TWI665552B - Circuit for recovering from power loss and electronic device using the same circuit and method thereof - Google Patents
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Abstract
一種用於從電力損耗中恢復的電路以及使用此電路的電子裝置與其方法。電路包含但不限於:記憶體電路,包含輸出第一記憶體輸出電壓的第一記憶體元件以及輸出第二記憶體輸出電壓的第二記憶體元件;邏輯比較器電路,連接到記憶體電路,且包含將第一記憶體輸出電壓與第一電源電壓進行比較以產生第一邏輯比較器輸出電壓的第一邏輯比較器,以及將第二記憶體輸出電壓與第二電源電壓進行比較以產生第二邏輯比較器輸出電壓的第二邏輯比較器;以及邏輯電路,電連接到邏輯比較器電路且接收第一邏輯比較器輸出電壓及第二邏輯比較器輸出電壓以執行第一邏輯操作,第一邏輯操作經至少部分地使用以產生上電復位電壓。A circuit for recovering from power loss, and an electronic device and method using the same. The circuit includes, but is not limited to, a memory circuit including a first memory element outputting a first memory output voltage and a second memory element outputting a second memory output voltage; a logic comparator circuit connected to the memory circuit, It also includes a first logic comparator that compares the first memory output voltage with a first power supply voltage to generate a first logic comparator output voltage, and compares a second memory output voltage with a second power supply voltage to generate a first logic comparator. A second logic comparator with two logic comparator output voltages; and a logic circuit electrically connected to the logic comparator circuit and receiving the first logic comparator output voltage and the second logic comparator output voltage to perform a first logic operation, the first Logic operations are used at least in part to generate a power-on reset voltage.
Description
本發明是有關於一種電力損耗測試的技術,且特別是有關於一種用於從電力損耗中恢復的電路以及使用此電路的電子裝置與其方法。The present invention relates to a technology for power loss testing, and in particular, to a circuit for recovering from power loss, and an electronic device and method using the same.
電力損耗測試可為當晶片在裝配線上或實驗室中評估時製造的晶片或積體電路(integrated circuit;IC)所需通過的測試中的一個。舉例來說,在電池組上運行的行動電話可能進行此測試。當晶片經歷來自內部或外部電源的突然的電力損耗時,電力位準可能逐漸降低至某一位準但並非直接降至零,從而可能未觸發上電復位(power on reset;POR)產生重置信號來重置晶片的電源電路。如果未觸發POR來重置晶片,那麼記憶體元件可能處於未知狀態。The power loss test may be one of the tests required for a wafer or an integrated circuit (IC) manufactured when the wafer is evaluated on an assembly line or in a laboratory. For example, a mobile phone running on a battery pack might perform this test. When the chip experiences sudden power loss from an internal or external power source, the power level may gradually decrease to a certain level but not directly to zero, which may not trigger a power on reset (POR) to generate a reset Signal to reset the chip's power circuit. If the POR is not triggered to reset the chip, the memory element may be in an unknown state.
如圖1所示,在已觸發POR 101之後,晶片的電源可從0伏變為正常偏壓VCC。然而,假設晶片的電源如電力損耗區域102中所示突然下降,如果電源下降至低於最低閾值但不直接達到約0伏的電壓以觸發如死區區域103中所示的POR,那麼晶片的記憶體元件可能進入未知狀態。死區區域103是指電源電壓的範圍,在所述範圍內,將不保證記憶體元件保持其記錄狀態,同時將不觸發POR。As shown in Figure 1, after the POR 101 has been triggered, the chip's power can be changed from 0 volts to a normal bias VCC. However, assuming that the power supply of the chip drops abruptly as shown in the power loss region 102, if the power supply drops below the minimum threshold but does not directly reach a voltage of about 0 volts to trigger the POR as shown in the dead band region 103, The memory element may enter an unknown state. The dead zone 103 refers to the range of the power supply voltage, within which the memory element will not be guaranteed to maintain its recording state, and POR will not be triggered at the same time.
晶片將可能處於未知狀態的原因是,當電源位準下降過慢時,記憶體元件的記錄狀態丟失。當電源位準下降到死區區域103時,例如正反器、鎖存器等記憶體元件可能不能夠保持其記錄狀態,且因此使得晶片進入未知狀態。在晶片進入未知狀態之後,晶片將可能出現故障,這是因為狀態機將無法進入預期狀態。因此,由電源進入死區區域103導致的晶片進入未知狀態可能是需要解決的問題。The reason the chip will probably be in an unknown state is that when the power level drops too slowly, the recording state of the memory element is lost. When the power supply level drops to the dead zone region 103, memory elements such as flip-flops, latches, etc. may not be able to maintain their recording state, and thus the chip enters an unknown state. After the wafer enters an unknown state, the wafer may fail because the state machine will not be able to enter the expected state. Therefore, an unknown state of the wafer caused by the power source entering the dead zone 103 may be a problem that needs to be solved.
本發明提供一種用於從電力損耗中恢復的電路以及使用此電路的電子裝置與其方法。The invention provides a circuit for recovering from power loss, and an electronic device and method using the same.
本發明揭露一種用於從電力損耗中恢復的電路,所述電路應包含但不限於:記憶體電路,包含輸出第一記憶體輸出電壓的第一記憶體元件及輸出第二記憶體輸出電壓的第二記憶體元件;邏輯比較器電路,電連接到所述記憶體電路,且包括將所述第一記憶體輸出電壓與第一電源電壓進行比較以產生第一邏輯比較器輸出電壓的第一邏輯比較器,以及將所述第二記憶體輸出電壓與高於所述第一電源電壓的第二電源電壓進行比較以產生第二邏輯比較器輸出電壓的第二邏輯比較器;以及邏輯電路,電連接到所述邏輯比較器電路且接收第一邏輯比較器輸出電壓及第二邏輯比較器輸出電壓以執行第一邏輯操作,第一邏輯操作經至少部分地使用以產生上電復位電壓。The invention discloses a circuit for recovering from power loss. The circuit should include, but is not limited to, a memory circuit including a first memory element that outputs a first memory output voltage and a second memory element that outputs a second memory output voltage. A second memory element; a logic comparator circuit, electrically connected to the memory circuit, and including a first circuit that compares the first memory output voltage with a first power supply voltage to generate a first logic comparator output voltage A logic comparator, and a second logic comparator that compares the second memory output voltage with a second power supply voltage that is higher than the first power supply voltage to generate a second logic comparator output voltage; and a logic circuit, Electrically connected to the logic comparator circuit and receiving a first logic comparator output voltage and a second logic comparator output voltage to perform a first logic operation, the first logic operation is at least partially used to generate a power-on reset voltage.
