloxane adhesive composition to produce a pendant of the siloxane in the crosslinked network of the composition. Due to the presence of pendant groups of siloxane, the component can achieve the task of suppressing the adhesion of the adherend to increase over time. When a silicone curable composition is used as an adhesive for an adhesive article, the adhesion force to the adherend increases over time, but by using the (H) component, the substrate adheres well, and the adhesion to the substrate can be suppressed. The adhesion of the attached body increases.
具體地,可添加(H)以下述平均組成式(7)所表示的有機氫聚矽氧烷(惟,不包括上述(C)成分)。 Specifically, (H) an organohydrogenpolysiloxane represented by the following average composition formula (7) (but excluding the component (C) described above) may be added.
上述式(7)中,R24係可相同或相異之碳數1~10的1價烴基,例如可舉出甲基、乙基、丙基、丁基等之烷基、環己基等之環烷基、乙烯基、烯丙基、己烯基、辛烯基等之烯基、苯基等之芳基等。再者,此等之基的碳原子所鍵結的氫原子之一部分或全部亦可被鹵素原子或其他的基所取代,作為取代基,可例示三氟甲基、3,3,3-三氟丙基等。其中,較佳為飽和的脂肪族基或芳香族基,更佳為甲基、苯基。 In the formula (7), R 24 is a monovalent hydrocarbon group having 1 to 10 carbon atoms which may be the same or different, and examples thereof include alkyl groups such as methyl, ethyl, propyl, and butyl, and cyclohexyl. Cycloalkyl, vinyl, allyl, hexenyl, octenyl and other alkenyl groups, phenyl and other aryl groups and the like. In addition, a part or all of the hydrogen atoms bonded to the carbon atoms of these groups may be substituted by a halogen atom or other groups. Examples of the substituent include trifluoromethyl, 3,3,3-tri Fluoropropyl and so on. Among these, a saturated aliphatic group or an aromatic group is preferable, and a methyl group and a phenyl group are more preferable.
i為1以上之整數,較佳為1~3,更佳為i=1。較佳為僅在分子末端具有Si-H基的有機氫聚矽氧 烷,更佳為在分子末端具有一個Si-H基的有機氫聚矽氧烷。基於如前述之點,(F)成分係在聚矽氧烷的末端具有可交聯的Si-H基之構造者為有效,在1分子中具有1個Si-H基的聚矽氧烷為特別合適。j為1以上之整數,k為1以上之整數,l及m為0以上之整數,5≦i+j+k+l+m≦500,較佳為7≦i+j+k+l+m≦300,更佳為8≦i+j+k+l+m≦200。i+j+k+l+m比5更小時,如前述的側基之效果係不充分發揮,i+j+k+l+m比500更大時,由於側基部分過長而發生在側基彼此的分子之絡合,黏著力上升的抑制會不充分。 i is an integer of 1 or more, preferably 1 to 3, and more preferably i = 1. An organohydrogenpolysiloxane having a Si-H group only at the molecular end is preferred Alkane is more preferably an organohydrogenpolysiloxane having one Si-H group at the molecular terminal. Based on the foregoing, a component having a crosslinkable Si-H group at the end of the polysiloxane is effective in the (F) component, and a polysiloxane having one Si-H group in one molecule is Especially suitable. j is an integer of 1 or more, k is an integer of 1 or more, l and m are integers of 0 or more, 5 ≦ i + j + k + l + m ≦ 500, preferably 7 ≦ i + j + k + l + m ≦ 300, more preferably 8 ≦ i + j + k + l + m ≦ 200. When i + j + k + l + m is smaller than 5, the effect of the side group is not fully exerted. When i + j + k + l + m is larger than 500, it occurs because the side group is too long. The side-group molecules are complexed with each other, and the suppression of the increase in adhesion is insufficient.
作為表示(H)成分的具體構造者,可舉出如以下所示者等,但不受此等所限定。再者,下述式中的i-Pr,n-Bu各自表示異丙基、正丁基。Q為4~300,較佳為4~100,R為1~10。 Specific examples of the structure representing the (H) component include the following, but are not limited thereto. In addition, i-Pr and n-Bu in the following formulae each represent an isopropyl group and an n-butyl group. Q is 4 to 300, preferably 4 to 100, and R is 1 to 10.
相對於上述(A)~(C)成分之總量100質量份,(H)成分之配合量為0.01~100質量份,較佳為0.05~50質量份,更佳為0.1~20質量份,尤佳為0.5~10質量份。配合量若比0.01質量份還少,則前述黏著力上升抑制效果變弱,添加量若比100質量份更多,則由於聚矽氧黏著劑組成物中的Si-H基變多,有發生黏著劑轉移到被附體之情況。 The compounding amount of the (H) component is 0.01 to 100 parts by mass, preferably 0.05 to 50 parts by mass, and more preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the total of the components (A) to (C). It is particularly preferably 0.5 to 10 parts by mass. If the blending amount is less than 0.01 parts by mass, the aforementioned effect of suppressing the increase in adhesion will be weakened. If the adding amount is more than 100 parts by mass, the Si-H group in the polysiloxane adhesive composition will increase, which may occur. In the case where the adhesive is transferred to the attached body.
若全部混合前述的成分,則黏度變高而處理變困難, 故可任意添加用於稀釋的溶劑。作為溶劑,可舉出甲苯、二甲苯等之芳香族烴系溶劑、己烷、庚烷、辛烷、異辛烷、癸烷、環己烷、甲基環己烷、異烷烴等之脂肪族烴系溶劑、工業用汽油、石油醚、溶劑油等之烴系溶劑、丙酮、甲基乙基酮、2-戊酮、3-戊酮、2-己酮、2-庚酮、4-庚酮、甲基異丁基酮、二異丁基酮、丙酮基丙酮、環己酮等之酮系溶劑、醋酸乙酯、醋酸丙酯、醋酸異丙酯、醋酸丁酯、醋酸異丁酯等之酯系溶劑、二乙基醚、二丙基醚、二異丙基醚、二丁基醚、1,2-二甲氧基乙烷、1,4-二烷等之醚系溶劑、2-甲氧基乙基乙酸酯、2-乙氧基乙基乙酸酯、丙二醇單甲基醚乙酸酯、2-丁氧基乙基乙酸酯等之具有酯與醚部分之溶劑、六甲基二矽氧烷、八甲基三矽氧烷、八甲基環四矽氧烷、十甲基環五矽氧烷、三(三甲基矽烷氧基)甲基矽烷、四(三甲基矽烷氧基)矽烷等之矽氧烷系溶劑、或此等之混合溶劑等。此等係可單獨1種或適宜組合2種以上使用。 When all of the aforementioned components are mixed, the viscosity becomes high and handling becomes difficult. Therefore, a solvent for dilution can be arbitrarily added. Examples of the solvent include aromatic hydrocarbon solvents such as toluene and xylene, and aliphatics such as hexane, heptane, octane, isooctane, decane, cyclohexane, methylcyclohexane, and isoalkane. Hydrocarbon solvents, hydrocarbon solvents for industrial gasoline, petroleum ether, solvent oil, etc., acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, 2-heptanone, 4-heptane Ketone solvents such as ketones, methyl isobutyl ketones, diisobutyl ketones, acetone acetone, cyclohexanone, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, etc. Ester solvents, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, 1,2-dimethoxyethane, 1,4-di Ether solvents such as alkane, 2-methoxyethyl acetate, 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, 2-butoxyethyl acetate, etc. Solvents with ester and ether moieties, hexamethyldisilazane, octamethyltrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, tris (trimethylsilyloxy) ) Siloxane-based solvents such as methylsilane, tetrakis (trimethylsilyloxy) silane, or mixed solvents thereof. These systems can be used alone or in a suitable combination of two or more.