本發明揭露一種使用用於從電力損耗中恢復的電路的電子裝置,所述電子裝置應包含但不限於:電源電路;以及電路,電連接到所述電源電路,用於從由來自所述電源電路的輸出電壓降導致的電力損耗中恢復,其中所述電路包含:記憶體電路,具有輸出第一記憶體輸出電壓的第一記憶體元件,以及輸出第二記憶體輸出電壓的第二記憶體元件;邏輯比較器電路,電連接到所述記憶體電路,且包含將所述第一記憶體輸出電壓與從所述電源電路接收的第一電源電壓進行比較以產生第一邏輯比較器輸出電壓的第一邏輯比較器,以及將所述第二記憶體輸出電壓與從所述電源電路接收的且高於所述第一電源電壓的第二電源電壓進行比較以產生第二邏輯比較器輸出電壓的第二邏輯比較器;以及邏輯電路,電連接到所述邏輯比較器電路且接收第一邏輯比較器輸出電壓及所述第二邏輯比較器輸出電壓以執行第一邏輯操作,所述第一邏輯操作經至少部分地使用以產生上電復位電壓,所述上電復位電壓響應於來自所述電源電路的所述輸出電壓降而重置所述記憶體電路。The present invention discloses an electronic device using a circuit for recovering from power loss. The electronic device should include but is not limited to: a power supply circuit; and a circuit electrically connected to the power supply circuit for freely from the power supply. Recovery from power loss caused by an output voltage drop of a circuit, wherein the circuit includes a memory circuit, a first memory element having a first memory output voltage, and a second memory having a second memory output voltage Element; a logic comparator circuit electrically connected to the memory circuit, and including comparing the first memory output voltage with a first power supply voltage received from the power supply circuit to generate a first logic comparator output voltage A first logic comparator, and comparing the second memory output voltage with a second power supply voltage received from the power supply circuit and higher than the first power supply voltage to generate a second logic comparator output voltage A second logic comparator; and a logic circuit electrically connected to the logic comparator circuit and receiving the output voltage of the first logic comparator And the second logic comparator output voltage to perform a first logic operation, the first logic operation is used at least in part to generate a power-on reset voltage, the power-on reset voltage is responsive to all power from the power supply circuit The output voltage drops to reset the memory circuit.
本發明揭露一種供電子裝置使用的用於從電力損耗中恢復的方法,所述方法應包含但不限於:從第一記憶體元件接收第一記憶體輸出電壓以及從第二記憶體元件接收第二記憶體輸出電壓;將所述第一記憶體輸出電壓與從所述電源電路接收的第一電源電壓進行比較以產生第一邏輯比較器輸出電壓;將所述第二記憶體輸出電壓與從所述電源電路接收的且高於所述第一電源電壓的第二電源電壓進行比較,以產生第二邏輯比較器輸出電壓;通過使用所述第一邏輯比較器輸出電壓及所述第二邏輯比較器輸出電壓來執行第一邏輯操作;以及至少部分地基於用於回應於所述電源的電力損耗而重置所述電源的所述第一邏輯操作來產生上電復位電壓。The invention discloses a method for recovering from power loss used by a power supply device. The method should include, but is not limited to, receiving a first memory output voltage from a first memory element and receiving a second memory element from a second memory element. Two memory output voltages; comparing the first memory output voltage with a first power supply voltage received from the power supply circuit to generate a first logic comparator output voltage; comparing the second memory output voltage with a slave output voltage The second power supply voltage received by the power supply circuit and higher than the first power supply voltage is compared to generate a second logic comparator output voltage; by using the first logic comparator output voltage and the second logic A comparator output voltage to perform a first logic operation; and generating a power-on reset voltage based at least in part on the first logic operation for resetting the power supply in response to a power loss of the power supply.
為了使得本公開的前述特徵和優點便於理解,下文詳細描述帶有附圖的實施例。應理解,前文總體描述以及以下詳細描述都是示例性的,並且意圖提供對所要求保護的本公開的進一步說明。In order to make the foregoing features and advantages of the present disclosure easy to understand, embodiments with accompanying drawings are described in detail below. It should be understood that the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed disclosure.
現在將詳細參考本公開的當前實施例。Reference will now be made in detail to the current embodiment of the present disclosure.
在本公開中,描述一種適用於電子裝置檢測上述死區區域103以及從死區區域103導致的未知記憶體元件狀態恢復到已知記憶體元件狀態的方法及電路。當已檢測到死區區域103時,將發佈上電復位(power on reset;POR)以對電子裝置的電源重置,從而恢復成已知狀態。一種檢測死區區域103的技術將包含將載入到記憶體元件中的期望值與預定的電源電壓值進行比較。In the present disclosure, a method and a circuit suitable for an electronic device to detect the dead zone region 103 and restore the state of an unknown memory element caused by the dead zone region 103 to a known memory element state are described. When the dead zone 103 has been detected, a power on reset (POR) will be issued to reset the power of the electronic device, thereby restoring to a known state. A technique for detecting the dead zone 103 will include comparing the expected value loaded into the memory element with a predetermined value of the power supply voltage.
在電力開啟的狀態期間,將來自非揮發性記憶體的值載入到記憶體元件中。這些值被稱作DZD模式,且這些值為類比電壓,所述類比電壓可為例如用於使用比較器測試電源電壓的高壓、低壓或帶隙電壓(bandgap voltage)。記憶體元件可為例如鎖存器、正反器、虛擬記憶體等。上述DZD模式可為IC內部的硬連線或從外部電源載入到IC中。在已完成電力開啟的序列之後,將來自記憶體元件的值與可為預定值的電源電壓進行比較。在正常操作狀態下,將由比較器匹配這些值以產生匹配結果,且匹配結果不會觸發POR。在電力損耗及/或記憶體元件減值的情況下,當電源電壓恢復時,匹配結果將有可能觸發POR。在觸發POR後,將啟動電力開啟的序列。During the power-on state, values from non-volatile memory are loaded into the memory elements. These values are called DZD modes, and these values are analog voltages that can be, for example, high voltage, low voltage, or bandgap voltage used to test the supply voltage using a comparator. The memory element may be, for example, a latch, a flip-flop, a virtual memory, or the like. The DZD mode can be hard-wired inside the IC or loaded into the IC from an external power source. After the power-on sequence has been completed, the value from the memory element is compared with a power supply voltage that can be a predetermined value. Under normal operating conditions, these values are matched by the comparator to produce a matching result, and the matching result does not trigger a POR. In the case of power loss and / or memory element depreciation, when the power supply voltage is restored, the matching result may trigger a POR. After the POR is triggered, the power-on sequence will start.