藉由將上述聚矽氧組成物塗布於基材的至少一面上及使硬化,可形成具備基材與形成在基材的至少一面上之黏著層的黏著性物品。 By coating the above-mentioned polysiloxane composition on at least one surface of the substrate and curing it, an adhesive article having the substrate and an adhesive layer formed on at least one surface of the substrate can be formed.
作為塗布聚矽氧黏著劑之基材,可選擇紙或塑膠製的塑膠薄膜、玻璃、金屬。作為紙,可舉出上質紙、塗布紙、銅版紙、玻璃紙、聚乙烯層合紙、牛皮紙 等。作為塑膠薄膜,可舉出聚乙烯薄膜、聚丙烯薄膜、聚酯薄膜、聚醯亞胺薄膜、聚氯乙烯薄膜、聚偏二氯乙烯薄膜、聚乙烯醇薄膜、聚碳酸酯薄膜、聚四氟乙烯薄膜、聚苯乙烯薄膜、乙烯-醋酸乙烯酯共聚物薄膜、乙烯-乙烯醇共聚物薄膜、三乙醯基纖維素薄膜、聚醚醚酮薄膜、聚苯硫薄膜等。關於玻璃,在厚度或種類等沒有特別的限制,亦可為施有化學強化處理等者。又,玻璃纖維亦可適用,玻璃纖維係可為單質,也可使用與其他樹脂複合者。作為金屬,可例示鋁箔、銅箔、金箔、銀箔、鎳箔等。 As the base material for coating the polysiloxane adhesive, paper or plastic plastic film, glass, metal can be selected. Examples of the paper include high-quality paper, coated paper, coated paper, cellophane, polyethylene laminated paper, and kraft paper. Wait. Examples of the plastic film include polyethylene film, polypropylene film, polyester film, polyimide film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, polycarbonate film, and polytetrafluoroethylene. Ethylene film, polystyrene film, ethylene-vinyl acetate copolymer film, ethylene-vinyl alcohol copolymer film, triethylfluorenyl cellulose film, polyetheretherketone film, polyphenylene sulfide film, etc. The glass is not particularly limited in thickness, kind, and the like, and may be one subjected to chemical strengthening treatment or the like. Moreover, glass fiber is also applicable, and a glass fiber system may be single substance, and a compound with other resin may also be used. Examples of the metal include aluminum foil, copper foil, gold foil, silver foil, and nickel foil.
於此等基材之中,如本發明的聚矽氧黏著劑係較宜使用塑膠薄膜作為基材。以各種塑膠薄膜作為基材所製作的黏著膠帶或黏著片係可使用於各式各樣的用途。作為被附體,可舉出玻璃、金屬、塑膠等。作為黏著性物品,可用於各種顯示器之保護膜、電絕緣膠帶、遮蔽膠帶、電線絕緣包布(splicing tape)、對皮膚的貼附等。作為顯示器,可舉出電視接收機、電腦用監視器、攜帶資訊終端用監視器、監視用監視器、攝影機、數位相機、行動電話、攜帶資訊終端、汽車等之儀錶板用顯示器、各種的設備‧裝置‧機器之儀錶板用顯示器、液晶顯示器、有機EL顯示器、自動售票機、自動提款機等之顯示文字或記號、圖像用的各種觸控面板或平面顯示器(FPD)等。 Among these substrates, the silicone adhesive of the present invention is preferably a plastic film as a substrate. Adhesive tapes or sheets made with various plastic films as substrates can be used for a variety of applications. Examples of the adherend include glass, metal, and plastic. As an adhesive article, it can be used for protective films of various displays, electrical insulating tapes, masking tapes, splicing tapes for electric wires, and adhesion to the skin. Examples of the display include a television receiver, a computer monitor, a portable information terminal monitor, a surveillance monitor, a video camera, a digital camera, a mobile phone, a portable information terminal, a dashboard display of an automobile, and various devices. ‧Equipment‧Instrument panel displays, liquid crystal displays, organic EL displays, automatic ticket machines, cash dispensers, etc. to display characters or signs, various touch panels or flat panel displays (FPDs) for images, etc.
基材係基材薄膜的厚度沒有特別的限定,但較佳為1~200μm,更佳為5~150μm。於基材薄膜之情況,得到一種黏著薄膜,其具備基材薄膜與在基材薄膜的 至少一面上塗布上述聚矽氧組成物,使硬化而形成之黏著層。 The thickness of the substrate-based substrate film is not particularly limited, but is preferably 1 to 200 μm, and more preferably 5 to 150 μm. In the case of a base film, an adhesive film is obtained, which comprises a base film and Adhesive layer formed by coating the above polysiloxane composition on at least one side and hardening.
為了提高基材與黏著層的密著性,亦可使用經底漆處理、電暈處理、蝕刻處理、電漿處理、噴砂處理者。較佳可為電暈處理。亦可不進行底漆處理,而成為無底漆層之構成。 In order to improve the adhesion between the substrate and the adhesive layer, a primer-treated, corona-treated, etching-treated, plasma-treated, or sand-blasted treatment can also be used. Corona treatment is preferred. It is also possible to form a primerless layer without performing a primer treatment.
於基材之黏著層面與相反面上,較佳為進行損傷防止、污髒防止、指紋附著防止、防眩、防反射、抗靜電等之處理等的表面處理。可於基材上塗布黏著層後進行上述的各表面處理,也可在表面處理後塗布黏著層。 It is preferable to perform surface treatments such as damage prevention, dirt prevention, fingerprint adhesion prevention, anti-glare, anti-reflection, anti-static, and the like on the adhesive layer surface and the opposite surface of the substrate. Each of the above surface treatments may be performed after the adhesive layer is coated on the substrate, or the adhesive layer may be applied after the surface treatment.
作為損傷防止處理(硬塗處理),可舉出丙烯酸酯系、聚矽氧系、氧雜環丁烷系、無機系、有機無機混成系等之硬塗劑的處理。 Examples of the damage prevention treatment (hard coating treatment) include treatments of hard coating agents such as acrylate-based, polysiloxane-based, oxetane-based, inorganic-based, and organic-inorganic hybrid systems.
作為防污處理,可舉出氟系、聚矽氧系、陶瓷系、光觸媒系等之防污處理劑的處理。 Examples of the antifouling treatment include treatment of antifouling agents such as fluorine-based, polysiloxane-based, ceramic-based, and photocatalyst-based agents.
作為防反射處理,可舉出氟系、聚矽氧系等之防反射劑的塗布之濕處理,或蒸鍍或濺鍍之乾處理。作為抗靜電處理,可舉出界面活性劑系、聚矽氧系、有機硼系、導電性高分子系、金屬氧化物系、蒸鍍金屬系等之抗靜電劑的處理。 Examples of the antireflection treatment include a wet treatment for coating an antireflection agent such as a fluorine-based or polysiloxane-based agent, or a dry treatment for vapor deposition or sputtering. Examples of the antistatic treatment include treatment of antistatic agents such as surfactants, polysiloxanes, organic borons, conductive polymers, metal oxides, and vapor deposited metals.
塗布方法只要是使用眾所周知的塗布方式即可,例如可舉出缺角輪(comma)、塗布機、唇塗機、輥塗機、刀塗機、刮板塗布機、桿塗機、吻塗機、凹版塗布機、網版塗布、浸漬塗布、澆鑄塗布等。 As long as the coating method is a well-known coating method, for example, a comma, a coater, a lip coater, a roll coater, a knife coater, a blade coater, a rod coater, and a kiss coater are mentioned , Gravure coater, screen coating, dip coating, casting coating, etc.
塗布量係沒有特別的限制,但硬化後的黏著劑層之厚度可為0.1~300μm,較佳為0.5~200μm。 The coating amount is not particularly limited, but the thickness of the adhesive layer after curing may be 0.1 to 300 μm, and preferably 0.5 to 200 μm.
一般地,於聚矽氧黏著劑中大部分沒有混合觸媒。觸媒係在實際使用前均勻混合而使用。作為硬化條件,只要在80~150℃為20秒~10分鐘即可,惟不受此所限定。 Generally, most catalysts are not mixed in polysiloxane adhesives. The catalyst is used before being evenly mixed. The hardening conditions are not limited as long as they are 20 seconds to 10 minutes at 80 to 150 ° C.
硬化後的聚矽氧黏著劑組成物之黏著力較佳為0.01~12.0N/25mm之範圍,更佳為0.01~10.0N/25mm,尤佳為0.01~8.0N/25mm。於0.01N/25mm以上,更貼附於被附體,於12.0N/25mm以下,重做變更容易。 The adhesive force of the cured silicone adhesive composition is preferably in the range of 0.01 to 12.0 N / 25 mm, more preferably 0.01 to 10.0 N / 25 mm, and even more preferably 0.01 to 8.0 N / 25 mm. Above 0.01N / 25mm, it is more attached to the body, and below 12.0N / 25mm, it is easy to redo changes.
以下,顯示製造例、實施例及比較例,具體說明本發明,惟本發明不受下述的實施例所限制。又,Me表示甲基,Vi表示乙烯基,n-Bu表示正丁基。 Hereinafter, manufacturing examples, examples, and comparative examples are shown to specifically explain the present invention, but the present invention is not limited to the following examples. Me is methyl, Vi is vinyl, and n-Bu is n-butyl.
於安裝有攪拌裝置、溫度計、滴液漏斗、回流冷卻管的500mL之可分離式燒瓶中,加入1,3,5,7-四甲基環四矽氧烷144.3g(0.6mol)、甲苯144.3g、1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷鉑(0)錯合物之含有鉑分0.5質量%的甲苯溶液0.03g,混合攪拌,加熱至60~65℃左右。於其中,自滴液漏斗滴下2,2-雙(4-烯丙氧基苯基) 丙烷61.7g(0.2mol),滴下結束後加熱至80~85℃左右,於此溫度反應1小時。反應結束後,為了去除觸媒的鉑,添加活性碳0.3g並混合2小時後,藉由過濾去除活性碳。對所得之液體進行90℃/8小時減壓濃縮,而得到無色透明的液體。調查結果可知為以下所示的化合物之混合物,z1=0~4中z1=2之化合物為主成分。 In a 500 mL separable flask equipped with a stirring device, a thermometer, a dropping funnel, and a reflux cooling tube, add 1,3,5,7-tetramethylcyclotetrasiloxane 144.3 g (0.6 mol) and toluene 144.3 g, 0.03 g of a toluene solution containing 0.5% by mass of platinum content of 1,3-divinyl-1,1,3,3-tetramethyldisilanium platinum (0) complex, mix and stir, and heat to About 60 ~ 65 ℃. In it, 2,2-bis (4-allyloxyphenyl) was dropped from the dropping funnel 61.7 g (0.2 mol) of propane was heated to about 80-85 ° C. after the dropping was completed, and reacted at this temperature for 1 hour. After the reaction, in order to remove the platinum of the catalyst, 0.3 g of activated carbon was added and mixed for 2 hours, and then the activated carbon was removed by filtration. The obtained liquid was concentrated under reduced pressure at 90 ° C for 8 hours to obtain a colorless transparent liquid. As a result of the investigation, it can be seen that the mixture is a mixture of the compounds shown below. Among the compounds z1 = 0 to 4, z1 = 2 is the main component.
於安裝有攪拌裝置、溫度計、滴液漏斗、回流冷卻管的500mL之可分離式燒瓶中,加入1,3,5,7-四甲基環四矽氧烷96.2g(0.4mol)、甲苯96.2g、1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷鉑(0)錯合物之含有鉑分0.5質量的甲苯溶液0.03g,混合攪拌,加熱至60~65℃左右。於其中,自滴液漏斗滴下2,2-雙(4-烯丙氧基苯基)丙烷 61.7g(0.2mol),滴下結束後加熱至80~85℃左右,於此溫度反應2小時。反應結束後,為了去除觸媒的鉑,添加活性碳0.3g及混合2小時後,藉由過濾去除活性碳。對所得之液體進行90℃/8小時減壓濃縮,而得到無色透明的液體。調查結果可知為上述製造例1所示的化合物之混合物,z1=0~4中z1=3之化合物為主成分。 In a 500 mL separable flask equipped with a stirring device, a thermometer, a dropping funnel, and a reflux cooling tube, add 1,3,5,7-tetramethylcyclotetrasiloxane, 96.2 g (0.4 mol), and toluene 96.2 g, 0.03 g of a toluene solution containing 0.5 mass of platinum content of 1,3-divinyl-1,1,3,3-tetramethyldisilanium platinum (0) complex, mix and stir, and heat to 60 ~ 65 ℃. In it, 2,2-bis (4-allyloxyphenyl) propane was dropped from the dropping funnel 61.7 g (0.2 mol), after the dropping, heat to about 80-85 ° C, and react at this temperature for 2 hours. After the reaction, in order to remove the platinum of the catalyst, 0.3 g of activated carbon was added and mixed for 2 hours, and then the activated carbon was removed by filtration. The obtained liquid was concentrated under reduced pressure at 90 ° C for 8 hours to obtain a colorless transparent liquid. As a result of the investigation, it was found that the compound was a mixture of the compounds shown in Production Example 1 above, and the compound with z1 = 3 in z1 = 0 to 4 was the main component.