在一方面,本公開提供一種將解決上述從由來自電源電路的輸出電壓降導致的電力損耗中恢復的問題的電路。參看圖2,電路將電連接到電源電路,且電路及電源電路均可設置在電子裝置內。電路200將包含但不限於記憶體電路201、邏輯比較器電路202、輸出POR信號線的邏輯電路203等。In one aspect, the present disclosure provides a circuit that will solve the above-mentioned problem of recovering from power loss caused by an output voltage drop from a power supply circuit. Referring to FIG. 2, the circuit is electrically connected to a power supply circuit, and both the circuit and the power supply circuit can be disposed in an electronic device. The circuit 200 will include, but is not limited to, a memory circuit 201, a logic comparator circuit 202, a logic circuit 203 that outputs a POR signal line, and the like.
記憶體電路201可包含但不限於輸出第一記憶體輸出電壓的第一記憶體元件,以及輸出第二記憶體輸出電壓的第二記憶體元件。電連接到記憶體電路201的邏輯比較器電路202可包含但不限於將第一記憶體輸出電壓與從電源電路接收的第一電源電壓進行比較以產生第一邏輯比較器輸出電壓的第一邏輯比較器,以及將第二記憶體輸出電壓與從電源電路接收的第二電源電壓進行比較以產生第二邏輯比較器輸出電壓的第二邏輯比較器。電連接到邏輯比較器電路202的邏輯電路203將接收第一邏輯比較器輸出電壓及第二邏輯比較器輸出電壓以執行第一邏輯操作,所述第一邏輯操作經至少部分地使用以產生上電復位(POR)電壓,所述上電復位電壓響應於來自電源電路的輸出電壓降而重置記憶體電路。The memory circuit 201 may include, but is not limited to, a first memory element that outputs a first memory output voltage, and a second memory element that outputs a second memory output voltage. The logic comparator circuit 202 electrically connected to the memory circuit 201 may include, but is not limited to, a first logic that compares a first memory output voltage with a first power supply voltage received from a power supply circuit to generate a first logic comparator output voltage. A comparator, and a second logic comparator that compares the second memory output voltage with a second power supply voltage received from the power supply circuit to generate a second logic comparator output voltage. A logic circuit 203 electrically connected to the logic comparator circuit 202 will receive a first logic comparator output voltage and a second logic comparator output voltage to perform a first logic operation, the first logic operation being at least partially used to generate a An electrical reset (POR) voltage that resets the memory circuit in response to an output voltage drop from a power circuit.
在一實施例中,第一記憶體輸出電壓具有與第二記憶體輸出電壓相反的二進位值,當電源在沒有電力損耗的情況下正常操作時,第一記憶體輸出電壓及第二記憶體輸出電壓使得第一邏輯比較器輸出電壓及第二邏輯比較器輸出電壓輸出相同的第一二進位值。然而,當電源經歷由來自電源電路的輸出電壓降導致的電力損耗時,第一邏輯比較器輸出電壓及第二邏輯比較器輸出電壓中的至少一個輸出與第一二進位值相反的第二二進位值。In an embodiment, the output voltage of the first memory has a binary value opposite to the output voltage of the second memory. When the power supply operates normally without power loss, the output voltage of the first memory and the second memory The output voltage is such that the first logic comparator output voltage and the second logic comparator output voltage output the same first binary value. However, when the power source experiences a power loss caused by an output voltage drop from the power supply circuit, at least one of the first logic comparator output voltage and the second logic comparator output voltage outputs a second two that is opposite to the first binary value. Carry value.
在一實施例中,第一邏輯操作可為由第一邏輯操作電路執行的反及操作,所述操作在當電源在沒有電力損耗的情況下正常操作時輸出第二二進位值,而在電源經歷由來自電源電路的輸出電壓降導致的電力損耗時輸出第一二進位值。In an embodiment, the first logic operation may be an inverse operation performed by the first logic operation circuit. The operation outputs a second binary value when the power supply normally operates without power loss, and the The first binary value is output when the power loss is caused by the output voltage drop from the power circuit.
在一實施例中,邏輯比較器電路202可另外包含但不限於:第三邏輯比較器,將第三記憶體輸出電壓與從電源電路接收的第一電源電壓進行比較以產生第三邏輯比較器輸出電壓;第四邏輯比較器,將第四記憶體輸出電壓與第二電源電壓進行比較以產生第四邏輯比較器輸出電壓;以及第二邏輯操作電路,接收第三邏輯比較器輸出電壓及第四邏輯比較器輸出電壓以對第三邏輯比較器輸出電壓及第四邏輯比較器輸出電壓執行第二邏輯操作,所述第二邏輯操作可例如為反及操作。In one embodiment, the logic comparator circuit 202 may further include, but is not limited to, a third logic comparator that compares the output voltage of the third memory with the first power voltage received from the power circuit to generate a third logic comparator. An output voltage; a fourth logic comparator that compares the fourth memory output voltage with a second power supply voltage to generate a fourth logic comparator output voltage; and a second logic operation circuit that receives the third logic comparator output voltage and the first The four logic comparator output voltages perform a second logic operation on the third logic comparator output voltage and the fourth logic comparator output voltage, and the second logic operation may be, for example, an invert operation.
在一實施例中,邏輯電路203可另外包含但不限於第三邏輯操作電路,所述第三邏輯操作電路接收第一邏輯操作電路的反及操作以及第二邏輯操作電路的反及操作以執行第三邏輯操作,從而產生上電復位(POR)電壓。In an embodiment, the logic circuit 203 may further include, but is not limited to, a third logic operation circuit that receives the inverse operation of the first logic operation circuit and the inverse operation of the second logic operation circuit to perform The third logic operation generates a power-on reset (POR) voltage.
在一實施例中,記憶體電路201的第一記憶體元件可為電路專用的虛擬記憶體元件(即,不用作處理器、控制器等使用的通用儲存媒體)。或者,第一記憶體元件可為由上電復位設置的第一SR正反器,且第二記憶體元件可為由上電復位重置的第二SR正反器。In an embodiment, the first memory element of the memory circuit 201 may be a virtual memory element dedicated to the circuit (that is, not used as a general-purpose storage medium used by a processor, a controller, or the like). Alternatively, the first memory element may be a first SR flip-flop set by a power-on reset, and the second memory element may be a second SR flip-flop reset by a power-on reset.