於安裝有攪拌裝置、溫度計、滴液漏斗、回流冷卻管的500mL之可分離式燒瓶中,加入二甲基二甲氧基矽烷86.54g(0.7mol)、甲基乙烯基二甲氧基矽烷52.89g(0.4mol)與甲醇8.00g,自滴液漏斗滴下成為2種類矽烷的合計之50ppm量的KOH與蒸餾水100g,於甲醇回流下反應2小時後,進行60℃/4小時減壓濃縮,得到末端經矽烷醇或甲氧基所封鎖之含有乙烯基的矽氧烷。藉由將所得之油與3-環氧丙氧基丙基三甲氧基矽烷以質量比成為50/50之方式,於室溫下混合攪拌1小時左右,得到化合物。 In a 500 mL separable flask equipped with a stirring device, a thermometer, a dropping funnel, and a reflux cooling tube, 86.54 g (0.7 mol) of dimethyldimethoxysilane and 52.89 of methylvinyldimethoxysilane were added. g (0.4 mol) and 8.00 g of methanol, dripped from the dropping funnel into a total of 50 ppm of KOH and 100 g of distilled water, and reacted for 2 hours under methanol reflux, and then concentrated under reduced pressure at 60 ° C / 4 hours to obtain Vinyl-containing siloxanes blocked at the ends by silanols or methoxy groups. The compound was obtained by mixing and stirring the obtained oil and 3-glycidoxypropyltrimethoxysilane at a mass ratio of 50/50 at room temperature for about 1 hour.
混合(A)以下述平均組成式(a)所表示之具有乙烯基的聚二甲基矽氧烷90質量份、
(B)作為不揮發分之含有Me3SiO1/2單位及SiO2單位,(Me3SiO1/2單位)/(SiO2單位)之莫耳比為0.85的有機聚矽氧烷之60質量%甲苯溶液10質量份,(C)以下述平均組成式(c-1)所表示的有機氫聚矽氧烷0.29質量份、
(C)以平均組成式(c-2)所表示的有機氫聚矽氧烷0.41質量份、及
(G)乙炔基環己醇0.16質量份,以甲苯稀釋而得到有效成分60質量%的混合物。 (G) 0.16 parts by mass of ethynylcyclohexanol, and diluted with toluene to obtain a mixture of 60% by mass of the active ingredient.
於所得之有效成分60質量%的混合物100質量份中,加入甲苯50質量份,添加(D)1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷鉑(0)錯合物之含有鉑分0.5質量%的甲苯溶液0.5質量份、作為本發明之密著提升成分 的(E)成分之由製造例1所得的化合物2質量份、與作為(F)成分的以下述平均組成式(f-1)所表示之25℃的黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物2質量份,製作聚矽氧黏著劑組成物。 50 parts by mass of toluene was added to 100 parts by mass of the obtained 60% by mass active ingredient mixture, and (D) 1,3-divinyl-1,1,3,3-tetramethyldisilazane platinum ( 0) 0.5 part by mass of a toluene solution containing 0.5% by mass of platinum as a complex, as the adhesion-improving component of the present invention The (E) component has 2 parts by mass of the compound obtained in Production Example 1, and the viscosity at 25 ° C. represented by the following average composition formula (f-1) as the (F) component is 24.0 mPa · s and 100 g The silicone compound contained 2 parts by mass of 0.53 moles of a silicon compound to produce a polysiloxane adhesive composition.
除了使由製造例1所得的化合物成為0.5質量份,以平均組成式(f-1)表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物成為0.5質量份以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 Except that the compound obtained in Production Example 1 was 0.5 parts by mass, the silicon compound having a viscosity represented by an average composition formula (f-1) of 24.0 mPa · s and a vinyl group content of 0.53 in 100 g was 0.5 mass A polysiloxane adhesive composition was produced in the same manner as in Example 1 except that the amount was not greater than 1 part.
除了使由製造例1所得的化合物成為0.4質量份,以平均組成式(f-1)表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物成為0.4質量份以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 Except that the compound obtained in Production Example 1 was 0.4 parts by mass, the silicon compound having a viscosity represented by the average composition formula (f-1) of 24.0 mPa · s and the amount of vinyl contained in 100 g of 0.53 mole was 0.4 mass. A polysiloxane adhesive composition was produced in the same manner as in Example 1 except that the amount was not greater than 1 part.
除了不添加以平均組成式(f-1)所表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物以外,與實施例3同樣地製作聚矽氧黏著劑組成 物。 A polysiloxane adhesive was produced in the same manner as in Example 3, except that a silicon compound having a viscosity of 24.0 mPa · s and a vinyl group content of 0.53 mol in 100 g was not added, as shown in the average composition formula (f-1). Agent composition Thing.
除了使由製造例1所得的化合物成為0.3質量份,以平均組成式(f-1)表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物成為0.3質量份以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 Except that the compound obtained in Production Example 1 was 0.3 parts by mass, the silicon compound having a viscosity represented by the average composition formula (f-1) of 24.0 mPa · s and the amount of vinyl contained in 100 g of 0.53 mole was 0.3 mass. A polysiloxane adhesive composition was produced in the same manner as in Example 1 except that the amount was not greater than 1 part.
除了使由製造例1所得的化合物成為0.2質量份,以平均組成式(f-1)表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物成為0.2質量份以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 Except that the compound obtained in Production Example 1 was 0.2 parts by mass, the silicon compound having a viscosity represented by an average composition formula (f-1) of 24.0 mPa · s and a vinyl group content of 0.53 in 100 g was 0.2 mass A polysiloxane adhesive composition was produced in the same manner as in Example 1 except that the amount was not greater than 1 part.
除了使以平均組成式(c-1)所表示的有機氫聚矽氧烷成為0.12質量份、以平均組成式(c-2)所表示的有機氫聚矽氧烷成為0.16質量份、由製造例1所得的化合物成為0.4質量份、以平均組成式(f-1)所表示之25℃的黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物成為0.4質量份以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 The organic hydrogen polysiloxane represented by the average composition formula (c-1) is 0.12 parts by mass, and the organic hydrogen polysiloxane represented by the average composition formula (c-2) is 0.16 parts by mass. The silicon compound obtained in Example 1 was 0.4 parts by mass, the viscosity at 25 ° C. represented by the average composition formula (f-1) was 24.0 mPa · s, and the silicon compound contained in 100 g of 0.53 moles of silicon compound was 0.4 mass. A polysiloxane adhesive composition was produced in the same manner as in Example 1 except that the amount was not greater than 1 part.