本公開還提供一種供具有電路200的電子裝置使用用於從如本公開中描述的電源的電力損耗中恢復的方法。本公開將包含但不限於下文所描述的步驟。在步驟S301中,電路可從第一記憶體元件接收第一記憶體輸出電壓,且從第二記憶體元件接收第二記憶體輸出電壓。在步驟S302中,電路可將第一記憶體輸出電壓與從電源電路接收的第一電源電壓進行比較以產生第一邏輯比較器輸出電壓。在步驟S303中,電路可將第二記憶體輸出電壓與從電源電路接收的第二電源電壓進行比較以產生第二邏輯比較器輸出電壓。在步驟S304中,電路可通過使用第一邏輯比較器輸出電壓及第二邏輯比較器輸出電壓執行第一邏輯操作。在步驟S305中,電路可至少部分地基於用於響應於電源的電力損耗而重置記憶體電路的第一邏輯操作來產生上電復位電壓。The present disclosure also provides a method for use by an electronic device having a circuit 200 for recovering from power loss of a power source as described in the present disclosure. This disclosure will include, but is not limited to, the steps described below. In step S301, the circuit may receive the first memory output voltage from the first memory element and receive the second memory output voltage from the second memory element. In step S302, the circuit may compare the output voltage of the first memory with the first power voltage received from the power circuit to generate a first logic comparator output voltage. In step S303, the circuit may compare the second memory output voltage with the second power supply voltage received from the power supply circuit to generate a second logic comparator output voltage. In step S304, the circuit may perform a first logic operation by using the first logic comparator output voltage and the second logic comparator output voltage. In step S305, the circuit may generate a power-on reset voltage based at least in part on a first logic operation for resetting the memory circuit in response to a power loss of the power supply.
在一實施例中,第一記憶體輸出電壓可具有與第二記憶體輸出電壓相反的二進位值,當電源在沒有電力損耗的情況下正常操作時,第一記憶體輸出電壓及第二記憶體輸出電壓使得第一邏輯比較器輸出電壓及第二邏輯比較器輸出電壓輸出相同的第一二進位值。當電源經歷由來自電源電路的輸出電壓降導致的電力損耗時,第一邏輯比較器輸出電壓及第二邏輯比較器輸出電壓中的至少一個可輸出與第一二進位值相反的第二二進位值。In an embodiment, the output voltage of the first memory may have a binary value opposite to the output voltage of the second memory. When the power supply operates normally without power loss, the output voltage of the first memory and the second memory The bulk output voltage causes the first logic comparator output voltage and the second logic comparator output voltage to output the same first binary value. When the power source experiences a power loss caused by an output voltage drop from the power supply circuit, at least one of the first logic comparator output voltage and the second logic comparator output voltage may output a second binary opposite to the first binary value value.
在一實施例中,第一邏輯操作可為反及操作,所述反及操作在當電源在沒有電力損耗的情況下正常操作時輸出第二二進位值,而在電源經歷由來自電源電路的輸出電壓降導致的電力損耗時輸出第一二進位值。In an embodiment, the first logic operation may be an inverse operation, which outputs a second binary value when the power supply normally operates without power loss, and when the power supply undergoes The first binary value is output when the power loss caused by the output voltage drop.
為了進一步闡明上述概念,本公開提供如圖4至圖6中公開的若干實施例及其對應書面描述。所述方法可包含但不限於下文所描述的步驟。在步驟S401中,電子裝置將執行電力開啟操作,其可包含打開電子裝置、將電子裝置從睡眠模式喚醒等。在步驟S402中,電子裝置可任選地執行熔絲讀取操作(fuse read operation),其將允許電子裝置取得用於比較的DZD模式。在步驟S403,電子裝置將獲得DZD模式。DZD模式可從步驟S402中的熔絲讀取中獲得。或者,DZD模式可預先存在,因為其可固線式至電子裝置的電路或記憶體元件。此外,DZD模式可替代地從例如中央處理單元(central processing unit;CPU)或外部控制器等外部電源獲得。在步驟S404中,一旦獲得DZD模式,電子裝置會將DZD模式載入到例如虛擬記憶體元件、鎖存器、正反器等記憶體元件中。或者,DZD模式可預先存在於記憶體元件中或從外部電源程式設計到記憶體元件中。在步驟S405中,電路應通過一或多個比較器將DZD模式與來自電源的預定電壓值進行比較以產生POR信號。所述比較將是連續的,因為電路將保持監測死區區域103。一旦DZD模式與預定電壓值之間的比較不產生期望值,所述過程將在步驟S401處繼續,即會觸發POR重置。To further clarify the above concepts, the present disclosure provides several embodiments as disclosed in FIGS. 4 to 6 and their corresponding written descriptions. The method may include, but is not limited to, the steps described below. In step S401, the electronic device performs a power-on operation, which may include turning on the electronic device, waking the electronic device from a sleep mode, and the like. In step S402, the electronic device may optionally perform a fuse read operation, which will allow the electronic device to obtain a DZD mode for comparison. In step S403, the electronic device will obtain a DZD mode. The DZD mode can be obtained from the fuse reading in step S402. Alternatively, the DZD mode can be pre-existing because it can be fixed to the circuit or memory element of the electronic device. In addition, the DZD mode may alternatively be obtained from an external power source such as a central processing unit (CPU) or an external controller. In step S404, once the DZD mode is obtained, the electronic device loads the DZD mode into a memory element such as a virtual memory element, a latch, and a flip-flop. Alternatively, the DZD mode can be pre-existed in the memory device or programmed into the memory device from an external power source. In step S405, the circuit should compare the DZD mode with a predetermined voltage value from the power source through one or more comparators to generate a POR signal. The comparison will be continuous because the circuit will keep monitoring the dead zone 103. Once the comparison between the DZD mode and the predetermined voltage value does not produce an expected value, the process will continue at step S401, which will trigger a POR reset.
參看圖5,電路可包含但不限於多個為記憶體電路201的一部分的記憶體元件501到記憶體元件504、多個為邏輯比較器電路202的一部分的比較器511到比較器514以及多個為邏輯電路203的一部分的邏輯閘521到邏輯閘523。邏輯電路將被配置成響應於下降到特定閾值以下的電源電壓(即,死區區域103)而產生POR。5, the circuit may include, but is not limited to, a plurality of memory elements 501 to 504 which are part of the memory circuit 201, a plurality of comparators 511 to 514 which are part of the logic comparator circuit 202, and a plurality of Each of the logic gates 521 to 523 is a part of the logic circuit 203. The logic circuit will be configured to generate a POR in response to a power supply voltage falling below a certain threshold (ie, the dead-time region 103).
多個記憶體元件501到記憶體元件504可為虛擬記憶體元件,這意味著虛擬記憶體元件不用作實際記憶體,而是圖5的電路專用以儲存用於後續比較的DZD模式。虛擬記憶體元件將包含輸出第一記憶體輸出電壓501o的第一記憶體元件501、輸出第二記憶體輸出電壓502o的第二記憶體元件502、輸出第三記憶體輸出電壓503o的第三記憶體元件503以及輸出第四記憶體輸出電壓504o的第四記憶體元件504。在此實施例中,DZD模式可為分別載入到虛擬記憶體元件501到虛擬記憶體元件504中的高低高低(例如,1 0 1 0)電壓的序列,但應理解,本公開不限於此特定序列集。因此,輸出電壓501o、輸出電壓502o、輸出電壓503o以及輸出電壓504o將分別為高低高低(例如,1 0 1 0)。The plurality of memory elements 501 to 504 can be virtual memory elements, which means that the virtual memory elements are not used as actual memory, but the circuit of FIG. 5 is dedicated to store the DZD mode for subsequent comparisons. The virtual memory element will include a first memory element 501 that outputs a first memory output voltage 501o, a second memory element 502 that outputs a second memory output voltage 502o, and a third memory that outputs a third memory output voltage 503o A body element 503 and a fourth memory element 504 that outputs a fourth memory output voltage 504o. In this embodiment, the DZD mode may be a sequence of high and low (eg, 1 0 1 0) voltages respectively loaded into the virtual memory element 501 to the virtual memory element 504, but it should be understood that the present disclosure is not limited thereto Specific sequence set. Therefore, the output voltage 501o, the output voltage 502o, the output voltage 503o, and the output voltage 504o will be high or low (for example, 1 0 1 0).
電連接到記憶體電路201的邏輯比較器電路202可包含但不限於將第一記憶體輸出電壓501o與從電源電路接收的第一電源電壓(例如,接地電壓或Vss)進行比較以產生第一邏輯比較器輸出電壓511o的第一邏輯比較器511、將第二記憶體輸出電壓502o與從電源電路接收且高於第一電源電壓(例如,接地電壓或Vss)的第二電源電壓(例如,Vcc)進行比較以產生第二邏輯比較器輸出電壓512o的第二邏輯比較器512、將第三記憶體輸出電壓503o與從電源電路接收的第一電源電壓(例如,接地電壓或Vss)進行比較以產生第三邏輯比較器輸出電壓513o的第三邏輯比較器513以及將第四記憶體輸出電壓504o與第二電源電壓(例如,Vcc)進行比較以產生第四邏輯比較器輸出電壓514o的第四邏輯比較器514。The logic comparator circuit 202 electrically connected to the memory circuit 201 may include, but is not limited to, comparing the first memory output voltage 501o with a first power supply voltage (eg, a ground voltage or Vss) received from the power supply circuit to generate a first The first logic comparator 511 of the logic comparator output voltage 511o, the second memory output voltage 502o, and a second power supply voltage (for example, Vcc) to compare the second logical comparator 512 to generate the second logical comparator output voltage 512o, and compare the third memory output voltage 503o to the first power supply voltage (eg, ground voltage or Vss) received from the power supply circuit The third logic comparator 513 generates a third logic comparator output voltage 513o, and the fourth memory comparator output voltage 504o is compared with a second power supply voltage (for example, Vcc) to generate a fourth logic comparator output voltage 514o. Four logic comparator 514.
第二邏輯比較器512可為例如通過執行或非操作將第二記憶體輸出電壓502o與第二電源電壓(例如Vcc)進行比較以產生第二邏輯比較器輸出電壓512o的反或閘。類似地,第四邏輯比較器514可為通過執行或非操作將第四記憶體輸出電壓504o與第四電源電壓(例如Vcc)進行比較以產生第四邏輯比較器輸出電壓514o的反或閘。The second logic comparator 512 may be an inverse OR gate that compares the second memory output voltage 502o with a second power supply voltage (such as Vcc) by performing an NOR operation to generate a second logic comparator output voltage 512o. Similarly, the fourth logic comparator 514 may be an inverse OR gate of the fourth logic comparator output voltage 514o by comparing the fourth memory output voltage 504o with a fourth power supply voltage (such as Vcc) by performing an NOR operation.
比較器511到比較器514將基於比較結果產生高壓或低壓。應注意,通過比較器(511到514)用作高壓或低壓輸出的實際電壓位準可不必與虛擬記憶體元件(501到504)的高壓及低壓相同。在正常操作條件下,第一邏輯比較器輸出電壓511o可被配置為高壓(例如1),這是因為第一記憶體輸出電壓501o與第一電源電壓(例如接地電壓或Vss)之間的比較結果被配置成產生高壓。第二邏輯比較器輸出電壓512o可被配置為高壓(例如1),這是因為第二記憶體輸出電壓502o與第二電源電壓(例如Vcc)之間的比較結果被配置成產生高壓。第三邏輯比較器輸出電壓513o可被配置為高壓(例如1),這是因為第三記憶體輸出電壓503o與第一電源電壓(例如接地電壓或Vss)之間的比較結果被配置成產生高壓。第四邏輯比較器輸出電壓514o被配置為高壓(例如1),這是因為第四記憶體輸出電壓504o與第二電源電壓(例如Vcc)之間的比較結果被配置成產生高壓。應注意,由於DZD模式為可程式設計的,因此實際邏輯閘及輸出值可為任意的。The comparators 511 to 514 will generate a high voltage or a low voltage based on the comparison result. It should be noted that the actual voltage levels used by the comparators (511 to 514) for high or low voltage output need not be the same as the high and low voltages of the virtual memory elements (501 to 504). Under normal operating conditions, the first logic comparator output voltage 511o can be configured as a high voltage (eg, 1) because the comparison between the first memory output voltage 501o and the first power supply voltage (eg, ground voltage or Vss) The result is configured to generate high voltage. The second logic comparator output voltage 512o may be configured as a high voltage (for example, 1) because the comparison result between the second memory output voltage 502o and the second power supply voltage (for example, Vcc) is configured to generate a high voltage. The third logic comparator output voltage 513o may be configured as a high voltage (for example, 1) because the comparison result between the third memory output voltage 503o and the first power supply voltage (such as a ground voltage or Vss) is configured to generate a high voltage . The fourth logic comparator output voltage 514o is configured as a high voltage (for example, 1) because the comparison result between the fourth memory output voltage 504o and the second power supply voltage (for example, Vcc) is configured to generate a high voltage. It should be noted that since the DZD mode is programmable, the actual logic gate and output values can be arbitrary.