除了使以平均組成式(c-1)所表示的有機氫聚矽氧烷成為0.46質量份、以平均組成式(c-2)所表示的有機氫聚矽氧烷成為0.66質量份、由製造例1所得的化合物成為0.4質量份、以平均組成式(f-1)所表示之25℃的黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物成為0.4質量份以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 The organic hydrogen polysiloxane represented by the average composition formula (c-1) was changed to 0.46 parts by mass, and the organic hydrogen polysiloxane represented by the average composition formula (c-2) was changed to 0.66 parts by mass. The silicon compound obtained in Example 1 was 0.4 parts by mass, the viscosity at 25 ° C. represented by the average composition formula (f-1) was 24.0 mPa · s, and the silicon compound contained in 100 g of 0.53 moles of silicon compound was 0.4 mass. A polysiloxane adhesive composition was produced in the same manner as in Example 1 except that the amount was not greater than 1 part.
除了使製造例1所得的化合物、製造例2所得的化合物成為0.4質量份、以平均組成式(f-1)所表示之25℃的黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物成為0.4質量份以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 Except that the compound obtained in Production Example 1 and the compound obtained in Production Example 2 were 0.4 parts by mass, the viscosity at 25 ° C. represented by the average composition formula (f-1) was 24.0 mPa · s, and the amount of vinyl contained in 100 g A polysiloxane adhesive composition was prepared in the same manner as in Example 1 except that the silicon compound having a molar content of 0.53 was changed to 0.4 parts by mass.
除了使以平均組成式(f-1)所表示之25℃的黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物成為0.2質量份以外,與實施例3同樣地製作聚矽氧黏著劑組成物。 The same as Example 3 except that the silicon compound having a viscosity at 25 ° C. expressed by the average composition formula (f-1) of 24.0 mPa · s and a vinyl compound content of 100 g of 0.53 mol was 0.2 parts by mass. Polysiloxane adhesive composition is produced.
除了使以平均組成式(f-1)所表示之25℃的黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之 矽化合物成為0.8質量份以外,與實施例3同樣地製作聚矽氧黏著劑組成物。 Except that the viscosity at 25 ° C. expressed by the average composition formula (f-1) was 24.0 mPa · s and the amount of vinyl contained in 100 g was 0.53 mol A polysiloxane adhesive composition was produced in the same manner as in Example 3 except that the silicon compound was changed to 0.8 parts by mass.
除了不使用0.4質量份的以平均組成式(f-1)所表示之25℃的黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物而代替地使用0.2質量份之以下述式(f-2)所表示之在100g中所含有的乙烯基量為0.86莫耳之矽化合物以外,與實施例3同樣地製作聚矽氧黏著劑組成物。 Except not using 0.4 parts by mass of a silicon compound having a viscosity of 24.0 mPa · s at 25 ° C. represented by the average composition formula (f-1) and a vinyl compound content of 0.53 mol in 100 g, 0.2 mass is used instead. A polysiloxane adhesive composition was prepared in the same manner as in Example 3 except that the silicon compound having a vinyl content of 0.86 mol in 100 g was expressed by the following formula (f-2).
除了使以式(f-2)所表示之在100g中所含有的乙烯基量為0.86莫耳之矽化合物成為0.4質量份以外,與實施例11同樣地製作聚矽氧黏著劑組成物。 A polysiloxane adhesive composition was produced in the same manner as in Example 11 except that the silicon compound having a vinyl group content of 0.86 mol in 100 g represented by the formula (f-2) was changed to 0.4 parts by mass.
除了不使用0.4質量份的以平均組成式(f-1)所表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物,而代替地使用0.4質量份的以下述 式(f-3)所表示之在100g中所含有的乙烯基量為0.20莫耳之矽化合物以外,與實施例3同樣地製作聚矽氧黏著劑組成物。 Except that 0.4 parts by mass of a silicon compound having a viscosity of 24.0 mPa · s represented by the average composition formula (f-1) and a vinyl content of 0.53 mol in 100 g is not used, 0.4 parts by mass of Take the following A polysiloxane adhesive composition was produced in the same manner as in Example 3 except that the silicon compound having a vinyl group content of 0.20 mol in 100 g represented by the formula (f-3).
除了使以平均組成式(f-3)所表示之100g中所含有的乙烯基量為0.20莫耳之矽化合物成為0.8質量份以外,與實施例13同樣地製作聚矽氧黏著劑組成物。 A polysiloxane adhesive composition was produced in the same manner as in Example 13 except that the silicon compound having a vinyl group content of 0.20 mol in 100 g represented by the average composition formula (f-3) was 0.8 parts by mass.
混合(A)以下述平均組成式(a)所表示之具有乙烯基的聚二甲基矽氧烷100質量份、
(C)以下述平均組成式(c-1)所表示的有機氫聚矽氧烷0.32質量份、
(C)以平均組成式(c-2)所表示的有機氫聚矽氧烷0.46質量份、及
(G)乙炔基環己醇0.18質量份,以甲苯稀釋而得到有效成分60質量%的混合物。 (G) 0.18 parts by mass of ethynylcyclohexanol, and diluted with toluene to obtain a mixture of 60% by mass of the active ingredient.
於所得之混合物100質量份中加入甲苯50質量份,添加(D)1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷鉑(0)錯合物之含有鉑分0.5質量%的甲苯溶液0.5質量份、作為密著提升成分的(E)成分之製造例1記載的密著提升劑0.4質量份、與以平均組成式(f-1)所表示之25℃的黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物0.4質量份,製作聚矽氧黏著劑組成物。 50 parts by mass of toluene was added to 100 parts by mass of the obtained mixture, and (D) 1,3-divinyl-1,1,3,3-tetramethyldisiladium platinum (0) complex was added. 0.5 parts by mass of a 0.5% by mass platinum solution in toluene, 0.4 parts by mass of the adhesion promoter described in Production Example 1 of the (E) component as the adhesion promotion component, and 25 by the average composition formula (f-1) A silicone compound having a viscosity of 24.0 mPa · s and a content of 0.43 parts by mass of a silicon compound having a vinyl group content of 0.53 mol at 100 ° C. was prepared.
混合(A)以下述平均組成式(a)所表示之具有乙烯基的聚二甲基矽氧烷80質量份、
(B)作為不揮發分之含有Me3SiO1/2單位及SiO2單位,(Me3SiO1/2單位)/(SiO2單位)之莫耳比為0.85的
有機聚矽氧烷之60質量%甲苯溶液20質量份,(C)以下述平均組成式(c-1)所表示的有機氫聚矽氧烷0.26質量份、
(C)以平均組成式(c-2)所表示的有機氫聚矽氧烷0.36質量份、及
(G)乙炔基環己醇0.18質量份,以甲苯稀釋而得到有效成分60質量%的混合物。 (G) 0.18 parts by mass of ethynylcyclohexanol, and diluted with toluene to obtain a mixture of 60% by mass of the active ingredient.
於所得之混合物100質量份中,加入甲苯50質量份,添加(D)1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷鉑(0)錯合物之含有鉑分0.5質量%的甲苯溶液0.5質量份、作為本發明之密著提升成分的(E)成分之製造例1記載的密著提升劑0.4質量份、與以平均組成式(f-1)所表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物0.4質量份,製作聚矽氧黏著劑組成物。 To 100 parts by mass of the obtained mixture, 50 parts by mass of toluene was added, and (D) 1,3-divinyl-1,1,3,3-tetramethyldisilanium platinum (0) complex was added. 0.5 mass part of a toluene solution containing 0.5 mass% of a platinum content, 0.4 mass part of the adhesion promoter described in Production Example 1 of the (E) component as the adhesion promotion component of the present invention, and an average composition formula (f-1) The indicated viscosity was 24.0 mPa · s, and 0.4 g parts by mass of a silicon compound having a vinyl group content of 0.53 mol in 100 g was used to prepare a polysiloxane adhesive composition.
混合(A)以下述平均組成式(a)所表示之具有乙烯基的聚二甲基矽氧烷60質量份、
(B)作為不揮發分之含有Me3SiO1/2單位及SiO2單位,(Me3SiO1/2單位)/(SiO2單位)之莫耳比為0.85的有機聚矽氧烷之60質量%甲苯溶液40質量份,(C)以下述平均組成式(b)所表示的有機氫聚矽氧烷0.19質量份、
(C)以平均組成式(c-2)所表示的有機氫聚矽氧烷0.27質量份、及
(G)乙炔基環己醇0.18質量份,以甲苯稀釋而得到有效成分60質量%的混合物。 (G) 0.18 parts by mass of ethynylcyclohexanol, and diluted with toluene to obtain a mixture of 60% by mass of the active ingredient.
於所得之混合物100質量份中加入甲苯50質量份,添加(D)1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷鉑(0) 錯合物之含有鉑分0.5質量%的甲苯溶液0.5質量份、作為密著提升成分的(E)成分之製造例1記載的密著提升劑0.4質量份、與以平均組成式(f-1)所表示之25℃的黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物0.4質量份,製作聚矽氧黏著劑組成物。 50 parts by mass of toluene was added to 100 parts by mass of the obtained mixture, and (D) 1,3-divinyl-1,1,3,3-tetramethyldisilazane platinum (0) was added. 0.5 part by mass of a toluene solution containing 0.5% by mass of a platinum component in a complex, 0.4 part by mass of the adhesion promoter described in Production Example 1 as an adhesion promotion component (E) component, and an average composition formula (f-1 The viscosity at 25 ° C. is 24.0 mPa · s and 0.4 parts by mass of a silicon compound having a vinyl group content of 0.53 mol in 100 g is used to prepare a polysiloxane adhesive composition.
於實施例3所製作的聚矽氧黏著劑組成物中,更添加0.4質量份的作為(H)成分之以下的平均組成式(h-1)所表示之有機氫聚矽氧烷,製作聚矽氧黏著劑組成物。 To the polysiloxane adhesive composition prepared in Example 3, 0.4 parts by mass of an organohydrogenpolysiloxane represented by the average composition formula (h-1) below (H) component was further added to prepare a polysiloxane. Silicone adhesive composition.
於實施例3所製作的聚矽氧黏著劑組成物中,更添加0.4質量份的作為(H)成分之以下的平均組成式(h-2)所表示之有機氫聚矽氧烷,製作聚矽氧黏著劑組成物。 To the polysiloxane adhesive composition prepared in Example 3, 0.4 parts by mass of an organohydrogenpolysiloxane represented by the average composition formula (h-2) below (H) component was further added to prepare a polysiloxane. Silicone adhesive composition.
於實施例3所製作的聚矽氧黏著劑組成物中,更添加0.4質量份的作為(H)成分之以下的平均組成式(h-3) 所表示之有機氫聚矽氧烷,製作聚矽氧黏著劑組成物。 To the polysiloxane adhesive composition prepared in Example 3, 0.4 part by mass of the average composition formula (h-3) below the (H) component was further added. The indicated organohydrogenpolysiloxane is used to make a polysiloxane adhesive composition.
於實施例3所製作的聚矽氧黏著劑組成物中,更添加0.4質量份的作為(H)成分之以下的平均組成式(h-4)所表示之有機氫聚矽氧烷,製作聚矽氧黏著劑組成物。 To the polysiloxane adhesive composition prepared in Example 3, 0.4 parts by mass of an organohydrogenpolysiloxane represented by the average composition formula (h-4) below (H) component was further added to prepare a polysiloxane. Silicone adhesive composition.
除了添加0.8質量份的以平均組成式(h-2)所表示之有機氫聚矽氧烷以外,與實施例19同樣地製作用於試驗的聚矽氧黏著劑組成物。 A polysiloxane adhesive composition for the test was produced in the same manner as in Example 19 except that 0.8 parts by mass of the organohydrogenpolysiloxane represented by the average composition formula (h-2) was added.
除了不添加由製造例1所得之化合物,及不添加以平均組成式(f-1)所表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 Except that the compound obtained in Production Example 1 was not added, and the silicon compound having a viscosity represented by the average composition formula (f-1) of 24.0 mPa · s and the amount of vinyl contained in 100 g of 0.53 mole was not added, A polysiloxane adhesive composition was produced in the same manner as in Example 1.
除了代替由製造例1所得之化合物與以平均組成式(f-1)所表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物,使用0.4質量份的2,2-雙(4-烯丙氧基苯基)丙烷以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 In addition to replacing the compound obtained in Production Example 1 with a silicon compound having a viscosity of 24.0 mPa · s represented by the average composition formula (f-1) and a silicon compound having a vinyl content of 0.53 mol in 100 g, 0.4 parts by mass of A polysiloxane adhesive composition was prepared in the same manner as in Example 1 except for 2,2-bis (4-allyloxyphenyl) propane.
除了添加0.4質量份的以平均組成式(f-1)所表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物以外,與比較例2同樣地製作用於試驗的聚矽氧黏著劑組成物。 It was produced in the same manner as in Comparative Example 2 except that 0.4 parts by mass of a silicon compound having a viscosity represented by an average composition formula (f-1) of 24.0 mPa · s and a vinyl content of 100 g of 0.53 mol was added. Polysiloxane adhesive composition for testing.