在一實施例中,假定DZD模式為1010,那麼第一邏輯比較器511可為及閘,第二邏輯比較器512可為反或閘,第三邏輯比較器513可為及閘,且第四邏輯比較器514可為反或閘。舉例來說,在正常操作條件下,第一記憶體輸出電壓501o將輸出高壓(例如1),且因此第一邏輯比較器輸出電壓511o也將輸出高壓。然而,假定死區現象已發生,導致第一記憶體輸出電壓501o輸出低壓,那麼第一邏輯比較器輸出電壓511o也將為低壓。In an embodiment, assuming that the DZD mode is 1010, the first logic comparator 511 may be an AND gate, the second logic comparator 512 may be an inclusive OR gate, the third logic comparator 513 may be an AND gate, and the fourth The logic comparator 514 may be an inverting OR gate. For example, under normal operating conditions, the first memory output voltage 501o will output a high voltage (eg, 1), and therefore the first logic comparator output voltage 511o will also output a high voltage. However, assuming that the dead band phenomenon has occurred, causing the first memory output voltage 501o to output a low voltage, the first logic comparator output voltage 511o will also be a low voltage.
此外,舉例來說,在正常操作條件下,假定第二記憶體輸出電壓502o被配置成輸出低壓,因此作為與參考電壓(例如低壓)比較的結果,在反或閘外的第二邏輯比較器輸出電壓512o也將輸出高壓。然而,假定異常操作條件已發生,導致第二記憶體輸出電壓502o輸出高壓,那麼第二邏輯比較器輸出電壓512o也將為低壓。第三邏輯比較器電路513及第四邏輯比較器電路514將分別以與第一邏輯比較器電路511及第二邏輯比較器電路512相似的方式操作。In addition, for example, under normal operating conditions, it is assumed that the second memory output voltage 502o is configured to output a low voltage, so as a result of comparison with a reference voltage (eg, low voltage), a second logic comparator outside the OR gate The output voltage of 512o will also output high voltage. However, assuming that an abnormal operating condition has occurred, causing the second memory output voltage 502o to output a high voltage, the second logic comparator output voltage 512o will also be a low voltage. The third logic comparator circuit 513 and the fourth logic comparator circuit 514 will operate in a similar manner to the first logic comparator circuit 511 and the second logic comparator circuit 512, respectively.
然而,在出現死區區域的電力損耗的情況下,電壓Vcc將下降但不會很快達到零。Vcc的下降將使得第二邏輯比較器512中的至少第二電源電壓(例如Vcc)的電壓下降,例如與第二記憶體輸出電壓502o的比較結果的電壓可產生低壓(例如0)。類似地,Vcc的下降將使得第四邏輯比較器514中的至少第二電源電壓(例如Vcc)的電壓下降,例如與第四記憶體輸出電壓504o的比較結果可產生低壓(例如0)。此外,由於電力損耗可導致虛擬記憶體元件501到記憶體元件504的電壓不穩定,因此第一邏輯比較器511及第三邏輯比較器513的比較結果也可能不產生預期的高壓(例如1)結果,而可能替代地輸出低壓(例如0)。However, in the event of power loss in the dead zone, the voltage Vcc will drop but will not reach zero anytime soon. The drop in Vcc will cause the voltage of at least the second power supply voltage (for example, Vcc) in the second logic comparator 512 to drop. For example, the voltage compared with the second memory output voltage 502o may generate a low voltage (for example, 0). Similarly, the drop in Vcc will cause the voltage of at least the second power supply voltage (eg, Vcc) in the fourth logic comparator 514 to drop. For example, the comparison with the fourth memory output voltage 504o may generate a low voltage (eg, 0). In addition, because the power loss can cause the voltage of the virtual memory element 501 to the memory element 504 to be unstable, the comparison results of the first logical comparator 511 and the third logical comparator 513 may not produce the expected high voltage (for example, 1) As a result, a low voltage (for example, 0) may be output instead.
邏輯電路203可包含第一邏輯操作電路521、第二邏輯操作電路522以及第三邏輯操作電路523。在此實施例中,第一邏輯操作電路521及第二邏輯操作電路522均為可執行反及操作(例如反及閘)的電路,且第三邏輯操作電路523為可執行或操作(例如或閘)的電路。在正常操作情況下,由於第一邏輯比較器輸出電壓511o及第二邏輯比較器輸出電壓512o均為高壓,因此第一邏輯操作電路輸出521o將為低壓(例如0),且由於第三邏輯比較器輸出電壓513o及第四邏輯比較器輸出電壓514o均為高壓,因此第二邏輯操作電路輸出522o也將為低壓(例如0)。The logic circuit 203 may include a first logic operation circuit 521, a second logic operation circuit 522, and a third logic operation circuit 523. In this embodiment, the first logic operation circuit 521 and the second logic operation circuit 522 are both circuits that can perform an inverse operation (such as an inverse AND gate), and the third logic operation circuit 523 is an executable or operation (such as or Brake) circuit. Under normal operating conditions, since the output voltage of the first logic comparator 511o and the output voltage of the second logic comparator 512o are both high voltages, the output of the first logic operation circuit 521o will be a low voltage (for example, 0), and due to the third logic comparison The output voltage 513o of the comparator and the output voltage 514o of the fourth logic comparator are both high voltages, so the output 522o of the second logic operation circuit will also be low voltage (for example, 0).