除了代替由製造例1所得之化合物與以平均組成式(f-1)所表示之黏度為24.0mPa‧s且100g中所含有的乙烯基量為0.53莫耳之矽化合物,使用由比較製造例1所得之化合物以外,與實施例1同樣地製作聚矽氧黏著劑組成物。 In addition to replacing the compound obtained in Production Example 1 with a silicon compound having a viscosity of 24.0 mPa · s represented by the average composition formula (f-1) and a silicon compound having a vinyl content of 0.53 mol in 100 g, a comparative production example was used. A polysiloxane adhesive composition was prepared in the same manner as in Example 1 except for the obtained compound.
對於上述的聚矽氧黏著劑組成物,用下述方法評價密著性與黏著力。 About the said polysiloxane adhesive composition, the adhesiveness and adhesive force were evaluated by the following method.
製作對於上述有效成分60質量%的混合物100質量份,添加(D)硬化觸媒與前述說明的(E)、(F)成分而迅速地混合攪拌之處理浴,使用塗布器,設定硬化後的 黏著劑層之厚度為30μm,將該處理浴塗布於厚度23μm、寬度25mm的聚對苯二甲酸乙二酯(PET)薄膜上。將此在130℃的乾燥機中風乾1分鐘,將所製作的黏著性物品在一定的條件下靜置後,以指甲或刀具等的突起物刮劃黏著層而使有傷痕,以手指肚擦該部分,如下述地評價。再者,靜置黏著性物品之條件係室溫下1日、60℃/90%RH下1日、85℃/85%RH下1日、60℃/90%RH下7日之四個條件。以下述基準表示結果。 A processing bath was prepared by adding 100 parts by mass of the above-mentioned active ingredient to 60% by mass, adding (D) a curing catalyst, and the components (E) and (F) described above, and rapidly mixing and stirring. A coater was used to set the cured bath. The thickness of the adhesive layer was 30 μm, and the treatment bath was coated on a polyethylene terephthalate (PET) film having a thickness of 23 μm and a width of 25 mm. This was air-dried in a dryer at 130 ° C for 1 minute. After the produced adhesive article was allowed to stand under certain conditions, the adhesive layer was scratched with protrusions such as nails or knives to make scars, and rubbed with a finger belly. This part was evaluated as follows. In addition, the conditions for the stationary adhesive article are four conditions: one day at room temperature, one day at 60 ° C / 90% RH, one day at 85 ° C / 85% RH, and seven days at 60 ° C / 90% RH. . The results are expressed on the following basis.
○:黏著層沒有自基材剝離 ○: The adhesive layer is not peeled from the substrate.
×:黏著層自基材剝離 ×: The adhesive layer is peeled from the substrate
製作對於有效成分60質量%的混合物100質量份,添加硬化觸媒與前述說明的(E)、(F)成分而迅速地混合攪拌之處理浴,以硬化後的厚度成為30μm之方式,使用塗布器將該處理浴塗布於厚度23μm、寬度25mm的聚對苯二甲酸乙二酯(PET)薄膜上後,於130℃/1分鐘之條件下加熱而使硬化,製作黏著膠帶。將此黏著膠帶貼附於玻璃板,藉由使重量2kg的橡膠層被覆之輥往返2次而壓合。將貼合有黏著膠帶的玻璃板置入一定濕度與溫度的恆溫槽中指定日數後取出,使用拉伸試驗機,以300mm/分鐘之速度測定以180°的角度自玻璃板撕下膠帶時所需要之力(N/25mm)。 A processing bath was prepared with 100 parts by mass of a mixture of 60% by mass of an active ingredient, a curing catalyst was added and the components (E) and (F) described above were rapidly mixed and stirred, and the thickness after curing was 30 μm, and applied using a coating The processing bath was applied to a polyethylene terephthalate (PET) film having a thickness of 23 μm and a width of 25 mm, and then heated and cured at 130 ° C./1 minute to prepare an adhesive tape. This adhesive tape was affixed to a glass plate, and the roller covered with a rubber layer having a weight of 2 kg was reciprocated twice and pressed. Place the glass plate with the adhesive tape in the constant temperature and humidity bath for a specified number of days, take it out, and use a tensile tester to measure at a speed of 300 mm / min. When the tape is removed from the glass plate at an angle of 180 ° Required force (N / 25mm).
於實施例1~22中,以1次的塗布而與基材的密著性提高為可能,上述4個條件下的基材密著性皆良好。茲認為此係藉由(E)成分的苯基與基材因π電子之堆積效應,在界面進行相互作用而展現。若比較實施例2~14及18~22與參考例,則可知參考例者係經時的黏著力上升幅度變大,茲認為此係因為具有苯基,與玻璃表面的矽烷醇基亦進行相互作用。然而,藉由添加(F)成分, 可抑制經時的黏著力上升,茲認為此係由於黏著層全體的交聯密度變大,黏著層的硬度上升,黏著層變難以鈎掛在被附體表面之凹凸上。又,可知併用(H)成分,亦一邊維持基材密著性,一邊抑制經時的黏著力上升。 In Examples 1 to 22, it was possible to improve the adhesion to the substrate with a single application, and the substrate adhesion was good under the above four conditions. It is believed that this is manifested by the interaction between the phenyl component of the (E) component and the substrate at the interface due to the π electron stacking effect. If you compare Examples 2 to 14 and 18 to 22 with the reference example, it can be seen that the reference example has a larger increase in adhesion over time. It is believed that this is because it has a phenyl group and interacts with the silanol group on the glass surface. effect. However, by adding (F) component, It is possible to suppress the increase of the adhesive force over time. It is thought that this is because the crosslinking density of the entire adhesive layer is increased, the hardness of the adhesive layer is increased, and the adhesive layer is difficult to hook on the unevenness on the surface of the adherend. In addition, it was found that the (H) component was used in combination to suppress the increase in adhesive force over time while maintaining the adhesiveness of the substrate.
另一方面,於未添加密著提升劑的比較例1中,無法確保密著性。使用比較製造例1之情況,雖然僅初期可確保密著性,但為經時的密著性不充分之結果。又,使用2,2-雙(4-烯丙氧基苯基)丙烷作為(E)成分之原料的比較例2、3,亦密著性不充分,茲認為其主要原因為僅使用原料則分子量小,故與基材的相互作用只能部分地發揮機能。茲認為如在製造例1、2所製造,藉由使用分子量大到某一程度者,或許就能發揮效果。於黏著力之測定中,黏著層會轉移到玻璃,亦暗示硬化不充分。 On the other hand, in Comparative Example 1 to which no adhesion enhancer was added, the adhesion cannot be secured. In the case of using Comparative Production Example 1, although the adhesion was ensured only in the initial stage, the adhesion was insufficient over time. In addition, Comparative Examples 2 and 3 using 2,2-bis (4-allyloxyphenyl) propane as a raw material for the component (E) also had insufficient adhesion. The main reason is considered to be that only the raw materials are used. The molecular weight is small, so the interaction with the substrate can only partially function. It is considered that the effects may be exhibited by using those having a large molecular weight as produced in Production Examples 1 and 2. In the measurement of adhesion, the adhesion layer will be transferred to the glass, which also implies insufficient hardening.
Claims (7)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-125487 | 2014-06-18 | ||
| JP2014125487 | 2014-06-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201614033A TW201614033A (en) | 2016-04-16 |
| TWI669365B true TWI669365B (en) | 2019-08-21 |
Family
ID=54935378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104119599A TWI669365B (en) | 2014-06-18 | 2015-06-17 | Silicone adhesive composition and adhesive article with excellent substrate adhesion |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6292305B2 (en) |
| KR (1) | KR102320575B1 (en) |
| CN (1) | CN106103629B (en) |
| TW (1) | TWI669365B (en) |
| WO (1) | WO2015194389A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110506087B (en) * | 2017-04-12 | 2022-03-01 | 信越化学工业株式会社 | Primer compositions and articles for silicone pressure sensitive adhesives |
| WO2019030914A1 (en) * | 2017-08-10 | 2019-02-14 | 株式会社寺岡製作所 | Adhesive sheet |
| TWI802631B (en) * | 2018-01-16 | 2023-05-21 | 日商信越化學工業股份有限公司 | Silicone adhesive composition, cured product, adhesive film and adhesive tape |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3324166B2 (en) * | 1992-12-10 | 2002-09-17 | 信越化学工業株式会社 | Adhesive silicone rubber composition |
| JP2002338890A (en) * | 2000-03-23 | 2002-11-27 | Shin Etsu Chem Co Ltd | Primer composition for silicone adhesive |
| JP2012149240A (en) * | 2010-12-31 | 2012-08-09 | Dow Corning Toray Co Ltd | Primer composition for silicone adhesive, laminate, and silicone adhesive tape |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3189133B2 (en) | 1992-07-03 | 2001-07-16 | ニホンハンダ株式会社 | Cream solder |
| JP3232004B2 (en) | 1995-08-17 | 2001-11-26 | 信越化学工業株式会社 | Coating composition |
| JP2002285129A (en) | 2001-03-23 | 2002-10-03 | Shin Etsu Chem Co Ltd | Silicone pressure sensitive adhesive composition |
| JP4996797B2 (en) | 2001-09-28 | 2012-08-08 | 東レ・ダウコーニング株式会社 | Organohydrogenpolysiloxane mixture and peelable cured film-forming silicone composition |
| JP4073223B2 (en) * | 2002-03-19 | 2008-04-09 | 株式会社カネカ | Sealant, method for sealing semiconductor, semiconductor device manufacturing method, and semiconductor device |
| US7687591B2 (en) * | 2003-03-17 | 2010-03-30 | Dow Corning Corporation | Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength |
| DE10338478A1 (en) * | 2003-08-21 | 2005-03-17 | Wacker-Chemie Gmbh | Self-adhesive addition-curing silicone compositions |
| US7745505B2 (en) * | 2004-12-29 | 2010-06-29 | Henkel Ag & Co. Kgaa | Photoinitiators and UV-crosslinkable acrylic polymers for pressure sensitive adhesives |
| GB0616021D0 (en) | 2006-08-14 | 2006-09-20 | Dow Corning | Silicone release coating compositions |
| DE102007044789A1 (en) * | 2007-09-19 | 2009-04-02 | Wacker Chemie Ag | Self-adhesive addition-curing silicone composition |
| JP2010285507A (en) | 2009-06-10 | 2010-12-24 | Kaneka Corp | Adhesive curable composition |
| JP2013159671A (en) * | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | Curable silicone composition, cured product thereof, and optical semiconductor device |
| JP5799915B2 (en) * | 2012-08-20 | 2015-10-28 | 信越化学工業株式会社 | Addition-curing self-adhesive silicone rubber composition |
| JP6168002B2 (en) * | 2014-02-27 | 2017-07-26 | 信越化学工業株式会社 | Silicone adhesive composition and adhesive article excellent in substrate adhesion |
-
2015
- 2015-06-05 KR KR1020167025440A patent/KR102320575B1/en active Active
- 2015-06-05 CN CN201580012920.8A patent/CN106103629B/en active Active
- 2015-06-05 WO PCT/JP2015/066284 patent/WO2015194389A1/en not_active Ceased
- 2015-06-05 JP JP2016529234A patent/JP6292305B2/en active Active
- 2015-06-17 TW TW104119599A patent/TWI669365B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3324166B2 (en) * | 1992-12-10 | 2002-09-17 | 信越化学工業株式会社 | Adhesive silicone rubber composition |
| JP2002338890A (en) * | 2000-03-23 | 2002-11-27 | Shin Etsu Chem Co Ltd | Primer composition for silicone adhesive |
| JP2012149240A (en) * | 2010-12-31 | 2012-08-09 | Dow Corning Toray Co Ltd | Primer composition for silicone adhesive, laminate, and silicone adhesive tape |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106103629A (en) | 2016-11-09 |
| WO2015194389A1 (en) | 2015-12-23 |
| KR20170018803A (en) | 2017-02-20 |
| JP6292305B2 (en) | 2018-03-14 |
| TW201614033A (en) | 2016-04-16 |
| CN106103629B (en) | 2019-12-20 |
| KR102320575B1 (en) | 2021-11-02 |
| JPWO2015194389A1 (en) | 2017-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6168002B2 (en) | Silicone adhesive composition and adhesive article excellent in substrate adhesion | |
| JP4678847B2 (en) | Adhesive film having an adhesive layer obtained from a silicone composition | |
| CN107429145B (en) | Release agent composition, release film and laminate for silicone pressure-sensitive adhesive | |
| CN111315840B (en) | Silicone adhesive composition, adhesive tape, adhesive sheet and double-sided adhesive sheet | |
| CN102051153A (en) | Silicone base pressure-sensitive adhesive compositions and film | |
| JP6471579B2 (en) | LAMINATE, METHOD FOR PRODUCING THE SAME, METHOD FOR USING SUBSTRATE-LESS ADHESIVE SHEET, AND ARTICLE | |
| JP2014047310A (en) | Adhesive film and method for manufacturing the same | |
| WO2019142779A1 (en) | Silicone adhesive composition, adhesive film, and adhesive tape | |
| JP6795086B2 (en) | Primer Compositions and Articles for Silicone Adhesives | |
| TWI669365B (en) | Silicone adhesive composition and adhesive article with excellent substrate adhesion | |
| JPWO2017065131A1 (en) | Shock-absorbing screen protection film | |
| JP6024638B2 (en) | Silicone pressure-sensitive adhesive composition, method for producing adhesion improver, and pressure-sensitive adhesive article | |
| CN101041764B (en) | Silicone composition and adhesive film having an adhesive layer obtained from the composition | |
| JP7358174B2 (en) | Primer composition for silicone adhesive | |
| TW202506949A (en) | Silicone adhesive composition and adhesive products, adhesion enhancer | |
| KR20260015819A (en) | Silicone adhesive composition and adhesive article, adhesion enhancer |