然而,在異常操作情況下,例如在已出現死區區域103時,比較器輸出電壓511o、比較器輸出電壓512o、比較器輸出電壓513o、比較器輸出電壓514o中的至少一或多個可為低壓。只要輸出電壓511o、輸出電壓512o、輸出電壓513o、輸出電壓514o中的任一個可為低壓,那麼由於反及閘的操作原理,第一邏輯操作電路輸出521o及第二邏輯操作電路輸出522o中的至少一個將為高壓。只要第一邏輯操作電路輸出521o及第二邏輯操作電路輸出522o中的任一個為高壓,那麼由於或閘的操作原理,第三邏輯操作電路523的輸出將為高壓。第三邏輯操作電路523的高壓將觸發POR。However, under abnormal operating conditions, for example, when the dead zone 103 has occurred, at least one or more of the comparator output voltage 511o, the comparator output voltage 512o, the comparator output voltage 513o, and the comparator output voltage 514o may be Low pressure. As long as any of the output voltage 511o, output 512o, output voltage 513o, output voltage 514o can be a low voltage, the first logic operation circuit outputs 521o and the second logic operation circuit outputs 522o due to the inverse operation principle At least one will be high voltage. As long as any of the first logic operation circuit output 521o and the second logic operation circuit output 522o is high voltage, the output of the third logic operation circuit 523 will be high voltage due to the operation principle of the OR gate. The high voltage of the third logic operation circuit 523 will trigger a POR.
在概念上,第一記憶體輸出電壓501o具有與第二記憶體輸出電壓502o相反的二進位值,當電源在沒有電力損耗的情況下正常操作時,第一記憶體輸出電壓501o及第二記憶體輸出電壓502o使得第一邏輯比較器輸出電壓511o及第二邏輯比較器輸出電壓512o輸出相同的高壓。然而,當電源經歷由來自電源電路的輸出電壓降導致的電力損耗時,第一邏輯比較器輸出電壓511o及第二邏輯比較器輸出電壓512o中的至少一個將輸出低壓。輸出低壓的比較器511到比較器514中的任一個將由邏輯電路203來處理以觸發POR。Conceptually, the first memory output voltage 501o has a binary value opposite to the second memory output voltage 502o. When the power supply operates normally without power loss, the first memory output voltage 501o and the second memory The bulk output voltage 502o makes the first logic comparator output voltage 511o and the second logic comparator output voltage 512o output the same high voltage. However, when the power supply experiences a power loss caused by an output voltage drop from the power supply circuit, at least one of the first logic comparator output voltage 511o and the second logic comparator output voltage 512o will output a low voltage. Any one of the comparators 511 to 514 outputting a low voltage will be processed by the logic circuit 203 to trigger a POR.
在一實施例中,作為為虛擬記憶體元件的記憶體元件501到記憶體元件504的替代方案,記憶體元件可為其它類型的記憶體元件,例如鎖存器、正反器等。參看圖6,記憶體元件可通過使用多個SR正反器來實施,所述多個SR正反器可包含但不限於從第一SR正反器的S端接收DZD模式的第一電壓的第一SR正反器601,以及從第二SR正反器(例如602)的R端接收DZD模式的第二電壓的第二SR正反器602。圖6還示出與第一SR正反器601及第二SR正反器602相同的第三SR正反器603及第四SR正反器604。以此方式,DZD模式可從外部接收且根據SR正反器的典型操作原理程式設計到SR正反器中。圖7的其餘部分的操作原理將與圖6的相同,因為圖6的DZ_POR端在DZ_POR輸出的極性切換之後將觸發POR。In an embodiment, as an alternative to the memory elements 501 to 504 which are virtual memory elements, the memory elements may be other types of memory elements, such as latches, flip-flops, and the like. Referring to FIG. 6, the memory element may be implemented by using a plurality of SR flip-flops, which may include, but is not limited to, receiving the first voltage of the DZD mode from the S terminal of the first SR flip-flop. A first SR flip-flop 601 and a second SR flip-flop 602 that receives a second voltage in a DZD mode from the R terminal of a second SR flip-flop (eg, 602). FIG. 6 also shows a third SR flip-flop 603 and a fourth SR flip-flop 604 which are the same as the first SR flip-flop 601 and the second SR flip-flop 602. In this way, the DZD mode can be received from the outside and programmed into the SR flip-flop according to the typical operating principle of the SR flip-flop. The operation principle of the rest of FIG. 7 will be the same as that of FIG. 6, because the DZ_POR terminal of FIG. 6 will trigger a POR after the polarity of the DZ_POR output is switched.
圖7繪示在正常操作情況下電子裝置的記憶體元件狀態應處於已知狀態。然而,當已出現死區區域701時,電子裝置的記憶體元件狀態可變為未知狀態。通過使用圖6的電路,由於電子裝置的電源的Vcc已恢復到特定位準,因此POR信號線的輸出(DZ_POR)將切換極性以觸發POR 702。在POR 702發生後,電子裝置的記憶體元件狀態將恢復到已知狀態。FIG. 7 illustrates that the state of the memory element of the electronic device should be in a known state under normal operating conditions. However, when the dead zone 701 has occurred, the state of the memory element of the electronic device may become an unknown state. By using the circuit of FIG. 6, since Vcc of the power supply of the electronic device has recovered to a certain level, the output of the POR signal line (DZ_POR) will switch polarity to trigger POR 702. After POR 702 occurs, the state of the memory elements of the electronic device will return to a known state.
鑒於前述描述,本公開適用於電子裝置中且能夠檢測電力損耗狀態,以在電力損耗狀態期間產生上電復位,從而使電子裝置的記憶體元件狀態從未知狀態改變回到已知狀態。通過使用本發明,電子裝置(1)可在電源低於某一位準降至“死區區域”時從未知狀態中恢復(2)可為監測器且通過比較記憶體元件的輸出電壓來檢測電力損耗(3)將在電力損耗的情況下增加應用可靠性,尤其是在移動應用中(4)可在駭客試圖將IC晶片置於未知狀態以對其進行攻擊的情況下通過產生晶片重置來增加安全性(5)且可以省電,為所提供的設計使用比精確的VCC位準檢測器更少的電力。In view of the foregoing description, the present disclosure is applicable to an electronic device and is capable of detecting a power loss state to generate a power-on reset during the power loss state, thereby changing a state of a memory element of the electronic device from an unknown state to a known state. By using the present invention, the electronic device (1) can recover from an unknown state when the power supply falls below a certain level to a "dead zone" (2) can be a monitor and detect by comparing the output voltage of the memory element Power loss (3) will increase application reliability in the case of power loss, especially in mobile applications (4) It can be used to generate IC weights when a hacker tries to put the IC chip in an unknown state to attack it To increase safety (5) and save power, use less power for the provided design than an accurate VCC level detector.
本領域技術人員將明白,在不脫離本公開的範圍或精神的情況下,可對所揭露的實施例的結構進行各種修改和變化。鑒於前述內容,希望本公開涵蓋屬於所附權利要求書和其等效物的範圍內的本公開的修改及變化。Those skilled in the art will appreciate that various modifications and changes can be made to the structure of the disclosed embodiments without departing from the scope or spirit of the present disclosure. In light of the foregoing, it is intended that the present disclosure cover the modifications and variations of this disclosure that fall within the scope of the appended claims and their equivalents.
101、702‧‧‧上電復位101, 702‧‧‧ Power-on reset
102‧‧‧電力損耗區域 102‧‧‧Power loss area
103、701‧‧‧死區區域 103, 701‧‧‧ dead zone
200‧‧‧電路 200‧‧‧circuit
201‧‧‧記憶體電路 201‧‧‧Memory Circuit
202‧‧‧邏輯比較器電路 202‧‧‧Logic Comparator Circuit
203‧‧‧邏輯電路 203‧‧‧Logic Circuit
S301- S305、S401- S405‧‧‧步驟 S301- S305, S401- S405‧‧‧ steps
501‧‧‧第一記憶體元件/記憶體元件/虛擬記憶體元件 501‧‧‧first memory element / memory element / virtual memory element
501o‧‧‧第一記憶體輸出電壓/輸出電壓 501o‧‧‧First memory output voltage / output voltage
502‧‧‧第二記憶體元件 502‧‧‧Second memory element
502o‧‧‧第二記憶體輸出電壓/輸出電壓 502o‧‧‧Second memory output voltage / output voltage
503‧‧‧第三記憶體元件 503‧‧‧Third memory element
503o‧‧‧第三記憶體輸出電壓/輸出電壓 503o‧‧‧Third memory output voltage / output voltage
504‧‧‧第四記憶體元件/記憶體元件/虛擬記憶體元件 504‧‧‧Fourth Memory Element / Memory Element / Virtual Memory Element
504o‧‧‧第四記憶體輸出電壓/輸出電壓 504o‧‧‧Fourth memory output voltage / output voltage
511‧‧‧第一邏輯比較器/比較器/第一邏輯比較器電路 511‧‧‧first logic comparator / comparator / first logic comparator circuit
511o‧‧‧第一邏輯比較器輸出電壓/比較器輸出電壓/輸出電壓 511o‧‧‧First logic comparator output voltage / comparator output voltage / output voltage
512‧‧‧第二邏輯比較器/第二邏輯比較器電路 512‧‧‧Second Logic Comparator / Second Logic Comparator Circuit
512o‧‧‧第二邏輯比較器輸出電壓/比較器輸出電壓/輸出電壓 512o‧‧‧Second logic comparator output voltage / comparator output voltage / output voltage
513‧‧‧第三邏輯比較器/第三邏輯比較器電路 513‧‧‧Third Logic Comparator / Third Logic Comparator Circuit
513o‧‧‧第三邏輯比較器輸出電壓/比較器輸出電壓/輸出電壓 513o‧‧‧Third logic comparator output voltage / comparator output voltage / output voltage
514‧‧‧第四邏輯比較器/比較器/第四邏輯比較器電路 514‧‧‧Fourth logic comparator / comparator / fourth logic comparator circuit
514o‧‧‧第四邏輯比較器輸出電壓/比較器輸出電壓/輸出電壓 514o‧‧‧ Fourth logical comparator output voltage / comparator output voltage / output voltage
521‧‧‧第一邏輯操作電路/邏輯閘 521‧‧‧First logic operation circuit / logic gate
521o‧‧‧第一邏輯操作電路輸出 521o‧‧‧First logic operation circuit output
522‧‧‧第二邏輯操作電路 522‧‧‧Second logic operation circuit
522o‧‧‧第二邏輯操作電路輸出 522o‧‧‧Second logic operation circuit output
523‧‧‧第三邏輯操作電路/邏輯閘 523‧‧‧Third logic operation circuit / logic gate
601‧‧‧第一SR正反器 601‧‧‧The first SR flip-flop
602‧‧‧第二SR正反器 602‧‧‧Second SR flip-flop
603‧‧‧第三SR正反器 603‧‧‧The third SR flip-flop
604‧‧‧第四SR正反器 604‧‧‧Fourth SR flip-flop
POR‧‧‧上電復位/訊號 POR‧‧‧ Power-on reset / signal
PORb、DZ_POR、PWV_POR、PUMP_LEVEL_DETECTOR‧‧‧訊號 PORb, DZ_POR, PWV_POR, PUMP_LEVEL_DETECTOR‧‧‧Signal
包含附圖以便進一步理解本公開,且附圖併入本說明書中並構成本說明書的一部分。附圖示出了本公開的實施例,且與描述一起用於解釋本公開的原理。 圖1示出可能導致晶片發生故障的“死區”區域的現象。 圖2以方塊圖示出用於從電子裝置內的電源的電力損耗中恢復的電路的硬體。 圖3示出如本公開所描述的供電子裝置使用的用於從電源的電力損耗中恢復的方法。 圖4示出供電子裝置使用的用於從電源的電力損耗中恢復的方法的實施例。 圖5示出根據本公開的實施例中的一個用於從電子裝置內的電源的電力損耗中恢復的電路。 圖6示出根據本公開的實施例中的一個用於從電子裝置內的電源的電力損耗中恢復的另一電路。 圖7示出通過使用根據本公開的實施例中圖6的電路將電子裝置的記憶體狀態從未知狀態移到已知狀態的現象圖。The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain principles of the present disclosure. FIG. 1 illustrates a phenomenon in a “dead zone” region that may cause a wafer to malfunction. FIG. 2 is a block diagram showing hardware of a circuit for recovering from power loss of a power source in an electronic device. FIG. 3 illustrates a method for recovering from a power loss of a power source used by a power feeding sub-device as described in the present disclosure. FIG. 4 illustrates an embodiment of a method for recovering from a power loss of a power source used by a power supply device. FIG. 5 illustrates a circuit for recovering from power loss of a power source in an electronic device according to an embodiment of the present disclosure. FIG. 6 illustrates another circuit for recovering from power loss of a power source within an electronic device according to an embodiment of the present disclosure. FIG. 7 illustrates a phenomenon diagram of moving a memory state of an electronic device from an unknown state to a known state by using the circuit of FIG. 6 in an embodiment according to the present disclosure.
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| TWI855654B (en) * | 2023-04-26 | 2024-09-11 | 大陸商星宸科技股份有限公司 | Voltage detector device having trimming mechanism and voltage detection method |
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